Imaging apparatus

Abstract

To provide an imaging apparatus with high heat dissipation while avoiding a large size.SOLUTION: An imaging apparatus 10 includes an imaging element 510, a main board 600 arranged on the rear side of the imaging element 510, a CPU 610 mounted on the main board 600, a base member 300 that holds a main board 610, a battery room 320 in which a battery is housed, a first sheet metal member 310 arranged on the front side of the imaging element 510, and a second sheet metal member 700 arranged on the rear side of the main board 600. The first sheet metal member 310 has an arm 318 extending in an optical axis direction towards the rear side of the imaging apparatus 10. The arm 318 is positioned closer to an optical axis P than the battery room 320 on a projection plane in the optical axis direction.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to an imaging device.

Background Art

[0002] Imaging devices such as digital cameras and digital video cameras are equipped with heat-generating elements such as imaging elements, control ICs, and image processing ICs that generate heat during operation inside them. For such imaging devices, higher pixel counts for the imaging elements and faster image processing are required. Also, the opportunities for taking still images and shooting videos while acquiring live view videos have increased. As a result, the power consumption has increased, and the amount of heat generated inside the imaging device has also increased.

[0003] Here, in order to enable the imaging device to be used stably for a long time, it is necessary to release the heat generated inside the imaging device to the outside and suppress the rise in the internal temperature of the imaging device and the temperature of the heat-generating element itself. Therefore, for example, Patent Document 1 proposes a configuration in which the chassis member of the imaging device and the heat-generating element are connected via a flexible heat transfer member, thereby efficiently diffusing the heat of the heat-generating element to the exterior.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the technology disclosed in Patent Document 1 above, since the heat transfer destination of the heat generated by the heat-generating element is limited to the chassis member, there is a possibility that heat cannot be sufficiently released from the exterior, especially in a small imaging device with a small exterior area. Also, considering that miniaturization has been required for imaging devices conventionally, it is also necessary to avoid increasing the size of the imaging device for heat dissipation.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide an imaging device having high heat dissipation performance while avoiding an increase in size.

Means for Solving the Problems

[0007] An imaging device according to the present invention is an imaging device including an imaging element, and includes a substrate disposed on the back side of the imaging device with respect to the imaging element, a heat generating element mounted on the substrate, a holding member for holding the substrate, a battery chamber for housing a battery, a first sheet metal member disposed on the front side of the imaging device with respect to the imaging element, and a second sheet metal member disposed on the back side of the imaging device with respect to the substrate. The first sheet metal member has a first arm portion extending in the optical axis direction of the imaging device toward the back side of the imaging device, and the first arm portion is disposed at a position closer to the optical axis than the battery chamber on the projection plane in the optical axis direction.

Effects of the Invention

[0008] According to the present invention, it is possible to realize an imaging device having high heat dissipation performance while avoiding an increase in size.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0011] FIG. 1 is a perspective view showing the appearance of an imaging device 10 according to an embodiment. FIG. 1(a) is a view of the imaging device 10 seen from the front upper diagonal, and FIG. 1(b) is a view of the imaging device 10 seen from the rear upper diagonal. The imaging device 10 is a so-called mirrorless digital single-lens camera.

[0012] In the description of this embodiment, the imaging device 10 refers to the camera body of a mirrorless digital single-lens camera and does not include a photographing lens unit (interchangeable lens) not shown that is detachable from the camera body. Also, before defining the front, rear, left, right, up, and down directions of the imaging device 10, as shown in FIGS. 1(a) and 1(b), the directions are defined as the directions when viewed from a photographer (user) not shown.

[0013] On the front surface of the imaging device 10, a mount portion 11 for detachably fixing a photographing lens unit not shown is provided. The optical axis P shown by the dashed-dotted line in FIG. 1(a) passes through the center of the mount portion 11 and substantially coincides with the optical axis of the imaging optical system of the photographing lens unit when the photographing lens unit is attached to the mount portion 11. The mount portion 11 is provided with mount contacts 12 that enable communication of control signals, status signals, data signals, etc. between the imaging device 10 and the photographing lens unit and supply power to the photographing lens unit. Also, a lens lock release button 13 is provided at a position on the front surface of the imaging device 10 close to the mount portion 11. A user of the imaging device 10 can remove the photographing lens unit from the imaging device 10 by rotating the photographing lens unit attached to the mount portion 11 in a predetermined direction while pressing the lens lock release button 13.

[0014] At the right end of the imaging device 10, a grip portion 27 is formed. The grip portion 27 has a shape that allows the user to easily hold the imaging device 10 with the right hand. On the upper surface of the imaging device 10, at a position where the user can operate with the index finger of the right hand while holding the grip portion 27 with the right hand, a release button 15 and a main electronic dial 18 are arranged. The release button 15 is an operation member that instructs the control means (not shown) of the imaging device 10 to start shooting. The main electronic dial 18 is a rotary operation member. The user can change the set values such as the shutter speed and aperture by turning the main electronic dial 18.

[0015] On the upper surface of the imaging device 10, in the vicinity of the main electronic dial 18, a mode change switch 16 for switching the shooting mode and a movie button 19 used to instruct the start / stop of movie shooting (recording) are arranged. In the vicinity of the mode change switch 16, a power switch 17, which is a rotary operation member for switching the on / off of the power of the imaging device 10, is arranged.

[0016] On the back side of the imaging device 10, a display unit 20 for displaying images and various information is provided. A touch panel 21 is superimposed on the display surface of the display unit 20, and it is possible to detect a touch operation on the display surface of the display unit 20 and instruct various operations to the control means (not shown). An eyepiece portion 22 is provided above the display unit 20. The user can view the video displayed on an EVF (not shown) arranged inside the imaging device 10 through the eyepiece portion 22. In the vicinity of the eyepiece portion 22, an eyepiece detection unit 24 for detecting whether the user is looking through the eyepiece portion 22 is arranged.

[0017] A first terminal cover 25 is provided on the left side surface of the imaging device 10, and a second terminal cover 26 is provided on the right side surface. Each of the first terminal cover 25 and the second terminal cover 26 is a member that protects a connector for connecting a cord (not shown) for connecting the imaging device 10 and an external device (not shown).

[0018] FIG. 2 is an exploded perspective view showing the internal configuration of the imaging device 10. FIG. 2(a) is a view of the imaging device 10 seen from the rear upper diagonal, and FIG. 2(b) is a view of the imaging device 10 seen from the front upper diagonal. FIGS. 2(a) and (b) show the main components of the imaging device 10. The imaging device 10 includes a base member 300 having a first sheet metal member 310, a shutter unit 400, an imaging element unit 500, a main board 600, and a second sheet metal member 700.

[0019] The base member 300 is a resin member integrally formed with the first sheet metal member 310 by insert molding, and is a holding member that holds the mount portion 11, the shutter unit 400, the imaging element unit 500, the main board 600, and the second sheet metal member 700. Note that the shutter unit 400, the imaging element unit 500, the main board 600, and the second sheet metal member 700 are assembled to the base member 300 in this order. The base member 300 has a battery chamber 320 for housing a battery (not shown) that supplies power to the imaging device 10.

[0020] The shutter unit 400 includes a drive mechanism for opening and closing a shutter curtain (not shown), and controls the exposure time of the imaging element 510 by the opening and closing operation of the shutter curtain. The shutter unit 400 is provided with screw holes 410a, 410b, and 410c, and the shutter unit 400 is fastened to the base member 300 by screws 420a, 420b, and 420c inserted through the screw holes 410a, 410b, and 410c. The shutter unit 400 includes a first flexible substrate 430. By electrically and mechanically connecting the first flexible substrate 430 to the main board 600 via the terminal portion 431, it becomes possible to transmit and receive various signals between the shutter unit 400 and the main board 600.

[0021] The imaging element unit 500 includes an imaging element 510, a sensor substrate 520, a sensor plate 530 (the third sheet metal member), a first heat transfer plate 540, and a second heat transfer plate 550. The imaging element 510 is a photoelectric conversion element that converts incident light from the imaging lens unit into an electrical signal, and is, for example, a CMOS sensor, a CCD sensor, or the like. The imaging element 510 is mounted on the front surface (the surface) of the sensor substrate 520, and various circuit components are mounted on the back surface (the reverse side) of the sensor substrate 520. The second flexible substrate 521 connects a connector (not shown) mounted on the back surface of the sensor substrate 520 and a connector (not shown) mounted on the main substrate 600. Thereby, the sensor substrate 520 and the main substrate 600 are electrically connected, and electrical signals can be transmitted and received between the imaging element 510 and the CPU 610 and the like mounted on the main substrate 600.

[0022] The sensor plate 530 is a sheet metal member made of a metal (such as aluminum or copper) having high thermal conductivity. The imaging element 510 mounted on the sensor substrate 520 is fixed to the sensor plate 530 with an adhesive (for example, an ultraviolet curable adhesive). The sensor plate 530 is provided with screw holes 531a, 531b, 531c, and the sensor plate 530 is fastened to the base member 300 with adjustment screws 532a, 532b, 532c inserted through the screw holes 531a, 531b, 531c.

[0023] Compression coil springs 533a, 533b, 533c are disposed between the sensor plate 530 and the base member 300. One end of each of the compression coil springs 533a, 533b, 533c contacts the base member 300, and the other end contacts the sensor plate 530. The compression coil springs 533a, 533b, 533c are assembled in a state of being compressed by a predetermined amount from the natural state (no-load state), and bias the sensor plate 530 in the direction opposite to the direction (the front direction) in which the mount portion 11 is disposed (the rear direction). By adjusting the tightening amount of the adjustment screws 532a, 532b, 532c, the distance (flange back) from the mount surface of the mount portion 11 to the imaging element 510 can be adjusted to a desired distance.

[0024] The first heat transfer plate 540 and the second heat transfer plate 550 are sheet metal members made of a metal having high thermal conductivity (for example, aluminum, copper, etc.). One end of the first heat transfer plate 540 is fastened to the sensor plate 530 with a screw 541, and the other end is fastened to the first exposed portion 316a of the first sheet metal member 310 with a screw 542 to thermally connect the sensor plate 530 and the base member 300. One end of the second heat transfer plate 550 is fastened to the sensor plate 530 with a screw 551. The other end of the second heat transfer plate 550 is fastened (clamped) to the first sheet metal member 310 with a screw 720 while being sandwiched between the second sheet metal member 700 and the second exposed portion 317a of the first sheet metal member 310. Thus, the second heat transfer plate 550 thermally connects the second sheet metal member 700 and the base member 300 to the sensor plate 530.

[0025] With such a configuration, in the imaging device 10, the heat generated in the imaging element 510 and the sensor substrate 520 can be transferred to the base member 300 and the second sheet metal member 700 via the sensor plate 530, the first heat transfer plate 540, and the second heat transfer plate 550.

[0026] The main board 600 is a circuit board on which various components (electrical components, electronic components) are mounted. A CPU 610, which is a main heat generating element, is mounted on the main board 600. Note that the CPU 610 controls the overall operation of the imaging device 10 and also performs image processing on the image signal (video signal) output from the imaging element 510 in the present embodiment. In addition to the CPU 610, heat generating circuit components such as DRAMs 620 and 630 are mounted on the main board 600. Further, a plurality of connectors (not shown) to which the first flexible board 430, the second flexible board 521, etc. are connected are mounted on the main board 600.

[0027] The main substrate 600 has screw holes 640. The main substrate 600 is disposed on the back side of the imaging element unit 500 and is fastened to the base member 300 by screws 650 inserted through the screw holes 640. Further, the main substrate 600 is also fastened to the base member 300 by screws 721, 722, 723, 724, 725 inserted through screw holes 641, 642, 643, 644, 645 while being sandwiched between the base member 300 and the second sheet metal member 700. At this time, as will be described later, the main substrate 600 and the second sheet metal member 700 are co-fastened and fixed to the base member 300 by the screws 721, 722, 723, 724, 725. Thus, a configuration is provided in which heat generated by the CPU 610 and the DRAMs 620, 630, etc. can be transferred to the base member 300 and the second sheet metal member 700 through the main substrate 600.

[0028] The second sheet metal member 700 is a sheet metal member made of a metal having high thermal conductivity (for example, aluminum, copper, etc.). The second sheet metal member 700 is disposed on the back side of the main substrate 600 and has screw holes 710, 711, 712, 713, 714, 715. The fastening point by the screw 720 inserted through the screw hole 710 co-fastens and fixes the second sheet metal member 700 and the second heat transfer plate 550, constructing a heat transfer path for heat generated by the imaging element 510 and the sensor substrate 520. The second sheet metal member 700 is fastened to the base member 300 by screws 721, 722, 723, 724, 725 inserted through screw holes 710, 711, 712, 713, 714, 715 while sandwiching the main substrate 600 between it and the base member 300. Thus, the fastening points by the screws 721, 722, 723, 724, 725 inserted through the screw holes 711, 712, 713, 714, 715 form a heat transfer path for heat generated by the main substrate 600 to the base member 300 and the second sheet metal member 700.

[0029] Next, the first sheet metal member 310 insert-molded into the base member 300 will be described. FIG. 3(a) is a perspective view of the first sheet metal member 310 seen from the front upper diagonal, and FIG. 2(b) is a perspective view of the first sheet metal member 310 seen from the rear upper diagonal. The first sheet metal member 310 is disposed on the front side of the imaging element 510 and the CPU 610 and is formed of a metal having high thermal conductivity (for example, aluminum, copper, etc.). In addition to the role of improving the strength of the base member 300, it also plays a role in improving the heat dissipation performance.

[0030] The first sheet metal member 310 has a first flat portion 311 and a second flat portion 312 that are substantially orthogonal to the optical axis. The first flat portion 311 and the second flat portion 312 are provided on the right and left sides that are opposite to each other with the optical axis interposed therebetween, and are connected by a first connecting portion 313, a second connecting portion 314, and a third connecting portion 315. The first connecting portion 313 and the second connecting portion 314 are disposed outside the opening region of the mount portion 11 so as not to block the incident light from the imaging lens unit. The second connecting portion 314 has a recess 314a that is disposed so as to contact a tripod base (not shown). The third connecting portion 315 is provided so as to be substantially orthogonal to the second flat portion 312, and connects the second flat portion 312 and the first connecting portion 313 that are disposed so as to avoid the lens release button 13 (not shown in FIG. 3). In this way, by thermally connecting the first flat portion 311 and the second flat portion 312 of the first sheet metal member 310 vertically (the first connecting portion 313, the second connecting portion 314, and the third connecting portion 315), the effect of dispersing heat throughout the first sheet metal member 310 can be obtained.

[0031] The first sheet metal member 310 has a first bent portion 316 that extends in the optical axis direction from the first connecting portion 313 toward the back side (rear). The first bent portion 316 is substantially orthogonal to the optical axis and has a planar first exposed portion 316a that is exposed on the appearance of the base member 300. As described above, the first exposed portion 316a is fastened by screws 542 in a state of being in contact with the first heat transfer plate 540. Similarly, the first sheet metal member 310 has a second bent portion 317 that extends in the optical axis direction from the second planar portion 312 toward the back side. The second bent portion 317 is substantially orthogonal to the optical axis and has a planar second exposed portion 317a that is exposed on the appearance of the base member 300.

[0032] As described above, in a state where the second exposed portion 317a is in contact with the second heat transfer plate 550, the second heat transfer plate 550 and the second sheet metal member 700 are fastened together by screws 720. By adopting such a configuration, the heat generated by the imaging element 510 can be transferred to the first heat transfer plate 540 and the second heat transfer plate 550 via the first sheet metal member 310.

[0033] The first sheet metal member 310 has an arm portion 318 that extends from the first planar portion 311 toward the main substrate 600 (in the optical axis direction from the first planar portion 311 toward the back side). The arm portion 318 serves as a heat transfer path for the heat generated by heat generating elements such as the CPU 610 and the DRAMs 620 and 630 to the first sheet metal member 310 (that is, to the front side of the imaging device 10). Therefore, it is desirable to make the length of the arm portion 318 in the direction orthogonal to the extending direction (front-rear direction) and the thickness direction (vertical direction in this embodiment) as long as possible and make the cross-sectional area as large as possible.

[0034] FIG. 4 is a cross-sectional view of the imaging device 10, showing a cross-section that includes the optical axis P and is orthogonal to the vertical direction. In the cross-section of FIG. 4, it can be seen that the arm portion 318 is disposed at a position closer to the optical axis P than the battery chamber 320. In other words, the arm portion 318 is disposed at a position closer to the optical axis P than the battery chamber 320 even on the optical axis projection plane. Thereby, heat transfer from the arm portion 318 to the grip portion 27 disposed near the battery chamber 320 can be suppressed. That is, by suppressing the temperature rise of the grip portion 27 that the user grips, it is possible to prevent the user from feeling uncomfortable due to the temperature rise of the grip portion 27. Further, compared with the case where the arm portion 318 is disposed on the right side (outer package side) of the battery chamber 320, the length of the heat transfer path from the inside of the imaging device 10 to the outer package surface is shortened, so that more efficient heat dissipation can be performed.

[0035] FIG. 5(a) is a cross-sectional view showing an extraction of some components from the cross-sectional view of FIG. 4. FIG. 5(b) is a front view of the first sheet metal member 310. As shown in FIG. 5(b), the arm portion 318 is provided near the outer periphery of the opening region S so that most of the arm portion 318 overlaps with the opening region S of the mount portion 11 on the projection plane in the optical axis direction. The heat generating elements equipped in the imaging device 10 are often disposed at positions close to the optical axis P of the imaging lens unit. For example, since it is necessary to align the center of the imaging element 510, which is one of the heat generating elements, with the optical axis P of the imaging lens unit, the center of the imaging element 510 is disposed so that the optical axis P passes therethrough. Further, another heat generating element, the CPU 610, is often disposed at a position close to the center of the imaging device 10 (that is, close to the optical axis P) in order to transfer the heat generated by the CPU 610 as evenly as possible to the entire outer package. As a result, inside the imaging device 10, the amount of heat generation tends to be large around the optical axis P. Therefore, in the present embodiment, the arm portion 318 is disposed inside the opening region S of the mount portion 11 and as close as possible to the optical axis P within a range that does not block the incident light from the imaging lens unit to the imaging element 510. Thereby, it is possible to efficiently transfer the heat generated by the plurality of heat generating elements inside the imaging device 10 to the outer package of the imaging device 10.

[0036] The wrist part 318 has a flat part 318b substantially parallel to the optical axis P and a bent part 318a bent from the flat part 318b so as to be substantially orthogonal to the optical axis P. FIG. 6(a) is an enlarged cross-sectional view of the periphery of the bent part 318a shown in FIG. 5(a).

[0037] The bent part 318a is a part close to the main board 600 in the optical axis direction, and a gap having a certain distance D is provided between the bent part 318a and the main board 600. If the bent part 318a is brought into contact with the main board 600, when an impact is applied to the imaging device 10, such as when the user accidentally drops the imaging device 10, the main board 600 may be damaged. On the other hand, in order to prevent damage to the main board 600 due to an impact applied to the imaging device 10, if the main board 600 and the bent part 318a are fixed by screwing or the like, various components cannot be mounted on the front and back of the main board 600 in the vicinity of the bent part 318a. As a result, it becomes necessary to increase the size of the main board 600, and there is a concern that the imaging device 10 will become larger. Therefore, it is desirable that the bent part 318a be arranged so that a gap having a certain distance D is formed between the bent part 318a and the main board 600 in the optical axis direction.

[0038] Also, no components (electrical components, electronic components) are mounted in the range overlapping the projection area in the optical axis direction of the bent part 318a on the surface (front surface (the surface facing the bent part 318a)) of the main board 600. This is to prevent the bent part 318a from contacting the components and damaging the components when an impact is applied to the imaging device 10.

[0039] Note that it is desirable not to provide the bent part 318a at a position overlapping the CPU 610 on the projection plane in the optical axis direction. Even when the CPU 610 is mounted on the back surface (rear surface) of the main board 600, when an impact is applied to the imaging device 10, the bent part 318a contacts the main board 600, which may cause cracks in the soldering part of the CPU 610 and lead to conduction failure.

[0040] FIG. 6(b) is a diagram showing a configuration in which a heat transfer member 660 is disposed between the bent portion 318a and the main substrate 600. The heat transfer member 660 is disposed so as to fill the distance D, that is, so as to be in contact with the bent portion 318a and the main substrate 600. Even if there is a space of distance D between the bent portion 318a and the main substrate 600, heat transfer from the main substrate 600 to the bent portion 318a is performed, but by disposing the heat transfer member 660, the heat transfer performance from the main substrate 600 to the arm portion 318 can be improved.

[0041] Note that the heat transfer member 660 desirably has elasticity capable of absorbing an impact force so that when an impact is applied to the imaging device 10, a large force is not applied from the bent portion 318a to the main substrate 600 via the heat transfer member 660. For example, as the heat transfer member 660, a thermally conductive silicone rubber in which a thermally conductive material is blended with silicone rubber or the like is used.

[0042] On the other hand, when the heat transfer performance from the main substrate 600 to the arm portion 318 is enhanced, there is a possibility that the surface temperature of the exterior near the imaging element 510 rises too much and the video shooting possible time (continuous driving time) of the imaging element 510 becomes short. Therefore, it is desirable to adjust the heat transfer performance to the first sheet metal member 310 by considering the balance between the temperature rise of heat generating elements such as the imaging element 510 and the CPU 610 and the temperature rise of the exterior surface, and by adjusting the presence or absence of the heat transfer member 660 and the distance D. Thereby, the video shooting possible time of the imaging element 510 can be extended to the maximum.

[0043] Next, the main heat transfer paths formed inside the imaging device 10 will be described. FIG. 7 is a front view of a main member group constituting the heat transfer path of the imaging device 10. FIG. 8(a) is a cross-sectional view taken along the arrow A-A shown in FIG. 7, and FIG. 8(b) is a cross-sectional view taken along the arrow B-B shown in FIG. 7.

[0044] As shown in FIG. 8(a), the first heat transfer path of the heat generated by the CPU 610 is a heat transfer path that is transferred to the first sheet metal member 310 by being transferred to the arm portion 318 through the main board 600. That is, the first heat transfer path is a path that transfers the heat generated by the heat generating element such as the CPU 610 mounted on the main board 600 to the front side of the imaging device 10. Further, the second heat transfer path of the heat generated by the CPU 610 is a path that is entirely transferred to the second sheet metal member 700 through a plurality of fastening portions by the screws 721, 722, 723, 724, 725 through the main board 600. That is, the second heat transfer path is a path that transfers the heat generated by the heat generating element such as the CPU 610 mounted on the main board 600 to the back side of the imaging device 10.

[0045] The heat transfer path of the heat generated by the imaging element 510 (hereinafter referred to as the "third heat transfer path") has two paths. As shown in FIG. 8(b), one of the third heat transfer paths is a path that passes through the first heat transfer plate 540 and is transferred to the first sheet metal member 310 through the first exposed portion 316a of the first sheet metal member 310. And the other one of the third heat transfer paths is a path that passes through the second heat transfer plate 550 and is transferred to the first sheet metal member 310 and the second sheet metal member 700 through the fastening portion between the second exposed portion 317a of the first sheet metal member 310 and the second sheet metal member 700 by the screw 720.

[0046] In the imaging device 10, since the front side and the back side of the imaging device 10 are thermally connected by the first to third heat transfer paths, the heat generated by the heat generating element inside the imaging device 10 can be efficiently dispersed and transferred to the entire exterior of the imaging device 10. Further, since the first heat transfer path is formed at a position close to the optical axis P, the heat transfer distance from the inside of the imaging device 10 to the entire exterior can be significantly shortened, and thus the heat dissipation performance can be greatly improved.

[0047] Note that the imaging device 10 is not limited to the first to third heat transfer paths. For example, as described above, the heat generated in the imaging element 510 is radiated to the base member 300 and the second sheet metal member 700 via the sensor plate 530, the first heat transfer plate 540, and the second heat transfer plate 550. Thus, the heat generated inside the imaging device 10 is transferred to the exterior member through the members that come into contact with the members serving as the heat transfer path. These auxiliary heat transfer paths also contribute to improving the heat dissipation performance of the imaging device 10.

[0048] As described above, according to the present invention, without increasing the size of the imaging device, the heat dissipation performance can be significantly improved, and as a result, long-time video shooting becomes possible.

[0049] The disclosure of the present embodiment includes the following configurations and methods. [Configuration 1] An imaging device including an imaging element, a substrate disposed on the back side of the imaging device relative to the imaging element, a heat generating element mounted on the substrate, a holding member for holding the substrate, a battery chamber for housing a battery, a first sheet metal member disposed on the front side of the imaging device relative to the imaging element, and a second sheet metal member disposed on the back side of the imaging device relative to the substrate, wherein the first sheet metal member has a first arm portion extending in the optical axis direction of the imaging device toward the back side of the imaging device, and the first arm portion is disposed at a position closer to the optical axis than the battery chamber on the projection plane in the optical axis direction. An imaging device characterized by this. [Configuration 2] The imaging device according to Configuration 1, wherein the first arm portion is disposed between the imaging element and the battery chamber. [Configuration 3] The holding member has a mount portion to which a photographing lens unit is detachably attached, and the first arm portion is disposed inside the opening region of the mount portion on the projection plane in the optical axis direction and at a position that does not block the incident light from the photographing lens unit to the imaging element. The imaging device according to Configuration 1 or 2, characterized by this. [Configuration 4] The first sheet metal member has a first flat portion that intersects substantially orthogonally with the optical axis direction and is connected to the first arm portion, and a second flat portion that intersects substantially orthogonally with the optical axis direction and is provided on the opposite side across the optical axis of the imaging device. The imaging device according to Configuration 3, characterized in that it has such. [Configuration 5] The first sheet metal member has a connecting portion that connects the first flat portion and the second flat portion outside the opening region of the mount portion on the projection plane in the optical axis direction. The imaging device according to Configuration 4, characterized in that it has such. [Configuration 6] A third sheet metal member adhered to the imaging element, a first heat transfer plate that thermally connects the third sheet metal member and the first sheet metal member, and a second heat transfer plate that thermally connects the first sheet metal member, the second sheet metal member, and the third sheet metal member. The first sheet metal member extends in the optical axis direction from the second flat portion toward the back side of the imaging device and has a second arm portion fastened to the second heat transfer plate. The imaging device according to Configuration 4 or 5, characterized in that it has such. [Configuration 7] A gap with a certain distance is provided between the first arm portion and the substrate in the optical axis direction. The imaging device according to any one of Configurations 1 to 6, characterized in that it has such. [Configuration 8] A heat transfer member is disposed in the gap so as to thermally connect the first arm portion and the substrate. The imaging device according to Configuration 7, characterized in that it has such. [Configuration 9] No components are mounted in the range of the surface of the substrate facing the first arm portion that overlaps the projection region of the first arm portion in the optical axis direction. The imaging device according to any one of Configurations 1 to 8, characterized in that it has such. [Configuration 10] The first arm portion and the heating element do not overlap on the projection plane in the optical axis direction. The imaging device according to any one of Configurations 1 to 9, characterized in that it has such. [Configuration 11] The first sheet metal member and the holding member are integrally formed. The imaging device according to any one of Configurations 1 to 10, characterized in that it has such. An imaging device including an imaging element, comprising: a substrate disposed on the back side of the imaging device relative to the imaging element and having a heating element mounted thereon; a first sheet metal member disposed on the front side of the imaging device relative to the imaging element; and a second sheet metal member disposed on the back side of the imaging device relative to the substrate, wherein heat generated by the heating element is transferred to the first sheet metal member through a first heat transfer path including the substrate and a portion where the substrate and the first sheet metal member are close to each other, and a second heat transfer path including the substrate and a plurality of fastening portions fastening the substrate and the second sheet metal member, through which the heat generated by the heating element is transferred to the second sheet metal member. [Configuration 13] A third sheet metal member adhered to the imaging element, a first heat transfer plate fastened to the third sheet metal member and the first sheet metal member, and a second heat transfer plate fastened to the third sheet metal member and fastened together with the first sheet metal member and the second sheet metal member, wherein heat generated by the imaging element is transferred to the first sheet metal member through the third sheet metal member and the first heat transfer plate, and a third heat transfer path including a path through which the heat is transferred to the first sheet metal member and the second sheet metal member through the third sheet metal member and the second heat transfer plate. The imaging device according to Configuration 12, characterized by having the above.

[0050] As described above, the present invention has been described in detail based on its preferred embodiments. However, the present invention is not limited to these specific embodiments, and various forms within the scope not departing from the gist of the present invention are also included in the present invention. Furthermore, each of the above-described embodiments merely shows one embodiment of the present invention, and it is also possible to appropriately combine the embodiments.

Explanation of Reference Numerals

[0051] 10 Imaging device 11 Mounting portion 300 Base member 310 First sheet metal member 311 First flat portion 312 Second flat portion 318 Arm portion 320 Battery chamber 510 imaging element 530 sensor plate 540 first heat transfer plate 550 second heat transfer plate 600 main substrate 660 heat transfer member 700 second sheet metal member

Claims

1. An imaging device comprising an imaging element mounted on an imaging substrate, a main board disposed on the rear side of the imaging device relative to the imaging board; a first sheet metal member disposed closer to a front surface of the imaging device than the imaging element; an imaging device characterized in that the first sheet metal member has a first arm portion extending in the optical axis direction toward the back side of the imaging device, a first heat transfer path thermally connected to the imaging element via a mechanical connection with a second sheet metal member that holds the imaging element and the imaging board, and a second heat transfer path via the first arm portion to which the main board is thermally connected without being mechanically connected.

2. The imaging device described in Claim 1, characterized in that the first arm portion is arranged between the imaging element and the battery chamber.

3. An imaging device as described in Claim 2, characterized in that the first arm is positioned closer to the optical axis than the battery compartment on the projection plane in the optical axis direction.

4. An imaging device as described in Claim 1, characterized in that a gap is provided between the first arm portion and the main board in the optical axis direction.

5. An imaging device as described in Claim 1, characterized in that the first arm and the heating element provided on the main board do not overlap on the projection plane in the optical axis direction.

6. An imaging device as described in Claim 5, characterized in that the heating element provided on the main board is an element that performs image processing.

7. An imaging device as described in Claim 5, characterized in that the heat generating element provided on the main board is a DRAM.

8. An imaging device as described in Claim 1, characterized in that no components are mounted on the surface of the main board facing the first arm in the area that overlaps with the projection area of ​​the first arm in the optical axis direction.

9. A holding member for holding the main board has a mount portion to which a photographing lens unit is attached and detached, 2. The imaging device according to claim 1, wherein the first arm is located inside the opening area of ​​the mount portion on a projection plane in the optical axis direction and at a position that does not block incident light from the photographing lens unit to the imaging element.

10. The first sheet metal member is a first planar portion that is substantially perpendicular to the optical axis direction and is connected to the first arm portion; 10. The imaging device according to claim 9, further comprising: a second flat portion that is substantially perpendicular to the optical axis direction and is provided on the opposite side of the optical axis of the imaging device.

11. The imaging device described in Claim 10, characterized in that the first sheet metal member has a connecting portion that connects the first planar portion and the second planar portion outside the opening area of ​​the mount portion on the projection surface in the optical axis direction.

12. An imaging device as described in Claim 9, characterized in that the holding member is made of resin, and the first sheet metal member and the holding member are integrally formed by insert molding.

13. A third sheet metal member arranged on the rear side of the imaging device relative to the main board; a first heat transfer member that thermally connects the second sheet metal member and the first sheet metal member; a second heat transfer member that thermally connects the first sheet metal member and the third sheet metal member to the second sheet metal member, The imaging device according to claim 10, characterized in that the first sheet metal member has a second arm portion that extends in the optical axis direction from the second planar portion toward the rear side of the imaging device and is fastened to the second heat transfer member.

14. A third sheet metal member arranged on the rear side of the imaging device relative to the main board, 2. The imaging device according to claim 1, further comprising a third heat transfer path through which heat generated by a heat generating element provided on the main board is transferred to the third sheet metal member via the main board and a plurality of fastening portions that fasten the main board to the third sheet metal member.

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