Plant heat management evaluation device

Abstract

To provide a plant heat management evaluation device capable of suppressing the possibility that calculation accuracy of energy consumption might deteriorate.SOLUTION: A plant heat management evaluation device 10 includes: a positional information acquisition section 1 that acquires positional information indicting a plurality of sites where a heating process or a cooling process is performed and a site where a heat management apparatus is installed; a piping route calculation section 2 that calculates a piping route of piping for interconnecting the plurality of sites where the heating process or the cooling process is performed on the basis of the positional information; a piping heat loss model generation section 3 that generates a piping heat loss model on the basis of the process information on the heating process and the cooling process, piping information on the piping and the piping route; and an extraction section 4 that extracts a combination of the site where the heat management apparatus is installed and the piping route, which minimizes energy consumption by using the piping heat loss model.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a factory thermal management evaluation device. [Background technology]

[0002] The analysis device disclosed in Patent Document 1 analyzes the energy efficiency when a heat pump is introduced into an energy system. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-029233 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present inventors have discovered the following problems. In such an energy system, there are pipes connecting each heat supply system and each heat receiving system. Media and the like are transported between each heat supply system and each heat receiving system via the pipes. Heat loss occurs through the pipes, which affects the amount of energy consumption, etc. Such an analysis device analyzes the energy consumption efficiency without considering the heat loss through the pipes. As a result, there is a risk that the calculation accuracy of the amount of energy consumption will decrease.

[0005] The present disclosure has been made in consideration of the above-mentioned problems, and provides a factory thermal management evaluation device that can reduce the risk of a decrease in the calculation accuracy of energy consumption. [Means for solving the problem]

[0006] The factory thermal management evaluation device according to the present disclosure comprises: a location information acquiring unit that acquires location information indicating a plurality of locations where the heating process or the cooling process is performed and a location where the thermal management device is installed; a piping route calculation unit that calculates a piping route connecting a plurality of locations where the heating process or the cooling process is performed based on the position information; and a piping heat loss model generating unit configured to generate a piping heat loss model based on process information of the heating process and the cooling process, piping information of the piping, and the piping route; and an extraction unit that uses the piping heat loss model to extract a combination of the location where the thermal management device is installed and the piping route that results in the smallest amount of energy consumption. Effect of the Invention

[0007] According to the present disclosure, it is possible to suppress the risk of a decrease in the calculation accuracy of energy consumption. [Brief description of the drawings]

[0008] [Figure 1] 1 is a block diagram showing an example of a configuration of a factory thermal management evaluation device according to a first embodiment. [Diagram 2] 4 is a flowchart showing an example of processing performed by the factory thermal management evaluation device according to the first embodiment. [Diagram 3] 2 is a schematic diagram showing an example of processing of the factory thermal management evaluation device according to the first embodiment; FIG. [Figure 4] 1 is a table list constituting an example of process information. [Diagram 5] 11 is a table list constituting an example of process heat quantity information of a heat management device. [Figure 6] 1 is a table list constituting an example of a COP performance table of a heat pump device. [Figure 7] 1 is a table listing an example of the amount of heat required by a process for each time. [Figure 8] FIG. 2 is a schematic diagram showing an example of a piping heat loss model. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. In addition, the following description and drawings are appropriately simplified for clarity of explanation.

[0010] <Embodiment 1> The first embodiment will be described with reference to FIG.

[0011] As shown in FIG. 1, a factory thermal management evaluation device 10 includes a position information acquisition unit 1, a piping route calculation unit 2, a piping heat loss model generation unit 3, and an extraction unit 4.

[0012] The location information acquisition unit 1 acquires location information indicating a plurality of locations where the heating process or the cooling process is performed and a location where a heat management device is installed. The heat management device is, for example, a heat pump device, a heat exchanger, a heat buffer, etc. The heat buffer may be any device that can store heat, such as a heat storage tank or a hot water tank.

[0013] Based on the position information acquired by the position information acquisition unit 1, the piping route calculation unit 2 calculates a piping route for piping connecting a plurality of locations where the heating process or the cooling process is performed.

[0014] The piping heat loss model generating unit 3 generates a piping heat loss model based on the process information of the heating process and the cooling process, the piping information of the piping, and the above-mentioned piping route.

[0015] The extraction unit 4 uses the piping heat loss model generated by the piping heat loss model generation unit 3 to extract a combination of the location where the thermal management device is installed and the piping route that results in the smallest amount of energy consumption.

[0016] The factory thermal management evaluation device 10 is a computer equipped with, for example, a central processing unit, a memory, various interfaces, a communication module, storage, etc. The storage stores various programs. The processor reads and executes the programs loaded onto the memory, thereby providing the processing and functions of the factory thermal management evaluation device 10. In addition, the storage may hold, for example, a thermal management device list including information on the thermal management devices.

[0017] As described above, the above-described configuration of the factory thermal management evaluation device 10 makes it possible to determine the combination of the location where the thermal management device is installed and the piping route that results in the smallest amount of energy consumption, taking into account the heat loss in the piping. This makes it possible to reduce errors in the calculation results of the amount of energy consumption caused by the heat loss in the piping, and to suppress the risk of a decrease in the accuracy of the calculation of the amount of energy consumption.

[0018] The above-mentioned factory thermal management evaluation device 10 can also evaluate the thermal management of a factory that uses a thermal buffer as a thermal management device. Therefore, it is possible to obtain a combination of the location where the thermal buffer is installed and the piping route that minimizes the amount of energy consumption, taking into account the thermal capacity of the thermal buffer and the piping. Furthermore, it is possible to suppress the risk of a decrease in the calculation accuracy of the amount of energy consumption.

[0019] <Processing> Next, an example of the processing of the factory thermal management evaluation device 10 will be described with reference to FIGS.

[0020] Information on the process of the system performing thermal management is acquired (step ST1). In the example shown in Fig. 3, process information indicating heating processes PH1, PH2, PH3 and cooling processes PC1, PC2 is acquired. The process information is, for example, position coordinates, type, medium, target temperature, flow rate, inlet temperature, etc. The type is, for example, heating, cooling, etc. The medium is, for example, air, water, etc. A specific example of the process information is shown in Fig. 4.

[0021] Next, a combination pattern of mutually connected processes is generated (step ST2). In the example shown in Fig. 3, three heating processes PH1, PH2, and PH3 are connected to two cooling processes PC1 and PC2, respectively. Specifically, the combinations are a total of six combinations, including a combination of the heating process PH1 and a cooling process PC1, a combination of the heating process PH1 and a cooling process PC2, a combination of the heating process PH2 and a cooling process PC1, a combination of the heating process PH2 and a cooling process PC2, a combination of the heating process PH3 and a cooling process PC1, and a combination of the heating process PH3 and a cooling process PC2.

[0022] Next, a pattern is generated in which a thermal management device is combined with a combination pattern of processes (step ST3). Specifically, each thermal management device listed in the thermal management device list is combined with a combination pattern of processes to generate a pattern in which the thermal management devices are combined. The thermal management device list includes information on the heat exchanger, the heat pump, and the thermal buffer. The information on the heat exchanger is, for example, the size, the heat transfer area, the heat exchange method, etc. The heat exchange method is, for example, counterflow. The information on the heat pump includes, for example, the rated power, COP (Conference of the Parties) performance information, and the medium, upper limit temperature, and upper limit flow rate during heating or cooling. The information on the thermal buffer is, for example, the size, the heat capacity, etc.

[0023] An example of the heat pump information is shown in FIG. 5. An example of the COP performance information is shown in FIG. 6. In the example shown in FIGS. 2 and 5, in step ST3, two heat management devices HPX and HPY are combined with a total of six process combination patterns, such as a combination of a heating process PH1 and a cooling process PC1. This generates a total of 12 patterns, such as a combination of a heating process PH1, a cooling process PC1, and a heat management device HPX, a combination of a heating process PH1, a cooling process PC2, and a heat management device HPY, etc. Note that step ST3 may be performed by extracting only heat management devices that match the process combination patterns using information on the process combination patterns and the heat management device list. In addition, the number of heat management devices to be combined with one process combination pattern is not particularly limited.

[0024] Next, an exhaustive search pattern is generated (step ST4). Specifically, a piping model of piping that connects processes to each other is selected based on the pattern generated in step ST3. Pipes are selected according to process information indicating the processes of the pattern generated in step ST3, such as medium, target temperature, flow rate, etc. The piping model of the selected piping is combined with the pattern generated in step ST3 to generate an exhaustive search pattern. The exhaustive search pattern includes all patterns that combine processes and thermal management devices that are connected to each other, and each pattern includes a piping model. The piping model includes, for example, the diameter, thickness, and thermal conductivity of the piping.

[0025] Next, one pattern is selected from the exhaustive search patterns (step ST5). In the next steps ST6 to ST8, the energy consumption of the selected pattern is calculated. In the example shown in Fig. 3, the exhaustive search patterns are made up of n patterns, including patterns R1, R2, R3, ..., Rn.

[0026] Next, the position of the thermal management device is determined (step ST6). A piping route is generated using the position coordinates of the processes connected to each other. The piping route may be generated so that the total length of the piping route is minimized in Manhattan distance. The installation position of the thermal management device may be appropriately restricted by the installation area and size of the thermal management device. The piping length between the thermal management device and the process may be calculated based on the position coordinates of the processes connected to each other and the position information of the thermal management device. The position of the thermal management device may be determined so that the piping cost is minimized. In the example shown in FIG. 3, when the pattern R1 is selected in step ST5, the position of the thermal management device M1 is determined in step ST6 to be near the center of the piping route of the piping connecting the heating process PH1 and the cooling process PC1. When the patterns R2 and R3 are selected in step ST5, the positions of the thermal management devices M2 and M3 are similarly determined to be predetermined positions on the piping route.

[0027] Next, the heat quantity information of the process is acquired (step ST7). The heat quantity information of the process is, for example, the heat quantity required by the process at each time point. Each time point is, for example, every minute or every hour. The length from the start point to the end point is, for example, one year. If this heat quantity changes, it is advisable to specify whether to change the flow rate or inlet temperature of the medium from the rated value. The heat quantity information of the process may be the heat quantity required by the process at a specified time during stable operation. One specific example of the heat quantity information of the process is shown in FIG. 7.

[0028] Next, the energy consumption of the pattern selected in step ST5 is calculated (step ST8). Specifically, the energy consumption of the pattern is the amount of energy required by the entire process when the thermal management device is operated optimally. The amount of energy required by the entire process when the thermal management device is operated optimally may be calculated by calculating the sum of the power consumption of the thermal management device and the amount of energy required by the process. The conditions for optimally operating the thermal management device can be determined by comparing the thermal energy of the connected heating process and cooling process and determining the lesser amount of thermal energy supply. The amount of energy required by the process may be calculated using the heat amount information of the process acquired in step ST7, the position of the thermal management device, the amount of heat dissipated by the piping, etc.

[0029] The amount of heat radiation from the piping can be obtained using a piping heat loss model. Specifically, a piping heat loss model is generated based on process information, piping information, and a piping route. An example of a piping heat loss model shown in FIG. 8 is an area i of a piping having a substantially circular cross-sectional shape. The area i of the piping is one of N areas obtained by dividing the piping in the extending direction. i is a natural number from 1 to N. The amount of external heat radiation Q of the area i is i and the natural convection heat transfer coefficient h n , pipe surface temperature T si , outside temperature T amb , surface area A i , specific heat Cp i , mass flow rate F in , inlet temperature T in , outflow temperature T out , pipe length L i , pipe conductivity λ, average input and output temperature T ai , pipe surface temperature T si , inner radius of pipe r 0 The relationship between the thickness of the pipe and the thickness of the pipe is expressed by the following formulas (1) to (3).

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[0030] Next, the energy consumption of the pattern selected in step ST5 in which one thermal management device is added is calculated (step ST9: NO, step ST10, step ST8).

[0031] If the energy consumption calculated in step ST8 is lower than the energy consumption calculated in the previous step ST8, the process returns to step ST10 (step ST9: NO).

[0032] If the energy consumption calculated in step ST8 is equal to or greater than the energy consumption calculated in the previous step ST8, the process proceeds to step ST11 (step ST9: YES).

[0033] Steps ST5 to ST10 are repeated until the energy consumption of all patterns included in the exhaustive search pattern is calculated (step ST11: NO).

[0034] When the energy consumption of all patterns included in the exhaustive search pattern is calculated (step ST11: YES), the smallest energy consumption level is extracted (step ST12). In other words, the smallest energy consumption level is the level at which the energy saving effect of thermal management is the greatest. In the example shown in FIG. 3, a pattern RM showing the smallest energy consumption level is extracted. In pattern RM, two pipes extend along different routes and connect the heating process PH1 and the cooling process PC2. Two thermal management devices M1 and M4 are installed on the two pipes, respectively. In addition, thermal management devices M5, M6, and M7 are installed at the same location on the pipes connecting the heating process PH3 and the cooling process PC2.

[0035] As a result, the energy consumption can be calculated taking into account the heat loss due to the piping, which reduces the risk of a decrease in the accuracy of the calculation of the energy consumption.

[0036] The present invention is not limited to the above-mentioned embodiment, and can be modified as appropriate without departing from the spirit of the present invention. The present invention may be implemented by appropriately combining the above-mentioned embodiment and examples thereof. For example, in step ST11 shown in FIG. 2, a search is performed for all connection patterns, but a search may be performed using an objective function. Performing a search using an objective function may shorten the search time. In addition, at least one of the thermal management device list and the piping model may include costs such as acquisition costs and construction costs. In step ST8, the cost of the pattern may be calculated in the same way as the energy consumption of the pattern. [Explanation of symbols]

[0037] 10 Factory Thermal Management Evaluation Equipment 1 Location information acquisition section 2 Piping route calculation section 3. Piping heat loss model generation section 4 Extraction part

Claims

1. a location information acquiring unit that acquires location information indicating a plurality of locations where the heating process or the cooling process is performed and a location where the thermal management device is installed; a piping route calculation unit that calculates a piping route connecting a plurality of locations where the heating process or the cooling process is performed based on the position information; and a piping heat loss model generating unit configured to generate a piping heat loss model based on process information of the heating process and the cooling process, piping information of the piping, and the piping route; and an extraction unit that extracts a combination of a location where the thermal management device is installed and the piping route that has the smallest energy consumption by using the piping heat loss model. Factory thermal management evaluation equipment.

2. the thermal management device includes a heat pump; The factory thermal management evaluation device according to claim 1 , wherein the piping connects a location where the heating process is performed and a location where the cooling process is performed.

3. the thermal management device includes a heat exchanger; The factory thermal management evaluation device according to claim 1 , wherein the piping connects a location where the heating process is performed and a location where the heating process is performed.

4. the thermal management device includes a thermal buffer; The factory thermal management evaluation device according to claim 1 .

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