Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of improving a cooling property.SOLUTION: A substrate processing apparatus comprises: a processing container; a mounting board that is provided into the processing container, includes a first contact surface, and is rotatably constructed; a refrigeration machine that includes a second contact surface, and is constructed so as to be elevated; a rotational device that rotates the mounting board; and an elevated device that elevates the refrigeration machine, and can thermally be connected or separated to / from the second contact surface and the first contact surface. The refrigeration machine includes a refrigerator, and a cold link of which one end is thermally contacted to the refrigeration machine, and the second contact surface is provided to the other end. A volume of the cold link is larger than that of the mounting board.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus.

Background Art

[0002] Patent Document 1 discloses a holding device that rotatably holds an object to be processed while cooling it in a vacuum chamber, the holding device including a stage on which the object to be processed is placed, a rotation driving means for rotatably supporting the stage, and a cooling means for cooling the stage. With the stage surface side where the object to be processed is placed facing upward, the rotation driving means includes a cylindrical rotating shaft body that penetrates through a wall surface of the vacuum chamber via a first vacuum seal, a connecting member that connects an upper end portion of the rotating shaft body and a lower surface of the stage so that a space is defined below the stage, and a driving motor that rotationally drives the rotating shaft body. The cooling means includes a cooling panel that is disposed to face a lower surface of the stage with a gap in a space below the stage, a heat transfer shaft body that is inserted into the rotating shaft body and abuts against a lower surface of the cooling panel, and a refrigerator that cools the heat transfer shaft body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] One aspect of the present disclosure provides a substrate processing apparatus with improved cooling performance.

Means for Solving the Problems

[0005] According to one aspect of the present disclosure, there is provided a substrate processing apparatus including a processing container, a mounting table provided in the processing container, having a first contact surface and configured to be rotatable, a refrigeration device having a second contact surface and configured to be movable up and down, a rotation device configured to rotate the mounting table, and a lifting device configured to move the refrigeration device up and down to thermally connect or disconnect the second contact surface and the first contact surface. The refrigeration device includes a refrigerator and a cold link having one end thermally connected to the refrigerator and the other end having the second contact surface. The volume of the cold link is larger than the volume of the mounting table.

Advantages of the Invention

[0006] According to one aspect of the present disclosure, a substrate processing apparatus capable of improving coolability can be provided.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are assigned to the same components, and redundant descriptions may be omitted.

[0009] In this specification, for directions such as parallel, perpendicular, orthogonal, horizontal, vertical, up and down, left and right, a deviation to the extent that does not impair the effects of the embodiments is allowed. The shape of the corner is not limited to a right angle and may be arcuate and rounded. For parallel, perpendicular, orthogonal, horizontal, vertical, circular, and coincident, substantially parallel, substantially perpendicular, substantially orthogonal, substantially horizontal, substantially vertical, substantially circular, and substantially coincident may be included.

[0010] [Substrate Processing Apparatus] An example of the substrate processing apparatus 1 according to an embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a cross-sectional view showing an example configuration when the mounting table 20 of the substrate processing apparatus 1 according to an embodiment rotates. FIG. 2 is a partially enlarged cross-sectional view showing an example configuration when the mounting table 20 rotates and cools. (a) shows the rotation of the mounting table 20, and (b) shows the cooling of the mounting table 20.

[0011] Note that the substrate processing apparatus 1 may be, for example, a CVD (Chemical Vapor Deposition) apparatus or an ALD (Atomic Layer Deposition) apparatus that supplies a processing gas into the processing chamber 10 to perform a desired process (such as a film forming process) on the substrate W. Further, it may be a PE-CVD (Plasma-Enhanced Chemical Vapor Deposition) apparatus or a PE-ALD (Plasma-Enhanced Atomic Layer Deposition) that generates plasma of a processing gas in the processing chamber 10 to perform a desired process on the substrate W. Further, the substrate processing apparatus 1 may be, for example, a PVD apparatus that supplies a processing gas into the processing chamber 10 and sputters a target provided in the processing chamber 10 to perform a desired process (such as a film forming process) on the substrate W.

[0012] The substrate processing apparatus 1 includes a processing chamber 10, a mounting table 20 for mounting the substrate W inside the processing chamber 10, a refrigeration device 30, a rotating device 40 for rotating the mounting table 20, and a lifting device 50 for lifting and lowering the refrigeration device 30. Inside the processing chamber 10, a mounting table 20 for mounting the substrate W is provided. Further, the substrate processing apparatus 1 includes a control device 80 that controls various devices such as the refrigeration device 30, the rotating device 40, and the lifting device 50.

[0013] The processing container 10 forms an internal space 10S. The processing container 10 is configured such that its internal space 10S is decompressed to an ultra-high vacuum by operating an evacuation device (not shown) such as a vacuum pump. Further, the processing container 10 is configured to supply a desired gas used for substrate processing through a gas supply pipe (not shown) communicating with a processing gas supply device (not shown).

[0014] The mounting table 20 is formed of a material with high thermal conductivity (e.g., Cu). The mounting table 20 includes an electrostatic chuck 21. The electrostatic chuck 21 has a chuck electrode 21a embedded in a dielectric film. The substrate processing apparatus 1 includes a slip ring 60 for supplying power to the chuck electrode 21a of the rotating mounting table 20. A predetermined potential is applied to the chuck electrode 21a via the slip ring 60 and wiring 63. With this configuration, the substrate W can be adsorbed and held on the mounting surface by the electrostatic chuck 21, and the substrate W can be fixed to the upper surface (mounting surface) of the mounting table 20. Further, the mounting table 20 has a first contact surface 21s (see FIG. 2) that contacts the refrigeration heat medium 32 on a surface (lower surface) opposite to the mounting surface (upper surface) on which the substrate W is mounted. The first contact surface 21s is, for example, a flat surface.

[0015] Further, outside the radial direction of the electrostatic chuck 21, a shield member 22 is provided to prevent the film from adhering to the rotating device 40 or the like when a film forming process or the like is performed on the substrate W placed on the mounting table 20. The shield member 22 is an annular member and is supported by the electrostatic chuck 21 via a heat insulating member 74 described later. That is, the shield member 22 rotates together with the mounting table 20 by the rotating device 40.

[0016] Here, the shield member 22 is formed to cover the structure below the mounting table 20 such as the rotating device 40 from the process gas or the plasma of the process gas. Or, the shield member 22 is formed to cover the structure below the mounting table 20 such as the rotating device 40 when viewed from the target that emits sputtering particles. For this reason, the shield member 22 is formed with a large surface area, and the temperature easily rises when radiant heat from the target, the side wall of the processing container 10, etc. enters.

[0017] A heat insulating member 74 is provided between the mounting table 20 (electrostatic chuck 21) and the shield member 22. As the heat insulating member 74, a resin material having a low thermal conductivity (for example, PTFE: polytetrafluoroethylene, etc.) can be used. Thereby, the heat input from the shield member 22 to the mounting table 20 can be suppressed, and the cooling performance of the mounting table 20 can be improved.

[0018] Although the description has been made on the assumption that the heat insulating member 74 is provided between the mounting table 20 (electrostatic chuck 21) and the shield member 22, it is not limited thereto. There may be a heat insulating structure between the mounting table 20 (electrostatic chuck 21) and the shield member 22 that suppresses heat conduction between the mounting table 20 and the shield member 22. For example, instead of the mounting table 20 and the shield member 22 being in surface contact, a structure that reduces the contact area by making point contact using pins and suppresses heat conduction may be used.

[0019] The refrigeration device 30 is configured to contact or separate from the mounting table 20 at the lower part of the mounting table 20 and cool the mounting table 20 (electrostatic chuck 21). The refrigeration device 30 is composed of a refrigerator 31 and a refrigeration heat medium 32 stacked together. Note that the refrigeration heat medium 32 can also be referred to as a cold link. The refrigerator 31 holds the refrigeration heat medium 32 and cools the upper surface of the refrigeration heat medium 32 to an extremely low temperature. From the perspective of cooling capacity, it is preferable to adopt a form that utilizes the GM (Gifford-McMahon) cycle for the refrigerator 31. One end (lower end) of the refrigeration heat medium 32 is fixed on and thermally connected to the refrigerator 31, and its upper part is housed inside the processing container 10. The other end (upper end) of the refrigeration heat medium 32 has a second contact surface 32s. The refrigeration heat medium 32 is formed of a material with high thermal conductivity (for example, Cu), and its outer shape is substantially cylindrical. The refrigeration heat medium 32 is arranged such that its center coincides with the central axis CL of the mounting table 20.

[0020] The refrigeration heat medium 32 has a head portion 32a and a shaft portion 32b. The head portion 32a is a part having a second contact surface 32s (see FIG. 2) that abuts against the first contact surface 21s of the mounting table 20, and is a part that expands in the radial direction more than the shaft portion 32b. The shaft portion 32b is a part that thermally connects the head portion 32a and the refrigerator 31.

[0021] Here, the mounting table 20 and the refrigeration heat medium 32 are formed of a material with high thermal conductivity (for example, Cu). Preferably, the volume of the refrigeration heat medium 32 is larger than the volume of the mounting table 20. Also preferably, the heat capacity of the refrigeration heat medium 32 is larger than the heat capacity of the mounting table 20. Thereby, a large heat capacity of the refrigeration heat medium 32 can be ensured, and the temperature change of the refrigeration heat medium 32 due to the heat input from the radiant heat from the side wall of the processing container 10 or the like, or the heat transfer from the mounting table 20 to the refrigeration heat medium 32 when they are brought into contact is suppressed.

[0022] Also, it is preferable that the volume of the head 32a of the refrigerating heat medium 32 is larger than the volume of the shaft portion 32b of the refrigerating heat medium 32. Also, it is preferable that the heat capacity of the head 32a of the refrigerating heat medium 32 is larger than the heat capacity of the shaft portion 32b of the refrigerating heat medium 32. Thereby, it is possible to secure a large heat capacity of the head 32a of the refrigerating heat medium 32 that comes into contact with the mounting table 20, and suppress the temperature change of the refrigerating heat medium 32 due to heat input by radiant heat from the side wall of the processing container 10 or the like, or heat transfer from the mounting table 20 to the refrigerating heat medium 32 when coming into contact with the mounting table 20.

[0023] Also, it is preferable that the volume of the head 32a of the refrigerating heat medium 32 is larger than the volume of the mounting table 20. Also, it is preferable that the heat capacity of the head 32a of the refrigerating heat medium 32 is larger than the heat capacity of the mounting table 20. Thereby, it is possible to secure a large heat capacity of the head 32a of the refrigerating heat medium 32 that comes into contact with the mounting table 20, and suppress the temperature change of the refrigerating heat medium 32 due to heat input by radiant heat from the side wall of the processing container 10 or the like, or heat transfer from the mounting table 20 to the refrigerating heat medium 32 when coming into contact with the mounting table 20.

[0024] A first reflecting member 71 is provided around the refrigerating heat medium 32. The first reflecting member 71 reflects radiant heat from the side wall of the processing container 10 or the like to prevent radiant heat from entering the refrigerating heat medium 32. The first reflecting member 71 is made of a metal material such as stainless steel (SUS) or aluminum. A mirror finish is applied to the surface of the first reflecting member 71 to reflect radiant heat from the side wall of the processing container 10 or the like. Also, a plating treatment (for example, gold plating treatment, nickel plating treatment, etc.) may be applied to the surface of the first reflecting member 71. Also, a plating treatment (for example, nickel plating treatment, etc.) is applied to the surface of the refrigerator 31 and the refrigerating heat medium 32 to reflect radiant heat. Thereby, the temperature rise of the refrigerating heat medium 32 due to radiant heat is suppressed, and the cooling performance of the mounting table 20 is improved.

[0025] The first reflecting member 71 has a cylindrical portion 71a that covers the sides of the refrigerator 31 and the shaft portion 32b, an annular portion 71b that covers the lower part of the head portion 32a, and a cylindrical portion 71c that covers the sides of the head portion 32a. Note that the annular portion 71b may be connected to the cylindrical portion 71a on the inner diameter side and to the cylindrical portion 71c on the outer diameter side. Also, the cylindrical portion 71a, the annular portion 71b, and the cylindrical portion 71c may each be configured as separate components.

[0026] Note that the first reflecting member 71 may be fixed to the processing container 10, or may be supported by a refrigerator support portion 53 or the like so as to move up and down together with the refrigeration device 30 by the lifting device 50.

[0027] Also, the mounting table 20 is rotatably supported by a rotating device 40. The rotating device 40 includes a rotation driving device 41, a fixed shaft 45, a rotating shaft 44, a housing 46, magnetic fluid seals 47, 48, and a stand 49.

[0028] The rotation driving device 41 is a direct drive motor having a rotor 42 and a stator 43. The rotor 42 has a substantially cylindrical shape extending coaxially with the rotating shaft 44 and is fixed to the rotating shaft 44. The stator 43 has a substantially cylindrical shape with an inner diameter larger than the outer diameter of the rotor 42. The rotation driving device 41 may be in a form other than a direct drive motor, such as a form including a servo motor and a transmission belt.

[0029] The rotating shaft 44 has a substantially cylindrical shape extending coaxially with the central axis CL of the mounting table 20. A fixed shaft 45 is provided on the inner side in the radial direction of the rotating shaft 44. The fixed shaft 45 has a substantially cylindrical shape extending coaxially with the central axis CL of the mounting table 20. A housing 46 is provided on the outer side in the radial direction of the rotating shaft 44. The housing 46 has a substantially cylindrical shape extending coaxially with the central axis CL of the mounting table 20 and is fixed to the processing container 10.

[0030] Also, a magnetic fluid seal 47 is provided between the outer peripheral surface of the fixed shaft 45 and the inner peripheral circle of the rotating shaft 44. The magnetic fluid seal 47 rotatably supports the rotating shaft 44 with respect to the fixed shaft 45, seals the space between the outer peripheral surface of the fixed shaft 45 and the inner peripheral circle of the rotating shaft 44, and separates the internal space 10S of the processing container 10 capable of being depressurized from the external space of the processing container 10. Further, a magnetic fluid seal 48 is provided between the inner peripheral surface of the housing 46 and the outer peripheral circle of the rotating shaft 44. The magnetic fluid seal 48 rotatably supports the rotating shaft 44 with respect to the housing 46, seals the space between the inner peripheral surface of the housing 46 and the outer peripheral circle of the rotating shaft 44, and separates the internal space 10S of the processing container 10 capable of being depressurized from the external space of the processing container 10. Thereby, the rotating shaft 44 is rotatably supported by the fixed shaft 45 and the housing 46. Further, a refrigeration heat medium 32 is inserted inside the fixed shaft 45 in the radial direction. Note that a substantially cylindrical first reflecting member 71 (cylindrical portion 71a) is disposed between the fixed shaft 45 and the refrigeration heat medium 32.

[0031] The stand 49 is provided vertically between the rotating shaft 44 and the mounting table 20 and is configured to transmit the rotation of the rotating shaft 44 to the mounting table 20.

[0032] Also, a heat insulating member 73 is provided between the mounting table 20 (electrostatic chuck 21) and the stand 49. As the heat insulating member 73, a resin material having a low thermal conductivity (for example, PTFE or the like) can be used. Thereby, heat input from the stand 49 to the mounting table 20 can be suppressed, and the cooling performance of the mounting table 20 can be improved.

[0033] Note that although the description has been made on the assumption that the heat insulating member 73 is provided between the mounting table 20 (electrostatic chuck 21) and the stand 49, the present invention is not limited thereto. The mounting table 20 (electrostatic chuck 21) and the stand 49 may have a heat insulating structure that suppresses heat conduction therebetween. For example, instead of the mounting table 20 and the stand 49 being in surface contact, a structure may be adopted in which point contact using pins is made to reduce the contact area and suppress heat conduction.

[0034] A substantially cylindrical second reflecting member 72 is provided on the inner circumferential side of the stand 49. The second reflecting member 72 reflects radiant heat from the side wall of the processing vessel 10 or the like to prevent the radiant heat from entering the refrigerating heat medium 32. In particular, the upper surface of the head 32a of the refrigerating heat medium 32 serves as a second contact surface 32s that contacts the mounting table 20 and is not covered by the first reflecting member 71. The second reflecting member 72 prevents radiant heat from the side wall of the processing vessel 10 or the like from entering the second contact surface 32s of the refrigerating heat medium 32. Further, the second reflecting member 72 suppresses the entry of radiant heat from the lower surface side of the mounting table 20. The second reflecting member 72 is made of a metallic material such as stainless steel (SUS) or aluminum. The surface of the second reflecting member 72 is subjected to mirror finishing. Further, the surface of the second reflecting member 72 may be subjected to plating treatment (for example, gold plating treatment, nickel plating treatment, etc.). Thereby, the temperature rise of the refrigerating heat medium 32 due to radiant heat is suppressed, and the cooling performance of the mounting table 20 is improved.

[0035] Note that the second reflecting member 72 may be fixed to the mounting table 20 and / or the stand 49 and supported so as to rotate together with the mounting table 20 by the rotating device 40. Further, as shown in FIG. 1, the diameter of the second reflecting member 72 is larger than the diameter of the cylindrical portion 71c of the first reflecting member 71, and at least a part of the first reflecting member 71 may enter the cylindrical second reflecting member 72.

[0036] With the above configuration, when the rotor 42 of the rotary drive device 41 rotates, the rotary shaft 44, the stand 49, and the mounting table 20 rotate relative to the refrigerating heat medium 32 in the X1 direction (see FIG. 1).

[0037] Further, the refrigeration device 30 is supported by a lifting device 50 so as to be movable up and down. The lifting device 50 includes an air cylinder 51, a link mechanism 52, a refrigeration device support portion 53, a linear guide 54, a fixing portion 55, and a bellows 56.

[0038] The air cylinder 51 is a mechanical device in which a rod moves linearly by air pressure. The link mechanism 52 converts the linear motion of the rod of the air cylinder 51 into the lifting motion of the refrigeration device support portion 53. Further, the link mechanism 52 has a lever structure with one end connected to the air cylinder 51 and the other end connected to the refrigeration device support portion 53. Thereby, a large pressing force can be generated with a small thrust of the air cylinder 51. The refrigeration device support portion 53 supports the refrigeration device 30 (refrigerator 31, refrigeration heat medium 32). Further, the moving direction of the refrigeration device support portion 53 is guided in the lifting direction by the linear guide 54.

[0039] The fixing portion 55 is fixed to the lower surface of the fixing shaft 45. A substantially cylindrical bellows 56 surrounding the refrigerator 31 is provided between the lower surface of the fixing portion 55 and the upper surface of the refrigeration device support portion 53. The bellows 56 is a metal bellows structure that can expand and contract in the vertical direction. Thereby, the fixing portion 55, the bellows 56, and the refrigeration device support portion 53 seal the space between the inner peripheral surface of the fixing shaft 45 and the outer peripheral circle of the refrigeration heat medium 32, and separate the internal space 10S of the depressurizable processing container 10 from the external space of the processing container 10. Further, the lower surface side of the refrigeration device support portion 53 is adjacent to the external space of the processing container 10, and the region surrounded by the bellows 56 on the upper surface side of the refrigeration device support portion 53 is adjacent to the internal space 10S of the processing container 10.

[0040] The substrate processing apparatus 1 has a slip ring 60 made of metal below the rotating shaft 44 and the housing 46 in order to supply a DC voltage (DC voltage, direct current voltage) to the chuck electrode 21a.

[0041] The slip ring 60 has a rotating body 61 including a metal ring and a fixed body 62 including a brush. The rotating body 61 has a substantially cylindrical shape extending coaxially with the rotating shaft 44 and is fixed to the lower surface of the rotating shaft 44. The fixed body 62 has a substantially cylindrical shape with an inner diameter slightly larger than the outer diameter of the rotating body 61 and is fixed to the lower surface of the housing 46. The slip ring 60 is electrically connected to a DC power source (not shown) and supplies the power supplied from the DC power source to the wiring 63 via the brush of the fixed body 62 and the metal ring of the rotating body 61. With this configuration, a potential can be applied from the DC power source to the chuck electrode 21a without causing twisting or the like in the wiring 63. Note that the structure of the slip ring 60 may be a structure other than the brush structure, for example, a non-contact power supply structure, a structure having no mercury or a conductive liquid, or the like.

[0042] At the upper part of the processing container 10, a cathode part (not shown) is provided facing the mounting table 20 and configured to sputter a plurality of targets. The power source connected to the cathode part may be either a DC (direct current) power source or an RF (radio frequency) power source, or may be a DC power source and an RF power source, but is not limited thereto. At least either a DC voltage or an RF voltage may be applied to the cathode part from the DC power source and / or the RF power source.

[0043] The control device 80 is, for example, a computer and includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, and the like. The CPU operates based on a program stored in the ROM or the auxiliary storage device and controls the operation of the substrate processing apparatus 1. The control device 80 can control the substrate processing apparatus 1 by means of communication such as wired or wireless.

[0044] When performing a desired process on the substrate W, as shown in FIGS. 1 and 2(a), the control device 80 controls the lifting device 50 (air cylinder 51) to separate the mounting table 20 from the refrigerating heat medium 32, and controls the rotating device 40 (rotary drive device 41) to rotate the mounting table 20 on which the substrate W is placed. Note that the shielding member 22 and the second reflecting member 72 also rotate together with the mounting table 20. Thereby, the in-plane uniformity of the substrate process (for example, film forming process, etc.) of the substrate W can be improved.

[0045] Also, when cooling the mounting table 20 and the substrate W placed on the mounting table 20, as shown in FIG. 2(b), the control device 80 stops the rotating device 40 (rotary drive device 41) to stop the rotation of the mounting table 20, and controls the lifting device 50 (air cylinder 51) to thermally connect the mounting table 20 and the refrigerating heat medium 32. Thereby, the substrate W placed on the mounting table 20 can be cooled.

[0046] [Control of Refrigerator] Next, the control of the refrigerator 31 will be described with reference to FIG. 2. In the following description, it is described that the control device 80 controls the refrigerator 31, but it is not limited thereto. A configuration having a controller (not shown) for controlling the refrigerator 31 in the refrigerator 31 may also be used.

[0047] As shown in FIGS. 2(a) and 2(b), a temperature sensor 81 is provided at the head 32a of the refrigerating heat medium 32. Also, a temperature sensor 82 is provided on the mounting table 20. The temperature sensor 81 is connected to the control device 80 so as to be communicable by wire. The temperature sensor 82 is connected to the control device 80 so as to be communicable wirelessly. Note that the temperature sensor 82 may be connected to the control device 80 via the slip ring 60.

[0048] As shown in FIG. 2(a), when the mounting table 20 is rotating, the mounting table 20 and the refrigerating heat medium 32 are separated. The control device 80 performs feedback control on the refrigerator 31 so that the temperature of the head 32a of the refrigerating heat medium 32 detected by the temperature sensor 81 becomes a predetermined target temperature. For example, the target temperature T of the mounting table 20 20From the value obtained by subtracting a predetermined temperature from the temperature of the head 32a, the target temperature T of the head 32a is set. 32a (For example, T 32a = T 20 - 3 [°C]). The control device 80 performs feedback control on the refrigerator 31 based on the detected temperature T of the temperature sensor 81 81 and the target temperature T of the head 32a. 32a The control device 80 also monitors the temperature of the mounting table 20 detected by the temperature sensor 82.

[0049] As shown in FIG. 2(b), when the mounting table 20 is cooled, the mounting table 20 and the refrigeration heat medium 32 are in contact with each other. The control device 80 performs feedback control on the refrigerator 31 so that the temperature of the mounting table 20 detected by the temperature sensor 82 reaches a predetermined target temperature. For example, the control device 80 sets the target temperature T of the head 32a 82 based on the detected temperature T of the temperature sensor 82 20 and the target temperature T of the mounting table 20. 32a Next, the control device 80 performs feedback control on the refrigerator 31 based on the detected temperature T of the temperature sensor 81 81 and the target temperature T of the head 32a. 32a

[0050] In this way, by providing the temperature sensor 81 near the mounting table 20 and on the head 32a of the refrigeration heat medium 32 that is in thermal contact with the mounting table 20 during cooling, the refrigerator 31 can quickly respond to temperature changes in the head 32a. As a result, the temperature of the mounting table 20 can be well controlled. Further, since the head 32a is not a part that rotates together with the mounting table 20, the control device 80 and the temperature sensor 81 can be connected by wire. Thereby, temperature detection can be performed with high accuracy.

[0051] [Power supply structure to the chuck electrode] Next, the power supply structure to the chuck electrode 21a will be described with reference to FIGS. 3 to 5. FIG. 3 is an example of a perspective view of the mounting table 20. FIG. 4 is an example of a schematic diagram for explaining the power supply structure to the chuck electrode 21a. FIG. 5 is an example of a cross-sectional schematic diagram of the electrode introduction portion 21b.

[0052] As shown in FIG. 3, the mounting table 20 has an electrode introduction portion 21b for introducing power to the chuck electrode 21a. Here, the electrode introduction portion 21b is provided on the side surface of the mounting table 20.

[0053] As shown in FIG. 4, a power supply line 631 extending from the wiring 63 is connected to the electrode introduction portion 21b. With such a configuration, it is possible to widely secure the contact area between the first contact surface 21s of the mounting table 20 and the second contact surface 32s of the refrigeration heat medium 32 (the head 32a). That is, in the contact region where the first contact surface 21s and the second contact surface 32s are in contact, there is no portion where the first contact surface 21s and the second contact surface 32s are non-contact inside, and they can be brought into contact over the entire surface. Thereby, the first contact surface 21s of the mounting table 20 and the second contact surface 32s of the refrigeration heat medium 32 can be thermally contacted, and the cooling performance during cooling for cooling the mounting table 20 can be improved.

[0054] Also, as shown in FIG. 5, the power supply line 631 includes a conductive wire 631a, an insulating tube 631b covering the conductive wire 631a, and a terminal portion 631c. The conductive wire 631a is made of a metal material such as SUS. The insulating tube 631b is made of an insulating material such as PTFE. The terminal portion 631c is provided at one end of the conductive wire 631a and is electrically connected to the conductive wire 631a. Note that the other end of the power supply line 631 is connected to the wiring 63 and is connected to a power source (not shown) via the slip ring 60.

[0055] The electrode introduction part 21b has a conductive part 21b1, an insulating cover 21b2, a fastening bolt 21b3, and an insulating cover 21b4. The conductive part 21b1 is made of a conductive member and is electrically connected to the chuck electrode 21a (see FIG. 4). The conductive part 21b1 has a recess formed with a female screw for screwing with the fastening bolt 21b3. The insulating cover 21b2 is made of an insulating material such as PEEK (polyetheretherketone) and covers the conductive part 21b1. The insulating cover 21b2 has a hole through which the fastening bolt 21b3 is inserted. The fastening bolt 21b3 is made of a conductive member and is electrically connected to the terminal part 631c of the power supply line 631. Thereby, the conductive wire 631a of the power supply line 631 is electrically connected to the chuck electrode 21a via the terminal part 631c, the fastening bolt 21b3, and the conductive part 21b1. The insulating cover 21b4 is made of an insulating material such as PEEK and covers the terminal part 631c and the fastening bolt 21b3.

[0056] As described above, the conductive members (the conductive part 21b1 and the fastening bolt 21b3) of the electrode introduction part 21b and the terminal part 631c of the power supply line 631 are covered with insulating members (the insulating cover 21b2 and the insulating cover 21b4). Thereby, when generating plasma in the internal space 10S and performing plasma processing on the substrate W, abnormal discharge in the conductive members of the electrode introduction part 21b is prevented.

[0057] As described above, the substrate processing apparatus 1 has been described. However, the present disclosure is not limited to the above-described embodiments and the like, and various modifications and improvements can be made within the scope of the gist of the present disclosure described in the claims.

Explanation of Reference Numerals

[0058] W Substrate 1 Substrate processing apparatus 10 Processing container 10S Internal space 20 Mounting table 21 Electrostatic chuck 21a Chuck electrode 21b Electrode introduction part 21s First contact surface 22 Shielding member 30 Refrigeration device 31 Refrigerator 32 Refrigeration heat medium 32a Head 32b Shaft portion 32s Second contact surface 40 Rotating device 49 Stand 50 Lifting device 60 Slip ring 63 Wiring 631 Power supply line 631a Conductive wire 631b Insulating tube 631c Terminal portion 71 First reflecting member 71a Cylindrical portion 71b Annular portion 71c Cylindrical portion 72 Second reflecting member 73 Heat insulating member 74 Heat insulating member 80 Control device 81 Temperature sensor 82 Temperature sensor

Claims

1. A processing container, A mounting table provided in the processing container, having a first contact surface and configured to be rotatable, A refrigeration device having a second contact surface and configured to be movable up and down, A rotating device for rotating the mounting table, An elevating device for elevating the refrigeration device and thermally connecting or disconnecting the second contact surface and the first contact surface, comprising: The refrigeration device, A refrigerator, A cold link having one end thermally connected to the refrigerator and the other end having the second contact surface, The volume of the cold link is larger than the volume of the mounting table, A substrate processing apparatus.

2. The cold link has a head having the second contact surface and a shaft portion thermally connecting the head and the refrigerator, The volume of the head of the cold link is larger than the volume of the shaft portion of the cold link, The substrate processing apparatus according to claim 1.

3. The cold link has a head having the second contact surface and a shaft portion thermally connecting the head and the refrigerator, The volume of the head of the cold link is larger than the volume of the mounting table, The substrate processing apparatus according to claim 1.

4. The first contact surface and the second contact surface are flat surfaces, The substrate processing apparatus according to any one of claims 1 to 3.

5. In the contact area where the first contact surface and the second contact surface contact, there is no portion where the first contact surface and the second contact surface are non-contact inside, and they contact in the whole area, The substrate processing apparatus according to claim 4.

6. The mounting table has an electrostatic chuck having a chuck electrode and an electrode introduction portion for introducing power into the chuck electrode, The electrode introduction portion is provided on a side surface of the mounting table, The substrate processing apparatus according to claim 4.

7. The substrate processing apparatus is a substrate processing apparatus for generating plasma in the processing container and performing processing on a substrate, The electrode introduction portion is covered with an insulating member by a conductive member, The substrate processing apparatus according to claim 6.

8. Further comprising a reflecting member for reflecting radiant heat incident on the cold link, The substrate processing apparatus according to any one of claims 1 to 3.

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