Maintenance method and molding apparatus

The maintenance method for the discharge device addresses the issue of expired metal-containing liquid by implementing a notification system and a discharge cleaning process, thereby reducing the risk of nozzle clogging and ensuring the device's functionality.

JP2025086709APending Publication Date: 2025-06-09FUJI CORP
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Patent Information

Application Number
JP2023200918
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-28
Publication Date
2025-06-09

AI Technical Summary

Technical Problem

The metal-containing liquid used in three-dimensional lamination molding methods can expire, leading to aggregation of metal fine particles in the inkjet head, which may cause nozzle clogging and other issues.

Method used

A maintenance method that includes determining the lifetime of the metal-containing liquid, providing notifications when the lifetime is approaching, and performing a discharge and cleaning process when the liquid has reached the end of its lifetime to prevent nozzle clogging.

Benefits of technology

The method effectively reduces the risk of nozzle clogging and other problems by ensuring timely replacement of the metal-containing liquid and cleaning of the nozzle, thereby maintaining the integrity of the discharge device.

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Abstract

To provide a maintenance method capable of reducing the possibility of malfunction of an ejection device, and to provide a molding apparatus.SOLUTION: A maintenance method of the present disclosure includes: a first life-determining step of determining whether or not a predetermined time has elapsed from a life of a metal-containing liquid stored in a tank; a first notification step of executing a notification indicating that the life of the metal-containing liquid stored in the tank is approaching when it is determined that the predetermined time has elapsed in the first life-determining step; a second life-determining step of determining whether the metal-containing liquid stored in the tank has reached its life; and a discharge cleaning step of discharging the metal-containing liquid stored in the tank from a nozzle and cleaning the nozzle by a cleaning device when it is determined in the second life-determining step that the metal-containing liquid has reached its life.SELECTED DRAWING: Figure 7
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Description

Technical Field

[0001] The present disclosure relates to the technology of maintenance of a discharge device.

Background Art

[0002] Conventionally, a technique for forming a three-dimensional object by a three-dimensional lamination molding method using a metal-containing liquid containing metal fine particles has been proposed. For example, in Patent Document 1 below, a metal-containing liquid is discharged from an inkjet head, and the discharged metal-containing liquid is heated to perform molding.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The above-mentioned metal-containing liquid may be designed, for example, to exhibit conductivity by drying and heating the solvent after discharge, and a lifetime (expiration date) may be set because the state changes. If the metal-containing liquid with an expired lifetime is left in a tank or the like, metal fine particles may aggregate in the inkjet head to form large particles, and there is a risk of problems such as nozzle clogging.

[0005] In view of such circumstances, the present disclosure has been made, and an object thereof is to provide a maintenance method and a molding apparatus that can reduce the possibility of problems occurring in a discharge device.

Means for Solving the Problems

[0006] This specification discloses a maintenance method for a discharging device including a tank capable of storing a metal-containing liquid containing metal fine particles, a nozzle connected to the tank and discharging the metal-containing liquid supplied from the tank, and a cleaning device for cleaning the nozzle. The maintenance method includes: a first lifetime determination step of determining whether a predetermined time has passed since the lifetime of the metal-containing liquid stored in the tank; a first notification step of, when it is determined in the first lifetime determination step that the predetermined time has passed, executing a notification suggesting that the lifetime of the metal-containing liquid stored in the tank is approaching; a second lifetime determination step of determining whether the metal-containing liquid stored in the tank has reached the end of its lifetime; and a discharging and cleaning step of, when it is determined in the second lifetime determination step that the metal-containing liquid has reached the end of its lifetime, discharging the metal-containing liquid stored in the tank from the nozzle and cleaning the nozzle with the cleaning device. Note that the content of the present disclosure is not limited to implementation as a maintenance method, and can be implemented in various forms. For example, it is extremely beneficial to implement the content of the present disclosure as a shaping device including a discharging device, a control program for controlling the shaping device, a storage medium storing the control program, and the like.

Advantages of the Invention

[0007] According to the present disclosure, when the metal-containing liquid reaches the end of its lifetime, the metal-containing liquid stored in the tank is discharged and the nozzle is cleaned. Thereby, the possibility of problems such as nozzle clogging occurring in the discharging device can be reduced. Further, when the predetermined time before the end of the lifetime is reached, a notification suggesting that the lifetime is approaching is executed. Thereby, the user can be notified in advance that the lifetime is approaching. After receiving the notification, the user can perform preparations for replacing the metal-containing liquid and the like before the metal-containing liquid reaches the end of its lifetime.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0009] (Configuration of the Substrate Forming Apparatus 10 of the First Embodiment) Hereinafter, a substrate forming apparatus of a first embodiment, which is an embodiment in which the modeling apparatus of the present disclosure is embodied, will be described with reference to the drawings. FIG. 1 is a schematic diagram of the substrate forming apparatus 10 of the first embodiment. FIG. 2 is a block diagram showing the control device 28 of the substrate forming apparatus 10 of the first embodiment. As shown in FIGS. 1 and 2, the substrate forming apparatus 10 includes a transfer device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a fourth modeling unit 25, a pressing unit 26, a mounting unit 27, and a control device 28 (see FIG. 2). The transfer device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, and the mounting unit 27 are arranged on the base 29 of the substrate forming apparatus 10. The base 29 generally has a rectangular shape. In the following description, as shown in FIG. 1, the longitudinal direction of the base 29 is referred to as the X-axis direction, the short-side direction of the base 29 is referred to as the Y-axis direction, and the direction orthogonal to both the X-axis direction and the Y-axis direction is referred to as the Z-axis direction for explanation.

[0010] The transfer device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 has an electromagnetic motor 38 (see FIG. 2), and by driving the electromagnetic motor 38, the X-axis slider 36 is moved to an arbitrary position in the X-axis direction. The Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 in the Y-axis direction is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction together with the X-axis slider 36. A stage 52 is held by the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Further, the Y-axis slide mechanism 32 has an electromagnetic motor 56 (see FIG. 2), and by driving the electromagnetic motor 56, the stage 52 is moved to an arbitrary position in the Y-axis direction. As a result, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

[0011] Stage 52 has a base 60, a holding device 62, a lifting device 64 (see FIG. 2), and a temperature control unit 66 (see FIG. 2). The base 60 is formed in a flat plate shape, and a pallet 61 is placed on the upper surface. The pallet 61 is, for example, a flat plate-shaped metal member. A circuit board is shaped on the pallet 61. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the pallet 61 placed on the base 60 in the X-axis direction are clamped by the holding device 62, so that the circuit board is fixedly held. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60. The temperature control unit 66 includes a device used for overheating such as a heater and a device used for cooling such as a water cooling device and a Peltier element. It is built into the base 60 and heats or cools the circuit board placed on the base 60 to an arbitrary temperature. Incidentally, the temperature control unit 66 may be configured to be capable of executing only one of heating or cooling.

[0012] The first shaping unit 22 is a unit for shaping the metal wiring of the circuit board, and has a first printing unit 72 and a firing unit 74. The first printing unit 72 has an inkjet head 76 (see FIG. 2) and linearly discharges metal ink from the inkjet head 76. The metal ink is a dispersion of metal nanoparticles of nanometer size, for example, silver fine particles in a solvent (such as an organic solvent). The surface of the metal fine particles is coated with a dispersant to prevent aggregation in the solvent. Further, the inkjet head 76 discharges metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element. Incidentally, the method of discharging the metal ink is not limited to the inkjet method using a piezoelectric element, and other methods such as a jet dispenser method using a piezoelectric element and air may also be used.

[0013] The firing unit 74 has an infrared irradiation device 78 (see FIG. 2). The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays. The metal ink irradiated with infrared rays is fired to form a metal wiring. Note that the firing of the metal ink is a phenomenon in which by applying energy, vaporization of the solvent, a protective film of metal fine particles, that is, decomposition of a dispersant, etc. are performed, and the metal fine particles come into contact or fuse, resulting in an increase in conductivity. And when the metal ink is fired, a metal wiring is formed. Further, when firing the metal ink, the substrate forming apparatus 10 may cool the stage 52 by the temperature control unit 66.

[0014] Also, the second shaping unit 23 is a unit that shapes the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head 88 (see FIG. 2), and the inkjet head 88 ejects an ultraviolet curable resin. The ultraviolet curable resin is a resin that cures by irradiation with ultraviolet rays. Note that the method by which the inkjet head 88 ejects the ultraviolet curable resin may be, for example, a piezo method using a piezoelectric element, or a thermal method in which the resin is heated to generate bubbles and ejected from a plurality of nozzles.

[0015] The curing unit 86 has a flattening device 90 (see FIG. 2) and an irradiation device 92 (see FIG. 2). The flattening device 90 flattens the upper surface of the ultraviolet curable resin ejected by the inkjet head 88. For example, while leveling the surface of the ultraviolet curable resin, the excess resin is scraped off by a roller or a blade to make the thickness of the ultraviolet curable resin uniform. Also, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ejected ultraviolet curable resin with ultraviolet rays. Thereby, the ejected ultraviolet curable resin cures and a resin layer is formed.

[0016] The third shaping unit 24 is a unit that shapes the connection part between the electrodes of electronic components and the metal wiring, and has a third printing unit 100. The third printing unit 100 has a dispenser 106 (see FIG. 2), and the dispenser 106 discharges a conductive paste. The conductive paste is a resin that cures by heating at a relatively low temperature, in which metal particles (such as silver microparticles) of micrometer size are dispersed. The metal particles are in the form of flakes, and the viscosity of the conductive paste is relatively high compared to metal ink. Also, the metal contained in the metal ink and the conductive resin paste is not limited to silver, and may be gold, copper, etc., or a plurality of types of metals.

[0017] Then, the conductive paste discharged by the dispenser 106 is heated by a temperature control unit 66 built into the base 60. In the heated conductive paste, the resin cures. At this time, in the conductive paste, the resin cures and shrinks, and the flaky metal particles dispersed in the resin come into contact. Thereby, the conductive paste exhibits conductivity. Also, the resin of the conductive paste is an organic adhesive, and exhibits adhesive force by curing by heating. The heating methods of the above-mentioned metal ink and conductive resin paste are examples. For example, a heating plate may be used to heat the metal ink or the conductive paste. Further, the substrate forming apparatus 10 may be provided with, for example, an electric furnace that heats the shaped object in a furnace as means for heating the metal ink or the conductive paste. The third shaping unit 24 may shape other connection parts. For example, it may shape a connection part that connects a probe pin that connects the metal wirings of each layer of the circuit board and the metal wiring. Alternatively, the substrate forming apparatus 10 may be provided with a unit that shapes such a connection part of the probe pin separately from the third shaping unit 24.

[0018] The fourth shaping unit 25 is a unit for shaping a resin for fixing an electronic component to a circuit board, and has a fourth printing unit 110. The fourth printing unit 110 has a dispenser 116 (see FIG. 2), and the dispenser 116 discharges a thermosetting resin. The thermosetting resin is a resin that cures by heating and is a so-called underfill resin. Note that the method in which the dispenser 106 discharges the conductive paste and the method in which the dispenser 116 discharges the thermosetting resin may be, for example, an air pulse method using compressed air, or other methods such as a jet method or a mechanical method. Then, the thermosetting resin discharged by the dispenser 116 is heated by a temperature control unit 66 built in the base 60 and cured.

[0019] Also, the pressing unit 26 is a unit for pressing an electronic component arranged on a circuit board, and has a driving unit 120 and a curing unit 121 (see FIG. 2). The pressing unit 26 includes, for example, a pressing member (such as a rubber sheet) that presses an electronic component arranged on a circuit board from above, drives the driving unit 120, and presses the electronic component on the circuit board against the circuit board side by the pressing member. As the driving unit 120, a servo motor, an air cylinder, or the like can be adopted. Further, when pressing the electronic component (circuit board) by the pressing member, a low-friction sheet may be sandwiched between the pressing member and the electronic component. This low-friction sheet is, for example, a sheet formed of a material with a low friction coefficient such as PTFE (polytetrafluoroethylene) or a fluororesin. By sandwiching the low-friction sheet, the pressing member can be slid with respect to the electronic component, the force in the shearing direction acting on the electronic component during pressing can be reduced, and the displacement of the electronic component due to pressing can be suppressed.

[0020] The curing unit 121 is, for example, a heater, includes a heating wire that functions as a heat source, and is provided at a position where the pressing member is heated and at a position where a mounting portion on which the circuit board is mounted is heated. When the electronic component is pressed by the pressing member, the curing unit 121 heats the pressing member and the circuit board, thereby heating the above-described conductive paste and thermosetting resin, and electrically connecting and fixing the electronic component to the circuit board.

[0021] Further, the mounting unit 27 is a unit for mounting electronic components on a circuit board, and includes a supply unit 130 and a mounting unit 132. The supply unit 130 has, for example, a plurality of tape feeders 134 (see FIG. 2) that feed out taped electronic components one by one, and supplies the electronic components at the supply position. Note that the supply unit 130 is not limited to the tape feeder 134, and may be a tray-type supply device that picks up and supplies electronic components from a tray or the like.

[0022] The mounting unit 132 includes a mounting head 136 (see FIG. 2) and a moving device 138 (see FIG. 2) that moves the mounting head 136. The mounting head 136 has a suction nozzle (not shown) for sucking and holding an electronic component. The moving device 138 moves the mounting head 136 between the supply position of the electronic components by the tape feeder 134 and the circuit board placed on the base 60. Thereby, the mounting unit 132 sucks the electronic component supplied from the tape feeder 134 with the suction nozzle, and mounts the sucked electronic component on the circuit board.

[0023] Also, as shown in FIG. 2, the substrate forming apparatus 10 includes, for example, a touch panel 139 as a user interface. The touch panel 139 changes the display content based on the control of the control device 28. Further, the touch panel 139 outputs a signal corresponding to an operation input by the user to the control device 28.

[0024] Further, as shown in FIG. 2, the control device 28 includes a controller 140, a plurality of drive circuits 142, and a storage device 144. Each of the plurality of drive circuits 142 is connected to the electromagnetic motors 38 and 56, the holding device 62, the elevating device 64, the temperature control unit 66, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispensers 106 and 116, the drive unit 120, the curing unit 121, the tape feeder 134, the mounting head 136, the moving device 138, and the touch panel 139. The controller 140 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to the plurality of drive circuits 142. The storage device 144 includes, for example, a RAM, a ROM, a flash memory, an HDD, etc. A control program 146 is stored in the storage device 144. The controller 140 executes the control program 146 with the CPU and controls the operations of the conveyance device 20, the first shaping unit 22, the second shaping unit 23, the third shaping unit 24, the fourth shaping unit 25, the pressing unit 26, the mounting unit 27, and the touch panel 139 via the drive circuits 142.

[0025] (Formation of Circuit Board) Next, an example of the process of forming a circuit board will be described. The substrate forming apparatus 10 forms a circuit board on the base 60 with the above-described configuration. In the following description, the case of forming the circuit board 151 shown in FIG. 3 will be described. Also, the devices controlled by the control device 28 may be simply described by their device names. For example, the description "the stage 52 moves below the second shaping unit 23" means that "the stage 52 moves below the second shaping unit 23 by the electromagnetic motors 38 of the X-axis slide mechanism 30 and the electromagnetic motors 56 of the Y-axis slide mechanism 32 being controlled based on the control of the control device 28".

[0026] First, for example, a release film 153 is attached onto a pallet 61 of a stage 52. A circuit board 151, which is a shaped article, is shaped on this release film 153. The release film 153 is a film whose adhesiveness decreases at a predetermined temperature or higher and which becomes easy to peel from the pallet 61. The control device 28 moves the pallet 61 (stage 52) to each unit to perform forming. For example, when the forming operation starts, first, the stage 52 moves below the second shaping unit 23. The second shaping unit 23 repeatedly executes a process of discharging an ultraviolet curable resin onto the release film 153 from an inkjet head 88 and a process of irradiating the discharged ultraviolet curable resin with ultraviolet rays by an irradiating device 92, thereby forming a resin laminate 155 on the release film 153. In forming the resin laminate 155, the second shaping unit 23 appropriately executes flattening by a flattening device 90 of a cured portion 86.

[0027] Next, in a first printing section 72 of the first shaping unit 22, an inkjet head 76 linearly discharges metal ink onto the upper surface of the resin laminate 155 according to a circuit pattern. Subsequently, in a firing section 74, an infrared irradiating device 78 irradiates the discharged metal ink with infrared rays to fire the metal ink, thereby forming a metal wiring 157 on the upper surface of the resin laminate 155 (an example of a metal wiring forming step of the present application).

[0028] Subsequently, in the second shaping unit 23, similar to the formation of the resin laminate 155 described above, discharging of the ultraviolet curable resin and irradiation with ultraviolet rays are repeatedly executed to form a resin laminate 159 on the metal wiring 157. The second shaping unit 23 forms the resin laminate 159 such that, for example, an end portion of the metal wiring 157 is exposed. A stepped portion between the resin laminate 155 and the resin laminate 159 functions as a cavity.

[0029] Subsequently, in the third printing unit 100 of the third shaping unit 24, the dispenser 106 discharges the conductive paste onto the end portion of the metal wiring 157. Subsequently, in the fourth printing unit 110 of the fourth shaping unit 25, the dispenser 116 discharges the thermosetting resin 161 onto the upper surface of the resin laminate 155 between the end portions of the metal wiring 157. Subsequently, the mounting unit 27 supplies the electronic component 163 by means of the tape feeder 134 and holds the electronic component 163 by the suction nozzle of the mounting head 136. The mounting head 136 is moved by the moving device 138 and mounts the electronic component 163 held by the suction nozzle so that the electrode 165 of the electronic component 163 is electrically connected to the metal wiring 157. The electrode 165 is arranged so as to be in contact with the conductive paste discharged onto the metal wiring 157 and not yet cured. Also, the lower surface of the electronic component 163 is in contact with the uncured thermosetting resin 161 discharged between the metal wirings 157. The thermosetting resin 161 is encapsulated between the upper surface of the resin laminate 155 and the lower surface of the electronic component 163.

[0030] Subsequently, the stage 52 moves below the pressing unit 26. The pressing unit 26 drives the driving unit 120 to, for example, raise the pallet 61 and press it against the pressing member, and presses the electronic component 163 against the resin laminate 155 side by the pressing member. Incidentally, the pressing unit 26 may be configured to lower the pressing member to press the electronic component 163. At the time of pressing, the pressing member presses the electronic component through the low-friction sheet described above. Thereby, displacement of the electronic component 163 during pressing is suppressed. Also, when the pressing unit 26 presses the electronic component 163, heating by the curing unit 121 is executed to heat and cure the conductive paste and the thermosetting resin 161. The conductive paste is heated and cured in a compressed state to exhibit conductivity and electrically connect the electronic component 163 to the metal wiring 157. Therefore, the cured conductive paste functions as the bump 167. Also, by being pressed, the electronic component 163 and the thermosetting resin 161 are in close contact with each other, and the electrode 165 and the conductive paste are in close contact with each other. Thereby, due to the adhesion force of the thermosetting resin 161, the electronic component 163 is fixed to the upper surface of the resin laminate 155.

[0031] When the pressing by the pressing unit 26 is completed, the stage 52 moves below the fourth shaping unit 25. In the fourth printing unit 110 of the fourth shaping unit 25, the dispenser 116 discharges the thermosetting resin 169 so as to cover the side surface of the electronic component 163. Then, the resin laminate 155 is heated by the temperature control unit 66 built in the base 60. Thereby, the thermosetting resin 169 is heated and cured through the resin laminate 155. Therefore, the thermosetting resin 161 is enclosed between the upper surface of the resin laminate 155 and the lower surface of the electronic component 163, and the thermosetting resin 169 is cured in a state of covering the side surface of the electronic component 163. In this way, the circuit board 151 is manufactured. Note that the materials, the content and order of the steps used in the above manufacturing process are examples, and are appropriately changed according to the shaped object to be manufactured.

[0032] (Configuration of the first printing unit 72) Next, as an example of the metal-containing liquid containing the metal fine particles of the present disclosure, the case where the metal ink discharged from the first printing unit 72 is adopted will be described. FIG. 4 schematically shows a configuration related to the inkjet head 76 in the first printing unit 72. As shown in FIG. 4, in addition to the above-described inkjet head 76, the first printing unit 72 includes first and second tanks 171A and 171B, a positive pressure pump 173, a negative pressure pump 174, first and second regulators 175 and 176, first and second pressure gauges 177 and 178, and the like. The first tank 171A is different from the second tank 171B in that it includes an ink supply path 179 to be described later, but has the same configuration as the second tank 171B in other parts. Therefore, in the following description, the first tank 171A will be mainly described, and the description of the second tank 171B will be appropriately omitted. In addition, the letter "A" is added to the end of the reference numeral of the member related to the first tank 171A, and the letter "B" is added to the end of the reference numeral of the member related to the corresponding second tank 171B.

[0033] Each of the first and second tanks 171A and 171B, for example, has a vertically long cylindrical shape and is capable of storing the metal ink 181. The positive pressure pump 173 is a pump that supplies positive pressure gas to each of the first and second tanks 171A and 171B. The negative pressure pump 174 is a pump that supplies negative pressure gas to each of the first and second tanks 171A and 171B. As the gas supplied by the positive pressure pump 173 and the negative pressure pump 174, air can be adopted, but specific gases such as oxygen and nitrogen may also be used.

[0034] The positive pressure pump 173 is connected to the first tank 171A via the first positive pressure supply path 183A and is connected to the second tank 171B via the second positive pressure supply path 183B. The negative pressure pump 174 is connected to the first tank 171A via the first negative pressure supply path 184A and is connected to the second tank 171B via the second negative pressure supply path 184B. The first tank 171A is provided with a first air supply port 185A for supplying air. The positive pressure pump 173 supplies positive pressure air into the first tank 171A from the first air supply port 185A via the first positive pressure supply path 183A. The negative pressure pump 174 supplies negative pressure air into the first tank 171A from the first air supply port 185A via the first negative pressure supply path 184A. Similarly, the second air supply port 185B of the second tank 171B is connected to each of the second positive pressure supply path 183B and the second negative pressure supply path 184B.

[0035] The positive pressure pump 173 changes the pressure (positive pressure) of the air supplied based on the control of the control device 28 (see FIG. 2). The first regulator 175 is connected between the positive pressure pump 173 and the first and second positive pressure supply paths 183A and 183B. The first regulator 175 adjusts the pressure of the air supplied from the positive pressure pump 173 to the first and second positive pressure supply paths 183A and 183B, that is, the pressure of the air supplied to the first and second tanks 171A and 171B, to a desired positive pressure based on the control of the control device 28. The first pressure gauge 177 is a device that detects the pressure of the air supplied from the first regulator 175 to the first and second positive pressure supply paths 183A and 183B. The first pressure gauge 177 outputs a signal indicating the detected pressure to the control device 28. The control device 28 controls the first regulator 175 and the like based on the signal input from the first pressure gauge 177 to set the inside of the first and second tanks 171A and 171B to a desired positive pressure.

[0036] Similarly, the negative pressure pump 174 changes the pressure (negative pressure) of the air supplied based on the control of the control device 28. The second regulator 176 is connected between the negative pressure pump 174 and the first and second negative pressure supply paths 184A and 184B. The second regulator 176 adjusts the pressure of the air supplied from the negative pressure pump 174 to the first and second negative pressure supply paths 184A and 184B, that is, the pressure of the air supplied to the first and second tanks 171A and 171B, to a desired negative pressure based on the control of the control device 28. Also, the control device 28 controls the second regulator 176 and the like based on the signal input from the second pressure gauge 178 to set the inside of the first and second tanks 171A and 171B to a desired negative pressure.

[0037] A first electromagnetic valve 187A is connected between the first positive pressure supply path 183A and the positive pressure pump 173, and a first electromagnetic valve 187B is connected between the second positive pressure supply path 183B and the positive pressure pump 173. Also, a second electromagnetic valve 188A is connected between the first negative pressure supply path 184A and the negative pressure pump 174, and a second electromagnetic valve 188B is connected between the second negative pressure supply path 184B and the negative pressure pump 174. The first electromagnetic valves 187A, 187B, the second electromagnetic valves 188A, 188B, and other electromagnetic valves (third electromagnetic valves 189A, 189B, fourth electromagnetic valve 193, nozzle electromagnetic valves 201A, 201B) to be described later are, for example, solenoid valves.

[0038] The first electromagnetic valve 187A opens and closes the first positive pressure supply path 183A based on the control of the control device 28. Similarly, each of the first electromagnetic valve 187B and the second electromagnetic valves 188A, 188B opens and closes the second positive pressure supply path 183B, the first negative pressure supply path 184A, and the second negative pressure supply path 184B based on the control of the control device 28. Thereby, the control device 28 controls the positive pressure pump 173, the negative pressure pump 174, the first electromagnetic valves 187A, 187B, and the second electromagnetic valves 188A, 188B, etc., to individually control the pressures in the first and second tanks 171A, 171B. Note that the configuration for individually controlling the pressures of the first and second tanks 171A, 171B is not limited to the configuration shown in FIG. 4. For example, the first printing unit 72 may include two positive pressure pumps 173 connected to the first and second tanks 171A, 171B respectively, and individually control the pressures of the first and second tanks 171A, 171B by controlling each positive pressure pump 173.

[0039] In addition, the first air supply port 185A is connected to the outside via the third solenoid valve 189A, and can take in air outside the apparatus. The control device 28 sets the pressure in the first tank 171A to atmospheric pressure by opening the third solenoid valve 189A. Similarly, the second air supply port 185B is connected to the outside via the third solenoid valve 189B, and supplies atmospheric pressure into the second tank 171B in response to the opening of the third solenoid valve 189B. In the following description, simply making the pressure in the first tank 171A positive pressure, negative pressure, or atmospheric pressure is described as simply "making the first tank 171A positive pressure", etc. Further, when any one of the first solenoid valve 187A, the second solenoid valve 188A, and the third solenoid valve 189A is opened, the other two solenoid valves are closed. For this reason, for example, when making the first tank 171A positive pressure, the control device 28 opens only the first solenoid valve 187A and closes the second solenoid valve 188A and the third solenoid valve 189A. Also, in the following description, the description of the opening and closing control of the first to third solenoid valves 187A, 188A, 189A when making the first tank 171A positive pressure, negative pressure, or atmospheric pressure may be omitted. The same applies to the second tank 171B. Note that the control device 28 may execute control to open at least two of the first solenoid valve 187A, the second solenoid valve 188A, and the third solenoid valve 189A simultaneously, and control the positive pressure pump 173, the negative pressure pump 174, etc. to adjust the pressure in the first tank 171A.

[0040] In addition, the first printing unit 72 includes a cleaning liquid tank 195 that can store the cleaning liquid 197. The first tank 171A is provided with a first cleaning liquid supply port 191A for supplying the cleaning liquid 197. The first cleaning liquid supply port 191A is provided below the first air supply port 185A in the first tank 171A. Note that the first cleaning liquid supply port 191A may be provided at the same height as the first air supply port 185A or at a position above the first air supply port 185A. Similarly, the second tank 171B is provided with a second cleaning liquid supply port 191B for supplying the cleaning liquid 197 at a position below the second air supply port 185B.

[0041] A fourth solenoid valve 193 is connected to the discharge port of the cleaning liquid tank 195. A three-way valve 194 is connected to the fourth solenoid valve 193. In addition to the fourth solenoid valve 193, a first cleaning liquid supply port 191A and a second cleaning liquid supply port 191B are connected to the three-way valve 194. The three-way valve 194 is a switching valve, and based on the control of the control device 28, it switches between a state of connecting the fourth solenoid valve 193 (cleaning liquid tank 195) and the first cleaning liquid supply port 191A, and a state of connecting the fourth solenoid valve 193 and the second cleaning liquid supply port 191B. In this way, by making the tank that can be connected to the cleaning liquid tank 195 at one time be one of the first and second tanks 171A and 171B, it becomes easy to control the supply amount of the cleaning liquid 197.

[0042] Note that the connection configuration between the above-described first and second tanks 171A and 171B and the cleaning liquid tank 195 is an example. For example, each of the first and second cleaning liquid supply ports 191A and 191B may be connected to the cleaning liquid tank 195 by separate flow paths. For example, the first cleaning liquid supply port 191A may be connected to the cleaning liquid tank 195 via the fourth solenoid valve 193, and the second cleaning liquid supply port 191B may be connected to the cleaning liquid tank 195 via another fourth solenoid valve. In this case, the three-way valve 194 may be omitted. Also, the cleaning liquid 197 can be supplied from the cleaning liquid tank 195 to the first and second tanks 171A and 171B simultaneously.

[0043] The cleaning liquid 197 is a liquid for flushing the metal ink 181 in the first and second tanks 171A and 171B. The control device 28 switches the three-way valve 194 to the first tank 171A side, opens the fourth solenoid valve 193, and makes the inside of the first tank 171A negative pressure, thereby supplying the cleaning liquid 197 from the cleaning liquid tank 195 into the first tank 171A. The control device 28 drives the negative pressure pump 174 and the second regulator 176, and adjusts the negative pressure of the first tank 171A, thereby adjusting the supply amount of the cleaning liquid 197 supplied from the cleaning liquid tank 195 to the first tank 171A. Similarly, the control device 28 switches the three-way valve 194 to the second tank 171B side, opens the fourth solenoid valve 193, and makes the inside of the second tank 171B negative pressure, thereby supplying the cleaning liquid 197 from the cleaning liquid tank 195 into the second tank 171B.

[0044] Therefore, the first and second tanks 171A and 171B sometimes store the metal ink 181, the cleaning liquid 197, or a mixture thereof. In the following description, the liquid stored in the first and second tanks 171A and 171B may be collectively referred to as the stored liquid. Note that the first printing unit 72 may include a cleaning liquid tank 195 that supplies the cleaning liquid 197 to the second tank 171B, separate from the cleaning liquid tank 195 that supplies the cleaning liquid 197 to the first tank 171A. Further, the first printing unit 72 may be configured such that the cleaning liquid tank 195 is connected to only one of the first and second tanks 171A and 171B.

[0045] FIG. 5 schematically shows the inkjet head 76. As shown in FIGS. 4 and 5, the inkjet head 76 includes nozzle electromagnetic valves 201A and 201B, first nozzle flow paths 203A and 203B, and a nozzle section 205. The first tank 171A is connected to the nozzle electromagnetic valve 201A of the inkjet head 76 via a tank flow path 207A. The nozzle electromagnetic valve 201A is connected to the nozzle section 205 via the first nozzle flow path 203A. Similarly, the second tank 171B is connected to the nozzle section 205 via a tank flow path 207B, a nozzle electromagnetic valve 201B, and a first nozzle flow path 203B. The nozzle electromagnetic valves 201A and 201B are opened and closed based on the control of the control device 28 to open and close the flow paths.

[0046] The nozzle section 205 includes a second nozzle flow path 207 (see FIG. 5) and a plurality of nozzles 209 (see FIG. 5). The first nozzle flow paths 203A and 203B are connected to the second nozzle flow path 207. Therefore, the first tank 171A is connected to the second tank 171B via the tank flow path 207A, the first nozzle flow path 203A, the second nozzle flow path 207, the first nozzle flow path 203B, and the tank flow path 207B. Further, the plurality of nozzles 209 are connected to the second nozzle flow path 207. Therefore, the plurality of nozzles 209 discharge the metal ink 181 or the cleaning liquid 197 supplied from the first tank 171A, the second tank 171B, or both tanks via the second nozzle flow path 207.

[0047] When the nozzle solenoid valves 201A and 201B are open, the stored liquid moves between the first and second tanks 171A and 171B according to the pressure difference between the first and second tanks 171A and 171B. The control device 28 sends the stored liquid back and forth between the first and second tanks 171A and 171B through the second nozzle flow path 207. For example, when sending the stored liquid from the first tank 171A to the second tank 171B, the control device 28 opens the nozzle solenoid valves 201A and 201B, opens the third solenoid valve 189A to make the first tank 171A at atmospheric pressure, and opens the second solenoid valve 188B to make the second tank 171B at negative pressure. Thereby, the stored liquid in the first tank 171A flows into the second tank 171B through the second nozzle flow path 207 of the nozzle portion 205. Similarly, when sending the stored liquid from the second tank 171B to the first tank 171A, the control device 28 makes the second tank 171B at atmospheric pressure and the first tank 171A at negative pressure. The control device 28 switches between atmospheric pressure and negative pressure in this way, and executes an operation (hereinafter sometimes referred to as circulation) of returning the stored liquid sent from one tank to the other tank back from the other tank to the one tank again. Note that the control content of the above-described circulation operation is an example. For example, when sending the stored liquid from the first tank 171A to the second tank 171B, the control device 28 may open the first solenoid valve 187A to make the first tank 171A at positive pressure and open the second solenoid valve 188B to make the second tank 171B at negative pressure.

[0048] Further, for example, when the control device 28 discharges the metal ink 181 from the nozzle 209 to form the metal wiring 157, the control device 28 opens the nozzle electromagnetic valves 201A and 201B to fill the inkjet head 76 with the metal ink 181. The control device 28 vibrates a piezoelectric element (not shown) with the interiors of the first and second tanks 171A and 171B at a predetermined negative pressure, thereby discharging the metal ink 181 from the plurality of nozzles 209. This predetermined negative pressure is, for example, the pressure at which the liquid level of the metal ink 181 is held at the opening of the nozzle 209 and the metal ink 181 does not leak from the nozzle 209. Note that the control device 28 may adjust the pressure in the first and second tanks 171A and 171B to execute the discharge in addition to or without using the piezoelectric element.

[0049] Further, an ink supply path 179 for replenishing the metal ink 181 is provided in the first tank 171A. The lower opening of the ink supply path 179 communicates with the first tank 171A and is provided at a position below the first air supply port 185A and above the first cleaning liquid supply port 191A in the vertical direction. An ink supply unit 211 is attached to the upper opening of the ink supply path 179.

[0050] The ink supply unit 211 is, for example, a lid of the ink supply path 179 and is detachable with respect to the opening of the ink supply path 179. The user removes the ink supply unit 211 and replenishes the metal ink 181 into the first tank 171A through the ink supply path 179. Note that the replenishment of the metal ink 181 may be automatically executed. For example, the substrate forming apparatus 10 may include an ink tank capable of storing the metal ink 181. Then, the first tank 171A and the ink tank storing the metal ink 181 are connected, and similar to the cleaning liquid tank 195, the metal ink 181 may be replenished from the ink tank to the first tank 171A by setting the first tank 171A to a negative pressure. In the case of this configuration, the control device 28 may execute a notification for checking the amount of the metal ink 181 in the ink tank and prompting the replenishment of the metal ink 181 as each of the notifications described later.

[0051] In addition, the first printing unit 72 is provided with a first liquid sensor 213A and a second liquid sensor 213B. Further, a first lens 215A is attached to the upper surface of the first tank 171A, and a second lens 215B is attached to the upper surface of the second tank 171B. The first liquid sensor 213A is, for example, an optical liquid level sensor and is attached above the first tank 171A. The first liquid sensor 213A outputs a detection signal corresponding to the height of the liquid level to the control device 28 based on the reflected light reflected by the liquid level of the stored liquid in the first tank 171A via the first lens 215A. Similarly, the second liquid sensor 213B outputs a detection signal corresponding to the height of the liquid level to the control device 28 based on the reflected light reflected by the liquid level of the stored liquid in the second tank 171B via the second lens 215B. Thereby, the control device 28 can detect the amount of the stored liquid stored in each of the first and second tanks 171A and 171B and execute control according to the amount. Note that the liquid sensor is not limited to an optical liquid level sensor, and may be, for example, a sensor that detects the height of the liquid level or the amount of the stored liquid using ultrasonic waves or electromagnetic waves.

[0052] As shown in FIG. 5, in the first embodiment, an upper limit value TH1A and a lower limit value TH2A for determining the height of the liquid level of the stored liquid in the first tank 171A are set. The upper limit value TH1A is set, for example, at a position a predetermined distance below the position of the first cleaning liquid supply port 191A. The lower limit value TH2A is set at a position below the upper limit value TH1A. Similarly, an upper limit value TH1B and a lower limit value TH2B are set for the second tank 171B. The control device 28, for example, prompts replenishment of the metal ink 181 when the height of the liquid level of the metal ink 181 in the first and second tanks 171A and 171B is below the predetermined lower limit values TH2A and TH2B before starting the production of the circuit board 151. Alternatively, the control device 28, for example, when circulating the stored liquid, executes control to send out the stored liquid to the lower limit values TH2A and TH2B in the tank on the sending side. Further, the control device 28 manages the amount of the stored liquid by the upper limit values TH1A and TH1B. The control device 28, for example, discharges (purges) the stored liquid when the height of the liquid level of the stored liquid in the first tank 171A exceeds the upper limit value TH1A after replenishment of the metal ink 181 or the like. The discharge destination of the stored liquid is not particularly limited. For example, a box for discharging the stored liquid may be provided in the first printing unit 72. The inkjet head 76 of the first printing unit 72 is, for example, slidable within a certain range and movable between the region for forming the circuit board 151 and the position for discharging the stored liquid. Then, the above-described box may be installed at the position for discharging the stored liquid, and the inkjet head 76 may be moved to the discharging position according to the discharging operation. Alternatively, a box for discharging the stored liquid and a discharge port connected to the box may be provided on the base 60.

[0053] (Regarding the life management of the metal ink 181) Next, the process by which the control device 28 manages the life of the metal ink 181 will be described. FIG. 6 shows an example of the process executed by the control device 28 when the substrate forming apparatus 10 is activated. FIG. 7 shows the process of executing notification according to the life of the metal ink 181, discharging of the ink, and cleaning of the nozzles 209. By executing the processes of FIGS. 6 and 7, the control device 28 discharges the metal ink 181 in response to the metal ink 181 reaching the end of its life (hereinafter sometimes referred to as "expired"), and after the discharge, the control device 28 cleans the tank with the cleaning liquid 197. In the present application, in order to distinguish from the operation of discharging the metal ink 181 to form the metal wiring 157, taking the metal ink 181 out from the first and second tanks 171A and 171B for disposal is described as "discharge".

[0054] When the power of the substrate forming apparatus 10 is turned on and the system of the substrate forming apparatus 10 is activated, the control device 28 starts the process shown in FIG. 6. Note that the conditions for starting the process shown in FIG. 6 are not limited to the conditions of power-on or system activation. For example, when the substrate forming apparatus 10 has a mode for managing the life of the metal ink 181 and a mode for not managing it, the process of FIG. 6 may be started on the condition that the user switches to the mode for management.

[0055] As shown in FIG. 6, first, in step (hereinafter simply referred to as "S") 11, the control device 28 determines whether or not the metal ink 181 has reached the end of its life. The life of the metal ink 181 is the expiration date, which is set by, for example, the ink manufacturer and is the period during which the quality is guaranteed. If this expiration date passes, there is a risk that the printing accuracy and the electrical characteristics of the formed metal wiring 157 will deteriorate. For example, the metal ink 181 has a determined life for each lot. The life of the lot here is, for example, the expiration date for each unit in which the metal ink 181 is sold as a product, and when it is sold packed in a tank, it is the expiration date set for each tank.

[0056] As will be described later, when replenishing the metal ink 181, the control device 28 accepts the remaining life of the metal ink 181 to be replenished (S39 in FIG. 7), and stores the accepted remaining life information in the storage device 144. As the unit of the set time of the remaining life, various time widths such as monthly, daily, hourly, minute-by-minute, and second-by-second can be adopted. In the following description, as an example, an example in which the remaining life is set in units of days (date) and managed in units of days will be described. Incidentally, when the metal ink 181 is already stored in the first and second tanks 171A and 171B and replenished by adding, for example, the remaining life of the metal ink 181 already stored may be prioritized. When the control device 28 is replenished after discharging all the metal ink 181 in the first and second tanks 171A and 171B, it accepts the remaining life and updates the remaining life information in the storage device 144. When replenished by adding, it is not necessary to update the remaining life.

[0057] In S11, for example, when the date today has reached the remaining life date stored in the storage device 144 (S11: YES), specifically, when the date today is the remaining life date or after the remaining life date, the control device 28 executes S29 in FIG. 7 described later. Thereby, the metal ink 181 is discharged and cleaning is performed with the cleaning liquid 197. Incidentally, the remaining life in the present application is not limited to the expiration date set by the manufacturer. For example, the metal ink 181 may progress drying under normal temperature and pressure. For this reason, if the time during which the metal wiring 157 is not formed becomes long, the metal ink 181 in the nozzle 209 of the inkjet head 76 may dry, and silver fine particles may adhere to the nozzle 209. As a result, ejection failure may occur, and there is a risk that the metal wiring 157 cannot be properly shaped. Subsequently, a failure of the inkjet head 76 may occur and it may be necessary to replace it. Therefore, in S11, for example, when the elapsed time since the metal ink 181 was replenished into the tank is equal to or longer than a predetermined time, the control device 28 may determine that the metal ink 181 has reached the remaining life (S11: YES).

[0058] Also, when the current date has not reached the expiration date (S11: NO), specifically, when the current date is before the expiration date, the control device 28 determines whether the prior notice in S23 of FIG. 7 described later has been executed. If it has been executed (S12: YES), the control device 28 executes S25 of FIG. 7. Thereby, the process of FIG. 7 after the prior notice described later can be started. Further, when the prior notice has not been executed (S12: NO), the control device 28 executes S21 of FIG. 7, that is, starts the process of FIG. 7.

[0059] When the control device 28 starts the process of FIG. 7, in S21, it determines whether the current date has reached a predetermined number of days before the expiration date of the storage device 144. For example, when the expiration date is set in units of half a year or one year, as the predetermined number of days in S21, a period such as one month or one week can be adopted. Also, the predetermined number of days in S21 is an example of the predetermined time in the present application. As described above, it is not limited to the unit of days, and other units such as a predetermined number of months before, a predetermined time before, or a predetermined minute before may be used. Also, a change in the predetermined number of days may be accepted from the user. When the current date is before the day before the above-mentioned predetermined number of days, that is, when it has not reached the predetermined number of days (S21: NO), the control device 28 repeatedly executes the determination process of S21. Specifically, when the predetermined number of days is one month, a negative determination is made in S21 until the day before one month ago (S21: NO).

[0060] When the current date is before a predetermined number of days or after the day before the predetermined number of days, that is, when the current date has passed the day before the predetermined number of days (S21: YES), the control device 28 executes a prior notice suggesting that the life of the metal ink 181 stored in the first and second tanks 171A and 171B is approaching. Specifically, the control device 28 displays, for example, a message such as "It has been XXXX (predetermined number of days) before the expiration date of the metal ink. Please replace it before the expiration date" on the touch panel 139. This prior notice is an example of a notice suggesting that the life of the metal-containing liquid of the present application is approaching. Note that the content of the suggestive notice is not limited to the above content prompting replacement. For example, a notice that only informs that the life is approaching without prompting replacement, or a notice that only prompts replacement without informing that the life is approaching may be used. Therefore, as the prior notice in S23, various notices that allow recognition of the approaching life can be adopted. Also, the method of executing the prior notice is not limited to the method of displaying a message on the touch panel 139. For example, the control device 28 may send a prior notice to the administrator's email address or a smartphone application. Further, when the substrate forming apparatus 10 can communicate with the management PC via a network, the content of the prior notice may be displayed on the management PC. Regarding the following other notices (completion notice in S35, notice of the third notice process before production, etc.), the notice is not limited to the notice using the touch panel 139, and the above-mentioned other methods may be used for the notice.

[0061] When the control device 28 executes S23, it determines whether an exchange instruction has been received (S25). For example, when the user performs the exchange of the metal ink 181 after seeing the prior notice of S23, the user operates the touch panel 139 to execute an instruction indicating the exchange. When the control device 28 receives this instruction (S25: YES), it starts the discharge and cleaning process of S31. Note that the method of giving the exchange instruction is not limited to the method using the touch panel 139, and other methods such as the method implemented from the above-described management PC may also be used. On the other hand, when no exchange instruction has been received (S25: NO), similar to S11 described above, it is determined whether the metal ink 181 has reached the end of its life (S27). Until the life has ended (S27: NO), the process from S25 is repeatedly executed. Therefore, after the prior notice is executed, until an exchange instruction is received and the current date reaches the life date, the processes of S25 and S27 are repeatedly executed. Also, if the power is cut off and then turned on again, since the prior notice has already been executed, the control device 28 makes an affirmative determination in S12 of FIG. 6 (S12: YES) and executes the processes after S25. Note that the control device 28 may start from the process of S21 each time the power is turned on and repeatedly execute the prior notice.

[0062] When the metal ink 181 has reached the end of its life (S27: YES), the control device 28 determines whether the state of the substrate forming device 10 allows for discharging and cleaning (S29). For example, when various doors provided in the substrate forming device 10 (such as doors for maintaining the inkjet head 76 and doors for taking out the produced circuit board 151) are opened, the control device 28 temporarily halts various operations until the doors are closed and does not perform discharging and cleaning. Alternatively, when some error has occurred in the first printing unit 72 or the like, at least one of discharging and cleaning cannot be executed. For example, when the inkjet head 76 cannot move to the position for discharging the above-described storage liquid (the box for discharging) due to an error in the drive motor or the like, the discharging process cannot be executed. Also, when an error occurs in the positive pressure pump 173 or the like, the discharging process cannot be executed. Further, when the cleaning liquid 197 in the cleaning liquid tank 195 runs out, the cleaning process cannot be executed. In such cases, the control device 28 makes a negative determination in S29 (S29: NO) and executes a notification of reaching the end of life (S30).

[0063] Also, when the circuit board 151 reaches the end of its life during production (S27: YES), the control device 28 makes a negative determination in S29 until production is completed (S29: NO) and may continue production. Alternatively, when the control device 28 reaches the end of its life during production, it may make an affirmative determination in S29 (S29: YES) and execute discharging and the like after S31. In this case, production is interrupted.

[0064] In S30, the control device 28 displays, on the touch panel 139, a message such as "The metal ink has reached the expiration date. Discharging / cleaning will start after the door is closed." This message is an example of a notification suggesting that the metal-containing liquid of the present application has reached the end of its life. Thereby, the user can know in advance that the discharging operation of the metal ink 181 will start after work such as maintenance is completed and can prepare the replacement metal ink 181.

[0065] After executing S30, the control device 28 executes S29 and continues to execute S30 until it becomes possible to execute discharge and cleaning. When it becomes possible to execute discharge and cleaning (S29: YES), the control device 28 starts discharge and cleaning (S31). In S31, for example, after discharging the metal ink 181 in the first and second tanks 171A and 171B to the lower limit values TH2A and TH2B, the cleaning liquid 197 is supplied to both tanks to dilute the metal ink 181 remaining in both tanks with the cleaning liquid 197. The control device 28 discharges the stored liquid in which the cleaning liquid 197 is mixed with the metal ink 181 until both tanks become empty. When the metal ink 181 is discharged until the tank becomes empty in a state where the concentration of the metal ink 181 is high, air may mix into the metal ink 181 sticking to the ejection surface of the nozzle 209, generating bubbles and adhering to other units or the like. On the other hand, by diluting the metal ink 181 and then discharging it until the tank becomes empty, the generation of the above-mentioned bubbles can be suppressed, and the scattering of the metal ink 181 can be suppressed. Note that the processing content of S31 described above is an example. For example, the control device 28 may discharge the metal ink 181 until the tank becomes empty at once without diluting it.

[0066] After diluting and discharging, the control device 28 executes a cycle of two processes, namely, a first supply process of supplying the cleaning liquid 197 to both tanks up to the upper limit values TH1A and TH1B, and a first discharge process of discharging until the tanks become empty after the first supply process, a predetermined number of times. Next, the control device 28 executes a cycle of two processes, namely, a second supply process of supplying the cleaning liquid 197 only to the first tank 171A up to the upper limit value TH1A, and a second discharge process of circulating the cleaning liquid 197 between both tanks and then discharging until the tanks become empty, a predetermined number of times. In this way, after cleaning the inside of the tank a first number of times and flushing away the metal ink 181 adhering to the inside of the tank, circulation is executed. Here, when executing circulation, when the stored liquid in the sending-side tank reaches the lower limit values TH2A and TH2B, the control device 28 stops the sending operation. However, if an error occurs in the first liquid sensor 213A or the like, there is a possibility of sending until the tank becomes empty. In this case, if the viscosity of the stored liquid is high, bubbles of the metal ink 181 may be generated in the tank on the side where it is sent, and the metal ink 181 may splash and adhere to the first lens 215A or the like. Therefore, by diluting with the cleaning liquid 197 to lower the viscosity of the stored liquid and then executing circulation, the generation and splashing of the above-mentioned bubbles of the metal ink 181 can be suppressed.

[0067] Then, in order to prevent drying in the washed first and second tanks 171A and 171B and in the inkjet head 76, for example, the control device 28 supplies the cleaning liquid 197 to the first tank 171A up to the upper limit value TH1A, makes the first and second tanks 171A and 171B under negative pressure, and maintains a state in which the inside of both tanks and the inkjet head 76 are filled with the cleaning liquid 197. Incidentally, for example, when the user is present near the substrate forming apparatus 10 and the metal ink 181 is replenished immediately, it is not necessary to execute the process of filling the inside of the above-mentioned tank and the inkjet head 76 with the cleaning liquid 197. For example, the control device 28 may display a message such as "Do you want to replenish the metal ink?" on the touch panel 139 for a certain period of time, and execute the process of filling the cleaning liquid 197 as described above if there is no response.

[0068] Also, as described above, when the substrate forming apparatus 10 is started up, the control device 28 determines the remaining life (S11, an example of the second remaining life determination step of the present application). If the remaining life has already expired (S11: YES), discharge and cleaning are executed (S31). If the metal ink 181 whose life has expired is left in a tank or the like, silver fine particles may aggregate in the inkjet head 76 to form large particles, which may cause clogging of the nozzles 209. On the other hand, if the remaining life has expired at startup, by automatically executing discharge and cleaning in accordance with the startup, the occurrence of failures in the inkjet head 76 can be suppressed. Also, when the remaining life expires during power-off, the user can be prompted to replace the ink. Note that the control device 28 does not necessarily have to determine the remaining life at startup. For example, the control device 28 may execute the processing starting from S21 in FIG. 7 at startup without executing the processing in FIG. 6.

[0069] Further, the control device 28 may increase the number of times of cleaning in S31 and the amount of the cleaning liquid 197 according to the length of the elapsed time from the remaining life until the start of cleaning. For example, the control device 28 increases at least one of the first number of times of repeating the above-described first supply process and first discharge process and the second number of times of repeating the second supply process and second discharge process as the number of elapsed days from the remaining life date until the day when the process of S31 is started becomes longer. As the number of elapsed days becomes longer, there is a possibility that the silver fine particles are more condensed and solidified, or the viscosity of the metal ink 181 is increased. Therefore, by increasing each parameter in the cleaning and performing stronger cleaning, the metal ink 181 whose life has expired can be more surely washed away. Alternatively, the control device 28 may increase the number of times of execution of the circulation operation in which the cleaning liquid 197 is circulated between both tanks in the second discharge process according to the number of elapsed days. Specifically, the number of times of execution of the circulation operation of sending the cleaning liquid 197 from the first tank 171A to the second tank 171B up to the lower limit value TH2A and sending the cleaning liquid 197 from the second tank 171B to the first tank 171A up to the lower limit value TH2B may be increased as the number of elapsed days becomes longer.

[0070] Further, the control device 28 increases the amount of the cleaning liquid 197 supplied in each process (the first supply process or the second supply process) of S31 as the number of elapsed days from the above-described life date to the day when the process of S31 is started becomes longer. For example, the control device 28 may increase the supply amount of the cleaning liquid 197 step by step from the lower limit values TH2A and TH2B to the upper limit values TH1A and TH1B every time the number of elapsed days increases by a predetermined number of days (such as 3 days). Also, when the first printing unit 72 is provided with a wiping device that wipes off the ink adhering to the ejection surface of the nozzle 209, the number of wiping times for wiping the ejection surface by the wiping device may be increased in accordance with the increase in the number of elapsed days. Note that the control device 28 may increase at least one of the above-described number of cleaning executions and the amount of the cleaning liquid 197 in accordance with the number of elapsed days. Further, the control device 28 may execute the discharge and cleaning processes of the same content regardless of the number of elapsed days without performing such adjustments of the number of executions and the amount of the cleaning liquid 197.

[0071] After starting the execution of S31, the control device 28 determines whether or not the above-described discharge and cleaning have been executed and the process of filling the inkjet head 76 and the like with the cleaning liquid 197 has been completed (S33). Until the process is completed (S33: NO), the control device 28 continues the process of S31, and when the process is completed (S33: YES), the control device 28 executes a completion notification (S35). The control device 28 displays a message such as "Cleaning is completed" on the touch panel 139. Thereby, the user who has seen the message can start replenishing the metal ink 181.

[0072] Next, when the control device 28 executes S35, it determines whether the replenishment of the metal ink 181 is completed (S37). For example, after the user confirms the completion notification of S31, the user executes an operation on the touch panel 139 to replenish the metal ink 181. When the control device 28 receives this operation, in S35, it discharges the cleaning liquid 197 filled in both tanks and the inkjet head 76. After discharging the cleaning liquid 197, the control device 28 displays a message on the touch panel 139 indicating that ink replenishment is desired. When the user confirms this message, the user removes the ink supply unit 211 of the first tank 171A and replenishes the metal ink 181 into the first tank 171A. When the replenishment work is completed, the user executes an operation on the touch panel 139 indicating that the ink has been replenished. Until the control device 28 receives this operation, it repeatedly executes the determination process of S37 (S37: NO), and when it receives the operation (S37: YES), it executes acceptance of the life, etc. (S39). The control device 28 receives information (such as the date) on the life of the replenished metal ink 181 on the touch panel 139. As described above, the use-by date of the metal ink 181 is determined for each lot. The user operates the touch panel 139 to input the life (use-by date) of the tank containing the replenished metal ink 181.

[0073] In addition to accepting the life, the control device 28 also executes processes such as replenishing the metal ink 181 to the nozzles 209. The control device 28 circulates the metal ink 181 replenished in the first tank 171A between the two tanks a plurality of times and then applies a negative pressure to both tanks. As a result, the same amount of metal ink 181 is stored in both tanks, and the replenishment is completed. Incidentally, the control device 28 may execute an operation of discharging the metal ink 181 for testing and execute a process of filling the metal ink 181 up to the tip of the nozzle 209. When the control device 28 executes S39, it ends the processes shown in FIGS. 6 and 7. The control device 28, for example, starts the process from S21 and executes advance notification, monitoring of the end of life, etc. based on the life received in S39, that is, the life of the new metal ink 181 after replenishment.

[0074] (Notification before production) Next, the life determination process before starting the production of the circuit board 151 will be described. If the control device 28 anticipates that the circuit board 151 will reach the end of its life during production before production starts, it executes a notification. For example, when the control device 28 receives an instruction from the user to start the production of the circuit board 151 via the touch panel 139, it determines whether the metal ink 181 stored in the first and second tanks 171A and 171B will reach the end of its life between the start and end of the production (modeling) of the circuit board 151 before starting production (an example of the third life determination step of the present application). The control device 28 estimates the production time from the control data (production job) for producing the circuit board 151 and determines whether the end of life will occur within the estimated production time. Specifically, the production time is estimated by multiplying the number of steps of the circuit board 151 to be produced by the estimated working time of each step set in advance. Note that the method of setting the production time is not limited to the method described above. For example, the control device 28 may receive the estimated production time from the user. Alternatively, the control device 28 may estimate it from the production time of past similar circuit boards 151.

[0075] When the control device 28 determines, based on the above-described determination, that the metal ink 181 reaches the end of its life between the start and end of production, it executes, before starting the shaping, a notification suggesting that the metal ink 181 reaches the end of its life during the shaping (an example of the third notification step of the present application). The control device 28 displays, for example, a message such as "The metal ink will reach the end of its life during production. Do you want to replace it?" on the touch panel 139. When the control device 28 receives an operation indicating replacement on the touch panel 139, it executes, for example, the processes of S31 to S39 in FIG. 7, replaces the metal ink 181, and then starts production. Thereby, it is possible to suppress reaching the end of life during production. Also, by not using the metal ink 181 that has reached the end of its life, the electrical characteristics of the metal wiring 157 can be maintained. Also, the production time of the circuit board 151 may be one day or several days. For this reason, it is not always the case that a user is present near the substrate forming apparatus 10 when it reaches the end of its life. Therefore, notifying the end of life when the user gives a production instruction, that is, when there is a high possibility of being near the substrate forming apparatus 10, is extremely effective from the viewpoint of the user's work efficiency. Also, when the control device 28 receives an operation indicating not to replace from the user on the touch panel 139, it may start production as it is. Thereby, when the user desires to produce even when it reaches the end of its life, for example, when in a hurry to produce, production can be prioritized over quality. Note that the control device 28 does not necessarily execute the above-described determination of the end of life before production.

[0076] (Notification of power saving mode) Next, the determination process of the life during the power saving mode will be described. The substrate forming apparatus 10 has a normal mode and a power saving mode. After the power is turned on and the system is started up, the control device 28 shifts the substrate forming apparatus 10 to the normal mode. In the normal mode, when the substrate forming apparatus 10 supplies power to each device and receives a production start instruction from the user via the touch panel 139, it maintains a state where it can immediately start producing the circuit board 151.

[0077] Further, for example, in the normal mode, when the production of the circuit board 151 is not executed and the time during which no operation input is made to the touch panel 139 is equal to or longer than a predetermined reference time, the control device 28 causes the substrate forming apparatus 10 to shift to the power saving mode. In the power saving mode, the substrate forming apparatus 10 stops each device or the like to achieve power saving. For example, the control device 28 closes the nozzle solenoid valves 201A and 201B in the first printing unit 72 to stop the positive pressure pump 173 and the negative pressure pump 174, thereby achieving power saving. Alternatively, the control device 28 turns off the screen of the touch panel 139 to achieve power saving. Further, the control device 28 may stop the power supply to the electromagnetic motor 38, the temperature control unit 66, etc. to achieve power saving.

[0078] Further, the control device 28 shifts from the power saving mode to the normal mode based on a predetermined condition. For example, when the control device 28 receives an operation input to the touch panel 139 in the power saving mode, it releases the power saving mode and shifts to the normal mode. Further, the control device 28 determines whether or not the end of life has occurred during the power saving mode (an example of the second life determination step of the present application). The control device 28 determines whether or not the end of life has occurred in the same manner as in S11 and S27 described above. The control device 28 maintains the power saving mode while the end of life has not occurred and other release conditions (such as the condition that the touch panel 139 is operated) are not satisfied. Then, when the control device 28 determines that the end of life has occurred during the power saving mode, it releases the power saving mode and executes the processing after S29 in FIG. 7 (an example of the discharge cleaning step of the present application), and performs discharge and cleaning or the like. Thereby, when the end of life occurs during the power saving mode for suppressing power consumption, it is possible to automatically shift to the normal mode and perform discharge and cleaning. It is possible to suppress the occurrence of clogging of the nozzle 209 or the like during the power saving mode. Note that the control device 28 does not necessarily need to determine the end of life during the power saving mode. Further, the substrate forming apparatus 10 does not necessarily need to include the power saving mode.

[0079] Incidentally, in the above first embodiment, the substrate forming apparatus 10 is an example of a modeling apparatus. The first printing unit 72 is an example of the ejection device of the present application. The circuit board 151 is an example of a modeled object. The metal ink 181 is an example of a metal-containing liquid. The first and second tanks 171A and 171B are examples of tanks. The cleaning liquid tank 195, the positive pressure pump 173, the negative pressure pump 174, the first solenoid valves 187A and 187B, the fourth solenoid valve 193, the three-way valve 194, the first positive pressure supply path 183A, and the second positive pressure supply path 183B are examples of a cleaning device. The process of S21 is an example of a first life determination step and a first life determination process. The process of S23 is an example of a first notification step and a first notification process. The processes of S11 and S27 are examples of a second life determination step and a second life determination process. The process of S31 is an example of a discharge cleaning step and a discharge cleaning process. The process of S30 is an example of a second notification step.

[0080] As described above, according to the first embodiment, the following effects can be obtained. The control device 28, which is an aspect of the first embodiment, determines whether or not the metal ink 181 stored in the first and second tanks 171A and 171B has reached a time point a predetermined time ago (S21). When the control device 28 determines in S21 that the time point a predetermined time ago has been reached (S21: YES), the control device 28 executes a notification suggesting that the life is approaching (S23). As a result, it is possible to notify the user in advance that the life is approaching. After receiving the notification, the user can perform preparations for replacing the metal ink 181 or the like before the metal ink 181 reaches the end of its life. Further, the control device 28 determines whether or not the ink has run out (S27), and when it determines that the ink has run out (S27: YES), the control device 28 discharges the metal ink 181 and performs cleaning of the nozzle 209 and the like (S31). As a result, it is possible to reduce the possibility of problems such as clogging of the nozzle 209 occurring in the first printing unit 72 and suppress the occurrence of failures.

[0081] (Second Embodiment) Next, a second embodiment of the present disclosure will be described. FIG. 8 schematically shows the configuration related to the inkjet head 76 in the first printing unit 72 according to the second embodiment. In the above-described first embodiment, the first printing unit 72 includes both a positive pressure pump 173 that supplies positive pressure to the first and second tanks 171A and 171B, and a negative pressure pump 174 that supplies negative pressure to the first and second tanks 171A and 171B. In contrast, in the second embodiment, as shown in FIG. 8, it is different from the first embodiment in that an ejector 301 is provided instead of the negative pressure pump 174.

[0082] The ejector 301 includes a throttle portion 302 and a vacuum generator 303. The throttle portion 302 is provided between the first regulator 175 connected to the positive pressure pump 173 and the vacuum generator 303. The throttle portion 302 restricts the flow rate of the positive pressure air supplied from the first regulator 175 to the vacuum generator 303 to a constant flow rate. This flow rate is suitable for causing a pressure drop in the vacuum generator 303.

[0083] The vacuum generator 303 is connected between the throttle portion 302 and the second pressure gauge 178. The vacuum generator 303 has a space for generating negative pressure. Compressed air is supplied from the throttle portion 302, and when the supplied compressed air is discharged, the pressure in the internal space is reduced to generate negative pressure. The vacuum generator 303 supplies the generated negative pressure to the first and second tanks 171A and 171B via the first negative pressure supply path 184A and the second negative pressure supply path 184B.

[0084] Even with such a configuration, the control device 28 can individually control the pressures of the first and second tanks 171A and 171B by controlling the first solenoid valves 187A and 187B, the second solenoid valves 188A and 188B, and the third solenoid valves 189A and 189B. For example, when making the first tank 171A negative pressure, the control device 28 supplies air to the vacuum generator 303 to generate negative pressure, opens only the second solenoid valve 188A, and closes the other solenoid valves (the first solenoid valve 187A and the third solenoid valve 189A), thereby supplying negative pressure to the first tank 171A.

[0085] Further, in the above-described first embodiment, the control device 28 supplies the cleaning liquid 197 from the cleaning liquid tank 195 into each tank by making the inside of the first and second tanks 171A and 171B negative pressure. On the other hand, in the second embodiment, as shown in FIG. 8, it is different from the first embodiment in that it includes a liquid feed pump 305 that supplies the cleaning liquid 197 from the cleaning liquid tank 195. The liquid feed pump 305 is connected to the fourth solenoid valve 193, is driven based on the control of the control device 28, sucks up the cleaning liquid 197 stored in the cleaning liquid tank 195, and supplies it to each tank. Even with such a configuration, the cleaning liquid 197 can be appropriately supplied into the first and second tanks 171A and 171B.

[0086] Note that the present disclosure is not limited to the above-described embodiments, and can be implemented in various modes in which various changes and improvements are made based on the knowledge of those skilled in the art. For example, the content, order, etc. of the processes shown in FIGS. 6 and 7 described above are merely examples. For example, the control device 28 does not necessarily need to execute the completion notification in S35. Further, when the control device 28 makes an affirmative determination in S11 (S11: YES), it may start the process from S31 without executing S29 in FIG. 7. Also, the shape of the circuit board 151, the number of electronic components 163, the metal wiring 157, etc. shown in FIG. 3 are merely examples. Further, the first printing unit 72 may have a configuration including one tank (such as the first and second tanks 171A and 171B) that stores the metal ink 181, or may have a configuration including three or more tanks. Further, the first printing unit 72 may have a configuration that does not include the first and second liquid sensors 213A and 213B.

[0087] In addition, in the above-described embodiment, the substrate forming apparatus 10 includes the mounting unit 27 on the base 29, but it may include the mounting unit 27 outside the base 29. In this case, the X-axis slide rail 34 and the Y-axis slide rail 50 may be extended outside the base 29 to convey the stage 52 to the mounting unit 27 outside the base 29. Alternatively, the substrate forming apparatus 10 may include a conveying device that conveys the formed circuit board between the inside of the base 29 and the mounting unit 27 outside the base 29 separately from the conveying device 20. In addition, the substrate forming apparatus 10 includes the mounting unit 27 and is configured to perform up to the mounting of the electronic component 163, but it may not include the mounting unit 27. In this case, the substrate forming apparatus 10 may perform the production up to the circuit board before mounting the electronic component 163. In addition, the first solenoid valves 187A and 187B, the second solenoid valves 188A and 188B, the third solenoid valves 189A and 189B, the fourth solenoid valve 193, the three-way valve 194, and the nozzle solenoid valves 201A and 201B for switching each flow path are not limited to solenoid valves, and for example, those of a type that drives a valve by driving a motor or a piezo valve using a piezoelectric element may be used. Also, pneumatic or hydraulic valves may be used. In addition, the first printing unit 72 discharges the metal ink 181 from both the first and second tanks 171A and 171B, but it may be configured to discharge from one of them. For example, in the case where the first printing unit 72 is configured to discharge only from the first tank 171A, when discharging the metal ink 181, the nozzle solenoid valve 201B is closed and the nozzle solenoid valve 201A is opened to apply a negative pressure to the first tank 171A. Further, when the ink amount in the first tank 171A decreases, the control device 28 may open the nozzle solenoid valves 201A and 201B to replenish the metal ink 181 from the second tank 171B to the first tank 171A. The positive pressure pump 173 and the negative pressure pump 174 may be a single device. That is, the first printing unit 72 may include a pump that can supply both positive pressure and negative pressure. In addition, in the above-described embodiment, the metal ink 181 is adopted as the metal-containing liquid of the present application, but other metal-containing liquids such as the conductive paste discharged by the dispenser 106 may be adopted. Therefore, the ejection device of the present application is not limited to a configuration including an inkjet head, and may also be a configuration including a dispenser (such as an air dispenser or a jet dispenser).

[0088] Next, the technical idea derived from the content of the above embodiment will be described. (i) The ejection device includes a first tank and a second tank as the tanks, and includes a liquid sensor that outputs a detection signal according to the amount of liquid stored in the first tank and the second tank, The liquid sensor is used to determine whether the amount of liquid stored in the first tank and the second tank is below a predetermined lower limit value, In the discharge cleaning step, a circulation operation of sending the cleaning liquid sent from the first tank to the second tank back from the second tank to the first tank is executed. When sending the cleaning liquid from the first tank to the second tank, the cleaning liquid is sent until the cleaning liquid stored in the first tank reaches the lower limit value, and the longer the elapsed time from the life of the metal-containing liquid until the cleaning of the nozzle is started by the cleaning device, the more times the circulation operation is executed. The maintenance method according to claim 6. According to this, the longer the elapsed time since the end of the life, the more times the circulation operation during cleaning is increased, so that stronger cleaning can be performed and the metal ink 181 whose life has ended can be more surely washed away.

[0089] Furthermore, the content of the present disclosure is not limited to the dependency relationships described in the claims. For example, the present specification also discloses the technical idea of changing "the maintenance method according to claim 1 or claim 2" to "the maintenance method according to any one of claims 1 to 3" in claim 4. For example, the present specification also discloses the technical idea of changing "the maintenance method according to claim 1 or claim 2" to "the maintenance method according to any one of claims 1 to 4" in claim 5. For example, the present specification also discloses the technical idea of changing "the maintenance method according to claim 1 or claim 2" to "the maintenance method according to any one of claims 1 to 5" in claim 6.

Explanation of Signs

[0090] 10 Substrate forming device (modeling device), 28 Control device, 72 First printing unit (dispensing device), 151 Circuit board (modeled object), 157 Metal wiring, 171A First tank (tank), 171B Second tank (tank), 173 Positive pressure pump (cleaning device), 174 Negative pressure pump (cleaning device), 181 Metal ink (metal-containing liquid), 183A First positive pressure supply path (cleaning device), 183B Second positive pressure supply path (cleaning device), 187A, 187B First solenoid valve (cleaning device), 193 Fourth solenoid valve (cleaning device), 194 Three-way valve (cleaning device), 195 Cleaning liquid tank (cleaning device), 209 Nozzle.

Claims

1. A tank capable of storing a metal-containing liquid containing metal fine particles, a nozzle connected to the tank and discharging the metal-containing liquid supplied from the tank, a cleaning device for cleaning the nozzle, A maintenance method for a discharge device comprising: a first life determination step of determining whether a predetermined time has been reached before the life of the metal-containing liquid stored in the tank; a first notification step of executing a notification suggesting that the life of the metal-containing liquid stored in the tank is approaching when it is determined in the first life determination step that the predetermined time has been reached; a second life determination step of determining whether the metal-containing liquid stored in the tank has reached the end of its life; a discharge cleaning step of discharging the metal-containing liquid stored in the tank from the nozzle and cleaning the nozzle with the cleaning device when it is determined in the second life determination step that the metal-containing liquid has reached the end of its life; A maintenance method including the above.

2. When it is determined in the second life determination step that the metal-containing liquid has reached the end of its life, if the discharge device is in a state where at least one of discharging the metal-containing liquid and cleaning with the cleaning device cannot be performed, a second notification step of executing a notification suggesting that the metal-containing liquid has reached the end of its life is further included. The maintenance method according to claim 1.

3. a metal wiring forming step of discharging the metal-containing liquid from the nozzle and curing the discharged metal-containing liquid to form a metal wiring; a third life determination step of determining whether the metal-containing liquid stored in the tank reaches the end of its life before starting to finish the shaping of a shaped object having the metal wiring by the shaping device including the discharge device; a third notification step of executing a notification suggesting that the metal-containing liquid reaches the end of its life during shaping before starting shaping when it is determined in the third life determination step that the metal-containing liquid reaches the end of its life from the start to the end of shaping; The maintenance method according to claim 1 or claim 2, including the above.

4. When starting the shaping device including the discharge device, the second life determination step is executed, and when the metal-containing liquid has already passed its life, the discharge cleaning step is executed. The maintenance method according to claim 1 or claim 2.

5. The shaping device including the discharge device, It has a power-saving mode that reduces power consumption compared to the normal mode in which shaping can be performed using the ejection device. The maintenance method according to claim 1 or claim 2, wherein the second life determination step is executed during the power-saving mode, and when it is determined that the metal-containing liquid has reached the end of its life during the power-saving mode, the power-saving mode is canceled and the discharge cleaning step is executed.

6. In the discharge cleaning step, The maintenance method according to claim 1 or claim 2, wherein at least one of the number of cleaning executions and the amount of cleaning liquid is increased according to the length of the elapsed time from the life of the metal-containing liquid until the cleaning of the nozzle is started by the cleaning device.

7. An ejection device, A control device for controlling the ejection device, Comprising, The ejection device is A tank capable of storing a metal-containing liquid containing metal fine particles, A nozzle connected to the tank and ejecting the metal-containing liquid supplied from the tank, A cleaning device for cleaning the nozzle, Comprising, The control device is A first life determination process for determining whether or not it has reached a predetermined time before from the life of the metal-containing liquid stored in the tank, A first notification process for executing a notification indicating that the life of the metal-containing liquid stored in the tank is approaching when it is determined by the first life determination process that it has reached a predetermined time before, A second life determination process for determining whether or not the metal-containing liquid stored in the tank has reached the end of its life, When it is determined by the second life determination process that the metal-containing liquid has reached the end of its life, a discharge cleaning process for discharging the metal-containing liquid stored in the tank from the nozzle and cleaning the nozzle by the cleaning device, A shaping device that executes.

Citation Information

Patent Citations

  • Cleaning fluid for liquid application device, and liquid application device cleaning method

    JP2020193236A