Apparatus comprising carriers with optoelectronic elements, and method for manufacturing the same

Abstract

To provide an apparatus comprising carriers with optoelectronic elements making it possible to segment the carriers and arrange several segments next to each other without visible borders on a cover.SOLUTION: An apparatus comprises: an at least partially transparent first cover; a second cover; and at least one first layer segment, in particular, an intermediate layer segment, which is arranged between the first cover and the second cover. The first layer segment carries an arrangement of a plurality of optoelectronic light sources. The arrangement of the plurality of optoelectronic light sources has a defined shape with a defined contour. The first layer segment has the same shape and the same contour as the arrangement of the plurality of optoelectronic light sources.SELECTED DRAWING: Figure 17C

Description

Technical Field

[0001] The present invention relates to an apparatus comprising a carrier having an optoelectronic element attached to the carrier and a method for manufacturing the same.

Background Art

[0002] The present invention claims priority from German Patent Application No. 10 2019 133 449.7 (December 6, 2019), Danish Patent Application No. PA202070104 (February 21, 2020), German Patent Application No. 10 2020 126 792.4 (October 13, 2020), and German Patent Application No. 10 2020 126 793.2 (October 13, 2020), the entire disclosures of which are incorporated herein by reference.

[0003] A carrier, in particular a foil having a light-emitting diode, an LED, attached to the carrier can be attached to or integrated into a vehicle window, for example, to display information such as the speed or speed limit of the vehicle to the driver of the vehicle. For manufacturing reasons, the width of such a carrier is limited. In order to cover a large area, several carriers need to be arranged adjacent to each other.

[0004] Placing two carriers adjacent to each other or on or in a window or cover without a gap at the interface between the carriers can be technically difficult, so that a person, such as a vehicle passenger, may see reflections occurring at the interface due to variations in the refractive index. Furthermore, different light transmissions at the body of the carrier and at the interface between two adjacent carriers may be seen. The sharp edges of the carrier may also be seen and should be removed.

[0005] Furthermore, carriers containing LEDs are used to model various three-dimensional shapes. Therefore, segmenting the carrier and arranging several segments adjacent to each other without visible boundaries on the cover is a technical requirement.

[0006] Accordingly, there is a need to provide an optoelectronic device comprising a cover and at least two carriers mounted on the cover having optoelectronic elements attached to at least two carriers, wherein at least one of the aforementioned drawbacks is reduced or eliminated.

[0007] A further object of the present invention is to provide a vehicle comprising this device and a method for manufacturing this device.

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] The underlying object of the present invention is fulfilled by an optoelectronic device having the features of item 1. Furthermore, the underlying objects of the present invention are fulfilled by an optoelectronic device having the features of item 5, an optoelectronic device having the features of item 7, a vehicle having the features of item 14, and a method for manufacturing an optoelectronic device having the features of items 15, 16 and 17 respectively. Advantageous further developments and aspects of the present invention are described in the dependent items.

[0009] In a first aspect of the present application, an optoelectronic device is provided. The optoelectronic device comprises a transparent first cover, at least two carriers, a plurality of optoelectronic elements, and a second cover. The optoelectronic elements are configured to emit light and are attached to at least two carriers. Furthermore, the at least two carriers are attached to the first cover. The second cover is attached on at least two carriers carrying the optoelectronic elements. Accordingly, at least two carriers having optoelectronic elements are sandwiched between the first cover and the second cover.

[0010] The second cover has a lower light transmittance than the first cover, at least partially. Alternatively or additionally, the second cover has a lower light transmittance than at least two carriers, at least partially.

[0011] Light transmittance can also be expressed as light transmission, but it is a measure of what proportion of electromagnetic radiation, particularly visible light, passes through a medium. Light can be attenuated, for example, by absorption in the medium.

[0012] At least two carriers may be arranged adjacent to each other on the first cover. The gap between adjacent carriers can have a higher light transmittance than the carriers having optoelectronic elements. These different light transmittances can be covered and thus made less visible by the reduced light transmittance of the second cover. The second cover can, for example, provide the effect of smoked glass.

[0013] In this application, that is, with respect to the first and all other aspects of this application, the carrier can be a foil, particularly a flexible foil. The foil can be made of, for example, polyurethane, PU, polyethylene terephthalate, PET, poly(methyl methacrylate), PMMA, polycyclic aromatic hydrocarbons, PAK, polyvinyl butyral, PVB, or any other suitable material.

[0014] One or several conductive layers can be deposited on the carrier to provide electrical contacts and redistribution to optoelectronic elements mounted on the conductive layer(s).

[0015] Each of the optoelectronic elements can include a light-emitting diode, LED, or any other suitable light-emitting element. In particular, the optoelectronic element can be a micro light-emitting diode, μLED, having a small lateral dimension in the micrometer range, for example.

[0016] Optoelectronic devices can emit light of a specific wavelength or within a specific wavelength range, such as visible light, or infrared, IR, light, or ultraviolet, UV, light.

[0017] Optoelectronic devices can be arranged in an array on at least two carriers and can form a display or part of a display. Each of the optoelectronic devices may represent a pixel of the array. Alternatively, each optoelectronic device may represent a sub-pixel. For example, in an RGB pixel array, a pixel may include three optoelectronic devices that emit red light, green light, and blue light, respectively.

[0018] Optoelectronic devices can include integrated circuits, ICs, particularly semiconductor chips or packaged semiconductor chips.

[0019] Each of the first and second covers can be made from a glass material, a plastic material, and / or any other suitable material. Each of the first and second covers can include only one layer or several layers of the same or different materials.

[0020] The reduced light transmittance of the second cover may be achieved, for example, by dots or a pattern printed on the second cover. The dots and patterns may have suitable shapes and may be arranged regularly or periodically. Alternatively, they may be arranged in an irregular pattern or any other suitable pattern. Further, the second cover may include light-absorbing particles that reduce the light transmittance of the second cover.

[0021] The light transmittance may be reduced uniformly or may vary over the second cover. Dithering may be used to vary the light transmittance. For example, the density of the dots printed on the second cover can be increased in regions where a low light transmittance is desired, and the density of the dots can be decreased in regions having a higher light transmittance.

[0022] The light transmittance can be decreased only in a specific region of the second cover.

[0023] The second cover may be colored or may have a black-and-white appearance.

[0024] The second cover may have a lower light transmittance in the region at the interface between two adjacent carriers, and in other regions of the second cover, its light transmittance may be higher. This helps to compensate for the higher light transmittance at the interface between two adjacent carriers where a gap may occur between the two carriers.

[0025] The gap between two adjacent carriers of at least two carriers may be filled with a material having a light transmittance the same as or similar to that of the two carriers, and / or a refractive index the same as or similar to that of the two carriers. Such materials will be described in more detail below in connection with the second aspect of the present application.

[0026] Alternatively, by not filling the gap between two adjacent carriers with a material, air or a vacuum may be included in the gap.

[0027] In a second aspect of the present application, the optoelectronic device includes a transparent first cover and at least two carriers mounted on the first cover. Further, a plurality of optoelectronic elements configured to emit light are attached to each of the at least two carriers. The gap between two adjacent carriers of the at least two carriers is filled with a material having a light transmittance the same as or similar to that of the two carriers. Additionally or alternatively, the material has a refractive index similar to that of the two carriers.

[0028] When the light transmittance of the material filling the voids is adapted to the light transmittance of the carriers, the interface between two adjacent carriers becomes less visible. Further, if the refractive index of the material filling the voids is similar to the refractive index of the carriers, the reflection occurring at the interface between adjacent carriers is reduced.

[0029] Having similar light transmittance or refractive index means that the light transmittance and refractive index of the filler material differ from those of the carriers by no more than 1%, 3%, 5%, or 10% respectively.

[0030] The material filling the voids can be made of, for example, silicone, epoxy resin, or any other suitable material. The material may further contain particles.

[0031] The optoelectronic device can comprise a transparent second cover attached to at least two carriers such that at least two carriers are sandwiched between a first and a second carrier, together with an optoelectronic element attached to the carriers.

[0032] The second carrier can have a reduced light transmittance, as described above in connection with the first aspect of the present invention.

[0033] Furthermore, dots or patterns may be printed on at least two carriers and / or the material filling the voids between two adjacent carriers to further conceal the use of different materials.

[0034] The filling material can be deposited in the voids between adjacent carriers by using dispensing, screen printing, spraying, especially spraying through a mask, or any other suitable method.

[0035] After the material has been deposited in the voids, the material protruding from the voids can be removed to form a smooth surface.

[0036] In one embodiment, before at least two carriers are attached to the first cover, an adhesive material is deposited on the first cover. Thereafter, at least two carriers are pressed into the adhesive material. As a result, portions of the adhesive material are pressed into the gaps between adjacent carriers. In this embodiment, the adhesive material has a light transmittance that is the same as or similar to the light transmittance of the two carriers, and / or a refractive index that is the same as or similar to the refractive index of the two carriers. Thus, the adhesive material can be used as a filling material. The adhesive material can be made of, for example, silicone, epoxy, or any other suitable material.

[0037] In a third aspect of the present application, an optoelectronic device includes a transparent first cover and at least two carriers attached on the first cover. Further, a plurality of optoelectronic elements configured to emit light are attached to each of the at least two carriers. The light transmittance of each carrier varies in the direction of the gap between each carrier and an adjacent carrier.

[0038] The light transmittance of each carrier can be increased in the direction of the gap between each carrier and an adjacent carrier. Thus, the light transmittance may be high adjacent to the gap and low further away from the gap. This can be particularly useful for making the transition from the carrier to the gap less visible or smoother to an observer, especially when the gap contains air or vacuum. The gap may also be filled with a material as described above in connection with the second aspect of the present application.

[0039] The gradient of the light transmittance towards the gap may or may not be constant or stationary.

[0040] The light transmittance of each carrier can be varied by perforating each carrier, i.e., making holes, and / or by a pattern printed on each carrier. When there are perforations in the carrier, the adhesive material used to attach the carrier to the first cover may be pushed into the holes when the carrier is pressed against the first cover. The adhesive material can have a light transmittance that is the same as or similar to the light transmittance of the two carriers, and / or a refractive index that is the same as or similar to the refractive index of the two carriers, as described above in connection with the second aspect of the present application.

[0041] A transparent second cover can be attached over at least two carriers such that the carriers are disposed between the first cover and the second cover together with the optoelectronic element.

[0042] The optoelectronic device according to the first, second, or third aspect of the present application may be a window for use in a vehicle, and the optoelectronic element is used to generate light and / or to display content or any other optical feature. In particular, the optoelectronic device may be one of a roof lining, a panoramic roof, a front windshield, a rear window, and a side window for a vehicle.

[0043] According to a fourth aspect of the present invention, a vehicle comprises an optoelectronic device according to one of the first, second, and third aspects.

[0044] In a fifth aspect of the present application, a method of manufacturing an optoelectronic device is provided. The method includes attaching at least two carriers onto a transparent first cover on which a plurality of optoelectronic elements configured to emit light are attached to each of the at least two carriers, and attaching a second cover onto the at least two carriers, the second cover having a light transmittance that is at least partially lower than that of the first cover and / or the at least two carriers.

[0045] The method according to the fifth aspect can be used to manufacture the optoelectronic device according to the first aspect.

[0046] The method according to the fifth aspect can include the embodiments disclosed above in relation to the optoelectronic device according to the first aspect.

[0047] In a sixth aspect of the present application, a method of manufacturing an optoelectronic device is provided. The method includes attaching at least two carriers on a transparent first cover, wherein a plurality of optoelectronic elements configured to emit light are attached to each of the at least two carriers, and filling a gap between two adjacent carriers of the at least two carriers with a material having a light transmittance identical or similar to the light transmittance of the two carriers and / or a refractive index identical or similar to the refractive index of the two carriers.

[0048] The method according to the sixth aspect can be used to manufacture the optoelectronic device according to the second aspect.

[0049] The method according to the sixth aspect can include the embodiments described above in relation to the optoelectronic device according to the second aspect.

[0050] In a seventh aspect of the present application, a method of manufacturing an optoelectronic device is provided. The method includes mounting at least two carriers on a transparent first cover, wherein a plurality of optoelectronic elements configured to emit light are attached to each of the at least two carriers, and the light transmittance of each carrier is varied in the direction of the gap between each carrier and an adjacent carrier.

[0051] The method according to the seventh aspect can be used to manufacture the optoelectronic device according to the third aspect.

[0052] The method according to the seventh aspect can include the embodiments described above in connection with the optoelectronic device according to the third aspect.

[0053] Some embodiments of the present invention include a transparent first cover, a first layer segment, particularly an intermediate layer segment, including at least one optoelectronic element disposed on the transparent first cover, and a second layer segment, particularly an intermediate layer segment, disposed on the transparent first cover adjacent to the first layer segment along a first direction. The first and second layer segments include substantially the same refractive index and are joined to each other by a molten and re-solidified material along the first direction to mechanically connect the first layer segment and the second layer segment. Each of the first and second layer segments forms a respective boundary region where the first and second layer segments are joined to each other, and the boundary region includes, consists of, or at least contacts the molten and re-solidified material.

[0054] In some aspects, a third layer segment, particularly an intermediate layer segment, is disposed on the transparent first cover adjacent to the first layer segment along a second direction, where the second direction is different from the first direction, and in particular, the first and second directions are oriented perpendicular to each other. The first and third layer segments include substantially the same refractive index and are joined to each other along the second direction by a molten and re-solidified material to mechanically connect the first and third layer segments. Each of the first and third layer segments forms a respective boundary region where the first and third layer segments are joined to each other, and the boundary region includes, consists of, or at least contacts the molten and re-solidified material.

[0055] The layer segments make it possible to form a larger layer, such as a so-called intermediate layer, between the transparent first cover and the transparent second cover. Thus, by using layer segments joined to each other along the first and / or second directions, a large surface area corresponding to the larger layer can be formed.

[0056] The layer segments can be quite thin and flexible. Thus, they can be made of a more sensitive material such as a foil material. Using smaller layer segments and building larger layers from the layer segments makes the smaller-sized layer segments easier to handle than the larger layers, thus simplifying the production process. Further, placing layer segments on the surface of, for example, a transparent cover can be easier than placing a larger single layer. Using smaller layer segments and building a larger layer from the layer segments onto a transparent cover also simplifies possible rework in the case of defective segments or obviates rework if only "good" segments are used for final assembly.

[0057] At least one optoelectronic element is disposed on a first layer segment. In some embodiments, at least one optoelectronic element is disposed on each layer segment, on a plurality of layer segments, or on just one layer segment. Thus, there may be layer segments on which no optoelectronic element is disposed and / or layer segments on which one or more optoelectronic elements are disposed.

[0058] In some embodiments, the fused and re-solidified material comprises or consists of the material of the first layer segment, the material of the second layer segment, or a combination of the materials of the first and second layer segments.

[0059] In some embodiments, the fused and re-solidified material comprises or consists of the material of the first layer segment, the material of the third layer segment, or a combination of the materials of the first and third layer segments.

[0060] In some embodiments, the fused and re-solidified material consists of a material different from the material of one of the first, second, and third layer segments.

[0061] Thus, by melting and re-dissolving the boundary regions of the first and / or second layer segments, a melted and re-solidified material can be formed from the material of the first layer segment, the material of the second layer segment, or a combination of the materials of the first and second layer segments. However, the melted and re-solidified material can also be formed, at least in part, from a material that is different from the material of one of the first and second layer segments, in particular, from a material having a melting temperature lower than that of the material of one of the first and second layer segments.

[0062] In some embodiments, the melted and re-solidified material includes a refractive index similar to that of the first and / or second layer segments. Thereby, the transparency of the optoelectronic device can be improved.

[0063] The layer segments can be at least partially transparent and can include or consist of materials such as high-grade or low-grade polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), (colorless) polyimide (PI), ethylene vinyl acetate (EVA), polyvinyl butyral (PVB), or ionomer-based layers. In particular, the layer segments can include or consist of at least partially transparent plastics, in particular at least partially transparent foils. The height of the layer segments can be, for example, less than 1 mm, in particular less than 500 μm, and more particularly less than 200 μm.

[0064] The transparent first cover is at least partially transparent and can include or consist of materials such as ethylene vinyl acetate (EVA), polyvinyl butyral (PVB), or ionomer-based systems. In particular, the transparent first cover can include or consist of at least partially transparent plastics, in particular at least partially transparent foils.

[0065] In some embodiments, at least one optoelectronic element may be a light-emitting diode, and the LED may be a volume emitter or a surface emitter. At least one optoelectronic element can be individually controlled. Thus, the light distribution can be controlled in the optoelectronic device. The individual control of at least one optoelectronic element can be achieved, for example, by individually controlling the current supplied to each optoelectronic element. The LED can form a pixel or a sub-pixel and emit light of a selected color, such as an RGB pixel.

[0066] In some embodiments, at least one optoelectronic element, particularly an LED, can have a size of less than 300 μm, particularly less than 150 μm. Due to these spatial extensions, at least one optoelectronic element is hardly visible to the human eye.

[0067] In some embodiments, at least one optoelectronic element is an LED. The LED can be particularly called a mini-LED, which is a small LED having an edge length in the range of, for example, less than 200 μm, particularly less than 40 μm, and particularly in the range of 200 μm to 10 μm. Another range is 150 to 40 μm. However, the LED can also be called a micro-LED, or a μLED chip, particularly when the edge length is in the range of 100 μm to 10 μm.

[0068] As an optoelectronic device, a mini-LED or μ-LED chip can be used. The mini-LED or μ-LED chip forms a pixel or sub-pixel and can emit light of a selected color. The mini-LED or μ-LED chip forms a pixel or sub-pixel and can emit light of a selected color, such as RGB pixels. In a preferred embodiment, the mini-LED or μ-LED chip may be an unpackaged semiconductor chip. Being unpackaged may mean that the chip does not have a housing around its semiconductor layer, such as an unpackaged semiconductor die.

[0069] In some embodiments, at least one optoelectronic device can be a sensor, particularly a light-sensitive sensor such as a photodiode.

[0070] In some embodiments, the optoelectronic device can include a connector region and a programming region disposed adjacent to the first layer segment, electrically coupled to at least one optoelectronic device to control the optoelectronic device and supply energy thereto.

[0071] A further embodiment provides an optoelectronic system comprising an optoelectronic device according to any one of the foregoing embodiments disposed between two transparent plates, particularly glass plates, wherein the transparent first cover can form one of the transparent plates.

[0072] In some embodiments, the optoelectronic system forms at least a partially transparent window glass of a vehicle, particularly the front glass or a window of the vehicle. Thus, the window glass, particularly the front glass or a window, comprises at least one optoelectronic device in order to at least partially brighten the window glass and / or display information on at least a part of the window glass.

[0073] The optoelectronic system can be part of, for example, a headliner or any other surface such as the outer surface of a vehicle. Thus, the optoelectronic system can have a three-dimensional shape and / or can be arranged on a curved surface. In this way, the headliner or the outer surface includes at least one optoelectronic element, at least in part to brighten the headliner or the outer surface and / or to display information on at least a part of the headliner or the outer surface.

[0074] The production of small layer segments can be easier and more cost-effective, especially compared to a complete layer of a size such as the size of a vehicle windshield. Thus, by arranging two or more layer segments adjacent to each other on, for example, a transparent cover, a simpler and more cost-efficient method for manufacturing an optoelectronic system having particularly large dimensions can be provided. Further, it can be made easier to arrange layer segments adjacent to each other on a transparent cover having, for example, a three-dimensional shape as if the layer segments were the same size as the transparent cover.

[0075] Some embodiments provide a method of manufacturing an optoelectronic device, the method comprising providing a temporary carrier layer, placing a first layer segment on the temporary carrier layer that includes at least one optoelectronic element, placing a second layer segment adjacent to the first layer segment along a first direction on the temporary carrier layer, wherein the first and second layer segments have substantially the same refractive index, joining the first and second layer segments to each other such that a molten and re-solidified material (24) is disposed between adjacent edges of the first and second layer segments along the first direction.

[0076] In some embodiments, arranging a second layer segment adjacent to a first layer segment along a first direction includes overlapping the first and second layer segments at edge regions of the first and second layer segments.

[0077] In some embodiments, joining the first and second layer segments together includes heating at least a boundary region of the first and / or second layer segments such that the overlapping layer segments flow into a gap between the first and second layer segments that forms a molten and re-solidified material. The gap can be formed, in particular, by an opening caused by superimposing the first and second layer segments under the overlapping layer segments.

[0078] In some embodiments, joining the first and second layer segments together includes heating at least a boundary region of the first and / or second layer segments such that the molten and re-solidified material is formed from the material of the first and / or second layer segments. Thus, the first and second layer segments can be arranged adjacent to each other along the first direction at a predetermined distance, in particular a distance less than 1 mm. Thus, when heating at least a boundary region of the first and / or second layer segments, the material of at least the boundary region of the first and / or second layer segments flows into the gap between the first layer segment and the second layer segment.

[0079] In some embodiments, the boundary region of the first and / or second layer segments can be heated, for example, by an oven, a locally applied laser beam, an infrared heater, or by heating at least a locally temporary carrier layer. In some embodiments, the boundary region of the first and / or second layer segments can be heated in a vacuum atmosphere to avoid air pockets, thus enhancing the transparency of the optoelectronic device.

[0080] In some embodiments, the temporary carrier layer can include or consist of a material having good thermal conductivity, such as a metal.

[0081] In some embodiments, joining the first layer segment and the second layer segment together includes partially chemically dissolving the first layer segment and / or the second layer segment such that the molten and re-solidified material is formed from the material of the first layer segment and / or the second layer segment. Thus, the first and second layer segments can be arranged adjacent to each other along a first direction at a predetermined distance, particularly a distance less than 1 mm. Thus, when at least the boundary region of the first and / or second layer segment is partially chemically dissolved, the material of at least the boundary region of the first and / or second layer segment flows into the gap between the first and second layer segments.

[0082] In some embodiments, the method further comprises placing a third layer segment adjacent to the first layer segment along a first direction on the temporary carrier layer opposite the second layer segment, placing a fourth layer segment on the first, second, and third layer segments, wherein the first, second, third, and fourth layer segments include substantially similar refractive indices and optionally consist of similar materials.

[0083] In some embodiments, the method further comprises joining the second, third, and fourth layer segments together such that a molten and re-solidified material is disposed between adjacent edges of the second, third, and fourth layer segments to cover the first layer segment with the second, third, and fourth layer segments. A further embodiment provides a method of manufacturing an optoelectronic device, the method comprising providing a temporary carrier layer, placing a first layer segment on the temporary carrier layer including at least one optoelectronic element, Placing a second layer segment on the first layer segment such that the second layer segment overlaps at least one edge region of the first layer segment, joining the first and second layer segments such that the second layer segment nests up to the contour of the first layer segment, wherein the first and second layer segments have similar refractive indices.

[0084] In some embodiments, joining the first and second layer segments together can be performed by melting and re-solidifying the material between adjacent edges of the first and second layer segments, or by deep drawing the second layer segment.

[0085] In some embodiments, the second layer segment completely overlaps the first layer segment.

[0086] In some embodiments, the second layer segment at least partially extends onto the edge of the first layer.

[0087] In some embodiments, the method further includes removing the joined layer segments from a temporary carrier layer and placing them on a transparent first cover.

[0088] The object of the present invention is satisfied by an optoelectronic device comprising at least partially transparent first cover, a second cover, and at least one first layer segment. The at least one first layer segment is, in particular, an intermediate layer segment arranged between the first cover and the second cover and carrying the arrangement of a plurality of optoelectronic light sources. The optoelectronic light sources can be embedded within the first layer segment or can be arranged on the upper surface region of the first layer segment. The arrangement of the plurality of optoelectronic light sources has, in particular, a defined shape with a defined contour when seen in a top view of the optoelectronic device. The top view of the optoelectronic device can be correlated, for example, with the top view of the first cover. In addition, the first layer segment has the same shape and the same contour as the arrangement of the plurality of optoelectronic light sources.

[0089] If the first layer segment carries an arrangement of a plurality of optoelectronic light sources and the first layer segment does not have the same shape but the same contour as the arrangement of the plurality of optoelectronic light sources, the contour of the first layer segment (which does not coincide with the contour of the arrangement of the optoelectronic light sources) is visible, in particular when the light sources are switched on, due to the refractive index difference between the first layer segment and the surrounding medium. In other words, when the optoelectronic light sources are switched on, not only can the optoelectronic light sources light up, but also the contour of the first layer segment can light up due to the propagation of light within the first layer segment and the out-coupling of light at the contour of the first layer segment. The illumination of the contour of the intermediate layer can be perceived as bothersome by the user of the optoelectronic device and can thus be an undesirable light extraction.

[0090] However, when the first layer segment carries the arrangement of a plurality of optoelectronic light sources and the first layer segment has the same shape and the same contour as the arrangement of the plurality of optoelectronic light sources, the disruptive light extraction at the contour of the first layer segment, and thus the visibility of the contour of the first layer segment, is pushed onto the contour of the arrangement of the plurality of optoelectronic light sources. Thus, the illumination of the contour of the first layer segment due to the refractive index difference between the first layer segment and the surrounding medium may become non-disruptive to the user of the optoelectronic device.

[0091] The term "contour" can mean an outer contour and / or an inner contour. The contour of the arrangement of the plurality of optoelectronic light sources, and thus the contour of the first layer segment, may be, for example, in the shape of a ring, the inner ring may be the inner contour, and the outer ring may be the outer contour.

[0092] However, the contour of the arrangement of the plurality of optoelectronic light sources, and thus the contour of the first layer segment, can be of any other shape, such as circular, rectangular, arrow-shaped, any symbol or indicator, and may not have an inner contour. Further, the contour need not be continuous and can be composed of a plurality of smaller segments instead.

[0093] In some embodiments, the optoelectronic device further includes at least one second layer segment. The second layer segment is, in particular, an intermediate layer segment arranged in the same layer as at least one first layer segment between the first cover and the second cover. The second layer segment includes a second edge shaped complementary to at least a first portion of the contour of the first layer segment. Further, the second layer segment is arranged adjacent to the first layer segment such that the second edge is adjacent to the first portion of the contour.

[0094] The term "second edge" can relate to the outer edge or the inner edge of the second layer segment. The second edge of the second layer segment may be, for example, at least a part of a ring-shaped inner ring, or at least a part of an outer ring of any shape of the second layer segment. The second edge of the second layer segment can be of any shape. For example, it can be a circle, a rectangle, an arrow, any symbol, an indicator, or a negative of at least a part of any one of the aforementioned shapes.

[0095] The first part of the contour of the first layer segment can include, for example, a curve and / or a line including a kink. Thus, the second edge shaped complementarily to the first part of the contour of the first layer segment can include a line including a kink shaped complementarily to the curve and / or the kink of the contour of the first layer segment.

[0096] In some embodiments, the second edge is shaped complementarily to at least the first part of the contour of the first layer segment, and the second layer segment is disposed adjacent to the first layer segment such that the second edge is adjacent to the first part of the contour. In other words, the second edge and the first part of the contour of the first layer segment can fit together as, for example, two puzzle pieces, and these puzzle pieces are joined together. However, in contrast to a puzzle, there are usually no interlocking parts.

[0097] In some embodiments, the second layer segment is a layer of molten material, or an adhesive layer, particularly a hot melt adhesive layer, or a resin such as PVB or EVA.

[0098] In some embodiments, the second layer segment can surround the first layer segment in the same layer. The second layer segment can have the same height as the first layer segment, but the second layer segment can also have a height different from, particularly greater than, the height of the first layer segment. Thus, the second layer segment can not only surround the first layer segment in the circumferential direction, but also completely embed the first layer segment in the second layer segment.

[0099] In some embodiments, the second edge contacts, particularly directly contacts, the first part of the contour along the entire length of the first part of the contour. Thus, there may be a refractive index difference between the material of the first layer segment and the material of the second layer segment. However, a small gap, particularly an air gap, can be arranged between the second edge of the contour and the first part, and thus between the first layer segment and the second layer segment. Thus, the refractive index difference can occur between the first layer segment and the air in the gap.

[0100] In some embodiments, both the contour and the second edge are closed in the circumferential direction, and the second edge is shaped complementary to the contour along its complete circumferential length. The first layer segment can have, for example, a circular, rectangular, or any desired symbol shape, and the second layer segment can include, for example, a layer segment having the shape of the cut-out first layer segment.

[0101] Thus, the cut-out contour of the second layer segment can form the second edge.

[0102] In some embodiments, the optoelectronic light sources are equally distributed over at least one first layer segment. Each of the optoelectronic light sources can form a pixel, where the optoelectronic light sources can be distributed over the surface area of at least one first layer segment to obtain a desired resolution. Thereby, the resolution can be defined by dividing the number of pixels by the surface area on which the pixels are arranged. In some embodiments, LEDs can be used as optoelectronic light sources. The LEDs can in particular be referred to as mini-LEDs, which are small LEDs having an edge length in the range of, for example, less than 200 μm, in particular less than 40 μm, in particular in the range of 200 μm to 10 μm. Another range is 150 to 40 μm. However, the LEDs can also be referred to as micro-LEDs (also called μLEDs) or μLED chips, especially when the edge length is in the range of 100 μm to 10 μm.

[0103] The mini-LED or μLED chip can be used as an optoelectronic light source. The mini-LED or μLED chip can form a pixel or a sub-pixel and can emit light of a selected color. The mini-LED or μLED chip can in some embodiments be an unpackaged semiconductor chip. By unpackaged is meant that the chip has no housing around its semiconductor layer, such as, for example, an unpackaged semiconductor chip.

[0104] In some embodiments, each optoelectronic light source can include a mini-LED or μLED chip configured to emit light of a selected color. In some embodiments, each optoelectronic light source can include one or more mini-LED or μLED chips, including, for example, three mini-LED or μLED examples, such as an RGB pixel. The RGB pixel can emit light of, for example, red, green, and blue, as well as any mixed color.

[0105] In some embodiments, the RGB pixels can further include one or more integrated circuits (ICs), particularly small integrated circuits, such as micro integrated circuits (μICs).

[0106] In some embodiments, the size of the first layer segment is significantly smaller than the size of the first cover, particularly noticeable when viewed from the top view of the optoelectronic device. Thus, for example, the arrangement of a plurality of optoelectronic light sources forming symbols or indicators can illuminate only a small area of the first cover and thus the optoelectronic device. In some embodiments, the first layer segment can form a small display between the first cover and the second cover, and the size of the display is significantly smaller than the size of the first cover. Significantly smaller can mean, for example, that the size of the first layer segment is in the range of 0.5% to 20% of the size of the first cover.

[0107] In some embodiments, the first layer segment is arranged between the first cover and the second cover such that, particularly when viewed from the top view of the optoelectronic device, the first layer segment is not arranged within the boundary region of the first cover. The boundary region of the first cover extends inwardly of the first cover from the outer edge of the first cover by at least about 5 mm, in particular.

[0108] In some embodiments, the first layer segment includes a surface side that extends in a vertical direction along the contour of the first layer segment. The material of the first layer segment can include at least one of scattering particles, defects, and voids on the surface side. The scattering particles, defects, or voids can be formed, for example, by a laser cutting process used to obtain the contour of the first layer segment. The vertical direction can particularly be a direction perpendicular to the layers of the optoelectronic device.

[0109] Scattered particles, defects, and / or voids can increase the refractive index difference between the first layer segment and any other layer segment disposed adjacent to the first layer segment.

[0110] In some embodiments, the optoelectronic device further includes at least one third layer segment. The third layer segment is, in particular, an intermediate layer segment disposed in the same layer as at least one first layer segment between the first cover and the second cover. The third layer segment includes at least one conductor line, and preferably two conductor lines, and in particular supplies electrical energy and / or data signals to a plurality of optoelectronic light sources. The third layer segment further includes a third edge that is complementarily shaped to at least a second portion of the contour of the first layer segment. Further, the third layer segment is disposed adjacent to the first layer segment such that the third edge is adjacent to the second portion of the contour.

[0111] The term "third edge" relates to the outer or inner edge of the third layer segment. The third edge of the third layer segment may be, for example, at least a part of the inner ring of a ring-shaped shape, or at least a part of the outer contour of any shape of the third layer segment. However, the third edge may preferably be shaped complementary to a part of the outer contour of any shape of the first layer segment.

[0112] In some embodiments, the third edge contacts, in particular directly contacts, the second portion of the contour along at least the entire length of the second portion of the contour. Thus, a refractive index difference may occur between the material of the first layer segment and the material of the third layer segment. However, small voids, in particular air voids, can be disposed between the third edge of the contour and the second portion, and thus between the first layer segment and the third layer segment. Thus, the refractive index difference can occur between the first layer segment and the air in the void.

[0113] In some embodiments, the third layer segment includes a surface side that extends vertically along the third edge. The material of the third layer segment can include at least one of scattered particles, defects, and voids on the surface side. The vertical direction can be, in particular, a direction perpendicular to the layers of the optoelectronic device.

[0114] In some embodiments, the first layer segment and / or the second layer segment and / or the third layer segment are made in one piece. A plurality of perforations extend along the contour of the first layer segment, and the layer segments can be distinguished from each other while remaining in one piece. In particular, the first layer segment and / or the second layer segment and / or the third layer segment are made of the same material connected to each other. A single layer segment can be identified by a plurality of perforations extending along the contour of the first layer segment. Due to the perforations, the contour of the first layer segment becomes jagged, and thus, the refractive index difference between the first layer segment and / or the second layer segment and / or the third layer segment can be increased.

[0115] In some embodiments, the first layer segment and the third layer segment are made in one piece. A plurality of perforations can extend along a second portion of the contour of the first layer segment that is complementarily shaped to the third edge of the third layer segment. The first layer segment can include an arrangement of a plurality of optoelectronic light sources, while the third layer segment can include at least one conductor line and preferably two conductor lines, in particular, for supplying electrical energy and / or data signals to the plurality of optoelectronic light sources.

[0116] In some embodiments, the first layer segment, the second layer segment, and the third layer segment are made in one piece. The plurality of perforations can extend along the entire contour of the first layer segment that is complementarily shaped to the second edge of the second layer segment and the third edge of the third layer segment. The first layer segment can include an arrangement of a plurality of optoelectronic light sources, the third layer segment can include at least one conductor line and preferably two conductor lines, in particular for supplying electrical energy and / or data signals to the plurality of optoelectronic light sources, and the second layer segment can circumferentially surround the first and third layer segments.

[0117] In some embodiments, the first and second layer segments, and / or the first and third layer segments have different refractive indices. In some embodiments, the first layer segment has a refractive index different from any layer segment and / or the first and second covers. Thus, the light from the plurality of optoelectronic light sources propagating through the first layer segment is scattered at the boundary regions between the first layer segment and any layer segment, and / or between the first layer segment and the first and / or second covers.

[0118] In some embodiments, at least one, preferably all, of the layer segments are made of or include a material that is at least partially transparent or blackened. By using a blackening material, the effect of light scattering within the boundary regions between the first layer segment and any layer segment, and / or between the first layer segment and the first and / or second covers can be reduced.

[0119] In a further embodiment of the present invention, a method of manufacturing an optoelectronic device is provided. The method includes providing at least one first layer segment, in particular an intermediate layer segment, carrying an arrangement of a plurality of optoelectronic light sources. The arrangement of the plurality of optoelectronic light sources has a defined shape with a defined contour, and the first layer segment has the same shape and the same contour as the arrangement of the plurality of optoelectronic light sources. The method further includes providing at least a transparent first cover and a second cover, and arranging the first layer segment between the first cover and the second cover.

[0120] In some embodiments, providing at least one first layer segment includes providing the first layer segment from a larger first layer, in particular by cutting or laser cutting. Thereby, the first layer segment has at least the same shape and the same contour as the arrangement of the plurality of optoelectronic light sources when viewed in a top view of the optoelectronic device.

[0121] In some embodiments, the method further includes arranging a second layer segment between the first cover and the second cover, and a second edge of the second layer segment is adjacent to a first part of the contour. The second edge is in particular shaped complementary to at least a first part of the contour of the first layer segment.

[0122] In some embodiments, the second layer segment is disposed between the first cover and the second cover in front of the first layer segment. The second layer segment can be, for example, a hot melt adhesive layer such as a polyvinyl butyral (PVB) or ethylene vinyl acetate (EVA) layer disposed on at least one of the first cover and the second cover, and the first layer segment can be disposed on the second layer segment or pushed into the second layer segment in a molten state or at least a softened state of the second layer segment. Thus, when the molten or at least softened material of the second layer segment follows the contour of the first layer segment, the second edge can be complementary formed to at least a first portion of the contour of the first layer segment.

[0123] Alternatively, the first layer segment is disposed between the first cover and the second cover in front of the second layer segment. Thus, the second layer segment can be disposed adjacent to the first layer segment so as to join the two puzzle pieces together.

[0124] In some embodiments, providing the first layer segment includes exposing the surface side of the first layer segment to laser light. The surface side extends along the contour of the first layer segment in a vertical direction. Exposing the surface side to laser light can optionally be a laser cutting process. By exposing the surface side of the first layer segment to laser light, small defects or voids are generated on the surface side of the first layer segment. In particular, when the first layer segment is cut from the first layer using a laser cutting process, small defects in the form of burn marks and lumps of material and voids are generated in the material of the first layer segment on its surface.

[0125] In some embodiments, the method further includes providing scattering particles on the surface side of the first layer segment. The surface side extends particularly along the contour of the first layer segment in a vertical direction.

[0126] In some embodiments, the method further includes providing a third layer segment in the same layer as at least one first layer segment between the first cover and the second cover. The third layer segment includes at least one conductor line and preferably two conductor lines, similar to the third edge. The third edge is shaped complementary to at least a second portion of the contour of the first layer segment.

[0127] In some embodiments, the method further includes placing a third layer segment between the first cover and the second cover adjacent to the first layer segment such that the third edge is adjacent to the second portion of the contour.

[0128] In some embodiments, a second layer segment is placed between the first cover and the second cover before the first layer segment and the third layer segment. The second layer segment can be, for example, a hot melt adhesive layer such as a PVB or EVA layer disposed on at least one of the first cover and the second cover, and the first layer segment and the third layer segment can be placed on the second layer segment or pushed into the second layer segment in a molten state or at least a softened state of the second layer segment.

[0129] Alternatively, the first layer segment and the third layer segment are placed between the first cover and the second cover before the second layer segment. Thus, the second layer segment can be placed adjacent to the first layer segment and the third layer segment to puzzle pieces together.

[0130] In some embodiments, the method further includes providing scattering elements, defects, and / or voids on the surface side of the third layer segment. The surface side of the third layer segment extends vertically along the third edge of the third layer segment. The vertical direction can be, in particular, a direction perpendicular to the layers of the optoelectronic device. Providing scattering elements, defects, and / or voids on the surface side of the third layer segment can include, for example, exposing the surface side to laser light, a laser cutting process, or applying scattering particles to the surface side. Applying scattering particles to the surface side can include, for example, not only spraying scattering particles onto the surface side, but also screen printing or stencil printing.

[0131] In some embodiments, the method further includes generating a series of perforations in the third layer segment. The series of perforations preferably extends adjacent to the third edge, and the perforations can intersect the third edge. Between each two of the perforations, at least one conductor line can be guided so that electrical energy and / or data signals can still be transferred to a plurality of optoelectronic light sources. By generating a series of perforations, the third edge can become jagged, and thus the refractive index difference between the first layer and the third layer can be increased.

[0132] In some embodiments, an optoelectronic device or device includes a first layer, also referred to as a first layer segment or carrier or carrier layer, and a first cover and a second cover. The first cover and the second cover can also be considered as layers, and thus can be referred to as a first cover layer and a second cover layer. The first layer can be disposed between the first cover and the second cover. The first layer can carry at least one optoelectronic element or optoelectronic light source and / or at least one optoelectronic element or optoelectronic light, and can be partially or completely embedded in the first layer.

[0133] In some embodiments, the carrier layer is at least partially transparent and can comprise or consist of materials such as high or low grade polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), (colorless) polyimide (PI), polyurethane (PU), poly(methyl methacrylate) (PMMA), polycyclic aromatic hydrocarbon (PAK), or any other suitable material. In particular, the carrier layer can comprise or consist of at least partially transparent plastic, in particular at least partially transparent foil, in particular flexible foil.

[0134] Each of the first and second covers can be made from a glass material, a plastic material, and / or any other suitable material. Each of the first and second covers can comprise only one layer or several layers of the same or different materials.

[0135] In some embodiments, the optoelectronic device further comprises at least one auxiliary layer, also referred to as a second, third, or fourth layer segment. The first auxiliary layer can be disposed between the first layer and the first cover, and optionally, the second auxiliary layer can be disposed between the first layer and the second cover.

[0136] The at least one auxiliary layer can be a molten material layer, or an adhesive layer, in particular a hot melt adhesive layer, a resin such as ethylene vinyl acetate (EVA), polyvinyl butyral (PVB), or an ionomer-based system.

[0137] In some embodiments, at least one auxiliary layer can encapsulate the first layer within the same layer. The at least one auxiliary layer can have the same height as the first layer, but the at least one auxiliary layer can also have a different, particularly large height, from the height of the first layer. Since the first layer can be completely embedded in the at least one auxiliary layer, the at least one auxiliary layer can surround the first layer not only circumferentially.

[0138] In some embodiments, at least one auxiliary layer can be at least partially transparent. In some embodiments, at least one auxiliary layer can be blackened, resulting in an at least partially transparent auxiliary layer. If the optoelectronic device includes two or more auxiliary layers, none of the auxiliary layers can be blackened, or one, a selected auxiliary layer, or all of the auxiliary layers can be blackened.

[0139] In some embodiments, at least one optoelectronic element or optoelectronic light source, particularly an LED, can have a size of less than 300 μm, particularly less than 150 μm. Due to these spatial extensions, at least one optoelectronic element or optoelectronic light source is hardly visible to the human eye.

[0140] In some embodiments, at least one optoelectronic element optoelectronic light source is an LED. The LED can be particularly a mini-LED, which has an edge length in the range of, for example, less than 200 μm, particularly less than 40 μm, particularly in the range of 200 μm to 10 μm. Another range is 150 μm to 40 μm.

[0141] The LED can also be called a micro-LED (also referred to as μLED) or μLED chip, particularly when the edge length is in the range of 100 μm to 10 μm. In some embodiments, the LED can have a spatial dimension of 90×150 μm, or the LED can have a spatial dimension of 75×125 μm.

[0142] In some embodiments, the mini-LED or μ-LED chip can be an unpackaged semiconductor chip. Being unpackaged can mean that the chip does not have a housing around its semiconductor layer, such as an unpackaged semiconductor die. In some embodiments, being unpackaged can mean that the chip does not contain organic materials. Thus, an unpackaged device does not contain an organic compound containing carbon by covalent bond.

[0143] In some embodiments, each optoelectronic element or optoelectronic light source can include a mini-LED or μ-LED chip configured to emit light of a selected color. In some embodiments, each optoelectronic element or optoelectronic light source can include one or more mini-LED or μ-LED chips, such as three mini-LED or μ-LED chips, for example an RGB pixel. An RGB pixel can emit light of, for example, red, green, and blue, and any mixed color.

[0144] In some embodiments, the RGB pixel can further include one or more integrated circuits (ICs), particularly small integrated circuits, such as micro-integrated circuits (μICs).

[0145] In some embodiments, the optoelectronic device includes at least one conductor line, and preferably two conductor lines, particularly for supplying electrical energy and / or data signals to at least one optoelectronic light source.

[0146] In some embodiments, the carrier layer carries at least one conductor line. However, in some embodiments, at least one auxiliary layer can carry at least one conductor line.

[0147] In some embodiments, at least one conductor line may be a conductive material such as copper, for example. At least one conductor line can be coated and / or blackened to reduce the reflectivity of the outer surface area of the at least one conductor line. The coating can be, for example, a palladium or molybdenum coating. In some embodiments, at least one conductor line can have a width in the range of 5 μm to 50 μm.

[0148] In some embodiments, at least one conductor line can be formed as a conductive mesh, particularly a metal mesh. The mesh can be coated and / or blackened, particularly to reduce the reflectivity of the outer surface area of the conductive mesh. The coating can be, for example, a palladium or molybdenum coating.

[0149] In some embodiments, an optoelectronic device or device comprises a layer stack including a first layer as well as a first cover and a second cover. The first layer is, in particular, an intermediate layer arranged between the first cover and the second cover. At least one electronic element or optoelectronic element, particularly an optoelectronic light source, is arranged on the first layer, and at least one layer of the layer stack, preferably all layers of the layer stack, is at least partially transparent. The layer stack includes at least one conductive layer, and the conductive layer is arranged between two adjacent layers of the layer stack or embedded within the layer.

[0150] In some embodiments, at least one conductive layer includes at least one conductive wiring electrically connected to the contact pads of the optoelectronic light source. The at least one conductive layer can be, for example, a material with good electrical and thermal conductivity such as copper, silver, gold, and aluminum. The at least one conductive layer, and particularly the at least one conductive wiring, can be coated and / or blackened to reduce the reflectivity of the outer surface area of the at least one conductive wiring. The coating can be, for example, a palladium or molybdenum coating. In some embodiments, at least one electrical wire can have a width in the range of 5 μm to 50 μm.

[0151] The at least one conductive layer can include a conductive mesh, such as a metal mesh, particularly a copper mesh. The mesh can have nodes and interconnections between the knots, and preferably at least most of the interconnections are not interrupted. Thus, the at least one conductive layer can have a structure comprising a plurality of conductive wirings connected to each other.

[0152] The mesh can have a regular or irregular pattern, and the irregular pattern can increase the transparency of the conductive layer, so the irregular pattern can be preferred. The reason is that the irregular pattern can be more difficult to be perceived by the human eye.

[0153] In some embodiments, the conductive mesh is coated and / or blackened, particularly to reduce the reflectivity of the outer surface area of the conductive mesh. The coating can be, for example, a palladium or molybdenum coating.

[0154] At least some embodiments of the optoelectronic devices described herein can be disposed on non-flat or curved surfaces, such as on the outside or inside of a vehicle or a building. This is particularly possible since at least some embodiments of the optoelectronic devices described herein can be constructed based on a flexible layer structure.

[0155] Accordingly, the present invention also relates to larger entities such as vehicles or buildings that comprise at least one optoelectronic device on their outside or inside, particularly on their outside or inside surface.

[0156] The description using exemplary embodiments does not limit the present invention. Rather, the present invention includes any new features and any combination of features, particularly any combination of features in the claims even if such feature or combination itself is not explicitly stated in the claims or in the exemplary embodiments.

Brief Description of the Drawings

[0157] The following description of the drawings can further illustrate and explain exemplary embodiments. Components that are functionally identical or have the same effect are denoted by the same reference numerals. Identical or substantially identical components may be described only with respect to the drawing in which they first occur. Their description is not necessarily repeated in subsequent drawings.

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Embodiments for Carrying Out the Invention

[0158] Figures 1A and 1B show the optoelectronic device 10 in a cross-sectional view and a top view, respectively. The optoelectronic device 10 can be, for example, a roof lining for a vehicle, a panoramic roof, a windshield, a rear window, or a side window. The optoelectronic device 10 includes a transparent first cover 11, at least two carriers 12 (several carriers 12 are shown here), and a transparent second cover 13.

[0159] The first cover 11 is made of glass, and its thickness is, for example, 3 mm to 4 mm. The upper surface of the first cover 11 in Figure 1A forms the outer surface of the optoelectronic device 10 facing the outside of the vehicle.

[0160] The carriers 12 are attached to the first cover 11 and are arranged adjacent to each other. The carriers 12 are aligned as shown in Figure 1B.

[0161] The second cover 13 is attached to the carrier 12. The second cover 13 is made of a glass or plastic material and may have a thickness smaller than that of the first cover 11.

[0162] One of the carriers 12 is exemplarily shown in an enlarged and cross-sectional view in FIG. 1C. The carrier 12 is made of a flexible foil. One or more conductive layers 14 are deposited on the carrier 12 to provide electrical contacts and redistribution for optoelectronic elements in the form of LEDs 15 mounted on the conductive layer 14. The LED 15 is configured to emit light in a given wavelength range. The LEDs 15 are arranged in an array on the carrier 12.

[0163] As can be seen from FIGS. 1A and 1B, the void 16 occurs at the interface between adjacent carriers 12. In the optoelectronic device 10, the void 16 is filled with air or vacuum. The void 16 is visible to an observer due to the different light transmittances of the carriers 12 and the air or vacuum filling the void 16.

[0164] FIGS. 2A and 2B show examples of a head-up display 20 integrated into the front windshield 21 of a vehicle during the day and at night, respectively. The head-up display 20 includes a foil having LEDs attached to the foil. The area 22 of the front windshield 21 where the head-up display 20 is disposed can be clearly distinguished from the area 23 where the head-up display 20 is not disposed. This is because the light transmittances of the areas 22 and 23 are different.

[0165] FIG. 3 shows in cross-section an optoelectronic device 30 as an exemplary embodiment according to the first aspect of the present application, which can be manufactured using the method according to the fifth aspect of the present application.

[0166] The optoelectronic device 30 includes a transparent first cover 11, several carriers 12, and a second cover 13, which are arranged in the same way as the optoelectronic device 10 shown in FIGS. 1A and 1B. Further, an LED 15 not shown in FIG. 3 is mounted on the carrier 12 as shown in FIG. 1C. A gap 16 is formed between adjacent carriers 16, which may be filled with air or vacuum. When the optoelectronic device 30 is a window of a vehicle, the second cover 13 may face the inside of the vehicle.

[0167] The light transmittance of the optoelectronic device 30 is higher in the region 31 where the gap 16 is located than in the region 32 where the carrier 12 is located, as shown by arrows 33 and 34 in FIG. 3 respectively. The thicknesses of arrows 33 and 34 are related to the light transmittance in the respective regions 31 and 32.

[0168] To hide the different light transmittances in regions 31 and 32, the second cover 13 has a lower light transmittance than the first cover 11 and / or the carrier 12.

[0169] The decrease in the light transmittance of the second cover 13 can be achieved, for example, by dots or patterns printed on the second cover 13, or by light-absorbing particles contained in the second cover 13. The light transmittance may be uniformly reduced on the second cover 13, or may be varied, for example, by dithering that changes the density of the dots printed on the second cover 13.

[0170] For example, in the region 31 where the gap 16 is located, the light transmittance of the second cover 13 can be reduced compared to the light transmittance of the second cover 13 in the region 32 where the carrier 12 is located.

[0171] FIG. 4A shows, in cross section, an exemplary embodiment of an optoelectronic device 40 according to a second aspect of the present application. The optoelectronic device 40 can be manufactured using the method according to the sixth aspect of the present application.

[0172] The optoelectronic device 40 includes a transparent first cover 11, several carriers 12 having LEDs 15, and a transparent second cover 13, which are arranged in the same way as the optoelectronic device 10 shown in FIGS. 1A - 1C.

[0173] In the optoelectronic device 40, the gap 16 between adjacent carriers 16 is filled with a material 41 having a light transmittance the same as or similar to that of the carrier 12 and / or a refractive index the same as or similar to that of the carrier 12. The material 41 makes the interface between two adjacent carriers 12 less visible and reduces the reflection occurring at the interface.

[0174] When the carrier 12 and the material 41 have the same light transmittance, the light transmittance in the region 31 where the gap 16 is located is the same as the light transmittance in the region 32 where the carrier 12 is located. This is shown in FIG. 4A by arrows 43 and 44 having the same thickness, where arrow 43 represents the light transmittance in region 31 and arrow 44 represents the light transmittance in region 32.

[0175] The material 41 may be deposited into the gap 16 by using dispensing, screen printing, spraying, especially spraying through a mask, or any other suitable method. After the material 41 is deposited in the gap 16, the material 41 protruding from the gap 16 may be removed to form a smooth surface.

[0176] FIG. 4B schematically shows a light beam 45 passing through the optoelectronic device 40. The air outside the optoelectronic device 40 has a refractive index RI equal to 1, while the first cover 11 has a refractive index RI equal to 1.5, where glass can have a refractive index in the range of 1.45 - 2.14. The carrier 12, the second cover 13, and the material 41 have a refractive index higher than or lower than that of the first cover 11.

[0177] FIG. 5 shows, as an exemplary embodiment according to the third aspect of the present application, an optoelectronic device 50 in cross section. The optoelectronic device 50 can be manufactured using the method according to the seventh aspect of the present application.

[0178] The optoelectronic device 50 includes a transparent first cover 11, several carriers 12 having LEDs 15, and a transparent second cover 13, which are arranged in the same manner as the optoelectronic device 10 shown in FIGS. 1A - 1C.

[0179] In the optoelectronic device 50, the light transmittance of each of the carriers 12 changes in the direction of the gap 16 between the carriers 12. In particular, the light transmittance of each of the carriers 12 is increased in the direction of the gap 16 indicated by the arrow 51 in FIG. 5. Thus, the light transmittance of the carriers 12 is high adjacent to the gap 16 and low as it gets further away from the gap 16. This helps to make the transition from the carriers to the gap less visible or smoother to the observer. The gap 16 can be filled with air, vacuum, or the material 41 shown in FIG. 4A.

[0180] To change the light transmittance of the carriers 12, perforations including several holes 52 are punched in the carriers 12. Near the gap 16, the density of the holes 52 increases compared to the regions further away from the gap 16.

[0181] FIG. 6 shows the optoelectronic device 10 in a top view. The optoelectronic device includes a transparent first cover 11, a first layer segment 1.1, particularly an intermediate layer segment, disposed on the transparent first cover 11 and including optoelectronic elements 15, and a second layer segment 1.2, particularly an intermediate layer segment, disposed on the transparent first cover adjacent to the first layer segment 1.1 along the first direction x. When viewing the optoelectronic device 10 in a top view, the first layer segment and the second layer segment are joined to each other by melted and re - solidified material along the first direction x.

[0182] The optoelectronic device 10 further comprises a connector region 18 and a programming region 17 which is arranged along a first direction x, adjacent to the first layer segment 1.1 and opposite the second layer segment 1.2, and which is electrically coupled to the optoelectronic elements 15 to control the optoelectronic elements and supply them with energy.

[0183] According to this embodiment, the second layer segment can also include the optoelectronic elements 15 which are coupled to the connector 18 and the programming region 17.

[0184] FIG. 7 is a view showing the optoelectronic device 10 in a top view. The optoelectronic device 10 includes a further third layer segment 1.3, in particular an intermediate layer segment, which is arranged on a transparent first cover 11 adjacent to the second layer segment 1.2 along the first direction x, as compared with the optoelectronic device 10 of FIG. 6. Also, the third layer segment may include the optoelectronic elements 15 which are coupled to the connector and the programming region.

[0185] Next, referring to FIG. 8, the optoelectronic device 10 of FIG. 6 includes a further third layer segment 1.3, in particular an intermediate layer segment, disposed on a transparent first cover 11 adjacent to the second layer segment 1.2 along a first direction x. However, the third layer segment 1.3 may not include optoelectronic elements disposed thereon. The optoelectronic device 10 further includes two rows each of three layer segments 1.4 and 1.5 and 1.6, 1.7 and 1.8 and 1.9 disposed adjacent to the first, second, and third layer segments 1.1, 1.2, 1.3 along a second direction y, the second direction y being oriented perpendicular to the first direction x. Thus, one row 1.4 and 1.5 and 1.6 is disposed on the first, second, and third layer segments, and one row 1.7 and 1.8 and 1.9 is disposed under the first, second, and third layer segments. The two rows of layer segments do not include optoelectronic elements.

[0186] All of the layer segments may be of the same size, for example, as shown in FIG. 8, but the size and shape may be varied. The layer segments can include, for example, rectangles, squares, triangles, hexagons, or any other equivalent pattern.

[0187] In such a modular manner, a larger layer, for example, a so-called intermediate layer, can be formed between the transparent first cover and the transparent second cover. Thus, by using layer segments joined to each other along the first and / or second directions, a large surface area corresponding to the larger layer can be formed. Such a larger layer disposed between the transparent first cover and the transparent second cover, in particular a glass plate, can form an optoelectronic system.

[0188] The optoelectronic system can form at least a partially transparent vehicle window glass, especially the front glass or a window of a vehicle. Thus, the window glass, especially the front glass or a window, is provided with optoelectronic elements in order to at least partially brighten the window glass and / or to display information on at least a part of the window glass.

[0189] As shown in FIGS. 6 and 7, the optoelectronic elements 15 can be distributed over the entire surface area of the optoelectronic device 10, and thus the entire area can be brightened and / or information can be displayed over the entire area. On the other hand, according to FIG. 8, only the left central part of the optoelectronic device - the first and second layer segments 1.1, 1.2 - is provided with optoelectronic elements 15 in order to brighten the components of the optoelectronic device and / or to display information on the components of the optoelectronic device. In the case of the front glass of a vehicle, this area is, for example, within the line of sight of the driver of the vehicle and provides information to the driver by being displayed on the front glass.

[0190] Next, referring to FIGS. 9A and 9B, two processes for manufacturing the optoelectronic device are shown. In the first process (see FIG. 9A), a temporary carrier layer 19 is provided, and a first layer segment 1.1 is disposed on the temporary carrier layer 19, and the first layer segment 1.1 includes at least one optoelectronic element 15. A second layer segment 1.2 is disposed adjacent to the first layer segment 1.1 along a first direction x on the temporary carrier layer 19, and the first and second layer segments include substantially the same refractive index. The first and second layer segments 1.1, 1.2 are disposed adjacent to each other such that a gap 16 of a predetermined distance d is formed between the first and second layer segments. The predetermined distance is specifically selected according to the flow behavior of the materials of the first and second layer segments, but is especially less than 1 mm.

[0191] In the next step (see Figure 9B), the first and second layer segments 1.1, 1.2 are joined to each other such that the molten and re-solidified material 24 is disposed between the adjacent edges of the first and second layer segments along the first direction x. The step of joining the first and second layer segments together includes the step of heating at least the boundary regions of the first and second layer segments. Heating the material in the boundary regions causes it to melt and flow into the gap 16 between the first and second layer segments. The heating itself is spatially limited such that only the material near the gap and the boundary regions melts.

[0192] After the material is heated and flows into the gap, the heating is stopped and the material re-solidifies, forming a joint between the two layers here. As a result, the molten and re-solidified material 24 is formed from the materials of the first and second layer segments 1.1, 1.2.

[0193] Figure 10A shows an alternative manufacturing approach. Here, the second layer 1.2 is arranged to partially overlap the first layer 1.1, thus forming a gap or hole under the layer 1.2 adjacent to the first layer 1.1. The overall size can depend, for example, on the flexibility viscosity of the second layer 1.2 and the height of the first layer. In some embodiments, the gap can be made smaller if the second layer is pushed down adjacent to the first layer before the melting process is activated. Then, as shown in Figure 10A, the wrinkles and folds become steeper.

[0194] Next, the step of joining the first and second layer segments together (see FIG. 10B) includes heating at least the overlapping portions of the second layer segment. Heating the material of the overlapping portion of the second layer segment causes it to melt and flow into the gap 16 between the first and second layer segments. The heating itself is spatially limited such that only the material near the gap and the boundary region melts. After the material is heated and flows into the gap, the heating is stopped and the material solidifies again, forming a joint between the two layers here. Thus, the material of the overlapping portion of the second layer segment forms the melted and re-solidified material 24. The melted and re-solidified material 24 can form an accumulation of excess material above the joint region of the first and second layer segments, as shown in FIG. 10B. However, depending on the size of the gap 16 and the size of the overlapping portion of the second layer segment, the melted and re-solidified material 24 can also form a planar surface having the first and second layer segments, or can form a groove between the first and second layer segments.

[0195] Referring now to FIG. 11A, the method shown in FIG. 9A further includes arranging a third layer segment 1.3 adjacent to the first layer segment 1.1 along a first direction x on a temporary carrier layer 19 facing the second layer segment 1.2, and arranging a fourth layer segment 1.4 on top of the first, second, and third layer segments 1.1, 1.2, 1.3. The third layer segment is arranged adjacent to the first layer segment such that a gap 16 is formed between the two layer segments.

[0196] Figure 11B shows the step of joining the first, second, third, and fourth layer segments together. Thus, the entire optoelectronic device is placed in an oven, for example, such that the materials of the second, third, and fourth layer segments begin to melt or at least soften. In particular, the melting temperature of the materials of the second, third, and fourth layer segments is different from that of the material of the first layer segment, and in particular, lower than that of the material of the first layer segment, such that the second, third, and fourth layer segments connect to each other at their adjacent edges and in particular flow into each other, while the material of the first layer segment remains solid. After the materials of the second, third, and fourth layer segments are heated and flow into each other, the heating is stopped and the materials solidify again, forming a joint between the three layer segments covering the first layer segment. Thus, the materials at the adjacent edges of the second, third, and fourth layer segments form a molten and re-solidified material 24 such that the molten and re-solidified material 24 is placed between the adjacent edges of the first, second, third, and fourth layer segments. As shown in the figure, the first layer segment is completely covered by the second, third, and fourth layer segments.

[0197] Figures 12A - 12C are diagrams showing a method of joining two layer segments by using additional materials. The additional material may be, for example, the same material as the layer segments, but can also be changed accordingly. As shown in Figure 12A, the first and second layer segments 1.1, 1.2 are arranged adjacent to each other along the first direction x on a temporary carrier layer 19, resulting in a gap 16 being formed between the two layer segments.

[0198] In the next step (see Figure 12B), additional material is provided over and into the gap 16, for example, in the form of a solution in a desired solvent or in a molten form. In a further step (see Figure 12C), the additional material is then cured, for example, using an oven, or further processed, and the curing or further processing can be carried out, for example, in a vacuum atmosphere. The material within the gap solidifies, forming a tight joint between the first layer and the second layer.

[0199] Next, referring to FIGS. 13A - 14B, another method for manufacturing an optoelectronic device is shown. As shown in FIGS. 13A and 14A, the method includes providing a temporary carrier layer and disposing a first layer segment including at least one optoelectronic element on the temporary carrier layer. Next, a second layer segment is disposed on the first layer segment such that the second layer segment overlaps at least one edge region of the first layer segment. In the case of the method shown in FIG. 13A, the second layer segment 1.2 has a size larger than the size of the first layer segment 1.1, whereby the second layer segment overlaps all edge regions of the first layer segment and thus extends at least partially along the edges of the first layer.

[0200] In the case of the method shown in FIG. 14A, the second layer segment 1.2 has a size larger than the size of the first layer segment 1.1, the second layer segment overlaps all edge regions of the first layer segment, but the central region of the second layer segment is removed and the second layer segment includes a ring - like pattern.

[0201] As schematically shown in FIGS. 13B and 14B, the first and second layer segments are joined together by melting and re - solidifying the material between adjacent edges of the first and second layer segments or by deeply stretching the second layer segment such that the second layer segment nests up to the contour of the first layer segment.

[0202] FIG. 15 shows a top view of an optoelectronic device 10, the optoelectronic device 10 comprising four layer segments joined to each other along a first direction x and a second direction y by a molten and re - solidified material 24. The first and second layer segments each include an optoelectronic element 15 coupled via an electrical bridging 25 element extending between the first and second layer segments.

[0203] FIG. 16A shows a top view of the intermediate layer 1 with the arrangement of the optoelectronic light source 15. The arrangement of the optoelectronic light source 15 has a defined shape with a defined contour 26, such as a symbol or an indicator. Here, the symbol or the indicator has the shape of an arrow. The arrangement of the optoelectronic light source 15 may be embedded in the intermediate layer 1 or may be arranged in the upper surface region of the intermediate layer 1. However, the arrangement of the optoelectronic light source 15 covers only a part of the upper surface region of the intermediate layer 1. Within this part of the surface region, particularly within the defined contour 26, the optoelectronic light source 15 is evenly distributed over the surface region in order to obtain the desired resolution of the symbol or the indicator.

[0204] In the optoelectronic device 10 of FIG. 16B, the intermediate layer 1 is arranged between the first cover 11 and the second cover 13. As shown in the figure, the size of the upper surface region of the intermediate layer 1 is smaller than the sizes of the first and second covers 11, 13. However, the size of the upper surface area of the intermediate layer 1 can be made at least approximately equal to the sizes of the first and second covers 11, 13. In the illustrated example, the intermediate layer forms the first layer segment 1.1, and the first layer segment 1.1 is surrounded by a second layer segment 1.2 within the same layer. The first and second layer segments 1.1, 1.2 are both at least approximately equal to the sizes of the first cover 11 and the second cover 13. The first and second layer segments 1.1, 1.2 can include two different materials, for example, so as to include different refractive indices. However, the first layer segment and the second layer segment can include similar materials, and in particular, the boundary region between the first layer segment and the second layer segment along the first edge 27.1 of the first layer segment can include scattering particles, defects, or voids that scatter the light propagating through the first layer segment. The first edge 27.1 is particularly the outer contour of the first layer segment 1.1.

[0205] FIG. 16C shows a top view of the optoelectronic device of FIG. 16B during operation. In other words, at least some of the optoelectronic light sources 15 are switched on. As shown, not only the arrangement of the optoelectronic light sources 15 is irradiated, but also the boundary region between the first layer segment and the second layer segment is irradiated. This is caused by the propagation of light within the first layer segment 1.1 and the out-coupling of light at the surface side of the first layer segment 1.1 extending vertically along the first edge 27.1. The illumination of the boundary region between the first layer segment and the second layer segment can be an undesirable light extraction since it may be perceived by the user of the optoelectronic device as being annoying.

[0206] Referring next to FIG. 17A, the intermediate layer 1 of FIG. 16A is shown with a cutting line C along the defined contour 26 of the arrangement of the optoelectronic light sources 15. By using a cutting or laser cutting process, a first layer segment 1.1 is provided that has the same shape and the same contour 26 as the arrangement of the plurality of optoelectronic light sources 15. Each first layer segment 1.1 is shown in FIG. 17B.

[0207] The first layer segment 1.1 is arranged between a first cover 11 and a second cover 13, as shown in FIG. 17C, to form the optoelectronic device 10. The first layer segment 1.1 is surrounded by a second layer segment 1.2 within the same layer. The second layer segment 1.2 includes a second edge 27.2 shaped complementary to the contour 26 of the first layer segment 1.1.

[0208] Here, the second layer segment 1.2 is a hot melt adhesive layer, such as a PVB or EVA layer, disposed on at least one of the first cover 11 and the second cover 13. The first layer segment 1.1 is disposed on the second layer segment 1.2 and is pressed onto the second layer segment 1.2, particularly in a molten state or at least a softened state of the second layer segment. The second layer segment 1.2 surrounds the first layer segment 1.1 in the circumferential direction Y. The second edge 27.2 is complementarily shaped along its entire circumferential length with respect to the contour 26 of the first layer segment 1.1. Thus, the second edge 27.2 is adjacent to the contour 26 along its entire circumferential length when the molten or at least softened material of the second layer segment 1.2 follows the contour 26 of the first layer segment.

[0209] However, the second layer segment 1.1 can also be formed of a layer having holes in the shape of the first layer segment 1.1 through the second layer segment 1.2. Thus, the second edge 27.2 can be defined by the inner contour of the holes such that the second edge 27.2 is complementarily shaped with respect to the contour 26 of the first layer segment 1.1. The contour 26 and the second edge 27.2 are both closed in the circumferential direction Y, and the second edge 27.2 is complementarily shaped with respect to the contour 26 along its entire circumferential length. The first layer segment 1.1 is disposed adjacent to the second layer segment 1.2, particularly in the holes of the second layer segment 1.2, such that the second edge 27.2 is adjacent to the contour 26 along its entire circumferential length.

[0210] Alternatively, the first layer segment 1.1 is surrounded by a plurality of second layer segments 1.2 in the same layer, as shown in FIG. 17D. Thus, each second layer segment 1.2 includes a second edge 27.2 having a shape complementary to a part of the contour 26 of the first layer segment 1.1. In other words, the second layer segments 1.2 are disposed adjacent to the first layer segment 1.1, and each second edge 27.2 fits the part of the contour 26 of the first layer segment 1.1, for example, as joined puzzle pieces.

[0211] Figure 17E shows a top view of the optoelectronic device 10 of FIGS. 17C and 17D during operation, i.e., when the optoelectronic light source 15 is switched on. As shown, only the arrangement of the optoelectronic light source 15 is irradiated because the boundary region between the first layer segment 1.1 and the second layer segment 1.2 correlates with the contour of the arrangement of the optoelectronic light source 15. Due to the refractive index void in the contour 26, light cannot propagate laterally away from the light source. In this way, the adverse effects on the lighting components of the optoelectronic device 10 arranged at positions away from the arrangements of the plurality of optoelectronic light sources 15 can be avoided.

[0212] FIG. 18A shows a top view of the optoelectronic device 10, which is similar to the optoelectronic device 10 of FIG. 17C but further includes a third layer segment 1.3 in the same layer as the first and second layer segments. The third layer segment 1.3 includes at least one conductor line, preferably two conductor lines embedded in the third layer segment 1.3 or disposed on the surface area of the third layer segment 1.3. The one or more conductor lines are configured to supply electrical energy and / or electrical signals to a plurality of optoelectronic light sources 15. The third layer segment 1.3 further includes a third edge 27.3 that is complementarily shaped to a second portion of the contour 26 of the first layer segment 1.1. The third edge 27.3 is defined by a part of the outer contour of the third layer segment 1.3 and is complementary in shape to the second portion of the contour 26 of the first layer segment 1.1. In the illustrated example, the third layer segment 1.3 has a rectangular shape and the third edge is formed by one of the short sides of the rectangle. The second portion of the contour 26 is formed by the base of the arrangement of the optoelectronic light sources 15, in particular the base of the arrow formed by the optoelectronic light sources 15. The third layer segment 1.3 is disposed adjacent to the first layer segment 1.1 such that the third edge 27.3 is adjacent to the second portion of the contour 26. The second layer segment 1.2 surrounds the first layer segment 1.1 such that the second edge 27.2 is complementary in shape to the first portion of the contour 26. The second layer segment further surrounds the third layer segment, and the adjacent edges of the second and third layer segments are complementarily shaped to form respective boundary regions 28. As can be seen from the figure, one of the outer edges of the third layer segment correlates with the outer edges of the first and / or second covers, but the outer edge of the third layer can extend over the outer edges of the first and / or second covers 11, 13.

[0213] Figure 18B shows a top view of the optoelectronic device 10 of Figure 18A in operation. As can be seen from the figure, not only the arrangement of the optoelectronic light source 15 is irradiated, but also the boundary region 28 between the second layer segment and the third layer segment is irradiated. This is caused by the propagation of light within the third layer segment 1.3 and the out-coupling of light on the surface side of the third layer segment 1.3 extending vertically along the boundary region 28. However, the illumination of the boundary region 28 can be perceived as bothersome by the user of the optoelectronic device and thus can be unwanted light extraction.

[0214] To reduce the illumination of the boundary region 28, at least one, preferably all, of the layer segments can be made of a blackening material. The effect of all layer segments made of the blackening material is schematically shown in Figure 18C. Due to the blackening material, the propagation of light within the third layer is reduced, and thus the out-coupling of light within the boundary region 28 is reduced as can be seen from the figure.

[0215] Two further approaches for reducing the irradiation of light in the boundary region 28 are shown in Figures 19A and 19B. As shown in Figure 19A, a series of perforations 29 are created in the third layer segment 1.3. The series of perforations extends adjacent to the third edge 27.3. By creating the series of perforations, the third edge can be serrated and thus the refractive index difference between the first layer and the third layer can be increased. Between each two of the perforations, at least one conductor line can be led so as to enable the transfer of electrical energy and / or data signals to the plurality of optoelectronic light sources 15 to still be transferred.

[0216] As shown in FIG. 19B, scattering elements, defects, and / or voids are provided on the surface side of the third layer segment 1.3. The surface side extends in a vertical direction along the third edge 27.3 of the third layer segment. The scattering elements, defects, and / or voids can be generated, for example, by exposing the surface side surface that extends in a vertical direction along the third edge 27.3 of the third layer segment to laser light.

[0217] In the following, various devices and arrangements, as well as methods for manufacturing, processing, and operating, are again listed as items. The following items present various aspects and implementations of the proposed principles and concepts, which can be combined in different ways. Such combinations are not limited to those shown below.

[0218] 1. A transparent first cover (11), At least two carriers (12) attached to the first cover (11), wherein a plurality of optoelectronic elements (15) configured to emit light are attached to each of the at least two carriers (12), the at least two carriers (12), A second cover (13) attached to the at least two carriers (12), wherein the second cover (13) has a light transmittance that is at least partially lower than that of the first cover (11) and / or the at least two carriers (12), the optoelectronic device (30) comprising the second cover (13).

[0219] 2. The optoelectronic device (30) according to item 1, wherein the second cover (13) has a low light transmittance in a region (31) at the interface between two adjacent carriers (12) of the at least two carriers (12) as compared to the light transmittance in other regions (32).

[0220] 3. The optoelectronic device (30) according to item 1 or 2, wherein dots or patterns are printed on the second cover (13), or the second cover (13) contains light-absorbing particles.

[0221] 4. The optoelectronic device (30) according to any one of items 1 to 3, wherein the gap (16) between two adjacent carriers (12) of the at least two carriers (12) is filled with a material (41) having a light transmittance the same as or similar to the light transmittance of the at least two carriers (12) and / or a refractive index the same as or similar to the refractive index of the at least two carriers (12).

[0222] 5. A transparent first cover (11), and at least two carriers (12) attached to the first cover (11), wherein a plurality of optoelectronic elements (15) configured to emit light are attached to each of the at least two carriers (12), and the gap (16) between two adjacent carriers (12) of the at least two carriers (12) is filled with a material (41) having a light transmittance the same as or similar to the light transmittance of the two carriers (12) and / or a refractive index the same as or similar to the refractive index of the two carriers (12), the optoelectronic device (40).

[0223] 6. The optoelectronic device (40) according to item 5, further comprising a transparent second cover (13) attached to the at least two carriers (12).

[0224] 7. A transparent first cover (11), and at least two carriers (12) attached to the first cover (11), wherein a plurality of optoelectronic elements (15) configured to emit radiation are attached to each of the at least two carriers (12), An optoelectronic device (50) in which the light transmittance of each of the carriers (12) changes in the direction (51) of the gap (16) between each carrier (12) and an adjacent carrier (12).

[0225] 8. The optoelectronic device (50) according to item 7, wherein the light transmittance of each of the carriers (12) is increased in the direction (51) of the gap (16) between each carrier (12) and an adjacent carrier (12).

[0226] 9. The optoelectronic device (50) according to item 7 or 8, wherein the light transmittance of each of the carriers (12) is changed by perforations in each carrier (12) and / or a pattern printed on each carrier (12).

[0227] 10. The optoelectronic device (50) according to any one of items 7 to 9, further comprising a transparent second cover (13) attached to the at least two carriers (12).

[0228] 11. The optoelectronic device (30, 40, 50) according to any one of items 1 to 10, wherein the first cover (11) is made of glass and / or a plastic material.

[0229] 12. The optoelectronic device (30, 40, 50) according to any one of items 1, 6, and 10, wherein the second cover (13) is made of glass, a carrier, and / or a plastic material.

[0230] 13. The optoelectronic device (30, 40, 50) according to any one of items 1 to 12, wherein the optoelectronic device (30, 40, 50) is one of a roof lining for a vehicle, a panoramic roof, a front glass, a rear window, and a side window.

[0231] 14. A vehicle comprising the optoelectronic device (30, 40, 50) according to any one of items 1 to 13.

[0232] 15. Attaching at least two carriers (12) onto a transparent first cover (11), wherein a plurality of optoelectronic elements (15) configured to emit light are attached to each of the at least two carriers (12), and attaching a second cover (13) onto the at least two carriers (12), wherein the second cover (13) has a light transmittance that is at least partially lower than that of the first cover (11) and / or the at least two carriers (12), the method for manufacturing an optoelectronic device (30) including the above.

[0233] 16. Attaching at least two carriers (12) onto a transparent first cover (11), wherein a plurality of optoelectronic elements (15) configured to emit light are attached to each of the at least two carriers (12), and filling a gap (16) between two adjacent carriers (12) of the at least two carriers (12) with a material (41) having a light transmittance that is the same as or similar to that of the two carriers (12) and / or a refractive index that is the same as or similar to that of the two carriers (12), the method for manufacturing an optoelectronic device (40) including the above.

[0234] 17. Attaching at least two carriers (12) onto a transparent first cover (11), wherein a plurality of optoelectronic elements (15) configured to emit light are attached to each of the at least two carriers (12), and the light transmittance of each of the carriers (12) is changed in the direction of the gap between each carrier (12) and an adjacent carrier (12), the method for manufacturing an optoelectronic device (50) including the above attachment.

[0235] 18. A transparent first cover (11), and a first layer segment (1.1), in particular an intermediate layer segment arranged on the transparent first cover (11) and comprising at least one optoelectronic element (15); and a second layer segment (1.2), in particular an intermediate layer segment arranged on the transparent first cover (11) adjacent to the first layer segment (1.1) along a first direction (x), wherein the first and second layer segments (1.1, 1.2) have substantially the same refractive index, and the first and second layer segments (1.1, 1.2) are joined to each other along the first direction (x) by a melted or dissolved and re-solidified material (24), an optoelectronic device (10).

[0236] 19. The optoelectronic device according to item 18, wherein the melted and re-solidified material (24) comprises or consists of the material of the first layer segment (1.1), the material of the second layer segment (1.2), or a combination of the materials of the first and second layer segments (1.1, 1.2).

[0237] 20. The optoelectronic device according to item 18 or 19, wherein the melted and re-solidified material (24) has a refractive index similar to that of the first and / or second layer segments (1.1, 1.2).

[0238] 21. The optoelectronic device according to any one of items 18 to 20, wherein the melted and re-solidified material (24) is a material different from the material of one of the first and second layer segments (1.1, 1.2).

[0239] 22. An optoelectronic system (9) comprising the optoelectronic device (10) according to any one of items 18 to 21, arranged between two transparent plates, in particular glass plates.

[0240] 23. Providing a temporary carrier layer (19), placing a first layer segment (1.1) on the temporary carrier layer (19) that includes at least one optoelectronic element (15), placing a second layer segment (1.2) adjacent to the first layer segment (1.1) along a first direction (x) on the temporary carrier layer (19), wherein the first and second layer segments (1.1, 1.2) have substantially similar refractive indices, joining the first and second layer segments (1.1, 1.2) to each other such that a molten and re-solidified material (24) is disposed between adjacent edges of the first and second layer segments (1.1, 1.2) along the first direction (x), a method for manufacturing an optoelectronic device.

[0241] 24. The method according to item 23, wherein placing the second layer segment (1.2) adjacent to the first layer segment (1.1) along the first direction (x) on the temporary carrier layer (19) includes overlapping the first and second layer segments (1.1, 1.2) in an edge region of the first and second layer segments.

[0242] 25. The method according to item 24, wherein joining the first and second layer segments (1.1, 1.2) to each other includes heating the first and / or second layer segments such that the overlapping layer segments flow into a gap (16) between the first and second layer segments that forms the molten and re-solidified material (24).

[0243] 26. The method according to item 23, wherein joining the first and second layer segments (1.1, 1.2) to each other includes heating the first and / or second layer segments such that the molten and re-solidified material (24) is formed from the material of the first and / or second layer segments.

[0244] 27. Joining the first and second layer segments (1.1, 1.2) together, as described in item 23, includes chemically dissolving the first and / or second layer segments such that the molten and re-solidified material (24) is formed from the material of the first and / or second layer segments.

[0245] 28. The method further includes placing a third layer segment (1.3) adjacent to the first layer segment (1.1) along the first direction (x) on the temporary carrier layer (19) opposite the second layer segment (1.2), placing a fourth layer segment (1.4) on the first, second, and third layer segments, and the first, second, third, and fourth layer segments include substantially similar refractive indices and optionally consist of similar materials, as described in item 23.

[0246] 29. The method further includes joining the second, third, and fourth layer segments together, with molten and re-solidified material (24) disposed between adjacent edges of the second, third, and fourth layer segments, such that the first layer segment is covered by the second, third, and fourth layer segments, as described in item 28.

[0247] 30. Providing a temporary carrier layer (19), placing a first layer segment (1.1) on the temporary carrier layer (19) including at least one optoelectronic element (15), placing a second layer segment (1.2) on the first layer segment (1.1) such that the second layer segment overlaps at least one edge region of the first layer segment, joining the first and second layer segments such that the second layer segment nests up to the contour of the first layer segment. A method for manufacturing an optoelectronic device, wherein the first and second layer segments have similar refractive indices.

[0248] 31. The method according to item 30, wherein the second layer segment (1.2) completely overlaps the first layer segment (1.1).

[0249] 32. The method according to item 31, wherein the second layer segment (1.2) extends at least partially across the edge of the first layer (1.1).

[0250] 33. At least partially transparent first cover (11), second cover (13), at least one first layer segment (1.1), in particular an intermediate layer segment, disposed between the first cover (11) and the second cover (13) and carrying the arrangement of a plurality of optoelectronic light sources (15), and at least one first layer segment (1.1). The arrangement of the plurality of optoelectronic light sources has a defined shape with a defined contour (26). The optoelectronic device (10), wherein the first layer segment (1.1) has the same shape and the same contour (26) as the arrangement of the plurality of optoelectronic light sources (15).

[0251] 34. The optoelectronic device according to item 33, comprising at least one second layer segment (1.2), in particular an intermediate layer segment, wherein the at least one second layer segment (1.2) is arranged in the same layer as the at least one first layer segment (1.1) between the first cover (11) and the second cover (13), the second layer segment (1.2) includes a second edge (27.2) shaped complementary to at least a first part of the contour (26) of the first layer segment (1.1), and the second layer segment (1.2) is arranged adjacent to the first layer segment (1.1) such that the second edge (27.2) is adjacent to the first part of the contour (26).

[0252] 35. The second layer segment (1.2) is a molten material layer, or an adhesive layer, in particular a hot melt adhesive layer, or a resin such as PVB or EVA, and is formed by one of them, the optoelectronic device according to item 34.

[0253] 36. The second edge (27.2) is in contact with the first part of the contour (26), in particular along the entire length of the first part of the contour (26), the optoelectronic device according to item 34 or 35.

[0254] 37. Both the contour (26) and the second edge (27.2) are closed in the circumferential direction (Y), and the second edge (27.2) has a shape complementary to the contour (26) along its entire circumferential length, the optoelectronic device according to any one of items 33 to 36.

[0255] 38. The optoelectronic light source (15) is evenly distributed on the at least one first layer segment (1.1), the optoelectronic device according to any one of items 33 to 37.

[0256] 39. The size of the first layer segment (1.1) is significantly smaller than the size of the first cover (11), especially when viewed in a top view of the optoelectronic device (10), the optoelectronic device according to any one of items 33 to 38.

[0257] 40. The first layer segment (1.1) includes a surface side that extends vertically along the contour (26), and the material of the first layer segment (1.1) on the surface side is scattering particles, defects, and voids, and includes at least one of them, the optoelectronic device according to any one of items 33 to 39.

[0258] 41. The optoelectronic device further comprises at least one third layer segment (1.3), in particular an intermediate layer segment, the at least one third layer segment (1.3) being arranged in the same layer as the at least one first layer segment (1.1) between the first cover (11) and the second cover (13), the third layer segment comprising at least one conductor line, preferably two conductor lines, and a third edge (27.3) shaped complementary to at least a second part of the contour (26) of the first layer segment (1.1), the third layer segment (1.3) being arranged adjacent to the first layer segment (1.1) such that the third edge (27.3) is adjacent to the second part of the contour (26). The optoelectronic device according to any one of items 33 to 40.

[0259] 42. The third layer segment (1.3) comprises a surface side extending in a vertical direction along the third edge (27.3), and the material of the third layer segment (1.3) on the surface side scattering particles, defects, and voids, contains at least one of them. The optoelectronic device according to item 41.

[0260] 43. The first layer segment (1.1) and / or the second layer segment (1.2) and / or the third layer segment (1.3) are made of one piece, and a plurality of perforations (29) extend along the contour (26) of the first layer segment (1.1), distinguishing the layer segments from each other while the layer segments remain in one piece. The optoelectronic device according to any one of items 33 to 42.

[0261] 44. The first and second layer segments (1.1, 1.2) and / or the first and third layer segments (1.1, 1.3) have different refractive indices. The optoelectronic device according to any one of items 33 to 43.

[0262] 45. The optoelectronic device according to any one of items 33 to 44, characterized in that at least one and preferably all of said layer segments are made of a material that is at least partially transparent or blackened.

[0263] 46. Providing at least one first layer segment (1.1), in particular an intermediate layer segment, carrying the arrangement of a plurality of optoelectronic light sources (15), wherein the arrangement of said plurality of optoelectronic light sources has a defined shape with a defined contour (26), and said first layer segment (1.1) has the same shape and the same contour as the arrangement of said plurality of optoelectronic light sources (15), providing at least a transparent first cover (11) and a second cover (13), and arranging said first layer segment (1.1) between said first cover (11) and said second cover (13), a method for manufacturing an optoelectronic device.

[0264] 47. Providing at least one first layer segment (1.1) includes, in particular by cutting or laser cutting, providing said first layer segment (1.1) from a larger first layer (1), such that said first layer segment (1.1) has the same shape and the same contour as the arrangement of said plurality of optoelectronic light sources (15), the method according to item 46.

[0265] 48. The method further includes arranging a second layer segment (1.2) between said first cover (11) and said second cover (13), wherein a second edge (27.2) of said second layer segment (1.2) and a first part of said contour (26) are adjacent to each other, wherein said second edge (27.2) is shaped complementary to at least a first part of said contour (26) of said first layer segment (1.1), the method according to item 46 or 47.

[0266] 49. The method according to item 48, wherein the second layer segment (1.2) is disposed in front of the first layer segment (1.1) between the first cover (11) and the second cover (13), or alternatively, the first layer segment (1.1) is disposed in front of the second layer segment (1.2) between the first cover (11) and the second cover (13).

[0267] 50. Providing the first layer segment (1.1) includes exposing a surface side extending vertically along the contour (26) of the first layer segment (1.1) to laser light. Optionally, exposing the surface side to laser light is laser cutting. The method according to any one of items 46 to 49.

[0268] 51. The method further comprises providing scattering particles on a surface side extending vertically along the contour (26) of the first layer segment (1.1). The method according to any one of items 46 to 50.

[0269] 52. The method further comprises providing a third layer segment (1.3) in the same layer as the at least one first layer segment (1.1) between the first cover (11) and the second cover (13). The third layer segment includes at least one conductor line, preferably two conductor lines, and a third edge (27.3) complementarily shaped to at least a second portion of the contour (26) of the first layer segment (1.1). The method according to any one of items 46 to 51.

[0270] 53. The method further comprises disposing the third layer segment (1.3) between the first cover (11) and the second cover (13) adjacent to the first layer segment (1.1) such that the third edge (27.3) is adjacent to the second portion of the contour (26). The method according to item 52.

[0271] 54. The method further comprises Including providing scattering elements, defects, and / or voids on the surface side of the third layer segment (1.3), wherein the surface side extends in a vertical direction along the third edge (27.3) of the third layer segment, the method according to item 52 or 53.

[0272] 55. The method further comprises Including generating a sequence of perforations (29) in the third layer segment (1.3), the sequence of perforations extending adjacent to the third edge (27.3), the method according to any one of items 52 to 54.

[0273] The description using exemplary embodiments does not limit the various embodiments shown to these. Rather, the present disclosure shows several aspects that can be combined with each other. The various items shown above also illustrate this.

[0274] Accordingly, the present invention includes any feature and any combination of features, including any combination of features in the items and claims in particular, even if this feature or this combination is not explicitly specified in the exemplary embodiments.

Claims

1. an at least partially transparent first cover (11); A second cover (13); at least one first layer segment (1.1), which is arranged between the first cover (11) and the second cover (13) and carries an arrangement of a plurality of optoelectronic light sources (15), the arrangement of the plurality of optoelectronic light sources has a defined shape with a defined contour (26); An optoelectronic device (10), wherein the first layer segment (1.1) has the same shape and the same contour (26) as the arrangement of the plurality of optoelectronic light sources (15).

2. 2. The optoelectronic device according to claim 1, further comprising at least one second layer segment (1.2) arranged in the same layer as the at least one first layer segment (1.1) between the first cover (11) and the second cover (13), the second layer segment (1.2) including a second edge (27.2) shaped complementarily to at least a first portion of the contour (26) of the first layer segment (1.1), the second layer segment (1.2) being arranged adjacent to the first layer segment (1.1) such that the second edge (27.2) is adjacent to the first portion of the contour (26).

3. The second layer segment (1.2) comprises: a layer of molten material, or Adhesive layer, or 3. The optoelectronic device of claim 2, formed from one of the following materials: a resin such as PVB or EVA.

4. 4. An optoelectronic device according to claim 2 or 3, wherein the second edge (27.2) is in contact with the first part of the contour (26).

5. 5. An optoelectronic device according to claim 2, wherein the contour (26) and the second edge (27.2) are both closed in the circumferential direction (Y), the second edge (27.2) being of a complementary shape to the contour (26) along its complete circumferential length.

6. 6. The optoelectronic device according to any one of the preceding claims, wherein the optoelectronic light sources (15) are evenly distributed on the at least one first layer segment (1.1).

7. 7. The optoelectronic device according to any one of the preceding claims, wherein the size of the first layer segment (1.1) is significantly smaller than the size of the first cover (11).

8. The first layer segment (1.1) comprises a surface side extending vertically along the contour (26), the material of the first layer segment (1.1) on the surface side being scattering particles, Defects, and An optoelectronic device according to claim 1 , further comprising at least one of the following:

9. 9. The optoelectronic device according to claim 1, further comprising at least one third layer segment (1.3), the at least one third layer segment (1.3) being arranged in the same layer as the at least one first layer segment (1.1) between the first cover (11) and the second cover (13), the third layer segment comprising at least one conductor line and a third edge (27.3) that is complementarily shaped to at least a second portion of the contour (26) of the first layer segment (1.1), the third layer segment (1.3) being arranged adjacent to the first layer segment (1.1) such that the third edge (27.3) is adjacent to the second portion of the contour (26).

10. The third layer segment (1.3) comprises a surface side extending vertically along the third edge (27.3), the material of the third layer segment (1.3) on the surface side being scattering particles, Defects, and 10. The optoelectronic device of claim 9, comprising at least one of: a.

11. 11. The optoelectronic device according to claim 1, wherein the first layer segment (1.1) and / or the second layer segment (1.2) and / or the third layer segment (1.3) are made in one piece, and a plurality of perforations (29) extend along the contour (26) of the first layer segment (1.1) and distinguish the layer segments from one another while the layer segments remain in one piece.

12. 12. The optoelectronic device according to claim 1, wherein the first layer segment (1.1) and the second layer segment (1.2) and / or the first layer segment (1.1) and the third layer segment (1.3) have different refractive indices.

13. 13. An optoelectronic device according to claim 1, characterized in that at least one of the layer segments consists at least partially of a transparent or blackened material.

14. Providing at least one first layer segment (1.1) carrying an arrangement of a plurality of optoelectronic light sources (15), the arrangement of the plurality of optoelectronic light sources having a defined shape with a defined contour (26), the first layer segment (1.1) having the same shape and the same contour as the arrangement of the plurality of optoelectronic light sources (15); providing at least a transparent first cover (11) and a second cover (13); and placing said first layer segment (1.1) between said first cover (11) and said second cover (13).

15. 15. The method of claim 14, wherein providing the at least one first layer segment (1.1) comprises providing the first layer segment (1.1) from a larger first layer (1), so that the first layer segment (1.1) has the same shape and the same contour as the arrangement of the multiple optoelectronic light sources (15).

16. The method further comprises: disposing a second layer segment (1.2) between the first cover (11) and the second cover (13), where a second edge (27.2) of the second layer segment (1.2) and a first portion of the contour (26) are adjacent to each other; 16. The method according to claim 14 or 15, wherein the second edge (27.2) is shaped complementarily to at least the first part of the contour (26) of the first layer segment (1.1).

17. 17. The method according to claim 16, wherein the second layer segment (1.2) is arranged in front of the first layer segment (1.1) between the first cover (11) and the second cover (13), or the first layer segment (1.1) is arranged in front of the second layer segment (1.2) between the first cover (11) and the second cover (13).

18. 18. The method according to claim 14, wherein providing the first layer segment (1.1) comprises exposing a surface side of the first layer segment (1.1) that extends vertically along the contour (26) to laser light.

19. The method further comprises:

19. The method according to any one of claims 14 to 18, comprising providing scattering particles on a surface side of the first layer segment (1.1) that extends vertically along the contour (26).

20. The method further comprises:

20. The method according to claim 14, further comprising providing a third layer segment (1.3) in the same layer as the at least one first layer segment (1.1) between the first cover (11) and the second cover (13), the third layer segment comprising at least one conductor line and a third edge (27.3) shaped complementarily to at least a second portion of the contour (26) of the first layer segment (1.1).

21. The method further comprises:

21. The method according to claim 20, comprising disposing the third layer segment (1.3) adjacent to the first layer segment (1.1) between the first cover (11) and the second cover (13) such that the third edge (27.3) is adjacent to the second portion of the contour (26).

22. The method further comprises:

22. The method according to claim 20 or 21, comprising providing a surface side of the third layer segment (1.3) with scattering elements, defects and / or voids, the surface side extending vertically along a third edge (27.3) of the third layer segment.

23. The method further comprises:

23. The method according to any one of claims 20 to 22, comprising generating a sequence of perforations (29) in the third layer segment (1.3), the sequence of perforations extending adjacent to the third edge (27.3).

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