Liquid discharge head, head module, and liquid discharge apparatus

Abstract

To provide a liquid discharge head having a structure for discharging electric current generated in a head substrate.SOLUTION: A liquid discharge head includes: a liquid chamber substrate 122 forming a pressure chamber which may change its volumetric capacity by pressure generating means; a nozzle substrate 10 joined to the liquid chamber substrate 122; and a holding substrate 126 joined to a surface, which is opposite to a surface joined to the nozzle substrate 10, of the liquid chamber substrate 122. Four corner parts of the liquid chamber substrate 122 and side surfaces from the liquid chamber substrate 122 to the holding substrate 126 of at least the four corner parts are covered with a conductive resin 130. The holding substrate 126 has a structure in which a conductive frame is joined to a surface opposite to a surface joined to the liquid chamber substrate 122.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a liquid ejection head, a head module, and an apparatus for ejecting a liquid.

Background Art

[0002] In a piezoelectric method which is a general ejection method of an inkjet head, a head substrate having a structure in which a nozzle substrate, a liquid chamber substrate, a damper, and a holding substrate (damper frame) are joined is already known. The nozzle substrate is a substrate for ejecting ink to the outside as ink droplets. The liquid chamber substrate converts electrical energy into mechanical energy such as displacement and force. The damper dissipates the energy to reduce the impact. The holding substrate has a space in which the damper can move. Conventionally, various proposals have been made to improve the ejection property of a liquid (for example, Patent Document 1). However, in a conventional liquid ejection head, when static electricity is generated in a manufacturing process or the like, the head substrate is charged, and an excessive current (static electricity) flows through the head substrate, resulting in a problem that the electrode of the liquid chamber substrate is damaged.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to provide a liquid ejection head having a structure for discharging a current generated in a head substrate.

Means for Solving the Problems

[0004] In order to solve the above-described problems, the liquid ejection head of the present invention includes: a liquid chamber substrate forming a pressure chamber whose volume can be changed by a pressure generating means; a nozzle substrate joined to the liquid chamber substrate; a holding substrate joined to a surface of the liquid chamber substrate opposite to the surface joined to the nozzle substrate, The four corner portions of the liquid chamber substrate and at least the side surfaces of the four corner portions from the liquid chamber substrate to the holding substrate are covered with a conductive resin. The holding substrate has a structure in which a conductive frame is joined to the surface opposite to the surface joined to the liquid chamber substrate.

Advantages of the Invention

[0005] According to the present invention, it is possible to provide a liquid ejection head having a structure for discharging the current generated in the head substrate.

Brief Description of the Drawings

[0006]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Embodiments for Carrying Out the Invention

[0007] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. In each drawing for explaining the embodiments of the present invention, for components such as members and components having the same function or shape, the same reference numerals are given as much as possible to distinguish them, and the description will be omitted after once explaining.

[0008] When it comes to the structure of an inkjet as a liquid ejection head, the outermost periphery of the head substrate is covered with a conductive resin, so that the static electricity generated on the nozzle substrate is discharged to the outside through the conductive resin, the conductive frame, and the base member. By covering at least a part of the outermost periphery of the head substrate with a conductive resin and forming a structure for discharging the current generated on the head substrate, a liquid ejection head that is not affected by static electricity can be provided. Thereby, destruction of the head substrate due to excessive current (static electricity) can be prevented.

[0009] The liquid ejection head according to an embodiment of the present invention includes, for example, a liquid chamber substrate (liquid chamber substrate 122) that forms a pressure chamber whose volume can be changed by a pressure generating means (piezoelectric element 40), a nozzle substrate (nozzle substrate 10) joined to the liquid chamber substrate, and a holding substrate (holding substrate 126) joined to the surface of the liquid chamber substrate opposite to the surface joined to the nozzle substrate. The four corner portions of the liquid chamber substrate and at least the side surfaces from the liquid chamber substrate to the holding substrate of the at least four corner portions are covered with a conductive resin (conductive resin 130). The holding substrate has a structure in which a conductive frame (conductive frame 128) is joined to the surface opposite to the surface joined to the liquid chamber substrate. ( ) shows the correspondence with the configuration of FIGS. 3-4 described later as an example. Hereinafter, a liquid ejection head and the like according to an embodiment of the present invention will be described with reference to the drawings.

[0010] FIG. 1 is an exploded perspective explanatory view seen from the nozzle surface side of a head module according to an embodiment, and FIG. 2 is a cross-sectional explanatory view along the short side direction of the head of the same head module. A head module (also referred to as a "liquid ejection unit" or a "head unit") according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. The head module 100 includes a plurality of heads 101, a base member 102, a cover member (also referred to as a "nozzle cover") 103, a heat dissipation member 104, a manifold 105, a printed circuit board (PCB) 106, and a module case 107. Here, the liquid ejection head according to one embodiment includes a plurality of heads 101, a base member 102, and a cover member 103.

[0011] The plurality of heads 101 include a nozzle substrate 10 forming nozzles 11, a flow path substrate 20 forming individual liquid chambers 21 and the like communicating with the nozzles 11, a diaphragm 30 including a piezoelectric element 40, a holding substrate 126 laminated on the diaphragm 30, and a common flow path member (also referred to as a "frame member") 70 laminated on the holding substrate 126. The piezoelectric element 40 is an example of a pressure generating means capable of changing the volume of the individual liquid chamber 21 as a pressure chamber.

[0012] The flow path substrate 20 forms a supply-side individual flow path 22 communicating with the individual liquid chamber 21 and a recovery-side individual flow path 24 communicating with the individual liquid chamber 21 together with the individual liquid chamber 21. The holding substrate 126 forms a supply-side intermediate individual flow path 51 communicating with the supply-side individual flow path 22 through the opening 31 of the diaphragm 30 and a recovery-side intermediate individual flow path 52 communicating with the recovery-side individual flow path 24 through the opening 32 of the diaphragm 30.

[0013] The common flow path member 70 forms a supply-side common flow path 71 communicating with the supply-side intermediate individual flow path 51 and a recovery-side common flow path 72 communicating with the recovery-side intermediate individual flow path 52. The supply-side common flow path 71 communicates with the supply port 81 through the flow path 151 of the manifold 105. The recovery-side common flow path 72 communicates with the recovery port 82 through the flow path 152 of the manifold 105. The printed circuit board 106 and the piezoelectric element 40 of the head 101 are connected via a flexible wiring member 90, and a driver IC (drive circuit) 91 is mounted on the flexible wiring member 90.

[0014] FIG. 3 is a detailed explanatory view in which the holding substrate and its periphery in the cross-sectional explanatory view of FIG. 2 are enlarged. In FIG. 3, a plurality of substrates laminated in the order of the nozzle substrate 10, the liquid chamber substrate 122, and the holding substrate 126 are represented as a head substrate 127. The configuration of the head substrate 127 included in the liquid ejection head according to an embodiment of the present invention will be described with reference to FIG. 3. The nozzle substrate 10 is a substrate having nozzles 11 which are holes for ejecting to the outside as ink droplets (also referred to as "liquid droplets"), and is joined to the liquid chamber substrate 122.

[0015] The liquid chamber substrate 122 has a structure including a diaphragm 30 including a piezoelectric element 40, a flow path substrate 20 joined to the diaphragm 30, and a sub-frame 121 that houses the piezoelectric element 40 and is joined to the diaphragm 30 on the side opposite to the flow path substrate 20. The holding substrate 126 includes a damper 123 that disperses the energy generated during the deformation of the piezoelectric element 40 to reduce the impact, and a damper frame 125 that has a space in which the damper 123 can vibrate. The liquid chamber substrate 122 is joined to the damper 123. The damper 123 is also joined to the damper frame 125.

[0016] The liquid chamber substrate 122 has a shape with four corners, and on the surface to which the nozzle substrate 10 is joined, the four corners are in a range (exposed) where they are not joined to the nozzle substrate 10. The side surface of the liquid chamber substrate 122 is a surface along the stacking direction of the substrates, and the same applies to other substrates such as the holding substrate 126. The corner portion is a range of an arbitrary length from the intersection (vertex) of the straight lines forming the corners of the shape of the liquid chamber substrate 122. The arbitrary length may be determined based on, for example, a range where the substrate is likely to be damaged. The corner portion can be defined by the length from the intersection of the longitudinal direction, the short-side direction, and the stacking direction of the substrate, for example. Hereinafter, embodiments of the head substrate or the liquid ejection head will be described.

[0017] Embodiment 1. FIG. 4 is a detailed explanatory view of an example of the head substrate in Embodiment 1, (A) is a cross-sectional explanatory view of the side surface, and (B) is an explanatory view when viewed from the nozzle substrate side. The head substrate 127A has a structure in which four corner portions of the liquid chamber substrate 122 and side surfaces from the liquid chamber substrate 122 to the holding substrate 126 of at least the four corner portions are covered with a conductive resin (also referred to as "conductive resin") 130. A conductive frame (also referred to as "conductive frame") 128 is joined to a surface of the holding substrate 126 opposite to the surface joined to the liquid chamber substrate 122. The conductive frame 128 is an example of the common flow path member 70. The conductive frame indicates a metal frame or a sputtered frame, and it is sufficient that at least the frame surface and the portion in contact with the base member 102 are conductive.

[0018] In the present embodiment, the head substrate 127A has a structure in which four corner portions of the liquid chamber substrate 122 and side surfaces from the liquid chamber substrate 122 to the holding substrate 126 are covered with the conductive resin 130, thereby preventing charging due to static electricity and reducing chipping, scratches, and cracks due to contact with the outside. Further, by joining the head substrate 127A to the conductive frame 128, it is possible to prevent static electricity from charging on the head substrate by discharging the static electricity generated on the head substrate 127A through a path from the conductive resin 130 to the conductive frame 128. By doing so, for example, even when the head substrate is an insulating member, it becomes possible to discharge the generated static electricity and prevent the head substrate from being charged.

[0019] Embodiment 2. In the present embodiment, an aspect having a structure in which at least the side surface of the liquid chamber substrate 122 is covered with the conductive resin 130 will be described. Also in the present embodiment, similar to Embodiment 1, a conductive frame 128 is joined to a surface of the holding substrate 126 opposite to the surface joined to the liquid chamber substrate 122. FIG. 5 is a detailed explanatory view of an example of the head substrate in Embodiment 2, (A) is a cross-sectional explanatory view of the side surface, and (B) is an explanatory view when viewed from the nozzle substrate side. The head substrate 127B has a structure in which side surfaces around the liquid chamber substrate 122 and the holding substrate 126 are covered with the conductive resin 130.

[0020] FIG. 6 is a detailed explanatory view of another example of the head substrate in Embodiment 2, where (A) is a cross-sectional explanatory view of the side surface, and (B) is an explanatory view when viewed from the nozzle substrate side. The head substrate 127C has a structure in which, in addition to the conductive resin 130 that the head substrate 127A in Embodiment 1 has, the side surfaces around the liquid chamber substrate 122 are covered with the conductive resin 130. The head substrate 127C has a structure in which, among the side surfaces around the liquid chamber substrate 122, the portions adjacent to the surface of the liquid chamber substrate 122, excluding the side surfaces of the liquid chamber substrate 122 at the four corners, are covered with the conductive resin 130.

[0021] The head substrate 127C shown in FIG. 6 is an example of a structure in which at least the side surfaces around the liquid chamber substrate 122 of the head substrate 127A in Embodiment 1 are covered with the conductive resin 130, but it is not limited to this. As long as the head substrate 127A in Embodiment 1 has a structure in which at least the surfaces of the side surfaces around the liquid chamber substrate 122 are covered with the conductive resin 130. For example, similar to the head substrate 127B in FIG. 5, a structure in which the side surfaces around the liquid chamber substrate 122 and the holding substrate 126 are covered with the conductive resin 130 may be used. Also in this case, among the side surfaces of the liquid chamber substrate 122 and the holding substrate 126, the portions adjacent to the surfaces of the side surfaces of the liquid chamber substrate 122 and the holding substrate 126, excluding the side surfaces from the liquid chamber substrate 122 to the holding substrate 126 at the four corners, are covered with the conductive resin 130. Further, a structure in which a part of the periphery in the stacking direction of the side surfaces around the liquid chamber substrate 122 and the holding substrate 126 is covered with the conductive resin 130 may be used.

[0022] In the present embodiment, the head substrates 127B and 127C can prevent charging due to static electricity and reduce chipping, scratching, and cracking due to contact with the outside by covering the surfaces adjacent to at least the side surfaces around the liquid chamber substrate 122 with the conductive resin 130. Further, by joining the head substrates 127B and 127C to the conductive frame 128, the static electricity generated on the head substrates 127B and 127C is discharged through the path from the conductive resin 130 to the conductive frame 128, thereby preventing the static electricity from charging on the head substrate.

[0023] Embodiment 3. FIG. 7 is a detailed explanatory view of an example of a head substrate in Embodiment 3. (A) is a cross-sectional explanatory view of a side surface for explaining the current flow in the head substrate of Embodiment 1, and (B) is a cross-sectional explanatory view of a side surface for explaining the structure example and current flow of the head substrate of Embodiment 3. As shown in FIG. 7(A), in the head substrate 127A, since the side surfaces of the liquid chamber substrate 122 and the holding substrate 126 have exposed substrate ends, a part of the discharged current may flow into the head substrate. Specifically, the current flowing through the conductive resin 130 may flow into the head substrate. Therefore, the head substrate of this embodiment protects the side surface with an insulating resin and covers it with a conductive resin thereon. In the head substrate 127D shown in FIG. 7(B), the resin covering at least the four corner side surfaces from the liquid chamber substrate 122 to the holding substrate 126 has a two-layer structure of an insulating resin 131 and a conductive resin 130. Further, the side surfaces of the liquid chamber substrate 122 and the holding substrate 126 are preferably made such that there is no exposure of the metal member.

[0024] The head substrate 127D shows an example in which the conductive resin 130 of the head substrate 127A in FIG. 4 has a two-layer structure of an insulating resin 131 and a conductive resin 130, but the two-layer structure of the insulating resin 131 and the conductive resin 130 may be applied to the head substrates 127B and 127C in Embodiment 2.

[0025] As described above, in this embodiment, the resin covering the side surface of the head substrate 127 has a two-layer structure of an insulating resin 131 and a conductive resin 130. By protecting the side surface with the insulating resin 131, it is possible to prevent the current from flowing into the head substrate.

[0026] Embodiment 4. FIG. 8 is a schematic diagram for explaining the structure of the liquid ejection head in Embodiment 4. (A) is a disassembled perspective schematic diagram of the liquid ejection head, and (B) is a schematic diagram of the liquid ejection head viewed from the nozzle substrate side. In the liquid ejection head of the present embodiment, the conductive frame 128 is attached to the metal base member 102 without an insulating material in between. Further, the liquid ejection head has a structure in which a metal nozzle cover 103A as a cover member 103 is joined to the nozzle substrate side of the base member 102. In FIG. 8(B), the nozzle substrate 10 is shown shaded. The liquid ejection head has a structure in which static electricity generated on the head substrate is discharged to the outside by joining the conductive resin 130, the conductive frame 128, the base member 102, and the nozzle cover 103A without an insulating material in between. By doing so, since the base member and the cover member are made of metal, even if static electricity is generated on the head substrate, it will be discharged.

[0027] <Liquid ejection unit and apparatus for ejecting liquid> Next, an example of an apparatus for ejecting liquid according to the present invention will be described with reference to FIGS. 9 and 10. FIG. 9 is a schematic explanatory diagram of the apparatus, and FIG. 10 is a plan explanatory diagram of an example of the head unit of the apparatus.

[0028] This printing apparatus 500, which is an apparatus for ejecting liquid, includes a loading means 501 for loading a continuous body 510, a guiding and conveying means 503 for guiding and conveying the continuous body 510 loaded from the loading means 501 to a printing means 505, a printing means 505 for performing printing to form an image by ejecting liquid onto the continuous body 510, a drying means 507 for drying the continuous body 510, an unloading means 509 for unloading the continuous body 510, and the like.

[0029] The continuous body 510 is sent out from the supply reel roller 511 of the loading means 501, guided and conveyed by the rollers of the loading means 501, the guiding and conveying means 503, the drying means 507, and the unloading means 509, and wound up by the winding roller 591 of the unloading means 509.

[0030] This continuum 510 is conveyed on the conveyance guide member 559 in the printing means 505 facing the head unit 550, and an image is printed by the liquid discharged from the head unit 550.

[0031] Here, as shown in FIG. 10, the head unit 550 includes two head modules 100A and 100B according to the present invention on a common base member 552.

[0032] When the arrangement direction of the heads 101 in the direction orthogonal to the conveyance direction of the head module 100 is defined as the head arrangement direction, the head rows 1A1 and 1A2 of the head module 100A discharge the liquid of the same color. Similarly, the head rows 1B1 and 1B2 of the head module 100A are grouped, the head rows 1C1 and 1C2 of the head module 100B are grouped, and the head rows 1D1 and 1D2 are grouped to discharge the liquid of the required color, respectively.

[0033] Next, another example of the apparatus for discharging the liquid according to the present invention will be described with reference to FIGS. 11 and 12. FIG. 11 is a plan explanatory view of the main part of the apparatus, and FIG. 12 is a side explanatory view of the main part of the apparatus.

[0034] This apparatus is a serial type apparatus, and the carriage 403 reciprocates in the main scanning direction by the main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, and the like. The guide member 401 is bridged between the left and right side plates 491A and 491B and holds the carriage 403 movably. Then, by the main scanning motor 405, the carriage 403 is reciprocated in the main scanning direction via the timing belt 408 bridged between the drive pulley 406 and the driven pulley 407.

[0035] This carriage 403 is equipped with a liquid ejection unit 440 that integrates the liquid ejection head 404 and the head tank 441 according to the present invention. The liquid ejection head 404 of the liquid ejection unit 440 ejects liquids of various colors such as yellow (Y), cyan (C), magenta (M), and black (K), for example. Further, the liquid ejection head 404 is arranged in a sub-scanning direction orthogonal to the main scanning direction with a nozzle row composed of a plurality of nozzles 11, and is mounted with the ejection direction facing downward. As the liquid ejection head 404, for example, the above-described head 101 can be used.

[0036] A supply mechanism 494 for supplying the liquid stored outside the liquid ejection head 404 to the liquid ejection head 404 supplies the liquid stored in the liquid cartridge 450 to the head tank 441.

[0037] The supply mechanism 494 is composed of a cartridge holder 451 which is a filling part for mounting the liquid cartridge 450, a tube 456, a liquid feeding unit 452 including a liquid feeding pump, etc. The liquid cartridge 450 is detachably mounted on the cartridge holder 451. The liquid in the liquid cartridge 450 is fed to the head tank 441 by the liquid feeding unit 452 via the tube 456.

[0038] This apparatus is provided with a conveyance mechanism 495 for conveying the paper 410. The conveyance mechanism 495 includes a conveyance belt 412 which is a conveyance means, and a sub-scanning motor 416 for driving the conveyance belt 412.

[0039] The conveyance belt 412 adsorbs the paper 410 and conveys it to a position facing the liquid ejection head 404. This conveyance belt 412 is an endless belt and is stretched between a conveyance roller 413 and a tension roller 414. The adsorption can be performed by electrostatic adsorption or air suction, etc.

[0040] Then, the conveyance belt 412 moves in a circular motion in the sub-scanning direction as the conveyance roller 413 is rotationally driven via a timing belt 417 and a timing pulley 418 by a sub-scanning motor 416.

[0041] Furthermore, on one side of the carriage 403 in the main-scanning direction, a maintenance and recovery mechanism 420 for maintaining and recovering the liquid ejection head 404 is arranged on the side of the conveyance belt 412.

[0042] The maintenance and recovery mechanism 420 is composed of, for example, a cap member 421 that caps the nozzle surface (the surface on which the nozzles 11 are formed) of the liquid ejection head 404, a wiper member 422 that wipes the nozzle surface, and the like.

[0043] The main-scanning movement mechanism 493, the supply mechanism 494, the maintenance and recovery mechanism 420, and the conveyance mechanism 495 are attached to a housing including side plates 491A and 491B and a back plate 491C.

[0044] In this apparatus configured as described above, the sheet 410 is fed onto the conveyance belt 412 and adsorbed, and the sheet 410 is conveyed in the sub-scanning direction by the circular movement of the conveyance belt 412.

[0045] Therefore, while moving the carriage 403 in the main-scanning direction, the liquid ejection head 404 is driven according to an image signal, so that liquid is ejected onto the stopped sheet 410 to form an image.

[0046] Thus, in this apparatus, since it is provided with the liquid ejection head according to the present invention, a high-quality image can be stably formed.

[0047] Next, an example of the liquid ejection unit according to the present invention will be described with reference to FIG. 13. FIG. 13 is a main part plan explanatory view of the unit.

[0048] This liquid ejection unit is composed of a housing portion formed by side plates 491A, 491B and a back plate 491C, a main scanning movement mechanism 493, a carriage 403, and a liquid ejection head 404, among the members constituting the device for ejecting the liquid.

[0049] In addition, a liquid ejection unit can also be configured by further attaching at least one of the above-described maintenance and recovery mechanism 420 and supply mechanism 494 to, for example, the side plate 491B of this liquid ejection unit.

[0050] Next, another example of the liquid ejection unit according to the present invention will be described with reference to FIG. 14. FIG. 14 is a front explanatory view of the unit.

[0051] This liquid ejection unit is composed of a liquid ejection head 404 to which a flow path component 444 is attached and a tube 456 connected to the flow path component 444.

[0052] Note that the flow path component 444 is disposed inside the cover 442. Instead of the flow path component 444, a head tank 441 can also be included. Further, a connector 443 for making an electrical connection with the liquid ejection head 404 is provided above the flow path component 444.

[0053] Hereinafter, application examples in which the liquid ejection head, the device for ejecting liquid, etc. according to the above-described embodiments of the present invention are applied will be described.

[0054] Application Example 1. <Electrode Manufacturing Apparatus> The "device for ejecting liquid" according to the embodiments of the present invention includes apparatuses for manufacturing electrodes and electrochemical elements. Hereinafter, the electrode manufacturing apparatus will be described.

[0055] FIG. 15 is a schematic diagram showing an example of an electrode manufacturing apparatus as a device for ejecting liquid according to the embodiments of the present invention in Application Example 1. The electrode manufacturing apparatus is an apparatus for manufacturing an electrode including a layer having an electrode material by ejecting a liquid composition using a head module including a liquid ejection head.

[0056] <Forming means for layer containing electrode material, forming process for layer containing electrode material> The discharging means included in the manufacturing apparatus of the electrode shown in FIG. 15 is the head module according to the embodiment of the present invention. By discharging the liquid composition from the discharging head of the head module, the liquid composition is applied onto the object, and a liquid composition layer is formed. The object (hereinafter, also referred to as "discharge object") is not particularly limited as long as it is an object on which a layer containing an electrode material is to be formed, and can be appropriately selected according to the purpose. For example, examples of the object include an electrode substrate (current collector), an active material layer, a layer containing a solid electrode material, etc. Further, the object may be an electrode mixture layer containing an active material on the electrode substrate (current collector). Further, as long as the discharging means and the discharging process can form a layer having an electrode material on the discharge object, they may be means and processes for forming a layer having an electrode material by directly discharging the liquid composition. Further, the discharging means and the discharging process may be means and processes for forming a layer having an electrode material by indirectly discharging the liquid composition.

[0057] <Other configurations, other processes> Other configurations included in the manufacturing apparatus of the electrode mixture layer are not particularly limited as long as the effects of the present invention are not impaired, and can be appropriately selected according to the purpose. Further, other processes included in the manufacturing method of the electrode mixture layer are also not particularly limited as long as the effects of the present invention are not impaired, and can be appropriately selected according to the purpose. For example, examples of the configurations and processes included in the manufacturing apparatus and the manufacturing method of the electrode mixture layer include heating means and heating processes.

[0058] <Heating means, heating process> The heating means included in the manufacturing apparatus of the electrode mixture layer is means for heating the liquid composition discharged by the discharging means. Further, the heating process included in the manufacturing method of the electrode mixture layer is a process for heating the liquid composition discharged in the discharging process. By heating the liquid composition, the liquid composition layer can be dried.

[0059] <Configuration for forming a layer containing an electrode material by direct ejection of a liquid composition> Here, as an example of an electrode manufacturing apparatus, an electrode manufacturing apparatus for forming an electrode mixture layer containing an active material on an electrode substrate (current collector) will be described. As shown in FIG. 15, the electrode manufacturing apparatus includes a discharge process section 110 that includes a process of applying a liquid composition onto a printing substrate 704 having a discharge target to form a liquid composition layer, and a heating process section 120 that includes a heating process of heating the liquid composition layer to obtain an electrode mixture layer.

[0060] The electrode manufacturing apparatus includes a transport section 705 for transporting the printing substrate 704. The transport section 705 transports the printing substrate 704 at a preset speed in the order of the discharge process section 110 and the heating process section 120. As a method for manufacturing the printing substrate 704 having a discharge target such as an active material layer, there are no particular limitations, and known methods can be appropriately selected. The discharge process section 110 includes a liquid discharge head 281a that realizes a process of applying a liquid composition onto the printing substrate 704, a storage container 281b that stores the liquid composition 707, and a supply tube 281c that supplies the liquid composition 707 stored in the storage container 281b to the liquid discharge head 281a.

[0061] In the discharge process section 110, the liquid composition 707 is discharged from the liquid discharge head 281a, the liquid composition 707 is applied onto the printing substrate 704, and a liquid composition layer is formed in a thin film shape. Note that the storage container 281b may be configured to be integrated with the electrode mixture layer manufacturing apparatus, or may be configured to be removable from the electrode mixture layer manufacturing apparatus. Further, the storage container 281b may be a container used for adding to a storage container integrated with the electrode mixture layer manufacturing apparatus or a storage container removable from the electrode mixture layer manufacturing apparatus.

[0062] The storage container 281b and the supply tube 281c can be arbitrarily selected as long as they can stably store and supply the liquid composition 707.

[0063] In the heating engineering department 120, a solvent removal process is performed to heat and remove the solvent remaining in the liquid composition layer. Specifically, the solvent remaining in the liquid composition layer is heated by the heating device 703 in the heating engineering department 120 and dried, whereby the solvent is removed from the liquid composition layer. Thereby, the electrode mixture layer is formed. Further, the solvent removal process in the heating engineering department 120 may be performed under reduced pressure.

[0064] The heating device 703 is not particularly limited and can be appropriately selected according to the purpose. For example, examples of the heating device 703 include substrate heating, an IR heater, and a hot air heater. Further, the heating device 703 may be a combination of at least two of substrate heating, an IR heater, and a hot air heater. Also, regarding the heating temperature and heating time, they can be appropriately selected according to the boiling point of the solvent contained in the liquid composition 707 or the formed film thickness.

[0065] By using the electrode manufacturing apparatus according to the embodiment of the present invention, the liquid composition can be discharged to the target of the discharge object. The electrode mixture layer can be suitably used, for example, as a part of the configuration of an electrochemical element. The configuration other than the electrode mixture layer in the electrochemical element is not particularly limited, and known ones can be appropriately selected. For example, examples of the configuration other than the electrode mixture layer include a positive electrode, a negative electrode, and a separator.

[0066] Application Example 2. <Ultrasonic Diagnostic Device> Next, an application example in which a liquid discharge head including a diaphragm member (for example, diaphragm 30) is applied to an ultrasonic diagnostic device will be described. Using the diaphragm member of the liquid discharge head of the above-described embodiment, the liquid discharge head is used as an ultrasonic transmission device of the ultrasonic diagnostic device. In Application Example 2, the liquid discharge head does not discharge liquids or the like. Also, in Application Example 2, the liquid discharge head of the above-described embodiment is used as an actuator. The actuator according to Application Example 2 is not limited to liquid discharge, and may be used, for example, for ultrasonic transmission. Hereinafter, a case where the actuator according to Application Example 2 is applied to an ultrasonic diagnostic device will be exemplified and described.

[0067] FIG. 16 is a schematic explanatory diagram showing an example in which the actuator according to Application Example 2 is applied to an ultrasonic diagnostic apparatus. The ultrasonic diagnostic apparatus 700 includes an ultrasonic probe 750 that oscillates ultrasonic waves toward a measurement object U and detects vibrations of the ultrasonic waves reflected by the measurement object U. The ultrasonic diagnostic apparatus 700 also includes a display unit 701 that visualizes and displays a signal from the ultrasonic probe 750, an operation unit 702, and a control unit 703 that controls the ultrasonic probe 750.

[0068] Generally, the control unit 703 includes an ultrasonic pulse generation unit that generates a pulsed electrical signal for generating an ultrasonic signal, a conversion unit that converts an echo signal received from the ultrasonic probe 750 into an electrical signal, and an ultrasonic image formation unit that forms a two-dimensional ultrasonic image, a three-dimensional ultrasonic image, or various Doppler images from the echo signal.

[0069] The display unit 701 is an LCD (Liquid Crystal Display) or a monitor device, and displays an image formed by the control unit 703. The operation unit 702 is an input means for performing parameter input or the like so that an operator can perform an appropriate diagnosis on the measurement object U, and may use a push button, a touch panel, or the like.

[0070] The ultrasonic probe 750 is electrically connected to the control unit 703 via a cable or the like, transmits an ultrasonic signal toward the measurement object U that is a human body or an object, and receives the ultrasonic signal reflected as an echo from the measurement object U. In this way, the ultrasonic diagnostic apparatus 700 can visualize and diagnose the inside of the measurement object U by transmitting and receiving ultrasonic signals.

[0071] FIG. 17 is a schematic configuration diagram showing an example of the configuration of the ultrasonic probe. The ultrasonic probe 750 includes a support portion 751 that is a support substrate, a PMUT (Piezoelectric Micro-Machined Ultrasonic Transducer) chip 752 that is an ultrasonic transducer formed on the support portion 751, a flexible substrate 753, wiring 754, connectors 755 and 756, and an acoustic lens 757. The PMUT chip 752 is electrically connected to the connectors 755 and 756 via the flexible substrate 753 and the wiring 754, and is connected to the control unit 703 via the circuit board from the connectors 755 and 756.

[0072] The support portion 751 also functions as a backing plate for holding the PMUT chip 752.

[0073] The acoustic lens 757 is an acoustic lens made of silicone resin for focusing the ultrasonic waves transmitted from the PMUT chip 752 to the measurement position of the measurement object U. The acoustic lens 757 has a so-called dome shape where the central portion is thicker than the peripheral portion, and by contacting and adhering to the measurement object U, it has a function of pseudo-refracting and focusing ultrasonic waves due to the difference in thickness between the central portion and the peripheral portion. Note that the acoustic lens 757 only needs to have a function of focusing ultrasonic waves in at least one direction, and does not necessarily need to focus ultrasonic waves to a single point. The acoustic lens 757 and the PMUT chip 752 are bonded together, for example, by an adhesive.

[0074] The PMUT chip 752 includes a plurality of actuators 800 arranged in an array. Hereinafter, the details of the actuator 800 will be described. FIG. 18 is a cross-sectional view showing an example of the actuator.

[0075] The actuator 800 includes a silicon substrate 810, a wiring portion 820, a diaphragm 830, a piezoelectric element 850, an insulating film 860, a lead wiring 870, and a protective film (moisture-proof film) 880. In the silicon substrate 810, for example, a void portion 840 formed of a cylindrical opening is formed, and the wiring portion 820 is laminated on the silicon substrate 810.

[0076] The wiring portion 820 is formed on the silicon substrate 810 and includes a wiring portion for applying a bias to the first electrode 851, a wiring portion for applying a bias to the second electrode 853, and the like. A diaphragm 830 as a diaphragm member is laminated on the wiring portion 820.

[0077] The diaphragm 830 is formed on the wiring portion 820 and is displaced in the vertical direction in FIG. 18 by receiving vibrations from the piezoelectric element 850. The piezoelectric element 850 provided on the diaphragm 830 includes a first electrode (also referred to as a lower electrode) 851, a piezoelectric body 852, and a second electrode (also referred to as an upper electrode) 853.

[0078] The first electrode 851 has a width (outer diameter) L1, and its size is smaller than the width (inner diameter) L4 of the gap portion 840 formed in the silicon substrate 810, and the first electrode 851 is provided with an outer shape that fits inside the gap portion 840.

[0079] The second electrode 853 is formed along the upper surface side of the dome-shaped piezoelectric body 852. It is desirable that the outer diameter (L3) of the second electrode 853 is smaller than the outer diameter (L2) of the piezoelectric body 852. In particular, when the piezoelectric body 852 is a dome-shaped piezoelectric body, by making the outer diameter of the second electrode 853 smaller than the outer shape of the piezoelectric body 852, a short circuit between the second electrode 853 and the first electrode 851 can be prevented.

[0080] The insulating film 860 prevents a short circuit between the first electrode 851 and the second electrode 853, and a short circuit between the lead wiring 870 and the first electrode 851. In the embodiment, the piezoelectric body 852 has a dome shape, but it is not limited thereto. The shape of the piezoelectric body 852 may be a shape other than the dome shape, such as a cylindrical shape.

[0081] In the above configuration, the piezoelectric body 852 undergoes mechanical deformation by applying a driving voltage between the first electrode 851 and the second electrode 853, and generates vibrations of a predetermined frequency due to the periodic variation of the driving voltage, thereby vibrating the diaphragm 830 to generate ultrasonic waves W.

[0082] Also, when ultrasonic waves vibrate the piezoelectric body 852, the piezoelectric body 852 becomes polarized, generating a potential difference between the first electrode 851 and the second electrode 853, and the actuator 800 also functions as a detection means for detecting the vibration as an electrical signal. In this way, the actuator 800 has a function as an electromechanical conversion element that periodically expands and contracts the piezoelectric body 852 by the potential difference between the first electrode 851 and the second electrode 853, that is, an electrical signal, to generate vibration. In particular, in the present embodiment, it has a function as an ultrasonic transducer that oscillates sound waves in the ultrasonic region by vibration.

[0083] Also, in the actuator 800 configured as described above, by providing the outer shape of the first electrode 851 in a shape that fits inside the gap portion 840, the fixed ends P1 and P2 of the vibration film 830 can be made to move easily, and the vibration film 830 can be vibrated well. Further, the deformation efficiency of the vibration film 830 with respect to voltage can be increased, and a decrease in responsiveness to high frequencies can be suppressed.

[0084] In the present invention, the "device for discharging a liquid" is a device that includes a liquid discharge head or a liquid discharge unit and drives the liquid discharge head to discharge a liquid. The device for discharging a liquid includes not only a device capable of discharging a liquid onto an object to which the liquid can adhere, but also a device capable of discharging a liquid into the air or into a liquid.

[0085] This "device for discharging a liquid" can also include means related to the supply, conveyance, and discharge of an object to which the liquid can adhere, as well as other pre-treatment devices, post-treatment devices, and the like. For example, as the "device for discharging a liquid", there is an image forming device that discharges ink to form an image on paper, and a three-dimensional modeling device (three-dimensional modeling device) that discharges a modeling liquid onto a powder layer formed in a layer shape of powder in order to model a three-dimensional object (three-dimensional object).

[0086] Further, the "device for discharging a liquid" is not limited to those in which a significant image such as characters or figures is visualized by the discharged liquid. For example, those that form a pattern or the like having no meaning by itself, and those that fabricate a three-dimensional image are also included.

[0087] The above-mentioned "thing to which liquid can adhere" means a thing to which liquid can adhere at least temporarily, and includes things that adhere and stick, things that adhere and penetrate, etc. Specific examples include recording media such as paper, recording paper, recording sheets, films, cloth, electronic substrates, electronic components such as piezoelectric elements, powder layers (powder layers), organ models, media such as test cells, and all things to which liquid adheres are included unless otherwise particularly limited.

[0088] The material of the above-mentioned "thing to which liquid can adhere" may be paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, building materials such as wallpaper and floor materials, textile for clothing, current collectors such as aluminum foil and copper foil, or electrodes having an active material layer formed on the current collector, etc., as long as liquid can adhere even temporarily.

[0089] Also, the "liquid" only needs to have a viscosity and surface tension that can be discharged from the head, and is not particularly limited, but it is preferably such that the viscosity becomes 30 mPa·s or less at normal temperature and pressure, or by heating or cooling. More specifically, solvents such as water and organic solvents, colorants such as dyes and pigments, polymerizable compounds, resins, functional imparting materials such as surfactants, biocompatible materials such as DNA, amino acids, proteins, calcium, edible materials such as natural pigments, solutions containing active materials and solid electrolytes used as electrode materials, inks containing conductive materials and insulating materials, etc., including solutions, suspensions, emulsions, etc. These can be used, for example, in applications such as inkjet inks, surface treatment liquids, components of electronic elements and light-emitting elements, liquids for forming electronic circuit resist patterns, material liquids for three-dimensional fabrication, electrodes, and electrochemical elements. The "liquid" also includes inks, treatment liquids, DNA samples, resists, pattern materials, binders, shaping liquids, or solutions and dispersions containing amino acids, proteins, calcium, etc.

[0090] In addition, the "device for discharging a liquid" includes, but is not limited to, a device in which a liquid discharge head and an object to which the liquid can adhere move relative to each other. Specific examples include a serial type device that moves the liquid discharge head and a line type device that does not move the liquid discharge head.

[0091] In addition, other examples of the "device for discharging a liquid" include a treatment liquid application device that discharges a treatment liquid onto a sheet in order to apply the treatment liquid to the surface of the sheet for the purpose of modifying the surface of the sheet, and an injection granulation device that injects a composition liquid in which raw materials are dispersed in a solution through a nozzle to granulate fine particles of the raw materials.

[0092] In addition, the "device for discharging a liquid" is not limited to a stationary type device. The device for discharging a liquid may be, for example, a robot equipped with a liquid discharge head that can move by remote control or autonomous driving, and can also be applied to painting the outer wall of a building or painting road surface markings (such as crosswalks, stop lines, speed signs, etc.) by a movable robot. In this case, the building and the road are also included in the "object to which the liquid can adhere".

[0093] The "liquid discharge unit" is an integrated unit of functional components and mechanisms with a liquid discharge head, and is an aggregate of components related to the discharge of the liquid. For example, the "liquid discharge unit" includes at least one of the configurations of a head tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, and a main scanning movement mechanism combined with the liquid discharge head.

[0094] Here, the integration includes, for example, those in which the liquid discharge head and the functional components and mechanisms are fixed to each other by fastening, adhesion, engagement, etc., and those in which one is held movably with respect to the other. Also, the liquid discharge head and the functional components and mechanisms may be configured to be detachable from each other.

[0095] For example, as a liquid discharge unit, there is one in which a liquid discharge head and a head tank are integrated, such as the liquid discharge unit 440 shown in FIG. 12. Also, there is one in which a liquid discharge head and a head tank are integrated by being connected to each other with a tube or the like. Here, a unit including a filter can also be added between the head tank and the liquid discharge head of these liquid discharge units.

[0096] Also, as a liquid discharge unit, there is one in which a liquid discharge head and a carriage are integrated.

[0097] Also, as a liquid discharge unit, there is one in which a liquid discharge head is movably held by a guide member that forms a part of a scanning movement mechanism, and the liquid discharge head and the scanning movement mechanism are integrated. Also, as shown in FIG. 13, as a liquid discharge unit, there is one in which a liquid discharge head, a carriage, and a main scanning movement mechanism are integrated.

[0098] Also, as a liquid discharge unit, there is one in which a cap member that is a part of a maintenance and recovery mechanism is fixed to a carriage to which a liquid discharge head is attached, and the liquid discharge head, the carriage, and the maintenance and recovery mechanism are integrated.

[0099] Also, as a liquid discharge unit, as shown in FIG. 14, there is one in which a tube is connected to a liquid discharge head to which a head tank or a flow path component is attached, and the liquid discharge head and a supply mechanism are integrated.

[0100] The main scanning movement mechanism shall also include a single guide member. Also, the supply mechanism shall include a single tube and a single loading unit.

[0101] Also, the "liquid discharge head" is not limited to the pressure generation means used. For example, in addition to the piezoelectric actuator (which may use a laminated piezoelectric element) as described in the above embodiment, a thermal actuator using an electrothermal conversion element such as a heating resistor, an electrostatic actuator including a diaphragm and a counter electrode, etc. may also be used.

[0102] In addition, in the terms of the present application, image formation, recording, printing, imprinting, printing, shaping, etc. are all regarded as synonyms.

[0103] Aspects of the present invention are as follows, for example. <1> A liquid chamber substrate forming a pressure chamber whose volume can be changed by pressure generating means, A nozzle substrate joined to the liquid chamber substrate, A holding substrate joined to a surface of the liquid chamber substrate opposite to the surface joined to the nozzle substrate, and comprising: Four corner portions of the liquid chamber substrate and at least side surfaces of the four corner portions from the liquid chamber substrate to the holding substrate are covered with a conductive resin, The holding substrate has a structure in which a conductive frame is joined to a surface opposite to the surface joined to the liquid chamber substrate A liquid discharge head characterized by the above. <2> A liquid chamber substrate forming a pressure chamber whose volume can be changed by pressure generating means, A nozzle substrate joined to the liquid chamber substrate, A holding substrate joined to a surface of the liquid chamber substrate opposite to the surface joined to the nozzle substrate, and comprising: Four corner portions of the liquid chamber substrate, at least side surfaces of the four corner portions from the liquid chamber substrate to the holding substrate, and at least surfaces of side surfaces around the liquid chamber substrate are covered with a conductive resin, The holding substrate has a structure in which a conductive frame is joined to a surface opposite to the surface joined to the liquid chamber substrate A liquid discharge head characterized by the above. <3> The liquid discharge head according to <1> or <2>, The side surface from the liquid chamber substrate to the holding substrate is provided with an insulating resin between the side surface and the conductive resin, and has a two-layer structure of the insulating resin and the conductive resin A liquid discharge head characterized by the above. <4> A liquid chamber substrate forming a pressure chamber whose volume can be changed by a pressure generating means, a nozzle substrate joined to the liquid chamber substrate, and a holding substrate joined to a surface of the liquid chamber substrate opposite to the surface joined to the nozzle substrate, wherein side surfaces around the liquid chamber substrate and the holding substrate are covered with a conductive resin, and the holding substrate has a structure in which a conductive frame is joined to a surface opposite to the surface joined to the liquid chamber substrate. A liquid discharge head characterized by the above. <5> The liquid discharge head according to any one of <1> to <4> above, wherein there is no exposure of a metal member on side surfaces of the liquid chamber substrate and the holding substrate. A liquid discharge head characterized by the above. <6> The liquid discharge head according to any one of <1> to <5> above, further comprising a metal base member, and a metal cover member, wherein the frame is attached to the base member without an insulator therebetween, and the base has a structure in which the cover member is joined to the side of the nozzle substrate. A liquid discharge head characterized by the above. <7> The liquid discharge head according to any one of <1> to <6> above, wherein the nozzle substrate, the liquid chamber substrate, and the holding substrate are made of silicon. A liquid discharge head characterized by the above. <8> A head module equipped with the liquid discharge head according to any one of <1> to <7> above. <9> An apparatus for discharging a liquid equipped with the head module according to <8> above.

[0104] Note that the present invention is not limited to the above-described embodiments. Within the scope of the present invention, each element of the above embodiments can be easily changed, added, or converted by those skilled in the art. Also, two or more of the above-described embodiments, application examples, etc. can be appropriately combined.

Explanation of Reference Numerals

[0105] 10 Nozzle substrate 11 Nozzle 20 Flow path substrate 30 Diaphragm 40 Piezoelectric element 100, 100A, 100B Head module 101 Head 102 Base member 103 Cover member 103A Nozzle cover 121 Sub-frame 122 Liquid chamber substrate 123 Damper 125 Damper frame 126 Holding substrate 127, 127A - 127D Head substrate 128 Conductive frame 130 Conductive resin 131 Insulating resin

Prior Art Documents

Patent Documents

[0106]

Patent Document 1

Claims

1. A liquid chamber substrate forming a pressure chamber whose volume can be changed by a pressure generating means, a nozzle substrate joined to the liquid chamber substrate, and a holding substrate joined to a surface of the liquid chamber substrate opposite to the surface joined to the nozzle substrate, wherein four corners of the liquid chamber substrate and at least sides from the liquid chamber substrate to the holding substrate of at least the four corners are covered with a conductive resin, and the holding substrate has a structure in which a conductive frame is joined to a surface opposite to the surface joined to the liquid chamber substrate. A liquid ejection head characterized by the above.

2. A liquid chamber substrate forming a pressure chamber whose volume can be changed by a pressure generating means, a nozzle substrate joined to the liquid chamber substrate, and a holding substrate joined to a surface of the liquid chamber substrate opposite to the surface joined to the nozzle substrate, wherein four corners of the liquid chamber substrate, at least sides from the liquid chamber substrate to the holding substrate of at least the four corners, and at least surfaces of side surfaces around the liquid chamber substrate are covered with a conductive resin, and the holding substrate has a structure in which a conductive frame is joined to a surface opposite to the surface joined to the liquid chamber substrate. A liquid ejection head characterized by the above.

3. The liquid ejection head according to claim 1 or 2, wherein an insulating resin is provided between the side surface from the liquid chamber substrate to the holding substrate and the conductive resin, and it has a two-layer structure of an insulating resin and a conductive resin. A liquid ejection head characterized by the above.

4. A liquid chamber substrate forming a pressure chamber whose volume can be changed by a pressure generating means, a nozzle substrate joined to the liquid chamber substrate, and a holding substrate joined to a surface of the liquid chamber substrate opposite to the surface joined to the nozzle substrate, wherein side surfaces around the liquid chamber substrate and the holding substrate are covered with a conductive resin, and the holding substrate has a structure in which a conductive frame is joined to a surface opposite to the surface joined to the liquid chamber substrate. A liquid ejection head characterized by the above.

5. The liquid ejection head according to claim 1 or 2, characterized in that there is no exposure of a metal member on side surfaces of the liquid chamber substrate and the holding substrate. A liquid ejection head characterized by the above.

6. The liquid ejection head according to claim 1 or 2, further comprising a metal base member and a metal cover member, wherein the frame is attached to the base member without an insulator therebetween. The base has a structure in which the cover member is joined to the side of the nozzle substrate. A liquid ejection head characterized by this.

7. A liquid ejection head according to claim 1 or 2, wherein the nozzle substrate, the liquid chamber substrate, and the holding substrate are made of silicon. A liquid ejection head characterized by this.

8. A head module equipped with the liquid ejection head according to claim 1 or 2.

9. An apparatus for ejecting a liquid equipped with the head module according to claim 8.

Images