Multilayer electronic component
By integrating carbon fibers into the cover portions of multilayer ceramic capacitors, the bending strength is enhanced, ESR is maintained low, and crack propagation is prevented, addressing the challenges faced by existing technologies.
Patent Information
- Application Number
- JP2024193395
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-01
- Filing Date
- 2024-11-05
- Publication Date
- 2025-06-12
AI Technical Summary
Existing multilayer ceramic capacitors face challenges in improving bending strength without increasing equivalent series resistance (ESR) and preventing crack propagation from the cover portion to the capacitance forming portion.
Incorporating carbon fibers into the cover portions of the multilayer electronic component, which contain Ba and Ti, to enhance bending strength while maintaining low ESR and preventing crack propagation.
The solution effectively improves the bending strength of multilayer electronic components without increasing ESR and prevents crack propagation to the capacitance forming portion, ensuring reliable performance under mechanical stress.
Smart Images
Figure 2025089265000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a multilayer electronic component.
Background Art
[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.
[0003] Due to the advantages of being small in size while ensuring high capacitance and being easy to mount, multilayer ceramic capacitors can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices are miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.
[0004] Conventionally, various attempts have been made to improve the bending strength of multilayer electronic components. For example, there is a method of introducing a conductive resin layer into the external electrode. However, when introducing a conductive resin into the external electrode, there may be a side effect of increasing the equivalent series resistance (ESR) of the multilayer electronic component compared to a sintered electrode or a plated electrode.
[0005] Therefore, there is a need for a structural improvement that can improve the bending strength of multilayer electronic components without special side effects.
Summary of the Invention
Problems to be Solved by the Invention
[0006] One of the various objects of the present invention is to improve the bending strength of a multilayer electronic component.
[0007] One of the various objects of the present invention is to suppress the propagation of cracks generated in the cover portion to the capacitance forming portion.
[0008] One of the various objects of the present invention is to suppress the side effect of an increase in ESR in the process of improving the bending strength of a multilayer electronic component.
[0009] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.
Means for Solving the Problems
[0010] A multilayer electronic component according to an embodiment of the present invention includes first and second internal electrodes alternately arranged in a first direction with a dielectric layer interposed therebetween, a first and a second surface facing each other in the first direction, a third and a fourth surface connected to the first and second surfaces and facing each other in a second direction, and a fifth and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, a main body, and external electrodes disposed on the third and fourth surfaces. The main body includes a capacitance forming portion which is a region where the first and second internal electrodes overlap in the first direction, and a cover portion disposed on one surface and the other surface of the capacitance forming portion in the first direction. The cover portion can contain Ba, Ti, and carbon fiber.
Effects of the Invention
[0011] One of the various effects of the present invention is to improve the bending strength of a multilayer electronic component.
[0012] One of the various effects of the present invention is to suppress the propagation of cracks generated in the cover portion to the capacitance forming portion.
[0013] One of the various effects of the present invention is to suppress the side effect of an increase in ESR in the process of improving the bending strength of a multilayer electronic component.
[0014] However, the diverse and meaningful advantages and effects of the present invention are not limited to the above-described content and can be more easily understood during the process of explaining the specific embodiments of the present invention.
Brief Description of the Drawings
[0015]
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Modes for Carrying Out the Invention
[0016] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.
[0017] In the drawings, parts not relevant to the description are omitted to clearly explain the present invention. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the illustrations. Also, components with the same functions within the scope of the same concept can be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.
[0018] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.
[0019] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 schematically shows a cross-sectional view taken along line I-I' of FIG. 1. FIG. 3 schematically shows a cross-sectional view taken along line III-III' of FIG. 1. FIG. 4 schematically shows a cross-sectional view taken along line II-II' of FIG. 1. FIG. 5 is an enlarged view of the P region in FIG. 2. FIGS. 6(a) and 6(b) schematically show the form of carbon fiber according to an embodiment. FIG. 7 schematically shows an exploded perspective view of the main body according to an embodiment.
[0020] Hereinafter, with reference to FIGS. 1 to 7, a stacked electronic component 100 according to an embodiment of the present invention will be described in detail. Also, as an example of a stacked electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto.
[0021] The multilayer electronic component 100 according to an embodiment of the present invention includes first and second internal electrodes 121 and 122 that are alternately arranged in a first direction with a dielectric layer 111 interposed therebetween, a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction and connected to the first and second surfaces, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction and connected to the first to fourth surfaces, and external electrodes 131 and 132 disposed on the third and fourth surfaces. The main body includes a capacitance forming portion Ac which is a region where the first and second internal electrodes overlap in the first direction, and cover portions 112 and 113 disposed on one surface and the other surface of the capacitance forming portion in the first direction. The cover portion can include Ba, Ti, and carbon fiber 123.
[0022] Hereinafter, each component included in the multilayer electronic component 100 according to an embodiment of the present invention will be described.
[0023] The main body 110 can have a dielectric layer 111 and internal electrodes 121 and 122 alternately laminated.
[0024] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can have a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can substantially have a hexahedron shape.
[0025] The main body 110 can have a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction and connected to the first and second surfaces, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction and connected to the first and second surfaces and the third and fourth surfaces.
[0026] By overlapping the margin regions where the internal electrodes 121 and 122 are not arranged on the dielectric layer 111, a step due to the thickness of the internal electrodes 121 and 122 is generated, and the corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, by performing a separate process to round the corners connecting the respective surfaces of the main body 110, the corner connecting the first surface and the third to sixth surfaces and / or the corner connecting the second surface and the third to sixth surfaces can have a round form.
[0027] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not particularly need to be limited and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.
[0028] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based (BaTiO 3 )-based powder can be used. More specifically, for example, the ceramic powder is a barium titanate (BaTiO 3 )-based powder, CaZrO 3Base paraelectric powders and the like can be used. To give a more specific example, barium titanate (BaTiO 3 )-based powders include BaTiO 3 , (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O 3 (0 < y < 1), and one or more of them can be used. The base paraelectric powder of CaZrO 3 can be (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 (0 < x < 1, 0 < y < 1).
[0029] Therefore, the dielectric layer 111 can include one or more of BaTiO 3 , (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O 3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 (0 < x < 1, 0 < y < 1).
[0030] The average thickness td of the dielectric layer 111 is not particularly limited.
[0031] When aiming at miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 can be 3 μm or more.
[0032] The average thickness td of the dielectric layer 111 can be measured by scanning an image of the cross-section (L-T cross-section) of the main body 110 in the third and first directions using a scanning electron microscope (SEM).
[0033] For example, the average thickness td of the dielectric layer 111 is extracted from an image scanned using a scanning electron microscope (SEM) of the cross-section in the length and thickness directions (L-T) cut at the central part in the width direction of the main body 110. Among the dielectric layers, for a total of 5 dielectric layers, 2 layers on the upper part and 2 layers on the lower part with respect to one layer of the dielectric layer at the point where the central line in the length direction of the main body and the central line in the thickness direction are in contact, with the point where the central line in the length direction of the main body and the central line in the thickness direction are in contact as a reference, after determining 5 points at equal intervals, 2 points on the left side and 2 points on the right side centered on one reference point, the thickness of each point can be measured and the average value can be measured.
[0034] The main body 110 includes a capacitance forming portion Ac in which a capacitance is formed including a first internal electrode 121 and a second internal electrode 122 that are arranged inside the main body 110 so as to face each other with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed on the upper and lower parts of the capacitance forming portion Ac in the first direction.
[0035] The capacitance forming section Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 interposed therebetween. Also, a first internal electrode 121 can be arranged at the uppermost end of the capacitance forming section Ac in the first direction, and a second internal electrode 122 can be arranged at the lowermost end of the capacitance forming section Ac in the first direction.
[0036] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.
[0037] The first internal electrode 121 is separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 is separated from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 can be arranged on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 can be arranged on the fourth surface 4 of the main body and connected to the second internal electrode 122.
[0038] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Also, the first and second internal electrodes 121 and 122 can be arranged separated from the fifth and sixth surfaces of the main body 110.
[0039] The conductive metal included in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.
[0040] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and can vary depending on the purpose. In order to miniaturize the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 can be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121 and 122 can be 3 μm or more.
[0041] The average thickness te of the internal electrodes 121 and 122 is extracted from an image scanned using a scanning electron microscope (SEM) of the cross-section in the length and thickness directions (L-T) cut at the central portion in the width direction of the main body 110. Among the internal electrode layers, for a total of 5 internal electrode layers, 2 layers on the upper side and 2 layers on the lower side, with the internal electrode layer at the point where the center line in the length direction of the main body and the center line in the thickness direction are in contact as the reference, after determining 5 points at equal intervals, 2 points on the left side and 2 points on the right side centered on the one reference point, the thickness at each point can be measured and the average value can be measured.
[0042] Cover portions 112 and 113 can be arranged on the upper and lower surfaces of the capacitance forming portion Ac in the first direction.
[0043] The cover portions 112 and 113 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.
[0044] The cover portions 112 and 113 can contain the same material as the dielectric layer 111. That is, the cover portions 112 and 113 can contain a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.
[0045] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. For example, the thickness tc of the cover portions 112 and 113 can each be 20 μm or less.
[0046] The average thickness tc1 of the cover portions 112 and 113 can represent the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points above or below the capacitance forming portion Ac.
[0047] Also, margin portions 114 and 115 can be arranged on the side surfaces of the capacitance forming portion Ac.
[0048] The margin portions 114 and 115 can include a first margin portion 114 arranged on the fifth surface 5 of the main body 110 and a second margin portion 115 arranged on the sixth surface 6. That is, the margin portions 114 and 115 can be arranged on both end surfaces in the width direction of the ceramic main body 110.
[0049] As shown in FIG. 3, the margin portions 114 and 115 can represent the regions between the interfaces of both ends of the first and second internal electrodes 121 and 122 and the main body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.
[0050] Basically, the margin portions 114 and 115 can play a role in preventing damage to the internal electrodes due to physical or chemical stress.
[0051] The margin portions 114 and 115 can be formed by applying a conductive paste to form internal electrodes, except where the margin portions are formed on the ceramic green sheet.
[0052] On the other hand, the widths of the margin portions 114 and 115 do not need to be particularly limited. For example, the average widths of the margin portions 114 and 115 can each be 20 μm or less.
[0053] The average widths of the margin portions 114 and 115 can mean the average size in the third direction of the region where the internal electrodes are separated from the fifth surface and the average size in the third direction of the region where the internal electrodes are separated from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.
[0054] The external electrodes 131 and 132 are disposed on the third surface 3 and the fourth surface 4 which are surfaces facing each other in the second direction perpendicular to the first direction of the main body 110, and can be connected to the internal electrodes 121 and 122. Specifically, the first external electrode 131 is disposed on the third surface 3 which is one surface facing each other in the second direction perpendicular to the first direction of the main body 110, and can be connected to the first internal electrode 121. The second external electrode 132 is disposed on the fourth surface 4 which is the other surface facing each other in the second direction perpendicular to the first direction of the main body 110, and can be connected to the second internal electrode 122.
[0055] In the present embodiment, the structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described. However, the number, shape, etc. of the external electrodes 131 and 132 can vary according to the form of the internal electrodes 121 and 122 and other purposes.
[0056] On the other hand, the external electrodes 131 and 132 can be formed using any material as long as it has electrical conductivity such as metal, etc., and a specific material can be determined in consideration of electrical characteristics, structural stability, etc., and can further have a multilayer structure.
[0057] For example, the external electrodes 131 and 132 can include an electrode layer disposed on the main body 110 and a plating layer disposed on the electrode layer.
[0058] To give a more specific example of the electrode layer, the electrode layer can be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and a resin.
[0059] Further, the electrode layer can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layer can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto the fired electrode.
[0060] As the conductive metal contained in the electrode layer, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys, and preferably can be copper (Cu) in order to improve the adhesion to the main body.
[0061] The plating layer plays a role in improving the mounting characteristics. The type of the plating layer is not particularly limited, and it can be a plating layer containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and their alloys, and can be formed from a plurality of layers.
[0062] More specific examples of the plating layer are as follows. The plating layer can be a Ni plating layer or a Sn plating layer, and can be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or can be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layer can include a plurality of Ni plating layers and / or a plurality of Sn plating layers.
[0063] The size of the multilayer electronic component 100 does not need to be particularly limited. For example, the length of the multilayer electronic component 100 can be 0.25 to 5.7 mm, the thickness of the multilayer electronic component 100 can be 0.125 to 3.2 mm, and the width of the multilayer electronic component 100 can be 0.125 to 5.0 mm.
[0064] Here, the length of the multilayer electronic component 100 means the maximum size in the second direction of the multilayer electronic component 100, the thickness of the multilayer electronic component 100 means the maximum size in the first direction of the multilayer electronic component 100, and the width of the multilayer electronic component 100 can mean the maximum size in the third direction of the multilayer electronic component 100.
[0065] Conventionally, there have been attempts to introduce a conductive resin layer into an external electrode to improve the bending strength of a multilayer electronic component. However, since the conductive resin layer has a structure in which conductive particles are dispersed in a resin, different from a sintered electrode or a plated electrode, when the conductive resin layer is introduced into the external electrode, there may occur a side effect that the equivalent series resistance (ESR) of the multilayer electronic component increases.
[0066] Therefore, in one embodiment of the present invention, by including carbon fibers 123 in the cover portions 112 and 113 containing Ba and Ti, the bending strength of the multilayer electronic component 100 can be improved without an increase in the equivalent series resistance, and the phenomenon that a crack propagates to the capacitance forming portion even when a bending crack occurs can be prevented.
[0067] However, the present invention does not exclude the case where the external electrode includes a conductive resin layer. Even when the external electrode includes a conductive resin layer, when the cover portions 112 and 113 containing Ba and Ti include carbon fibers 123, it is the same that the bending strength of the multilayer electronic component 100 can be improved.
[0068] In one embodiment, the carbon fibers 123 can include one or more of single-walled carbon nanotubes (SWCNT) and multi-walled carbon nanotubes (MWCNT).
[0069] A single-walled carbon nanotube (SWCNT) is a material in which graphene is wound into a single tube shape, and a multi-walled carbon nanotube (MWCNT) can mean a case where the number of wound graphene tubes is two or more.
[0070] Since the carbon fiber 123 containing one or more of these single-walled carbon nanotubes (SWCNT) and multi-walled carbon nanotubes (MWCNT) has a large Young's modulus, when added to the cover parts 112 and 113 containing Ba and Ti, the bending strength of the laminated electronic component 100 can be improved.
[0071] On the other hand, when the carbon fiber 123 is a single-walled carbon nanotube (SWCNT), the average diameter of the carbon fiber 123 can be 0.4 nm or more and 4 nm or less, and when the carbon fiber 123 is a multi-walled carbon nanotube (MWCNT), the average diameter of the carbon fiber 123 can be 100 nm or more and 1 μm or less.
[0072] Referring to Fig. 6(a), the carbon fiber 123 can be composed of carbon nanotube units F1. The carbon nanotube unit F1 can mean the above-mentioned single-walled carbon nanotube (SWCNT) or multi-walled carbon nanotube (MWCNT). Therefore, the average diameter d1 of the carbon nanotube unit F1 can be 0.4 nm or more and 4 nm or less in the case of single-walled carbon nanotubes (SWCNT), and 100 nm or more and 1 μm or less in the case of multi-walled carbon nanotubes (MWCNT).
[0073] Referring to Fig. 6(b), the carbon fiber 123 can be in a form F2 in which a plurality of carbon nanotube units are combined. In this case, as the strength and surface area of the carbon fiber 123 increase, the effect of improving the bending strength of the laminated electronic component 100 can be further improved.
[0074] In Fig. 6(b), a form in which a plurality of carbon nanotube units are stacked in a columnar shape is shown, but the present invention is not limited thereto. That is, the form F2 in which the carbon nanotube units are combined is not particularly limited as long as it can form a carbon fiber.
[0075] Referring to Fig. 2, the cover parts 112 and 113 include a plurality of carbon fibers 123, and the plurality of carbon fibers 123 can be arranged spaced apart from each other in the first direction.
[0076] Referring to Fig. 3, the cover parts 112 and 113 include a plurality of carbon fibers 123, and the plurality of carbon fibers 123 can be arranged spaced apart from each other in the third direction.
[0077] When comprehensively considering FIGS. 2 to 4, it can be confirmed that the cover portions 112 and 113 include a plurality of carbon fibers 123, and the plurality of carbon fibers 123 are arranged at intervals in the first direction and the third direction with respect to each other.
[0078] In one embodiment, the plurality of carbon fibers 123 can be arranged at intervals in the first direction and the third direction with respect to each other. Thereby, the plurality of carbon fibers 123 can be arranged at a high density in the cover portions 112 and 113.
[0079] In one embodiment, each of the plurality of carbon fibers 123 can be continuously arranged in the second direction. Since the second direction is the direction in which the external electrodes 131 and 132 are separated from each other, it is the direction in which the bending stress transmitted to the stacked electronic component 100 is strong. Therefore, by arranging each of the plurality of carbon fibers 123 continuously in the second direction, the effect of improving the bending strength of the stacked electronic component 100 can be further improved.
[0080] In one embodiment, the carbon fibers 123 can be aligned in the second direction. Thereby, the effect of improving the bending strength of the stacked electronic component 100 can be further improved. The meaning that the carbon fibers 123 are aligned in the second direction means that the angle formed by the straight line connecting the long axes of the carbon fibers 123 and the second direction is 0 degrees or more and tan -1 (the average thickness of the cover portion / the average length of the main body) degrees or less.
[0081] The angle formed by the straight line connecting the long axes of the carbon fibers 123 and the second direction can be measured via a scanning electron microscope (SEM) in the cross sections in the first direction and the second direction polished in the third direction so that the carbon fibers 123 of the stacked electronic component 100 are exposed.
[0082] Further, the average length of the main body 110 can be a value obtained by averaging the sizes of the main body 110 in the second direction measured at five equally spaced points in the first direction between one end and the other end of the capacitance forming portion Ac in the first direction in the cross sections in the first and second directions polished up to the central portion in the third direction of the multilayer electronic component 100.
[0083] In one embodiment, in the Raman spectrum analysis, the cover portions 112 and 113 can form an RBM (Radial Breathing Mode) peak that is distinguishable from other peaks in addition to the G peak and the D peak. The Raman spectrum can be a value measured using a Raman spectrometer LabRam HR-800 manufactured by HORIBA, Ltd. of Japan. The presence or absence of carbon nanotubes can be confirmed by the above Raman spectrum, and it is possible to distinguish from other carbon allotropes.
[0084] Specifically, it can be confirmed that in the Raman analysis of the cover portions 112 and 113 of the multilayer electronic component 100 according to one embodiment, not only the D band and the G band but also a peak is detected in the RBM (Radial Breathing Mode).
[0085] On the other hand, when the carbon content contained in the carbon fiber 123 is less than 50 moles with respect to 100 moles of Ba contained in the cover portions 112 and 113, it may be difficult to realize the effect of improving the bending strength.
[0086] When the carbon content contained in the carbon fiber 123 exceeds 1000 moles with respect to 100 moles of Ba contained in the cover portions 112 and 113, when forming the cover portions 112 and 113 on the upper surface or the lower surface of the capacitance forming portion Ac, it is difficult to smoothly perform the lamination and crimping processes, so the mechanical strength of the multilayer electronic component 100 may decrease.
[0087] Therefore, in one embodiment, by adjusting the carbon content in the carbon fiber 123 to be 50 mol or more and 1000 mol or less with respect to 100 mol of Ba contained in the cover parts 112 and 113, a decrease in the mechanical strength of the multilayer electronic component 100 can be prevented, and the bending strength can be sufficiently improved.
[0088] On the other hand, the phenomenon of a decrease in the mechanical strength or a decrease in the bending strength of the multilayer electronic component 100, which may occur when the carbon content in the carbon fiber 123 is insufficient or excessive with respect to 100 mol of Ba contained in the cover parts 112 and 113, can be further aggravated when the carbon fiber 123 is a multi-walled carbon nanotube (MWCNT). However, according to one embodiment, by adjusting the carbon content in the carbon fiber 123 to be 50 mol or more and 1000 mol or less with respect to 100 mol of Ba contained in the cover parts 112 and 113, a decrease in the mechanical strength of the multilayer electronic component 100 can be prevented, and the bending strength can be sufficiently improved. Therefore, even when the carbon fiber 123 is a multi-walled carbon nanotube (MWCNT), the bending strength and the mechanical strength of the multilayer electronic component 100 can be sufficiently ensured.
[0089] The method for measuring the carbon content in the carbon fiber 123 with respect to 100 mol of Ba contained in the cover parts 112 and 113 is not particularly limited. For example, the carbon content in the carbon fiber 123 with respect to 100 mol of Ba contained in the cover parts 112 and 113 is obtained by dividing, in the second direction, the region of the cover parts 112 and 113 in the cross sections in the first and second directions, which are polished up to the central part in the third direction of the multilayer electronic component 100, and which overlaps with the capacitance forming part Ac in the first direction, into three equal parts, analyzing the composition of the elements contained in a region of horizontal × vertical = 15 μm × 15 μm centered on the central part of the three equal parts by SEM-EDX (Scanning Electron Microscope-Energy Dispersive X-ray Spectrometer), converting it into the number of moles of carbon with respect to 100 mol of Ba, and then taking the average value.
[0090] On the one hand, the carbon fiber 123 can be made to have electrical conductivity according to its structure. Therefore, in one embodiment, by arranging the carbon fiber 123 so as to be separated from the external electrodes 131 and 132, a short circuit between the external electrodes 131 and 132 can be prevented.
[0091] Referring to FIG. 5, in one embodiment, the other cover portions 112 and 113 can include a plurality of dielectric crystal grains G and grain boundaries GB disposed between the plurality of dielectric crystal grains. At this time, the carbon fiber 123 can be disposed on the dielectric including the crystal grains G and the grain boundaries GB.
[0092] Referring to FIG. 7, the carbon fiber 123 can be disposed on the cover portions 112 and 113 disposed on the upper and lower surfaces in the first direction of the region where the dielectric layer 111 and the first and second internal electrodes 121 and 122 are alternately disposed in the first direction. The cover portions 112 and 113 can be composed of a plurality of layers.
[0093] The carbon fiber 123 can be arranged in alignment in the second direction on one surface of the cover sheet. The method of aligning the carbon fiber 123 with the cover sheet is not particularly limited. For example, before proceeding with the cutting process to form the main body 110, carbon fibers pre-manufactured in a laminated bar state in which a dielectric green sheet and an internal electrode pattern are printed, laminated, and pressure-bonded are applied to the cover sheet in a predetermined pattern, and this is formed through a method of adhering and pressure-bonding it to the laminated bar. At this time, the carbon fiber can be pre-manufactured by a method such as chemical vapor deposition (CVD).
[0094] In one embodiment, the carbon fiber 123 can be included not only in the cover portions 112 and 113 but also in the margin portions 114 and 115. Specifically, the margin portions 114 and 115 can include Ba, Ti, and carbon fiber. Thereby, the bending strength of the laminated electronic component 100 can be further improved.
[0095] The carbon fibers included in the margin portions 114 and 115 can have the characteristics of the carbon fibers 123 included in the cover portion applied thereto.
[0096] Specifically, a plurality of carbon fibers included in the margin portions 114 and 115 can be arranged at intervals in the first direction or the third direction.
[0097] In one embodiment, each of the plurality of carbon fibers included in the margin portions 114 and 115 can be arranged continuously in the second direction.
[0098] On the other hand, the alignment direction of the carbon fibers included in the margin portions 114 and 115 can be the first direction. In this case, a plurality of carbon fibers included in the margin portions 114 and 115 are arranged at intervals from each other in the second direction and the third direction, and each of the plurality of carbon fibers can be arranged continuously in the first direction.
[0099] In one embodiment, the carbon fibers included in the margin portions 114 and 115 can be arranged at a distance from the external electrodes 131 and 132.
[0100] In one embodiment, the angle formed by the straight line connecting the major axes of the carbon fibers included in the margin portions 114 and 115 and the second direction can be 0 degrees or more and tan -1 (average width of the margin portion / average thickness of the main body) degrees or less.
[0101] In one embodiment, the carbon content included in the above carbon fibers can be 50 moles or more and 1000 moles or less with respect to 100 moles of Ba included in the margin portion.
[0102] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and it can be said that these also belong to the scope of the present invention.
[0103] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of another one embodiment. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to the other one embodiment as long as there is no explanation contrary to or conflicting with that matter in the other one embodiment.
[0104] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates otherwise.
Explanation of Reference Numerals
[0105] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover part 114, 115 Margin part 121, 122 Internal electrode 123 Carbon fiber 131, 132 External electrode
Claims
1. a body including first and second internal electrodes alternately disposed in a first direction with a dielectric layer interposed therebetween, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; external electrodes disposed on the third surface and the fourth surface; the main body includes a capacitance forming portion that is a region where the first and second internal electrodes overlap in the first direction, and a cover portion that is disposed on an upper surface and a lower surface of the capacitance forming portion in the first direction, The cover portion includes Ba, Ti, and carbon fiber.
2. 2. The laminated electronic component according to claim 1, wherein the carbon fibers include at least one of a single-walled carbon nanotube (SWCNT) and a multi-walled carbon nanotube (MWCNT).
3. 2. The laminated electronic component according to claim 1, wherein the carbon fibers are single-walled carbon nanotubes (SWCNTs), and the average diameter of the carbon fibers is 0.4 nm or more and 4 nm or less.
4. 2. The laminated electronic component according to claim 1, wherein the carbon fibers are multi-walled carbon nanotubes (MWCNTs), and the average diameter of the carbon fibers is 100 nm or more and 1 μm or less.
5. The multilayer electronic component according to claim 1 , wherein the carbon fibers are composed of carbon nanotube units.
6. The multilayer electronic component according to claim 1 , wherein the carbon fiber is in the form of a plurality of carbon nanotube units bonded together.
7. The cover portion includes a plurality of the carbon fibers, The multilayer electronic component according to claim 1 , wherein the plurality of carbon fibers are arranged spaced apart from one another in the first direction and the third direction.
8. The cover portion includes a plurality of the carbon fibers, The multilayer electronic component according to claim 1 , wherein each of the plurality of carbon fibers is configured as a single unit body.
9. The cover portion includes a plurality of the carbon fibers, The multilayer electronic component according to claim 1 , wherein each of the plurality of carbon fibers is arranged continuously in the second direction.
10. The multilayer electronic component according to claim 1 , wherein the carbon fibers are disposed apart from the external electrodes.
11. The angle between the line connecting the major axes of the carbon fibers and the second direction is 0 degrees or more. -1 2. The multilayer electronic component according to claim 1, wherein the average thickness of the cover portion is equal to or less than the average length of the main body.
12. 2. The multilayer electronic component according to claim 1, wherein a content of carbon contained in said carbon fibers is 50 mol to 1000 mol per 100 mol of said Ba contained in said cover portion.
13. the main body includes a margin portion disposed on one surface and a side surface of the capacitance forming portion in the third direction, The multilayer electronic component according to claim 1 , wherein the margin portion contains Ba, Ti, and carbon fiber.