Method for manufacturing photoelectric conversion element

Abstract

To suppress unevenness in pigment density.SOLUTION: In a manufacturing method of a photoelectric conversion element 10 which is a dye-sensitized solar cell 10 formed by bonding a first substrate 20 and a second substrate 21 together, and a porous semiconductor layer 30 is formed on the first substrate 20, and a dye solution 32 containing dye 32C is printed on the first substrate 20 or the second substrate 21.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The technology disclosed in this specification relates to a method for manufacturing a photoelectric conversion element.

Background Art

[0002] A dye adsorption device used in the manufacture of a dye-sensitized solar cell, which is a type of photoelectric conversion element, is disclosed in Patent Document 1 below. The dye adsorption device described in Patent Document 1 is a dye adsorption device that adsorbs a dye onto a porous semiconductor layer formed on a surface to be treated of a substrate, and includes a nozzle that discharges a dye solution in which the dye is dissolved in a predetermined solvent, and a dye solution dropping and coating unit that drops and coats the dye solution from the nozzle onto the semiconductor layer on the substrate, a solvent evaporation and removal unit that evaporates and removes the solvent from the dye solution coated on the semiconductor layer on the substrate, and a rinse unit that washes away and removes unnecessary dye adhering to the surface of the semiconductor layer on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When manufacturing a dye-sensitized solar cell using the dye adsorption device described in Patent Document 1 above, the dye solution dropping and coating unit drops and coats the dye solution from the nozzle onto the semiconductor layer on the substrate. For this reason, on the semiconductor layer, there are portions where the dye solution is dropped and portions where the dye solution is not dropped, and there is a concern that unevenness in the dye concentration may occur between these portions. If unevenness in the dye concentration occurs in the semiconductor layer, there is a risk that the photoelectric conversion efficiency may decrease, and there is also a risk that the appearance quality may decrease.

[0005] The technology described in this specification has been completed based on the above circumstances, and aims to suppress unevenness in the shade of the dye.

Means for Solving the Problems

[0006] (1) The method for manufacturing a photoelectric conversion element related to the technology described in this specification is a method for manufacturing a photoelectric conversion element formed by bonding a first substrate and a second substrate, comprising forming a porous semiconductor layer on the first substrate, and printing a dye solution containing a dye on the first substrate or the second substrate.

[0007] (2) Further, in addition to the above (1), the method for manufacturing the photoelectric conversion element may include disposing a screen plate having an opening on the first substrate or the second substrate, supplying the dye solution onto the screen plate, and spreading the supplied dye solution with a squeegee.

[0008] (3) Further, in addition to the above (1) or (2), the method for manufacturing the photoelectric conversion element may include applying a sealing material in an annular shape on the substrate on which the dye solution is not printed among the first substrate and the second substrate, and supplying an electrolyte to the region surrounded by the sealing material.

[0009] (4) Further, in addition to any one of the above (1) to (3), the method for manufacturing the photoelectric conversion element may include printing the dye solution on the second substrate.

[0010] (5) Further, in addition to the above (4), the method for manufacturing the photoelectric conversion element includes applying a sealing material in an annular shape on the first substrate, supplying an electrolyte to the region surrounded by the sealing material, and selectively printing the dye solution such that a printed region where the dye solution is printed and a non-printed region where the dye solution is not printed alternately and repeatedly line up within the main surface of the second substrate.

[0011] (6) Further, in addition to the above (5), the method for manufacturing the photoelectric conversion element may print the dye solution so that both the printed area and the non-printed area form a strip extending along one direction within the main surface of the second substrate.

[0012] (7) Further, in addition to the above (5), the method for manufacturing the photoelectric conversion element may print the dye solution so that both the printed area and the non-printed area form a staggered grid pattern within the main surface of the second substrate.

[0013] (8) Further, in addition to any one of the above (1) to (3), the method for manufacturing the photoelectric conversion element may print the dye solution on the first substrate.

Advantages of the Invention

[0014] According to the technology described in this specification, unevenness in the density of the dye can be suppressed.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

Figure 23

Figure 24

Figure 25

Mode for Carrying Out the Invention

[0016] <Embodiment 1> Embodiment 1 will be described with reference to FIGS. 1 to 10. In the present embodiment, a dye-sensitized solar cell (photoelectric conversion element) 10 and a method for manufacturing the same are shown. Note that the X-axis, Y-axis, and Z-axis are shown in part of each drawing, and each axis direction is drawn so as to be the direction shown in each drawing.

[0017] As shown in FIG. 1, the dye-sensitized solar cell 10 includes a plurality (four in FIG. 1) of cells (unit cells) 11. The dye-sensitized solar cell 10 is configured such that a plurality of cells 11 are connected in series or in parallel according to the required output voltage. Note that the dye-sensitized solar cell 10 has electrodes and wirings for connecting the plurality of cells 11.

[0018] As shown in FIG. 2, the dye-sensitized solar cell 10 is configured by bonding a first substrate (semiconductor substrate, first support) 20 and a second substrate (opposing substrate, second support) 21. Both the first substrate 20 and the second substrate 21 are made of a glass material, a synthetic resin material, or the like, and have translucency and insulation properties. An electrolyte 22 and a seal portion 23 for sealing the electrolyte 22 are interposed between the first substrate 20 and the second substrate 21. The electrolyte 22 will be described in detail later.

[0019] As shown in FIG. 1, the seal portion 23 is provided in an annular shape so as to surround each of the plurality of cells 11. The seal portion 23 is made of a seal material 31 (see FIG. 5). The seal material 31 is, for example, an ultraviolet curable resin material (photo-curable resin material) or the like. The seal portion 23 has a grid shape when viewed in plan. Specifically, the seal portion 23 includes a frame-shaped portion 23A that overlaps the outer peripheral ends of the first substrate 20 and the second substrate 21 and forms a frame shape when viewed in plan, and a cross-shaped portion (partition portion) 23B that overlaps the central portions of the first substrate 20 and the second substrate 21 in the X-axis direction and the Y-axis direction and forms a cross shape when viewed in plan. The frame-shaped portion 23A surrounds all the cells 11 collectively. The cross-shaped portion 23B partitions between adjacent cells 11 in the X-axis direction and the Y-axis direction.

[0020] On the inner main surface of the first substrate 20 facing the second substrate 21, as shown in FIG. 2, a first electrode 24 and a photoelectric conversion layer 25 constituting the cell 11 are provided. The first electrode 24 is provided on the inner main surface of the first substrate 20. The photoelectric conversion layer 25 is provided so as to overlap the first electrode 24. The mutually laminated first electrode 24 and photoelectric conversion layer 25 are arranged in a plurality of sets (four sets in this embodiment) in a checkerboard pattern when viewed in plan on the inner main surface of the first substrate 20. The space between two adjacent sets of the first electrode 24 and photoelectric conversion layer 25 in the X-axis direction and the space between two adjacent sets of the first electrode 24 and photoelectric conversion layer 25 in the Y-axis direction are partitioned by the cross-shaped portion 23B of the seal portion 23.

[0021] The first electrode 24 is generally made of a material that can be used in a solar cell and has conductivity. Examples of the material used for the first electrode 24 include those containing at least one selected from the group consisting of indium tin composite oxide (ITO), tin oxide (SnO2), fluorine-doped tin oxide (FTO), zinc oxide (ZnO), and titanium oxide doped with tantalum or niobium.

[0022] The photoelectric conversion layer 25 includes a porous semiconductor and a dye (photosensitizer) 32C adsorbed on the porous semiconductor (see FIG. 9). Since the photoelectric conversion layer 25 shown in FIG. 2 contains the dye 32C, in FIG. 2, the cross section of the photoelectric conversion layer 25 is shaded. The type of semiconductor constituting the porous semiconductor is not particularly limited as long as it includes a porous semiconductor generally used as a photoelectric conversion material in the field of solar cells. Examples of the porous semiconductor include semiconductor compounds containing at least one selected from the group consisting of titanium oxide, zinc oxide, tin oxide, iron oxide, niobium oxide, cerium oxide, tungsten oxide, barium titanate, strontium titanate, cadmium sulfide, lead sulfide, zinc sulfide, indium phosphide, copper-indium sulfide (CuInS2), CuAlO2, and SrCu2O2. Among them, from the viewpoint of improving stability and safety, it is particularly preferable to use a porous semiconductor containing titanium oxide. The porous semiconductor may be composed of titanium oxide fine particles having a particle size within a predetermined numerical range.

[0023] As the dye contained in the photoelectric conversion layer 25, for example, one or more of various organic dyes or metal complex dyes having an absorption region in the visible light region or the infrared light region can be used. As the organic dye, for example, those containing at least one selected from the group consisting of azo dyes, quinone dyes, quinoneimine dyes, quinacridone dyes, squarylium dyes, cyanine dyes, merocyanine dyes, triphenylmethane dyes, xanthene dyes, porphyrin dyes, perylene dyes, indigo dyes, and naphthalocyanine dyes can be used. Generally, the extinction coefficient of the organic dye is larger than that of the metal complex dye in which the molecule is coordinated to the transition metal. As the metal complex dye, for example, those in which a metal is coordinated to the molecule can be used. As the molecule, for example, those containing at least one selected from the group consisting of porphyrin dyes, phthalocyanine dyes, naphthalocyanine dyes, and ruthenium dyes can be used. As the metal, for example, at least one selected from the group consisting of Cu (copper), Ni (nickel), Fe (iron), Co (cobalt), V (vanadium), Sn (tin), Si (silicon), Ti (titanium), Ge (germanium), Cr (chromium), Zn (zinc), Ru (ruthenium), Mg (magnesium), Al (aluminum), Pb (lead), Mn (manganese), In (indium), Mo (molybdenum), Y (yttrium), Zr (zirconium), Nb (niobium), Sb (antimony), La (lanthanum), W (tungsten), Pt (platinum), Ta (tantalum), Ir (iridium), Pd (palladium), Os (osmium), Ga (gallium), Tb (terbium), Eu (europium), Rb (rubidium), Bi (bismuth), Se (selenium), As (arsenic), Sc (scandium), Ag (silver), Cd (cadmium), Hf (hafnium), Re (rhenium), Au (gold), Ac (actinium), Tc (technetium), Te (tellurium), and Rh (rhodium) can be used. Among them, as the metal complex dye, it is preferable to use those in which a metal is coordinated to a phthalocyanine dye or a ruthenium dye, and it is particularly preferable to use a ruthenium-based metal complex dye.

[0024] On the inner main surface of the second substrate 21 facing the first substrate 20, a second electrode (counter electrode) 26 and a catalyst layer 27 that constitute the cell 11 are provided. The second electrode 26 is provided on the inner main surface of the second substrate 21. The catalyst layer 27 is provided so as to overlap the second electrode 26. The second electrode 26 and the catalyst layer 27 laminated on each other are arranged in a plurality of sets (four sets in this embodiment) in a checkerboard pattern when viewed in a plane on the inner main surface of the second substrate 21. Between two adjacent sets of the second electrode 26 and the catalyst layer 27 in the X-axis direction and between two adjacent sets of the second electrode 26 and the catalyst layer 27 in the Y-axis direction are partitioned by the cross-shaped portion 23B of the seal portion 23.

[0025] The second electrode 26 is generally made of a material that can be used in a solar cell and has conductivity. The second electrode 26 may be made of the same material as the first electrode 24, or may be made of a material different from the first electrode 24. The material of the second electrode 26 may be a material that does not have translucency. The second electrode 26 can be formed, for example, from a metal material containing at least one selected from the group consisting of titanium, tungsten, gold, silver, copper, aluminum, and nickel. Also, the second electrode 26 may be formed from a conductive carbon material such as carbon black or ketjen black. When a conductive carbon material is used for the second electrode 26, it may be formed integrally with the catalyst layer 27. The catalyst layer 27 is arranged to be interposed between the electrolyte 22 and the second electrode 26 described below, and is for activating the oxidation-reduction reaction of the electrolyte 22. The catalyst layer 27 can be constituted by, for example, at least one selected from the group consisting of platinum, graphite, carbon black, ketjen black, carbon nanotubes, graphene, and fullerenes.

[0026] The electrolyte 22 will be described. The electrolyte 22 according to this embodiment is a liquid substance containing redox species, that is, an electrolytic solution (liquid electrolyte). The electrolyte 22 contains, for example, I− and I3− as redox species. As the electrolyte 22, in addition to the above I− / I3− system, Br− - and so on are also included. - / I3− - system, Br− 2- / Br 3- system, Fe 2+ / Fe 3+ systems, quinone / hydroquinone systems, etc. can be used. The electrolyte 22 contains, in addition to the above-described redox species, a solvent (organic solvent), etc. Examples of the solvent contained in the electrolyte 22 include acetonitrile, ethanol, propanol, t-butanol, ethylene carbonate, methoxyacetonitrile, and the like. As shown in FIG. 2, the electrolyte 22 is individually sealed in a space partitioned for each cell 11 by the seal portion 23. By the ions contained in the electrolyte 22 moving between the photoelectric conversion layer 25 and the second electrode 26 that constitute each cell 11, the transport of electrons can be carried out.

[0027] This embodiment has the above-described structure, and subsequently, the operation of the dye-sensitized solar cell 10 will be described. When light such as sunlight is irradiated on the dye-sensitized solar cell 10, the dye contained in the photoelectric conversion layer 25 is excited by the light, and electrons in the dye transition from the ground state to the excited state. The electrons excited in the dye are injected into the conduction band of the semiconductor (for example, titanium oxide) of the photoelectric conversion layer 25 and move from the first electrode 24 through the external circuit to the second electrode 26. The dye oxidized by losing electrons receives electrons from the electrolyte 22 and is reduced to return to the dye in the ground state. At this time, the electrolyte 22 loses electrons and becomes oxidized (for example, when the electrolyte 22 is an I - / I3 - system, it becomes I3 - ). On the other hand, the electrons that have moved to the second electrode 26 are passed to the electrolyte 22 through the catalyst layer 27. At this time, the electrolyte 22 receives electrons and becomes reduced (for example, when the electrolyte 22 is an I - / I3 - system, it becomes I - ). By repeating the above cycle, light energy is converted into electrical energy.

[0028] Next, a method for manufacturing the dye-sensitized solar cell 10 will be described. As shown in FIG. 3, the method for manufacturing the dye-sensitized solar cell 10 includes a first substrate processing step of providing a predetermined structure on the first substrate 20, a second substrate processing step of providing a predetermined structure on the second substrate 21, a bonding step of bonding the first substrate 20 and the second substrate 21, and a seal material curing step of curing the seal material 31.

[0029] As shown in FIG. 3, the first substrate processing step includes a first electrode forming step of forming the first electrode 24 on the first substrate 20, a porous semiconductor layer forming step of forming the porous semiconductor layer 30 on the first substrate 20, a seal material coating step of coating the seal material 31, which is the material of the seal portion 23, on the first substrate 20, and an electrolyte dropping step of dropping the droplets 22LQ of the electrolyte 22 on the first substrate 20. On the other hand, the second substrate processing step includes a second electrode forming step of forming the second electrode 26 on the second substrate 21, a catalyst layer forming step of forming the catalyst layer 27 on the second substrate 21, a dye solution printing step of printing the dye solution 32 containing the dye 32C on the second substrate 21, and a drying step of drying the dye solution 32. Note that the first substrate processing step and the second substrate processing step also include steps of forming electrodes, wirings, etc. for connecting between the plurality of cells 11 on the first substrate 20 and the second substrate 21.

[0030] In the first electrode formation process included in the first substrate processing step, for example, by using a sputtering method or a spraying method, as shown in FIG. 4, a first electrode 24 is formed on the main surface of the first substrate 20. In the porous semiconductor layer formation process, a suspension containing semiconductor fine particles, which are the material of the porous semiconductor, is applied onto the first electrode 24, and at least one of drying and firing is performed, whereby a porous semiconductor layer 30 is formed on the first electrode 24. Note that since the porous semiconductor layer 30 shown in FIG. 4 does not contain a dye 32C, which will be described later, cross-hatching is not applied to the cross-section of the porous semiconductor layer 30. Specifically, first, semiconductor fine particles are suspended in an appropriate solvent to obtain a suspension. The obtained suspension is applied onto the first electrode 24 by a known method such as a doctor blade method, a squeegee method, a spin coating method, or a screen printing method. The temperature, time, atmosphere, etc. required for at least one of drying and firing of the suspension applied onto the first electrode 24 may be appropriately set according to the type of semiconductor fine particles. For example, it can be performed in an air atmosphere or an inert gas atmosphere in a temperature range of 50°C or higher and 800°C or lower for a time of 10 seconds or longer and 12 hours or shorter. Drying and firing of such a suspension can be performed, for example, once at a single temperature or two or more times with a temperature change.

[0031] In the seal material application process, as shown in FIG. 5, a seal material 31, which is the material of the seal portion 23, is applied onto the main surface of the first substrate 20 by a predetermined dispenser device. Specifically, when the seal material application process is performed, the seal material 31 is applied so as to form an annular shape surrounding the plurality of first electrodes 24 and the porous semiconductor layers 30 on the main surface of the first substrate 20. The application range of the seal material 31 at this time generally matches the formation range of the seal portion 23 shown in FIG. 1. Note that after the seal material application process, it is also possible to perform a pre-curing process of irradiating ultraviolet rays to the seal material 31 to a degree of semi-curing the seal material 31. In the electrolyte dropping process, droplets 22LQ of the electrolyte 22 are dropped onto the main surface of the first substrate 20 by a predetermined dispenser device. At this time, the droplets 22LQ of the electrolyte 22 are selectively dropped in predetermined amounts onto each of the plurality of regions surrounded by the annular seal material 31 on the main surface of the first substrate 20.

[0032] In the second electrode formation process included in the second substrate processing step, for example, by using a sputtering method or a spraying method, as shown in FIG. 6, a second electrode 26 is formed on the main surface of the second substrate 21. In the catalyst layer formation process, for example, by a PVC method, a vapor deposition method, a sputtering method, or the like, a catalyst layer 27 is formed on the second electrode 26.

[0033] Then, in the dye solution printing process, a dye solution 32 containing a dye 32C is printed on the catalyst layer 27 using a screen printing apparatus 40. The dye solution 32 used here is obtained by dissolving the dye 32C in a predetermined solvent at a predetermined concentration, and is preferably in a paste form, but is not necessarily limited thereto. Here, the configuration of the screen printing apparatus 40 will be described with reference to FIGS. 6 and 7. The screen printing apparatus 40 includes at least a screen plate 41, a frame-shaped frame 42 attached to the outer peripheral edge of the screen plate 41, and a squeegee 43 movable on the screen plate 41. The screen plate 41 has a main surface parallel to the main surface of the second substrate 21, which is the object to be printed, and is arranged so that the main surface faces the main surface of the second substrate 21 with a predetermined interval therebetween. The screen printing apparatus 40 also includes a stage or the like on which the second substrate 21 is placed. The screen plate 41 is larger in size when viewed in a plane than the second substrate 21. The screen plate 41 has openings 41A at positions overlapping with the respective catalyst layers 27 of the second substrate 21. The openings 41A are arranged in a plurality (four in this embodiment) in a grid pattern when viewed in a plane on the main surface of the screen plate 41. The screen plate 41 is manufactured by applying a photosensitive emulsion in a solid state to a base material formed by weaving fine metal wires in a mesh shape, selectively exposing the photosensitive emulsion, and then developing it. The non-formed portions of the photosensitive emulsion are the above-described openings 41A.

[0034] In the pigment solution printing process, as shown in FIG. 6, the pigment solution 32 is supplied onto a screen plate 41 disposed to face the main surface of the second substrate 21 with a predetermined interval therebetween. Then, by moving the squeegee 43 along the main surface on the screen plate 41, as shown in FIG. 8, the pigment solution 32 is spread on the screen plate 41. Then, the pigment solution 32 is selectively printed onto the catalyst layer 27 that overlaps the opening 41A through the opening 41A of the screen plate 41. The printed pigment solution 32 is disposed in a solid state over the entire area of the catalyst layer 27. That is, the printing area where the pigment solution 32 is printed within the main surface of the second substrate 21 coincides with the formation range of the catalyst layer 27. After finishing the printing of the pigment solution 32, the second substrate 21 is taken out from the screen printing apparatus 40. Thereafter, in the drying process, as shown in FIG. 9, the pigment solution 32 printed on the catalyst layer 27 is dried for a predetermined time in a predetermined temperature environment. After undergoing the drying process, the solvent contained in the pigment solution 32 volatilizes, and the pigment 32C remains adhered to the catalyst layer 27. The pigment 32C is adhered in a solid state over substantially the entire area on the catalyst layer 27.

[0035] After the first substrate processing step and the second substrate processing step are performed as described above, a bonding step is performed. In the bonding step, as shown in FIG. 10, the first substrate 20 coated with the sealing material 31 is placed on the lower side, and the second substrate 21 is placed so as to face the first substrate 20 on the upper side. Then, for example, the second substrate 21 is brought close to the first substrate 20 side for bonding. When the sealing material 31 on the first substrate 20 side comes into contact with the second substrate 21 during bonding, the space formed between the first substrate 20 and the second substrate 21 is partitioned by the sealing material 31, and each partitioned space (the space within each cell 11) is filled with the electrolyte 22. In each space partitioned by the sealing material 31, the dye 32C adhering on the catalyst layer 27 of the second substrate 21 dissolves in the solvent of the electrolyte 22 and diffuses into the solvent, and is gradually adsorbed on the surface of the porous semiconductor layer 30. In this way, the photoelectric conversion layer 25 is formed. Then, when the sealing material curing step is performed, ultraviolet rays with a predetermined emission intensity are irradiated from a light source that emits ultraviolet rays to the sealing material 31 for a predetermined time. The sealing material 31 irradiated with ultraviolet rays is completely cured to become the seal portion 23 as shown in FIG. 2. The electrolyte 22 within each cell 11 is sealed by the cured seal portion 23. In this way, the dye-sensitized solar cell 10 is manufactured.

[0036] As described above, in this embodiment, in the dye solution printing step included in the second substrate processing step, the dye solution 32 containing the dye 32C is printed on the second substrate 21 by the screen printing method. According to the screen printing method, the printing range of the dye solution 32 can be easily adjusted by setting the pattern related to the opening 41A of the screen plate 41. Specifically, the dye solution 32 is printed in a solid state on the catalyst layer 27 provided on the second substrate 21. Then, the dye 32C contained in the dye solution 32 printed on the second substrate 21 dissolves in the solvent of the electrolyte 22 and diffuses in the solvent in the bonding step. Here, the dye 32C that adhered in a solid state on the catalyst layer 27 is diffused uniformly over the entire area of the portion of the electrolyte 22 that overlaps with the porous semiconductor layer 30. Since the solvent of the electrolyte 22 enters the pores existing in large numbers on the surface of the porous semiconductor layer 30, the dye 32C diffused in the solvent also diffuses to every corner in the pores and is adsorbed evenly on the surface of the pores.

[0037] Here, conventionally, since the dye solution was dropped onto the semiconductor layer, there were portions on the semiconductor layer where the dye solution was dropped and portions where the dye solution was not dropped, and there was a risk of uneven shading of the dye between these portions. In particular, dyes with a large molecular size tend to travel easily along the vertical direction and hardly travel in the horizontal direction in the portion of the semiconductor layer where the dye solution is dropped, so the uneven shading of the dye tends to be strongly pronounced. In this regard, according to the present embodiment, since the dye solution 32 is printed in a solid state on the catalyst layer 27 provided on the second substrate 21, the dye 32C contained in the dye solution 32 can be uniformly adhered over substantially the entire porous semiconductor layer 30 facing the catalyst layer 27. As a result, uneven shading of the dye 32C hardly occurs in the porous semiconductor layer 30, so the photoelectric conversion efficiency in the photoelectric conversion layer 25 is improved and the appearance is also improved. Further, in the present embodiment, since the sealant application step and the electrolyte dropping step are included in the first substrate processing step, and the dye solution printing step and the drying step are included in the second substrate processing step, it is possible to process the sealant application step and the electrolyte dropping step and the dye solution printing step and the drying step in parallel. By performing parallel processing, the tact can be shortened.

[0038] As described above, the method for manufacturing the dye-sensitized solar cell (photoelectric conversion element) 10 according to the present embodiment is a method for manufacturing the dye-sensitized solar cell 10 formed by bonding the first substrate 20 and the second substrate 21, in which a porous semiconductor layer 30 is formed on the first substrate 20, and a dye solution 32 containing the dye 32C is printed on the first substrate 20 or the second substrate 21.

[0039] A porous semiconductor layer 30 is formed on the first substrate 20, and a dye solution 32 is printed on the first substrate 20 or the second substrate 21. Then, by bonding the first substrate 20 and the second substrate 21 together, the dye-sensitized solar cell 10 is manufactured. When the dye solution 32 is printed on the second substrate 21 as in this embodiment, as the first substrate 20 and the second substrate 21 are bonded together, the dye 32C is adsorbed onto the porous semiconductor layer 30. Thus, since the dye solution 32 is printed on the first substrate 20 or the second substrate 21, the printing range of the dye solution 32 can be easily adjusted, thereby making it difficult for unevenness in the density of the dye 32C to occur as in the conventional dropping method. As a result, the photoelectric conversion efficiency is improved and the appearance is also improved.

[0040] Also, a screen plate 41 having an opening 41A is disposed on the first substrate 20 or the second substrate 21, the dye solution 32 is supplied onto the screen plate 41, and the supplied dye solution 32 is spread by a squeegee 43. When the dye solution 32 supplied onto the screen plate 41 is spread by the squeegee 43, the dye solution 32 is printed onto the first substrate 20 or the second substrate 21 through the opening 41A of the screen plate 41. Thus, since the dye solution 32 is printed by the screen printing method, the printing range of the dye solution 32 can be easily adjusted by setting the pattern related to the opening 41A of the screen plate 41.

[0041] Also, a sealing material 31 is applied in an annular shape to the first substrate 20, which is the substrate on which the dye solution 32 is not printed, out of the first substrate 20 and the second substrate 21, and an electrolyte 22 is supplied to the region surrounded by the sealing material 31. When the first substrate 20 and the second substrate 21 are bonded together, the space between the two substrates 20, 21 is filled with the electrolyte 22 and the electrolyte 22 is sealed by a seal portion 23 made of the sealing material 31. It is possible to perform in parallel the process of printing the dye solution 32 on the first substrate 20 or the second substrate 21 and the process of applying the sealing material 31 to the first substrate 20, which is the substrate on which the dye solution 32 is not printed, out of the first substrate 20 and the second substrate 21 and supplying the electrolyte 22. Thereby, the tact can be shortened.

[0042] Further, a dye solution 32 is printed on the second substrate 21. After forming the porous semiconductor layer 30 on the first substrate 20 and printing the dye solution 32 on the second substrate 21, the first substrate 20 and the second substrate 21 are bonded together. Then, the dye 32C contained in the dye solution 32 printed on the second substrate 21 is adsorbed onto the porous semiconductor layer 30 formed on the first substrate 20.

[0043] <Embodiment 2> Embodiment 2 will be described with reference to FIGS. 11 to 17. This Embodiment 2 shows a case where the manufacturing procedure of the dye-sensitized solar cell 10 is changed. Note that redundant descriptions of the same structures, operations, and effects as those in Embodiment 1 described above are omitted.

[0044] In the manufacturing method of the dye-sensitized solar cell 10 according to this embodiment, as shown in FIG. 11, the first substrate processing step includes a first electrode formation step and a porous semiconductor layer formation step, and a dye solution printing step and a drying step, while the second substrate processing step includes a second electrode formation step and a catalyst layer formation step, and a seal material application step and an electrolyte dropping step. Hereinafter, the first substrate processing step and the second substrate processing step will be described.

[0045] In the second substrate processing step, as in Embodiment 1, when the second electrode formation step and the catalyst layer formation step are performed, as shown in FIG. 12, the second electrode 126 and the catalyst layer 127 are provided on the main surface of the second substrate 121. Then, when the seal material application step is performed, as shown in FIG. 13, the seal material 131 is applied in an annular shape surrounding each of the plurality of second electrodes 126 and catalyst layers 127 on the main surface of the second substrate 121. Subsequently, when the electrolyte dropping step is performed, droplets 122LQ of the electrolyte 122 are selectively dropped in predetermined amounts into each of the plurality of regions surrounded by the annular seal material 131 on the main surface of the second substrate 121.

[0046] In the first substrate processing step, as in Embodiment 1, when the first electrode forming step and the porous semiconductor layer forming step are performed, as shown in FIG. 14, a first electrode 124 and a porous semiconductor layer 130 are provided on the main surface of the first substrate 120. Subsequently, a dye solution printing step is performed. The screen plate 141 of the screen printing apparatus 140 used in the dye solution printing step has openings 141A at positions overlapping with the respective porous semiconductor layers 130 of the first substrate 120. The openings 141A are arranged in a grid pattern (four in this embodiment) when viewed in plan on the main surface of the screen plate 141 (see FIG. 7). In the dye solution printing step, the dye solution 132 is supplied onto the screen plate 141 arranged to face the main surface of the first substrate 120 with a predetermined interval therebetween. Then, by moving the squeegee 143 along the main surface on the screen plate 141, as shown in FIG. 15, the dye solution 132 is spread on the screen plate 141. Then, the dye solution 132 is selectively printed onto the porous semiconductor layer 130 overlapping with the opening 141A through the opening 141A of the screen plate 141. The printed dye solution 132 is distributed in a solid state over the entire area of the porous semiconductor layer 130. That is, the printing area where the dye solution 132 is printed within the main surface of the first substrate 120 coincides with the formation range of the porous semiconductor layer 130. In this way, the dye solution 132 printed on the porous semiconductor layer 130 enters the pores of the porous semiconductor layer 130, thereby promoting the diffusion of the dye 32C contained in the dye solution 132, and gradually the dye 32C is adsorbed on the surface of the porous semiconductor layer 130. After that, when a drying step is performed, as shown in FIG. 16, the solvent contained in the dye solution 132 printed on the porous semiconductor layer 130 volatilizes, and the dye 32C remains adsorbed on the surface of the porous semiconductor layer 130. In this manner, the photoelectric conversion layer 125 is formed.

[0047] After the first substrate processing step and the second substrate processing step are performed as described above, a bonding step is performed. In the bonding step, as shown in FIG. 17, the second substrate 121 coated with the sealing material 131 is placed on the lower side, and the first substrate 120 is placed so as to face the second substrate 121 from above. Then, for example, the first substrate 120 is brought close to the second substrate 121 side for bonding. When the sealing material 131 on the second substrate 121 side comes into contact with the first substrate 120 during bonding, the space formed between the first substrate 120 and the second substrate 121 is partitioned by the sealing material 131, and each partitioned space (the space in each cell 111) is filled with the electrolyte 122. Thereafter, when the sealing material curing step is performed, the sealing material 131 is completely cured as ultraviolet rays are irradiated onto the sealing material 131. In this way, the dye-sensitized solar cell 110 is manufactured.

[0048] As described above, in the present embodiment, in the dye solution printing step included in the first substrate processing step, the dye solution 132 containing the dye 32C is printed on the first substrate 120 by the screen printing method. According to the screen printing method, the printing range of the dye solution 132 can be easily adjusted by setting the pattern related to the opening 141A of the screen plate 141. Specifically, the dye solution 132 is printed in a solid state on the porous semiconductor layer 130 provided on the first substrate 120. Therefore, the dye 32C contained in the dye solution 132 printed on the first substrate 120 is diffused uniformly over the entire area of the porous semiconductor layer 130. Since the dye solution 132 enters the pores existing in large numbers on the surface of the porous semiconductor layer 130, the dye 32C contained in the dye solution 132 also diffuses to every corner inside the pores and is adsorbed evenly on the surface of the pores.

[0049] Here, conventionally, since the dye solution was dropped onto the semiconductor layer, there were portions on the semiconductor layer where the dye solution was dropped and portions where it was not, and there was a risk of unevenness in the density of the dye between these portions. In particular, dyes with large molecular sizes tend to travel easily along the vertical direction in the portion of the semiconductor layer where the dye solution is dropped and are difficult to travel horizontally, so the unevenness in the density of the dye tends to be strongly visible. In that regard, according to the present embodiment, since the dye solution 132 is printed in a solid state on the porous semiconductor layer 130 provided on the first substrate 120, the dye 32C contained in the dye solution 132 can be uniformly adhered over substantially the entire area of the porous semiconductor layer 130. As a result, unevenness in the density of the dye 32C is less likely to occur in the porous semiconductor layer 130, so the photoelectric conversion efficiency in the photoelectric conversion layer 125 is improved and the appearance is also improved. Further, in the present embodiment, since the dye solution printing step and the drying step are included in the first substrate processing step, and the sealant application step and the electrolyte dropping step are included in the second substrate processing step, it is possible to process the dye solution printing step and the drying step and the sealant application step and the electrolyte dropping step in parallel. By performing parallel processing, the tact can be shortened.

[0050] As described above, according to the present embodiment, the dye solution 132 is printed on the first substrate 120. After forming the porous semiconductor layer 130 on the first substrate 120, the dye solution 132 is printed on the porous semiconductor layer 130. Then, the dye 32C contained in the printed dye solution 132 is adsorbed by the porous semiconductor layer 130. Thereafter, the dye-sensitized solar cell 110 is manufactured by bonding the first substrate 120 and the second substrate 121 together.

[0051] <Embodiment 3> Embodiment 3 will be described with reference to FIGS. 18 to 23. This Embodiment 3 shows a case where the dye solution printing step in the above-described Embodiment 1 is changed. Note that redundant descriptions of the same structures, operations, and effects as those in the above-described Embodiment 1 are omitted.

[0052] In the screen printing apparatus 240 used in the dye solution printing step according to this embodiment, as shown in FIG. 18, a plurality of openings 241A are provided at positions overlapping each porous semiconductor layer 230 of the first substrate 220. The openings 241A form an elongated strip extending along the Y-axis direction in a portion of the screen printing plate 241 that overlaps the porous semiconductor layer 230, and a plurality of them are arranged side by side with an interval in the X-axis direction. The dimension (length dimension) of the opening 241A in the Y-axis direction is substantially the same as the dimension of the porous semiconductor layer 230 in the Y-axis direction. The dimension (width dimension) of the opening 241A in the X-axis direction is smaller than the dimension of the porous semiconductor layer 230 in the X-axis direction. The arrangement interval of the plurality of openings 241A (the interval between two adjacent openings 241A in the X-axis direction) is approximately equal to the dimension of the opening 241A in the X-axis direction.

[0053] In the dye solution printing step, the dye solution 232 is printed on the second substrate 221 using the screen printing plate 241 configured as described above. Specifically, as shown in FIG. 19, the dye solution 232 supplied onto the screen printing plate 241 is spread by the squeegee 243. At this time, the moving direction of the squeegee 243 coincides with, for example, the X-axis direction, that is, the width direction of the opening 241A. The dye solution 232 spread by the squeegee 243 is selectively printed onto the catalyst layer 227 that overlaps the opening 241A through the opening 241A of the screen printing plate 241, as shown in FIG. 20.

[0054] As shown in FIG. 21, the printed dye solution 232 forms an elongated strip extending along the Y-axis direction (one direction) on the catalyst layer 227, and a plurality of them are arranged side by side at intervals in the X-axis direction (a direction intersecting the one direction). That is, the dye solution 232 is selectively printed so that in the main surface of the second substrate 221, the printing region PA where the dye solution 232 is printed and the non-printing region NPA where the dye solution 232 is not printed are alternately repeated one by one along the X-axis direction. In FIG. 21, the printing region PA of the catalyst layer 227 is shown shaded, and the non-printing region NPA is shown in white. Both the printing region PA and the non-printing region NPA form strips extending along the Y-axis direction. The printing region PA is arranged at a position that overlaps the opening 241A of the screen plate 241 in a plan view. The non-printing region NPA is at a position that does not overlap the opening 241A of the screen plate 241 and is arranged at a position adjacent to the opening 241A in the X-axis direction (a position sandwiched between two openings 241A).

[0055] Thereafter, when the drying process is performed, as shown in FIG. 22, the solvent contained in the dye solution 232 printed on the catalyst layer 227 volatilizes, and the dye 232C remains in a state of adhering to the catalyst layer 227. The dye 232C selectively adheres to a plurality of printing regions PA on the catalyst layer 227. Then, when the bonding process is performed and the first substrate 220 and the second substrate 221 are bonded together, as shown in FIG. 23, the electrolyte 222 on the first substrate 220 side enters each non-printing region NPA among the printing regions PA and the non-printing regions NPA that alternately repeat side by side on the catalyst layer 227. Therefore, the electrolyte 222 comes into contact with the first surface 232C1 of the dye 232C facing the porous semiconductor layer 230 and the second surface 232C2 of the dye 232C facing the adjacent printing region PA in the X-axis direction among the dyes 232C existing in each printing region PA. Thus, since the contact area of the electrolyte 222 with respect to the dye 232C in the printing region PA becomes larger than that in the first embodiment, the dye 232C is more likely to dissolve in the solvent of the electrolyte 222, and the diffusion rate in the solvent becomes faster. As a result, the dye 232C dissolved in the electrolyte 222 diffuses more quickly into the pores of the porous semiconductor layer 230 and is adsorbed more quickly by the surface of the pores. Thereby, unevenness in the density of the dye 232C hardly occurs in the porous semiconductor layer 230, and the tact can be shortened.

[0056] As described above, according to the present embodiment, the sealing material 231 is applied to the first substrate 220 so as to form an annular shape, and the electrolyte 222 is supplied to the region surrounded by the sealing material 231. In the main surface of the second substrate 221, the dye solution 232 is selectively printed so that the printing region PA where the dye solution 232 is printed and the non-printing region NPA where the dye solution 232 is not printed are alternately repeated. When the dye solution 232 is printed on the second substrate 221, an arrangement is formed in which the printing region PA and the non-printing region NPA are alternately repeated. When the first substrate 220 and the second substrate 221 are bonded together, the electrolyte 222 on the first substrate 220 side enters the non-printing region NPA among the printing region PA and the non-printing region NPA that are alternately repeated on the main surface of the second substrate 221. As a result, the contact area of the electrolyte 222 with respect to the dye 232C (dye solution 232) in the printing region PA increases, so that the adsorption rate of the dye 232C to the porous semiconductor layer 230 on the first substrate 220 side is improved. Further, as the first substrate 220 and the second substrate 221 are bonded together, the electrolyte 222 is sealed by the seal portion 23 made of the sealing material 231.

[0057] Also, in the main surface of the second substrate 221, the dye solution 232 is printed so that both the printing region PA and the non-printing region NPA form a strip extending along one direction. When the dye solution 232 is printed on the second substrate 221, an arrangement is formed in which the printing region PA and the non-printing region NPA, both of which extend along one direction, are alternately repeated in a direction intersecting the extending direction. When the first substrate 220 and the second substrate 221 are bonded together, the electrolyte 222 on the first substrate 220 side enters the strip-shaped non-printing region NPA on the main surface of the second substrate 221. As a result, the contact area of the electrolyte 222 with respect to the dye 232C (dye solution 232) in the strip-shaped printing region PA adjacent to the non-printing region NPA increases.

[0058] <Embodiment 4> Embodiment 4 will be described with reference to FIG. 24 or FIG. 25. This Embodiment 4 shows a case where the dye solution printing process is changed from Embodiment 3 described above. Note that redundant descriptions of the same structures, operations, and effects as those in Embodiment 3 described above are omitted.

[0059] In the screen printing apparatus 40 used in the dye solution printing step according to the present embodiment, the screen plate 341 has a plurality of openings 341A provided in a staggered pattern in a plan view in a portion overlapping with the porous semiconductor layer 330, as shown in FIG. 24. Specifically, the openings 341A have a square planar shape and are arranged in a plurality with a predetermined interval in each of the X-axis direction and the Y-axis direction. FIG. 24 shows a case where the planar shape of the opening 341A is a square and each arrangement interval in the X-axis direction and the Y-axis direction is substantially equal to the length of one side of the opening 341A.

[0060] In the dye solution printing step, when the dye solution 332 is printed on the second substrate 321 using the screen plate 341 having the above-described configuration, the dye solution 332 forms a pattern as shown in FIG. 25. Specifically, the dye solution 332 printed on the second substrate 321 is arranged in a plurality with a predetermined interval in each of the X-axis direction and the Y-axis direction, as shown in FIG. 25. That is, the dye solution 332 is selectively printed in a staggered pattern (alternately repeating one by one along the X-axis direction and the Y-axis direction) with a printing region PA where the dye solution 332 is printed and a non-printing region NPA where the dye solution 332 is not printed in the main surface of the second substrate 321. In FIG. 25, the printing region PA of the catalyst layer 327 is shown shaded and the non-printing region NPA is shown white.

[0061] When the second substrate 321 printed with the dye solution 332 in this manner is bonded to the first substrate 20, the electrolyte 22 on the first substrate 20 side enters each non-printing area NPA among the printing areas PA and non-printing areas NPA arranged in a staggered lattice pattern on the catalyst layer 327 (see FIG. 23). Therefore, the electrolyte 22 contacts the first surface 332C1 of the dye 332C existing in each printing area PA that faces the porous semiconductor layer 30, the second surface 332C2 that faces the dye 332C existing in the adjacent printing area PA in the X-axis direction, and the third surface 332C3 that faces the dye 332C existing in the adjacent printing area PA in the Y-axis direction. In this way, since the contact area of the electrolyte 22 with respect to the dye 332C in the printing area PA becomes larger than that in the third embodiment, the dye 332C is more likely to dissolve in the solvent of the electrolyte 22, and the diffusion rate in the solvent becomes faster. As a result, the dye 332C dissolved in the electrolyte 22 diffuses more quickly into the pores of the porous semiconductor layer 30 and is adsorbed more quickly on the surface of the pores. This makes it difficult for unevenness in the concentration of the dye 332C to occur in the porous semiconductor layer 30 and enables further shortening of the tact.

[0062] As described above, according to the present embodiment, the dye solution 332 is printed so that both the printing area PA and the non-printing area NPA form a staggered lattice pattern within the main surface of the second substrate 321. When the dye solution 332 is printed on the second substrate 321, the printing areas PA and non-printing areas NPA, both of which form a staggered lattice pattern, are arranged in an alternating repeating pattern in two intersecting directions. When the first substrate 20 and the second substrate 321 are bonded together, the electrolyte 22 on the first substrate 20 side enters the non-printing area NPA that forms a staggered lattice pattern on the main surface of the second substrate 321. As a result, the contact area of the electrolyte 22 with respect to the dye solution 332 in the printing area PA that is adjacent to the non-printing area NPA and forms a staggered lattice pattern further increases.

[0063] <Other Embodiments> The technology disclosed in this specification is not limited to the embodiments described by the above description and drawings. For example, the following embodiments are also included in the technical scope.

[0064] (1) In Embodiments 1, 3, and 4, the sealing material 31, 231 may be applied to the second substrate 21, 221, 321 on which the dye solution 32, 232, 332 is printed, and the electrolyte 22, 222 may be dropped onto the second substrate 21, 221, 321 on which the dye solution 32, 232, 332 is printed.

[0065] (2) In Embodiment 2, the sealing material 131 may be applied to the first substrate 120 on which the dye solution 132 is printed, and the electrolyte 122 may be dropped onto the first substrate 120 on which the dye solution 132 is printed.

[0066] (3) In Embodiments 1 and 2, the size of the opening 41A, 141A in the screen plate 41, 141 (the size of the printing area PA) may be smaller than the size of each of the catalyst layer 27, 127 and the porous semiconductor layer 30, 130.

[0067] (4) In Embodiment 3, the arrangement interval of the openings 241A in the screen plate 241 (the arrangement interval of the printing area PA) may be larger or smaller than the width dimension of the opening 241A.

[0068] (5) In Embodiment 3, the moving direction of the squeegee 243 may coincide with the Y-axis direction, that is, the length direction of the opening 241A.

[0069] (6) In Embodiment 4, the planar shape of the opening 341A in the screen plate 341 (the planar shape of the printing area PA) may be rectangular. Also, the planar shape of the opening 341A in the screen plate 341 may be a shape other than a square (for example, a circle, an ellipse, a triangle, a polygon with five or more sides, etc.).

[0070] (7) In Embodiment 4, the arrangement intervals in the X-axis direction and the Y-axis direction of the openings 341A in the screen plate 341 (the arrangement intervals of the printing area PA) may be different from the length of one side of the opening 341A.

[0071] (8) In the pigment solution printing process, the pigment solutions 32, 132, 232, 332 may be printed using printing methods other than screen printing (such as letterpress printing, intaglio printing, lithographic printing, stencil printing, etc.).

[0072] (9) The specific method for forming the first electrodes 24, 124 in the first electrode formation process can be appropriately changed in addition to the above.

[0073] (10) The specific method for forming the second electrodes 26, 126 in the second electrode formation process can be appropriately changed in addition to the above.

[0074] (11) The specific method for forming the porous semiconductor layers 30, 130, 230 in the porous semiconductor layer formation process can be appropriately changed in addition to the above.

[0075] (12) The specific method for applying the sealing materials 31, 131, 231 in the sealing material application process can be appropriately changed in addition to the above.

[0076] (13) The specific method for dropping the electrolytes 22, 122, 222 in the electrolyte dropping process can be appropriately changed in addition to the above. Also, instead of the electrolyte dropping process, an electrolyte coating process for applying the electrolytes 22, 122, 222 may be performed. In addition, depending on the materials used for the electrolytes 22, 122, 222, the electrolyte dropping process can be appropriately changed.

[0077] (14) The specific method for forming the catalyst layers 27, 127, 227, 327 in the catalyst layer formation process can be appropriately changed in addition to the above.

[0078] (15) The specific method for bonding the first substrates 20, 120, 220 and the second substrates 21, 121, 221, 321 in the bonding process can be appropriately changed in addition to the above.

[0079] (16) For the specific materials of each electrode 24, 26, 124, 126, catalyst layer 27, 127, 227, 327, porous semiconductor layer 30, 130, 230, sealing material 31, 131, 231, dye solution 32, 132, 232, 332 and dye 32C, 232C, 332C, in addition to the above, they can be appropriately changed as needed.

[0080] (17) Each substrate 20, 21, 120, 121, 220, 221, 321 may be made of a synthetic resin material in addition to a glass material.

[0081] (18) The electrolyte 22, 122, 222 may be a solid (solid electrolyte) or a gel (gel electrolyte, molten salt gel electrolyte), etc., in addition to a liquid.

[0082] (19) The sealing material 31, 131, 231 may be composed of a photocurable resin material having the property of being cured by light with a wavelength other than ultraviolet light, or may be composed of a thermosetting resin material. When changing the sealing material 31, 131, 231, the sealing material curing process may be changed according to the properties of the sealing material 31, 131, 231.

[0083] (20) The planar shape of the cell 11 provided in the dye-sensitized solar cell 10, 110 can be appropriately changed in addition to those shown in the figure. The planar shape of the cell 11 may be, for example, a vertically long rectangle, a horizontally long rectangle, etc.

[0084] (21) The number of cells 11 provided in the dye-sensitized solar cell 10, 110 can be appropriately changed in addition to those shown in the figure. For example, the dye-sensitized solar cell 10, 110 may have a configuration including a single cell 11.

Explanation of Reference Numerals

[0085] 10,110…Dye-sensitized solar cell (photoelectric conversion element), 20,120,220…First substrate, 21,121,221,321…Second substrate, 22,122,222…Electrolyte, 30,130,230…Porous semiconductor layer, 31,131,231…Sealing material, 32,132,232,332…Dye solution, 32C,232C,332C…Dye, 41,141,241,341…Screen plate, 41A,141A,241A,341A…Opening, 43,143,243…Squeegee, PA…Printing area, NPA…Non-printing area

Claims

1. A method for manufacturing a photoelectric conversion element formed by laminating a first substrate and a second substrate, wherein a porous semiconductor layer is formed on the first substrate, and a dye solution containing a dye is printed on the first substrate or the second substrate.

2. The method for manufacturing a photoelectric conversion element according to claim 1, wherein a screen plate having an opening is disposed on the first substrate or the second substrate, the dye solution is supplied onto the screen plate, and the supplied dye solution is spread by a squeegee.

3. The method for manufacturing a photoelectric conversion element according to claim 1 or claim 2, wherein a sealing material is applied in an annular shape to the substrate on which the dye solution is not printed among the first substrate and the second substrate, and an electrolyte is supplied to a region surrounded by the sealing material.

4. The method for manufacturing a photoelectric conversion element according to claim 1 or claim 2, wherein the dye solution is printed on the second substrate.

5. A sealing material is applied in an annular shape to the first substrate, and an electrolyte is supplied to a region surrounded by the sealing material, and the dye solution is selectively printed so that a printing region where the dye solution is printed and a non-printing region where the dye solution is not printed are alternately repeated in the main surface of the second substrate. The method for manufacturing a photoelectric conversion element according to claim 4.

6. The method for manufacturing a photoelectric conversion element according to claim 5, wherein the dye solution is printed so that both the printing region and the non-printing region form a strip extending along one direction in the main surface of the second substrate.

7. The method for manufacturing a photoelectric conversion element according to claim 5, wherein the dye solution is printed so that both the printing region and the non-printing region form a staggered grid in the main surface of the second substrate.

8. The method for manufacturing a photoelectric conversion element according to claim 1 or claim 2, wherein the dye solution is printed on the first substrate.

Images