Bonding resin and method for manufacturing the same

Abstract

To provide a bonding resin that enables a plurality of substrates to be joined together accurately, easily and firmly, and a method for manufacturing the same.SOLUTION: A bonding resin 1 according to one aspect of the present invention has a first resin plate 2 and a second resin plate 3, the first resin plate having a first bonding surface 21 for overlapping and integrally bonding with the second resin plate, the second resin plate having a second bonding surface 31 for overlapping and integrally bonding with the first resin plate, and an outer peripheral part 22 and a protrusion 4 are formed on at least one of the first resin plate and the second resin plate, and the first resin plate and the second resin plate are positioned by the protrusion.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a bonding resin and a method for producing the same.

Background Art

[0002] Bonding resins produced by bonding two or more substrates are used in various fields. For example, microchannel chips used in fields such as analysis in medicine, synthesis of compounds, and environmental measurement are typical examples.

[0003] A microchannel chip is formed by bonding two substrates, at least one of which has fine microchannel grooves formed thereon, to form a channel through which a reagent or the like can flow. By injecting a reagent or a specimen into this channel and performing separation, analysis, or detection on the reagent or the like, necessary information can be obtained.

[0004] As a known technique for this microchannel chip, for example, Patent Document 1 below discloses a technique for firmly bonding substrates together. In this technique, pins are provided on one substrate, and through-holes for penetrating these pins are formed on the other substrate, and the substrates are to be firmly bonded together by penetrating the pins through the through-holes.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, when combining unevenness such as pins and through holes as in the technology described in Patent Document 1 above, there is a problem that the design accuracy must be high. For example, when using resin for a substrate (resin substrate), it is common to form the resin substrate using a mold such as a die. However, the deformation of the resin substrate that occurs during demolding of this molding cannot be ignored, and there remains a problem in the accuracy of bonding.

[0007] In addition, when bonding two resins, there is a problem that it becomes easy to peel off when a force is applied to the outer peripheral portion thereof.

[0008] Therefore, in view of the above problems, an object of the present invention is to provide a bonding resin and a method for manufacturing the same that can accurately, easily, and firmly combine a plurality of substrates with each other.

Means for Solving the Problems

[0009] The bonding resin according to one aspect of the present invention for solving the above problems has a first resin plate and a second resin plate. The first resin plate has a first bonding surface for integrally bonding with the second resin plate by overlapping. The second resin plate has a second bonding surface for integrally bonding with the first resin plate by overlapping. At least one of the first resin plate and the second resin plate is formed with an outer peripheral portion and protrusions, and the first resin plate and the second resin plate are positioned by the protrusions.

[0010] In addition, in this aspect, although not limited, it is preferable that at least one of the first resin plate and the second resin plate is arranged so as to engage with the protrusion.

[0011] In addition, in this aspect, although not limited, it is preferable that a plurality of protrusions are provided.

[0012] In addition, in this aspect, although not limited, it is preferable that the height of at least any one of the plurality of protrusions is the maximum height in the first resin plate.

[0013] Also, from this perspective, although not necessarily limited, it is preferable that the protrusion has a taper at least at one location.

[0014] Also, from this perspective, although not necessarily limited, it is preferable that at least three or more protrusions are provided such that the extension lines of the boundary lines form a closed shape.

[0015] Also, from this perspective, although not necessarily limited, at least one of the first resin and the second resin is preferably any one of polycarbonate, polymethyl methacrylate, cycloolefin polymer, cyclic olefin copolymer, polystyrene, polyethylene terephthalate, and silicone rubber.

[0016] Moreover, a method for manufacturing a bonding resin according to another aspect of the present invention is a method for manufacturing a bonding resin that bonds a first resin plate and a second resin plate. The first resin plate has a first bonding surface for integrally bonding with the second resin plate when overlapped, and the second resin plate has a second bonding surface for integrally bonding with the first resin plate when overlapped. At least one of the first resin plate and the second resin plate has an outer peripheral portion and protrusions formed thereon, and the first resin plate and the second resin plate are positioned by the protrusions.

Advantages of the Invention

[0017] As described above, the present invention can provide a bonding resin and a method for manufacturing the same that can accurately, easily, and firmly combine a plurality of substrates with each other.

Brief Description of the Drawings

[0018]

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Embodiments for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention can be implemented in many different forms and is not limited only to the specific examples described in the following embodiments and examples.

[0020] (Bonding Resin) Figs. 1 to 4 are diagrams showing an overview of the bonding resin (hereinafter referred to as "this bonding resin") 1 according to the present embodiment. Specifically, Fig. 1 is a perspective view of the bonding resin 1, Fig. 2 is a plan view of the bonding resin 1 (when viewed from the side of the first resin plate 2), Fig. 3 is a plan view of one resin plate (the first resin plate 2) (a view when the first bonding surface 21 is seen), and Fig. 4 is a plan view of the other resin plate (the second resin plate 3) (a view when the second bonding surface 31 is seen).

[0021] As shown in these figures, the bonding resin 1 has a first resin plate 2 and a second resin plate 3. The first resin plate 2 has a first bonding surface 21 for integrally bonding with the second resin plate 3 by overlapping. The second resin plate 3 has a second bonding surface 31 for integrally bonding with the first resin plate 2 by overlapping. At least one of the first resin plate 2 and the second resin plate 3 has an outer peripheral portion 22, 32 and a protrusion 4 formed thereon (in the examples of Figs. 1 to 4, an example in which the outer peripheral portion and the protrusion are formed on both the first resin plate 2 and the second resin plate 3 is shown). The first resin plate 2 and the second resin plate 3 are positioned by the protrusion 4, which is a characteristic feature of this invention.

[0022] As is clear from the above description, the bonding resin 1 is formed by bonding the first resin plate 2 and the second resin plate 3 together. The bonding resin 1 is not particularly limited as long as it is formed by bonding a plurality of resin plates in this way. For example, a microchannel chip used in fields such as analysis in medicine, synthesis of compounds, and environmental measurement can be cited as a typical example.

[0023] Also, as described above, the first resin plate 2 in the bonding resin 1 is combined with the second resin plate 3 and is a plate-shaped member formed of resin as the name implies. The first resin plate 2 has a first bonding surface 21 for integrally bonding with the second resin plate 3 by overlapping, and has a first outer peripheral portion 22 on its outer side.

[0024] Also, as is clear from the above description, the first joint surface 21 on the first resin plate 2 is a flat surface formed on the first resin plate 2. By having this flat joint surface, the first resin plate 2 can be joined to the second resin plate 3. Specifically, a second joint surface 31 similar to the first joint surface 21 is also formed on the second resin plate 3, and the two joint surfaces can be joined together to be integrated. Incidentally, as will be described later, it is preferable that flow path grooves 211 and the like are formed in the first joint surface 21.

[0025] On the other hand, as described above, the second resin plate 3 in the present bonded resin 1 is combined with the first resin plate 2 and has a second joint surface 31 that is bonded to the first joint surface 21, and an outer peripheral portion 32 is provided on the outside thereof. That is, the first resin plate 2 and the second resin plate 3 are common in this configuration (however, when no protrusion 4 is formed on the resin plate, the outer peripheral portion may not be provided).

[0026] In the present bonded resin 1, the first resin plate 2 and the second resin plate 3 are common in that they have a joint surface and, in some cases, an outer peripheral portion as described above. The differences between them are only the shapes and arrangements of the formed flow paths, protrusions, etc. That is, the "first" and "second" in the first resin plate 2 and the second resin plate 3 are merely ordinal numbers used to distinguish the resin plates to be combined and do not include any special technical meaning. If one is arbitrarily defined as the first resin plate 2, the other will automatically become the second resin plate 3. However, in the present embodiment, for the sake of easy understanding, the first resin plate 2 and the second resin plate 3 will be specifically specified and described respectively. Also, the meanings of this "first" and "second" are the same for the joint surface and the outer peripheral portion.

[0027] As described above, the first resin plate 2 and the second resin plate 3 are made of resin. The resin may be a thermoplastic resin or a thermosetting resin. However, from the viewpoint that it can be softened by heating, injected into a predetermined mold, then hardened by cooling or the like, and further easily formed into a desired shape by removing (releasing) it from this mold, it is preferably a thermoplastic resin. As the thermoplastic resin, although it can be appropriately adjusted according to its dimensions and uses, for example, it is preferably at least one of polycarbonate, polymethyl methacrylate, cycloolefin polymer, cyclic olefin copolymer, polystyrene, polyethylene terephthalate, and silicone rubber.

[0028] Also, in the present bonding resin 1, it is preferable that a flow path groove 211 is formed on the first bonding surface 21 of the first resin plate 2. By forming the flow path groove 211, it is possible to form a flow path when bonding to the second resin plate 3, and by flowing a reagent or the like through this flow path, desired processes such as separation, analysis, and detection can be performed on the reagent or the like. Further, on the first bonding surface 21 of the first resin plate 2, in addition to the flow path groove 211, it is also possible to form a recess 212 that becomes a closed groove space not connected to the injection port 23, the discharge port 24, etc. In the examples of FIGS. 1 to 4, an example is shown in which no flow path groove and recess are formed on the second bonding surface 31 of the second resin plate 3, but it is of course possible to provide a flow path groove and a recess in these.

[0029] In addition, it is preferable that the first resin plate 2 of the bonding resin 1 is formed with an injection port 23 and a discharge port 24 connected to the flow path groove 211. By connecting these injection port 23 and discharge port 24 to the flow path groove 211, it becomes possible to flow (inject and discharge) a reagent or the like from the outside of the bonding resin 1. When providing the injection port 23 and the discharge port 24, since it is necessary to connect the flow path groove 211 to the outside of the bonding resin 1, for example, in the first resin plate 2 in which the flow path groove 211 is formed, it is preferably formed so as to penetrate the surface opposite to the surface on which the first bonding surface 21 of the first resin plate 2 is formed (corresponding to the example shown in FIGS. 1 to 4). However, the injection port 23 and the discharge port 24 do not necessarily have to be provided on the side where the flow path groove 211 is formed. As long as they can be connected to the flow path groove 211, they may be formed on the side of the second resin plate 3 opposite to the first resin plate 2 in which the flow path groove 211 is formed. In this case, it is preferable to form an injection port and a discharge port connected to the flow path groove so as to penetrate the surface opposite to the second connection surface 31 of the second resin plate 3.

[0030] In addition, a first outer peripheral portion 22 is formed on the first resin plate 2 of the bonding resin 1. Here, the "first outer peripheral portion" refers to a portion other than the first bonding surface 21 that does not bond to the second resin plate 3 on the surface of the first resin plate 2 on the side where the first bonding surface 21 is formed, and is also the portion where the protrusion 4 is formed. Specifically, since the first bonding surface 21 of the first resin plate 2 is bonded to the second bonding surface 31 of the second resin plate 3 at the central portion thereof, in the first resin plate 2, the surrounding portion not used for bonding to the second resin plate 3 is called the first outer peripheral portion. Note that "first" is an ordinal number used to distinguish these because, as described above, it may also be formed on the second resin plate 3, and does not include a special technical meaning. That is, since the second bonding surface 31 of the second resin plate 3 is bonded to the first bonding surface 21 of the first resin plate 2 at the central portion thereof, in the second resin plate 3, the surrounding portion not used for bonding to the first resin plate 2 will be called the second outer peripheral portion. However, as will be clear from the description below, when the protrusion 4 is not formed, it is not always necessary to provide an outer peripheral portion on the resin plate.

[0031] In addition, on the first resin plate 2 of the bonding resin 1, more specifically on the first outer peripheral portion 22, protrusions 4 are arranged. By providing the protrusions 4 on the first outer peripheral portion 22, the protrusions 4 are configured to intermittently surround the first bonding surface 21 and the second bonding surface 31, enabling reliable positioning of the first resin plate 2 and the second resin plate 3 and ensuring the stability of their bonding. Here, the "protrusion" refers to a portion that rises higher than the first bonding surface 21 and the second bonding surface 31. Fig. 5 shows an enlarged partial view of the area around the protrusion 4 formed on the first resin plate 2, and Fig. 6 shows an enlarged partial side view when the first resin plate 2 and the second resin plate 3 are bonded together.

[0032] As described above, the first resin plate 2 and the second resin plate 3 are positioned by the protrusions 4 of the bonding resin 1. This positioning is not limited, but it is preferable that at least one of the first resin plate 2 and the second resin plate 3 is arranged so as to engage with the protrusions 4. More specifically, when the protrusions 4 are formed on the first resin plate 2, it is preferably arranged to engage with the second resin plate 3, and when the protrusions 4 are formed on the second resin plate 3, it is preferably arranged to engage with the first resin plate 2. By doing so, the protrusions 4 and the resin plate facing the resin plate on which the protrusions 4 are formed engage with each other, restricting the positions of the resin plates with respect to each other and enabling positioning. More specifically, the protrusions 4 preferably have a clear boundary line 41 in the raised portion. By having the boundary line 41, its position can be determined more reliably, and the other resin plate can be aligned along this boundary line 41. Here, the "boundary line" refers to the line formed at the base of the protrusions 4. Of course, it is also preferable that the protrusions 4 are provided on both the first resin plate 2 and the second resin plate 3.

[0033] In addition, since the protrusions 4 of the present bonding resin 1 are for positioning the first resin plate 2 and the second resin plate 3, it is preferable that a plurality of them are provided instead of just one. By doing so, the positions of the first resin plate 2 and the second resin plate 3 can be restricted from a plurality of directions, enabling the positioning of the first resin plate 2 and the second resin plate 3. In the examples of FIGS. 1 to 4, an example is shown where two protrusions are provided on each of the first resin plate 2 and the second resin plate 3. However, as shown in the examples of FIGS. 7 and 8, it is also possible to provide the outer peripheral portion 32 and the protrusions 4 only on one of the resin plates (for example, only on the second resin plate 3). Note that FIG. 7 is a plan view of another example of the present bonding resin 1, and FIG. 8 is a side view thereof.

[0034] Also, although not limited, it is preferable that at least three or more protrusions 4 of the present bonding resin 1 are provided such that the extension lines of the boundary lines 41 thereof form a closed shape. Furthermore, it is more preferable that these three or more protrusions 4 are provided on one of the resin plates. By doing so, a closed region surrounded by the extension lines 411 of the boundary lines 41 of the protrusions 4 is formed, and the other resin plate is stably positioned within this closed region. For example, in the examples shown in FIGS. 7 and 8, a closed square S formed by the boundary lines 41 of the plurality of protrusions 4 is shown. The image in this case is shown in FIG. 9. When described on both the first resin plate 2 and the second resin plate 3, it is preferable that the extension lines form a closed shape when the boundary lines 41 of the protrusions 4 formed on both the first resin plate 2 and the second resin plate 3 are combined.

[0035] As another example of the present bonding resin 1, FIG. 10 shows a view when the first resin plate 2 and the second resin plate 3 are in a disc shape and a circular protrusion 4 is provided on the outer peripheral portion of the second resin plate 3. In the figure, (A) is an overall perspective view, (B) is a plan view of the first resin plate 2, and (C) is a plan view of the second resin plate 3. By doing so, the same effects as in the above examples can be obtained. In this figure, an example is shown where the protrusion 4 is formed over the entire outer peripheral portion of the second resin plate 3.

[0036] Also, as yet another example of the bonding resin 1, FIG. 11 shows a case where the first resin plate 2 and the second resin plate 3 are trapezoidal, and a plurality (three places) of protrusions 4 are provided on the second outer peripheral portion 32 of the second resin plate 3. In the figure, (A) is an overall perspective view, (B) is a plan view of the first resin plate 2, and (C) is a plan view of the second resin plate 3, respectively. By doing so, the same effects as in the above example can be obtained. That is, the bonding resin 1 can adopt various shapes, and the shape and number of arrangements of the protrusions 4 can be appropriately adjusted according to the shape and the like. In the example of this figure, the first outer peripheral portion 21 is not formed on the first resin plate 2.

[0037] Further, in the bonding resin 1, it is preferable that the protrusion 4 has a taper at at least one location. More specifically, it is preferable that its cross section (the cross section cut along the direction perpendicular to the extending direction of the protrusion 4) is triangular or trapezoidal. By doing so, for example, when the other resin plate (the first resin plate 2) contacts the triangular slope of the protrusion 4 of the second resin plate 3, the first resin plate 2 slides down the triangular slope and is firmly guided to its base. The image in this case is shown in FIG. 12.

[0038] In addition, in the present bonding resin 1, it is preferable that the height of at least any one of the plurality of protrusions 4 is the maximum height in the resin plate on which the protrusions 4 are formed. This is important for positioning the resin plates, and it also has a great effect on manufacturing. Specifically, the resin plate is formed by injecting softened resin into a mold. When removing (releasing) the resin plate from the mold, the resin will inevitably be bent. This bending will affect the accuracy of the resin plate (for example, it may affect the flatness of the bonding surface and the outer peripheral portion). However, if the portion that is in contact with the mold until the end becomes the protrusion 4 with this maximum height, it becomes possible to concentrate the stress generated during demolding on this protrusion 4, and it becomes possible to make it difficult for other portions such as the bonding surface to be distorted. The image in this case is shown in FIG. 13. However, it is preferable that the height of this protrusion 4 is thinner than the thickness of the opposing resin plate. When it is thicker than the thickness of the opposing resin plate, when bonding, this protrusion 4 will be higher than the opposing resin plate, and problems such as having to reduce the area of the surface pressing the resin plates will occur. Therefore, by making it thinner than the opposing resin plate, it becomes possible to press the resin plates against each other with a pressing mechanism larger than the area of the resin plates. As described above, when removing the resin from the mold, there is a risk that the resin will be bent due to the resistance of the contact portion between the mold and the resin. The image in this case is shown in FIG. 14. Thus, when the protruding portion of the mold is in the middle portion of the resin and the protruding portion is large, bent and deformed portions of the resin will occur on both sides of the formed recess. That is, by making the height of at least any one of the plurality of protrusions 4 the maximum height in the resin plate on which the protrusions 4 are formed, like the present bonding resin 1, it becomes possible to suppress this bending.

[0039] (Method for manufacturing bonding resin) Here, a method for manufacturing the present bonding resin 1 (hereinafter referred to as "the present manufacturing method") will be described. As is clear from the above description, the present manufacturing method is a method for manufacturing a bonding resin for bonding the first resin plate 2 and the second resin plate 3. The first resin plate 2 has a first bonding surface 21 for being superposed on and integrally bonded to the second resin plate 3. The second resin plate 3 has a second bonding surface 31 for being superposed on and integrally bonded to the first resin plate 2. At least one of the first resin plate 2 and the second resin plate 3 has outer peripheral portions 22, 23 and protrusions 4 formed thereon, and the first resin plate 2 and the second resin plate 3 are positioned by the protrusions 4. This is the characteristic feature. Thereby, the present bonding resin 1 can be manufactured.

[0040] As described above, according to the present bonding resin, it is possible to provide a bonding resin and a method for manufacturing the same that can accurately, easily, and firmly combine a plurality of substrates with each other. More specifically, by providing protrusions, it is possible to engage with the other resin plate and accurately perform positioning. Moreover, since positioning can be achieved simply by applying the other resin plate against the protrusions, it is easy, and there is almost no labor as in the known technique where pins and through holes are provided on different resin plates and these must be accurately fitted together. Further, by forming the protrusions on the outer peripheral portion, it is possible to reduce the risk that the distortion affects the bonding surface near the center by concentrating the distortion when forming the resin plate using a mold or the like. That is, there is an advantage that the accuracy can be maintained higher.

[0041] It should be noted that the present bonding resin can be configured in various patterns as described above. Needless to say, in addition to the examples shown above, combinations of resin plates as shown in FIGS. 15 and 16 are also possible. In each figure, (A) shows an overall perspective view, (B) shows a plan view of the first resin plate 2, and (C) shows a plan view of the second resin plate 3. In the example of this figure, the first resin plate 2 is not provided with protrusions 4 and the first bonding surface has an H shape with a pair of recesses, while in the second resin plate 3, this recessed portion becomes the second outer peripheral portion 31 and protrusions 4 are formed on this outer peripheral portion 31.

Industrial Applicability

[0042] The present invention has industrial applicability as a bonding resin and a method for producing the same.

Explanation of Signs

[0043] 1... Bonding resin 2... First resin plate 21... First bonding surface 211... Flow path groove 212... Recess 22... First outer periphery 23... Injection port 24... Discharge port 3... Second resin plate 31... Second bonding surface 32... Second outer periphery 4... Projection 41... Boundary line 411... Extension line

Claims

1. having a first resin plate and a second resin plate, the first resin plate has a first joint surface for integrally joining with the second resin plate in an overlapping manner, the second resin plate has a second joint surface for integrally joining with the first resin plate in an overlapping manner, at least one of the first resin plate and the second resin plate has an outer peripheral portion and protrusions formed thereon, the joining resin, characterized in that the first resin plate and the second resin plate are positioned by the protrusions.

2. The joining resin according to claim 1, wherein at least one of the first resin plate and the second resin plate is arranged so as to engage with the protrusions.

3. The joining resin according to claim 1, wherein a plurality of the protrusions are provided.

4. The joining resin according to claim 3, wherein the height of at least any one of the plurality of protrusions is the maximum height in the first resin plate or the second resin plate.

5. The joining resin according to claim 1, wherein the protrusions are tapered at at least one location.

6. The joining resin according to claim 3, wherein at least three or more of the protrusions are provided such that the extension lines of the boundary lines form a closed shape.

7. A method for manufacturing a joining resin for joining a first resin plate and a second resin plate, the first resin plate has a first joint surface for integrally joining with the second resin plate in an overlapping manner, the second resin plate has a second joint surface for integrally joining with the first resin plate in an overlapping manner, at least one of the first resin plate and the second resin plate has an outer peripheral portion and protrusions formed thereon, A method for manufacturing a joining resin, characterized in that the first resin plate and the second resin plate are positioned by the protrusions.

Images