Display device and device using them

By optimizing the layout of metal and peripheral metal layers with specific width constraints and additional separation regions, the display device addresses the issue of increased electrode resistance, enhancing stability and efficiency.

JP2025094445APending Publication Date: 2025-06-25CANON KK
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Patent Information

Application Number
JP2023209996
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-13
Publication Date
2025-06-25

AI Technical Summary

Technical Problem

In display devices with an optical resonator structure, the layout of the reflective layer between the display and peripheral regions leads to increased resistance in the upper electrode due to thinning, which is not addressed in existing technologies.

Method used

The display device is designed with a specific layout where a first region separating the metal and peripheral metal layers has a width equal to or less than twice the film thickness of the insulating layer, and additional regions are introduced to further reduce conduction and electrode resistance.

Benefits of technology

This configuration effectively reduces the resistance of the upper electrode and minimizes conduction issues, ensuring stable and efficient operation of the display device.

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Abstract

To provide a display device capable of reducing an increase of a resistance of an upper part electrode.SOLUTION: A display device includes: a display region; and a peripheral region to be distributed to a circumference of the display region on the substrate. From the substrate side, the display region includes at least a metal layer, an insulation film, a lower electrode, a light emission layer, and an upper electrode in this order. From the substrate side, the peripheral region includes at least a peripheral metal layer, a peripheral insulation layer, in this order. In a plan view to the substrate, a first region for separating the metal layer and the peripheral metal layer is arranged to between the metal layer and the peripheral metal layer. In a cross section passing through the substrate, the display region, and the peripheral region, a width of the first region is two times or less of a film thickness of the peripheral insulation layer.SELECTED DRAWING: Figure 1
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Description

Technical Field

[0001] The present invention relates to a display device and a device using the same.

Background Art

[0002] In recent years, an optical resonator structure may be used in an organic electroluminescence element (hereinafter also referred to as an "organic EL element", an "organic light-emitting element", a "display device", or an "organic device"). In an organic device having an optical resonator structure, light emitted from the organic device passes through an anode (positive electrode), and the transmitted light is reflected by a reflective layer. The light emitted from the organic device and the reflected light interfere with each other and reinforce each other, thereby improving the light emission efficiency of the organic device. Patent Document 1 describes a display device having an optical resonator structure.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the display device described in Patent Document 1, there is no disclosure regarding the layout of the reflective layer in the region between the display region and the peripheral region. Therefore, the upper electrode may be easily thinned in the region between the display region and the peripheral region. In other words, in the display device described in Patent Document 1, the resistance of the upper electrode tends to increase.

[0005] The present invention has been made in view of the above problems, and an object thereof is to reduce an increase in the resistance of the upper electrode.

Means for Solving the Problems

[0006] The display device according to the present invention is a display device having a display area and a peripheral area arranged around the display area on a substrate. From the substrate side, the display area has at least a metal layer, an insulating film, a lower electrode, a light-emitting layer, and an upper electrode in this order. From the substrate side, the peripheral area has at least a peripheral metal layer and a peripheral insulating layer in this order. In a plan view with respect to the substrate, a first region that separates the metal layer and the peripheral metal layer is arranged between the metal layer and the peripheral metal layer. In a cross section passing through the substrate, the display area, and the peripheral area, the width of the first region is not more than twice the film thickness of the peripheral insulating layer.

Advantages of the Invention

[0007] According to the present invention, a display device capable of reducing an increase in the resistance of the upper electrode can be provided.

Brief Description of the Drawings

[0008]

Figure 1

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Figure 10

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant explanations are omitted.

[0010] In this specification, when referring to a specific pixel among a plurality of pixels 201, a subscript is added after the reference numeral as in pixel 201 “r”, and when it doesn't matter which one, it is simply shown as pixel “201”. The same applies to other components.

[0011] (First Embodiment) The display device of the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1(a) is a plan view of the display device of the first embodiment, and FIG. 1(b) is a modified example of the display device of the first embodiment. FIG. 2(a) is a cross-sectional view taken along line A - A′ of FIG. 1, and FIG. 2(b) is a modified example of the display device of the first embodiment.

[0012] The display device according to this embodiment has a display area DA and a peripheral area PA arranged around the display area DA on a substrate. The pixel 201 arranged in the display area DA has a light-emitting element. The light-emitting element may be an organic light-emitting element or an inorganic light-emitting element. In the following examples, an example in which the light-emitting element included in the pixel 201 is an organic light-emitting element will be described. The pixels arranged in the peripheral area PA may also have a light-emitting element, and may have an organic light-emitting element.

[0013] In FIG. 1(a), the display area DA has a first pixel 201r and a second pixel 201g. The light emitted by the first pixel 201r and the second pixel 201g may be light of the same color or light of different colors. Further, the display area DA may further have a third pixel 201b, and the third pixel 201b may emit light of the same color as the light emitted by the first pixel 201r, or may emit different light. Further, the third pixel 201b may emit light of the same color as the light emitted by the second pixel 201g, or may emit different light. When the first pixel 201r, the second pixel 201g, and the third pixel 201b emit the same color, for example, it may be white light emission. When the first pixel 201r, the second pixel 201g, and the third pixel 201b emit different colors, they may be red light emission, green light emission, and blue light emission, respectively.

[0014] In this specification, the display area DA refers to an area where pixels having light-emitting elements contributing to light emission are arranged, and the peripheral area PA refers to an area where pixels having light-emitting elements not contributing to light emission are arranged. Specifically, in a plan view with respect to the substrate, the area overlapping with the peripheral circuit portion can be referred to as the peripheral area PA.

[0015] In FIG. 1(a), a form in which the pixels 201 are arranged in a delta arrangement is shown, but the pixel arrangement is not limited to this, and may be a stripe arrangement, a Bayer arrangement, a square arrangement, or a pentile arrangement.

[0016] In the display device according to this embodiment, a metal layer 506 is disposed in a display area DA, and a peripheral metal layer 503 is disposed in a peripheral area PA. Since the metal layer 506 can reflect light from a light-emitting element included in the display area DA, it can also be referred to as a reflective layer. Further, in a plan view with respect to the substrate 100, a first area 601 that separates the metal layer 506 and the peripheral metal layer 503 is provided between the display area DA and the peripheral area PA. The first area 601 may be provided so as to pass over a pixel disposed closest to the peripheral area PA among the pixels disposed in the pixel area DA as shown in FIG. 1(a), or may be provided along a pixel disposed closest to the peripheral area PA among the pixels disposed in the pixel area DA as shown in FIG. 1(b).

[0017] In FIG. 1(a), the peripheral metal layer disposed in the peripheral area PA is represented by a rectangle, but of course, it is not limited to this. It may have the same pixel arrangement as the display area DA, or may have a pixel arrangement different from that of the display area DA.

[0018] The display device according to this embodiment will be described in more detail with reference to FIG. 2. FIG. 2(b) is different from FIG. 2(a) in that the metal layer 506 has an area 600, and the metal layer 506 to which the lower electrode 120 is electrically connected and the metal layer 506 to which the lower electrode 120 is not electrically connected are separated.

[0019] In the display area DA, a pixel 201 has at least the metal layer 506, the insulating layer 110, the lower electrode 120, the light-emitting layer 140, and the upper electrode 150 in this order from the substrate 100 side. Further, the peripheral area PA has at least the peripheral metal layer 503 and the peripheral insulating layer in this order from the substrate 100 side.

[0020] In the display device according to this embodiment, a driving circuit layer 102 and an interlayer insulating layer 104 are provided on the substrate 100.

[0021] The substrate 100 may be a semiconductor substrate such as a silicon substrate or a resin substrate. The substrate 100 may be provided with a MOS transistor and an element isolation region (e.g., STI) for driving the light-emitting element. The MOS transistor has a gate electrode and a source / drain region.

[0022] An interlayer insulating layer is provided in the drive circuit layer 102, and a wiring layer is provided in the interlayer insulating layer. Further, the interlayer insulating layer may be provided with a conductive plug that connects the wiring layer and the MOS transistor included in the substrate 100. The conductive plug is not particularly limited as long as it can electrically connect the wiring layer and the MOS transistor included in the substrate 100, and specifically, a conductive material such as tungsten (W) can be mentioned. Further, the conductive plug may have a barrier metal such as titanium (Ti), titanium nitride (TiN), or Ti / TiN. The wiring layer may be formed of AlCu and may have a barrier metal such as titanium (Ti), titanium nitride (TiN), or Ti / TiN.

[0023] The interlayer insulating layer included in the drive circuit layer 102 is preferably a silicon oxide, silicon oxynitride, silicon nitride, or borophosphorosilicate glass (BPSG) film. The interlayer insulating layer is formed, for example, by a chemical vapor deposition (CVD) method, and may be formed by a thermal CVD method or a plasma CVD method.

[0024] The interlayer insulating layer 104 is provided with a conductive plug that connects the drive circuit layer 102 and the metal layer 506. Specifically, the wiring layer provided in the drive circuit layer 102 and the metal layer 506 are connected. Further, the interlayer insulating layer 104 may be provided with a conductive plug that connects the drive circuit layer 102 and the peripheral metal layer 503. Specifically, the wiring layer provided in the drive circuit layer 102 and the peripheral metal layer 503 are connected. The conductive plug is not particularly limited as long as it can electrically connect the wiring layer and the metal layer 506 or the wiring layer and the peripheral metal layer 503, and specifically, the above-described conductive materials can be mentioned. Further, the conductive plug may have the above-described barrier metal.

[0025] The interlayer insulating layer 104 is preferably made of silicon oxide, silicon oxynitride, silicon nitride, or a BPSG film. The interlayer insulating layer may be formed, for example, by a chemical vapor deposition (CVD) method, and may be formed by a thermal CVD method or a plasma CVD method.

[0026] The peripheral metal layer 503 has at least a first metal layer 501. Optionally, it may further have a first layer 502 different from the first metal layer 501. The first metal layer 501 is not particularly limited as long as it can reflect light, but preferably has a reflectivity of 80% or more. Specifically, metal materials such as Al, Ag, Pt, Ni, Ti, and alloys obtained by adding Si, Cu, Ni, Nd, Ti, etc. to the metal materials can be mentioned. When the first metal layer 501 is Al or an alloy containing Al, it is preferable because more high-precision patterning can be performed. The first layer 502 is not particularly limited as long as it can suppress light reflection, but specifically, Ti, TiN, Ti / TiN, etc. can be mentioned. In other words, the reflectivity of the first metal layer 501 is preferably higher than the reflectivity of the first layer 502. Also, the first metal layer 501 may be arranged in contact with the first layer 502. Also, the first metal layer 501 may be arranged closer to the substrate 100 side than the first layer 502. Also, the peripheral metal layer 503 may further have a first layer 502 between the first metal layer 501 and the interlayer insulating layer 104.

[0027] The metal layer 506 has at least a second metal layer 504. Optionally, it may further have a second layer 505 different from the second metal layer 504. The second metal layer 504 is not particularly limited as long as it can reflect light, but preferably has a reflectivity of 80% or more. Specifically, the above-mentioned materials and the like can be mentioned. When the second metal layer 504 is Al or an alloy containing Al, it is preferable because more precise patterning can be performed. The second layer 505 is not particularly limited as long as it can suppress light reflection, and specifically, the above-mentioned materials can be mentioned. In other words, preferably, the reflectivity of the second metal layer 504 is higher than that of the second layer 505. The second metal layer 504 may be arranged in contact with the second layer 505. Also, the second metal layer 504 may be arranged closer to the substrate 100 than the second layer 505. Further, the metal layer 506 may further have the second layer 505 between the second metal layer 504 and the interlayer insulating layer 104.

[0028] Also, when the metal layer 506 has the second layer 505, the metal layer 506 has a region where the second layer 505 is not provided so as to expose the second metal layer 504. In a plan view with respect to the substrate 100, the region where the second layer 505 is not provided is arranged so as to overlap with the region where the insulator portion 130 described later is not provided.

[0029] Also, the peripheral metal layer 503 and the metal layer 506 are preferably arranged in the same layer. Specifically, it is preferable that the peripheral metal layer 503 and the metal layer 506 are provided on the interlayer insulating layer 104, and it is more preferable that the peripheral metal layer 503 and the metal layer 506 are provided in contact with the interlayer insulating layer 104. By having this configuration, the peripheral metal layer 503 and the metal layer 506 can be formed simultaneously, which is preferable from the perspective of the process.

[0030] Also, from the perspective of the process, it is preferable that the first metal layer 501 and the second metal layer 504 are made of the same material. When the peripheral metal layer 503 and the metal layer 506 further have the first layer 502 and the second layer 505, the first layer 502 and the second layer 505 are preferably made of the same material.

[0031] The insulating layer 110 is disposed on the metal layer 506 and is made of a material that can transmit light emitted from the light-emitting element. Specifically, examples include inorganic materials such as silicon nitride, silicon oxynitride, or silicon oxide, and organic materials such as acrylic resin, polyimide resin, epoxy resin, and silicon resin. The insulating layer 110 can be formed using a known method such as sputtering or CVD. From the viewpoint of ease of processing, it is preferably silicon oxide.

[0032] The peripheral insulating layer is disposed so as to cover the peripheral metal layer 503 and is made of the same material as the material used for the insulating layer 110. The peripheral metal layer has a first peripheral insulating layer 111 and may further have a second peripheral insulating layer 113 and a third peripheral insulating layer 115 as necessary.

[0033] The insulating layer 110 disposed on the pixel 201 included in the display region DA may have different film thicknesses of the insulating layer 110 among a plurality of pixels 201 according to the emission wavelength of the light emitted from the light-emitting element. In other words, the light-emitting element may have an optical resonator structure. At this time, the light-emitting element may be an organic light-emitting element. Specifically, the film thicknesses of the insulating layer 110 included in the first pixel 201r and the second pixel 201g may be different from each other. Further, when a plurality of pixels 201 further include a third pixel 201b, the film thicknesses of the insulating layer 110 included in the first pixel 201r, the second pixel 201g, and the third pixel 201b may be different from each other. More specifically, the pixel 201r having the longest emission wavelength (for example, red emission) may have a first insulating layer 112, a second insulating layer 114, and a third insulating layer 116, and the pixel 201b having the shortest emission wavelength (for example, blue emission) may have only the first insulating layer 112. The pixel 201g having an emission wavelength shorter than that of the pixel 201r and longer than that of the pixel 201b (for example, green emission) may have a first insulating layer 112 and a second insulating layer 114. Further, the insulating layer 110 may have voids among a plurality of pixels 201 or in the first region 601.

[0034] The lower electrode 120 is not particularly limited as long as it can transmit light emitted from the light-emitting element toward the substrate 100, but it is preferably a transparent material. Specifically, examples include thin films made of conductive oxide materials such as indium tin oxide (ITO) and indium zinc oxide (IZO), metals and alloys such as Al, Ag, and Pt, and conductive materials such as metal oxides. In the display device according to the present embodiment, the lower electrode 120 is also disposed in the opening 108 provided in the insulating layer 110, and the lower electrode 120 and the metal layer 506 are electrically connected. The film thickness of the lower electrode 120 is not particularly limited, and it may be uniform or non-uniform. Specifically, it may be 20 nm or more and 100 nm or less.

[0035] The lower electrode 120 may further have an insulating portion 130 disposed so as to cover its end portion. The insulating portion 130 is also called a bank and is disposed so as to electrically insulate the lower electrodes between the plurality of pixels 201. The insulator portion 130 may be formed of an inorganic material such as silicon nitride, silicon oxynitride, or silicon oxide, or an organic material such as an acrylic resin, a polyimide resin, an epoxy resin, or a silicon resin. The insulator 5 can be formed using a known method such as a sputtering method or a CVD method.

[0036] The light-emitting layer 140 is a layer that emits light. In addition to the layer that emits light, the light-emitting layer 130 may include a carrier transport layer, a carrier blocking layer, and the like. Further, the light-emitting layer 140 may be continuously disposed between the plurality of pixels 201, or may be independently disposed for each pixel 201. When the light-emitting layer 140 is continuously disposed between the plurality of pixels 201, the pixel 201 may have a color filter described later. Also, when the light-emitting layer 140 is independently disposed for each pixel 201, the pixel 201 may not have a color filter described later.

[0037] The upper electrode 150 is made of a material that can transmit the light emitted from the light-emitting layer 140. Specifically, examples include a semi-transmissive reflective material composed of a thin film of a transparent conductive oxide material such as ITO or IZO, a metal such as Al, Ag, or Au, an alkali metal such as Li or Cs, an alkaline earth metal such as Mg, Ca, or Ba, or an alloy material containing these metals. In particular, the upper electrode 150 is preferably Ag or an alloy composed of Mg and Ag. Also, as long as the upper electrode 150 can transmit light, it may be a single layer or a plurality of layers.

[0038] The display device according to the present invention may further include a sealing layer 160, a planarization layer 170, a color filter 180, and an optical member 190 on the upper electrode 150.

[0039] The sealing layer 160 is disposed on the upper electrode 150 and plays a role of protecting the organic light-emitting element from the intrusion of air and moisture. The material for forming the sealing layer 160 is not particularly limited, but it is preferably a material having translucency and capable of suppressing the intrusion of oxygen and moisture from the outside. Specifically, examples include inorganic materials such as silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and titanium oxide, and organic materials such as acrylic resin, polyimide resin, epoxy resin, and silicon resin.

[0040] The sealing layer 160 can be formed using a known method such as a CVD method, an atomic layer deposition method (ALD method), or a sputtering method.

[0041] As long as the sealing layer 160 has the above functions, it may be a single layer or a plurality of layers. In particular, when the sealing layer 160 is a plurality of layers, it may have a laminated structure of only inorganic materials, only organic materials, or a laminated structure of inorganic materials and organic materials. Also, the sealing layer 160 may be formed across a plurality of pixels 201.

[0042] The planarization layer 170 may be formed on the encapsulation film 160. The planarization layer 170 is provided for the purpose of reducing the unevenness of the underlying layer. The material for forming the planarization layer 170 is not particularly limited, but the planarization layer 170 may be composed of an inorganic material or an organic material. When formed of an organic material, it may be a low-molecular material or a high-molecular material.

[0043] The planarization layer 170 is preferably formed by a wet process such as a spin coating method, a dip coating method, a slit coating method, or a blade coating method. By performing the wet process, it becomes easy to flatten the light-emitting side surface of the planarization layer 170. The planarization layer 170 formed by the wet process is preferably cured by heating, UV irradiation, etc. after formation. Also, the planarization layer 170 may be formed across a plurality of organic light-emitting elements.

[0044] The color filter layer 180 is preferably provided on the planarization layer 170 (on the side opposite to the substrate 100). The wavelengths of the light transmitted through the color filter layer 180r of the first pixel 201r, the color filter layer 180g of the second pixel 201g, and the color filter layer 180b of the third pixel 201b may be the same as or different from each other.

[0045] The color filter layer 180 may be formed by applying a color resist on a substrate such as the planarization layer 170 and then patterning it by lithography. The color resist is composed of, for example, a photocurable resin, and forms a pattern by curing the irradiated site with ultraviolet light or the like.

[0046] The optical member 190 may be provided above (on the side opposite to the substrate 100) or below (on the substrate 100 side) the color filter layer 8. The optical member 9 may be a lens, and its shape is not particularly limited, and it may be convex toward the light-emitting layer 140 or convex in the direction opposite to the light-emitting layer 140. When the optical member 190 is a lens, it may also be referred to as a microlens. The microlens may be a spherical microlens, an aspherical microlens, or an asymmetric microlens.

[0047] The optical member 190 is made of a material having light transmissibility. Specifically, for example, it is made of an organic material such as an acrylic resin, an epoxy resin, or a silicon resin, or an inorganic material such as silicon nitride, silicon oxynitride, or silicon oxide.

[0048] When the optical member 190 is convex in the direction opposite to the light-emitting layer 140, a material having a lower refractive index than the material constituting the optical member 190 is disposed on the light-emitting side of the optical member 190. In particular, a gas such as air or nitrogen, a material having a low refractive index such as silica aerogel, or a vacuum state is preferable. When the optical member 190 is convex with respect to the light-emitting layer 140, a material having a higher refractive index than the material constituting the lens is formed on the light-emitting side.

[0049] Hereinafter, the display device according to the present invention will be described in detail.

[0050] In the display device described in Patent Document 1, which is a comparative example, when the width of the first region 601 disposed between the display region DA and the peripheral region PA is large, a portion where the insulating layer 110 is difficult to deposit is formed between the display region DA and the peripheral region PA. As a result, the upper electrode 150 disposed at that portion may be thinned or broken. Therefore, in the display device described in Patent Document 1, the resistance of the upper electrode 150 may increase.

[0051] On the other hand, in the display device according to the present invention, the width of the first region 601 is equal to or less than twice the film thickness of the insulating layer 110 or the peripheral insulating layer 118. Specifically, among the plurality of pixels 201, it is equal to or less than twice the film thickness of the thickest portion of the insulating layer 110, or equal to or less than twice the film thickness of the thickest portion of the peripheral insulating layer 118. By satisfying this condition, thinning of the upper electrode 150 can be reduced between the display region DA and the peripheral region PA. Therefore, the display device according to the present invention can reduce an increase in the resistance of the upper electrode 150.

[0052] In a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the first region 601 may be equal to or less than twice the film thickness of the peripheral insulating layer, and more preferably smaller than the film thickness of the peripheral insulating layer.

[0053] Also, when the metal layer 506 has the region 600 as shown in FIG. 2(b), in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the region 600 may be equal to or less than twice the film thickness of the insulating layer 110 or the peripheral insulating layer 118, and may be equal to or less than twice the film thickness of the insulating layer 110. More specifically, the width of the region 600 may be equal to or less than twice the film thickness of the thickest portion of the insulating layer 110 among the plurality of pixels 201.

[0054] Also, in FIG. 1, a part of the peripheral metal layer 503 is illustrated, but the same applies to the other outer peripheral portions. Specifically, in a plan view with respect to the substrate 100, the first region 601 is provided so as to surround the display region DA, and the metal layer 506 and the peripheral metal layer 503 may be separated.

[0055] In this specification, the width is the length in a direction parallel to the substrate 100 in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA. Also, the film thickness is the length in a direction perpendicular to the substrate 100 in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA.

[0056] The display device according to this embodiment can be obtained by a known process except that when patterning the metal layer 506 and the peripheral metal layer 503, the width of the first region 601 is controlled to be equal to or less than twice the film thickness of the insulating layer 110.

[0057] (Second Embodiment) The display device according to the second embodiment will be described with reference to FIG. 3. FIG. 3 is a plan view of the display device according to the second embodiment. Hereinafter, for simplicity of the drawing, the metal layer 506 and the peripheral metal layer 503 are represented as rectangles, but the present invention is not limited thereto. The display device according to the second embodiment is different from the display device according to the first embodiment in the following points.

[0058] The display device according to the second embodiment has, in the peripheral region PA, a first peripheral metal layer 503a and a second peripheral metal layer 503b as the peripheral metal layer 503. In a plan view with respect to the substrate 100, the first peripheral metal layer 503a is disposed between the metal layer 506 and the second peripheral metal layer 503b. Further, a first region 601 is disposed between the metal layer 506 and the first peripheral metal layer 503a, and a second region 602 is disposed between the first peripheral metal layer 503a and the second peripheral metal layer 503b. By having this configuration, the display device according to the second embodiment can further reduce the conduction between the metal layer 506 and the peripheral metal layer 503 due to foreign matter or pattern abnormality caused by defocus.

[0059] In FIG. 3(a), the second region 602 is provided in parallel with the first region 601, but the second region 602 may be disposed so as to separate the first peripheral metal layer 503a and the second peripheral metal layer 503b. Further, the potential applied to the first peripheral metal layer 503a may be the same as or different from the potential applied to the second peripheral metal layer 503b.

[0060] The width of the second region 602 is not particularly limited, but in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, it may be equal to or less than twice the film thickness of the insulating layer 110 and may be equal to or less than twice the film thickness of the peripheral insulating layer. Specifically, among the plurality of pixels 201, it may be equal to or less than twice the thickest portion of the film thickness of the insulating layer 110, or may be equal to or less than twice the thickest portion of the film thickness of the peripheral insulating layer 118. The peripheral insulating layer here may be an insulating layer disposed on the first peripheral metal layer 503a or may be an insulating layer disposed on the second peripheral metal layer 503b.

[0061] Also, as shown in FIGS. 3(b) and 3(c), the first peripheral metal layer 503a may further have a fourth region 604 connecting the first region 601 and the second region 602. By having this configuration, the energization between the metal layer 506 and the peripheral metal layer 503 can be further reduced.

[0062] In the present embodiment, the fourth region 604 is provided in the first peripheral metal layer 503a, but it may be provided in the second peripheral metal layer 503b. In that case, the fourth region 604 may be provided in the second peripheral metal layer 503b as a region connecting the second region 602 and the outer edge of the second peripheral metal layer 503b.

[0063] The width of the fourth region 604 is not particularly limited, but in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, it may be equal to or less than twice the film thickness of the insulating layer 110 and may be equal to or less than twice the film thickness of the peripheral insulating layer. Specifically, among the plurality of pixels 201, it may be equal to or less than twice the thickest portion of the film thickness of the insulating layer 110, or may be equal to or less than twice the thickest portion of the film thickness of the peripheral insulating layer 118. The peripheral insulating layer here may be an insulating layer disposed on the first peripheral metal layer 503a or may be an insulating layer disposed on the second peripheral metal layer 503b.

[0064] Also, in a plan view with respect to the substrate 100, as shown in FIG. 3(c), the width of the fourth region 604 may be larger than the width of the first region 601 and may also be larger than the width of the second region 602. Specifically, in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the fourth region 604 may be larger than twice the film thickness of the insulating layer 110 and may be larger than twice the film thickness of the peripheral insulating layer. Specifically, among the plurality of pixels 201, it may be larger than twice the thickness of the thickest portion of the insulating layer 110 and may be larger than twice the thickness of the thickest portion of the peripheral insulating layer 118.

[0065] The first peripheral metal layer 503a may have a plurality of the fourth regions 604 as shown in FIG. 3(b), or may have only one as shown in FIG. 3(c). Also, similar to the first embodiment, in a plan view with respect to the substrate 100, the first region 601 and the second region 602 may be arranged to surround the display region DA.

[0066] (Third Embodiment) The display device according to the third embodiment will be described with reference to FIG. 4. FIG. 4 is a plan view of the display device according to the third embodiment. The display device according to the third embodiment is different from the display device according to the first embodiment in the following points.

[0067] The display device according to the third embodiment has, in the peripheral region PA, a peripheral metal layer 503 including a first peripheral metal layer 503a, a second peripheral metal layer 503b, and a third peripheral metal layer 503c. In a plan view with respect to the substrate 100, the first peripheral metal layer 503a is disposed between the metal layer 506 and the second peripheral metal layer 503b, and the second peripheral metal layer 503b is disposed between the first peripheral metal layer 503a and the third peripheral metal layer 503c. In a plan view with respect to the substrate 100, a second region 602 that separates the first peripheral metal layer 503a and the second peripheral metal layer 503b is disposed between the first peripheral metal layer 503a and the second peripheral metal layer 503b. In a plan view with respect to the substrate 100, a third region 603 that separates the second peripheral metal layer 503b and the third peripheral metal layer 503c is disposed between the second peripheral metal layer 503b and the third peripheral metal layer 503c. By having this configuration, the display device according to the second embodiment can further reduce the conduction between the metal layer 506 and the peripheral metal layer 503 due to foreign matter or pattern abnormalities caused by defocusing.

[0068] In FIG. 4(a), the second region 602 is provided in parallel with the first region 601, but the second region 602 may be disposed so as to separate the first peripheral metal layer 503a and the second peripheral metal layer 503b. Similarly, the third region 603 may be disposed so as to separate the second peripheral metal layer 503b and the third peripheral metal layer c. Also, the potential applied to the first peripheral metal layer 503a, the potential applied to the second peripheral metal layer 503b, and the potential applied to the third peripheral metal layer 503c may be the same or different.

[0069] The width of the second region 602 is not particularly limited, but in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, it may be equal to or less than twice the film thickness of the insulating layer 110, and may be equal to or less than twice the film thickness of the peripheral insulating layer. Specifically, among the plurality of pixels 201, it may be equal to or less than twice the thickness of the thickest portion of the insulating layer 110, or may be equal to or less than twice the thickness of the thickest portion of the peripheral insulating layer 118. Here, the peripheral insulating layer may be an insulating layer disposed on the first peripheral metal layer 503a, may be an insulating layer disposed on the second peripheral metal layer 503b, or may be an insulating layer disposed on the third peripheral metal layer 503c. The width of the third region 603 is also not particularly limited, but in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, it may be equal to or less than twice the film thickness of the insulating layer 110, and may be equal to or less than twice the film thickness of the peripheral insulating layer. Specifically, among the plurality of pixels 201, it may be equal to or less than twice the thickness of the thickest portion of the insulating layer 110, or may be equal to or less than twice the thickness of the thickest portion of the peripheral insulating layer 118. Here, the peripheral insulating layer may be an insulating layer disposed on the first peripheral metal layer 503a, may be an insulating layer disposed on the second peripheral metal layer 503b, or may be an insulating layer disposed on the third peripheral metal layer 503c.

[0070] Also, as shown in FIGS. 4(b) and 4(c), the second peripheral metal layer 503b may have a fifth region 605 connecting the second region 602 and the third region 603. In FIG. 4(b), the second peripheral metal layer 503b has the fifth region 605, and the first peripheral metal layer 503a does not have the fourth region 604, but it is not limited thereto. The first peripheral metal layer 503a may have a fourth region 604 connecting the first region 601 and the second region 602, and the second peripheral metal layer 503b may not have the fifth region 605. Also, the first peripheral metal layer 503a may have the fourth region 604, and the second peripheral metal layer 503b may have the fifth region 605. By having these configurations, the energization between the metal layer 506 and the peripheral metal layer 503 can be further reduced.

[0071] In this embodiment, the fifth region 605 is provided in the second peripheral metal layer 503b, but a region connecting the third region 602 and the outer edge of the third peripheral metal layer 503c may also be provided in the third peripheral metal layer 503c.

[0072] The width of the fifth region 605 is not particularly limited, but in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, it may be equal to or less than twice the film thickness of the insulating layer 110 and may be equal to or less than twice the film thickness of the peripheral insulating layer. Specifically, among the plurality of pixels 201, it may be equal to or less than twice the thickness of the thickest portion of the insulating layer 110, or may be equal to or less than twice the thickness of the thickest portion of the peripheral insulating layer 118. Here, the peripheral insulating layer may be an insulating layer disposed on the first peripheral metal layer 503a, may be an insulating layer disposed on the second peripheral metal layer 503b, or may be an insulating layer disposed on the third peripheral metal layer 503c. Further, as shown in FIG. 4(c), the width of the fifth region 605 may be larger than the width of the first region 601, may be larger than the width of the second region 602, or may be larger than the width of the third region 603 in a plan view with respect to the substrate 100. Specifically, in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the fifth region 605 may be larger than twice the film thickness of the insulating layer 110 and may be larger than twice the film thickness of the peripheral insulating layer. Specifically, among the plurality of pixels 201, it may be larger than twice the thickness of the thickest portion of the insulating layer 110 and may be larger than twice the thickness of the thickest portion of the peripheral insulating layer 118.

[0073] The second peripheral metal layer 503b may have a plurality of the fifth regions 605 as shown in FIG. 4(b) or may have only one as shown in FIG. 4(c). Further, similar to the first embodiment, the first region 601, the second region 602, and the third region 603 may be arranged so as to surround the display region DA.

[0074] Further, when the first peripheral metal layer 503a has the fourth region 604 and the second peripheral metal layer 503b has the fifth region 605, in a plan view with respect to the substrate 100, it is preferable that the intersection of the second region 602 and the fourth region 604 and the intersection of the second region 602 and the fifth region 605 do not coincide. This is because by providing the fourth region 604 and the fifth region 605 so that these intersections do not coincide, it is possible to reduce the locations where the insulating layer 110 is difficult to deposit. As a result, the upper electrode is less likely to be thinned or broken, and thus it is possible to further reduce the increase in the resistance of the upper electrode 150. Specifically, it is preferable to have a configuration as shown in FIG. 4(d). The arrangement shown in FIG. 4(d) can also be described as being arranged in a lattice pattern, a staggered pattern, or a checkered pattern.

[0075] By having this configuration, the display device according to the present embodiment can further reduce the conduction between the metal layer 506 and the peripheral metal layer 503 due to foreign matter or pattern abnormalities caused by defocus. Also, in the first region 601, since it is possible to reduce the thinning and step discontinuity of the upper electrode 150, it is possible to further reduce the increase in the resistance of the upper electrode 150.

[0076] (Application Example) FIG. 5 is a schematic diagram showing an example of the display device according to the present embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPC1002 and 1004 are connected to the touch panel 1003 and the display panel 1005, respectively. The display panel 1005 may have the display device according to the present invention. Transistors are printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, or may be provided at another position even if it is a portable device.

[0077] The display device according to the present embodiment may include a color filter having red, green, and blue. The red, green, and blue colors of the color filter may be arranged in a delta array.

[0078] The display device according to the present embodiment may be used for a display unit of an imaging device that receives light. The imaging device may include a display unit that displays information acquired by the imaging element. Further, the display unit may be a display unit exposed outside the imaging device or a display unit disposed in the viewfinder. The imaging device may be a digital camera or a digital video camera.

[0079] FIG. 6(a) is a schematic diagram showing an example of the imaging device according to the present embodiment. The imaging device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 and the rear display 1102 may include the display device according to the present invention. In that case, the display device may display not only the image to be captured but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject is shielded by an obstacle, and the like.

[0080] The imaging device 1100 may further include an optical unit (not shown). The lens included in the optical unit may be single or plural and forms an image on the imaging element housed in the housing 1104. The focus can be adjusted by adjusting the relative positions of the plural lenses. This operation can also be performed automatically. The imaging device may be called a photoelectric conversion device. The photoelectric conversion device may include, as an imaging method, a method of detecting a difference from a previous image instead of sequentially imaging, a method of cutting out from an image that is always recorded, and the like.

[0081] FIG. 6(b) is a schematic diagram showing an example of an electronic device according to the present embodiment. The electronic device 1200 includes a display unit 1201, an operation unit 1202, and a housing 1203. The display unit 1201 may include a display device according to the present invention. The housing 1203 may include a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a reaction unit of a touch panel type. The operation unit 1202 may be a biometric recognition unit that recognizes a fingerprint and performs unlocking or the like. An electronic device having a communication unit can also be called a communication device. The electronic device may further have a camera function by including a lens and an imaging device. An image captured by the camera function is displayed on the display unit 1201. Examples of the electronic device include a smartphone and a notebook computer.

[0082] FIG. 7 is a schematic diagram showing an example of the display device according to the present embodiment. FIG. 7(a) shows a display device such as a TV monitor or a PC monitor. The display device 1300 includes a housing 1301 and a display unit 1302. The display device according to the present invention may be used for the display unit 1302.

[0083] The display device 1300 may further include a base 1303 that supports the housing 1301 and the display unit 1302. The base 1303 is not limited to the form shown in FIG. 11(a). The lower side of the housing 1301 may also serve as the base.

[0084] Also, the housing 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0085] FIG. 7(b) is a schematic diagram showing another example of the display device according to the present embodiment. The display device 1310 in FIG. 7(b) is configured to be foldable and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit may have the display device according to the present invention. The first display unit 1311 and the second display unit 1312 may be a single seamless display device. The first display unit 1311 and the second display unit 1312 can be separated at the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or may display one image together with the first display unit 1311 and the second display unit 1312.

[0086] FIG. 8(a) is a schematic diagram showing an example of the lighting device according to the present embodiment. The lighting device 1400 may have a housing 1401, a light source 1402, and a circuit board 1403. The light source 1402 may have the display device according to the present invention. The lighting device 1400 may have an optical film 1404 in order to improve the color rendering property of the light source. Further, the lighting device 1400 may have a light diffusing unit 1405 in order to effectively diffuse the light of the light source. By having the light diffusing unit 1405 in the lighting device 1400, light can be delivered to a wide area. The optical film 1404 and the light diffusing unit 1405 may be provided on the light emitting side of the illumination. If necessary, a cover may be provided on the outermost side.

[0087] The lighting device is, for example, a device for illuminating a room. The lighting device may emit any color from white, day white, or other blue to red. It may have a dimming circuit for dimming them. The lighting device may have a power supply circuit. The power supply circuit may be a circuit that converts an AC voltage into a DC voltage. Further, white has a color temperature of 4200K, and day white has a color temperature of 5000K. The lighting device may have a color filter.

[0088] Further, the lighting device according to the present embodiment may have a heat radiating unit. The heat radiating unit releases the heat inside the device to the outside of the device and is made of a metal or ceramic having a high thermal conductivity.

[0089] Figure 8(b) is a schematic diagram of an automobile which is an example of a moving body according to the present embodiment. The automobile has a tail lamp which is an example of a lighting device. The automobile 1500 may have a tail lamp 1501 and may be a vehicle in which the tail lamp lights up when a braking operation or the like is performed. The automobile 1500 may have a vehicle body 1503 and a window 1502 attached thereto.

[0090] The tail lamp 1501 may have a display device according to the present invention. The tail lamp may have a protection member for protecting a light source. The protection member has a certain degree of strength and may be made of any material as long as it is transparent, but is preferably made of polycarbonate or the like. A phthalic acid derivative, an acrylonitrile derivative or the like may be mixed with the polycarbonate.

[0091] The moving body according to the present embodiment includes a driving force generation unit that mainly generates a driving force used for the movement of the moving body, and one or both of rotators mainly used for the movement of the moving body. The driving force generation unit can be an engine, a motor, or the like. The rotator can be a tire, a wheel, a screw of a ship, a propeller of an aircraft, or the like. Specifically, it may be a bicycle, an automobile, a train, a ship, an aircraft, a drone, or the like. The moving body may have a body and a lighting device provided on the body. The lighting device may emit light to make the position of the body known.

[0092] The electronic device or the display device can be applied to a system wearable as a wearable device such as smart glasses, a head-mounted display, or smart contacts. The electronic device may have an imaging device capable of photoelectrically converting visible light and a display device capable of emitting visible light.

[0093] FIG. 9 is a schematic diagram showing an example of glasses (smart glasses) according to the present embodiment. Glasses 1600 (smart glasses) will be described with reference to FIG. 9(a). Glasses 1600 have a display unit on the back side of lens 1601. The display unit may include a display device according to the present invention. Further, an imaging device 1602 such as a CMOS sensor or a SPAD may be provided on the front side of lens 1601.

[0094] Glasses 1600 further include a control device 1603. Control device 1603 functions as a power supply that supplies power to imaging device 1602 and the display unit. In addition, control device 1603 controls the operations of imaging device 1602 and the display unit. An optical system for condensing the light of imaging device 1602 and the display unit is formed in lens 1601.

[0095] Glasses 1610 (smart glasses) will be described with reference to FIG. 9(b). Glasses 1610 have a control device 1612, and a display device including a display device according to the present invention is provided in control device 1612. Control device 1612 may further include an imaging device corresponding to imaging device 1602. An optical system for projecting the light emitted from control device 1612 is formed in lens 1611, and an image is projected onto lens 1611. Control device 1612 functions as a power supply that supplies power to the imaging device and the display device, and controls the operations of the imaging device and the display device. The control device may include a gaze detection unit that detects the gaze of the wearer. Gaze detection may use infrared rays. The infrared light emitting unit emits infrared rays toward the eyeball of the user who is gazing at the display image. Among the emitted infrared light, an imaging image of the eyeball is obtained by detecting the reflected light from the eyeball with an imaging unit having a light receiving element. By having a reducing means for reducing the light from the infrared light emitting unit to the display unit in a plan view, a decrease in image quality is reduced.

[0096] From the captured image of the eyeball obtained by infrared imaging, the control device 1612 detects the user's line of sight with respect to the display image. Any known method can be applied to the line-of-sight detection using the captured image of the eyeball. As an example, a line-of-sight detection method based on the Purkinje image by the reflection of the irradiation light on the cornea can be used.

[0097] More specifically, a line-of-sight detection process based on the pupil corneal reflex method is performed. Using the pupil corneal reflex method, a line-of-sight vector representing the orientation (rotation angle) of the eyeball is produced based on the image of the pupil and the Purkinje image included in the captured image of the eyeball, thereby detecting the user's line of sight.

[0098] The display device according to an embodiment of the present invention has an imaging device having a light receiving element, and may control the display image of the display device based on the user's line-of-sight information from the imaging device.

[0099] Specifically, the display device determines a first visual field area that the user is gazing at and a second visual field area other than the first visual field area based on the line-of-sight information. The first visual field area and the second visual field area may be determined by the control device of the display device, or may be received as determined by an external control device. In the display area of the display device, the display resolution of the first visual field area may be controlled to be higher than that of the second visual field area. That is, the resolution of the second visual field area may be made lower than that of the first visual field area.

[0100] Note that AI may be used to determine the first display area or the display area with high priority. AI may be a model configured to estimate the angle of the line of sight and the distance to the target at the tip of the line of sight from the image of the eyeball using the image of the eyeball and the direction in which the eyeball of the image is actually looking as teacher data. AI may be possessed by the display device, may be possessed by the imaging device, or may be possessed by an external device. When the external device has AI, it is preferably applied to smart glasses further having an imaging device for imaging the outside. The smart glasses can display the captured external information in real time.

[0101] FIG. 10(a) is a schematic diagram showing an example of an image forming apparatus according to the present embodiment. The image forming apparatus 40 is an electrophotographic image forming apparatus and includes a photoreceptor 27, an exposure light source 28, a charging unit 30, a developing unit 31, a transferrer 32, a conveyance roller 33, and a fixing unit 35. Light 29 is irradiated from the exposure light source 28, and an electrostatic latent image is formed on the surface of the photoreceptor 27. This exposure light source 28 may have a display device according to the present embodiment. The developing unit 31 has toner or the like. The charging unit 30 charges the photoreceptor 27. The transferrer 32 transfers the developed image onto a storage medium 34. The conveyance roller 33 conveys the recording medium 34. The recording medium 34 is, for example, paper. The fixing unit 35 fixes the image formed on the recording medium 34.

[0102] FIGS. 10(b) and 10(c) are diagrams showing the exposure light source 28, and are schematic diagrams showing a state in which a plurality of light emitting portions 36 are arranged on a long substrate. Arrow 37 represents the column direction in which the light emitting elements are arranged. This column direction is the same as the direction of the axis around which the photoreceptor 27 rotates. This direction can also be called the major axis direction of the photoreceptor 27. FIG. 10(b) shows a form in which the light emitting portions 36 are arranged along the major axis direction of the photoreceptor 27. FIG. 10(c) shows a form different from FIG. 10(b), in which the light emitting portions 36 are alternately arranged in the column direction in each of the first column and the second column. The first column and the second column are arranged at different positions in the row direction. In the first column, a plurality of light emitting portions 36 are arranged at intervals. The second column has light emitting portions 36 at positions corresponding to the intervals between the light emitting portions 36 in the first column. That is, also in the row direction, a plurality of light emitting portions 36 are arranged at intervals. The arrangement in FIG. 10(c) can also be described as, for example, a state of being arranged in a grid pattern, a state of being arranged in a staggered grid, or a checkered pattern.

[0103] As described above, by using the device using the organic light emitting element according to the present embodiment, it is possible to achieve a good image quality and a stable display even for a long-time display.

[0104] As described above, in the display device according to the present invention, by setting the width of the first region provided between the metal layer and the peripheral metal layer to be equal to or less than twice the film thickness of the peripheral insulating layer, an increase in the resistance of the upper electrode can be reduced. Further, by increasing the regions arranged so as to separate the metal layer and the peripheral metal layer, the possibility of conduction between the metal layer and the peripheral metal layer can be further reduced.

[0105] Further, the present invention can have the following configurations.

[0106] (Configuration 1) A display device having a display region and a peripheral region arranged around the display region on a substrate, From the substrate side, the display region has at least a metal layer, an insulating layer, a lower electrode, a light-emitting layer, and an upper electrode in this order, From the substrate side, the peripheral region has at least a peripheral metal layer and a peripheral insulating layer in this order, In a plan view with respect to the substrate, a first region that separates the metal layer and the peripheral metal layer is arranged between the metal layer and the peripheral metal layer, In a cross section passing through the substrate, the display region, and the peripheral region, the width of the first region is equal to or less than twice the film thickness of the peripheral insulating layer.

[0107] (Configuration 2) The peripheral metal layer has a first peripheral metal layer and a second peripheral metal layer, In a plan view with respect to the substrate, the first peripheral metal layer is arranged between the metal layer and the second peripheral metal layer, the first region is arranged between the metal layer and the first peripheral metal layer, and a second region that separates the first peripheral metal layer and the second peripheral metal layer is arranged between the first peripheral metal layer and the second peripheral metal layer.

[0108] (Configuration 3) In a cross section passing through the substrate, the display region, and the peripheral region, the width of the second region is equal to or less than twice the film thickness of the peripheral insulating layer.

[0109] (Configuration 4) The display device according to Configuration 2 or 3, wherein the first peripheral metal layer has a fourth region connecting the first region and the second region.

[0110] (Configuration 5) The peripheral metal layer further has a third peripheral metal layer, In a plan view with respect to the substrate, the second peripheral metal layer is disposed between the first peripheral metal layer and the third peripheral metal layer, and a third region separating the second peripheral metal layer and the third peripheral metal layer is disposed between the second peripheral metal layer and the third peripheral metal layer. The display device according to Configuration 2 or 3.

[0111] (Configuration 6) In a cross section passing through the substrate, the display region, and the peripheral region, the width of the third region is 2 times or less the film thickness of the peripheral insulating layer. The display device according to Configuration 5.

[0112] (Configuration 7) The display device according to Configuration 5 or 6, wherein the first peripheral metal layer has a fourth region connecting the first region and the second region.

[0113] (Configuration 8) In a plan view with respect to the substrate, the width of the fourth region is larger than the width of the first region and larger than the width of the second region. The display device according to Configuration 7.

[0114] (Configuration 9) In a cross section passing through the substrate, the display region, and the peripheral region, the width of the fourth region is larger than 2 times the film thickness of the peripheral insulating layer. The display device according to Configuration 7 or 8.

[0115] (Configuration 10) The display device according to any one of Configurations 5 to 9, wherein the second peripheral metal layer has a fifth region connecting the second region and the third region.

[0116] (Configuration 11) The first peripheral metal layer has a fourth region connecting the first region and the second region, The second peripheral metal layer has a fifth region connecting the second region and the third region, The display device according to Configuration 5 or 6, wherein in a plan view with respect to the substrate, an intersection of the second region and the fourth region and an intersection of the second region and the fifth region do not coincide.

[0117] (Configuration 12) The display device according to any one of Configurations 1 to 11, wherein the display region has an organic light-emitting element.

[0118] (Configuration 13) The display region has at least a first pixel and a second pixel, The first pixel and the second pixel each have an organic light-emitting element, The display device according to any one of Configurations 1 to 12, wherein a film thickness of an insulating layer included in the first pixel and a film thickness of an insulating layer included in the second pixel are different from each other.

[0119] (Configuration 14) The display region further has a third pixel, The third pixel has the organic light-emitting element, The display device according to Configuration 13, wherein a film thickness of an insulating layer included in the first pixel, a film thickness of an insulating layer included in the second pixel, and a film thickness of an insulating layer included in the third pixel are different from each other.

[0120] (Configuration 15) The display device according to any one of Configurations 12 to 14, wherein the organic light-emitting element has an optical resonator structure.

[0121] (Configuration 16) The peripheral metal layer has a first metal layer and a first layer different from the first metal layer, The display device according to any one of Configurations 1 to 15, wherein the reflectance of the first metal layer is higher than the reflectance of the first layer.

[0122] (Configuration 17) The metal layer has a second metal layer and a second layer different from the second metal layer. The display device according to any one of Configurations 1 to 16, wherein the reflectance of the second metal layer is higher than the reflectance of the second layer.

[0123] (Configuration 18) An interlayer insulating layer is provided on the substrate. The display device according to any one of Configurations 1 to 17, wherein the metal layer and the peripheral metal layer are provided on the interlayer insulating layer.

[0124] (Configuration 19) A photoelectric conversion device having an imaging element that receives light and a display unit that displays an image captured by the imaging element. The photoelectric conversion device, wherein the display device according to any one of Configurations 1 to 18 is the display unit.

[0125] (Configuration 20) A display device having a display unit including the display device according to any one of Configurations 1 to 18 and a housing provided with the display unit.

[0126] (Configuration 21) An electronic device having a display unit including the display device according to any one of Configurations 1 to 18, a housing provided with the display unit, and a communication unit provided in the housing and communicating with the outside.

[0127] (Configuration 22) An illumination device having a light source including the display device according to any one of Configurations 1 to 18 and a housing provided with the light source.

[0128] (Configuration 23) A moving body comprising: a lighting fixture having a display device according to any one of Configurations 1 to 18; and a body provided with the lighting fixture.

[0129] (Configuration 24) A wearable device comprising: a display unit having a display device according to any one of Configurations 1 to 18; an optical system that condenses light from the display unit; and a control device that controls the operation of the display unit.

Explanation of Reference Numerals

[0130] 100 Substrate 110 Insulating layer 118 Peripheral insulating layer 120 Lower electrode 140 Light-emitting layer 150 Upper electrode 503 Peripheral metal layer 506 Metal layer DA Display area PA Peripheral area

Claims

1. A display device having a display area and a peripheral area arranged around the display area on a substrate, when viewed from the substrate side, the display area has at least a metal layer, an insulating layer, a lower electrode, a light-emitting layer, and an upper electrode in this order, when viewed from the substrate side, the peripheral area has at least a peripheral metal layer and a peripheral insulating layer in this order, in a plan view with respect to the substrate, a first region that separates the metal layer and the peripheral metal layer is arranged between the metal layer and the peripheral metal layer, A display device characterized in that in a cross section passing through the substrate, the display area, and the peripheral area, the width of the first region is not more than twice the film thickness of the peripheral insulating layer.

2. The peripheral metal layer has a first peripheral metal layer and a second peripheral metal layer, in a plan view with respect to the substrate, the first peripheral metal layer is arranged between the metal layer and the second peripheral metal layer, the first region is arranged between the metal layer and the first peripheral metal layer, and a second region that separates the first peripheral metal layer and the second peripheral metal layer is arranged between the first peripheral metal layer and the second peripheral metal layer. The display device according to Claim 1.

3. A display device according to Claim 2, characterized in that in a cross section passing through the substrate, the display area, and the peripheral area, the width of the second region is not more than twice the film thickness of the peripheral insulating layer.

4. The display device according to Claim 2, characterized in that the first peripheral metal layer has a fourth region connecting the first region and the second region.

5. The peripheral metal layer further has a third peripheral metal layer, in a plan view with respect to the substrate, the second peripheral metal layer is arranged between the first peripheral metal layer and the third peripheral metal layer, A display device according to Claim 2, characterized in that a third region that separates the second peripheral metal layer and the third peripheral metal layer is arranged between the second peripheral metal layer and the third peripheral metal layer.

6. A display device according to Claim 5, characterized in that in a cross section passing through the substrate, the display area, and the peripheral area, the width of the third region is not more than twice the film thickness of the peripheral insulating layer.

7. The display device according to Claim 5, characterized in that the first peripheral metal layer has a fourth region connecting the first region and the second region.

8. The display device according to claim 7, wherein in a plan view with respect to the substrate, the width of the fourth region is larger than the width of the first region and larger than the width of the second region.

9. The display device according to claim 7 or 8, wherein in a cross section passing through the substrate, the display region, and the peripheral region, the width of the fourth region is larger than twice the film thickness of the peripheral insulating layer.

10. The display device according to claim 5, wherein the second peripheral metal layer has a fifth region connecting the second region and the third region.

11. The first peripheral metal layer has a fourth region connecting the first region and the second region, The second peripheral metal layer has a fifth region connecting the second region and the third region, The display device according to claim 5, wherein in a plan view with respect to the substrate, the intersection of the second region and the fourth region does not coincide with the intersection of the second region and the fifth region.

12. The display device according to claim 1, wherein the display region has an organic light-emitting element.

13. The display region has at least a first pixel and a second pixel, The first pixel and the second pixel each have an organic light-emitting element, The display device according to claim 1, wherein the film thickness of the insulating layer of the first pixel is different from the film thickness of the insulating layer of the second pixel.

14. The display region further has a third pixel, The third pixel has the organic light-emitting element, The display device according to claim 13, wherein the film thickness of the insulating layer of the first pixel, the film thickness of the insulating layer of the second pixel, and the film thickness of the insulating layer of the third pixel are different from each other.

15. The display device according to claim 12, wherein the organic light-emitting element has an optical resonator structure.

16. The peripheral metal layer has a first metal layer and a first layer different from the first metal layer, The display device according to claim 1, wherein the reflectance of the first metal layer is higher than the reflectance of the first layer.

17. The metal layer has a second metal layer and a second layer different from the second metal layer, The display device according to claim 1, wherein the reflectance of the second metal layer is higher than the reflectance of the second layer.

18. An interlayer insulating layer is provided on the substrate, The display device according to claim 1, wherein the metal layer and the peripheral metal layer are provided on the interlayer insulating layer.

19. An imaging device that receives light, and a display unit that displays an image captured by the imaging device. An optoelectronic device, wherein the display device according to any one of Claims 1 to 18 is the display unit.

20. An electronic device, comprising: a display unit having the display device according to any one of Claims 1 to 18; a housing provided with the display unit; and a communication unit provided in the housing and communicating with the outside.

21. A wearable device, comprising: a display unit having the display device according to any one of Claims 1 to 18; an optical system that condenses light of the display unit; and a control device that controls the operation of the display unit.

Citation Information

Patent Citations

  • Organic device, manufacturing method thereof, display device, photoelectric conversion device, electronic equipment, illumination device and mobile body

    JP2021072282A