Semiconductor module

Abstract

To provide a semiconductor module capable of functioning as various power converters with a simple configuration.SOLUTION: A semiconductor module 1 having a bridge circuit 4 including a plurality of switching elements includes: a first connection terminal pair 11; a second connection terminal pair 12; a third connection terminal pair 13; a fourth connection terminal pair 14; first wiring 31; second wiring 32; third wiring 33; fourth wiring 34; and fifth wiring 35. The bridge circuit 4 includes a first vertical arm 41 that connects between the first wiring 31 and the second wiring 32, and a second vertical arm 42 that connects between the third wiring 33 and the second wiring 32. The fourth wiring 34 connects between a connection point of an upper arm and a lower arm of the first vertical arm 41 and a fifth terminal 25. The fifth wiring connects between a connection point of an upper arm and a lower arm of the second vertical arm 42 and a sixth terminal 26.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a semiconductor module.

Background Art

[0002] Patent Document 1 discloses an isolated DCDC converter in which a first converter and a second converter are coupled via a transformer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the configuration described in Patent Document 1, since the interfaces on the transformer side of both the first converter and the second converter are the input / output parts of AC power, it is difficult for the first converter and the second converter to function as DCDC converters.

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a semiconductor module that can function as various power converters with a simple configuration.

Means for Solving the Problems

[0006] The present invention relates to a semiconductor module including an external connection terminal, a wiring connected to the external connection terminal, and a full-bridge circuit including a plurality of switching elements. The external connection terminal includes a first connection terminal pair including a first terminal and a second terminal, a second connection terminal pair including a third terminal and a fourth terminal, a third connection terminal pair including a fifth terminal and a sixth terminal, and a fourth connection terminal pair including a seventh terminal and an eighth terminal. The wiring includes a first wiring connecting the first terminal and the third terminal, a second wiring connecting the second terminal and the eighth terminal, a third wiring connecting the fourth terminal and the seventh terminal, a fourth wiring connected to the fifth terminal, and a fifth wiring connected to the sixth terminal. The full-bridge circuit has a first upper and lower arm connecting between the first wiring and the second wiring, and a second upper and lower arm connecting between the third wiring and the second wiring. The fourth wiring connects between a connection point of the upper arm and the lower arm of the first upper and lower arm and the fifth terminal, and the fifth wiring connects between a connection point of the upper arm and the lower arm of the second upper and lower arm and the sixth terminal.

[0007] The present invention relates to a semiconductor module including an external connection terminal, a wiring connected to the external connection terminal, and a half-bridge circuit including a plurality of switching elements. The external connection terminal includes a first connection terminal pair including a first terminal and a second terminal, a second connection terminal pair including a third terminal and a fourth terminal, a third connection terminal pair including a fifth terminal and a sixth terminal, and a fourth connection terminal pair including a seventh terminal and an eighth terminal. The wiring includes a first wiring connecting between the first terminal and the third terminal, a second wiring connecting between the second terminal and the eighth terminal, a third wiring connecting between the fourth terminal and the seventh terminal, a fourth wiring connected to the fifth terminal, a fifth wiring connected to the sixth terminal, and a sixth wiring connecting between the second wiring and the third wiring. The half-bridge circuit has an upper and lower arm connecting between the first wiring and the second wiring. The fourth wiring connects between a connection point of the upper arm and the lower arm of the upper and lower arm and the fifth terminal, and the fifth wiring connects between the sixth wiring and the sixth terminal. [[Effect of the Invention]]

[0008] In the present invention, it can function as various power converters with a simple configuration.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0010] Hereinafter, the semiconductor module in the embodiment of the present invention will be specifically described. Note that the present invention is not limited to the embodiments described below.

[0011] FIG. 1 is a schematic diagram showing a semiconductor module in an embodiment. The semiconductor module 1 is a module capable of configuring various power converters by switching connections. The semiconductor module 1 includes an external connection terminal 2, a wiring 3, and a bridge circuit 4.

[0012] The external connection terminal 2 is a terminal for connecting to an external circuit. The external connection terminal 2 includes a first connection terminal pair 11, a second connection terminal pair 12, a third connection terminal pair 13, and a fourth connection terminal pair 14. The first connection terminal pair 11 includes a first terminal 21 and a second terminal 22. The second connection terminal pair 12 includes a third terminal 23 and a fourth terminal 24. The third connection terminal pair 13 includes a fifth terminal 25 and a sixth terminal 26. The fourth connection terminal pair 14 includes a seventh terminal 27 and an eighth terminal 28.

[0013] The wiring 3 is wiring connected to the external connection terminal 2. The wiring 3 includes a first wiring 31 connected to the first terminal 21, a second wiring 32 connected to the second terminal 22, a third wiring 33 connected to the fourth terminal 24, a fourth wiring 34 connected to the fifth terminal 25, and a fifth wiring 35 connected to the sixth terminal 26. The first wiring 31 connects the first terminal 21 and the third terminal 23. The second wiring 32 connects the second terminal 22 and the eighth terminal 28. The third wiring 33 connects the fourth terminal 24 and the seventh terminal 27. One end of the fourth wiring 34 is connected to the fifth terminal 25 and the other end is connected to the bridge circuit 4. One end of the fifth wiring 35 is connected to the sixth terminal 26 and the other end is connected to the bridge circuit 4.

[0014] The bridge circuit 4 is a full-bridge circuit including a plurality of switching elements. The bridge circuit 4 is composed of four switching elements SW1 to SW4 that constitute two upper and lower arms 41, 42. The upper and lower arms 41, 42 each include two switching elements. A diode is connected in anti-parallel to each switching element. Each switching element is constituted by an IGBT. Each switching element performs a switching operation according to a control signal from a control device.

[0015] The first upper and lower arm 41 is an upper and lower arm in which the first switching element SW1 and the second switching element SW2 are connected in series. In the first upper and lower arm 41, the first switching element SW1 is the upper arm and the second switching element SW2 is the lower arm. The first upper and lower arm 41 connects between the first wiring 31 and the second wiring 32.

[0016] The second upper and lower arm 42 is an upper and lower arm in which a third switching element SW3 and a fourth switching element SW4 are connected in series. In the second upper and lower arm 42, the third switching element 43 is the upper arm, and the fourth switching element SW4 is the lower arm. The second upper and lower arm 42 connects between the third wiring 33 and the second wiring 32.

[0017] In the bridge circuit 4, a wiring 3 is connected to each of the connection points between the paired switching elements. A fourth wiring 34 is connected to the connection point between the first switching element SW1 and the second switching element SW2 of the first upper and lower arm 41. A fifth wiring 35 is connected to the connection point between the third switching element SW3 and the fourth switching element SW4 of the second upper and lower arm 42. The fourth wiring 34 connects between the connection point of the upper arm and the lower arm of the first upper and lower arm 41 and the fifth terminal 25. The fifth wiring 35 connects between the connection point of the upper arm and the lower arm of the second upper and lower arm 42 and the sixth terminal 26.

[0018] In the relationship between the external connection terminal 2 and the bridge circuit 4, the first connection terminal pair 11 is connected to one side of the bridge. The second connection terminal pair 12 is connected to the positive electrode side of the bridge. The third connection terminal pair 13 is connected to the midpoint of the bridge. The fourth connection terminal pair 14 is connected to the other side of the bridge. The midpoint of the bridge means the connection point between the upper arm and the lower arm.

[0019] The semiconductor module 1 can constitute various power converters by switching the connections. An external circuit on the input side and an external circuit on the output side are connected to the external connection terminal 2. By appropriately switching the connections on the external circuit side and performing appropriate switching control, it is possible to make the semiconductor module 1 function as various power converters.

[0020] An external circuit on the input side is connected to any one of the four connection terminal pairs of the external connection terminal 2, and an external circuit on the output side is connected to one of the remaining three connection terminal pairs. Further, one of the remaining two connection terminal pairs is electrically open, and the other is short-circuited. When a connection terminal pair is electrically open, it means that no external device (external circuit or component) is connected to that connection terminal pair, or that although an external device is connected to that connection terminal pair, the external device side electrically opens that connection terminal pair. When a connection terminal pair is short-circuited, it means that the connection terminal pair is short-circuited by the external device in a state where the external device is connected to that connection terminal pair. In this connection state, the first to fourth switching elements SW1 to SW4 included in the bridge circuit 4 perform a switching operation, whereby the semiconductor module 1 converts the power input from the external circuit on the input side into a desired power and outputs it to the external circuit on the output side. For example, the semiconductor module can function as a bidirectional buck-boost converter, an AC-DC converter, or the like.

[0021] Specifically, the semiconductor module 1 can be driven in any one of a DCDC mode, an ACDC mode, a DCAC mode, and a PFC mode. The DCDC mode is a driving state in which the input DC power is converted into a predetermined voltage and output. The ACDC mode is a driving state in which the input AC power is converted into DC power and output. The DCAC mode is a driving state in which the input DC power is converted into AC power and output. The PFC mode is a mode in which it is driven as a power factor correction circuit, and is a driving state in which the phase difference between the voltage and the current is reduced to improve the power factor.

[0022] As a first mode, when the semiconductor module 1 is driven in the DCDC mode, the first connection terminal pair 11 becomes an input / output terminal, and the fourth connection terminal pair 14 becomes an input / output terminal. The DCDC mode includes two connection methods: a first pattern in which the first connection terminal pair 11 is used as an input terminal and the fourth connection terminal pair 14 is used as an output terminal, and a second pattern in which the fourth connection terminal pair 14 is used as an input terminal and the first connection terminal pair 11 is used as an input terminal.

[0023] In the DCDC mode of the first pattern, an external DC circuit on the input side is connected to the first connection terminal pair 11, an external DC circuit on the output side is connected to the fourth connection terminal pair 14, the second connection terminal pair 12 is electrically open, and the third connection terminal pair 13 is short-circuited. In this state, the semiconductor module 1 converts the DC power input from the first connection terminal pair 11 into a predetermined voltage and outputs it from the fourth connection terminal pair 14. In this case, the semiconductor module 1 functions as a buck-boost converter. When functioning as a boost converter, the semiconductor module 1 boosts the DC voltage applied to the first connection terminal pair 11 and outputs it to the fourth connection terminal pair 14. When functioning as a buck converter, the semiconductor module 1 steps down the DC voltage applied to the first connection terminal pair 11 and outputs it to the fourth connection terminal pair 14.

[0024] In the DCDC mode of the second pattern, an external DC circuit on the input side is connected to the fourth connection terminal pair 14, an external DC circuit on the output side is connected to the first connection terminal pair 11, the second connection terminal pair 12 is electrically open, and the third connection terminal pair 13 is short-circuited. In this state, the semiconductor module 1 converts the DC power input from the fourth connection terminal pair 14 into a predetermined voltage and outputs it from the first connection terminal pair 11. In this case, the semiconductor module 1 functions as a buck-boost converter. When functioning as a boost converter, the semiconductor module 1 boosts the DC voltage applied to the fourth connection terminal pair 14 and outputs it to the first connection terminal pair 11. When functioning as a buck converter, the semiconductor module 1 steps down the DC voltage applied to the fourth connection terminal pair 14 and outputs it to the first connection terminal pair 11.

[0025] As the second mode, when the semiconductor module 1 is driven in the ACDC mode, the third connection terminal pair 13 becomes the input terminal, and the first connection terminal pair 11 or the fourth connection terminal pair 14 becomes the output terminal. The ACDC mode includes two connection methods: a first pattern with the first connection terminal pair 11 as the output terminal and a second pattern with the fourth connection terminal pair 14 as the output terminal.

[0026] In the ACDC mode of the first pattern, an external AC circuit on the input side is connected to the third connection terminal pair 13, an external DC circuit on the output side is connected to the first connection terminal pair 11, the second connection terminal pair 12 is short-circuited, and the fourth connection terminal pair 14 is electrically opened. In this state, the semiconductor module 1 converts the AC power input from the third connection terminal pair 13 into DC power and outputs it from the first connection terminal pair 11.

[0027] In the ACDC mode of the second pattern, an external AC circuit on the input side is connected to the third connection terminal pair 13, an external DC circuit on the output side is connected to the fourth connection terminal pair 14, the second connection terminal pair 12 is short-circuited, and the first connection terminal pair 11 is electrically opened. In this state, the semiconductor module 1 converts the AC power input from the third connection terminal pair 13 into DC power and outputs it from the fourth connection terminal pair 14.

[0028] As the third mode, when the semiconductor module 1 is driven in the DCAC mode, the first connection terminal pair 11 or the fourth connection terminal pair 14 serves as the input terminal, and the third connection terminal pair 13 serves as the output terminal. The DCAC mode includes two connection methods: a first pattern with the first connection terminal pair 11 as the input terminal and a second pattern with the fourth connection terminal pair 14 as the input terminal.

[0029] In the DCAC mode of the first pattern, an external DC circuit on the input side is connected to the first connection terminal pair 11, an external AC circuit on the output side is connected to the third connection terminal pair 13, the second connection terminal pair 12 is short-circuited, and the fourth connection terminal pair 14 is electrically opened. In this state, the semiconductor module 1 converts the DC power input from the first connection terminal pair 11 into AC power and outputs it from the third connection terminal pair 13.

[0030] In the DCAC mode of the second pattern, an external DC circuit on the input side is connected to the fourth connection terminal pair 14, an external AC circuit on the output side is connected to the third connection terminal pair 13, the second connection terminal pair 12 is short-circuited, and the first connection terminal pair 11 is electrically opened. In this state, the semiconductor module 1 converts the DC power input from the fourth connection terminal pair 14 into AC power and outputs it from the third connection terminal pair 13.

[0031] As a fourth mode, when the semiconductor module 1 is driven in the PFC mode, the third connection terminal pair 13 serves as an input terminal, and the first connection terminal pair 11 or the fourth connection terminal pair 14 serves as an output terminal. The PFC mode includes two connection methods: a first pattern with the first connection terminal pair 11 as the output terminal and a second pattern with the fourth connection terminal pair 14 as the output terminal.

[0032] In the PFC mode of the first pattern, an external AC circuit on the input side is connected to the third connection terminal pair 13, an external DC circuit on the output side is connected to the first connection terminal pair 11, the second connection terminal pair 12 is short-circuited, and the fourth connection terminal pair 14 is electrically opened. In this state, the semiconductor module 1 converts the AC power input from the third connection terminal pair 13 into DC power and outputs it from the first connection terminal pair 11.

[0033] In the PFC mode of the second pattern, an external AC circuit on the input side is connected to the third connection terminal pair 13, an external DC circuit on the output side is connected to the fourth connection terminal pair 14, the second connection terminal pair 12 is short-circuited, and the first connection terminal pair 11 is electrically opened. In this state, the semiconductor module 1 converts the AC power input from the third connection terminal pair 13 into DC power and outputs it from the fourth connection terminal pair 14.

[0034] In this way, the semiconductor module 1 has different connection destinations connected to any two of the first connection terminal pair 11, the third connection terminal pair 13, and the fourth connection terminal pair 14. In this connection state, the semiconductor module 1 converts the power input from one connection destination into the desired power and outputs it to the other connection destination.

[0035] As described above, according to the embodiment, by appropriately switching the connection on the external circuit side and performing appropriate switching control, the semiconductor module 1 can be applied to various power converters. Also, cost reduction can be expected due to the mass production effect.

[0036] Note that the semiconductor module 1 is not limited to the configuration shown in FIG. 1, and may incorporate a control circuit and sensors. For example, the semiconductor module 1 may include a drive circuit for a switching element, and may include a control circuit that determines ON and OFF of the drive circuit, and a power supply for driving the drive circuit. The semiconductor module 1 may include a function for abnormal stop or communication with an external circuit. The semiconductor module 1 may include a communication circuit with an external circuit. The semiconductor module 1 may include sensors such as a voltage sensor, a current sensor, and a thermistor.

[0037] In addition, the semiconductor module 1 may incorporate passive components and sub-circuits. For example, the semiconductor module 1 may be configured to include a reactor and a capacitor. The reactor and the capacitor may be mounted on the semiconductor module 1, or may be mounted on an external connection destination.

[0038] FIG. 2 is a schematic diagram showing a semiconductor module according to a first modification. The semiconductor module according to the first modification includes a first capacitor C1, a second capacitor C2, a third capacitor C3, and a reactor L.

[0039] As shown in FIG. 2, the first capacitor C1 connects between the first wiring 31 and the second wiring 32. The first capacitor C1 is connected in parallel with the first upper and lower arms 41, and is connected between the first terminal 21 and the second terminal 22 of the first connection terminal pair 11. As shown in FIG. 3, in a driving state where the first connection terminal pair 11 serves as an input / output terminal for DC power, the first capacitor C1 functions as a smoothing capacitor that smooths the voltage of the DC power input / output to the first connection terminal pair 11.

[0040] The second capacitor C2 connects between the third wiring 33 and the second wiring 32. The second capacitor C2 is connected in parallel with the second upper and lower arms 42, and is connected between the seventh terminal 27 and the eighth terminal 28 of the fourth connection terminal pair 14. As shown in FIGS. 2 and 3, in a driving state where the fourth connection terminal pair 14 serves as an input / output terminal for DC power, the second capacitor C2 functions as a smoothing capacitor that smooths the voltage of the DC power input / output to the fourth connection terminal pair 14.

[0041] The third capacitor C3 connects between the fourth wiring 34 and the fifth wiring 35. The reactor L is provided on the fourth wiring 34. The third capacitor C3 and the reactor L constitute an LC filter connected between the fifth terminal 25 and the sixth terminal 26 of the third connection terminal pair 13. As shown in FIG. 4, in the driving state where the third connection terminal pair 13 serves as the input / output terminal of AC power, the reactor L and the third capacitor C3 function as an LC filter.

[0042] Note that the semiconductor module 1 of the first modification example is not limited to the configuration shown in FIG. 2. For example, not only the first capacitor C1 but also a coil or an LC filter may be connected to the first connection terminal pair 11. Not only the second capacitor C2 but also a coil or an LC filter may be connected to the fourth connection terminal pair 14. Not only an LC filter but also a capacitor or a coil may be connected to the third connection terminal pair 13.

[0043] Also, as shown in FIG. 4, when driving the semiconductor module 1 of the first modification example in the AC-DC mode, DC-AC mode, or PFC mode, the first capacitor C1 may not be provided. In other words, it is only necessary to provide a capacitor only on the side of the connection terminal pair connected to the external circuit on the DC side. In the example shown in FIG. 4, since the fourth connection terminal pair 14 is used as the input / output terminal, it is only necessary to provide the second capacitor C2, and the first capacitor C1 on the side of the first connection terminal pair 11 that is electrically open may not be provided. Conversely, when the first connection terminal pair 11 is used as the input / output terminal, it is only necessary to provide the first capacitor C1, and the second capacitor C2 on the side of the fourth connection terminal pair 14 that is electrically open may not be provided.

[0044] FIG. 5 is a schematic diagram showing a semiconductor module according to a second modified example. The semiconductor module 1 according to the second modified example includes a bridge circuit 4 in which two switching elements are connected in parallel. The upper arm of the first upper and lower arm 41 is an element in which the first switching element SW11 and the switching element SW12 are connected in parallel. The lower arm of the first upper and lower arm 41 is an element in which the second switching element SW21 and the switching element SW22 are connected in parallel. The upper arm of the second upper and lower arm 42 is an element in which the third switching element SW31 and the switching element SW32 are connected in parallel. The lower arm of the second upper and lower arm 42 is an element in which the fourth switching element SW41 and the switching element SW42 are connected in parallel.

[0045] FIG. 6 is a schematic diagram showing a semiconductor module according to a third modified example. The semiconductor module 1 according to the third modified example includes a bridge circuit 4 configured as a half-bridge circuit and a wiring 3 including a sixth wiring 36. The bridge circuit 4 which is a half-bridge circuit has a first upper and lower arm 41. The sixth wiring 36 connects between the third wiring 33 and the second wiring 32. The fifth wiring 35 connects between the sixth terminal 26 and the sixth wiring 36. This semiconductor module 1 can be driven in any one of a DCDC mode, an ACDC mode, a DCAC mode, and a PFC mode.

Description of Reference Numerals

[0046] 1 Semiconductor module 2 External connection terminal 3 Wiring 4 Bridge circuit 11 First connection terminal pair 12 Second connection terminal pair 13 Third connection terminal pair 14 Fourth connection terminal pair 21 First terminal 22 Second terminal 23 Third terminal 24 Fourth terminal 25 Fifth terminal 26 Sixth terminal 27 Seventh terminal 28 Eighth terminal 31 First wiring 32 Second wiring 33 Third wiring 34 Fourth wiring 35 Fifth wiring 41 First upper and lower arm 42 Second upper and lower arm

Claims

1. An external connection terminal, A wiring connected to the external connection terminal, A full-bridge circuit including a plurality of switching elements, A semiconductor module comprising: The external connection terminal A first connection terminal pair including a first terminal and a second terminal, A second connection terminal pair including a third terminal and a fourth terminal, A third connection terminal pair including a fifth terminal and a sixth terminal, A fourth connection terminal pair including a seventh terminal and an eighth terminal, The wiring A first wiring connecting the first terminal and the third terminal, A second wiring connecting the second terminal and the eighth terminal, A third wiring connecting the fourth terminal and the seventh terminal, A fourth wiring connected to the fifth terminal, A fifth wiring connected to the sixth terminal, The full-bridge circuit A first upper and lower arm connecting between the first wiring and the second wiring, A second upper and lower arm connecting between the third wiring and the second wiring, The fourth wiring connects between the connection point of the upper arm and the lower arm of the first upper and lower arm and the fifth terminal, The fifth wiring connects between the connection point of the upper arm and the lower arm of the second upper and lower arm and the sixth terminal A semiconductor module characterized by the above.

2. In a state where the second connection terminal pair is short-circuited or electrically open, and different connection destinations are respectively connected to any two of the first connection terminal pair, the third connection terminal pair, and the fourth connection terminal pair, it enters a driving state in which the power input from the connection destination on the input side is converted and output to the connection destination on the output side. The driving state is any one of a plurality of modes. The plurality of modes A first mode in which the input DC power is converted to a predetermined voltage and output, A second mode in which the input DC power is converted to AC power and output, A third mode in which the input AC power is converted to DC power and output, Including a fourth mode of driving as a power factor improvement circuit The semiconductor module according to claim 1, characterized by the above.

3. In the first mode, The connection destination on the first AC side is connected to the first connection terminal pair, The connection destination on the second AC side is connected to the fourth connection terminal pair, The second connection terminal pair is electrically open, The third connection terminal pair is short-circuited The semiconductor module according to claim 2, characterized by the above.

4. In the second mode, the third mode, and the fourth mode, The connection destination on the AC side is connected to the third connection terminal pair, Either one of the first connection terminal pair and the fourth connection terminal pair is connected to the connection destination on the DC side, the other one of the first connection terminal pair and the fourth connection terminal pair is electrically open, and the second connection terminal pair is short-circuited. The semiconductor module according to claim 2 or 3, characterized in that.

5. An external connection terminal, a wiring connected to the external connection terminal, a half-bridge circuit including a plurality of switching elements, A semiconductor module comprising: The external connection terminal, a first connection terminal pair including a first terminal and a second terminal, a second connection terminal pair including a third terminal and a fourth terminal, a third connection terminal pair including a fifth terminal and a sixth terminal, a fourth connection terminal pair including a seventh terminal and an eighth terminal, The wiring, a first wiring connecting between the first terminal and the third terminal, a second wiring connecting between the second terminal and the eighth terminal, a third wiring connecting between the fourth terminal and the seventh terminal, a fourth wiring connected to the fifth terminal, a fifth wiring connected to the sixth terminal, and a sixth wiring connecting between the second wiring and the third wiring, The half-bridge circuit has upper and lower arms connecting between the first wiring and the second wiring, The fourth wiring connects between the connection point of the upper arm and the lower arm of the upper and lower arms and the fifth terminal, The fifth wiring connects between the sixth wiring and the sixth terminal. A semiconductor module characterized by that.

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