Substrate processing system, inspection module, and inspection method

Abstract

To provide a technique capable of inspecting the fill state of a filler applied to a peripheral portion of a laminated substrate without immersing the entire laminated substrate in a liquid.SOLUTION: A substrate processing system 1 comprises: a substrate holding device 2 that holds and rotates a laminated substrate Ws in a vertical orientation; a coating device 3 that applies a filler F to a target application region T included in a peripheral portion of the laminated substrate Ws; and an inspection device 5 that inspects the fill state of the filler F applied to the target application region T. The inspection device 5 comprises: a liquid tank 30 configured to hold a liquid L for locally immersing only the peripheral portion of the laminated substrate Ws; and an ultrasonic imaging device 32 that generates an ultrasonic image of the target application region T when immersed in the liquid L.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a technique for inspecting the filling state of a filler applied to a laminated substrate in which a plurality of substrates are joined.

Background Art

[0002] In recent years, in order to achieve further high density and high functionality of semiconductor devices, development of three-dimensional packaging technology for laminating a plurality of substrates for three-dimensional integration has been progressing. In three-dimensional packaging technology, for example, the device surface of a first substrate on which an integrated circuit and electrical wiring are formed is joined to the device surface of a second substrate on which an integrated circuit and electrical wiring are formed. Further, after joining the first substrate to the second substrate, the second substrate is thinned by a polishing device or a grinding device. In this way, integrated circuits can be laminated in a direction perpendicular to the device surfaces of the first substrate and the second substrate.

[0003] In three-dimensional packaging technology, three or more substrates may be joined. For example, after thinning the second substrate joined to the first substrate, the third substrate may be joined to the second substrate and the third substrate may be thinned. In this specification, the form of a plurality of substrates joined to each other may be referred to as a "laminated substrate".

[0004] Normally, the edge portion of a substrate is pre-polished into a rounded shape or a chamfered shape in order to prevent cracking or chipping. When a second substrate having such a shape is ground, as a result, a sharp end portion is formed on the second substrate. This sharp end portion (hereinafter referred to as a "knife edge portion") is formed by the back surface of the ground second substrate and the outer peripheral surface of the second substrate. Such a knife edge portion is liable to chip due to physical contact, and the laminated substrate itself may be damaged during conveyance of the laminated substrate. Further, if the joining between the first substrate and the second substrate is not sufficient, the second substrate may crack during grinding.

[0005] Therefore, in order to prevent cracks or chipping in the knife edge portion, a filler is applied to the edge portion of the laminated substrate before grinding the second substrate. The filler is applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate. The filler can support the knife edge portion formed after grinding the second substrate and prevent cracks and chipping in the knife edge portion.

[0006] However, when applying the filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate, filling defects such as insufficient filler or over-application may occur under the preset application conditions. If the laminated substrate is processed in subsequent steps with filling defects remaining, it may cause damage to the laminated substrate and have an adverse effect on the laminated substrate and process performance, such as scratching the laminated substrate. Therefore, as described in Patent Document 1, inspection of the filling state of the filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate is performed non-destructively using infrared rays.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] As another method for non-destructively inspecting the filling state of the filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate, there is a method of irradiating the laminated substrate to be inspected with ultrasonic waves and detecting the reflected waves. The higher the frequency of the ultrasonic waves, the more capable of high-resolution inspection, but high-frequency ultrasonic waves tend to attenuate as the propagation progresses. Therefore, the laminated substrate to be inspected is immersed in a liquid (for example, pure water) in which the attenuation of ultrasonic waves is smaller than that in air to inspect the filling state of the filler.

[0009] However, when the entire laminated substrate is immersed in a liquid, it takes time to dry the liquid adhering to the entire laminated substrate, and watermarks (water stains) or the like may occur on the surface of the laminated substrate after drying, resulting in contamination of the laminated substrate.

[0010] Therefore, an object of the present invention is to provide a technique capable of inspecting the filling state of a filler applied to the peripheral portion of a laminated substrate without immersing the entire laminated substrate in a liquid.

Means for Solving the Problems

[0011] In one aspect, there is provided a substrate processing system for applying a filler to a peripheral portion of a laminated substrate in which a first substrate and a second substrate are joined together, the substrate processing system including a substrate holding device configured to hold and rotate the laminated substrate in a vertical posture, a coating device configured to apply the filler to a target coating region included in the peripheral portion of the laminated substrate, and an inspection device configured to inspect a filling state of the filler applied to the target coating region, the inspection device including a liquid tank configured to hold a liquid for locally immersing only the peripheral portion of the laminated substrate, and an ultrasonic imaging device configured to generate an ultrasonic image of the target coating region when immersed in the liquid. In one aspect, the substrate processing system further includes a curing device configured to cure the filler applied to the target coating region, and the curing device is disposed downstream of the coating device and upstream of the ultrasonic imaging device in the rotation direction of the laminated substrate.

[0012] In one aspect, the substrate processing system further includes a control device configured to determine a filling state of the filler in the target coating region based on the ultrasonic image. In one aspect, the control device is configured to control an operation of the coating device and is configured to end application of the filler to the target coating region based on the filling state. In one aspect, the substrate processing system further includes a gas blower that blows gas onto the laminated substrate to remove the liquid adhering to the laminated substrate, and the gas blower is disposed on the downstream side of the liquid tank in the rotational direction of the laminated substrate.

[0013] In one aspect, there is provided an inspection module for inspecting the filling state of a filler applied to the peripheral portion of a laminated substrate in which a first substrate and a second substrate are joined, the inspection module including a substrate holding device that holds and rotates the laminated substrate in a vertical posture, a liquid tank configured to hold a liquid for locally immersing only the peripheral portion of the laminated substrate including the target application region of the filler, and an ultrasonic imaging device that generates an ultrasonic image of the target application region when immersed in the liquid. In one aspect, the inspection module further includes an imaging device moving mechanism that moves the ultrasonic imaging device in the radial direction of the laminated substrate. In one aspect, the inspection module further includes a gas blower that blows gas onto the laminated substrate to remove the liquid adhering to the laminated substrate, and the gas blower is disposed on the downstream side of the liquid tank in the rotational direction of the laminated substrate. In one aspect, the inspection module further includes a control device that determines the filling state of the filler in the target application region based on the ultrasonic image.

[0014] In one aspect, there is provided an inspection method for inspecting the filling state of a filler applied to the peripheral portion of a laminated substrate in which a first substrate and a second substrate are joined, the inspection method including holding the laminated substrate in a vertical posture, locally immersing only the peripheral portion of the laminated substrate including the target application region of the filler in a liquid in a liquid tank, rotating the laminated substrate in a vertical posture, and generating an ultrasonic image of the target application region immersed in the liquid by an ultrasonic imaging device. In one aspect, the ultrasonic image of the target application region is generated while moving the ultrasonic imaging device in the radial direction of the laminated substrate. In one aspect, the inspection method further includes blowing a gas onto the laminated substrate by a gas blower to remove the liquid adhering to the laminated substrate, and the gas blower is disposed on the downstream side of the liquid tank in the rotation direction of the laminated substrate. In one aspect, the inspection method further includes determining a filling state of the filler in the target application area based on the ultrasonic image.

[0015] In one aspect, the inspection method further includes applying the filler to the target application area while rotating the laminated substrate in a vertical posture, and generating the ultrasonic image by the ultrasonic imaging device is performed while applying the filler to the target application area. In one aspect, the inspection method further includes curing the filler applied to the target application area by a curing device, and the curing device is disposed on the downstream side of the coating device and on the upstream side of the ultrasonic imaging device in the rotation direction of the laminated substrate. In one aspect, the inspection method includes determining a filling state of the filler in the target application area based on the ultrasonic image, and further includes ending the application of the filler to the target application area based on the filling state. In one aspect, after starting the application of the filler, the generation of the ultrasonic image is started, and after stopping the application of the filler, the laminated substrate is further rotated to generate the ultrasonic images of the entire circumference of the target application area.

Advantages of the Invention

[0016] According to the present invention, only the peripheral portion of the laminated substrate including the target application area of the filler is locally immersed in the liquid, and an ultrasonic image of the target application area immersed in the liquid is generated. Thereby, the filling state of the filler applied to the target application area can be inspected without immersing the entire laminated substrate in the liquid. As a result, the drying time of the laminated substrate can be shortened, and contamination of the laminated substrate due to water spots or the like generated after drying can be suppressed.

Brief Description of the Drawings

[0017]

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Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1(a) is a cross-sectional view showing an example of the peripheral portion of the laminated substrate to be processed. As shown in FIG. 1(a), the laminated substrate Ws has a structure in which the flat surface (for example, the device surface) S1 of the first substrate W1 and the flat surface (for example, the device surface) S2 of the second substrate W2 are joined. The first substrate W1 and the second substrate W2 used in this embodiment are circular.

[0019] The edge portion E1 of the first substrate W1 is the outermost portion inclined with respect to the flat surface (for example, the device surface) S1 of the first substrate W1. More specifically, the edge portion E1 of the first substrate W1 has a rounded shape or a chamfered shape. Similarly, the edge portion E2 of the second substrate W2 is the outermost portion inclined with respect to the flat surface (for example, the device surface) S2 of the second substrate W2. More specifically, the edge portion E2 of the second substrate W2 has a rounded shape or a chamfered shape. The edge portions E1 and E2 may also be called bevel portions.

[0020] In the example of FIG. 1(a), in the laminated substrate Ws, a part of the flat surface S1 adjacent to the edge portion E1 of the first substrate W1 and a part of the flat surface S2 adjacent to the edge portion E2 of the second substrate W2 are not joined. The first substrate W1 has a non-joined portion N1 including the non-joined part of the flat surface S1, and the second substrate W2 has a non-joined portion N2 including the non-joined part of the flat surface S2. The peripheral portion of the laminated substrate Ws includes the edge portion E1 of the first substrate W1, the edge portion E2 of the second substrate W2, the non-joined portion N1 of the first substrate W1, and the non-joined portion N2 of the second substrate W2. A gap is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2, and between the non-joined portion N1 of the first substrate W1 and the non-joined portion N2 of the second substrate W2, respectively.

[0021] FIG. 1(b) is a cross-sectional view showing an example of the peripheral portion of the laminated substrate Ws coated with the filler F. The target coating region T to which the filler F is to be applied is a region composed of the gap between the edge portion E1 and the edge portion E2 and the gap between the non-joined portion N1 and the non-joined portion N2. The filler F is applied so as to fill the target coating region T. The target coating region T is formed over the entire circumference of the laminated substrate Ws and has a substantially triangular cross-section. In one embodiment, the width of the target coating region T in the radial direction of the laminated substrate Ws is in the range of 0.3 mm to 3 mm.

[0022] In one embodiment, in the laminated substrate Ws, the entire flat surface S1 of the first substrate W1 and the entire flat surface S2 of the second substrate W2 may be joined. In this case, the target coating region T is the gap between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.

[0023] FIG. 1(c) is a cross-sectional view showing an example of the peripheral portion of the laminated substrate Ws thinned after the filler F is applied. As a result of this thinning process, a knife edge portion Ek is formed at the edge portion E2 of the second substrate W2. Since the knife edge portion Ek is held (supported) by the filler F, cracking or chipping of the knife edge portion Ek is prevented.

[0024] FIG. 2 is a front view showing an embodiment of the substrate processing system 1, and FIG. 3 is a side view of the substrate processing system 1 shown in FIG. 2. The substrate processing system 1 is an apparatus for applying a filler F to the peripheral portion of a laminated substrate Ws in which a first substrate W1 and a second substrate W2 are bonded, and inspecting the filling state of the filler F applied to the peripheral portion of the laminated substrate Ws. The substrate processing system 1 includes a substrate holding device 2 that holds the laminated substrate Ws in a vertical posture and rotates the laminated substrate Ws, a coating device 3 that applies the filler F to the peripheral portion of the laminated substrate Ws, a curing device 4 that cures the filler F applied to the peripheral portion of the laminated substrate Ws, and an inspection device 5 that inspects the filling state of the filler F applied to the peripheral portion of the laminated substrate Ws.

[0025] The substrate holding device 2 includes a holding stage 12 that holds the back surface of the laminated substrate Ws, a rotating shaft 13 connected to the central portion of the holding stage 12, and a rotation mechanism 15 that rotates the holding stage 12 and the rotating shaft 13. The holding stage 12 is configured to hold the back surface of the laminated substrate Ws by vacuum suction. As shown in FIG. 3, the holding stage 12 has a holding surface 12a perpendicular to the horizontal plane. The laminated substrate Ws is held in a vertical posture by the holding stage 12. In the present embodiment, the laminated substrate Ws is held by the holding surface 12a of the holding stage 12 such that its flat portion is 90 degrees with respect to the horizontal plane. However, as will be described later, as long as only the peripheral portion of the laminated substrate Ws can be locally immersed in the liquid, the angle of the holding surface 12a of the holding stage 12 (that is, the flat portion of the laminated substrate Ws) with respect to the horizontal plane is not limited to the present embodiment. In one embodiment, the angle of the holding surface 12a of the holding stage 12 (that is, the flat portion of the laminated substrate Ws) with respect to the horizontal plane may be in the range of 30 degrees to 90 degrees.

[0026] The laminated substrate Ws is held by the holding stage 12 such that the center of the laminated substrate Ws coincides with the axis Cr of the rotating shaft 13. The rotation mechanism 15 includes a motor (not shown). The rotation mechanism 15 is configured to integrally rotate the holding stage 12 and the laminated substrate Ws about the axis Cr of the rotating shaft 13 in the direction indicated by the arrow in FIG. 2.

[0027] In one embodiment, instead of the holding stage 12, the substrate holding device 2 includes a plurality of (e.g., four) rollers (not shown) that can contact the peripheral portion of the stacked substrate Ws, and the stacked substrate Ws may be held in a vertical posture by these rollers. In this case, instead of the rotation shaft 13 and the rotation mechanism 15, the substrate holding device 2 includes a roller rotation mechanism (not shown) that rotates each roller in the same direction at the same speed about its axis. By rotating the plurality of rollers by the roller rotation mechanism, the stacked substrate Ws is rotated about the central axis Cr of the stacked substrate Ws.

[0028] As shown in FIG. 3, the substrate processing system 1 further includes a substrate vertical movement mechanism 18 that moves the stacked substrate Ws held by the substrate holding device 2 up and down. The substrate vertical movement mechanism 18 is connected to the substrate holding device 2. The substrate vertical movement mechanism 18 is configured to move the substrate holding device 2 and the stacked substrate Ws held by the substrate holding device 2 in a direction perpendicular to the axis Cr of the rotation shaft 13. In other words, the substrate vertical movement mechanism 18 is configured to move the substrate holding device 2 and the stacked substrate Ws held by the substrate holding device 2 in the radial direction of the stacked substrate Ws. In FIG. 3, the substrate vertical movement mechanism 18 is schematically depicted.

[0029] Examples of the substrate vertical movement mechanism 18 include a combination of a linear movement mechanism (such as a ball screw mechanism or a cylinder mechanism) and a motor (such as a servo motor or a stepping motor), a linear electric actuator (such as a linear motor), and an air cylinder.

[0030] The coating device 3 is located outside the radial direction of the stacked substrate Ws held by the substrate holding device 2 and is disposed opposite the target coating region T above the stacked substrate Ws. The coating device 3 is configured to apply the filler F to the target coating region T of the stacked substrate Ws. The application of the filler F by the coating device 3 is performed while rotating the stacked substrate Ws by the substrate holding device 2.

[0031] FIG. 4 is a schematic diagram showing an embodiment of the coating device 3. The coating device 3 includes a syringe 21 for discharging the filler F, a piston 22 that can reciprocate within the syringe 21, and a syringe moving mechanism (not shown) for moving the syringe 21 closer to or away from the laminated substrate Ws. By this syringe moving mechanism, the coating device 3 can adjust the distance between the laminated substrate Ws and the filler discharge port 21a of the coating device 3. In one embodiment, the coating device 3 may omit the syringe moving mechanism. In this case, the distance between the laminated substrate Ws and the filler discharge port 21a is predetermined so that the filler F is appropriately injected into the target coating region T of the laminated substrate Ws.

[0032] The syringe 21 has a hollow structure and is configured such that the filler F is filled therein. The piston 22 is disposed within the syringe 21. The syringe 21 has a filler discharge port 21a at its tip for discharging the filler F. The tip of the syringe 21 including the filler discharge port 21a may be configured to be detachable. The shape of the filler discharge port 21a is selected to be an appropriate shape according to the physical properties (e.g., viscosity, etc.) of the filler F to be coated. The filler discharge port 21a is disposed so as to face the target coating region T of the laminated substrate Ws.

[0033] The coating device 3 includes a gas supply line 25 connected to a gas supply source and a pressure adjustment device 26 disposed in the gas supply line 25. The syringe 21 is connected to the gas supply source via the gas supply line 25. When gas (e.g., dry air or nitrogen gas) is supplied from the gas supply source to the syringe 21, the piston 22 advances within the syringe 21. By the advancement of the piston 22, the filler F within the syringe 21 is discharged from the filler discharge port 21a. By adjusting the pressure of the gas supplied from the gas supply source to the syringe 21 by the pressure adjustment device 26, the amount of the filler F discharged from the filler discharge port 21a per unit time can be adjusted. When the filler F is discharged from the filler discharge port 21a, the filler F falls toward the target coating region T of the laminated substrate Ws. In this way, the coating device 3 can coat the filler F on the target coating region T of the laminated substrate Ws.

[0034] In one embodiment, instead of the combination of the syringe 21 and the piston 22, the coating device 3 may include a screw feeder.

[0035] As shown in FIG. 2, the curing device 4 is located radially outside the laminated substrate Ws held by the substrate holding device 2 and is disposed to face the target coating region T of the laminated substrate Ws. The curing device 4 is located downstream of the coating device 3 in the rotational direction of the laminated substrate Ws and upstream of the ultrasonic imaging device 32 of the inspection device 5 described later. The curing device 4 is configured to heat and cure the filler F applied to the target coating region T of the laminated substrate Ws by the coating device 3. The curing of the filler F by the curing device 4 is performed while the laminated substrate Ws is rotated by the substrate holding device 2. In the present embodiment, the filler F is a thermosetting filler. Examples of such fillers include thermosetting resins.

[0036] The filler F includes a binder, a solvent, particles, etc. The particles are dispersed in the binder dissolved in the solvent. For example, the composition of the filler F is the type of binder, the amount of solvent, the amount of particles, and the size of the particles. Examples of the binder include an inorganic binder containing an alkali metal silicate, an organic binder composed of a silicone resin or an epoxy resin, and an inorganic-organic hybrid binder. The particles are, for example, particles such as silica or alumina. The particles are mixed into the binder to increase the volume of the filler F and to adjust the viscosity of the filler F. In order to lower the viscosity of the filler F, the filler F may not contain particles.

[0037] The curing device 4 of the present embodiment is an air heater and is configured to blow hot air toward the filler F applied to the laminated substrate Ws. The filler F heated by the hot air is cured by a crosslinking reaction. When the filler F contains a solvent, the solvent is volatilized by heating. The curing device 4 is not limited to an air heater as long as it can heat and cure the filler F, and may have other configurations such as a lamp heater.

[0038] In this embodiment, the filler F is a thermosetting filler. However, in one embodiment, the filler F may be an ultraviolet-curable filler. In this case, the curing device 4 may be a UV irradiation device that irradiates ultraviolet rays to cure the filler F. When the filler F contains a solvent, an air heater or the like may be used in combination to heat the filler F to volatilize the solvent.

[0039] The substrate processing system 1 further includes a control device 10 that controls the operations of the substrate holding device 2, the substrate vertical movement mechanism 18, the coating device 3, and the curing device 4. The substrate holding device 2, the substrate vertical movement mechanism 18, the coating device 3, and the curing device 4 are electrically connected to the control device 10.

[0040] The control device 10 is composed of at least one computer. The control device 10 includes a storage device 10a in which a program is stored, and a processing device 10b that executes calculations according to instructions included in the program. The storage device 10a includes a main storage device such as a random access memory (RAM), and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the processing device 10b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the control device 10 is not limited to these examples.

[0041] As shown in FIGS. 2 and 3, the inspection device 5 includes a liquid tank 30 configured to hold a liquid L for locally immersing only the peripheral portion of the laminated substrate Ws including the target coating region T of the filler F, and an ultrasonic imaging device 32 that generates an ultrasonic image of the target coating region T of the laminated substrate Ws when immersed in the liquid L in the liquid tank 30. The laminated substrate Ws held by the substrate holding device 2 is lowered by the above-described substrate vertical movement mechanism 18, and only the peripheral portion of the laminated substrate Ws is locally immersed in the liquid L in the liquid tank 30. More specifically, only the lower portion of the peripheral portion of the laminated substrate Ws held by the substrate holding device 2 is locally immersed in the liquid L in the liquid tank 30.

[0042] FIG. 5 is a schematic diagram showing a state in which the ultrasonic imaging device 32 generates an ultrasonic image of the target coating region T of the laminated substrate Ws. The peripheral portion of the laminated substrate Ws is the outer peripheral region of the laminated substrate Ws immersed in the liquid L in the liquid tank 30. In one embodiment, the peripheral portion of the laminated substrate Ws is a region from the outermost end to 10 mm inward in the radial direction of the laminated substrate Ws. When only the peripheral portion of the laminated substrate Ws is locally immersed in the liquid L in the liquid tank 30, the other portions including the central region of the laminated substrate Ws are not in contact with the liquid L.

[0043] When only the peripheral portion of the laminated substrate Ws is locally immersed in the liquid L in the liquid tank 30, the bottom surface 30a of the liquid tank 30 is located below the laminated substrate Ws held by the substrate holding device 2. That is, the depth of the liquid L in the liquid tank 30 is greater than the width of the peripheral portion in the radial direction of the laminated substrate Ws. The liquid surface La of the liquid L in the liquid tank 30 is at a position higher than the target coating region T of the laminated substrate Ws. As an example of the liquid L, pure water can be mentioned, but the liquid L is not limited to this example, and other liquids may be used as long as they can transmit ultrasonic waves.

[0044] The ultrasonic imaging device 32 includes an ultrasonic probe 32a that transmits and receives ultrasonic waves, and an image processing unit 32b that generates an ultrasonic image from the reflection signal output from the ultrasonic probe 32a. The ultrasonic imaging device 32 penetrates the side wall 30b of the liquid tank 30. The ultrasonic probe 32a is disposed in the liquid tank 30 and immersed in the liquid L held in the liquid tank 30. A seal member 33 is disposed between the side wall 30b of the portion where the ultrasonic imaging device 32 penetrates the side wall 30b and the ultrasonic imaging device 32, and the seal member 33 seals the liquid L in the liquid tank 30 so as not to leak. In one embodiment, the ultrasonic imaging device 32 has waterproof performance, and the entire ultrasonic imaging device 32 may be disposed in the liquid tank 30.

[0045] The ultrasonic imaging device 32 is arranged perpendicular to the laminated substrate Ws and is disposed to face the back surface (the non-bonding surface of the first substrate W1) of the laminated substrate Ws. In one embodiment, the ultrasonic imaging device 32 may be disposed to face the front surface (the non-bonding surface of the second substrate W2) of the laminated substrate Ws. The ultrasonic probe 32a is configured to irradiate ultrasonic waves to the peripheral portion of the laminated substrate Ws and receive the ultrasonic waves reflected from the laminated substrate Ws. The ultrasonic waves irradiated from the ultrasonic probe 32a propagate through the liquid L in the liquid tank 30 and are reflected from the laminated substrate Ws. A part of the ultrasonic waves further propagates through the laminated substrate Ws and is reflected from the interface between the first substrate W1 and the target coating region T (the filler F or the void) or the interface between the target coating region T (the filler F or the void) and the second substrate W2.

[0046] In one embodiment, the frequency of the ultrasonic waves irradiated from the ultrasonic probe 32a is in the range of 20 kHz to 300 MHz, preferably in the range of 10 MHz to 100 MHz. The depth to which ultrasonic waves can penetrate the substance to be inspected varies depending on their frequency. This is because the higher the frequency of the ultrasonic waves, the more easily the sound pressure attenuates as they travel through the substance to be inspected. Ultrasonic waves of the above frequencies are suitable for inspecting the target coating region T of the laminated substrate Ws in this embodiment.

[0047] Also, the resolution of the inspection varies depending on the frequency of the ultrasonic waves. In one embodiment, with the ultrasonic probe 32a that irradiates ultrasonic waves in the range of 10 MHz to 100 MHz, the inspection can be performed with an accuracy of approximately 10 μm to 100 μm. For example, with the ultrasonic probe 32a that irradiates ultrasonic waves in the range of 10 MHz to 100 MHz, voids (voids) of approximately 10 μm to 100 μm existing in the target coating region T can be detected.

[0048] The ultrasonic probe 32a receives the ultrasonic waves reflected from the multilayer substrate Ws, outputs a reflection signal, and transmits the reflection signal to the image processing unit 32b. The image processing unit 32b is configured to generate an ultrasonic image of the target coating region T of the multilayer substrate Ws from the reflection signal output from the ultrasonic probe 32a. However, the specific configuration of the ultrasonic imaging device 32 may be other configurations as long as it can generate an ultrasonic image of the target coating region T of the multilayer substrate Ws.

[0049] The generation of the ultrasonic image of the target coating region T by the ultrasonic imaging device 32 is performed while rotating the multilayer substrate Ws by the substrate holding device 2. Thereby, the ultrasonic imaging device 32 can scan the entire circumference of the target coating region T and generate an ultrasonic image of the entire circumference of the target coating region T. The ultrasonic imaging device 32 is electrically connected to the control device 10, and the ultrasonic image of the entire circumference of the target coating region T of the multilayer substrate Ws generated by the ultrasonic imaging device 32 is sent to the control device 10.

[0050] FIG. 6(a) is a cross-sectional view showing an example of the peripheral portion of the multilayer substrate Ws in which the filler F is not applied to the target coating region T, and FIG. 6(b) is a schematic diagram showing the ultrasonic image of the entire circumference of the target coating region T of the multilayer substrate Ws shown in FIG. 6(a). The reference sign D shown in FIGS. 6(a) and 6(b) indicates the imaging region by the ultrasonic imaging device 32. The peripheral portion of the multilayer substrate Ws includes the imaging region D, and the imaging region D includes the target coating region T. In one embodiment, the imaging region D may include only the target coating region T. In one embodiment, the imaging region D is a region from the outermost end to 5 mm inward in the radial direction of the multilayer substrate Ws.

[0051] The laminated substrate Ws shown in Fig. 6(a) is in a state before applying the filler F to the target application area T, and the filling state of the filler F is "unfilled". As shown in Fig. 6(b), the target application area T where the filler F is not applied appears as a color close to white on the ultrasonic image. On the other hand, the portion other than the target application area T within the imaging area D, that is, the portion where the first substrate W1 and the second substrate W2 are joined, appears as a color close to black on the ultrasonic image. This is due to the fact that the intensity of the ultrasonic wave reflected from the laminated substrate Ws for each frequency is different between the portion where the first substrate W1 and the second substrate W2 are not joined (i.e., the target application area T) and the portion where the first substrate W1 and the second substrate W2 are joined.

[0052] Fig. 7(a) is a cross-sectional view showing an example of the peripheral portion of the laminated substrate Ws with the filler F applied to the target application area T, and Fig. 7(b) is a schematic diagram showing the ultrasonic image of the entire circumference of the target application area T of the laminated substrate Ws shown in Fig. 7(a). The laminated substrate Ws shown in Fig. 7(a) is in a state where the target application area T is entirely filled with the filler F, and the filling state of the filler F is "filled". As shown in Fig. 7(b), the target application area T where the filler F is applied appears as a color close to black on the ultrasonic image. As can be seen from the comparison between Fig. 6(b) and Fig. 7(b), the target application area T appears in different colors on the ultrasonic image depending on the presence or absence of the filler F. This is due to the fact that the intensity of the ultrasonic wave reflected from the laminated substrate Ws for each frequency is different between the portion where the filler F is not applied and the portion where the filler F is applied.

[0053] FIG. 8(a) is a cross-sectional view showing an example of the peripheral portion of the laminated substrate Ws in which voids have occurred in a part of the target coating region T, and FIG. 8(b) is a schematic diagram showing an ultrasonic image of the entire circumference of the target coating region T of the laminated substrate Ws shown in FIG. 8(a). The laminated substrate Ws shown in FIG. 8(a) is in a state where voids have occurred in a part of the target coating region T, and the filling state of the filler F is "poor filling". The reference sign V shown in FIGS. 8(a) and 8(b) indicates voids (voids) generated in the target coating region T. As shown in FIG. 8(b), the voids V in the target coating region T where the filler F is not applied appear as a color close to white on the ultrasonic image. In the examples shown in FIGS. 8(a) and 8(b), the voids V occur in a band shape across the entire target coating region T, but the voids V may also occur locally in a part of the target coating region T.

[0054] The ultrasonic images of the entire circumference of the target coating region T of the laminated substrate Ws shown in FIGS. 6(b), 7(b), and 8(b) are circular, but in one embodiment, the ultrasonic image of the entire circumference of the target coating region T of the laminated substrate Ws may be band-shaped. Also, the colors appearing on the ultrasonic images described with reference to FIGS. 6(b), 7(b), and 8(b) are examples, and the colors appearing on the ultrasonic images are not limited to this example.

[0055] The control device 10 is configured to determine the filling state of the filler F in the target coating region T based on the ultrasonic image of the target coating region T of the laminated substrate Ws generated by the ultrasonic imaging device 32. More specifically, the control device 10 is configured to detect the presence or absence of the filler F in the target coating region T from the difference in the colors appearing in the ultrasonic image of the target coating region T, and to determine the filling state of the filler F in the target coating region T. In one embodiment, the control device 10 calculates the filling rate of the filler F in the target coating region T based on the ultrasonic image of the target coating region T sent from the ultrasonic imaging device 32, and determines the filling state of the filler F in the target coating region T based on the filling rate of the filler F in the target coating region T.

[0056] The filling rate of the filler F within the target application area T is the ratio of the area where the filler F is applied to the entire target application area T. The filling rate of the filler F within the target application area T is expressed, for example, as a ratio of 0 to 100%. The control device 10 detects the size of the target application area T (i.e., the area of the target application area T) that appears on the ultrasonic image, and the size of the portion where the filler F is applied within the target application area T (i.e., the area of the portion where the filler F is applied within the target application area T). The control device 10 calculates the filling rate of the filler F within the target application area T from the detected size of the target application area T and the size of the portion where the filler F is applied within the target application area T.

[0057] When the filling rate of the filler F within the target application area T reaches a predetermined threshold value (for example, 100%), the control device 10 determines that the filling state of the filler F in the target application area T is "filling completed". When the filling rate of the filler F within the target application area T has not reached a predetermined threshold value (for example, 100%), the control device 10 determines that the filling state of the filler F in the target application area T is "filling incomplete".

[0058] Based on the ultrasonic image of the target application area T sent from the ultrasonic imaging device 32, the control device 10 detects the void V generated in the target application area T. When a void V is detected within the target application area T, the control device 10 determines that the filling state of the filler F in the target application area T is "poor filling".

[0059] In the present embodiment, the ultrasonic imaging device 32 generates ultrasonic images of the entire circumference of the target application area T of the laminated substrate Ws, and the control device 10 determines the filling state of the filler F in the target application area T based on the ultrasonic images of the entire circumference of the target application area T. However, in one embodiment, the ultrasonic imaging device 32 may generate ultrasonic images of a part of the target application area T in the rotational direction of the laminated substrate Ws, and the control device 10 may determine the filling state of the filler F in the target application area T based on the ultrasonic images of a part of the target application area T.

[0060] In one embodiment, the control device 10 is electrically connected to a display device (not shown) provided in the substrate processing system 1, and may display an ultrasonic image of the target coating area T and / or a determination result of the filling state of the filler F in the target coating area T on the display device. The display device may be arranged at a location away from the substrate processing system 1.

[0061] As shown in FIGS. 2 and 3, the inspection device 5 further includes a gas blower 40 that blows a gas G onto the laminated substrate Ws. In the present embodiment, the inspection device 5 includes three gas blowers 40, and the three gas blowers 40 blow the gas G onto the laminated substrate Ws from the front side, the back side, and the side surface side of the laminated substrate Ws, respectively. In one embodiment, each gas blower 40 is configured to form a curtain-like gas jet. The number of gas blowers 40 is not limited to the present embodiment, and may be two or less or four or more.

[0062] The gas blower 40 is arranged on the downstream side of the ultrasonic imaging device 32 and the liquid tank 30 in the rotation direction of the laminated substrate Ws. The laminated substrate Ws has a liquid L attached to a portion located on the downstream side of the liquid tank 30 in the rotation direction of the laminated substrate Ws. The gas blower 40 is configured to blow the gas G onto the laminated substrate Ws to remove the liquid L attached to the laminated substrate Ws. More specifically, the gas blower 40 is configured to blow the gas G obliquely downward toward the laminated substrate Ws. Thereby, the liquid L attached to the laminated substrate Ws flows downwards together with the gas G, and the liquid L attached to the laminated substrate Ws can be removed. The gas blower 40 is electrically connected to the control device 10, and the operation of the gas blower 40 is controlled by the control device 10. Examples of the gas G include air and inert gas.

[0063] FIG. 9 and FIG. 10 are flowcharts showing an embodiment of a method for inspecting the filling state of the filler F applied to the target application area T of the laminated substrate Ws by the substrate processing system 1. In this embodiment, the coating device 3 applies the filler F to the target application area T while the laminated substrate Ws makes one rotation. The curing device 4 cures the filler F applied to the target application area T while the laminated substrate Ws makes one rotation. The ultrasonic imaging device 32 generates ultrasonic images of the entire circumference of the target application area T while the laminated substrate Ws makes one rotation.

[0064] As shown in FIG. 9, in step S101, the control device 10 gives a command to the substrate holding device 2 to hold the laminated substrate Ws to be processed in a vertical posture. In step S102, the control device 10 gives a command to the substrate vertical movement mechanism 18 to lower the laminated substrate Ws held by the substrate holding device 2 and immerse only the peripheral portion of the laminated substrate Ws locally in the liquid L in the liquid tank 30. In step S103, the control device 10 gives a command to the rotation mechanism 15 of the substrate holding device 2 to start the rotation of the laminated substrate Ws held by the substrate holding device 2. In step S104, the control device 10 gives a command to the gas blower 40 to start blowing the gas G onto the laminated substrate Ws to remove the liquid L adhering to the laminated substrate Ws.

[0065] In step S105, the control device 10 gives a command to the pressure adjustment device 26 of the coating device 3 to supply gas from the gas supply source to the syringe 21 of the coating device 3 and start applying the filler F to the target application area T of the laminated substrate Ws by the coating device 3. The application of the filler F by the coating device 3 is performed while rotating the laminated substrate Ws by the substrate holding device 2. In step S106, the control device 10 gives a command to the curing device 4 to start curing the filler F applied to the target application area T. The curing of the filler F by the curing device 4 is performed while rotating the laminated substrate Ws by the substrate holding device 2. In step S107, the ultrasonic imaging device 32 starts generating an ultrasonic image of the target application area T of the laminated substrate Ws immersed in the liquid L in the liquid tank 30. The generation of the ultrasonic image of the target application area T by the ultrasonic imaging device 32 is performed while rotating the laminated substrate Ws by the substrate holding device 2.

[0066] In step S108, when the control device 10 starts applying the filler F to the target application area T of the laminated substrate Ws and the laminated substrate Ws makes one rotation, the control device 10 stops the application of the filler F to the target application area T by the application device 3. Specifically, when the laminated substrate Ws makes one rotation after starting the application of the filler F to the target application area T, the control device 10 gives an instruction to the pressure adjustment device 26 of the application device 3 to stop the supply of gas from the gas supply source to the syringe 21 of the application device 3. After starting the generation of the ultrasonic image of the target application area T in step S107 and before stopping the application of the filler F to the target application area T by the application device 3 in step S108, while applying the filler F to the target application area T by the application device 3, the ultrasonic imaging device 32 generates an ultrasonic image of the target application area T. The substrate holding device 2 continues to rotate the laminated substrate Ws even after stopping the application of the filler F to the target application area T by the application device 3. In step S109, when the control device 10 starts curing the filler F applied to the target application area T and the laminated substrate Ws makes one rotation, the control device 10 gives an instruction to the curing device 4 to stop curing the filler F applied to the target application area T of the laminated substrate Ws.

[0067] As shown in FIG. 10, in step S110, when the ultrasonic imaging device 32 starts generating an ultrasonic image of the target application area T and the laminated substrate Ws makes one rotation, the ultrasonic imaging device 32 stops generating an ultrasonic image of the target application area T immersed in the liquid L in the liquid tank 30. Thereby, ultrasonic images of the entire circumference of the target application area T are generated. The ultrasonic images of the entire circumference of the target application area T generated by the ultrasonic imaging device 32 are sent to the control device 10. In step S111, the control device 10 determines the filling state of the filler F in the target coating area T based on the ultrasonic image of the target coating area T of the multilayer substrate Ws. In one embodiment, as described above, the control device 10 calculates the filling rate of the filler F in the target coating area T based on the ultrasonic image of the target coating area T, and determines the filling state of the filler F in the target coating area T based on the calculated filling rate of the filler F in the target coating area T.

[0068] In step S111, when the control device 10 determines that the filling state of the filler F in the target coating area T is "filling completed" or "filling defective", the operations after step S112 for ending the application of the filler F to the target coating area T are performed. In step S111, when the control device 10 determines that the filling state of the filler F in the target coating area T is "filling in progress", the processing flow returns to step S105. Thereafter, the operations of steps S105 to S111 are repeated.

[0069] In step S112, the control device 10 gives a command to the rotation mechanism 15 of the substrate holding device 2 to temporarily stop the rotation of the multilayer substrate Ws. In step S113, the control device 10 gives a command to the substrate vertical movement mechanism 18 to raise the multilayer substrate Ws immersed in the liquid L in the liquid tank 30 and lift the multilayer substrate Ws out of the liquid tank 30. In step S114, the control device 10 gives a command to the rotation mechanism 15 of the substrate holding device 2 to rotate the multilayer substrate Ws again. In step S115, after the liquid L adhering to the multilayer substrate Ws lifted out of the liquid tank 30 is removed by the gas blower 40, the control device 10 gives a command to the gas blower 40 to stop blowing the gas G onto the multilayer substrate Ws. In step S116, the control device 10 gives a command to the rotation mechanism 15 of the substrate holding device 2 to stop the rotation of the multilayer substrate Ws.

[0070] According to this embodiment, by locally immersing only the peripheral portion of the stacked substrate Ws in the liquid L and generating an ultrasonic image of the target coating region T immersed in the liquid L, it is possible to inspect the filling state of the filler F applied to the target coating region T included in the peripheral portion of the stacked substrate Ws without immersing the entire stacked substrate Ws in the liquid L. As a result, the drying time of the stacked substrate Ws can be shortened, and contamination of the stacked substrate due to watermarks or the like generated after drying can be suppressed.

[0071] In addition, since the liquid L adhering to the stacked substrate Ws is removed by the gas blower 40 of the inspection apparatus 5, there is no need to provide a separate drying process, and the throughput can be improved. Furthermore, since the liquid L is removed by the gas blower 40 immediately after the liquid L adheres to the stacked substrate Ws, watermarks are less likely to occur.

[0072] In one embodiment, the coating apparatus 3 may apply the filler F to the target coating region T while the stacked substrate Ws rotates a plurality of times, and the curing apparatus 4 may cure the filler F applied to the target coating region T while the stacked substrate Ws rotates a plurality of times. In this case, the ultrasonic imaging apparatus 32 may generate an ultrasonic image of the target coating region T while the stacked substrate Ws makes its last rotation.

[0073] In one embodiment, the control device 10 may detect position information of a portion where the filler F is not applied within the target coating region T based on the ultrasonic image of the target coating region T. Based on the detected position information, the control device 10 may perform additional application of the filler F to the target coating region T when the portion where the filler F is not applied within the target coating region T faces the filler discharge port 21a of the syringe 21 of the coating apparatus 3. The control device 10 can adjust the position of the portion where the filler F is not applied within the target coating region T of the stacked substrate Ws with respect to the filler discharge port 21a of the syringe 21 of the coating apparatus 3 by controlling the operation of the rotation mechanism 15 of the substrate holding device 2.

[0074] FIG. 11 is a side view showing another embodiment of the substrate processing system 1. The configuration and operation of this embodiment not specifically described are the same as those of the above-described embodiment, and thus the overlapping description thereof is omitted. As shown in FIG. 11, the inspection apparatus 5 of this embodiment further includes an imaging apparatus moving mechanism 35 that moves the ultrasonic imaging apparatus 32 in the radial direction of the stacked substrate Ws. Examples of the imaging apparatus moving mechanism 35 include a combination of a linear motion mechanism (such as a ball screw mechanism or a cylinder mechanism) and a motor (such as a servo motor or a stepping motor), and a linear electric actuator (such as a linear motor).

[0075] FIG. 12 is a schematic diagram showing a state where the imaging apparatus moving mechanism 35 moves the ultrasonic imaging apparatus 32. As shown in FIG. 12, a seal member 33 is disposed between the side wall 30b of the portion where the ultrasonic imaging apparatus 32 penetrates the side wall 30b and the ultrasonic imaging apparatus 32, and the liquid L in the liquid tank 30 is sealed by the seal member 33 so as not to leak. The seal member 33 is fixed to the ultrasonic imaging apparatus 32, and when the imaging apparatus moving mechanism 35 moves the ultrasonic imaging apparatus 32 in the radial direction of the stacked substrate Ws, the seal member 33 also moves in the radial direction of the stacked substrate Ws so as to maintain the sealed state. In one embodiment, the moving distance of the ultrasonic imaging apparatus 32 by the imaging apparatus moving mechanism 35 is in the range of 10 mm or less. In FIGS. 11 and 12, the imaging apparatus moving mechanism 35 is schematically depicted.

[0076] In one embodiment, the ultrasonic imaging apparatus 32 has waterproof performance, and the entire ultrasonic imaging apparatus 32 may be disposed in the liquid tank 30. In this case, the imaging apparatus moving mechanism 35 may also be disposed in the liquid tank 30 together with the ultrasonic imaging apparatus 32.

[0077] In this embodiment, the generation of the ultrasonic image by the ultrasonic imaging device 32 is performed while rotating the stacked substrate Ws by the substrate holding device 2 and moving the ultrasonic imaging device 32 in the radial direction of the stacked substrate Ws by the imaging device moving mechanism 35. Thereby, even when the scanning area of the ultrasonic imaging device 32 is small, the entire target coating area T can be scanned in the radial direction of the stacked substrate Ws to generate an ultrasonic image of the entire target coating area T. The imaging device moving mechanism 35 is electrically connected to the control device 10, and the operation of the imaging device moving mechanism 35 is controlled by the control device 10.

[0078] In one embodiment, the control device 10 may intermittently rotate the stacked substrate Ws by the substrate holding device 2. In this case, the generation of the ultrasonic image by the ultrasonic imaging device 32 may be performed while moving the ultrasonic imaging device 32 in the radial direction of the stacked substrate Ws by the imaging device moving mechanism 35 at the timing when the rotation of the stacked substrate Ws by the substrate holding device 2 has stopped.

[0079] FIG. 13 is a schematic diagram showing another embodiment of the substrate processing system 1. In the embodiments described so far, the application of the filler F to the target application area T of the stacked substrate Ws and the inspection of the filling state of the filler F applied to the target application area T are performed by the substrate processing system 1 as a single module. The substrate processing system 1 of the present embodiment includes an application module 100 for applying the filler F to the target application area T of the stacked substrate Ws and an inspection module 200 for inspecting the filling state of the filler F applied to the target application area T. The substrate processing system 1 includes a transfer device 300 for transferring the stacked substrate Ws between the application module 100 and the inspection module 200. After the filler F is applied to the target application area T by the application module 100, the stacked substrate Ws is transferred to the inspection module 200 by the transfer device 300, and the inspection module 200 inspects the filling state of the filler F in the target application area T.

[0080] FIG. 14 is a front view showing an embodiment of the coating module 100. The coating module 100 includes a substrate holding device 102 that holds the stacked substrate Ws in a vertical posture and rotates the held stacked substrate Ws, a coating device 103 that applies a filler F to the peripheral portion of the stacked substrate Ws, and a curing device 104 that cures the filler F applied to the peripheral portion of the stacked substrate Ws. The substrate holding device 102 includes a holding stage 112 that holds the back surface of the stacked substrate Ws, a rotating shaft 113 connected to the central portion of the holding stage 112, and a rotation mechanism (not shown in FIG. 14) that rotates the holding stage 112 and the rotating shaft 113. The stacked substrate Ws is held in a vertical posture by the substrate holding device 102.

[0081] Since the configurations and operations of the substrate holding device 102, the coating device 103, and the curing device 104 in the present embodiment are the same as those of the substrate holding device 2, the coating device 3, and the curing device 4 in the above-described embodiment, the overlapping description thereof will be omitted. The coating module 100 further includes a first control device 110 that controls the operations of the substrate holding device 102, the coating device 103, and the curing device 104. The substrate holding device 102, the coating device 103, and the curing device 104 are electrically connected to the first control device 110. In one embodiment, the transfer device 300 may be electrically connected to the first control device 110, and the operation of the transfer device 300 may be controlled by the first control device 110.

[0082] The first control device 110 is composed of at least one computer. The first control device 110 includes a storage device 110a in which a program is stored, and a processing device 110b that executes calculations according to instructions included in the program. The storage device 110a includes a main storage device such as a random access memory (RAM), and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the processing device 110b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the first control device 110 is not limited to these examples.

[0083] FIG. 15 is a side view showing an embodiment of the inspection module 200. The inspection module 200 includes a substrate holding device 202 that holds the stacked substrate Ws in a vertical posture and rotates the held stacked substrate Ws, a substrate vertical movement mechanism 218 that moves the stacked substrate Ws held by the substrate holding device 202 up and down, a liquid tank 230 configured to hold a liquid L for locally immersing only the peripheral portion of the stacked substrate Ws including the target application region T of the filler F, an ultrasonic imaging device 232 that generates an ultrasonic image of the target application region T of the stacked substrate Ws when immersed in the liquid L in the liquid tank 230, and a gas blower 240 (in this embodiment, three gas blowers 240) that blows a gas G onto the stacked substrate Ws.

[0084] The substrate holding device 202 includes a holding stage 212 that holds the back surface of the stacked substrate Ws, a rotating shaft 213 connected to the central portion of the holding stage 212, and a rotation mechanism 215 that rotates the holding stage 212 and the rotating shaft 213. The stacked substrate Ws is held in a vertical posture by the substrate holding device 202. Since the configurations and operations of the substrate holding device 202, the substrate vertical movement mechanism 218, the liquid tank 230, the ultrasonic imaging device 232, and the gas blower 240 in this embodiment are the same as those of the substrate holding device 2, the substrate vertical movement mechanism 18, the liquid tank 30, the ultrasonic imaging device 32, and the gas blower 40 in the above-described embodiment, the overlapping description thereof is omitted.

[0085] The inspection module 200 further includes a second control device 210 that controls the operations of the substrate holding device 202, the substrate vertical movement mechanism 218, and the gas blower 240. The substrate holding device 202, the substrate vertical movement mechanism 218, and the gas blower 240 are electrically connected to the second control device 210.

[0086] The second control device 210 is composed of at least one computer. The second control device 210 includes a storage device 210a storing a program, and a processing device 210b that executes operations according to instructions included in the program. The storage device 210a includes a main storage device such as a random access memory (RAM), and auxiliary storage devices such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the processing device 210b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the second control device 210 is not limited to these examples.

[0087] In one embodiment, the second control device 210 may be integrally configured with the first control device 110. That is, the first control device 110 and the second control device 210 may be composed of at least one computer including a storage device storing a program, and a processing device that executes operations according to instructions included in the program.

[0088] The ultrasonic imaging device 232 is configured to generate an ultrasonic image of the filler F applied to the target application region T of the laminated substrate Ws by the coating module 100. Generation of the ultrasonic image by the ultrasonic imaging device 232 is performed while rotating the laminated substrate Ws by the substrate holding device 202. Thereby, the ultrasonic imaging device 232 can scan the entire circumference of the target application region T and generate an ultrasonic image of the entire circumference of the target application region T. The ultrasonic imaging device 232 is electrically connected to the second control device 210, and the ultrasonic image of the entire circumference of the target application region T of the laminated substrate Ws generated by the ultrasonic imaging device 232 is sent to the second control device 210.

[0089] In one embodiment, similar to the embodiment described with reference to FIGS. 11 and 12, the inspection module 200 may further include an imaging device moving mechanism that moves the ultrasonic imaging device 232 in the radial direction of the laminated substrate Ws. In this case, generation of an ultrasonic image by the ultrasonic imaging device 232 may be performed while rotating the laminated substrate Ws by the substrate holding device 202 and while moving the ultrasonic imaging device 232 in the radial direction of the laminated substrate Ws by the imaging device moving mechanism.

[0090] The second control device 210 is configured to determine the filling state of the filler F applied to the target application region T based on the ultrasonic image of the target application region T. In one embodiment, the second control device 210 calculates the filling rate of the filler F in the target application region T based on the ultrasonic image of the target application region T sent from the ultrasonic imaging device 232, and based on the calculated filling rate of the filler F in the target application region T, determines the filling state of the filler F in the target application region T. The operation of the second control device 210 in this embodiment for determining the filling state of the filler F in the target application region T is the same as that of the control device 10 in the above-described embodiment, and thus the overlapping description thereof is omitted.

[0091] In one embodiment, when the second control device 210 determines that the filling state of the filler F in the target application region T is "unfilled", the laminated substrate Ws may be conveyed again to the coating module 100 by a conveying device (not shown), and the coating module 100 may perform additional coating of the filler F in the target application region T on the laminated substrate Ws.

[0092] In one embodiment, the second control device 210 may detect position information of a portion within the target application area T where the filler F has not been applied, based on the ultrasonic image of the target application area T. In this case, the second control device 210 is electrically connected to the first control device 110, and the second control device 210 may send the detected position information to the first control device 110. Based on the position information sent from the second control device 210, when a portion within the target application area T where the filler F has not been applied faces the filler discharge port of the syringe of the coating device 103, the first control device 110 may perform additional application of the filler F to the target application area T. The first control device 110 can adjust the position of a portion within the target application area T of the filler F on the laminated substrate Ws that has not been applied, relative to the filler discharge port of the syringe of the coating device 103, by controlling the operation of the rotation mechanism of the substrate holding device 102.

[0093] In one embodiment, the second control device 210 is electrically connected to a display device (not shown) provided in the inspection module 200, and may display the ultrasonic image of the target application area T and / or the determination result of the filling state of the filler F in the target application area T on the display device. The display device may be arranged at a location away from the inspection module 200.

[0094] FIGS. 16 and 17 are flowcharts showing an embodiment of a method for inspecting the filling state of the filler F applied to the target application area T of the laminated substrate Ws by the substrate processing system 1 described with reference to FIGS. 13 to 15. As shown in FIG. 16, in step S201, the first control device 110 gives a command to the substrate holding device 102 of the coating module 100 to hold the laminated substrate Ws to be processed in a vertical posture and rotate the held laminated substrate Ws. In step S202, the first control device 110 gives a command to the pressure adjustment device of the coating device 103 to supply gas from the gas supply source to the syringe of the coating device 103, and cause the coating device 103 to apply the filler F to the target application area T of the laminated substrate Ws. The application of the filler F by the coating device 103 is performed while rotating the laminated substrate Ws by the substrate holding device 102.

[0095] In step S203, the first control device 110 gives an instruction to the curing device 104 to cure the filler F applied to the target application area T. The curing of the filler F by the curing device 104 is performed while the stacked substrate Ws is rotated by the substrate holding device 102. The application of the filler F to the target application area T by the application device 3 and the curing of the filler F by the curing device 4 may be performed while the stacked substrate Ws makes one rotation, or may be performed while the stacked substrate Ws makes a plurality of rotations. In step S204, the first control device 110 gives an instruction to the substrate holding device 102 to stop the rotation of the stacked substrate Ws and end the application process of the stacked substrate Ws by the application module 100.

[0096] In step S205, the transfer device 300 transfers the stacked substrate Ws from the application module 100 to the inspection module 200. In step S206, the second control device 210 gives an instruction to the substrate holding device 202 of the inspection module 200 to hold the stacked substrate Ws in a vertical posture. In step S207, the second control device 210 gives an instruction to the substrate vertical movement mechanism 218 to lower the stacked substrate Ws held by the substrate holding device 202 and immerse only the peripheral portion of the stacked substrate Ws locally in the liquid L in the liquid tank 230. In step S208, the second control device 210 gives an instruction to the rotation mechanism 215 of the substrate holding device 202 to rotate the stacked substrate Ws held by the substrate holding device 202. In step S209, the second control device 210 gives an instruction to the gas blower 240 to blow the gas G onto the stacked substrate Ws and start removing the liquid L adhering to the stacked substrate Ws.

[0097] As shown in FIG. 17, in step S210, the ultrasonic imaging device 232 generates ultrasonic images of the entire circumference of the target coating region T of the laminated substrate Ws immersed in the liquid L in the liquid tank 230. The generation of the ultrasonic images of the target coating region T by the ultrasonic imaging device 232 is performed while rotating the laminated substrate Ws by the substrate holding device 202. The ultrasonic images of the entire circumference of the target coating region T generated by the ultrasonic imaging device 232 are sent to the second control device 210. In step S211, the second control device 210 gives a command to the rotation mechanism 215 of the substrate holding device 202 to temporarily stop the rotation of the laminated substrate Ws held by the substrate holding device 202. In step S212, the second control device 210 gives a command to the substrate vertical movement mechanism 218 to raise the laminated substrate Ws immersed in the liquid L in the liquid tank 230 and lift the laminated substrate Ws out of the liquid tank 230.

[0098] In step S213, the second control device 210 gives a command to the rotation mechanism 215 of the substrate holding device 202 to rotate the laminated substrate Ws again. In step S214, after the liquid L adhering to the laminated substrate Ws lifted out of the liquid tank 230 is removed by the gas blower 240, the second control device 210 gives a command to the gas blower 240 to stop blowing the gas G onto the laminated substrate Ws. In step S215, the second control device 210 gives a command to the rotation mechanism 215 of the substrate holding device 202 to stop the rotation of the laminated substrate Ws.

[0099] In step S216, the second control device 210 determines the filling state of the filler F in the target coating region T based on the ultrasonic images of the target coating region T of the laminated substrate Ws. In one embodiment, the second control device 210 calculates the filling rate of the filler F in the target coating region T based on the ultrasonic images of the target coating region T, and determines the filling state of the filler F in the target coating region T based on the filling rate of the filler F in the target coating region T. In one embodiment, the determination of the filling state of the filler F in the target coating region T by the second control device 210 may be performed immediately after the generation of the ultrasonic images of the target coating region T by the ultrasonic imaging device 232 in step S210.

[0100] In step S216, when the second control device 210 determines that the filling state of the filler F in the target application area T is "filling completed" or "filling defective", the substrate processing system 1 ends the processing of the laminated substrate Ws. In step S216, when the second control device 210 determines that the filling state of the filler F in the target application area T is "filling incomplete", the transfer device 300 transfers the laminated substrate Ws to the coating module 100 again (step S217), and the processing flow returns to step S201. Thereafter, the operations of steps S201 to S216 are repeated.

[0101] According to the present embodiment, by locally immersing only the peripheral portion of the laminated substrate Ws in the liquid L and generating an ultrasonic image of the target application area T immersed in the liquid L, it is possible to inspect the filling state of the filler F applied to the target application area T included in the peripheral portion of the laminated substrate Ws without immersing the entire laminated substrate Ws in the liquid L. As a result, the drying time of the laminated substrate Ws can be shortened, and contamination of the laminated substrate due to watermarks or the like generated after drying can be suppressed.

[0102] In addition, since the liquid L attached to the laminated substrate Ws is removed by the gas blower 240 of the inspection module 200, it is not necessary to provide a separate drying process, and the throughput can be improved. Further, since the liquid L is removed by the gas blower 40 immediately after the liquid L adheres to the laminated substrate Ws, watermarks are less likely to occur.

[0103] The above-described embodiments are described for the purpose of enabling those having ordinary knowledge in the technical field to which the present invention pertains to practice the present invention. Various modifications of the above embodiments can be naturally made by those skilled in the art, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is construed in the broadest scope in accordance with the technical idea defined by the claims.

Explanation of Reference Numerals

[0104] 1 Substrate processing system 2 Substrate holding device 3 Coating device 4 Hardening device 5 Inspection device 10 Control device 10a Memory device 10b Processing device 12 Holding stage 12a Holding surface 13 Rotation axis 15 Rotation mechanism 18 Substrate vertical movement mechanism 21 Syringe 21a Filler discharge port 22 Piston 25 Gas supply line 26 Pressure regulator 30 Liquid tank 32 Ultrasonic imaging device 32a Ultrasonic probe 32b Image processing unit 33 Sealing member 35 Imaging device movement mechanism 40 Gas blower 100 Coating module 102 Substrate holding device 103 Coating device 104 Hardening device 110 First control device 110a Memory device 110b Processing device 112 Holding stage 113 Rotation axis 200 Inspection module 202 Substrate holding device 210 Second control device 210a Memory device 210b Processing device 212 Holding stage 213 Rotation axis 215 Rotation mechanism 218 Substrate vertical movement mechanism 230 Liquid tank 232 Ultrasonic imaging device 240 Gas blower

Claims

1. A substrate processing system for applying a filler to a peripheral portion of a laminated substrate in which a first substrate and a second substrate are joined, comprising: a substrate holding device configured to hold and rotate the laminated substrate in a vertical posture; a coating device configured to apply the filler to a target coating region included in the peripheral portion of the laminated substrate; an inspection device configured to inspect a filling state of the filler applied to the target coating region; wherein the inspection device includes a liquid tank configured to hold a liquid for locally immersing only the peripheral portion of the laminated substrate, and an ultrasonic imaging device configured to generate an ultrasonic image of the target coating region when immersed in the liquid.

2. The substrate processing system according to claim 1, further comprising a curing device configured to cure the filler applied to the target coating region, wherein the curing device is disposed downstream of the coating device and upstream of the ultrasonic imaging device in a rotational direction of the laminated substrate.

3. The substrate processing system according to claim 1, further comprising a control device configured to determine a filling state of the filler in the target coating region based on the ultrasonic image.

4. The substrate processing system according to claim 3, wherein the control device is configured to control an operation of the coating device and is configured to terminate application of the filler to the target coating region based on the filling state.

5. The substrate processing system according to claim 1, further comprising a gas blower configured to blow gas onto the laminated substrate to remove the liquid adhering to the laminated substrate, wherein the gas blower is disposed downstream of the liquid tank in a rotational direction of the laminated substrate.

6. An inspection module for inspecting a filling state of a filler applied to a peripheral portion of a laminated substrate in which a first substrate and a second substrate are joined, comprising: a substrate holding device configured to hold and rotate the laminated substrate in a vertical posture; a liquid tank configured to hold a liquid for locally immersing only the peripheral portion of the laminated substrate including a target coating region of the filler; and an ultrasonic imaging device configured to generate an ultrasonic image of the target coating region when immersed in the liquid.

7. The inspection module according to claim 6, further comprising an imaging device moving mechanism configured to move the ultrasonic imaging device in a radial direction of the laminated substrate.

8. Further comprising a gas blower for blowing a gas onto the laminated substrate to remove the liquid adhering to the laminated substrate. The inspection module according to claim 6, wherein the gas blower is disposed on the downstream side of the liquid tank in the rotational direction of the laminated substrate.

9. The inspection module according to claim 6, further comprising a control device for determining the filling state of the filler in the target application area based on the ultrasonic image.

10. An inspection method for the filling state of a filler applied to the peripheral portion of a laminated substrate in which a first substrate and a second substrate are joined, holding the laminated substrate in a vertical posture, locally immersing only the peripheral portion of the laminated substrate including the target application area of the filler in the liquid in the liquid tank, rotating the laminated substrate in a vertical posture, An inspection method including generating an ultrasonic image of the target application area immersed in the liquid by an ultrasonic imaging device.

11. The inspection method according to claim 10, wherein the ultrasonic image of the target application area is generated while moving the ultrasonic imaging device in the radial direction of the laminated substrate.

12. Further including removing the liquid adhering to the laminated substrate by blowing a gas onto the laminated substrate by a gas blower, The inspection method according to claim 10, wherein the gas blower is disposed on the downstream side of the liquid tank in the rotational direction of the laminated substrate.

13. The inspection method according to claim 10, further including determining the filling state of the filler in the target application area based on the ultrasonic image.

14. Further including applying the filler to the target application area while rotating the laminated substrate in a vertical posture, The inspection method according to claim 10, wherein generating the ultrasonic image by the ultrasonic imaging device is performed while applying the filler to the target application area.

15. Further including curing the filler applied to the target application area by a curing device, The inspection method according to claim 14, wherein the curing device is disposed on the downstream side of the coating device and on the upstream side of the ultrasonic imaging device in the rotational direction of the laminated substrate.

16. The inspection method according to claim 14, further including determining the filling state of the filler in the target application area based on the ultrasonic image, and ending the application of the filler to the target application area based on the filling state.

17. After starting the application of the filler, start generating the ultrasonic image, The inspection method according to claim 14, wherein after stopping the application of the filler, the laminated substrate is further rotated to generate ultrasonic images of the entire circumference of the target application area.

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