Electronic component unit

Abstract

To prevent a substrate from being affected by noise radiated from lead wires.SOLUTION: A electronic component unit 10 has a resin 50 that covers lead wires 32 and a metal cover 60 that covers the outer peripheral surface of the resin 50 while being supported by the resin 50. Noise radiated from the lead wires 32 is shielded by the metal cover 60. In this case, a length L1 in an extension direction along the lead wires 32 in the metal cover 60 is longer than a thickness H1 of a shield plate 40. Thus, for example, noise radiated from the lead wires 32 is more efficiently shielded by the metal cover 60 than when the length L1 in the extension direction along the lead wires 32 in the metal cover 60 is the thickness H1 of the shield plate 40 or less. Because the shield plate 40 is in contact with the metal cover 60 via a contact area 42, noise shielded by the metal cover 60 flows through the shield plate 40 to ground.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component unit.

Background Art

[0002] An electronic component unit includes a substrate and an electronic component. The electronic component has a component body and lead wires. The lead wires project from the component body toward the substrate and are electrically connected to the substrate.

[0003] In such an electronic component unit, since noise radiated from the electronic component may affect the substrate, for example, it is considered to employ a shielding plate as in Patent Document 1. The shielding plate is disposed between the component body and the substrate, extends along the substrate, and is connected to the ground. According to this, noise radiated from the electronic component toward the substrate is shielded by the shielding plate, and the noise shielded by the shielding plate flows to the ground. For this reason, it is suppressed that the substrate is affected by the noise radiated from the electronic component.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In such an electronic component unit, since the shielding plate is disposed between the component body and the substrate, noise radiated from the component body toward the substrate is suitably shielded by the shielding plate. On the other hand, depending on the positional relationship among the substrate, the lead wire, and the shielding plate, it may be difficult to shield the noise radiated from the lead wire toward the substrate by the shielding plate. For this reason, there is a risk that the noise radiated from the lead wire may affect the substrate. Therefore, it is desired to suppress the substrate from being affected by the noise radiated from the lead wire.

Means for Solving the Problem

[0006] An electronic component unit for solving the above problems includes a substrate, an electronic component having a component body and a lead wire that protrudes from the component body toward the substrate and is electrically connected to the substrate, and a shielding plate that is disposed between the component body and the substrate, extends along the substrate, and is connected to the ground. The electronic component unit includes a resin that coats the lead wire and a metal cover that covers the outer peripheral surface of the resin while being supported by the resin. The shielding plate has a contact portion that contacts the metal cover, and the length of the metal cover in the extending direction along the lead wire is longer than the thickness of the shielding plate.

[0007] According to this, the noise radiated from the lead wire is shielded by the metal cover. At this time, the length of the metal cover in the extending direction along the lead wire is longer than the thickness of the shielding plate. For this reason, for example, compared with the case where the length of the metal cover in the extending direction along the lead wire is equal to or less than the thickness of the shielding plate, the noise radiated from the lead wire can be efficiently shielded by the metal cover. And since the shielding plate is in contact with the metal cover via the contact portion, the noise shielded by the metal cover flows to the ground via the shielding plate. As a result, it is possible to suppress the substrate from being affected by the noise radiated from the lead wire.

[0008] In the above electronic component unit, the component body has a first surface that overlaps with the shield plate in the thickness direction of the substrate, and a second surface that extends in a direction intersecting the first surface and from which the lead wires protrude. The lead wires have a lead protruding portion that protrudes from the second surface, and a lead extending portion that bends toward the substrate with respect to the lead protruding portion and extends toward the substrate. The resin has a main body cover portion placed on the first surface, and a lead wire cover portion that extends from the main body cover portion and through which the lead extending portion is inserted. The metal cover preferably covers the outer peripheral surface of the lead wire cover portion.

[0009] According to this, since the main body cover portion is placed on the first surface of the component body, for example, compared with a configuration in which the resin does not have the main body cover portion, the relative position of the lead wire cover portion with respect to the component body is stabilized. As a result, the position of the metal cover that covers the outer peripheral surface of the lead wire cover portion is also stabilized. Therefore, even in a configuration in which the lead wires have a lead protruding portion and a lead extending portion, noise radiated from the lead extending portion, which is a portion close to the substrate in the lead wires, can be shielded more efficiently by the metal cover. Thus, it is possible to further easily suppress the substrate from being affected by noise radiated from the lead wires.

[0010] In the above electronic component unit, the substrate has a low-voltage circuit and a high-voltage circuit. The lead wires are electrically connected to the high-voltage circuit. The shield plate is disposed at a position overlapping the low-voltage circuit in the thickness direction of the substrate. The metal cover is preferably disposed at a position close to a position overlapping the boundary between the low-voltage circuit and the high-voltage circuit in the thickness direction of the substrate.

[0011] Since the lead wire is electrically connected to the high-voltage circuit, the electronic component is a high-voltage component. Here, the shield plate is disposed at a position overlapping the low-voltage circuit in the thickness direction of the substrate. Therefore, noise radiated from the component body of the electronic component, which is a high-voltage component, toward the low-voltage circuit can be suitably shielded by the shield plate. Thus, it is possible to suppress the low-voltage circuit from being affected by noise radiated from the component body of the electronic component, which is a high-voltage component. Further, the metal cover is disposed at a position close to a position overlapping the boundary between the low-voltage circuit and the high-voltage circuit in the thickness direction of the substrate. According to this, noise radiated from the lead wire of the electronic component, which is a high-voltage component, toward the low-voltage circuit can be suitably shielded by the metal cover.

[0012] In the above electronic component unit, it is preferable that the metal cover covers a portion between a portion located on the component body side of the contact portion in the resin and a portion located on the substrate side of the contact portion.

[0013] According to this, noise radiated from the lead wire toward the space between the shield plate and the substrate can be suitably shielded by the metal cover. Therefore, it is possible to avoid a problem that noise radiated from the lead wire toward the substrate through the space between the shield plate and the substrate affects the substrate. As a result, it is possible to further suppress the substrate from being affected by noise radiated from the lead wire.

[0014] In the above electronic component unit, the electronic component has a plurality of the lead wires, the resin covers the plurality of lead wires, and it is preferable that the metal cover covers the outer peripheral surface of the resin in a state of surrounding the plurality of lead wires together.

[0015] According to this, compared with a case where the electronic component unit includes, for example, a plurality of metal covers and each metal cover covers the outer peripheral surface of the resin in a state of surrounding each lead wire one by one, the configuration of the electronic component unit can be simplified.

[0016] In the above-described electronic component unit, it is preferable to include a plurality of the metal covers that cover the outer peripheral surface of the resin while surrounding the lead wires of the respective electronic components.

[0017] According to this, since the electronic component unit includes a plurality of metal covers that cover the outer peripheral surface of the resin while surrounding the lead wires of the respective electronic components, it is possible to easily avoid the influence of noise between the lead wires of adjacent electronic components.

[0018] In the above-described electronic component unit, the contact portion preferably has spring properties. According to this, since the contact portion has spring properties, the contact portion can be brought into contact with the metal cover while absorbing the dimensional tolerance generated between the metal cover and the shield plate by the elastic deformation of the contact portion. Therefore, since the contact state between the contact portion and the metal cover can be stabilized, the reliability of the electronic component unit can be improved.

Advantages of the Invention

[0019] According to this invention, it is possible to suppress the substrate from being affected by the noise radiated from the lead wires.

Brief Description of the Drawings

[0020]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0021] Hereinafter, an embodiment in which the electronic component unit is embodied will be described with reference to FIGS. 1 to 3. <Overview of the Electronic Component Unit> As shown in FIGS. 1 and 2, the electronic component unit 10 includes a housing 11, a substrate 20, electronic components 30, and a shield plate 40. The housing 11 is made of metal. The housing 11 is made of, for example, aluminum. The housing 11 is connected to the ground.

[0022] The housing 11 has a first wall 12 and a second wall 13. The first wall 12 is, for example, flat. The first wall 12 has a first wall surface 12a. The first wall surface 12a is flat. The second wall 13 stands up from the first wall 12. The second wall 13 is, for example, flat. The second wall 13 extends in a direction orthogonal to the first wall surface 12a. The second wall 13 has a second wall surface 13a. The second wall surface 13a is continuous with the first wall surface 12a and extends in a direction orthogonal to the first wall surface 12a.

[0023] The electronic component unit 10 includes a heat sink 14 and an insulating sheet 15. The heat sink 14 is placed on the first wall surface 12a of the first wall 12. The heat sink 14 is configured such that cooling water flows inside. The surface of the heat sink 14 opposite to the first wall 12 is a mounting surface 14a on which the electronic components 30 are placed. The insulating sheet 15 is provided on the mounting surface 14a via a heat dissipation grease 16. Then, the electronic components 30 are placed on the mounting surface 14a of the heat sink 14 via the insulating sheet 15 and the heat dissipation grease 16. The insulating sheet 15 insulates between the electronic components 30 and the heat sink 14. Also, the heat generated from the electronic components 30 is transmitted to the heat sink 14 via the insulating sheet 15 and the heat dissipation grease 16. The heat transmitted to the heat sink 14 is dissipated to the cooling water flowing inside the heat sink 14. Thereby, the electronic components 30 are cooled.

[0024] The substrate 20 is flat. The substrate 20 is accommodated in the housing 11 while extending parallel to the first wall 12. The substrate 20 is accommodated in the housing 11 with the thickness direction of the substrate 20 coinciding with the extending direction of the second wall 13. The substrate 20 has a low-voltage circuit 21 and a high-voltage circuit 22. The low-voltage circuit 21 controls the high-voltage circuit 22. The high-voltage circuit 22 is driven under the control of the low-voltage circuit 21. The low-voltage circuit 21 is located closer to the second wall 13 than the high-voltage circuit 22.

[0025] The electronic component 30 has a component body 31 and lead wires 32. The electronic component 30 has a plurality of lead wires 32. The electronic component 30 of the present embodiment has three lead wires 32. The electronic component 30 is a switching element. Therefore, the electronic component 30 is a power semiconductor element. The electronic component 30 is a discrete semiconductor element.

[0026] The component body 31 is in the shape of a square block. The component body 31 is flat. The component body 31 is placed on the placement surface 14a of the heat sink 14 via an insulating sheet 15 and a heat dissipation grease 16.

[0027] The component body 31 has a first surface 31a and a second surface 31b. The first surface 31a is the surface located on the side opposite to the heat sink 14. The first surface 31a is in the shape of a flat surface. The second surface 31b is continuous with the first surface 31a and extends in a direction orthogonal to the first surface 31a. Therefore, the second surface 31b extends in a direction intersecting the first surface 31a. The second surface 31b is the surface of the component body 31 located on the side opposite to the second wall 13. A plurality of lead wires 32 protrude from the second surface 31b. Therefore, the second surface 31b is the surface of the component body 31 that extends in a direction intersecting the first surface 31a and from which the lead wires 32 protrude.

[0028] Each lead wire 32 has a lead protruding portion 33 and a lead extending portion 34. The lead protruding portion 33 protrudes from the second surface 31b of the component body 31. The lead protruding portion 33 extends parallel to the substrate 20. The lead extending portion 34 is continuous with the end of the lead protruding portion 33 on the side opposite to the second surface 31b of the component body 31. The lead extending portion 34 bends toward the substrate 20 with respect to the lead protruding portion 33 and extends toward the substrate 20. The extending direction of the lead extending portion 34 coincides with the thickness direction of the substrate 20. The end of the lead extending portion 34 on the side opposite to the lead protruding portion 33 is electrically connected to the high-voltage circuit 22 of the substrate 20. Therefore, the lead wire 32 is electrically connected to the high-voltage circuit 22. Specifically, the lead extending portion 34 is soldered to the substrate 20 and thus is electrically connected to the high-voltage circuit 22 of the substrate 20. Since the lead wire 32 is electrically connected to the high-voltage circuit 22, the electronic component 30 is a high-voltage component. Thus, the lead wire 32 protrudes from the component body 31 toward the substrate 20 and is electrically connected to the substrate 20. The electronic component unit 10 includes a plurality of electronic components 30. Each electronic component 30 is arranged side by side with the second surface 31b of the component body 31 located on the side opposite to the second wall 13.

[0029] The housing 11 has a plurality of first boss portions 17. In FIG. 1, for the sake of illustration, only one first boss portion 17 is shown. Each first boss portion 17 protrudes from the first wall surface 12a of the first wall 12. Each first boss portion 17 is arranged at a position corresponding to each electronic component 30. A first female screw hole 17a is formed in the tip surface of each first boss portion 17.

[0030] The electronic component unit 10 includes a plurality of leaf spring members 25. The leaf spring member 25 has an elongated plate shape. A hole 25a is formed in the first end portion of the leaf spring member 25. The second end portion of the leaf spring member 25 forms a spring portion 25b.

[0031] Each leaf spring member 25 is supported by each first boss portion 17 by each first bolt 26 passing through the inside of the hole 25a of each leaf spring member 25 and being screwed into the first female screw hole 17a of each first boss portion 17. The spring portion 25b of each leaf spring member 25 presses the first surface 31a of the component body 31 of each electronic component 30. Each electronic component 30 is disposed with respect to the heat sink 14 in a state of being pressed toward the mounting surface 14a of the heat sink 14 by each leaf spring member 25.

[0032] The shield plate 40 is flat. The shield plate 40 is square plate-shaped. The shield plate 40 is made of metal. The shield plate 40 is disposed between the component body 31 of each electronic component 30 and the substrate 20. A plurality of holes 40a are formed in the shield plate 40. In FIG. 1, for convenience of illustration, only one hole 40a is shown. The hole 40a is formed at the edge portion of the shield plate 40 from the second wall 13. The plurality of holes 40a are arranged in the juxtaposition direction of the plurality of electronic components 30.

[0033] The housing 11 has a plurality of second boss portions 18. In FIG. 1, for convenience of illustration, only one second boss portion 18 is shown. Each second boss portion 18 projects from the first wall surface 12a of the first wall 12. The protruding length of each second boss portion 18 from the first wall surface 12a is longer than the protruding length of each first boss portion 17 from the first wall surface 12a. Each second boss portion 18 is located closer to the second wall 13 than each first boss portion 17. A second female screw hole 18a is formed in the tip surface of each second boss portion 18.

[0034] The shield plate 40 is disposed with respect to each second boss portion 18 in a state where each hole 40a communicates with the second female screw hole 18a of each second boss portion 18. Then, the shield plate 40 is supported by each second boss portion 18 when each second bolt 41 passes through the inside of each hole 40a and is screwed into the second female screw hole 18a of each second boss portion 18. As a result, the shield plate 40 is electrically connected to the housing 11 via each second bolt 41. Consequently, the shield plate 40 is connected to the ground. The shield plate 40 extends along the substrate 20. Therefore, the shield plate 40 is disposed between the component main body 31 and the substrate 20, extends along the substrate 20, and is connected to the ground. The first surface 31a of the component main body 31 overlaps the shield plate 40 in the thickness direction of the substrate 20. The shield plate 40 is disposed at a position overlapping the low-voltage circuit 21 in the thickness direction of the substrate 20. The shield plate 40 is separate from the housing 11.

[0035] The shield plate 40 has a plurality of contact portions 42. Each contact portion 42 protrudes from an edge portion located on the side opposite to the second wall 13 in the shield plate 40 toward each lead wire 32. Each contact portion 42 protrudes from a portion corresponding to the lead extension portion 34 of each lead wire 32 at an edge portion located on the side opposite to the second wall 13 in the shield plate 40.

[0036] Each contact portion 42 has spring properties. Each contact portion 42 is configured to be elastically deformable in a direction of approaching and separating from an edge portion located on the side opposite to the second wall 13 in the shield plate 40. Specifically, the contact portion 42 has a first extending portion 42a and a second extending portion 42b. The first extending portion 42a and the second extending portion 42b are in a thin plate shape. The first extending portion 42a extends obliquely in a direction of separating from the second wall 13 and approaching the first wall 12 as it separates from the edge portion located on the side opposite to the second wall 13 in the shield plate 40. The second extending portion 42b extends obliquely in a direction of approaching the second wall 13 and approaching the first wall 12 as it separates from the tip of the first extending portion 42a. And when the connection portion between the first extending portion 42a and the second extending portion 42b is pressed, the contact portion 42 is elastically deformable with the base end of the first extending portion 42a as a base point.

[0037] <Resin> The electronic component unit 10 includes a resin 50. The resin 50 has a main body cover portion 51 and a lead wire cover portion 52.

[0038] As shown in FIGS. 2 and 3, the main body cover portion 51 has a plurality of exposed holes 51a. Each exposed hole 51a exposes the first surface 31a of the component body 31 of each electronic component 30. The spring portion 25b of each leaf spring member 25 presses a portion exposed from each exposed hole 51a on the first surface 31a of the component body 31 of each electronic component 30. The frame-shaped portion defining each exposed hole 51a in the main body cover portion 51 is placed on the first surface 31a of the component body 31 of each electronic component 30. Therefore, the main body cover portion 51 is placed on the first surface 31a of the component body 31.

[0039] As shown in FIG. 2, the resin 50 has a partition wall 53. The partition wall 53 protrudes from the main body cover portion 51. The partition wall 53 is disposed between the component bodies 31 of adjacent electronic components 30. The partition wall 53 separates the component bodies 31 of adjacent electronic components 30.

[0040] As shown in FIGS. 1 and 3, the resin 50 has a plurality of lead wire cover portions 52. Each lead wire cover portion 52 extends from the main body cover portion 51 corresponding to each electronic component 30. Each lead wire cover portion 52 extends along each lead extension portion 34 of each lead wire 32. Each lead wire cover portion 52 is in contact with the substrate 20.

[0041] The lead extension portion 34 of each lead wire 32 is inserted into each lead wire cover portion 52. Each lead wire cover portion 52 covers the lead extension portion 34 of each lead wire 32 of each electronic component 30. Specifically, the lead wire cover portion 52 covers a portion located on the substrate 20 side of the first surface 31a of the component body 31 in the lead extension portion 34. Thus, the resin 50 covers the lead wire 32. The resin 50 covers a plurality of lead wires 32.

[0042] <Metal cover> The electronic component unit 10 includes a plurality of metal covers 60. Each metal cover 60 covers the outer peripheral surface of each lead wire cover portion 52. Each metal cover 60 is cylindrical. Each metal cover 60 covers the outer peripheral surface of each lead wire cover portion 52 so as to go around it. The axial direction of each metal cover 60 coincides with the extending direction of the lead extension portion 34 of the lead wire 32. The length L1 in the extending direction along the lead extension portion 34 of the lead wire 32 in each metal cover 60 is longer than the thickness H1 of the shield plate 40. Each metal cover 60 covers most of the outer peripheral surface of each lead wire cover portion 52. Each metal cover 60 is supported by the outer peripheral surface of each lead wire cover portion 52. Therefore, each metal cover 60 covers the outer peripheral surface of the resin 50 while being supported by the resin 50.

[0043] Each metal cover 60 covers the outer peripheral surface of each lead wire cover portion 52 in a state of surrounding together the lead extending portions 34 of the plurality of lead wires 32 of each electronic component 30. Therefore, each metal cover 60 covers the outer peripheral surface of the resin 50 in a state of surrounding together the plurality of lead wires 32 of each electronic component 30. Thus, the electronic component unit 10 includes a plurality of metal covers 60 that cover the outer peripheral surface of the resin 50 in a state of surrounding the lead wires 32 of each electronic component 30 respectively.

[0044] Each contact portion 42 is in contact with each metal cover 60. Therefore, the shield plate 40 has the contact portions 42 that contact the respective metal covers 60. Each metal cover 60 covers a portion from a site located on the component body 31 side rather than the contact portion 42 in the lead wire cover portion 52 to a site located on the substrate 20 side rather than the contact portion 42. Therefore, each metal cover 60 covers a portion from a site located on the component body 31 side rather than the contact portion 42 in the resin 50 to a site located on the substrate 20 side rather than the contact portion 42. A slight gap is formed between each metal cover 60 and the substrate 20. Therefore, each metal cover 60 is separated from the substrate 20. Each metal cover 60 is disposed at a position close to a position overlapping with the boundary K1 between the low-voltage circuit 21 and the high-voltage circuit 22 in the thickness direction of the substrate 20.

[0045] [Operation of Embodiment] Next, the operation of this embodiment will be described. In the electronic component unit 10, since the shield plate 40 is disposed between the component main body 31 and the substrate 20, the noise radiated from the component main body 31 toward the substrate 20 is suitably shielded by the shield plate 40. The noise shielded by the shield plate 40 flows to the ground via each second bolt 41 and the housing 11. The noise radiated from each lead wire 32 is shielded by each metal cover 60. At this time, the length L1 in the extending direction along the lead wire 32 in each metal cover 60 is longer than the thickness H1 of the shield plate 40. Therefore, for example, compared with the case where the length L1 in the extending direction along the lead wire 32 in each metal cover 60 is less than or equal to the thickness H1 of the shield plate 40, the noise radiated from each lead wire 32 is efficiently shielded by each metal cover 60. And since the shield plate 40 is in contact with each metal cover 60 via each contact portion 42, the noise shielded by each metal cover 60 flows to the ground via the shield plate 40, each second bolt 41, and the housing 11.

[0046] Each metal cover 60 covers a portion between a portion located on the component main body 31 side of the contact portion 42 in the resin 50 to a portion located on the substrate 20 side of the contact portion 42. Therefore, the noise radiated from each lead wire 32 toward the space between the shield plate 40 and the substrate 20 is suitably shielded by each metal cover 60.

[0047] [Effects of the Embodiment] In the above embodiment, the following effects can be obtained. (1) The electronic component unit 10 includes a resin 50 that coats the lead wire 32 and a metal cover 60 that covers the outer peripheral surface of the resin 50 while being supported by the resin 50. According to this, the noise radiated from the lead wire 32 is shielded by the metal cover 60. At this time, the length L1 in the extending direction along the lead wire 32 in the metal cover 60 is longer than the thickness H1 of the shielding plate 40. Therefore, for example, compared with the case where the length L1 in the extending direction along the lead wire 32 in the metal cover 60 is less than or equal to the thickness H1 of the shielding plate 40, the noise radiated from the lead wire 32 can be efficiently shielded by the metal cover 60. And since the shielding plate 40 is in contact with the metal cover 60 via the contact portion 42, the noise shielded by the metal cover 60 flows to the ground via the shielding plate 40. As a result, it is possible to suppress the substrate 20 from being affected by the noise radiated from the lead wire 32.

[0048] (2) Since the main body cover portion 51 is placed on the first surface 31a of the component main body 31, for example, compared with a configuration in which the resin 50 does not have the main body cover portion 51, the relative position of the lead wire cover portion 52 with respect to the component main body 31 is stabilized. As a result, the position of the metal cover 60 that covers the outer peripheral surface of the lead wire cover portion 52 is also stabilized. Therefore, even in a configuration in which the lead wire 32 has a lead protruding portion 33 and a lead extending portion 34, the noise radiated from the lead extending portion 34, which is a portion of the lead wire 32 close to the substrate 20, can be more efficiently shielded by the metal cover 60. Thus, it is possible to further easily suppress the substrate 20 from being affected by the noise radiated from the lead wire 32.

[0049] (3) Since the lead wire 32 is electrically connected to the high-voltage circuit 22, the electronic component 30 is a high-voltage component. Here, the shield plate 40 is disposed at a position overlapping the low-voltage circuit 21 in the thickness direction of the substrate 20. Therefore, the noise radiated from the component body 31 of the electronic component 30, which is a high-voltage component, toward the low-voltage circuit 21 can be suitably shielded by the shield plate 40. Thus, it is possible to suppress the low-voltage circuit 21 from being affected by the noise radiated from the component body 31 of the electronic component 30, which is a high-voltage component. Further, the metal cover 60 is disposed at a position close to a position overlapping the boundary K1 between the low-voltage circuit 21 and the high-voltage circuit 22 in the thickness direction of the substrate 20. According to this, the noise radiated from the lead wire 32 of the electronic component 30, which is a high-voltage component, toward the low-voltage circuit 21 can be suitably shielded by the metal cover 60.

[0050] (4) The metal cover 60 covers a portion from a portion located on the component body 31 side of the contact portion 42 in the resin 50 to a portion located on the substrate 20 side of the contact portion 42. According to this, the noise radiated from the lead wire 32 toward the space between the shield plate 40 and the substrate 20 can be suitably shielded by the metal cover 60. Therefore, it is possible to avoid the problem that the noise radiated toward the substrate 20 through the space between the shield plate 40 and the substrate 20 from the lead wire 32 affects the substrate 20. As a result, it is possible to further suppress the substrate 20 from being affected by the noise radiated from the lead wire 32.

[0051] (5) The metal cover 60 covers the outer peripheral surface of the resin 50 in a state where a plurality of lead wires 32 are surrounded together. According to this, compared with a case where the electronic component unit 10 includes, for example, a plurality of metal covers 60 and each metal cover 60 covers the outer peripheral surface of the resin 50 in a state where each lead wire 32 is surrounded one by one, the configuration of the electronic component unit 10 can be simplified.

[0052] (6) Since the electronic component unit 10 includes a plurality of metal covers 60 that cover the outer peripheral surface of the resin 50 while surrounding the lead wires 32 of the respective electronic components 30, it is possible to easily avoid the influence of noise between the lead wires 32 of adjacent electronic components 30.

[0053] (7) Since the contact portion 42 has spring properties, the contact portion 42 can be brought into contact with the metal cover 60 while absorbing the dimensional tolerance generated between the metal cover 60 and the shield plate 40 by the elastic deformation of the contact portion 42. Therefore, since the contact state between the contact portion 42 and the metal cover 60 can be stabilized, the reliability of the electronic component unit 10 can be improved.

[0054] (8) Even when attempting to solder the substrate 20 and the lead wires 32 while bringing each metal cover 60 into contact with each contact portion 42, each contact portion 42 elastically deforms. For this reason, the contact between each metal cover 60 and each contact portion 42 does not affect the soldering operation of the substrate 20 and the lead wires 32. Therefore, before soldering the substrate 20 and the lead wires 32, the soldering operation of the substrate 20 and the lead wires 32 can be performed while confirming the contact between each metal cover 60 and each contact portion 42. Thus, since the contact between each metal cover 60 and each contact portion 42 can be surely performed, the reliability of the electronic component unit 10 can be improved.

[0055] [Modification Example] Note that the above-described embodiment can be modified and implemented as follows. The above-described embodiment and the following modification examples can be implemented in combination with each other within a technically consistent range.

[0056] ○ As shown in FIG. 4, the electronic component unit 10 may include a shield plate 40A integrally formed with the housing 11. The shield plate 40A is integrally formed with the second wall 13 of the housing 11. The shield plate 40A protrudes from the second wall surface 13a of the second wall 13 toward each metal cover 60. The end portion of the shield plate 40A on the side opposite to the second wall surface 13a is in contact with each metal cover 60.

[0057] ○ In the embodiment, the resin 50 may not have the main body cover portion 51. ○ In the embodiment, the lead wire 32 may be electrically connected to the low voltage circuit 21. In short, the electronic component 30 is not limited to a high voltage component such as a switching element, and may be a low voltage component.

[0058] ○ In the embodiment, the shield plate 40 may be disposed at a position overlapping the high voltage circuit 22 in the thickness direction of the substrate 20. ○ In the embodiment, the metal cover 60 may not be disposed at a position close to the position overlapping the boundary K1 between the low voltage circuit 21 and the high voltage circuit 22 in the thickness direction of the substrate 20.

[0059] ○ In the embodiment, the metal cover 60 may cover only the portion located on the component main body 31 side rather than the contact portion 42 in the resin 50. ○ In the embodiment, the metal cover 60 may cover only the portion located on the substrate 20 side rather than the contact portion 42 in the resin 50.

[0060] ○ In the embodiment, the electronic component unit 10 may be configured to include a plurality of metal covers 60 that cover the outer peripheral surface of the resin 50 in a state of surrounding one lead wire 32. In short, the metal cover 60 may not cover the outer peripheral surface of the resin 50 in a state of surrounding a plurality of lead wires 32 together.

[0061] ○ In the embodiment, the electronic component unit 10 may be configured to include one metal cover 60 that covers the outer peripheral surface of the resin 50 in a state of surrounding the lead wires 32 of all the electronic components 30 together.

[0062] ○ In the embodiment, the contact portion 42 may not have spring properties. ○ In the embodiment, the metal cover 60 may not be cylindrical, and may be, for example, U-shaped. In short, the metal cover 60 may not cover the outer peripheral surface of the lead wire cover portion 52 in a circular manner.

[0063] ○ In an embodiment, each metal cover 60 may be electrically connected to the ground pattern of the substrate 20. ○ In an embodiment, the number of lead wires 32 of each electronic component 30 is not particularly limited.

[0064] ○ In an embodiment, the second surface 31b of the component body 31 may extend obliquely with respect to the first surface 31a. In short, the second surface 31b of the component body 31 may be a surface that extends in a direction intersecting the first surface 31a and from which the lead wire 32 protrudes.

[0065] ○ In an embodiment, each lead wire cover portion 52 may be spaced apart from the substrate 20. ○ In an embodiment, the metal cover 60 may be, for example, a magnetic material.

[0066] ○ In an embodiment, the electronic component 30 is not limited to a discrete semiconductor element. In short, the electronic component 30 may have a configuration including a component body 31 and lead wires 32 that protrude from the component body 31 toward the substrate 20 and are electrically connected to the substrate 20.

[0067] [Appendix] The technical idea that can be grasped from the above embodiment and modification examples is described below. [Appendix 1] A substrate, An electronic component having a component body and lead wires that protrude from the component body toward the substrate and are electrically connected to the substrate, A shield plate that is disposed between the component body and the substrate, extends along the substrate, and is connected to the ground, and an electronic component unit including the same, A resin that covers the lead wires, A metal cover that covers the outer peripheral surface of the resin while being supported by the resin, The shield plate has a contact portion that contacts the metal cover, An electronic component unit, wherein a length in an extending direction extending along the lead wire in the metal cover is longer than a thickness of the shield plate.

[0068] <Appendix 2> The component body has a first surface overlapping with the shield plate in the thickness direction of the substrate, and a second surface extending in a direction intersecting the first surface and from which the lead wire protrudes. The lead wire has a lead protruding portion protruding from the second surface, and a lead extending portion bent toward the substrate with respect to the lead protruding portion and extending toward the substrate. The resin has a main body cover portion placed on the first surface, and a lead wire cover portion extending from the main body cover portion and through which the lead extending portion is inserted. The metal cover covers an outer peripheral surface of the lead wire cover portion, and the electronic component unit according to <Appendix 1>.

[0069] <Appendix 3> The substrate has a low voltage circuit and a high voltage circuit. The lead wire is electrically connected to the high voltage circuit. The shield plate is disposed at a position overlapping with the low voltage circuit in the thickness direction of the substrate. The metal cover is disposed at a position close to a position overlapping with a boundary between the low voltage circuit and the high voltage circuit in the thickness direction of the substrate, and the electronic component unit according to <Appendix 1> or <Appendix 2>.

[0070] <Appendix 4> The metal cover covers a portion between a portion located closer to the component body side than the contact portion in the resin and a portion located closer to the substrate side than the contact portion, and the electronic component unit according to any one of <Appendix 1> to <Appendix 3>.

[0071] <Appendix 5> The electronic component has a plurality of the lead wires, The resin coats the plurality of lead wires, The metal cover covers the outer peripheral surface of the resin in a state of surrounding the plurality of lead wires together, and the electronic component unit according to any one of <Appendix 1> to <Appendix 4>.

[0072] <Appendix 6> A plurality of the electronic components are provided, The electronic component unit according to any one of <Appendix 1> to <Appendix 5>, characterized in that a plurality of metal covers are provided to cover the outer peripheral surface of the resin in a state of surrounding the lead wires of each of the electronic components respectively.

[0073] <Appendix 7> The contact portion has spring properties, and the electronic component unit according to any one of <Appendix 1> to <Appendix 6>.

Description of Reference Numerals

[0074] 10... Electronic component unit, 20... Substrate, 21... Low-voltage circuit, 22... High-voltage circuit, 30... Electronic component, 31... Component body, 31a... First surface, 31b... Second surface, 32... Lead wire, 33... Lead protruding portion, 34... Lead extending portion, 40, 40A... Shielding plate, 42... Contact portion, 50... Resin, 51... Body cover portion, 52... Lead wire cover portion, 60... Metal cover.

Claims

1. A substrate, an electronic component having a component body and a lead wire that protrudes from the component body toward the substrate and is electrically connected to the substrate, and a shield plate that is disposed between the component body and the substrate, extends along the substrate, and is connected to ground, the electronic component unit comprising: resin that covers the lead wire, and a metal cover that covers the outer peripheral surface of the resin while being supported by the resin, wherein the shield plate has a contact portion that contacts the metal cover, and an electronic component unit, wherein a length of the metal cover in an extending direction along the lead wire is longer than a thickness of the shield plate.

2. The component body has a first surface that overlaps the shield plate in a thickness direction of the substrate, and a second surface that extends in a direction intersecting the first surface and from which the lead wire protrudes, wherein the lead wire has a lead protruding portion that protrudes from the second surface, and a lead extending portion that bends toward the substrate with respect to the lead protruding portion and extends toward the substrate, wherein the resin has a main body cover portion that is placed on the first surface, and a lead wire cover portion that extends from the main body cover portion and through which the lead extending portion is inserted, and the electronic component unit according to claim 1, wherein the metal cover covers an outer peripheral surface of the lead wire cover portion.

3. The substrate has a low voltage circuit and a high voltage circuit, the lead wire is electrically connected to the high voltage circuit, the shield plate is disposed at a position that overlaps the low voltage circuit in a thickness direction of the substrate, and the electronic component unit according to claim 1 or claim 2, wherein the metal cover is disposed at a position close to a position that overlaps a boundary between the low voltage circuit and the high voltage circuit in a thickness direction of the substrate.

4. The electronic component unit according to claim 1, wherein the metal cover covers a portion between a portion located closer to the component body side than the contact portion in the resin and a portion located closer to the substrate side than the contact portion.

5. The electronic component has a plurality of the lead wires, the resin covers the plurality of lead wires, and the electronic component unit according to claim 1, wherein the metal cover covers the outer peripheral surface of the resin in a state of surrounding the plurality of lead wires together.

6. comprising a plurality of the electronic components, The electronic component unit according to claim 1, further comprising a plurality of metal covers that cover an outer peripheral surface of the resin in a state where lead wires of each of the electronic components are surrounded respectively.

7. The electronic component unit according to claim 1, wherein the contact portion has spring properties.

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