Electronic component unit

Abstract

To prevent a substrate from being affected by noise radiated from lead wires.SOLUTION: Around an insertion portion 43 in a shield plate 40, there is a shield wall portion 44 that protrudes toward a substrate 20 and surrounds lead wires 32. Therefore, noise radiated from the lead wires 32 toward the space between the shield plate 40 and the substrate 20 is shielded by the shield wall portion 44. Therefore, problems such as noise radiated from the lead wires 32 toward the substrate 20 through the space between the shield plate 40 and the substrate 20 affecting the substrate 20 are avoided.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electronic component unit.

Background Art

[0002] An electronic component unit includes a substrate and an electronic component. The electronic component has a component body and lead wires. The lead wires protrude from the component body. In such an electronic component unit, since noise radiated from the electronic component may affect the substrate, for example, it is considered to employ a shield plate as in Patent Document 1. The shield plate is disposed between the component body and the substrate, extends along the substrate, and is connected to the ground. Further, the shield plate has an insertion portion through which the lead wire is inserted. The lead wire protrudes from the component body toward the substrate and is electrically connected to the substrate through the insertion portion. Noise radiated from the electronic component toward the substrate is shielded by the shield plate, and the noise shielded by the shield plate flows to the ground. For this reason, it is suppressed that the substrate is affected by the noise radiated from the electronic component.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such an electronic component unit, since a shield plate is disposed between the component body and the substrate, noise radiated from the component body toward the substrate is suitably shielded by the shield plate. On the other hand, when a lead wire protrudes from the component body toward the substrate and is electrically connected to the substrate through an insertion portion, there is a risk that noise radiated from the lead wire toward the substrate through the space between the shield plate and the substrate may affect the substrate. Therefore, it is desired to suppress the substrate from being affected by the noise radiated from the lead wire.

Means for Solving the Problem

[0005] An electronic component unit for solving the above problems includes a substrate, an electronic component having a component body and a lead wire protruding from the component body, and a shield plate disposed between the component body and the substrate, extending along the substrate, and connected to the ground. The shield plate has an insertion portion through which the lead wire is inserted. The lead wire protrudes from the component body toward the substrate and is electrically connected to the substrate through the insertion portion. A shield wall portion that protrudes toward the substrate and surrounds the lead wire is provided around the insertion portion in the shield plate.

[0006] According to this, since a shield wall portion that protrudes toward the substrate and surrounds the lead wire is provided around the insertion portion in the shield plate, noise radiated from the lead wire toward the space between the shield plate and the substrate is shielded by the shield wall portion. Therefore, it is possible to avoid the problem that noise radiated from the lead wire toward the substrate through the space between the shield plate and the substrate affects the substrate. As a result, it is possible to suppress the substrate from being affected by the noise radiated from the lead wire.

[0007] In the above electronic component unit, the substrate has lead wire insertion holes through which the lead wires are inserted, and the lead wires have lead wire protruding portions that are inserted through the lead wire insertion holes and protrude from the surface of the substrate located on the side opposite to the shield plate. It is preferable to provide a shield cover that covers the lead wire protruding portions and is connected to the ground.

[0008] According to this, the noise radiated from the lead wire protruding portions is shielded by the shield cover, and the noise shielded by the shield cover flows to the ground. Therefore, it is possible to avoid the problem that the noise radiated from the lead wire protruding portions affects the substrate. As a result, it is possible to further suppress the substrate from being affected by the noise radiated from the lead wires.

[0009] In the above electronic component unit, the shield plate has a boss portion that protrudes toward the substrate and receives a fastening member for fastening the substrate to the shield plate, and the shield cover preferably has a fastening portion that is fastened to the boss portion by the fastening member together with the substrate.

[0010] According to this, the noise shielded by the shield cover flows to the shield plate through the fastening portion, the fastening member, and the boss portion, and flows to the ground through the shield plate. Such a configuration is suitable as a configuration for flowing the noise shielded by the shield cover to the ground.

[0011] In the above electronic component unit, the substrate preferably has a ground pattern that is electrically connected to the shield plate, and the shield cover is electrically connected to the shield plate through the ground pattern.

[0012] According to this, the noise shielded by the shield cover flows through the ground pattern to the shield plate and then through the shield plate to the ground. Such a configuration is suitable as a configuration for flowing the noise shielded by the shield cover to the ground.

[0013] In the above electronic component unit, the shield cover may have a solder connection portion soldered to the substrate, and the solder connection portion may be electrically connected to the ground pattern.

[0014] Thus, a configuration in which the shield cover has a solder connection portion soldered to the substrate and the solder connection portion is electrically connected to the ground pattern is suitable as a configuration for electrically connecting the shield cover to the ground pattern.

[0015] In the above electronic component unit, it is preferable to provide a housing that houses the substrate, the electronic component, the shield plate, and the shield cover and is connected to the ground, and the shield cover may have a contact portion that contacts the housing.

[0016] According to this, the noise shielded by the shield cover flows from the contact portion through the housing to the ground. Such a configuration is suitable as a configuration for flowing the noise shielded by the shield cover to the ground.

[0017] In the above electronic component unit, the shield plate may have a boss portion that protrudes from the shield wall portion toward the substrate and receives a fastening member for fastening the substrate to the shield plate.

[0018] According to this, since the boss portion protrudes more than the shield wall portion, a desired gap can be secured between the shield wall portion and the substrate. As a result, even if a shield wall portion protruding toward the substrate is provided around the insertion portion in the shield plate, it is easy to secure an insulation distance between the shield wall portion and the substrate.

Effects of the Invention

[0019] According to the present invention, it is possible to suppress the substrate from being affected by noise radiated from the lead wires.

Brief Description of the Drawings

[0020]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0021] Hereinafter, an embodiment in which the electronic component unit is embodied will be described with reference to FIG. 1. <Overview of the Electronic Component Unit> As shown in FIG. 1, the electronic component unit 10 includes a housing 11, a substrate 20, an electronic component 30, a shield plate 40, and a shield cover 50. The housing 11 is made of metal. The housing 11 is made of, for example, aluminum. The housing 11 houses the substrate 20, the electronic component 30, the shield plate 40, and the shield cover 50. The housing 11 is connected to the ground.

[0022] The housing 11 has a housing body 12 and a lid member 13. The housing body 12 has a plate-shaped end wall 12a and a cylindrical peripheral wall 12b. The peripheral wall 12b extends cylindrically from the outer peripheral portion of the end wall 12a. The lid member 13 is plate-shaped. The lid member 13 closes an opening located on the side opposite to the end wall 12a in the peripheral wall 12b.

[0023] The housing 11 has a plurality of support portions 14. Each support portion 14 protrudes from the end wall 12a. Each support portion 14 is columnar. A female screw hole 14a is formed in the tip surface of each support portion 14.

[0024] The substrate 20 is flat. The substrate 20 is accommodated in the housing 11 while extending parallel to the lid member 13. The substrate 20 has a plurality of lead wire insertion holes 21. The substrate 20 of the present embodiment has four lead wire insertion holes 21. Each lead wire insertion hole 21 penetrates the substrate 20 in the thickness direction of the substrate 20. A plurality of holes 22 are formed in the substrate 20. Each hole 22 penetrates the substrate 20 in the thickness direction of the substrate 20.

[0025] The electronic component 30 has a component body 31 and lead wires 32. The component body 31 is in the shape of a square block. The lead wires 32 protrude from the component body 31. The electronic component 30 has a plurality of lead wires 32. The electronic component 30 of the present embodiment has four lead wires 32. The electronic component 30 is a switching element. Therefore, the electronic component 30 is a power semiconductor element. Two of the four lead wires 32 are high voltage terminals, and the remaining two are low voltage terminals. The electronic component 30 is a discrete semiconductor element. The four lead wires 32 protrude in a state of being arranged in one direction from one surface of the component body 31.

[0026] The shield plate 40 is flat. The shield plate 40 is square plate-shaped. The shield plate 40 is made of metal. The shield plate 40 is disposed between the component body 31 and the substrate 20. A plurality of holes 40a are formed in the shield plate 40. The shield plate 40 is disposed with respect to each support portion 14 in a state where each hole 40a communicates with the female screw hole 14a of each support portion 14. Then, the shield plate 40 is supported by each support portion 14 when each bolt 41 passes through the inside of each hole 40a and is screwed into the female screw hole 14a of each support portion 14. As a result, the shield plate 40 is electrically connected to the housing 11 via each bolt 41. Consequently, the shield plate 40 is connected to the ground. The shield plate 40 extends along the substrate 20. Therefore, the shield plate 40 is disposed between the component body 31 and the substrate 20, extends along the substrate 20, and is connected to the ground. The shield plate 40 is disposed at a position overlapping the substrate 20 in the thickness direction of the substrate 20. The shield plate 40 is separate from the housing 11.

[0027] The shield plate 40 has a plurality of boss portions 42. Each boss portion 42 protrudes from the surface of the shield plate 40 located on the substrate 20 side toward the substrate 20. The tip surface of each boss portion 42 is in contact with the substrate 20. A female screw hole 42a is formed in the tip surface of each boss portion 42. The substrate 20 is disposed with respect to each boss portion 42 in a state where each hole 22 communicates with the female screw hole 42a of each boss portion 42.

[0028] The shield plate 40 has an insertion portion 43. The insertion portion 43 is a hole that penetrates the shield plate 40 in the thickness direction of the shield plate 40. The insertion portion 43 has a long rectangular hole shape. A lead wire 32 is inserted into the insertion portion 43. The four lead wires 32 are inserted into the insertion portion 43 in a state where the parallel arrangement direction of the four lead wires 32 coincides with the longitudinal direction of the insertion portion 43. Then, each lead wire 32 inserted into the insertion portion 43 is inserted into each lead wire insertion hole 21. Therefore, each lead wire 32 is inserted into each lead wire insertion hole 21.

[0029] The portions of each lead wire 32 inserted into each lead wire insertion hole 21 are soldered to the substrate 20. As a result, each lead wire 32 is electrically connected to the substrate 20. Therefore, each lead wire 32 protrudes from the component body 31 toward the substrate 20 and is electrically connected to the substrate 20 via the insertion portion 43. Each lead wire 32 has a lead wire protruding portion 33 that is inserted into each lead wire insertion hole 21 and protrudes from the surface of the substrate 20 located on the side opposite to the shield plate 40.

[0030] <Shield wall portion> A shield wall portion 44 is provided around the insertion portion 43 of the shield plate 40. The shield wall portion 44 protrudes from around the insertion portion 43 of the shield plate 40 toward the substrate 20. The shield wall portion 44 is cylindrical. The shield wall portion 44 extends in the thickness direction of the shield plate 40. The inside of the shield wall portion 44 communicates with the insertion portion 43.

[0031] Each boss portion 42 protrudes toward the substrate 20 more than the shield wall portion 44. Therefore, a slight desired gap is formed between the shield wall portion 44 and the substrate 20. Therefore, the shield wall portion 44 is separated from the substrate 20. The shield wall portion 44 surrounds the lead wire 32. Specifically, the shield wall portion 44 surrounds the portion of each lead wire 32 closer to the substrate 20 than the insertion portion 43 and the portion closer to the insertion portion 43 than the substrate 20. The shield wall portion 44 is integrally formed with the shield plate 40. Therefore, the shield wall portion 44 is made of metal.

[0032] <Shield cover> The shield cover 50 is made of metal. The shield cover 50 has a plate-shaped cover end wall 51 and a cylindrical cover peripheral wall 52. The cover peripheral wall 52 extends cylindrically from the outer peripheral portion of the cover end wall 51. The shield cover 50 is arranged with respect to the substrate 20 such that an opening located on the side opposite to the cover end wall 51 in the cover peripheral wall 52 is closed by a surface located on the side opposite to the shield plate 40 in the substrate 20. The shield cover 50 is arranged with respect to the surface located on the side opposite to the shield plate 40 in the substrate 20 such that the lead wire protruding portions 33 of the respective lead wires 32 are arranged within the space defined by the cover end wall 51 and the cover peripheral wall 52. Therefore, the shield cover 50 covers the lead wire protruding portions 33.

[0033] The shield cover 50 has a pair of flange portions 53. Each flange portion 53 is plate-shaped. Each flange portion 53 protrudes outward from an end portion located on the side opposite to the cover end wall 51 in the cover peripheral wall 52. A hole 53a is formed in each flange portion 53. The hole 53a penetrates the flange portion 53 in the thickness direction of the flange portion 53.

[0034] The shield cover 50 is arranged with respect to the substrate 20 in a state where the holes 53a of the respective flange portions 53 communicate with the respective holes 22 of the substrate 20. Then, the shield cover 50 is supported by the respective boss portions 42 together with the substrate 20 when each bolt 54 passes through the inside of each hole 53a and the inside of each hole 22 and is screwed into the female screw hole 42a of each boss portion 42. Therefore, the substrate 20 is fastened to the respective boss portions 42.

[0035] Thus, each boss portion 42 receives a bolt 54, which protrudes toward the substrate 20 and is a fastening member for fastening the substrate 20 to the shield plate 40. And each flange portion 53 of the shield cover 50 is a fastening portion that is fastened to the boss portion 42 by the bolt 54 together with the substrate 20. The shield cover 50 is electrically connected to the shield plate 40 via each bolt 54. Therefore, the shield cover 50 is connected to the ground by being electrically connected to the housing 11 via each bolt 54, the shield plate 40, and each bolt 41.

[0036] [Operation of the Embodiment] Next, the operation of this embodiment will be described. In the electronic component unit 10, since the shield plate 40 is disposed between the component body 31 and the substrate 20, noise radiated from the component body 31 toward the substrate 20 is suitably shielded by the shield plate 40. The noise shielded by the shield plate 40 flows to the ground via each bolt 41 and the housing 11.

[0037] When the lead wire 32 protrudes from the component body 31 toward the substrate 20 and is electrically connected to the substrate 20 via the insertion portion 43, noise is radiated from the lead wire 32 toward the space between the shield plate 40 and the substrate 20. In particular, when the electronic component 30 is a discrete semiconductor element having a plurality of lead wires 32 in which high-voltage terminals and low-voltage terminals are mixed, the lead wire 32 that is a high-voltage terminal is also electrically connected to the substrate 20 via the insertion portion 43. For this reason, for example, it is difficult to shield the noise radiated from the high-voltage terminal toward the substrate 20 by the shield plate 40 as in the case where the high-voltage terminal is not inserted into the insertion portion 43 and the high-voltage terminal is disposed on the side opposite to the substrate 20 with respect to the shield plate 40.

[0038] Therefore, a shield wall portion 44 is provided around the insertion portion 43 of the shield plate 40 so as to protrude toward the substrate 20 and surround the lead wire 32. For this reason, noise radiated from the lead wire 32 toward the space between the shield plate 40 and the substrate 20 is shielded by the shield wall portion 44. The noise shielded by the shield wall portion 44 flows to the ground through the shield plate 40, each bolt 41, and the housing 11.

[0039] Noise radiated from the lead wire protruding portion 33 is shielded by the shield cover 50. The noise shielded by the shield cover 50 flows to the ground through each bolt 54, the shield plate 40, each bolt 41, and the housing 11.

[0040] [Advantages of the Embodiment] The following advantages can be obtained in the above embodiment. (1) A shield wall portion 44 is provided around the insertion portion 43 of the shield plate 40 so as to protrude toward the substrate 20 and surround the lead wire 32. For this reason, noise radiated from the lead wire 32 toward the space between the shield plate 40 and the substrate 20 is shielded by the shield wall portion 44. Therefore, it is possible to avoid the problem that noise radiated from the lead wire 32 toward the substrate 20 through the space between the shield plate 40 and the substrate 20 affects the substrate 20. As a result, it is possible to suppress the substrate 20 from being affected by noise radiated from the lead wire 32.

[0041] (2) The electronic component unit 10 includes a shield cover 50 that covers the lead wire protruding portion 33 and is connected to the ground. According to this, the noise radiated from the lead wire protruding portion 33 is shielded by the shield cover 50, and the noise shielded by the shield cover 50 flows to the ground. Therefore, it is possible to avoid the problem that the noise radiated from the lead wire protruding portion 33 affects the substrate 20. In particular, it is possible to avoid the problem that the noise from the lead wire protruding portion 33 is reflected by the lid member 13 of the housing 11 and radiated to the substrate 20. As a result, it is possible to further suppress the substrate 20 from being affected by the noise radiated from the lead wire 32.

[0042] (3) The shield cover 50 has flange portions 53 that are fastened to the boss portion 42 together with the substrate 20 by bolts 54. According to this, the noise shielded by the shield cover 50 flows to the shield plate 40 through the flange portions 53, the bolts 54, and the boss portion 42, and flows to the ground through the shield plate 40. Such a configuration is suitable as a configuration for flowing the noise shielded by the shield cover 50 to the ground.

[0043] (4) The shield plate 40 has a boss portion 42 that protrudes more than the shield wall portion 44 toward the substrate 20. According to this, since the boss portion 42 protrudes more than the shield wall portion 44, a desired gap can be secured between the shield wall portion 44 and the substrate 20. As a result, even if a shield wall portion 44 protruding toward the substrate 20 is provided around the insertion portion 43 in the shield plate 40, it is easy to secure the insulation distance between the shield wall portion 44 and the substrate 20.

[0044] [Modification Example] Note that the above embodiment can be implemented with the following modifications. The above embodiment and the following modification examples can be implemented in combination with each other within a technically non - conflicting range.

[0045] As shown in FIG. 2, the electronic component unit 10 may include a shield lid portion 45 that closes an opening located on the side opposite to the shield plate 40 in the shield wall portion 44. The shield lid portion 45 is, for example, integrally formed with the shield wall portion 44. Note that the shield lid portion 45 may be a separate member from the shield wall portion 44. When the shield lid portion 45 is a separate member from the shield wall portion 44, the shield lid portion 45 is integrated with the shield wall portion 44 by, for example, welding or the like. A hole 45a through which each lead wire 32 can be inserted is formed in the shield lid portion 45. Each lead wire 32 is electrically connected to the substrate 20 through the hole 45a. According to this, noise radiated from the lead wire 32 toward the substrate 20 can also be shielded by the shield lid portion 45.

[0046] ○ As shown in FIG. 3, an end portion of the cover peripheral wall 52 of the shield cover 50, which is located on the side opposite to the cover end wall 51, may be a solder connection portion 56 soldered to the substrate 20. Thus, the shield cover 50 may have a solder connection portion 56 soldered to the substrate 20. In this case, the shield cover 50 may be configured not to have each flange portion 53. The substrate 20 has a ground pattern 23. The ground pattern 23 is electrically connected to the boss portion 42. Therefore, the ground pattern 23 is electrically connected to the shield plate 40 via the boss portion 42. The substrate 20 has a hole 24. The solder connection portion 56 is soldered to the substrate 20 in a state of being inserted into the hole 24. The solder connection portion 56 is electrically connected to the ground pattern 23 by being soldered to the substrate 20. Therefore, the solder connection portion 56 is electrically connected to the ground pattern 23. Thus, a configuration in which the shield cover 50 has a solder connection portion 56 soldered to the substrate 20 and the solder connection portion 56 is electrically connected to the ground pattern 23 is suitable as a configuration for electrically connecting the shield cover 50 to the ground pattern 23. In this way, the shield cover 50 may be electrically connected to the shield plate 40 via the ground pattern 23. According to this, noise shielded by the shield cover 50 flows to the shield plate 40 via the ground pattern 23 and also flows to the ground via the shield plate 40. Such a configuration is suitable as a configuration for flowing noise shielded by the shield cover 50 to the ground.

[0047] ○ As shown in FIG. 4, the shield cover 60 may be in the form of a sheet. The shield cover 60 may be, for example, a conductive cloth tape. The shield cover 60 has an extending portion 61, a covering portion 62, a mounting portion 63, and a contact portion 64. The extending portion 61 extends along the surface of the substrate 20 located on the side opposite to the shield plate 40. The covering portion 62 bulges from the extending portion 61 and covers the lead wire protruding portions 33 of the respective lead wires 32. The mounting portion 63 extends from the extending portion 61 toward the shield plate 40. A mounting hole 63a is formed in the mounting portion 63. The mounting portion 63 is fastened to the shield plate 40 by screwing a bolt 65 inserted through the mounting hole 63a into the shield plate 40. Thus, the shield cover 60 is supported by the shield plate 40 when the mounting portion 63 is fastened to the shield plate 40. The shield cover 60 is electrically connected to the shield plate 40 via the bolt 65. The contact portion 64 extends from the extending portion 61 toward the inner surface of the lid member 13 of the housing 11. And the contact portion 64 is attached to the inner surface of the lid member 13 of the housing 11 via, for example, a conductive adhesive. Therefore, the contact portion 64 is in contact with the housing 11 via the adhesive. Thus, the shield cover 60 may have a contact portion 64 that contacts the housing 11. The shield cover 60 is electrically connected to the housing 11 via the contact portion 64. According to this, the noise shielded by the shield cover 60 flows from the contact portion 64 to the ground via the housing 11. Such a configuration is suitable as a configuration for flowing the noise shielded by the shield cover 60 to the ground.

[0048] ○ As shown in FIG. 5, a part of the shield wall portion 44 may also serve as a boss portion 71 into which a bolt 70 for fastening the substrate 20 to the shield plate 40 is screwed. In this case, the shield wall portion 44 abuts on the surface of the substrate 20 located on the shield plate 40 side. It should be noted that the shield wall portion 44 and the substrate 20 need to be in contact with each other in a state where insulation between the shield wall portion 44 and the pattern of the substrate 20 is ensured.

[0049] ○ As shown in FIG. 5, the electronic component unit 10 may be configured without the shield cover 50. ○ In the embodiment, the shield cover 50 may have only one flange portion 53. In short, the number of locations where the shield cover 50 is fastened to the boss portion 42 by bolts 54 together with the substrate 20 is not particularly limited.

[0050] ○ In the embodiment, a part of the shield cover 50 may be in contact with, for example, the inner surface of the lid member 13 of the housing 11. In short, even if the shield cover 50 is not sheet-shaped but plate-shaped, a part of the shield cover 50 may extend toward the inner surface of the lid member 13 of the housing 11 and have a contact portion that contacts the inner surface of the lid member 13.

[0051] ○ In the embodiment, the shield wall portion 44 may extend obliquely with respect to the thickness direction of the shield plate 40. Further, the shield wall portion 44 may be curved. In short, the shield wall portion 44 may have a shape that surrounds the lead wire 32.

[0052] ○ In the embodiment, the insertion portion 43 does not have to be a hole that penetrates the shield plate 40 in the thickness direction of the shield plate 40, and may be, for example, a notch. In short, the insertion portion 43 only needs to allow the lead wire 32 to be inserted therethrough.

[0053] ○ In the embodiment, the shield wall portion 44 may be a separate member from the shield plate 40. In this case, the shield wall portion 44 is integrally provided on the shield plate 40 by, for example, welding or the like.

[0054] ○ In the embodiment, the boss portion 42 does not have to protrude more than the shield wall portion 44, and the shield wall portion 44 may be in contact with the substrate 20. In this case, the shield wall portion 44 and the substrate 20 need to be in contact with each other in a state where insulation between the pattern of the shield wall portion 44 and the substrate 20 is ensured.

[0055] ○ In the embodiment, for example, a press-fit pin may be employed as a fastening member for fastening the substrate 20 to the shield plate 40. In this case, a press-fit hole into which the press-fit pin is press-fitted is formed in the boss portion that receives the fastening member.

[0056] ○ In the embodiment, the number of lead wires 32 of the electronic component 30 is not particularly limited. ○ In the embodiment, the electronic component 30 does not have to be a discrete semiconductor element having a plurality of lead wires 32 in which high-voltage terminals and low-voltage terminals are mixed. For example, it may be a semiconductor element having a plurality of lead wires 32 with only high-voltage terminals.

Description of Reference Numerals

[0057] 10... Electronic component unit, 11... Housing, 20... Substrate, 21... Lead wire insertion hole, 23... Ground pattern, 30... Electronic component, 31... Component body, 32... Lead wire, 33... Lead wire protruding portion, 40... Shield plate, 42, 71... Boss portion, 43... Insertion portion, 44... Shield wall portion, 50, 60... Shield cover, 53... Flange portion which is a fastening portion, 54... Bolt which is a fastening member, 56... Soldering connection portion, 64... Contact portion.

Claims

1. A substrate, An electronic component having a component body and lead wires protruding from the component body, A shield plate disposed between the component body and the substrate, extending along the substrate, and connected to ground, The shield plate has an insertion portion through which the lead wire is inserted, The lead wire is an electronic component unit that protrudes from the component body toward the substrate and is electrically connected to the substrate through the insertion portion, An electronic component unit, characterized in that a shield wall portion that protrudes toward the substrate and surrounds the lead wire is provided around the insertion portion of the shield plate.

2. The substrate has a lead wire insertion hole through which the lead wire is inserted, The lead wire has a lead wire protruding portion that is inserted into the lead wire insertion hole and protrudes from a surface of the substrate located on the side opposite to the shield plate, The electronic component unit according to claim 1, further comprising a shield cover that covers the lead wire protruding portion and is connected to ground.

3. The shield plate has a boss portion that protrudes toward the substrate and receives a fastening member for fastening the substrate to the shield plate, The electronic component unit according to claim 2, characterized in that the shield cover has a fastening portion that is fastened to the boss portion by the fastening member together with the substrate.

4. The substrate has a ground pattern that is electrically connected to the shield plate, The electronic component unit according to claim 2, characterized in that the shield cover is electrically connected to the shield plate through the ground pattern.

5. The shield cover has a solder connection portion that is soldered to the substrate, The electronic component unit according to claim 4, characterized in that the solder connection portion is electrically connected to the ground pattern.

6. A housing that houses the substrate, the electronic component, the shield plate, and the shield cover and is connected to ground, The electronic component unit according to claim 2, characterized in that the shield cover has a contact portion that contacts the housing.

7. The shield plate according to claim 1, wherein the shield plate has a boss portion that protrudes toward the substrate more than the shield wall portion and receives a fastening member for fastening the substrate to the shield plate.

Images