Holding device

Abstract

To facilitate replacement work of an insulator.SOLUTION: A holding device of the disclosure includes: a plate-like member 10 having a first surface 10A arranged orthogonal to a first direction and a second surface 10B located at the opposite side of the first surface 10A; a metal part 20 which has a third surface 20A facing the second surface 10B and a fourth surface 20B located at the opposite side of the third surface 20A and is provided with a through hole 25 penetrating from the third surface 20A to the fourth surface 20B; a pad 52 disposed at the second surface 10B side of the plate-like member 10; a terminal 53 joined to the pad 52; a cylindrical insulator 60 which is disposed so as to enclose the terminal 53; and an insulative insulation part 70. The insulator 60 includes a first insulator 61 which is arranged so that one end 61A of itself is disposed at the second surface 10B side of the plate-like member 10 and the other end 61B of itself extends into the through hole 25. A primer 73 is not disposed between the insulation part 70 and the one end 61A of the first insulator 61 and the insulation part 70 is fastened to a position such that the insulation part 70 blocks a path ranging from the pad to the metal part 20.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a holding device.

Background Art

[0002] As a holding device for holding a wafer when manufacturing a semiconductor, an electrostatic chuck described in Japanese Patent Application Laid-Open No. 2021-64661 (Patent Document 1 below) is known. This electrostatic chuck includes a plate-like member formed of ceramics, a base member formed of metal, and a joint portion for joining these. In the electrostatic chuck, a terminal hole is formed from the lower surface of the base member to the inside of the plate-like member. On the bottom surface of the recess that constitutes the terminal hole in the plate-like member, a power supply pad electrically connected to an internal electrode such as a heater electrode via a via is disposed. Inside the terminal hole of the base member, a tubular insulating tube (insulator) formed of an insulating material is disposed. Inside the insulating tube, a conductive power supply terminal is disposed. The power supply terminal is joined to the power supply pad by a brazed portion.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described electrostatic chuck, the insulating tube prevents a short circuit between the power supply terminal and the base member. However, when the applied voltage increases, discharge is likely to occur between the power supply pad and the base member. In order to suppress the discharge, it is necessary to block the discharge path from the power supply pad to the base member with an insulating resin. Here, in order to more effectively suppress the discharge, it is useful to use an adhesive or a primer or the like so that no gap is formed at the interface between the insulating resin and the power supply pad.

[0005] However, when the insulating tube deteriorates due to repeated stress being applied to the insulating tube by repeated expansion and contraction caused by repeated use of the electrostatic chuck, discharge cannot be suppressed, and thus the insulating tube needs to be replaced. To replace the insulating tube, it is necessary to remove the deteriorated insulating tube from the terminal hole. However, since the insulating tube is strongly adhered to the power supply pad via an adhesive or a primer, it is conceivable that the removability of the insulating tube deteriorates.

Means for Solving the Problems

[0006] The holding device of the present disclosure includes a plate-like member having a first surface orthogonal to a first direction and a second surface located on the opposite side of the first surface, a third surface facing the second surface, and a fourth surface located on the opposite side of the third surface, a metal portion in which a through hole penetrating from the third surface to the fourth surface is formed, a pad disposed on the second surface side of the plate-like member, a terminal joined to the pad, a cylindrical insulator disposed so as to surround the terminal, and an insulating insulating portion. The insulator includes a first insulator having one end thereof disposed on the second surface side of the plate-like member and the other end thereof extending into the through hole. No primer is disposed between the insulating portion and the one end of the first insulator, and the insulating portion is fixed at a position that blocks a path from the pad to the metal portion.

Advantages of the Invention

[0007] According to the present disclosure, the replacement work of the insulator can be easily performed.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0009] [Description of Embodiments of the Present Disclosure] First, the embodiments of the present disclosure will be listed and described. (1) The holding device of the present disclosure includes a plate-like member having a first surface orthogonal to a first direction and a second surface located on the opposite side of the first surface, a third surface facing the second surface, and a fourth surface located on the opposite side of the third surface. A metal part having a through-hole formed therethrough from the third surface to the fourth surface, a pad disposed on the side of the second surface of the plate-like member, a terminal joined to the pad, a cylindrical insulator disposed so as to surround the terminal, and an insulating insulating part. The insulator includes a first insulator having one end thereof disposed on the side of the second surface of the plate-like member and the other end thereof extending into the through-hole. No primer is disposed between the insulating part and the one end of the first insulator, and the insulating part is fixed at a position that blocks a path from the pad to the metal part. It is a holding device.

[0010] Since the insulating part is disposed so as to be fixed at a position that blocks the path from the pad to the metal part, it is possible to suppress the occurrence of discharge between the pad and the metal part. When replacing the deteriorated first insulator, since a primer generally used to improve the adhesive force is not disposed between one end of the first insulator and the insulating part, the replacement work becomes easy.

[0011] (2) The plate-like member has a bottomed pad hole in which the pad is disposed on the bottom surface. The insulator includes a first insulator and a second insulator disposed such that one end of the second insulator faces the other end of the first insulator. One end of the first insulator is disposed within the pad hole. The insulating portion includes a first insulating portion disposed between the first insulator and the inner wall of the pad hole, and a second insulating portion disposed between the second insulator and the inner wall of the through hole. It is preferable that the other end of the first insulator and the one end of the second insulator are fixed by at least one of the first insulating portion and the second insulating portion. The discharge between the pad and the metal part can be suppressed by the first insulating portion. Further, the discharge between the terminal and the metal part through the gap between the first insulator and the second insulator can be suppressed by at least one of the first insulating portion and the second insulating portion.

[0012] (3) It is preferable that the first insulating portion includes a first resin made of an adhesive mainly composed of silicone and a filler having thermal conductivity. Since the first insulating portion includes a filler having thermal conductivity, heat is easily transferred from the first insulator to the metal part, and the heat dissipation performance can be improved.

[0013] (4) It is preferable that the second insulating portion includes a non-adhesive second resin and a primer interposed between the second resin and the object. The second insulator can be fixed to the inner wall of the through hole by the second insulating portion.

[0014] (5) It is preferable that a gap is formed between the first insulating portion and the second insulator. Since a gap is formed between the first insulating portion and the second insulator, the second insulator is not fixed to the first insulator via the first insulating portion, and the second insulator can be easily removed from the metal part.

[0015] [Details of Embodiments of the Present Disclosure] <Embodiment> Specific examples of embodiments of the present disclosure will be described with reference to FIGS. 1 to 4. It should be noted that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. In the following description, for a plurality of identical members, only some members may be labeled, and the labels of other members may be omitted. Also, in this specification, "orthogonal" shall include arrangements in a mode that is substantially recognized as orthogonal.

[0016] In FIGS. 1 and 2, XYZ axes orthogonal to each other for specifying directions are shown. In this specification, for convenience, the Z-axis direction is defined as the vertical direction, and the XY plane direction is defined as the horizontal direction to describe the configuration of the holding device. However, in the actual usage mode of the holding device, it may have a different arrangement. Note that in FIGS. 3 to 5, since it is inverted in the vertical direction, the upper side in the drawing is defined as the upper side and the lower side in the drawing is defined as the lower side as shown for description. The vertical direction corresponds to the "first direction" of the present disclosure.

[0017] (Electrostatic chuck 1) The holding device of the present disclosure is an electrostatic chuck 1 that can adsorb and hold an object such as a semiconductor wafer or a glass substrate (hereinafter referred to as "wafer W"). The electrostatic chuck 1 is attached to, for example, a processing chamber of a semiconductor manufacturing apparatus (not shown) and is used to perform various processes (film formation, etching, etc.) on the wafer W using plasma. The electrostatic chuck 1 includes, as shown in FIG. 1, a plate-like member 10 and a metal part 20. The plate-like member 10 and the metal part 20 are joined by a joining part 30. The electrostatic chuck 1 is configured to be able to adsorb and hold the wafer W by electrostatic attraction.

[0018] (Plate-like member 10) The plate-like member 10 is generally disk-shaped and can be formed, for example, into a shape having a diameter of about 300 mm and a thickness of about 5 mm. The plate-like member 10 is an insulating substrate. The material mainly forming the plate-like member 10 is, for example, ceramics such as aluminum nitride (AlN) or alumina (Al2O3).

[0019] The plate-shaped member 10 has a first surface (the upper surface shown in FIG. 2) 10A orthogonal to the vertical direction and a second surface (the lower surface shown in FIG. 2) 10B located on the opposite side of the first surface 10A. The first surface 10A is a circular flat surface and functions as a holding surface for holding the wafer W. The second surface 10B disposed on the side opposite to the first surface 10A in the holding member 10 is joined to the metal part 20 via the joining part 30.

[0020] Inside the plate-shaped member 10, a chuck electrode 40 formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is disposed. The shape of the chuck electrode 40 as viewed from the vertical direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attraction force is generated, and the wafer W is attracted and fixed to the first surface 10A of the plate-shaped member 10 by this electrostatic attraction force.

[0021] Below the chuck electrode 40 inside the plate-shaped member 10, a heater electrode 50 formed of a resistance heating element containing a conductive material (for example, tungsten, molybdenum, platinum, etc.) is disposed. When a voltage is applied to the heater electrode 50 from a power source (not shown), the heater electrode 50 generates heat, thereby heating the plate-shaped member 10, and the wafer W held on the first surface 10A of the plate-shaped member 10 is heated.

[0022] The metal part 20 is a disk-shaped member and can be formed into a shape having a diameter of about 340 mm and a thickness of about 35 mm, for example. The material mainly forming the metal part 20 is a conductive material such as aluminum or an aluminum alloy. Therefore, the coefficient of thermal expansion of the metal part 20 is different from that of the plate-shaped member 10. Here, the "material mainly forming" means the main component and means the material having the largest content ratio (weight ratio) (the same applies hereinafter).

[0023] (Metal part 20 and joining part 30) The metal part 20 has a third surface 20A facing the second surface 10B of the plate-like member 10 and a fourth surface 20B located on the opposite side of the third surface 20A. The plate-like member 10 and the metal part 20 are arranged such that the second surface 10B of the plate-like member 10 and the third surface 20A of the metal part 20 face each other in the vertical direction with the joint part 30 therebetween.

[0024] The joint part 30 is constituted by, for example, an adhesive such as a silicone-based resin, a fluorine-based resin, an acrylic-based resin, or an epoxy-based resin. The thickness of the joint part 30 is, for example, about 0.1 mm to 1.5 mm.

[0025] Inside the metal part 20, a refrigerant flow path 21 is provided. The refrigerant flow path 21 is connected to a refrigerant circulation device (not shown). The refrigerant circulation device is configured to be able to circulate a refrigerant such as a fluorine-based inert liquid or water through the refrigerant flow path 21. When the refrigerant flows through the refrigerant flow path 21, the metal part 20 is cooled, and due to the heat transfer (heat extraction) between the metal part 20 and the plate-like member 10 via the joint part 30, the plate-like member 10 is cooled, and the wafer W held on the first surface 10A of the plate-like member 10 is cooled. Thereby, the temperature of the wafer W can be controlled.

[0026] (Chuck electrode 40 and heater electrode 50) Next, a configuration for supplying power to the heater electrode 50 will be described with reference to FIGS. 2 and 3. The electrostatic chuck 1 is provided with a configuration for supplying power to the heater electrode 50. Since the configuration for supplying power to the chuck electrode 40 is the same as the configuration for supplying power to the heater electrode 50, the description thereof will be omitted.

[0027] That is, as shown in FIG. 2, the electrostatic chuck 1 is formed with a terminal hole H for a heater electrode (hereinafter referred to as "terminal hole H") that extends from the fourth surface 20B of the metal part 20 into the inside of the plate-like member 10. The terminal hole H is an integral hole formed by the communication of a through hole 25 that vertically penetrates from the third surface 20A to the fourth surface 20B of the metal part 20, a through hole 35 that vertically penetrates the joint part 30, and a bottomed pad hole 15 formed on the second surface 10B side of the plate-like member 10. In the present embodiment, the through holes 25 and 35 that constitute the terminal hole H are holes having a substantially circular cross-section (a cross-section cut in a direction perpendicular to the vertical direction).

[0028] On the bottom surface 15A of the pad hole 15 that constitutes the terminal hole H in the plate-like member 10, a power supply pad 52 for a heater electrode (hereinafter referred to as "pad 52") that is electrically connected to the heater electrode 50 via a via 51 for a heater electrode (hereinafter referred to as "via 51") is arranged. The pad 52 is arranged on the side of the second surface 10B of the plate-like member 10, and more specifically, it is arranged on the bottom surface 15A of the pad hole 15. The pad 52 and the via 51 are formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.). Note that as long as the pad 52 is exposed from the plate-like member 10, a part or the whole in the thickness direction (vertical direction) of the pad 52 may be embedded in the plate-like member 10.

[0029] An insulator 60 made of an insulating resin material is arranged in the terminal hole H. The insulator 60 has a cylindrical shape. As shown in FIG. 2, the insulator 60 has one end 60A on the second surface 10B side and the other end 60B on the fourth surface 20B side. The insulator 60 prevents discharge (short circuit) between the power supply terminal 53 for the heater electrode, which will be described later, and the metal part 20. The thermal expansion coefficient of the metal part 20 and the thermal expansion coefficient of the insulator 60 are both larger than the thermal expansion coefficient of the plate-like member 10.

[0030] A power supply terminal 53 for a heater electrode (hereinafter referred to as "terminal 53") is joined to the pad 52 by brazing. The terminal 53 extends from the pad 52 into the insulator 60 and is disposed within the insulator 60. The insulator 60 is disposed so as to surround the terminal 53. The terminal 53 has a round bar shape and extends in the vertical direction. The tip of the terminal 53 is rounded. When the electrostatic chuck 1 is in use, power is supplied to the heater electrode 50 through a conduction path from the power supply, via the terminal 53, the pad 52, and the via 51, causing the heater electrode 50 to generate heat.

[0031] Similarly, for the chuck electrode 40, when the electrostatic chuck 1 is in use, power is supplied to the chuck electrode 40 through a conduction path from the power supply, via the power supply terminal 43 for the chuck electrode, the pad 42 for the chuck electrode, and the via 41 for the chuck electrode, thereby generating an electrostatic attraction force for adsorbing and fixing the wafer W to the first surface 10A.

[0032] (Insulator 60) As shown in FIG. 3, the insulator 60 has a first insulator 61 with one end 61A disposed on the side of the second surface 10B of the plate-like member 10 and the other end 61B extending into the through-hole 25, and a second insulator 62 with one end 62A disposed to face the other end 61B of the first insulator 61 and the other end 62B extending to the fourth surface 20B. The first insulator 61 and the second insulator 62 are coaxially arranged. The material mainly forming the insulator 60 is a super engineering plastic such as polyether ether ketone.

[0033] The first insulator 61 is formed in a cylindrical shape from one end 61A to the other end 61B. On the other hand, a pedestal portion 16 is formed to project in the vertical direction at the outer peripheral edge portion of the bottom surface 15A of the pad hole 15. The pedestal portion 16 has a placement surface 16A on which the outer peripheral edge portion at the lower end of the first insulator 61 is placed. A first space S1 in which a first insulating portion 71 described later is disposed is formed between one end 61A of the first insulator 61 and the bottom surface 15A of the pad hole 15.

[0034] One end 61A of the first insulator 61 is accommodated in the pad hole 15, and the other end 61B of the first insulator 61 is accommodated on the side of the third surface 20A in the through hole 25 of the metal portion 20. The first insulator 61 extends upward from inside the pad hole 15 through the through hole 35 of the joint portion 30 to inside the through hole 25 of the metal portion 20.

[0035] A second space S2 in which a first insulating portion 71 described later is disposed is constituted by the space formed between the first insulator 61 and the inner peripheral surface of the pad hole 15, the space formed between the first insulator 61 and the inner peripheral surface of the through hole 35 of the joint portion 30, and the space formed between the first insulator 61 and the inner peripheral surface of the through hole 25.

[0036] A third space S3 in which a second insulating portion 72 described later is disposed is constituted by the space formed between the second insulator 62 and the inner peripheral surface of the through hole 25.

[0037] (Insulating portion 70) An insulating portion 70 is filled between the insulator 60 and the inner wall of the terminal hole H. The insulating portion 70 has at least a first insulating portion 71 disposed between the first insulator 61 and the inner wall of the pad hole 15, and a second insulating portion 72 disposed between the second insulator 62 and the inner wall of the through hole 25. The first insulating portion 71 is located in a first space S1 and a second space S2, and the second insulating portion 72 is located in a third space S3. Specifically, the first insulating portion 71 of the present embodiment is disposed between the first insulator 61 and the inner wall of the pad hole 15, between the first insulator 16 and the inner wall of the through hole 35, and between the first insulator 61 and the inner wall of the through hole 25.

[0038] The first insulating portion 71 includes a first resin made of an adhesive mainly composed of silicone, and a filler having thermal conductivity. The second insulating portion 72 includes a non-adhesive second resin, and a primer 73 interposed between the second resin and the object (the inner wall of the through hole 25 and the outer surface of the second insulator 62). The other end 61B of the first insulator 61 and one end 62A of the second insulator 62 are fixed by both the first insulating portion 71 and the second insulating portion 72.

[0039] FIG. 4 shows a state before the first insulator 61 and the second insulator 62 are fixed to the inner wall of the terminal hole H, in which the primer 73 is applied to each of the insulators 61, 62 and the inner wall of the terminal hole H.

[0040] Next, the arrangement of the primer 73 will be described in detail. In the through hole 25, the primer 73 is disposed on the inner peripheral surface of the through hole 25. In the through hole 35, the primer 73 is disposed on the inner peripheral surface of the through hole 35. In the pad hole 15, the primer 73 is disposed at four locations: the inner peripheral surface of the pad hole 15, the mounting surface 16A of the pedestal portion 16, the inner peripheral surface of the pedestal portion 16, and the bottom surface 15A of the pad hole 15.

[0041] In the first insulator 61, the primer 73 is disposed on the upper surface of the first insulator 61 and on the outer peripheral surface of the first insulator 61. However, the primer 73 is not disposed at one end 61A of the first insulator 61. Therefore, when the first insulating portion 71 is filled in the first space S1, the primer 73 is not disposed between the first insulating portion 71 and one end 61A of the first insulator 61.

[0042] In the second insulator 62, the primer 73 is disposed on the outer peripheral surface of the second insulator 62 and on the lower surface of the second insulator 62.

[0043] After applying the primer 73 in the above arrangement, the first insulator 61 is inserted into the terminal hole H, and subsequently the second insulator 62 is inserted into the terminal hole H. One end 61A of the first insulator 61 is supported by the mounting surface 16A of the pedestal portion 16, and one end 62A of the second insulator 62 is supported by the other end 61B of the first insulator 61. Also, the first insulator 61 and the second insulator 62 are disposed around the terminal 53. Thereby, a first space S1 is formed between one end 61A of the first insulator 61 and the bottom surface 15A of the pad hole 15, a second space S2 is formed between the outer peripheral surface of the first insulator 61 and the inner peripheral surface of the pad hole 15, the inner peripheral surface of the through hole 35, and the inner peripheral surface of the through hole 25, and a third space S3 is formed between the outer peripheral surface of the second insulator 62 and the inner peripheral surface of the through hole 25.

[0044] Inject the first insulating part 71 into the first space S1, inject the first insulating part 71 into the second space S2, and inject the second insulating part 72 into the third space S3. However, a gap G is formed between the first insulating part 71 injected into the second space S2 and one end 62A of the second insulator 62. That is, the first space S1 is filled with the first insulating part 71 without a gap, but the gap G in the second space S2 is not filled with the first insulating part 71. After the injection of each insulating part 71, 72 is completed, heat is applied to cure each insulating part 71, 72. In this way, the primer 73 is filled without a gap at the interface between each insulating part 71, 72 and the objects (metal part 20, joint part 30, plate-like member 10, first insulator 61, and second insulator 62), the adhesive force is improved, and the withstand voltage property is increased.

[0045] Specifically, since the first insulating part 71 and the primer 73 are fixed at a position that blocks the path from the pad 52 to the metal part 20, the discharge between the pad 52 and the metal part 20 can be suppressed. Also, since the primer 73 is filled at the interface between the other end 61B of the first insulator 61 and one end 62A of the second insulator 62, the discharge between the terminal 53 and the metal part 20 can be suppressed.

[0046] Furthermore, in this embodiment, the removability when replacing the insulator 60 can be improved. Due to the repeated expansion and contraction caused by the repeated use of the electrostatic chuck 1, stress is applied to the insulator 60, and the insulator 60 may chip or be burned due to discharge. Therefore, it becomes necessary to replace such a deteriorated insulator 60. To replace the insulator 60, it is necessary to remove the defective first insulator 61 and second insulator 62. However, since they are strongly adhered to the object via the primer 73, the removability is poor. Therefore, in this embodiment, since the primer 73 is not arranged between the first insulating part 71 and one end 61A of the first insulator 61, the removability of the first insulator 61 can be improved.

[0047] In this embodiment, the primer 73 is applied at two locations, namely, on the outer peripheral surface of the first insulator 61 and on the upper surface of the first insulator 61. However, by not applying the primer 73 at these locations, the application area of the primer 73 can be reduced, and the removability of the first insulator 61 can be further improved.

[0048] Also, in this embodiment, a gap G (an area without the first insulating portion 71) is provided between the first insulating portion 71 and the second insulator 62. Thus, the removability of the insulator 60 can also be improved by this means.

[0049] Note that since the first insulating portion 71 has adhesiveness, the first insulator 61 can be fixed to the object (metal portion 20, joint portion 30, plate-like member 10) even without the primer 73. However, by applying the primer 73, the interface between the first insulating portion 71 and the object is filled with the primer 73. Therefore, the primer 73 is necessary for improving the withstand voltage property. On the other hand, since the second insulating portion 72 does not have adhesiveness, the primer 73 is necessary for fixing the second insulator 62 to the object (metal portion 20). As a result, the withstand voltage property is also improved.

[0050] (Advantages and effects of the embodiment) The electrostatic chuck 1 of the present disclosure includes a plate-like member 10 having a first surface 10A orthogonal to a first direction and a second surface 10B located on the opposite side of the first surface 10A, a metal part 20 having a third surface 20A facing the second surface 10B and a fourth surface 20B located on the opposite side of the third surface 20A, with a through-hole 25 formed penetrating from the third surface 20A to the fourth surface 20B, a pad 52 disposed on the side of the second surface 10B of the plate-like member 10, a terminal 53 joined to the pad 52, a cylindrical insulator 60 disposed so as to surround the terminal 53, and an insulating insulating part 70. The insulator 60 includes a first insulator 61 having one end 61A of itself disposed on the side of the second surface 10B of the plate-like member 10 and the other end 61B of itself extending into the through-hole 25. A primer 73 is not disposed between the insulating part 70 and one end 61A of the first insulator 61, and the insulating part 70 is fixed at a position that blocks the path from the pad 52 to the metal part 20.

[0051] Since the insulating part 70 is disposed so as to be fixed at a position that blocks the path from the pad 52 to the metal part 20, it is possible to suppress the occurrence of discharge between the pad 52 and the metal part 20. When replacing the deteriorated first insulator 61, since a primer 73 generally used to improve the adhesive force is not disposed between one end 61A of the first insulator 61 and the insulating part 70, the replacement work becomes easy.

[0052] The plate-like member 10 has a bottomed pad hole 15 in which the pad 52 is disposed on the bottom surface 15A. The insulator 60 includes a first insulator 61 and a second insulator 62 having one end 62A of itself disposed so as to face the other end 61B of the first insulator 61. One end 61A of the first insulator 61 is disposed in the pad hole 15. The insulating part 70 has a first insulating part 71 disposed between the first insulator 61 and the inner wall of the pad hole 15 and a second insulating part 72 disposed between the second insulator 62 and the inner wall of the through-hole 25. The other end 61B of the first insulator 61 and one end 62A of the second insulator 62 are fixed by at least one of the first insulating part 71 and the second insulating part 72. The first insulating portion 71 can suppress discharge between the pad 52 and the metal portion 20. Further, at least one of the first insulating portion 71 and the second insulating portion 72 can suppress discharge between the terminal 53 and the metal portion 20 through the gap between the first insulator 61 and the second insulator 62.

[0053] The first insulating portion 71 includes a first resin made of an adhesive mainly composed of silicone and a filler having thermal conductivity. Since the first insulating portion 71 includes a filler having thermal conductivity, heat can easily be transferred from the first insulator 61 to the metal portion 20, and heat dissipation performance can be improved.

[0054] The second insulating portion 72 includes a second resin having no adhesiveness and a primer 73 interposed between the second resin and the object. The second insulating portion 72 can fix the second insulator 62 to the inner wall of the through hole 25.

[0055] A gap G is formed between the first insulating portion 71 and the second insulator 62. Since a gap G is formed between the first insulating portion 71 and the second insulator 62, the second insulator 62 is not fixed to the first insulator 61 via the first insulating portion 71, and the second insulator 62 can be easily removed from the metal portion 20.

[0056] <Modification Example> Next, a modification example will be described with reference to FIG. 5. Different from the electrostatic chuck 1 of the embodiment, in the electrostatic chuck of the modification example, both the first insulating portion and the second insulating portion are composed of a resin having no adhesiveness and a primer. The same components as those in the embodiment are denoted by the same reference numerals as those in the embodiment, and the description thereof will be omitted.

[0057] The first insulating portion 171 is disposed in the first space S1 and the second space S2, and the second insulating portion 172 is disposed in the third space S3. As described above, both the first insulating portion 171 and the second insulating portion 172 are composed of a resin without adhesiveness and a primer 73. The point that no primer 73 is disposed between the first insulating portion 171 and one end 61A of the first insulator 61 is the same as that in the embodiment.

[0058] <Other Embodiments> (1) In the embodiment, the arrangement of the primer 73 of the heater electrode 50 has been exemplified and described. However, the arrangement of the primer 73 of the chuck electrode 40 may be the same as that of the primer 73 of the heater electrode 50.

[0059] (2) In the embodiment, an example in which the primer 73 is disposed between the first insulator 61 and the second insulator 62 has been exemplified. However, the primer 73 may not be disposed between the first insulator 61 and the second insulator 62.

[0060] (3) In the embodiment, an example of the insulator 60 in which the first insulator 61 and the second insulator 62 are formed of separate members has been exemplified. However, the first insulator and the second insulator may be integrally formed.

[0061] (4) In the modification example, an example in which both the first insulating portion 171 and the second insulating portion 172 include a second resin without adhesiveness and a primer interposed between the second resin and the object has been exemplified. However, both the first insulating portion and the second insulating portion may include a first resin composed of an adhesive mainly containing silicone and a filler having thermal conductivity.

[0062] (5) In the embodiment, an example in which a gap G is formed between the first insulating portion 71 and the second insulator 62 has been exemplified. However, the gap G may be eliminated.

Description of Reference Numerals

[0063] 1: Electrostatic chuck 10: Plate-like member 10A: First surface 10B: Second surface 15: Pad hole 15A: Bottom surface 16: Pedestal portion 16A: Mounting surface 20: Metal part 20A: Third surface 20B: Fourth surface 21: Refrigerant flow path 25: Through hole 25A: Small-diameter through hole 25B: Large-diameter through hole 25C: Horizontal plane 30: Joint portion 35: Through hole 40: Chuck electrode 41: Via for chuck electrode 42: Pad for chuck electrode 43: Power supply terminal for chuck electrode 50: Heater electrode 51: Via for heater electrode 52: Pad for heater electrode 53: Power supply terminal for heater electrode 60: Insulator 60A: One end 61: First insulator 61A: One end 61B: The other end 62: Second insulator 62A: One end 62B: The other end 70: Insulating portion 71, 171: First insulating portion 72, 172: Second insulating portion G: Gap H: Hole for heater electrode terminal S1: First space S2: Second space S3: Third space W: Wafer

Claims

1. A plate-like member having a first surface orthogonal to a first direction and a second surface located on the opposite side of the first surface; A metal part having a third surface facing the second surface and a fourth surface located on the opposite side of the third surface, and having a through hole formed therethrough from the third surface to the fourth surface; A pad disposed on the side of the second surface of the plate-like member; A terminal joined to the pad; A cylindrical insulator disposed so as to surround the terminal; An insulating insulating part, and comprising: The insulator includes a first insulator having one end thereof disposed on the side of the second surface of the plate-like member and the other end thereof extending into the through hole; No primer is disposed between the insulating part and the one end of the first insulator, and The insulating part is fixed at a position that blocks a path from the pad to the metal part. A holding device.

2. The plate-like member has a bottomed pad hole in which the pad is disposed on the bottom surface, The insulator has the first insulator and a second insulator having one end thereof disposed so as to face the other end of the first insulator, One end of the first insulator is disposed in the pad hole, The insulating part has a first insulating part disposed between the first insulator and the inner wall of the pad hole, and a second insulating part disposed between the second insulator and the inner wall of the through hole, and the other end of the first insulator and the one end of the second insulator are fixed by at least one of the first insulating part and the second insulating part. The holding device according to claim 1.

3. The first insulating part includes a first resin made of an adhesive mainly composed of silicone and a filler having thermal conductivity. The holding device according to claim 2.

4. The second insulating part includes a non-adhesive second resin and a primer interposed between the second resin and an object. The holding device according to claim 2.

5. A gap is formed between the first insulating part and the second insulator. The holding device according to any one of claims 2 to 4.

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