Liquid discharge device, molding device, control method, and article manufacturing method

Abstract

To provide a liquid discharge device capable of eliminating a foreign object filling a nozzle outlet.SOLUTION: This liquid discharge device comprises: a storage part that stores a discharge liquid; an outlet having a plurality of nozzles for discharging the discharge liquid; a circulation part for circulating the discharge liquid on individual flow paths in the nozzles; and a control unit that applies foreign object pulling-in waveforms to piezoelectric elements provided in the nozzles to pull in and eliminate a foreign object clogging the outlet of the nozzles, and then circulates the discharge liquid of the individual flow paths in the nozzles by the circulation part to discharge the foreign object from the individual flow paths.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a liquid ejection device, a molding device, a control method, a method for manufacturing an article, and the like.

Background Art

[0002] In a liquid ejection device that ejects a liquid, a piezoelectric element is driven to eject the liquid from a fine ejection port. The fine ejection port may be clogged with foreign matter and cause ejection failure.

[0003] Patent Document 1 discloses a method of removing foreign matter adhering to the outside of a nozzle port by driving a piezoelectric element to push out a liquid to the outside of the nozzle port.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the method of removing foreign matter adhering to the outside of the nozzle port by driving a piezoelectric element to push out a liquid to the outside of the nozzle port as in Patent Document 1, it is difficult to remove foreign matter stuck inside the ejection port from the inside.

[0006] One object of the present invention is to provide a liquid ejection device capable of removing foreign matter clogged in the ejection port of a nozzle.

Means for Solving the Problems

[0007] A liquid ejection device according to one aspect of the present invention includes a storage unit that stores a liquid to be ejected, and an ejection unit having a plurality of nozzles for ejecting the liquid to be ejected. A circulation unit for circulating the discharge liquid in the individual flow paths inside the nozzle; After drawing in and removing foreign matter clogging inside the discharge port of the nozzle by applying a foreign matter drawing-in waveform to the piezoelectric element provided in the nozzle, a control unit that circulates the discharge liquid in the individual flow paths inside the nozzle by the circulation unit and discharges the foreign matter from the individual flow paths; It is characterized by having the above.

Effect of the Invention

[0008] According to the present invention, it is possible to provide a liquid discharge device capable of removing foreign matter clogging inside the discharge port of a nozzle.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments. In each figure, the same members or elements are denoted by the same reference numerals, and overlapping explanations are omitted or simplified.

[0011] <Embodiment 1> FIG. 1 is a diagram showing a configuration example of a liquid ejection device according to Embodiment 1 of the present invention. The liquid ejection device 10 includes a discharge unit 11, a storage unit 12, a driver board 31, a discharge liquid 8 for discharging from the discharge unit 11, and a circulation unit 40 for circulating the discharge liquid in the individual flow paths inside the nozzles.

[0012] Note that the liquid ejection device 10 is used to apply a discharge liquid such as an imprint material to a substrate in a forming device such as an imprint device or a planarizing device. Further, in the forming device, after applying the discharge liquid to the substrate by the liquid ejection device 10, the mold is brought into contact with the discharge liquid on the substrate, and then ultraviolet rays, heat, or the like is irradiated to the discharge liquid to cure it, thereby forming a predetermined pattern or a flat surface.

[0013] The storage unit 12 is a container for storing the discharge liquid 8 and is connected to the discharge unit 11. The discharge liquid 8 is supplied to the discharge unit 11 from a supply port 20. The discharge unit 11 has a plurality of nozzles for discharging the discharge liquid 8, and the discharge liquid 8 supplied through the supply port 20 can be discharged from each nozzle.

[0014] FIG. 2 is a diagram showing a schematic configuration example of a nozzle according to Embodiment 1, and shows an enlarged view of each nozzle 9 in the discharge unit 11. The discharge liquid 8 supplied to each nozzle through the supply port 20 of the discharge unit 11 is supplied to the individual flow path 23 of each nozzle through an individual flow path supply port 24. 25 is an individual flow path outlet.

[0015] The discharge liquid 8 supplied to the individual flow path 23 is discharged from a discharge port 19 provided near the center of the individual flow path 23. The opening area of the discharge port 19 is smaller than the opening area of the individual flow path supply port 24, and the cross-sectional area is the smallest in the flow path of the nozzle 9.

[0016] In order to discharge the discharge liquid 8 as droplets from the discharge port 19, an energy generating element is provided at a position facing the discharge port 19.

[0017] Examples of the energy generating element include a piezoelectric element and a heating resistor. Since a resin-rich discharge liquid is often used, a piezoelectric element 18 is used here as the energy generating element.

[0018] A command for controlling the discharge is issued from the control unit 32 to the driver board 31. The output of the driver board 31 is connected to the piezoelectric elements 18 of each nozzle of the liquid discharge device 10, and a voltage waveform for discharging droplets is applied to the piezoelectric element 18 of the specified nozzle, and the droplets are discharged.

[0019] Note that the control unit 32 incorporates a CPU or the like as a computer, and functions as a control means for controlling the operations of each part of the entire liquid discharge device 10 based on a computer program stored in a memory as a storage medium. Note that the control unit 32 may be provided inside the liquid discharge device 10 or outside the liquid discharge device 10.

[0020] In this embodiment, the piezoelectric element 18 is also used to determine the clogging state of the discharge port 19. That is, in the liquid discharge device according to this embodiment, by applying a voltage of 30% to 70% of the voltage applied to the piezoelectric element 18 when discharging the discharge liquid 8, the volume of the individual flow path 23 is changed (hereinafter referred to as inspection oscillation), and vibration is applied to the discharge liquid 8 in the individual flow path 23.

[0021] With this voltage variation range, vibration can be applied to the discharge liquid 8 inside the individual flow path 23, but the meniscus at the discharge port 19 is not broken, and the discharge liquid 8 is not discharged from the discharge port 19. Even after stopping applying voltage to the piezoelectric element 18, residual vibration remains in the individual flow path. Since this residual vibration deforms the piezoelectric element 18, a back electromotive force is generated in the piezoelectric element 18.

[0022] When the discharge port 19 is blocked by deposits or when air bubbles enter the individual flow path 23, the resonance frequency in the individual flow path 23 is different from that in the normal discharge state. When a voltage is applied to the piezoelectric element 18 to vibrate the liquid in the individual flow path 23, the residual vibration also becomes different.

[0023] Therefore, the nozzle clogging detection means of the present embodiment measures the residual vibration in the individual flow path 23 by the back electromotive force of the piezoelectric element 18 to detect that a foreign object has clogged the discharge port 19 of the nozzle or that air bubbles have entered the individual flow path 23.

[0024] In the present embodiment, at the timing when the discharge operation is not being performed, the clogging condition of the discharge port 19 is inspected by the inspection oscillation of the piezoelectric element 18. If an abnormality is recognized, the process proceeds to the abnormal nozzle recovery step described later. If there is no abnormality, it becomes a ready state where discharge can be performed at any time.

[0025] In addition, in the present embodiment, a discharge defective nozzle is detected by inspection oscillation. However, a landing inspection device (not shown) may be used to measure the presence or absence of landing, the landing position, speed, and amount to detect a discharge defective nozzle.

[0026] The discharge part 11 is open to the atmosphere through the discharge port 19. However, since the diameter of the discharge port 19 is from several μm to several tens of μm and the outer surface of the nozzle opening is in a liquid-repellent state, the discharged liquid 8 does not leak due to its own weight. The liquid surface near the discharge port 19 is held in a concave so-called meniscus state.

[0027] In addition, the discharge part 11 is connected to the supply port 20 and the discharge port 21. The discharged liquid 8 supplied from the supply port 20 to each individual flow path 23 is discharged from the discharge port 21 through each individual flow path outlet 25.

[0028] 40 is a circulation part for circulating the discharged liquid in the individual flow path inside the nozzle. The discharge port 21 is connected to the passage 45 of the circulation part 40. A pump 44, a three-way valve 47, and a filter 41 are connected to the passage 45. The pump 44 forms a flow from the pump 44 toward the filter 41.

[0029] Still, the three-way valve 47 is usually configured such that the discharged liquid 8 flows from the pump 44 to the filter 41. When the pump 44 is driven, the discharged liquid 8 in the storage unit 12 passes through the individual flow path 23 from the supply port 20, passes through the discharge port 21, and is filtered by the filter 41. By the filtered discharged liquid 8 returning to the storage unit 12 again, the cleanliness of the discharged liquid 8 in the storage unit 12 is improved. Here, 46 is the bypass passage 46.

[0030] FIG. 3 is a flowchart showing a control method for abnormal nozzle recovery according to Embodiment 1. Here, the operations of each step of the flowchart in FIG. 3 are sequentially performed by a CPU or the like as a computer in the control unit 32 executing a computer program stored in the memory.

[0031] In step S1 of FIG. 3, the CPU of the control unit 32 performs inspection oscillations of the piezoelectric elements 18 of each nozzle simultaneously or in a predetermined order during discharge standby. Here, step S1 functions as a nozzle clogging detection step (nozzle clogging detection means) for detecting that a foreign object has clogged the nozzle.

[0032] Still, step S1 is performed every period during which the imprint operation is not being performed when performing a periodic imprint operation, for example, in an imprint device or the like. Alternatively, it is performed every predetermined period when the storage unit is replaced or for regular maintenance of the imprint device.

[0033] In step S2, the CPU of the control unit 32 determines whether clogging has occurred in each nozzle based on the result of the inspection oscillation. If it is determined as No, that is, if it is determined that there is no abnormality in any of the nozzles, the flow shown in FIG. 3 is terminated.

[0034] If it is determined as Yes in step S2, that is, if it is determined that there is an abnormality in any one of the nozzles, the process proceeds to the abnormal nozzle recovery step of step S3.

[0035] In step S3, the CPU of the control unit 32 applies a pulling waveform only to the piezoelectric element 18 of the nozzle determined to be abnormal in step S2. That is, the control unit applies a foreign matter pulling waveform to the nozzle in which foreign matter is detected to be clogged by the nozzle clogging detection means. Thereby, the foreign matter is removed from the discharge port 19, and the foreign matter is moved inside the individual flow path 23.

[0036] In addition, in the present embodiment, in step S3, since no pulling waveform is applied to the nozzles without abnormalities, generation of unnecessary bubbles can be suppressed. The movement inside the individual flow path 23 when the pulling waveform is applied will be described later.

[0037] In step S4, the CPU of the control unit 32 performs a foreign matter recovery process. That is, after removing the foreign matter in the nozzle, the foreign matter 26 in the individual flow path 23 is moved into the storage unit 12 by a pump. Then, the foreign matter 26 inside the storage unit 12 is removed by driving the pump and using a filter. Also, the bubbles inside the storage unit 12 are removed. This foreign matter recovery step will also be described later.

[0038] In addition, steps S3 and S4 function as control steps. In the control step, the control unit applies a foreign matter pulling waveform to the piezoelectric element provided in the nozzle to pull in and remove the foreign matter clogged inside the discharge port of the nozzle. Then, the circulation unit circulates the discharge liquid in the individual flow path inside the nozzle to discharge the foreign matter from the individual flow path.

[0039] In step S5, the CPU of the control unit 32 causes the nozzles determined to be abnormal in step S2 to perform inspection oscillation, and determines in step S6 whether the abnormal nozzles have recovered.

[0040] That is, after pulling in and removing the foreign matter clogged inside the discharge port of the nozzle, it is determined in step S6 whether the clogging of the nozzle has been resolved. If it is determined in step S6 that the abnormal nozzle has not recovered, the process returns to step S3, and if it is determined Yes in step S6, the flow in FIG. 3 ends.

[0041] In the imprinting apparatus, when it is determined in step S2 that there is an abnormality in the nozzle, a recovery process for the abnormal nozzle is performed, and for example, several tens of minutes elapse. Therefore, the substrate on which the imprinting operation has been performed until then is replaced with a new substrate, and the imprinting operation is restarted from the first imprinting area of the replaced new substrate.

[0042] That is, a molding apparatus such as an imprinting apparatus performs a process for molding the discharge liquid by bringing a mold into contact with the discharge liquid on the substrate by a molding control unit (not shown) after discharging the discharge liquid onto the substrate by a liquid discharge device. Further, after drawing in and removing foreign matter clogged inside the discharge port of the nozzle and determining that the clogging of the nozzle has been resolved, the molding control unit replaces the substrate with a new substrate and then resumes the process for molding.

[0043] Next, FIGS. 4(A) to 4(D) are diagrams showing the state of the individual flow paths when an abnormal nozzle is recovered according to Embodiment 1, and the movement inside the individual flow path 23 when a drawing waveform is applied in step S3 will be described with reference to FIGS. 4(A) to 4(D).

[0044] FIG. 4(A) shows a state in which the foreign matter 26 is clogged in the discharge port 19. The foreign matter 26 is inside the storage portion 12 or inside the individual flow path 23, and as the discharge liquid 8 is discharged from the discharge port 19, the discharge liquid 8 in the storage portion 12 flows toward the discharge port 19.

[0045] Then, when the discharge liquid 8 is discharged from the discharge port 19, the foreign matter 26 gets stuck in the discharge port 19 from the inside. Since the foreign matter 26 is stuck from the inside of the discharge port 19, it cannot be pushed out even if an attempt is made to push it out from the inside of the discharge port 19 to the outside. In order to remove such foreign matter 26 from the discharge port 19, first, it is necessary to draw the foreign matter 26 from the discharge port 19 into the inside of the individual flow path 23.

[0046] This method will be described with reference to FIGS. 4(B), 5(A), and 5(B). FIGS. 5(A) and 5(B) are diagrams showing examples of foreign matter attracting waveforms applied to the piezoelectric element 18 of the nozzle according to Embodiment 1. FIG. 5(A) shows a foreign matter attracting waveform 60 for attracting the foreign matter 26 into the individual flow path 23.

[0047] The foreign matter attracting waveform 60 has a pushing waveform A1 (first pushing waveform) for pushing the discharge liquid 8, a waiting waveform B1 (first waiting waveform), and a pulling waveform C1 (maximum pulling waveform) for pulling the discharge liquid 8.

[0048] First, an operation of pushing the meniscus outside the discharge port 19 is performed with the pushing waveform A1. At this time, since the discharge port 19 is clogged with the foreign matter 26, the individual flow path 23 vibrates at a resonance period (period of the resonance frequency) T1 when the discharge port 19 is clogged with the foreign matter. When pushed with the pushing waveform A1, the inside of the individual flow path 23 becomes a positive pressure, and after approximately T1 / 4, the pressure starts to reverse and becomes a negative pressure.

[0049] Therefore, wait for a time of T1 / 4 with the waiting waveform B1, and apply the pulling waveform C1 in synchronization with the timing when the pressure reverses. The piezoelectric element 18 bends in the opposite direction to the discharge port 19, can apply a strong negative pressure to the inside of the individual flow path 23, and can apply a stronger force to pull the foreign matter 26 into the individual flow path 23.

[0050] In this embodiment, in order to increase the pulling force, the voltage change amount of the pulling waveform C1 is made the same as or greater than the voltage change amount of the pushing waveform A1.

[0051] That is, the foreign matter attracting waveform 60 of this embodiment has a maximum pulling waveform (pulling waveform C1) with the largest voltage change amount and a first pushing waveform (pushing waveform A1) before the maximum pulling waveform, and the voltage change amount of the first pushing waveform is set to be equal to or less than the voltage change amount of the maximum pulling waveform. Here, the voltage change amount per unit time of the first pushing waveform and the maximum pulling waveform is substantially the same, and they are compared in terms of the magnitude of the voltage change amount.

[0052] The waiting time of the waiting waveform B1 (the first waiting waveform) is optimally 1 / 4 of the resonance period T1, but if T1 / 6 <= the waiting time of the waiting waveform B1 <= T1 / 3, the effect of foreign matter removal can be obtained. That is, when there is a first waiting waveform between the maximum pulling waveform and the first pushing waveform, and the resonance period of the individual flow path is T, the waiting time of the first waiting waveform (the first waiting time) may be T / 6 or more and T / 3 or less.

[0053] In this embodiment, by such a waiting waveform, the timing of the recoil when pushing and then pulling is adjusted, so that foreign matter can be removed more strongly.

[0054] In addition, when the foreign matter 26 clogs the discharge port 19, the discharge port 19 is not completely blocked, and the resonance period T1 when the foreign matter 26 is clogged and the resonance period T0 when it is not clogged are not very different. Therefore, the waiting time of the waiting waveform B1 may be based on the resonance period T0 when the foreign matter 26 is not clogged, and the waiting time may be set to T0 / 4. Alternatively, T0 / 6 <= the waiting waveform B1 <= T0 / 3 may be used.

[0055] Another example of the foreign matter drawing waveform 60 will be described with reference to FIG. 5(B). The pushing waveform A1 (the first pushing waveform), the waiting waveform B1 (the first waiting waveform), and the pulling waveform C1 (the maximum pulling waveform) are the same as those in FIG. 5(A), and the period of the waiting waveform B1 is 1 / 4 of the resonance period T1 of the individual flow path 23. Also, in FIG. 5(B), in order to make the pulling force stronger, the voltage change amount of the pulling waveform C1 is made larger than the voltage change amount of the pushing waveform A1.

[0056] However, if the pulling is too strong with the pulling waveform C1, there is a possibility of sucking in a large amount of bubbles. Therefore, in the example of FIG. 5(B), a waiting waveform B2 (the second waiting waveform) is inserted, and after waiting for about 1 / 20 of the resonance period T1, the discharge liquid 8 is pushed with the pushing waveform A2 (the second pushing waveform) to reduce the mixing of bubbles.

[0057] By providing the push waveform A2 after the pull waveform C1 in this way, it is possible to reduce the entrainment of bubbles when the voltage change amount of the maximum pull waveform C1 is made equal to or greater than the voltage change amount of the previous push waveform A1.

[0058] Also, the voltage change amount of the maximum pull waveform C1 (the maximum pull waveform) is made larger than the voltage change amount of the subsequent push waveform A2 (the second push waveform). That is, the foreign object pulling waveform has the maximum pull waveform and the second push waveform after the maximum pull waveform, and the voltage change amount of the maximum pull waveform is made larger than the voltage change amount of the second push waveform.

[0059] Also, the waiting time (the second waiting time) of the waiting waveform B2 (the second waiting waveform) is desirably about 1 / 20 of the resonance period T1, but the effect of removing foreign objects can also be obtained even if T1 / 40 <= the second waiting time <= T2 / 10. However, the longer the period of the waiting waveform B2, the easier it is for bubbles to generate.

[0060] That is, there is a second waiting waveform between the maximum pull waveform and the second push waveform, and when the resonance period of the individual flow path is T, the waiting time of the second waiting waveform may be 1 / 40 or more and 1 / 10 or less of T.

[0061] By repeatedly applying this foreign object pulling waveform 60 to the abnormal nozzle, foreign objects can be gradually removed. For example, foreign objects are removed by applying a pulling waveform as shown in FIG. 5(A) or FIG. 5(B) about 100 times.

[0062] When the foreign object 26 is pulled out from the discharge port 19 with a strong pulling force in the individual flow path 23 as described above, as shown in FIG. 4(B), the foreign object 26 enters the individual flow path 23. At the same time, bubbles are also drawn into the individual flow path 23 by a strong negative pressure.

[0063] In this embodiment, operations for collecting these foreign objects 26 and bubbles are performed. That is, as shown in FIG. 4(C), by creating a flow from the individual flow path supply port 24 to the individual flow path outlet 25, the foreign objects 26 and bubbles in the individual flow path 23 are removed.

[0064] Still, FIG. 4(D) is a diagram showing an example of a state in which a predetermined pressing waveform is applied to the piezoelectric element 18. After FIG. 4(C), by changing to the state as shown in FIG. 4(D), the discharge liquid 8 is pushed to fill the nozzle opening with the discharge liquid 8.

[0065] An explanation of the operation in the present embodiment for creating the flow as shown in FIG. 4(C) will be given. As described above, when the three-way valve 47 does not involve the foreign matter removal operation, it is configured to flow from the pump 44 to the filter 41. Then, by driving the pump 44, the discharge liquid 8 in the storage unit 12 passes through the individual flow path 23 from the supply port 20, passes through the discharge port 21, and is filtered by the filter 41.

[0066] Still, if the discharge liquid 8 is circulated by the pump 44 while the discharge liquid 8 is being discharged from the nozzle, the pressure in the individual flow path 23 fluctuates, and the discharge speed and discharge amount of the discharge liquid 8 also fluctuate. Therefore, the discharge liquid 8 is not circulated by the pump 44 during discharge.

[0067] Also, in the present embodiment, as described with reference to FIGS. 4(B), 5(A), and 5(B), when the foreign matter attracting waveform 60 is applied for abnormal nozzle recovery, bubbles enter the individual flow path 23. Therefore, if the pump 44 is driven thereafter to circulate the bubbles as they are, the bubbles in the individual flow path 23 will enter the filter 41. For example, in the case of a filter of about 100 nm, the bubbles that enter the filter 41 cannot pass through the filter 41, and the filter 41 becomes clogged.

[0068] Therefore, in the present embodiment, when the operation of removing the foreign matter 26 with the foreign matter attracting waveform 60 is performed, the direction of the three-way valve 47 is changed so that the bubbles do not go to the filter 41, and the foreign matter and bubbles in the individual flow path 23 flow into the bypass passage 46. By doing so, the foreign matter 26 and bubbles in the individual flow path 23 enter the storage unit 12 through the bypass passage 46. Then, the bubbles accumulate at the upper part of the storage unit 12, and the foreign matter 26 floats in the discharge liquid 8 in the storage unit 12.

[0069] After that, the three-way valve 47 is returned to its original position so that the liquid flows from the pump 44 to the filter 41, and then the pump 44 is driven to remove the foreign matter 26 with the filter 41. At this time, since the bubbles stay at the upper part of the accommodating portion 12, the filter 41 will not be clogged.

[0070] Next, a method for removing bubbles will be described with reference to FIG. 6. FIG. 6 is a diagram for explaining a first bubble removal method in the accommodating portion according to Embodiment 1, and shows a state of the liquid discharge device 10 of FIG. 1 viewed from the side.

[0071] Inside the accommodating portion 12, a separation membrane 14 formed of two flexible members that separate the space inside the accommodating portion is provided. The separation membrane 14 is preferably composed of two films with a thickness of 10 μm or more and 200 μm or less, and is preferably formed of a material with low liquid permeability.

[0072] The separation membrane 14 can be formed of, for example, a film of a fluororesin material such as PFA or a composite multilayer film combining a fluororesin material and a plastic material. The space between the two flexible members forming the separation membrane 14 is sucked by a vacuum pump 128 so that the two flexible members do not separate.

[0073] One accommodating portion 12 partitioned by the separation membrane 14 of the accommodating portion 12 stores the discharge liquid 8, and the other filling liquid accommodating portion 16 stores the filling liquid. The accommodating portion 12 and the filling liquid accommodating portion 16 are separated by the separation membrane 14.

[0074] The filling liquid accommodating portion 16 is connected to the meniscus control portion 127 by a pipe 17. The meniscus control portion 127 is connected to the supply tank 126 of the filling liquid through the pipe 17. The upper part of the supply tank 126 is open to the atmosphere, and the liquid level in the supply tank 126 is at atmospheric pressure.

[0075] The liquid level of the filling liquid in the supply tank 126 is controlled so as to be at a position ΔH [mm] lower than the liquid level of the discharge port 19. In this case, the internal pressure of the discharge port 19 is controlled to a value (slightly negative pressure) ΔH × 0.01 [kP] lower than the external atmospheric pressure to maintain the meniscus.

[0076] When the discharge of the discharge liquid 8 is repeated from the discharge part 11, the discharge liquid 8 inside the storage part 12 is consumed and decreased, and the separation membrane 14 gradually deforms in the +x direction. Along with the deformation of the separation membrane 14, the filling liquid is replenished from the filling liquid tank to the filling liquid storage part 16 by a pressure control part (not shown).

[0077] Since the filling liquid in the filling liquid storage part 16 decreases, the filling liquid is replenished into the filling liquid storage part 16 by a pump (not shown), and it is controlled to maintain the difference ΔH in the liquid level height of the filling liquid between the discharge port 19 and the supply tank 126.

[0078] Thereby, the shape of the meniscus in the discharge part 11 is stabilized, and the discharge of the discharge liquid 8 can be performed with good reproducibility.

[0079] The bubbles taken into the storage part 12 in the abnormal nozzle recovery step of step S3 accumulate in the upper part of the storage part 12. If there is a large amount of gas in the storage part 12, pressure control becomes impossible, but if the amount of bubbles taken in by the vibration of the piezoelectric element 18 from several nozzles, such as those taken in during the abnormal nozzle recovery step, it will not have a great impact on pressure control.

[0080] The space between the separation membranes 14 is depressurized by a vacuum pump 128, and since the film of the separation membrane 14 permeates a certain amount of gas, the gas dissolved in the discharge liquid 8 in the storage part 12 is degassed. That is, the bubbles inside the storage part 12 are removed through the separation membrane in contact with the discharge liquid 8. Also, since the dissolved gas concentration of the discharge liquid 8 in the storage part 12 decreases, the bubbles in the storage part 12 dissolve into the discharge liquid 8 and finally disappear.

[0081] <Embodiment 2> Next, the method for removing bubbles in Embodiment 2 is shown in FIG. 7. FIG. 7 is a diagram for explaining the second method for removing bubbles in the housing portion according to Embodiment 2. A bubble removal valve 50 for removing bubbles inside the housing portion is disposed above the housing portion 12. After the abnormal nozzle recovery step of Step S3, by opening the bubble removal valve 50, the bubbles accumulated in the upper portion of the housing portion 12 can be removed.

[0082] <Embodiment regarding the manufacturing method of an article> The liquid ejection device and control method according to Embodiments 1 and 2 are suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having fine structures.

[0083] A method for manufacturing a device (such as a semiconductor device, a magnetic storage medium, a liquid crystal display element, etc.) as an article will be described.

[0084] Such a manufacturing method includes, using the liquid ejection device according to Embodiments 1 and 2, in a molding device, a coating step of applying a discharge liquid onto a substrate, and a molding step of bringing a mold into contact with the substrate onto which the discharge liquid has been applied and curing the discharge liquid to mold the discharge liquid. Further, it has a manufacturing step of manufacturing an article from the substrate on which the discharge liquid has been molded by the molding step.

[0085] That is, the method for manufacturing an article includes a step of transferring a pattern of a mold onto the surface of a substrate (such as a wafer, a glass plate, a film-like substrate, etc.) using a molding device. Here, the step of transferring the pattern of the mold may include a flattening step. Further, the substrate is not limited to a single base material and may include those having a multilayer structure.

[0086] Further, it may include a step of forming a latent image pattern (a step of exposing the substrate) on the photosensitive agent applied to the substrate using an exposure device, and a step of developing the substrate on which the latent image pattern has been formed in such a step.

[0087] Furthermore, such a manufacturing method further includes a processing step of processing the substrate before or after the pattern transfer step. Also, the processing step may include, for example, a step of removing the remaining film of the pattern.

[0088] Also, the processing step may include a step of etching the substrate using the pattern as a mask, a step of cutting out chips from the substrate (dicing), and a step of placing and electrically connecting the chips to a frame (bonding). Also, the processing step may include well-known steps such as a step of sealing with resin (molding).

[0089] The manufacturing method of the article to which Embodiment 1 or Embodiment 2 is applied can reduce the abnormality of the nozzles for discharging the discharge liquid as compared with the prior art, and thus is advantageous in at least one of the performance, quality, productivity, and production cost of the article.

[0090] As described above, the present invention has been described in detail based on its preferred embodiments. However, the present invention is not limited to the above embodiments, and various modifications and combinations of the above embodiments are possible based on the gist of the present invention, and they are not excluded from the scope of the present invention. The present invention includes the following combinations.

[0091] (Configuration 1) A liquid discharge device, comprising: a storage unit for storing a discharge liquid; a discharge unit having a plurality of nozzles for discharging the discharge liquid; a circulation unit for circulating the discharge liquid in individual flow paths inside the nozzles; and a control unit that applies a foreign matter attracting waveform to a piezoelectric element provided in the nozzle to attract and remove foreign matter clogged inside the discharge port of the nozzle, and then circulates the discharge liquid in the individual flow paths inside the nozzle by the circulation unit to discharge the foreign matter from the individual flow paths.

[0092] (Configuration 2) The liquid discharge device according to Configuration 1, further comprising nozzle clogging detection means for detecting that a foreign object has clogged in the nozzle, wherein the control unit applies the foreign object attracting waveform to the nozzle in which it is detected by the nozzle clogging detection means that a foreign object has clogged.

[0093] Configuration 3: The nozzle clogging detection means measures the remaining vibration in the individual flow path by the back electromotive force of the piezoelectric element, and detects that a foreign object has clogged the nozzle. The liquid ejection device according to Configuration 2, wherein the liquid ejection device is characterized in that.

[0094] Configuration 4: The foreign object attracting waveform includes a maximum attracting waveform and a first pushing waveform before the maximum attracting waveform, and a voltage change amount of the first pushing waveform is equal to or less than a voltage change amount of the maximum attracting waveform. The liquid ejection device according to any one of Configurations 1 to 3, wherein the liquid ejection device is characterized in that.

[0095] Configuration 5: The maximum attracting waveform and the first pushing waveform have a first waiting waveform therebetween. When a resonance period of the individual flow path is T, a waiting time of the first waiting waveform is T / 6 or more and T / 3 or less. The liquid ejection device according to Configuration 4, wherein the liquid ejection device is characterized in that.

[0096] Configuration 6: The foreign object attracting waveform has a maximum attracting waveform and a second pushing waveform after the maximum attracting waveform, and a voltage change amount of the maximum attracting waveform is larger than a voltage change amount of the second pushing waveform. The liquid ejection device according to any one of Configurations 1 to 5, wherein the liquid ejection device is characterized in that.

[0097] Configuration 7: The maximum attracting waveform and the second pushing waveform have a second waiting waveform therebetween. When a resonance period of the individual flow path is T, a waiting time of the second waiting waveform is T / 40 or more and T / 10 or less. The liquid ejection device according to Configuration 6, wherein the liquid ejection device is characterized in that.

[0098] Configuration 8: After removing the foreign object in the nozzle, bubbles inside the housing are removed. The liquid ejection device according to any one of Configurations 1 to 7, wherein the liquid ejection device is characterized in that.

[0099] Configuration 9: The bubbles inside the housing are removed through a separation membrane in contact with the ejection liquid. The liquid ejection device according to any one of Configurations 1 to 8, wherein the liquid ejection device is characterized in that.

[0100] (Configuration 10) The liquid discharge device according to any one of Configurations 1 to 9, wherein the housing portion has a vent valve for removing bubbles inside the housing portion.

[0101] (Configuration 11) The liquid discharge device according to any one of Configurations 1 to 10, wherein the control unit discriminates whether the clogging of the nozzle is resolved after drawing in and removing the foreign matter clogged inside the discharge port of the nozzle.

[0102] (Configuration 12) A molding device having a molding control unit that performs a process for molding the discharged liquid by bringing a mold into contact with the discharged liquid on the substrate after discharging the discharged liquid onto the substrate by the liquid discharge device according to any one of Configurations 1 to 11.

[0103] (Configuration 13) The molding device according to Configuration 12, wherein when it is determined that the clogging of the nozzle has been resolved after drawing in and removing the foreign matter clogged inside the discharge port of the nozzle, the molding control unit replaces the substrate with a new substrate and then resumes the molding.

[0104] (Method 1) A control method for controlling a liquid discharge device having a housing portion for storing a discharged liquid, a discharge portion having a plurality of nozzles for discharging the discharged liquid, and a circulation portion for circulating the discharged liquid in individual flow paths inside the nozzles, the method including: applying a foreign matter drawing waveform to a piezoelectric element provided in the nozzle to draw in and remove the foreign matter clogged inside the discharge port of the nozzle; and then circulating the discharged liquid in the individual flow paths inside the nozzle by the circulation portion to discharge the foreign matter from the individual flow paths.

[0105] (Method 2) A method for manufacturing an article, comprising: an application step of applying the discharged liquid onto a substrate using the liquid discharge device according to any one of Configurations 1 to 11; a molding step of molding the discharged liquid by bringing a mold into contact with the substrate on which the discharged liquid has been applied and curing the discharged liquid; and a manufacturing step of manufacturing an article from the substrate on which the discharged liquid has been molded by the molding step.

[0106] Furthermore, in order to implement part or all of the control in the above-described embodiment, a computer program for implementing the functions of the above-described embodiment may be supplied to a liquid discharge device or the like via a network or various storage media.

[0107] Then, a computer (or CPU, MPU, etc.) in the liquid discharge device or the like may read and execute the program. In that case, the program and the storage medium storing the program will constitute the present invention.

Explanation of Reference Numerals

[0108] 8: Discharged liquid 9: Nozzle 10: Liquid discharge device 11: Discharge part 12: Storage part 13: Pressure control part 14: Separation membrane 16: Filling liquid storage part 17: Pipe 18: Piezoelectric element 19: Discharge port 20: Supply port 21: Drain port 23: Individual flow path 24: Individual flow path supply port 25: Individual flow path outlet 26: Foreign matter 31: Driver board 32: Control part 40: Circulation part 41: Filter 44: Pump 45: Passage 46: Bypass passage 47: Three-way valve 50: Degassing valve 60: Foreign matter attracting waveform 126: Supply tank 127: Meniscus control part 128: Vacuum pump A1: Pushing waveform A2: Pushing waveform B1: Waiting waveform B2: Waiting waveform C1: Pull waveform

Claims

1. A housing part for housing the discharged liquid, A discharge part having a plurality of nozzles for discharging the discharged liquid, A circulation part for circulating the discharged liquid in the individual flow paths inside the nozzles, After drawing in and removing foreign matter clogged inside the discharge port of the nozzle by applying a foreign matter drawing-in waveform to the piezoelectric element provided in the nozzle, the circulation part circulates the discharged liquid in the individual flow paths inside the nozzle to discharge the foreign matter from the individual flow paths, a control part; A liquid discharge device, characterized by comprising the above.

2. Provided with nozzle clogging detection means for detecting that a foreign matter has clogged the nozzle, The control part applies the foreign matter drawing-in waveform to the nozzle in which it is detected by the nozzle clogging detection means that a foreign matter has clogged, The liquid discharge device according to claim 1.

3. The nozzle clogging detection means measures the residual vibration in the individual flow path by the back electromotive force of the piezoelectric element, and detects that a foreign matter has clogged the nozzle, The liquid discharge device according to claim 2.

4. The foreign matter drawing-in waveform includes a maximum drawing waveform and a first pushing waveform before the maximum drawing waveform, and a voltage change amount of the first pushing waveform is less than or equal to a voltage change amount of the maximum drawing waveform, The liquid discharge device according to claim 1.

5. Having a first waiting waveform between the maximum drawing waveform and the first pushing waveform, when the resonance period of the individual flow path is T, a waiting time of the first waiting waveform is T / 6 or more and T / 3 or less, The liquid discharge device according to claim 4.

6. The foreign matter drawing-in waveform has a maximum drawing waveform and a second pushing waveform after the maximum drawing waveform, and a voltage change amount of the maximum drawing waveform is larger than a voltage change amount of the second pushing waveform, The liquid discharge device according to claim 1.

7. Having a second waiting waveform between the maximum drawing waveform and the second pushing waveform, when the resonance period of the individual flow path is T, a waiting time of the second waiting waveform is T / 40 or more and T / 10 or less, The liquid discharge device according to claim 6.

8. After removing the foreign matter in the nozzle, removing the bubbles inside the housing part, The liquid discharge device according to claim 1.

9. The liquid ejection device according to claim 1, wherein the bubbles inside the housing portion are removed through a separation membrane that contacts the ejection liquid.

10. The liquid ejection device according to claim 1, wherein the housing portion has a vent valve for removing bubbles inside the housing portion.

11. The liquid ejection device according to claim 1, wherein the control unit discriminates whether the clogging of the nozzle is resolved after sucking and removing the foreign matter clogged inside the discharge port of the nozzle.

12. A molding device having a molding control unit that performs a process for molding the ejection liquid by bringing a mold into contact with the ejection liquid on the substrate after ejecting the ejection liquid onto the substrate by the liquid ejection device according to any one of claims 1 to 11.

13. The molding device according to claim 12, wherein when it is determined that the clogging of the nozzle has been resolved after sucking and removing the foreign matter clogged inside the discharge port of the nozzle, the molding control unit replaces the substrate with a new substrate and then resumes the molding.

14. A control method for controlling a liquid ejection device having a housing portion for housing an ejection liquid, an ejection portion having a plurality of nozzles for ejecting the ejection liquid, and a circulation portion for circulating the ejection liquid in individual channels inside the nozzles, the method comprising a control step of applying a foreign matter suction waveform to a piezoelectric element provided in the nozzle to suck and remove the foreign matter clogged inside the discharge port of the nozzle, and then circulating the ejection liquid in the individual channels inside the nozzle by the circulation portion to discharge the foreign matter from the individual channels.

15. An application step of applying the ejection liquid to a substrate using the liquid ejection device according to any one of claims 1 to 11, a molding step of molding the ejection liquid by bringing a mold into contact with the substrate coated with the ejection liquid and curing it, and a manufacturing step of manufacturing an article from the substrate on which the ejection liquid has been molded by the molding step. characterized by the above.

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