Component mounting device, component mounting system, and manufacturing method of mounting board

Abstract

To provide a component mounting device capable of quickly and accurately attaching a cover member to a board for preventing lead components attached to the board from falling off the board, a component mounting system, and a manufacturing method of a mounting board.SOLUTION: The component mounting device includes: lead component mounting means that picks up a main body HT and a lead component LB with leads LD extending from the main body HT, and mounts a lead component LB onto a substrate KB by inserting the leads LD into insertion holes SA formed in the substrate KB; cover member mounting means that mounts a cover member CB for covering the main body HT of the lead component LB onto the substrate KB with the lead component LB mounted thereon. The mounting head 33 as the lead component mounting means serves also as the cover member mounting means.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a component mounting apparatus, a component mounting system, and a method for manufacturing a mounting substrate, for mounting a lead component having leads extending from a main body portion as connection terminals on a substrate.

Background Art

[0002] Conventionally, as a type of component mounted on a substrate, a lead component having leads extending from a main body portion as connection terminals is known. After the lead component is mounted on the substrate such that the leads are inserted into insertion holes provided in the substrate, a flow soldering process is performed on the leads extending from the surface of the substrate opposite to the main body portion. Thereby, the leads of the lead component are fixed to the substrate and electrically connected to the conductor pattern of the substrate (see, for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, a lead component with leads inserted into the insertion holes of the substrate may fall off the substrate before the flow soldering process is performed. As a countermeasure against such dropping of the lead component, it is conceivable to attach a cover member to the substrate so as to cover the main body portion of the lead component mounted on the substrate. However, in that case, the substrate with the lead component mounted thereon needs to be temporarily taken out from the mounting line, and an operator needs to manually attach the cover member to the taken-out substrate and then return it to the line. There are problems in that productivity is poor due to the involvement of human hands, and there is a risk that the attachment of the cover member will be inaccurate.

[0005] Therefore, an object of the present invention is to provide a component mounting apparatus, a component mounting system, and a method for manufacturing a mounted substrate that can quickly and accurately perform the operation of mounting a cover member that prevents a lead component mounted on a substrate from falling off the substrate.

Means for Solving the Problems

[0006] The component mounting apparatus of the present invention includes a lead component mounting means for picking up a lead component having a body portion and leads extending from the body portion and mounting the lead component on the substrate by inserting the leads into insertion holes provided in the substrate, and a cover member mounting means for mounting a cover member that covers the body portion of the lead component on the substrate on which the lead component is mounted.

[0007] The component mounting system of the present invention includes the component mounting apparatus of the present invention and a flow soldering apparatus for performing a flow soldering process on the leads extending from the substrate on which the cover member is mounted by the component mounting apparatus.

[0008] Another component mounting system of the present invention includes a component mounting apparatus provided with lead component mounting means for picking up a lead component having a body portion and leads extending from the body portion and mounting the lead component on the substrate by inserting the leads into insertion holes provided in the substrate, a cover member mounting apparatus provided with cover member mounting means for mounting a cover member that covers the body portion of the lead component on the substrate on which the lead component is mounted by the component mounting apparatus, and a flow soldering apparatus for performing a flow soldering process on the leads extending from the substrate on which the cover member is mounted by the cover member mounting apparatus.

[0009] The method for manufacturing a mounting substrate according to the present invention includes a lead component mounting step of picking up a lead component having a main body portion and leads extending from the main body portion and inserting the leads into insertion holes of the substrate to mount the lead component on the substrate, a cover member mounting step of mounting a cover member that covers the main body portion of the lead component on the substrate on which the lead component is mounted in the lead component mounting step, and a flow soldering step of performing a flow soldering process on the leads extending from the substrate on which the cover member is mounted in the cover member mounting step.

Advantages of the Invention

[0010] According to the present invention, it is possible to quickly and accurately perform the operation of mounting a cover member on a substrate to prevent the lead component mounted on the substrate from falling off the substrate.

Brief Description of the Drawings

[0011]

Figure 1

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Figure 5

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Figure 11

Embodiments for Carrying out the Invention

[0012] (Embodiment 1) First, Embodiment 1 of the present invention will be described. FIG. 1 shows a schematic configuration diagram of a component mounting system 1 according to Embodiment 1. The component mounting system 1 is a system for manufacturing a mounting substrate, and a solder printing device 11, a first component mounting device 12, a solder reflow device 13, a second component mounting device 14, a flow soldering device 15, and a cover member removal device 16 are arranged in series in this order from the upstream side (the left side of the paper surface in FIG. 1).

[0013] The solder printing device 11 carries in a substrate KB supplied from the outside and applies solder SD to electrodes DK that form part of the conductor pattern formed on the surface of the substrate KB (FIG. 2(a)). After applying the solder SD to the substrate KB, the solder printing device 11 carries out the substrate KB to the first component mounting device 12 on the downstream side.

[0014] In FIGS. 1 and 3, the first component mounting device 12 includes a component supply unit (surface mount component supply unit 21) and a mounting head (surface mount component mounting head 22). The surface mount component supply unit 21 supplies surface mount components HB. As shown in FIGS. 3 and 4(a), the surface mount component HB has two terminals BT at both ends. The surface mount component mounting head 22 is provided with a nozzle (surface mount component suction nozzle 23) extending downward, and a vacuum suction force can be generated at the lower end of the surface mount component suction nozzle 23.

[0015] The first component mounting device 12 receives the substrate KB carried out from the solder printing device 11 and positions the substrate KB. Then, the surface mount component mounting head 22 is moved above the surface mount component supply unit 21, and the surface mount component HB supplied by the surface mount component supply unit 21 is adsorbed by the surface mount component suction nozzle 23. When the surface mount component suction nozzle 23 adsorbs the surface mount component HB, the surface mount component mounting head 22 is moved above the substrate KB, and after positioning the two terminals BT provided in the surface mount component HB above two electrodes DK (solder SD is applied to the electrodes DK by the solder printing device 11) on the substrate KB (FIG. 4(a)), the surface mount component suction nozzle 23 is lowered (FIG. 4(b)). As a result, the two terminals BT come into contact with the two electrodes DK, and the surface mount component HB is in a state of being mounted on the substrate KB (FIG. 2(b)).

[0016] After mounting the surface mount component HB on the substrate KB as described above, the first component mounting device 12 releases the adsorption of the surface mount component HB by the surface mount component suction nozzle 23 and then raises the surface mount component suction nozzle 23 (FIG. 4(c)). By repeating the above operations, when all the surface mount components HB to be mounted on the substrate KB are mounted, the first component mounting device 12 carries out the substrate KB to the downstream solder reflow device 13.

[0017] The solder reflow device 13 receives the substrate KB unloaded from the first component mounting device 12, conveys it while transporting it downstream in a reflow furnace (not shown), and performs a solder reflow process on the substrate KB. As a result, the solder SD applied by the solder printing device 11 is melted and solidified, and the terminals BT of the surface-mounted components HB mounted on the substrate KB by the first component mounting device 12 are fixed to the substrate KB and electrically connected to the conductor patterns of the substrate KB. The solder reflow device 13 unloads the substrate KB that has passed through the reflow furnace to the second component mounting device 14 on the downstream side.

[0018] In FIGS. 1 and 5, the second component mounting device 14 includes a lead component supply unit 31, a cover member supply unit 32, and a mounting head 33. The lead component supply unit 31 supplies lead components LB, and the cover member supply unit 32 supplies cover members CB. As shown in FIGS. 5 and 6(a), the lead component LB includes a main body portion HT and leads LD as two connection terminals extending downward from the main body portion HT. The cover member CB is made of, for example, a resin material and has a shape that is open downward. The mounting head 33 includes a nozzle (mounting nozzle 34) extending downward, and a vacuum adsorption force can be generated at the lower end of the mounting nozzle 34.

[0019] The second component mounting device 14 receives the substrate KB unloaded from the solder reflow device 13 and positions the substrate KB. Then, the mounting head 33 is moved above the lead component supply unit 31, and the upper surface of the main body portion HT of the lead component LB supplied by the lead component supply unit 31 is adsorbed by the mounting nozzle 34. When the mounting nozzle 34 adsorbs the upper surface of the main body portion HT of the lead component LB, the mounting head 33 is moved above the substrate KB, and after positioning the two leads LD above the two insertion holes SA (FIG. 5) that form part of the conductor pattern of the substrate KB (FIG. 6(a)), the mounting nozzle 34 is lowered (FIG. 6(b)). As a result, the two leads LD are inserted into the two insertion holes SA, and the lead component LB is mounted on the substrate KB (FIG. 2(c)).

[0020] As shown in Fig. 2(c), when the lead component LB is mounted on the substrate KB, the main body HT of the lead component LB is located on the upper surface side of the substrate KB, and the two leads LD are respectively inserted downward through the insertion holes SA and extend downward on the lower surface side of the substrate KB. After mounting the lead component LB on the substrate KB as described above, the second component mounting device 14 releases the suction of the main body HT by the mounting nozzle 34 and then raises the mounting nozzle 34 (Fig. 6(c)).

[0021] By repeating the above operations, when the second component mounting device 14 has mounted all the lead components LB to be mounted on the substrate KB, it moves the mounting head 33 above the cover member supply unit 32 and causes the mounting nozzle 34 to suck the cover member CB supplied by the cover member supply unit 32. When the mounting nozzle 34 sucks the cover member CB, it moves the mounting head 33 above the substrate KB, positions the plurality of engaging protrusions TK protruding downward from the lower edge of the cover member CB above the plurality of protrusion engaging holes KA provided in the substrate KB (Fig. 7(a)), and then lowers the mounting nozzle 34 (Fig. 7(b)). As a result, the plurality of engaging protrusions TK of the cover member CB are respectively inserted and engaged with the corresponding protrusion engaging holes KA of the substrate KB from above, so that the cover member CB is in a state of being mounted on the substrate KB.

[0022] When the cover member CB is mounted on the substrate KB, the main body HT of the lead component LB is covered by the cover member CB, and the lead component LB is in a state where it is prevented from falling off the substrate KB (Fig. 2(d)). After mounting the cover member CB on the substrate KB in this way, the second component mounting device 14 releases the suction of the cover member CB by the mounting nozzle 34 and then raises the mounting nozzle 34 (Fig. 7(c)).

[0023] Here, the cover member CB is in a state of being attached to the substrate KB, and its inner ceiling surface TJ is lightly in contact with or slightly spaced from the upper surface of the main body HT of the lead component LB (Fig. 2(d)). As a result, the main body HT of the lead component LB is pressed against the substrate KB side by the cover member CB and is firmly held with respect to the substrate KB. Thus, beyond the degree of preventing detachment from the substrate KB, the lead component LB can be fixed (temporarily fixed) to the substrate KB. After all the cover members CB to be mounted have been mounted, the second component mounting device 14 carries out the substrate KB to the downstream flow soldering device 15.

[0024] The flow soldering device 15 carries in the substrate KB carried out from the second component mounting device 14 and conveys it above a flow solder bath (not shown) downstream while performing a flow soldering process on the substrate KB. Specifically, the solder SD heated and blown upward hits the lower surface of the substrate KB where the leads LD protrude. As a result, the leads LD of the lead component LB mounted on the substrate KB by the second component mounting device 14 are fixed to the substrate KB and are electrically connected to the conductor pattern of the substrate KB (Fig. 2(e)). The flow soldering device 15 carries out the substrate KB that has passed above the flow solder bath to the downstream cover member removing device 16.

[0025] In the first embodiment, the lead component LB mounted on the substrate KB in the second component mounting device 14 is covered by the cover member CB immediately thereafter and is maintained in a state of being mounted on the substrate KB until it is carried out from the flow soldering device 15. Therefore, the lead component LB mounted on the substrate KB by the second component mounting device 14 will not fall off the substrate KB even when the substrate KB is vibrated, not only while it is carried out from the second component mounting device 14 and carried into the flow soldering device 15, but also until the flow soldering process on the substrate KB in the flow soldering device 15 is completed (i.e., until the leads LD are completely fixed to the substrate KB).

[0026] In FIGS. 1 and 8, the cover member removing device 16 includes a cover member removing head 41 and a cover member collecting section 42. The cover member removing head 41 can sandwich (chuck) the cover member CB by bringing a pair of finger portions 41F extending downward closer to each other, and can release the sandwiched cover member CB by separating the pair of finger portions 41F from each other. The cover member collecting section 42 is a tray-shaped member that can be arranged side by side without contacting other cover members CB so that the collected cover member CB can be reused here.

[0027] The cover member removing device 16 receives and positions the substrate KB carried out from the flow soldering device 15. Then, the cover member CB attached to the substrate KB is removed by the cover member removing head 41. Specifically, first, the cover member removing device 16 moves the cover member removing head 41 above the substrate KB and positions the pair of finger portions 41F above the cover member CB attached to the substrate KB (FIG. 9(a)). Then, after separating the pair of finger portions 41F from each other to an open state, the pair of finger portions 41F are lowered (FIG. 9(b)). At this time, the cover member CB is positioned between the pair of finger portions 41F.

[0028] After the cover member removing device 16 lowers the pair of finger portions 41F so that the cover member CB is positioned therebetween, the pair of finger portions 41F are brought closer to each other and closed, and the cover member CB is sandwiched (chucked) by the pair of finger portions 41F. Then, in that state, the pair of finger portions 41F are raised so that the engagement protrusion TK of the cover member CB comes out of the protrusion engagement hole KA of the substrate KB (comes out upward), thereby removing the cover member CB from the substrate KB (FIGS. 9(c) and 2(f)).

[0029] After removing the cover member CB as described above, the cover member removal device 16 moves the cover member removal head 41 above the cover member recovery unit 42 and lowers the finger unit 41F. Then, the finger unit 41F is opened, and the cover member CB is placed on the cover member recovery unit 42. As a result, the cover member CB is removed from the substrate KB and recovered.

[0030] The cover member removal device 16 repeatedly executes such an operation of removing the cover member CB. Then, after removing all the cover members CB mounted on the substrate KB, the substrate KB is carried out to the downstream side. As a result, the manufacturing of the mounting substrate on which components (here, the surface mount components HB and the lead components LB) are mounted on the substrate KB is completed.

[0031] Thus, in the manufacturing procedure (mounting substrate manufacturing method) of the mounting substrate by the component mounting system 1 in the first embodiment, first, solder SD is printed on the substrate KB by the solder printing device 11 (solder printing step in step ST1 in FIG. 10), and then the surface mount component HB is mounted on the substrate KB by the first component mounting device 12 (surface mount component mounting step in step ST2). Then, by performing a solder reflow process on the substrate KB (solder reflow step in step ST3), the electrodes DK of the surface mount component HB are fixed to the substrate KB and electrically connected to the conductor pattern of the substrate KB.

[0032] After the solder reflow process is completed, the lead component LB is mounted on the substrate KB (lead component mounting step in step ST4), and then the cover member CB is mounted on the substrate KB, so that the main body HT of the lead component LB mounted on the substrate KB is covered by the cover member CB (cover member mounting step in step ST5). Then, by performing a flow soldering process on the substrate KB, the leads LD of the lead component LB are fixed to the substrate KB and electrically connected to the conductor pattern of the substrate KB, and then (flow soldering step in step ST6), the cover member CB is removed from the substrate KB (cover member removal step in step ST7).

[0033] As described above, the second component mounting device 14, which is a component mounting device according to the first embodiment, picks up a lead component LB having a main body HT and leads LD extending from the main body HT, and inserts the leads LD into insertion holes SA provided in a substrate KB to mount the lead component LB on the substrate KB. The lead component mounting means (mounting head 33) and the cover member mounting means (mounting head 33) for mounting a cover member CB that covers the main body HT of the lead component LB on the substrate KB on which the lead component LB is mounted are provided, and the lead component LB can be mounted on the substrate KB and then the cover member CB can be immediately mounted.

[0034] By mounting the cover member CB on the substrate KB, it is possible to prevent a situation where the lead component LB mounted on the substrate KB falls off the substrate KB before the completion of the flow soldering process. However, in the first embodiment, since the mounting operation of the cover member CB on the substrate KB is automatically performed without human intervention, the mounting operation of the cover member CB can be performed quickly and accurately.

[0035] The above effect can be obtained even when the lead component mounting means and the cover member mounting means are separate configurations in the component mounting device. However, in the first embodiment, since the mounting head 33, which is the lead component mounting means, also serves as the cover member mounting means, the configuration of the second component mounting device 14, which is the component mounting device, can be simplified. As a result, the size of the component mounting device (the second component mounting device 14) can be reduced, and thus the entire component mounting system 1 can be made more compact.

[0036] (Second Embodiment) Next, Embodiment 2 of the present invention will be described. FIG. 11 shows a schematic configuration diagram of the component mounting system 1A in Embodiment 2. The component mounting system 1A in Embodiment 2 differs from the component mounting system 1 in Embodiment 1 in that two second component mounting devices 14 in Embodiment 1 are arranged side by side to form a component mounting device 14A and a cover member mounting device 14B, and the function of the second component mounting device 14 in Embodiment 1 is divided into a component mounting device 14A having a mounting head 33 as lead component mounting means for mounting a lead component LB on a substrate KB, and a cover member mounting device 14B having a mounting head 33 as cover member mounting means for mounting a cover member CB. In Embodiment 2, the mounting head 33 of the component mounting device 14A is exclusively used for mounting the lead component LB on the substrate KB (therefore, it is not necessary to provide a cover member supply unit 32), and the mounting head 33 of the cover member mounting device 14B is exclusively used for mounting the cover member CB on the substrate KB (therefore, it is not necessary to provide a lead component supply unit 31).

[0037] Thus, the component mounting system 1A in Embodiment 2 includes a component mounting device 14A having a mounting head 33 as a component mounting head for picking up a lead component LB and inserting a lead LD into an insertion hole SA provided in a substrate KB to mount the lead component LB on the substrate KB, a cover member mounting device 14B having a mounting head 33 as a cover member mounting head for mounting a cover member CB that covers the main body portion HT of the lead component LB on the substrate KB on which the lead component LB has been mounted by the component mounting device 14A, a flow soldering device 15 that performs a flow soldering process on the lead LD extending from the substrate KB on which the cover member CB has been mounted by the cover member mounting device 14B, and a cover member removing device 16 that removes the cover member CB from the substrate KB on which the flow soldering process has been performed by the flow soldering device 15. The manufacturing procedure (mounted substrate manufacturing method) of the mounted substrate by the component mounting system 1A in Embodiment 2 is exactly the same as the manufacturing procedure (mounted substrate manufacturing method) of the mounted substrate in Embodiment 1.

[0038] Even in the component mounting system 1A with such a configuration, similar to the component mounting system 1 in the first embodiment, by mounting the cover member CB on the substrate KB, it is possible to prevent the lead component LB mounted on the substrate KB from falling off the substrate KB before the completion of the flow soldering process. Since the mounting operation of the cover member CB on the substrate KB is automatically performed without human intervention, the mounting operation of the cover member CB can be performed quickly and accurately.

[0039] As described above, the component mounting apparatus (second component mounting apparatus 14) in the first embodiment, the component mounting system 1 in the first embodiment provided with this component mounting apparatus, and the component mounting system 1A in the second embodiment include a lead component mounting means for mounting the lead component LB on the substrate KB, and a cover member mounting means for mounting a cover member CB that covers the main body portion HT of the lead component LB on the substrate KB on which the lead component LB is mounted. After the lead component LB is mounted on the substrate KB by the lead component mounting means, the cover member CB is mounted on the substrate KB by the cover member mounting means (that is, automatically without human intervention). Therefore, according to the first and second embodiments, the mounting of the cover member CB on the substrate KB, which prevents the lead component LB mounted on the substrate KB from falling off the substrate KB, can be performed quickly and accurately.

[0040] Furthermore, in the component mounting apparatus (second component mounting apparatus 14) in the first embodiment and the component mounting system 1 including the same, since the mounting head 33, which is the lead component mounting means, also serves as the cover member mounting means, the configuration of the component mounting apparatus (second component mounting apparatus 14) can be simplified. Thereby, the size of the component mounting apparatus can be reduced, and ultimately, the entire component mounting system 1 can be made more compact.

[0041] In addition, in the method for manufacturing a mounting substrate according to Embodiments 1 and 2, there are a step of mounting a lead component LB on a substrate KB (lead component mounting step), a step of mounting a cover member CB that covers the main body HT of the lead component LB on the substrate KB on which the lead component LB has been mounted in the lead component mounting step (cover member mounting step), and a step of performing a flow soldering process on the lead LD extending from the substrate KB on which the cover member CB has been mounted in the cover member mounting step (flow soldering step). After mounting the lead component LB on the substrate KB, the cover member CB is automatically mounted on the substrate KB without manual intervention. Therefore, according to the method for manufacturing a mounting substrate in Embodiments 1 and 2 of the present invention, the operation of mounting the cover member CB on the substrate KB can be performed quickly and accurately.

[0042] Although the embodiments of the present invention have been described so far, the present invention is not limited to those described above, and various modifications and the like are possible. For example, in the above-described Embodiments 1 and 2, the lead component LB and the cover member CB are respectively adsorbed and picked up by a nozzle (mounting nozzle 34), but it is not necessarily required to be picked up by a nozzle. For example, the lead component LB and the cover member CB may be respectively chucked and picked up by a chuck mechanism such as the finger portion 41F provided in the cover member removing device 16 and mounted on the substrate KB.

[0043] In addition, in the above-described Embodiments 1 and 2, the cover member recovery unit 42 is a tray-shaped member that can arrange the recovered cover members CB so as not to contact other recovered cover members CB in order to reuse the recovered cover members CB. However, if the recovered cover members CB are not reused, there is no problem even if the recovered cover members CB come into contact with each other, so it may be a box-shaped member suitable for disposal.

[0044] In the above-described embodiment, the cover member CB was fixed to the substrate KB by engaging the engaging protrusion TK protruding downward from the lower edge of the cover member CB with the protrusion engaging hole KA provided in the substrate KB. However, this is just an example, and the cover member CB may be fixed to the substrate KB by other methods.

[0045] Also, in the component mounting system 1 of the above-described Embodiment 1 and the component mounting system 1A of Embodiment 2, each had a configuration including a cover member removing device 16 for removing the cover member CB. However, the cover member removing device 16 does not necessarily have to be provided, and an operator may manually perform the operation of removing the cover member CB from the substrate KB.

Industrial Applicability

[0046] Provided are a component mounting device, a component mounting system, and a mounting substrate manufacturing method capable of quickly and accurately mounting a cover member for preventing a lead component mounted on a substrate from falling off the substrate.

Explanation of Reference Numerals

[0047] 1, 1A Component mounting system 11 Solder printing device 12 First component mounting device 13 Solder reflow device 14 Second component mounting device (component mounting device) 14A Component mounting device 14B Cover member mounting device 15 Flow soldering device 16 Cover member removing device 21 Surface mount component supply unit 22 Surface mount component mounting head 23 Surface mount component suction nozzle 31 Lead component supply unit 32 Cover member supply unit 33 Mounting head (lead component mounting means) (cover member mounting means) 34 Mounting nozzle 41 Cover member removal head 42 Cover member recovery section DK Electrode SD Solder HB Surface mount component BT Terminal SA Insertion hole LB Lead component HT Main body section LD Lead CB Cover member KB Substrate

Claims

1. A lead component mounting means for picking up a lead component having a main body portion and a lead extending from the main body portion and mounting the lead component on a substrate by inserting the lead into an insertion hole provided in the substrate; A cover member mounting means for mounting a cover member that covers the main body portion of the lead component on the substrate on which the lead component is mounted; A component mounting apparatus comprising the above.

2. The component mounting apparatus according to claim 1, wherein the mounting head, which is the lead component mounting means, also serves as the cover member mounting means.

3. A component mounting system comprising the component mounting apparatus according to claim 1 or 2, and a flow soldering apparatus for performing a flow soldering process on the leads extending from the substrate on which the cover member is mounted by the component mounting apparatus.

4. A component mounting apparatus comprising a lead component mounting means for picking up a lead component having a main body portion and a lead extending from the main body portion and mounting the lead component on a substrate by inserting the lead into an insertion hole provided in the substrate; A cover member mounting apparatus comprising a cover member mounting means for mounting a cover member that covers the main body portion of the lead component on the substrate on which the lead component is mounted by the component mounting apparatus; A flow soldering apparatus for performing a flow soldering process on the leads extending from the substrate on which the cover member is mounted by the cover member mounting apparatus; A component mounting system comprising the above.

5. The component mounting system according to claim 3 or 4, comprising a cover member removing apparatus for removing the cover member from the substrate on which the flow soldering process has been performed by the flow soldering apparatus.

6. A lead component mounting step of picking up a lead component having a main body portion and a lead extending from the main body portion and mounting the lead component on a substrate by inserting the lead into an insertion hole of the substrate; A cover member mounting step of mounting a cover member that covers the main body portion of the lead component on the substrate on which the lead component has been mounted in the lead component mounting step; A flow soldering step of performing a flow soldering process on the leads extending from the substrate on which the cover member has been mounted in the cover member mounting step; A method for manufacturing a mounted substrate comprising the above.

7. The method for manufacturing a mounted substrate according to claim 6, comprising a cover member removing step of removing the cover member from the substrate on which the flow soldering process has been performed in the flow soldering step.

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