Display device

Abstract

To provide a foldable novel display device or an electronic apparatus that uses the same: for example, a portable information processing device and a communication information apparatus.SOLUTION: A foldable display device is achieved by alternately folding a display surface of one display panel inside and outside at a curvature radius of 1 mm or longer and 100 mm or shorter for n times (n≥1, n is a natural number). Size of a display device can be reduced by making the display device foldable. In addition, in a state where a flexible display panel is expanded, a seamless continuous display over a plurality of housings is possible. The plurality of housings can accommodate a circuit, an electronic component, a battery, and so on as required and thickness of each of the housings can be reduced.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an article, a method, or a manufacturing method. Alternatively, the present invention relates to a process, a machine , a manufacture, or a composition of matter. In particular , one aspect of the present invention relates to a semiconductor device, a display device, a light-emitting device, a lighting device, a driving method thereof, or a manufacturing method thereof. In particular, one aspect of the present invention relates to an electronic device having a display device , an information processing device, a communication information device, or a manufacturing method thereof.

Background Art

[0002] The social infrastructure related to information transmission means has been enriched. As a result, diverse and abundant information can be acquired, processed, or transmitted using an information processing device not only at the workplace or at home but also outside. has become possible.

[0003] Under such a background, portable information processing devices such as smartphones, tablets, and phablets are actively being developed. For example, electronic devices using a flexible display panel are known. (Patent Document 1). Also, multi-panel electronic devices are known (Patent Document 2).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] One aspect of the present invention is to provide a novel foldable display device or an electronic device using the same, such as , a portable information processing device, a communication information device, as one of the problems. Or, One aspect of the present invention is to provide a downsized display device, as one of the problems. Or, One aspect of the present invention is to provide a display device that enables seamless continuous display, as one of the problems. Or, one aspect of the present invention is to provide a thin display device, as one of the problems. Or, one aspect of the present invention is to provide a novel display device, as one of the problems.

[0006] Note that the description of these problems does not prevent the existence of other problems. Note that one aspect of the present invention does not need to solve all of these problems. Note that other problems will be naturally revealed from the descriptions in the specification, drawings, claims, etc., and it is possible to extract these other problems from the descriptions in the specification, drawings, claims, etc.

Means for Solving the Problems

[0007] In one form, a display device that can be folded by folding a single display panel n times (n ≥ 1, n is a natural number) with a curvature radius of 1 mm or more and 100 mm or less, with the display surface folded alternately inward and outward, is provided.

[0008] In one form, the flexible display panel includes a first portion supported by a first housing, a second portion supported by a second housing, and a bending portion located between the first portion and the second portion. A first circuit (or electronic component) is provided in the first housing that supports the first portion, and a second circuit (or electronic component) is provided in the second housing that supports the second portion. In the bending portion,​ By folding (or bending) the flexible display panel, the first housing and the second housing are in an overlapping positional relationship with each other. The first circuit (or electronic component) and the second circuit (or electronic component) may have different functions from each other. Also, the first circuit (or electronic component) and the second circuit (or electronic component) may have the same function as each other.

[0009] In one form, the flexible display panel includes first to third portions each supported by the first to third housings, and includes a first folding portion between the first portion and the second portion, and a second folding portion between the second portion and the third portion. In the folded state of the flexible display panel, the first to third portions are in an overlapping positional relationship with each other. In this state, one of the first to third portions appears on the topmost surface, and it is possible to take a driving mode in which at least the portion appearing on the topmost surface is selectively displayed, while the other portions are in a display pause state. Among the first to third housings that support the first to third portions respectively, one housing is provided with a first circuit (or electronic component), and another housing is provided with a second circuit (or electronic component). Further, another housing may be provided with a third circuit (or electronic component), but it is not particularly necessary to provide a circuit (or electronic component). In the folded state of the flexible display panel, not only the topmost first portion but also the folding portion connected to the first portion can be selectively displayed in the folded state. In the above form, the first circuit (or electronic component) and the second circuit (electronic component) described above may be connected by wiring. This wiring may be provided directly on the flexible display panel. Or it may not be provided with a circuit (or electronic component) at all. In the folded state of the flexible display panel, not only the topmost first portion but also the folding portion connected to the first portion can be selectively displayed in the folded state. is also selectively displayable in the folded state.

[0010] In the above form, the first circuit (or electronic component) and the second circuit (electronic component) described above may be connected by wiring. This wiring may be provided directly on the flexible display panel. Or it may be provided directly on the flexible display panel. Or , This wiring may be provided on one flexible substrate or sheet provided so as to overlap the flexible display panel. Or, the above-mentioned first circuit (or electronic component) and the second circuit (electronic component) may transmit and receive signals wirelessly. - The part may be provided on a sheet. Or, the above-mentioned first circuit (or electronic component) and the second circuit (electronic component) may transmit and receive signals wirelessly.

Advantages of the Invention

[0011] By making the display device foldable, the display device can be miniaturized. Also, when the flexible display panel is in an unfolded state, continuous display without breaks can be achieved across a plurality of housings. The plurality of housings can appropriately store circuits, electronic components, batteries, etc. inside, and the thickness of each housing can be reduced. Note that one aspect of the present invention is not limited to these effects. For example, one aspect of the present invention may, in some cases or depending on the situation, have effects other than these. Or, for example, one aspect of the present invention may, in some cases or depending on the situation, not have these effects. When the flexible display panel is unfolded, continuous display without breaks can be achieved across a plurality of housings. The plurality of housings can appropriately store circuits, electronic components, batteries, etc. inside, and the thickness of each housing can be reduced. Note that one aspect of the present invention is not limited to these effects. For example, one aspect of the present invention may, in some cases or depending on the situation, have effects other than these. Or, for example, one aspect of the present invention may, in some cases or depending on the situation, not have these effects. The plurality of housings can appropriately store circuits, electronic components, batteries, etc. inside, and the thickness of each housing can be reduced. Note that one aspect of the present invention is not limited to these effects. For example, one aspect of the present invention may, in some cases or depending on the situation, have effects other than these. Or, for example, one aspect of the present invention may, in some cases or depending on the situation, not have these effects. Note that one aspect of the present invention is not limited to these effects. For example, one aspect of the present invention may, in some cases or depending on the situation, have effects other than these. Or, for example, one aspect of the present invention may, in some cases or depending on the situation, not have these effects. For example, one aspect of the present invention may, in some cases or depending on the situation, have effects other than these. Or, for example, one aspect of the present invention may, in some cases or depending on the situation, not have these effects. Also, for example, one aspect of the present invention may, in some cases or depending on the situation, have effects other than these. Or, for example, one aspect of the present invention may, in some cases or depending on the situation, not have these effects.

Brief Description of the Drawings

[0012]

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Embodiments for Carrying Out the Invention

[0013] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art can easily understand that the form and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having the same function among different drawings, and the repeated description thereof will be omitted. and the repeated description thereof will be omitted. It will be easily understood by those skilled in the art. Therefore, the present invention is not construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having the same function among different drawings, and the repeated description thereof will be omitted. It will be easily understood by those skilled in the art. Therefore, the present invention is not construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having the same function among different drawings, and the repeated description thereof will be omitted. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having the same function among different drawings, and the repeated description thereof will be omitted. and the repeated description thereof will be omitted.

[0014] (Embodiment 1) In the present embodiment, the configuration of a display device according to an aspect of the present invention will be described with reference to FIGS. 1 to 3. In the present embodiment, a three-fold display device, that is, a display device having two folding portions, is shown. Note that one aspect of the present invention does not need to be limited to three folds, and for example, it can be two folds, four folds, five folds, etc. Also, the method of folding the display panel is not limited to the embodiments, and for example, the rightmost part instead of the left part may be on the topmost surface, or the central part may be folded to the topmost surface. In the present embodiment, a three-fold display device, that is, a display device having two folding portions, is shown. Note that one aspect of the present invention does not need to be limited to three folds, and for example, it can be two folds, four folds, five folds, etc. Also, the method of folding the display panel is not limited to the embodiments, and for example, the rightmost part instead of the left part may be on the topmost surface, or the central part may be folded to the topmost surface. In the present embodiment, a three-fold display device, that is, a display device having two folding portions, is shown. Note that one aspect of the present invention does not need to be limited to three folds, and for example, it can be two folds, four folds, five folds, etc. Also, the method of folding the display panel is not limited to the embodiments, and for example, the rightmost part instead of the left part may be on the topmost surface, or the central part may be folded to the topmost surface. In the present embodiment, a three-fold display device, that is, a display device having two folding portions, is shown. Note that one aspect of the present invention does not need to be limited to three folds, and for example, it can be two folds, four folds, five folds, etc. Also, the method of folding the display panel is not limited to the embodiments, and for example, the rightmost part instead of the left part may be on the topmost surface, or the central part may be folded to the topmost surface. In the present embodiment, a three-fold display device, that is, a display device having two folding portions, is shown. Note that one aspect of the present invention does not need to be limited to three folds, and for example, it can be two folds, four folds, five folds, etc. Also, the method of folding the display panel is not limited to the embodiments, and for example, the rightmost part instead of the left part may be on the topmost surface, or the central part may be folded to the topmost surface. In the present embodiment, a three-fold display device, that is, a display device having two folding portions, is shown. Note that one aspect of the present invention does not need to be limited to three folds, and for example, it can be two folds, four folds, five folds, etc. Also, the method of folding the display panel is not limited to the embodiments, and for example, the rightmost part instead of the left part may be on the topmost surface, or the central part may be folded to the topmost surface.

[0015] FIG. 1 shows a conceptual diagram of the display device according to the present embodiment. FIG. 1A shows a state in which the flexible display panel is unfolded. FIG. 1B shows a state in which the display device is changing from one of the unfolded state or the folded state to the other. FIG. 1A shows a state in which the flexible display panel is unfolded. FIG. 1B shows a state in which the display device is changing from one of the unfolded state or the folded state to the other. shows the state. FIG. 1C shows the state where the flexible display panel is folded. The display surface appears on the upper side of the drawing paper of the drawing. FIG. 2 shows the display device in the state where the display panel is unfolded. FIGS. 3A and 3B show the state where the flexible panel is folded (hereinafter also referred to as the closed state), and show the CD cross-section of FIG. 1C.

[0016] Means such as a switch (not shown) for detecting the closed state and the open state of the display panel may be provided in at least one of the housings.

[0017] In FIG. 3A, in the state where the display panel is folded, the uppermost region and the side surface region connected to that region (that is, the side surface region on the right side of the uppermost display region in the drawing) are selectively used as the display region, and the remaining portion is not used as the display region. Driving may be performed so that unnecessary power consumption in the folded state can be avoided.

[0018] On the lower side (back side) of the flexible display panel 101, there are housings (or frames) 111-1, 112-1, 113-1 that support the display panel. These housings can store circuits, electronic components, batteries, etc. inside. In addition, the housing may be made of materials such as metal, resin, rubber, or a combination thereof in order to have a function of protecting the display panel or the circuits and electronic components stored inside from impacts such as strikes and drops.

[0019] On the upper side (display surface side) of the peripheral portion of the flexible display panel 101, frame members 111-2, frame members 112-2, and frame members 113-2 are provided. The flexible display panel ​​​​​​​​​​​, is supported so as to be sandwiched between the lower housing and the corresponding upper frame member. The frame member may be made of the same material as the housing.

[0020] Each frame member and the corresponding housing may be fixed by fixing means such as an adhesive or screws, but these members may be formed of the same material and configured as a single material. In that case, a configuration may be adopted in which a gap for holding the display panel is provided and the display panel is sandwiched therein. In the present embodiment, side frame members 128 and 129 are provided. The side frame members may be made of materials such as metal, resin, and rubber.

[0021] The radius of curvature at the bent portion may be 1 mm or more and 100 mm or less.

[0022] At least one of the housings 111-1, 112-1, and 113-1 houses circuits and electronic components (121, 122) such as a control unit, a power supply unit, a storage battery, or an antenna. The connection between these circuits and electronic components and the display panel may be made using an FPC125 (flexible printed circuit board).

[0023] The housings 111-1, 112-1, and 113-1 may be directly fixed to the display panel with an adhesive or the like, or a flexible substrate that protects the display panel or has a function of routing wiring may be provided therebetween.

[0024] In this embodiment, an example is shown in which a flexible substrate 102-1 is provided between the display panel and the housing. The flexible substrate 102-1 has substantially the same size as the display panel and also serves to connect between the housings. A part of the flexible substrate is cut off to connect the FPC extending from the display panel to the housing. Alternatively, the flexible substrate 102-1 may be made slightly smaller than the display panel. The material may be resin or rubber, etc., which reinforces the mechanical strength of the bent portion. In addition, the circuit and electronic components provided in the housing are mounted inside the flexible substrate 102-1. Wiring is provided to connect the components together.

[0025] A flexible substrate 102-2 may be provided between the display panel and the upper frame member. A general FPC board may be used as the flexible boards 102-1 and 102-2. Either or both of the flexible substrates 102-1 and 102-2 may be omitted.

[0026] The flexible display panel 101 is provided with an FPC 125, and the display panel is provided in the housing. It is not necessary to limit this to this, but the FPC125 is also connected to the housing. The light emitting diode 132 may be connected to a driving circuit provided within the housing through an opening 133 .

[0027] FIG. 3B shows a modification of this embodiment, in which the housing 112-1 is replaced with the housing 111-1 and the housing 113-1. The present embodiment is different from the other embodiments shown in this specification. They can be combined as appropriate.

[0028] (Embodiment 2) In this embodiment, a structure of a display device according to one embodiment of the present invention will be described with reference to FIGS. In addition, the following will be described with respect to elements to which the same display device as that described in the first embodiment can be applied. The explanation in the first embodiment is incorporated herein.

[0029] In this embodiment, as an example, the battery unit 121 is stored in the housing 111-1. 13-1 stores a main board that includes a display panel and a control unit that controls the entire electronic device. The housing 112-1 may be a dummy without storing circuits, electronic components, etc. In the present embodiment, by distributing a plurality of components into a plurality of housings and storing them, the thickness of the housing can be made uniform and thin. In the present embodiment, the thicknesses of all the housings are made equal. This makes it easy to flatten the display surface when the display panel is unfolded.

[0030] Wiring (including power supply wiring in this embodiment) is provided inside the flexible substrate 102-1, and power is supplied from the battery unit 121 of the housing 111-1 to the control unit 122 of the housing 113-1. An example of such a flexible substrate 102-1 with wiring provided inside is shown in FIG. 4. In FIG. 4, 130 is the wiring and 131 is the terminal portion. The wiring 130 is connected to a battery or a control unit stored inside through an opening 132 provided in the housing. Note that FIG. 4 does not show the display panel above the flexible substrate 102-1 and the structure thereon for the purpose of explanation. FIG. 4 shows an example where one opening extends long, but the shape and number of the openings are not limited to this. As shown in FIG. 2, a plurality of openings may be provided.

[0031] FIG. 5 is a modification of FIG. 4, showing an example where the flexible substrate 102-1 is omitted and wiring 134 is directly provided on the flexible display panel 101. For example, using a wiring layer that forms the gate electrode, source-drain electrode of a transistor that constitutes the display panel, and / or some other wiring layers formed on the same substrate as the transistor, the wiring 134 is formed on the same substrate as the display panel and connected to the circuit inside the housing by the FPC135. As another modification, as shown in FIGS. 4 and ​​In the form of 5, it is also possible to store a battery unit in each of the housing 112-1 and the housing 111-1. Thereby, the display device can be used for a longer time without charging the storage battery.

[0032] Note that this embodiment can be appropriately combined with other embodiments shown in this specification.

[0033] (Embodiment 3) In this embodiment, an example of a mobile communication device such as a smartphone (multifunctional mobile phone), a tablet having a telephone function, or a phablet is shown. FIG. 6 shows a general configuration of a smartphone. Generally, a smartphone includes a main board 600, a speaker 601, a camera 60 2, a display panel 603, a battery unit 604, a mobile communication antenna 605, an NFC antenna 60 6, and the like. Various electronic components such as various ICs and passive elements are mounted on the main board 600. For example, a crystal oscillator 611, a DRAM 612, an application processor 61 3, a baseband processor 614, an electronic compass 615, a crystal oscillator 61 6, an RF transceiver IC 617, a touch panel control IC 618, an acceleration sensor 619 , a wireless LAN / Bluetooth (registered trademark) module 620, a power control IC 621 , a W-CDMA power amplifier 622, a flash memory 623, a filter 624, and the like are mounted. Here, for convenience, these are collectively referred to as a control unit. Note that not all of these circuits and electronic components need to be mounted on the main board, and some components and circuits may be appropriately mounted on another board. The display panel is a flexible panel that can be folded.

[0034] ​​​These main boards and various electronic components are appropriately divided and stored in a plurality of housings. As an example, in the display device of Embodiment 2, a battery unit 604 and an NFC antenna 606 are stored in the housing 113-1, and the main board 600 and the mobile communication antenna 605 are stored in the housing 111-1. As a result, since there is a spatial margin in the housing where the battery unit 604 is stored, the capacity of the secondary battery can be increased. Also, although there is no need to limit the usage method of the camera 602, when it is mounted on the housing 113-1, when the display device is in the closed state, the user can view the subject displayed on the upper part of the display panel housing 111-1 and photograph the subject with the camera mounted on the housing 113-1 on the opposite side.

[0035] (Embodiment 4) In this embodiment, a display panel using an active matrix EL display device as an example of a flexible display panel according to an aspect of the present invention will be described with reference to FIGS. 7, 8, 9, 10, 11, and 12. Note that, as the display panel, not only an EL display device but also other types of display devices such as a liquid crystal display device and an electrophoretic display device may be used.

[0036] <Specific Example 1> FIG. 7(A) shows a plan view of the flexible display panel 101, and FIG. 7(B) shows an example of a cross-sectional view between the dashed-dotted lines A1 -A2 in FIG. 7(A).

[0037] The display panel shown in FIG. 7(B) has an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors 1240, a conductive layer 1157, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements, ​​​​​Insulating layer 1211, sealing layer 1213, insulating layer 1261, coloring layer 1259, light-shielding layer 1257, and has an insulating layer 1255.

[0038] The conductive layer 1157 is electrically connected to the FPC 1108 via the connector 1215.

[0039] The light-emitting element 1230 has a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The EL layer is formed of an organic light-emitting material. The lower electrode 1231 is electrically connected to the source electrode or drain electrode of the transistor 1240. The end of the lower electrode 1231 is covered with the insulating layer 1211. The light-emitting element 1230 has a top-emission structure. The upper electrode 1235 has light-transmitting properties and transmits the light emitted by the EL layer 1233.

[0040] A coloring layer 1259 is provided at a position overlapping the light-emitting element 1230, and a light-shielding layer 1257 is provided at a position overlapping the insulating layer 1211. The coloring layer 1259 and the light-shielding layer 1257 are covered with the insulating layer 1261. The space between the light-emitting element 1230 and the insulating layer 1261 is filled with the sealing layer 1213.

[0041]

[0041] The display panel has a plurality of transistors in the light extraction portion 1104 and the drive circuit portion 1106. The transistor 1240 is provided on the insulating layer 1205. The insulating layer 1205 and the substrate 1201 are bonded together by the adhesive layer 1203. Also, the insulating layer 1255 and the substrate 1103 are bonded together by the adhesive layer 1105. Using a film with low water permeability for the insulating layer 1205 and the insulating layer 1255 can suppress the intrusion of impurities such as water into the light-emitting element 1230 and the transistor 1240, and is preferable because the reliability of the display panel is improved. The adhesive layer ​The material 1203 can be the same as that of the adhesive layer 1105 .

[0042] In the first specific example, the insulating layer 1205, the transistor 1240, and the light-emitting element 1204 are formed on a highly heat-resistant substrate. The element 1230 is prepared, the substrate on which the element was prepared is peeled off, and the element is attached to the substrate 1201 using the adhesive layer 1203. It can be fabricated by transposing the insulating layer 1205, the transistor 1240, and the light-emitting element 1230. In the specific example 1, an insulating layer 125 is formed on a substrate having high heat resistance. 5. A colored layer 1259 and a light-shielding layer 1257 are formed, and the formed substrate is peeled off, and an adhesive layer 1105 is formed. The insulating layer 1255, the colored layer 1259, and the light-shielding layer 1257 are transferred onto the substrate 1103 using the method described above. The figure shows a display panel that can be fabricated by

[0043] When using a material with high water permeability and low heat resistance (such as resin) for the substrate, the substrate may be exposed to high temperatures during the manufacturing process. Since it is not possible to apply heat, there are limitations on the conditions for fabricating transistors and insulating films on the substrate. In the manufacturing method of this embodiment, a transistor or the like is manufactured on a manufacturing substrate having high heat resistance. This makes it possible to form highly reliable transistors and insulating films with sufficiently low water permeability. By transferring them to the substrate 1103 or the substrate 1201, a highly reliable As a result, in one embodiment of the present invention, a display panel that is lightweight or thin and This allows the realization of a highly reliable active matrix type light emitting device. The details of the fabrication method will be described later. State.

[0044] It is preferable that the substrate 1103 and the substrate 1201 are made of a material having high toughness. This makes it possible to realize a display device that is highly impact resistant and difficult to break. Use 03 as an organic resin substrate, and use a substrate 1201 made of a thin metal material or alloy material By doing so, compared with the case where a glass substrate is used for the substrate, a display panel that is lightweight and less likely to be damaged can be realized.

[0045] Since the metal material or alloy material has high thermal conductivity and can easily conduct heat throughout the substrate, local temperature rise of the display panel can be suppressed, which is preferable. The thickness of the substrate made of the metal material or alloy material is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less.

[0046] In addition, when a material with a high emissivity is used for the substrate 1201, it is possible to suppress the increase in the surface temperature of the display panel, and to suppress the destruction of the display panel and the decrease in reliability. For example, the substrate 1201 may have a laminated structure of a metal substrate and a layer with a high emissivity (for example, a metal oxide or a ceramic material can be used). In the following specific examples, the description of the same configuration as in Specific Example 1 will be omitted.

[0047] <Specific Example 2> FIG. 8(A) shows another example of the light extraction unit 1104 in the display panel. The display panel shown in FIG. 8(A) is a display panel capable of touch operation.

[0048] The display panel shown in FIG. 8(A) includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements, an insulating layer 1211, an insulating layer 1217, a sealing layer 1213, an insulating layer 1261, a coloring layer 1259, a light-shielding layer 1257, and a plurality of receivers. ​​​​​​​​​​​​Optical element, conductive layer 1281, conductive layer 1283, insulating layer 1291, insulating layer 1293, insulating layer 1 295 and an insulating layer 1255.

[0049] In the specific example 2, an insulating layer 1217 is provided on the insulating layer 1211. In this way, the distance between the substrate 1103 and the substrate 1201 can be adjusted.

[0050] FIG. 8A shows an example in which a light-receiving element is provided between an insulating layer 1255 and a sealing layer 1213 . In the non-light-emitting region on the substrate 1201 side (for example, the region where the transistor 1240 and wiring are provided), Since the light receiving elements can be arranged in an overlapping manner, the aperture ratio of the pixels (light emitting elements) can be reduced. Therefore, a touch sensor can be provided on the display panel without any need for a touch panel.

[0051] The light receiving element of the display panel is, for example, a pn-type or pin-type photodiode. In this embodiment, the light receiving element is made of a p-type semiconductor layer 1271 and an i-type semiconductor layer 1272. A pin-type photodiode having a conductor layer 1273 and an n-type semiconductor layer 1275 is used. do.

[0052] The i-type semiconductor layer 1273 contains impurities that give p-type conductivity and impurities that give n-type conductivity. Each item is 1×10 20 cm -3 The concentration is less than 10 and the photoconductivity is 10 The i-type semiconductor layer 1273 contains impurities of Group 13 or 15 of the periodic table. In other words, i-type semiconductors are those that have valence electron control. When no impurity elements are intentionally added, it exhibits weak n-type electrical conductivity, so it is called an i-type semiconductor. The layer 1273 is formed by intentionally or unintentionally doping with an impurity element that imparts p-type conductivity during or after the film formation. It includes what is intentionally added within its scope.

[0053] The light-shielding layer 1257 overlaps with the light-receiving element on the surface side closer to the substrate 1103. The light emitted from the light-emitting element 1230 can be suppressed from irradiating the light-receiving element by the light-shielding layer 1257 located between the light-receiving element and the sealing layer 12 13. It can be suppressed.

[0054] The conductive layer 1281 and the conductive layer 1283 are each electrically connected to the light-receiving element. It is preferable to use a conductive layer that transmits the light incident on the light-receiving element for the conductive layer 1 281. It is preferable to use a conductive layer that shields the light incident on the light-receiving element for the conductive layer 12 83.

[0055] When an optical touch sensor is provided between the substrate 1103 and the sealing layer 1213, it is less affected by the light emission of the light-emitting element 1230 and the S / N ratio can be improved, which is preferable.

[0056] <Specific Example 3> FIG. 8(B) shows another example of the light extraction portion 1104 in the display panel. The display panel in FIG. 8(B) is a display panel capable of touch operation.

[0057] The display panel shown in FIG. 8(B) has an element layer 1101, an adhesive layer 1105, and a substrate 1103 . The element layer 1101 has a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors, an insulating layer 1207, an insulating layer 1209a, an insulating layer 1209b, a plurality of light-emitting elements, an insulating layer 1211, an insulating layer 1217, a sealing layer 1213, a coloring layer 1259, a light-shielding layer 1257, a plurality of light-receiving elements, a conductive layer 1280, a conductive layer 1281, and an insulating layer 1255.

[0058] FIG. 8(B) shows an example having a light-receiving element between the insulating layer 1205 and the sealing layer 1213. By providing the light-receiving element between the insulating layer 1205 and the sealing layer 1213, the light-receiving element can be electrically connected to the conductive layer or semiconductor layer constituting the transistor 124 using the same material and the same process as those of the conductive layer or semiconductor layer, and a conductive layer for electrically connecting to the light-receiving element or a photoelectric conversion layer constituting the light-receiving element can be fabricated. Therefore, a display panel capable of touch operation can be fabricated without significantly increasing the manufacturing process.

[0059] <Specific Example 4> Another example of the display panel is shown in FIG. 9(A). The display panel in FIG. 9(A) is a display panel capable of touch operation.

[0060] The display panel shown in FIG. 9(A) includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors, a conductive layer 1156, a conductive layer 1157, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements, an insulating layer 1211, an insulating layer 1217, a sealing layer 1213, a coloring layer 1259, a light-shielding layer 1 257, an insulating layer 1255, a conductive layer 1272, a conductive layer 1274, an insulating layer 1276, an insulating layer 1 278, a conductive layer 1294, and a conductive layer 1296. In FIG. 9(A), an example having a capacitive touch sensor between the insulating layer 1255 and the sealing layer 1213 is shown. The capacitive touch sensor includes a conductive layer 1272 and a conductive layer 1274.

[0061] In FIG. 9(A), the conductive layers 1156 and 1157 are electrically connected to the FPC 1108 via the connector 1215. The conductive layers 1294 and 1296 are electrically connected to the conductive layer 1274 via the conductive particles 1292. Therefore, the capacitive touch sensor can be driven via the FPC 1108.

[0062] ​​​​​​​​​​

[0063] <Specific Example 5> FIG. 9(B) shows another example of the display panel. The display panel of FIG. 9(B) is a display panel capable of touch operation is a display panel.

[0064] The display panel shown in FIG. 9(B) has an element layer 1101, an adhesive layer 1105, and a substrate 1103 . The element layer 1101 includes a substrate 1201, an adhesive layer 1203, an insulating layer 1205, a plurality of transistors , a conductive layer 1156, a conductive layer 1157, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements , an insulating layer 1211, an insulating layer 1217, a sealing layer 1213, a coloring layer 1259, a light-shielding layer 1 257, an insulating layer 1255, a conductive layer 1270, a conductive layer 1272, a conductive layer 1274, an insulating layer 1 276, and an insulating layer 1278.

[0065] In FIG. 9(B), an example having a capacitive touch sensor between the insulating layer 1255 and the sealing layer 1213 is shown . The capacitive touch sensor has a conductive layer 1272 and a conductive layer 1274 .

[0066] The conductive layer 1156 and the conductive layer 1157 are electrically connected to the FPC 1108a via the connector 1215a . The conductive layer 1270 is electrically connected to the FPC 1108b via the connector 1215b . Therefore, the light-emitting element 1230 and the transistor 1240 can be driven via the FPC 1108a, and the capacitive touch sensor can be driven via the FPC 1108b .

[0067] <Specific Example 6> FIG. 10(A) shows another example of the light extraction portion 1104 in the display panel.

[0068] The light extraction unit 1104 shown in Fig. 10(A) includes a substrate 1103, an adhesive layer 1105, a substrate 12 02, an insulating layer 1205, a plurality of transistors, an insulating layer 1207, a conductive layer 1208, an insulating layer 1209a, an insulating layer 1209b, a plurality of light-emitting elements, an insulating layer 1211, a sealing layer 1213, and a coloring layer 1259.

[0069] The light-emitting element 1230 has a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The lower electrode 1231 is electrically connected to the source electrode or the drain electrode of the transistor 1240 via the conductive layer 1208. The end of the lower electrode 1231 is covered with the insulating layer 1211. The light-emitting element 1230 has a bottom emission structure. The lower electrode 1231 has light-transmitting properties and transmits the light emitted by the EL layer 1233.

[0070] A coloring layer 1259 is provided at a position overlapping the light-emitting element 1230, and the light emitted by the light-emitting element 1230 is taken out to the substrate 1103 side through the coloring layer 1259. The space between the light-emitting element 1230 and the substrate 1202 is filled with the sealing layer 1213. The substrate 1202 can be fabricated using the same material as the aforementioned substrate 120 1.

[0071] <Specific Example 7> Fig. 10(B) shows another example of the display panel.

[0072] The display panel shown in Fig. 10(B) includes an element layer 1101, an adhesive layer 1105, and a substrate 1103. The element layer 1101 includes a substrate 1202, an insulating layer 1205, a conductive layer 1310a, a conductive layer 1 310b, a plurality of light-emitting elements, an insulating layer 1211, a conductive layer 1212, and a sealing layer 1213.

[0073] The conductive layer 1310a and the conductive layer 1310b are external connection electrodes of the display panel, and can be electrically connected to an FPC or the like. It can be electrically connected.

[0074] The light-emitting element 1230 includes a lower electrode 1231, an EL layer 1233, and an upper electrode 1235. The end of the lower electrode 1231 is covered with an insulating layer 1211. The light-emitting element 1230 has a bottom-emission structure. The lower electrode 1231 has light-transmitting properties and transmits the light emitted by the EL layer 1233. The conductive layer 1212 is electrically connected to the lower electrode 1231.

[0075] The substrate 1103 may have, as a light extraction structure, a hemispherical lens, a microlens array, a film provided with a concavo-convex structure, a light diffusion film, or the like. For example, the above lens or film may be adhered onto a resin substrate using an adhesive or the like having a refractive index similar to that of the substrate or the lens or film, thereby forming a light extraction structure. For example, the above lens or film may be adhered onto a resin substrate using an adhesive or the like having a refractive index similar to that of the substrate or the lens or film, thereby forming a light extraction structure. The lens or film and the substrate or the lens or film using an adhesive or the like having a refractive index similar to that of the substrate or the lens or film, thereby forming a light extraction structure. It can be electrically connected.

[0076] The conductive layer 1212 is not necessarily provided, but it is preferably provided because it can suppress the voltage drop caused by the resistance of the lower electrode 1231. Also, for the same purpose, a conductive layer electrically connected to the upper electrode 1235 may be provided on the insulating layer 1211. The conductive layer 1212 is not necessarily provided, but it is preferably provided because it can suppress the voltage drop caused by the resistance of the lower electrode 1231. Also, for the same purpose, a conductive layer electrically connected to the upper electrode 1235 may be provided on the insulating layer 1211. The conductive layer 1212 is not necessarily provided, but it is preferably provided because it can suppress the voltage drop caused by the resistance of the lower electrode 1231. Also, for the same purpose, a conductive layer electrically connected to the upper electrode 1235 may be provided on the insulating layer 1211.

[0077] The conductive layer 1212 can be formed as a single layer or by lamination using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material having these as a main component. The conductive layer 1212 can be formed as a single layer or by lamination using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material having these as a main component. The conductive layer 1212 can be formed as a single layer or by lamination using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, aluminum, or an alloy material having these as a main component. The film thickness of the conductive layer 1212 can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0.5 μm or less. It is as follows.

[0078] When a paste (such as a silver paste) is used as the material of the conductive layer that is electrically connected to the upper electrode 1235 the metal constituting the conductive layer becomes granular and aggregates. Therefore, the surface of the conductive layer becomes rough and has many gaps, making it difficult for the EL layer 1233 to cover the surface of the conductive layer, and facilitating the electrical connection between the upper electrode and the auxiliary wiring, which is preferable.

[0079] <Example of material> Next, materials and the like that can be used for the display panel will be described. Note that the description of the configuration described above in this embodiment will be omitted.

[0080] The element layer 1101 has at least a light-emitting element. As the light-emitting element, an element capable of self-emission can be used, and elements whose luminance is controlled by current or voltage are included in this category. For example, a light-emitting diode (LED), an organic EL element, an inorganic EL element, etc. can be used.

[0081] The element layer 1101 may further have a transistor for driving the light-emitting element, a touch sensor, etc.

[0082] The structure of the transistor included in the display panel is not particularly limited. For example, it may be a staggered type transistor or an inverted staggered type transistor. Also, it may be either a top gate type or a bottom gate type transistor structure. The semiconductor material used for the transistor is not particularly limited, and for example, silicon, germanium, etc. can be mentioned. Or, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In-Ga-Zn based metal oxide, may be used.

[0083] ​​​The crystallinity of the semiconductor material used for the transistor is not particularly limited either, and any of an amorphous semiconductor, a semiconductor having crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single crystal semiconductor, or a semiconductor having a crystal region in part) may be used. Using a semiconductor having crystallinity is preferable because deterioration of transistor characteristics can be suppressed. The light-emitting element included in the display panel has a pair of electrodes (lower electrode 1231 and upper electrode 1235) and an EL layer 1233 provided between the pair of electrodes. One of the pair of electrodes functions as an anode and the other functions as a cathode.

[0084] The light-emitting element may have any of a top emission structure, a bottom emission structure, and a dual emission structure. For the electrode on the light extraction side, a conductive film that transmits visible light is used. Also, it is preferable to use a conductive film that reflects visible light for the electrode on the side where light is not extracted. The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO: Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like. Also, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, titanium nitride) can also be used by forming them thinly to have light-transmitting properties.

[0085] Moreover, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. The light-emitting element may have any of a top emission structure, a bottom emission structure, and a dual emission structure. For the electrode on the light extraction side, a conductive film that transmits visible light is used. Also, it is preferable to use a conductive film that reflects visible light for the electrode on the side where light is not extracted. The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO: Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like. Also, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, titanium nitride) can also be used by forming them thinly to have light-transmitting properties.

[0086] The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO: Indium Tin Oxide), indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like. Also, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, titanium nitride) can also be used by forming them thinly to have light-transmitting properties. Moreover, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Moreover, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Moreover, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Moreover, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Moreover, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Moreover, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Moreover, a laminated film of the above materials can be used as a conductive layer. For example, using a laminated film of an alloy of silver and magnesium and ITO is preferable because conductivity can be enhanced. Alternatively, graphene or the like may be used.

[0087] The conductive film that reflects visible light can be made of, for example, metal materials such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or alloys containing these metal materials can be used. Further, rare earth elements such as lanthanum, neodymium, or germanium may be added to the above metal materials or alloys. Also, aluminum-containing alloys (aluminum alloys) such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc., and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used. These metal materials and alloys may contain rare earth elements such as lanthanum, neodymium, or germanium. Also, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, etc. (aluminum alloys), and alloys containing silver such as an alloy of silver and copper, an alloy of silver, palladium, and copper, an alloy of silver and magnesium, etc. can be used to form the film. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, by laminating a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of the materials for the metal film and the metal oxide film include titanium, titanium oxide, etc. Also, a film composed of a conductive film that transmits visible light and a metal material may be laminated. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used.

[0088] The electrodes may be formed using, for example, vapor deposition or sputtering methods. In addition, they can be formed using ejection methods such as inkjet, printing methods such as screen printing, or plating methods. The electrodes may be formed using, for example, vapor deposition or sputtering methods. In addition, they can be formed using ejection methods such as inkjet, printing methods such as screen printing, or plating methods. The electrodes may be formed using, for example, vapor deposition or sputtering methods. In addition, they can be formed using ejection methods such as inkjet, printing methods such as screen printing, or plating methods.

[0089] When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 1231 and the upper electrode 1235, holes are injected into the EL layer 1233 from the anode side and electrons are injected from the cathode side. When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 1231 and the upper electrode 1235, holes are injected into the EL layer 1233 from the anode side and electrons are injected from the cathode side. The injected electrons and holes recombine in the EL layer 1233, and the light-emitting substance contained in the EL layer 1233 emits light.

[0090] The EL layer 1233 has at least a light-emitting layer. The EL layer 1233 may further have, as layers other than the light-emitting layer, a substance with high hole-injecting property, a substance with high hole-transporting property, a hole-blocking material, a substance with high electron-transporting property, a substance with high electron-injecting property, or a bipolar substance (a substance with high electron-transporting property and high hole-transporting property), etc.

[0091] Either a low-molecular compound or a high-molecular compound can be used for the EL layer 1233, and it may contain an inorganic compound. The layers constituting the EL layer 1233 can be formed by methods such as vapor deposition (including vacuum vapor deposition), transfer method, printing method, inkjet method, coating method, etc.

[0092] In the element layer 1101, it is preferable that the light-emitting element is provided between a pair of insulating films with low water permeability. Thereby, it is possible to suppress the intrusion of impurities such as water into the light-emitting element, and it is possible to suppress the decrease in the reliability of the light-emitting device.

[0093] Examples of the insulating film with low water permeability include films containing nitrogen and silicon such as silicon nitride film and silicon oxynitride film, and films containing nitrogen and aluminum such as aluminum nitride film. Also, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, etc. may be used.

[0094] For example, the water vapor transmission rate of the insulating film with low water permeability is 1×10 -5 [g / m 2 ·day] or less -6 [g / m 2 ·day] or less, more preferably 1×10​​​​​​​​​​​​-7 [g / m 2 ·day], hereinafter, more preferably 1×10 -8 [g / m 2 ·day] or less. 。

[0095] The substrate 1103 has translucency and transmits at least the light emitted by the light-emitting elements included in the element layer 1101. The substrate 1103 may have flexibility. Also, the refractive index of the substrate 1103 is higher than the refractive index of the atmosphere. Since an organic resin is lighter in weight than glass, using an organic resin as the substrate 1103 can reduce the weight of the light-emitting device compared to using glass, which is preferable.

[0096]

[0097] Examples of materials having flexibility and translucency to visible light include, for example, glass having a thickness sufficient to have flexibility, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, and the like. In particular, it is preferable to use a material having a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, etc. can be preferably used. Also, a substrate in which glass fibers are impregnated with an organic resin or a substrate in which an inorganic filler is mixed with an organic resin to reduce the coefficient of thermal expansion can be used.

[0098] As the substrate 1103, a layer using the above materials protects the surface of the light-emitting device from scratches, etc. - A coating layer (e.g., a silicon nitride layer, etc.) or a layer made of a material capable of dispersing pressure (e.g., an aramid resin layer, etc.) may be laminated and configured. Further, in order to suppress a decrease in the lifetime of the light-emitting element due to moisture or the like, the above-described insulating film with low water permeability may be provided.

[0099] The adhesive layer 1105 has translucency and transmits at least the light emitted by the light-emitting element included in the element layer 1101. Also, the refractive index of the adhesive layer 1105 is higher than the refractive index of the atmosphere.

[0100] For the adhesive layer 1105, a curable resin that cures at room temperature, such as a two-component mixed resin, a photocurable resin, , a thermosetting resin, or the like can be used. For example, epoxy resin, acrylic resin, silicone resin, phenol resin, etc. are exemplified. In particular, a material with low water permeability such as epoxy resin is preferable.

[0101] Further, the above resin may contain a desiccant. For example, a substance that adsorbs moisture by chemical adsorption, such as an oxide of an alkaline earth metal (calcium oxide, barium oxide, etc.), can be used. Or, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. When a desiccant is included, it is preferable because it can suppress the intrusion of impurities such as moisture into the light-emitting element and improve the reliability of the light-emitting device.

[0102] Also, by mixing a filler with a high refractive index (such as titanium oxide) into the above resin, the light extraction efficiency from the light-emitting element can be improved, which is preferable.

[0103] Further, the adhesive layer 1105 may have a scattering member that scatters light. For example, an adhesive In layer 1105, a mixture of the above resin and particles having a refractive index different from that of the above resin can also be used. These particles function as a light scattering member.

[0104] The resin and the particles having a different refractive index from that of the resin preferably have a refractive index difference of 0.1 or more, more preferably 0.3 or more. Specifically, as the resin, an epoxy resin, an acrylic resin, an imide resin, silicone, etc. can be used. As the particles, titanium oxide barium oxide, zeolite, etc. can be used.

[0105] Particles of titanium oxide and barium oxide are preferably strongly capable of scattering light. Also, when using zeolite, it is possible to adsorb the water possessed by the resin or the like, and the reliability of the light-emitting element can be improved.

[0106] For the insulating layer 1205 and the insulating layer 1255, an inorganic insulating material can be used. In particular, using the insulating film with low water permeability described above is preferable because a highly reliable display panel can be realized.

[0107] The insulating layer 1207 has the effect of suppressing the diffusion of impurities into the semiconductor constituting the transistor. As the insulating layer 1207, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, etc. can be used.

[0108] As the insulating layer 1209, the insulating layer 1209a, and the insulating layer 1209b, it is preferable to select an insulating film having a planarizing function in order to reduce surface irregularities due to, for example, transistor origin, etc. For example, an organic material such as polyimide, acrylic, benzocyclobutene-based resin, etc. can be used. In addition to the above organic materials, a low dielectric constant material (low-k material), etc. can also be used. ​​It is possible. In addition, a plurality of insulating films and inorganic insulating films formed of these materials may be laminated. It is also acceptable.

[0109] The insulating layer 1211 is provided so as to cover the end portion of the lower electrode 1231. In order to improve the covering property of the EL layer 1233 and the upper electrode 1235 formed on the upper layer of the insulating layer 1211, it is preferable that the side wall of the insulating layer 1211 is an inclined surface formed with a continuous curvature.

[0110] As the material of the insulating layer 1211, a resin or an inorganic insulating material can be used. As the resin, for example, a polyimide resin, a polyamide resin, an acrylic resin, a siloxane resin, an epoxy resin, or a phenol resin can be used. In particular, since the production of the insulating layer 1211 becomes easy, it is preferable to use a negative-type photosensitive resin or a positive-type photosensitive resin.

[0111] The method for forming the insulating layer 1211 is not particularly limited, and a photolithography method, a sputtering method , a vapor deposition method, a droplet discharge method (such as an inkjet method), a printing method (screen printing, offset printing etc.) can be used.

[0112] The insulating layer 1217 can be formed using an inorganic insulating material, an organic insulating material, or a metal material, etc. For example, as the organic insulating material, a negative-type or positive-type photosensitive resin, a non-photosensitive resin etc. can be used. Also, as the metal material, titanium, aluminum, etc. can be used. By using a conductive material for the insulating layer 1217 and configuring the insulating layer 1217 and the upper electrode 1235 to be electrically connected, the potential drop caused by the resistance of the upper electrode 1235 can be suppressed. Also, the insulating layer 1217 may have a forward taper shape or a reverse taper shape. ​ is also acceptable.

[0113] The insulating layers 1276, 1278, 1291, 1293, and 1295 can each be formed using an inorganic insulating material or an organic insulating material. In particular, the insulating layer 1278 and the insulating layer 1295 preferably use an insulating layer having a planarizing function to reduce surface irregularities caused by the sensor element. is preferred.

[0114] For the encapsulation layer 1213, a curable resin that cures at room temperature, such as a two-component mixed resin, a photocurable resin, a thermosetting resin, etc. can be used. For example, PVC (polyvinyl chloride) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB ( polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The encapsulation layer 1213 may contain a desiccant. Also, when the light of the light-emitting element 1230 passes through the encapsulation layer 1213 and is extracted outside the display panel, it is preferable that the encapsulation layer 1213 contains a filler or a scattering member with a high refractive index. For the desiccant, the filler with a high refractive index, and the scattering member, the same materials as those that can be used for the adhesive layer 1105 can be mentioned. .

[0115] The conductive layers 1156, 1157, 1294, and 1296 can each be formed of the same material and in the same process as the conductive layer constituting the transistor or the light-emitting element. Also, the conductive layer 1280 can be formed of the same material and in the same process as the conductive layer constituting the transistor. can be formed.

[0116] For example, each of the above conductive layers can be formed of molybdenum, titanium, chromium, tantalum, tungsten It can be formed in a single layer or by laminating using metal materials such as aluminum, copper, neodymium, scandium, or alloy materials containing these elements. Also, each of the above conductive layers may be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (such as In2O3), tin oxide (such as SnO2), zinc oxide (ZnO), ITO, indium zinc oxide (such as In2O3-ZnO), or those obtained by adding silicon oxide to these metal oxide materials can be used. It can be formed using the above metal materials, alloy materials, or conductive metal oxides, etc., either singly or in layers. For the conductive layer, it may also be formed using a conductive metal oxide. As the conductive metal oxide, indium oxide (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (In2O3-ZnO, etc.), or those obtained by adding silicon oxide to these metal oxide materials can be used. Indium (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (In2O3-ZnO, etc.), or those obtained by adding silicon oxide to these metal oxide materials can be used. Indium zinc oxide (In2O3-ZnO, etc.), or those obtained by adding silicon oxide to these metal oxide materials can be used. It can be formed using the above metal materials, alloy materials, or conductive metal oxides, etc., either singly or in layers.

[0117] Also, the conductive layer 1208, the conductive layer 1212, the conductive layer 1310a, and the conductive layer 1310b can each be formed using the above metal materials, alloy materials, or conductive metal oxides, etc. They can each be formed using the above metal materials, alloy materials, or conductive metal oxides, etc.

[0118] The conductive layer 1272 and the conductive layer 1274, and the conductive layer 1281 and the conductive layer 1283 are conductive layers having light transmissivity. For example, indium oxide, ITO, indium zinc oxide, zinc oxide, zinc oxide added with gallium, etc. can be used. Also, the conductive layer 1270 can be formed of the same material and in the same process as the conductive layer 1272. For example, indium oxide, ITO, indium zinc oxide, zinc oxide, zinc oxide added with gallium, etc. can be used. Also, the conductive layer 1270 can be formed of the same material and in the same process as the conductive layer 1272. Indium oxide, ITO, indium zinc oxide, zinc oxide, zinc oxide added with gallium, etc. can be used. Also, the conductive layer 1270 can be formed of the same material and in the same process as the conductive layer 1272. The conductive layer 1270 can be formed of the same material and in the same process as the conductive layer 1272.

[0119] As the conductive particles 1292, those obtained by coating the surface of particles such as organic resin or silica with a metal material are used. It is preferable to use nickel or gold as the metal material because the contact resistance can be reduced. Also, it is preferable to use particles coated with two or more metal materials in layers, such as coating nickel with gold. As the metal material, nickel or gold is preferably used because the contact resistance can be reduced. Also, it is preferable to use particles coated with two or more metal materials in layers, such as coating nickel with gold. As the metal material, nickel or gold is preferably used because the contact resistance can be reduced. Also, it is preferable to use particles coated with two or more metal materials in layers, such as coating nickel with gold. It is preferable to use particles coated with two or more metal materials in layers, such as coating nickel with gold.

[0120] As the connector 1215, a paste-like or sheet-like material obtained by mixing metal particles into a thermosetting resin can be used, and a material showing anisotropic conductivity by thermocompression bonding can be used. A paste-like or sheet-like material obtained by mixing metal particles into a thermosetting resin can be used, and a material showing anisotropic conductivity by thermocompression bonding can be used. As the core particles, it is preferable to use particles in which two or more kinds of metals are layered, such as nickel particles coated with gold. It is preferable to use particles in which two or more kinds of metals are layered.

[0121] The colored layer 1259 is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, a blue (B) color filter that transmits light in the blue wavelength band, etc. can be used. Each colored layer can be formed at a desired position using various materials by printing methods, inkjet methods, etching methods using photolithography methods, etc. Further, a light-shielding layer 1257 is provided between adjacent colored layers 1259. The light-shielding layer 125 7 shields the light that leaks from adjacent light-emitting elements and suppresses color mixing between adjacent pixels. By providing the end portion of the colored layer 1259 so as to overlap with the light-shielding layer 1257,

[0122] light leakage can be suppressed. The light-shielding layer 1257 can use a material that shields the light emission of the light-emitting element, and can be formed using a metal material, a resin material containing a pigment or a dye, etc. This can suppress color mixing between adjacent pixels. Here, by providing the end portion of the colored layer 1259 so as to overlap with the light-shielding layer 1257, light leakage can be suppressed. The light-shielding layer 1257 can use a material that shields the light emission of the light-emitting element, and can be formed using a metal material, a resin material containing a pigment or a dye, etc. It can be formed using a metal material, a resin material containing a pigment or a dye, etc. As shown in FIG. 7(A), when the light-shielding layer 1257 is provided in a region other than the light extraction portion 1104 such as the drive circuit portion 1106, unintended light leakage due to guided light or the like can be suppressed, so it is preferable.

[0123] Further, when an insulating layer 1261 that covers the colored layer 1259 and the light-shielding layer 1257 is provided, impurities such as pigments contained in the colored layer 125 9 and the light-shielding layer 1257 can be prevented from diffusing into the light-emitting element or the like, so it is preferable. The insulating layer 1261 uses a light-transmissive material and can be an inorganic insulating material or an organic insulating material. It can be used. The above-mentioned insulating film with low water permeability may be used for the insulating layer 1261.

[0124] <Example of manufacturing method> Next, a method for manufacturing a display panel will be exemplified with reference to FIGS. 11 and 12. Here, as a specific example 1 (FIG. 7(B)), a display panel having the configuration will be described as an example.

[0125] First, a release layer 1303 is formed on a manufacturing substrate 1301, and an insulating layer 120 5 is formed. Next, a plurality of transistors, a conductive layer 1157, an insulating layer 1207, an insulating layer 1209, a plurality of light-emitting elements, and an insulating layer 1211 are formed. Note that the conductive layer 1157 is exposed, and the insulating layer 1211, the insulating layer 1209, and the insulating layer 1207 are open (FIG. 11(A)).

[0126] Also, a release layer 1307 is formed on a manufacturing substrate 1305, and an insulating layer 125 5 is formed. Next, a light-shielding layer 1257, a coloring layer 1259, and an insulating layer 1261 are formed (FIG. 11(B)).

[0127] As the manufacturing substrate 1301 and the manufacturing substrate 1305, a glass substrate, a quartz substrate, a s apphire substrate, a ceramic substrate, a metal substrate, etc. can be used respectively.

[0128] Also, for the glass substrate, for example, glass materials such as aluminosilicate glass, aluminoborosilicate glass , barium borosilicate glass, etc. can be used. When the temperature of the subsequent heat treatment is high, it is preferable to use one having a strain point of 730°C or higher.

[0129] When a glass substrate is used for the manufacturing substrate, between the manufacturing substrate and the release layer, a silicon oxide film, an oxide When forming an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon oxynitride film, it is preferable to prevent contamination from the glass substrate.

[0130] The release layers 1303 and 1307 are each made of an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, silicon, an alloy material containing the element, or a compound material containing the element, and is a single-layer or laminated layer. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline.

[0131] The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. Note that the coating method includes a spin coating method, a droplet discharge method, and a dispensing method.

[0132] When the release layer has a single-layer structure, it is preferable to form a layer containing a tungsten layer, a molybdenum layer, or a mixture of tungsten and molybdenum. Also, a layer containing an oxide or oxynitride of tungsten, a layer containing an oxide or oxynitride of molybdenum, or a layer containing an oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. Note that the mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

[0133] Also, when forming a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten as the release layer, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed on the upper layer thereof. Thus, a layer containing an oxide of tungsten is formed at the interface between the tungsten layer and the insulating film. It may be utilized to form. Further, the surface of the layer containing tungsten is subjected to thermal oxidation treatment , oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, treatment with a solution having a strong oxidizing power such as ozonated water to form a layer containing tungsten oxide. Also, the plasma treatment and heat treatment may be performed in an atmosphere of oxygen, nitrogen, nitrous oxide alone, or a mixed gas of the gas and other gases . By changing the surface state of the release layer by the plasma treatment and heat treatment described above, it is possible to control the adhesion between the release layer and the insulating film formed later .

[0134] Each insulating layer can be formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. , for example, by forming the film by the plasma CVD method at a film formation temperature of 250°C or higher and 400°C or lower, a dense and very low water-permeable film can be obtained.

[0135] Thereafter, a material that becomes the sealing layer 1213 is applied to the surface of the production substrate 1305 where the coloring layer 1259 or the like is provided or the surface of the production substrate 1301 where the light-emitting element 1230 or the like is provided, and the surfaces are bonded together through the sealing layer 1213 (FIG. 11(C)).

[0136] Then, the production substrate 1301 is peeled off, and the exposed insulating layer 1205 and the substrate 1201 are bonded together using the adhesive layer 1203. Also, the production substrate 1305 is peeled off, and the exposed insulating layer 12 55 and the substrate 1103 are bonded together using the adhesive layer 1105. In FIG. 12(A), the substrate 1103 is configured not to overlap with the conductive layer 1157, but the conductive layer 1157 and the substrate 1103 may overlap.

[0137] Note that various methods can be appropriately used in the peeling process. For example, when a layer containing a metal oxide film is formed on the side of the layer to be peeled that contacts the layer to be peeled as the peeling layer, the metal oxide film can be embrittled by crystallization to peel the layer to be peeled from the production substrate. Also, when an amorphous silicon film containing hydrogen is formed as the peeling layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by laser light irradiation or etching to peel the layer to be peeled from the production substrate. Further, when a layer containing a metal oxide film is formed on the side of the layer to be peeled that contacts the layer to be peeled as the peeling layer, the metal oxide film is embrittled by crystallization, and then a part of the peeling layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3, and peeling can be performed on the embrittled metal oxide film. Additionally, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the peeling layer, and a method of irradiating the peeling layer with laser light to release nitrogen, oxygen, or hydrogen contained in the peeling layer as a gas to promote the peeling between the layer to be peeled and the substrate may be used. Also, a method of mechanically removing the production substrate on which the layer to be peeled is formed or etching with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, it is not necessary to provide a peeling layer. When a layer containing a metal oxide film is formed on the side that contacts the layer to be peeled, the metal oxide film can be embrittled by crystallization to peel the layer to be peeled from the production substrate. Moreover, when an amorphous silicon film containing hydrogen is formed as the peeling layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by laser light irradiation or etching to peel the layer to be peeled from the production substrate. Also, when a layer containing a metal oxide film is formed on the side that contacts the layer to be peeled as the peeling layer, the metal oxide film is embrittled by crystallization, and then a part of the peeling layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3. After that, peeling can be performed on the embrittled metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the peeling layer. By irradiating the peeling layer with laser light to release nitrogen, oxygen, or hydrogen contained in the peeling layer as a gas, a method of promoting the peeling between the layer to be peeled and the substrate may be used. In addition, a method of mechanically removing the production substrate on which the layer to be peeled is formed or etching with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, it is not necessary to provide a peeling layer. Note that various methods can be appropriately used in the peeling process. For example, when a layer containing a metal oxide film is formed on the side of the layer to be peeled that contacts the layer to be peeled as the peeling layer, the metal oxide film can be embrittled by crystallization to peel the layer to be peeled from the production substrate. Also, when an amorphous silicon film containing hydrogen is formed as the peeling layer between a production substrate with high heat resistance and the layer to be peeled, the amorphous silicon film can be removed by laser light irradiation or etching to peel the layer to be peeled from the production substrate. Moreover, when a layer containing a metal oxide film is formed on the side that contacts the layer to be peeled as the peeling layer, the metal oxide film is embrittled by crystallization, and then a part of the peeling layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3. After that, peeling can be performed on the embrittled metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the peeling layer. By irradiating the peeling layer with laser light to release nitrogen, oxygen, or hydrogen contained in the peeling layer as a gas, a method of promoting the peeling between the layer to be peeled and the substrate may be used. In addition, a method of mechanically removing the production substrate on which the layer to be peeled is formed or etching with a solution or a fluorinated gas such as NF3, BrF3, or ClF3 can be used. In this case, it is not necessary to provide a peeling layer. Also, by combining a plurality of the above peeling methods, the peeling process can be performed more easily. That is, laser light irradiation, etching of the peeling layer with a gas or a solution, mechanical removal with a sharp knife or a mesa, etc. are performed to make the peeling layer and the layer to be peeled in a state where they are easy to peel, and then peeling can be performed by a physical force (by a machine, etc.). Moreover, when a layer containing a metal oxide film is formed on the side that contacts the layer to be peeled as the peeling layer, the metal oxide film is embrittled by crystallization, and then a part of the peeling layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3. After that, peeling can be performed on the embrittled metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the peeling layer. By irradiating the peeling layer with laser light to release nitrogen, oxygen, or hydrogen contained in the peeling layer as a gas, a method of promoting the peeling between the layer to be peeled and the substrate may be used.

[0138] Also, by combining a plurality of the above peeling methods, the peeling process can be performed more easily. That is, laser light irradiation, etching of the peeling layer with a gas or a solution, mechanical removal with a sharp knife or a mesa, etc. are performed to make the peeling layer and the layer to be peeled in a state where they are easy to peel, and then peeling can be performed by a physical force (by a machine, etc.). Moreover, when a layer containing a metal oxide film is formed on the side that contacts the layer to be peeled as the peeling layer, the metal oxide film is embrittled by crystallization, and then a part of the peeling layer is removed by etching using a solution or a fluorinated gas such as NF3, BrF3, or ClF3. After that, peeling can be performed on the embrittled metal oxide film. Furthermore, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) can be used as the peeling layer. By irradiating the peeling layer with laser light to release nitrogen, oxygen, or hydrogen contained in the peeling layer as a gas, a method of promoting the peeling between the layer to be peeled and the substrate may be used.

[0139] Also, even if the liquid is permeated into the interface between the release layer and the layer to be released to release the layer to be released from the production substrate it is acceptable. Further, peeling may be performed while applying a liquid such as water during peeling.

[0140] As another peeling method, when the release layer is formed of tungsten, it is advisable to perform peeling while etching the release layer with a mixed solution of aqueous ammonia and hydrogen peroxide solution.

[0141] Note that when peeling is possible at the interface between the production substrate and the layer to be released, the release layer may not be provided. For example, glass is used as the production substrate, an organic resin such as polyimide is formed in contact with the glass, and an insulating film, a transistor, or the like is formed on the organic resin. In this case, peeling can be performed at the interface between the production substrate and the organic resin by heating the organic resin. Or, a metal layer is provided between the production substrate and the organic resin, and the metal layer is heated by passing an electric current through the metal layer, and peeling may be performed at the interface between the metal layer and the organic resin.

[0142] Finally, by opening the insulating layer 1255 and the sealing layer 1213, the conductive layer 1157 is exposed (FIG. 12(B)). Note that in the case where the substrate 1103 overlaps with the conductive layer 1157, the substrate 1103 and the adhesive layer 1105 are also opened (FIG. 12(C)). The means for opening is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method, or the like may be used. Further, a cut may be made in the film on the conductive layer 1157 using a sharp blade or the like, and a part of the film may be peeled off by physical force.

[0143] As described above, a display panel can be manufactured.

[0144] As described above, the display panel of this embodiment includes a substrate 1103 and two substrates, namely substrate 1201 or substrate 1202. Even if it includes a touch sensor, it can be composed of two substrates. By minimizing the number of substrates, it becomes easier to extract light and improve the clarity of the display.

[0145] This embodiment can be appropriately combined with other embodiments.

[0146] (Embodiment 5) In this embodiment, an example of an electronic device to which a display device according to an aspect of the present invention is applied will be described with reference to the drawings.

[0147] Examples of electronic devices to which a display device having a flexible shape is applied include, for example, a television device (also referred to as a TV or television receiver), a monitor for a computer, a digital camera, a digital video camera, a digital photo frame, a mobile phone (also referred to as a mobile phone or mobile phone device), a portable game console, a portable information terminal, an audio playback device, a large game console and the like.

[0148] FIGS. 13(A) and 13(B) illustrate a foldable tablet terminal 9600 that can be folded in two. Here, an example of folding in two is shown, but it can also be applied to those with a large number of folds, such as folding in three or four. FIG. 13(A) shows the open state of the tablet terminal 9600. The tablet terminal 9600 includes a housing 9630, a display unit 9631, a display mode switching switch 9626, a power switch 9627, a power saving mode switching switch 962 5, a fastener 9629, and an operation switch 9628.

[0149] The housing 9630 has a housing 9630a and a housing 9630b, and the housing 9630a and the housing 963 0b are connected by a hinge portion 9639. Further, the housing 9630 can be folded in two by the hinge portion 96 39.

[0150] Also, the display unit 9631 is formed on the housing 9630a, the housing 9630b, and the hinge portion 9639. By using the flexible display panel disclosed in this specification or the like for the display unit 9631, the display unit 9631 can be bent, and a highly reliable tablet-type terminal can be obtained.

[0151] A part of the display unit 9631 can be a touch panel area 9632, and data can be input by touching the displayed operation key 9638. Note that the display unit 9631 can be configured such that, for example, half of the area has only a display function and the other half has a touch panel function. Also, all areas of the display unit 9631 can be configured to have a touch panel function. For example, a keyboard button can be displayed on the entire surface of the display unit 9631 to make it a data input terminal.

[0152] Also, the display mode switching switch 9626 can select switching of the display orientation such as vertical display or horizontal display, switching between black and white display and color display, etc. The power saving mode switching switch 9625 can optimize the display brightness according to the amount of external light detected by a light sensor built into the tablet-type terminal during use. The tablet-type terminal may incorporate not only a light sensor but also other detection devices such as sensors for detecting inclination such as a gyro and an acceleration sensor.

[0153] Figure 13(B) shows the state in which the tablet terminal 9600 is closed, and the tablet terminal 96 00 includes a housing 9630, a solar cell 9633, and a charge / discharge control circuit 9634. In Figure 13(B), as an example of the charge / discharge control circuit 9634, a configuration having a battery 9635 and a DCDC converter 9636 is shown.

[0154] By using the display device disclosed in this specification or the like for the display unit 9631, the display unit 9631 can be folded. For example, since the tablet terminal 9600 can be folded in two, the housing 9630 can be closed when not in use. Therefore, it has excellent portability, and since the display unit 9631 can be protected by closing the housing 9630, it has excellent durability and can be made into a tablet terminal with excellent reliability

[0155] from the viewpoint of long-term use. In addition, the tablet terminal shown in FIGS. 13(A) and 13(B) also has functions such as displaying various information (such as still images, moving images, text images, etc.), displaying a calendar, date, or time on the display unit, a touch input function for touch input operation or editing of the information displayed on the display unit, and a function

[0156] for controlling processing by various software (programs), and so on. The solar cell 9633 mounted on the surface of the tablet terminal can supply power to the touch panel, the display unit, or the video signal processing unit, etc. The solar cell 9633 can be provided on one side or both sides of the housing 9630, and is suitable because it Using a lithium-ion battery has advantages such as miniaturization.

[0157] Also, regarding the configuration and operation of the charge / discharge control circuit 9634 shown in Fig. 13(B), a block diagram is shown and explained in Fig. 13(C ). Fig. 13(C) shows a solar cell 9633, a battery 96 35, a DC / DC converter 9636, a converter 9637, switches SW1 to SW3, and a display unit 9631. The battery 9635, the DC / DC converter 9636 , the converter 9637, and the switches SW1 to SW3 correspond to the locations in the charge / discharge control circuit 9634 shown in Fig. 13(B).

[0158] First, an example of the operation when power is generated by the solar cell 9633 due to external light will be described. The power generated by the solar cell is stepped up or down by the DC / DC converter 9636 to become a voltage for charging the battery 9635. When the power from the solar cell 9633 is used for the operation of the display unit 9631, the switch SW1 is turned on, and the converter 96 37 steps up or down to the voltage required for the display unit 9631. When the display on the display unit 9631 is not performed, SW1 can be turned off and SW2 can be turned on to charge the battery 96 35. 31.

[0159] Note that the solar cell 9633 is shown as an example of a power generation means, but it is not particularly limited. The battery 9635 may be charged by other power generation means such as a piezoelectric element (piezoelectric element) or a thermoelectric conversion element (Peltier element). For example, a contactless power transmission module that wirelessly (non-contact) transmits and receives power for charging, or a configuration that combines other charging means

[0160] Note that if the display device according to an aspect of the present invention is included, it goes without saying that the electronic device is not particularly limited to those described above. It goes without saying that.

[0161] This embodiment can be implemented in appropriate combination with the configurations described in other embodiments. It is.

Description of Reference Numerals

[0162] 101 Flexible display panel 102-1 Flexible substrate 102-2 Flexible substrate 111-1 Housing 111-2 Frame member 112-1 Housing 112-2 Frame member 113-1 Housing 113-2 Frame member 121 Battery unit 122 Control unit 125 FPC 128 Side frame material 130 Wiring 132 Opening 133 Opening 134 Wiring 1212 Conductive layer 1271 p-type semiconductor layer 1273 i-type semiconductor layer 1275 n-type semiconductor layer 1280 Conductive layer 600 Main board 601 Speaker 602 Camera 603 Display panel 604 Battery unit 605 Antenna for mobile communication 606 Antenna for NFC 611 Crystal oscillator 612 DRAM 613 Application processor 614 Baseband processor 615 Electronic compass 616 Crystal oscillator 617 RF transceiver IC 618 Touch panel control IC 619 Acceleration sensor 620 Module 621 Power control IC 622 Power amplifier for W-CDMA 623 Flash memory 624 Filter 1101 Element layer 1103 Substrate 1104 Light extraction part 1105 Adhesive layer 1106 Drive circuit part 1108 FPC 1108a FPC 1108b FPC 1156 Conductive layer 1157 Conductive layer 1201 Substrate 1202 Substrate 1203 Adhesive layer 1205 Insulating layer 1207 Insulating layer 1208 Conductive layer 1209 Insulating layer 1209a Insulating layer 1209b Insulating layer 1211 Insulating layer 1213 Encapsulation layer 1215 Connector 1215a Connector 1215b Connector 1217 Insulating layer 1230 Light-emitting element 1231 Lower electrode 1233 EL layer 1235 Upper electrode 1240 Transistor 1255 Insulating layer 1257 Light-shielding layer 1259 Coloring layer 1261 Insulating layer 1270 Conductive layer 1272 Conductive layer 1274 Conductive layer 1276 Insulating layer 1278 Insulating layer 1281 Conductive layer 1283 Conductive layer 1291 Insulating layer 1292 Conductive particles 1293 Insulating layer 1294 Conductive layer 1295 Insulating layer 1296 Conductive layer 1301 Fabrication substrate 1303 Release layer 1305 Fabrication substrate 1307 Release layer 1310a Conductive layer 1310b Conductive layer 9600 Tablet terminal 9625 Switch 9626 Switch 9627 Power switch 9628 Operation switch 9629 Fastener 9630 Housing 9631 Display unit 9632 Region 9633 Solar cell 9634 Charge / discharge control circuit 9635 Battery 9636 DCDC converter 9637 Converter 9638 Operation key 9639 Hinge part 9630a Housing 9630b Housing

Claims

【Claim 1】 A display device having a flexible display panel, a first housing, a second housing, a first circuit, a second circuit, and wiring, wherein the first housing supports a first portion of the flexible display panel, the second housing supports a second portion of the flexible display panel, the first circuit is provided within the first housing, the second circuit is provided within the second housing, the wiring is electrically connected to the first circuit and the second circuit, the flexible display panel is electrically connected to at least one of the first circuit and the second circuit, the flexible display panel has a bent portion between the first housing and the second housing, and the first housing and the second housing overlap in a state where the flexible display panel is folded.

Images