Contactless data transmitter / receiver

Abstract

To provide a contactless data transmitter / receiver that can have a low-profile.SOLUTION: An RFID tag 10 comprises a substrate 1 having an IC chip 11 and a first antenna 12 formed on a first main surface 1a, a second antenna 2 having an electromagnetic field coupling part 21 that is electromagnetically coupled to the first antenna 12, and a plate-shaped support 3 for supporting the substrate 1 and the second antenna 2. A holding part 43 for holding the substrate 1 is formed on the support 3. A container recess part 37 for containing the electromagnetic field coupling part 21 is formed on a bottom surface 43a of the holding part 43. The electromagnetic field coupling part 21 contained in a container groove 34 faces the first antenna 12.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a non-contact data transmitter.

Background Art

[0002] For purposes such as distribution management, RFID (Radio Frequency Identification) tags are used. An RFID tag (non-contact data transmitter) includes, for example, a chip and an antenna (see, for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] An RFID tag is installed on an object to be targeted. When the RFID tag is installed on the object, the protruding dimension from the surface of the object may increase. Therefore, there is a demand for the RFID tag to be thinned.

[0005] One aspect of the present invention is to provide a non-contact data transmitter capable of being thinned.

Means for Solving the Problems

[0006] One aspect of the present invention provides a non-contact data transceiver including a substrate having an IC chip and a first antenna formed on a first main surface, a second antenna having an electromagnetic coupling portion electromagnetically coupled to the first antenna, and a plate-like support for supporting the substrate and the second antenna. A holding portion for holding the substrate is formed on the support, a housing groove for housing the electromagnetic coupling portion is formed on a bottom surface of the holding portion, and the electromagnetic coupling portion housed in the housing groove faces the first antenna.

[0007] Preferably, the IC chip is formed to protrude from the first main surface of the substrate, and a housing recess for housing at least a part of the IC chip is formed on the bottom surface.

[0008] Preferably, the housing recess penetrates the support in a thickness direction.

[0009] Preferably, the first antenna is covered with an insulating coating.

[0010] Preferably, the electromagnetic coupling portion of the second antenna is non-linear, and the housing groove is non-linear according to the electromagnetic coupling portion.

[0011] Preferably, the substrate is fixed to the support by thermal welding.

Advantages of the Invention

[0012] According to one aspect of the present invention, a non-contact data transceiver capable of being thinned can be provided.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Embodiments for Carrying Out the Invention

[0014] [RFID Tag] (First Embodiment) FIG. 1 is a plan view of the non-contact data transmitter 10 according to the first embodiment. The non-contact data transmitter may be referred to as an "RFID tag". FIG. 2 is an enlarged plan view of the RFID tag 10. FIG. 3 is an exploded perspective view of the RFID tag 10. FIG. 4 is a cross-sectional view of the RFID tag 10. FIG. 5 is an enlarged cross-sectional view of the RFID tag 10. FIG. 6 is an exploded cross-sectional view of the RFID tag 10. FIGS. 4 and 5 are cross-sectional views taken along the line I-I of FIG. 2.

[0015] As shown in FIGS. 1 to 3, the RFID tag 10 includes a substrate 1, a second antenna 2, and a support 3. The longitudinal direction (the left - right direction in FIG. 1) of the main surface 31a of the main board portion 31 of the support 3 is the X - direction. One direction of the X - direction (the right - hand side in FIG. 1) is the +X - side. The direction opposite to the +X - side is the -X - side. The short - hand direction of the main surface 31a of the support 3 is the Y - direction. The Y - direction is orthogonal to the X - direction. One direction of the Y - direction (the upper - hand side in FIG. 1) is the +Y - side. The direction opposite to the +Y - side is the -Y - side. The direction orthogonal to the main surface 31a of the support 3 is the Z - direction. The Z - direction is orthogonal to both the X - direction and the Y - direction. One direction of the Z - direction (the direction in front of the paper surface in FIG. 1) is the +Z - side. The direction opposite to the +Z - side is the -Z - side. Looking from the Z - direction is called plan view. +Z is the height direction. The "Z - axis" is parallel to the Z - direction.

[0016] As shown in FIG. 3, the substrate 1 includes an IC chip 11, a first antenna 12, and a base material 13. Hereinafter, when explaining the structure of the RFID tag 10, the +Z - side may be provisionally defined as the upper side. The posture of the RFID tag 10 defined here does not limit the posture during the use of the RFID tag 10.

[0017] The base material 13 is formed in a plate shape. Examples of the constituent material of the base material 13 include glass - epoxy resin, ceramics, and plastics.

[0018] The shape of the substrate 1 in plan view is not particularly limited, but a non - circular shape is desirable. The substrate 1 may be, for example, an elliptical shape, an oval shape, a rectangular shape, etc. In this embodiment, the substrate 1 is in an elliptical shape. The substrate 1 is, for example, in a posture with its major axis oriented in the X - direction.

[0019] When the outer shape of the substrate 1 in plan view is a non - rotationally symmetric shape, during assembly, an error in the installation posture of the substrate 1 with respect to the support 3 is less likely to occur. Examples of the non - rotationally symmetric shape include a shape in which a part of the periphery of an ellipse bulges in the diameter - expanding direction. In this embodiment, the substrate 1 has a shape in which one location (the bulging portion 1A) of the periphery of the ellipse bulges in the diameter - expanding direction.

[0020] The thickness of the substrate 1 may be, for example, 0.3 mm or more. Thereby, the bending rigidity of the substrate 1 can be increased. The thickness of the substrate 1 may be 0.5 mm or less. When the thickness of the substrate 1 is within this range, it is advantageous in terms of thinning of the RFID tag 10.

[0021] The substrate 1 takes a posture with the first main surface 1a (one surface) facing the support 3, for example. The first main surface 1a faces the bottom surface 43a of the holding portion 43. When the substrate 1 is in a posture with the first main surface 1a facing the support 3, the first antenna 12 is less likely to be damaged by an external force. Therefore, the first antenna 12 can be protected.

[0022] As shown in FIGS. 4 and 5, an insulating coating 14 is formed on the surface of the base material 13. In the present embodiment, the insulating coating 14 is formed on both surfaces of the base material 13. The insulating coating 14 is formed so as to cover the first antenna 12. The insulating coating 14 is composed of a solder resist or the like.

[0023] The substrate 1 may be fixed to the support 3. For example, the substrate 1 may be joined to the bottom surface 43a by welding, adhesion, or the like.

[0024] As shown in FIG. 3, the IC chip 11 can write and read information non - contact via the first antenna 12 and the second antenna 2. The IC chip 11 is mounted on the first main surface 13b of the base material 13. The IC chip 11 is provided on the first main surface 1a of the substrate 1.

[0025] As shown in FIG. 4, the IC chip 11 protrudes from the lower surface (the first main surface 1a) of the substrate 1 toward the - Z side, for example. The protruding height of the IC chip 11 is, for example, 0.2 mm to 0.6 mm.

[0026] As shown in FIG. 3, the first antenna 12 is, for example, a conductive layer formed on the first main surface 13b of the base material 13. The conductive layer is composed of, for example, a conductive foil, a plating layer, a conductive ink layer, or the like. The conductive foil is a metal foil composed of, for example, copper, silver, gold, platinum, aluminum, or the like. The conductive foil is formed into a predetermined shape by etching or the like. The plating layer is composed of a metal such as, for example, copper, silver, gold, platinum, or aluminum. The conductive ink layer is formed by printing or the like using conductive ink. The conductive ink contains conductive particles formed of a metal, a carbon material, or the like.

[0027] A part of the first antenna 12 is formed in a loop shape. The portion of the first antenna 12 that electromagnetically couples with the electromagnetic coupling portion 21 is, for example, in a curved shape. The "curved shape" is a shape that has no sharp bent portions and bends smoothly. Examples of the curved shape include an elliptical arc shape, an arc shape, and a higher-order curve shape (parabolic shape, hyperbolic shape).

[0028] In the present embodiment, the portion of the first antenna 12 that electromagnetically couples with the electromagnetic coupling portion 21 is in an elliptical arc shape. Most of the first antenna 12 is formed along the outer peripheral edge 13a of the base material 13. The first antenna 12 is electrically connected to the IC chip 11. The first antenna 12 is provided on the first main surface 1a of the substrate 1.

[0029] The second antenna 2 is an antenna for a booster. The second antenna 2 is, for example, a linear body. The second antenna 2 is formed of a metal such as, for example, stainless steel, steel, copper, or a copper alloy. The second antenna 2 is separate from the substrate 1.

[0030] The second antenna 2 includes an electromagnetic field coupling portion 21 and a pair of extending portions 22. The electromagnetic field coupling portion 21 is preferably non-linear. The electromagnetic field coupling portion 21 has, for example, a curved shape. The electromagnetic field coupling portion 21 is, for example, in an elliptical arc shape, an arc shape, a higher-order curve shape (parabolic shape, hyperbolic shape), etc. In the present embodiment, the electromagnetic field coupling portion 21 is in an elliptical arc shape. Specifically, the electromagnetic field coupling portion 21 has a semi-elliptical shape extending from one vertex (the vertex intersecting the major axis) of the ellipse to the other vertex (the vertex intersecting the major axis). The shape of the cross-section orthogonal to the length direction of the electromagnetic field coupling portion 21 is, for example, circular (see FIG. 5).

[0031] In a plan view, the electromagnetic field coupling portion 21 has a shape along the first antenna 12 (for example, the same elliptical arc shape as the first antenna 12). As shown in FIG. 5, at least a part of the electromagnetic field coupling portion 21 faces the first antenna 12 in the vertical direction (Z direction). It is desirable that at least a part of the electromagnetic field coupling portion 21 is located at a position overlapping the first antenna 12 in a plan view.

[0032] The electromagnetic field coupling portion 21 couples with the first antenna 12 through an electromagnetic field. Electromagnetic field coupling is, for example, one or both of electric field coupling and magnetic field coupling. Even if the electromagnetic field coupling portion 21 is located at a position not overlapping the first antenna 12 in a plan view, if it is at a position sufficiently close to the first antenna 12, it can be said to face the first antenna 12. For example, if at least a part of the accommodating groove 34 is located at a position overlapping the first antenna 12 in a plan view, the electromagnetic field coupling portion 21 can face the antenna 12. Since the first antenna 12 is covered with the insulating coating 14, the electromagnetic field coupling portion 21 is non-contact with the first antenna 12.

[0033] As shown in FIG. 3, the pair of extending portions 22 extend from one end 21a and the other end 21a of the electromagnetic field coupling portion 21, respectively. As shown in FIG. 1, the first extension part 22A, which is one of the pair of extension parts 22, extends in the -X direction while meandering from the -X side end 21a (see FIG. 3) of the electromagnetic field coupling part 21. The second extension part 22B, which is the other of the pair of extension parts 22, extends in the +X direction while meandering from the +X side end 21a (see FIG. 3) of the electromagnetic field coupling part 21.

[0034] The planar shape of the extension part 22 is, for example, a meander (serpentine) shape, a wave shape, a zigzag shape, etc. In the present embodiment, the extension part 22 has a meander shape.

[0035] As shown in FIG. 3, the extension part 22 includes a plurality of straight parts 23 and a plurality of folding parts 24. The straight parts 23 are linear along the Y direction. The plurality of straight parts 23 are arranged at intervals in the X direction. The folding parts 24 connect the ends of adjacent straight parts 23. The folding parts 24 connect the one ends and the other ends of the straight parts 23 alternately. The folding parts 24 have a curved shape (for example, an arc shape).

[0036] The support 3 includes a plate-shaped main board part 31, a first protruding wall 41, and a second protruding wall 42. The support 3 is plate-shaped as a whole. The support 3 supports the substrate 1 and the second antenna 2.

[0037] The support 3 is formed of, for example, resin. Examples of the resin include polyamide resins such as nylon 6,6; polyester resins such as polyethylene terephthalate (PET); polyolefin resins such as polyethylene; polyfluoroethylene-based resins such as polyvinyl fluoride; vinyl polymers such as polyvinyl chloride; acrylic resins such as polymethyl methacrylate, etc.

[0038] The main board part 31 is, for example, shaped generally along the outer shape of the substrate 1 in a plan view. For example, when the substrate 1 is elliptical, the main board part 31 is also elliptical. Thereby, the overall size of the RFID tag 10 can be reduced.

[0039] The thickness T1 of the main board portion 31 (see FIG. 4) can be 0.8 mm or less (preferably 0.6 mm or less). Thereby, the RFID tag 10 can be made thinner. The thickness T1 may be, for example, 0.4 mm or more.

[0040] The first protruding wall 41 is a rib-shaped protrusion. The first protruding wall 41 protrudes from the main surface 31a toward the +Z side. The first protruding wall 41 extends along the periphery of the +Y side portion of the main board portion 31. The height of the first protruding wall 41 from the bottom surface 43a is the same as or greater than the thickness of the substrate 1.

[0041] The first protruding wall 41 faces a part of the outer peripheral edge of the substrate 1 (the +Y side portion). The inner peripheral surface of the first protruding wall 41 has a curved shape (for example, an elliptical arc shape) along the +Y side portion of the outer peripheral edge of the substrate 1. The shape of the cross section orthogonal to the length direction of the first protruding wall 41 is, for example, a rectangular shape (see FIG. 4). The first protruding wall 41 restricts the movement of the substrate 1 in the +Y direction. The first protruding wall 41 can also restrict the movement of the substrate 1 in the +X and -X directions. Since the first protruding wall 41 can restrict the movement of the substrate 1, it is possible to make it difficult for the substrate 1 to be displaced.

[0042] The second protruding wall 42 is a rib-shaped protrusion. The second protruding wall 42 protrudes from the main surface 31a toward the +Z side. The second protruding wall 42 extends along the periphery of the -Y side portion of the main board portion 31. The height of the second protruding wall 42 from the bottom surface 43a is the same as or greater than the thickness of the substrate 1.

[0043] The second protruding wall 42 faces a part of the outer peripheral edge of the substrate 1 (the -Y side portion). The inner peripheral surface of the second protruding wall 42 has a curved shape along the -Y side portion of the outer peripheral edge of the substrate 1. The shape of the cross section orthogonal to the length direction of the second protruding wall 42 is, for example, a rectangular shape (see FIG. 4). The second protruding wall 42 restricts the movement of the substrate 1 in the -Y direction. The second protruding wall 42 can also restrict the movement of the substrate 1 in the +X and -X directions. Since the second protruding wall 42 can restrict the movement of the substrate 1, it is possible to make it difficult for the substrate 1 to be displaced.

[0044] The second protruding wall 42 is formed at a position away from the first protruding wall 41 on the -Y side. A gap through which the second antenna 2 can pass is secured between the +X side end of the first protruding wall 41 and the +X side end of the second protruding wall 42. A gap through which the second antenna 2 can pass is also secured between the -X side end of the first protruding wall 41 and the -X side end of the second protruding wall 42.

[0045] A holding portion 43, which is a space capable of accommodating the substrate 1, is formed between the first protruding wall 41 and the second protruding wall 42. The holding portion 43 has a shape corresponding to the substrate 1 in a plan view. The holding portion 43 is formed by the first protruding wall 41 and the second protruding wall 42. The holding portion 43 can hold the substrate 1.

[0046] When the substrate 1 and the holding portion 43 are non-circular in a plan view, tilting of the substrate 1 around the Z axis can be restricted, and the correct posture of the substrate 1 can be maintained. Therefore, good electromagnetic field coupling between the first antenna 12 and the electromagnetic field coupling portion 21 can be maintained.

[0047] A housing recess 37 and a housing groove 34 are formed in the bottom surface 43a of the holding portion 43. The housing recess 37 can accommodate at least a part of the IC chip 11. The housing recess 37 has a first recess 38 and a second recess 39. The first recess 38 is, for example, rectangular in a plan view. The second recess 39 is formed at the central portion of the bottom surface of the first recess 38. The second recess 39 is, for example, a through hole that penetrates the main board portion 31 in the thickness direction. The second recess 39 is, for example, circular in a plan view. Since the second recess 39 is a through hole, when incorporating the substrate 1 into the holding portion 43 in the manufacture of the RFID tag 10, the air between the substrate 1 and the holding portion 43 can be discharged to the outside.

[0048] The accommodation groove 34 accommodates the electromagnetic coupling portion 21 of the second antenna 2 (see FIG. 4). The accommodation groove 34 has a non-linear shape corresponding to the electromagnetic coupling portion 21 in a plan view. The accommodation groove 34 has a curved shape (for example, an elliptical arc shape) along the electromagnetic coupling portion 21 in a plan view. For example, the accommodation groove 34 has a semi-elliptical shape extending from one vertex (the vertex intersecting the major axis) to the other vertex (the vertex intersecting the major axis) of the ellipse.

[0049] As shown in FIG. 5, the cross section orthogonal to the length direction of the accommodation groove 34 is, for example, rectangular. The width W1 of the accommodation groove 34 is preferably larger than the outer diameter φ of the electromagnetic coupling portion 21. When the width W1 of the accommodation groove 34 is larger than the outer diameter φ of the electromagnetic coupling portion 21, the electromagnetic coupling portion 21 is accommodated in the accommodation groove 34 in a state where it can be displaced in the wire diameter direction (for example, the Y direction).

[0050] The width W1 can be, for example, 0.35 mm or more. The width W1 can be, for example, 0.55 mm or less. The outer diameter φ of the electromagnetic coupling portion 21 can be, for example, 0.25 mm to 0.35 mm.

[0051] The depth D1 of the accommodation groove 34 is preferably the same as or larger than the outer diameter φ of the electromagnetic coupling portion 21. When the depth D1 of the accommodation groove 34 is larger than the outer diameter φ of the electromagnetic coupling portion 21, the electromagnetic coupling portion 21 is accommodated in a state where it can be displaced in the wire diameter direction (for example, the Z direction). The electromagnetic coupling portion 21 may also be displaceable in the length direction with respect to the accommodation groove 34. The depth D1 can be, for example, 0.3 mm or more. The depth D1 can be, for example, 0.5 mm or less.

[0052] Most of the opening of the accommodation groove 34 is blocked by the substrate 1. Therefore, the electromagnetic coupling portion 21 in the accommodation groove 34 is restricted from rising by the substrate 1.

[0053] The support 3 is not fixed to the second antenna 2. That is, the support 3 is non-fixed with respect to the second antenna 2.

[0054] The overall thickness T2 of the RFID tag 10 (see FIG. 4) can be, for example, 1.5 mm or less (preferably 1.0 mm or less). Thereby, when the RFID tag 10 is installed on an article to be installed, the RFID tag 10 is less likely to be conspicuous. The thickness T2 can be, for example, 0.8 mm or more.

[0055] The article on which the RFID tag 10 is to be installed is not particularly limited. The RFID tag 10 may be provided on the surface of the article or embedded in the article. The article to be installed may be, for example, an elastic body made of rubber, resin, or the like.

[0056] [Effects Exhibited by the RFID Tag of the First Embodiment] In the RFID tag 10, since the accommodation groove 34 for accommodating the electromagnetic field coupling portion 21 is formed on the bottom surface 43a of the holding portion 43 that holds the substrate 1, the substrate 1 can regulate the electromagnetic field coupling portion 21 from coming off the accommodation groove 34. Therefore, the second antenna 2 can be stably held without using a lid portion that covers the main board portion 31. Since the lid portion is unnecessary for the RFID tag 10, it can be made thinner. Thus, when the RFID tag 10 is installed on an article to be installed, the RFID tag 10 can be made less conspicuous.

[0057] In the RFID tag 10, since the electromagnetic field coupling portion 21 is located at a position facing the first antenna 12, the support 3 can be made smaller than when the electromagnetic field coupling portion 21 is outside the substrate 1 in plan view. Therefore, the RFID tag 10 can be miniaturized.

[0058] In the RFID tag 10, since the electromagnetic field coupling portion 21 faces the first antenna 12, the distance between the electromagnetic field coupling portion 21 and the first antenna 12 can be reduced. Therefore, the electromagnetic field coupling portion 21 can be sufficiently electromagnetically coupled to the first antenna 12. Thus, the RFID tag 10 can enhance communication performance.

[0059] Since the accommodation recess 37 for accommodating the IC chip 11 is formed in the bottom surface 43a of the holding portion 43, even though the IC chip 11 protrudes from the first main surface 1a, the substrate 1 can be held by the holding portion 43 in an appropriate posture.

[0060] Since the accommodation recess 37 is formed in the bottom surface 43a in the same manner as the accommodation groove 34, further thinning of the RFID tag 10 can be achieved as compared with the case where the accommodation recess 37 and the accommodation groove 34 are formed on different surfaces.

[0061] Since the accommodation recess 37 penetrates the main board portion 31, even when the IC chip 11 protrudes greatly from the first main surface 1a, the substrate 1 can be held by the holding portion 43 in an appropriate posture.

[0062] In the substrate 1, since the first antenna 12 is covered with the insulating coating 14, a short circuit between the first antenna 12 and the second antenna 2 can be avoided. Therefore, a decrease in the performance of the RFID tag 10 due to a short circuit can be suppressed.

[0063] Since the electromagnetic coupling portion 21 and the accommodation groove 34 are non-linear, the movement of the electromagnetic coupling portion 21 can be restricted by the accommodation groove 34. Therefore, displacement of the second antenna 2 with respect to the support 3 is unlikely to occur.

[0064] In the RFID tag 10, when the electromagnetic coupling portion 21 of the second antenna 2 is accommodated in the accommodation groove 34 in a state where it can be displaced in the wire diameter direction, when an external force acts on the second antenna 2, the stress in the second antenna 2 can be relaxed. Therefore, breakage of the second antenna 2 can be made less likely to occur.

[0065] Since the electromagnetic coupling portion 21 of the second antenna 2 has a curved shape (for example, a semi-elliptical shape), even when an external force acts on the second antenna 2, stress concentration is less likely to occur compared to the case of a rectangular shape. Therefore, breakage of the second antenna 2 can be made less likely to occur.

[0066] [Non-contact data transmitter and receiver] (Second Embodiment) FIG. 7 is a perspective view of the RFID tag 110 according to the second embodiment. FIG. 8 is an explanatory view showing a method of manufacturing the RFID tag 110. In FIG. 7, illustration of the second antenna 2 is omitted. Regarding the common configuration with the RFID tag 10 (see FIG. 3) of the first embodiment, the same reference numerals are given and the description thereof is omitted.

[0067] As shown in FIG. 7, the RFID tag 110 is different from the RFID tag 10 (see FIG. 3) in that a support 103 is used instead of the support 3. A plurality of holding protrusions 134 are formed on the upper surfaces 41a and 42a of the first protruding wall 41 and the second protruding wall 42 of the support 103. The holding protrusions 134 are formed in a disc shape.

[0068] A part of the holding protrusion 134 protrudes inward from the inner peripheral surface of the first protruding wall 41 in a plan view. The protruding portion of the holding protrusion 134 is heat-welded to the upper surface of the substrate 1. The holding protrusion 134 can regulate the upward movement of the substrate 1. The holding protrusion 134 is formed of, for example, a thermoplastic resin.

[0069] As shown in FIG. 8, in order to manufacture the RFID tag 110, the following method can be adopted. A support 103A having protrusions 134A formed on the upper surfaces 41a and 42a of the first protruding wall 41 and the second protruding wall 42 is prepared. The protrusions 134A are, for example, columnar. The protrusions 134A are formed of, for example, a thermoplastic resin.

[0070] After holding the substrate 1 (see FIG. 7) in the holding portion 43, a heated metal pressing body is pressed against the tip of the protrusion 134A. The protrusion 134A is softened by heating with the pressing body and is crushed and deformed into a disc shape. Thereby, the holding protrusion 134 (see FIG. 7) is formed.

[0071] The RFID tag 110 of the present embodiment has the same effects as the RFID tag 10 (see FIG. 3). In the RFID tag 110, the holding protrusion 134 makes it difficult for the substrate 1 to fall off from the support 103. In the RFID tag 110, since the holding protrusion 134 is thermally welded to the substrate 1, the substrate 1 can be fixed to the support 103.

[0072] [Non-contact data transmitter] (Third embodiment) FIG. 9 is a perspective view of the RFID tag 210 according to the third embodiment. FIG. 10 is an explanatory diagram showing a manufacturing method of the RFID tag 210. In FIG. 9, the illustration of the second antenna 2 is omitted. For the common configurations with other embodiments, the same reference numerals are given and the description is omitted.

[0073] As shown in FIG. 9, the RFID tag 210 is different from the RFID tag 10 (see FIG. 3) in that the substrate 201 is used instead of the substrate 1 and the support 203 is used instead of the support 3.

[0074] The substrate 201 has one or more insertion holes 1b. The insertion hole 1b is a through hole that penetrates the substrate 201 in the thickness direction. The support 203 has one or more holding protrusions 234 formed on the bottom surface 43a of the holding portion 43. The holding protrusion 234 includes an insertion portion 235 and a flange portion 236. The insertion portion 235 is inserted into the insertion hole 1b of the substrate 201. The flange portion 236 is formed on the insertion portion 235. The outer diameter of the flange portion 236 is larger than the inner diameter of the insertion hole 1b.

[0075] The flange portion 236 is located at a position higher than the upper surface of the substrate 201. The flange portion 236 is thermally welded to the upper surface of the substrate 201. The flange portion 236 can restrict the upward movement of the substrate 201. The holding protrusion 234 is formed of, for example, a thermoplastic resin.

[0076] As shown in FIG. 10, in order to manufacture the RFID tag 210, the following method can be adopted. Prepare a support 203A having a protrusion 234A formed on the bottom surface 43a of the holding portion 43. The protrusion 234A is formed of, for example, a thermoplastic resin.

[0077] The holding part 43 holds the substrate 201 (see FIG. 9). At this time, the protrusion 234A is inserted into the insertion hole 1b. A heated metal pressing body is pressed against the tip of the protrusion 234A. By heating by the pressing body, the upper part of the protrusion 234A is softened, crushed, and deformed into a flange shape. Thereby, the flange part 236 (see FIG. 9) is formed.

[0078] The RFID tag 210 of this embodiment has the same effect as the RFID tag 10 (see FIG. 3). In the RFID tag 210, the substrate 1 is less likely to fall off from the support 203 due to the holding protrusion 234. In the RFID tag 210, since the flange part 236 is thermally welded to the substrate 201, the substrate 201 can be fixed to the support 203.

[0079] FIG. 11 is a schematic cross-sectional view showing a modified example of the support 3, which is a support 303. As shown in FIG. 11, the inner side surfaces 341b of the first protruding wall 341 and 342b of the second protruding wall 342 of the support 303 are inclined surfaces that incline inward toward the upper side (+Z side). The distance L1 between the upper end of the first protruding wall 341 and the upper end of the second protruding wall 342 is smaller than the outer dimension L2 of the substrate 1. The distance L3 between the lower end of the first protruding wall 341 and the lower end of the second protruding wall 342 is larger than the outer dimension L2 of the substrate 1. The substrate 1 can be press-fitted into the holding part 343 while pushing the protruding walls 341, 342 apart. The substrate 1 accommodated in the holding part 343 is restricted from rising by the inner side surfaces 341b, 342b. Therefore, the substrate 1 is less likely to fall off from the support 303.

[0080] FIG. 12 is a schematic cross-sectional view showing a modified example of the substrate 1, which is a substrate 401. As shown in FIG. 12, the end surface of the substrate 401 has a shape having an inverted V-shaped protruding part 404. The outer dimension L4 of the substrate 401 is larger than the inner dimension L5 of the holding part 43 of the support 3. Therefore, when the substrate 401 is press-fitted into the holding part 43, the tip of the protruding part 404 is locked to the inner side surfaces 41b, 42b of the protruding walls 41, 42, thereby restricting the rising of the substrate 401. Therefore, the substrate 401 is less likely to fall off from the support 3.

[0081] As described above, embodiments of the present invention have been explained. However, each configuration and their combinations in the embodiments are merely examples, and additions, omissions, substitutions, and other modifications of the configuration are possible without departing from the spirit of the present invention. In the RFID tag 10 shown in FIG. 3, the first antenna 12 is provided on the first main surface 1a (lower surface) of the substrate 1. However, the first antenna 12 may be provided on the surface (upper surface) opposite to the first main surface 1a. Even in this case, if the electromagnetic coupling portion 21 and the first antenna 12 are in a close position in a plan view, it can be said that the electromagnetic coupling portion 21 faces the first antenna 12. The first antenna 12 may be embedded in the base material 13.

[0082] In the examples shown in FIGS. 4 and 5, the insulating coating 14 is formed on both surfaces of the substrate 1. However, the insulating coating 14 only needs to be formed so as to cover at least the first antenna 12. For example, the insulating coating 14 may be formed only on the first main surface 13b. The insulating coating 14 may be formed only in the region of the first main surface 13b where the first antenna 12 is formed. The second antenna 2 shown in FIG. 1 etc. is a linear body, but the shape of the second antenna is not particularly limited. The second antenna may be, for example, a plate-like body.

Description of reference numerals

[0083] 1,201,401... substrate, 1a... first main surface, 2... second antenna, 3,103,203,303... support, 10,110,210... RFID tag (non-contact data transmitter), 11... IC chip, 12... first antenna, 14... insulating coating, 21... electromagnetic coupling portion, 34... receiving groove, 37... receiving recess, 43,343... holding portion, 43a... bottom surface

Claims

1. A substrate having an IC chip and a first antenna formed on a first main surface, a second antenna having an electromagnetic field coupling portion electromagnetically coupled to the first antenna, and a plate-like support for supporting the substrate and the second antenna, wherein a holding portion for holding the substrate is formed on the support, a housing groove for housing the electromagnetic field coupling portion is formed on a bottom surface of the holding portion, the electromagnetic field coupling portion housed in the housing groove faces the first antenna, a non-contact data transceiver.

2. The IC chip is formed to protrude from the first main surface of the substrate, and a housing recess for housing at least a part of the IC chip is formed on the bottom surface, The non-contact data transceiver according to Claim 1.

3. The housing recess is formed to penetrate the support in a thickness direction, The non-contact data transceiver according to Claim 2.

4. The first antenna is covered with an insulating coating, The non-contact data transceiver according to Claim 1.

5. The electromagnetic field coupling portion of the second antenna is non-linear, and the housing groove is non-linear according to the electromagnetic field coupling portion, The non-contact data transceiver according to Claim 1.

6. The substrate is fixed to the support by thermal welding, The non-contact data transceiver according to any one of Claims 1 to 5.

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