Control device and drive device

Abstract

To provide a control device capable of inhibiting increase in size while cooling an electronic component efficiently, and to provide a drive device.SOLUTION: In a drive device 1, a control device 7 located above a motor 2 and configured to control the motor has: a power module 11; a first electronic component 14 having a function of one of voltage adjustment, current distribution, and a capacitor; and a housing 6C which houses the power module 11 and the first electronic component 14. The housing 6C has: a case part 61A having an opening which is open to the upper side; and a lid part 64 which covers the opening. The lid part 64 is provided with a passage. The passage 90 has cooling passage parts 90A, 90B which overlap with at least one of the power module 11 and the first electronic component 14 in a vertical direction.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a control device and a drive device.

Background Art

[0002] In a control device for controlling a motor, a plurality of electronic components are provided as heating elements. The control device is provided with a flow path for cooling the electronic components (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The plurality of electronic components each have a different heat generation amount. For this reason, in the control device, simply arranging the electronic components along the flow path not only increases the size of the control device, but also cannot sufficiently increase the cooling efficiency for each electronic component.

[0005] In view of the above circumstances, one object of the present invention is to provide a control device and a drive device that can efficiently cool electronic components while suppressing an increase in size.

Means for Solving the Problems

[0006] One aspect of the drive device of the present invention is a control device located above the motor for controlling the motor, comprising a power module, a first electronic component having any one of the functions of voltage regulation, current distribution, or a capacitor, and a housing for housing the power module and the first electronic component. The housing includes a case portion having an opening that opens upward, and a lid portion that covers the opening. A flow path is provided in the lid portion. The flow path has a cooling flow path portion that overlaps at least one of the power module or the first electronic component in the vertical direction.

[0007] One aspect of the drive device of the present invention includes the above-described control device, the motor, and a motor housing for housing the motor. The housing and the motor housing are connected to each other.

Advantages of the Invention

[0008] One of the objectives of one aspect of the present invention is to provide a control device and a drive device that can suppress the increase in size while efficiently cooling electronic components.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

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Figure 7

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Figure 11

Figure 12

Figure 13

BEST MODE FOR CARRYING OUT THE INVENTION

[0010] Hereinafter, the drive device of the embodiment will be described with reference to the drawings. In the following description, the direction of gravity is defined based on the positional relationship when the drive device is mounted on a vehicle located on a horizontal road surface. In addition, appropriate XYZ coordinates are shown in each figure. The Z-axis is in the vertical direction, the +Z side is the upper side, and the -Z side is the lower side. The Y-axis is the left-right direction of the vehicle on which the drive device is mounted. The X-axis is the front-rear direction of the vehicle on which the drive device is mounted.

[0011] In the following description, unless otherwise specified, the direction parallel to the first axis J1 of the motor 2 (Y-axis direction) is simply referred to as the "axial direction Y", the radial direction centered on the first axis J1 is simply referred to as the "radial direction", and the circumferential direction centered on the first axis J1, that is, the axis around the first axis J1 is simply referred to as the "circumferential direction". Furthermore, in the following description, the direction parallel to the Z-axis is referred to as the vertical direction Z.

[0012] In addition, in the following description, the direction parallel to the Z-axis is referred to as the "vertical direction Z", and one direction orthogonal to the vertical direction Z is defined as the first direction D1. In this specification, the first direction D1 is orthogonal not only to the vertical direction Z but also to the axial direction Y, and is a direction parallel to the X-axis direction. However, the first direction D1 may be a direction intersecting the X-axis direction, or may be a direction parallel to the axial direction Y.

[0013] In the following description, one side of the first direction D1 is the direction (+D1) in which the arrow of the first direction D1 in the figure points, and the other side of the first direction D1 is the direction opposite to the direction in which the arrow of the first direction D1 in the figure points (-D1).

[0014] <Drive device> FIG. 1 is a perspective view of the drive device 1 of the present embodiment. The drive device 1 of the present embodiment is mounted on a vehicle having a motor 2 as a power source, such as a hybrid vehicle (HEV), a plug-in hybrid vehicle (PHV), or an electric vehicle (EV), and is used as the power source thereof.

[0015] The drive device 1 includes a motor 2, a transmission mechanism 3, and a control device 7. Further, as will be described later, the motor 2 has a motor housing 6A, the transmission mechanism 3 has a gear housing 6B, and the control device 7 has an electronic component housing (housing) 6C. The motor housing 6A, the gear housing 6B, and the electronic component housing 6C are connected to each other to form a housing connection body 6. That is, the housing connection body 6 houses the motor 2, the transmission mechanism 3, and the control device 7.

[0016] The housing connection body 6 is configured by combining a plurality of members. The housing connection body 6 has a housing main body 61, a first lid member 63, a second lid member 62, and a third lid member (lid portion) 64. A part of the housing main body 61 and the first lid member 63 constitute the motor housing 6A. A part of the housing main body 61 and the second lid member 62 constitute the gear housing 6B. A part of the housing main body 61 and the third lid member 64 constitute the electronic component housing 6C.

[0017] <Motor> FIG. 2 is a schematic cross-sectional view of the drive device 1 of the present embodiment. The motor 2 of the present embodiment is, for example, an inner rotor type three-phase AC motor. The motor 2 has both a function of outputting power as a motor and a function of generating electricity as a generator. The motor 2 may be used as either an engine or a generator. Further, the configuration of the motor 2 is not limited to the present embodiment, and for example, an AC motor with four or more phases may be used.

[0018] The motor 2 has a rotor 20, a stator 25, and a motor housing 6A. The rotor 20 is rotatable about a first axis J1. The rotor 20 is rotatably supported by the motor housing 6A via a bearing (not shown). The stator 25 is located radially outside the rotor 20 and surrounds the rotor 20 from the radially outside. The stator 25 is fixed to the inner surface of the motor housing 6A.

[0019] The motor housing 6A houses the rotor 20 and the stator 25. The motor housing 6A has a cylindrical tubular portion 6d centered on the first axis J1 and a first lid member 63 that covers the opening on the other axial side (-Y) of the tubular portion 6d. The tubular portion 6d surrounds the stator 25 from the radially outside. The tubular portion 6d is a part of the housing body 61. The first lid member 63 shown in FIG. 1 is fastened to the tubular portion 6d.

[0020] <Transmission mechanism> As shown in FIG. 1, the transmission mechanism 3 is located on one axial side (+Y) of the motor 2. The transmission mechanism 3 is connected to the rotor 20. The transmission mechanism 3 includes a plurality of gears (not shown), a plurality of shafts, and a differential device that transmit the power of the rotor 20, a gear housing 6B that houses these, and an output shaft 55 that outputs the power of the rotor 20. The differential device transmits the same torque to a pair of output shafts 55 while absorbing the speed difference between the left and right wheels during a vehicle turn. The output shaft 55 is rotatable about a second axis J3 parallel to the first axis J1. A wheel (not shown) is provided on each of the pair of output shafts 55. In the present embodiment, the output shaft 55 is located on the other side (-D1) in the first direction with respect to the first axis J1.

[0021] <Control device> The control device 7 controls the motor 2. The control device 7 has at least the function of an inverter. That is, the control device 7 is connected to the battery and converts the direct current supplied from the battery into an alternating current. Further, the control device 7 is connected to the stator 25 and supplies an alternating current to the stator 25. The control device 7 is located above the motor 2 and on the other axial side (-Y) of the transmission mechanism 3.

[0022] As shown in FIG. 2, the control device 7 of the present embodiment includes a power module 11, a power integration system (first electronic component) 12, a current distribution unit (second electronic component) 13, a capacitor (second electronic component) 14, a heating device 15, and an electronic component housing 6C. Note that the electronic components provided in the control device 7 are not limited to those described above. Further, the control device 7 may further include electronic components other than the above-described electronic components.

[0023] The power module 11 includes, for example, a switching element, a circuit board on which the switching element is mounted, and a heat sink in contact with the switching element. The switching element is, for example, an insulated gate bipolar transistor (IGBT: Insulated Gate Bipolar Transistor). Further, the switching element may be a field effect transistor such as a metal oxide semiconductor field effect transistor (MOSFET; Metal-Oxide-Semiconductor Field-Effect Transistor).

[0024] The power integration system 12 has a voltage regulation function. The power integration system 12 of this embodiment has, for example, an on-board charger (OBC) 12a and a DC / DC converter 12b. The on-board charger 12a is a system that converts the AC voltage supplied via a plug into a DC voltage and charges the battery. The DC / DC converter 12b is a part that converts the voltage supplied from the battery and charges other low-voltage batteries. Note that the power integration system 12 only needs to have at least one of the DC / DC converter 12b or the on-board charger 12a. Note that the DC / DC converter 12b may boost the voltage supplied from the battery and supply it to other electronic components or the like.

[0025] The current distribution unit 13 is a power distribution unit (PDU) that has a current distribution function. The current distribution unit 13 is a part that distributes the current supplied from the battery to various electrical components in the vehicle including the power module 11.

[0026] The capacitor 14 is, for example, a film capacitor. The capacitor 14 is connected between the battery (not shown) and the power module 11. The capacitor 14 is provided to smooth the DC current supplied to the power module 11.

[0027] The heating device 15 includes a heater unit 15a and a heater control unit (control unit) 15b. A pipeline P is connected to the heater unit 15a. The pipeline P is a circulation path for circulating a fluid such as water, refrigerant, or air. An external device to be heated by the heater unit 15a is connected in the path of the pipeline P. The external device to be heated by the heating device 15 is, for example, a battery. The heating device 15 heats the fluid in the pipeline P in the heater unit 15a and heats the battery through this fluid. The heater control unit 15b is connected to a temperature sensor (not shown) that measures the temperature of the battery. The heater control unit 15b controls the heater unit 15a according to the temperature of the battery detected by the temperature sensor. Note that the heating device 15 may be used as a heater in heating equipment.

[0028] The electronic component housing 6C houses the power module 11, the power integration system 12, the current distribution unit 13, the capacitor 14, and the heater control unit 15b. The electronic component housing 6C includes a case part 61A and a third lid member 64.

[0029] The case part 61A of the present embodiment is a part of the housing main body 61. The case part 61A and the cylindrical part 6d are parts of a single member. Further, the case part 61A is located above the cylindrical part 6d and is connected to the cylindrical part 6d. That is, the case part 61A is connected to the motor housing 6A. The case part 61A has a first opening 61h that opens upward (+Z).

[0030] The case portion 61A has a first bottom wall portion 61b, a first side wall portion 61c, and a first flange portion 61f. The first bottom wall portion 61b extends along a plane orthogonal to the vertical direction Z. The first bottom wall portion 61b is integrally connected to the cylindrical portion 6d. The first bottom wall portion 61b has a shared wall portion 61n that also functions as a part of the cylindrical portion 6d. In the present embodiment, the shared wall portion 61n is curved in a substantially arc shape around the central axis J. The first bottom wall portion 61b has an outer surface 61g facing the lower side (-Z) and a first inner surface 61k facing the upper side (+Z). The first side wall portion 61c extends upward (+Z) from the outer edge of the first bottom wall portion 61b. The first flange portion 61f is provided at the upper end of the first side wall portion 61c. The first flange portion 61f surrounds the first opening 61h in a frame shape. The first flange portion 61f protrudes in a direction away from the first opening 61h along a plane orthogonal to the vertical direction Z.

[0031] The third lid member 64 is located above the case portion 61A. The third lid member 64 is connected to the upper side (+Z) of the case portion 61A. The third lid member 64 has a second opening 64h that opens downward (-Z). The third lid member 64 has a second bottom wall portion 64b, a second side wall portion 64c, and a second flange portion 64f. The second bottom wall portion 64b extends along a plane orthogonal to the vertical direction Z. The second bottom wall portion 64b has a second inner surface 64k facing the lower side (-Z). The second side wall portion 64c extends downward (-Z) from the outer edge of the second bottom wall portion 64b. The second flange portion 64f is provided at the lower end of the second side wall portion 64c. The fourth flange portion 64f surrounds the second opening 64h in a frame shape. The second flange portion 64f protrudes in a direction away from the second opening 64h along a plane orthogonal to the vertical direction Z.

[0032] The first flange portion 61f and the second flange portion 64f face each other in the vertical direction Z. The first flange portion 61f and the second flange portion 64f are fastened to each other. Thereby, the case portion 61A and the third lid member 64 are connected to each other. Also, the third lid member 64 covers the first opening 61h, and the case portion 61A covers the second opening 64h. Thereby, the internal space of the case portion 61A and the internal space of the third lid member 64 are connected, and the internal space A1 of the electronic component housing 6C is formed. A seal member may be sandwiched between the first flange portion 61f and the second flange portion 64f.

[0033] The internal space A1 of the electronic component housing 6C is surrounded by the first bottom wall portion 61b, the second bottom wall portion 64b, the first side wall portion 61c, and the second side wall portion 64c. The first inner surface 61k of the first bottom wall portion 61b and the second inner surface 64k of the second bottom wall portion 64b face each other in the vertical direction Z. The power integration system 12, the current distribution unit 13, and the heater control unit 15b of the present embodiment are fixed to the first inner surface 61k. In particular, in the present embodiment, the power integration system 12 is fixed to the shared wall portion 61n. Therefore, the power integration system 12 is fixed to the cylindrical portion 6d. Also, the power module 11 and the capacitor 14 of the present embodiment are fixed to the second inner surface 64k. Further, in the present embodiment, the heater portion 15a is fixed to the outer surface 61g of the case portion 61A.

[0034] In the present embodiment, a plurality of support portions 61u protruding upward (+Z) are provided on the first inner surface 61k. The plurality of support portions 61u support the power integration system 12, the current distribution unit 13, and the heater control unit 15b, respectively. The first inner surface 61k contacts the power integration system 12, the current distribution unit 13, and the heater control unit 15b at the upper end surfaces of the plurality of support portions 61u. Note that the support portions 61u may not be provided on the first inner surface 61k. In this case, the first inner surface 61k directly contacts the power integration system 12, the current distribution unit 13, and the heater control unit 15b.

[0035] The housing connector 6 is provided with a flow path 90. The flow path 90 is a path through which fluid flows. A part of the flow path 90 is constituted by a hole provided in the housing connector 6. Also, another part of the flow path 90 is constituted by the inner surface of a recess provided in the housing connector 6 and a member covering the recess. In this specification, the flow path 90 does not necessarily represent a single circulation path and may include a plurality of circulation paths. When the flow path 90 has a plurality of circulation paths, the fluids flowing through the respective circulation paths may be of the same type or different types. The fluid flowing through the flow path 90 is, for example, water, oil, or an aqueous ethylene glycol solution.

[0036] The flow path 90 of the present embodiment has a first flow path portion 91, a connecting flow path portion 95, and a third flow path portion 94. The first flow path portion 91 and the connecting flow path portion 95 are provided in the electronic component housing 6C. The third flow path portion 94 is provided in the motor housing 6A.

[0037] In the present embodiment, the first flow path portion 91, the connecting flow path portion 95, and the third flow path portion 94 constitute a single circulation path. Therefore, the same fluid flows through the first flow path portion 91, the connecting flow path portion 95, and the third flow path portion 94 of the present embodiment. In the present embodiment, the fluid flows through each part of the flow path 90 in the order of the first flow path portion 91, the connecting flow path portion 95, and the third flow path portion 94. Also, the downstream end of the third flow path portion 94 and the upstream end of the first flow path portion 91 are connected to each other via a flow path portion (not shown). Note that a pump for pumping the fluid and a radiator for cooling the fluid may be provided in this flow path portion.

[0038] The first flow path portion 91 is provided in the second bottom wall portion 64b. That is, the first flow path portion 91 is provided in the third lid member 64. The first flow path portion 91 of the present embodiment extends along the axial direction Y. However, the first flow path portion 91 may extend in any direction as long as it extends along a plane orthogonal to the vertical direction Z. One end portion of the first flow path portion 91 opens at the lower surface of the second flange portion 64f. The first flow path portion 91 is connected to the connecting flow path portion 95 at one end portion that opens at the lower surface of the second flange portion 64f.

[0039] The first flow path portion 91 has an opening portion 91a that opens to the second inner surface 64k of the second bottom wall portion 64b. The opening portion 91a opens downward (-Z). The power module 11 has a heat sink that covers the opening portion 91a. The heat sink contacts the fluid flowing through the first flow path portion 91. The heat sink preferably has a plurality of fins or pins disposed inside the first flow path portion 91. The fluid flowing through the first flow path portion 91 cools the power module 11 by contacting the heat sink. That is, the first flow path portion 91 cools the power module 11. Note that the structure for cooling the power module 11 by the fluid flowing through the first flow path portion 91 is not limited to this embodiment.

[0040] In the present embodiment, the first flow path portion 91 provided in the third lid member 64 has a cooling flow path portion 90A. The cooling flow path portion 90A is a region of the first flow path portion 91 that overlaps at least one of the power module 11 or the power integration system 12 in the vertical direction Z. According to the present embodiment, since the cooling flow path portion 90A overlaps the power module 11 or the power integration system 12 in the vertical direction Z, the power module 11 or the power integration system 12 can be cooled. In the present embodiment, the cooling flow path portion 90A overlaps both the power module 11 and the power integration system 12. The cooling flow path portion 90A of the present embodiment is provided in the second bottom wall portion 64b to which the power module 11 is fixed. Therefore, the cooling flow path portion 90A can effectively cool the power module 11. Heat is not directly transferred from the power integration system 12 to the cooling flow path portion 90A of the present embodiment. However, since the cooling flow path portion 90A overlaps the power integration system 12 in the vertical direction Z, for example, by adopting a structure in which heat is easily transferred between the second bottom wall portion 64b and the power integration system 12, the power integration system 12 can be cooled. That is, the cooling flow path portion 90A overlaps the power integration system 12 in the vertical direction Z, making it easier for heat to be transferred from the power integration system 12. As a structure in which heat is easily transferred, a structure such as disposing a heat transfer material in the vertical direction Z gap between the second bottom wall portion 64b and the power integration system 12 can be adopted.

[0041] The cooling channel portion 90A is preferably located above at least one of the power module 11 and the power integration system 12. In the present embodiment, the cooling channel portion 90A is located above both the power module 11 and the power integration system 12. As described above, the cooling channel portion 90A is provided in the third lid member 64 that covers the internal space A1 of the electronic component housing 6C from above. Therefore, by arranging the cooling channel portion 90A above the power module 11 and the power integration system 12 that are disposed in the internal space A1 of the electronic component housing 6C and overlap the cooling channel portion 90A in the vertical direction Z, the structure of the cooling channel portion 90A can be simplified.

[0042] The connection channel portion 95 is provided in the first side wall portion 61c. That is, the connection channel portion 95 is provided in the case portion 61A. The connection channel portion 95 is constituted by a hole portion provided inside the wall of the first side wall portion 61c. The connection channel portion 95 extends along the vertical direction Z. One end portion on the upper side (+Z) of the connection channel portion 95 opens to a surface facing the upper side (+Z) of the first flange portion 61f. By fastening the first flange portion 61f and the second flange portion 64f to each other, the connection channel portion 95 and the first channel portion 91 are connected to each other. That is, one end portion of the connection channel portion 95 is connected to the first channel portion 91. Further, the other end portion located on the lower side (-Z) of the connection channel portion 95 is connected to the third channel portion 94.

[0043] The third channel portion 94 is provided in the cylindrical portion 6d. That is, the third channel portion 94 is provided in the motor housing 6A. The third channel portion 94 of the present embodiment extends spirally along the axial direction Y around the first axis J1. Heat is transferred from the motor 2 to the fluid flowing through the third channel portion 94. That is, the third channel portion 94 cools the motor 2.

[0044] The third flow path portion 94 is not limited to this embodiment as long as it cools the motor 2. The motor 2 may extend while meandering in the axial direction or the circumferential direction inside the wall of the cylindrical portion 6d. Further, the third flow path portion 94 may cool the motor 2 by directly applying a fluid to the motor 2. In this case, the third flow path portion 94 may have a structure in which ejection holes for ejecting the fluid toward the motor 2 are provided in the inner wall of the motor housing 6A, or may be a pipe or a gutter-shaped member that is disposed in the internal space of the motor housing 6A and has ejection holes for ejecting the fluid toward the motor 2.

[0045] The cylindrical portion 6d of the present embodiment has a shared wall portion 61n that also functions as a part of the first bottom wall portion 61b. The third flow path portion 94 passes through the inside of the shared wall portion 61n. Therefore, a part of the third flow path portion 94 is provided in the first bottom wall portion 61b. Thereby, the third flow path portion 94 cools the internal space of the case portion 61A. Further, the power integration system 12 is fixed to the shared wall portion 61n. According to the present embodiment, the third flow path portion 94 can cool the power integration system 12.

[0046] In the present embodiment, the third flow path portion 94 is connected to the first flow path portion 91 via the connection flow path portion 95. Therefore, the third flow path portion 94 of the present embodiment constitutes the same circulation path as the first flow path portion 91. According to the present embodiment, compared with the case where the third flow path portion 94 constitutes a different circulation path from the first flow path portion 91, the flow path 90 can be simplified and the drive device 1 can be downsized as a whole.

[0047] According to the present embodiment, the power module 11 and the power integration system 12 are arranged side by side in the vertical direction Z. For this reason, compared with the case where the power module 11 and the power integration system 12 are arranged side by side in a direction orthogonal to the vertical direction Z, the control device 7 can be downsized in the first direction D1.

[0048] In this embodiment, the power module 11 and the power integration system 12 are located above (+Z) the motor 2. Also, the power integration system 12 is located below (-Z) the power module 11. According to this embodiment, since the power module 11 can be arranged at a position farther from the motor 2 than the power integration system 12, it is possible to suppress the heat of the motor 2 from affecting the operation of the power module 11. Conversely, it is also possible to suppress the heat of the power module 11 from affecting the operation of the motor 2.

[0049] According to this embodiment, the power module 11 is fixed to the third lid member 64, and the power integration system 12 is fixed to the case portion 61A. That is, the power module 11 and the power integration system 12 can be brought into contact with different members (the third lid member 64 and the case portion 61A) of the electronic component housing 6C, respectively. Thereby, it becomes possible to transfer the heat of the power module 11 and the power integration system 12 to different members and dissipate the heat, and the power module 11 and the power integration system 12 can be efficiently cooled. Also, it is possible to suppress the heat of either one of the power module 11 and the power integration system 12 from being transferred to the other.

[0050] According to this embodiment, the heater control unit 15b, which is a part of the heating device 15, is housed in the electronic component housing 6C. Thereby, it becomes possible to protect the heater control unit 15b by the electronic component housing 6C. Furthermore, by arranging the heater control unit 15b inside the electronic component housing 6C, it becomes easier to cool the heater control unit 15b by the flow path 90, and the reliability of the heating device 15 can be increased. In this embodiment, the case where only the heater control unit 15b is housed in the electronic component housing 6C has been described. However, the same effect can be obtained even if both the heater unit 15a and the heater control unit 15b are housed in the electronic component housing 6C.

[0051] In this embodiment, the heater unit 15a of the heating device 15 is fixed to the outer surface of the electronic component housing 6C and is not disposed inside the electronic component housing 6C. According to this embodiment, it is possible to suppress the heat of the heater unit 15a from affecting the electronic components disposed inside the electronic component housing 6C. Note that the heater unit 15a of the heating device 15 may be provided not only on the outer surface of the electronic component housing 6C but also on the outer surface of the motor housing 6A or the gear housing 6B.

[0052] In this embodiment, the case where the cooling channel portion 90A can cool both the power module 11 and the power integration system 12 by overlapping them in the vertical direction Z has been described. However, the cooling channel portion 90A may be capable of cooling other electronic components instead of the power integration system 12. Here, the electronic components other than the power module 11 cooled by the cooling channel portion 90A are referred to as the first electronic component 12. The first electronic component 12 of this embodiment is the power integration system 12, but it may be the current distribution unit 13 or the capacitor 14. That is, the first electronic component 12 only needs to have any one of the functions of voltage adjustment, current distribution, or capacitor. Further, the cooling channel portion 90A is provided on the third lid member 64, and in the vertical direction Z, it only needs to be a part of the channel 90 that overlaps with any one of the power integration system 12, the current distribution unit 13, the capacitor 14, or the power module 11 in the vertical direction Z. Note that in this embodiment, the capacitor 14 may be replaced with the first electronic component, and the portion overlapping with the capacitor 14 in the first channel portion 91 may be replaced with the cooling channel portion 90B. The cooling channel portion 90B in this case cools the capacitor 14. Further, the current distribution unit 13 may be replaced with the first electronic component, and the portion overlapping with the current distribution unit 13 in the first channel portion 91 may be replaced with the cooling channel portion 90B.

[0053] In the present embodiment, the capacitor 14 overlaps with the power module 11 in the first direction D1. Also, the current distribution unit 13 overlaps with the first electronic component 12 in the first direction D1. Here, electronic components other than the power module 11 and the first electronic component 12 that have any one of the functions of voltage adjustment, current distribution, or capacitance are referred to as the second electronic components 13 and 14. The second electronic components 13 and 14 only need to have any one of the functions of voltage adjustment, current distribution, or capacitance. That is, the second electronic components 13 and 14 may be any one of the power integration system 12, the current distribution unit 13, and the capacitor 14. According to the present embodiment, the second electronic components 13 and 14 overlap at least one of the power module 11 or the first electronic component 12 in the first direction D1. According to the present embodiment, by arranging the second electronic components 13 and 14 and the power module 11 or the first electronic component 12 side by side along the first direction D1, it is possible to suppress the control device 7 from increasing in size in the vertical direction Z.

[0054] In the present embodiment, the control device 7 includes a plurality of second electronic components 13 and 14. The plurality of second electronic components 13 and 14 overlap each other in the vertical direction Z. According to the present embodiment, by arranging the plurality of second electronic components 13 and 14 side by side in the vertical direction Z, it is possible to suppress the control device 7 from increasing in size in the direction orthogonal to the vertical direction Z.

[0055] In the present embodiment, it is preferable to arrange the power module 11 and the power integration system 12 such that the vertical direction Z is the thickness direction and they extend along a plane orthogonal to the vertical direction Z. Also, it is preferable that the cooling flow path portion 90A extends along a plane orthogonal to the vertical direction Z. According to the present embodiment, the power module 11 and the power integration system 12 can be arranged to overlap the cooling flow path portion 90A over a wide range in the vertical direction Z, and the cooling efficiency of the power module 11 and the power integration system 12 can be increased. For the same reason, it is also preferable to arrange the power integration system 13 and the capacitor 14 such that the vertical direction Z is the thickness direction and they extend along a plane orthogonal to the vertical direction Z.

[0056] <Modification Example> A modification example of the drive device will be described below. In the description of each modification example described below, components that are the same as those in the embodiments or modification examples already described will be given the same reference numerals and their descriptions will be omitted.

[0057] Also, in the following modification examples as well, similar to the above-described embodiments, the case where the power integration system 12 is the first electronic component 12, and the current distribution unit 13 and the capacitor 14 are the second electronic components 13 and 14 will be described. However, the first electronic component only needs to have any one of the functions of voltage adjustment, current distribution, or capacitor, and can be any of the power integration system 12, the current distribution unit 13, or the capacitor 14. Similarly, the second electronic component only needs to have any one of the functions of voltage adjustment, current distribution, or capacitor among the electronic components other than the first electronic component, and can be any of the power integration system 12, the current distribution unit 13, or the capacitor 14.

[0058] (Modification Example 1) FIG. 3 is a schematic cross-sectional view of the drive device 101 of Modification Example 1. Similar to the above-described embodiments, the drive device 101 of this modification example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 107. The drive device 101 also has a housing connector 106. The housing connector 106 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 106C (housing). A flow path 190 is provided in the housing connector 106.

[0059] The electronic component housing 106C of this modification example houses a power module 11, a power integration system 12, a current distribution unit 13, a capacitor 14, and a heating device 115. The power module 11 and the power integration system 12 are fixed to the second inner surface 64k of the second bottom wall portion 64b. On the other hand, the current distribution unit 13, the capacitor 14, and the heating device 115 are fixed to the first inner surface 61k of the first bottom wall portion 61b.

[0060] The flow path 190 includes a first flow path portion 191, a second flow path portion 192, and a connection flow path portion 95 provided in the electronic component housing 106C, and a third flow path portion 94 provided in the motor housing 6A. The first flow path portion 191 and the second flow path portion 192 are provided on the second bottom wall portion 64b. In this modification, the first flow path portion 191 and the second flow path portion 192 are connected to each other to form the same circulation path. However, the first flow path portion 191 and the second flow path portion 192 may form different circulation paths from each other.

[0061] The first flow path portion 191 of this modification has a cooling flow path portion 190A that overlaps the power module 11 in the vertical direction Z. Also, the second flow path portion 192 of this modification has a cooling flow path portion 190B that overlaps the power integration system 12 in the vertical direction Z. The first flow path portion 191 can cool the power module 11, and the second flow path portion 192 can cool the power integration system 12.

[0062] Similar to the above-described embodiment, the first flow path portion 191 has a first opening portion 191a that opens on the second inner surface 64k of the second bottom wall portion 64b. The first opening portion 191a is covered by the power module 11. The fluid flowing through the first flow path portion 191 contacts the power module 11 at the first opening portion 191a to cool the power module 11.

[0063] The second flow path portion 192 has a second opening portion 192a that opens on the second inner surface 64k of the second bottom wall portion 64b. The second opening portion 192a is covered by the power integration system 12. The fluid flowing through the second flow path portion 192 contacts the power integration system 12 at the second opening portion 192a to cool the power integration system 12. Note that the power integration system 12 includes a heating element and a case portion that houses the heating element. The fluid flowing through the second flow path portion 192 contacts the case portion of the power integration system 12 and cools the heating element through the case portion.

[0064] In this modified example, the first flow path portion 191 and the second flow path portion 192 are arranged side by side in the first direction D1. According to this modified example, compared with the case where the first flow path portion 191 and the second flow path portion 192 are arranged one above the other in the vertical direction Z, the second bottom wall portion 64b can be made thinner and the control device 107 can be downsized in the vertical direction Z.

[0065] In this modified example, the power module 11 and the power integration system 12 are arranged side by side in the first direction D1. According to this modified example, the power module 11 and the power integration system 12 are arranged side by side along the first direction D1. In this modified example, since the power module 11 and the power integration system 12 are relatively large among the electronic components of the control device 107, arranging the power module 11 and the power integration system 12 side by side along the first direction D1 can prevent the control device 107 from being enlarged in the vertical direction Z.

[0066] In this modified example, both the power module 11 and the power integration system 12 are fixed to the third lid member 64. In this modified example, the heat generation amounts of the power module 11 and the power integration system 12 are relatively large among the electronic components of the control device 107. According to this modified example, the flow paths (the first flow path portion 191 and the second flow path portion 192) provided in the third lid member 64 can cool the power module 11 and the power integration system 12 with large heat generation amounts.

[0067] In this modified example, the capacitor 14 is fixed to the shared wall portion 61n. A part of the third flow path portion 94 is provided in the shared wall portion 61n. Therefore, the third flow path portion 94 can cool the capacitor 14. Note that a current distribution portion 13 may be fixed to the shared wall portion 61n. In this case, the third flow path portion 94 can cool the current distribution portion 13.

[0068] In this modified example, the case portion 61A of the electronic component housing 106C houses the heater portion 115a and the heater control portion 115b of the heating device 115. That is, according to this modified example, the entire heating device 115 is arranged in the internal space of the electronic component housing 106C. If a part of the heating device 115 is fixed to the outer surface of the housing connector 106, it may protrude from the outer shape of the driving device, and the driving device may be enlarged. According to this modified example, by arranging the entire heating device 115 (that is, the heater portion 115a and the heater control portion 115b) inside the electronic component housing 106C, the driving device 101 can be miniaturized.

[0069] (Modified Example 2) FIG. 4 is a schematic cross-sectional view of the driving device 201 of Modified Example 2. Similar to the above-described embodiment, the driving device 201 of this modified example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 207. The driving device 201 also has a housing connector 206. The housing connector 206 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 206C (housing). A flow path 190 is provided in the housing connector 206.

[0070] The electronic component housing 206C of this modified example houses a power module 11, a power integration system 12, a current distribution unit 13, and a capacitor 14. The power module 11 and the power integration system 12 are fixed to the second inner surface 64k of the second bottom wall portion 64b. The current distribution unit 13 is fixed to the lower surface of the power module 11. The capacitor 14 is fixed to the lower surface of the power module 11. In this modified example, the arrangements of the power module 11 and the power integration system 12 may be interchanged with each other. In this modified example, the arrangements of the current distribution unit 13 and the capacitor 14 may be interchanged with each other.

[0071] The flow path 190 includes a first flow path portion 191, a second flow path portion 192, and a connecting flow path portion 95 provided in the electronic component housing 206C, and a third flow path portion 94 provided in the motor housing 6A. The first flow path portion 191 has a cooling flow path portion 190A that overlaps with the power module 11 in the vertical direction Z. Further, the second flow path portion 192 of this modification has a cooling flow path portion 190B that overlaps with the power integration system 12 in the vertical direction Z.

[0072] In this modification, the power module 11 is cooled by the first flow path portion 191. Further, the current distribution unit 13 of this modification is attached to the power module 11. According to this modification, by bringing the current distribution unit 13 into contact with the heat sink of the power module 11, the current distribution unit 13 can be cooled by the first flow path portion 191 through the heat sink of the power module 11. Furthermore, the capacitor 14 of this modification is attached to the current distribution unit 13. According to this modification, the capacitor 14 can be cooled by the first flow path portion 191 via the current distribution unit 13 and the power module 11.

[0073] In this modification, the second electronic components 13 and 14 (the current distribution unit 13 and the capacitor 14) overlap with the cooling flow path portion 190A in the vertical direction Z. According to this modification, the second electronic components 13 and 14 can be brought closer to the cooling flow path portion 190A, and it becomes easier to cool the second electronic components 13 and 14 by the cooling flow path portion 190A.

[0074] In this modification, the second electronic components 13 and 14 overlap with the power module 11 in the vertical direction Z. According to this modification, the control device 207 can be miniaturized in a direction orthogonal to the vertical direction Z. In this modification, since the plurality of second electronic components 13 and 14 overlap with each other in the vertical direction Z, the control device 207 can be miniaturized in a direction orthogonal to the vertical direction Z.

[0075] According to this modification example, all the electronic components (power module 11, power integration system 12, current distribution unit 13, and capacitor 14) of the control device 207 are fixed to the third lid member 64. Therefore, before assembling the third lid member 64 to the housing body 61, the connection process between the electronic components can be completed, and the assembly process can be simplified.

[0076] (Modification Example 3) FIG. 5 is a schematic cross-sectional view of the drive device 301 according to Modification Example 3. Similar to the above-described embodiment, the drive device 301 of this modification example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 307. Further, the drive device 301 has a housing connector 306. The housing connector 306 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 306C (housing). A flow path 390 is provided in the housing connector 306.

[0077] In the electronic component housing 306C of this modification example, a power module 11, a power integration system 12, a current distribution unit 13, and a capacitor 14 are accommodated. The power integration system 12 and the current distribution unit 13 are fixed to the second inner surface 64k of the second bottom wall portion 64b. The power module 11 is fixed to the lower surface of the power integration system 12. That is, the power module 11 is disposed below the power integration system 12. The capacitor 14 is fixed to the lower surface of the current distribution unit 13. In this modification example, the arrangements of the power module 11 and the power integration system 12 may be mutually interchanged. In this modification example, the arrangements of the current distribution unit 13 and the capacitor 14 may be mutually interchanged.

[0078] The flow path 390 has a first flow path portion 391 provided in the electronic component housing 306C, a connection flow path portion 95, and a third flow path portion 94 provided in the motor housing 6A. In this modification example, the first flow path portion 391 has a cooling flow path portion 390A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z.

[0079] The first flow path portion 391 of this modification example has an opening 391a that opens to the second inner surface 64k, similar to the above-described embodiment. The opening 391a is covered by the power integration system 12. As a result, the power integration system 12 is cooled by the first flow path portion 391. Also, the power module 11 is attached to the power integration system 12. According to this modification example, the power module 11 can be cooled by the first flow path portion 391 via the case portion of the power integration system 12.

[0080] In this modification example, a part of the first flow path portion 391 overlaps the current distribution portion 13 in the vertical direction Z. The current distribution portion 13 is cooled by the first flow path portion 391. Also, the capacitor 14 attached to the current distribution portion 13 is cooled by the first flow path portion 391 via the current distribution portion 13.

[0081] In this modification example, among the plurality of second electronic components 13, 14 (current distribution portion 13 and capacitor 14), the current distribution portion 13 overlaps the power integration system 12 in the first direction D1. Also, among the plurality of second electronic components 13, 14, the capacitor 14 overlaps the power module 11 in the first direction D1. Therefore, according to this modification example, the control device 307 can be miniaturized in the vertical direction Z. In this modification example, since the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z, the control device 307 can be miniaturized in a direction orthogonal to the vertical direction Z.

[0082] In this embodiment, the power module 11 and the power integration system 12 are arranged above (+Z) the motor 2. Further, the power module 11 is arranged below (-Z) the power integration system 12. The power module 11 is connected to the motor 2 and supplies power to the motor 2. Therefore, if the distance between the power module 11 and the motor 2 increases, the electrical resistance of the connection path (e.g., bus bar) connecting the power module 11 and the motor 2 increases, and there is a risk that the loss when driving the drive device 1 will increase. According to this embodiment, since the power module 11 can be arranged closer to the motor 2 than the power integration system 12, the electrical resistance of the connection path between the power module 11 and the motor 2 can be reduced, and the loss generated in the drive device 1 can be reduced.

[0083] (Modification 4) FIG. 6 is a schematic cross-sectional view of the drive device 401 according to Modification 4. Similar to the above-described embodiment, the drive device 401 of this modification includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 407. Further, the drive device 401 has a housing connecting body 406. The housing connecting body 406 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 406C (housing). A flow path 490 is provided in the housing connecting body 406.

[0084] The electronic component housing 406C of this modification has a case portion 61A and a third lid member 464. Further, the third lid member 464 has a lid body 464A and a flow path member (wall portion) 465. The lid body 464A is located above the first opening 61h of the case portion 61A and is fixed to the case portion 61A. The lid body 464A has a plurality of support pillar portions 464d in addition to the second bottom wall portion 64b, the second side wall portion 64c, and the second flange portion 64f similar to the above-described embodiment. The support pillar portion 464d extends downward (-Z) from the second inner surface 64k of the second bottom wall portion 64b. The flow path member 465 is attached to the lower end portion of the support pillar portion 464d. That is, the flow path member 465 is fixed to the lid body 464A.

[0085] The flow path member 465 is plate-shaped and extends along a plane orthogonal to the vertical direction Z. The flow path member 465 is a so-called water jacket. The flow path member 465 is located between the first bottom wall portion 61b and the second bottom wall portion 64b in the vertical direction Z. The flow path member 465 faces the vertical direction Z with a gap via the first inner surface 61k. Also, the flow path member 465 faces the vertical direction Z with a gap via the second inner surface 64k. The flow path member 465 is located below the lid body 464A and above the case portion 61A.

[0086] In the electronic component housing 406C of this modification example, the power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are housed. The power module 11 is fixed to the second inner surface 64k of the second bottom wall portion 64b. The power integration system 12 is fixed to the upper surface of the flow path member 465. The capacitor 14 is fixed to the upper surface of the power integration system 12. The current distribution portion 13 is fixed to the upper surface of the capacitor 14. Further, the upper surface of the current distribution portion 13 contacts the second bottom wall portion 64b. The current distribution portion 13 and the second bottom wall portion 64b may be in contact via a heat transfer material such as a heat transfer sheet. In this modification example, the arrangements of the current distribution portion 13 and the capacitor 14 may be mutually interchanged.

[0087] The flow path 490 of this modification example has an internal flow path portion (first flow path portion) 491 in addition to the first flow path portion 391, the connection flow path portion 95, and the third flow path portion 94 similar to those in the above-described embodiment or modification example. The first flow path portion 391, the connection flow path portion 95, and the internal flow path portion 491 are provided in the electronic component housing 406C. The third flow path portion 94 is provided in the motor housing 6A.

[0088] In this modification example, the first flow path portion 391 has a cooling flow path portion 490A that overlaps the power module 11 in the vertical direction Z and a cooling flow path portion 490C that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portion 490A has an opening 391a covered by the power module 11.

[0089] The internal flow path portion 491 extends in a meandering manner inside the flow path member 465. That is, the internal flow path portion 491 is provided in the third lid member 464. A fluid cooled by a radiator (not shown) flows through the internal flow path portion 491. The internal flow path portion 491 has a cooling flow path portion 490B that overlaps with the power integration system 12 in the vertical direction Z. The power integration system 12 contacts the upper surface of the flow path member 465. The internal flow path portion 491 cools the power integration system 12. According to this modification, the power integration system 12 can be efficiently cooled using the plate-shaped flow path member 465.

[0090] In this modification, since the current distribution portion 13 contacts the second bottom wall portion 64b, it is cooled by the first flow path portion 391 passing through the inside of the second bottom wall portion 64b. Further, the capacitor 14 contacts the current distribution portion 13 on the upper surface and contacts the power module 11 on the lower surface. Therefore, the capacitor 14 is cooled by the first flow path portion 391 via the current distribution portion 13 and is cooled by the internal flow path portion 491 via the power module 11.

[0091] In this modification, the power integration system 12, the current distribution portion 13, and the capacitor 14 are arranged between the lid main body 464A and the flow path member 465 in the vertical direction Z. Further, the flow path member 465 is provided with a cooling flow path portion 490B. That is, the cooling flow path portion 490B is located below the power integration system 12. According to this modification, the heat of the electronic components (power integration system 12, current distribution portion 13, and capacitor 14) arranged between the lid main body 464A and the flow path member 465 can be transferred to the lid main body 464A and the flow path member 465, and it is possible to prevent the temperature of these electronic components from becoming too high. In this modification, the power module 11 is not arranged between the lid main body 464A and the flow path member 465, but the power module 11 may also be arranged between the lid main body 464A and the flow path member 465. That is, in the vertical direction Z, between the lid main body 464A and the flow path member 465, the power module 11 or the first electronic component 12 (power integration system 12) is arranged, and if the flow path member 465 is provided with the cooling flow path portion 490B, the power module 11 or the first electronic component 12 can be cooled.

[0092] In particular, in this modification example, the power integration system 12, the current distribution unit 13, and the capacitor 14 are arranged between the cooling channel portion 490C of the first channel portion 391 and the cooling channel portion 490B of the internal channel portion 491 in the vertical direction Z. Therefore, the channel 490 can cool the power integration system 12, the current distribution unit 13, and the capacitor 14 from the vertical direction Z. In this modification example, although the power module 11 is not arranged between the first channel portion 391 and the internal channel portion 491, the power module 11 may also be arranged between the first channel portion 391 and the internal channel portion 491. That is, in the vertical direction Z, as long as the power module 11 or the first electronic component 12 (power integration system 12) is arranged between the first channel portion 391 and the internal channel portion 491.

[0093] In this modification example, the cooling channel portion 490B overlaps with the power module 11 in the first direction D1. Therefore, it is possible to suppress the control device 407 from increasing in size in the vertical direction Z. In this modification example, the cooling channel portion 490B of the channel member 465 overlaps with the power integration system 12 in the vertical direction Z and overlaps with the power module 11 in the first direction D1. However, the cooling channel portion 490B may overlap with the power module 11 in the vertical direction Z and overlap with the power integration system 12 in the first direction D1. As long as the cooling channel portion 490B overlaps with at least one of the power module 11 or the first electronic component 12 (power integration system 12) in the first direction D1, it is possible to reduce the size of the control device 407 in the vertical direction Z.

[0094] In this modified example, the plurality of second electronic components 13 and 14 (current distribution unit 13 and capacitor 14) overlap the power integration system 12 in the vertical direction Z. According to this modified example, the control device 407 can be miniaturized in a direction orthogonal to the vertical direction Z. In this modified example, the plurality of second electronic components 13 and 14 overlap the power module 11 in the first direction D1. According to this modified example, the control device 407 can be miniaturized in the vertical direction Z. In this modified example, the plurality of second electronic components 13 and 14 overlap each other in the vertical direction Z. According to this modified example, the control device 407 can be miniaturized in a direction orthogonal to the vertical direction Z.

[0095] (Modified Example 5) FIG. 7 is a schematic cross-sectional view of the drive device 501 of Modified Example 5. Similar to the above-described embodiment, the drive device 501 of this modified example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 507. The drive device 501 also has a housing connector 506. The housing connector 506 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 506C (housing). A flow path 590 is provided in the housing connector 506.

[0096] The electronic component housing 506C of this modified example has a case portion 61A and a third lid member 564. The third lid member 564 has a lid body 564A and a flow path member 465. The lid body 564A has a plurality of support pillar portions 564d in addition to the second bottom wall portion 64b, the second side wall portion 64c, and the second flange portion 64f similar to the above-described embodiment. The support pillar portion 564d extends downward (-Z) from the second inner surface 64k of the second bottom wall portion 64b. A flow path member 465 is attached to the lower end portion of the support pillar portion 564d. The flow path member 465 is located between the first bottom wall portion 61b and the second bottom wall portion 64b in the vertical direction Z. The flow path member 465 faces the vertical direction Z with a gap from the first inner surface 61k. The flow path member 465 also faces the vertical direction Z with a gap from the second inner surface 64k.

[0097] In the electronic component housing 506C of this modification example, a power module 11, a power integration system 12, a current distribution unit 13, and a capacitor 14 are accommodated. The power integration system 12 is fixed to the second inner surface 64k of the second bottom wall portion 64b. The power module 11 is fixed to the upper surface of the flow path member 465. The capacitor 14 is fixed to the upper surface of the power module 11. The current distribution unit 13 is fixed to the upper surface of the capacitor 14. Further, the upper surface of the current distribution unit 13 contacts the second bottom wall portion 64b. The current distribution unit 13 and the second bottom wall portion 64b may be in contact via a heat transfer material such as a heat transfer sheet. According to this modification example, the heat of the current distribution unit 13 can be transferred to the third lid member 564 and dissipated. In this modification example, the arrangements of the power module 11 and the power integration system 12 may be mutually interchanged. In this modification example, the arrangements of the current distribution unit 13 and the capacitor 14 may be mutually interchanged.

[0098] The flow path 590 of this modification example has an internal flow path portion 491 provided in the electronic component housing 506C and a third flow path portion 94 provided in the motor housing 6A. The internal flow path portion 491 meanders and extends inside the flow path member 465. The internal flow path portion 491 is provided in the third lid member 564. The internal flow path portion 491 has a cooling flow path portion 590A that overlaps the power module 11 in the vertical direction Z. The power module 11 contacts the upper surface of the flow path member 465. The cooling flow path portion 590A is located below the power module 11. The internal flow path portion 491 cools the power module 11. According to this modification example, the power module 11 can be efficiently cooled using the plate-shaped flow path member 465. Further, since the capacitor 14 contacts the power module 11 on the lower surface, the capacitor 14 is cooled by the internal flow path portion 491 via the power module 11.

[0099] In this modified example, between the lid body 564A and the flow path member 465 in the vertical direction Z, the power module 11, the current distribution unit 13, and the capacitor 14 are arranged. Further, the flow path member 465 is provided with a cooling flow path portion 590A. According to this modified example, the heat of the electronic components (the power module 11, the current distribution unit 13, and the capacitor 14) arranged between the lid body 564A and the flow path member 465 can be transferred to the lid body 564A and the flow path member 465, and it is possible to suppress the temperature of these electronic components from becoming too high.

[0100] In this modified example, the plurality of second electronic components 13, 14 (the current distribution unit 13 and the capacitor 14) overlap the power module 11 in the vertical direction Z. According to this modified example, the control device 507 can be miniaturized in a direction orthogonal to the vertical direction Z. In this modified example, the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z. According to this modified example, the control device 507 can be miniaturized in a direction orthogonal to the vertical direction Z.

[0101] (Modified Example 6) FIG. 8 is a schematic cross-sectional view of the drive device 601 of Modified Example 6. Similar to the above-described embodiment, the drive device 601 of this modified example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 607. Further, the drive device 601 has a housing connection body 606. The housing connection body 606 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 606C (housing). The housing connection body 606 is provided with a flow path 690.

[0102] The electronic component housing 606C of this modified example has a case portion 61A and a third lid member 664. The third lid member 664 has a lid main body 664A and a flow path member 465. The lid main body 664A has a plurality of support pillar portions 664d in addition to the second bottom wall portion 64b, the second side wall portion 64c, and the second flange portion 64f similar to those in the above-described embodiment. The support pillar portions 664d extend downward (-Z) from the second inner surface 64k of the second bottom wall portion 64b. The flow path member 465 is attached to the lower end portion of the support pillar portion 664d. The flow path member 465 is positioned between the first bottom wall portion 61b and the second bottom wall portion 64b in the vertical direction Z. The flow path member 465 faces the first inner surface 61k with a gap in the vertical direction Z. Also, the flow path member 465 faces the second inner surface 64k with a gap in the vertical direction Z.

[0103] The electronic component housing 606C of this modified example houses a power module 11, a power integration system 12, a current distribution portion 13, and a capacitor 14. The power integration system 12 and the current distribution portion 13 are fixed to the second inner surface 64k of the second bottom wall portion 64b. The power integration system 12 and the current distribution portion 13 are arranged side by side in the first direction D1. Also, the current distribution portion 13 is positioned above the flow path member 465. The current distribution portion 13 and the flow path member 465 may be in contact with each other directly or via a heat transfer material. The power module 11 is fixed to the lower surface of the flow path member 465. The capacitor 14 is fixed to the lower surface of the power module 11. In this modified example, the arrangements of the power module 11 and the power integration system 12 may be mutually interchanged. In this modified example, the arrangements of the current distribution portion 13 and the capacitor 14 may be mutually interchanged.

[0104] The flow path 690 of this modification example has an internal flow path portion 491 provided in the electronic component housing 606C and a third flow path portion 94 provided in the motor housing 6A. The internal flow path portion 491 meanders and extends inside the flow path member 465. The internal flow path portion 491 is provided in the third lid member 664. The internal flow path portion 491 has a cooling flow path portion 690A that overlaps the power module 11 in the vertical direction Z. The power module 11 contacts the lower surface of the flow path member 465. The cooling flow path portion 690A is located above the power module 11. The internal flow path portion 491 cools the power module 11. According to this modification example, the power module 11 can be efficiently cooled using the plate-shaped flow path member 465. Further, since the capacitor 14 contacts the power module 11 on the lower surface, the capacitor 14 is cooled by the internal flow path portion 491 via the power module 11.

[0105] In this modification example, a current distribution portion 13 is arranged between the lid main body 664A and the flow path member 465 in the vertical direction Z. Further, the cooling flow path portion 690A is provided in the flow path member 465. According to this modification example, the heat of the current distribution portion 13 arranged between the lid main body 664A and the flow path member 465 can be transferred to the lid main body 664A and the flow path member 465, and it is possible to suppress the temperature of the current distribution portion 13 from becoming too high.

[0106] In this modification example, the plurality of second electronic components 13, 14 (current distribution portion 13 and capacitor 14) overlap the power module 11 in the vertical direction Z. According to this modification example, the control device 607 can be miniaturized in a direction orthogonal to the vertical direction Z. In this modification example, among the plurality of second electronic components 13, 14, the current distribution portion 13 overlaps the power integration system 12 in the first direction D1. According to this modification example, the control device 607 can be miniaturized in the vertical direction Z. In this modification example, the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z. According to this modification example, the control device 607 can be miniaturized in a direction orthogonal to the vertical direction Z.

[0107] (Modification Example 7) FIG. 9 is a schematic cross-sectional view of the drive device 701 of Modification 7. Similar to the above-described embodiment, the drive device 701 of this modification includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 707. Further, the drive device 701 has a housing connector 706. The housing connector 706 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 706C (housing). A flow path 790 is provided in the housing connector 706.

[0108] The electronic component housing 706C of this modification has a case portion 61A and a third lid member 764. The third lid member 764 has a lid main body 764A and a flow path member 465. The lid main body 764A has a second bottom wall portion 764b, a second side wall portion 64c, a second flange portion 64f, and a plurality of support pillar portions 764d.

[0109] The second bottom wall portion 764b of this modification has a first bottom plate portion 764g, a second bottom plate portion 764n, and a first step portion 764m. The first bottom plate portion 764g and the second bottom plate portion 764n are plate-shaped and extend along a plane orthogonal to the vertical direction Z. A first flow path portion 91 is provided in the first bottom plate portion 764g. The second bottom plate portion 764n is located below (-Z) the first bottom plate portion 764g and on the other side (-D1) in the first direction. The first step portion 764m connects the first bottom plate portion 764g and the second bottom plate portion 764n.

[0110] The support pillar portion 764d extends downward (-Z) from the first bottom plate portion 764g. A flow path member 465 is attached to the lower end portion of the support pillar portion 764d.

[0111] In the electronic component housing 706C of this modified example, a power module 11, a power integration system 12, a current distribution unit 13, and a capacitor 14 are accommodated. In this modified example, the power module 11 is fixed to the lower surface of the first bottom plate portion 764g. Further, the power module 11 contacts the upper surface of the flow path member 465 directly or via a heat transfer material. The power integration system 12 is fixed to the lower surface of the flow path member 465. The current distribution unit 13 and the capacitor 14 are fixed to the lower surface of the second bottom plate portion 764n. The current distribution unit 13 and the capacitor 14 are arranged side by side in the first direction D1. In this modified example, the arrangements of the power module 11 and the power integration system 12 may be interchanged with each other. In this modified example, the arrangements of the current distribution unit 13 and the capacitor 14 may be interchanged with each other.

[0112] The flow path 790 has a first flow path portion 91, a connection flow path portion 95, and an internal flow path portion 491 provided in the electronic component housing 706C, and a third flow path portion 94 provided in the motor housing 6A. The first flow path portion 91 has a cooling flow path portion 790A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z. The cooling flow path portion 790A cools the power module 11 that contacts the second bottom wall portion 764b.

[0113] The internal flow path portion 491 extends in a meandering manner inside the flow path member 465. The internal flow path portion 491 has a cooling flow path portion 790B that overlaps the power module 11 and the power integration system 12 in the vertical direction Z. The cooling flow path portion 790B cools the power module 11 and the power integration system 12 that contact the flow path member 465.

[0114] In this modified example, a power module 11 is disposed between the lid main body 764A and the flow path member 465 in the vertical direction Z. Further, a cooling flow path portion 790B is provided in the flow path member 465. According to this modified example, the heat of the power module 11 disposed between the lid main body 764A and the flow path member 465 can be transferred to the lid main body 764A and the flow path member 465, and it is possible to suppress the temperature of the power module 11 from becoming too high. Particularly in this modified example, the power module 11 is disposed between two cooling flow path portions 790A and 790B in the vertical direction Z. Thereby, the power module 11 is effectively cooled from both sides in the vertical direction Z by the two cooling flow path portions 790A and 790B.

[0115] In this modified example, the plurality of second electronic components 13 and 14 overlap the cooling flow path portion 790B in the first direction D1. According to this modified example, the control device 707 can be miniaturized in the vertical direction Z. In this modified example, the plurality of second electronic components 13 and 14 overlap the power module 11 in the first direction D1. According to this modified example, the control device 707 can be miniaturized in the vertical direction Z. In this modified example, the plurality of second electronic components 13 and 14 overlap each other in the first direction D1. According to this modified example, the control device 707 can be miniaturized in the vertical direction Z.

[0116] (Modified Example 8) FIG. 10 is a schematic cross-sectional view of the drive device 801 of Modified Example 8. Similar to the above-described embodiment, the drive device 801 of this modified example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 807. Further, the drive device 801 has a housing connector 806. The housing connector 806 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 806C (housing). A flow path 890 is provided in the housing connector 806.

[0117] The electronic component housing 806C of this modified example has a case portion 61A and a third lid member 864. The third lid member 864 has a lid main body 864A and a flow path member 465. The lid main body 864A has a plurality of support pillar portions 864d in addition to the second side wall portion 64c and the second flange portion 64f. The support pillar portions 864d extend downward (-Z) from the second bottom wall portion 64b. A flow path member 465 is attached to the lower end portion of the support pillar portion 864d.

[0118] The electronic component housing 806C of this modified example houses a power module 11, a power integration system 12, a current distribution portion 13, and a capacitor 14. In this modified example, the current distribution portion 13 is fixed to the lower surface of the second bottom wall portion 64b. The power integration system 12 is fixed to the upper surface of the flow path member 465. The power module 11 is fixed to the lower surface of the flow path member 465. The capacitor 14 is fixed to the upper surface of the first bottom wall portion 61b. In this modified example, the current distribution portion 13, the power integration system 12, the power module 11, and the capacitor 14 are arranged side by side in the vertical direction Z. In this modified example, the arrangements of the power module 11 and the power integration system 12 may be interchanged with each other. In this modified example, the arrangements of the current distribution portion 13 and the capacitor 14 may be interchanged with each other.

[0119] The flow path 890 has an internal flow path portion 491 and a third flow path portion 94. The internal flow path portion 491 meanders and extends inside the flow path member 465. The internal flow path portion 491 has a cooling flow path portion 890A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z. The cooling flow path portion 890A cools the power module 11 and the power integration system 12 that are in contact with the flow path member 465.

[0120] In this modified example, a power integration system 12 is arranged between the lid main body 864A and the flow path member 465 in the vertical direction Z. According to this modified example, it becomes easier to transfer the heat of the power integration system 12 arranged between the lid main body 864A and the flow path member 465 to the lid main body 864A and the flow path member 465, and it is possible to suppress the temperature of the power integration system 12 from becoming too high.

[0121] In this modified example, the plurality of second electronic components 13 and 14 overlap the cooling channel portion 890A in the vertical direction Z. According to this modified example, the control device 807 can be miniaturized in a direction orthogonal to the vertical direction Z. In this modified example, the plurality of second electronic components 13 and 14 overlap the power module 11 and the power integration system 12 in the vertical direction Z. According to this modified example, the control device 807 can be miniaturized in a direction orthogonal to the vertical direction Z. In this modified example, the plurality of second electronic components 13 and 14 overlap each other in the vertical direction Z. According to this modified example, the control device 807 can be miniaturized in a direction orthogonal to the vertical direction Z.

[0122] The capacitor 14 of this modified example is fixed to the shared wall portion 61n. A part of the third channel portion 94 is provided in the shared wall portion 61n. Therefore, the third channel portion 94 can cool the capacitor 14.

[0123] (Modified Example 9) FIG. 11 is a schematic cross-sectional view of the drive device 901 of Modified Example 9. Similar to the above-described embodiment, the drive device 901 of this modified example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 907. Further, the drive device 901 has a housing connection body 906. The housing connection body 906 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 906C (housing). A flow path 990 is provided in the housing connection body 906.

[0124] The power module 11, the power integration system 12, the current distribution unit 13, the capacitor 14, and the heating device 115 are housed in the electronic component housing 906C of this modified example. The power integration system 12 and the capacitor 14 are fixed to the second inner surface 64k of the second bottom wall portion 64b. On the other hand, the power module 11, the current distribution unit 13, and the heating device 115 are fixed to the first inner surface 61k of the first bottom wall portion 61b.

[0125] The flow path 990 includes a first flow path portion 91, a connection flow path portion 95, and a third flow path portion 94. The first flow path portion 91 is provided on the second bottom wall portion 64b. The first flow path portion 91 has a cooling flow path portion 990A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z. Therefore, the first flow path portion 91 cools the power integration system 12. Also, the first flow path portion 91 can cool the power module 11.

[0126] In this modification, the power module 11 and the power integration system 12 overlap in the vertical direction Z. According to this modification, the power module 11 and the power integration system 12 are arranged side by side along the first direction D1, so that the control device 907 can be prevented from increasing in size in the direction orthogonal to the vertical direction Z.

[0127] According to this modification, the power module 11 is fixed to the case portion 61A, and the power integration system 12 is fixed to the third lid member 64. According to this modification, the heat of the power module 11 can be dissipated through the case portion 61A, and the heat of the power integration system 12 can be dissipated through the third lid member 64.

[0128] The power module 11 of this modification is fixed to the shared wall portion 61n. A part of the third flow path portion 94 is provided on the shared wall portion 61n. Therefore, the third flow path portion 94 can cool the power module 11.

[0129] (Modification 10) FIG. 12 is a schematic cross-sectional view of the drive device 1001 according to Modification 10. Similar to the above-described embodiment, the drive device 1001 of this modification includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 1007. The drive device 1001 also has a housing connection body 1006. The housing connection body 1006 includes a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 1006C (housing). A flow path 1090 is provided in the housing connection body 1006.

[0130] The electronic component housing 1006C of this modified example includes a case portion 61A, a third lid member (lid portion) 1064, and a fourth lid member 1065. The third lid member 1064 is located above the case portion 61A and covers the first opening 61h. The third lid member 1064 has a second opening 1064h that opens upward (+Z).

[0131] The third lid member 1064 includes a second bottom wall portion 1064b, a second side wall portion 1064c, a second flange portion 1064d, and a third flange portion 1064f. The second bottom wall portion 1064b extends along a plane orthogonal to the vertical direction Z. The second bottom wall portion 1064b covers the first opening 61h of the case portion 61A. The second bottom wall portion 1064b partitions the internal space of the case portion 61A and the internal space of the third lid member 1064. The second bottom wall portion 1064b has a second inner surface 1064k facing downward (-Z) and a third inner surface 1064s facing upward (+Z). The second side wall portion 1064c extends upward (+Z) from the outer edge of the second bottom wall portion 1064b.

[0132] The second flange portion 1064d is disposed on the same plane as the second bottom wall portion 1064b. The second flange portion 1064d is provided at the lower end of the second side wall portion 1064c. The second flange portion 1064d faces the first flange portion 61f in the vertical direction Z. The second flange portion 1064d is fastened to the first flange portion 61f. A seal member may be sandwiched between the first flange portion 61f and the second flange portion 1064d.

[0133] The third flange portion 1064f is provided at the upper end of the second side wall portion 1064c. The third flange portion 1064f surrounds the second opening 1064h in a frame shape. The third flange portion 1064f protrudes in a direction away from the second opening 1064h along a plane orthogonal to the vertical direction Z. The fourth lid member 1065 is fastened to the third flange portion 1064f.

[0134] The fourth lid member 1065 is plate-shaped and extends along a plane orthogonal to the first direction D1. The fourth lid member 1065 is fastened to the third flange portion 1064f. Thereby, the fourth lid member 1065 covers the second opening 1064h. A seal member may be sandwiched between the third flange portion 1064f and the fourth lid member 1065.

[0135] The electronic component housing 1006C houses the power module 11, the power integration system 12, the current distribution unit 13, the capacitor 14, and the heating device 115. The internal space of the electronic component housing 1006C has a first accommodation space B1 and a second accommodation space B2. The first accommodation space B1 is surrounded by the case portion 61A and the third lid member 1064. The power module 11, the capacitor 14, and the heating device 115 are arranged in the first accommodation space B1. The power module 11, the capacitor 14, and the heating device 115 are fixed to the second inner surface 1064k. The second accommodation space B2 is surrounded by the third lid member 1064 and the fourth lid member 1065. The power integration system 12 and the current distribution unit 13 are arranged in the second accommodation space B2. The power integration system 12 and the current distribution unit 13 are fixed to the third inner surface 1064s. That is, all the electronic components (the power module 11, the capacitor 14, the heating device 115, the power integration system 12, and the current distribution unit 13) of the control device 1007 are fixed to the second bottom wall portion 1064b.

[0136] The flow path 1090 of this modification example has a cooling flow path portion 1090A, a connection flow path portion 95, and a third flow path portion 94. The cooling flow path portion 1090A has a first flow path portion 1091 and a second flow path portion 1092. The cooling flow path portion 1090A overlaps the power module 11 and the power integration system 12 in the vertical direction Z. Further, the cooling flow path portion 1090A is disposed between the power module 11 and the power integration system 12. The cooling flow path portion 1090A can cool the power module 11 and the power integration system 12 simultaneously. In particular, the cooling flow path portion 1090A of this modification example is provided on the second bottom wall portion 1064b to which the power module 11 and the power integration system 12 are fixed. Therefore, the cooling flow path portion 1090A can directly cool the power module 11 and the power integration system 12. Further, other electronic components (current distribution portion 13, capacitor 14, and heating device 115) are fixed to the second bottom wall portion 1064b. By the fluid flowing through the cooling flow path portion 1090A cooling the second bottom wall portion 1064b, other electronic components (current distribution portion 13, capacitor 14, and heating device 115) can be indirectly cooled.

[0137] The first flow path portion 1091 and the second flow path portion 1092 of this modification example are arranged side by side in the vertical direction Z. The first flow path portion 1091 is located below (-Z) the second flow path portion 1092. The first flow path portion 1091 cools the power module 11. The second flow path portion 1092 cools the power integration system 12.

[0138] The first flow path portion 1091 and the second flow path portion 1092 are connected to each other. Therefore, the first flow path portion 1091 and the second flow path portion 1092 constitute a single circulation flow path, and the same fluid flows through each other. For this reason, the structure of the flow path 1090 including the first flow path portion 1091 and the second flow path portion 1092 can be simplified. Note that the first flow path portion 1091 and the second flow path portion 1092 may each be a part of an independent circulation flow path, and in this case, different fluids may flow through the first flow path portion 1091 and the second flow path portion 1092, respectively.

[0139] In this modified example, the power module 11, the first flow path portion 1091, the second flow path portion 1092, and the power integration system 12 are arranged side by side in the vertical direction Z. Therefore, it is possible to suppress the control device 1007 from increasing in size in the direction orthogonal to the vertical direction Z.

[0140] (Modified Example 11) FIG. 13 is a schematic cross-sectional view of the drive device 1101 of Modified Example 11. Similar to the above-described embodiment, the drive device 1101 of this modified example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 1107. The drive device 1101 also has a housing connector 1106. The housing connector 1106 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 1106C (housing). A flow path 1190 is provided in the housing connector 1106.

[0141] The electronic component housing 1106C houses a power module 11, a power integration system 12, a current distribution unit 13, a capacitor 14, and a heating device 115. The power module 11, the capacitor 14, and the heating device 115 are fixed to the second inner surface 1064k. The power integration system 12 and the current distribution unit 13 are fixed to the third inner surface 1064s. That is, all the electronic components (power module 11, capacitor 14, heating device 115, power integration system 12, and current distribution unit 13) of the control device 1107 are fixed to the second bottom wall portion 1064b.

[0142] The flow path 1190 of this modified example has a cooling flow path portion 1190A. The cooling flow path portion 1190A has a first flow path portion 1191 and a second flow path portion 1192. The cooling flow path portion 1190A overlaps the power module 11 and the power integration system 12 in the vertical direction Z. Also, the cooling flow path portion 1190A is disposed between the power module 11 and the power integration system 12. The cooling flow path portion 1190A can cool the power module 11 and the power integration system 12 simultaneously. In particular, the cooling flow path portion 1190A of this modified example is provided on the second bottom wall portion 1064b to which the power module 11 and the power integration system 12 are fixed. Also, other electronic components (current distribution portion 13, capacitor 14, and heating device 115) are fixed to the second bottom wall portion 1064b. By the fluid flowing through the cooling flow path portion 1190A cooling the second bottom wall portion 1064b, other electronic components (current distribution portion 13, capacitor 14, and heating device 115) can be indirectly cooled.

[0143] The first flow path portion 1191 and the second flow path portion 1192 of this modified example are arranged side by side in the first direction D1. The first flow path portion 1191 cools the power module 11. The second flow path portion 1192 cools the power integration system 12.

[0144] The first flow path portion 1191 and the second flow path portion 1192 are connected to each other. Therefore, the first flow path portion 1191 and the second flow path portion 1192 constitute a single circulation flow path, and the same fluid flows through each other. For this reason, the structure of the flow path 1190 including the first flow path portion 1191 and the second flow path portion 1192 can be simplified.

[0145] In this modified example, the first flow path portion 1191 and the second flow path portion 1192 are arranged side by side in the first direction D1, so that compared with the case where the first flow path portion 1191 and the second flow path portion 1192 are arranged overlapping each other in the vertical direction Z, the second bottom wall portion 1064b can be made thinner and the control device 1107 can be miniaturized in the vertical direction Z.

[0146] The embodiments of the present invention have been described above. However, each configuration and their combinations in the embodiments are merely examples, and additions, omissions, substitutions, and other changes to the configuration are possible without departing from the spirit of the present invention. Further, the present invention is not limited by the embodiments.

[0147] In particular, the configuration of the control device shown in the above-described embodiments and their modifications is merely an example. The control device may have any other electronic components as long as it has at least a power module.

[0148] Note that the present technology can be configured as follows. (1) A control device located above the motor and controlling the motor, comprising a power module, a first electronic component having any one of the functions of voltage adjustment, current distribution, or capacitor, and a housing accommodating the power module and the first electronic component, wherein the housing has a case portion having an opening opening upward and a lid portion covering the opening, and a flow path is provided in the lid portion, and the flow path has a cooling flow path portion overlapping at least one of the power module or the first electronic component in the vertical direction. Control device. (2) The control device according to (1), wherein the cooling flow path portion is located above at least one of the power module or the first electronic component. (3) The power module and the first electronic component are fixed to the lid portion, the cooling flow path portion is provided in the lid portion, and includes a first flow path portion for cooling the power module and a second flow path portion provided in the lid portion for cooling the first electronic component. The control device according to (1) or (2). (4) The control device according to (3), wherein a direction orthogonal to the vertical direction is defined as a first direction, and the first flow path portion and the second flow path portion are arranged side by side in the vertical direction or the first direction. (5) The control device according to (3) or (4), wherein the first flow path portion and the second flow path portion are connected to each other. (6) The direction orthogonal to the vertical direction is defined as the first direction, and the power module and the first electronic component are arranged side by side in the first direction, the control device according to any one of (1) to (5). (7) The power module and the first electronic component are arranged side by side in the vertical direction, the control device according to any one of (1) to (5). (8) The power module is arranged below the first electronic component, the control device according to (6) or (7). (9) The cooling channel portion is located below at least one of the power module or the first electronic component, the control device according to (1). (10) The direction orthogonal to the vertical direction is defined as the first direction, and the cooling channel portion overlaps at least one of the power module or the first electronic component in the first direction, the control device according to any one of (1) to (9). (11) The lid portion has a lid body located above the opening and a wall portion fixed to the lid body and located below the lid body. In the vertical direction, between the lid body and the wall portion, the power module or the first electronic component is arranged, and the cooling channel portion is provided in the wall portion, the control device according to any one of (1) to (10). (12) Comprising a second electronic component housed in the housing, the second electronic component has any one of the functions of voltage regulation, current distribution, or capacitor. The direction orthogonal to the vertical direction is defined as the first direction, and the second electronic component overlaps the cooling channel portion in the vertical direction or the first direction, the control device according to any one of (1) to (11). (13) Comprising a second electronic component housed in the housing, the second electronic component has any one of the functions of voltage regulation, current distribution, or capacitor. The direction orthogonal to the vertical direction is defined as the first direction, and the second electronic component overlaps the power module or the first electronic component in the vertical direction or the first direction, the control device according to any one of (1) to (12). (14) Comprising a plurality of the second electronic components, the control device according to (12) or (13). (15) The plurality of the second electronic components in the control device according to (14) overlap each other in the vertical direction or in the first direction. (16) The control device according to any one of (1) to (15), wherein the power module is fixed to the case portion, and the first electronic component is fixed to the lid portion. (17) The control device according to any one of (1) to (15), wherein the power module is fixed to the lid portion, and the first electronic component is fixed to the case portion. (18) The control device according to any one of (1) to (15), wherein the power module and the first electronic component are fixed to the lid portion. (19) The control device according to any one of (1) to (18), further comprising a heating device having a heater portion and a control portion for controlling the heater portion, wherein the control portion is housed in the housing. (20) A drive device comprising the control device according to any one of (1) to (19), the motor, and a motor housing for housing the motor, wherein the housing and the motor housing are connected to each other. (21) The drive device according to (20), wherein the flow path has a third flow path portion provided in the motor housing for cooling the motor, and the third flow path portion is connected to a portion of the flow path provided in the lid portion.

Explanation of Signs

[0149] 1,101,201,301,401,501,601,701,801,901,1001,1101… drive device, 2… motor, 6A… motor housing, 6C, 106C, 206C, 306C, 406C, 506C, 706C, 806C, 906C, 1006C, 1106C… electronic component housing (housing), 7,107,207,307,407,507,607,707,807,907,1007,1107… control device, 11… power module, 12… power integration system (first electronic component), 13… current distribution section (second electronic component), 14… capacitor (second electronic component), 15,115… heating device, 15a,115a… heater section, 15b… heater control section (control section), 61A… case section, 64,1064… third lid member (lid section), 90,190,390,490,590,690,790,890,990,1090,1190… flow path, 90A,90B,190A,190B,390A,490A,490B,490C,590A,690A,790A,790B,890A,990A,1090A,1190A… cooling flow path section, 91,191,391,1091,1191… first flow path section, 91a,391a… opening, 94… third flow path section, 192,1092,1192… second flow path section, 464A,564A,664A,764A,864A… lid body, 465… flow path member (wall section), 491… internal flow path section (first flow path section), D1… first direction

Claims

1. A control device located above a motor for controlling the motor, comprising: a power module; a first electronic component having any one of the functions of voltage regulation, current distribution, or a capacitor; a housing for housing the power module and the first electronic component; wherein the housing comprises a case part having an opening that opens upward; a lid part covering the opening; a flow path is provided in the lid part; the flow path has a cooling flow path part that overlaps at least one of the power module or the first electronic component in the vertical direction; a control device.

2. The cooling flow path part is located above at least one of the power module or the first electronic component; The control device according to Claim 1.

3. The power module and the first electronic component are fixed to the lid part; The cooling flow path part comprises a first flow path part provided in the lid part for cooling the power module; a second flow path part provided in the lid part for cooling the first electronic component; The control device according to Claim 1.

4. Taking the direction perpendicular to the vertical direction as the first direction; the first flow path part and the second flow path part are arranged side by side in the vertical direction or the first direction; The control device according to Claim 3.

5. The first flow path part and the second flow path part are connected to each other; The control device according to Claim 3.

6. Taking the direction perpendicular to the vertical direction as the first direction; the power module and the first electronic component are arranged side by side in the first direction; The control device according to Claim 1.

7. The power module and the first electronic component are arranged side by side in the vertical direction; The control device according to Claim 1.

8. The power module is arranged below the first electronic component; The control device according to Claim 6 or 7.

9. The cooling flow path part is located below at least one of the power module or the first electronic component; The control device according to Claim 1.

10. Taking the direction perpendicular to the vertical direction as the first direction; the cooling flow path part overlaps at least one of the power module or the first electronic component in the first direction; The control device according to Claim 1.

11. The lid part comprises a lid body located above the opening; a wall part fixed to the lid body and located below the lid body; In the vertical direction, between the lid body and the wall portion, the power module or the first electronic component is disposed. The cooling channel portion is provided in the wall portion. The control device according to claim 1.

12. Comprising a second electronic component housed in the housing. The second electronic component has any one of functions of voltage adjustment, current distribution, or a capacitor. Taking the direction orthogonal to the vertical direction as the first direction. The second electronic component overlaps with the cooling channel portion in the vertical direction or the first direction. The control device according to claim 1.

13. Comprising a second electronic component housed in the housing. The second electronic component has any one of functions of voltage adjustment, current distribution, or a capacitor. Taking the direction orthogonal to the vertical direction as the first direction. The second electronic component overlaps with the power module or the first electronic component in the vertical direction or the first direction. The control device according to claim 1.

14. Comprising a plurality of the second electronic components. The control device according to claim 12 or 13.

15. The plurality of second electronic components overlap with each other in the vertical direction or the first direction. The control device according to claim 14.

16. The power module is fixed to the case portion. The first electronic component is fixed to the lid portion. The control device according to claim 1.

17. The power module is fixed to the lid portion. The first electronic component is fixed to the case portion. The control device according to claim 1.

18. The power module and the first electronic component are fixed to the lid portion. The control device according to claim 1.

19. Comprising a heating device having a heater portion and a control portion for controlling the heater portion. The control portion is housed in the housing. The control device according to claim 1.

20. The control device according to claim 1, the motor, and a motor housing for housing the motor, and the housing and the motor housing are connected to each other. Drive device.

21. The flow path has a third flow path portion provided in the motor housing for cooling the motor. The third flow path portion is connected to a portion of the flow path provided in the lid portion. The drive device according to claim 20.

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