Semiconductor manufacturing device

Abstract

To provide a technique capable of decreasing the number of times of setup change in a process of manufacturing a semiconductor device.SOLUTION: A semiconductor manufacturing device comprises: a bottom-side lead frame press jig 17 which is mounted with a lead frame 7 on its top surface; a bonding head 12 which is arranged above the bottom-side lead frame press jig 17, and performs wire bonding to the lead frame 7 through ultrasonic vibration; and a lead frame press mechanism 18 which presses the lead frame 7 against the bottom-side lead frame press jig 17. The bonding head 12 and lead frame press mechanism 18 can move horizontally and vertically.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a semiconductor manufacturing apparatus.

Background Art

[0002] Conventionally, in the manufacturing process of semiconductor devices, there is a wire bonding apparatus that performs wire bonding on the internal circuit of a semiconductor device using metal wires (see, for example, Patent Document 1).

[0003] In the apparatus described in Patent Document 1, wire bonding is performed while sandwiching a lead frame between an upper pressing member and a lower pressing member.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the apparatus described in Patent Document 1, since the upper pressing member is configured not to move in the horizontal direction, the upper pressing member was previously arranged in the vicinity of the wire bonding portion, which is the bonding location of the wire. Since the position of the wire bonding portion varies from product to product, it was necessary to perform wire bonding while exchanging the upper pressing member for each product. As a result, the apparatus described in Patent Document 1 had a problem that the frequency of setup operations such as exchanging the upper pressing member became high.

[0006] Therefore, an object of the present disclosure is to provide a technique capable of reducing the number of setup operations in the manufacturing process of semiconductor devices.

Means for Solving the Problems

[0007] The semiconductor manufacturing apparatus according to the present disclosure includes a bottom-side lead frame presser jig on which a lead frame is mounted on the upper surface, a bonding head disposed above the bottom-side lead frame presser jig for performing wire bonding on the lead frame by ultrasonic vibration, and a lead frame pressing mechanism for pressing the lead frame against the bottom-side lead frame presser jig. The bonding head and the lead frame pressing mechanism are movable in the horizontal and vertical directions.

Effect of the Invention

[0008] According to the present disclosure, since the lead frame pressing mechanism can move in the horizontal and vertical directions in accordance with the wire bonding portions that differ for each product, the number of changeover operations can be reduced in the manufacturing process of the semiconductor device.

Brief Description of the Drawings

[0009]

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MODE FOR CARRYING OUT THE INVENTION

[0010] <Embodiment 1> Embodiment 1 will be described below with reference to the drawings. FIG. 1 is a side view of the semiconductor manufacturing apparatus according to Embodiment 1.

[0011] (Configuration of Semiconductor Manufacturing Apparatus) First, the semiconductor manufacturing apparatus will be described. As shown in FIG. 1, the semiconductor manufacturing apparatus includes a bottom-side lead frame holding jig 17, a bonding head 12, and a lead frame holding mechanism 18.

[0012] A lead frame 7 on which a semiconductor element 8 is mounted is disposed on the bottom-side lead frame holding jig 17. Further, a recess 17a for disposing the die pad 7a of the lead frame 7 is provided on the upper surface of the bottom-side lead frame holding jig 17.

[0013] FIG. 2 is a side view of a bonding head 12 provided in the semiconductor manufacturing apparatus according to Embodiment 1. In FIG. 2, the lead frame pressing mechanism 18 is not shown in order to make the structure of the bonding head 12 easier to see.

[0014] As shown in FIGS. 1 and 2, the bonding head 12 is disposed above the lead frame 7. The bonding head 12 includes a wire guide 1, a bonding tool 2, a clamper 3, a cutter 4, and a mounting portion 13. The upper ends of the wire guide 1, the bonding tool 2, the clamper 3, and the cutter 4 are attached to the mounting portion 13.

[0015] Although not shown, the semiconductor manufacturing apparatus further includes a reel around which a metal wire 5 is wound. The reel supplies the metal wire 5 to the wire guide 1. The wire guide 1 guides the metal wire 5 supplied from the reel to the lower end of the wire guide 1. The clamper 3 is disposed above the wire guide 1 and locks the metal wire 5 supplied from the reel to the wire guide 1 above the wire guide 1.

[0016] The bonding tool 2 extends to the lower side of the wire guide 1 such that the tip of the bonding tool 2 is located around the lower end of the wire guide 1. Further, the bonding tool 2 generates frictional heat by applying ultrasonic vibration while pressing the metal wire 5 supplied from the wire guide 1, and melts the metal wire 5 by the frictional heat to bond it to the lead frame 7 or the semiconductor element 8.

[0017] As shown in FIG. 1, the lead frame pressing mechanism 18 is provided on the bonding head 12 and is disposed above the lead frame 7. The lead frame pressing mechanism 18 is formed in a shape that extends in the vertical direction (up and down direction) from the upper end to the middle part and extends in an oblique direction from the middle part to the lower end, and the upper end part of the lead frame pressing mechanism 18 is attached to the mounting portion 13.

[0018] The bonding head 12 and the lead frame holding mechanism 18 are connected to a driving mechanism (not shown) so as to be integrally movable horizontally. Further, the bonding head 12 and the lead frame holding mechanism 18 are connected to a driving mechanism (not shown) so as to be integrally movable vertically. With this configuration, the bonding head 12 and the lead frame holding mechanism 18 operate simultaneously in the horizontal and vertical directions. Further, the bonding head 12 and the lead frame holding mechanism 18 are connected to a rotating mechanism (not shown) so as to be rotatable about their respective central axes. With the above configuration, by pressing the lead frame 7 against the bottom-side lead frame holding jig 17 at the tip of the lead frame holding mechanism 18, the positions of the lead frame 7 and the semiconductor element 8 can be fixed. Here, the driving mechanism and the rotating mechanism are, for example, motors.

[0019] Note that the rotating mechanisms of the bonding head 12 and the lead frame holding mechanism 18 are separate bodies and can be driven independently. Further, the tip shape of the lead frame holding mechanism 18 may be, for example, a planar shape, a pointed shape, an R shape, etc., and there is no restriction on the tip shape of the lead frame holding mechanism 18. Further, the number of mounts of the lead frame holding mechanism 18 is set to the minimum number of mounts that can reliably fix the lead frame 7, and there is no restriction on the number of mounts of the lead frame holding mechanism 18.

[0020] (Operation of semiconductor manufacturing apparatus) Next, the operation of the semiconductor manufacturing apparatus will be described. FIG. 3 is a partial side view of the semiconductor device. FIG. 4 is an enlarged side view showing a cutting operation by the bonding head 12. FIG. 5 is a cross-sectional view showing a state in which the bonding tool 2 presses the metal wire 5. FIG. 6 is a flowchart showing the operation of the semiconductor manufacturing apparatus according to Embodiment 1. In FIGS. 1 and 4, although the vertical lengths of the lead frame holding mechanism 18 appear to be different, actually the vertical lengths of the lead frame holding mechanism 18 are the same.

[0021] As shown in FIG. 3, the first process of wire bonding is an operation of bonding a metal wire 5 to a bonding surface such as an electrode of a semiconductor element 8.

[0022] First, as shown in FIG. 6, the lead frame 7 is conveyed (step S1), and the bonding head 12 is moved above a desired wire bonding position on the semiconductor element 8 bonded to the lead frame 7 by the bonding material 6 (step S2). At this time, the lead frame pressing mechanism 18 also moves upward simultaneously with the bonding head 12.

[0023] Next, after rotating and moving the lead frame pressing mechanism 18 to an arbitrary angle and position, it is lowered (step S3). By pressing the lead frame 7 against the bottom lead frame pressing jig 17 with the tip of the lead frame pressing mechanism 18, the position of the lead frame 7 is fixed.

[0024] At this time, the bonding head 12 also descends simultaneously with the lead frame pressing mechanism 18, and the metal wire 5 passing across the tip of the bonding tool 2 shown in FIG. 5 is pressed against the semiconductor element 8. After the position of the lead frame 7 is fixed, wire bonding is started (step S4), and in this state, ultrasonic vibration is applied through the bonding tool 2 to bond the metal wire 5 to the semiconductor element 8.

[0025] At this time, fixing the position of the lead frame 7 is important. By transmitting all the ultrasonic vibration applied through the bonding tool 2 without loss to the bonding interface between the metal wire 5 and the lead frame 7, or between the metal wire 5 and the semiconductor element 8, it becomes possible to construct a high-quality metal bonding state.

[0026] The lead frame holding mechanism 18 shown in Fig. 4 contributes to reducing the loss of ultrasonic vibration. The lead frame holding mechanism 18 is provided on the bonding head 12 and is arranged in the vicinity of the bonding tool 2. With this configuration, when the bonding tool 2 presses the metal wire 5 against the bonding surface and applies ultrasonic vibration, the bonding surface can be firmly fixed, thereby reducing the loss of ultrasonic vibration. As a result, it becomes possible to construct a high-quality metal bonding state. Also, no matter how the bonding tool 2 moves in the horizontal direction and attempts wire bonding, the lead frame holding mechanism 18 is always arranged in the vicinity of the bonding tool 2, making it possible to stably construct a high-quality metal bonding state.

[0027] As shown in Fig. 6, after wire bonding is completed, the position of the lead frame holding mechanism 18, specifically the rotational position of the lead frame holding mechanism 18, is initialized (step S5).

[0028] The second process of wire bonding is an operation of shaping the metal wire 5 into a desired trajectory. After bonding the metal wire 5 to the semiconductor element 8 as shown in Fig. 3, the bonding head 12 repeats fine operations in the horizontal and vertical directions, or performs kinking so that a desired trajectory is formed on the metal wire 5 by hitting the metal wire 5 with a trajectory forming component (not shown).

[0029] The third process of wire bonding is an operation of bonding the metal wire 5 to the next bonding location, such as the electrode of the semiconductor element 8 or the lead frame 7. As shown in Fig. 6, the bonding head 12 is moved above the next wire bonding position (step S6). As shown in Fig. 3, the metal wire 5 that has completed kinking in the second process is pressed against the next bonding surface and ultrasonic vibration is applied for bonding. When continuously bonding the metal wire 5 to the next bonding location, steps S3 to S6 are repeatedly executed (step S7).

[0030] The fourth process of wire bonding is the operation of cutting the metal wire 5 after the completion of the bonding of the metal wire 5 at the final joint location. As shown in FIG. 4, after bonding the metal wire 5 to the final joint location, as indicated by the arrow 10, the bonding head 12 moves in the direction opposite to the direction in which the trajectory of the metal wire 5 is formed while rising. After the movement is completed, as indicated by the arrow 11, the cutter 4 descends to cut the metal wire 5.

[0031] Generally, in the manufacture of semiconductor devices, there are a plurality of metal wires 5 wired in the above four processes, and the semiconductor element 8 is mounted on the lead frame 7 via the bonding material 6. In order to achieve normal bonding of the metal wire 5, it is necessary to accurately and surely press the lead frame 7 during wire bonding.

[0032] (Effect) As described above, the semiconductor manufacturing apparatus according to Embodiment 1 includes a bottom lead frame presser jig 17 on which the lead frame 7 is mounted on the upper surface, a bonding head 12 disposed above the bottom lead frame presser jig 17 and performing wire bonding on the lead frame 7 by ultrasonic vibration, and a lead frame pressing mechanism 18 that presses the lead frame 7 against the bottom lead frame presser jig 17. The bonding head 12 and the lead frame pressing mechanism 18 are movable in the horizontal and vertical directions.

[0033] Therefore, since the lead frame pressing mechanism 18 can move in the horizontal and vertical directions in accordance with the wire bonding portion different for each product, the number of changeover operations can be reduced in the manufacturing process of the semiconductor device. As a result, it is not necessary to manufacture the upper pressing members different for each product, and the design man-hours and manufacturing man-hours related to the jig can be reduced. Further, since the number of changeover operations is reduced, it is possible to realize an improvement in productivity accompanying an improvement in cycle time.

[0034] In addition, since the lead frame pressing mechanism 18 is provided on the bonding head 12, the bonding head 12 and the lead frame pressing mechanism 18 can be operated integrally.

[0035] In addition, since the bonding head 12 and the lead frame pressing mechanism 18 operate simultaneously in the horizontal and vertical directions, the drive mechanisms of the bonding head 12 and the lead frame pressing mechanism 18 can be shared. As a result, the semiconductor manufacturing apparatus can be miniaturized.

[0036] In addition, since the bonding head 12 is rotatable about its central axis, the metal wires 5 are less likely to interfere with each other even in a location where the area of the wire bonding portion is narrow, and wire bonding can be performed.

[0037] In addition, since the lead frame pressing mechanism 18 is rotatable about its central axis, it becomes easier to press the lead frame 7 even in a location where the area of the wire bonding portion is narrow and in a location where the angle of the wire bonding portion is different.

[0038] <Embodiment 2> Next, a semiconductor manufacturing apparatus according to Embodiment 2 will be described. FIG. 7 is a side view of the semiconductor manufacturing apparatus according to Embodiment 2. In Embodiment 2, the same components as those described in Embodiment 1 are denoted by the same reference numerals and the description thereof is omitted.

[0039] In Embodiment 1, the lead frame pressing mechanism 18 was provided on the bonding head 12, whereas in Embodiment 2, as shown in FIG. 7, the lead frame pressing mechanism 18 is provided on the bottom side lead frame pressing jig 17.

[0040] The lead frame holding mechanism 18 is formed in a shape extending in the vertical direction, and a groove 18a is provided at the upper end of the lead frame holding mechanism 18 so as to be able to hold the side portion of the lead frame 7. Instead of the groove 18a, a protruding portion (not shown) for pressing the upper surface of the lead frame 7 may be provided at the upper end of the lead frame holding mechanism 18. The lead frame holding mechanism 18 is connected to a drive mechanism (not shown) different from the drive mechanism of the bonding head 12 so as to be movable independently in the horizontal and vertical directions. The number of mounted lead frame holding mechanisms 18 is the minimum number that can securely fix the lead frame 7, and there is no restriction on the number of mounted lead frame holding mechanisms 18.

[0041] Next, the operation of the semiconductor manufacturing apparatus will be described. FIG. 8 is a flowchart showing the operation of the semiconductor manufacturing apparatus according to the second embodiment.

[0042] First, as shown in FIG. 8, the lead frame 7 is conveyed (step S11), and after moving the lead frame holding mechanism 18 to an arbitrary position, it is lowered (step S12). The position of the lead frame 7 is fixed by pressing the lead frame 7 against the bottom-side lead frame holding jig 17 with the groove 18a of the lead frame holding mechanism 18.

[0043] Next, the bonding head 12 is moved above a desired wire bonding position on the semiconductor element 8 bonded to the lead frame 7 with the bonding material 6 (step S13), and wire bonding is started (step S14). After the wire bonding is completed, steps S12 to S14 are repeatedly performed (step S15).

[0044] As described above, in the semiconductor manufacturing apparatus according to the second embodiment, since the lead frame holding mechanism 18 is provided on the bottom-side lead frame holding jig 17, the lead frame holding mechanism 18 and the bonding head 12 can be operated separately. As a result, the bonding accuracy can be improved.

[0045] <Embodiment 3> Next, a semiconductor manufacturing apparatus according to Embodiment 3 will be described. FIG. 9 is a side view of a bottom-side lead frame holding jig 17 and a vacuum generation circuit 21 included in the semiconductor manufacturing apparatus according to Embodiment 3. In Embodiment 3, the same components as those described in Embodiments 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted.

[0046] As shown in FIG. 9, in Embodiment 3, the structure of the bottom-side lead frame holding jig 17 is different from that of Embodiment 1. The bottom-side lead frame holding jig 17 is constituted by a vacuum adsorption block. A vacuum generation circuit 21 is provided on the lower surface of the bottom-side lead frame holding jig 17. In FIG. 9, illustration of the bonding head 12 and the lead frame holding mechanism 18 is omitted.

[0047] With the lead frame 7 placed on the bottom-side lead frame holding jig 17, by turning on the vacuum generation circuit 21, a negative pressure is generated between the bottom-side lead frame holding jig 17 and the bottom surface of the lead frame 7. Then, by adsorbing the lead frame 7 to the bottom-side lead frame holding jig 17, the position of the lead frame 7 is fixed. Note that there are no restrictions on the size and number of the adsorption holes provided in the bottom-side lead frame holding jig 17.

[0048] Next, the operation of the semiconductor manufacturing apparatus will be described. However, only the operation of fixing the position of the lead frame 7 by the bottom-side lead frame holding jig 17 will be described. FIG. 10 is a flowchart showing the operation of the semiconductor manufacturing apparatus according to Embodiment 3.

[0049] First, as shown in FIG. 10, the lead frame 7 is transported (step S21), and the lead frame 7 is placed on the bottom-side lead frame holding jig 17 (step S22). The vacuum generation circuit 21 is turned on to start vacuum adsorption (step S23).

[0050] Next, in the same manner as in the case of the first embodiment, the lead frame 7 is pressed against the bottom-side lead frame pressing jig 17 at the tip of the lead frame pressing mechanism 18 to fix the position of the lead frame 7. After the position of the lead frame 7 is fixed, wire bonding is started (step S24), and in this state, ultrasonic waves are applied through the bonding tool 2 to bond the metal wire 5 to the semiconductor element 8.

[0051] After the wire bonding is completed, the vacuum generation circuit 21 is turned off to release the vacuum adsorption (step S25).

[0052] It should be noted that instead of the first embodiment, it is also possible to add the configuration of the third embodiment to the configuration of the second embodiment.

[0053] As described above, in the semiconductor manufacturing apparatus according to the third embodiment, the vacuum generation circuit 21 is provided on the lower surface of the bottom-side lead frame pressing jig 17, and the lead frame 7 is fixed to the bottom-side lead frame pressing jig 17 by vacuum adsorption.

[0054] Therefore, compared with the cases of the first and second embodiments, the fixing of the lead frame 7 is strengthened, so that the lead frame 7 does not move even when receiving ultrasonic vibrations from the bonding head 12. Therefore, the ultrasonic vibrations from the bonding head 12 are accurately transmitted, leading to an improvement in the strength of wire bonding.

[0055] <Fourth Embodiment> Next, a semiconductor manufacturing apparatus according to the fourth embodiment will be described. FIG. 11 is a side view of the bottom-side lead frame pressing jig 17 and the magnetic force generation circuit 22 provided in the semiconductor manufacturing apparatus according to the fourth embodiment. In the fourth embodiment, the same components as those described in the first to third embodiments are denoted by the same reference numerals and the description thereof is omitted.

[0056] As shown in FIG. 11, in the fourth embodiment, the magnetic force generation circuit 22 is further provided in addition to the configuration of the first embodiment. The magnetic force generation circuit 22 is provided on the lower surface of the bottom-side lead frame holding jig 17. In FIG. 11, the illustration of the bonding head 12 and the lead frame holding mechanism 18 is omitted.

[0057] With the lead frame 7 placed on the bottom-side lead frame holding jig 17, by turning on the magnetic force generation circuit 22, a magnetic force is generated on the lead frame 7. Then, the position of the lead frame 7 is fixed by magnetically adsorbing the lead frame 7 to the bottom-side lead frame holding jig 17.

[0058] Next, the operation of the semiconductor manufacturing apparatus will be described. However, only the operation of fixing the position of the lead frame 7 by the bottom-side lead frame holding jig 17 will be described. FIG. 12 is a flowchart showing the operation of the semiconductor manufacturing apparatus according to the fourth embodiment.

[0059] As shown in FIG. 12, in steps S31 and S32, the same processing as steps S21 and S22 in FIG. 10 is performed. Next, in step S33, the magnetic force generation circuit 22 is turned on to start magnetic adsorption. In step S34, after performing the same processing as step S24 in FIG. 10, in step S35, after wire bonding is completed, the magnetic force generation circuit 22 is turned off to release the magnetic adsorption.

[0060] Note that it is also possible to add the configuration of the fourth embodiment to the configuration of the second embodiment instead of the first embodiment.

[0061] As described above, in the semiconductor manufacturing apparatus according to the fourth embodiment, the bottom-side lead frame holding jig 17 is provided with the magnetic force generation circuit 22, and the lead frame 7 is fixed to the bottom-side lead frame holding jig 17 by magnetic adsorption.

[0062] Therefore, since the fixation of the lead frame 7 is strengthened compared to the cases of Embodiments 1 and 2, the lead frame 7 does not move even when receiving ultrasonic vibrations from the bonding head 12. As a result, the ultrasonic vibrations from the bonding head 12 are accurately transmitted, leading to an improvement in the strength of wire bonding.

[0063] <Embodiment 5> Next, a semiconductor manufacturing apparatus according to Embodiment 5 will be described. FIG. 13 is a side view of a bottom-side lead frame retainer 17 and a magnetic force generation circuit 22 included in the semiconductor manufacturing apparatus according to Embodiment 5. In Embodiment 5, the same components as those described in Embodiments 1 to 4 are denoted by the same reference numerals and the description thereof is omitted.

[0064] As shown in FIG. 13, in Embodiment 5, the structure of the bottom-side lead frame retainer 17 is different from that of Embodiment 1. The bottom-side lead frame retainer 17 includes a magnetorheological (MR) fluid 23b. Specifically, the bottom-side lead frame retainer 17 includes a deformable case 23a and the MR fluid 23b filled in the case 23a. The case 23a is connected to a magnetic force generation circuit 22 provided on the lower surface of the case 23a. In FIG. 13, the illustration of the bonding head 12 and the lead frame pressing mechanism 18 is omitted.

[0065] With the lead frame 7 disposed on the bottom-side lead frame retainer 17, by turning on the magnetic force generation circuit 22, the MR fluid 23b in the case 23a is solidified together with the case 23a in a state conforming to the shape of the lead frame 7 to grip the lead frame 7. Thereby, the position of the lead frame 7 is fixed. Note that the MR fluid is a fluid that reversibly changes to a solid or fluid state by applying or removing a magnetic field.

[0066] Next, the operation of the semiconductor manufacturing apparatus will be described. However, only the operation of fixing the position of the lead frame 7 by the bottom surface side lead frame pressing jig 17 will be described. FIG. 14 is a flowchart showing the operation of the semiconductor manufacturing apparatus according to the fifth embodiment.

[0067] As shown in FIG. 14, in steps S41 and S42, the same processes as steps S21 and S22 in FIG. 10 are performed. Next, in step S43, the magnetic force generation circuit 22 is turned on to start the solidification of the MR fluid 23b. In step S44, after performing the same process as step S24 in FIG. 10, in step S45, after wire bonding is completed, the magnetic force generation circuit 22 is turned off to fluidize the MR fluid 23b.

[0068] Note that, instead of the first embodiment, it is also possible to add the configuration of the fourth embodiment to the configuration of the second embodiment.

[0069] As described above, in the semiconductor manufacturing apparatus according to the fifth embodiment, the bottom surface side lead frame pressing jig 17 includes the MR fluid 23b and is connected to the magnetic force generation circuit 22 provided in the bottom surface side lead frame pressing jig 17.

[0070] Therefore, since the fixing of the lead frame 7 is strengthened compared to the cases of the first and second embodiments, the lead frame 7 does not move even when receiving ultrasonic vibration from the bonding head 12. Therefore, the ultrasonic vibration from the bonding head 12 is accurately transmitted, leading to an improvement in the strength of wire bonding.

[0071] <Embodiment 6> Next, the semiconductor manufacturing apparatus according to the sixth embodiment will be described. FIG. 15 is a side view of the bottom surface side lead frame pressing jig 17 and the energization circuit 25 provided in the semiconductor manufacturing apparatus according to the sixth embodiment. In the sixth embodiment, the same components as those described in the first to fifth embodiments are denoted by the same reference numerals and the description thereof is omitted.

[0072] As shown in FIG. 15, in Embodiment 6, the structure of the bottom-side lead frame pressing jig 17 is different from that in Embodiment 1. The bottom-side lead frame pressing jig 17 contains an ER (Electrorheological) fluid 24b. Specifically, the bottom-side lead frame pressing jig 17 includes a deformable case 24a and the ER fluid 24b filled in the case 24a. The case 24a is connected to an energization circuit 25 provided on the lower surface of the case 24a. In FIG. 15, illustration of the bonding head 12 and the lead frame pressing mechanism 18 is omitted.

[0073] With the lead frame 7 placed on the bottom-side lead frame pressing jig 17, by turning on the energization circuit 25, the ER fluid 24b in the case 24a is solidified along with the case 24a in a state conforming to the shape of the lead frame 7 to grip the lead frame 7. Thereby, the position of the lead frame 7 is fixed. Note that the ER fluid is a fluid that reversibly changes to a solid or fluid state by applying or removing an electric field.

[0074] Next, the operation of the semiconductor manufacturing apparatus will be described. However, only the operation of fixing the position of the lead frame 7 by the bottom-side lead frame pressing jig 17 will be described. FIG. 16 is a flowchart showing the operation of the semiconductor manufacturing apparatus according to Embodiment 6.

[0075] As shown in FIG. 16, in steps S51 and S52, the same processes as steps S21 and S22 in FIG. 10 are performed. Next, in step S53, the energization circuit 25 is turned on to start solidification of the ER fluid 24b. In step S54, after performing the same process as step S24 in FIG. 10, in step S55, after wire bonding is completed, the energization circuit 25 is turned off to fluidize the ER fluid 24b.

[0076] Note that it is also possible to add the configuration of Embodiment 4 to the configuration of Embodiment 2 instead of Embodiment 1.

[0077] As described above, in the semiconductor manufacturing apparatus according to Embodiment 6, the bottom surface side lead frame pressing jig 17 includes the ER fluid 24b and is connected to the energization circuit 25 provided in the bottom surface side lead frame pressing jig 17.

[0078] Therefore, compared with the cases of Embodiments 1 and 2, the fixing of the lead frame 7 is strengthened, so that the lead frame 7 does not move even when receiving ultrasonic vibration from the bonding head 12. Therefore, the ultrasonic vibration from the bonding head 12 is accurately transmitted, leading to an improvement in the strength of wire bonding.

[0079] It should be noted that each embodiment can be freely combined, or each embodiment can be appropriately modified or omitted.

[0080] Hereinafter, aspects of the present disclosure will be summarized as appendices.

[0081] (Appendix 1) A bottom surface side lead frame pressing jig on which a lead frame is mounted on the upper surface, A bonding head disposed above the bottom surface side lead frame pressing jig and performing wire bonding on the lead frame by ultrasonic vibration, A lead frame pressing mechanism for pressing the lead frame against the bottom surface side lead frame pressing jig, and a semiconductor manufacturing apparatus, wherein the bonding head and the lead frame pressing mechanism are movable in horizontal and vertical directions.

[0082] (Appendix 2) The semiconductor manufacturing apparatus according to Appendix 1, wherein the lead frame pressing mechanism is provided on the bonding head.

[0083] (Appendix 3) The semiconductor manufacturing apparatus according to Appendix 2, wherein the bonding head and the lead frame pressing mechanism operate simultaneously in the horizontal and vertical directions.

[0084] ​(Appendix 4) The lead frame pressing mechanism is provided on the bottom surface side lead frame pressing jig, and the semiconductor manufacturing apparatus according to Appendix 1.

[0085] (Appendix 5) The bonding head is rotatable about its central axis, and the semiconductor manufacturing apparatus according to any one of Appendices 1 to 4.

[0086] (Appendix 6) The lead frame pressing mechanism is rotatable about its central axis, and the semiconductor manufacturing apparatus according to any one of Appendices 1 to 3.

[0087] (Appendix 7) A vacuum generation circuit is provided in the bottom surface side lead frame pressing jig, The lead frame is fixed to the bottom surface side lead frame pressing jig by vacuum adsorption, and the semiconductor manufacturing apparatus according to any one of Appendices 1 to 6.

[0088] (Appendix 8) A magnetic force generation circuit is provided in the bottom surface side lead frame pressing jig, The lead frame is fixed to the bottom surface side lead frame pressing jig by magnetic force adsorption, and the semiconductor manufacturing apparatus according to any one of Appendices 1 to 6.

[0089] (Appendix 9) The bottom surface side lead frame pressing jig contains MR (Magnetorheological) fluid and is connected to a magnetic force generation circuit provided in the bottom surface side lead frame pressing jig, and the semiconductor manufacturing apparatus according to any one of Appendices 1 to 6.

[0090] (Appendix 10) The bottom surface side lead frame pressing jig contains ER (Electrorheological) fluid and is connected to an energization circuit provided in the bottom surface side lead frame pressing jig, and the semiconductor manufacturing apparatus according to any one of Appendices 1 to 6.

Description of Symbols

[0091] 7 lead frame, 12 bonding head, 17 bottom-side lead frame pressing jig, 18 lead frame pressing mechanism, 21 vacuum generation circuit, 22 magnetic force generation circuit, 23b MR fluid, 24b ER fluid, 25 energization circuit.

Claims

1. A bottom-side lead frame holder jig on which a lead frame is mounted on the upper surface, A bonding head disposed above the bottom-side lead frame holder jig and performing wire bonding on the lead frame by ultrasonic vibration, A lead frame pressing mechanism for pressing the lead frame against the bottom-side lead frame holder jig, and comprising: A semiconductor manufacturing apparatus, wherein the bonding head and the lead frame pressing mechanism are movable in a horizontal direction and a vertical direction.

2. The semiconductor manufacturing apparatus according to claim 1, wherein the lead frame pressing mechanism is provided on the bonding head.

3. The semiconductor manufacturing apparatus according to claim 2, wherein the bonding head and the lead frame pressing mechanism operate simultaneously in the horizontal direction and the vertical direction.

4. The semiconductor manufacturing apparatus according to claim 1, wherein the lead frame pressing mechanism is provided on the bottom-side lead frame holder jig.

5. The semiconductor manufacturing apparatus according to claim 1, wherein the bonding head is rotatable about its central axis.

6. The semiconductor manufacturing apparatus according to claim 1, wherein the lead frame pressing mechanism is rotatable about its central axis.

7. A vacuum generation circuit is provided in the bottom-side lead frame holder jig, The semiconductor manufacturing apparatus according to any one of claims 1 to 6, wherein the lead frame is fixed to the bottom-side lead frame holder jig by vacuum adsorption.

8. A magnetic force generation circuit is provided in the bottom-side lead frame holder jig, The semiconductor manufacturing apparatus according to any one of claims 1 to 6, wherein the lead frame is fixed to the bottom-side lead frame holder jig by magnetic adsorption.

9. The bottom-side lead frame holder jig contains MR (Magnetorheological) fluid and is connected to a magnetic force generation circuit provided in the bottom-side lead frame holder jig. The semiconductor manufacturing apparatus according to any one of claims 1 to 6.

10. The bottom-side lead frame holder jig contains ER (Electrorheological) fluid and is connected to an energization circuit provided in the bottom-side lead frame holder jig. The semiconductor manufacturing apparatus according to any one of claims 1 to 6.

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