Control device and drive device

Abstract

To provide a control device capable of inhibiting increase in size while cooling an electronic component efficiently, and to provide a drive device.SOLUTION: In a drive device 1, a control device 7 located above a motor 2 and configured to control the motor has: a power module 11; a first electronic component 12 having a function of one of voltage adjustment, current distribution, and a capacitor; and a housing 6C which houses the power module 11 and the first electronic component 12. The housing 6C has: a case part 61A having an opening which is open to the upper side; and a lid part 64 which covers the opening. The case part 61A is provided with a passage 90. The passage 90 has a cooling passage part 90A which overlaps with at least one of the power module 11 and the first electronic component 12 in a vertical direction.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a control device and a drive device.

Background Art

[0002] A control device for controlling a motor is provided with a plurality of electronic components as heating elements. The control device is provided with a flow path for cooling the electronic components (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The plurality of electronic components each have a different heat generation amount. Therefore, in the control device, simply arranging the electronic components along the flow path not only increases the size of the control device but also cannot sufficiently increase the cooling efficiency for each electronic component.

[0005] In view of the above circumstances, an object of the present invention is to provide a control device and a drive device that can suppress the increase in size while efficiently cooling the electronic components.

Means for Solving the Problems

[0006] One aspect of the drive device of the present invention is a control device located above the motor for controlling the motor, which includes a power module, a first electronic component having any one of functions of voltage adjustment, current distribution, or a capacitor, and a housing for housing the power module and the first electronic component. The housing has a case portion having an opening that opens upward, and a lid portion that covers the opening. A flow path is provided in the case portion. The flow path has a cooling flow path portion that overlaps at least one of the power module or the first electronic component in the vertical direction.

[0007] One aspect of the drive device of the present invention includes the above-described control device, the motor, and a motor housing for housing the motor. The housing and the motor housing are connected to each other.

Advantages of the Invention

[0008] One of the objectives of one aspect of the present invention is to provide a control device and a drive device that can suppress the increase in size while efficiently cooling electronic components.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0010] Hereinafter, the drive device of the embodiment will be described with reference to the drawings. In the following description, the direction of gravity is defined based on the positional relationship when the drive device is mounted on a vehicle located on a horizontal road surface. In addition, XYZ coordinates are appropriately shown in each figure. The Z-axis is the vertical direction, the +Z side is the upper side, and the -Z side is the lower side. The Y-axis is the left-right direction of the vehicle on which the drive device is mounted. The X-axis is the front-rear direction of the vehicle on which the drive device is mounted.

[0011] In the following description, unless otherwise specified, the direction parallel to the first axis J1 of the motor 2 (Y-axis direction) is simply referred to as "axial direction Y", the radial direction centered on the first axis J1 is simply referred to as "radial direction", and the circumferential direction centered on the first axis J1, that is, the circumference around the first axis J1 is simply referred to as "circumferential direction". Furthermore, in the following description, the direction parallel to the Z-axis is referred to as the vertical direction Z.

[0012] Also, in the following description, the direction parallel to the Z-axis is referred to as the "vertical direction Z", and one direction orthogonal to the vertical direction Z is defined as the first direction D1. In this specification, the first direction D1 is orthogonal not only to the vertical direction Z but also to the axial direction Y, and is a direction parallel to the X-axis direction. However, the first direction D1 may be a direction intersecting the X-axis direction, or may be a direction parallel to the axial direction Y.

[0013] In the following description, one side of the first direction D1 is the direction (+D1) in which the arrow of the first direction D1 in the figure points, and the other side of the first direction D1 is the direction opposite to the direction in which the arrow of the first direction D1 in the figure points (-D1).

[0014] <Drive Device> FIG. 1 is a perspective view of the drive device 1 of the present embodiment. The drive device 1 of the present embodiment is mounted on a vehicle having a motor 2 as a power source, such as a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHV), or an electric vehicle (EV), and is used as the power source thereof.

[0015] The drive device 1 includes a motor 2, a transmission mechanism 3, and a control device 7. Further, as will be described later, the motor 2 has a motor housing 6A, the transmission mechanism 3 has a gear housing 6B, and the control device 7 has an electronic component housing (housing) 6C. The motor housing 6A, the gear housing 6B, and the electronic component housing 6C are connected to each other to form a housing connection body 6. That is, the housing connection body 6 houses the motor 2, the transmission mechanism 3, and the control device 7.

[0016] The housing connection body 6 is configured by combining a plurality of members. The housing connection body 6 has a housing main body 61, a first lid member 63, a second lid member 62, and a third lid member (lid portion) 64. A part of the housing main body 61 and the first lid member 63 constitute the motor housing 6A. A part of the housing main body 61 and the second lid member 62 constitute the gear housing 6B. A part of the housing main body 61 and the third lid member 64 constitute the electronic component housing 6C.

[0017] <Motor> FIG. 2 is a schematic cross-sectional view of the drive device 1 of the present embodiment. The motor 2 of the present embodiment is, for example, an inner rotor type three-phase AC motor. The motor 2 has both a function of outputting power as a motor and a function of generating electricity as a generator. The motor 2 may be used as either an engine or a generator. Further, the configuration of the motor 2 is not limited to the present embodiment, and for example, an AC motor having four or more phases may be used.

[0018] The motor 2 has a rotor 20, a stator 25, and a motor housing 6A. The rotor 20 is rotatable about a first axis J1. The rotor 20 is rotatably supported by the motor housing 6A via a bearing (not shown). The stator 25 is located radially outside the rotor 20 and surrounds the rotor 20 from the radially outside. The stator 25 is fixed to the inner surface of the motor housing 6A.

[0019] The motor housing 6A houses the rotor 20 and the stator 25. The motor housing 6A has a cylindrical tubular portion 6d centered on the first axis J1 and a first lid member 63 that covers the opening on the other axial side (-Y) of the tubular portion 6d. The tubular portion 6d surrounds the stator 25 from the radially outside. The tubular portion 6d is part of the housing body 61. The first lid member 63 shown in FIG. 1 is fastened to the tubular portion 6d.

[0020] <Transmission mechanism> As shown in FIG. 1, the transmission mechanism 3 is located on one axial side (+Y) of the motor 2. The transmission mechanism 3 is connected to the rotor 20. The transmission mechanism 3 has a plurality of gears (not shown), a plurality of shafts, and a differential device for transmitting the power of the rotor 20, a gear housing 6B that houses these, and an output shaft 55 that outputs the power of the rotor 20. The differential device transmits the same torque to a pair of output shafts 55 while absorbing the speed difference between the left and right wheels during vehicle turning. The output shaft 55 is rotatable about a second axis J3 parallel to the first axis J1. A wheel (not shown) is provided on each of the pair of output shafts 55. In the present embodiment, the output shaft 55 is located on the other side (-D1) in the first direction with respect to the first axis J1.

[0021] <Control device> The control device 7 controls the motor 2. The control device 7 has at least the function of an inverter. That is, the control device 7 is connected to the battery and converts the direct current supplied from the battery into an alternating current. Further, the control device 7 is connected to the stator 25 and supplies an alternating current to the stator 25. The control device 7 is located above the motor 2 and on the other axial side (-Y) of the transmission mechanism 3.

[0022] As shown in FIG. 2, the control device 7 of the present embodiment includes a power module 11, a power integration system (first electronic component) 12, a current distribution unit (second electronic component) 13, a capacitor (second electronic component) 14, a heating device 15, and an electronic component housing 6C. Note that the electronic components provided in the control device 7 are not limited to those described above. Further, the control device 7 may further include electronic components other than the above-described electronic components.

[0023] The power module 11 includes, for example, a switching element and a circuit board on which the switching element is mounted. The switching element is, for example, an insulated gate bipolar transistor (IGBT: Insulated Gate Bipolar Transistor). Further, the switching element may be a field effect transistor such as a metal oxide semiconductor field effect transistor (MOSFET; Metal-Oxide-Semiconductor Field-Effect Transistor).

[0024] The power integration system 12 has a function of voltage adjustment. The power integration system 12 of the present embodiment includes, for example, an on-board charger (OBC; On Board Charger) 12a and a DC / DC converter 12b. The on-board charger 12a is a system for converting an AC voltage supplied via a plug into a DC voltage and charging a battery. The DC / DC converter 12b is a part for converting the voltage supplied from the battery and charging another battery with a low voltage. Note that the power integration system 12 only needs to include at least one of the DC / DC converter 12b or the on-board charger 12a. Note that the DC / DC converter 12b may boost the voltage supplied from the battery and supply it to other electronic components or the like.

[0025] The current distribution unit 13 is a power distribution unit (PDU: Power Distribution Unit) that has the function of current distribution. The current distribution unit 13 is a part that distributes the current supplied from the battery to various electrical components in the vehicle including the power module 11.

[0026] The capacitor 14 is, for example, a film capacitor. The capacitor 14 is connected between the battery (not shown) and the power module 11. The capacitor 14 is provided to smooth the direct current supplied to the power module 11.

[0027] The heating device 15 has a heater part 15a and a heater control part (control part) 15b. A pipeline P is connected to the heater part 15a. The pipeline P is a circulation path for circulating a fluid such as water, refrigerant, or air. An external device to be heated by the heater part 15a is connected in the path of the pipeline P. The external device to be heated by the heating device 15 is, for example, the battery. The heating device 15 heats the fluid in the pipeline P in the heater part 15a and heats the battery through this fluid. The heater control part 15b is connected to a temperature sensor (not shown) that measures the temperature of the battery. The heater control part 15b controls the heater part 15a according to the temperature of the battery detected by the temperature sensor. Note that the heating device 15 may be used as a heater in heating equipment.

[0028] The electronic component housing 6C houses the power module 11, the power integration system 12, the current distribution unit 13, the capacitor 14, and the heater control part 15b. The electronic component housing 6C has a case part 61A and a third lid member 64.

[0029] The case portion 61A has a first opening 61h that opens upward (+Z). The case portion 61A includes a case portion main body 66 and a flow path member (wall portion) 65. The case portion main body 66 is a part of the housing main body 61. The case portion main body 66 and the cylindrical portion 6d are parts of a single member. Also, the case portion main body 66 is located above the cylindrical portion 6d and is connected to the cylindrical portion 6d. That is, the case portion 61A is connected to the motor housing 6A.

[0030] The case portion main body 66 has a first bottom wall portion (bottom portion) 61b, a first side wall portion 61c, a first flange portion 61f, and a plurality of support pillar portions 61u. That is, the case portion 61A has the first bottom wall portion 61b, the first side wall portion 61c, the first flange portion 61f, and the plurality of support pillar portions 61u. The first bottom wall portion 61b extends along a plane orthogonal to the vertical direction Z. The first bottom wall portion 61b is located below (-Z) the first opening 61h. The first bottom wall portion 61b is integrally connected to the cylindrical portion 6d. The first bottom wall portion 61b has a shared wall portion 61n that also functions as a part of the cylindrical portion 6d. In the present embodiment, the shared wall portion 61n curves in a substantially arc shape around the first axis J1. The first bottom wall portion 61b has a first inner surface 61k facing upward (+Z). The first side wall portion 61c extends upward (+Z) from the outer edge of the first bottom wall portion 61b. The first flange portion 61f is provided at the upper end of the first side wall portion 61c. The first flange portion 61f surrounds the first opening 61h in a frame shape. The first flange portion 61f protrudes in a direction away from the first opening 61h along a plane orthogonal to the vertical direction Z. The support pillar portion 61u extends upward (+Z) from the first inner surface 61k of the first bottom wall portion 61b. A flow path member 65 is attached to the upper end portion of the support pillar portion 61u. That is, the flow path member 65 is fixed to the first bottom wall portion 61b.

[0031] The flow path member 65 is plate-shaped and extends along a plane orthogonal to the vertical direction Z. The flow path member 65 is a so-called water jacket. The flow path member 65 is positioned between the first bottom wall portion 61b and the second bottom wall portion 64b in the vertical direction Z. That is, the flow path member 65 is positioned above the first bottom wall portion 61b. The flow path member 65 faces the first inner surface 61k in the vertical direction Z with a gap therebetween. Also, the flow path member 65 faces the second inner surface 64k in the vertical direction Z with a gap therebetween. The flow path member 65 is positioned below the third lid member 64 and above the case portion main body 66.

[0032] The third lid member 64 is positioned above the case portion 61A. The third lid member 64 is connected to the upper side (+Z) of the case portion 61A. The third lid member 64 has a second opening portion 64h that opens downward (-Z). The third lid member 64 has a second bottom wall portion 64b, a second side wall portion 64c, and a second flange portion 64f. The second bottom wall portion 64b extends along a plane orthogonal to the vertical direction Z. The second bottom wall portion 64b has a second inner surface 64k facing downward (-Z) and an outer surface 64g facing upward (+Z). The second side wall portion 64c extends downward (-Z) from the outer edge of the second bottom wall portion 64b. The second flange portion 64f is provided at the lower end portion of the second side wall portion 64c. The second flange portion 64f surrounds the second opening portion 64h in a frame shape. The second flange portion 64f protrudes in a direction away from the second opening portion 64h along a plane orthogonal to the vertical direction Z.

[0033] The first flange portion 61f and the second flange portion 64f face each other in the vertical direction Z. The first flange portion 61f and the second flange portion 64f are fastened to each other. Thereby, the case portion 61A and the third lid member 64 are connected to each other. Also, the third lid member 64 covers the first opening portion 61h, and the case portion 61A covers the second opening portion 64h. Thereby, the internal space of the case portion 61A and the internal space of the third lid member 64 are connected to form the internal space A of the electronic component housing 6C. A seal member may be sandwiched between the first flange portion 61f and the second flange portion 64f.

[0034] The internal space A of the electronic component housing 6C is surrounded by a first bottom wall portion 61b, a second bottom wall portion 64b, a first side wall portion 61c, and a second side wall portion 64c. The first inner surface 61k of the first bottom wall portion 61b and the second inner surface 64k of the second bottom wall portion 64b face each other in the vertical direction Z. The power integration system 12, the current distribution unit 13, and the heater control unit 15b of the present embodiment are fixed to the second inner surface 64k. Also, the power module 11 and the capacitor 14 of the present embodiment are fixed to the upper surface 65a of the flow path member 65.

[0035] A flow path 90 is provided in the housing connector 6. The flow path 90 is a path through which a fluid flows. A part of the flow path 90 is constituted by a hole provided in the housing connector 6. Also, another part of the flow path 90 is constituted by the inner surface of a recess provided in the housing connector 6 and a member covering the recess. In this specification, the flow path 90 does not necessarily represent a single circulation path and may include a plurality of circulation paths. When the flow path 90 has a plurality of circulation paths, the fluids flowing through the respective circulation paths may be of the same type or different types. The fluid flowing through the flow path 90 is, for example, water, oil, or an ethylene glycol aqueous solution.

[0036] The flow path 90 of the present embodiment has a first flow path portion 91 and a third flow path portion 94. The first flow path portion 91 is provided in the electronic component housing 6C. The third flow path portion 94 is provided in the motor housing 6A. In the present embodiment, the first flow path portion 91 and the third flow path portion 94 constitute a single circulation path. Therefore, the same fluid flows through the first flow path portion 91 and the third flow path portion 94 of the present embodiment. In the present embodiment, the fluid flows through each part of the flow path 90 in the order of the first flow path portion 91 and the third flow path portion 94. Also, the downstream end of the third flow path portion 94 and the upstream end of the first flow path portion 91 are connected to each other via a flow path portion (not shown). A pump for pumping the fluid, a radiator for cooling the fluid, etc. are provided in this flow path portion.

[0037] The first flow path portion 91 extends in a meandering manner inside the flow path member 65. That is, the first flow path portion 91 is provided in the case portion 61A. The power integration system 12 and the capacitor 14 are in contact with the upper surface 65a of the flow path member 65. The first flow path portion 91 cools the power integration system 12 and the capacitor 14. According to the present embodiment, by using the plate-shaped flow path member 65, the power integration system 12 and the capacitor 14 can be efficiently cooled.

[0038] In the present embodiment, the first flow path portion 91 provided in the case portion 61A has a cooling flow path portion 90A. The cooling flow path portion 90A is a region of the first flow path portion 91 that overlaps at least one of the power module 11 or the power integration system 12 in the vertical direction Z. According to the present embodiment, since the cooling flow path portion 90A overlaps the power module 11 or the power integration system 12 in the vertical direction Z, the power module 11 or the power integration system 12 can be cooled. In the present embodiment, the cooling flow path portion 90A overlaps both the power module 11 and the power integration system 12. The cooling flow path portion 90A of the present embodiment is provided in the flow path member 65 to which the power module 11 is fixed. Therefore, the cooling flow path portion 90A can effectively cool the power module 11. The cooling flow path portion 90A of the present embodiment does not directly cool the power integration system 12. However, since the cooling flow path portion 90A overlaps the power integration system 12 in the vertical direction Z, the power integration system 12 can be cooled by adopting a structure that easily transfers heat between the second bottom wall portion 64b and the power integration system 12. That is, the cooling flow path portion 90A overlaps the power integration system 12 in the vertical direction Z, making it easier to cool the power integration system 12. As a structure that easily transfers heat, for example, a heat transfer material can be arranged in the gap in the vertical direction Z between the second bottom wall portion 64b and the power integration system 12.

[0039] The cooling flow path portion 90A is preferably located below at least one of the power module 11 or the power integration system 12. The cooling flow path portion 90A of the present embodiment is located below both the power module 11 and the power integration system 12. As described above, the cooling flow path portion 90A is provided in the case portion 61A that covers the internal space A of the electronic component housing 6C from below. Therefore, by arranging the cooling flow path portion 90A below the power module 11 and the power integration system 12, the structure of the cooling flow path portion 90A can be simplified.

[0040] The third flow path portion 94 is provided in the cylindrical portion 6d. That is, the third flow path portion 94 is provided in the motor housing 6A. The third flow path portion 94 of the present embodiment extends spirally along the axial direction Y around the first axis J1. The fluid flowing through the third flow path portion 94 receives heat from the motor 2. That is, the third flow path portion 94 cools the motor 2.

[0041] The third flow path portion 94 is not limited to the present embodiment as long as it cools the motor 2. The motor 2 may extend while meandering in the axial direction or the circumferential direction inside the wall of the cylindrical portion 6d. Further, the third flow path portion 94 may cool the motor 2 by directly applying fluid to the motor 2. In this case, the third flow path portion 94 may have a structure in which ejection holes for ejecting fluid toward the motor 2 are provided in the inner wall of the motor housing 6A, or a pipe or gutter-shaped member disposed in the internal space of the motor housing 6A and having ejection holes for ejecting fluid toward the motor 2.

[0042] The third flow path portion 94 of the present embodiment overlaps with the portion of the flow path 90 provided in the case portion 61A (the first flow path portion 91 in the present embodiment) in the vertical direction Z. According to the present embodiment, by providing the first flow path portion 91 directly above the third flow path portion 94, the first flow path portion 91 and the third flow path portion 94 can be arranged close to each other. Thereby, the flow path 90 can be partially arranged densely, and heat transfer from members other than the object to be cooled to the fluid in the flow path 90 can be suppressed. Further, by arranging the flow path 90 partially densely, it is possible to make it difficult for the heat generated from the power module 11 and the motor, which are the objects to be cooled, to be transmitted to each other. Furthermore, since the first flow path portion 91 and the third flow path portion 94 overlap in the vertical direction Z, when the first flow path portion 91 and the third flow path portion 94 are connected, the overall length of the flow path 90 can be shortened.

[0043] The cylindrical portion 6d of the present embodiment has a shared wall portion 61n that also functions as a part of the first bottom wall portion 61b. The third flow path portion 94 passes through the shared wall portion 61n. Therefore, a part of the third flow path portion 94 is provided in the first bottom wall portion 61b. Thereby, the third flow path portion 94 cools the internal space of the case portion 61A.

[0044] According to the present embodiment, the power module 11 and the power integration system 12 are arranged side by side in the vertical direction Z. For this reason, compared with the case where the power module 11 and the power integration system 12 are arranged side by side in a direction orthogonal to the vertical direction Z, the control device 7 can be miniaturized in a direction orthogonal to the vertical direction.

[0045] In this embodiment, the power module 11 and the power integration system 12 are arranged above (+Z) the motor 2. Also, the power module 11 is arranged below (-Z) the power integration system 12. The power module 11 is connected to the motor 2 and supplies power to the motor 2. Therefore, if the distance between the power module 11 and the motor 2 increases, the electrical resistance of the connection path (for example, a bus bar) connecting the power module 11 and the motor 2 increases, and there is a risk that the loss when driving the drive device 1 will increase. According to this embodiment, since the power module 11 can be arranged closer to the motor 2 than the power integration system 12, the electrical resistance of the connection path between the power module 11 and the motor 2 can be reduced, and the loss generated in the drive device 1 can be reduced.

[0046] According to this embodiment, the power module 11 is fixed to the case portion 61A, and the power integration system 12 is fixed to the third lid member 64. That is, the power module 11 and the power integration system 12 can be brought into contact with different members (the case portion 61A and the third lid member 64) of the electronic component housing 6C, respectively. Thereby, the heat of the power module 11 and the power integration system 12 can be transmitted to different members and dissipated, and the power module 11 and the power integration system 12 can be efficiently cooled. Also, it is possible to suppress the heat of either the power module 11 or the power integration system 12 from being transmitted to the other.

[0047] According to this embodiment, since the power module 11 and the cooling channel portion 90A are provided in the channel member 65, the power module 11 can be efficiently cooled. Note that a power integration system 12 may be provided in the channel member 65. That is, it is sufficient that at least one of the power module 11 and the power integration system 12 and the cooling channel portion 90A is provided in the channel member 65. Here, for electronic components such as the power module 11 and the power integration system 12, "provided in the channel member 65" means that these electronic components are attached to the channel member 65.

[0048] In this embodiment, the motor 2 and the control device 7 overlap in the vertical direction. Further, the channel member 65 is located between the motor 2 and the power module 11 and the power integration system 12 in the vertical direction Z. Therefore, the cooling channel portion 90A of this embodiment is located between the motor 2 and the power module and the power integration system 12 in the vertical direction Z. According to this embodiment, the cooling channel portion 90A divides the internal space A of the electronic component housing 6C into an upper region and a lower region of the cooling channel portion 90A. Further, the cooling channel portion 90A blocks heat transfer between these upper and lower regions. Thereby, it is possible to suppress the heat of the motor 2 from being transmitted to the power module 11 and the power integration system 12. Similarly, it is possible to suppress the heat of the power module 11 and the power integration system 12 from being transmitted to the motor 2. In this embodiment, the case where both the power module 11 and the power integration system 12 are located above the cooling channel portion 90A has been described. However, if at least one of the power module 11 and the power integration system 12 is located above the cooling channel portion 90A, heat transfer between the one located above the cooling channel portion 90A and the motor 2 can be suppressed. That is, if the cooling channel portion 90A is located between the motor 2 and the power module 11 or the power integration system 12 in the vertical direction Z, at least a part of the above-described effects can be obtained.

[0049] According to this embodiment, the heater control unit 15b, which is a part of the heating device 15, is housed in the electronic component housing 6C. Thereby, it becomes possible to protect the heater control unit 15b by the electronic component housing 6C. Furthermore, by arranging the heater control unit 15b inside the electronic component housing 6C, it becomes easier to cool the heater control unit 15b by the flow path 90, and the reliability of the heating device 15 can be enhanced. In this embodiment, the case where only the heater control unit 15b is housed in the electronic component housing 6C has been described. However, the same effect can be obtained even when both the heater unit 15a and the heater control unit 15b are housed in the electronic component housing 6C.

[0050] In this embodiment, the heater unit 15a of the heating device 15 is fixed to the outer surface 64g of the electronic component housing 6C and is not arranged inside the electronic component housing 6C. According to this embodiment, it is possible to suppress the heat of the heater unit 15a from affecting the electronic components arranged inside the electronic component housing 6C. Note that the heater unit 15a of the heating device 15 may be provided not only on the outer surface of the electronic component housing 6C but also on the outer surface of the motor housing 6A or the gear housing 6B.

[0051] In this embodiment, the case where the cooling channel portion 90A can cool both the power module 11 and the power integration system 12 by overlapping them in the vertical direction Z has been described. However, the cooling channel portion 90A may be capable of cooling other electronic components instead of the power integration system 12. Here, the electronic components other than the power module 11 cooled by the cooling channel portion 90A are referred to as the first electronic component 12. The first electronic component 12 in this embodiment is the power integration system 12, but it may also be the current distribution portion 13 or the capacitor 14. That is, the first electronic component 12 only needs to have any one of the functions of voltage regulation, current distribution, or capacitance. Further, the cooling channel portion 90A is provided in the case portion 61A, and in the vertical direction Z, it only needs to be a part of the channel 90 that overlaps with any one of the power integration system 12, the current distribution portion 13, the capacitor 14, or the power module 11 in the vertical direction Z. In this embodiment, the capacitor 14 may be replaced with the first electronic component, and the portion of the first channel portion 91 that overlaps with the capacitor 14 may be replaced with the cooling channel portion 90B. The cooling channel portion 90B in this case cools the capacitor 14. Furthermore, the current distribution portion 13 may be replaced with the first electronic component, and the portion of the first channel portion 91 that overlaps with the current distribution portion 13 may be replaced with the cooling channel portion 90B.

[0052] In the present embodiment, the capacitor 14 overlaps the power module 11 in the first direction D1. Also, the current distribution unit 13 overlaps the first electronic component 12 in the first direction D1. Here, electronic components other than the power module 11 and the first electronic component 12 that have any one of the functions of voltage regulation, current distribution, or capacitance are referred to as second electronic components 13 and 14. The second electronic components 13 and 14 only need to have any one of the functions of voltage regulation, current distribution, or capacitance. That is, the second electronic components 13 and 14 may be any one of the power integration system 12, the current distribution unit 13, and the capacitor 14. According to the present embodiment, the second electronic components 13 and 14 overlap at least one of the power module 11 or the first electronic component 12 in the first direction D1. According to the present embodiment, by arranging the second electronic components 13 and 14 and the power module 11 or the first electronic component 12 side by side along the first direction D1, it is possible to suppress the control device 7 from increasing in size in the vertical direction Z.

[0053] In the present embodiment, the control device 7 includes a plurality of second electronic components 13 and 14 (current distribution unit 13 and capacitor 14). The plurality of second electronic components 13 and 14 overlap each other in the vertical direction Z. According to the present embodiment, by arranging the plurality of second electronic components 13 and 14 side by side in the vertical direction Z, it is possible to suppress the control device 7 from increasing in size in the direction orthogonal to the vertical direction Z.

[0054] In the present embodiment, it is preferable to arrange the power module 11 and the power integration system 12 such that the vertical direction Z is the thickness direction and they extend along a plane orthogonal to the vertical direction Z. Also, it is preferable that the cooling channel portion 90A extends along a plane orthogonal to the vertical direction Z. According to the present embodiment, the power module 11 and the power integration system 12 can be arranged so as to overlap the cooling channel portion 90A over a wide range in the vertical direction Z, and the cooling efficiency of the power module 11 and the power integration system 12 can be increased. For the same reason, it is also preferable to arrange the power integration system 13 and the capacitor 14 such that the vertical direction Z is the thickness direction and they extend along a plane orthogonal to the vertical direction Z.

[0055] <Modification Example> A modification example of the drive device will be described below. In the description of each modification example described below, for components that are the same as those in the already described embodiment or modification example, the same reference numerals are given and the description thereof is omitted.

[0056] Also, in the following modification examples as well, similar to the above-described embodiment, the case where the power integration system 12 is the first electronic component 12, and the current distribution unit 13 and the capacitor 14 are the second electronic components 13 and 14 will be described. However, the first electronic component only needs to have any one of the functions of voltage adjustment, current distribution, or capacitor, and may be any of the power integration system 12, the current distribution unit 13, or the capacitor 14. Similarly, the second electronic component only needs to have any one of the functions of voltage adjustment, current distribution, or capacitor among the electronic components other than the first electronic component, and may be any of the power integration system 12, the current distribution unit 13, or the capacitor 14.

[0057] (Modification Example 1) FIG. 3 is a schematic cross-sectional view of the drive device 101 according to Modification Example 1. Similar to the above-described embodiment, the drive device 101 of this modification example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 107. The drive device 101 also has a housing connector 6. The housing connector 6 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 6C. The electronic component housing 6C includes a case portion 61A having a case portion main body 66 and a flow path member 65, and a third lid member 64. A flow path 190 is provided in the housing connector 6.

[0058] The electronic component housing 6C of this modification example houses a power module 11, a power integration system 12, a current distribution unit 13, a capacitor 14, and a heating device 115. The power module 11 and the power integration system 12 are fixed to the upper surface 65a of the flow path member 65. The current distribution unit 13, the capacitor 14, and the heating device 115 are fixed to the second inner surface 64k of the second bottom wall portion 64b.

[0059] Similarly to the above-described embodiment, the flow path 190 has a first flow path portion 91 provided in the flow path member 65 and a third flow path portion 94 provided in the motor housing 6A. According to this modification, when the power module 11 and the power integration system 12 come into contact with the upper surface 65a of the flow path member 65 where the first flow path portion 91 is provided, the power module 11 and the power integration system 12 can be efficiently cooled.

[0060] The first flow path portion 91 of this modification has a cooling flow path portion 190A that overlaps the power module 11 in the vertical direction Z and a cooling flow path portion 190B that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portions 190A and 190B of this modification overlap the power module 11 or the power integration system 12 in the vertical direction Z, making it easy to cool the power module 11 or the power integration system 12.

[0061] In this modification, the current distribution portion 13 overlaps the cooling flow path portion 190A in the vertical direction Z, and the capacitor 14 overlaps the cooling flow path portion 190B in the vertical direction Z. According to this modification, it is possible to suppress the control device 107 from increasing in size in the direction orthogonal to the vertical direction Z.

[0062] In this modification, the power module 11 and the power integration system 12 are arranged side by side in the first direction D1. According to this modification, the power module 11 and the power integration system 12 overlap in the first direction D1. Since the power module 11 and the power integration system 12 are relatively large among the electronic components of the control device 107, arranging the power module 11 and the power integration system 12 side by side along the first direction D1 can suppress the control device 107 from increasing in size in the vertical direction Z.

[0063] In this modification example, the current distribution unit 13 overlaps with the power module 11 in the vertical direction Z. Further, the capacitor 14 overlaps with the power integration system 12 in the vertical direction Z. That is, according to the modification example, since the second electronic components 13 and 14 (the current distribution unit 13 and the capacitor 14) overlap with at least one of the power module 11 or the first electronic component 12 in the vertical direction Z, it is possible to suppress the control device 107 from increasing in size in the direction orthogonal to the vertical direction Z. Also, in this modification example, since the plurality of second electronic components 13 and 14 overlap with each other in the first direction D1, it is possible to suppress the control device 107 from increasing in size in the vertical direction Z.

[0064] In this modification example, both the power module 11 and the power integration system 12 are fixed to the flow path member 65. That is, according to this modification example, the power module 11 and the power integration system 12 are fixed to the case portion 61A. The heat generation amounts of the power module 11 and the power integration system 12 are relatively large among the electronic components of the control device 107. According to this modification example, the first flow path portion 91 provided in the case portion 61A can cool the power module 11 with a large heat generation amount and the first electronic component 12.

[0065] In this modification example, the electronic component housing 6C houses the heater portion 115a and the heater control portion 115b of the heating device 115. That is, according to this modification example, the entire heating device 115 is disposed in the internal space of the electronic component housing 6C. If a part of the heating device 115 is fixed to the outer surface of the housing connecting body 6, it may protrude from the outer shape of the driving device, and the driving device may increase in size. According to this modification example, by disposing the entire heating device 115 (that is, the heater portion 115a and the heater control portion 115b) inside the electronic component housing 6C, it is possible to reduce the size of the driving device 101.

[0066] (Modification Example 2) FIG. 4 is a schematic cross-sectional view of the drive device 201 according to Modification 2. Similar to the above-described embodiment, the drive device 201 of this modification includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 207. The drive device 201 also has a housing connecting body 206. The housing connecting body 206 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing (housing) 206C. The electronic component housing 206C includes a case portion main body 266 and a case portion 261A having a flow path member (wall portion) 265 and a third lid member 64. A flow path 290 is provided in the housing connecting body 206.

[0067] Similar to the above-described embodiment, the case portion main body 266 has a first bottom wall portion 61b, a first side wall portion 61c, a first flange portion 61f, and a plurality of support pillar portions 261u. The support pillar portions 261u extend upward (+Z) from the first inner surface 61k of the first bottom wall portion 61b. A flow path member 265 is attached to the upper end portion of the support pillar portion 261u. Compared with the above-described embodiment, the support pillar portions 261u of this modification are arranged biased toward one side (+D1) in the first direction. Also, the flow path member 265 of this modification has a smaller dimension in the first direction D1 compared with the above-described embodiment.

[0068] The power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are housed in the electronic component housing 206C of this modification. The power integration system 12 is fixed to the upper surface 265a of the flow path member 265. The power module 11 is arranged on the other side (-D1) in the first direction of the flow path member 265 and is fixed to the first inner surface 61k of the first bottom wall portion 61b. The current distribution portion 13 and the capacitor 14 are fixed to the second inner surface 64k of the second bottom wall portion 64b.

[0069] Similar to the above-described embodiment, the flow path 290 has a first flow path portion 291 provided in the flow path member 265 and a third flow path portion 94 provided in the motor housing 6A. According to this modification, the power integration system 12 can be efficiently cooled by the power integration system 12 coming into contact with the upper surface 265a of the flow path member 265 where the first flow path portion 291 is provided.

[0070] The first flow path portion 291 of this modified example has a cooling flow path portion 290A that overlaps with the power integration system 12 in the vertical direction Z. By overlapping with the power integration system 12 in the vertical direction Z, the cooling flow path portion 290A of this modified example can easily cool the power integration system 12.

[0071] The cooling flow path portion 290A of this modified example overlaps with the power module 11 in the first direction D1. That is, the cooling flow path portion 290A of this modified example overlaps with one of the power module 11 and the power integration system 12 that does not overlap with the cooling flow path portion 290A in the vertical direction Z in the first direction D1. According to this modified example, it is possible to suppress the control device 207 from increasing in size in the vertical direction Z. Note that this effect can be obtained as long as the cooling flow path portion 290A overlaps with at least one of the power module 11 or the power integration system 12 in the first direction.

[0072] In this modified example, since the power module 11 and the power integration system 12 are arranged side by side in the first direction D1, it is possible to suppress the control device 207 from increasing in size in the vertical direction Z. Also, in this modified example, the current distribution unit 13 overlaps with the power integration system 12 in the vertical direction Z, and the capacitor 14 overlaps with the power module 11 in the vertical direction Z. That is, according to the modified example, since the second electronic components 13, 14 (the current distribution unit 13 and the capacitor 14) overlap with at least one of the power module 11 or the first electronic component 12 in the vertical direction Z, it is possible to suppress the control device 207 from increasing in size in the direction orthogonal to the vertical direction Z. Furthermore, in this modified example, since the current distribution unit 13 overlaps with the cooling flow path portion 290A in the vertical direction Z, it is possible to suppress the control device 207 from increasing in size in the direction orthogonal to the vertical direction Z. In this modified example, since the plurality of second electronic components 13, 14 overlap with each other in the first direction D1, it is possible to suppress the control device 207 from increasing in size in the direction orthogonal to the vertical direction Z.

[0073] (Modified Example 3) FIG. 5 is a schematic cross-sectional view of the drive device 301 according to Modification 3. Similar to the above-described embodiment, the drive device 301 of this modification includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 307. Further, the drive device 301 has a housing connector 206. The housing connector 206 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 206C. The electronic component housing 206C includes a case portion main body 266 and a case portion 261A having a flow path member 265, and a third lid member 64. A flow path 290 is provided in the housing connector 206.

[0074] The control device 307 of this modification is different in that the arrangements of the power module 11 and the power integration system 12 are interchanged compared with the above-described Modification 2 (see FIG. 4). In this modification, the power module 11 is fixed to the upper surface 265a of the flow path member 265. Further, in this modification, the power integration system 12 is arranged on the other side (-D1) in the first direction of the flow path member 265 and is fixed to the first inner surface 61k of the first bottom wall portion 61b.

[0075] According to this modification, since the power module 11 contacts the upper surface 265a of the flow path member 265 provided with the first flow path portion 291, the power module 11 can be efficiently cooled. The first flow path portion 291 of this modification has a cooling flow path portion 290A that overlaps the power module 11 in the vertical direction Z. The cooling flow path portion 290A of this modification overlaps the power module 11 in the vertical direction Z, making it easy to cool the power module 11.

[0076] The cooling channel portion 290A of this modification example overlaps with the power integration system 12 in the first direction D1. According to this modification example, it is possible to suppress the enlargement of the control device 307 in the vertical direction Z. In this modification example, since the power integration system 12 and the power module 11 are arranged side by side in the first direction D1, it is possible to suppress the enlargement of the control device 307 in the vertical direction Z. Also, in this modification example, the current distribution portion 13 overlaps with the power module 11 in the vertical direction Z, and the capacitor 14 overlaps with the power integration system 12 in the vertical direction Z. That is, according to the modification example, since the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap with at least one of the power integration system 12 or the first electronic component 12 in the vertical direction Z, it is possible to suppress the enlargement of the control device 307 in the direction orthogonal to the vertical direction Z. Further, in this modification example, since the current distribution portion 13 overlaps with the cooling channel portion 290A in the vertical direction Z, it is possible to suppress the enlargement of the control device 307 in the direction orthogonal to the vertical direction Z. Also, in this modification example, since the plurality of second electronic components 13, 14 overlap with each other in the first direction D1, it is possible to suppress the enlargement of the control device 307 in the vertical direction Z.

[0077] (Modification Example 4) FIG. 6 is a schematic cross-sectional view of the drive device 401 of Modification Example 4. Similar to the above-described embodiment, the drive device 401 of this modification example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 407. The drive device 401 also has a housing connector 206. The housing connector 206 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 206C. The electronic component housing 206C includes a case portion 261A having a case portion main body 266 and a flow path member 265, and a third lid member 64. A flow path 490 is provided in the housing connector 206.

[0078] The control device 407 of this modification example has different arrangements of the power module 11, power integration system 12, current distribution unit 13, and capacitor 14 inside the electronic component housing 206C compared to the above-described modification example 2 (see FIG. 4). In this modification example, the power module 11 and the power integration system 12 are fixed to the upper surface 265a of the flow path member 265. Also, in this modification example, the current distribution unit 13 and the capacitor 14 are arranged on the other side (-D1) in the first direction of the flow path member 265 and are fixed to the first inner surface 61k of the first bottom wall portion 61b.

[0079] According to this modification example, by the power module 11 and the power integration system 12 coming into contact with the upper surface 265a of the flow path member 265 where the first flow path portion 291 is provided, the power module 11 and the power integration system 12 can be efficiently cooled. The first flow path portion 291 of this modification example has a cooling flow path portion 490A that overlaps with the power module 11 in the vertical direction Z and a cooling flow path portion 490B that overlaps with the power integration system 12 in the vertical direction Z. The cooling flow path portions 490A and 490B of this modification example overlap with the power module 11 or the power integration system 12 in the vertical direction Z, making it easy to cool the power module 11 or the power integration system 12.

[0080] In this modification example, since the power module 11 and the power integration system 12 are arranged side by side in the first direction D1, it is possible to suppress the control device 407 from increasing in size in the vertical direction Z. Also, in this modification example, since the second electronic components 13, 14 (current distribution unit 13 and capacitor 14) overlap with the power module 11 and the power integration system 12 in the first direction D1, it is possible to suppress the control device 407 from increasing in size in the vertical direction Z. Furthermore, in this modification example, since the second electronic components 13, 14 overlap with the cooling flow path portions 490A, 490B in the first direction D1, it is possible to suppress the control device 407 from increasing in size in the vertical direction Z. Also, in this modification example, since the plurality of second electronic components 13, 14 overlap with each other in the first direction D1, it is possible to suppress the control device 407 from increasing in size in the vertical direction Z.

[0081] (Modification Example 5) FIG. 7 is a schematic cross-sectional view of the drive device 501 according to Modification 5. Similar to the above-described embodiment, the drive device 501 of this modification includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 507. The drive device 501 also has a housing connector 6. The housing connector 6 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 6C. The electronic component housing 6C includes a case portion main body 66 and a case portion 61A having a flow path member 65, and a third lid member 64. A flow path 590 is provided in the housing connector 6.

[0082] The control device 507 of this modification has different arrangements of the power module 11, the power integration system 12, the current distribution unit 13, and the capacitor 14 inside the electronic component housing 6C as compared with the above-described embodiment (see FIG. 2) and Modification 1 (see FIG. 3). In this modification, the power module 11 and the power integration system 12 are fixed to the upper surface 65a of the flow path member 65. The current distribution unit 13 is fixed to the second inner surface 64k of the second bottom wall portion 64b. Further, the capacitor 14 is fixed to the first inner surface 61k of the first bottom wall portion 61b.

[0083] According to this modification, the power module 11 and the power integration system 12 are efficiently cooled by coming into contact with the upper surface 65a of the flow path member 65 provided with the first flow path portion 91. The first flow path portion 91 of this modification has a cooling flow path portion 590A that overlaps with the power module 11 in the vertical direction Z and a cooling flow path portion 590B that overlaps with the power integration system 12 in the vertical direction Z. The cooling flow path portions 590A and 590B of this modification are easily cooled by overlapping with the power module 11 or the power integration system 12 in the vertical direction Z.

[0084] In this modified example, the flow path member 65 is fixed to the tip of the support column portion 61u that protrudes upward from the first bottom wall portion 61b. Therefore, a gap is provided between the first bottom wall portion 61b and the flow path member 65. In this modified example, the capacitor 14 is located below the flow path member 65. Therefore, the capacitor 14 is provided between the first bottom wall portion 61b and the flow path member 65 in the vertical direction Z. According to this modified example, the space between the first bottom wall portion 61b and the flow path member 65 can be effectively used as the accommodation space for the capacitor 14. Further, according to this modified example, the heat of the capacitor 14 can be transmitted from the lower surface of the capacitor 14 to the case body 66 and from the upper surface of the capacitor 14 to the flow path member 65. That is, according to this modified example, the capacitor 14 can be cooled from above and below, and it is possible to suppress the temperature of the capacitor 14 from becoming too high. In FIG. 7, a gap is provided between the capacitor 14 and the flow path member 65. However, the capacitor and the flow path member 65 may be in direct contact with each other or in contact with each other via a heat transfer material. In this modified example, the arrangement of the current distribution portion 13 and the capacitor 14 may be interchanged with each other. That is, at least one of the current distribution portion 13 and the capacitor 14 (the second electronic component) may be provided between the first bottom wall portion 61b and the flow path member 65 in the vertical direction Z.

[0085] In this modified example, since the power module 11 and the power integration system 12 are arranged side by side in the first direction D1, it is possible to suppress the control device 507 from increasing in size in the vertical direction Z. Further, in this modified example, since the second electronic components 13 and 14 (the current distribution portion 13 and the capacitor 14) overlap the power module 11 and the power integration system 12 in the vertical direction Z, it is possible to suppress the control device 507 from increasing in size in the direction orthogonal to the vertical direction Z. Furthermore, in this modified example, since the second electronic components 13 and 14 overlap the cooling flow path portion 590A in the vertical direction Z, it is possible to suppress the control device 507 from increasing in size in the direction orthogonal to the vertical direction Z. Also, in this modified example, since the plurality of second electronic components 13 and 14 overlap each other in the vertical direction Z, it is possible to suppress the control device 507 from increasing in size in the direction orthogonal to the vertical direction Z.

[0086] (Modification Example 6) FIG. 8 is a schematic cross-sectional view of the drive device 601 of Modification Example 6. Similar to the above-described embodiment, the drive device 601 of this modification includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 607. The drive device 601 also has a housing connector 6. The housing connector 6 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 6C. The electronic component housing 6C includes a case portion main body 66 and a case portion 61A having a flow path member 65, and a third lid member 64. A flow path 690 is provided in the housing connector 6.

[0087] The control device 607 of this modification has different arrangements of the power module 11 and the power integration system 12 compared to the above-described Modification Example 5 (see FIG. 7). The power module 11 and the power integration system 12 of this modification are fixed to the lower surface 65b of the flow path member 65.

[0088] According to this modification, the power module 11 and the power integration system 12 can be efficiently cooled by contacting the lower surface 65b of the flow path member 65 where the first flow path portion 91 is provided. The first flow path portion 91 of this modification has a cooling flow path portion 690A that overlaps the power module 11 in the vertical direction Z, and a cooling flow path portion 690B that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portions 690A and 690B of this modification overlap the power module 11 or the power integration system 12 in the vertical direction Z, making it easy to cool the power module 11 or the power integration system 12.

[0089] In this modification, the power module 11 and the power integration system 12 are located below the flow path member 65. Therefore, the power module 11 and the power integration system 12 are provided between the first bottom wall portion 61b and the flow path member 65 in the vertical direction Z. According to this modification, the space between the first bottom wall portion 61b and the flow path member 65 can be effectively used as an accommodation space for the power module 11 and the power integration system 12.

[0090] In this modification example, the lower surfaces of the power module 11 and the power integration system 12 face the first inner surface 61k of the first bottom wall portion 61b with a gap therebetween. The lower surfaces of the power module 11 and the power integration system 12 may be in contact with the first inner surface 61k directly or via a heat transfer material 667. In this case, while cooling the power module 11 and the power integration system 12 by the flow path member 65, the heat generated from the power module 11 and the power integration system 12 can be transmitted to the first bottom wall portion 61b, and the power module 11 and the power integration system 12 can be cooled from the vertical direction. Note that if at least one of the power module 11 or the power integration system 12 is disposed between the first bottom wall portion 61b and the flow path member 65 in the vertical direction Z, similarly, the power module 11 and the power integration system 12 can be cooled from the vertical direction.

[0091] In this modification example, since the power module 11 and the power integration system 12 are arranged side by side in the first direction D1, an increase in the size of the control device 607 in the vertical direction Z can be suppressed. Further, in this modification example, since the second electronic components 13 and 14 (current distribution portion 13 and capacitor 14) overlap the power module 11 and the power integration system 12 in the vertical direction Z, an increase in the size of the control device 607 in the direction orthogonal to the vertical direction Z can be suppressed. Furthermore, in this modification example, since the second electronic components 13 and 14 overlap the cooling flow path portion 690A in the vertical direction Z, an increase in the size of the control device 607 in the direction orthogonal to the vertical direction Z can be suppressed. Also, in this modification example, since the plurality of second electronic components 13 and 14 overlap each other in the vertical direction Z, an increase in the size of the control device 607 in the direction orthogonal to the vertical direction Z can be suppressed.

[0092] (Modification Example 7) FIG. 9 is a schematic cross-sectional view of the drive device 701 according to Modification 7. Similar to the above-described embodiment, the drive device 701 of this modification includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 707. The drive device 701 also has a housing connector 706. The housing connector 706 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing (housing) 706C.

[0093] In this modification, the electronic component housing 706C has a case portion 761A having a case portion main body 766 and a flow path member 265, and a third lid member 64. The case portion main body 766 has a first bottom wall portion (bottom portion) 761b, a first side wall portion 61c, a first flange portion 61f, and a plurality of support pillar portions 261u. The flow path member 265 is fixed to the upper end portions of the plurality of support pillar portions 261u.

[0094] The electronic component housing 706C of this modification houses a power module 11, a power integration system 12, a current distribution portion 13, and a capacitor 14. The power integration system 12 is fixed to the upper surface 265a of the flow path member 265. The power module 11 is disposed on the other side (-D1) in the first direction of the flow path member 265 and is fixed to the first inner surface 761k of the first bottom wall portion 761b. The current distribution portion 13 and the capacitor 14 are fixed to the second inner surface 64k of the second bottom wall portion 64b.

[0095] A flow path 790 is provided in the housing connector 706. The control device 707 of this modification mainly has a different configuration of the flow path 790 compared to the above-described Modification 2 (see FIG. 4). The flow path 790 of this modification has a first flow path portion 291, a second flow path portion 792, and a third flow path portion 94. The second flow path portion 792 of this modification is provided in the first bottom wall portion 761b. The second flow path portion 792 extends along the axial direction Y. However, the second flow path portion 792 may extend in any direction as long as it extends along a plane orthogonal to the vertical direction Z. One end portion of the second flow path portion 792 is connected to the third flow path portion 94. The one end portion is located at the shared wall portion 61n.

[0096] The third flow path portion 94 is provided in the motor housing 6A to cool the motor 2. The third flow path portion 94 of the present modification overlaps vertically with the portion of the flow path 790 provided in the case portion 761A (in the present modification, the first flow path portion 291 and the second flow path portion 792). According to the present modification, since the first flow path portion 291 and the second flow path portion 792 are provided directly above the third flow path portion 94, the third flow path portion 94 can be arranged closer to the first flow path portion 291 and the second flow path portion 792. Thereby, the flow path 790 can be partially arranged densely, and it is possible to suppress the fluid in the flow path 790 from absorbing heat from members other than the object to be cooled. Further, by arranging the flow path 790 partially densely, it is possible to make it difficult for the heat generated from the power module 11 and the motor, which are the objects to be cooled, to be transmitted to each other. Furthermore, since the third flow path portion 94 overlaps the second flow path portion 792 in the vertical direction Z, the third flow path portion 94 and the second flow path portion 792 can be connected by a short path, and the overall length of the flow path 790 can be shortened.

[0097] In the present modification, the third flow path portion 94 is connected to the portion of the flow path 790 provided in the case portion 761A (in the present modification, the second flow path portion 792). According to the present modification, the second flow path portion 792 and the third flow path portion 94 can be made into respective parts of a single circulation path, and the structure of the flow path 790 can be easily simplified.

[0098] According to the present modification, by the power integration system 12 coming into contact with the upper surface 265a of the flow path member 265 provided with the first flow path portion 291, the power integration system 12 can be efficiently cooled. The first flow path portion 291 of the present modification has a cooling flow path portion 790A that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portion 790A of the present modification overlaps the power integration system 12 in the vertical direction Z, making it easy to cool the power integration system 12.

[0099] The second flow path portion 792 has an opening 792a that opens to the first inner surface 761k of the first bottom wall portion 761b. The opening 792a opens upward (+Z). In this modification, the power module 11 covers the opening 792a. The fluid flowing through the second flow path portion 792 contacts the power module 11 and absorbs heat from the power module 11. That is, the second flow path portion 792 cools the power module 11. The second flow path portion 792 of this modification has a cooling flow path portion 790B that overlaps the power module 11 in the vertical direction Z. The cooling flow path portion 790B of this modification is likely to cool the power integration system 12 by overlapping the power module 11 in the vertical direction Z. Note that in this modification, the positions of the power module 11 and the power integration system 12 may be mutually interchanged. That is, it is sufficient that at least one of the power module 11 and the power integration system 12 and the cooling flow path portion 790B are provided on the first bottom wall portion 761b.

[0100] The first flow path portion 291 of this modification is provided in the flow path member 265. The first flow path portion 291 has a cooling flow path portion 790A that overlaps the power integration system 12 in the vertical direction Z. According to this modification, the power integration system 12 can be cooled in the cooling flow path portion 790A.

[0101] In this modified example, since the power module 11 and the power integration system 12 are arranged side by side in the first direction D1, it is possible to suppress the control device 707 from increasing in size in the vertical direction Z. Also, in this modified example, the current distribution unit 13 overlaps the power integration system 12 in the vertical direction Z, and the capacitor 14 overlaps the power module 11 in the vertical direction Z. That is, according to the modified example, since the second electronic components 13, 14 (the current distribution unit 13 and the capacitor 14) overlap at least one of the power module 11 or the first electronic component 12 in the vertical direction Z, it is possible to suppress the control device 707 from increasing in size in the direction orthogonal to the vertical direction Z. Further, in this modified example, since the second electronic components 13, 14 overlap the cooling channel portions 790A, 790B in the vertical direction Z respectively, it is possible to suppress the control device 707 from increasing in size in the direction orthogonal to the vertical direction Z. Also, in this modified example, since the plurality of second electronic components 13, 14 overlap each other in the first direction D1, it is possible to suppress the control device 707 from increasing in size in the vertical direction Z.

[0102] (Modified Example 8) FIG. 10 is a schematic cross-sectional view of the drive device 801 of Modified Example 8. Similar to the above-described embodiment, the drive device 801 of this modified example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 807. The drive device 801 also has a housing connector 6. The housing connector 6 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing 6C. The electronic component housing 6C includes a case portion main body 66 and a case portion 61A having a flow path member 65, and a third lid member 64. A flow path 90 is provided in the housing connector 6.

[0103] The control device 807 of this modified example is different in that the arrangement of the power module 11 and the power integration system 12 is interchanged compared to the above-described embodiment (see FIG. 2). In this modified example, the power module 11 is fixed to the second inner surface 64k of the second bottom wall portion 64b, and the power integration system 12 is fixed to the upper surface 65a of the flow path member 65.

[0104] In this modified example, the power module 11 is fixed to the third lid member 64, and the power integration system 12 is fixed to the case portion 61A. That is, according to this modified example, the power module 11 and the power integration system 12 can be brought into contact with different members (the case portion 61A and the third lid member 64) of the electronic component housing 6C, respectively. Thereby, the heat of the power module 11 and the power integration system 12 can be transferred to different members and dissipated, and the power module 11 and the power integration system 12 can be efficiently cooled. Also, it is possible to suppress the heat of either the power module 11 or the power integration system 12 from being transmitted to the other.

[0105] In this modified example, the power module 11 and the power integration system 12 are located above the motor 2 (+Z). Also, the power integration system 12 is located below the power module 11 (-Z). Among the electronic components included in the control device 807, the power module 11 has the largest heat generation amount and is likely to have a high temperature. According to this modified example, since the power module 11 can be arranged at a position farther from the motor 2 than the power integration system 12, it is possible to suppress the heat of the power module 11 from affecting the operation of the motor 2. Conversely, it is possible to suppress the heat of the motor 2 from affecting the operation of the power module 11.

[0106] (Modified Example 9) FIG. 11 is a schematic cross-sectional view of the drive device 901 according to Modified Example 9. Similar to the above-described embodiment, the drive device 901 according to this modified example includes a motor 2, a transmission mechanism 3 (see FIG. 1), and a control device 907. Also, the drive device 901 has a housing connection body 906. The housing connection body 906 has a motor housing 6A, a gear housing 6B (see FIG. 1), and an electronic component housing (housing) 906C.

[0107] In this modification example, the electronic component housing 906C includes a case portion 961A having a case portion main body 966, a first flow path member (wall portion) 265, and a second flow path member (wall portion) 965, and a third lid member 64. The case portion main body 966 includes a first bottom wall portion 61b, a first side wall portion 61c, a first flange portion 61f, a plurality of first support pillar portions 261u, and a plurality of second support pillar portions 961u. The first flow path member 265 is fixed to the upper ends of the plurality of first support pillar portions 261u. The second flow path member 965 is fixed to the upper ends of the plurality of second support pillar portions 961u. Both the first flow path member 265 and the second flow path member 965 are plate-shaped water jackets extending along a plane perpendicular to the vertical direction Z.

[0108] The power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are accommodated in the electronic component housing 906C of this modification example. The power module 11 is fixed to the upper surface 265a of the first flow path member 265. The power integration system 12 is fixed to the upper surface 965a of the second flow path member 965. The current distribution portion 13 and the capacitor 14 are fixed to the second inner surface 64k of the second bottom wall portion 64b.

[0109] A flow path 990 is provided in the housing connector 906. The control device 907 of this modification example mainly differs in the configuration of the flow path 990 compared to the above-described modification example 2 (see FIG. 4). The flow path 990 of this modification example includes a first flow path portion 291, a second flow path portion 991, and a third flow path portion 94. The first flow path portion 291 extends in a meandering manner inside the first flow path member 265. Similarly, the second flow path portion 991 extends in a meandering manner inside the second flow path member 965.

[0110] According to this modification example, by the power module 11 contacting the upper surface 265a of the first flow path member 265 where the first flow path portion 291 is provided, the power module 11 can be efficiently cooled. Also, according to this modification example, by the power integration system 12 contacting the upper surface 965a of the second flow path member 965 where the second flow path portion 991 is provided, the power integration system 12 can be efficiently cooled. The first flow path portion 291 of this modification example has a cooling flow path portion 990A that overlaps the power module 11 in the vertical direction Z. The second flow path portion 991 of this modification example has a cooling flow path portion 990B that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portions 990A and 990B of this modification example overlap the power module 11 or the power integration system 12 in the vertical direction Z, making it easy to cool the power module 11 or the power integration system 12.

[0111] According to this modification example, the case portion 961A has a plurality of flow path members 265 and 965, and the power module 11 and the power integration system 12 are separately fixed to the upper surfaces 265a and 965a of the respective flow path members 265 and 965. Therefore, according to the dimensions of the power module 11 and the power integration system 12 in the vertical direction Z, the arrangement of the respective flow path members 265 and 965 can be appropriately determined, and it is easy to effectively utilize the internal space A of the electronic component housing 906C without gaps. According to this modification example, miniaturization of the control device 907 can be achieved.

[0112] In this modification example, since the power module 11 and the power integration system 12 are arranged side by side in the first direction D1, it is possible to suppress the control device 907 from increasing in size in the vertical direction Z. Further, in this modification example, the current distribution unit 13 overlaps the power module 11 in the vertical direction Z, and the capacitor 14 overlaps the power integration system 12 in the vertical direction Z. That is, according to the modification example, since the second electronic components 13 and 14 (the current distribution unit 13 and the capacitor 14) overlap at least one of the power module 11 or the first electronic component 12 in the vertical direction Z, it is possible to suppress the control device 907 from increasing in size in the direction orthogonal to the vertical direction Z. Furthermore, in this modification example, since the current distribution unit 13 overlaps the cooling flow path portions 990A and 990B in the vertical direction Z, it is possible to suppress the control device 907 from increasing in size in the direction orthogonal to the vertical direction Z.

[0113] As described above, the embodiments of the present invention and their modification examples have been described. However, each configuration and their combinations in the embodiments and their modification examples are merely examples, and additions, omissions, substitutions, and other changes of the configuration are possible without departing from the spirit of the present invention. Further, the present invention is not limited by the embodiments.

[0114] In particular, the configuration of the control device shown in the above-described embodiments and their modification examples is merely an example. The control device may have any other electronic components as long as it has at least a power module.

[0115] Note that the present technology can be configured as follows. (1) A control device located above the motor for controlling the motor, including a power module and a first electronic component having any one of functions of voltage adjustment, current distribution, or a capacitor. A control device having the power module and a housing for accommodating the first electronic component, the housing having a case portion having an opening that opens upward and a lid portion that covers the opening, the case portion being provided with a flow path, the flow path having a cooling flow path portion that overlaps at least one of the power module or the first electronic component in the vertical direction. (2) The control device according to (1), wherein the cooling flow path portion is located below at least one of the power module or the first electronic component. (3) The control device according to (1) or (2), wherein a direction orthogonal to the vertical direction is defined as a first direction, and the power module and the first electronic component are arranged side by side in the first direction. (4) The control device according to any one of (1) to (3), wherein the power module and the first electronic component are arranged side by side in the vertical direction. (5) The control device according to (4), wherein the power module is arranged below the first electronic component. (6) The control device according to any one of (1) to (5), wherein a direction orthogonal to the vertical direction is defined as a first direction, and the cooling flow path portion overlaps at least one of the power module or the first electronic component in the first direction. (7) The control device according to any one of (1) to (6), further comprising a second electronic component housed in the housing, the second electronic component having any one of functions of voltage regulation, current distribution, or a capacitor, a direction orthogonal to the vertical direction being defined as a first direction, and the second electronic component overlapping the cooling flow path portion in the vertical direction or the first direction. (8) The control device according to any one of (1) to (7), further comprising a second electronic component housed in the housing, the second electronic component having any one of functions of voltage regulation, current distribution, or a capacitor, a direction orthogonal to the vertical direction being defined as a first direction, and the second electronic component overlapping the power module or the first electronic component in the vertical direction or the first direction. (9) The control device according to (7) or (8), comprising a plurality of the second electronic components. (10) The plurality of the second electronic components in the control device according to (9) overlap each other in the vertical direction or in the first direction. (11) The case portion has a bottom portion located below the opening portion and a wall portion fixed to the bottom portion and located above the bottom portion. The wall portion is provided with at least one of the power module and the first electronic component and the cooling flow path portion. The control device according to any one of (1) to (10). (12) In the vertical direction, at least one of the power module or the first electronic component is disposed between the bottom portion and the wall portion. The control device according to (11). (13) The bottom portion is provided with at least one of the power module and the first electronic component and the cooling flow path portion. The control device according to (12). (14) The power module is fixed to the case portion, and the first electronic component is fixed to the lid portion. The control device according to any one of (1) to (13). (15) The power module is fixed to the lid portion, and the first electronic component is fixed to the case portion. The control device according to any one of (1) to (13). (16) The power module and the first electronic component are fixed to the case portion. The control device according to any one of (1) to (13). (17) The control device includes a heating device having a heater portion and a control portion for controlling the heater portion. The control portion is housed in the housing. The control device according to any one of (1) to (16). (18) The control device according to (1), the motor, and a motor housing for housing the motor, and the housing and the motor housing are connected to each other. Drive device. (19) The motor and the control device overlap in the vertical direction, and the cooling flow path portion is located between the motor and the power module or the first electronic component in the vertical direction. The drive device according to (18). (20) The flow path has a third flow path portion for cooling the motor provided in the motor housing, and the third flow path portion overlaps in the vertical direction with the portion of the flow path provided in the case portion, the drive device according to (18) or (19). (21) The third flow path portion is connected to the portion of the flow path provided in the case portion, the drive device according to (20).

Explanation of Reference Numerals

[0116] 1, 101, 201, 301, 401, 501, 601, 701, 801, 901... drive device, 2... motor, 6A... motor housing, 6C, 206C, 706C, 906C... electronic component housing (housing), 7, 107, 207, 307, 407, 507, 607, 707, 807, 907... control device, 11... power module, 12... power integration system (first electronic component), 13... current distribution unit (second electronic component), 14... capacitor (second electronic component), 15, 115... heating device, 15a, 115a... heater unit, 15b, 115b... heater control unit (control unit), 61b, 761b... first bottom wall portion (bottom), 61A, 261A, 761A, 961A... case portion, 64... third lid member (lid portion), 65, 265, 965... flow path member (wall portion), 90, 190, 290, 490, 590, 690, 790, 990... flow path, 90A, 90B, 190A, 190B, 290A, 490A, 490B, 590A, 590B, 690A, 690B, 790A, 790B, 990A, 990B... cooling flow path portion, 94... third flow path portion, D1... first direction, Z... vertical direction

Claims

1. A control device located above the motor for controlling the motor, comprising: a power module; a first electronic component having any one of the functions of voltage regulation, current distribution, or a capacitor; a housing for housing the power module and the first electronic component; wherein the housing has a case portion having an opening opening upward; and a lid portion covering the opening; a flow path is provided in the case portion; the flow path has a cooling flow path portion overlapping at least one of the power module or the first electronic component in the vertical direction; a control device.

2. The cooling flow path portion is located below at least one of the power module or the first electronic component; The control device according to Claim 1.

3. Taking the direction orthogonal to the vertical direction as the first direction, the power module and the first electronic component are arranged side by side in the first direction; The control device according to Claim 1.

4. The power module and the first electronic component are arranged side by side in the vertical direction; The control device according to Claim 1.

5. The power module is arranged below the first electronic component; The control device according to Claim 4.

6. Taking the direction orthogonal to the vertical direction as the first direction, the cooling flow path portion overlaps at least one of the power module or the first electronic component in the first direction; The control device according to Claim 1.

7. Comprising a second electronic component housed in the housing, the second electronic component has any one of the functions of voltage regulation, current distribution, or a capacitor, taking the direction orthogonal to the vertical direction as the first direction, the second electronic component overlaps the cooling flow path portion in the vertical direction or the first direction; The control device according to Claim 1.

8. Comprising a second electronic component housed in the housing, the second electronic component has any one of the functions of voltage regulation, current distribution, or a capacitor, taking the direction orthogonal to the vertical direction as the first direction, the second electronic component overlaps the power module or the first electronic component in the vertical direction or the first direction; The control device according to Claim 1.

9. Comprising a plurality of the second electronic components; The control device according to Claim 7 or 8.

10. The plurality of second electronic components overlap each other in the vertical direction or the first direction; The control device according to Claim 9.

11. The case portion has a bottom portion located below the opening; It has a wall portion fixed to the bottom and located above the bottom. The wall portion is provided with at least one of the power module and the first electronic component and the cooling flow path portion. The control device according to claim 1.

12. In the vertical direction, at least one of the power module or the first electronic component is disposed between the bottom and the wall portion. The control device according to claim 11.

13. The bottom is provided with at least one of the power module and the first electronic component and the cooling flow path portion. The control device according to claim 12.

14. The power module is fixed to the case portion. The first electronic component is fixed to the lid portion. The control device according to claim 1.

15. The power module is fixed to the lid portion. The first electronic component is fixed to the case portion. The control device according to claim 1.

16. The power module and the first electronic component are fixed to the case portion. The control device according to claim 1.

17. A heating device having a heater portion and a control portion for controlling the heater portion is provided. The control portion is housed in the housing. The control device according to claim 1.

18. The control device according to claim 1, the motor, and a motor housing for housing the motor, and the housing and the motor housing are connected to each other. Drive device.

19. The motor and the control device overlap in the vertical direction. The cooling flow path portion is located between the motor and the power module or the first electronic component in the vertical direction. The drive device according to claim 18.

20. The flow path has a third flow path portion for cooling the motor provided in the motor housing. The third flow path portion overlaps in the vertical direction with a portion of the flow path provided in the case portion. The drive device according to claim 18.

21. The third flow path portion is connected to a portion of the flow path provided in the case portion. The drive device according to claim 20.

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