Camera device and method for manufacturing camera device

Abstract

To provide a camera device capable of improving vibration resistance and reliability while ensuring a waterproof property.SOLUTION: A camera device 1 includes a camera module 2 having an imaging board 20 on which an imaging element is mounted and a lens, a main board 5 connected to the camera module 2 via a communication line 4, a connector 7 connected to a connector connection portion 50, and a housing 8 having a base portion 8a and a cover portion 8b and accommodating the camera module 2 and the main board 5. The housing 8 has a first space 11 in which the main board 5 and at least a part of the camera module 2 are accommodated, and a second space 12 separated from the first space 11 by partitions 81 and 82 and in which a board region 52 is accommodated, and a sealing material 13 is disposed in the second space 12 so as to enclose the board region 52.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an in-vehicle camera device and a method for manufacturing the camera device.

Background Art

[0002] As background art in this technical field, there is Japanese Unexamined Patent Application Publication No. 2007-001334 (Patent Document 1). This publication describes "an in-vehicle camera comprising a circuit board, a camera case for housing and disposing the circuit board, and an external connection connector portion provided on the outer surface of the camera case, the connector portion including a connector housing integrally formed on the outer surface of the camera case, a connector terminal penetrating through the outer wall of the camera case so as to be housed in the connector housing and electrically connected to the circuit board, and a sealing agent filled between the connector terminal and the connector housing."

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In recent years, due to the increasing safety awareness, the mounting of in-vehicle cameras on two-wheel vehicles has been under consideration, and higher vibration and shock resistance performance are required for in-vehicle cameras. In addition, since a camera device for a two-wheel vehicle is mounted outside the vehicle, waterproofness is required. In the in-vehicle camera described in Patent Document 1, the connector housing is integrally formed with the camera case, and the space between the connector terminal electrically connected to the circuit board housed in the camera case and the connector housing is filled with a sealing material, thereby providing waterproofness between the camera case and the connector housing and between the connector housing and the connector terminal.

[0005] However, with this structure, for example, when stress is applied to the connector portion, there is a possibility of damage from the integrally formed camera case, or when stress is applied to the connection portion between the substrate and the connector terminal, a connection failure may occur.

Means for Solving the Problems

[0006] A camera device according to one aspect of the present invention includes a camera module having an imaging substrate on which an imaging element is mounted and a lens, a main substrate on which an image processing circuit is mounted and which is connected to the camera module via a communication line, a connector to which a connection terminal is connected to a connector connection portion of the main substrate, a housing having a base portion and a cover portion connected to each other and housing the camera module and the main substrate, the housing having a first space in which at least a part of the camera module and the main substrate are housed, and a second space separated from the first space by a partition wall and housing a substrate region including the connector connection portion of the main substrate, and a sealing material is disposed in the second space so as to enclose the substrate region.

Advantages of the Invention

[0007] According to the present invention, in an in-vehicle camera device, it is possible to improve the vibration resistance performance and reliability while ensuring waterproofness.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0009] <First Embodiment> Referring to FIGS. 1 and 2, a camera device according to a first embodiment of the present invention will be described. FIG. 1 is an exploded perspective view of the camera device 1. FIG. 2 is a cross-sectional view of the camera device 1. The camera device 1 is an in-vehicle camera device, and is mounted on, for example, a two-wheeled vehicle. The camera device 1 includes a camera module 2, a camera cover 3, a main board 5 and a connector 7, and a housing 8 that houses the camera module 2 and the main board 5.

[0010] As shown in FIG. 2, the camera module 2 includes an imaging board 20 on which an imaging element (not shown) is mounted, and an imaging optical system 21 in which an optical lens is mounted on a lens barrel. The camera module 2 is adhesively fixed or screwed to a mounting portion (not shown) provided on the base portion 8a of the housing 8. The imaging optical system 21 is attached to the base portion 8a so as to be exposed to the outside of the housing. The camera cover 3 is a cover that protects the imaging optical system 21 exposed to the outside of the housing, and is attached to the base portion 8a. Although not shown, the camera cover 3 and the housing 8 are fixed via a waterproof adhesive or a waterproof O-ring.

[0011] In addition to imaging elements such as a CCD sensor and a CMOS sensor, electronic components (circuits) that perform predetermined processing on the drive of the imaging element and the electrical signal output from the imaging element are mounted on the imaging board 20. Although not shown, electronic components (image processing circuits) such as a CPU, an MPU, and an AGTG that perform image processing and system control are mounted on the main board 5. The imaging board 20 and the main board 5 are connected via a communication line 4. For example, press-fit connectors are used for the connectors 40a and 40b of the communication line 4. A press-fit connector is a connector that makes an electrical connection by pressing press-fit terminals provided in a connector housing into through-holes of a board, that is, a connector that makes a connection without soldering.

[0012] The main board 5 is placed on the fixing portion 80 and the partition wall 81 provided on the base portion 8a, and is fixed by screwing it to the fixing portion 80. By screwing the main board 5 to the fixing portion 80, the main board 5 is in close contact with the partition wall 81. In FIG. 2, a connector 7 connected to an external device is provided in the board region 52 at the right end of the main board 5 shown in the figure. Hereinafter, the portion where the connection terminals 70 of the connector 7 are soldered in the board region 52 will be referred to as the connector connection portion 50. The connection terminal 70 extending downward from the main board 5 in the figure is bent 90 degrees in the right direction in the figure, and the connector 7 is facing rightward.

[0013] After fixing the main board 5 to the fixing portion 80, the cover portion 8b is fixed to the base portion 8a such that the convex portion 83 of the cover portion 8b is inserted into the groove portion 84 of the base portion 8a. In that case, the cover portion 8b and the base portion 8a are fixed via a waterproof adhesive or a waterproof O-ring. The waterproof adhesive and the waterproof O-ring are disposed in the groove portion 84.

[0014] A partition wall 82 is formed in the cover portion 8b so as to face the partition wall 81 of the base portion 8a. Note that the partition walls 81 and 82 are formed in a bent shape as shown by the broken-line arrow L in FIG. 1. When the cover portion 8b is fixed to the base portion 8a, the partition wall 81 and the partition wall 82 are connected so as to sandwich the main board 5. As a result, a first space 11 and a second space 12 separated by the partition walls 81 and 82 are formed inside the housing 8 composed of the cover portion 8b and the base portion 8a.

[0015] In FIG. 2, in the first space 11 on the left side of the partition walls 81 and 82 in the drawing, the camera module 2 and the substrate area 51 of the main substrate 5 are accommodated. Electronic components for performing image processing and system control are mounted on the substrate area 51. In the second space 12 on the right side of the partition walls 81 and 82 in the drawing, the substrate area 52 including the connector connection part 50 in the main substrate 5 is accommodated. That is, most of the main substrate 5 is accommodated in the first space 11, but the substrate area 52 including the connector connection part 50 at the right end in the drawing penetrates the connection boundary 85 (the part shown by the broken line) between the partition wall 81 and the partition wall 82 and is accommodated in the second space 12. The second space 12 is filled with a sealing material 13. The sealing material 13 is filled in the second space 12 so as to enclose the substrate area 52 including the connector connection part 50. Incidentally, after the sealing material 13 is filled, a gap may be formed in a part (such as a corner) of the second space 12. Of course, the second space 12 may be filled with the sealing material 13 over the entire area.

[0016] The assembly procedure of the camera device 1 is generally as follows. Hereinafter, the case where the connection between the base part 8a and the cover part 8b is made with a waterproof adhesive will be described. Each of the main substrate 5 and the camera module 2 to which the connector 7 is connected is attached to the base part 8a. When the main substrate 5 is fixed to the fixing part 80 with screws, the upper end of the partition wall 81 and the back surface of the main substrate 5 are in close contact.

[0017] Next, connect the imaging substrate 20 and the main substrate 5 by the communication line 4, and attach the camera cover 3. Then, arrange (apply) a waterproof adhesive in the groove portion 84 (see FIG. 1) of the base portion 8a, and connect the base portion 8a and the cover portion 8b so that the tip of the partition wall 82 of the cover portion 8b is in close contact with the substrate surface of the main substrate 5. After that, with the posture of the housing 8 such that the opening of the second space 12 faces upward, fill the sealing material 13 from the opening of the second space 12. In the example shown in FIG. 2, the sealing material 13 is filled up to the connector root portion (convex portion) where the connection terminal 70 protrudes from the connector 7, but the second space 12 may be filled with the sealing material 13 so as to be sealed up to the flange-like portion on the left side of the connector 7. Since the sealing material 13 is filled in the spaces on both the front and back sides of the main substrate 5, deformation of the main substrate 5 due to thermal expansion of the sealing material 13 can be prevented.

[0018] As the sealing material 13, for example, there are (a) a two-component room-temperature curing type in which a curing agent and a main agent are mixed and cured at room temperature, (b) a two-component heat-curing type in which a curing agent and a main agent are mixed and heat-cured, (c) a one-component curing type in which a main agent and a curing agent are contained in one liquid and the curing agent is reacted by heating, and the like. Also, as the resin type used for the sealing material 13, urethane, silicone, epoxy resin, etc. can be used.

[0019] From the viewpoint of manufacturing tact, the two-component heat-curing type with fast curing is more suitable. Also, from the viewpoint of vibration resistance, a sealing material made of urethane or silicone resin with high flexibility of the resin after curing is suitable. In order to prevent contact failure of electronic components due to low molecular siloxane, urethane resin or silicone resin with a cut low molecular siloxane component is most preferably used. When using the heat-curing type, after filling the second space 12 with the sealing material 13, heating in a curing furnace to cure the sealing material 13 can exhibit waterproofness between the connector 7, the base portion 8a, and the cover portion 8b.

[0020] As described above, since the first space 11 is separated from the second space 12 by the partition walls 81 and 82, the sealing material 13 can be disposed in the second space 12 without affecting the optical system of the camera module 2 or the connection by the communication line 4. That is, it is possible to prevent problems such as the influence of the conventional sealing material 13 on the optical system, that is, connection failure due to the adhesion of the sealing material 13 to the communication line 4, and the inability to obtain a correct image due to the adhesion of the sealing material 13 to the imaging lens of the camera module 2. For example, when a connector with a plug-in contact such as a press-fit connector is used for the communication line 4, if the sealing material 13 penetrates into the first space 11, there is a risk that the sealing material 13 will enter the plug-in contact portion and cause communication failure.

[0021] Further, since the sealing material 13 is filled so as to enclose the substrate region 52 penetrating the partition walls 81 and 82, it is possible to improve the waterproof property of the penetrating portion. Since the partition walls 81 and 82 are disposed so as to be in close contact with the substrate surface of the main substrate 5, it is possible to prevent the highly fluid sealing material 13 in the uncured state from penetrating from the second space 12 to the first space 11 side during the sealing material filling operation.

[0022] In addition, since the substrate region 52 including the connector connection portion 50 is enclosed by the sealing material 13 filled in the second space 12, when stress is applied to the connector 7, the stress is dispersed by the sealing material 13, and the influence on the connector connection portion 50 can be reduced. As a result, the vibration resistance performance can be improved, and the reliability of the camera device 1 mounted on the vehicle can be improved.

[0023] Conventionally, there is a configuration in which the body of the connector 7 is integrally formed with the housing in consideration of waterproofing. However, when the camera device 1 is mounted on a two-wheeled vehicle, it is subjected to greater vibration and impact than when mounted on a four-wheeled vehicle. Therefore, cracks are likely to occur due to vibration or the like at the boundary portion between the integrated connector body and the housing, and the waterproof performance is deteriorated. On the other hand, in the present embodiment, since the second space 12 is filled with the sealing material 13 as described above, it is possible to prevent the deterioration of the waterproof property due to vibration.

[0024] (Modification example) Next, regarding a modification of the first embodiment, it will be described with reference to FIG. 3. FIG. 3 is a cross-sectional view of the camera device 1 according to the modification. In the following, the description will focus on the parts different from the configuration shown in FIG. 2 described above, and the description of the same configuration parts will be omitted. In the modification, the opening of the second space 12 faces the minus y direction side. The connection terminal 70 connected to the connector connection portion 50 of the main board 5 is a straight terminal that is not bent unlike the case of FIG. 2. Therefore, the connector 7 also faces the minus y direction side.

[0025] In the case of the configuration shown in FIG. 2 described above, the opening of the second space 12 faces both the front side and the back side of the board region 52. Therefore, when filling the sealing material 13 from the opening of the second space 12, the sealing material 13 can be easily filled on both the front side and the back side of the board region 52.

[0026] On the other hand, in the case of the modification shown in FIG. 3, the opening of the second space 12 faces only the back side of the board region 52. When filling the sealing material, the housing 8 is turned upside down so that the opening of the second space 12 faces upward, and the sealing material 13 is filled into the space on the back side of the board region 52 from the opening. Therefore, the gap 120 between the right end portion (as shown in the figure) of the board region 52 and the housing 8 is set to a sufficient size so that the sealing material 13 can easily move from the space on the base portion 8a side to the space on the cover portion 8b side through the gap 120 during filling, and air can be easily discharged from the space on the cover portion 8b side to the space on the base portion 8a side. By adopting such a configuration, the second space 12 can be filled with the sealing material 13 with fewer bubbles.

[0027] Of course, it is also possible to set the gap 120 small and configure to fill the sealing material 13 only on the back side (the space on the base portion 8a side) of the board region 52 of the second space 12. However, when the sealing material 13 is filled only on one side of the board region 52, the main board 5 may be deformed due to the thermal expansion of the sealing material 13. Also, in order to improve the vibration resistance performance of the connector connection portion 50, it is desirable to fill the sealing material 13 into the space on the cover portion 8b side as well.

[0028] In the example shown in FIG. 3, the opening of the second space 12 is provided on the bottom surface side of the base portion 8a (the lower side in the drawing of the housing 8). However, it may be provided on the side surface side of the housing 8 (the direction perpendicular to the paper surface) or the upper side in the drawing of the housing 8 (the cover portion 8b side), and the connection direction of the connector 7 may be set in those directions. In the modified example, the same operational effects as those of the first embodiment described above are achieved, and by changing the arrangement of the opening of the second space 12, the arrangement space of the camera device 1 (the space in the xz plane) can be made smaller, and the degree of freedom in the layout of the camera device when mounted on various vehicles is improved.

[0029] <Second Embodiment> FIG. 4 is a diagram for explaining the second embodiment, and is a cross-sectional view of the camera device 1 in the same manner as in the case of FIG. 2 described above. Hereinafter, the explanation will be centered on the configuration different from that of the first embodiment, and the explanation of the same configuration parts will be omitted.

[0030] On the main board 5, only the connector connection portion 50 was arranged in the board region 52 included in the second space 12. On the other hand, in the second embodiment, electronic components are also arranged in the board region 52 included in the second space 12. In the example shown in FIG. 4, two electronic components 15a and 15b are arranged. These electronic components 15a and 15b are also sealed by the sealing material 13 filled in the second space 12. Note that the filling of the sealing material 13 into the second space 12 is the same as in the case of the first embodiment, with the housing 8 (the base portion 8a and the cover portion 8b) in a posture where the connector 7 faces upward, and the sealing material 13 is filled into both the space of the base portion 8a and the space of the cover portion 8b from the opening of the second space 12. The sealing material 13 seals the board region 52 including the electronic components 15a and 15b and the connector connection portion 50.

[0031] Among the electronic components mounted on the main board 5, large-sized electronic components such as electrolytic capacitors may cause cracks in the board connection part (soldering connection part, etc.) due to vibration, resulting in poor connection. Therefore, in this embodiment, electronic components 15a and 15b that are vulnerable to vibration, such as electrolytic capacitors, are provided in the board area 52 on the main board 5 and housed on the second space 12 side. Since the second space 12 is filled with the sealing material 13, the electronic components 15a and 15b are also sealed by the sealing material 13, and the stress applied to the electronic components 15a and 15b can be reduced.

[0032] As described above, in the second embodiment, a part of the electronic components (electronic components 15a and 15b) mounted on the main board 5 is also housed in the second space 12 and encapsulated by the sealing material 13. Thereby, in addition to improving the waterproof performance with respect to the second space 12, it is possible to improve the seismic resistance performance of the connector connection part 50 and the reliability of the electronic components 15a and 15b that are vulnerable to vibration.

[0033] <The Third Embodiment> FIG. 5 is a diagram for explaining the third embodiment, and is a cross-sectional view of the camera device 1 in the same manner as in the case of FIG. 2 described above. Hereinafter, the description will focus on the configuration different from that of the first embodiment, and the description of the same configuration parts will be omitted. In the third embodiment, at least one of the spaces between the partition walls 81 and 82 and the main board 5 and between the partition walls 82 and 82 and the main board 5 is provided with a buffer material 90 at the connection boundary of the partition walls 81 and 82. In the example shown in FIG. 5, the buffer materials 90 are arranged between both the partition wall 81 and the main board 5 and between the partition wall 82 and the main board 5.

[0034] In the configuration of the first embodiment shown in FIG. 2 described above, the partition walls 81 and 82 separate the space by directly contacting the main substrate 5. However, due to the manufacturing tolerances of the main substrate 5, the base portion 8a, and the cover portion 8b, there may be a gap between the partition walls 81 and 82 and the main substrate 5. Since the uncured sealing material 13 has high fluidity, if a gap occurs between the partition walls 81 and 82 and the main substrate 5, the uncured sealing material 13 may flow into the first space 11 from that gap. Therefore, even when the second space 12 is filled with a specified amount of the sealing material 13, the sealing material 13 may flow into the first space 11 side, resulting in an insufficient amount of the sealing material 13 in the second space 12 and possibly causing a decrease in waterproof performance. In addition, there is a concern about contact failure due to the sealing material 13 flowing into the first space 11 and adhering to the electronic components stored on the first space 11 side, as well as the impact on the optical components.

[0035] In this embodiment, by interposing a deformable buffer material 90 between the partition walls 81 and 82 and the main substrate 5, it is possible to prevent the occurrence of a gap due to manufacturing tolerances by the deformation of the buffer material 90. As a result, it is possible to prevent the uncured sealing material 13 from flowing from the second space 12 into the first space 11.

[0036] In the example shown in FIG. 5, the buffer material 90 is provided on both sides between the partition walls 81 and 82 and the main substrate 5, but it may be provided on only one side. For example, when the main substrate 5 is screwed to the fixing portion 80 as described above, the main substrate 5 and the partition wall 81 are brought into close contact with each other by screwing, so that it is possible to reduce the gap generated due to manufacturing tolerances. Therefore, a configuration in which the buffer material 90 is provided only between the partition wall 82 and the main substrate 5 can be applied, which is preferable from the viewpoint of cost reduction.

[0037] As the material of the buffer material 90, those that can reduce the stress on the substrate when contacting the main substrate 5 are preferable. For example, rubber gaskets such as ethylene propylene rubber, butadiene rubber, and silicone rubber, more low-elastic elastomers, and liquid gaskets (low-elastic adhesives, waterproof adhesives) are used. Considering the viewpoint of manufacturability, a waterproof adhesive is preferable.

[0038] The assembly procedure of the camera device 1 when using a waterproof adhesive for the buffer material 90 will be described with reference to FIG. 6. FIG. 6 is a plan view showing a state where the camera module 2, the camera cover 3, and the main board 5 to which the connector 7 is connected are attached to the base portion 8a of the housing 8, and the imaging board 20 and the main board 5 are connected by the communication line 4. In the main board 5, the hatched portion is the board region 52. The main board 5 is placed on the fixing portion 80 and the partition wall 81 of the base portion 8a and is screwed to the fixing portion 80. Most of the region of the main board 5 is arranged on the first space side, and only the board region 52 including the connector connection portion 50 is arranged on the second space 12 side across the partition wall 81.

[0039] In FIG. 6, the thick two-dot chain line represents the waterproof adhesive 9. The waterproof adhesive 9 is arranged (applied) to the groove portion 84 of the base portion 8a and the region connected to the partition wall 82 on the main board 5 by using, for example, a dispenser or the like. In FIG. 6, the two-dot chain line described in the portion of the partition wall 81 indicated by the broken line represents the waterproof adhesive 9 used for connecting the partition wall 82 of the cover portion 8b and the main board 5, and it also functions as the above-described buffer material 90. By applying the waterproof adhesive 9 in this way to connect the base portion 8a and the cover portion 8b, the waterproof property of the connection portion of the housing 8 is ensured.

[0040] By using the same material (waterproof adhesive) for the buffer material 90 and the waterproof adhesive 9 for housing connection, a continuous coating operation can be performed in one step as shown by the two-dot chain line in FIG. 6. That is, the arrangement of the buffer material 90 and the waterproof adhesive 9 can be performed continuously, and the manufacturing process can be simplified. When applying the waterproof adhesive 9 as shown by the thick two-dot chain line, by making the heights of the application surfaces of the base portion 8a and the main board 5 substantially coincide, the waterproof adhesive 9 can be easily applied integrally and continuously.

[0041] For example, at the location indicated by reference sign C in FIG. 6, if there is an obvious step between the coating surface of the base portion 8a and the coating surface of the main substrate 5, a step of moving the dispenser in the vertical direction (height direction) at that step is necessary. Therefore, an excessive amount of adhesive will accumulate at that stepped portion (the location indicated by reference sign C). In order to prevent such a situation from occurring at the stepped portion, when moving the dispenser from the base portion 8a to the main substrate 5, it is necessary to temporarily interrupt the discharge of the waterproof adhesive 9 and move the dispenser in the height direction, which results in the disadvantage of increased working time.

[0042] On the other hand, by making the heights of the coating surface of the base portion 8a and the coating surface of the main substrate 5 substantially coincide as described above, the waterproof adhesive 9 can be uniformly applied over the entire circumference in one step without interrupting the discharge of the dispenser.

[0043] As described above, by using the common waterproof adhesive 9 for the adhesive used for connecting the base portion 8a and the cover portion 8b and the cushioning materials in the partition walls 81 and 82, and continuously applying the waterproof adhesive 9 used for connection and the waterproof adhesive 9 used for the cushioning materials, the manufacturing process can be simplified. Furthermore, by making the heights of the coating surface of the base portion 8a and the coating surface of the main substrate 5 substantially coincide, the waterproof adhesive 9 can be uniformly applied. Note that the configuration of the sealing material 13 in the second space 12 is the same as that in the first embodiment, and the same operational effects as those in the first embodiment can be achieved.

[0044] According to the above-described embodiments and modifications, the following operational effects can be achieved.

[0045] (1) As shown in FIGS. 1, 2, etc., the camera device 1 includes a camera module 2 having an imaging substrate 20 on which an imaging element is mounted and a lens, a main substrate 5 on which an image processing circuit is mounted and which is connected to the camera module 2 via a communication line 4, a connector 7 to which a connection terminal 70 is connected to a connector connection portion 50 of the main substrate 5, and a housing 8 having a base portion 8a and a cover portion 8b connected to each other and housing the camera module 2 and the main substrate 5. And the housing 8 has a first space 11 in which at least a part of the camera module 2 and the main substrate 5 are housed, and a second space 12 which is separated from the first space 11 by partitions (partitions 81, 82) and in which a substrate region 52 including the connector connection portion 50 of the main substrate 5 is housed, and a sealing material 13 is disposed in the second space 12 so as to enclose the substrate region 52.

[0046] Since the second space 12 is separated from the first space 11 by partitions (partitions 81, 82), the sealing material 13 can be disposed in the second space 12 without affecting the lens of the camera module 2 and the connection portion of the communication line 4 housed in the first space 11. Also, by disposing the sealing material 13 so as to enclose the substrate region 52, that is, so as to enclose the connector connection portion 50 to which the connection terminal 70 of the connector 7 is connected, the stress applied to the connector connection portion 50 can be reduced.

[0047] (2) In the above (1), as shown in FIG. 4, at least one electronic component 15a, 15b is mounted on the substrate region 52, and the sealing material 13 encloses the electronic components 15a, 15b and the substrate region 52. By enclosing the electronic components 15a, 15b which are vulnerable to vibration, such as electrolytic capacitors, etc., with the sealing material 13, the stress related to the electronic components can be reduced, and the reliability can be improved.

[0048] (3) In the above (1), as shown in FIG. 2 and the like, the partition walls (81, 82) are formed by connecting the first partition wall (partition wall 81) of the base portion 8a and the second partition wall (partition wall 82) of the cover portion 8b, and the substrate region 52 is disposed in the second space 12 through the connection boundary 85 between the partition wall 81 and the partition wall 82. By disposing the substrate region 52 in the second space 12 through the connection boundary 85 between the partition wall 81 and the partition wall 82, it becomes possible to easily separate the first space 11 that houses the image processing circuit and the communication line 4 mounted on the main substrate 5 from the second space 12 by the partition walls 81, 82.

[0049] (4) In the above (3), as shown in FIG. 5, a deformable buffer material 90 is provided between at least one of the first partition wall (partition wall 81) and the second partition wall (partition wall 82) and the main substrate 5. By providing such a deformable buffer material 90 between the partition walls 81, 82 and the main substrate 5, it is possible to eliminate the gaps caused by the dimensional tolerances of the partition walls 81, 82 and the main substrate 5, and prevent the leakage of the sealing material 13 from the second space 12 to the first space 11.

[0050] (5) In the above (4), as shown in FIG. 6, the base portion 8a and the cover portion 8b are connected by a waterproof adhesive 9, and it is preferable that the same adhesive as the waterproof adhesive 9 is used for the buffer material 90. By using the same adhesive for the buffer material 90 and the waterproof adhesive 9, it becomes possible to perform the installation (coating) of the buffer material 90 and the coating of the waterproof adhesive 9 in the same process.

[0051] (6) In the above (5), as shown in FIG. 6, the waterproof adhesive 9 that connects the base portion 8a and the cover portion 8b and the buffer material 90 using the same adhesive as the waterproof adhesive 9 are preferably formed continuously and integrally. In the manufacturing method in that case, the application of the waterproof adhesive 9 and the application of the adhesive constituting the buffer material 90 are continuously performed without interruption in the application process. As a result, the manufacturing process can be simplified.

[0052] The embodiments of the present invention have been described above. However, the above embodiments merely show some application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above embodiments.

Explanation of Reference Numerals

[0053] 1... Camera device, 2... Camera module, 3... Camera cover, 4... Communication line, 5... Main board, 7... Connector, 8... Housing, 8a... Base portion, 8b... Cover portion, 9... Waterproof adhesive, 11... First space, 12... Second space, 13... Sealing material, 15a, 15b... Electronic components, 20... Imaging board, 21... Imaging optical system, 50... Connector connection portion, 51, 52... Board regions, 70... Connection terminals, 80... Fixing portion, 81, 82... Partition walls, 85... Connection boundary, 90... Buffer material

Claims

1. A camera module having an imaging substrate on which an imaging element is mounted and a lens, A main substrate on which an image processing circuit is mounted and which is connected to the camera module via a communication line, A connector to which a connection terminal is connected to a connector connection portion of the main substrate, A housing having a base portion and a cover portion connected to each other and accommodating the camera module and the main substrate, The housing is A first space in which at least a part of the camera module and the main substrate are accommodated, A second space separated from the first space by a partition wall and accommodating a substrate region including the connector connection portion of the main substrate, A camera device in which a sealing material is disposed in the second space so as to enclose the substrate region.

2. In the camera device according to claim 1, At least one electronic component is mounted on the substrate region, The camera device, wherein the sealing material encloses the electronic component and the substrate region.

3. In the camera device according to claim 1, The partition wall is formed by connecting a first partition wall of the base portion and a second partition wall of the cover portion, The camera device, wherein the substrate region is disposed in the second space through a connection boundary between the first partition wall and the second partition wall.

4. In the camera device according to claim 3, A deformable cushioning material is provided between at least one of the first partition wall and the second partition wall and the main substrate.

5. In the camera device according to claim 4, The base portion and the cover portion are connected by a waterproof adhesive, The same adhesive as the waterproof adhesive is used for the cushioning material.

6. In the camera device according to claim 5, The waterproof adhesive connecting the base portion and the cover portion and the cushioning material using the same adhesive as the waterproof adhesive are continuously formed integrally.

7. A method for manufacturing the camera device according to claim 6, The method for manufacturing a camera device having a coating step of continuously and continuously coating the waterproof adhesive and the adhesive constituting the cushioning material.

Images