Three dimension mounting apparatus and three dimension mounting method

Abstract

To suppress misalignment of components.SOLUTION: A three dimension mounting apparatus includes a stage for holding a three dimensional substrate, a mounting head for mounting a component onto a surface of the three dimensional substrate, and a controller. The controller includes an allowable angle acquisition section that acquires an allowable angle, the allowable angle representing an inclination angle of the component having a misalignment amount controlled equal to or less than a specified amount after being mounted, a mounting order determination section that determines component mounting order on a plurality of mounting areas set on the surface of the three dimensional substrate so that the mounted components have the angle values equal to or less than the allowable angel, a stage control section that controls the stage so that the plurality of mounting areas sequentially become a horizontal state in accordance with the mounting order, and a head control section that controls the mounting head so that the components are sequentially mounted on the mounting area in the horizontal state in accordance with the mounting order.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The technology disclosed in this specification relates to a three-dimensional mounting device and a three-dimensional mounting method.

Background Art

[0002] In the technical field related to three-dimensional mounting devices, a three-dimensional mounting device for mounting components on a three-dimensional substrate, as disclosed in Patent Document 1, is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When mounting components on a mounting area set on the surface of a three-dimensional substrate, the inclination angle of the three-dimensional substrate is adjusted so that the mounting area is in a horizontal state. When mounting a second component on a second mounting area after mounting a first component on a first mounting area, the first mounting area may be inclined with respect to the horizontal plane. If the first mounting area is inclined with respect to the horizontal plane, the first component may be displaced due to the action of gravity.

[0005] The technology disclosed in this specification aims to suppress displacement of components.

Means for Solving the Problems

[0006] This specification discloses a three-dimensional mounting apparatus including a stage for supporting a three-dimensional substrate, a mounting head for mounting components on the surface of the three-dimensional substrate, and a controller. The controller includes a tolerance angle acquisition unit that acquires a tolerance angle indicating an inclination angle of a component for which the amount of positional deviation after mounting is suppressed to be equal to or less than a specified amount, a mounting order determination unit that determines the mounting order of components with respect to a plurality of mounting areas set on the surface of the three-dimensional substrate so that the components after mounting are at an angle equal to or less than the tolerance angle, a stage control unit that controls the stage so that the plurality of mounting areas are sequentially in a horizontal state according to the mounting order, and a head control unit that controls the mounting head so that components are sequentially mounted on the mounting areas in the horizontal state according to the mounting order.

Advantages of the Invention

[0007] According to the technology disclosed in this specification, the positional deviation of components is suppressed.

Brief Description of the Drawings

[0008]

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MODE FOR CARRYING OUT THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis of the predetermined plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The rotational direction or tilting direction centered on the X-axis direction is defined as the θX direction. The rotational direction or tilting direction centered on the Y-axis direction is defined as the θY direction. The rotational direction or tilting direction centered on the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane and the horizontal plane are parallel. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the vertical direction. The +Z side is the upper side, and the -Z side is the lower side. Also, in the embodiments, the predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0010] [First Embodiment] The first embodiment will be described.

[0011] [Substrate] FIG. 1 is a perspective view showing a substrate 1 and components 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a part of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. Protrusions may be provided on the surface of the substrate 1.

[0012] An electric circuit is provided on the surface of the substrate 1. In the embodiment, the substrate 1 is formed by an in-mold molding technique. The substrate 1 includes a base material 1A having a curved surface and a film 1B joined to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electric circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0013] The component 2 includes an electronic component. The component 2 may be a lead-type electronic component having leads protruding from a body. The component 2 may be a chip-type electronic component having no leads. An electronic device is manufactured by mounting the component 2 on the surface of the substrate 1.

[0014] <Palette> FIG. 2 is a perspective view showing a palette 3 for holding the substrate 1 according to an embodiment. FIG. 3 is an exploded perspective view showing the substrate 1 and the palette 3 according to an embodiment. The palette 3 holds the substrate 1. In the embodiment, the substrate 1 is handled while being held by the palette 3. The palette 3 has a support member 4 for supporting the substrate 1 and a clamp mechanism 5 for fixing the substrate 1.

[0015] The support member 4 includes a base portion 4A for supporting the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and the -Y side of the base portion 4A, and a plurality of pin portions 4C for supporting the substrate 1 from each of the +Y side and the -Y side.

[0016] The base portion 4A is plate-shaped and has a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper surface and the lower surface of the base portion 4A.

[0017] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B is provided. The pair of guard portions 4B are separated from each other in the Y-axis direction. One guard portion 4B protrudes from the +Y side end of the upper surface of the base portion 4A to the +Z side. The other guard portion 4B protrudes from the -Y side end of the upper surface of the base portion 4A to the +Z side.

[0018] Each of the plurality of pin portions 4C protrudes from the upper surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The plurality of pin portions 4C arranged on the +Y side of the center of the base portion 4A support the +Y side end of the substrate 1. The plurality of pin portions 4C arranged on the -Y side of the center of the base portion 4A support the -Y side end of the substrate 1.

[0019] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support portions 5A that support the -X side end of the substrate 1 and a movable portion 5B that supports the +X side end of the substrate 1. The movable portion 5B is movable in the X-axis direction on the upper surface of the base portion 4A. With the substrate 1 disposed between the support portion 5A and the movable portion 5B, when the movable portion 5B moves in the -X direction, the substrate 1 is sandwiched between the support portion 5A and the movable portion 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support portion 5A and the movable portion 5B.

[0020] <3D mounting device> FIG. 4 is a side view schematically showing the 3D mounting device 10 according to the embodiment. FIG. 5 is a plan view schematically showing the 3D mounting device 10 according to the embodiment. The 3D mounting device 10 mounts the component 2 on the substrate 1.

[0021] The 3D mounting device 10 includes a base member 18, a transfer device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a camera 25, a head moving device 27, a dispenser 11, a laser head 12, a chamber 29, and a controller 16.

[0022] The base member 18 supports each of a conveying device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24, a dispenser 11, a laser head 12, and a head moving device 27.

[0023] The conveying device 19 conveys the pallet 3 holding the substrate 1 in the X-axis direction. The conveying device 19 conveys the pallet 3 to the processing position of the three-dimensional mounting device 10. The processing position is defined in the conveying path of the conveying device 19.

[0024] The conveying device 19 has a conveying belt 19A that conveys the pallet 3 in the X-axis direction and a guide member 19B that guides the pallet 3.

[0025] The guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are separated from each other in the Y-axis direction. One guide member 19B is disposed on the +Y side of the pallet 3. The other guide member 19B is disposed on the -Y side of the pallet 3.

[0026] The conveying belt 19A is annular. A pair of conveying belts 19A are provided. The conveying belt 19A is supported by the guide member 19B via a driving pulley and a driven pulley. The conveying belt 19A is wound around the driving pulley and the driven pulley. One conveying belt 19A is supported by one guide member 19B. The other conveying belt 19A is supported by the other guide member 19B.

[0027] Of the pair of conveying belts 19A, the conveying belt 19A disposed on the +Y side supports the +Y side end portion of the lower surface of the pallet 3. The conveying belt 19A disposed on the -Y side supports the -Y side end portion of the lower surface of the pallet 3. When the driving pulley rotates by a drive motor (not shown), the pallet 3 is conveyed in the X-axis direction.

[0028] By an actuator (not shown), one guide member 19B is movable in the Y-axis direction with respect to the other guide member 19B. When the one guide member 19B and the other guide member 19B move apart in the Y-axis direction, the support of the pallet 3 by the conveyor belt 19A is released.

[0029] FIG. 6 is a perspective view showing the pallet 3 and the stage 20 according to the embodiment. FIG. 7 is an exploded perspective view showing the pallet 3 and the stage 20 according to the embodiment.

[0030] The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 conveyed to the processing position from the -Z side. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into the holes 4D of the pallet 3. When the positioning members 20A are inserted into the holes 4D from the -Z side of the pallet 3, the stage 20 and the pallet 3 are positioned. Hooks are provided at the upper end portions of the positioning members 20A. The hooks are hung on the pallet 3. The hooks include balls that move by air pressure. After the positioning members 20A are inserted into the holes 4D from the -Z side of the pallet 3, the balls are hung on the pallet 3, whereby the stage 20 and the pallet 3 are fixed.

[0031] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, Z-axis direction, θX direction, and θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0032] After the pallet 3 is transported to the processing position by the transport device 19, the +Y-side guide member 19B moves in the +Y direction so as to separate from the other guide member 19B, and the stage moving device 21 moves the stage 20 in the +Z direction. By moving the +Y-side guide member 19B in the Y-axis direction so as to separate from the other guide member 19B, the support of the pallet 3 by the conveyor belt 19A is released. When the support of the pallet 3 by the conveyor belt 19A is released and the stage 20 moves in the +Z direction, the pallet 3 is transferred from the transport device 19 to the stage 20. The stage moving device 21 can move the stage 20 in the Z-axis direction, θX direction, and θY direction by moving the stage 20 in the +Y direction so that the pallet 3 is supported by the stage 20 and comes to the center between the two guide members 19B.

[0033] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 comes onto the conveyor belt 19A, and the +Y-side guide member 19B moves to the -Y side until the opposite side of the pallet 3 comes onto the conveyor belt 19A. After the fixing of the hook provided at the upper end of the positioning member 20A is released, the stage moving device 21 moves the stage 20 in the -Z direction. As a result, the support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the conveyor belt 19A.

[0034] The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeder holds a plurality of components 2. The component supply device 22 supplies at least one of the plurality of components 2 to the supply position. The component supply device 22 is arranged on the -Y side of the transport device 19. Note that the component supply device 22 may be arranged on each of the +Y side and -Y side of the transport device 19.

[0035] The mounting head 24 mounts the component 2 on the substrate 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the component 2 supplied from the component supply device 22 by the nozzles 23 and mounts it on the substrate 1. The mounting head 24 is movable between a supply position where the component 2 is supplied from the component supply device 22 and a processing position where the substrate 1 is disposed. The mounting head 24 holds the component 2 supplied to the supply position by the nozzles 23, moves to the processing position, and then mounts it on the surface of the substrate 1 disposed at the processing position.

[0036] The head moving device 27 moves the mounting head 24. In the embodiment, the head moving device 27 moves the mounting head 24 in each of the X-axis direction and the Y-axis direction. The head moving device 27 includes an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. By the operation of the X-axis moving device 27X, the mounting head 24 moves in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. By the operation of the Y-axis moving device 27Y causing the X-axis moving device 27X to move in the Y-axis direction, the mounting head 24 moves in the Y-axis direction.

[0037] FIG. 8 is a diagram schematically showing the mounting head 24 according to the embodiment. As shown in FIG. 8, the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction-hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 in contact with the component 2, a suction operation is performed from the opening provided at the lower end of the nozzle 23, whereby the component 2 is suction-held at the lower end of the nozzle 23. When the suction operation from the opening is released, the component 2 is released from the nozzle 23. Note that the nozzle 23 may be a gripper nozzle that holds the component 2 by sandwiching it.

[0038] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in each of the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of the shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to respective ones of the plurality of shafts 23A. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to respective ones of the plurality of shafts 23A. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the nozzle 23 by moving the shaft 23A in the Z-axis direction and the θZ direction.

[0039] The nozzle 23 is movable in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction by the head moving device 27 and the nozzle moving device 28. When the nozzle 23 moves, the component 2 held by the nozzle 23 is also movable in each of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0040] The camera 25 images the substrate 1. In the embodiment, the camera 25 images the surface of the substrate 1 from the +Z side of the substrate 1. The camera 25 is provided on the mounting head 24. The camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The camera 25 can image the alignment marks provided on the surface of the substrate 1. The camera 25 can image the component 2 after being mounted on the substrate 1.

[0041] The dispenser 11 applies the cream solder to the substrate 1. The dispenser 11 moves in each of the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the transfer device 19. The dispenser 11 and the mounting head 24 are movable separately. After the cream solder is applied to the surface of the substrate 1 by the dispenser 11, the component 2 is mounted on the substrate 1 by the mounting head 24. The mounting head 24 mounts the component 2 on the substrate 1 to which the cream solder has been applied.

[0042] The laser head 12 irradiates the cream solder with laser light so that the cream solder melts. The laser head 12 irradiates the cream solder with laser light after the component 2 is mounted on the substrate 1 via the cream solder. The laser head 12 irradiates the cream solder with laser light to melt the cream solder. The laser head 12 moves in the X-axis direction, Y-axis direction, and Z-axis direction, respectively, on the +Z side of the transfer device 19. The laser head 12, the dispenser 11, and the mounting head 24 can move separately.

[0043] The chamber 29 has an internal space in which the base member 18, the transfer device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, the nozzle moving device 28, the dispenser 11, and the laser head 12 are respectively accommodated.

[0044] <Controller> FIG. 9 is a hardware configuration diagram of the controller 16 according to the embodiment. The controller 16 includes a computer system. The controller 16 has a processor 16A such as a CPU (Central Processing Unit), a main memory 16B including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 16C, and an interface 16D including an input / output circuit. The functions of the controller 16 are stored in the storage 16C as a computer program. The processor 16A reads the computer program from the storage 16C and expands it in the main memory 16B, and executes a predetermined process according to the computer program. Note that the computer program may be distributed to the controller 16 via a network.

[0045] FIG. 10 is a functional block diagram showing a three-dimensional mounting device 10 according to an embodiment. As shown in FIG. 10, the controller 16 includes a permissible angle storage unit 30, a mounting order storage unit 40, a dispenser control unit 31, a stage control unit 32, a head control unit 33, a laser control unit 34, a misalignment amount calculation unit 35, a permissible angle acquisition unit 36, and a mounting order determination unit 37.

[0046] The dispenser control unit 31 controls the dispenser 11. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to the surface of the substrate 1.

[0047] FIG. 11 is a plan view schematically showing a substrate 1 according to an embodiment. As shown in FIG. 11, a plurality of mounting areas 50 are set on the surface of the substrate 1. The mounting area 50 is an area where the component 2 is mounted. The component 2 is mounted in each of the plurality of mounting areas 50. The dispenser control unit 31 applies the cream solder 60 to each of the plurality of mounting areas 50.

[0048] The stage control unit 32 controls the stage 20. The head control unit 33 controls the mounting head 24 so that the component 2 is mounted on the substrate 1 supported by the stage 20.

[0049] Each of FIGS. 12 and 13 is a diagram for explaining the operations of the stage 20 and the mounting head 24 according to an embodiment. A plurality of mounting areas 50 are set on the surface of the substrate 1. In the example shown in FIGS. 12 and 13, the mounting areas 50 set on the surface of the substrate 1 include a mounting area 50A, a mounting area 50B, and a mounting area 50C. The cream solder 60 is applied to each of the plurality of mounting areas 50. The component 2 includes a component 2A mounted in the mounting area 50A, a component 2B mounted in the mounting area 50B, and a component 2C mounted in the mounting area 50C.

[0050] When mounting the component 2 on the mounting area 50 set on the surface of the substrate 1, the inclination angle of the substrate 1 is adjusted so that the mounting area 50 is in a horizontal state. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2 is sequentially mounted on the mounting area 50 in a horizontal state.

[0051] As shown in FIG. 12, when mounting the component 2A on the mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2A is mounted on the mounting area 50A in a horizontal state. The component 2A is mounted on the mounting area 50A via the cream solder 60 applied to the mounting area 50A.

[0052] As shown in FIG. 13, after the component 2A is mounted on the mounting area 50A, the component 2B is mounted on the mounting area 50B. When mounting the component 2B on the mounting area 50B, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2B is mounted on the mounting area 50B in a horizontal state. The component 2B is mounted on the mounting area 50B via the cream solder 60 applied to the mounting area 50B.

[0053] After the component 2B is mounted on the mounting area 50B, the component 2C is mounted on the mounting area 50C. When mounting the component 2C on the mounting area 50C, the stage control unit 32 controls the stage 20 so that the mounting area 50C is in a horizontal state. The head control unit 33 controls the mounting head 24 so that the component 2C is mounted on the mounting area 50C in a horizontal state. The component 2C is mounted on the mounting area 50C via the cream solder 60 applied to the mounting area 50C.

[0054] The laser control unit 34 controls the laser head 12. After the component 2 is mounted on the mounting area 50 via the cream solder 60, the laser control unit 34 controls the laser head 12 so that the cream solder 60 is irradiated with laser light. When the cream solder 60 is irradiated with laser light, the cream solder 60 melts. When the melted cream solder 60 cools, the component 2 is soldered to the substrate 1.

[0055] FIG. 14 is a diagram for explaining the operation of the laser head 12 according to the embodiment. As shown in FIG. 14, after the component 2 is mounted on the mounting area 50, the laser head 12 irradiates the cream solder 60 with laser light. When irradiating the cream solder 60 in the mounting area 50 where the component 2 is mounted with laser light, the inclination angle of the substrate 1 is adjusted so that the mounting area 50 is in a horizontal state. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50 is sequentially irradiated with laser light.

[0056] As shown in FIG. 14, when irradiating the cream solder 60 in the mounting area 50A where the component 2A is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50A is irradiated with laser light. The cream solder 60 in the mounting area 50A melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50A is cooled, the component 2A is soldered to the mounting area 50A.

[0057] When irradiating the cream solder 60 in the mounting area 50B where the component 2B is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50B is irradiated with laser light. The cream solder 60 in the mounting area 50B melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50B is cooled, the component 2B is soldered to the mounting area 50B.

[0058] When irradiating the cream solder 60 in the mounting area 50C where the component 2C is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50C is in a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting area 50C is irradiated with laser light. The cream solder 60 in the mounting area 50C melts by the irradiation of the laser light. When the melted cream solder 60 in the mounting area 50C is cooled, the component 2C is soldered to the mounting area 50C.

[0059] <Allowable Angle> The misalignment amount calculation unit 35 calculates the misalignment amount ΔD of the component 2 after mounting with respect to the mounting area 50. The component 2 after being mounted on the substrate 1 is imaged by the camera 25. The misalignment amount calculation unit 35 calculates the misalignment amount ΔD of the component 2 after mounting based on the image data of the component 2 after being imaged by the camera 25.

[0060] FIG. 15 is a diagram for explaining the misalignment of the component 2 according to the embodiment. After the component 2 is mounted on the mounting area 50 via the cream solder 60 and before the cream solder 60 is irradiated with laser light, the component 2 is not soldered to the mounting area 50. Therefore, as shown in FIG. 15, when the mounting area 50 is inclined with respect to the horizontal plane, the component 2 may be misaligned with respect to the mounting area 50 due to the action of gravity.

[0061] For example, as shown in FIG. 13, when component 2A is mounted on mounting area 50A and then component 2B is mounted on mounting area 50B, mounting area 50A is inclined with respect to the horizontal plane. When mounting area 50A is inclined with respect to the horizontal plane, due to the action of gravity, component 2A may be displaced.

[0062] When calculating the displacement amount ΔD of component 2, after component 2 is mounted on mounting area 50 via solder paste 60 and before the solder paste 60 is irradiated with laser light, component 2 is imaged by camera 25. Displacement amount calculation unit 35 can calculate the displacement amount ΔD of component 2 based on the image data of component 2 imaged by camera 25.

[0063] Allowable angle acquisition unit 36 acquires an allowable angle θ indicating the maximum value of the inclination angle of component 2 at which the displacement amount ΔD of component 2 after mounting is suppressed to be equal to or less than a predetermined specified amount. The inclination angle of component 2 is equal to the inclination angle of mounting area 50 on which component 2 is mounted. The inclination angle of component 2 and the inclination angle of mounting area 50 are inclination angles with respect to the horizontal plane. The specified amount is a value close to zero. In the embodiment, allowable angle θ is the maximum value of the inclination angle at which component 2 is substantially not displaced.

[0064] As shown in FIG. 15, when displacement amount calculation unit 35 calculates displacement amount ΔD, stage control unit 32 inclines mounting area 50 to an arbitrary inclination angle. Stage control unit 32 gradually increases the inclination angle of mounting area 50 with respect to the horizontal plane from 0 degrees. Camera 25 images component 2 mounted on mounting area 50 whose inclination angle is gradually increasing. Displacement amount calculation unit 35 can calculate the maximum value of the inclination angle of component 2 at which displacement amount ΔD becomes equal to or less than the specified value based on the image data of component 2 mounted on mounting area 50 whose inclination angle is gradually increasing. In the embodiment, displacement amount calculation unit 35 can calculate the maximum value of the inclination angle of component 2 at which component 2 is substantially not displaced based on the image data of component 2.

[0065] The allowable angle acquisition unit 36 acquires, as the allowable angle θ, the maximum value of the inclination angle of the component 2 when the amount of positional deviation ΔD of the component 2 calculated by the positional deviation amount calculation unit 35 is equal to or less than the specified amount. The positional deviation amount calculation unit 35 calculates the allowable angle θ for each of the plurality of components 2 mounted on the substrate 1. The allowable angle acquisition unit 36 acquires the allowable angle θ for each of the plurality of components 2 mounted on the substrate 1. The allowable angle θ acquired by the allowable angle acquisition unit 36 is stored in the allowable angle storage unit 30.

[0066] <Mounting order> The mounting order determination unit 37 determines the mounting order of the component 2 with respect to the plurality of mounting areas 50 set on the surface of the substrate 1 so that the component 2 after being mounted on the substrate 1 has an allowable angle θ or less. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state according to the mounting order determined by the mounting order determination unit 37. The head control unit 33 controls the mounting head 24 so that the component 2 is sequentially mounted on the horizontal mounting area 50 according to the mounting order determined by the mounting order determination unit 37.

[0067] Each of FIGS. 16 and 17 is a diagram for explaining the mounting order of the component 2 according to the embodiment. In the examples shown in FIGS. 16 and 17, the allowable angle θa of the component 2A is smaller than the allowable angle θb of the component 2B. FIG. 16 shows an example in which the component 2B is mounted on the mounting area 50B after the component 2A is mounted on the mounting area 50A. FIG. 17 shows an example in which the component 2A is mounted on the mounting area 50A after the component 2B is mounted on the mounting area 50B.

[0068] As shown in FIG. 16(A), when mounting 2A on the mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. As shown in FIG. 16(B), when mounting the component 2B on the mounting area 50B after the component 2A is mounted on the mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. Since the allowable angle θa of the component 2A is small, when the mounting area 50A is inclined with respect to the horizontal plane, the component 2A is likely to be displaced due to the action of gravity.

[0069] As shown in FIG. 17(A), when mounting the component 2B on the mounting area 50B, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal state. As shown in FIG. 17(B), after the component 2B is mounted on the mounting area 50B, when mounting the component 2A on the mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal state. Since the allowable angle θb of the component 2B is large, even if the mounting area 50B is inclined with respect to the horizontal plane, the possibility of the component 2B being displaced is low.

[0070] As shown in FIG. 17, after mounting the component 2B with a large allowable angle θb and then mounting the component 2A with a small allowable angle θa, displacement of each of the component 2A and the component 2B is suppressed. The mounting order determination unit 37 determines the mounting order of the component 2 for each of the plurality of mounting areas 50 so that the component 2 with a small allowable angle θ is mounted after the component 2 with a large allowable angle θ. The mounting order determined by the mounting order determination unit 37 is stored in the mounting order storage unit 40.

[0071] The mounting order of the component 2 determined by the mounting order determination unit 37 is stored in the mounting order storage unit 40, and by mounting the components in that order, displacement is suppressed.

[0072] <Corresponding to components with displacement not eliminated> Due to the weight of the component 2, the size of the component 2, the shape of the substrate 1, etc., even if the mounting order is adjusted, there may be a component 2 that does not become less than the allowable angle θ in the mounting of the component 2. That is, even if the mounting order is adjusted, there may be a component 2 whose displacement is not eliminated.

[0073] In the following description, a component 2 whose displacement is eliminated by adjusting the mounting order is appropriately referred to as an allowable component, and a component 2 whose displacement is not eliminated even if the mounting order is adjusted is appropriately referred to as a non-allowable component.

[0074] Each of FIGS. 18 and 19 is a diagram for explaining component 2 in which misalignment is not eliminated according to the embodiment. In the examples shown in FIGS. 18 and 19, the mounting area 50 set on the surface of the substrate 1 includes a mounting area 50D, a mounting area 50E, and a mounting area 50F. Solder paste 60 is applied to each of the plurality of mounting areas 50. Component 2 includes a component 2D mounted in the mounting area 50D, a component 2E mounted in the mounting area 50E, and a component 2F mounted in the mounting area 50F. The allowable angle θf of component 2F is large. The allowable angles θd of component 2D and θe of component 2E are small. Component 2F is an allowable component. Each of component 2D and component 2E is a non-allowable component. FIG. 18 shows an example in which after component 2D is mounted in the mounting area 50D, component 2E is mounted in the mounting area 50E. FIG. 19 shows an example in which after component 2E is mounted in the mounting area 50E, component 2D is mounted in the mounting area 50D. Component 2F is already mounted in the mounting area 50F.

[0075] As shown in FIG. 18(A), when mounting component 2D in the mounting area 50D, the stage control unit 32 controls the stage 20 so that the mounting area 50D is in a horizontal state. As shown in FIG. 18(B), after component 2D is mounted in the mounting area 50D, when mounting component 2E in the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E is in a horizontal state. Since the allowable angle θd of component 2D is small, when the mounting area 50D is inclined with respect to the horizontal plane, component 2D is likely to be misaligned due to the action of gravity.

[0076] As shown in FIG. 19(A), when mounting component 2E in the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E is in a horizontal state. As shown in FIG. 19(B), after component 2E is mounted in the mounting area 50E, when mounting component 2D in the mounting area 50D, the stage control unit 32 controls the stage 20 so that the mounting area 50D is in a horizontal state. Since the allowable angle θe of component 2E is small, when the mounting area 50E is inclined with respect to the horizontal plane, component 2E is likely to be misaligned due to the action of gravity.

[0077] That is, when component 2E is mounted on mounting area 50E after component 2D is mounted on mounting area 50D, component 2D does not fall below the allowable angle θd during the mounting of component 2E, and component 2D is displaced. Even when the mounting order is reversed and component 2D is mounted on mounting area 50D after component 2E is mounted on mounting area 50E, there may be a situation where component 2E does not fall below the allowable angle θe during the mounting of component 2D.

[0078] When the situations shown in FIGS. 18 and 19 occur, that is, after component 2D is mounted on mounting area 50D, component 2D does not fall below the allowable angle θd during the mounting of component 2E, and there are cases where component 2E does not fall below the allowable angle θe during the mounting of component 2D after the mounting order is reversed and component 2E is mounted on mounting area 50E. In that case, the laser control unit 34 irradiates the cream solder 60 in mounting area 50D with laser light after component 2D is mounted and before the substrate 1 is tilted, and fixes component 2D by soldering before the tilt associated with the mounting of component 2E. When the mounting order is opposite, the laser head 12 is controlled so that the cream solder 60 in mounting area 50E is irradiated with laser light after component 2E is mounted and before the substrate 1 is tilted.

[0079] Each of FIGS. 20 and 21 is a diagram for explaining the operation of the three-dimensional mounting apparatus 10 when there is a component 2 for which displacement is not eliminated according to the embodiment.

[0080] As shown in FIG. 20(A), when component 2D is mounted on mounting area 50D, the stage control unit 32 controls the stage 20 so that mounting area 50D is in a horizontal state. As shown in FIG. 20(B), after component 2D is mounted on mounting area 50D, the cream solder 60 in mounting area 50D is irradiated with laser light while the horizontal state of mounting area 50D is maintained. When the melted cream solder 60 by the laser light cools, component 2D is soldered to mounting area 50D.

[0081] As shown in FIG. 21(A), after the component 2D is soldered to the mounting area 50D, the component 2E is mounted on the mounting area 50E. When mounting the component 2E on the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E becomes horizontal. When the mounting area 50E becomes horizontal, the mounting area 50D inclines with respect to the horizontal plane. Since the component 2D is soldered to the mounting area 50D, even if the inclination angle of the mounting area 50D exceeds the allowable angle θd, the displacement of the component 2D is suppressed. As shown in FIG. 21(B), after the component 2E is mounted on the mounting area 50E, the mounting area 50E is maintained in a horizontal state, and the laser light is irradiated onto the cream solder 60 in the mounting area 50E. When the melted cream solder 60 by the laser light cools, the component 2E is soldered to the mounting area 50E. Thereafter, the soldering of the allowable components by the laser light is sequentially performed.

[0082] <Method for determining mounting order> FIG. 22 is a flowchart showing a method for determining the mounting order of the component 2 according to the embodiment. When determining the mounting order, the test substrate 1 and the test component 2 are used.

[0083] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 become horizontal sequentially. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SA1).

[0084] The head control unit 33 controls the mounting head 24 so that the component 2 is mounted on the horizontal mounting area 50 (step SA2).

[0085] The displacement amount calculation unit 35 causes the camera 25 to image the component 2 in the mounting area 50 (step SA3).

[0086] The displacement amount calculation unit 35 calculates the respective displacement amounts ΔD of the component 2 based on the image data of the component 2 captured in step SA3 (step SA4). It is determined whether or not the displacement amount ΔD calculated by the displacement amount calculation unit 35 is less than or equal to a specified amount (step SA5).

[0087] In step SA5, when it is determined that the displacement amount ΔD is less than or equal to the specified amount (step SA5: Yes), the stage control unit 32 increases the tilt angle of the mounting area 50, and the imaging by the displacement amount calculation unit 35 and the calculation of the displacement amount ΔD are repeated (step SA6).

[0088] In step SA5, when it is determined that the displacement amount ΔD exceeds the specified amount (step SA5: No), the tilt angle before the displacement amount ΔD exceeds the specified amount is stored in the allowable angle storage unit 30 as the allowable angle θ of the tilt angle of the component 2 (step SA7).

[0089] This operation is performed for each component 2 mounted on the substrate 1. The allowable angle θ stored in the allowable angle storage unit 30 can also be applied to other substrates 1 for the same component 2.

[0090] The mounting order determination unit 37 determines the mounting order of the component 2 with respect to the plurality of mounting areas 50 based on the respective allowable angles θ of the plurality of components 2.

[0091] The mounting order determination unit 37 tentatively determines the mounting order based on the optimal mounting order in the case of a conventional flat substrate (step SA8).

[0092] Check whether each component 2 becomes an allowable component or a non-allowable component when mounted in accordance with the mounting order (step SA9).

[0093] The non-allowable components are moved to the back of the mounting order, and it is checked whether each component 2 becomes an allowable component or a non-allowable component (step SA10).

[0094] Repeat the rearrangement and check of the mounting order until the identification of acceptable parts and unacceptable parts no longer changes (step SA11).

[0095] Store the mounting order and the identification of acceptable parts and unacceptable parts in that order in the mounting order storage unit 40 (step SA12).

[0096] By doing so, the parts 2 with a small allowable angle θ, that is, the parts 2 that are likely to be displaced, are mounted later in the mounting order, and are less likely to receive the inclination of the substrate 1 when other parts 2 are mounted. Therefore, by increasing the acceptable parts and decreasing the unacceptable parts, continuous mounting operation becomes possible and the mounting tact can be shortened.

[0097] <Mounting method> FIG. 23 is a flowchart showing a method for mounting the parts 2 according to the embodiment.

[0098] The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SB1).

[0099] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are sequentially in a horizontal state according to the mounting order stored in the mounting order storage unit 40. The head control unit 33 controls the mounting head 24 so that the parts 2 are sequentially mounted on the horizontal mounting area 50 according to the mounting order stored in the mounting order storage unit 40, and mounts the acceptable parts (step SB2).

[0100] The head control unit 33 determines whether there are any unacceptable parts (step SB3).

[0101] In step SB3, if it is determined that there are unacceptable parts (step SB3: Yes), the head control unit 33 mounts the unacceptable parts on the mounting area 50 (step SB4).

[0102] As described with reference to FIGS. 20 and 21, after the non-conforming parts are mounted on the mounting area 50, the laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 of the non-conforming parts in a state where the horizontal state of the mounting area 50 is maintained (step SB5).

[0103] The head control unit 33 determines whether or not the mounting of all the non-conforming parts has been completed (step SB6).

[0104] In step SB6, if it is determined that the mounting of the non-conforming parts has not been completed (step SB6: No), the process returns to step SB4.

[0105] In step SB6, if it is determined that the mounting of the non-conforming parts has been completed (step SB6: Yes), the laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 of the conforming parts (step SB7).

[0106] The laser control unit 34 controls the laser head 12 so that the laser light is sequentially irradiated onto the cream solder 60 of each of the plurality of conforming parts. Similarly, in step SB3, if it is determined that there are no non-conforming parts (step SB3: No), the laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 of each of the plurality of conforming parts (step SB7).

[0107] The soldering order by the laser light at this time is set to be the opposite order to the component mounting, so that it is possible to prevent the conforming parts before soldering from being tilted more than the angle at the time of mounting.

[0108] <Effect> As described above, according to the embodiment, based on the allowable angle θ of the component 2, the mounting order of the component 2 is determined. Since the mounting order of the component 2 is determined so that the component 2 after mounting is equal to or less than the allowable angle θ, the displacement of the component 2 is suppressed.

[0109] The three-dimensional mounting apparatus 10 is designed such that an optimum tact time is achieved when continuously adsorbing and mounting components 2, thereby improving productivity. According to the present invention, by discriminating between acceptable components and unacceptable components, acceptable components can be continuously adsorbed and mounted in the conventional manner, and even in three-dimensional mounting where the substrate 1 is mounted while being tilted, a decrease in tact time can be minimized.

[0110] [Second Embodiment] The second embodiment will be described. In the following description, components that are the same as or equivalent to those in the above-described embodiment are denoted by the same reference numerals, and the description of those components is simplified or omitted.

[0111] FIG. 24 is a side view schematically showing a three-dimensional mounting apparatus 110 according to the embodiment. In the embodiment, the three-dimensional mounting apparatus 110 includes an application head 13 for applying an adhesive 70 to the surface of the substrate 1, and an ultraviolet light head 14 for emitting ultraviolet light. In FIG. 24, the dispenser 11 is not shown. Note that the cream solder 60 may be applied to the substrate 1 by an application apparatus different from the three-dimensional mounting apparatus 110.

[0112] FIG. 25 is a functional block diagram showing the three-dimensional mounting apparatus 110 according to the embodiment. In the embodiment, the controller 16 has a fixed control unit 38 for controlling each of the application head 13 and the ultraviolet light head 14.

[0113] FIG. 26 is a diagram for explaining the operation of the application head 13 according to the embodiment. In the embodiment, the adhesive 70 is applied to the mounting area 50 where the unacceptable component is to be mounted. The unacceptable component and the mounting area 50 are fixed with the adhesive 70.

[0114] In the embodiment, the adhesive 70 is an ultraviolet light curable type. The fixed control unit 38 controls the ultraviolet light head 14 such that after the unacceptable component is mounted on the mounting area 50 via the adhesive 70 and the cream solder 60, the adhesive 70 applied to the mounting area 50 is irradiated with ultraviolet light.

[0115] Each of FIGS. 27 and 28 is a diagram for explaining the operation of the three-dimensional mounting device 110 when there is a component 2 where misalignment is not eliminated according to the embodiment.

[0116] After mounting the component 2D on the mounting area 50D and before mounting the component 2E, if the component 2D does not become equal to or less than the allowable angle θd, and after mounting the component 2E on the mounting area 50E and before mounting the component 2D, if the component 2E does not become equal to or less than the allowable angle θe, the fixing control unit 38 controls the application head 13 so that the component 2D and the mounting area 50D are fixed with the adhesive 70 after mounting the component 2D and before tilting the substrate 1, and the component 2E and the mounting area 50E are fixed with the adhesive 70 after mounting the component 2E and before tilting the substrate 1.

[0117] Before the non-conforming component 2D is mounted on the mounting area 50D, the cream solder 60 and the adhesive 70 are applied to the mounting area 50D. Before the non-conforming component 2E is mounted on the mounting area 50E, the cream solder 60 and the adhesive 70 are applied to the mounting area 50E.

[0118] As shown in FIG. 27(A), when mounting the component 2D on the mounting area 50D, the stage control unit 32 controls the stage 20 so that the mounting area 50D is in a horizontal state. The component 2D is mounted on the mounting area 50D via the adhesive 70 and the cream solder 60. As shown in FIG. 27(B), after the component 2D is mounted on the mounting area 50D via the adhesive 70 and the cream solder 60, ultraviolet light is irradiated onto the adhesive 70 of the mounting area 50D while maintaining the horizontal state of the mounting area 50D. By irradiating the adhesive 70 with ultraviolet light, the adhesive 70 hardens, and the component 2D and the mounting area 50D are fixed with the adhesive 70.

[0119] As shown in FIG. 28(A), after the component 2D and the mounting area 50D are fixed with the adhesive 70, the component 2E is mounted on the mounting area 50E. When mounting the component 2E on the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E becomes horizontal. When the mounting area 50E becomes horizontal, the mounting area 50D is inclined with respect to the horizontal plane. Since the component 2D is fixed to the mounting area 50D with the adhesive 70, even if the inclination angle of the mounting area 50D exceeds the allowable angle θd, the displacement of the component 2D is suppressed. As shown in FIG. 28(B), after the component 2E is mounted on the mounting area 50E via the adhesive 70 and the cream solder 60, ultraviolet light is irradiated onto the adhesive 70 of the mounting area 50E while the horizontal state of the mounting area 50E is maintained. By irradiating the adhesive 70 with ultraviolet light, the adhesive 70 is cured, and the component 2E and the mounting area 50E are fixed with the adhesive 70.

[0120] Curing of the adhesive by ultraviolet light does not need to be immediately after the component 2 is mounted, and there is no problem as long as the component 2 is not tilted by more than the allowable angle θ before that. Therefore, as long as this condition is met, adjacent non-allowable components can be cured simultaneously, and the tact time can be shortened accordingly.

[0121] FIG. 29 is a flowchart showing a method for mounting the component 2 according to the embodiment.

[0122] The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SC1).

[0123] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 sequentially become horizontal according to the mounting order stored in the mounting order storage unit 40. The head control unit 33 controls the mounting head 24 so that the components 2 are sequentially mounted on the horizontal mounting areas 50 according to the mounting order stored in the mounting order storage unit 40 (step SC2).

[0124] The head control unit 33 determines whether there is a non-permissible component (step SC3).

[0125] In step SC3, if it is determined that there is a non-permissible component (step SC3: Yes), the fixing control unit 38 applies the adhesive 70 to the mounting area 50 where the non-permissible component is to be mounted (step SC4).

[0126] The head control unit 33 mounts the non-permissible component in the mounting area 50 (step SC5).

[0127] As described with reference to FIGS. 27 and 28, after the non-permissible component is mounted in the mounting area 50, the fixing control unit 38 controls the ultraviolet light head 14 so that the ultraviolet light is irradiated onto the adhesive 70 of the non-permissible component within a range where the inclination angle of the mounting area 50 does not exceed the allowable angle θ.

[0128] The head control unit 33 determines whether the mounting of all non-permissible components has been completed (step SC6).

[0129] In step SC6, if it is determined that the mounting of the non-permissible component has not been completed (step SC6: No), the process returns to step SC4.

[0130] In step SC6, if it is determined that the mounting of the non-permissible component has been completed (step SC6: Yes), the laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 of all components 2 including the permissible components and the non-permissible components (step SC7). Similarly, in step SC3, if it is determined that there is no non-permissible component (step SC3: No), the laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 of all permissible components (step SC7).

[0131] By setting the irradiation order of the laser light to be the reverse of the mounting order, it is possible to prevent the permissible components before soldering from being tilted by more than the reference angle.

[0132] Note that in step SC7, the substrate 1 on which a plurality of components 2 are mounted may be carried into the reflow furnace without tilting it, without using the laser head 12. In that case, soldering by laser light becomes unnecessary, and productivity is greatly improved by batch soldering.

[0133] As described above, also in the embodiment, the displacement of the component 2 is suppressed while minimizing the decrease in productivity due to three-dimensional mounting. In the embodiment, even if there are non-conforming components, the displacement of the non-conforming components is suppressed by the adhesive 70.

[0134] [Other Embodiments] FIG. 30 is a diagram schematically showing the allowable angle storage unit 30 according to the embodiment. In the above-described embodiment, the allowable angle θ is calculated based on the image data of the component 2 captured by the camera 25. The allowable angle θ of the component 2 may be measured by a measuring device different from the three-dimensional mounting device 10. In that case, correlation data (allowable angle table) between the component 2 and the allowable angle θ as shown in FIG. 30 may be directly stored in the allowable angle storage unit 30 from external measurement data without passing through the allowable angle acquisition unit 36.

[0135] FIG. 31 is a diagram schematically showing the controller 16 according to the embodiment. As shown in FIG. 31, the controller 16 may have an allowable angle calculation unit 39 that calculates the allowable angle θ of the component 2 based on the weight of the component 2. The allowable angle acquisition unit 36 may acquire the allowable angle θ from the allowable angle calculation unit 39. The weight of the component 2 and the allowable angle θ are correlated. The larger the weight of the component 2, the smaller the allowable angle θ. Note that the allowable angle calculation unit 39 may calculate the allowable angle θ in consideration of not only the weight of the component 2 but also the volume of the component 2 and the physical properties of the cream solder 60. By considering not only the weight of the component 2 but also the volume of the component 2 and the physical properties of the cream solder 60, the calculation accuracy of the allowable angle θ is improved.

Explanation of Reference Numerals

[0136] 1... Substrate, 1A... Base material, 1B... Film, 2... Component, 2A... Component, 2B... Component, 2C... Component, 2D... Component, 2E... Component, 2F... Component, 3... Pallet, 4... Support member, 4A... Base part, 4B... Guard part, 4C... Pin part, 4D... Hole, 5... Clamping mechanism, 5A... Support part, 5B... Movable part, 10... 3D mounting device, 11... Dispenser, 12... Laser head, 13... Coating head, 14... Ultraviolet light head, 16... Controller, 16A... Processor, 16B... Main memory, 16C... Storage, 16D... Interface, 18... Base member, 19... Conveyor, 19A... Conveyor belt, 19B... Guide member, 20... Stage, 20A... Positioning member, 21... Stage moving device, 22... Component supply device, 23... Nozzle, 23A... Shaft, 24... Mounting head, 25... Camera, 27... Head moving device, 27X... X-axis moving device, 27Y... Y-axis moving device, 28... Nozzle moving device, 29... Chamber, 30... Allowable angle memory unit, 31... Dispenser control unit, 32... Stage control unit, 33... Head control unit, 34... Laser control unit, 35... Position deviation amount calculation unit, 36... Allowable angle acquisition unit, 37... Mounting order determination unit, 38... Fixing control unit, 39... Allowable angle calculation unit, 40... Mounting order memory unit, 50... Mounting area, 50A... Mounting area, 50B... Mounting area, 50C... Mounting area, 50D... Mounting area, 50E... Mounting area, 50F... Mounting area, 60... Solder paste, 70... Adhesive, 110... 3D mounting device.

Claims

1. A stage for supporting a three-dimensional substrate, a mounting head for mounting components on the surface of the three-dimensional substrate, and a controller, comprising: The controller includes a tolerance angle acquisition unit that acquires a tolerance angle indicating the maximum value of the inclination angle of a component whose displacement amount after mounting is suppressed to be equal to or less than a specified amount; an installation order determination unit that determines the installation order of components for a plurality of installation areas set on the surface of the three-dimensional substrate so that the components after installation are equal to or less than the tolerance angle; a stage control unit that controls the stage so that a plurality of the installation areas are sequentially in a horizontal state according to the installation order; a head control unit that controls the mounting head so that components are sequentially mounted on the horizontal installation area according to the installation order, A three-dimensional mounting device.

2. The controller includes a displacement amount calculation unit that calculates the displacement amount of the component after mounting based on the image data of the component after mounting. The tolerance angle acquisition unit acquires the maximum value of the inclination angle of the component whose displacement amount calculated by the displacement amount calculation unit is equal to or less than the specified amount as the tolerance angle. The three-dimensional mounting device according to claim 1.

3. The controller includes a tolerance angle storage unit that stores correlation data between the component and the tolerance angle. The tolerance angle storage unit acquires and stores the tolerance angle from the tolerance angle acquisition unit. The three-dimensional mounting device according to claim 1.

4. The controller includes a tolerance angle calculation unit that calculates the tolerance angle based on the weight of the component. The tolerance angle acquisition unit acquires the tolerance angle from the tolerance angle calculation unit. The three-dimensional mounting device according to claim 1.

5. The installation order determination unit determines the installation order so that the component after installation does not exceed the tolerance angle during the installation of subsequent components. The three-dimensional mounting device according to claim 1.

6. Solder paste is applied to the installation area, A laser head is provided that irradiates laser light onto the solder paste after the component is mounted on the installation area. The controller has a laser control unit that controls the laser head so that when it is impossible to have an installation order in which the first component is equal to or less than the tolerance angle during the installation of the second component after the installation of the first component on the first installation area, laser light is irradiated onto the solder paste of the first installation area after the installation of the first component and before the three-dimensional substrate is tilted, and soldering of the first component is performed. The three-dimensional mounting device according to claim 5.

7. Obtaining an allowable angle indicating the maximum value of the inclination angle of a component that suppresses the amount of displacement of the component after mounting on the surface of the three-dimensional substrate to be equal to or less than a specified amount; Determining the mounting order of components with respect to a plurality of mounting areas set on the surface of the three-dimensional substrate so that the component after mounting is equal to or less than the allowable angle; Rotating the three-dimensional substrate so that the plurality of mounting areas are sequentially in a horizontal state according to the mounting order; Sequentially mounting components on the mounting areas in the horizontal state according to the mounting order. A three-dimensional mounting method.

Images