Stage device, substrate processing device, information processing device, information processing method, program, and article manufacturing method

Abstract

To provide a stage device capable of shortening a driving time.SOLUTION: A stage device has: a movable stage that holds a substrate; and a control unit that controls the movement of the stage on the basis of a drive profile. The drive profile is determined on the basis of a first parameter which is a parameter related to the movement of the stage in a first direction and a second parameter which is a parameter related to the movement of the stage in a second direction determined on the basis of the first parameter. A distance of the movement of the stage in the first direction is longer than a distance of the movement thereof in the second direction.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a stage device, a substrate processing device, an information processing device, an information processing method, a program, and a method for manufacturing an article.

Background Art

[0002] In a manufacturing process of a semiconductor device, a liquid crystal display device, etc., a stage device is used to move a substrate to a desired position. Patent Document 1 describes calculating three target trajectories of a stage for moving from the end of exposure to the start of the next exposure, and adopting a target trajectory that is achievable among the calculated target trajectories and has the minimum driving time of the stage.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, the stage drives in two directions (X-axis direction, Y-axis direction) orthogonal to each other on the surface holding the substrate to move the substrate to a desired position. However, when driving simultaneously in these two directions, the stage speed is the combined speed of the speeds in the two directions respectively. Since the maximum value (limit speed) of this combined speed is determined by the hardware configuration, it may not be possible to drive at the maximum speed in each of the two directions due to this limitation.

[0005] Therefore, an object of the present invention is to provide a stage device capable of shortening the driving time.

Means for Solving the Problems

[0006] To achieve the above object, a stage device according to one aspect of the present invention includes a stage capable of holding and moving a substrate, and a control unit that controls the movement of the stage based on a drive profile. The drive profile is determined based on a first parameter that is a parameter related to the movement of the stage in a first direction and a second parameter that is a parameter related to the movement of the stage in a second direction determined based on the first parameter. The movement distance of the stage in the first direction is longer than the movement distance in the second direction.

[0007] A further object or another aspect of the present invention will be clarified by the embodiments described below with reference to the drawings.

Advantages of the Invention

[0008] According to the present invention, it is possible to provide a stage device capable of shortening the drive time.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0011] Also, in this specification and the drawings, basically, the vertical direction is the Z-axis, and the horizontal plane perpendicular to the vertical direction is the XY plane, and the directions are indicated by the XYZ coordinate system in which each axis is orthogonal to each other. However, when the XYZ coordinate system is described in each drawing, that coordinate system is given priority.

[0012] Hereinafter, specific configurations will be described in each embodiment.

[0013] <First Embodiment> FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 according to the present embodiment. In the present embodiment, the substrate processing apparatus 1 is a projection exposure apparatus that exposes a pattern of a master (mask, reticle) onto a substrate through a projection optical system by a step-and-scan method. However, the substrate processing apparatus 1 is not limited to a projection exposure apparatus. For example, the substrate processing apparatus 1 may be a projection exposure apparatus using a step-and-repeat method. Alternatively, the substrate processing apparatus 1 may be a drawing apparatus that draws on a substrate with an electron beam, an ion beam, or the like to form a pattern on the substrate. Further, the substrate processing apparatus 1 may be another lithography apparatus (substrate exposure apparatus), for example, an imprint apparatus that forms a pattern on a substrate by molding an imprint material on the substrate with a mold. Or the substrate processing apparatus 1 may be another apparatus that processes a substrate such as a semiconductor wafer or a glass plate, such as an ion implantation apparatus, a developing apparatus, an etching apparatus, a film forming apparatus, an annealing apparatus, a sputtering apparatus, or a vapor deposition apparatus. Also, the substrate processing apparatus 1 may be a planarization apparatus that planarizes a composition on a substrate using a flat plate.

[0014] The substrate processing apparatus 1 includes an illumination optical system 2 that irradiates light, a projection optical system 3, a reticle stage 6 that holds a reticle 4, a substrate stage 7 that can be driven (moved) in the XY direction while holding a substrate 5, and a main control unit (information processing unit) 8. Note that the substrate stage 7 is not limited to the XY direction and may be driven (moved) in the Z direction. Further, the substrate stage 7 may include a six-axis drive system that can be driven in the X-axis direction, Y-axis direction, Z-axis direction, around the X-axis, around the Y-axis, and around the Z-axis. Also, the substrate stage 7 includes a stage control unit 9.

[0015] The position of the substrate stage 7 in the Y-axis direction is measured by a bar mirror 10 extending along the X-axis direction on the substrate stage 7 and a laser interferometer 11. Also, the position of the substrate stage 7 in the X-axis direction is measured by a bar mirror (not shown) extending along the Y-axis direction on the substrate stage 7 and a laser interferometer (not shown). Note that a plurality of laser interferometers 11 for measuring the position of the substrate stage 7 in the Y-axis direction and laser interferometers for measuring the position of the substrate stage 7 in the X-axis direction may be provided respectively. With such a configuration, not only the position of the substrate stage 7 in the X-axis direction and the Y-axis direction, but also the amount of deviation in the rotational direction around the X-axis, the amount of deviation in the rotational direction around the Y-axis, and the amount of deviation in the rotational direction around the Z-axis can be measured. In this embodiment, an example of measuring the position of the substrate stage 7 by an interferometer system is shown, but the position of the substrate stage 7 may be measured by another means such as an encoder.

[0016] The position of the reticle stage 6 in the Y-axis direction is measured by a bar mirror 12 extending along the X-axis direction on the reticle stage 6 and a laser interferometer 13. Also, the position of the reticle stage 6 in the X-axis direction is measured by a bar mirror (not shown) extending along the Y-axis direction on the reticle stage 6 and a laser interferometer (not shown).

[0017] The reticle 4 is, for example, a master plate on which a pattern to be transferred (e.g., a circuit pattern) is formed of chromium on the surface of quartz glass. The substrate 5 is, for example, single crystal silicon, and when the substrate processing apparatus 1 is an exposure apparatus, the substrate 5 transported to the substrate processing apparatus 1 has a photosensitive material (resist) applied on its surface. Here, the illumination optical system 2 is a pattern forming unit that forms a pattern on the substrate 5. In this embodiment, an example of a lithography apparatus that forms a pattern using light is shown, and the pattern forming unit is the illumination optical system 2, but it may also be a lithography apparatus that cures a heat-curable material on which a pattern has been transferred by heat. In that case, the pattern forming unit is, for example, a heating unit that heats the heat-curable material. Further, the portion of the substrate processing apparatus 1 that processes the substrate is the substrate processing unit. For example, if the substrate processing apparatus 1 is a projection exposure apparatus, the illumination optical system and the projection optical system are included in the substrate processing unit. When the substrate processing apparatus 1 is an imprint apparatus or a planarization apparatus, the illumination optical system and the heating unit for curing the imprint material or the composition are included in the substrate processing unit.

[0018] The main control unit 8 controls each part within the substrate processing apparatus 1, and the stage control unit 9 controls the driving (movement) of the substrate stage 7. The main control unit 8 is an information processing apparatus that adjusts (determines) the driving profile of the substrate stage 7 by the method described later. The main control unit 8 transmits the adjusted (determined) driving profile to the stage control unit 9. The stage control unit 9 controls the driving (movement) of the substrate stage 7 based on the driving profile transmitted from the main control unit 8 and the position of the substrate stage 7 obtained by the above-described beam splitter and laser interferometer, and moves the substrate 5 to a desired position.

[0019] The main control unit 8 and the stage control unit 9 include a processing unit, a bus, a ROM, a RAM, and a storage device, and each component functions according to a program. The processing unit is a processing device that performs operations for control according to a program and controls each component connected to the bus. The processing unit can be constituted by a CPU, a PLD such as an FPGA, an ASIC, a computer in which a program is incorporated, or a combination of all or part of these. The ROM is a memory dedicated to data reading, and stores programs and data. The RAM is a memory for data reading and writing, and is used for storing programs and data. The RAM is used for temporarily storing data such as the results of CPU operations. The storage device is also used for storing programs and data. The storage device is also used as a temporary storage area for the operating system (OS) programs and data of the main control unit 8 and the stage control unit 9. The storage device has slower data input / output than the RAM, but can store a large amount of data. It is desirable that the storage device be a non-volatile storage device that can store the data to be stored as permanent data so that the stored data can be referenced over a long period of time. The storage device is mainly constituted by a magnetic storage device (HDD), but may be a device that loads an external medium such as a CD, a DVD, or a memory card to read and write data.

[0020] In the substrate processing apparatus 1, exposure light from a light source (not shown) illuminates a reticle 4 held on a reticle stage 6 via an illumination optical system 2. The light transmitted through the reticle 4 is irradiated onto a substrate 5 via a projection optical system 3. At this time, light from the pattern formed on the reticle 4 forms an image on the surface of the substrate 5, and the substrate 5 (photosensitive material) is exposed by the pattern image. The substrate processing apparatus 1 thus exposes the shot areas on the substrate 5 and performs exposure in the same manner for each of the plurality of shot areas.

[0021] FIG. 2 is a schematic diagram when the substrate 5 is scanned and exposed. FIG. 2(a) shows the shot layout of a plurality of shot regions on the substrate 5. In this embodiment, 98 shot regions are provided on the substrate 5. The numbers in each shot region indicate the order in which each shot region is scanned and exposed, and the plurality of shot regions on the substrate 5 are sequentially scanned and exposed in the order indicated by the dotted line. The arrows described in each shot region indicate the direction in which each shot region is scanned and exposed.

[0022] FIG. 2(b) is an example of the locus of the position of the projection optical system 3 with respect to the substrate stage 7 when exposing the shot region. In this embodiment, the Y-axis direction is the scanning direction. Actually, the relative position between the projection optical system 3 and the substrate stage 7 changes by moving the substrate stage 7 with respect to the fixed projection optical system 3, and scanning exposure is performed. For the sake of explanation, the locus of the position of the projection optical system 3 with respect to the substrate stage 7 will be described for convenience. FIG. 2(b) shows the 84th and 85th shot regions to be exposed among the shot regions shown in FIG. 2(a). First, the exposure of the 84th shot region is started from position A, and the exposure of the 84th shot region is ended when the projection optical system 3 reaches position B. Then, in order to expose the 85th shot region, the substrate stage 7 moves in the -Y direction while moving in the +X direction, and the projection optical system 3 reaches position C. After that, the projection optical system 3 reaches position D by the substrate stage 7 moving in the -Y direction, and the speed of the substrate stage 7 at position D is 0. Next, the projection optical system 3 reaches position E, which is the exposure start position of the 85th shot region, by the substrate stage 7 moving in the +Y direction, and the exposure of the 85th shot region is started from position E. The projection optical system 3 reaches position F, which is the exposure end position of the 85th shot region, by the substrate stage 7 moving in the +Y direction.

[0023] For the 85th shot area with respect to the 84th shot area, the positions of the shot areas in the Y-axis direction (scanning direction) on the substrate are different, and the substrate stage 7 is sometimes called moving between shot areas with such a positional relationship. When moving, in particular, as shown in Fig. 2(b), the moving distance of the substrate stage 7 in the Y-axis direction is longer than the moving distance of the substrate stage 7 in the X-axis direction.

[0024] Fig. 3 is a diagram showing the driving profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area in the prior art. The upper graph in Fig. 3 shows the driving speed of the substrate stage 7 in the X-axis direction (hereinafter sometimes referred to as the X speed), and the middle graph shows the driving speed of the substrate stage 7 in the Y-axis direction (hereinafter sometimes referred to as the Y speed). The lower graph shows the driving speed of the substrate stage 7 obtained by synthesizing the driving speed of the substrate stage 7 in the X-axis direction and the driving speed of the substrate stage 7 in the Y-axis direction (hereinafter sometimes referred to as the synthesized speed). In this embodiment, the driving speed of the substrate stage 7 is sometimes referred to as the moving speed of the substrate stage 7.

[0025] Explaining with the example of Fig. 3, between position A and position B, it is during scanning exposure, and since there is no movement in the X-axis direction, the X speed is 0, and the Y speed is a constant speed of -Vy. When the projection optical system 3 reaches position B, the X speed starts to increase and increases until the X speed becomes Vx. On the other hand, the Y speed remains at -Vy. Then, by the time it reaches position C, the X speed decreases from Vx to 0, completing the movement in the X-axis direction. Also, between position C and position D, the Y speed approaches 0, and at position D, the Y speed becomes 0. Next, between position D and position E, since the movement in the X-axis direction is completed, the X speed is 0, and the Y speed increases to Vy. Then, between position E and position F, it is during scanning exposure, and since there is no movement in the X-axis direction, the X speed is 0, and the Y speed is a constant speed of Vy.

[0026] Here, the maximum value of the synthesis speed of the substrate stage 7 (hereinafter sometimes referred to as the limit speed) is determined by the hardware configuration, and this limit speed is the maximum speed within an acceptable speed range such that the substrate stage 7 can perform normal operations multiple times without problems. In other words, this limit speed of the synthesis speed is the limit value of the synthesis speed. For example, the substrate stage 7 may include a coarse movement stage and a fine movement stage that moves together with the coarse movement stage in a non-contact state with the coarse movement stage by an electromagnetic actuator or the like. In this case, for example, the limit speed of the synthesis speed is defined as the limit speed at which the fine movement stage without a braking mechanism does not collide with the coarse movement stage even when the coarse movement stage stops from the limit speed. In other words, the limit speed of the synthesis speed is defined as the limit speed at which the collision between the coarse movement stage and the fine movement stage can be suppressed by the electromagnetic actuator. Alternatively, the limit speed of the synthesis speed is defined as the limit speed at which components (e.g., the fine movement top plate) included in the substrate stage 7 do not break even if they collide with a shock absorber (shock absorption device) or the like as long as the synthesis speed is below the limit speed. In addition, the limit speed of the synthesis speed may be defined based on the specifications of the drive mechanism (e.g., linear motor) included in the substrate stage 7. Also, the limit speed of the synthesis speed may be a variable. For example, the limit speed of the synthesis speed may be determined according to the drive direction, drive start position, etc. of the substrate stage 7.

[0027] The main control unit 8 determines the X speed and the Y speed so that the synthesis speed becomes equal to or lower than the limit speed Vmax, and determines the drive profile of the substrate stage 7. That is, the X speed (Vx) and the Y speed (Vy) are determined so as to satisfy formula (1), and the drive profile of the substrate stage 7 is determined.

Equation

[0028] Therefore, the substrate stage 7 of the present embodiment determines (adjusts) the timing of moving in the X-axis direction during the non-exposure period. Thereby, the timing at which the absolute value of the X velocity becomes maximum and the timing at which the absolute value of the Y velocity becomes maximum are made different from each other, and the restriction of the X velocity and the Y velocity on each other is reduced. Thereby, the Y velocity can be improved, and the driving time of the substrate stage 7 can be shortened. In the present embodiment, the parameter in the X-axis direction is determined based on the Y velocity in the Y-axis direction, but the other parameter may be determined based on the velocity in the direction in which the moving distance of the substrate stage 7 is long, in other words, the direction in which the speed is likely to be the rate-determining factor. In the present embodiment, time may be expressed as timing.

[0029] FIG. 4 is a diagram showing the driving profile of the substrate stage 7 when exposing the 84th shot region and the 85th shot region in the present embodiment. The upper graph in FIG. 4 shows the X velocity of the substrate stage 7, and the middle graph shows the Y velocity of the substrate stage 7. The lower graph shows the composite velocity of the substrate stage 7.

[0030] In the present embodiment, the timing at which the substrate stage 7 starts moving in the X-axis direction is shifted by the time t3. Specifically, based on the first parameter (Y velocity), the timing at which the substrate stage 7 starts moving in the X-axis direction is determined (adjusted). Thereby, since the timing at which the absolute value of the X velocity becomes maximum and the timing at which the absolute value of the Y velocity becomes maximum do not overlap, the Y velocity can be improved.

[0031] First, the main control unit 8 determines ±V2y, which is the Y speed (the first parameter) that satisfies the desired throughput and production conditions (e.g., the scanning speed in exposure), as the Y speed. This determination is made, for example, based on the shot layout, the order in which a plurality of shot areas are exposed, the specifications of the article to be manufactured, and the like. Note that the Y speed (the first parameter) may be input and set by the user from an input device (not shown). The absolute value of this ±V2y can be set to a value larger than the absolute value of the conventional ±Vy, and is, for example, a value that satisfies Expression (2). |±V y |<|±V2 y |···Expression (2)

[0032] Next, the main control unit 8 obtains ±V2x, which is the X speed that satisfies Expressions (3) and (4), based on the determined Y speed ±V2y. |±V x |>|±V2 x |···Expression (3)

Equation

[0033] Next, after the substrate stage 7 starts moving in the X-axis direction, the main control unit 8 obtains the time t1 required for the obtained X speed ±V2x to be reached. Then, using Expression (5), the main control unit 8 obtains the time t3 (the second parameter) from the time t2 (the time from the end of the exposure of the previous shot until the Y speed changes from -V2y (the maximum speed), that is, the time during which the absolute value of the Y speed remains the maximum after the end of the exposure of the previous shot)) and the time t1. t3 = t2 - t1 ···Expression (5) The main control unit 8 determines a drive profile in which the start timing of the movement of the substrate stage 7 in the X-axis direction is shifted by the obtained time t3. Thereby, since the timing at which the absolute value of the X speed becomes the maximum (|±V x |) and the timing at which the absolute value of the Y speed becomes the maximum (|±V2 y |) do not overlap, the maximum value (|±V2 y |) of the absolute value of the Y speed in the present embodiment is the maximum value (|±V yIt can be made larger than |), and throughput can be improved.

[0034] FIG. 5 is a diagram showing a flowchart of determining a drive profile in the present embodiment. The main control unit 8 determines a second parameter, which is a parameter related to the movement of the substrate stage 7 in the second direction (X-axis direction), based on a first parameter, which is a parameter related to the movement of the substrate stage 7 in the first direction (Y-axis direction) (S110, first determination step). Here, the movement distance of the substrate stage 7 in the first direction is longer than the movement distance in the second direction. The movement distance in each direction can be obtained based on the shot layout, the order in which a plurality of shot regions are exposed, and the like. The first determination step in the present embodiment is a step of determining the time t3 to start the movement in the X-axis direction, which is the second parameter, based on the Y speed, which is the first parameter. Next, the main control unit 8 determines a drive profile for controlling the movement of the substrate stage 7 based on the first parameter and the second parameter determined in the first determination step (S120, second determination step). In other words, the drive profile is determined based on the first parameter and the second parameter determined in the first determination step. Then, the main control unit 8 transmits the drive profile determined in the second determination step to the stage control unit 9 (S130, transmission step). Note that determining the drive profile includes both generating the drive profile and adjusting the drive profile. Steps S110 to S130 are information processing methods executed by the main control unit (information processing apparatus) 8 according to a program stored therein.

[0035] In the present embodiment, the drive profile of the substrate stage 7 when exposing the 84th shot region and the 85th shot region has been described as an example, but it is also applicable to other shot regions.

[0036] When delaying the timing to start the movement in the X-axis direction, it is preferable to consider the relationship between the time to end the movement in the X-axis direction and the exposure start time of the next shot area. First, the movement in the X-axis direction must be completed by the exposure start time of the next shot area. Also, if the time to end the movement in the X-axis direction and the exposure start time of the next shot area are too close, the exposure accuracy of the next shot area may deteriorate due to the influence of vibrations caused by the movement. After considering these factors, it is advisable to determine the time t3 to shift the timing to start the movement in the X-axis direction.

[0037] In this embodiment, an example where the main control unit 8 determines the drive profile of the substrate stage 7 as an information processing device has been shown. However, the drive profile may be determined by the stage control unit 9, or may be determined by an information processing device outside the substrate processing apparatus 1. When the stage control unit 9 determines the drive profile, the transmission process may not be performed. When an information processing device outside the substrate processing apparatus 1 determines the drive profile, the drive profile determined in the second determination process may be transmitted from the information processing device to the stage control unit 9 in the transmission process, or may be transmitted to the main control unit 8 that controls the substrate processing apparatus 1.

[0038] In this embodiment, an example of determining the second parameter based on the first parameter and determining the drive profile has been shown. This drive profile may include a first drive profile used to control the movement of the substrate stage 7 in the Y-axis direction (first direction) and a second drive profile used to control the movement of the substrate stage 7 in the X-axis direction (second direction). That is, the drive profiles may be managed and determined separately for each direction. In this case, the drive profile (first drive profile) in the Y-axis direction is determined based on the first parameter, and the drive profile (second drive profile) in the X-axis direction is determined based on the second parameter.

[0039] In this embodiment, an example of determining a driving profile has been mainly described, but a form of adjusting the driving profile stored in the storage device may also be used. For example, when the storage device (storage unit) stores a first driving profile and a second driving profile, the second driving profile stored in the storage device may be adjusted based on the second parameter. Further, not only the second driving profile may be adjusted, but also the first driving profile may be adjusted based on the first parameter and the second parameter. This adjustment may be performed multiple times. Also, in this embodiment, the driving of the substrate stage 7 in the X-axis direction is determined based on the driving of the substrate stage 7 in the Y-axis direction. However, when the moving distance of the substrate stage 7 in the X-axis direction is longer than the moving distance of the substrate stage 7 in the Y-axis direction, the driving of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the driving of the substrate stage 7 in the X-axis direction.

[0040] That is, the adjustment in this embodiment is to adjust at least one of the first driving profile and the second driving profile based on the combined speed obtained by combining the moving speed of the substrate stage 7 in the first direction and the moving speed of the substrate stage 7 in the second direction. Specifically, in at least one of the first driving profile and the second driving profile, the timing at which the substrate stage 7 starts to move is adjusted. The moving speed of the substrate stage 7 in the first direction can be obtained from the first driving profile, and the moving speed of the substrate stage 7 in the second direction can be obtained from the second driving profile.

[0041] Also, in this embodiment, an example in which the maximum speed of the Y speed during the exposure period is the same as the maximum speed of the Y speed during the non-exposure period has been shown, but the maximum speed of the Y speed during the exposure period and the maximum speed of the Y speed during the non-exposure period may be different. For example, during the exposure period, the Y speed (scanning speed) based on the specifications of the article (such as a chip) to be manufactured may be used, and during the non-exposure period, a Y speed faster than the scanning speed may be used to improve the throughput.

[0042] This embodiment determines the time (second parameter) at which the substrate stage 7 starts to move in the X-axis direction (second direction), where the moving distance of the substrate stage 7 is shorter than in the Y-axis direction, based on the moving speed (Y speed, first parameter) of the substrate stage 7 in the Y-axis direction (first direction). Thereby, the timing at which the absolute value of the X speed becomes maximum (|±V x |) and the timing at which the absolute value of the Y speed becomes maximum (|±V2 y |) do not overlap, and the X speed and the Y speed are not restricted by each other. Therefore, the driving time of the substrate stage 7 is shorter than before, and the throughput (productivity) can be improved.

[0043] <Second Embodiment> This embodiment is different from the first embodiment in the method of determining (adjusting) a drive profile such that the timing at which the absolute value of the X speed becomes maximum and the timing at which the absolute value of the Y speed becomes maximum do not overlap. In this embodiment, by changing the acceleration of the movement of the substrate stage 7 in the X-axis direction during the non-exposure period, the timing at which the absolute value of the X speed becomes maximum and the timing at which the absolute value of the Y speed becomes maximum are made different from each other.

[0044] FIG. 6 is a diagram showing the drive profile of the substrate stage 7 when exposing the 84th shot area and the 85th shot area in this embodiment.

[0045] The main control unit 8 obtains the X speed ±V2x based on the determined Y speed (first parameter) in the same manner as in the first embodiment. In this embodiment, the time t2 from the end of the exposure of the previous shot until the Y speed changes from -V2y (the time during which the absolute value of the Y speed remains maximum after the end of the exposure of the previous shot) elapses, and the time at which the absolute value of the X speed becomes |±V2 x | are made the same. Specifically, the acceleration (second parameter) when the absolute value of the X speed changes to |±V2 x | is made smaller so that the X speed rises gently. Thereby, the timing at which the absolute value of the X speed becomes maximum |±V x | and the timing at which the absolute value of the Y speed becomes maximum (|±V2 ySince the timing does not overlap with the timing at which it becomes (|), the maximum value of the absolute value of the Y velocity in the present embodiment (|±V2 y |) can be made larger than the maximum value of the absolute value of the conventional Y velocity (|±V y |), and the throughput can be improved.

[0046] Similar to the first embodiment, in the present embodiment, when the moving distance of the substrate stage 7 in the X-axis direction is longer than the moving distance of the substrate stage 7 in the Y-axis direction, the driving of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the driving of the substrate stage 7 in the X-axis direction. That is, similar to the first embodiment, the adjustment in the present embodiment is based on the combined velocity obtained by combining the moving velocity of the substrate stage 7 in the first direction and the moving velocity of the substrate stage 7 in the second direction, and at least one of the first driving profile and the second driving profile is adjusted. Specifically, the acceleration of the substrate stage 7 is adjusted in at least one of the first driving profile and the second driving profile.

[0047] In the present embodiment, the driving profile of the substrate stage 7 when exposing the 84th shot region and the 85th shot region has been described as an example, but it is also applicable to other shot regions. Further, the determination (adjustment) of the acceleration in the X-axis direction in the present embodiment and the determination (adjustment) of the timing to start the movement in the X-axis direction in the first embodiment may be performed together.

[0048] <Third Embodiment> In the present embodiment, the method for determining (adjusting) the driving profile is different from that in the first embodiment and the second embodiment. FIG. 7 is a diagram showing the driving profile of the substrate stage 7 when exposing the 84th shot region and the 85th shot region in the present embodiment.

[0049] The main control unit 8 obtains the X velocity ±V2x (second parameter) based on the determined Y velocity (first parameter) in the same manner as in the first embodiment. In the present embodiment, the absolute value of the maximum velocity of the X velocity during the non-exposure period is |±V2 x|. By doing this, the Y speed can be set to the maximum absolute value of the Y speed greater than the maximum absolute value (|±V y |) of the conventional Y speed, i.e., the maximum absolute value (|±2V y |), and the throughput can be improved.

[0050] When setting the absolute value of the maximum speed of the X speed to |±V2 x | (when reducing the absolute value of the maximum speed of the X speed), it is preferable to consider the relationship between the time to complete the movement in the X-axis direction and the exposure start time of the next shot area. First, the movement in the X-axis direction must be completed by the exposure start time of the next shot area. Also, if the time to complete the movement in the X-axis direction and the exposure start time of the next shot area are too close, the exposure accuracy of the next shot area may deteriorate due to the influence of vibrations caused by the movement. After considering these factors, it is advisable to determine |±V2 x |, which is the absolute value of the maximum speed of the X speed.

[0051] Here, in this embodiment, the maximum speed of the X speed is set to +V2x. However, if it is necessary to move further in the X-axis direction at the timing when the Y speed no longer has the maximum absolute value (|±V2 y |), the X speed may be further increased from +V2x to such an extent that it does not affect the Y speed.

[0052] Similar to the first embodiment, in this embodiment, when the moving distance of the substrate stage 7 in the X-axis direction is longer than the moving distance of the substrate stage 7 in the Y-axis direction, the driving of the substrate stage 7 in the Y-axis direction may be determined (adjusted) based on the driving of the substrate stage 7 in the X-axis direction. That is, similar to the first embodiment, the adjustment in this embodiment is based on the combined speed obtained by synthesizing the moving speed of the substrate stage 7 in the first direction and the moving speed of the substrate stage 7 in the second direction, and at least one of the first driving profile and the second driving profile is adjusted. Specifically, in at least one of the first driving profile and the second driving profile, the maximum speed of the substrate stage 7 (in a predetermined direction) is adjusted.

[0053] This embodiment may be implemented in combination with one or both of the first embodiment and the second embodiment. That is, in at least one of the first drive profile and the second drive profile, at least one of the timing at which the substrate stage 7 moves, the acceleration of the substrate stage 7, and the maximum speed of the substrate stage is adjusted.

[0054] In this embodiment, the drive profile of the substrate stage 7 when exposing the 84th shot region and the 85th shot region has been described as an example, but it is also applicable to other shot regions.

[0055] <Fourth Embodiment> The method for determining (adjusting) the drive profile in this embodiment is different from that in the foregoing embodiments. For example, in order to detect each alignment mark formed in a plurality of sample shot regions, the substrate stage 7 may move each of two shot regions at discrete positions to a target position (for example, an alignment mark detection position) continuously. As a specific example, for example, among the plurality of shot regions on the substrate 5 shown in Fig. 2(a), it is assumed that the 87th shot region and the 8th shot region are sample shot regions. In this case, first, the substrate stage 7 moves so that the 87th shot region moves to the target position, and the alignment mark of the 87th shot region is detected. Next, the substrate stage 7 moves so that the 8th shot region moves to the target position, and the alignment mark of the 8th shot region is detected.

[0056] Fig. 8 is a diagram showing the drive profile of the substrate stage 7 when moving the 87th shot region to the target position and then moving the 8th shot region in the prior art. The upper graph in Fig. 8 shows the X speed of the substrate stage 7, and the middle graph shows the Y speed of the substrate stage 7. The lower graph shows the composite speed of the substrate stage 7.

[0057] As shown in FIG. 8, conventionally, since the movement in the X-axis direction and the movement in the Y-axis direction were started simultaneously, the X speed and the Y speed restricted each other. The main control unit 8 calculates an X speed Vx and a Y speed Vy that satisfy Equation (1), and the stage control unit 9 controls the movement of the substrate stage 7 at a constant speed of Vx in the X-axis direction and at a constant speed of Vy in the Y-axis direction. As a result, since the substrate stage 7 is moved at the mutually restricted X speed and Y speed, the driving time of the substrate stage 7 becomes long.

[0058] FIG. 9 is a diagram showing a drive profile of the substrate stage 7 when moving the 87th shot area to the target position and then moving the 8th shot area in the present embodiment. The upper graph in FIG. 9 shows the X speed of the substrate stage 7, the middle graph shows the Y speed of the substrate stage 7, and the lower graph shows the composite speed of the substrate stage 7.

[0059] When the main control unit 8 moves the substrate stage 7 so that the 8th shot area becomes the target position from the state where the 87th shot area is at the target position, the main control unit 8 first determines a drive profile so as to move only in the Y-axis direction with the Y speed as the limit speed Vmax. Then, the main control unit 8 increases the X speed from the timing (first parameter) at which the Y speed changes from the limit speed Vmax (maximum speed), and determines a drive profile so that the X speed becomes the limit speed Vmax at the timing when the Y speed becomes 0. In other words, the main control unit 8 determines a drive profile so as to shift the timing (second parameter) at which the substrate stage 7 starts moving in the X-axis direction until the time t4 which is the timing at which the Y speed changes from the limit speed Vmax. That is, based on the first parameter, the timing (second parameter) at which the substrate stage 7 starts moving in the X-axis direction is determined (adjusted).

[0060] By determining the drive profile in this way, the X speed and the Y speed are not restricted by each other and can be set to the limit speed Vmax respectively. As a result, the driving time of the substrate stage 7 can be shortened.

[0061] In this embodiment, the drive profile of the substrate stage 7 when moving the 87th shot area to the target position and then moving the 8th shot area is described as an example, but it is also applicable to other shot areas. Further, in this embodiment, an example is shown in which the substrate stage 7 is first driven in the Y-axis direction and then in the X-axis direction, and an example is shown in which the parameters in the X-axis direction are determined based on the parameters in the Y-axis direction. However, the other parameters may be determined based on the speed in the direction in which the moving distance of the substrate stage 7 is long, in other words, the direction in which the speed is likely to be the bottleneck, and is not particularly limited to the example of this embodiment.

[0062] Similar to the first embodiment, this embodiment may also be realized by adjusting the drive profile stored in the storage unit. This adjustment, in other words, is to adjust at least one of the first drive profile and the second drive profile based on the combined speed obtained by combining the moving speed of the substrate stage 7 in the first direction and the moving speed of the substrate stage 7 in the second direction.

[0063] <Fifth Embodiment> This embodiment is characterized by moving the substrate stage 7 according to the drive profile described above to manufacture an article.

[0064] FIG. 10 is a diagram showing a flowchart of a method for manufacturing an article according to the present embodiment. The main control unit (information processing device) 8 determines a second parameter, which is a parameter related to the movement of the substrate stage 7 in the second direction, based on a first parameter, which is a parameter related to the movement of the substrate stage 7 in the first direction (S210, first determination step). Here, the movement distance of the substrate stage 7 in the first direction is longer than the movement distance in the second direction. Next, the main control unit 8 determines a drive profile for controlling the movement of the substrate stage 7 based on the first parameter and the second parameter determined in the first determination step (S220, second determination step). Then, a forming step (S230) of forming a pattern on the substrate is performed while controlling the movement of the substrate stage 7 that holds the substrate based on the drive profile determined in the second determination step. Next, a manufacturing step (S240) of manufacturing an article from the substrate on which the pattern has been formed in the forming step is performed.

[0065] Articles manufactured by this manufacturing method are, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, etc.

[0066] The forming step forms a pattern on the substrate, for example, by exposing a substrate (such as a silicon wafer or a glass plate) coated with a photosensitive material using an exposure apparatus (lithography apparatus).

[0067] The manufacturing step includes, for example, developing the substrate (photosensitive material) on which the pattern has been formed, etching and resist stripping on the developed substrate, dicing, bonding, and packaging. According to this manufacturing method, an article can be manufactured with higher throughput than in the past.

[0068] The disclosure of this specification includes the following stage apparatus, substrate processing apparatus, information processing apparatus, information processing method, program, and article manufacturing method.

[0069] [Item 1] A stage capable of holding and moving a substrate, A control unit that controls the movement of the stage based on a drive profile, The driving profile is determined based on a first parameter which is a parameter related to the movement of the stage in a first direction, and a second parameter which is a parameter related to the movement of the stage in a second direction determined based on the first parameter. The moving distance of the stage in the first direction is longer than the moving distance in the second direction. A stage device characterized by the above.

[0070] 〔Item 2〕 The stage device according to Item 1, wherein the second parameter is determined based on the first parameter and the limit speed of the combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction.

[0071] 〔Item 3〕 In the stage device according to Item 1 or 2, the first parameter is the speed at which the stage moves in the first direction, and the second parameter is the time when the stage starts to move in the second direction, or the acceleration when the stage moves in the second direction, or the maximum speed when the stage moves in the second direction.

[0072] 〔Item 4〕 In the stage device according to Item 1 or 2, the first parameter is the time when the speed of the movement of the stage in the first direction changes from the maximum speed, and the second parameter is the time when the stage starts to move in the second direction.

[0073] 〔Item 5〕 In the stage device according to any one of Items 1 to 4, the speed at which the stage moves in the first direction and the speed at which the stage moves in the second direction each reach the maximum speed at different times.

[0074] 〔Item 6〕 The first direction is the scanning direction when performing scanning exposure on the substrate, and the second direction is a direction orthogonal to the first direction. The stage device according to any one of Items 1 to 5, characterized in that.

[0075] 〔Item 7〕 The drive profile includes a first drive profile used for controlling the movement of the stage in the first direction and a second drive profile used for controlling the movement of the stage in the second direction. The first drive profile is determined based on the first parameter, and the second drive profile is determined based on the second parameter. The stage device according to any one of Items 1 to 6, characterized in that.

[0076] 〔Item 8〕 It has a storage unit that stores a second drive profile used for controlling the movement of the stage in the second direction. Based on the second parameter, the second drive profile stored in the storage unit is adjusted. The stage device according to any one of Items 1 to 7, characterized in that.

[0077] 〔Item 9〕 The storage unit stores a first drive profile used for controlling the movement of the stage in the first direction. The first drive profile is adjusted based on the first parameter and the second parameter. The stage device according to Item 8, characterized in that.

[0078] 〔Item 10〕 The drive profile is used for controlling the movement of the stage during a non-exposure period. The stage device according to any one of Items 1 to 9, characterized in that.

[0079] 〔Item 11〕 The stage device according to any one of items 1 to 10, characterized in that the drive profile is used when the stage moves between shot regions having different positions in the scanning direction of the stage.

[0080] 〔Item 12〕 A stage capable of holding and driving a substrate, and a control unit that controls the driving of the stage based on a drive profile. The drive profile includes a first drive profile used for driving the stage in a first direction and a second drive profile used for driving the stage in a second direction. The control unit controls the driving of the stage with a drive profile in which at least one of the first drive profile and the second drive profile is adjusted based on a combined speed of a moving speed of the stage in the first direction and a moving speed of the stage in the second direction. A stage device characterized by this.

[0081] 〔Item 13〕 The stage device according to item 12, characterized in that in at least one of the first drive profile and the second drive profile, at least one of a time when the stage starts moving, an acceleration of the stage, and a maximum speed of the stage is adjusted.

[0082] 〔Item 14〕 A stage capable of holding and moving a substrate, a control unit that controls the movement of the stage based on a drive profile, and a substrate processing unit that performs processing on the substrate held by the stage. It has The drive profile is determined based on a first parameter that is a parameter related to the movement of the stage in a first direction and a second parameter that is a parameter related to the movement of the stage in a second direction determined based on the first parameter. The moving distance of the stage in the first direction is longer than the moving distance in the second direction. A substrate processing apparatus characterized by this.

[0083] 〔Item 15〕 An information processing unit that determines a drive profile used for controlling the movement of a stage capable of holding and moving a substrate, The information processing unit, Based on a first parameter that is a parameter related to the movement of the stage in the first direction, a second parameter that is a parameter related to the movement of the stage in a second direction with a shorter movement distance than the movement distance in the first direction is determined, The drive profile is determined based on the first parameter and the second parameter. An information processing apparatus characterized by this.

[0084] 〔Item 16〕 An information processing method for determining a drive profile used for controlling the movement of a stage capable of holding and moving a substrate, A first determination step of determining a second parameter that is a parameter related to the movement of the stage in a second direction with a shorter movement distance than the movement distance in the first direction based on a first parameter that is a parameter related to the movement of the stage in the first direction, A second determination step of determining the drive profile based on the first parameter and the second parameter, A transmission step of transmitting the drive profile determined in the second determination step, including. An information processing method characterized by this.

[0085] 〔Item 17〕 A program for causing a computer to execute the information processing method according to Item 16.

[0086] 〔Item 18〕 Based on a first parameter, which is a parameter related to the movement of the stage in a first direction that can hold and move the substrate, a first determination step of determining a second parameter, which is a parameter related to the movement of the stage in a second direction with a shorter movement distance than the movement distance in the first direction; A second determination step of determining a drive profile used for controlling the movement of the stage based on the first parameter and the second parameter; A forming step of forming a pattern on the substrate held by the stage while controlling the movement of the stage based on the drive profile determined in the second determination step; A manufacturing step of manufacturing an article from the substrate on which the pattern is formed in the forming step, including: A method for manufacturing an article, characterized in that.

[0087] The invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are appended to disclose the scope of the invention.

Claims

1. A stage that can hold and move a substrate, and a control unit that controls the movement of the stage based on a drive profile, wherein the drive profile is determined based on a first parameter that is a parameter related to the movement of the stage in a first direction and a second parameter that is a parameter related to the movement of the stage in a second direction determined based on the first parameter, the movement distance of the stage in the first direction is longer than the movement distance in the second direction, characterized in that it is a stage device.

2. The stage device according to claim 1, wherein the second parameter is determined based on the first parameter and a limit speed of a combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction.

3. The stage device according to claim 1, wherein the first parameter is the speed at which the stage moves in the first direction, and the second parameter is the time when the stage starts to move in the second direction, or the acceleration when the stage moves in the second direction, or the maximum speed when the stage moves in the second direction.

4. The stage device according to claim 1, wherein the first parameter is the time when the speed of the movement of the stage in the first direction changes from the maximum speed, and the second parameter is the time when the stage starts to move in the second direction.

5. The stage device according to claim 1, wherein the speed at which the stage moves in the first direction and the speed at which the stage moves in the second direction each reach the maximum speed at different times.

6. The stage device according to claim 1, wherein the first direction is the scanning direction when performing scanning exposure on the substrate, and the second direction is a direction orthogonal to the first direction.

7. The drive profile includes a first drive profile used for controlling the movement of the stage in the first direction and a second drive profile used for controlling the movement of the stage in the second direction, wherein the first drive profile is determined based on the first parameter and the second drive profile is determined based on the second parameter, characterized in that it is a stage device according to claim 1.

8. It has a storage unit that stores a second drive profile used for controlling the movement of the stage in the second direction. Based on the second parameter, the second drive profile stored in the storage unit is adjusted. The stage device according to claim 1, characterized in that.

9. The storage unit stores a first drive profile used for controlling the movement of the stage in the first direction. Based on the first parameter and the second parameter, the first drive profile is adjusted. The stage device according to claim 8, characterized in that.

10. The drive profile is used for controlling the movement of the stage during a non-exposure period. The stage device according to claim 1, characterized in that.

11. The drive profile is used when the stage moves between shot regions having different positions in the scanning direction of the stage. The stage device according to claim 1, characterized in that.

12. A stage that can hold and drive a substrate. A control unit that controls the driving of the stage based on a drive profile. It has, The drive profile includes a first drive profile used for driving the stage in a first direction and a second drive profile used for driving the stage in a second direction. The control unit controls the driving of the stage with the drive profile in which at least one of the first drive profile and the second drive profile is adjusted based on the combined speed of the moving speed of the stage in the first direction and the moving speed of the stage in the second direction. A stage device characterized by that.

13. In at least one of the first drive profile and the second drive profile, the drive profile is such that at least one of the time when the stage starts to move, the acceleration of the stage, and the maximum speed of the stage is adjusted. The stage device according to claim 12, characterized in that.

14. A stage that can hold and move a substrate. A control unit that controls the movement of the stage based on a drive profile. A substrate processing unit that processes the substrate held on the stage. It has, The drive profile is determined based on a first parameter that is a parameter related to the movement of the stage in a first direction and a second parameter that is a parameter related to the movement of the stage in a second direction determined based on the first parameter. The movement distance of the stage in the first direction is longer than the movement distance in the second direction. A substrate processing apparatus characterized by this.

15. An information processing unit that determines a drive profile used for controlling the movement of a stage capable of holding and moving a substrate, The information processing unit, Based on a first parameter that is a parameter related to the movement of the stage in a first direction, determines a second parameter that is a parameter related to the movement of the stage in a second direction with a movement distance shorter than the movement distance in the first direction, Determines the drive profile based on the first parameter and the second parameter. An information processing apparatus characterized by this.

16. An information processing method for determining a drive profile used for controlling the movement of a stage capable of holding and moving a substrate, A first determination step of determining a second parameter that is a parameter related to the movement of the stage in a second direction with a movement distance shorter than the movement distance in the first direction based on a first parameter that is a parameter related to the movement of the stage in a first direction, A second determination step of determining the drive profile based on the first parameter and the second parameter, A transmission step of transmitting the drive profile determined in the second determination step, and includes. An information processing method characterized by this.

17. A program for causing a computer to execute the information processing method according to claim 16.

18. A first determination step of determining a second parameter that is a parameter related to the movement of the stage in a second direction with a movement distance shorter than the movement distance in the first direction based on a first parameter that is a parameter related to the movement of the stage in a first direction, A second determination step of determining a drive profile used for controlling the movement of the stage based on the first parameter and the second parameter, A forming step of forming a pattern on the substrate held on the stage while controlling the movement of the stage based on the drive profile determined in the second determination step. A manufacturing process of manufacturing an article from the substrate on which the pattern is formed in the forming process, and A method for manufacturing an article, characterized in that.

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