Printing system assembly and method

Abstract

To provide a printing system assembly and method.SOLUTION: The present teachings disclose various embodiments of a printing system for printing a substrate, in which the printing system can be housed in a gas enclosure, where environment within the enclosure can be maintained as controlled printing environment. The controlled environment of the present teachings can include control of a type of gas environment within the gas enclosure, size and level of a particulate matter within the enclosure, control of temperature within the enclosure, and control of lighting. Various embodiments of a printing system of the present teachings can include a Y-axis motion system and a Z-axis moving plate that are configured to substantially decrease excess thermal load within the enclosure by, for example, eliminating or substantially minimizing use of conventional electric motors.SELECTED DRAWING: Figure 5A

Description

Technical Field

[0001] The present teachings relate to various embodiments of a printing system that can be maintained within a gas enclosure system that defines an interior having an inert, substantially low particle environment.

[0002] (Cross - References to Related Applications) This application claims priority to each of the following: (1) U.S. Provisional Application No. 62 / 013,433, filed June 17, 2014; (2) U.S. Provisional Application No. 62 / 021,390, filed July 7, 2014; (3) U.S. Provisional Application No. 62 / 037,494, filed August 14, 2014; (4) U.S. Provisional Application No. 62 / 013,440, filed June 17, 2014; (5) U.S. Provisional Application No. 62 / 021,563, filed July 7, 2014; (6) U.S. Provisional Application No. 62 / 044,165, filed August 29, 2014; (7) U.S. Provisional Application No. 62 / 092,721, filed December 16, 2014. Each of the above applications is hereby incorporated by reference in its entirety.

Background Art

[0003] Interest in the potential of organic light - emitting diode (OLED) display technology has been driven by OLED display technology attributes, including demonstrations of display panels having highly saturated colors, high contrast, extremely thin form, fast response, and energy efficiency. In addition, various substrate materials, including flexible polymer materials, can be used in the processing of OLED display technology. Demonstrations of displays for small - screen applications, mainly for mobile phones, have served to highlight the potential of the technology, but challenges remain in scaling up mass production over a range of substrate formats with high yields.

[0004] Regarding the expansion of the format, the Gen 5.5 substrate has dimensions of approximately 130 cm × 150 cm and can yield approximately 8 pieces of 26-inch flat panel displays. In comparison, larger format substrates can include using Gen 7.5 and Gen 8.5 mother glass substrate sizes. The Gen 7.5 mother glass has dimensions of approximately 195 cm × 225 cm and can be cut into 8 pieces of 42-inch or 6 pieces of 47-inch flat panel displays per substrate. The mother glass used in Gen 8.5 is approximately 220 cm × 250 cm and can be cut into 6 pieces of 55-inch or 8 pieces of 46-inch flat panel displays per substrate. As one indicator of the remaining issues in the expansion of OLED display manufacturing to larger formats, it has been found that mass production of OLED displays with high yields on substrates larger than Gen 5.5 substrates is substantially difficult.

[0005] In principle, OLED devices may be manufactured by printing various organic thin films and other materials on a substrate using an OLED printing system. Such organic materials can be susceptible to damage by oxidation and other chemical processes. Accommodating an OLED printing system in a manner that can be expanded for various substrate sizes and can be carried out in an inert, substantially low-particle printing environment can present various technical challenges. For example, manufacturing tools for high-throughput large-format substrate printing such as printing of Gen 7.5 and Gen 8.5 substrates require substantially large equipment. Therefore, maintaining large equipment under an inert atmosphere, which requires gas purification to remove reactive atmospheric species such as water vapor and oxygen, as well as organic solvent vapors, and maintaining a substantially low-particle printing environment presents significant challenges.

Summary of the Invention

Means for Solving the Problems

[0006] Therefore, there remain challenges in expanding the mass production of OLED display technology across a range of substrate formats with high yields. Accordingly, there is a need for a gas enclosure system of the present teachings that can house an OLED printing system in an inert and substantially low particle environment and that can be readily scaled to provide for the processing of OLED panels on a variety of substrate sizes and substrate materials. Additionally, the various gas enclosure systems of the present teachings can provide for immediate access from the outside to the OLED printing system during processing and immediate access to the inside for maintenance with minimal downtime. The present invention provides, for example, the following. (Item 1) A gas enclosure defining an interior, a printing system housed within the interior of the gas enclosure assembly, and comprising: The printing system includes a print head assembly having at least one print head, a substrate support device for supporting a substrate, and a motion system for positioning the substrate relative to the print head assembly, comprising: The motion system is a Y-axis linear air bearing motion system configured with a substrate gripper assembly for gripping the substrate and a gripper motion control system for maintaining the orientation of the substrate parallel to the Y-axis of travel within + / - 4300 micro radians, an X-axis linear air bearing motion system, and is a printing system. (Item 2) The printing system according to Item 1, wherein the gripper motion system can maintain the orientation of the substrate parallel to the Y-axis of travel within + / - 4300 micro radians. (Item 3) The printing system according to Item 1, wherein the substrate support device is a floating table. (Item 4) The floating table has a printing zone, and the floating table is configured to hold the substrate at a flying height of about 30 micrometers to about 50 micrometers above the floating table within the printing zone, the printing system according to item 3. (Item 5) The floating table includes a porous plate, the printing system according to item 3. (Item 6) The substrate support device is configured to support substrates sized from about 3.5 generations to about 10 generations, the printing system according to item 1. (Item 7) The X-axis linear air bearing motion system is configured with a Z-axis moving plate assembly, the printing system according to item 1. (Item 8) The Z-axis moving plate assembly is configured with a pneumatic balance system to balance the force against the load on the Z-axis moving plate assembly, the printing system according to item 7. (Item 9) The printing system further includes a gas circulation and filtration system, the printing system according to item 1. (Item 10) The filtration system is configured to provide a low particle environment with a substrate deposition rate specification of about 100 particles or less per square meter of substrate per minute for particles sized 2 mm or larger, the printing system according to item 9. (Item 11) The printing system further includes a gas purification system, the printing system according to item 1. (Item 12) The gas purification system maintains the gas at less than 100 ppm of each of the reactive species, the printing system according to item 11. (Item 13) The reactive species are selected from water vapor and oxygen, the printing system according to item 12. (Item 14) The printing system according to item 1, wherein the gas contained inside the gas enclosure is an inert gas. (Item 15) The printing system according to item 14, wherein the inert gas is selected from any of nitrogen, noble gases, and combinations thereof.

Brief Description of the Drawings

[0007] A further understanding of the features and advantages of the present disclosure will be obtained by referring to the accompanying drawings, which are intended to illustrate rather than limit the present teachings. The drawings are not necessarily drawn to scale, and like numerals in different figures may describe similar components. Similar numerals with different suffixes may represent different instances of similar components.

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[0008] The present teachings disclose various embodiments of a printing system for printing a substrate, where the printing system can be housed in a gas enclosure and the environment within the enclosure can be maintained as a controlled printing environment. The controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level of particulate matter within the enclosure, control of the temperature within the enclosure, and control of illumination. Various embodiments of the printing system of the present teachings are configured to substantially reduce excessive heat loads within the enclosure, for example, by eliminating or substantially minimizing the use of conventional electric motors, and can include a Y-axis motion system and a Z-axis moving plate assembly. Additionally, various embodiments of the Y-axis motion system of the present teachings can include a gripper motion control assembly of the Y-axis motion system configured to provide dynamic rotation of the orientation of the substrate about the theta-Z (θ-Z) axis during Y-axis travel and to maintain a high degree of accuracy for substrate orientation parallel to the axis of travel.

[0009] Various embodiments of the gas enclosure assembly can be hermetically constructed and integrated with various components that provide a gas circulation and filtration system, a particle control system, a gas purification system, and a thermal regulation system, and equivalents, so as to form various embodiments of a gas enclosure system that can sustain such an environment for processes that require a substantially low-particle inert gas environment. Various embodiments of the gas enclosure can have a printing system enclosure and an auxiliary enclosure constructed as a compartment of the gas enclosure assembly that can be hermetically isolated from the printing system enclosure of the gas enclosure. Various embodiments of the printing system of the present teachings can have a print head management system enclosed within the auxiliary enclosure. Embodiments of the print head management system of the present teachings can include various devices and apparatuses for the maintenance and calibration of the print head, and the various devices and apparatuses are each mounted on a motion system platform for fine positioning of the various devices and apparatuses with respect to the print head.

[0010] The printing system, such as the printing system 2000 of FIG. 1B, shown in an enlarged view in FIG. 1C, can consist of several devices and apparatuses that enable the reliable placement of ink droplets at specific locations on a substrate. Printing requires relative movement between the print head assembly and the substrate. This can be achieved using a motion system, typically a gantry or a split-axis XYZ system. The print head assembly can move over a stationary substrate (gantry type), or in the case of a split-axis configuration, either the print head and the substrate can both move. In another embodiment, the print head assembly can be substantially stationary, for example, in the X and Y axes, and the substrate can move in the X and Y axes relative to the print head, and the Z-axis movement can be provided either by a substrate support device or by a Z-axis motion system associated with the print head assembly. When the print head moves relative to the substrate, ink droplets are ejected at the correct time so as to be deposited at the desired locations on the substrate. The substrate can be inserted and removed from the printer using a substrate loading and unloading system. Depending on the printer configuration, this can be achieved using a mechanical conveyor, a substrate floating table with a transport assembly, or a substrate transfer robot with an end effector. For various embodiments of the systems and methods of the present teachings, the Y-axis motion system can be based on an air bearing gripper system.

[0011] For a clearer perspective on the substrate sizes that can be used in the production of various OLED devices, the sizes of mother glass substrates over several generations have evolved since the early 1990s for flat panel displays processed by means other than OLED printing. The first-generation mother glass substrate, designated as Gen 1, was approximately 30 cm × 40 cm and could thus produce 15-inch panels. Around the mid-1990s, the existing technology for producing flat panel displays evolved to the Gen 3.5 mother glass substrate size, which has dimensions of approximately 60 cm × 72 cm. In comparison, the Gen 5.5 substrate has dimensions of approximately 130 cm × 150 cm.

[0012] As generations progressed, Gen 7.5 and Gen 8.5 mother glass sizes have been produced for processing processes other than OLED printing. The Gen 7.5 mother glass has dimensions of approximately 195 cm × 225 cm and can be cut into 8 sheets of 42-inch or 6 sheets of 47-inch flat panels per substrate. The mother glass used in Gen 8.5 is approximately 220 cm × 250 cm and can be cut into 6 sheets of 55-inch or 8 sheets of 46-inch flat panels per substrate. The future of OLED flat panels for qualities such as more natural colors, higher contrast, thinness, flexibility, transparency, and energy efficiency has been realized while OLED manufacturing has been practically limited to G3.5 and smaller. Currently, OLED printing is considered the optimal manufacturing technology that enables OLED panel manufacturing not only for G3.5 and smaller mother glass sizes but also at the largest mother glass sizes such as Gen 5.5, Gen 7.5, and Gen 8.5. One of the characteristics of OLED panel display technology is that various substrate materials can be used, including, but not limited to, various glass substrate materials as well as various polymer substrate materials. In that regard, the sizes described in terms arising from the use of glass-based substrates can be applied to substrates of any material suitable for use in OLED printing.

[0013] In principle, manufacturing tools that can enable printing of various substrate sizes, including large-scale substrate sizes, may require substantially large equipment to house such OLED manufacturing tools. Thus, maintaining the entire large equipment under an inert atmosphere presents engineering challenges such as continuous purification of large amounts of inert gas. Various embodiments of a gas enclosure system can provide, together with an external gas purification system of the gas enclosure, a continuous circulation of a substantially low particulate matter inert gas having a substantially low level of reactive species throughout the gas enclosure system, and can have a circulation and filtration system inside the gas enclosure assembly. According to the present teachings, an inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions. Some generally used non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. Additionally, providing large equipment that is substantially sealed to prevent contamination by various reactive atmospheric gases such as water vapor and oxygen, as well as organic solvent vapors generated from various printing processes, presents engineering challenges. According to the present teachings, the OLED printing equipment will maintain various levels of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapors, at 100 ppm or lower, for example, 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower.

[0014] In a facility where the respective levels of reactive species should be maintained at a target low level, the need to print OLED panels can be illustrated when reconsidering the information summarized in Table 1. The data summarized in Table 1 resulted from the respective tests of test coupons equipped with organic thin film compositions for each of red, green, and blue, processed in a spin-coated device format of large pixels. Such test coupons are substantially easier to process and test for the purpose of rapid evaluation of various formulations and processes. The test coupon tests should not be confused with the durability tests of printed panels, but can show the effects of various formulations and processes on durability. The results shown in the following table represent the variation of process steps in the processing of test coupons where only the spin-coating environment varied for test coupons processed in a nitrogen environment where the reactive species were less than 1 ppm compared to test coupons processed in air in the same manner.

[0015] Through inspection of the data in Table 1 of test coupons processed under different processing environments, it is clear that printing in an environment that effectively reduces the exposure of the organic thin film composition to reactive species, especially in the case of red and blue, can have a substantial impact on various EL stabilities and thus durability. Since the durability specification is directly correlated with the display product life, it is particularly important for OLED panel technology and is a product specification for all panel technologies that are difficult for OLED panel technology to meet. To provide panels that meet the required durability specifications, the respective levels of reactive species such as water vapor, oxygen, and organic solvent vapors can be maintained at 100 ppm or lower, for example, 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower using various embodiments of the gas enclosure system of the present teachings.

[0016] [Table 1]

[0017] In addition to providing an inert environment, maintaining a substantially low-particle environment for OLED printing is particularly important because even very small particles can lead to visible defects on the OLED panel. Particle control within a gas enclosure system can present significant challenges that are not presented, for example, for processes that can be performed under ambient conditions under an open-type high-flow laminar flow filtration hood. For example, manufacturing equipment can be operably connected from various systems and assemblies so as to provide, for example, but not limited to, the optical, electrical, mechanical, and fluid connections required to operate a printing system, and may require a substantial length of various service bundles. Such service bundles, which are used in the operation of the printing system and are located proximal to the substrate positioned for printing, can be a source of particulate matter during operation. In addition, components used in a printing system, such as a fan using friction bearings or a linear motion system, can be particle-generating components. Various embodiments of the gas circulation and filtration systems of the present teachings can be used in conjunction with particle control components to contain and remove particulate matter. In addition, by using various pneumatically operated components that are essentially low-particle generating, such as, but not limited to, substrate floating tables, air bearings, pneumatically operated robots, and equivalents, a low-particle environment can be maintained for various embodiments of the gas enclosure system.

[0018] Regarding maintaining a substantially low-particle environment, various embodiments of gas circulation and filtration systems can be designed to provide a low-particle inert gas environment for airborne particulate matter that meets the standards of International Standards Organization Standard (ISO) 14644-1:1999, "Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness," as defined by Classes 1 through 5. However, for example, but not limited to, particles generated proximal to the substrate during a printing process can accumulate on the substrate surface before they can be swept through the gas circulation and filtration system. Therefore, controlling only the airborne particulate matter is not sufficient to provide a low-particle environment proximal to the substrate during such processes.

[0019] Accordingly, in combination with the gas circulation and filtration system, various embodiments of the gas enclosure system of the present teachings can have a particle control system that can include components capable of providing a low-particle zone proximal to the substrate during processing in a printing step. The particle control system for various embodiments of the gas enclosure system of the present teachings can include a gas circulation and filtration system, a low-particle generation X-axis linear bearing system for moving the print head assembly relative to the substrate, a service beam enclosure exhaust system, and a print head assembly exhaust system. For example, the gas enclosure system can have a gas circulation and filtration system inside the gas enclosure assembly.

[0020] Various embodiments of the systems and methods of the present teachings can maintain a substantially low particle environment that provides an average on-substrate distribution of particles within a specific size range of interest that does not exceed the on-substrate deposition rate specification. The on-substrate particle deposition rate specification can be set for each of the particle size ranges of interest from about 0.1 μm and above to about 10 μm and above. In various embodiments of the systems and methods of the present teachings, the on-substrate particle deposition rate specification can be expressed as a limit on the number of particles deposited per square meter of substrate per minute for each of the target particle size ranges.

[0021] Various embodiments of the on-substrate particle deposition rate specification can be easily converted from a limit on the number of particles deposited per square meter of substrate per minute for each of the target particle size ranges to a limit on the number of particles deposited per substrate per minute. Such a conversion can be easily performed, for example, through known relationships between substrates of specific generation sizes and the corresponding areas of substrates of that substrate generation. For example, Table 2 below summarizes the aspect ratios and areas of substrates of some known generation sizes. It should be understood that aspect ratios, and thus slight variations in size, can be seen by the manufacturer. However, despite such variations, conversion factors and areas in square meter units for substrates of specific generation sizes can be obtained for any of the various generation sizes of substrates.

[0022]

Table 2

[0023] In addition, the substrate particle deposition rate specification, expressed as the limit of the number of particles deposited per square meter of the substrate per minute, can be easily converted into any of various unit-time expressions. The substrate particle deposition rate specification normalized to minutes can be easily understood to be convertible, through known time relationships, into any other time expression, for example, but not limited to, seconds, hours, days, etc. In addition, a unit of time specific to the process can be used. For example, a print cycle can be associated with a unit of time. For various embodiments of the gas enclosure system according to the present teachings, the print cycle can be a period of time during which the substrate is moved into the gas enclosure system for printing and then removed from the gas enclosure system after printing is completed. For various embodiments of the gas enclosure system according to the present teachings, the print cycle can be a period of time from the start of alignment of the substrate to the print head assembly to the delivery of the last droplet of ink released onto the substrate. In the technical field of processing, the total average cycle time or TACT can be an expression of a unit of time for a particular process cycle. According to various embodiments of the systems and methods of the present teachings, the TACT of the print cycle can be about 30 seconds. For various embodiments of the systems and methods of the present teachings, the TACT of the print cycle can be about 60 seconds. In various embodiments of the systems and methods of the present teachings, the TACT of the print cycle can be about 90 seconds. For various embodiments of the systems and methods of the present teachings, the TACT of the print cycle can be about 120 seconds. In various embodiments of the systems and methods of the present teachings, the TACT of the print cycle can be about 300 seconds.

[0024] Regarding airborne particulate matter and particle deposition within a system, a significant number of variables can affect the development of a general model that can adequately calculate an approximation of the value of the particle fallout rate on a surface, such as a substrate, for any given manufacturing system. Variables such as particle size, the distribution of particles of a particular size, the surface area of the substrate, and the exposure time of the substrate within the system can vary depending on the various manufacturing systems. For example, particle size and the distribution of particles of a particular size can be substantially affected by the source and location of the particle generation components within the various manufacturing systems. Calculations based on various embodiments of the gas enclosure system of the present teachings suggest that without the various particle control systems of the present teachings, the deposition of particulate matter on the substrate per print cycle per square meter of the substrate can be more than about 1 million to more than about 10 million particles for particles in the size range of 0.1 μm and above. Such calculations suggest that without the various particle control systems of the present teachings, the deposition of particulate matter on the substrate per print cycle per square meter of the substrate can be more than about 1000 to more than about 10,000 particles for particles in the size range of about 2 μm and above. Suggesting that it can be more than about 1 million to more than about 10 million particles.

[0025] Various embodiments of the low-particle gas enclosure system of the present teachings can maintain a low-particle environment that provides an average particle distribution on the substrate satisfying a deposition rate specification of about 100 particles or less per square meter of the substrate per minute for particles sized greater than or equal to 10 μm. Various embodiments of the low-particle gas enclosure system of the present teachings can maintain a low-particle environment that provides an average particle distribution on the substrate satisfying a deposition rate specification of about 100 particles or less per square meter of the substrate per minute for particles sized greater than or equal to 5 μm. In various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average particle distribution on the substrate satisfying a deposition rate specification of about 100 particles or less per square meter of the substrate per minute for particles sized greater than or equal to 2 μm. In various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average particle distribution on the substrate satisfying a deposition rate specification of about 100 particles or less per square meter of the substrate per minute for particles sized greater than or equal to 1 μm. Various embodiments of the low-particle gas enclosure system of the present teachings can maintain a low-particle environment that provides an average particle distribution on the substrate satisfying a deposition rate specification of about 1000 particles or less per square meter of the substrate per minute for particles sized greater than or equal to 0.5 μm. For various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average particle distribution on the substrate satisfying a deposition rate specification of about 1000 particles or less per square meter of the substrate per minute for particles sized greater than or equal to 0.3 μm. Various embodiments of the low-particle gas enclosure system of the present teachings can maintain a low-particle environment that provides an average particle distribution on the substrate satisfying a deposition rate specification of about 1000 particles or less per square meter of the substrate per minute for particles sized greater than or equal to 0.1 μm.

[0026] A variety of ink formulations are contemplated to be printable within the inert and substantially low particle environment of various embodiments of the gas enclosure system of the present teachings. During the manufacture of an OLED display, an OLED pixel can be formed to include an OLED film stack that can emit light of a specific peak wavelength when a voltage is applied. The OLED film stack structure between the anode and the cathode can include a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EL), an electron transport layer (ETL), and an electron injection layer (EIL). In some embodiments of the OLED film stack structure, the electron transport layer (ETL) can be combined with the electron injection layer (EIL) to form an ETL / EIL layer. According to the present teachings, for example, using inkjet printing, various ink formulations for EL for various color pixel EL films of the OLED film stack can be printed. Additionally, for example, without limitation, the HIL, HTL, EML, and ETL / EIL layers can have ink formulations that can be printed using inkjet printing.

[0027] Furthermore, it is contemplated that the organic encapsulation layer can be printed on the substrate printing. Since inkjet printing can provide several advantages, it is contemplated that inkjet printing can be used to print the organic encapsulation layer. First, since such inkjet-based processing can be performed at atmospheric pressure, a series of vacuum processing operations can be eliminated. In addition, during the inkjet printing process, the organic encapsulation layer can be confined to cover a portion of the OLED substrate proximal thereto across the active region and effectively encapsulate the active region including the outer edge of the active region. Target patterning using inkjet printing results in eliminating waste of materials and eliminating additional processing typically required to achieve patterning of the organic layer. The encapsulation ink can include, for example, polymers including, but not limited to, acrylates, methacrylates, urethanes, or other materials, as well as their copolymers and mixtures that can be cured using heat treatment (e.g., baking), ultraviolet exposure, and combinations thereof. As used herein, polymers and copolymers can include any form of polymer component that can be formulated into an ink and cured on a substrate to form an organic encapsulation layer. Such polymer components can include polymers and copolymers, as well as their precursors, for example, but not limited to, monomers, oligomers, and resins.

[0028] Various embodiments of the gas enclosure assembly can have various frame members constructed to provide the contour of the gas enclosure assembly. Various embodiments of the gas enclosure assembly of the present teachings can optimize the working space to minimize the inert gas volume and can adapt to an OLED printing system while allowing immediate access to the external OLED printing system during processing. In that regard, various gas enclosure assemblies of the present teachings can have a contoured topology and volume. As will be discussed in more detail later herein, various embodiments of the gas enclosure can be contoured around the perimeter of the printing system base on which a substrate support device can be mounted. Further, the gas enclosure can be contoured around the bridge structure of the printing system used for X-axis movement of the carriage assembly. As a non-limiting example, various embodiments of the contoured gas enclosure according to the present teachings can be about 6 m 3 to about 95 m 3 in gas enclosure volume to accommodate various embodiments of printing systems capable of printing substrate sizes from Gen 3.5 to Gen 10. As a further non-limiting example, various embodiments of the contoured gas enclosure according to the present teachings can be about 15 m 3 to about 30 m 3 in gas enclosure volume to accommodate various embodiments of printing systems capable of printing substrate sizes, for example, from Gen 5.5 to Gen 8.5. Such embodiments of the contoured gas enclosure can save about 30% to about 70% in volume compared to a non-contoured enclosure having non-contoured dimensions in width, length, and height.

[0029] Figure 1A depicts a perspective view of a gas enclosure assembly 1000 according to various embodiments of the present teachings. The gas enclosure assembly 1000 can include a front panel assembly 1200, a central panel assembly 1300, and a rear panel assembly 1400. The front panel assembly 1200 can include a front ceiling panel assembly 1260, a front wall panel assembly 1240 that can have an opening 1242 for receiving a substrate, and a front base panel assembly 1220. The rear panel assembly 1400 can include a rear ceiling panel assembly 1460, a rear wall panel assembly 1440, and a rear base panel assembly 1420. The central panel assembly 1300 can include a first central enclosure panel assembly 1340, a central wall and ceiling panel assembly 1360, a second central enclosure panel assembly 1380, and a central base panel assembly 1320.

[0030] In addition, as depicted in FIG. 1A, the central panel assembly 1300 can include a substantially low particle environment of the first printhead management system, as well as a second printhead management system auxiliary panel assembly (not shown). Various embodiments of the auxiliary enclosure constructed as a section of the gas enclosure assembly can be hermetically isolated from the working volume of the gas enclosure system. For various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 1% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 2% of the enclosure volume of the gas enclosure system. For various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 5% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 10% of the enclosure volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 20% of the enclosure volume of the gas enclosure system. Even if an opening of the auxiliary enclosure to the ambient environment containing reactive gas is shown, for example, to perform maintenance procedures, contamination of the entire volume of the gas enclosure can be prevented by isolating the auxiliary enclosure from the working volume of the gas enclosure. Further, considering the relatively small volume of the auxiliary enclosure compared to the print system enclosure portion of the gas enclosure, the recovery time of the auxiliary enclosure can require a significantly less time than the recovery time of the entire print system enclosure.

[0031] As depicted in FIG. 1B, the gas enclosure assembly 1000 can include a front base panel assembly 1220, a central base panel assembly 1320, and a rear base panel assembly 1420 that form an adjacent base or pan on which the printing system 2000 can be mounted when fully constructed. Similar to what was described for the gas enclosure assembly 100 in FIG. 1A, various frame members and panels, including the front panel assembly 1200, the central panel assembly 1300, and the rear panel assembly 1400 of the gas enclosure assembly 1000, can be joined around the printing system 2000 to form a printing system enclosure. The front panel assembly 1200 can be contoured around the printing system 2000 that is mounted to form a first tunnel enclosure section of the gas enclosure. Similarly, the rear panel assembly 1400 can be contoured around the printing system 2000 to form a second tunnel enclosure section of the gas enclosure. Additionally, the central panel assembly 1300 can be contoured around the bridge section of the printing system 2000 to form a bridge enclosure section of the gas enclosure. Together, the first tunnel enclosure section, the second tunnel section, and the bridge enclosure section can form a printing enclosure section. As discussed in more detail herein, according to the present teachings, an auxiliary enclosure can be hermetically isolated from the printing system enclosure, for example, during a printing process, to perform various measurement and maintenance tasks with little or no interruption to the printing process.

[0032] Furthermore, a fully constructed gas enclosure assembly, such as gas enclosure assembly 1000, can form various embodiments of a gas enclosure system that include various embodiments of an OLED printing system, such as printing system 2000, when integrated with various environmental control systems. According to various embodiments of the gas enclosure system of the present teachings, environmental control of the internal volume defined by the gas enclosure assembly can include, for example, control of illumination, by the number and placement of light of a specific wavelength, control of particulate matter using various embodiments of a particle control system, control of reactive gas species using various embodiments of a gas purification system, and temperature control of the gas enclosure assembly using various embodiments of a thermal regulation system.

[0033] A printing system, such as printing system 2000 of FIG. 1B, shown in an enlarged view in FIG. 1C, can consist of several devices and apparatuses that enable the reliable placement of ink droplets at specific locations on a substrate. These devices and apparatuses can include, but are not limited to, a print head assembly, an ink delivery system, a motion system for providing relative motion between the print head assembly and the substrate, a substrate support device, a substrate loading and unloading system, and a print head management system.

[0034] The printhead assembly can include at least one inkjet head with at least one orifice capable of ejecting ink droplets at a controlled rate, speed, and size. The inkjet head is fed by an ink supply system that provides ink to the inkjet head. As shown in the enlarged view of FIG. 1C, the printing system 2000 can have a substrate, such as substrate 2050, which can be supported by a chuck, such as, but not limited to, a vacuum chuck, a substrate floating chuck having pressure ports, and a substrate floating chuck having vacuum and pressure ports, etc. In various embodiments of the systems and methods of the present teachings, the substrate support device can be a substrate floating table. As will be discussed in more detail later herein, the substrate floating table 2200 of FIG. 1C can be used to support substrate 2050 and, in conjunction with the Y-axis motion system, can be part of a substrate transport system that provides frictionless transport of substrate 2050. The Y-axis motion system of the present teachings can include a first Y-axis support beam 2351 and a second Y-axis support beam 2352, which can include a gripper system (not shown) for holding the substrate, as will be discussed in more detail herein. Y-axis motion can be provided by either a linear air bearing or a linear mechanical system. The substrate floating table 2200 of the printing system 2000 shown in FIGS. 1B and 1C can define the movement of substrate 2050 through the gas enclosure assembly 1000 of FIG. 1A during the printing process.

[0035] Figure 1C illustrates an example of a substrate floating table 2200 for a printing system 2000 that can include floating conveyance of a substrate, which can generally have a porous medium to provide floating. In the example of Figure 1C, a handler or other conveyance can be used to position substrate 2050 in an input region 2201 of substrate floating table 2200 such that it is located on a conveyor. The conveyor can use mechanical contact (e.g., using an array of pins, trays, or support frame configurations) or a gas cushion (e.g., an “air bearing” table configuration) to controllably float substrate 2050 to position substrate 2050 at a defined location within the printing system. A printing region 2202 of substrate floating table 2200 can be used to controllably deposit one or more layers on substrate 2050 during processing. The printing region 2202 can also be coupled to an output region 2203 of substrate floating table 2200. The conveyor can extend along the input region 2201, printing region 2202, and output region 2203 of substrate floating table 2200, and substrate 2050 can be repositioned as desired for various deposition tasks or during a single deposition operation. A controlled environment near the input region 2201, printing region 2202, and output region 2203 can be shared jointly.

[0036] The printing system 2000 of FIG. 1C can include one or more print head devices 2505, where each print head device has, for example, one or more print heads of the nozzle printing, thermal jet, or ink jet type. The one or more print head devices 2505 can be coupled to or otherwise traverse an overhead carriage such as the first X-axis carriage assembly 2301. For various embodiments of the printing system 2000 of the present teachings, one or more print heads of the one or more print head devices 2505 can be configured to deposit one or more patterned organic layers on the substrate 2050 in an “upward” configuration with respect to the substrate 2050. Such layers can include, for example, one or more of an electron injection or transport layer, a hole injection or transport layer, a blocking layer, or an emissive layer. Such materials can provide one or more electrically functional layers.

[0037] According to the floating method shown in FIG. 1C, in an embodiment where the substrate 2050 is exclusively supported by a gas cushion, a combination of gas positive pressure and vacuum can be applied through an array of ports or using a porous dispersion medium. Such zones having both pressure and vacuum control can effectively provide a fluid spring between the conveyor and the substrate. The combination of positive pressure and vacuum control can provide a fluid spring with bidirectional stiffness. The gap existing between the substrate (e.g., substrate 2050) and the surface can be referred to as the "flying height", and such height can be controlled or otherwise established by controlling the positive pressure and vacuum port states. In this way, the substrate Z-axis height can be carefully controlled, for example, in the printing area 2202. In some embodiments, mechanical retention techniques such as pins or frames can be used to limit the lateral translation of the substrate while the substrate is supported by the gas cushion. Such retention techniques can include using a spring load structure, for example, to reduce the impact of an instantaneous force entering the side surface of the substrate while the substrate is being retained. This can be beneficial because a high force impact between the laterally translating substrate and the retention means can cause chipping or even catastrophic breakage of the substrate.

[0038] In other locations generally illustrated in FIG. 1C, such as where precise control of the flying height is not required, a pressure-only floating zone can be provided along the conveyor in the input or output region 2100 or 2300, or elsewhere. A "transition" zone, such as where the ratio of the pressure to the vacuum nozzle gradually increases or decreases, can be provided. In an illustrative embodiment, there can be an essentially uniform height between the pressure-vacuum zone, the transition zone, and the pressure-only zone such that, within tolerances, the three zones can be essentially located in one plane. The flying height of the substrate across the pressure-only zone in other locations can be greater than the flying height of the substrate across the pressure-vacuum zone, for example, to allow sufficient height so that the substrate does not collide with the floating table within the pressure-only zone. In an illustrative example, the OLED panel substrate can have a flying height of about 150 micrometers (μm) to about 300 μm above the pressure-only zone and then about 30 μm to about 50 μm above the pressure-vacuum zone. In an illustrative example, the substrate floating table 2200 or one or more portions of other processing apparatuses can include an "air bearing" assembly provided by NewWay® Air Bearings (Aston, Pennsylvania, United States of America).

[0039] A porous medium can be used to establish a distributed pressurized gas cushion for floating conveyance or support of the substrate 2050 during one or more of printing, buffering, drying, or heat treatment. For example, a porous medium "plate" that is connected to or included as part of a conveyor can provide a "distributed" pressure to support the substrate 2050, similar to the use of individual gas ports. The use of a distributed pressurized gas cushion without using large gas port openings can, in some cases, further improve uniformity, reduce or minimize the formation of unevenness or other visible defects, such as when the use of relatively large gas ports to create the gas cushion leads to non-uniformity despite the use of the gas cushion.

[0040] A porous medium having physical dimensions defined to occupy the entire substrate 2050, or a defined area of the substrate such as a display area or an area outside the display area, can be obtained from Nano TEM Co., Ltd. (Niigata, Japan). Such a porous medium can include pore sizes defined to provide a desired pressurized gas flow across a defined area while reducing or minimizing non-uniformities or other visible defect formation.

[0041] Printing requires relative movement between the printhead assembly and the substrate. This can be achieved using a motion system, typically a gantry or split axis XYZ system. The printhead assembly can move over a stationary substrate (gantry type), or in the case of a split axis configuration, both the printhead and the substrate can move. In another embodiment, the printhead assembly can be substantially stationary, for example, in the X and Y axes, and the substrate can move in the X and Y axes relative to the printhead, with the Z axis motion provided either by the substrate support device or by a Z axis motion system associated with the printhead assembly. When the printhead moves relative to the substrate, ink droplets are ejected at the correct time so as to be deposited at the desired locations on the substrate. The substrate can be inserted and removed from the printer using a substrate loading and unloading system. Depending on the printer configuration, this can be achieved using a mechanical conveyor, a substrate floating table with a transport assembly, or a substrate transfer robot with an end effector. The printhead management system can consist of several subsystems that enable such measurement tasks as checking nozzle firing and measuring droplet volume, velocity, and trajectory from all nozzles in the printhead, and maintenance tasks such as wiping or sucking excess ink from the inkjet nozzle surface, priming and purging the printhead by discharging ink from the ink supply through the printhead into a waste container, and replacing the printhead. Considering the various components that can be included in an OLED printing system, the various embodiments of an OLED printing system can have various installation areas and form factors.

[0042] With respect to FIG. 1C, the printing system base 2100 can include a first riser 2120 and a second riser 2122 on which the bridge 2130 is mounted. For various embodiments of the printing system 2000, the bridge 2130 can support a first X-axis carriage assembly 2301 and a second X-axis carriage assembly 2302 that can control the movement of the first print head assembly 2501 and the second print head assembly 2502, respectively, across the bridge 2130. For various embodiments of the printing system 2000, the first X-axis carriage assembly 2301 and the second X-axis carriage assembly 2302 can utilize a linear air bearing motion system that is essentially low particle generation. According to various embodiments of the printing system of the present teachings, the X-axis carriage can have a Z-axis moving plate mounted thereon. In FIG. 1C, the first X-axis carriage assembly 2301 is depicted with the first Z-axis moving plate 2310, while the second X-axis carriage assembly 2302 is depicted with the second Z-axis moving plate 2312. FIG. 1C depicts two carriage assemblies and two print head assemblies, but for various embodiments of the printing system 2000, there can be a single carriage assembly and a single print head assembly. For example, either the first print head assembly 2501 or the second print head assembly 2502 can be mounted on the X, Z-axis carriage assembly, while a camera system for inspecting the features of the substrate 2050 can be mounted on the second X, Z-axis carriage assembly. Various embodiments of the printing system 2000 can have a single print head assembly. For example, either the first print head assembly 2501 or the second print head assembly 2502 can be mounted on the X, Z-axis carriage assembly, while an ultraviolet lamp for curing the encapsulation layer printed on the substrate 2050 can be mounted on the second X, Z-axis carriage assembly.For various embodiments of the printing system 2000, there may be either a single print head assembly, e.g., either a first print head assembly 2501 or a second print head assembly 2502 mounted on an X, Z-axis carriage assembly, while a heat source for curing an encapsulation layer printed on the substrate 2050 can be mounted on a second carriage assembly.

[0043] In FIG. 1C, each print head assembly, such as the first print head assembly 2501 and the second print head assembly 2502 of FIG. 1C, can have a plurality of print heads mounted within at least one print head device, as depicted in a partial view of the first print head assembly 2501 depicting a plurality of print head devices 2505. The print head device can include, for example, but is not limited thereto, fluid and electrical connections to at least one print head, and each print head has a plurality of nozzles or orifices capable of discharging ink at a controlled rate, speed, and size. For various embodiments of the printing system 2000, the print head assembly can include from about 1 to about 60 print head devices, and each print head device can have from about 1 to about 30 print heads within each print head device. A print head, e.g., an industrial inkjet head, can have from about 16 to about 2048 nozzles capable of discharging a droplet volume of from about 0.1 pL to about 200 pL.

[0044] According to various embodiments of the gas enclosure system of the present disclosure, considering a very large number of printhead devices and printheads, the first printhead management system 2701 and the second printhead management system 2702 can be housed in an auxiliary enclosure that can be isolated from the print system enclosure during the printing process in order to perform various measurement and maintenance tasks with little or no interruption to the printing process. As can be seen in FIG. 1C, the first printhead assembly 2501 can be seen positioned relative to the first printhead management system 2701 for the immediate implementation of various measurement and maintenance procedures that can be performed by the first printhead management system devices 2707, 2709, and 2711. Devices 2707, 2709, and 2011 can be any of various subsystems or modules for performing various printhead management functions. For example, devices 2707, 2709, and 2011 can be any of a drop measurement module, a printhead replacement module, a purge container module, and a blotter module. As depicted in FIG. 1C, the first printhead management system 2701 can have devices 2707, 2709, and 2711 that can be mounted on a linear rail motion system 2705 for positioning relative to the first printhead assembly 2501. Similarly, the various devices housed within the second printhead management system 2702 can be mounted on a linear rail motion system 2706 for positioning relative to the first printhead assembly 2502.

[0045] Regarding various embodiments of a gas enclosure assembly having a first working volume, for example, an auxiliary enclosure that can be enclosed and hermetically isolated from a printing system enclosure, again refer to FIG. 1B. As depicted in FIG. 1C, there can be four isolators on top of the printing system 2000, namely, a first set of isolators 2110 (the second is not shown on the opposite side) that supports the substrate floating table 2200 of the printing system 2000, and a second set of isolators 2112 (the second is not shown on the opposite side). For the gas enclosure assembly 1000 of FIG. 1B, the first set of isolators 2110 and the second set of isolators 2112 can be mounted within respective isolator wall panels such as the first isolator wall panel 1325 and the second isolator wall panel 1327 of the central foundation panel assembly 1320. For the gas enclosure assembly 1000 of FIG. 1B, the central foundation assembly 1320 can include a first print head management system auxiliary panel assembly 1330, as well as a second print head management system auxiliary panel assembly 1370. FIG. 1B of the gas enclosure assembly 1000 depicts the first print head management system auxiliary panel assembly 1330, which can include a first rear wall panel assembly 1338. Similarly, the second print head management system auxiliary panel assembly 1370, which can include a second rear wall panel assembly 1378, is also depicted. The first rear wall panel assembly 1338 of the first print head management system auxiliary panel assembly 1330 can be constructed similarly as shown for the second rear wall panel assembly 1378. The second rear wall panel assembly 1378 of the second print head management system auxiliary panel assembly 1370 can be constructed from a second rear wall frame assembly 1378 having a second seal support panel 1375 hermetically mounted thereto. The second seal support panel 1375 can have a second passage 1365 proximal to a second end (not shown) of the base 2100.The second seal 1367 can be mounted on the second seal support panel 1375 around the second passage 1365. The first seal can likewise be positioned and mounted around the first passage for the first printhead management system auxiliary panel assembly 1330. Each passage within the auxiliary panel assemblies 1330 and 1370 can be adapted to a printhead management system platform such that the first and second printhead management system platforms 2703 and 2704 of FIG. 1C can pass through the passage. According to the present teachings, passages such as the second passage 1365 of FIG. 1B must be sealable in order to sealably isolate the auxiliary panel assemblies 1330 and 1370. It is contemplated that various seals such as an inflatable seal, a bellows seal, and a lip seal can be used to seal passages such as the second passage 1365 of FIG. 1B around the periphery of the printhead management system platform attached to the printing system base.

[0046] The first print head management system auxiliary panel assembly 1330 and the second print head management system auxiliary panel assembly 1370 can each include a first print head assembly opening 1342 of the first floor panel assembly 1341 and a second print head assembly opening 1382 of the second floor panel assembly 1381. The first floor panel assembly 1341 is depicted in FIG. 1B as part of the first central enclosure panel assembly 1340 of the central panel assembly 1300. The first floor panel assembly 1341 is a panel assembly common to both the first central enclosure panel assembly 1340 and the first print head management system auxiliary panel assembly 1330. The second floor panel assembly 1381 is depicted in FIG. 1B as part of the second central enclosure panel assembly 1380 of the central panel assembly 1300. The second floor panel assembly 1381 is a panel assembly common to both the second central enclosure panel assembly 1380 and the second print head management system auxiliary panel assembly 1370.

[0047] As previously discussed herein, the first print head assembly 2501 can be housed within the first print head assembly enclosure 2503, and the second print head assembly 2502 can be housed within the second print head assembly enclosure 2504. According to the systems and methods of the present teachings, the first print head assembly enclosure 2503 and the second print head assembly enclosure 2504 can have an opening at the bottom with a periphery (not shown) such that various print head assemblies can be positioned for printing during the printing process. Additionally, portions of the first print head assembly enclosure 2503 and the second print head assembly enclosure 2504 that form the housing can be constructed as previously described for the various panel assemblies such that frame assembly members and panels can provide a sealed enclosure.

[0048] In addition, a compressible gasket that can be used for sealing various frame members can be attached around each of the first printhead assembly opening 1342 and the second printhead assembly opening 1382, or alternatively, around the peripheries of the first printhead assembly enclosure 2503 and the second printhead assembly enclosure 2504.

[0049] According to the present teachings, the compressible gasket material can be selected from any of the types of closed-cell polymer materials, such as, but not limited to, what is also referred to in the art as an expanded rubber material or an expanded polymer material. Briefly, a closed-cell polymer is prepared in a manner such that gas is encapsulated in discrete cells, where each discrete cell is encapsulated by the polymer material. The properties of a compressible closed-cell polymer gasket material desirable for use in the hermetic sealing of frame and panel components include, but are not limited to, being robust against chemical attack over a wide range of chemical species, having excellent moisture barrier properties, being elastic over a wide temperature range, and being resistant to permanent compression set. Generally, compared to open-cell structured polymer materials, closed-cell polymer materials have higher dimensional stability, lower moisture absorption coefficients, and higher strength. The various types of polymer materials from which a closed-cell polymer material can be made can include, but are not limited to, polymers and composite materials made using silicone, neoprene, ethylene polyethylene diene terpolymer (EPT), ethylene polyethylene diene monomer (EPDM), vinyl nitrile, styrene butadiene rubber (SBR), as well as various copolymers and mixtures thereof.

[0050] In addition to closed-cell compressible gasket materials, another example of a type of compressible gasket material having desired attributes for use in constructing embodiments of a gas enclosure assembly according to the present teachings includes types of hollow extruded compressible gasket materials. Hollow extruded gasket materials as a type of material may include, but are not limited to, being robust against chemical attack over a wide range of chemical species, possessing excellent moisture barrier properties, being elastic over a wide temperature range, and being resistant to permanent compression set, and having other desirable attributes. Such hollow extruded compressible gasket materials can be provided in a variety of shape factors, such as, but not limited to, U-cells, D-cells, square cells, rectangular cells, and any of a variety of custom shape factor hollow extruded gasket materials. The various hollow extruded gasket materials can be processed from polymer materials used in closed-cell compressible gasket processing. For example, but not limited to, various embodiments of hollow extruded gaskets can be made from polymers and composite materials made using silicone, neoprene, ethylene propylene diene terpolymer (EPT), ethylene propylene diene monomer (EPDM), vinyl nitrile, styrene butadiene rubber (SBR), and various copolymers and mixtures thereof. Compression of such hollow cell gasket materials should not exceed about 50% deflection in order to maintain the desired attributes. It is contemplated that various types of expandable seals can be utilized to seal the printhead assembly using a first printhead assembly docking gasket 1345 and a second printhead assembly docking gasket 1385. Such expandable seals may be processed from low contamination materials such as low particle generation, low gas emission polymer materials such as for silicone, neoprene, and butyl rubber materials, and provide rapid sealing and unsealing during processing.

[0051] As depicted in FIG. 1B, the first print head assembly docking gasket 1345 and the second print head assembly docking gasket 1385 each correspond to the first print head assembly opening 1342 and the second print head assembly It can be attached around the print head opening 1382. During various print head measurement and maintenance procedures, the first print head assembly 2501 and the second print head assembly 2502 can be positioned to cover the first print head assembly opening 1342 of the first floor panel assembly 1341 and the second print head assembly opening 1382 of the second floor panel assembly 1381, respectively, by the first X, Z-axis carriage assembly 2301 and the second X, Z-axis carriage assembly 2302. In that regard, for various print head measurement and maintenance procedures, the first print head assembly 2501 and the second print head assembly 2502 can be positioned to cover the first print head assembly opening 1342 and the second print head assembly opening 1382, respectively, without covering or sealing the first print head assembly opening 1342 of the first floor panel assembly 1341 and the second print head assembly opening 1382 of the second floor panel assembly 1381. The first X, Z-axis carriage assembly 2301 and the second X, Z-axis carriage assembly 2302 can dock the first print head assembly enclosure 2503 and the second print head assembly enclosure 2504 with the first print head management system auxiliary panel assembly 1330 and the second print head management system auxiliary panel assembly 1370, respectively. In various print head measurement and maintenance procedures, such docking may effectively close the first print head assembly opening 1342 and the second print head assembly opening 1382 without the need to seal them. For various print head measurement and maintenance procedures, docking can include the formation of a gasket seal between each of the print head assembly enclosure and the print head management system panel assembly.In addition to sealing the passages such as the second passage 1365 of FIG. 1B and the complementary first passage, when the first print head assembly enclosure 2503 and the second print head assembly enclosure 2504 are docked with the first print head management system auxiliary panel assembly 1330 and the second print head management system auxiliary panel assembly 1370 so as to sealably close the first print head assembly opening 1342 and the second print head assembly opening 1382, the composite structure thus formed is sealed.

[0052] In addition, according to the present teachings, for example, in order to sealably close passages such as the first print head assembly opening 1342 and the second print head assembly opening 1382 of FIG. 1B, by using structural closures, the auxiliary enclosure can be isolated from another internal enclosure volume such as a printing system enclosure, as well as from the outside of the gas enclosure assembly. According to the present teachings, structural closures can include various sealable covers for openings or passages, such openings or passages including non-limiting examples of enclosure panel openings or passages. According to the systems and methods of the present teachings, a gate can be any structural closure that can be used to reversibly cover or reversibly sealably close any opening or passage using pneumatic, hydraulic, electrical, or manual actuation. Thus, a gate can be used to reversibly cover or reversibly sealably close the first print head assembly opening 1342 and the second print head assembly opening 1382 of FIG. 1B.

[0053] In the enlarged view of the printing system 2000 of FIG. 1C, various embodiments of the printing system can include a substrate floating table 2200 supported by a substrate floating table base 2220. The substrate floating table base 2220 can be mounted on the printing system base 2100. The substrate floating table 2200 of the OLED printing system supports the substrate 2050 and can define movement through which the substrate 2050 can be moved through the gas enclosure assembly 1000 during printing of the OLED substrate. The Y-axis motion system of the present teachings can include a first Y-axis support beam 2351 and a second Y-axis support beam 2352, which may include a gripper system (not shown) for holding the substrate, to be discussed in more detail herein. The Y-axis motion can be provided by either a linear air bearing or a linear mechanical system. In that regard, the motion system, i.e., the Y-axis motion system in conjunction with the substrate floating table 2200, as depicted in FIG. 1C, can provide frictionless conveyance of the substrate 2050 through the printing system.

[0054] FIG. 1D depicts an enlarged view of a first printhead management system 2701 housed within a first printhead management system auxiliary panel assembly 1330 according to various embodiments of the gas enclosure assembly and system of the present teachings. As depicted in FIG. 1D, the auxiliary panel assembly 1330 is shown as a cutaway view so that the details of the first printhead management system 2701 are more clearly visible. In various embodiments of the printhead management system according to the present teachings, such as the first printhead management system 2701 of FIG. 1D, the devices 2707, 2709, and 2011 can be various subsystems or modules for performing various functions. For example, the devices 2707, 2709, and 2011 can be a drop measurement module, a printhead purge container module, and a blotter module. As depicted in FIG. 1D, the printhead exchange module 2713 can provide a location for docking at least one printhead device 2505. In various embodiments of the first printhead management system 2701, the first printhead management system auxiliary panel assembly 1330 can be maintained in the same environmental specifications in which the gas enclosure assembly 1000 (see FIG. 1A) is maintained. The first printhead management system auxiliary panel assembly 1330 can have a handler 2530 positioned to perform tasks associated with various printhead management procedures. For example, each subsystem can have various components that are essentially consumables and require replacement such as the replacement of blotting paper, ink, and waste reservoirs. The various consumable parts can be packaged for immediate insertion, for example, in a fully automated mode using a handler. As a non-limiting example, the blotting paper can be packaged in a cartridge format that can be easily inserted into the blotting module for use. As another non-limiting example, the ink can be packaged in a replaceable reservoir as well as in a cartridge format for use in a printing system. Various embodiments of the waste reservoir can be packaged in a cartridge format that can be easily inserted into the purge container module for use.In addition, the components of various components of the printing system that are subject to continued use may require periodic replacement. During the printing process, expedient management of the print head assembly, for example, but not limited to, replacement of the print head device or the print head, may be desirable. The print head replacement module can have components such as a print head device or a print head that can be easily inserted into the print head assembly for use. The droplet measurement module used for checking nozzle firing and measurements based on optical detection of droplet volume, velocity, and trajectory from all nozzles can include a source and a detector that may require periodic replacement after use. The highly utilized parts of various consumables can be packaged for immediate insertion, for example, in a fully automatic mode using a handler. The handler 2530 can have an end effector 2536 mounted on an arm 2534. Various embodiments of the end effector configuration, for example, blade-type end effectors, clamp-type end effectors, and gripper-type end effectors can be used. The various embodiments of the end effector can include mechanical gripping and crimping, as well as pneumatic or vacuum assist assemblies, either to actuate parts of the end effector or otherwise hold the print head device or the print head from the print head device in place.

[0055] Regarding the replacement of a print head device or a print head, the print head replacement module 2713 of the print head management system 2701 in FIG. 1D can include a docking station for a print head device having at least one print head, as well as a storage receptacle for the print head. Since each print head assembly (see FIG. 1B) can include from about 1 to about 60 print head devices, and each print head device can include from about 1 to about 30 print heads, then various embodiments of the printing system of the present teachings can have from about 1 to about 1800 print heads. In various embodiments of the print head replacement module 2713, while the print head device is docked, each print head mounted on the print head device can be maintained in an operable state while not in use in the printing system. For example, when placed within the docking station, each print head on each print head device can be connected to an ink supply and an electrical connection. Power can be provided to each print head on each print head device such that a periodic firing pulse can be applied to each nozzle of each print head while docked, to ensure that the nozzles are primed and do not clog. The handler 2530 in FIG. 1D can be positioned proximate to the print head assembly 2500. The print head assembly 2500 can be docked covering the first print head management system auxiliary panel assembly 1330 as depicted in FIG. 1D. During the procedure for replacing a print head, the handler 2530 can remove either a target component, i.e., either a print head or a print head device having at least one print head, from the print head assembly 2500. The handler 2530 can retrieve a replacement part such as a print head device or a print head from the print head replacement module 2713 and complete the replacement process. The removed part can be placed within the print head replacement module 2713 for retrieval.

[0056] In FIG. 2A, the gas enclosure system 500 can have a first tunnel enclosure section 1200 having an inlet gate 1242 for receiving a substrate, which can together form a print system enclosure, a bridge enclosure section 1300, and a second tunnel enclosure section 1400. Additionally, the gas enclosure system 500 can have an auxiliary enclosure 1330. The auxiliary enclosure 1330 can be hermetically isolated from the print system enclosure of the gas enclosure system 500. For example, during the printing process, the auxiliary enclosure 1330 can be hermetically isolated from the print system enclosure of the gas enclosure system 500 to perform various measurement and maintenance tasks with little or no interruption to the printing process. As will be discussed in more detail later in the discussion of FIG. 8, purified inert gas from a purification system such as the purification system 3130 of FIG. 8 can circulate into the print system enclosure of the gas enclosure system 500, as well as into the auxiliary enclosure 1300.

[0057] For various embodiments of the printing system of the present disclosure, the printhead assembly can include from about 1 to about 60 printhead devices. The printhead devices can include, for example, but are not limited to, fluid and electrical connections to at least one printhead, and each printhead has a plurality of nozzles or orifices capable of discharging ink at a controlled rate, speed, and size. It should be recalled that each printhead device can have from about 1 to about 30 printheads within each printhead device. A printhead, for example, an industrial inkjet head, can have from about 16 to about 2048 nozzles capable of discharging a droplet volume of from about 0.1 pL to about 200 pL. Considering a very large number of printhead devices and printheads, the auxiliary enclosure can house various embodiments of the printhead management system. According to the present disclosure, the auxiliary enclosure can be isolated from the printing system enclosure during the printing process, for example, but not limited to, using various devices and apparatuses of the printhead management system to perform various measurement and maintenance tasks. Thus, various measurement and maintenance tasks can be performed with little or no interruption to the printing process.

[0058] Figure 2B depicts a perspective view of the auxiliary enclosure 1330 of the gas enclosure system according to various embodiments of the present disclosure. The auxiliary enclosure 1330 can be an embodiment of an auxiliary enclosure that can be used with various gas enclosure systems of the present disclosure, such as, but not limited to, the gas enclosure system 1000 of FIG. 1A and the gas enclosure system 500 of FIG. 2A. As shown in FIG. 2B, the auxiliary enclosure 1330 can have a print head management system platform 2703 that has a linear rail system 2705 for positioning various devices and apparatuses used for various measurement and maintenance procedures with respect to various print head devices of the print head assembly. For example, in the partially exploded view of FIG. 2B, the print head assembly 2500 is shown positioned covering the print head assembly opening 1350. The print head assembly 2500 can have a plurality of print head devices such as 2505A, 2505B, and 2505C shown in FIG. 2C. The first motion system platform 2800A and the second motion system platform 2800B can be used for positioning various devices and apparatuses used for various measurement and maintenance procedures mounted on the motion system platform with respect to each of the plurality of print head devices of the print head assembly 2500.

[0059] The partial exploded view of FIG. 2C depicts a top perspective view of a print head management system 2700 associated with a print head assembly 2500. As depicted in FIG. 2C, a first motion system platform 2800A and a second motion system platform 2800B can be moved along the Y-axis direction on a linear rail system 2705. In that manner, the linear rail system 2705 can position various devices and apparatuses mounted on the motion system platforms with respect to each of the print head devices 2505A, 2505B, and 2505C of the print head assembly 2500. The first motion system platform 2800A can support a first X-axis motion system platform 2810A that may have a first X-axis linear rail system 2820A. The first X-axis linear rail system 2820A can move various apparatuses mounted on the first X-axis motion system platform 2810A in a direction perpendicular to the direction of the first motion system platform 2800A on the linear rail system 2705. Similarly, the second motion system platform 2800B can support a second X-axis motion system platform 2810B that may have a second X-axis linear rail system 2820B. The second X-axis linear rail system 2820B can move various apparatuses mounted on the second X-axis motion system platform 2810B in a direction perpendicular to the direction of the second motion system platform 2800B on the linear rail system 2705. In that regard, the X, Y motions of the first motion system platform 2800A and the first X-axis motion system platform 2810A, as well as the X, Y motions of the second motion system platform 2800B and the second X-axis motion system platform 2810B, can provide accurate X, Y positioning of various devices and apparatuses with respect to each of the print head devices 2505A, 2505B, and 2505C.

[0060] As depicted in FIG. 2C, various devices mounted on the first X-axis motion system platform 2810A of the first motion system platform 2800A can include purge containers 2707A, 2707B, and 2707C for the respective printhead devices 2505A, 2505B, and 2505C, and a pick-up station 2709. In FIG. 2C, a first droplet measurement module 2711A mounted on the first X-axis motion system platform 2810A of the first motion system platform 2800A, and a second droplet measurement module 2711B mounted on the second X-axis motion system platform 2810B of the second motion system platform 2800B are depicted for providing calibration information. The first droplet measurement system 2711A can be based on, for example, but not limited to, printing droplets from each nozzle of each printhead of each printhead device onto a film under defined conditions and then imaging the film. Information such as droplet volume, velocity, and trajectory can be obtained through image analysis of the data thus acquired. Alternatively, the second droplet measurement system 2711B can be based on, for example, but not limited to, an optical measurement system. For example, the droplet volume, velocity, and trajectory of each droplet from each nozzle of each printhead of each printhead device can be determined using laser light scattering such as phase Doppler analysis (PDA) and phase Doppler interferometry (PDI).

[0061] FIG. 3 depicts a Y-axis motion system according to the present teachings depicted in FIG. 3 as mounted on a Y-axis beam 2350, which can be, for example, a granite beam. As depicted in a coordinate system, a substrate such as 2050 mounted on a floating table 2200 can travel in the + / - Y-axis direction. While the floating table 2200 provides a frictionless low-particle generation substrate support for the substrate 2050 at a precise Z-axis flying height, the Y-axis motion system 2600 provides a frictionless low-particle Y-axis conveyance of the substrate 2050 with respect to a printhead assembly such as the printhead assembly 2501 of FIG. 1C.

[0062] Various embodiments of the low particle generation Y-axis motion system of the present teachings utilized in conjunction with a floating table can be compared, for example, to a chuck mounted on a large turntable. In the case of a chuck mounted on a large turntable, a large motor would be required for the operation of the large turntable, resulting in significant heat dissipation and particle generation due to the movement of solid parts against solid parts. In the case of various embodiments of the gripper systems of the present teachings, any linear motor required for Y-axis movement is substantially smaller than that for a chuck mounted on a turntable, such that only the inertia within the system is the mass of the substrate and the gripper assembly.

[0063] In addition, the inventors have discovered that the Y-axis beam 2350 can generate a misalignment during travel that may be unacceptable for the intended use for the accuracy of the orientation of the substrate with respect to the theta Z (θ-Z) axis during Y-axis travel, even if manufactured to provide a surface that is both flat and highly parallel. For example, without limitation, printing ink into the pixels of an OLED device substrate is a process that requires precise alignment of the substrate along the axis of travel where a beam manufactured with high tolerances of flatness and parallelism can still generate an unacceptable misalignment of the substrate orientation during travel. Accordingly, various embodiments of the Y-axis motion system 2600 of the present teachings that utilize an air bearing motion system for transporting the Y-axis carriage assembly 2620 provide reliable and accurate low particle generation Y-axis transport of the substrate, provide operation at high speeds with rapid acceleration and deceleration, and can eliminate the need for dissipation of excessive heat contamination within the gas enclosure system. Additionally, the gripper motion control assembly 2650 of the Y-axis motion system 2600 can provide a dynamic rotation of the orientation of the substrate about the theta Z (θ-Z) axis during Y-axis travel so as to maintain a high degree of accuracy for the orientation of the substrate parallel to the axis of travel. Accordingly, the gripper motion control assembly 2650 of the Y-axis motion system 2600 can maintain the substrate orientation parallel to the Y-axis travel direction with a high degree of accuracy, for example, within a horizontal plane determined by the flying height of the substrate.

[0064] As shown in FIG. 3, various embodiments of the linear Y-axis motion system 2600 can include a substrate gripper assembly 2610, a Y-axis carriage assembly 2620, and a gripper motion control assembly 2650. In FIG. 3, the gripper assembly 2610 can include a substrate gripping surface such as a vacuum chuck bar 2612 that can be supported, for example, but not limited to, on a substrate gripper frame 2614. The substrate gripper frame 2614 can be mounted to the Y-axis carriage assembly 2620 of the Y-axis motion system assembly 2600. In FIG. 3, the first air bearing pack 2628A and the second air bearing pack 2628B of the Y-axis carriage assembly 2620 are shown mounted on a first saddle arm 2622A and a second saddle arm 2622B, respectively, which are part of a plurality of air bearings that support the Y-axis carriage assembly 2620. The Y-axis carriage assembly 2620 can be translated in the + / -Y-axis directions using a brushless linear motor. As will be discussed in more detail later in this specification, the gripper motion control assembly 2650 can utilize dual voice coil motor assemblies such as voice coil motor assemblies 2630A and 2630B, and a pivotal assembly 2660. Various embodiments of the gripper motion control assembly can include at least one voice coil motor and an air bearing centered pivot, along with a position sensor and a motion controller. Various embodiments of the Y-axis motion system of the present teachings based on voice coil motors are highly reliable and can provide an alignment accuracy of less than 1 micron. Additionally, the direct connection of the substrate to such a gripper assembly of the Y-axis motion system uses a linear brushless motor for the conveyance of the Y-axis carriage assembly 2620 to enable a frictionless high-speed operation with rapid acceleration and rapid deceleration, and to enable a dynamic rotation of the orientation of the substrate around the theta Z (θ-Z) axis during Y-axis travel using the gripper motion control assembly 2650 to maintain a high degree of accuracy for the substrate orientation parallel to the travel axis.Accordingly, various embodiments of the Y-axis motion system utilizing an air bearing gripper system can provide precision low-particle generation conveyance of a substrate 2050 supported on a floating table 2200 through a printing system such as the printing system 2000 of FIG. 1C. Such a frictionless Y-axis motion system for moving the substrate can utilize either one or two Y-axis rails. The service bundle carrier 2430 can be used for the management of various service bundles, including, but not limited to, optical cables, electrical cables, wires, tubing, and the like. Various embodiments of the service bundle according to the present teachings can be connected to the printing system to provide the various optical, electrical, mechanical, and fluid connections required to operate the functioning printing system.

[0065] Figure 4A is a top view of the Y-axis motion system 2600 showing the gripper assembly 2610, the top plate 2624 of the Y-axis carriage assembly, and the gripper motion control assembly 2650. The gripper assembly 2610 can include a vacuum chuck bar 2612 mounted on a gripper frame 2614. The top plate 2624 of the Y-axis carriage assembly has a first end 2623 and a second end 2625 and is depicted in Figure 4A. The gripper assembly 2610 and the Y-axis carriage assembly 2620 can be joined through sub-assemblies of the gripper motion control assembly 2650. For example, a first voice coil assembly 2630A and a second voice coil assembly 2630B each have first and second voice coil housings 2632A and 2632B that can be fixed to the Y-axis carriage assembly 2620 on one side of the voice coil assembly housing and to the gripper assembly 2610 on the opposite side of the voice coil housing. Additionally, the central pivot 2660 can include an air bearing housing 2662 that can be fixed to a protrusion 2616 of the gripper assembly 2610. Figure 4B is a partial top view of the air bearing Y-axis motion system 2600 of Figure 4A depicting an enlarged top view of the second end 2625 of the Y-axis motion system 2600. In Figure 4B, an enlarged top view of the gripper assembly 2610, as well as an enlarged top view of the voice coil assembly 2630B, are particularly visible. Various embodiments of the vacuum chuck bar 2612 mounted on the gripper frame 2614 can include a plurality of vacuum sockets 2613, three of which are shown in Figure 4B. The vacuum sockets 2613 are spaced at intervals along the length of the vacuum chuck bar 2612 such that the vacuum chuck bar 2612 can easily engage and disengage the substrate, eliminating the need for two-sided mechanical gripping of the substrate such as the need for a two-finger or three-finger gripping device. In addition to the first air bearing pack 2628A and the second air bearing pack 2628B of Figure 3 for supporting the Y-axis carriage assembly 2620, a second upper pack 2628D can be mounted on the underside of the top plate 2624 of the Y-axis carriage assembly (see Figures 3 and 4B).A first upper pack (not shown) can be symmetrically mounted proximal to the first saddle arm 2622A and below the opposing first end 2623 of the top plate 2624 of the Y-axis carriage assembly (see FIG. 4A).

[0066] As will be discussed in more detail herein, in addition to the air bearing pack for supporting the Y-axis carriage assembly 2620, the voice coil air bearing 2641 of the second voice coil assembly 2630B depicted in FIG. 4B, together with a voice coil air bearing (not shown) associated with the first voice coil assembly 2630A (see FIG. 4A), can be utilized for the vertical stabilization of the gripper assembly 2610. In the top view rendering of FIG. 4B, a single air bearing is visible. As a preload for the voice coil air bearings within voice coil assemblies such as the voice coil assemblies 2630A and 2630B of FIG. 4A, the required system stiffness can be ensured. As depicted in the top view of FIG. 4B, various embodiments of the Y-axis motion system of the present teachings can include a single air bearing. Various embodiments of systems and methods that utilize a single air bearing within a voice coil assembly can apply a preload to the air bearing using, for example, but not limited to, gravity, vacuum, or magnetic preload. Various embodiments of the Y-axis motion system may utilize an opposing second air bearing to provide a bearing preload. Various embodiments of the voice coil motor assembly of the present teachings, such as the voice coil assembly 2630B of FIG. 4B, can include a voice coil housing 2633B that can be joined to the Y-axis carriage 2620. As will be discussed in more detail herein, the voice coil gripper frame-mounted block 2648B of the voice coil assembly 2630B can be used to attach the voice coil assembly to the gripper frame 2614. The voice coil assembly 2630B can also include a voice coil shaft 2634B that can have a pivot screw 2635B and a retaining screw 2636B, as well as a set screw 2637B. Additionally, the voice coil assembly 2630B can have a linear encoder 2638B. Finally, the central pivot 2660 is an air bushing configured to provide a rotation axis for reliable and accurate theta Z (θ-Z) rotation for embodiments of the gripper motion control system 2650 of the present teachings.The components of the voice coil assembly 2630B are described, but the voice coil assembly 2630A can be described in the same way.

[0067] Figure 5A is an isometric view of a carriage assembly, a gripper motion control assembly, and a gripper assembly of a Y-axis motion system according to various embodiments of the systems and methods of the present disclosure. As depicted in Figure 5A, Figure 5A depicts a Y-axis carriage assembly 2620 with first and second saddle arms 2622A and 2622B, respectively, with the saddle arms having a first pack 2628A and a second pack 2628B mounted thereon, respectively, such that the packs are proximal to the Y-axis beam 2350 (see Figure 3). The first and second saddle arms 2622A and 2622B, and the Y-axis carriage assembly side frame 2626, can be joined to the Y-axis carriage assembly top plate 2624. The Y-axis carriage assembly side frame 2626 can have a first side 2627 proximal to the Y-axis beam 2350 (see Figure 3) and a second side 2629 proximal to the gripper frame 2614. The gripper motion control assembly 2650 can include first and second voice coil assemblies 2630A and 2630B, respectively, and a central pivot assembly 2660. As previously discussed herein, the gripper motion control assembly 2650 is joined to both the Y-axis carriage assembly 2620 and the gripper assembly 2610, thereby effectively joining the Y-axis carriage assembly and the gripper assembly (see also Figure 4B). When a substrate, such as the substrate 2050 of Figure 3, is held by a vacuum chuck bar 2612 mounted to the gripper frame 2614, as the Y-axis carriage assembly 2620 travels across the Y-axis beam 2350, a dynamic angle (θ-Z) adjustment can be made to the substrate by the gripper motion control assembly 2650 to compensate for the effects of beam imperfections (see Figure 3). Thus, the substrate during Y-axis travel can be maintained with high accuracy with respect to the orientation of the substrate about the theta Z (θ-Z) axis during Y-axis travel using the gripper motion control assembly 2650 to maintain a high degree of accuracy for the orientation of the substrate parallel to the travel axis. Various embodiments of the gripper motion control assembly 2650 can maintain the orientation of the substrate within + / -4300 microradians parallel to the traveling Y-axis.Therefore, the gripper motion control assembly 2650 of the Y-axis motion system 2600 can maintain the substrate orientation parallel to the Y-axis travel direction with high precision, for example, in the horizontal plane determined by the flying height of the substrate.

[0068] FIG. 5B depicts a longitudinal perspective view through the Y-axis carriage assembly 2620 of FIG. 5A, generally illustrating the gripper assembly 2610 mounted on the Y-axis carriage assembly 2620. In FIG. 5B, the first and second voice coil motor assemblies 2630A and 2630B, as well as the vacuum chuck bar 2612 and the central pivot 2660 on the gripper frame 2614, are shown respectively. In FIGS. 3 and 5A, the first air bearing pack 2628A and the second air bearing pack 2628B of the Y-axis carriage assembly 2620 are shown. In FIG. 4B, the first and second air bearing packs under the top plate 2624 of the Y-axis carriage assembly were described. As shown in FIG. 5B, the side frame 2626 of the Y-axis carriage assembly can have a plurality of air bearing packs mounted thereon, such as from the air bearing pack 2628E to 2640H. In addition to the saddle arm of the carriage assembly proximal to the Y-axis beam 2350 and the air bearing packs located on the top plate, the plurality of air bearing packs mounted on the side frame 2626 of the Y-axis carriage assembly can provide bearing support between the side frame 2626 and the corresponding side of the Y-axis beam 2350. For example, generally, various embodiments of the Y-axis motion system of the present disclosure illustrated in FIGS. 3 to 5B can provide low-particle-generation and low-heat-generation transportation of the substrate through the printing system.

[0069] Figure 6 depicts a second side 2627 of the Y-axis carriage assembly side frame 2626, which is the proximal side of the gripper frame 2614, and generally illustrates a Y-axis movement system sub-assembly including a gripper motion control assembly 2650 without the gripper frame 2614 mounted thereon. The first and second voice coil assemblies 2630A and 2630B can be mounted at opposing upper ends of the second side 2627 of the Y-axis carriage assembly side frame 2626, while the central pivot 2660 can be mounted within the uppermost central portion of the second side 2627 of the Y-axis carriage assembly side frame 2626. The first and second voice coil assemblies 2630A and 2630B can each include a first voice coil assembly shaft 2634A and a second voice coil assembly shaft 2634B, as well as a first voice coil assembly housing 2632A and a second voice coil assembly housing 2632B. Each of the first voice coil assembly shaft 2634A and the second voice coil assembly shaft 2634B can have set screws, namely, a first voice coil assembly set screw 2635A and a second voice coil assembly set screw 2637B respectively, and each set screw has a shank extending into voice coil assembly set screw holes 2621A and 2621B respectively. Additionally, as depicted in Figure 6, each voice coil assembly shaft, namely, the first voice coil assembly shaft 2634A and the second voice coil assembly shaft 2634B, can have a pivot screw and a retaining screw, namely, a pivot screw 2635A and a retaining screw 2636A for the first voice coil assembly shaft 2634A, and a pivot screw 2635B and a retaining screw 2636B for the first voice coil assembly shaft 2634B. With respect to the initial adjustment of the horizontal position of the gripper assembly and the substrate relative to the floating table for the first and second voice coil assemblies 2630A and 2630B, the pivot screws and the retaining screws can be loosened until the horizontal position of the gripper assembly and the substrate is correctly adjusted, and then the pivot screws and the retaining screws are tightened.Equal adjustment of the voice coil assemblies 2630A and 2630B can be done by adjusting the position of the gripper assembly in + / -Z with respect to the floating table (see Figure 3). On the other hand, unequal adjustment of the voice coil assemblies 2630A and 2630B can be done by adjusting the position of the gripper assembly in theta X (θ-X) with respect to the floating table (see Figure 3). As previously discussed herein, various embodiments of the voice coil assemblies of the present teachings utilize a pair of air bearings, an upper or top air bearing such as air bearing 2640A of the first voice coil assembly 2630A and air bearing 2641A of the second voice coil assembly 2630B, and opposing bottom air bearings such as air bearing 2640B of the first voice coil assembly 2630A and air bearing 2641B of the second voice coil assembly 2630B. Each bottom air bearing is used to apply a preload to each upper or top air bearing.

[0070] Figure 7A generally illustrates an isometric view of a voice coil assembly according to the present teachings. The voice coil assembly can include a voice coil housing 2632, which can have a first side surface 2631 of a first voice coil housing and a second side surface 2633 of an opposing voice coil housing, and a voice coil shaft 2634. The voice coil shaft 2634 can include a pivot screw 2635, a retaining screw 2636, and a set screw 2637, all of which can be used in the initial vertical adjustment of the gripper assembly relative to the floating table as previously discussed herein with respect to FIG. 6. In FIG. 7B, the pivot screw 2635 and the retaining screw 2636 have been removed so that pivoting through a hole 2645 that houses the pivot screw 2635 and through a slot 2646 that houses the retaining screw 2636 can be seen. The voice coil assembly 2630 can have a pair of air bearings, such as an upper air bearing 2642A and an opposing or lower air bearing 2642B, where the lower air bearing is used to apply a preload to the upper air bearing. The voice coil assembly 2630 can include a voice coil gripper frame mounting block 2648 that can be used to attach the voice coil assembly to the gripper frame (see FIG. 4B). Additionally, the voice coil assembly of the present teachings can include a linear encoder 2638 oriented in the X direction. Various embodiments of the Y-axis motion system of the present teachings enable the voice coil to be oriented within 1 to 2 microns in the X direction relative to the carriage assembly, and utilize a linear encoder head to provide dynamic adjustment in theta Z (θ-Z) during the conveyance of the substrate on the Y-axis beam using various embodiments of the Y-axis motion system of the present teachings. Additionally, for various embodiments of the gripper motion control assembly 2650 of FIG. 6, a master-slave control system can be used to control the first voice coil assembly 2630A and the second voice coil assembly 2630B of FIG. 6 such that when one voice coil responds to correct a theta Z (θ-Z) orientation, the other voice coil is controlled in an equal and canceling manner.Various embodiments of the gripper motion control assembly 2650 can maintain the orientation of the substrate parallel to the Y-axis of travel within + / - 4300 micro-radians. Thus, the gripper motion control assembly 2650 of the Y-axis motion system 2600 can maintain the substrate orientation parallel to the Y-axis direction of travel with high precision, for example, in the horizontal plane determined by the flying height of the substrate.

[0071] FIG. 8 is a top view of the Y-axis motion system 2600 showing the gripper assembly 2610, the top plate 2624 of the Y-axis carriage assembly, and the gripper motion control assembly 2650, similar to FIG. 4A which shows the positions of the cross-sectional views of FIGS. 8 and 9.

[0072] FIG. 9 generally illustrates a cross-section through the voice coil assembly, specifically designated as FIG. 8 as a cross-section through voice coil assembly 2630B, although any description given herein with respect to the cross-section of FIG. 9 is equally applicable to voice coil assembly 2630A. Voice coil gripper frame mounted block 2648B is positioned between first air bearing 2641A and second air bearing 2641B of voice coil assembly 2630B and depicted in FIG. 9. Each of first air bearing 2641A and second air bearing 2641B is associated with air bearing spherical pivot portions 2643A and 2643B, respectively. Air bearing spherical pivot portion 2643A associated with first air bearing 2641A and air bearing spherical pivot portion 2643B associated with first air bearing 2641B allow each air bearing to float at theta X (θ-X) and theta Y (θ-Y) such that first air bearing 2641A and second air bearing 2641B remain in a parallel arrangement with respect to mounted block 2648B. In addition to being positioned between first air bearing 2641A and second air bearing 2641B, voice coil gripper frame mounted block 2648B is also attached to voice coil holder 2647. Voice coil holder 2647 and voice coil magnet base are housed inside the second side 2633 of the voice coil housing. Voice coil holder 2647 is depicted in FIG. 9 as being associated with coil magnet base 2649. During operation, the force of movement of voice coil magnet base 2649 is transferred to voice coil magnet holder 2647, which is transferred to voice coil gripper frame mounted block 2648B and thence to gripper frame 2614. As previously discussed herein, various embodiments of gripper motion control assembly 2650 can use master-slave control of the two voice coil assemblies such that the two voice coils act in synchrony to maintain the gripper assembly orientation with respect to the direction of travel. Also depicted in FIG. 9 is vacuum manifold 2618 of gripper assembly 2610 in fluid communication with vacuum groove 2617.As depicted in FIG. 9, the plurality of vacuum sockets depicted in FIG. 4B can be in fluid communication with a vacuum manifold 2618 via a vacuum groove 2617.

[0073] FIG. 10 generally illustrates a cross-sectional view through a central pivot assembly 2660 as designated in FIG. 8. The pivot assembly 2660 can include an air bearing housing 2662 that can house a first 2664A and a second air bearing 2664B. The first air bearing 2664A and the second air bearing 2664B can be configured around a central shaft 2666, and the use of the two air bearings imparts the required system rigidity. The first air bearing 2664A and the second air bearing 2664B can be machined from a porous material such as porous graphite to ensure that an even gas flow, such as an inert gas, can be evenly distributed around the central shaft 2666. The central shaft 2666 can be held by an upper clamp 2665 and a lower clamp 2667 that can be fixed to the carriage assembly top plate 2624. The central pivot adapter plate 2669 can be configured to attach the air bearing housing 2662 to the gripper frame 2614. In that regard, any theta Z (θ-Z) rotation of the air bearing assembly 2660 as a result of carriage assembly movement will be transferred to the gripper assembly 2610 in response. Also depicted in FIG. 10 are the carriage assembly air bearing 2638D (see FIG. 4B) and the carriage assembly air bearing 2638H (see FIG. 5B).

[0074] As previously discussed herein, maintaining a controlled environment within a printing enclosure is of paramount importance for various processes associated with the manufacture of various OLED devices. According to various embodiments of the gas enclosure system of the present teachings, environmental control of the internal volume defined by the gas enclosure assembly can include, for example, control of illumination by the number and placement of light of specific wavelengths, control of particulate matter using various embodiments of a particle control system, control of reactive gas species using various embodiments of a gas purification system, and temperature control of the gas enclosure assembly using various embodiments of a thermal regulation system, as will be discussed in more detail later herein. One aspect of thermal regulation relates to minimizing the thermal load within the enclosed printing system, as provided, for example, by the design of a Y-axis motion system as previously described herein.

[0075] In addition to the Y-axis motion system, with respect to the schematic shown in FIG. 11, minimizing the thermal load can also include minimizing the thermal load on the motor used to control the movement of the Z-axis moving plate by utilizing pneumatic balance. In FIG. 11, a control loop 100 can be used to ensure that the currently driven Z-axis motor 2305 can be optimized during operation, since increasing the current to the Z-axis motor 2305, especially when under load, will cause the motor temperature to rise. One disadvantage of such motor heating can be a loss of printing accuracy due to thermal expansion of the motor and motor assembly. In addition, as previously described herein, control of heat dissipation is one aspect of the environmental control of the enclosed printing system. Thus, the control loop 100 of FIG. 11 is shown to include a pneumatic balance system 2309 that can provide an automatic balancing force against the load to minimize the motor current and thereby compensate for the load on the Z-axis motor 2305 by minimizing motor heating.

[0076] In FIG. 11, Z cmdThe input 105 is the commanded Z-axis position of printhead assemblies such as the first printhead assembly 2501 and the second printhead assembly 2502 of FIG. 1C. Referring to FIG. 1C, it should be recalled that the first printhead assembly 2501 and the second printhead assembly 2502 can be mounted on the first Z-axis moving plate 2310 and the second Z-axis moving plate 2312, respectively. The first Z-axis moving plate 2310 and the second Z-axis moving plate 2312 are mounted on the first X-axis carriage assembly 2301 and the second X-axis carriage assembly 2302, respectively. In that regard, each printhead assembly can be positioned in the X and Z directions relative to a substrate such as the substrate 2050 of FIG. 1C. For example, but not limited to, during an exemplary process step such as a printing process, Z cmd The input 105 can be received by the motor controller C M 110, and the current associated with the commanded Z-axis position i cmd 115 can be sent to the motor drive D120 so that the Z-axis linear motor 2305 can move Z-axis moving plates such as the first Z-axis moving plate 2310 and the second Z-axis moving plate 2312 of FIG. 1C. The exact position of the Z-axis moving plate in the Z-axis direction can be measured using the encoder 2303, and then information regarding the exact Z-axis position can be fed back into the motor controller C M 110 until the commanded position is reached. In addition, i cmd 115 can be sent to a low-pass filter LP130 that can filter current spikes and, in addition, act to gate-control the controller response. The low-pass filter output 135 can be sent to the pneumatic controller C P 140. Then, the pneumatic controller C P 140 can optimize i cmd 115 to the equilibrium pressure P CBcan be calculated. Exemplary process steps, such as, but not limited to, during docking of the printhead assembly to a docking gasket as previously discussed herein, the sealing force F as shown in FIG. 11 S requires a motor force F to counteract it M There is. The extra motor force requires an increased motor current that allows the seal to be maintained but can result in increased heating of the motor

[0077] As depicted in FIG. 11, an air pressure balancing force F to minimize motor heating that would result from an increasing current to maintain the motor force F during sealing of the printhead assembly to the docking gasket M can be utilized. The vertical sealing force F CB can be detected by continuously detecting the current of the motor 2305. The magnitude and direction of the sealing force F S can be calculated and reported to an air pressure controller C S 140 that can calculate the required air pressure counterforce and transmit a commanded equilibrium pressure P CB 145 to a pressure regulator R150. The pressure regulator R150 can then supply a commanded pressure to an air pressure balancing system 2309 to exert an air pressure counterforce F P According to the present teachings, the control loop 100 acts in such a manner that the sum of all forces, namely, the sealing force F CB , the inherent tooling environment F S , the air pressure counterforce F E , the motor force F CB , and the gravity F M employed on the Z-axis assembly is zero G .

[0078] FIG. 12A depicts a printing system 2000 showing a first X-axis carriage assembly 2301 and a second X-axis carriage assembly 2302 on which no printhead assembly is mounted. In FIG. 12B, a front view of the X-axis carriage assembly 2301 mounted on a bridge 2130, where a pneumatic balance system 2309 can include a first pneumatic cylinder 2307A and a second pneumatic cylinder 2307B, is depicted. Although an example of the use of the control loop 100 was given for the process of docking a gasket and a printhead assembly, the control loop 100 can be utilized for a number of purposes. For example, during a printing operation, a pneumatic balance system such as the pneumatic balance system 2309 can operate to support the Z-axis movement plate and any associated load in response to various embodiments of the pneumatic balance control loop to minimize the current to the motor 2305 in FIG. 11 during printing. Additionally, various embodiments of the pneumatic balance control loop such as the control loop 100 in FIG. 11 can be used for monitoring parameters of the printing system. For example, the air slide of the Z-axis movement plate changes over time and can generate increased friction due to wear and aging. The increased load on the Z-axis movement plate motor as a result of the increased friction can be offset using various embodiments of the pneumatic balance control loop and related systems. As another non-limiting example, the change in pressure monitored by the pneumatic controller C P can be monitored as a quality measurement criterion to initiate unscheduled maintenance on the Z-axis motion system before a failure becomes apparent. Although some examples were given with respect to specific carriage assemblies, it should be noted that various embodiments of the pneumatic balance control loop and related systems are generally applicable to any carriage assembly and any load of the present teachings.

[0079] As depicted in FIG. 13, the gas enclosure 1000A can house the printing system 2000A. While the gas enclosure system 500A has features as described for the various embodiments of the gas enclosure system 500 of FIG. 18, the printing system 2000A can have all the features described for the printing system 2000 of FIG. 17. The printing system 2000A can have a printing system base 2100 that can be supported by at least two sets of isolators, such as isolator set 2110 including isolators 2110A and 2110B of FIG. 13. The Y-axis motion system 2350 can be mounted on the printing system base 2100. The substrate 2050 can be floatingly supported by a substrate floating table 2200. The printing system base 2100 can support a first riser 2120 and a second riser 2122 on which a bridge 2130 can be mounted. The printing system bridge 2130 can support a first X-axis carriage assembly 2301 on which a print head device assembly 2500 can be mounted and a second X-axis carriage assembly 2302 on which a camera assembly 2550 can be mounted. Additionally, the gas enclosure 1000A can have an auxiliary panel assembly 1330 that can enclose a print head management system 2701 and a waste containment system for a bulk ink delivery system. The auxiliary panel assembly 1330 can be in fluid communication with the remainder of the working volume of the gas enclosure 1000A through a print head assembly opening 1342. The various embodiments of the bulk ink delivery system can be external to the gas enclosure 1000A and can be in fluid communication with the various embodiments of a local ink delivery system that can be proximal to the print head device assembly 2500 on the first X-axis carriage assembly 2301.

[0080] FIG. 14 is a schematic diagram of various embodiments of a bulk ink delivery system 3300 that can be in fluid communication with a local ink delivery system 3500. A bulk ink delivery system (BIDS) 3300 is in fluid communication with a first ink source by a first BIDS ink supply line L B1 and can have a bulk ink supply system 3310 that can include a second BIDS ink supply line L B2 in fluid communication with a second ink source. The first BIDS ink supply line L B1 and the second BIDS ink supply line L B2 can each have a first BIDS ink supply safety valve V B1 and a second BIDS ink supply safety valve V B2 The first BIDS ink supply safety valve V B1 and the second BIDS ink supply safety valve V B2 can be used, for example, to isolate the first and second ink supply sources from the upstream line when the ink supply container needs to be replaced or refilled. The first BIDS ink supply valve V B3 is open when the first ink supply container, Ink 1 is in use. Similarly, the second BIDS ink supply valve V B4 is open when the second ink supply container, Ink 2 is in use.

[0081] Although two ink supply sources are shown in FIG. 14, a plurality of ink supply containers can be included in the bulk ink supply system 3310 and can serve as sequential supply sources for the ink. For example, as shown in FIG. 14, when the ink level of the first ink supply container, Ink 1 is at the low level indicator, the first BIDS ink supply safety valve V B1 can be closed so that the first ink supply container, Ink 1 can either be isolated and refilled or replaced, and the first BIDS ink supply valve V B3can be closed. Following the isolation of Ink 1, a second ink supply container, Ink 2, can serve as an ink supply source for a gas enclosure system such as the gas enclosure system 500A of FIG. 13, and a second BIDS ink supply safety valve V B2 can be opened, and a second BIDS ink supply valve V B4 can be opened. The first BIDS ink supply line L B1 and the second BIDS ink supply line L B2 can be joined at a T-junction using two valves as shown in FIG. 14, or a three-way valve can be used. Either the first BIDS ink supply line L B1 or the second BIDS ink supply line can be in fluid communication with a third BIDS line L B3 depending on which ink supply source is in use. The third BIDS line L B3 can be in fluid communication with a first BIDS pump P B1 which can be a pneumatic piston syringe or metering pump compatible with the chemical properties of the ink being used. During a process requiring ink flow from the bulk ink supply system 3310, a fifth BIDS valve V B5 is in the open position, allowing flow between the third BIDS line L B3 and a fourth BIDS line L B4 . The fourth BIDS line L B4 passes through a filter 3312 and is in fluid communication with a degassing device to remove dissolved gas in the ink from the bulk within the source of the bulk ink supply system 3310, and is in fluid communication with a fifth BIDS line L B5 . Finally, after degassing, the ink can flow through a sixth BIDS line L B6 which is in fluid communication with the local ink delivery system 3500. The sixth BIDS line L B6 can be controlled at the outlet by a sack-back valve located within the local ink delivery system 3500 as shown in FIG. 14.

[0082] In addition to the bulk ink supply system 3310, the bulk ink delivery system 3300 can include a solvent line, i.e., the seventh BIDS solvent line L B7 , and an inert gas line, i.e., the eighth BIDS gas line L, depicted in FIG. 14 as utilizing a nitrogen source, and can have a BIDS maintenance system 3330. The seventh BIDS solvent line L B8 can be in fluid communication with a second BIDS pump P, which can be a pneumatic piston syringe or a metering pump compatible with the chemical properties of the solvent being used. The seventh BIDS solvent line L B7 and the eighth BIDS gas line L B2 can each have a first BIDS maintenance system safety valve V and a second BIDS maintenance system safety valve V B7 that are normally in a closed position during processing but can be selectively opened, for example, but not limited to, during maintenance procedures. For example, during maintenance procedures, the BIDS valves associated with the bulk ink supply system 3310, i.e., BIDS valves V B8 from V B6 to V B7 will remain in the closed position. If a maintenance procedure utilizing the solvent is implemented, the BIDS valves V B1 to V B5 can be opened so that the solvent line, i.e., the seventh BIDS solvent line L B7 can be in fluid communication with the sixth BIDS line L that is in fluid communication with the local ink delivery system 3500 as previously described. In addition, if an inert gas is utilized during a maintenance procedure, the BIDS valves V B6 to V B6 and V B8 to V B10 can be opened so that the inert gas line, i.e., the eighth BIDS gas line L B8 can be in fluid communication with the sixth BIDS line L that is in fluid communication with the local ink delivery system 3500 as previously described. B6 to V B7 and V B9 to V B10can be opened. Similar to that described for the bulk ink supply system 3310, the seventh BIDS solvent line L B7 and the eighth BIDS gas line L B8 can be joined at a T-junction using two valves as shown in FIG. 14 so as to be in fluid communication with the ninth BIDS line L B9 . Note that similarly, the third BIDS line L B3 and the ninth BIDS line L B9 can be joined at a T-junction using two valves as shown in FIG. 14 so as to be in fluid communication with the fourth BIDS line L B4 . In either case, a three-way valve can be used in a manner equivalent to a T-junction using two valves.

[0083] As depicted in FIG. 14, the local ink delivery system 3500 according to various systems and methods of the present teachings can include a local ink supply system 3600, a printhead ink delivery system 3700, and a local ink waste assembly 3800. For various embodiments of the present teachings, the local ink supply system 3600 can be in fluid communication with the bulk ink delivery system 3300 via the sixth BIDS line L B6 , while the local ink waste assembly 3800 can be in fluid communication with the bulk ink delivery system waste assembly 3340 through the tenth BIDS line L B10 . The tenth BIDS line L B10 can have a third BIDS pump P B3 which can be a pneumatic piston syringe or a metering pump compatible with the waste chemicals removed from the printhead ink delivery system 3700.

[0084] FIG. 15 shows a schematic diagram of various embodiments of a bulk ink delivery system 3301. The bulk ink delivery system 3301 can be in fluid communication with a local ink delivery system 3501. Regarding various embodiments of the bulk ink delivery system 3301, pump P B1 can be a metering pump that can effectively deliver both liquid and gaseous fluids. In that regard, both the bulk ink supply system 3311 and the maintenance system 3331 of the bulk ink delivery system 3301 can utilize the metering pump P B1 for flow control. As depicted in FIG. 15, the metering pump P B1 provides a controllable manifold system having three input lines, along with the possibility of three output lines, all of which are controlled using metering pump valves as shown in their entirety, two of which are shown in FIG. 15. The number of controllable input and output lines can vary according to various embodiments of the metering pump. Various embodiments of the metering pump utilized in embodiments of the bulk ink delivery system of the present teachings can have attributes including, but not limited to, the ability to control both liquid and gaseous fluids, a corrosion-resistant polymer surface in contact with the fluid flow to prevent corrosion and contamination, zero dead volume connections to prevent secondary contamination, a minimum hold volume for rapid setup using a minimum volume of various inks, and valves with suck-back capabilities. Thus, various embodiments of the bulk ink delivery system 3301 can utilize fewer valves and pumps than various embodiments of the bulk ink delivery system 3300 of FIG. 14.

[0085] The bulk ink delivery system (BIDS) 3301 of FIG. 15 can have a bulk ink supply system 3311 having a first BIDS ink supply line L B1 in fluid communication with a first ink source and a second BIDS ink supply line L B2 in fluid communication with a second ink source. The first BIDS ink supply line L B1 and the second BIDS ink supply line L B2are, as shown in FIG. 15, a first BIDS valve V that can be part of the assembly of the multi-port metering pump P B1 and a second BIDS valve V B1 which can be controlled by. In addition to providing flow control for the bulk ink supply system 3311, considering the ability of the metering pump P B2 to handle various different fluids with a minimum holding volume, the metering pump P B1 can also be used to controllably handle the maintenance system 3331. For example, in FIG. 15, a third BIDS solvent supply line L B1 can be in fluid communication with a solvent source, and a fourth BIDS gas supply line L B3 can be in fluid communication with an inert gas source, such as a nitrogen source as shown in FIG. 15. The third BIDS solvent supply line L B4 and the fourth BIDS gas supply line L B3 can be controlled by a third BIDS solvent supply valve V B4 and a fourth BIDS gas supply valve V B3 respectively. As depicted in FIG. 15, the third BIDS solvent supply line L B4 and the fourth BIDS gas supply line L B3 can be in fluid communication with a fifth BIDS line L B4 which can be controlled by a fifth BIDS maintenance system supply valve V B5 . The fifth BIDS maintenance system supply valve V B5 can be part of the assembly of the multi-port metering pump P B5 as shown in FIG. 15. The third BIDS solvent supply line L B1 and the fourth BIDS gas supply line L B3 can be joined at a T-junction using two valves or a three-way valve can be used, as shown in FIG. 15. The third BIDS solvent supply valve V B4 and the fourth BIDS inert gas supply valve V B3 and the fourth BIDS inert gas supply valve V B4As will be discussed in more detail later in this specification, it is normally in a closed position during processing but can be selectively opened during maintenance procedures.

[0086] First, for various embodiments of the system and method of FIG. 15, for example, before the printing procedure starts, ink priming through the manifold system of metering pump P B1 can be performed. For example, once the ink supply becomes available from the first ink supply container, Ink 1, while all other valves remain closed, the first BIDS ink supply line L B1 is primed with ink from Ink 1 by opening the first BIDS ink supply valve V B1 and the BIDS waste line valve V BW . With the valve state positioned as such, the first BIDS ink supply line L BW through the BIDS waste line L B1 can be primed between the first BIDS ink supply line L B1 and the bulk ink delivery system waste assembly 3341. After priming, for example, during the start of the printing process, while all other valves are closed, the first BIDS ink supply valve V B1 of the metering pump P B1 and the sixth BIDS valve V B6 can be opened. With the valve state positioned as such, the first ink supply container, Ink 1, is in fluid communication with the bulk ink delivery system 3301, which is in fluid communication with the local ink delivery system 3501. The second BIDS line L B2 can be similarly primed with ink from Ink 2, as exemplified for priming the first BIDS ink supply line L B1 .

[0087] Two ink supply sources are shown in FIG. 15, although a plurality of ink supply containers can be included in the bulk ink supply system 3311 and can serve as sequential ink supply sources. For example, as shown in FIG. 15, when the level of ink in the first ink supply container, Ink 1, is at the low level indicator, the first ink supply container, Ink 1, can either be isolated and refilled or replaced, and the metering pump P B1 of the first BIDS ink supply valve V B1 can be closed. Following the isolation of Ink 1, the second ink supply container, Ink 2, can serve as an ink supply source for a gas enclosure system such as the gas enclosure system 500A of FIG. 13, and the metering pump P B1 of the second BIDS ink supply valve V B2 can be opened. Either the first BIDS ink supply line L B1 or the second BIDS ink supply line L B2 can be in fluid communication with the sixth BIDS line L B6 depending on which ink supply source is in use. During a process that requires ink flow from the bulk ink supply system 3311, while all other valves are closed, the first BIDS ink supply valve V B1 of the metering pump P B1 and the sixth BIDS valve VB are opened to allow flow between the first BIDS ink supply line L B1 and the sixth BIDS line L B6 . The sixth BIDS line L B6 passes through a filter 3312 and is in fluid communication with a seventh BIDS line L B7 which, for example but not limited to, is in fluid communication with a degassing device to remove dissolved gas in the ink from the bulk within the supply source of the bulk ink supply system 3311. Finally, after the gas has been removed, the ink can flow through an eighth BIDS line L B8 which is in fluid communication with the local ink delivery system 3501. The sixth BIDS line L of the bulk ink supply system 3310 of FIG. 14B6 Unlike, the eighth BIDS line L B8 does not require a sack-back valve located within the local ink delivery system 3500 as shown in FIG. 14 when a metering pump such as the metering pump P of FIG. 15 B1 can provide such control.

[0088] As previously discussed herein, in addition to the bulk ink supply system 3311, the bulk ink delivery system 3301 of FIG. 15 can have a BIDS maintenance system 3331. The BIDS maintenance system 3331 can include a third BIDS solvent supply line L B3 and a fourth BIDS inert gas supply line L B4 respectively controlled by a third BIDS solvent supply valve V B3 and a fourth BIDS inert gas supply valve V B4 As depicted in FIG. 15, the third BIDS solvent supply line L B3 and the fourth BIDS gas supply line L B4 can be in fluid communication with a fifth BIDS line L B5 The fifth BIDS line L B5 can be controlled by a fifth BIDS maintenance system supply valve V of the metering pump P B1 In addition, with respect to the bulk ink delivery system of FIG. 15, the BIDS waste line L B5 can be in fluid communication with a bulk ink delivery system waste assembly 3341. The BIDS waste line L BW can be controlled by a BIDS waste line valve V of the metering pump P BW The third BIDS solvent supply valve V B1 the fourth BIDS gas supply valve V BW the fifth BIDS maintenance system supply valve V B3 and the BIDS waste line valve V B4 are normally in a closed position during processing but can be selectively opened during maintenance procedures. B5 BW BW BW

[0089] For example, during maintenance procedures, the metering pump P associated with the bulk ink supply system 3311 B1 's BIDS valve, i.e., BIDS valve V B1 , V B2 , and V B6 will remain in the closed position. When a maintenance procedure utilizing a solvent purge is implemented, the solvent pre - preparation can be performed through a fifth BIDS line L B5 that can be in fluid communication with the bulk ink delivery system waste assembly 3341, such that the BIDS valves V B3 , V B5 , and V BW can be opened. After the pre - preparation, for example, during a maintenance procedure that utilizes solvent flushing of lines within the local ink delivery system 3501, then the solvent can flow through a fifth BIDS line L B6 that is in fluid communication with a sixth BIDS line L B5 by closing the BIDS waste line valve V BW such that the BIDS valves V B3 , V B5 , and V B6 can be opened. The sixth BIDS line L B6 is in fluid communication with the local ink delivery system 3500 as previously described and provides a solvent flow through the entire local ink delivery system 3501 and ultimately through a ninth BIDS line L B9 to the bulk ink delivery system waste assembly 3341. Additionally, when a maintenance procedure utilizing an inert gas is implemented, the inert gas can flow through a fifth BIDS line L B6 that is in fluid communication with a sixth BIDS line L B5 by opening the BIDS valves V B4 , V B5 , and V B6 . The sixth BIDS line L B6 is in fluid communication with the local ink delivery system 3500 as previously described.

[0090] As depicted in FIG. 15, a local ink delivery system 3501 according to various systems and methods of the present teachings can include a local ink supply system 3601, a printhead ink delivery system 3701, and a local ink waste assembly 3801. For various embodiments of the present teachings, the local ink supply system 3601 can be in fluid communication with a bulk ink delivery system 3301 via an eighth BIDS line L B8 while the local ink waste assembly 3801 can be in fluid communication with a bulk ink delivery system waste assembly 3341 through a ninth BIDS line L B9 The ninth BIDS line L B9 can have a second BIDS pump P B2 which can be a pneumatic piston syringe or a metering pump adapted to the chemical nature of the waste removed from the printhead ink delivery system 3701.

[0091] FIG. 16 depicts a schematic cross-sectional view of a gas enclosure system 500A that can include a gas enclosure 1000A with a local ink delivery system 3500. As previously explained herein, a local ink delivery system 3500 according to various embodiments of the present teachings can include a local ink supply system 3600, a printhead ink delivery system 3700, and a local ink waste assembly 3800. As depicted in FIG. 16, a sixth BIDS line L E6 is a sack-back valve V P1It can be controlled by. In this regard, various embodiments of the bulk ink delivery system of the present disclosure can be in fluid communication with a dispensing reservoir that is in fluid communication with a plurality of print head devices such as the print head device 2505 of FIG. 1C, and can be in fluid communication with a bulk ink reservoir, and can directly carry ink supply to the bulk supply reservoir of the ink reservoir local ink supply system 3600. As discussed in more detail herein, various embodiments of the print head ink delivery system 3700 can utilize a two-stage ink delivery assembly. Also, the local ink waste assembly inside the gas enclosure can be in fluid communication with the bulk ink delivery system waste assembly that is part of the bulk ink delivery system. Therefore, various embodiments of the bulk ink delivery system, which can be substantially outside the gas enclosure system, can be in fluid communication with the local ink delivery system inside the gas enclosure system in a manner that avoids reaching the ink line up to a print head assembly such as the print head device assembly 2500 on the first X-axis carriage assembly 2301 of FIG. 1C through a cable carrier. Therefore, the bulk replenishment system, which is substantially outside the gas enclosure, is more easily accessible for repairs such as replenishing ink and solvent supplies and replacing lines that carry various inks and solvents.

[0092] FIG. 17 shows a local ink delivery including a print head ink delivery system according to the present disclosure. It is a schematic diagram of a delivery system. For various embodiments of the local ink delivery system of the present disclosure, the pneumatic control assembly IA can provide control between the primary dispensing reservoir IC and various pneumatic control sources such as gas and vacuum sources. According to various embodiments of the local ink delivery system of the present disclosure, the local ink delivery line IB may be capable of providing fluid distribution and control between the primary dispensing reservoir IC and the local bulk ink reservoir ID. The primary dispensing reservoir IC can be in fluid communication with a plurality of print heads IE through the input manifold line IF. In the schematic diagram of FIG. 17, three print heads are shown for each of the three print head device assemblies. The print head assembly input manifold line IF can be in fluid communication with the print head assembly input manifold IG. The print head assembly input manifold IG can be in fluid communication with each of the plurality of print head devices, and each print head device can have at least three print heads that are consecutive numbers from print head 1 to print head 9 in FIG. 17. The fluid communication between the print head assembly input manifold IG and each print head device can be controlled by using the print head assembly manifold valves IG V1 , IG V2 , and IG V3 . Finally, the plurality of print head assemblies can be in fluid communication with a print head assembly output waste line that is part of the print head output manifold IH. The print head assembly output waste line can be in fluid communication with a local ink waste assembly that is in fluid communication with a bulk ink delivery system waste assembly in turn (see, for example, FIGS. 14 and 15). The fluid communication between the print head assembly output manifold IH and each print head device can be controlled by using the print head assembly manifold line valves IH V1 , IH V2 , and IH V3 .

[0093] FIG. 18A is an enlarged bottom perspective view of a print head device assembly 2500 mounted on a print head assembly positioning system such as a first X-axis carriage assembly 2301 (see also FIG. 1C). The first X-axis carriage assembly 2301 can be positioned in the X-axis direction on a print system bridge 2130 with respect to a substrate such as the substrate 2050 of FIG. 1C. As shown in FIG. 18A, a service bundle housing 2410 is mounted on the print system bridge 2130. The service bundle housing 2410 can contain various service bundles that are operably connected from various devices and systems to a gas enclosure system including the print system. Various embodiments of the service bundles can include bundled optical cables, electrical cables, wires, tubing, and the like to provide optical, electrical, mechanical, and fluid functions for various assemblies and systems disposed within the interior of the gas enclosure system. During various process steps such as printing and maintenance steps, when the X-axis carriage assembly 2301 traverses the print system bridge 2130 to move the print head device assembly 2500, the various service bundles move accordingly. Thus, the liquid ink lines in such service bundles are subject to continuous bending and wear. According to the systems and methods of the present teachings, a bulk ink delivery system external to the gas enclosure system can be in fluid communication with a local ink delivery supply system within the gas enclosure system that eliminates the need to reach ink lines through service bundles located within the service bundle housing 2410. Thus, a bulk refill system that is substantially external to the gas enclosure is more easily accessible for refilling ink and solvent supplies and for repairs such as repairing or replacing various lines and valves.

[0094] As depicted in FIG. 18A, the printhead device assembly 2500 can have a printhead assembly enclosure 2503 that can enclose a plurality of printhead devices 2505A, 2505B, and 2505C mounted therein. For the various embodiments of the printing system 2000 of FIG. 1C or the printing system 2000A of FIGS. 13 and 16 For various embodiments, the printhead device assembly can include from about 1 to about 60 printhead devices, and each printhead device can have from about 1 to about 30 printheads therein. As depicted in FIG. 18A, according to the systems and methods of the present teachings, the printhead device assembly 2500 can have three printhead devices, and each printhead device can have three printheads (see also FIG. 17). As will be discussed in more detail herein, considering the number of printhead devices and printheads that require ongoing maintenance, the printhead device assembly 2500 can be positioned over a maintenance system for immediate placement or replacement of a printhead device or printhead.

[0095] As shown in the bottom perspective view of FIG. 18B, the printhead device assembly 2500 can have printhead devices 2505A, 2505B, and 2505C mounted using kinematic mounting, similar to that described for the kinematic mounting of the printhead unit 1000 of FIG. 13A, for example. In that regard, various embodiments of kinematic mounting assemblies for the vertical mounting of embodiments of printhead devices such as the printhead devices 2505A, 2505B, and 2505C of FIG. 18B into a printhead device assembly such as the printhead device assembly 2500 of FIG. 18B can utilize, for example, kinematic spheres and V-block assemblies. In FIG. 18B, kinematic spheres 1118A are depicted for each of the printhead devices 2505A, 2505B, and 2505C of FIG. 18B.

[0096] In addition, camera assembly 2551 is shown mounted within print head assembly enclosure 2503. For various embodiments of the systems and methods of the present teachings, multiple cameras can be mounted on various devices, apparatuses, and assemblies to provide real-time visualization of operations within a gas enclosure system such as gas enclosure system 500A of FIG. 13. For example, camera assemblies 2550 of FIG. 13 and 2551 of FIG. 18B can be used for, by way of non-limiting example, navigation and inspection. Various embodiments of the print system camera assemblies can have different specifications with respect to field of view and resolution. For example, one camera can be a line-scan camera for in-situ particle inspection while a second camera can be used for regular navigation of a substrate within the gas enclosure system or for placement of a print head device assembly relative to the substrate. Such a camera useful for regular navigation can be a area-scan camera having a field of view within the range of about 5.4 mm × 4 mm with a magnification of about 0.9X to about 10.6 mm × 8 mm with a magnification of about 0.45X. In still other embodiments, one camera can be a line-scan camera for in-situ particle inspection while a second camera can be used for precise navigation of a substrate within the gas enclosure system, for example, for substrate alignment or for precise placement of a print head device assembly relative to the substrate. Such a camera useful for precise navigation can be an area-scan camera having a field of view of about 0.7 mm × 0.5 mm with a magnification of about 7.2X.

[0097] Figures 19A and 19B depict various perspective views of a printhead device 2505 according to various embodiments of the printhead device of the present disclosure. As previously described herein, the kinematic mounting of the printhead unit to the printing system can provide a repeatable non-distorted positioning of various embodiments of the printhead unit or printhead device of the present disclosure. For example, the kinematic mounting assembly described for the kinematic mounting of the printhead unit 1000 can utilize point contact kinematic assemblies such as ball and V-block kinematic mounting assemblies. Various embodiments of kinematic mounting assemblies for the vertical mounting of multiple printhead devices into a printhead device assembly can utilize line contact kinematic assemblies, such as, but not limited to, cannular spheres and V-block kinematic mounting assemblies. Various embodiments of line contact kinematic mounting assemblies can carry substantially more load, such as at least 100 times more load, than equivalent kinematic mounting assemblies that provide point contact. Various embodiments of kinematic mounting assemblies provide significant stability for the repeatable non-distorted positioning of the printhead device into the printhead device assembly and provide stability during X-axis movement of the printhead device assembly by naturally resisting movement in the X-axis direction.

[0098] In the top perspective view of FIG. 19A and the bottom perspective view of FIG. 19B, the first canoe sphere mounting fixture 1116A for the first canoe sphere 1118A and the second canoe sphere mounting fixture 1116B for the second canoe sphere 1118B can be seen. The third canoe sphere mounting fixture 1116C is visible in FIGS. 19A and 19B where the third canoe sphere can be mounted on the rear of the print head device 2505. The positions of the set of canoe spheres 1118A, 1118B, and 1118C can be used for repeatable distortion-free vertical bottom insertion of the print head device 2505 into a print head device assembly such as the print head device assembly 2500 of FIGS. 18A and 18B once each is engaged within the mating surface of the V-block mount. As shown in FIG. 19B, each print head device can have three print head assemblies 200A, 200B, and 200C selected by the end user. The print head device 2505 can have a first quick connect connector 1110A that provides ease of connecting a fluid line entering the print head device 2505 and a second quick connect connector 1110B that provides ease of connecting a fluid line exiting the print head device 2505. As shown in the schematic depiction of the fluid system of FIG. 17 for various embodiments of the local ink delivery system, fluid communication from the local ink delivery system for each print head device within the print head device assembly is controlled by using the print head assembly manifold valves IG V1 , IG V2 , and IG V3 . Also, as shown in FIG. 17, fluid communication from each print head device within the print head device assembly to the print head output manifold is through the print head assembly manifold valves IH V1 , IH V2 , and IH V3can be controlled by using. Various embodiments of the printhead output manifold can be in fluid communication with a local ink waste assembly, such as the local ink waste assembly 3800 of FIG. 16. In FIGS. 19A and 19B, an input printhead assembly manifold valve IG V and an output printhead assembly manifold valve IH V are shown with respect to the printhead device 2505.

[0099] FIG. 19C depicts a printhead device kinematic mounting plate 1340 with first V - block 1348A, second V - block 1348B, and third V - block 1348C, which are mating surfaces for the first canoe sphere 1118A, second canoe sphere 1118B, and third canoe sphere 1118C of FIGS. 19A and 19B, respectively. The first V - block 1348A, second V - block 1348B, and third V - block 1348C can be attached to the printhead device kinematic mounting plate 1340 using the first V - block mounting fixture 1342A, second V - block mounting fixture 1342B, and third V - block mounting fixture 1342C, respectively. As depicted from FIGS. 19A to 19C, the first V - block 1348A is a mating surface for the first canoe sphere 1118A, the second V - block 1348B is a mating surface for the second canoe sphere 1118B, and the third V - block 1348C is a mating surface for the third canoe sphere 1118C. FIG. 19D depicts a printhead device unit 1300 with a printhead device 2505 mounted on a printhead device kinematic mounting plate 1340 using canoe spheres and V - block kinematic mounts. For example, as shown in FIG. 19D, the first canoe sphere 1118A as shown in FIG. 19B is mounted on a first canoe sphere mounting fixture 1116A and engaged within a first V - block 1348A mounted on a first V - block mounting fixture 1342A. The first V - block mounting fixture 1342A is one of three V - block mounting fixtures mounted on the printhead device kinematic mounting plate 1340 as previously described herein. In that regard, the connection of the first canoe sphere 1118A to the first V - block 1348A for the printhead device unit 1300 of FIG. 19D exemplifies the connection of the second canoe sphere 1118B and third canoe sphere 1118C to the second V - block 1348B and third V - block 1348C, respectively.In addition to the printhead device kinematic mounting plate 1340, various embodiments of the mounting assembly for a printhead device unit, such as the printhead device unit 1300 of FIG. 19D, can include a printhead device front mounting plate 1341, as well as a first printhead device side mounting plate 1343A and a second printhead device side mounting plate 1343B. Each quick connect connector, as shown in FIGS. 19A and 19B, can be mounted on a printhead device side mounting plate, as depicted in FIG. 19D for the first quick connect connector 1110A mounted on the first printhead device side mounting plate 1343A.

[0100] According to various systems and methods of the present teachings, printhead devices such as printhead devices 2505A, 2505B, and 2505C of FIGS. 18A and 18B can be inserted manually or automatically from the bottom of the printhead device assembly 2500. For example, as depicted in FIG. 1D, printhead installation or replacement can be performed by a robot. As previously discussed with reference to FIG. 13, a gas enclosure such as gas enclosure 1000A can have an auxiliary panel assembly 1330 that can enclose a printhead management system 2701. In FIG. 1D, printhead device or printhead installation or replacement can be performed in the auxiliary panel assembly 1330 using a robot 2530. The printhead replacement module 2713 of the printhead management system 2701 of FIG. 1D can include a docking station for a printhead device having at least one printhead, as well as storage receptacles for a plurality of printhead devices and a plurality of printheads. Each printhead assembly of the present teachings can include from about 1 to about 60 printhead devices, and each printhead device can have from about 1 to about 30 printheads (see, e.g., but not limited to, printhead device assembly 2500 of FIGS. 1C and 18A). Thus, in addition to having from about 1 to about 60 printhead devices, various embodiments of the printing systems of the present teachings can have from about 1 to about 1800 printheads. As previously discussed herein, printhead devices such as printhead device 2505 of FIGS. 19A and 19B can be installed or replaced through bottom insertion without distortion of the printhead device within a printhead assembly such as printhead device assembly 2500 of FIGS. 23A and 18B, the bottom view of which is shown in FIG. 1D.

[0101] FIG. 20 is a schematic view showing a gas enclosure system 500B. Various embodiments of the gas enclosure system 500B according to the present teachings can include a gas enclosure assembly 1000B for housing a printing system, a gas purification loop 3130 in fluid communication with the gas enclosure assembly 1000B, and at least one thermal regulation system 3140. Additionally, various embodiments of the gas enclosure system 500B can have a pressurized inert gas recirculation system 3000 that can supply an inert gas for operating various devices such as a substrate floating table for an OLED printing system. Various embodiments of the pressurized inert gas recirculation system 3000 can utilize a compressor, a blower, and combinations of two as a source for various embodiments of the pressurized inert gas recirculation system 3000, as will be discussed in more detail later herein. Additionally, the gas enclosure system 500B can have a circulation and filtration system (not shown) inside the gas enclosure system 500B.

[0102] As depicted in FIG. 20, for various embodiments of the gas enclosure assembly according to the present teachings, the filtration system design can separate the inert gas that is continuously filtered and circulated internally within the gas enclosure assembly from the inert gas that is circulated through the gas purification loop 3130. The gas purification loop 3130 includes an outlet line 3131 from the gas enclosure assembly 1000B to the solvent removal component 3132 and then to the gas purification system 3134. Then, the purified inert gas with the solvent and other reactive gas species such as oxygen and water vapor is returned to the gas enclosure assembly 1000B through the inlet line 3133. The gas purification loop 3130 may also include suitable ducts and connections, as well as sensors, such as oxygen, water vapor, and solvent vapor sensors. A gas circulation unit such as a fan, blower, or motor, and equivalents, may be provided separately or incorporated into the gas purification system 3134, for example, to circulate the gas through the gas purification loop 3130. According to various embodiments of the gas enclosure assembly, the solvent removal system 3132 and the gas purification system 3134 are shown as separate units in the schematic diagram shown in FIG. 20, but the solvent removal system 3132 and the gas purification system 3134 can be housed together as a single purification unit.

[0103] The gas purification loop 3130 of FIG. 20 can have a solvent removal system 3132 disposed upstream of the gas purification system 3134 such that the inert gas circulated from the gas enclosure assembly 1000B passes through the solvent removal system 3132 via the outlet line 3131. According to various embodiments, the solvent removal system 3132 may be a solvent confinement system based on adsorbing solvent vapor from the inert gas passing through the solvent removal system 3132 of FIG. 20. For example, without limitation, one or more adsorbent layers such as activated carbon, molecular sieves, and the like may effectively remove a wide variety of organic solvent vapors. For various embodiments of the gas enclosure system, a cooling trap technique may be employed to remove solvent vapor within the solvent removal system 3132. As previously discussed herein, for various embodiments of the gas enclosure assembly according to the present teachings, sensors such as oxygen, water vapor, and solvent vapor sensors may be used to monitor such effective removal of such species from the inert gas continuously circulating through a gas enclosure system such as the gas enclosure system 500B of FIG. 20. Various embodiments of the solvent removal system can indicate when the adsorbent, such as activated carbon, molecular sieves, and the like, has reached capacity so that one or more adsorbent layers can be regenerated or replaced. Regeneration of the molecular sieves can involve heating the molecular sieves, contacting the molecular sieves with a forming gas, combinations thereof, and the like. Molecular sieves configured to confine various species, including oxygen, water vapor, and solvents, can be regenerated by heating and exposing them to a forming gas containing hydrogen, for example, a forming gas containing about 96% nitrogen and 4% hydrogen, the percentages being by volume or weight. Physical regeneration of the activated carbon can be performed using a similar heating procedure under an inert environment.

[0104] Any suitable gas purification system can be used in the gas purification system 3134 of the gas purification loop 3130 of FIG. 20. For example, gas purification systems available from MBRAUN Inc. (Statham, New Hampshire) or Innovative Technology (Amesbury, Massachusetts) may be useful for incorporation into various embodiments of the gas enclosure assembly according to the present teachings. The gas purification system 3134 can be used to purify one or more inert gases within the gas enclosure system 500B, e.g., to purify the entire gas atmosphere within the gas enclosure assembly. As previously discussed herein, the gas purification system 3134 can have a gas circulation unit such as a fan, blower, or motor, and the like. In that regard, the gas purification system can be selected according to the volume of the enclosure to define a volumetric flow rate for moving the inert gas through the gas purification system. For various embodiments of the gas enclosure system having a gas enclosure assembly with a volume of up to about 4 m 3 , a gas purification system that can move at about 84 m 3 / hour can be used. For various embodiments of the gas enclosure system having a gas enclosure assembly with a volume of up to about 10 m 3 , a gas purification system that can move at about 155 m 3 / hour can be used. For various embodiments of the gas enclosure assembly having a volume of about 52 - 114 m 3 , more than one gas purification system may be used.

[0105] Any suitable gas filter or purification device can be included in the gas purification system 3134 of the present teachings. In some embodiments, the gas purification system can comprise two parallel purification devices such that one of the devices can be removed from the line for maintenance and the other device can be used to continue system operation without interruption. In some embodiments, for example, the gas purification system can comprise one or more molecular sieves. In some embodiments, the gas purification system can comprise at least a first molecular sieve and a second molecular sieve such that the system can switch to the other molecular sieve while regenerating a saturated or inefficient molecular sieve when one of the molecular sieves is considered to be saturated with impurities or otherwise not operating efficiently enough. A control unit can be provided for determining the operating efficiency of each molecular sieve, switching the operation of different molecular sieves, regenerating one or more molecular sieves, or combinations thereof. As previously discussed herein, the molecular sieves may be regenerated and reused.

[0106] The thermal regulation system 3140 of FIG. 20 can include at least one cooling device 3142 that can have a fluid outlet line 3141 for circulating a coolant into a gas enclosure assembly and a fluid inlet line 3143 for returning the coolant to the cooling device. At least one fluid cooling device 3142 can be provided to cool the gas atmosphere within the gas enclosure system 500B. For various embodiments of the gas enclosure system of the present teachings, the fluid cooling device 3142 delivers the cooled fluid to a heat exchanger within the enclosure where the inert gas is passed to a filtration system inside the enclosure. At least one fluid cooling device can also be provided to the gas enclosure system 500B to cool the heat generated from the devices enclosed within the gas enclosure system 500B. For example, without limitation, at least one fluid cooling device can also be provided to the gas enclosure system 500B to cool the heat generated from an OLED printing system. The thermal regulation system 3140 can comprise a heat exchange or a Peltier device and can have various cooling capabilities. For example, for various embodiments of the gas enclosure system, the cooling device can provide a cooling capacity of from about 2 kW to about 20 kW. Various embodiments of the gas enclosure system can have multiple fluid cooling devices that can cool one or more fluids. In some embodiments, the fluid cooling device can utilize several fluids as the coolant, for example, without limitation, water, antifreeze, refrigerant, and combinations thereof as the heat exchange fluid. Appropriate leak-free locking connections can be used when connecting the associated conduits and system components.

[0107] As previously discussed, the present teachings disclose various embodiments of a gas enclosure system that can include a printing system enclosure that defines a first volume and an auxiliary enclosure that defines a second volume. Various embodiments of the gas enclosure system can have an auxiliary enclosure that can be constructed to be sealable as a section of the gas enclosure assembly. According to the systems and methods of the present teachings, the auxiliary enclosure can be sealably isolated from the printing system enclosure and can be opened to the environment external to the gas enclosure assembly without exposing the printing system enclosure to the external environment. For example, without limitation, such physical isolation of the auxiliary enclosure for performing various printhead management procedures can be done to eliminate or minimize exposure of the printing system enclosure to contamination such as air and water vapor and various organic vapors, as well as particulate matter contamination. Various printhead management procedures, which can include measurement and maintenance procedures on the printhead assembly, can be performed with little or no interruption to the printing process, thereby minimizing or eliminating downtime of the gas enclosure system.

[0108] For a gas enclosure system having a print system enclosure defining a first volume and an auxiliary enclosure defining a second volume, both volumes can be readily integrated with gas circulation, filtration, and purification components so as to form a gas enclosure system that can sustain an inert and substantially low particle environment for processes that require such an environment with little or no interruption to the printing process. According to various systems and methods of the present teachings, the print system enclosure may be introduced to a level of contamination that is low enough so that the purification system can remove the contamination before it can affect the printing process. Various embodiments of the auxiliary enclosure can have a volume that is substantially smaller than the total volume of the gas enclosure assembly, and can rapidly restore an inert low particle environment after exposure to the external environment, thereby forming an auxiliary enclosure system that provides little or no interruption to the printing process and can be readily integrated with gas circulation, filtration, and purification components.

[0109] In addition, various embodiments of the auxiliary enclosure can be readily integrated with a dedicated set of environmental control system components such as lighting, gas circulation and filtration, gas purification, and temperature regulation components. In that regard, various embodiments of a gas enclosure system including an auxiliary enclosure that can be hermetically isolated as part of the gas enclosure assembly can have a controlled environment that is set to be uniform with the first volume defined by the gas enclosure assembly that houses the print system. Further, various embodiments of a gas enclosure system including an auxiliary enclosure that can be hermetically isolated as a section of the gas enclosure assembly can have a controlled environment that is set to be different from the controlled environment of the first volume defined by the gas enclosure assembly that houses the print system.

[0110] The above embodiments describe cooling capacity and refrigeration applications, but the above embodiments may also be used in applications that include buffering the substrate in a controlled environment, or for applications where the circulating gas can be maintained at a temperature similar to other parts of the system, to avoid unwanted heat transfer from the processed substrate, or to avoid interfering with temperature uniformity across or between substrates.

[0111] Figures 21A and 21B generally illustrate an embodiment of a gas enclosure system for integrating and controlling a non-reactive gas and a clean dry air (CDA) source that can be used to establish a controlled environment referenced in other embodiments described elsewhere herein and that can include a supply of pressurized gas for use with a floating table. Figures 22A and 22B generally illustrate an embodiment of a gas enclosure system for integrating and controlling a non-reactive gas and a clean dry air (CDA) source that can be used to establish a controlled environment referenced in other embodiments described elsewhere herein and that can include, for example, a blower loop that provides pressurized gas and at least a partial vacuum for use with a floating table. Figure 22C generally illustrates a further embodiment of a system for integrating and controlling one or more gas or air sources, such as for establishing a floating control zone included as part of a floating transport system.

[0112] The various embodiments described herein include an encapsulation module that can be environmentally controlled. The enclosure assembly and corresponding support equipment can be referred to as a "gas enclosure system," and such an enclosure assembly can be constructed in a contoured fashion to reduce or minimize the internal volume of the gas enclosure assembly while simultaneously providing a working volume to accommodate various installation areas of printing system components such as deposition (e.g., printing), holding, loading, or processing modules described herein. For example, a contoured gas enclosure assembly according to the present teachings can have a gas enclosure volume of from about 6 m3 to about 95 m3 for various embodiments of the gas enclosure assembly of the present teachings, covering, for example, substrate sizes from Gen 3.5 to Gen 10. Various embodiments of the contoured gas enclosure assembly according to the present teachings can have a gas enclosure volume of from about 15 m3 to about 30 m3, for example, but not limited to, printing of substrate sizes from Gen 5.5 to Gen 8.5 or other substrate sizes and can be useful therefor. Various embodiments of the auxiliary enclosure are constructed as a section of the gas enclosure assembly and can be readily integrated with gas circulation and filtration, as well as purification components, to form a gas enclosure system that can sustain such an environment for processes that require a controlled substantially low particle environment.

[0113] As shown in FIGS. 21A and 22A, various embodiments of the gas enclosure system can include a pressurized non-reactive gas recirculation system. Various embodiments of the pressurized gas recirculation loop can utilize compressors, blowers, and combinations thereof. According to the present teachings, several engineering challenges have been addressed to provide various embodiments of the pressurized gas recirculation system within the gas enclosure system. First, under typical operation of a gas enclosure system without a pressurized non-reactive gas recirculation system, if any leakage occurs within the gas enclosure system, the gas enclosure system can be maintained at a slightly positive internal pressure (e.g., above atmospheric pressure) relative to the external pressure to prevent external gas or air from entering. For example, under typical operation, for various embodiments of the gas enclosure system of the present teachings, the interior of the gas enclosure system can be maintained at a pressure, for example, at least 2 mbarg, at least 4 mbarg, at least 6 mbarg, at least 8 mbarg, or higher, relative to the ambient atmosphere outside the enclosure system.

[0114] Maintaining a pressurized gas recirculation system within a gas enclosure system can be difficult as it entails the act of maintaining a dynamic ongoing equilibrium with respect to continuously introducing pressurized gas into the gas enclosure system while maintaining a slightly positive internal pressure within the gas enclosure system. Further, variable requirements of various devices and apparatuses can generate an irregular pressure profile for the various gas enclosure assemblies and systems of the present teachings. Maintaining a dynamic pressure equilibrium for a gas enclosure system that is held at a slightly positive pressure with respect to the external environment under such conditions can provide the integrity of the ongoing processing operation. For various embodiments of the gas enclosure system, the pressurized gas recirculation system according to the present teachings can include various embodiments of a pressurized gas loop that can utilize at least one of a compressor, an accumulator, and a blower, and combinations thereof. Various embodiments of the pressurized gas recirculation system, including various embodiments of the pressurized gas loop, can have a specially designed pressure control bypass loop that can provide an internal pressure of a non-reactive gas within the gas enclosure system of the present teachings at a stable defined value. In various embodiments of the gas enclosure system, the pressurized gas recirculation system can be configured to recirculate pressurized gas via the pressure control bypass loop when the pressure of the gas within the accumulator of the pressurized gas loop exceeds a preset threshold pressure. The threshold pressure can be, for example, within the range of about 25 psig to about 200 psig, or more specifically, within the range of about 75 psig to about 125 psig, or more specifically, within the range of about 90 psig to about 95 psig. In that regard, the gas enclosure system of the present teachings having a pressurized gas recirculation system with various embodiments of a specially designed pressure control bypass loop can maintain the equilibrium of having a pressurized gas recirculation system within a sealed gas enclosure.

[0115] According to the present teachings, various devices and apparatuses can be disposed within the interior of a gas enclosure system and be in fluid communication with various embodiments of a pressurized gas recirculation system. For various embodiments of the gas enclosures and systems of the present teachings, the use of various pneumatic devices and apparatuses can provide low particle generation performance and be relatively easy to maintain. Exemplary devices and apparatuses that can be disposed within the gas enclosure system and be in fluid communication with various pressurized gas loops can include, for example, pneumatic robots, substrate floating tables, air bearings, air bushings, compressed gas tools, pneumatic actuators, and one or more or combinations thereof, but are not limited thereto. Substrate floating tables, as well as air bearings, can be used for various aspects of operating a printing system according to various embodiments of the gas enclosure system of the present teachings. For example, a substrate floating table utilizing air bearing technology can be used to transfer a substrate to a fixed position within a print head chamber and to support the substrate during a printing process.

[0116] For example, as shown in FIGS. 21A, 21B, 22A, and 22B, various embodiments of the gas enclosure system 500C and the gas enclosure system 500D can have an external gas loop 3200 for integrating and controlling a non-reactive gas source 3201 and a clean dry air (CDA) source 3203 for use in various aspects of the operation of the gas enclosure system 500C and the gas enclosure system 500D. The gas enclosure system 500C and the gas enclosure system 500D can also include various embodiments of an internal particle filtration and gas circulation system, as well as various embodiments of an external gas purification system, as previously described. Such embodiments of the gas enclosure system can include a gas purification system for purifying various reactive species from the gas. Some generally used non-limiting examples of non-reactive gases can include nitrogen, any of the noble gases, and any combination thereof. Various embodiments of the gas purification system according to the present teachings can maintain various levels of various reactive species, including various reactive atmospheric gases such as water vapor, oxygen, ozone, etc., as well as organic solvent vapors, at 1000 ppm or lower, for example, 100 ppm or lower, 10 ppm or lower, 1.0 ppm or lower, or 0.1 ppm or lower. In addition to the external loop 3200 for integrating and controlling the gas source 3201 and the CDA source 3203, the gas enclosure assembly 500C and the gas enclosure system 500D can have a compressor loop 3250 that can supply gas for operating various devices and apparatuses that can be disposed inside the gas enclosure system 500C and the gas enclosure system 500D. A vacuum system 3270, such as in communication with the gas enclosure assembly 1005 through line 3272 when valve 3274 is in the open position, can also be provided.

[0117] The compressor loop 3250 of FIG. 21A can include a compressor 3262, a first accumulator 3264, and a second accumulator 3268 that are configured to be in fluid communication. The compressor 3262 can be configured to compress the gas drawn from the gas enclosure assembly 1005 to a desired pressure. The inlet side of the compressor loop 3250 can be in fluid communication with the gas enclosure assembly 1005 through line 3254 having a valve 3256 and a check valve 3258 via the gas enclosure assembly outlet 3252. The compressor loop 3250 can be in fluid communication with the gas enclosure assembly 1005 at the outlet side of the compressor loop 3250 via an external gas loop 3200. The accumulator 3264 can be disposed between the compressor 3262 and the junction of the compressor loop 3250 with the external gas loop 3200 and can be configured to generate a pressure of 5 psig or higher. The second accumulator 3268 can be within the compressor loop 3250 to provide a damped variation due to the compressor piston cycle at about 60 Hz. For various embodiments of the compressor loop 3250, the first accumulator 3264 can have a capacity between about 80 gallons and about 160 gallons, while the second accumulator can have a capacity between about 30 gallons and about 60 gallons. According to various embodiments of the gas enclosure system 500C, the compressor 3262 can be a zero - entry compressor. Various types of zero - entry compressors can operate without leaking atmospheric gas into various embodiments of the gas enclosure system of the present teachings. Various embodiments of the zero - entry compressor can be continuously executed during a processing operation, for example, by utilizing the use of various devices and apparatuses that require compressed gas.

[0118] The accumulator 3264 can be configured to receive and store compressed gas from the compressor 3262. The accumulator 3264 can supply compressed gas as needed within the gas enclosure assembly 1005. For example, the accumulator 3264 can provide gas to maintain pressure for various components of the gas enclosure assembly 1005, such as, but not limited to, one or more of pneumatic robots, substrate floating tables, air bearings, air bushings, compressed gas tools, pneumatic actuators, and combinations thereof. As shown in FIG. 21A for the gas enclosure system 500C, the gas enclosure assembly 1005 can have a printing system 2005 enclosed therein. As schematically depicted in FIG. 21A, the printing system 2005 can be supported by a printing system base 2150, which can be a granite stage. The printing system base 2150 can support a substrate support device, such as a chuck, e.g., but not limited to, a vacuum chuck, a substrate floating chuck having pressure ports, and a substrate floating chuck having both vacuum and pressure ports. In various embodiments of the present teachings, the substrate support device can be a substrate floating table, such as substrate floating table 2250. The substrate floating table 2250 can be used for frictionless support of the substrate. In addition to the low particle generation floating table, for frictionless Y-axis conveyance of the substrate, the printing system 2005 can have a Y-axis motion system that utilizes air bushings.

[0119] In addition, the printing system 2005 can have at least one X, Z-axis carriage assembly, along with motion control provided by a low-particle generation X-axis air bearing assembly. For example, instead of various particle-generating linear machine bearing systems, various components of a low-particle generation motion system, such as an X-axis air bearing assembly, can be used. For various embodiments of the gas enclosures and systems of the present teachings, the use of various air-operated devices and apparatuses can provide low-particle generation performance and be relatively easy to maintain. The compressor loop 3250 can be configured to continuously supply pressurized gas to various devices and apparatuses of the gas enclosure system 500C. In addition to the supply of pressurized gas, the substrate floating table 2250 of the printing system 2005 that utilizes air bearing technology also utilizes a vacuum system 3270 that is in fluid communication with the gas enclosure assembly 1005 through line 3272 when valve 3274 is in the open position.

[0120] The pressurized gas recirculation system according to the present teachings can have a pressure control bypass loop 3260 as shown in FIG. 21A for the compressor loop 3250, which acts to supplement variable demands for pressurized gas during use, thereby providing a dynamic equilibrium for various embodiments of the gas enclosure systems of the present teachings. For various embodiments of the gas enclosure system according to the present teachings, the bypass loop can maintain a constant pressure within the accumulator 3264 without disturbing or changing the pressure within the enclosure 1005. The bypass loop 3260 can have a first bypass inlet valve 3261 on the inlet side of the bypass loop that is closed unless the bypass loop 3260 is used. The bypass loop 3260 can also have a back pressure regulator 3266 that can be used when the second valve 3263 is closed. The bypass loop 3260 can have a second accumulator 3268 disposed on the outlet side of the bypass loop 3260. For embodiments of the compressor loop 3250 that utilize a zero-entry compressor, the bypass loop 3260 can compensate for minor pressure deviations that can occur over time during use of the gas enclosure system. The bypass loop 3260 can be in fluid communication with the compressor loop 3250 on the inlet side of the bypass loop 3260 when the bypass inlet valve 3161 is in the open position. When the bypass inlet valve 3261 is opened, gas from the compressor loop 3250 can be recirculated to the compressor if the gas is diverted through the bypass loop 3260 when it is not required inside the gas enclosure assembly 1005. The compressor loop 3250 is configured such that gas is diverted through the bypass loop 3260 when the pressure of the gas in the accumulator 3264 exceeds a preset threshold pressure.The pre-set threshold pressure of the accumulator 3264 can be from about 25 psig to about 200 psig at a flow rate of at least about 1 cubic foot per minute (cfm), or from about 50 psig to about 150 psig at a flow rate of at least about 1 cubic foot per minute (cfm), or from about 75 psig to about 125 psig at a flow rate of at least about 1 cubic foot per minute (cfm), or from about 90 psig to about 95 psig at a flow rate of at least about 1 cubic foot per minute (cfm).

[0121] Various embodiments of the compressor loop 3250 can utilize various compressors other than a zero-entry compressor, such as a variable speed compressor or a compressor that can be controlled to be either on or off. As previously discussed, a zero-entry compressor ensures that no atmospheric reactive species can be introduced into the gas enclosure system. Thus, any compressor configuration that prevents atmospheric reactive species from being introduced into the gas enclosure system can be utilized in the compressor loop 3250. According to various embodiments, the compressor 3262 of the gas enclosure system 500C can be housed, for example but not limited to, within a sealed housing. The interior of the housing can be configured to be in fluid communication with the same gas that forms the gas atmosphere for a gas source, for example, the gas enclosure assembly 1005. For various embodiments of the compressor loop 3250, the compressor 3262 can be controlled at a constant speed to maintain a constant pressure. In other embodiments of the compressor loop 3250 that do not utilize a zero-entry compressor, the compressor 3262 can be turned off when the maximum threshold pressure is reached and turned on when the minimum threshold pressure is reached.

[0122] In FIG. 22A of the gas enclosure system 500D, a blower loop 3280 utilizing a vacuum blower 3290 is shown for the operation of a substrate floating table 2250 of a printing system 2005 housed in a gas enclosure assembly 1005. As previously discussed for the compressor loop 3250, the blower loop 3280 can be configured to continuously supply pressurized gas to the substrate floating table 2250 of the printing system 2005.

[0123] Various embodiments of a gas enclosure system that can utilize a pressurized gas recirculation system can have various loops that utilize various sources of pressurized gas, such as at least one of a compressor, a blower, and combinations thereof. In FIG. 22A of the gas enclosure system 500D, the compressor loop 3250 can be in fluid communication with an external gas loop 3200 that can be used for the supply of gas to a high consumption manifold 3225, as well as a low consumption manifold 3215. For various embodiments of the gas enclosure system according to the present teachings as shown in FIG. 22A for the gas enclosure system 500D, the high consumption manifold 3225 can be used to supply gas to various devices and apparatuses, such as, but not limited to, a substrate floating table, a pneumatic robot, an air bearing, an air bushing, and a compressed gas tool, and one or more than one of combinations thereof. For various embodiments of the gas enclosure system according to the present teachings, the low consumption 3215 can be used to supply gas to various apparatuses and devices, such as, but not limited to, an isolator, and a pneumatic actuator, and one or more than one of combinations thereof.

[0124] Regarding various embodiments of the gas enclosure system 500D of FIGS. 22A and 22B, the blower loop 3280 can be utilized to supply pressurized gas to various embodiments of the substrate floating table 2250. In addition to the supply of pressurized gas, the substrate floating table 2250 of the printing system 2005 that utilizes air bearing technology also utilizes a blower vacuum 3290 that communicates with the gas enclosure assembly 1005 through line 3292 when the valve 3294 is in the open position. The housing 3282 of the blower loop 3280 can maintain a first blower 3284 for supplying a source of pressurized gas to the substrate floating table 2250 and a second blower 3290 that serves as a vacuum source for the substrate floating table 2250 housed in the gas environment within the gas enclosure assembly 1005. Attributes that can suitably make a blower for use as either a source of pressurized inert gas or a vacuum source for various embodiments of the substrate floating table include, for example, that they have high reliability, that they are not overly burdensome to maintain, that they have variable speed control, that they have a wide range of flow rates, that they can provide flow rates between about 100 m 3 / hour to about 2,500 m 3 / hour, including but not limited to various embodiments. Various embodiments of the blower loop 3280 can additionally have a first isolation valve 3283 at the inlet end of the compressor loop 3280 and a check valve 3285 and a second isolation valve 3287 at the outlet end of the blower loop 3280. Various embodiments of the blower loop 3280 can have an adjustable valve 3286, which can be, for example, but not limited to, a gate, butterfly, needle, or ball valve, and a heat exchanger 3288 for maintaining the gas from the blower loop 3280 to the substrate floating table 2250 at a specified temperature.

[0125] FIG. 22A depicts an external gas loop 3200, as also shown in FIG. 21A, for integrating and controlling a gas source 3201 and a clean dry air (CDA) source 3203 for use in various aspects of the operation of the gas enclosure system 500C of FIG. 21A and the gas enclosure system 500D of FIG. 22A. The external gas loop 3200 of FIGS. 21A and 22A can include at least four mechanical valves. These valves include a first mechanical valve 3202, a second mechanical valve 3204, a third mechanical valve 3206, and a fourth mechanical valve 3208. These various valves are located at positions within various flow lines that enable control of both a non-reactive gas and an air source such as clean dry air (CDA). According to the present teachings, a non-reactive gas can be any gas that does not undergo a chemical reaction under a defined set of conditions. Some generally used non-limiting examples of non-reactive gases can include nitrogen, any of the noble gases, and any combination thereof. From the built-in gas source 3201, a built-in gas line 3210 extends. The built-in gas line 3210 continues to extend linearly as a low-consumption manifold line 3212 that is in fluid communication with a low-consumption manifold 3215. A first section 3214 of the intersecting line extends from a first flow junction 3216 that is located at the intersection of the built-in gas line 3210, the low-consumption manifold line 3212, and the first section 3214 of the intersecting line. The first section 3214 of the intersecting line extends to a second flow junction 3218. A compressor gas line 3220 extends from an accumulator 3264 of a compressor loop 3250 and terminates at the second flow junction 3218. A CDA line 3222 extends from the CDA source 3203 and continues as a high-consumption manifold line 3224 that is in fluid communication with a high-consumption manifold 3225. A third flow junction 3226 is positioned at the intersection of a second section 3228 of the intersecting line, the clean dry air line 3222, and the high-consumption manifold line 3224. The second section 3228 of the intersecting line extends from the second flow junction 3218 to the third flow junction 3226. The high-consumption manifold 3225 can be used to supply various components that are high-consumption with CDA during maintenance.By isolating the compressor using valves 3204, 3208, and 3230, reactive species such as ozone, oxygen, and water vapor can be prevented from contaminating the gas within the compressor and accumulator.

[0126] In contrast to FIGS. 21A and 22A, FIGS. 21B and 22B generally illustrate a configuration in which the pressure of the gas inside the gas enclosure assembly 1005 can be maintained within a desired or specified range, such as by using a valve connected to the pressure monitor P. The valve uses the information obtained from the pressure monitor to allow the gas to be discharged to another enclosure, system, or the region surrounding the gas enclosure assembly 1005. Such gas can be recovered and reprocessed as in other embodiments described herein. As described above, since pressurized gas is also introduced into the gas enclosure system simultaneously, such regulation can help maintain a slightly positive internal pressure of the gas enclosure system. The variable requirements of various devices and apparatuses can generate an irregular pressure profile for the various gas enclosure assemblies and systems of the present teachings. Thus, the approach shown in FIGS. 21B and 22B can be used in addition to, or instead of, other approaches described herein, such as to help maintain a dynamic pressure balance of the gas enclosure system that is held at a slightly positive pressure with respect to the environment surrounding the enclosure.

[0127] FIG. 22C illustrates a further embodiment of a system 500E for integrating and controlling one or more gas or air sources, such as for establishing a floating control zone generally included as part of a floating transport system. Similar to the embodiments of FIGS. 1C, 22A, and 22B, FIG. 22C generally illustrates a floating table 2250. Additionally, in the illustrative embodiment of FIG. 22C, an input region 2201 and an output region 2203 are shown. Regions 2201, 2200, 2203 are referred to as input, print, and output for illustrative purposes only. Such regions can be used for other processing steps such as transporting or supporting a substrate, among one or more of holding, drying, or heat treating the substrate within one or more other modules. In the explanatory illustration of FIG. 22C, a first blower 3284A is configured to provide pressurized gas within one or more of the input or output regions 2201 or 2203 of the floating table device. Such pressurized gas can be temperature controlled, such as using a first cooling device 142A coupled to a first heat exchanger 1502A. Such pressurized gas can be filtered using a first filter 1503A. A temperature monitor 8701A can be coupled to the first cooling device 142 (or other temperature controller).

[0128] Similarly, the second blower 3284B can be connected to the printing area 2202 of the floating table. A separate cooling device 142B can be connected to a loop including a second heat exchanger 1502B and a second filter 1503B. A second temperature monitor 8701B can be used to provide independent regulation of the temperature of the pressurized gas provided by the second blower 3284B. In this illustrative embodiment, as previously described herein with respect to FIG. 1C, the input and output areas 2201 and 2203 are supplied with positive pressure, while the printing area 2202 can include the use of a combination of positive pressure and vacuum control to provide precise control over the substrate position. For example, using such a combination of positive pressure and vacuum control, the substrate can be uniquely controlled using the floating gas cushion provided by the gas enclosure system 500D within the zone defined by the printing area 2202. The vacuum can be established by a third blower 3290 such that at least a portion of the make-up gas for the first and second blowers 3284A or 3284B within the blower housing 3282 is also provided.

[0129] It should be understood that various alternatives of the embodiments of the present disclosure described herein may be employed in practicing the present disclosure. For example, widely different technical fields such as chemistry, biotechnology, advanced technology, and the pharmaceutical field may benefit from the present teachings. Printing is used to illustrate the usefulness of various embodiments of the gas enclosure system according to the present teachings. Various embodiments of the gas enclosure system that can house a printing system can provide, but are not limited to, features such as sealing the sealed enclosure through construction and deconstruction cycles, minimizing the enclosure volume, and providing immediate access from the outside to the inside during processing and maintenance. Such features of various embodiments of the gas enclosure system can affect, but are not limited to, the structural integrity that provides ease of maintaining low levels of reactive species during processing, and the functionality such as rapid enclosure volume conversion that minimizes downtime during maintenance cycles. Accordingly, various features and specifications that provide usefulness for panel printing can also provide benefits to various technical fields.

[0130] Embodiments of the present disclosure are shown and described herein, but it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Here, numerous variations, modifications, and substitutions will occur to those skilled in the art without departing from the present disclosure. The following claims define the scope of the present disclosure, and methods and structures within the scope of these claims and their equivalents are intended to be covered thereby.

Claims

1. A printing system, comprising a print head assembly having at least one print head, an X-axis support for the print head assembly, an X-axis linear air bearing motion system having a Z-axis moving plate assembly for coupling the print head assembly to the X-axis support, a floating support for supporting a substrate, a Y-axis support disposed along a side of the floating support, a Y-axis linear air bearing motion system coupled to the Y-axis support and having a rotatable member for moving a substrate on the floating support, the Y-axis linear air bearing motion system having a linear motor assembly for rotating the member, and a printing system comprising the same.

2. The printing system according to claim 1, wherein the Y-axis linear air bearing motion system further comprises a motion control assembly for controlling the rotation of the member.

3. The printing system according to claim 2, wherein the member is pivotally connected, the motion control assembly comprises two independently operable linear motor assemblies, and the pivot is disposed between the two linear motor assemblies.

4. The printing system according to claim 3, wherein the Y-axis support comprises a beam extending along a side of the floating support, and the Y-axis linear air bearing motion system comprises an air bearing carriage for coupling the member to the beam.

5. The printing system according to claim 1, wherein the X-axis linear air bearing motion system further comprises a Z-axis motor for moving the Z-axis moving plate.

6. The printing system according to claim 5, wherein the X-axis linear air bearing motion system further comprises a Z-axis pneumatic balance system.

7. The printing system according to claim 1, further comprising a gas enclosure for housing the print head assembly, the X-axis support, the X-axis linear air bearing motion system, the floating support, the Y-axis support, and the Y-axis linear air bearing motion system.

8. The printing system according to claim 7, wherein the interior of the gas enclosure is pressure-controlled.

9. In the printing system according to claim 8, a printing system further comprising a gas recirculation system coupled to the gas enclosure.

10. In the printing system according to claim 9, a printing system further comprising a gas purification system connected to the gas enclosure.

11. In the printing system according to claim 1, the member is a vacuum gripper.

12. A printing system, comprising a print head assembly including at least one print head and a local ink delivery system, an X-axis support for the print head assembly, an X-axis linear air bearing motion system having a Z-axis moving plate assembly that couples the print head assembly to the X-axis support, a floating support for supporting a substrate, a Y-axis support disposed along a side of the floating support, a Y-axis linear air bearing motion system coupled to the Y-axis support and including a rotatable member for moving a substrate on the floating support, the Y-axis linear air bearing motion system having a linear motor assembly for rotating the member, and a bulk ink delivery system fluidly coupled to the local ink delivery system, comprising a printing system.

13. In the printing system according to claim 12, the local ink delivery system includes a local ink supply system and a print head ink delivery system.

14. In the printing system according to claim 12, the floating support includes a positive pressure port and a vacuum port.

15. In the printing system according to claim 12, a printing system further comprising a camera system coupled to the X-axis support.

16. In the printing system according to claim 12, a printing system further comprising an ultraviolet source or a heat source, or both, coupled to the X-axis support.

17. In the printing system according to claim 12, the member is pivotally connected, the Y-axis linear air bearing motion system includes a motion control assembly having two independently operable linear motor assemblies, and the pivot is disposed between the two linear motor assemblies.

18. In the printing system according to claim 17, the pivoting is air bearing pivoting.

19. In the printing system according to claim 17, the Y-axis linear air bearing motion system includes a carriage that couples the Y-axis linear air bearing motion system to the Y-axis support, and the member is coupled to the carriage via the pivoting.

20. In the printing system according to claim 19, each linear motor assembly is a voice coil assembly.

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