Label attachment ledger sheet and IC label-attached leger sheet

Abstract

To provide a label attachment ledger sheet and an IC label-attached ledger sheet which can prevent counterfeiting by replacing IC labels.SOLUTION: In a certificate sheet 1 having an IC label 6 attached to a label attachment area 11 of a certificate mount 5, the certificate mount 5, which serves as a label attachment ledger sheet, has, in the label attachment area 11 to which the IC label 6 is attached, a plurality of dotted line parts 21a to 21c formed over substantially the entire area, and chip arrangement areas 24a to 24c without the dotted line parts 21a to 21c. The chip arrangement areas 24a to 24c, in which the IC chip 14 is to be arranged, are formed with a vertical and horizontal dimension greater than the spacing between the dotted line parts 21a to 21c and also larger in size than the IC chip. With these configurations, the breakage strength of the IC chip 14 can be improved, thereby suppressing the occurrence of failures.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a form paper for attaching an IC label such as an RFID, and a form paper with an IC label to which the IC label is attached.

Background Art

[0002] In recent years, a configuration has been proposed in which an RFID label (IC label) storing a certification item is attached to a certificate such as a family register or a vehicle inspection certificate. With this configuration, the certification item printed on the surface of the certificate can be read non-contact from the IC label (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the above-mentioned certificate, since the IC label attached to the paper surface is covered with a protective sheet, there is a risk of forgery by peeling off the IC label and the protective sheet from the paper surface and reattaching them.

[0005] The present invention proposes a form paper for attaching an IC label and a form paper with an IC label that can prevent forgery by replacing the IC label.

Means for Solving the Problems

[0006] The first aspect of the present invention is a label - affixing form for a label, in which a label - affixing area is provided on one side of a paper substrate, and an IC label having an IC chip and an antenna is affixed to the label - affixing area. In the label - affixing area, a plurality of cut - line portions cut into a predetermined shape are formed at intervals across substantially the entire area of the label - affixing area. One or more chip - placement areas without the cut - line portions are provided for placing the IC chip of the IC label affixed to the label - affixing area. The chip - placement area is formed with a length and width longer than the interval between the cut - line portions and is formed with a size larger than the IC chip.

[0007] In such a configuration, since a plurality of cut - line portions are formed in the label - affixing area, when the IC label is peeled off in a state where the IC label is affixed to the label - affixing area, the paper substrate of the label - affixing area is broken from the cut - line portions, leaving a trace. Thus, when an illegal act of replacing the IC label is committed, since the trace clearly remains, forgery due to the illegal act can be prevented.

[0008] Furthermore, in the configuration of the present invention, a chip - placement area is provided in the label - affixing area, and the IC chip of the IC label affixed to the label - affixing area is placed in the chip - placement area. As a result, in a state where the IC label is affixed, the IC chip of the IC label is non - contacting (non - overlapping) with the cut - line portions of the label - affixing area. Therefore, the protective action of the IC chip can be surely and stably exerted by the paper substrate of the chip - placement area. For this reason, it is possible to suppress the IC chip placed in the chip - placement area from being broken by the pressure acting from the outside. Here, in a certificate such as a vehicle inspection certificate to which an IC label is affixed, it is required that the IC chip is not damaged by a relatively large pressure acting locally on the IC chip. According to the certificate to which the present invention is applied, it is possible to suppress the IC chip from being damaged by the relatively large pressure.

[0009] In addition, in the form used for label attachment of the present invention described above, a configuration is proposed in which the vertical and horizontal dimensions of the chip placement area are 1.5 to 8 times the interval of the cutting line portions. Here, in a configuration in which a plurality of intervals of the cutting line portions are provided, the average interval obtained by averaging the plurality of intervals, the central interval corresponding to the plurality of median values, or the reference interval set in advance as a reference corresponds to the interval of the cutting line portions according to this configuration.

[0010] In such a configuration, since the size of the chip placement area can be made sufficiently larger than the interval of the cutting line portions, when attaching the IC label, the IC chip of the IC label can be surely and stably placed in the chip placement area. As a result, in a state where the IC label is attached, the above-described effects of the present invention can be more stably exhibited. In this configuration, if the vertical and horizontal dimensions of the chip placement area are smaller than 1.5 times the interval of the cutting line portions, the distance between the IC chip and the cutting line portion becomes close. Therefore, when the above-described locally relatively large pressure acts, there is a concern about the reduction of the above-described protective action. On the other hand, if the vertical and horizontal dimensions are larger than 10 times the interval of the cutting line portions, there is a concern that the chip placement area will be peeled off from the label attachment area.

[0011] In addition, in this configuration, a configuration in which the vertical and horizontal dimensions of the chip placement area are 1.5 to 5 times the interval of the cutting line portions is preferable, and the above-described effects can be more stably exhibited. Also, a configuration in which the interval between adjacent cutting line portions is 1 to 4 mm is preferable. A configuration in which the vertical and horizontal dimensions of the chip placement area are 3 to 10 mm is preferable.

[0012] In addition, in the form used for label attachment of the present invention described above, the label attachment area includes a plurality of chip placement areas, and a configuration is proposed in which one or a plurality of pairs of chip placement areas provided to be point-symmetrical with each other about a symmetry point defined at the center of the label attachment area are provided.

[0013] In such a configuration, since there are a pair of chip placement areas that are point-symmetric with respect to the symmetry point, it is possible to selectively perform attaching the IC label so that the IC chip is placed in one chip placement area and attaching it after rotating it 180 degrees so that the IC chip is placed in the other chip placement area. As a result, when a plurality of label-attaching form papers with IC chips attached are stacked, the number of IC chips overlapping in the vertical direction can be reduced, and thus the load acting on each IC chip can be reduced.

[0014] On the other hand, a second aspect of the present invention provides a form paper with an IC label, comprising the above-described form paper for attaching a label and an IC label attached to the form paper for attaching a label, wherein the IC chip of the IC label is arranged in one chip placement area provided on the form paper for attaching a label.

[0015] In such a configuration, since the IC label is attached to the above-described form paper for attaching a label, it can achieve the same operational effects as those of the form paper for attaching a label.

Effects of the Invention

[0016] As described above, when the IC label attached to the label attachment area of the form paper for attaching a label of the present invention is peeled off, the paper base material is broken from the cut line portion and a trace remains, so that forgery by replacing the IC label can be prevented. Further, by arranging the IC chip in the chip placement area having no cut line portion, destruction of the IC chip due to pressure acting from the outside can be suppressed.

[0017] The form paper with an IC label of the present invention exhibits the same operational effects as those of the above-described form paper for attaching a label.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0019] Embodiments according to the present invention will be described with reference to the accompanying drawings. The certificate paper 1 of this embodiment is a rectangular paper used for an automobile inspection certificate. On the surface, as shown in Fig. 1(A), an information printing portion 2 for printing certification matters (such as vehicle number, registration date, vehicle name, model, owner's name, etc.) is provided. And a background pattern (not shown) for preventing radiation and forgery is printed on the entire surface of the certificate paper 1. Also, on the back side of the certificate paper 1, caution information for the user, entry columns, etc. (not shown) are provided.

[0020] As shown in FIG. 1(B), the certificate paper 1 has an IC label 6 attached to the back side of the right portion when viewed from the front. The IC label 6 is attached along the right edge of the certificate paper 1 in its longitudinal direction. The certificate paper 1 of the present embodiment is composed of a certificate base paper 5 made of paper (paper base material) and an IC label 6 attached to the back surface of the certificate base paper 5.

[0021] The certificate base paper 5 is provided with a label attachment area 11 for attaching the IC label 6 on the back surface. Since this label attachment area 11 relates to the main part of the present invention, details will be described later.

[0022] The IC label 6 is a non-contact battery-less type that can transmit and receive signals such as commands and data without contact using electromagnetic waves in the HF band with an input / output device (reader / writer device) not shown, and is a so-called RFID label. As shown in FIG. 3, the IC label 6 includes an antenna 15 printed with a conductive paste on the surface of a thin film (not shown), an IC chip 14 connected to the antenna 15 on the surface, and a label sheet 13 to which the thin film is laminated and adhered. The label sheet 13 is made of a PET film or paper, and an adhesive is applied to one side, and the IC label 6 is attached to the certificate base paper 5 by this adhesive.

[0023] The antenna 15 is a multi-loop antenna in which a conductive wire is wound in a loop shape a plurality of times, and is composed of a substantially rectangular annular multi-loop wire 17, a pair of terminal wires 18 extending inside the multi-loop wire 17, and a jumper wire 19 that straddles the multi-loop wire 17 and connects the outer end of the multi-loop wire 17 and one of the terminal wires 18. The IC chip 14 can magnetically store required matters, and is disposed on the terminal wire 18 of the antenna 15 and electrically connected to the antenna 15 by being adhered to the terminal wire 18 with an anisotropic conductive adhesive.

[0024] In this embodiment, the IC label 6 has a length of about 60 mm in the longitudinal direction, a length of about 20 mm in the short-side direction (left-right direction), and a thickness of 250 to 300 μm. The IC chip 14 is substantially square with a vertical and horizontal dimension of 0.8 to 1.8 mm. The certificate paper 1 has a thickness of 150 to 200 μm for the certificate mount 5 (paper), and a thickness of 400 to 450 μm at the portion where the IC label 6 is attached.

[0025] Next, the main part of the present invention will be described in the following Examples 1 and 2.

Example

[0026] In the label attachment area 11 provided on the back surface of the certificate mount 5, as shown in FIG. 4, a plurality of cut line portions 21a to 21c cut in a half-cut shape are formed at intervals over substantially the entire area of the label attachment area 11. Here, in this Example 1, a plurality of substantially L-shaped cut line portions 21a, a plurality of substantially C-shaped cut line portions 21b, and a plurality of substantially mountain-shaped cut line portions 21c are provided, respectively. The cut line portions 21a and 21b are formed by continuous cut lines, while the cut line portion 21c is formed by a plurality of continuous cut lines (substantially cross-shaped) and a cut line slightly separated therefrom (substantially L-shaped). These plurality of cut line portions 21a to 21c are provided in the label attachment area 11 at intervals of 1 to 3 mm.

[0027] By providing the cut line portions 21a to 21c in the label attachment area at relatively short intervals in this way, when the IC label 6 is peeled off, paper breakage can be continuously caused by the plurality of cut line portions 21a to 21c. Here, if the interval between the cut line portions 21a to 21c is shorter than 1 mm, the strength of the label attachment area 11 itself (the paper itself) decreases, while if it is larger than 3 mm, the effect of continuously causing paper breakage when the IC label 6 is peeled off is reduced. For these reasons, the interval of the cut line portions 21a to 21c is set.

[0028] Furthermore, in the label - attaching area 11, a plurality of chip - arranging areas 24a to 24c for arranging the IC chip 14 of the IC label 6 are provided. The chip - arranging areas 24a to 24c have a vertical and horizontal size longer than the intervals of the cut - line parts 21a to 21c and are larger in size than the IC chip 14. And the cut - line parts 21a to 21c are not formed in the chip - arranging areas 24a to 24c. Here, the vertical width of the chip - arranging areas 24a to 24c indicates the longitudinal width of the IC label 6, and the horizontal width indicates the lateral width (left - right direction) of the IC label 6. That is, in the chip - arranging areas 24a to 24c of the first embodiment 1, both the vertical width and the horizontal width are longer than the intervals of the cut - line parts 21a to 21c. In the first embodiment 1, the vertical width of the chip - arranging areas 24a to 24c is set to 5 to 7 mm, the horizontal width is set to 4 to 10 mm, the vertical width is 1.9 to 2.7 times the average interval of the cut - line parts 21a to 21c, and the horizontal width is 1.5 to 3.8 times the average interval. Incidentally, in the first embodiment 1, the average interval of the cut - line parts 21a to 21c is about 2.6 mm.

[0029] Such chip - arranging areas 24a to 24c are set according to the positions where the IC chip 14 of the IC label 6 is arranged when the IC label 6 is attached to the label - attaching area 11 (see FIGS. 5 and 8). Specifically, the chip - arranging areas 24a to 24c are provided at the parts where the respective IC chips 14 are arranged in a state where three types of IC labels 6 with different positions of the IC chip 14 are attached. Thereby, when the IC label 6 is attached to the label - attaching area 11, as shown in FIGS. 5 and 8, the IC chip 14 of the IC label 6 is arranged in the chip - arranging areas 24a to 24c.

[0030] Furthermore, since the chip placement areas 24a to 24c of the first embodiment have a vertical and horizontal width that is more than twice the width of the IC chip 14, in the state where the IC label 6 is attached, the distance between the IC chip 14 arranged in the chip placement areas 24a to 24c and the cut line portions 21a to 21c closest to the IC chip 14 is greater than the minimum interval (1 mm) of the cut line portions 21a to 21c. Thus, in the first embodiment, in the state where the IC chip 14 is arranged in the chip placement areas 24a to 24c (the state where the IC label 6 is attached), a certain distance can be provided between the IC chip 14 and the cut line portions 21a to 21c.

[0031] Also, in the first embodiment, in the label attachment area 11, a pair of chip placement areas 24a, 24a that are point-symmetrical about the central symmetry point of the label attachment area 11, a pair of chip placement areas 24b, 24b that are point-symmetrical about the same symmetry point, and a pair of chip placement areas 24c, 24c that are point-symmetrical about the same symmetry point are provided. Thereby, as shown in FIGS. 5 and 6, even when the IC label 6 of the IC chip 14 arranged in the chip placement areas 24a to 24c is attached in the reverse longitudinal direction (the direction rotated 180 degrees), the IC chip 14 can be arranged in the chip placement areas 24a to 24c provided in point symmetry.

[0032] Furthermore, in the first embodiment, a background pattern (not shown) is printed over the entire label attachment area 11. Thereby, even when looking through the certificate paper 1, the cut line portions 21a to 21c are difficult to visually recognize.

[0033] As shown in FIG. 7, the certificate paper 1 of this first embodiment is obtained by separating a continuous certificate paper 41 in which a plurality (4 sheets) of certificate bases 5 are connected in series via perforations 42 at the perforations 42. The continuous certificate paper 41 is stacked, transported, and stored with IC labels 6 attached to the label attachment areas 11 of the respective certificate bases 5. In such a state where a plurality of continuous certificate papers 41 are stacked, since the positions of the IC chips 14 overlap in the vertical direction, a load is applied to the IC chips 14. In the first embodiment, as described above, by attaching the IC label 6 in the reverse longitudinal direction, the number of overlapping IC chips 14 can be reduced, and the load acting on the IC chips 14 can be reduced.

[0034] On the other hand, the certificate paper 1 is required to have a high fracture resistance that can prevent failures due to the load acting on the IC chip 14 by the stacking. Therefore, an experiment was conducted in which a predetermined load was applied to the IC chip 14 of the certificate paper 1 from the front side of the certificate paper 1 to examine the failure rate of the IC chip 14. In this embodiment, an experiment in which a pressure of about 20 N was applied to the IC chip 14 from the front side of the certificate paper 1 was conducted with n = 100. Furthermore, the same experiment was also conducted on the certificate paper 101 of the comparative example shown in FIG. 9 and compared with the first embodiment. Here, the certificate paper 101 of the comparative example has no chip arrangement area in the label attachment area 11, and cut line portions 21a and 21b are also formed at portions corresponding to the chip arrangement area of the first embodiment. Therefore, in the comparative example, with the IC label 6 attached to the label attachment area 11, the IC chip 14 overlaps the cut line portions 21a and 21b. Note that the comparative example is the same as the embodiment except that there is no chip arrangement area.

[0035] As a result of conducting the above experiment on the certificate paper 1 of the first embodiment and the certificate paper 101 of the comparative example, no failure occurred in the IC chip 14 of the certificate paper 1 of the first embodiment (failure rate = 0%). On the other hand, in the certificate paper 101 of the comparative example, failures occurred in 5 IC chips 14 (failure rate = 5%). Thus, the certificate paper 1 of the first embodiment has a high fracture resistance that prevents failures of the IC chip 14.

[0036] The certificate paper 1 of this Example 1 has a plurality of cut line portions 21a to 21c formed at intervals across substantially the entire label attachment area 11 of the certificate mount 5, and a plurality of chip arrangement areas 24a to 24c that are larger in vertical and horizontal dimensions than the intervals between the cut line portions 21a to 21c and larger in size than the IC chip 14 are formed. The IC chip 14 of the IC label 6 attached to the label attachment area 11 is arranged in one of the chip arrangement areas 24a to 24c. In this configuration, since the IC chip 14 is arranged in the chip arrangement areas 24a to 24c without the cut line portions 21a to 21c, it has a high bursting strength that can withstand the load generated by stacking a large number, and can prevent a failure from occurring in the IC chip 14 during transportation, storage, etc.

[0037] Also, since the cut line portions 21a to 21c are formed in the label attachment area 11 of the certificate mount 5 in the certificate paper 1 of this Example 1, when the IC label 6 is peeled off from the label attachment area 11, the paper of the certificate mount 5 is broken from the cut line portions 21a to 21c. Thereby, when an illegal act such as replacement of the IC label is committed, a trace of the paper breakage remains, so that forgery by the illegal act can be prevented. In particular, in this Example 1, since a plurality of cut line portions 21a to 21c are formed at extremely short intervals across substantially the entire label attachment area 11, paper breakage is likely to occur continuously due to the peeling of the IC label 6. In addition, in this Example 1, since a background pattern (not shown) is printed across substantially the entire label attachment area 11, it is difficult to visually recognize the cut line portions 21a to 21c even when seen through. For this reason, it is difficult to perform an illegal act of peeling off the IC label 6 so as not to cause paper breakage at the cut line portions 21a to 21c. For these reasons, according to the configuration of this Example 1, the effect of preventing the forgery is high.

[0038] Furthermore, in the label attachment area 11 of the certificate mount 5, since the cut line portions 21a to 21c are formed at positions that are point-symmetrical with respect to the center of symmetry of the label attachment area 11, by attaching the IC label 6 of the same form in the reverse direction (the direction rotated 180 degrees), the arrangement of the IC chips 14 can be changed. As a result, by alternately changing the attachment direction of the IC label 6, when a plurality of certificate papers 1 are stacked for storage or transportation, the load on each IC chip 14 can be reduced, and the effect of suppressing the occurrence of the above-described failures is improved. For example, as shown in FIG. 7, when a plurality of continuous certificate papers 41 are stacked and transported or stored, the attachment direction of the IC label 6 can be alternately changed. Thereby, the number of overlapping IC chips 14 can be reduced.

[0039] Also, in the first embodiment, as described above, since the sizes of the chip arrangement areas 24a to 24c are larger than those of the IC chips 14, even when the attachment position of the IC label 6 is slightly deviated, the IC chips 14 can be stably arranged in the chip arrangement areas 24a to 24c. Thereby, the operational effect of preventing the occurrence of the above-described failures can be more stably exhibited.

[0040] In addition, in the first embodiment described above, the certificate paper 1 corresponds to the IC label-attached form according to the present invention, and the certificate mount 5 corresponds to the label-attaching form according to the present invention. And the back surface of the certificate mount 5 corresponds to one surface of the paper base material according to the present invention.

Example

[0041] In the second embodiment, as shown in FIG. 10, a plurality of cut line portions 21a, 21c, 21d cut in a half-cut shape are formed in the label attachment area 11 of the certificate mount 5. Here, the configuration of the second embodiment is such that a substantially X-shaped cut line portion 21d is formed instead of the substantially C-shaped cut line portion 21b (see FIG. 4) in the first embodiment described above, and each cut line portion 21d is formed at substantially the same position as each cut line portion 21b of the first embodiment. Thereby, the interval (average interval) between the cut line portions 21a, 21c, 21d is set in the same manner as in the first embodiment.

[0042] Furthermore, since the configuration of Example 2 is the same as that of Example 1 except that the cut line portion 21d is provided, the same reference numerals are given to the same components, and the details thereof are omitted. Also, in Example 2 as well, as in Example 1 described above, in a state where IC labels 6 are respectively attached to each of the plurality of certificate base papers 5 of the continuous certificate paper in which the plurality of certificate base papers 5 are connected through perforations, the plurality of continuous certificate papers are stacked and transported and stored (see FIG. 7). Then, by cutting along the perforations of the continuous certificate paper, the certificate paper of Example 2 is obtained.

[0043] Such a configuration of Example 2, as in Example 1 described above, is such that a plurality of cut line portions 21a, 21c, 21d are formed at intervals over substantially the entire label attachment region 11, and a plurality of chip arrangement regions 24a to 24c having a length and width larger than the interval and a size larger than that of the IC chip 14 are formed. Then, the IC label 6 is attached to the label attachment region 11 such that the IC chips 14 are arranged in the chip arrangement regions 24a to 24c. Even in such a configuration of Example 2, the same operational effects as those of Example 1 described above can be achieved.

[0044] The present invention is not limited to Examples 1 and 2 described above, and can be appropriately modified within a range not departing from the gist of the present invention. For example, the shape of the cut line portion is not limited to the examples and can be appropriately changed. Also, the size of the cut line portion can be appropriately changed.

[0045] Also, in Examples 1 and 2, a configuration is adopted in which three types of cut line portions having different shapes are formed. However, the present invention is not limited to this, and for example, a configuration in which a plurality of cut line portions having the same shape are formed, or a configuration in which a plurality of cut line portions having two or five types of shapes are formed may be adopted.

[0046] In addition, the certificate paper 1 in Examples 1 and 2 is configured such that a continuous certificate paper 41 in which a plurality (4 sheets) of certificate base papers 5 are continuous via perforations 42 is obtained by separating the certificate base papers 5 at the perforations 42. However, the present invention is not limited to this, and a configuration may be adopted in which a continuous paper in which a large number of certificate base papers 5 are arranged in a line in the longitudinal direction via perforations is obtained by separating the continuous paper at the perforations. In such a configuration, since the continuous paper is transported and stored in a state where it is alternately folded back and overlapped in a bellows shape at the perforations, by appropriately changing the sticking direction of the IC label, the number of overlapping IC chips can be reduced, and the load acting on the IC chips can be reduced as in Examples 1 and 2.

Explanation of Signs

[0047] 1 Certificate paper 5 Certificate base paper 6 IC label 11 Label sticking area 14 IC chip 15 Antenna 21a~21d Cut line part 24a~24c Chip arrangement area

Claims

1. A label - attaching area is provided on one side of a paper substrate, on which an IC label having an IC chip and an antenna is attached. In the label - attaching area, a plurality of cut - line portions cut into a predetermined shape are formed at intervals over substantially the entire area of the label - attaching area, and one or more chip - arranging areas without the cut - line portions are provided for arranging the IC chip of the IC label attached to the label - attaching area. The label - attaching form sheet is characterized in that the chip - arranging area is formed with a vertical and horizontal size longer than the interval of the cut - line portions and with a size larger than the IC chip.

2. The label - attaching form sheet according to claim 1, wherein the vertical and horizontal size of the chip - arranging area is 1.5 to 8 times that of the interval of the cut - line portions.

3. The label - attaching area comprises a plurality of chip - arranging areas, and the label - attaching form sheet according to claim 1 or claim 2, characterized by comprising one or more pairs of chip - arranging areas provided to be point - symmetric with respect to a symmetric point defined at the center of the label - attaching area.

4. A form sheet with an IC label, comprising the label - attaching form sheet according to any one of claims 1 to 3, and the IC label attached to the label - attaching form sheet, wherein the IC chip of the IC label is arranged in one chip - arranging area provided on the label - attaching form sheet.

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