Rotating shaft sealing device and semiconductor substrate processing apparatus using the same

Abstract

To provide a rotating shaft sealing device not requiring the supply of an additional lubricant and enabling an extremely compact and simple structure, and a semiconductor substrate processing apparatus using the same.SOLUTION: Disclosed is a rotating shaft sealing device. According to one embodiment, the rotating shaft sealing device attached to a semiconductor substrate processing apparatus that processes a semiconductor substrate while rotating a semiconductor loading unit accommodating the semiconductor substrate includes: a housing that is hollow and attached to the semiconductor substrate processing apparatus; a rotating shaft accommodated in the housing and connected to the semiconductor loading unit to transfer a rotational force to the semiconductor loading unit; a bearing rotatably supporting the rotating shaft in the housing; a sealing unit including a plurality of seals to tightly seal a gap between the housing and the rotating shaft; and a power transfer unit attached to an end of the rotating shaft to transfer a rotational force to the rotating shaft.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a rotating shaft sealing device and a semiconductor substrate processing apparatus using the same, and more particularly to a rotating shaft sealing device that prevents fluid leakage between a rotating shaft and a housing, and a semiconductor substrate processing apparatus including the same.

Background Art

[0002] Semiconductor equipment is used for mass production of integrated circuits. Physical vapor deposition methods (PVD) such as sputtering and chemical vapor deposition methods (CVD) using chemical reactions are used to deposit thin films of a predetermined thickness on substrates such as semiconductor wafers and glass. Examples of chemical vapor deposition methods include atmospheric pressure chemical vapor deposition (APCVD), low pressure chemical vapor deposition (LPCVD), and plasma enhanced chemical vapor deposition. In addition, furnace equipment for heat treatment of substrates is used for film formation, oxidation, annealing, and impurity diffusion processes of semiconductor wafers.

[0003] Such semiconductor equipment uses a rotating shaft sealing device for vacuum pressure equipment. The rotating shaft sealing device faces a high-pressure region and a low-pressure region, is provided on the outer peripheral surface of a shaft that rotates between these regions, and is provided to seal the high-pressure region and the low-pressure region from each other.

[0004] Conventional sealing devices for vacuum pressure equipment include a housing and a rotating shaft that is coupled through the housing. The rotating shaft faces a high-pressure region and a low-pressure region, and the housing is located at the interface between the high-pressure region and the low-pressure region. In addition, a sealing seal is provided between the housing and the rotating shaft. The sealing seal is for sealing between the housing and the rotating shaft, and friction will also occur between the rotating shaft and the sealing seal.

[0005] In such a sealing device, it is necessary to prevent foreign matter from flowing out of the semiconductor vacuum pressure equipment or, conversely, from flowing into the semiconductor vacuum pressure equipment.

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of an embodiment of the present invention is to provide a rotating shaft sealing device that does not require a separate supply of lubricating oil and can have an extremely simple and straightforward structure, and a semiconductor substrate processing apparatus using the same.

[0007] In addition, it is to minimize the vibration of the rotating shaft of the rotating shaft sealing device, prevent foreign matter such as particles from the semiconductor substrate processing apparatus from flowing into the rotating shaft sealing device, and prevent foreign matter from the rotating shaft sealing device from flowing out to the semiconductor substrate processing apparatus.

[0008] The problems to be solved in the embodiment are not limited to the problems mentioned above, and further problems not mentioned will be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0009] A rotating shaft sealing device mounted on a semiconductor substrate processing apparatus for rotating a semiconductor loading unit that houses a semiconductor substrate to process the semiconductor substrate includes a hollow housing mounted on the semiconductor substrate processing apparatus, a rotating shaft housed in the housing and connected to the semiconductor loading unit to transmit a rotational force to the semiconductor loading unit, a bearing that rotatably supports the rotating shaft in the housing, a sealing portion provided in the housing to seal a gap between the housing and the rotating shaft and including a plurality of seals, and a power transmission portion mounted on one end of the rotating shaft to transmit a rotational force to the rotating shaft.

[0010] The sealing portion is disposed above the bearing so as to approach the flange portion of the housing coupled to the semiconductor substrate processing apparatus, and the power transmission portion can be disposed below the bearing.

[0011] The sealing portion includes one or more vacuum seals for maintaining the vacuum of the semiconductor substrate processing apparatus and one or more elastic seals for supporting the rotating shaft and suppressing vibration. The vacuum seal and the elastic seal are formed of a plastic material, and the elastic seal can have a greater elastic force than the vacuum seal.

[0012] The vacuum seal is a lip seal in which a curved lip is formed on the inner peripheral edge of an annular seal, and an elastic member can be inserted inside the seal body of the elastic seal.

[0013] An annular rotation prevention member can be provided on the outer peripheral surface of the vacuum seal and the elastic seal facing the housing so as to prevent relative rotation with the housing within the housing.

[0014] The vacuum seal and the elastic seal are arranged adjacent to each other in series. However, the vacuum seal is disposed closer to the flange portion of the housing coupled to the semiconductor substrate processing apparatus than the elastic seal, and the elastic seal can be disposed closer to the bearing than the vacuum seal.

[0015] The sealing portion can further include a pressure seal for preventing foreign matter from flowing into the inside from the semiconductor substrate processing apparatus when the inside of the semiconductor substrate processing apparatus is pressurized.

[0016] A labyrinth seal can be provided above the sealing portion to prevent foreign matter from the semiconductor substrate processing apparatus from flowing into the housing.

[0017] The housing can include a cooling water jacket provided at the periphery of the sealing portion so as to cool the sealing portion.

[0018] The housing can include a purge gas inflow path provided in the housing so as to prevent foreign matter from the semiconductor substrate processing apparatus from flowing into the housing, and a purge gas inflow port provided on a side surface of the housing so as to allow purge gas to flow in from the outside through the purge gas inflow path.

[0019] A labyrinth seal for preventing foreign matter from the semiconductor substrate processing apparatus from flowing into the housing is provided above the sealing portion, and the purge gas that has moved through the purge gas inflow path can be supplied to the semiconductor substrate processing apparatus through the labyrinth seal.

[0020] A semiconductor substrate processing apparatus for processing a semiconductor substrate according to an embodiment of the present invention includes a process tube that houses a plurality of semiconductor substrates therein, a semiconductor loading unit that is disposed in the process tube so as to be movable up and down, a nozzle unit that is provided inside the process tube for injecting a process gas, a sealing cap that is connected to the semiconductor loading unit and seals the lower portion of the process tube, and a rotary shaft sealing device that rotates the semiconductor loading unit and performs a sealing function. The rotary shaft sealing device includes a hollow housing that is attached to the sealing cap, a rotary shaft that is housed in the housing and is connected to the semiconductor loading unit to transmit a rotational force to the semiconductor loading unit, a bearing that rotatably supports the rotary shaft in the housing, a sealing portion that includes a plurality of seals for sealing a gap between the housing and the rotary shaft, and a power transmission portion that is attached to one end of the rotary shaft to transmit a rotational force to the rotary shaft.

[0021] The sealing portion is disposed above the bearing so as to approach the flange portion of the housing that is coupled to the sealing cap, and the power transmission portion can be disposed below the bearing.

[0022] The sealing part includes one or more vacuum seals for maintaining the vacuum of the process tube and one or more elastic seals for supporting the rotating shaft and suppressing vibration. The vacuum seal and the elastic seal are formed of a plastic material, and the elastic seal may have a greater elastic force than the vacuum seal.

[0023] The vacuum seal is a lip seal in which a curved lip is formed on the inner peripheral edge of an annular seal, and an elastic member can be inserted into the elastic seal inside the seal body.

[0024] Further, an annular rotation prevention member can be provided on the outer peripheral surface of the vacuum seal and the elastic seal facing the housing so as to prevent relative rotation with the housing within the housing.

[0025] Further, the vacuum seal and the elastic seal are arranged adjacent to each other in series. The vacuum seal is arranged closer to the flange portion of the housing coupled to the semiconductor substrate processing apparatus than the elastic seal, and the elastic seal can be arranged closer to the bearing than the vacuum seal.

[0026] Further, the sealing part can further include a pressure seal for preventing foreign matter from flowing into the inside of the rotating shaft sealing device from the process tube when the inside of the process tube is pressurized.

[0027] Further, a labyrinth seal for preventing foreign matter generated in the process tube from flowing into the housing can be provided above the sealing part.

[0028] Further, the housing can include a cooling water jacket provided on the periphery of the sealing part so as to cool the sealing part.

[0029] Further, the housing may include a purge gas inlet passage provided in the housing to prevent foreign matter generated in the process tube from flowing into the housing, and a purge gas inlet port provided on a side surface of the housing to allow purge gas to flow in from the outside through the purge gas inlet passage.

[0030] Also, a labyrinth seal is provided above the sealing portion to prevent foreign matter generated in the process tube from flowing into the housing, and the purge gas that has moved through the purge gas inlet passage can be supplied to the process tube through the labyrinth seal.

Advantages of the Invention

[0031] According to the rotating shaft sealing device and the semiconductor substrate processing apparatus using the same according to the embodiment of the present invention, since the sealing portion makes line contact with the object to be rotated, the frictional force can be minimized and the supply of separate lubricating oil is not required, so that the structure can be made extremely simple and concise.

[0032] In addition, the vibration of the rotating shaft of the rotating shaft sealing device can be minimized, and foreign matter such as particles from the semiconductor substrate processing apparatus can be prevented from flowing into the inside of the rotating shaft sealing device.

[0033] In addition, since the rotating shaft sealing device includes a cooling water jacket, the temperature of the sealing portion can be kept low and the life of the sealing portion can be extended.

[0034] In addition, by arranging the sealing portion above the bearing, foreign matter generated in the bearing can be prevented from flowing into the semiconductor substrate processing apparatus.

[0035] In addition, by flowing purge gas above the sealing portion and discharging it to the semiconductor substrate processing apparatus, foreign matter generated in the semiconductor substrate processing apparatus can be prevented from flowing into the sealing portion.

Brief Description of the Drawings

[0036]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0037] Hereinafter, embodiments of the present invention will be described in detail so that those having ordinary knowledge in the technical field to which the present invention belongs can easily implement it with reference to the attached drawings. However, the present invention may be realized in various different forms and is not limited to the embodiments described here. And in the drawings, parts not related to the description are omitted in order to clearly explain the embodiments of the present invention.

[0038] The terms used in this specification are merely used to describe specific embodiments and are not intended to limit the present invention. Singular expressions may include plural expressions unless the context clearly indicates otherwise.

[0039] In this specification, terms such as "comprising," "having," or "including" are intended to specify the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and are to be understood not to preclude in advance the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0040] Also, the following embodiments are provided to more clearly explain to those with average knowledge in the art, and elements such as the shape and size in the drawings may be exaggerated for a clearer explanation.

[0041] Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described. FIG. 1 is a diagram showing a rotating shaft sealing device and a semiconductor substrate processing device according to an embodiment of the present invention, and FIG. 2 is a perspective view of the rotating shaft sealing device according to an embodiment of the present invention. FIG. 3 is a plan view of the rotating shaft sealing device shown in FIG. 2, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 2.

[0042] First, referring to FIG. 1, a semiconductor substrate processing device 10 according to an embodiment of the present invention can be, for example, a vertical furnace device for heat-treating semiconductor substrates. The semiconductor substrate processing device 10 includes a process tube 220, a semiconductor loading unit 250, a nozzle unit 230, a sealing cap 224, and a rotating shaft sealing device 100.

[0043] The process tube 220 has a space capable of accommodating a plurality of semiconductor substrates (W) that require heat treatment, and the bottom is open, and the bottom may be opened and closed by the sealing cap 224. When the bottom of the process tube 220 is closed by the sealing cap 224, an O-ring 226 may be provided between the flange 222 of the process tube 220 and the sealing cap 224 to be sealed.

[0044] The semiconductor loading unit 250 is provided for holding a plurality of semiconductor substrates (W), and may be arranged to be movable up and down within the process tube 220. Specifically, the semiconductor loading unit 250 may hold the semiconductor substrates (W), which are substrates to be processed, at a predetermined interval in the vertical direction. A heat insulation mechanism 252 and a turntable 254 are provided at the lower part of the semiconductor loading unit 250. The semiconductor loading unit 250, the heat insulation mechanism 252, and the turntable 254 can be moved up and down with respect to the process tube 220 by an elevator device 270 together with the sealing cap 224. At the lowered position of the semiconductor loading unit 250, a plurality of semiconductor substrates (W) may be arranged on the semiconductor loading unit 250, and at the raised position, the semiconductor loading unit 250 is accommodated within the process tube 220, and the bottom of the process tube 220 may be closed and sealed by the sealing cap 224.

[0045] On the other hand, a nozzle unit 230 for injecting a process gas for processing the semiconductor substrate (W) is provided within the process tube 220, and an exhaust pipe 240 for discharging the process gas and maintaining the inside of the process tube 220 in a vacuum is provided.

[0046] Also, a heater assembly 210 for heating the process tube 220 may be arranged at the periphery of the process tube 220. The heater assembly 210 can heat-treat the semiconductor substrates (W) accommodated in the semiconductor loading unit 250 using radiant heat.

[0047] The rotary shaft sealing device 100 is provided for rotating the semiconductor loading unit 250 to perform a sealing function. A shaft through-hole is formed at the center of the sealing cap 224, and one end of the rotary shaft 120 of the rotary shaft sealing device 100 may protrude through the shaft through-hole. A turntable 254 is connected to one end of the protruding rotary shaft 120. Therefore, when the turntable 254 rotates due to the rotation of the rotary shaft 120, the semiconductor loading unit 250 arranged on the turntable 254 can also rotate together.

[0048] Referring to FIGS. 2 to 4, the rotary shaft sealing device 100 is provided for rotating the semiconductor mounting unit 250. The rotary shaft sealing device 100 includes a housing 110, a rotary shaft 120, a bearing 130, a sealing portion 150, and a power transmission portion 140.

[0049] The housing 110 is in a hollow form and can accommodate the rotary shaft 120, the bearing 130, the sealing portion 150, and the power transmission portion 140 therein. A flange portion 112 to be mounted on the semiconductor substrate processing apparatus is provided on the upper portion of the housing 110. As an example, as shown in FIG. 1, when the semiconductor substrate processing apparatus is a furnace apparatus, the rotary shaft sealing device 100 may be mounted below the sealing cap 224. An O-ring 113 is provided on the flange portion 112, and sealing between the flange portion 112 and the sealing cap 224 can be performed. Further, a driving device 200 such as a motor may be provided on one side of the housing 110.

[0050] The bearing 130 is provided in the housing 110 and can rotatably support the rotary shaft 120 within the housing 110. In the present embodiment, the bearing 130 is provided above the power transmission portion 140 and is generally provided at the central portion of the housing 110 as a whole, and can suppress vibration of the rotary shaft 120 and stably support the rotary shaft 120. In the present embodiment, the bearing 130 may be a double-row angular contact bearing as a thrust block. The double-row angular contact bearing 130 can support the load applied to the rotary shaft 120 in order to support the load of the semiconductor mounting unit 250 that houses a plurality of semiconductor substrates (W). On the other hand, a spacer 116 for filling the gap between the bearing 130 and the sealing portion 150 can be provided.

[0051] The sealing part 150 is provided to seal the gap between the housing 110 and the rotating shaft 120. The sealing part 150 prevents foreign matters (such as particles) generated in the rotating shaft sealing device 100 from flowing into the vacuum semiconductor substrate processing device provided above the rotating shaft sealing device 100, and seals the inside of the semiconductor substrate processing device so as to maintain a vacuum. The sealing part 150 may be arranged by combining a plurality of seals. A detailed description of the sealing part 150 will be given later.

[0052] The power transmission part 140 is provided at one end of the rotating shaft 120, that is, below the bearing 130 in this embodiment, and is provided to transmit a rotational force to the rotating shaft 120. The rotational force generated by a driving device 200 such as a motor can be transmitted to the rotating shaft 120 via the power transmission part 140. In this embodiment, the power transmission part 140 is provided with a worm gear, and the direction of the rotational force generated by the driving device 200 can be switched. Thereby, the height of the housing 110 can be reduced, the size of the rotating shaft sealing device 100 can be miniaturized, space can be saved and installation is easy, and replacement and maintenance can be facilitated.

[0053] In this embodiment, the sealing part 150 may be arranged closer to the flange part 112 of the housing 110 that is coupled to the semiconductor substrate processing device than the bearing 130, that is, above the bearing 130. Also, the power transmission part 140 may have a structure arranged below the bearing 130. Thereby, it is possible to block foreign matters such as particles that may be generated during the operation of the bearing 130 from flowing into the semiconductor substrate processing device due to a pressure difference. Also, since the bearing 130 is provided between the power transmission part 140 and the sealing part 150, the rotating shaft 120 can be supported more stably.

[0054] On the one hand, when the semiconductor substrate processing apparatus operates in a high-temperature environment like a furnace apparatus, since the sealing portion 150 is arranged closer to the semiconductor substrate processing apparatus than other components and adjacent to the flange portion 112, the temperature of the sealing portion 150 among the components of the rotary shaft sealing apparatus 100 is relatively high. In the present embodiment, a cooling water jacket 182 is provided in the housing 120 at a portion corresponding to the periphery of the sealing portion 150 so as to cool the sealing portion 150. Thereby, the temperature of the sealing portion 150 can be lowered, and the service life of the plurality of seals 152, 156 provided in the sealing portion 150 can be extended.

[0055] On the other hand, when the process of semiconductor substrate processing in the semiconductor substrate processing apparatus is completed, or the pressure inside the semiconductor substrate processing apparatus changes to atmospheric pressure or higher than atmospheric pressure which is not vacuum for reasons such as cleaning. In this case, the pressure inside the semiconductor substrate processing apparatus can be rather higher than the pressure inside the rotary shaft sealing apparatus 100. Therefore, foreign matters such as particles remaining in the semiconductor substrate processing apparatus may flow reversely into the inside of the rotary shaft sealing apparatus 100. To prevent this, in the present embodiment, a labyrinth seal 114 can be provided on the flange portion 112 of the housing 110.

[0056] Also, in the present embodiment, a purge gas inflow path 172 can be provided in the wall body of the housing 110 so as to prevent foreign matters such as the particles remaining in the semiconductor substrate processing apparatus from flowing into the inside of the rotary shaft sealing apparatus 100. Further, a purge gas inflow port 170 may be provided on the side surface of the housing 110 so as to allow a purge gas to flow in from the outside through the purge gas inflow path 172. The purge gas inflow path 172 extends upward toward the flange portion 112 within the wall body of the housing 110 and communicates with the labyrinth seal 114 provided on the flange portion 112. Therefore, the purge gas flowing through the purge gas inflow path 172 can pass through the labyrinth seal 114 and be supplied toward the semiconductor substrate processing apparatus.

[0057] FIG. 5 is a cross-sectional view of a rotating shaft sealing device according to another embodiment of the present invention. Referring to FIG. 5, the rotating shaft sealing device according to another embodiment of the present invention is the same as the rotating shaft sealing device shown in FIG. 4, except that the purge gas inflow path 172 includes an additionally provided branch portion 172a leading toward the sealing portion 150. Since the purge gas inflow path 172 communicates with the buffer space 150a inside the sealing portion 150 via the branch portion 172a, even if foreign matters such as particles are left between the sealing portions 150, they can be cleaned through the purge gas. In the present embodiment, the buffer space 150a can be provided between the elastic seals 156.

[0058] On the other hand, a vacuum pump (not shown) may be connected to the purge gas inflow path 172. Therefore, the buffer space 150a communicating with the branch portion 172a can hold a vacuum. Accordingly, even if a part of the vacuum seal 152 is damaged, the vacuum in the region (A) can be maintained due to the buffer space 150a in which a vacuum is formed.

[0059] Hereinafter, referring to FIG. 6, the structure of the sealing portion used in the above-described rotating shaft sealing device will be described in detail.

[0060] Referring to FIG. 6, the sealing portion 150 according to an embodiment of the present invention includes a plurality of vacuum seals 152 and a plurality of elastic seals 156. The vacuum seal 152 is provided to maintain the vacuum of the semiconductor substrate processing apparatus disposed above the rotating shaft sealing device 100, and the elastic seal 156 is provided to support the rotating shaft 120 and suppress vibration. All of the vacuum seal 152 and the elastic seal 156 may be formed of a plastic material. Further, the elastic force of the elastic seal 156 may be greater than that of the vacuum seal 152, and may be two times or more.

[0061] The vacuum seal 152 is a lip seal made of a plastic material with a lip curved on the inner peripheral edge of an annular seal. As shown in FIG. 6, it has a shape curved in the opposite direction so as to hold the vacuum in the region (A) where a vacuum is formed.

[0062] The elastic seal 156 serves to support the rotating shaft 120 together with the bearing 130 so that the axis 122 is constantly maintained without being changed by vibration or the like when the rotating shaft 120 rotates. On the other hand, when a variation in the axis 122 occurs, the space between the rotating shaft 120 and the vacuum seal 152 may be separated, and there arises a problem that foreign matter may flow in from there. In the present embodiment, since the elastic seal 156 is provided even when a variation in the axis 122 occurs, it is possible to block the foreign matter that has flowed into the space between the rotating shaft 120 and the vacuum seal 152 from entering the region (B). The elastic seal 156 includes a seal body 156a made of a plastic material having a recess formed in one direction, and an elastic member 156b accommodated inside the seal body 156a and capable of pressing the seal body 156a toward the rotating shaft 120. The elastic member 156b may be, for example, an O-ring, a square ring, or a metal spring, but is not limited thereto.

[0063] The vacuum seal 152 and the elastic seal 156 are arranged adjacent to each other in series in the direction of the axis 122. As shown in FIG. 4, the vacuum seal 152 may be arranged closer to the flange portion 112 of the housing 110 than the elastic seal 156, and the elastic seal 156 may be arranged closer to the bearing 130 than the vacuum seal 152. Also, a plurality of each of the vacuum seal 152 and the elastic seal 156 may be provided so that their functions can be maintained even if any one of the vacuum seals 152 or elastic seals 156 is damaged.

[0064] Further, an annular anti-rotation member 159 can be provided on the outer peripheral surface of the vacuum seal 152 and the elastic seal 156 facing the housing 110 so as to prevent the vacuum seal 152 and the elastic seal 156 from rotating relative to the housing 110 within the housing 110.

[0065] The rotation prevention member 159 serves to further pressurize the vacuum seal 152 and the elastic seal 156 toward the rotary shaft 120. Also, when there is no rotation prevention member 159, that is, when the vacuum seal 152 and the elastic seal 156 are in direct contact with the inner peripheral surface of the housing 110, the frictional force between the rotation prevention member 159 and the vacuum seal 152 and the elastic seal 156 is greater. Therefore, it is possible to suppress the relative rotation of the vacuum seal 152 and the elastic seal 156 with respect to the housing 110 within the housing 110.

[0066] Also, when disassembling and assembling the rotary shaft sealing device 100 for reasons such as damage and inspection, even if the surface roughness of the housing 110 is relatively rough, during the disassembly and assembly process, since the rotation prevention member 159 rubs against the inner peripheral surface of the housing 110, the sealing portion 150 can minimize damage caused by the low surface roughness of the housing 110. Further, even if the rotation prevention member 159 is damaged to some extent, since there is an advantage that it can be recycled, the rotary shaft sealing device 100 can be disassembled and assembled more easily.

[0067] FIG. 7 is a diagram schematically showing the structure of a sealing portion according to another embodiment of the present invention.

[0068] Referring to FIG. 7, the sealing portion according to another embodiment of the present invention is the same as that shown in the embodiment of FIG. 6, except that a pressure seal 158 is added. The pressure seal 158 is provided to prevent foreign matter from flowing into the semiconductor substrate processing apparatus when the inside of the semiconductor substrate processing apparatus is pressurized for reasons such as cleaning. In the present embodiment, the pressure seal 158 is disposed in front of the vacuum seal 152, that is, closer to the labyrinth seal 114 than the vacuum seal 152. The pressure seal 158 may be a lip seal made of a plastic material in which a lip curved on the inner peripheral edge of an annular seal is formed in the same manner as the vacuum seal 152. As shown in the figure, when the region (A) is pressurized, the pressure seal 158 has a shape curved in the direction of the region (A) so as to prevent foreign matter from flowing in from the region (A).

[0069] According to the rotating shaft sealing device according to the above-described embodiment and the semiconductor substrate processing apparatus using the same, the vacuum seal, the pressure seal, and the elastic seal can minimize the frictional force by making line contact with the object to be rotated, and since the supply of separate lubricating oil is unnecessary, the structure can be made extremely simple and straightforward.

[0070] In addition, the vibration of the rotating shaft of the rotating shaft sealing device can be minimized, and foreign substances such as particles from the semiconductor substrate processing apparatus can be prevented from flowing into the interior of the rotating shaft sealing device.

[0071] In addition, since the rotating shaft sealing device includes a cooling water jacket, the temperature of the sealing portion can be kept low, and the life of the sealing portion can be extended.

[0072] In addition, by disposing the sealing portion above the bearing, foreign substances generated in the bearing can be prevented from flowing into the semiconductor substrate processing apparatus.

[0073] In addition, by supplying purge gas to the upper part of the sealing portion and discharging it to the semiconductor substrate processing apparatus, foreign substances generated in the semiconductor substrate processing apparatus can be prevented from flowing into the sealing portion.

[0074] As described above, the present invention has been described based on the embodiments and drawings limited to specific matters such as specific components, but this is merely provided to assist a more general understanding of the present invention, and the present invention is not limited to the above-described embodiments. Those having ordinary knowledge in the technical field to which the present invention pertains can attempt various modifications and deformations from such descriptions.

[0075] Therefore, the idea of the present invention is not determined by being limited to the above-described embodiments, and it can be said that not only the scope of the following claims but also all those modified to be equivalent or equivalent to this scope of claims belong to the category of the idea of the present invention.

Claims

1. A rotary shaft sealing device mounted on a semiconductor substrate processing apparatus that rotates a semiconductor loading unit containing a semiconductor substrate to process the semiconductor substrate, comprising: a hollow housing mounted on the semiconductor substrate processing apparatus; a rotary shaft housed in the housing, connected to the semiconductor loading unit, and transmitting a rotational force to the semiconductor loading unit; a bearing that rotatably supports the rotary shaft in the housing; a sealing portion disposed in the housing to seal a gap between the housing and the rotary shaft, the sealing portion including a plurality of seals; a power transmission portion mounted on one end of the rotary shaft to transmit a rotational force to the rotary shaft, wherein the housing includes a purge gas inflow passage provided in the housing to prevent foreign matter from the semiconductor substrate processing apparatus from flowing into the housing; and a purge gas inflow port provided on a side surface of the housing to allow purge gas to flow in from the outside through the purge gas inflow passage; and the sealing portion further includes a pressure seal that contacts the rotary shaft and prevents foreign matter from flowing into the interior from the semiconductor substrate processing apparatus when the interior of the semiconductor substrate processing apparatus is pressurized. The rotary shaft sealing device is as described above.

2. The sealing portion is disposed above the bearing so as to approach the flange portion of the housing that is coupled to the semiconductor substrate processing apparatus, and the power transmission portion is disposed below the bearing. The rotary shaft sealing device according to claim 1 is as described above.

3. The sealing portion includes one or more vacuum seals for maintaining the vacuum of the semiconductor substrate processing apparatus; and one or more elastic seals that support the rotary shaft and suppress vibration; and the vacuum seal and the elastic seal are formed of a plastic material, and the elastic seal has a greater elastic force than the vacuum seal. The rotary shaft sealing device according to claim 1 is as described above.

4. The vacuum seal is a lip seal in which a curved lip is formed on the inner peripheral edge of an annular seal; and the elastic seal has an elastic member inserted into the seal body. The rotary shaft sealing device according to claim 3 is as described above.

5. An annular rotation prevention member is provided on the outer peripheral surface of the vacuum seal and the elastic seal facing the housing so as to prevent relative rotation of the vacuum seal and the elastic seal with respect to the housing within the housing. The rotary shaft sealing device according to claim 3 is as described above.

6. The vacuum seal and the elastic seal are arranged in series adjacent to each other, wherein the vacuum seal is arranged closer to the flange portion of the housing coupled to the semiconductor substrate processing apparatus than the elastic seal, and the elastic seal is arranged closer to the bearing than the vacuum seal. The rotary shaft sealing device according to claim 3. **Claim 7** The rotary shaft sealing device according to claim 1, wherein a labyrinth seal for preventing foreign matter from the semiconductor substrate processing apparatus from flowing into the housing is provided above the sealing portion. **Claim 8** The rotary shaft sealing device according to claim 1, wherein the housing includes a cooling water jacket provided at a peripheral edge of the sealing portion to cool the sealing portion. **Claim 9** A labyrinth seal for preventing foreign matter from the semiconductor substrate processing apparatus from flowing into the housing is provided above the sealing portion, and the purge gas that has moved through the purge gas inflow path is supplied to the semiconductor substrate processing apparatus through the labyrinth seal. The rotary shaft sealing device according to claim 1. **Claim 10** A semiconductor substrate processing apparatus for processing a semiconductor substrate, including a process tube for accommodating a plurality of semiconductor substrates therein, a semiconductor loading unit disposed in the process tube so as to be movable up and down, a nozzle unit provided inside the process tube for injecting a process gas, a sealing cap connected to the semiconductor loading unit for sealing a lower portion of the process tube, and a rotary shaft sealing device for rotating the semiconductor loading unit and performing a sealing function, comprising: wherein the rotary shaft sealing device includes a hollow housing attached to the sealing cap, a rotary shaft accommodated in the housing and connected to the semiconductor loading unit for transmitting a rotational force to the semiconductor loading unit, a bearing for rotatably supporting the rotary shaft in the housing, a sealing portion including a plurality of seals for sealing a gap between the housing and the rotary shaft, and a power transmission unit attached to one end of the rotary shaft for transmitting a rotational force to the rotary shaft, wherein the housing of the rotary shaft sealing device includes a purge gas inflow path provided in the housing so as to prevent foreign matter from the semiconductor substrate processing apparatus from flowing into the housing. Including a purge gas inlet port provided on a side surface of the housing so as to allow purge gas to flow in from the outside through the purge gas inflow path, The sealing portion is in contact with the rotating shaft, and further includes a pressure seal for preventing foreign matter from flowing into the semiconductor substrate processing apparatus when the inside of the semiconductor substrate processing apparatus is pressurized. A semiconductor substrate processing apparatus.

11. The sealing portion is disposed above the bearing so as to approach the flange portion of the housing coupled to the sealing cap, The power transmission unit is disposed below the bearing. The semiconductor substrate processing apparatus according to claim 10.

12. The sealing portion is, One or more vacuum seals for maintaining the vacuum of the process tube, One or more elastic seals for supporting the rotating shaft and suppressing vibration, Including, The vacuum seal and the elastic seal are formed of a plastic material, and the elastic seal has a greater elastic force than the vacuum seal. The semiconductor substrate processing apparatus according to claim 10.

13. The vacuum seal is a lip seal in which a curved lip is formed on the inner peripheral edge of the annular seal, The elastic seal has an elastic member inserted into the seal body. The semiconductor substrate processing apparatus according to claim 12.

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