Membrane forming device, membrane forming method, and article manufacturing method

Abstract

To provide a technique advantageous for forming a cured membrane on a substrate with high reproducibility.SOLUTION: A membrane forming device cures a curable composition arranged on a substrate to form a cured membrane. The membrane forming device comprises: a substrate holding unit that holds the substrate; a heating unit that heats the curable composition arranged on the substrate; an irradiation unit that irradiates the curable composition with curing light; a cooling unit that cools the substrate holding unit; and a lifting mechanism that lifts and lowers the substrate holding unit so that the substrate holding unit is arranged at a first position where the heating unit heats the curable composition and the irradiation unit irradiates the curable composition with the curing light, and a second position where the cooling unit cools the substrate holding unit. The substrate holding unit is placed on the cooling unit at the second position.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a film forming apparatus, a film forming method, and an article manufacturing method.

Background Art

[0002] Patent Document 1 describes a film forming apparatus that forms a film made of a cured product by bringing a curable composition disposed on a substrate into contact with a flat surface, reducing the viscosity of the curable composition by heating it to conform to the flat surface, and then curing the curable composition. This film forming apparatus includes a moving mechanism that horizontally moves the substrate between a first position where a substrate holding unit receives the substrate and a second position where a curing unit cures the curable composition.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When heating the curable composition, the substrate holding unit that holds the substrate may also be heated. When the substrate holding unit is heated, the substrate holding unit deforms, the positioning accuracy of the substrate holding unit decreases, and the reproducibility of the process of forming a cured film on the substrate may decrease. Further, the temperature of the substrate holding unit when receiving the substrate varies from substrate to substrate, whereby the conditions under which the substrate is processed vary from substrate to substrate, and the reproducibility of the process of forming a cured film on the substrate may decrease.

[0005] An object of the present invention is to provide a technology advantageous for forming a cured film on a substrate with high reproducibility.

Means for Solving the Problems

[0006] One aspect of the present invention relates to a film forming apparatus that forms a cured film by curing a curable composition disposed on a substrate. The film forming apparatus includes a substrate holding unit that holds the substrate, a heating unit that heats the curable composition disposed on the substrate, an irradiation unit that irradiates the curable composition with curing light, a cooling unit that cools the substrate holding unit, and an elevating mechanism that elevates the substrate holding unit so that the substrate holding unit is disposed at a first position where heating of the curable composition by the heating unit and irradiation of the curable composition with curing light by the irradiation unit are performed and at a second position where the substrate holding unit is cooled by the cooling unit. At the second position, the substrate holding unit is placed on the cooling unit.

Advantages of the Invention

[0007] According to the present invention, a technique advantageous for forming a cured film on a substrate with high reproducibility is provided.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0010] FIG. 1 is a cross-sectional view schematically showing a film forming method according to an embodiment. The film forming method forms a cured film CF by curing a curable composition CC disposed on a substrate S. In the step shown in FIG. 1(a), the curable composition CC can be applied or disposed on the substrate S. The substrate S may have irregularities on its surface. The curable composition CC can be applied or disposed on the surface of the substrate S, for example, by the spin coating method. The curable composition CC has, for example, a viscosity (e.g., 10 -3 ~10 6 Pa·S) suitable for the spin coating method at 25°C.

[0011] In the step shown in FIG. 1(b), heating energy EH is supplied to the curable composition CC on the substrate S, and the curable composition CC is heated to a predetermined temperature, whereby the viscosity of the curable composition CC decreases. The predetermined temperature can be, for example, a temperature within the range of 100°C to 200°C.

[0012] In the step shown in FIG. 1(c), the mold M having a flat surface can be disposed on the heated curable composition CC on the substrate S so that the flat surface of the mold M contacts the heated curable composition CC. The supply of the heating energy EH to the curable composition CC may be stopped before the flat surface of the mold M contacts the curable composition CC, or may be continued after the flat surface of the mold M contacts the curable composition CC. Alternatively, the supply of the heating energy EH to the curable composition CC may be started after the flat surface of the mold M contacts the curable composition CC. The upper surface of the curable composition CC whose viscosity has decreased by heating can be flattened so as to follow the flat surface of the mold M.

[0013] In the process shown in FIG. 1(d), the curable composition CC on the substrate S is irradiated with curing light (for example, ultraviolet light) CL, whereby the curable composition CC is cured and a cured film CF of the curable composition CC can be formed.

[0014] In the above example, a cured film CF having a flattened upper surface is formed using a mold M having a flat surface, but a cured film CF having the pattern transferred thereto may be formed using a mold M having a pattern. The envelope surface of the upper surface of the cured film CF with the pattern transferred thereto may have a flat surface.

[0015] FIG. 2 is a cross-sectional view schematically showing a film forming method according to another embodiment. The film forming method forms a cured film CF by curing a curable composition CC disposed on a substrate S. In the process shown in FIG. 2(a), the curable composition CC may be applied or disposed on the substrate S. The substrate S may have irregularities on its surface. The curable composition CC may be applied or disposed on the surface of the substrate S, for example, by a spin coating method. The curable composition CC may have a viscosity (for example, 10 -3 ~10 6 Pa·S) suitable for the spin coating method at, for example, 25°C.

[0016] In the processes shown in FIGS. 2(b) and 2(c), heating energy EH is supplied to the curable composition CC on the substrate S to heat the curable composition CC to a predetermined temperature, whereby the viscosity of the curable composition CC decreases. The predetermined temperature may be, for example, a temperature within the range of 100°C to 200°C. The heated curable composition CC can form a flat upper surface or a flattened upper surface by reflow.

[0017] In the process shown in FIG. 2(d), the curable composition CC on the substrate S is irradiated with curing light (for example, ultraviolet light) CL, whereby the curable composition CC is cured and a cured film CF of the curable composition CC can be formed.

[0018] FIG. 3 schematically shows the film forming apparatus 100 and the film forming method of the first embodiment. The film forming apparatus 100 is configured to form a cured film CF by curing a curable composition CC disposed on a substrate S. The film forming apparatus 100 can be configured to form a planarized film as the cured film CF using a mold having a flat surface as the mold M. Alternatively, the film forming apparatus 100 can be configured to form a cured film CF on which the pattern of the mold M is transferred using a mold having a pattern as the mold M.

[0019] The film forming apparatus 100 can include a substrate holding unit SH that holds the substrate S, a heating unit HT that heats the curable composition CC disposed on the substrate S, an irradiation unit IL that irradiates the curable composition CC with curing light, and a cooling unit CD that cools the substrate holding unit SH. The curable composition CC is a photocurable composition that cures upon irradiation with curing light, and contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, and the like. The curable composition CC can be disposed on the substrate S by a spin coater or a slit coater. The substrate S can include at least one patterned layer on a semiconductor substrate such as a silicon substrate or a compound semiconductor substrate.

[0020] The substrate holding unit SH can hold the substrate S by an attractive force such as a vacuum suction force or an electrostatic suction force, or by a mechanical clamp. Alternatively, the substrate holding unit SH can hold the substrate S without applying an attractive force to the substrate S. The light irradiation unit IL can be configured to irradiate the curable composition CC with curing light (e.g., ultraviolet light) for curing the curable composition CC. The light irradiation unit IL can be configured to irradiate the curable composition CC with curing light through the mold M. Alternatively, the light irradiation unit IL can be configured to irradiate the curable composition CC with curing light through the substrate. The film forming apparatus 100 can include a support structure SS that supports one or a plurality of irradiation units IL.

[0021] The heating unit TH can be configured to supply heat to the substrate TH through heat transfer. The heating unit TH can include, for example, a resistive element that generates heat. The heating unit TH can provide heat to the substrate S through the substrate holding unit SH. The cooling unit CD can be configured to cool the substrate holding unit SH and the heating unit HT by removing heat from the substrate holding unit SH and the heating unit HT. The cooling unit CD can include, for example, a flow path FP that forms part of a circulation system for circulating a refrigerant. A cooling device for cooling the refrigerant can be provided in the circulation system.

[0022] The film forming apparatus 100 can include an elevating mechanism LM for elevating the substrate holding unit SH. The elevating mechanism LM can elevate the substrate holding unit SH such that the substrate holding unit SH is disposed at a first position P1 and a second position P2. The first position P1 is a position where heating of the curable composition CC by the heating unit HT and irradiation of the curable composition with curing light by the irradiation unit IL are performed. The second position P2 is a position where the substrate holding unit SH is cooled by the cooling unit CD. At the second position P2, the substrate holding unit SH can be placed on the cooling unit CD.

[0023] The heating unit HT can be disposed on the substrate holding unit SH and can be fixed, for example, to the lower surface of the substrate holding unit SH. The heating unit HT can be embedded in the substrate holding unit SH, for example. The irradiation unit IL can be disposed above the cooling unit CD. The first position P1 can be located above the second position P2. As shown in FIGS. 3(a) and 3(d), when the substrate holding unit SH is disposed at the second position P2, the substrate S is separated from the substrate holding unit SH.

[0024] The substrate holding part SH may have a plurality of through-holes PH. The film forming apparatus 100 may have a plurality of support pins SP arranged so as to penetrate through the plurality of through-holes PH respectively. As shown in FIGS. 3(b) and 3(c), when the substrate holding part SH is arranged at the first position P1, the substrate S can be held by the substrate holding part SH. As shown in FIGS. 3(a) and 3(d), when the substrate holding part SH is arranged at the second position P2, the substrate S is supported by the plurality of support pins SP. The plurality of support pins SP may be arranged so as to protrude upward from the cooling part CD.

[0025] As shown in FIG. 3(a), in a state where the substrate holding part SH is arranged at the second position P2, the substrate S coated with the curable composition CC can be arranged on the plurality of support pins SP by a transfer mechanism (not shown). The curable composition CC may be arranged on the substrate S in the film forming apparatus 100, or may be arranged on the substrate S by another apparatus. From the state where the substrate S is supported by the plurality of support pins SP and the substrate holding part SH is arranged at the second position P2 as shown in FIG. 3(a), the substrate holding part SH can be driven upward to the first position P1 by the elevating mechanism LM as shown in FIG. 3(b). In the process of the substrate holding part SH moving from the second position P2 to the first position P1, the substrate S can be transferred from the plurality of support pins SP to the substrate holding part SH. From the state where the substrate S is supported by the substrate holding part SH and the substrate holding part SH is arranged at the first position P1 as shown in FIG. 3(c), the substrate holding part SH can be driven downward to the second position P2 by the elevating mechanism LM as shown in FIG. 3(d). In the process of the substrate holding part SH moving from the first position P1 to the second position P2, the substrate S can be transferred from the substrate holding part SH to the plurality of support pins SP. The substrate S on which the cured film CF of the curable composition CC is formed can be removed from above the plurality of support pins SP by a transfer mechanism (not shown).

[0026] The film forming apparatus 100 may further include a drive mechanism MM that disposes a mold M on a curable composition CC on a substrate S. The drive mechanism MM may be configured to dispose the mold M on the curable composition CC after the start of heating of the curable composition CC by the heating unit HT and before irradiation of the curable composition CC with curing light by the irradiation unit IL. In one example, the drive mechanism MM may be configured to dispose the mold M on the curable composition CC after the end of heating of the curable composition CC by the heating unit HT and before irradiation of the curable composition CC with curing light by the irradiation unit IL. Alternatively, the drive mechanism MM may be configured to dispose the mold M on the curable composition CC before the start of heating of the curable composition CC by the heating unit HT. Alternatively, a structure in which the mold M is disposed on the curable composition CC on the substrate S may be provided in the film forming apparatus 100.

[0027] The film forming apparatus 100 may include a control unit (not shown) that controls at least a part or all of the irradiation unit IL, the heating unit HT, the lifting mechanism LM, the cooling unit CD, and the drive mechanism MM. The control unit may be configured by, for example, a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose or dedicated computer in which a program is incorporated, or a combination of all or part of these.

[0028] Next, the operation of the film forming apparatus 100 of the first embodiment illustrated in FIG. 3 will be exemplarily described. First, as shown in FIG. 3(a), in a state where the substrate holding unit SH is disposed at the second position P2, the substrate S coated with the curable composition CC is conveyed onto a plurality of support pins SP by a conveyance mechanism (not shown) and can be supported by the plurality of support pins SP. Next, as shown in FIG. 3(b), the substrate holding unit SH is driven upward by the lifting mechanism LM to the first position P1, and in this process, the substrate S can be transferred from the plurality of support pins SP to the substrate holding unit SH. After the substrate holding unit SH starts to move from the second position P2 toward the first position P1, that is, after the substrate holding unit SH or the heating unit HT has moved away from the cooling unit CD, heat generation by the heating unit TH can be started. Then, when the substrate S is held by the substrate holding unit SH, heating of the curable composition CC on the substrate S by the heating unit TH is started. By heating the curable composition CC, the viscosity of the curable composition CC decreases, and reflow of the curable composition CC can be started.

[0029] Next, as shown in FIG. 3(c), the mold M can be disposed on the curable composition CC by the driving mechanism MM. The driving mechanism MM may start the contact of the mold M with the curable composition CC in a state where the mold M is deformed to have a downward convex shape. The space between the substrate S and the mold M can be filled with the curable composition CC so that the gas in the space is discharged. Heating of the curable composition CC by the heating unit HT can promote the filling of the curable composition CC into the space between the substrate S and the mold M. After such filling is completed, the curable composition CC is irradiated with curing light by the irradiation unit IL, whereby the curable composition CC can be cured. The irradiation of the curable composition CC with the curing light by the irradiation unit IL can be performed through the mold M. In a form where the mold M is not used, the driving mechanism MM is unnecessary.

[0030] Next, as shown in FIG. 3(d), the substrate holding unit SH is driven downward from the first position P1 to the second position P2 by the elevating mechanism LM, and in this process, the substrate S is transferred from the substrate holding unit SH to the plurality of support pins SP. The substrate S on which the cured film CF of the curable composition CC is formed can be removed from above the plurality of support pins SP by a transfer mechanism (not shown). In a state where the substrate holding unit SH is disposed at the second position P2, the substrate holding unit SH and the heating unit HT can be cooled to a target temperature by the cooling unit CD. Therefore, according to the first embodiment, since the substrate holding unit SH is cooled every time the processing of one substrate S is completed, a plurality of substrates S can be processed under the same conditions. For example, the temperature of the substrate holding unit SH when it contacts the substrate S and the time required for filling can be made uniform for a plurality of substrates S. Therefore, the reproducibility of the process of forming a cured film on a plurality of substrates S can be improved.

[0031] The film forming method performed by the film forming apparatus 100 of the first embodiment forms the cured film CF by curing the curable composition CC disposed on the substrate S. The film forming method may include a step of holding the substrate S by the substrate holding unit SH and moving the substrate holding unit SH to the first position P1, and a step of heating the curable composition CC in a state where the substrate holding unit SH is disposed at the first position P1. Further, the film forming method may include a step of irradiating the curable composition CC with curing light and curing the curable composition CC in a state where the substrate holding unit SH is disposed at the first position P1. Further, the film forming method may include a step of moving the substrate holding unit SH from the first position P1 to the second position P2 after the curable composition CC is cured, and a step of cooling the substrate holding unit SH in a state where the substrate holding unit SH is disposed at the second position P2. Further, the film forming method may further include a step of disposing the mold M on the curable composition CC after the start of the step of heating the curable composition CC and before the start of the step of irradiating the curable composition CC with curing light.

[0032] FIG. 4 schematically shows the film forming apparatus 100 and the film forming method of the second embodiment. Regarding matters not mentioned below for the film forming apparatus 100 and the film forming method of the second embodiment, they may follow the first embodiment as long as there is no contradiction. The second embodiment may differ from the first embodiment in the configuration and arrangement of the heating unit HT.

[0033] In the second embodiment, the heating unit HT may be configured to heat the curable composition CC by irradiating the curable composition CC with heat rays (infrared rays). The heating unit HT may be configured to irradiate the curable composition CC with heat rays through the mold M. Alternatively, the heating unit HT may be configured to irradiate the curable composition CC with heat rays through the substrate S. In the second embodiment, one or more heating units HT may be supported by the support structure SS together with one or more irradiation units IL.

[0034] Hereinafter, the operation of the film forming apparatus 100 of the second embodiment illustrated in FIG. 4 will be exemplarily described. First, as shown in FIG. 4(a), in a state where the substrate holding unit SH is arranged at the second position P2, the substrate S coated with the curable composition CC is conveyed onto a plurality of support pins SP by a conveyance mechanism (not shown) and can be supported by the plurality of support pins SP. Next, as shown in FIG. 4(b), the substrate holding unit SH is driven upward by the elevating mechanism LM to the first position P1, and in this process, the substrate S is transferred from the plurality of support pins SP to the substrate holding unit SH. Next, the curable composition CC is irradiated with heat rays by the heating unit TH, whereby the curable composition CC is heated. By heating the curable composition CC, the viscosity of the curable composition CC decreases, and the reflow of the curable composition CC may be started.

[0035] Next, as shown in FIG. 4(c), the mold M can be disposed on the curable composition CC by the drive mechanism MM. The drive mechanism MM may start the contact of the mold M with the curable composition CC in a state where the mold M is deformed to have a downward convexity. The space between the substrate S and the mold M can be filled with the curable composition CC so that the gas in the space is discharged. Heating of the curable composition CC by the heating unit HT can promote the filling of the curable composition CC into the space between the substrate S and the mold M. After such filling is completed, the curable composition CC can be irradiated with curing light by the irradiation unit IL, whereby the curable composition CC can be cured. The irradiation of the curable composition CC with the curing light by the irradiation unit IL can be performed through the mold M. In a form where the mold M is not used, the drive mechanism MM is unnecessary.

[0036] Next, as shown in FIG. 4(d), the substrate holding part SH is driven downward from the first position P1 to the second position P2 by the lifting mechanism LM, and in this process, the substrate S can be transferred from the substrate holding part SH to the plurality of support pins SP. The substrate S on which the cured film CF of the curable composition CC is formed can be removed from above the plurality of support pins SP by a transfer mechanism (not shown). In a state where the substrate holding part SH is disposed at the second position P2, the cooling part CD and the substrate holding part SH come into contact with each other, and the substrate holding part SH can be cooled to the target temperature by the cooling part CD. Therefore, according to the second embodiment, since the substrate holding part SH is cooled each time the processing of one substrate S is completed, a plurality of substrates S can be processed under the same conditions. For example, the temperature of the substrate holding part SH when it comes into contact with the substrate S and the time required for filling can be made uniform for the plurality of substrates S. Therefore, the reproducibility of the process of forming a cured film on a plurality of substrates S can be improved.

[0037] FIG. 5 schematically shows the film forming apparatus 100 and the film forming method of the third embodiment. Regarding matters not mentioned below for the film forming apparatus 100 and the film forming method of the third embodiment, the first embodiment can be followed as long as there is no contradiction. The third embodiment may differ from the first embodiment in the configuration and arrangement of the heating unit HT.

[0038] In the third embodiment, the heating unit HT can be configured to heat the curable composition CC by irradiating the curable composition CC with electromagnetic waves. The heating unit HT can be configured to irradiate the curable composition CC with electromagnetic waves via the mold M. Alternatively, the heating unit HT may be configured to irradiate the curable composition CC with electromagnetic waves via the substrate S.

[0039] Hereinafter, the operation of the film forming apparatus 100 according to the third embodiment illustrated in FIG. 5 will be exemplarily described. First, as shown in FIG. 5(a), in a state where the substrate holding unit SH is disposed at the second position P2, the substrate S coated with the curable composition CC is conveyed onto a plurality of support pins SP by a conveyance mechanism (not shown) and can be supported by the plurality of support pins SP. Next, as shown in FIG. 5(b), the substrate holding unit SH is driven upward by the lifting mechanism LM to the first position P1, and in this process, the substrate S is transferred from the plurality of support pins SP to the substrate holding unit SH. Next, the curable composition CC is irradiated with electromagnetic waves by the heating unit TH, whereby the curable composition CC is heated. By heating the curable composition CC, the viscosity of the curable composition CC decreases, and reflow of the curable composition CC can be started.

[0040] Next, as shown in FIG. 5(c), the mold M can be disposed on the curable composition CC by the drive mechanism MM. The drive mechanism MM may start the contact of the mold M with the curable composition CC in a state where the mold M is deformed to have a downward convex shape. The space between the substrate S and the mold M can be filled with the curable composition CC so that the gas in the space is discharged. Heating of the curable composition CC by the heating unit HT can promote the filling of the curable composition CC into the space between the substrate S and the mold M. After such filling is completed, the curable composition CC is irradiated with curing light by the irradiation unit IL, whereby the curable composition CC can be cured. The irradiation of the curable composition CC with the curing light by the irradiation unit IL can be performed via the mold M. In a form where the mold M is not used, the drive mechanism MM is unnecessary.

[0041] Next, as shown in FIG. 5(d), the substrate holding part SH is driven downward from the first position P1 to the second position P2 by the elevating mechanism LM, and in this process, the substrate S can be transferred from the substrate holding part SH to the plurality of support pins SP. The substrate S on which the cured film CF of the curable composition CC is formed can be removed from above the plurality of support pins SP by a transport mechanism (not shown). In a state where the substrate holding part SH is disposed at the second position P2, the cooling part CD and the substrate holding part SH come into contact with each other, and the substrate holding part SH can be cooled to a target temperature by the cooling part CD. Therefore, according to the second embodiment, since the substrate holding part SH is cooled every time the processing of one substrate S is completed, a plurality of substrates S can be processed under the same conditions. For example, the temperature of the substrate holding part SH when it contacts the substrate S and the time required for filling can be made uniform for a plurality of substrates S. Therefore, the reproducibility of the process of forming a cured film on a plurality of substrates S can be improved.

[0042] Hereinafter, an article manufacturing method for manufacturing articles such as semiconductor devices, display devices, or MEMS (Micro Electro Mechanical Systems) will be described. The article manufacturing method may include a film forming step of forming a cured film CF of a curable composition CC on a substrate S by the film forming method represented by the above-described plurality of embodiments, and a processing step of obtaining an article by processing the substrate S that has undergone the film forming step. The processing step may include, for example, a step of forming a film such as a conductor film or an insulating film on the cured film CF, a step of forming a resist pattern by a photolithography step on the film, and a step of etching the film through the opening of the resist pattern.

[0043] This specification and the drawings may include the following disclosures. (Item 1) A film forming apparatus for forming a cured film by curing a curable composition disposed on a substrate, a substrate holding part for holding the substrate, a heating part for heating the curable composition disposed on the substrate, an irradiation part for irradiating the curable composition with curing light, A cooling unit that cools the substrate holding unit, a lifting mechanism that raises and lowers the substrate holding unit so that the substrate holding unit is disposed at a first position where heating of the curable composition by the heating unit and irradiation of the curable composition with curing light by the irradiation unit are performed, and at a second position where the substrate holding unit is cooled by the cooling unit, wherein, at the second position, the substrate holding unit is placed on the cooling unit, a film forming apparatus characterized by the above. (Item 2) wherein the irradiation unit is disposed above the cooling unit, and the first position is located above the second position, the film forming apparatus according to Item 1, characterized by the above. (Item 3) wherein when the substrate holding unit is disposed at the second position, the substrate is separated from the substrate holding unit, the film forming apparatus according to Item 2, characterized by the above. (Item 4) wherein the substrate holding unit has a plurality of through holes, the film forming apparatus has a plurality of support pins disposed so as to penetrate the plurality of through holes respectively, wherein when the substrate holding unit is disposed at the first position, the substrate is held by the substrate holding unit, and when the substrate holding unit is disposed at the second position, the substrate is supported by the plurality of support pins, the film forming apparatus according to Item 3, characterized by the above. (Item 5) wherein the plurality of support pins are disposed so as to protrude upward from the cooling unit, the film forming apparatus according to Item 4, characterized by the above. (Item 6) wherein the heating unit is disposed on the substrate holding unit, the film forming apparatus according to any one of Items 1 to 5, characterized by the above. (Item 7) wherein the heating unit is fixed to the lower surface of the substrate holding unit, The film forming apparatus according to item 6, characterized in that (Item 8) The heating unit irradiates the curable composition with heat rays The film forming apparatus according to any one of items 1 to 5, characterized in that (Item 9) The heating unit irradiates the curable composition with electromagnetic waves The film forming apparatus according to any one of items 1 to 5, characterized in that (Item 10) The film forming apparatus further includes a drive mechanism for disposing a mold on the curable composition on the substrate The film forming apparatus according to any one of items 1 to 5, characterized in that (Item 11) The heating unit irradiates the curable composition with heat rays through the mold The film forming apparatus according to item 10, characterized in that (Item 12) The heating unit irradiates the curable composition with electromagnetic waves through the mold The film forming apparatus according to item 10, characterized in that (Item 13) The drive mechanism disposes a mold on the curable composition after the start of heating of the curable composition by the heating unit and before irradiation of the curable composition with the curing light by the irradiation unit The film forming apparatus according to any one of items 10 to 12, characterized in that (Item 14) The film forming apparatus is configured to form a planarized film as the cured film using a mold having a flat surface as the mold The film forming apparatus according to any one of items 10 to 13, characterized in that (Item 15) The film forming apparatus is configured to form the cured film on which the pattern is transferred using a mold having a pattern as the mold The film forming apparatus according to any one of items 10 to 13, characterized in that (Item 16) A film forming method for forming a cured film by curing a curable composition disposed on a substrate, holding the substrate by a substrate holding part and moving the substrate holding part to a first position; heating the curable composition with the substrate holding part disposed at the first position; irradiating the curable composition with curing light with the substrate holding part disposed at the first position to cure the curable composition; after the curable composition is cured, moving the substrate holding part from the first position to a second position; cooling the substrate holding part with the substrate holding part disposed at the second position; and a film forming method characterized by including the above steps. (Item 17) The first position is located above the second position, and the film forming method according to Item 16 is characterized by this. (Item 18) After the start of the step of heating the curable composition and before the start of the step of irradiating the curable composition with the curing light, further including a step of disposing a mold on the curable composition, and the film forming method according to Item 16 or 17 is characterized by this. (Item 19) In the process of moving the substrate holding part from the first position to the second position, the substrate is transferred from the substrate holding part to a plurality of support pins, and the film forming method according to any one of Items 16 to 18 is characterized by this. (Item 20) A film forming step of forming a cured film of a curable composition on a substrate by the film forming method according to any one of Items 16 to 19, and a processing step of obtaining an article by processing the substrate that has undergone the film forming step, and an article manufacturing method characterized by including the above steps.

[0044] The invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the claims are appended to disclose the scope of the invention.

Explanation of Reference Numerals

[0045] 100: Film Forming Apparatus, S: Substrate, CC: Curable Composition, CF: Cured Film, SH: Substrate Holding Unit, HT: Heating Unit, IL: Irradiation Unit, CD: Cooling Unit, LM: Lifting Mechanism

Claims

1. A film forming apparatus for forming a cured film by curing a curable composition disposed on a substrate, comprising: a substrate holding unit for holding the substrate; a heating unit for heating the curable composition disposed on the substrate; an irradiation unit for irradiating the curable composition with curing light; a cooling unit for cooling the substrate holding unit; a lifting mechanism for lifting and lowering the substrate holding unit so that the substrate holding unit is disposed at a first position where heating of the curable composition by the heating unit and irradiation of the curable composition with curing light by the irradiation unit are performed, and at a second position where the substrate holding unit is cooled by the cooling unit; at the second position, the substrate holding unit is placed on the cooling unit; A film forming apparatus characterized by the above.

2. The irradiation unit is disposed above the cooling unit, The first position is located above the second position, The film forming apparatus according to claim 1, characterized by the above.

3. When the substrate holding unit is disposed at the second position, the substrate is separated from the substrate holding unit, The film forming apparatus according to claim 2, characterized by the above.

4. The substrate holding unit has a plurality of through holes, The film forming apparatus has a plurality of support pins disposed so as to penetrate the plurality of through holes respectively, When the substrate holding unit is disposed at the first position, the substrate is held by the substrate holding unit, and when the substrate holding unit is disposed at the second position, the substrate is supported by the plurality of support pins, The film forming apparatus according to claim 3, characterized by the above.

5. The plurality of support pins are disposed so as to protrude upward from the cooling unit, The film forming apparatus according to claim 4, characterized by the above.

6. The heating unit is disposed on the substrate holding unit, The film forming apparatus according to any one of claims 1 to 5, characterized by the above.

7. The heating unit is fixed to the lower surface of the substrate holding unit, The film forming apparatus according to claim 6, characterized by the above.

8. The heating unit irradiates the curable composition with heat rays, The film forming apparatus according to any one of claims 1 to 5, characterized by the above.

9. The heating unit irradiates the curable composition with electromagnetic waves, The film forming apparatus according to any one of claims 1 to 5, characterized by the above.

10. The film forming apparatus further comprises a driving mechanism for disposing a mold on the curable composition on the substrate. The film forming apparatus according to any one of claims 1 to 5, characterized by the above.

11. The heating unit irradiates the curable composition with heat rays through the mold. The film forming apparatus according to claim 10, characterized by the above.

12. The heating unit irradiates the curable composition with electromagnetic waves through the mold. The film forming apparatus according to claim 10, characterized by the above.

13. After the start of heating of the curable composition by the heating unit, the drive mechanism places a mold on the curable composition before the irradiation unit irradiates the curable composition with the curing light. The film forming apparatus according to claim 10, characterized by the above.

14. The mold is configured to form a planarizing film as the cured film using a mold having a flat surface. The film forming apparatus according to claim 10, characterized by the above.

15. The mold is configured to form the cured film on which the pattern is transferred using a mold having a pattern. The film forming apparatus according to claim 10, characterized by the above.

16. A film forming method for forming a cured film by curing a curable composition disposed on a substrate, comprising: holding the substrate by a substrate holding unit and moving the substrate holding unit to a first position; heating the curable composition while the substrate holding unit is disposed at the first position; irradiating the curable composition with curing light while the substrate holding unit is disposed at the first position to cure the curable composition; moving the substrate holding unit from the first position to a second position after the curable composition is cured; cooling the substrate holding unit while the substrate holding unit is disposed at the second position. The film forming method is characterized by including the above steps.

17. The first position is located above the second position. The film forming method according to claim 16, characterized by the above.

18. The method further includes a step of placing a mold on the curable composition after the start of the step of heating the curable composition and before the start of the step of irradiating the curable composition with the curing light. The film forming method according to claim 16, characterized by the above.

19. In the process of moving the substrate holding unit from the first position to the second position, the substrate is transferred from the substrate holding unit to a plurality of support pins. The film forming method according to claim 16, characterized by the above.

20. A film forming step of forming a cured film of a curable composition on a substrate by the film forming method according to any one of claims 16 to 19; A processing step of obtaining an article by processing the substrate that has undergone the film forming step; An article manufacturing method, characterized by including these steps.

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