Liquid ejection head

Abstract

To provide a technology applicable to manufacturing of a liquid ejection head having a damper, which can reduce adhesion of an adhesive onto the damper while ensuring sealability.SOLUTION: A liquid ejection head comprising: a plurality of nozzles for ejecting a liquid; a plurality of pressure chambers corresponding to the plurality of nozzles respectively and configured to contain the liquid; a plurality of pressure generating elements arranged in the plurality of pressure chambers respectively and configured to generate pressure for ejecting the liquid; a plurality of first flow passages corresponding to the plurality of pressure chambers respectively; a second flow passage communicating with the plurality of first flow passages and common to the plurality of pressure chambers; and a damper that is elastically deformed when the pressure of the liquid is increased by the pressure generating element, where the liquid is supplied to each of the plurality of pressure chambers from the common second flow passage via the plurality of first flow passages, and a Young's modulus of a second flow passage member configuring the second flow passage is 65 GPa or less.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a liquid ejection head.

Background Art

[0002] In a liquid ejection apparatus that ejects a liquid such as ink from a nozzle onto a recording medium, a liquid ejection head having a damper for suppressing the influence of pressure fluctuations during ejection is widely used. In addition, when manufacturing a liquid ejection head, a step of bonding a plurality of plates using an adhesive may be included. Patent Document 1 describes that the performance of the damper is affected by the overflow of the adhesive onto the damper. Therefore, Patent Document 1 describes a liquid ejection head that stabilizes the damper performance by adding a member for reducing the adhesion of the adhesive to the damper even when the adhesive overflows.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, as a method for reducing the overflow of the adhesive during the manufacture of the liquid ejection head and suppressing the adhesion of the adhesive to the damper, in addition to the method of adding a member as in Patent Document 1, a method of reducing the fluidity of the adhesive is also conceivable. However, if the fluidity of the adhesive is reduced, there is a concern that the sealing property against the liquid may deteriorate.

[0005] The present invention has been made in view of the above problems. An object of the present invention is to provide a technique that enables both reduction of the adhesion of the adhesive to the damper and ensuring of the sealing property in the manufacture of a liquid ejection head having a damper.

Means for Solving the Problems

[0006] The present invention adopts the following configuration. That is, a plurality of nozzles for discharging a liquid; a plurality of pressure chambers respectively corresponding to the plurality of nozzles and accommodating the liquid; a plurality of pressure generating elements respectively arranged in the plurality of pressure chambers and generating a pressure for discharging the liquid; a plurality of first flow paths respectively corresponding to the plurality of pressure chambers; a second flow path common to the plurality of pressure chambers and communicating with the plurality of first flow paths; a damper that elastically deforms when the pressure of the liquid rises due to the pressure generating element; and the liquid is a liquid discharge head that is supplied from the common second flow path to each of the plurality of pressure chambers via the plurality of first flow paths, wherein a Young's modulus of a second flow path member constituting the second flow path is 65 GPa or less This is a liquid discharge head characterized by that.

Effect of the Invention

[0007] According to the present invention, in the manufacture of a liquid discharge head having a damper, it is possible to provide a technique that enables both reduction in adhesion of an adhesive to the damper and ensuring of sealing performance.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

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Figure 10

Embodiments for Carrying Out the Invention

[0009] Hereinafter, with reference to the drawings, preferred embodiments of the present invention will be described in detail by way of example. However, the dimensions, materials, shapes, relative arrangements, etc. of the components described in this embodiment are not intended to limit the scope of the present invention only to these, unless otherwise specified. Also, the materials, shapes, etc. of the members once described in the following explanation are the same as the initial explanation in the subsequent explanation, unless otherwise described again. For configurations and processes not particularly illustrated or described, well-known techniques or publicly known techniques in the relevant technical field can be applied. Also, the present invention is not limited to only these embodiments, and not all combinations of the features described in this embodiment are essential for the solution means of the present invention.

[0010] FIG. 1(A) and FIG. 1(B) are cross-sectional views showing an example of the element substrate 50 used in the liquid ejection head of the embodiment. Also, FIG. 10 is a cross-sectional view showing an example of the element substrate 50 used in a conventional liquid ejection head.

[0011] As in Embodiment 1 shown in FIG. 1(A), the element substrate 50 used for the liquid ejection head is composed of a first flow path member 100, a second flow path member 200, and a damper flow path member 300 laminated together. The first flow path member 100 has a nozzle 1 for ejecting a liquid such as ink, a pressure chamber 2 communicating with the nozzle and accommodating the liquid to supply it to the nozzle 1, a first flow path 10 communicating with the pressure chamber 2 through which the liquid passes, and an element 3 (pressure generating element). The element 3 has pressure generating means for generating pressure in the pressure chamber 2. As the pressure generating means, a heating element, a piezoelectric element, or the like can be used. The first flow path member 100 also includes wiring and terminals (not shown) for transmitting electric power and drive signals to the pressure generating means. The first flow path member 100 has a plurality of elements 3 provided in a row and columnar nozzles 1 corresponding to each element 3, and the plurality of nozzles 1 form a nozzle row.

[0012] The second flow path member 200 has a second flow path 20 communicating with the first flow path 10 through a first opening 11. The damper flow path member 300 has a damper 30. Here, when the liquid is ejected from the pressure chamber 2, pressure fluctuations may occur in the element substrate 50 due to energy or the like. However, by having the damper 30 that elastically deforms when there are pressure fluctuations, an effect of suppressing the pressure fluctuations can be obtained. That is, when the pressure of the liquid rises, the damper 30 deforms, increasing the volume of the entire liquid chamber including the pressure chamber 2, the first flow path 10, the second flow path 20, etc., and absorbing the pressure. When the liquid ejection ends, the shape of the deformed damper 30 returns to its original state.

[0013] In a conventional liquid ejection head, single crystal Si or SUS (stainless steel) is often used as a member constituting the first flow path member 100, the second flow path member 200, or the damper flow path member 300. The Young's modulus of single crystal Si depends on the crystal orientation but is about 130 to 190 GPa. The Young's modulus of SUS is about 200 GPa. After forming the flow path member with these members having a high Young's modulus and being difficult to deform, when joining the respective flow path members, the adhesive 40 is often formed thick from several tens of μm to several hundreds of μm in order to ensure the sealing property. As a result, as shown in FIG. 10, the protrusion of the adhesive 40 may adhere to the damper 30.

[0014] (Configuration) FIG. 1(A) shows an example of the configuration of the element substrate 50 of the present embodiment. Here, the second flow path member 200 is formed of a member having a low Young's modulus. As a result, the second flow path member 200 is easily deformed, and an effect is obtained in which it is easy to ensure the sealing property even with a small amount of the adhesive 40 as compared with a member having a high Young's modulus.

[0015] The preferable characteristics when the flow path member of the present embodiment is formed with the same configuration, dimensions, and manufacturing method as the conventional flow path member will be described. The flow path member of the present embodiment preferably has a Young's modulus of 65 GPa or less that enables the amount of deformation to be 2 to 3 times that of the flow path member used in the conventional configuration. Further, the flow path member of the present embodiment more preferably has a Young's modulus of 32.5 GPa or less that enables the amount of deformation to be 2 times that of the flow path member used in the conventional configuration. Further, the flow path member of the present embodiment more preferably has a Young's modulus of 10 GPa or less that enables the amount of deformation to be increased by using a resin and has an effect of being easy to manufacture. Further, the flow path member of the present embodiment more preferably has a Young's modulus of 5 GPa or less that obtains an effect of making it difficult for damage to occur during deformation by using a resin that does not contain a filler.

[0016] On the other hand, since the higher the Young's modulus, the more effective it is to suppress the flow of the adhesive 40, if the Young's modulus is made too low, the fluidity of the adhesive 40 may become too high and the amount of protrusion may increase. Therefore, it is preferable to increase the effect of suppressing the protrusion of the adhesive 40 by increasing the Young's modulus to a certain extent. Typically, the Young's modulus of the flow path member is preferably 0.1 GPa or more, and more preferably 0.5 GPa or more because the effect of suppressing the fluidity increases.

[0017] In this embodiment, the second flow path member 200 is composed of a second flow path component member A21 and a second flow path component member B22. By forming the second flow path component member A with a member having a low Young's modulus to enhance the sealing property, it becomes possible to use an adhesive 40 that is about one-tenth to one-hundredth as thin as the conventional configuration as the second flow path component member B, and it becomes possible to reduce the protrusion of the adhesive 40.

[0018] If the thickness of the second flow path member 200 is 50 μm or more, it is preferable because the effect of enhancing the sealing property can be easily obtained. If it is 100 μm or more, it is more preferable because the effect of enhancing the sealing property becomes greater. If it is 200 μm or more, it is even more preferable because the effect of further enhancing the sealing property becomes greater. When the second flow path member 200 having such a thickness is formed with the adhesive 40 of the conventional method, it is difficult to reduce the protrusion because of high fluidity. On the other hand, if the thickness of the second flow path member 200 is 500 μm or less, it is preferable because it is easy to ensure the damper performance. Further, when the cross section of the first opening 11 has a rectangular shape having a long side and a short side, if the thickness of the second flow path member 200 is 1 time or more and 20 times or less the length of the long side of the first opening 11, it is preferable because it is easy to ensure the damper performance. If the damper 30 faces the second flow path 20, the effect of suppressing the pressure fluctuation can be obtained. Among them, in the configuration formed on the surface facing the surface having the first opening 11 communicating with the first flow path 10 among the wall surfaces constituting the second flow path 20, the effect of suppressing the pressure fluctuation is enhanced, so it is more preferable. Since the first flow path 10 is an individual flow path for the nozzle 1, the influence of the pressure fluctuation on another nozzle arranged in the nozzle row direction is difficult to be transmitted, and the effect of stabilizing the discharge can be obtained, so it is preferable. Further, since the second flow path 20 is a common flow path for a plurality of nozzles 1, it becomes possible to form the common flow path large, it becomes possible to widen the width of the damper, and the effect of suppressing the pressure fluctuation can be enhanced. Therefore, it is preferable that the first flow path 10 is an individual flow path for the nozzle 1 and the second flow path 20 is a common flow path for a plurality of nozzles 1.

[0019] FIG. 1(B) shows another configuration example of the element substrate 50 as Embodiment 2. Here, the second flow path member 200 is composed of the second flow path constituent member C23. And since the second flow path constituent member C also serves as an adhesive, an effect of suppressing the protrusion of the adhesive can be obtained. When forming the second flow path constituent member C23, a material having thermoplasticity may be patterned and then joined using heat. Alternatively, a member that cures by a chemical reaction may be patterned in a partially cured state and then joined to proceed with the curing reaction. A material whose curing reaction proceeds after joining is more preferable because it is easier to increase the joining strength. Since the second flow path member 200 has low fluidity and adhesiveness, it is more preferable because both reduction of protrusion and ensuring of sealing performance can be achieved.

[0020] A filler may be added to the joining member, and a fibrous filler having a high effect of suppressing defects such as breakage of the joining member is preferable. For example, carbon fiber, metal fiber, glass fiber, and cellulose fiber can be used.

[0021] As the ratio in the thickness or volume of the second flow path member 200, it is preferably composed of a member that cures by a chemical reaction by 50% or more because it is easy to increase the joining strength, and more preferably 100% because it is even easier to increase the joining strength. Since the member that cures by a chemical reaction is a photosensitive resin, patterning becomes easy and an effect of being easy to manufacture can be obtained. A negative photosensitive resin is more preferable because it is easier to improve chemical resistance than a positive photosensitive resin.

[0022] For the second flow path member 200, epoxy, acrylic, urethane, silicone, benzocyclobutene, polyimide, polyamide, polyamideimide, cyanoacrylate, phenol, melamine, styrene, cyclized rubber, or a mixture thereof can be used. Among these, resins mainly composed of epoxy, silicone, benzocyclobutene, and polyimide, which are excellent in chemical resistance, are preferable.

[0023] The epoxy is not particularly limited, and for example, bisphenol type epoxy, novolac type epoxy, epoxy polyol type epoxy, alicyclic epoxy, glycidyl type epoxy, urethane-modified epoxy, chelate-modified epoxy, rubber-modified epoxy, or a mixture thereof can be used.

[0024] The silicone is not particularly limited, and for example, condensation type silicone or addition type silicone can be used. Among them, addition type silicone with less curing shrinkage is preferable. For example, epoxy-modified silicone, acrylic-modified silicone, methyl-based silicone, phenyl-based silicone, methylphenyl-based silicone, alkyd-modified silicone, polyester-modified silicone, or a mixture thereof can be used.

[0025] The benzocyclobutene is not particularly limited, and for example, the CYCLOTENE series manufactured by Dow Chemical Company can be used.

[0026] The polyimide is not particularly limited, and for example, a thermoplastic polyimide can be used in the form of a film, or a polyamic acid can be used as a precursor.

[0027] The interface between the second flow path member 200 and the first flow path member 100, or the interface between the second flow path member 200 and the damper flow path member 300 may have a coupling agent. By selecting a coupling agent according to the member, a covalent bond can be formed, so that the effect of enhancing the bonding strength can be obtained.

[0028] (Cross-sectional configuration) FIG. 2 is a diagram showing an example of the element substrate 50 used in the liquid ejection head, and shows a cross-sectional perspective view. As shown in FIG. 2, the first flow path 10 is an individual flow path, and has a structure that connects to the common flow path which is the second flow path 20 through the first opening 11. Although this configuration is a preferable configuration as the present invention, the present invention is not limited to this structure.

[0029] [Another embodiment] Figs. 3 to 5 are diagrams showing various configuration examples of the element substrate 50 used in the liquid ejection head of the present invention.

[0030] As in Embodiment 3 shown in Fig. 3(A), Embodiment 4 shown in Fig. 3(B), and Embodiment 5 shown in Fig. 3(C), the second flow path member 200 may be composed of a second flow path constituent member D24 and a second flow path constituent member E25. If the Young's modulus of the second flow path constituent member E25 is 65 GPa or less, the effects of the present invention can be obtained, which is preferable. If the thickness is 50 μm or more, an effect of enhancing the sealing property can be obtained, which is more preferable. The second flow path constituent member D24 may be used in a columnar shape, a filler shape, or in a laminated form.

[0031] As in Embodiment 6 shown in Fig. 4(A), the second flow path member 200 may have a cavity 26. By adopting such a structure, a part 27 of the second flow path member 200 can be used as an auxiliary damper. By forming the cavity 26 at least on the side close to the first opening 11, the effect as an auxiliary damper can be enhanced.

[0032] As in Embodiment 7 shown in Fig. 4(B), the damper flow path member 300 may be processed, and a configuration may be used in which the second flow path constituent member 22 having an adhesive function among the second flow path members 200 enters the damper flow path member 300. By adopting such a configuration, the adhesive strength can be increased by the anchor effect. Further, depending on the member configuration, it becomes easy to select a configuration in which a chemical bond is easily formed at the interface between a part of the second flow path member 200 and the damper flow path member 300, so that an effect of increasing the adhesive strength can be obtained.

[0033] As in Embodiment 8 shown in Fig. 4(C), the portion 22 having an adhesive function among the second flow path members 200 may be used at the interface with the first flow path member 100.

[0034] As in Embodiment 9 shown in Fig. 5(A), by forming the second flow path component F28 so as to cover the second flow path 20, the joint area with the first flow path member 100 can be increased, and the effect of enhancing the adhesion strength can be obtained. Here, when the first flow path 10 has an individual flow path for each nozzle, the second flow path component F28 may have an opening corresponding to the first opening 11, and the effect of increasing the degree of freedom of the manufacturable structure can be obtained.

[0035] As in Embodiment 10 shown in Fig. 5(B), the first flow path member 100 has a portion that becomes the cavity 26, and a part 27 of the second flow path component F28 that covers the cavity 26 may be used as an auxiliary damper. The auxiliary dampers may be separated into a plurality of rows. A configuration in which the damper at the adhesion portion between the second flow path component F28 and the damper flow path member 300 is patterned and removed may also be used. Since the degree of freedom of the member configuration is increased, it becomes easy to select a configuration that easily forms a chemical bond, and the effect of enhancing the adhesion strength can be obtained.

[0036] As in Embodiment 11 shown in Fig. 5(C), the first opening 11 in the first flow path 10 formed in the first flow path member 100 may be designed to be widened. For example, it can be designed in consideration of the flow resistance of the liquid. The damper 30 formed in the damper flow path member 300 may be formed so as to be arranged perpendicular to the surface having the first opening 11.

[0037] Figs. 6 to 7 are diagrams showing an example of a method for manufacturing the element substrate 50 of the liquid ejection head. Here, an example of manufacturing the element substrate 50 of Fig. 1(A) is shown.

[0038] As shown in Fig. 6(A), prepare the first flow path member 100.

[0039] As shown in Fig. 6(B), perform a first joining step of joining the second flow path component A21 to the first flow path member 100. In the first joining step, by transferring the second flow path component A21 as a dry film, the effect of simplifying the process can be obtained. Also, by forming it with a dry film, the effect of easily enhancing the thickness accuracy can be obtained.

[0040] As shown in FIG. 6(C), the second flow path component A21 is patterned. By using a negative photosensitive resin as a dry film, a pattern can be easily formed by exposure, post-exposure bake (PEB), and development. Here, although it can also be processed by etching using a mask pattern, since the first flow path member 100 may be easily damaged by over-etching, it is preferable to form it using a dry film.

[0041] As shown in FIG. 7(A), an adhesive is transferred as the second flow path component B22. In order to reduce the overhang of the adhesive, it is preferable that the thickness of the adhesive before bonding is 1 μm or less, and more preferably 0.5 μm or less.

[0042] As shown in FIG. 7(B), the damper flow path member 300 is bonded and cured.

[0043] FIG. 8 is a diagram showing another example of a method for manufacturing the element substrate 50 of the liquid ejection head. Here, an example of manufacturing the element substrate 50 of FIG. 1(B) is shown.

[0044] As shown in FIG. 8(A), the damper flow path member 300 is prepared.

[0045] As shown in FIG. 8(B), the second flow path component C23 is transferred as a dry film. For the second flow path component C23, a material that cures by a chemical reaction is preferable, and a photosensitive material such as an epoxy having negative photosensitivity can be used. Before transferring the second flow path component C23, a silane coupling agent compatible with the damper material and epoxy is applied to the damper flow path member 300 and baked to facilitate the formation of a chemical bond at the interface. The dry film is formed by spin-coating and baking on a polyethylene terephthalate film as a base material. The thickness of one layer of the dry film is 50 μm, and the second flow path component C23 is formed with a thickness of 150 μm by stacking three layers and transferring.

[0046] As shown in FIG. 8(C), the second flow path component C23 is patterned by exposure, post-exposure baking, and development.

[0047] As shown in FIG. 8(D), the first flow path member 100 is joined and cured. Before joining, a silane coupling agent compatible with the first flow path member 100 and epoxy is applied to the first flow path member 100 and baked to facilitate the formation of chemical bonds at the interface. Note that if the Young's modulus of the first flow path member 100 that also serves as an adhesive is 0.1 GPa or more, it is preferable because the effect of suppressing the protrusion of the adhesive is enhanced.

[0048] [Application Example] An example of applying the element substrate 50 of the embodiment to a liquid ejection head or a liquid ejection device is shown. FIG. 9(A) is a schematic perspective view of the element substrate 50. The element substrate 50 has a configuration in which a first flow path member 100, a second flow path member 200, and a damper flow path member 300 are laminated. Further, an electrical connection portion 4, which is a terminal for connecting to an electrical wiring, is formed on the second flow path member 200. The first flow path member 100, the second flow path member 200, and the damper flow path member 300 are laminated. Further, an electrical connection portion 4, which is a terminal for connecting to an electrical wiring, is formed on the second flow path member 200.

[0049] FIG. 9(B) is a schematic diagram showing the configuration of an inkjet type liquid ejection device 150 (recording device). The liquid ejection device 150 includes a liquid ejection head 250 (recording head) having the element substrate 50, a carriage 260, and a controller 270 which is a control unit for performing drive control thereof. When the liquid ejection head 250 drives each element 3 based on a control signal from the controller 270, the liquid in the pressure chamber 2 to which energy is applied is ejected from the nozzle 1. In this way, recording (image formation) on a recording medium P such as paper is executed.

[0050] The carriage 260 that supports the liquid ejection head 250 reciprocates in the direction of arrow d1 along the guide 280 based on a control signal from the controller 270. The recording medium P is conveyed in the direction d2 by a conveyance mechanism included in the liquid ejection apparatus 150. The controller 270 can record a desired image on the recording medium P by performing drive control of the liquid ejection head 250 while reciprocating the carriage 260.

[0051] The element substrate 50 can be mounted on the liquid ejection head 250 to manufacture the liquid ejection apparatus 150. By using such a liquid ejection head 250 and liquid ejection apparatus 150, since there is little adhesion of the adhesive to the damper 30 and the sealing property is high, highly reliable recording can be realized.

[0052] [Configuration 1] A plurality of nozzles that eject liquid, A plurality of pressure chambers that respectively correspond to the plurality of nozzles and store the liquid, A plurality of pressure generating elements that are respectively disposed in the plurality of pressure chambers and generate pressure for ejecting the liquid, A plurality of first flow paths that respectively correspond to the plurality of pressure chambers, A second flow path that is common to the plurality of pressure chambers and communicates with the plurality of first flow paths, A damper that elastically deforms when the pressure of the liquid rises due to the pressure generating element, Comprising, The liquid is supplied from the common second flow path to each of the plurality of pressure chambers via the plurality of first flow paths, and is a liquid ejection head, The Young's modulus of the second flow path member that constitutes the second flow path is 65 GPa or less A liquid ejection head characterized by this. [Configuration 2] The second flow path member has a Young's modulus of 32.5 GPa or less The liquid ejection head according to Configuration 1, characterized by this. [Configuration 3] The second flow path member has a Young's modulus of 10 GPa or less and is made of resin The liquid ejection head according to Configuration 1 or 2, characterized by the following. [Configuration 4] The second flow path member has a Young's modulus of 5 GPa or less and is made of a resin that does not contain a filler. The liquid ejection head according to any one of Configurations 1 to 3, characterized by the following. [Configuration 5] The second flow path member has a Young's modulus of 0.1 GPa or more. The liquid ejection head according to any one of Configurations 1 to 4, characterized by the following. [Configuration 6] The second flow path member has a Young's modulus of 0.5 GPa or more. The liquid ejection head according to any one of Configurations 1 to 5, characterized by the following. [Configuration 7] The thickness of the second flow path member is 50 μm or more. The liquid ejection head according to any one of Configurations 1 to 6, characterized by the following. [Configuration 8] The thickness of the second flow path member is 100 μm or more. The liquid ejection head according to any one of Configurations 1 to 7, characterized by the following. [Configuration 9] The thickness of the second flow path member is 200 μm or more. The liquid ejection head according to any one of Configurations 1 to 8, characterized by the following. [Configuration 10] The thickness of the second flow path member is 500 μm or less. The liquid ejection head according to any one of Configurations 1 to 9, characterized by the following. [Configuration 11] The second flow path and the first flow path communicate with each other through an opening having a rectangular cross section, and the thickness of the second flow path member is 1 to 20 times the length of the long side of the opening. The liquid ejection head according to any one of Configurations 1 to 10, characterized by the following. [Configuration 12] The damper is formed on a surface of the wall surface constituting the second flow path, which faces a surface having an opening communicating with the first flow path. The liquid discharge head according to any one of Configurations 1 to 11, characterized in that. [Configuration 13] The second flow path member also serves as an adhesive. The liquid discharge head according to any one of Configurations 1 to 12, characterized in that. [Configuration 14] 50% or more of the thickness or volume of the second flow path member is composed of a member that cures by a chemical reaction. The liquid discharge head according to any one of Configurations 1 to 13, characterized in that. [Configuration 15] The member that cures by the chemical reaction is a negative photosensitive resin. The liquid discharge head according to Configuration 14, characterized in that. [Configuration 16] The second flow path member contains epoxy, silicone, benzocyclobutene, polyimide, or a mixture thereof. The liquid discharge head according to any one of Configurations 1 to 15, characterized in that. [Configuration 17] The interface between the second flow path member and the member constituting the first flow path, or the interface between the second flow path member and the member having the damper, has a portion that forms a covalent bond. The liquid discharge head according to any one of Configurations 1 to 16, characterized in that. [Configuration 18] Among the plurality of members constituting the second flow path, at least the member close to the opening that communicates the second flow path with the first flow path has a cavity. The liquid discharge head according to any one of Configurations 1 to 17, characterized in that.

Explanation of Reference Numerals

[0053] 1: Nozzle, 2: Pressure chamber, 3: Element, 10: First flow path, 20: Second flow path, 21: Second flow path constituent member A, 30: Damper

Claims

1. A plurality of nozzles for ejecting liquid; a plurality of pressure chambers corresponding to the plurality of nozzles, respectively, and containing the liquid; a plurality of pressure generating elements arranged in the plurality of pressure chambers, respectively, for generating pressure for ejecting the liquid; a plurality of first flow paths respectively corresponding to the plurality of pressure chambers; a second flow passage common to the plurality of pressure chambers and communicating with the plurality of first flow passages; a damper that elastically deforms when the pressure of the liquid is increased by the pressure generating element; Equipped with a liquid ejection head, wherein the liquid is supplied from a common second flow path to each of the plurality of pressure chambers via the plurality of first flow paths, The Young's modulus of a second flow path member constituting the second flow path is 65 GPa or less. A liquid ejection head comprising:

2. The second flow path member has a Young's modulus of 32.5 GPa or less.

2. The liquid ejection head according to claim 1.

3. The second flow path member has a Young's modulus of 10 GPa or less and is made of a resin.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

4. The second flow path member has a Young's modulus of 5 GPa or less and is made of a resin that does not contain a filler.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

5. The second flow path member has a Young's modulus of 0.1 GPa or more.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

6. The second flow path member has a Young's modulus of 0.5 GPa or more.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

7. The thickness of the second flow path member is 50 μm or more.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

8. The thickness of the second flow path member is 100 μm or more.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

9. The thickness of the second flow path member is 200 μm or more.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

10. The thickness of the second flow path member is 500 μm or less.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

11. The second flow path and the first flow path are in communication with each other through an opening having a rectangular cross section, The thickness of the second flow path member is 1 to 20 times the length of the long side of the opening.

3. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head.

12. The damper is formed on a surface of the wall surface constituting the second flow path, which faces a surface having an opening communicating with the first flow path. The liquid discharge head according to claim 1 or 2, characterized in that.

13. The second flow path member also serves as an adhesive. The liquid discharge head according to claim 1 or 2, characterized in that.

14. 50% or more of the thickness or volume of the second flow path member is composed of a member that cures by a chemical reaction. The liquid discharge head according to claim 1 or 2, characterized in that.

15. The member that cures by the chemical reaction is a negative photosensitive resin. The liquid discharge head according to claim 14, characterized in that.

16. The second flow path member includes epoxy, silicone, benzocyclobutene, polyimide, or a mixture thereof. The liquid discharge head according to claim 1 or 2, characterized in that.

17. The interface between the second flow path member and the member constituting the first flow path, or the interface between the second flow path member and the member having the damper, has a portion that forms a covalent bond. The liquid discharge head according to claim 1 or 2, characterized in that.

18. Among the plurality of members constituting the second flow path, at least the member close to the opening that communicates the second flow path and the first flow path has a cavity. The liquid discharge head according to claim 1 or 2, characterized in that.

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