Resin sealing material manufacturing method and resin sealing material manufacturing device

Abstract

To accurately process an object to be polished.SOLUTION: Marking lines 507 orthogonal to each other are formed on an object to be polished 102. The object to be polished 102 is arranged in a pipe 103, and the pipe 103 is filled with liquid sealing resin 105. After the sealing resin 105 is cured, an extruding tool 104 is used to press a top face of the pipe 103 to take out the resin sealing material in which the object to be polished 102 is sealed. A surrounding area of a top face part of the resin sealing material is polished. The dimensions of the object to be polished 102 can be grasped by measuring the lengths of the marking lines 507. Polishing of a bottom face part of the resin sealing material is executed by using the grasped dimensions.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a polishing method, a polishing sample, an evaluation method for a polishing sample, a polishing apparatus, and a method for producing a polishing sample, which observe the surface state and polishing position of an object to be polished (polishing sample) and achieve good cross-section polishing. The present invention also relates to an apparatus for observing a polished surface of an object to be polished and a polishing apparatus equipped with the same.

Background Art

[0002] The miniaturization of semiconductor devices has been continuously progressing without showing any signs of reaching its limit. In order to achieve miniaturization, various technologies and methods are being developed.

[0003] With the miniaturization, problems such as poor connection of terminal portions of semiconductor devices, peeling of terminal portions, and crack generation occur. For the analysis of defective portions, it is necessary to perform cross-section polishing and observation of the defective portions. However, with the high definition of semiconductor devices, it is difficult to perform polishing processing with high precision.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Patent Document 1 discloses a polishing apparatus having a light transmitter and receiver, a transparent window provided in a polishing surface plate, and a reflecting mirror provided on a polishing body and facing the light transmitter and receiver. However, the polishing body needs to be composed of a member having light transmissibility, and there is a problem that the transmission window is contaminated with abrasive and the polishing portion of the polishing body cannot be observed.

[0006] Although polishing is sometimes carried out while visually observing the polishing state of the abrasive, it is difficult to observe the polishing location, and as a result, it has been difficult to carry out accurate polishing.

Means for Solving the Problems

[0007] The polishing apparatus of the present invention includes a sealed object in which the object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating the object to be polished with illumination light, a polarizing plate disposed on the light emission side of the illumination light irradiator, and optical observation means for observing the light reflected by the object to be polished.

[0008] The polishing apparatus of the present invention includes a sealed object in which the object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating the object to be polished with illumination light, a first polarizing plate disposed on the light emission side of the illumination light irradiator, a first λ / 4 plate disposed on the light emission side of the polarizing plate, optical observation means for observing the light reflected by the object to be polished, a second λ / 4 plate disposed between the optical observation means and the sealed object, and a second polarizing plate disposed between the second λ / 4 plate and the optical observation means.

[0009] The polishing apparatus of the present invention includes a sealed object in which the object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating the object to be polished with illumination light, a polarizing beam splitter disposed on the light emission side of the illumination light irradiator, a λ / 4 plate disposed on the light emission side of the polarizing beam splitter, and optical observation means for observing the light reflected by the object to be polished. The illumination light is reflected by the light separation surface of the polarizing beam splitter, then passes through the λ / 4 plate and is irradiated onto the object to be polished. The light reflected by the object to be polished is emitted from the sealed object, passes through the λ / 4 plate, passes through the light separation surface of the polarizing beam splitter, and enters the optical observation means.

[0010] In the polishing apparatus of the present invention, the light irradiator 201 is mounted on the moving (rotating) stage 603a. The angle of the incident light 205a incident on the resin-sealed sample 105 is adjusted by the moving (rotating) stage 603a. The incident light 205a passes through the polarizing plate 202a and becomes linearly polarized light. The optical image detection / photographing means 206 is mounted on the moving (rotating) stage 603b. The angle is adjusted so that the light 205d reflected by the polishing sample 102 and the processed surface 602a is incident on the optical image detection / photographing means 206. The incident light 205d is phase-converted by the λ / 2 plate 210 or the λ / 4 plate 204 and converted into linearly polarized light by the polarizing plate 202b.

[0011] The polishing method of the present invention is characterized in that the polishing surface of a sealed object in which the object to be polished is sealed is cleaned, a solution film or a cleaning liquid film is formed on the polishing surface to make it mirror-finished, the sealed object is irradiated with polarized light, and the optical image of the object to be polished on the polishing surface is observed.

[0012] The polishing method of the present invention uses the object to be polished as a reflecting surface, forms an optical image of the object to be polished on the reflecting surface, simultaneously observes the object to be polished and the optical image, and performs a polishing process.

[0013] The polishing method of the present invention is characterized in that the polishing surface of a sealed object in which the object to be polished is sealed is cleaned, a solution film is formed on the polishing surface, polarized light is irradiated from the side surface of the sealed object, and the optical image of the object to be polished on the polishing surface is observed from the upper surface of the polishing object.

Effect of the Invention

[0014] By generating a light reflecting surface on the polishing surface and illuminating it with polarized light, the polishing state of the resin-sealed sample can be observed well, and accurate polishing can be performed.

Brief Description of the Drawings

[0015]

Figure 1

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Figure 12

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Embodiments for Carrying Out the Invention

[0016] Hereinafter, the present invention will be described based on the drawings showing the embodiments. In the embodiments described in the specification and drawings, there may be cases of omission, enlargement, or reduction for the purpose of facilitating understanding or facilitating drawing. The embodiments of the present invention described in this specification and the drawings can be combined in part or in whole, respectively.

[0017] FIG. 1 is an explanatory diagram of a method for producing a polishing sample in the polishing method of the present invention. FIG. 1(a) is a model diagram (schematic diagram) of a polishing sample for explaining an embodiment of the present invention. A part of the semiconductor chip (object to be polished, polishing sample) 102 is imaged, and electrode terminals 101 are formed on one side of the semiconductor chip (object to be polished, polishing sample) 102. In this embodiment, as one embodiment, it will be described that cross-sectional polishing is performed along the line AA' which is the central part of the electrode terminal 101.

[0018] As shown in FIG. (a), a marking line 507 is formed on the polishing sample 102. The marking line 507 is marked with X-direction and Y-direction lines by a laser marker device (not shown). The marking line 507 is marked parallel to the cutting line AA' in the X direction and parallel to the electrode terminal 101 in the Y direction. The marking lines in the X direction and the Y direction are formed to be orthogonal. When polishing the polishing sample 102, the marking line 507 is monitored or detected, and the polishing operation is carried out with reference to the marking line 507.

[0019] After the polishing sample 102 is cut into small pieces, a sample holding block 601 formed or composed of an acrylic resin or the like is attached to the back surface or the like of the chip. The attachment is performed with an adhesive or a pressure-sensitive adhesive or a double-sided tape.

[0020] The sample holding block 601 stably arranges the polishing sample 102 with the polishing sample sealing pipe 103, and the polishing sample 102 is also stably held when injecting the sealing resin.

[0021] Figure 1(b) is a perspective view of the polishing sample sealing pipe 103 for fabricating the resin-sealed sample 105. Examples of the polishing sample sealing pipe 103 include an acrylic pipe, a polycarbonate pipe, a stainless-steel pipe, an aluminum pipe, and a vinyl chloride pipe.

[0022] It is preferable to coat or form the inner surface of the polishing sample sealing pipe with a resin having excellent properties such as slipperiness, non-stickiness, chemical resistance, and low friction, such as a fluororesin (fluorocarbon resin).

[0023] For example, polytetrafluoroethylene (Poly Tetra Fluoro Etylene) is exemplified. Polytetrafluoroethylene is a polymer of tetrafluoroethylene and is a fluororesin (fluorocarbon resin) composed only of fluorine atoms and carbon atoms. It is chemically stable and excellent in heat resistance and chemical resistance.

[0024] The polishing sample 102 as the object to be polished is disposed within the polishing sample sealing pipe 103, and a sealing resin (mold resin) is injected or filled into the polishing sample sealing pipe 103. The sealing resin (mold resin) is a liquid sealing material (such as a thermosetting or ultraviolet-curing resin), and the liquid sealing material is classified into thermosetting·thermoplastic, solvent·solvent-free, one-component·two-component types, etc., depending on the type and dosage form of the resin.

[0025] As the constituent materials of the liquid sealing material, acrylic resins and epoxy resins are mainly used. Resins such as plastic polymers and additives such as coupling agents, diluents, flame retardants, and defoaming agents are used as required.

[0026] The sealing resin (mold resin) is a resin mainly composed of an epoxy resin. The epoxy resin has a high refractive index, and the refractive index difference between the polishing surface 602 and air (refractive index 1.0) is large. Therefore, it is preferable because a good mirror surface (reflective surface) is formed or configured on the polishing surface 602. It is preferable to use a light-transmissive epoxy resin having a refractive index of 1.55 or more and 1.7 or less as the sealing resin.

[0027] In addition, silicone-based resins are also exemplified. Compared with epoxy resins, silicone resins can suppress the speed at which the material deteriorates and the light transmittance decreases. Epoxy resins absorb up to several percent of light, while silicone resins are less than 1%. The deterioration rate of the resin becomes slower accordingly, and it also becomes easier to observe the object to be polished by polarized light irradiation.

[0028] If necessary, a plastic polymer is mixed or added. Examples of the plastic polymer include polyamide resins, polyimide resins, urethane resins, silicone resins, and phenoxy resins.

[0029] The polishing sample 102 is placed in the polishing sample sealing pipe 103, and after the sealing resin is filled, the sealing resin is cured. Examples of the sealing resin curing methods include light curing and heat curing.

[0030] FIG. 2 is an explanatory diagram for removing the resin-sealed sample 105 that seals the polishing sample 102 from the polishing sample sealing pipe 103. The removal is easy. As shown in FIG. 2(a), from above the polishing sample sealing pipe 103, the resin-sealed sample 105 is pressed with the cylindrical pusher 104. By pressing, the resin-sealed sample 105 is separated from the polishing sample sealing pipe 103, and as shown in FIG. 2(b), the polishing sample 102 is taken out in a state where it is resin-sealed.

[0031] FIG. 3(a) is an explanatory diagram schematically showing a cross-section obtained by vertically cutting the resin-sealed sample 105 of FIG. 2(b) along the line AA'. FIG. 3(b) is an explanatory diagram schematically showing a cross-section obtained by vertically cutting the resin-sealed sample 105 of FIG. 2(b) along the line BB'. As shown in FIG. 3, the polishing sample 102 is sealed in the sealing resin.

[0032] FIG. 5 is a diagram showing an embodiment of the polishing apparatus. As shown in FIG. 5, the polishing apparatus of the present invention includes a polishing table 107 to which a polishing pad 506 having a polishing surface 505 is attached. The resin-sealed sample 105 is attached to the polishing sample holder 106.

[0033] The polishing sample holder 106 can move upward (U1) and downward (D1) as shown in FIG. 5. By raising the polishing sample holder 106 (U1), the polishing sample 102 can be separated from the polishing surface 505. By lowering the polishing sample holder 106 (D1), the polishing sample 102 can be pressed against the polishing surface 505. Also, by adjusting the amount of downward (D1) or upward (U1) movement of the polishing sample holder 106, the pressure with which the polishing sample 102 is pressed against the polishing surface 505 can be adjusted.

[0034] The polishing apparatus of the present invention includes a polishing head 106 for polishing while pressing a polishing sample 102 against a polishing pad 506 on a polishing table 107, a polishing liquid supply nozzle 307 for supplying a polishing liquid (e.g., slurry) to the polishing pad 506, a cleaning liquid supply nozzle 207 for supplying a cleaning liquid, and a polishing control unit (not shown) for controlling the polishing of the polishing sample 102.

[0035] The polishing table 107 is connected to a table motor 509 disposed below it via a table shaft 108, and the table motor 509 rotates the polishing table 107 in the direction indicated by the arrow.

[0036] A polishing pad 506 is attached to the pad support surface 508 of the polishing table 107. The pad support surface 508 is disposed on the upper surface of the polishing table 107. The upper surface of the polishing pad 506 constitutes a polishing surface 505 for polishing the polishing sample 102.

[0037] As shown in FIG. 5, the polishing table 107 can move in the upward direction (U2) and the downward direction (D2). By lowering the polishing table 107 (in the D2 direction), the polished sample 102 can be separated from the polishing surface 505. By raising the polishing table 107 (in the U2 direction), the polished sample 102 can be pressed against the polishing surface 505. Also, by adjusting the amount of lowering (D1 direction) or raising (U1 direction) of the polishing table 107, the pressure with which the polished sample 102 is pressed against the polishing surface 505 can be adjusted.

[0038] Also, a space is formed between the resin-sealed sample 105 and the polishing surface 505, and by supplying a cleaning liquid such as water from the cleaning liquid supply nozzle 207 to the space, the polishing surface of the resin-sealed sample 105 can be cleaned, and by forming a film composed of water, cleaning liquid, oil, surfactant, etc. on the polishing surface, a reflecting surface (mirror surface, optical image surface) described in FIGS. 7 and 8 can be generated.

[0039] The polishing head 106 is configured to be rotatable in the direction of the arrow. By rotating the polishing head 106 at high speed and supplying a cleaning liquid to the polishing surface of the polished sample 102 under high pressure, the polishing surface can be cleaned.

[0040] As shown in FIG. 6, the polishing head 106 is connected to the lower end of the polishing head shaft 301. The polishing head 106 is configured to be able to hold the polished sample 102 on its lower surface by vacuum suction. The polishing head shaft 301 is configured to be able to adjust the angle of the resin-sealed sample 105 by an angle adjustment unit (rotation unit, position setting unit) 302. The polishing head shaft 301 is configured to move up and down and left and right by the operation of the up-down / left-right movement mechanism.

[0041] The polishing head 106 and the polishing table 107 are rotated in the directions indicated by the arrows respectively, and a polishing liquid (slurry) (not shown) is supplied from the polishing liquid supply nozzle 307 onto the polishing pad 506. In this state, the polishing head 106 presses the polishing sample 102 against the polishing surface 505 of the polishing pad 506. The surface of the polishing sample 102 is polished by the mechanical action of the abrasive grains contained in the polishing liquid, or by the mechanical action of the abrasive grains and the chemical action of the polishing liquid.

[0042] The polishing apparatus includes an optical image detection and photographing means 206a from the side direction of the polishing sample 102 and an optical image detection and photographing means 206b from the upper direction of the polishing sample 102. The optical image detection and photographing means 206 corresponds to optical members and elements such as the observer's eye, a camera, a video camera, a photosensor, an imaging device, vision, etc.

[0043] Also, if necessary, an optical measuring instrument (thickness measuring device) (not shown) for measuring the thickness of the polishing sample 102 is provided. The optical measuring instrument (not shown) includes a sensor module (not shown) that acquires an optical signal that changes according to the thickness of the polishing sample 102, and a processing unit that determines the thickness from the optical signal.

[0044] The sensor module (not shown) is disposed inside the polishing table 107, and the processing unit is connected to a polishing control unit (not shown). The sensor module (not shown) includes a sensor head that guides light to the surface of the polishing sample 102 and receives the reflected light from the polishing sample 102.

[0045] The sensor head rotates integrally with the polishing table 107 and acquires the optical signal of the polishing sample 102 held by the polishing head 106. The sensor module (not shown) is connected to the processing unit, and the optical signal acquired by the sensor module (not shown) is sent to the processing unit.

[0046] It is a schematic cross-sectional view showing a polishing apparatus equipped with an optical measuring device (not shown). The polishing head shaft 301 is connected to a polishing head motor 509 via a connecting means such as a belt, and is rotated by the polishing head motor 509. Due to the rotation of the polishing head shaft 301, the polishing head 106 rotates in the direction indicated by the arrow.

[0047] The rotation speed of the polishing head 106 is different when polishing the polishing sample 102 and when cleaning the polished surface of the polishing sample 102. When cleaning the polished surface of the polishing sample 102, it rotates at a high speed to perform cleaning of the polished surface, formation of a film such as moisture on the polished surface, and removal of moisture and abrasive from the polished surface. When cleaning the polished surface or the like, cleaning water is supplied from the cleaning liquid supply nozzle 207. Also, when forming a film on the polished surface, cleaning water mixed with a surfactant is supplied from the cleaning liquid supply nozzle 207. Soaps, detergents, etc. are applicable as the surfactant.

[0048] During polishing, the polishing can be finished neatly by changing gradually from those with small and rough numbers to those with larger numbers in order. First, #80 or #150 is used, then #400 or #800 is used, and finally #2000 or the like is used.

[0049] Numbers such as #1000 and #3000 indicate the size of the abrasive grains. The abrasive grains are the abrasive material. By gradually changing from those with small and rough numbers to those with larger numbers in order during polishing, the processed surface (polished surface, cut surface) 602 can be finished neatly.

[0050] When the abrasive grains are #400 or less, there are polishing scratches on the processed surface 602, and the observation state of the electrode terminal 101 image on the processed surface (polished surface, cut surface) 602 is poor. When the abrasive grains are #1000 or more, the polishing scratches on the processed surface (polished surface) 602 decrease, and the observation state of the electrode terminal 101 image on the processed surface (polished surface, cut surface) 602 becomes good.

[0051] The present invention utilizes the processed surface 602 of the polishing sample 102 as a mirror surface, and observes the image of the electrode terminal 101 reflected on the processed surface 602 (mirror surface or reflective surface) to perform the polishing process. Therefore, it is important to be able to observe the processed surface 602 at a stage when the abrasive grain number is small. The present invention can observe the processed surface 602 at a stage when the abrasive grain number is small. In the present invention, if there are polishing scratches on the processed surface 602, the light is scattered by the polishing scratches, and the observation state of the image of the electrode terminal 101 reflected on the processed surface 602a deteriorates.

[0052] Cleaning water is supplied from the cleaning liquid supply nozzle 207. Also, it is supplied to the cleaning water mixed with a surfactant. The cleaning water washes away the abrasive grains on the processed surface 602. After cleaning, a solution mixed with cleaning water or a surfactant forms a film on the polished scratch part, and the processed surface 602 is mirror-finished or the polished scratches become less noticeable. Therefore, at a stage when the abrasive grains are small, the processed surface 602 becomes closer to a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be observed.

[0053] After washing away the abrasive grains on the processed surface 602, by supplying cleaning water or the like between the polishing table 107 and the processed surface 602, and filling or interposing the cleaning liquid or the like between the polishing table 107 and the processed surface 602, the polishing scratches on the processed surface 602 are reduced. Also, due to the refractive index difference between the cleaning liquid or the like and the polishing sample 102, a light reflecting surface is generated. Therefore, the processed surface 602 is a mirror surface or the obstacle due to the polishing scratches is reduced, and the image of the electrode terminal 101 reflected on the processed surface 602a (mirror surface, optical image forming surface) can be observed well.

[0054] Instead of the cleaning liquid or the like, petrolatum, lubricating oil, etc. may be applied. For example, colored petrolatum is exemplified. White petrolatum is a mixture of hydrocarbons obtained from petroleum that has been decolorized and purified.

[0055] Petroleum jelly is a product obtained by decolorizing and purifying a mixture of hydrocarbons derived from petroleum. Most of it contains paraffins with branched chains (isoparaffins) and alicyclic hydrocarbons (cycloparaffins, naphthenes). That is, a viscous and optically transparent material is applied or formed on the processing surface 602.

[0056] In addition, oil is exemplified as a material to be applied or formed on the processing surface 602. Oil is a hydrophobic chemical substance that is phase-separated from water and is usually a mixture composed of a number of compounds. Narrowly, it refers to fats and oils, but broadly, materials other than fats and oils, such as petroleum mainly composed of hydrocarbons and essential oils mainly composed of terpenoids, are also called oil.

[0057] As the polishing operation of the polished sample progresses, at the polishing stage with high abrasive grains, the polishing scratches on the processing surface 602 disappear. In this case, an air layer can be arranged between the polished sample 102 (resin-encapsulated sample 105) and the polishing surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0058] Since the refractive index of the air layer is 1.0 and the resin-encapsulated sample 105 is composed of an epoxy resin or the like, the refractive index is 1.55. Due to the refractive index difference between the air layer and the resin-encapsulated sample 105, a light reflection surface is generated due to the refractive index difference with the polished sample 102.

[0059] Therefore, the processing surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be observed well. Moisture or solution adhering to the processing surface 602 can be removed by centrifugal force by rotating the polishing head 106 at high speed.

[0060] As schematically shown in FIG. 3, the portion indicated by the arrow at the upper part of the resin-encapsulated sample 105 has the encapsulating resin bulging up. This is because the encapsulating resin adheres around the polished sample encapsulating pipe or the like.

[0061] For the resin-sealed sample 105, the portion indicated by the first arrow shown in FIG. 3 is polished. As shown in FIG. 6(a), the resin-sealed sample 105 is held by the polishing head 106. The polishing head 106 is attached to the polishing head shaft 301, and the polishing angle is adjusted, set, or changed by the angle adjustment unit 302. Also, the polishing head 106 rotates.

[0062] The polishing table 107 rotates, and a polishing liquid (slurry) (not shown) is supplied from the polishing liquid supply nozzle 307. The resin-sealed sample 105 is pressed against the polishing surface 505, and the portion indicated by the arrow in FIG. 3 is polished. FIG. 4 shows the state after polishing the arrow portion.

[0063] FIG. 4(a) is a view seen from the side of the resin-sealed sample 105, and FIG. 4(b) is a view seen from the top of the resin-sealed sample 105. After polishing the portion indicated by the arrow in FIG. 3, the processed surface 602b shown in FIG. 4(a) is polished to a mirror finish.

[0064] Next, as shown in FIG. 6(b), the resin-sealed sample 105 is inverted vertically and attached to the polishing head 106. The polishing head 106 or the polishing head shaft 301 is moved to position the processed surface 602a of the resin-sealed sample 105 in contact with the polishing surface 505, and the processed surface 602a is polished. Also, the polishing head 106 rotates.

[0065] The polishing table 107 rotates, and a polishing liquid (slurry) (not shown) is supplied from the polishing liquid supply nozzle 307. The resin-sealed sample 105 is pressed against the polishing surface 505, and the processed surface 602a is polished.

[0066] During the polishing process, as shown in FIG. 5(b), the processing state of the electrode terminal 101 is observed from the side of the resin-sealed sample 105 by the optical image detection and photographing means 206a. The optical image detection and photographing means 206a may be the visual sense (eye) of an observer or an imaging and display device composed of a camera and a monitor.

[0067] Further, an image of the electrode terminal 101 on the bottom surface (machined surface 602b) of the resin-sealed sample 105 is observed from the upper surface of the resin-sealed sample 105 by the optical image detection / photographing means 206b. As shown in FIGS. 1 and 4, in the embodiment of the present invention, it will be described that cross-sectional polishing is performed at CC' which is the central portion of the electrode terminal 101.

[0068] For the polishing process of the polishing sample 102, it is necessary to grasp the actual dimensions or relative dimensions of the polishing sample and then perform the processing. Therefore, it is necessary to measure the height H and width W of the polishing sample 102.

[0069] As shown in FIG. 4 and the like, the resin-sealed sample 105 has a cylindrical shape. Since the H2 direction is the planar direction of the cylinder, the length H2 can be measured. On the other hand, as shown in FIG. 4(b), the length W2 is in the cylindrical direction and is a curved surface, so W2 cannot be actually measured.

[0070] However, if the length of H2 can be measured, the relative length of W2 can be grasped from the length of H2. Also, if the length H1 grasped as the length H1 formed by the laser marker device is known, the actual length of H2 can be grasped from H1.

[0071] If the length W1 grasped as the length W1 formed by the laser marker device is known, the actual length of W2 can be grasped from W1. The lengths H2 and W2 can be measured by the optical image detection / photographing means 206. The length A of the electrode terminal 101 can be grasped from the length H2 or H1. Since the resin-sealed sample 105 is cylindrical and the periphery of the cylindrical resin-sealed sample 105 is air, the image is bent when observing the polishing sample 102.

[0072] As shown in FIG. 12, when a square container is filled with a solution and the resin-sealed sample 105 is immersed, the refractive index difference between the resin constituting the resin-sealed sample 105 and the solution disappears or becomes small, and the actual dimensions of W (W1, W2), H (H1, H2), and A in FIG. 4 can be measured or grasped.

[0073] For the encapsulating resin of the encapsulation sample 105, an epoxy resin or an acrylic resin is used. The refractive index of the epoxy resin is 1.55 to 1.61, and the refractive index of acrylic is generally 1.49. Therefore, it is preferable to use a solution having a refractive index close to that of the encapsulating resin to be used.

[0074] Examples of the high refractive index solution 200 include edible oil, 2-propanol, methyl salicylate (refractive index 1.538), ethylene glycol (refractive index 1.431), carbon tetrachloride (refractive index 1.46), benzene (refractive index 1.50), and paraffin oil (refractive index 1.48). Note that the refractive index of water is 1.33.

[0075] The container 109 is made of soda glass or light lime glass. The container 109 is filled with the high refractive index solution 200 (optical coupling liquid), and the resin-encapsulated sample 105 is immersed in the high refractive index solution 200. In order to absorb stray light, a light absorption film such as a black paint is formed or arranged on the outer surface or the inner surface (Sa, Sb, Sc, Sd) of the container 109.

[0076] Examples of the black paint and the light absorption film include those obtained by incorporating carbon into an organic material such as an acrylic resin, or those obtained by dispersing black beads or the like in a similar organic material. Further, examples include those obtained by incorporating cyanine black, which is a phthalocyanine-based pigment having high electrical insulation, into a resin vehicle, and a polarizing film.

[0077] By forming a black paint or a light absorption film on the outer surface or the inner surface (Sa, Sb, Sc, Sd) of the container 109, stray light and reflected light at the interface of the container 109 are reduced, and the polished sample or the resin-encapsulated sample 105 can be observed well. In particular, when using polarized light, it is effective to configure the absorption axis of the polarizing film 202 to be orthogonal to the absorption axis of the polarizing film arranged on the outer surface of the container 109 or the like.

[0078] By adopting the method of FIG. 12, the influence of the cylindrical shape of the resin-sealed sample 105 is eliminated, and the actual dimensions of W (W1, W2), H (H1, H2), and A in FIG. 4 can be measured or grasped.

[0079] FIG. 7 is an explanatory diagram of the polishing method of the present invention. As an example, it is a method of cross-polishing the electrode terminal 101 along the CC' line. Since the polishing apparatus has been described in FIGS. 5 and 6, it is omitted here.

[0080] In FIG. 7, the captured image 308a images the captured image viewed from the side direction of the resin-sealed sample 105. The captured image 308b images the captured image of the processed surface 602b of the resin-sealed sample 105.

[0081] The processed surface 602a of the resin-sealed sample 105 is polished as shown in FIG. 6(b). As shown in FIG. 7, the polishing process proceeds in the direction of the arrow from the processed surface 602a. The length of the electrode terminal 101 is A. At the start of the polishing process, as shown in FIG. 7(a), the distance between the reflected images 208 of the electrode terminal 101 in the captured image 308a and the electrode terminal 101 in the captured image 308b is D. As the polishing process progresses, the distance D becomes shorter.

[0082] In FIG. 7(b), the distance D becomes 0. At this time, the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 are connected, and the length obtained by adding the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is 2A.

[0083] When further polishing is performed, as shown in FIG. 7(c), the length obtained by adding the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 becomes A. FIG. 7(c) shows a state where the electrode terminal 101 is polished to a distance of 1 / 2. It is a state where the electrode terminal 101 is cross-polished along CC'. Therefore, when the polishing process is completed in FIG. 7(c), it means that the electrode terminal 101 is cross-polished at the 1 / 2 position (central part).

[0084] As described above, by observing or grasping the image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 and performing polishing, a cross-section polished sample of the central portion of the electrode terminal 101 can be obtained. As shown in FIG. 7(d), by further performing polishing from FIG. 7(c), a polished sample at a location other than the electrode terminal 101 can be obtained.

[0085] FIG. 7 is an explanatory diagram of the case where the polished sample 102 is vertically arranged on the resin-sealed sample 105. FIG. 8 is an explanatory diagram of the case where the polished sample 102 is obliquely arranged on the resin-sealed sample 105.

[0086] The case of FIG. 8 is the same as that of FIG. 7. The processing surface 602a of the resin-sealed sample 105 is polished as shown in FIG. 6(b). As shown in FIG. 8(a), the polishing proceeds in the arrow direction from the processing surface 602a.

[0087] As shown in FIG. 8(a), the distance between the electrode terminal 101a and the reflected image 208a of the electrode terminal 101 is D1, and the distance between the electrode terminal 101b and the reflected image 208b of the electrode terminal 101 is D2. Therefore, D2 > D1. Thus, it is necessary to shorten the distance of D2 so that the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 have a linear relationship as shown in FIG. 7.

[0088] Therefore, the angle of the angle adjustment unit 302 of the polishing apparatus of the present invention shown in FIG. 6 is adjusted, and the distance of D2 is shortened as compared with D1 from FIG. 8(a)->FIG. 8(b)->FIG. 8(c)->FIG. 8(d), and polishing is performed so that the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 have a linear relationship as shown in FIG. 7.

[0089] In FIG. 8(c), the electrode terminal 101b and the reflected image 208b of the electrode terminal 101 are substantially in a straight line. In FIG. 8(d), similar to FIG. 7(c), when the polishing is completed in FIG. 8(d), it means that the electrode terminal 101 is cross-section polished at the 1 / 2 position (central portion).

[0090] As shown in FIG. 8(d), the length obtained by adding the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is A. FIG. 7(c) shows a state where the electrode terminal 101 is polished to a distance of 1 / 2. The electrode terminal 101 is in a state of being polished in cross section along CC'. Therefore, when the polishing process is completed in FIG. 8(d), it means that the electrode terminal 101 has been polished in cross section at the 1 / 2 position (central part).

[0091] As described above, by observing or grasping the image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 and performing the polishing process, a cross-section polished sample of the central part of the electrode terminal 101 can be obtained.

[0092] The electrode terminal 101 and the like described in FIGS. 7 and 8 are illuminated by the light irradiator 201 and detected or observed by the optical image detection / photographing means 206. The light emitted from the light irradiator 201 is polarized light, and the polarized light is irradiated onto the polished sample 102. Also, wave plates (λ / 2 plate 210, λ / 4 plate 204) are used. The 1 / 2 wavelength plate 210 rotates the polarization direction of linearly polarized light. The 1 / 4 wavelength plate 204 converts linearly polarized light into circularly polarized light.

[0093] The wave plate functions by shifting the phase between two perpendicular polarization components of light waves. A typical wave plate is a birefringent crystal with the direction of the optical axis and the thickness determined. When the direction of the crystal is selected so that the optical axis of the crystal is parallel to the surface of the plate and the crystal is cut into a plate, two axes, the ordinary axis with a refractive index of no and the extraordinary axis with a refractive index of ne, are obtained in the cut plane.

[0094] The ordinary axis is perpendicular to the optical axis, and the extraordinary axis is parallel to the optical axis. In the case of a light wave incident perpendicularly to the plate, the polarization component along the ordinary axis travels through the crystal at a speed vo = c / no, while the polarization component along the extraordinary axis moves at a speed ve = c / ne. When the incident light exits the crystal, a phase difference occurs between the two components. When ne < no as in calcite, the extraordinary axis is called the fast axis and the ordinary axis is called the slow axis. When ne > no, the fast axis and the slow axis are reversed.

[0095] A half-wave retarder (Half-wave Retarders λ / 2 plate) gives a phase difference of π (=λ / 2) to the electric field vibration direction (plane of polarization) of the incident light. When the plane of polarization of the incident light enters at an azimuth angle of θ° with respect to the fast axis (or slow axis) of the wave plate, its vibration direction can be rotated by (2×θ°).

[0096] Therefore, when incident at an azimuth angle of 45°, the maximum rotation angle (=90°) can be obtained. When it is desired to change the direction of the plane of polarization of the irradiated light, the plane of polarization can be moved only by the half-wave retarder without physically rotating it. When circularly polarized light is incident on a half-wave retarder, the rotation direction of the polarization can be reversed.

[0097] A half-wave retarder gives a phase difference of π (=λ / 2) between two perpendicular polarization components of the incident light and emits it. When the polarization direction of the incident light enters at an azimuth angle of θ with respect to the fast axis (or slow axis) of the wave plate, its polarization direction can be rotated by 2θ and emitted. That is, 90° when incident at an azimuth angle of 45° is the maximum rotation angle. When the polarization components of the incident light are circularly polarized or elliptically polarized, its direction can be reversed by passing through a half-wave retarder.

[0098] A quarter-wave retarder (Quarter-wave Retarders λ / 4 plate) gives a phase difference of =λ / 4 to the electric field vibration direction (plane of polarization) of the incident light. When the plane of polarization of the incident light enters at an azimuth angle of 45° with respect to the fast axis (or slow axis) of the wave plate, linearly polarized light can be changed to circularly polarized light. Also, reversibly, circularly polarized light can be changed to linearly polarized light. When incident at an azimuth angle other than 45°, it becomes elliptically polarized light. A quarter-wave retarder is used in pairs with a polarization filter to construct an optical isolator. The present invention is used for the purpose of removing unnecessary retroreflection and glare.

[0099] A quarter-wave plate gives a phase difference of π / 2 (= λ / 4) between two perpendicular polarization components of incident light and emits the light. When the polarization direction of the incident light is incident at an azimuth angle other than 45° with respect to the fast axis (or slow axis) of the wave plate, the emitted light becomes elliptically polarized, and when it is incident at an azimuth angle of 45°, it becomes circularly polarized.

[0100] When the polarization axis of the incident light makes 0° with the fast axis or the slow axis, the polarization does not change, so the emitted light is also linearly polarized. When it is greater than 0° and less than 45°, it becomes elliptically polarized, and when it is 45°, it becomes circularly polarized. Also, conversely, circularly polarized or elliptically polarized incident light can be converted into linearly polarized light and emitted. FIG. 9 is an explanatory diagram of the polishing apparatus of the present invention. The polishing sample 102 in the resin-sealed sample 105 is illuminated by the emitted light from the light irradiator 201.

[0101] Examples of the light irradiator 201 include a monochromatic laser device, a white laser device, a xenon lamp irradiation device, a tungsten lamp irradiation device, an LED irradiation device, a backlight lighting fixture, a fiber irradiation device, and the like.

[0102] Since the resin-sealed sample 105 has a cylindrical shape, light from the light irradiator 201 is diffusely reflected inside the resin-sealed sample 105, generating stray light. As a result, a light intensity distribution occurs in the illumination state of the polishing sample 102, making it difficult to observe the state of the electrode terminal 101 of the polishing sample 102 and the polishing process state.

[0103] To address this problem, in the embodiment of FIG. 4(a) of the present invention, a polarizing plate (polarizing film, polarizing sheet) 202a is disposed on the light-emitting side of the light irradiator 201. The light 205a from the light irradiator 201 passes through the polarizing plate 202a and becomes polarized light 205b, and the light 205b illuminates the polishing sample 102.

[0104] In the figure, as an example, linearly polarized light in the vertical direction is illustrated by arrows in the up and down directions, and linearly polarized light in the horizontal direction is illustrated by arrows in the left and right directions. Needless to say, the polarization direction can be freely set and changed not only in the up and down directions and the left and right directions but also in an oblique direction or the like depending on the angle of the polarization axis of the polarizing plate.

[0105] As shown in FIG. 9(c), the polarizing plate 202, quarter-wave plate (λ / 4 plate) 204, and half-wave plate (λ / 2 plate) 210 are configured to be arbitrarily adjustable or set at plus angle (+θ) and minus angle (−θ) with respect to 0° (DEG.).

[0106] The quarter-wave plate 204 gives a phase difference of π / 2 (=λ / 4) between two perpendicular polarization components of incident light and emits the light. When the polarization direction of the incident light enters at an azimuth angle other than 45° with respect to the fast axis (or slow axis) of the wave plate, the emitted light becomes elliptically polarized, and when it enters at an azimuth angle of 45°, it becomes circularly polarized.

[0107] Therefore, as shown in FIG. 9(c), by rotating the fast axis (or slow axis) of the quarter-wave plate 204, elliptically polarized light to circularly polarized light can be changed. By changing the state of elliptically polarized light to circularly polarized light, the polished sample 102 can be adjusted to be most easily observable.

[0108] The half-wave plate gives a phase difference of π (=λ / 2) between two perpendicular polarization components of incident light and emits the light. When the polarization direction of the incident light enters at an azimuth angle of θ with respect to the fast axis (or slow axis) of the wave plate, the polarization direction can be rotated by 2θ and emitted. That is, 90° when entering at an azimuth angle of 45° becomes the maximum rotation angle.

[0109] When the polarization components of the incident light are circularly polarized or elliptically polarized, the direction can be reversed by passing through the half-wave plate. By rotating the fast axis (or slow axis) of the half-wave plate 204, elliptically polarized light to circularly polarized light can be changed. By rotating the polarization direction by 2θ and changing the state of elliptically polarized light to circularly polarized light, the polished sample 102 can be adjusted to be most easily observable.

[0110] As shown in FIG. 9(a), the light 205b becomes the reflected light 205c at the polished sample 102. A part of the light 205c reflected by the polished sample 102 becomes stray light and is diffusely reflected within the resin-sealed sample 105. Also, the phase axis of the light 205c rotates.

[0111] In FIG. 9(a), the λ / 2 plate 210 is arranged and set so as to be incident at an azimuth angle of approximately 45°. The polarization axes of the polarizing plate 202a and the polarizing plate 202b are arranged orthogonally.

[0112] The reflected light 205c is rotated by 90° by the λ / 2 plate 210. Therefore, the reflected light 205c passes through the polarizing plate 202b and becomes the reflected light 205d. The reflected light 205d is detected by the optical image detection / photographing means 206, and the polishing state of the polishing sample 102 is observed.

[0113] The optical image detection / photographing means is an optical detection means or the like, and corresponds to a camera, a photographing device, an imaging device, and also corresponds to a light receiving member, a light receiving element, etc. Also, a display device such as an LCD or an organic EL, a monitor corresponds, and also a combination of a photographing device or the like with these display devices or the like corresponds. Also, it corresponds to grasping, recognizing, and evaluating an object by human vision or observation.

[0114] Since the polarization axes of the polarizing plate 202a and the polarizing plate 202b are orthogonal, and the reflected light 205c is rotated by 90° by the λ / 2 plate 210, stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b. The stray light does not have the same phase and does not coincide with the polarization axis of the polarizing plate 202b.

[0115] Therefore, the stray light reaching the optical image detection / photographing means 206 is reduced, and the polishing state can be observed well. Also, as shown in FIG. 9(c), the angle θ of the phase axis of the λ / 2 plate 210 (λ / 4 plate 204) is adjusted or set so that the observation can be made best.

[0116] Needless to say, the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integral structure. The above is the same in other embodiments of the present invention.

[0117] FIG. 9(b) is a configuration diagram and an explanatory diagram of a polishing apparatus according to another embodiment of the present invention. In FIG. 9(b), a λ / 4 plate 204a is disposed on the light-emitting side of the polarizing plate 202a. A λ / 4 plate 204b is disposed on the light-incident side of the polarizing plate 202b.

[0118] The quarter-wave plate is disposed at approximately 45° (DEG.) with respect to the polarization axis of the polarizing plate 202. The quarter-wave plate gives a phase difference of π / 2 (= λ / 4) between two perpendicular polarization components of the incident light and emits the light. When the polarization direction of the incident light is incident at an azimuth angle of 45°, it becomes circularly polarized light.

[0119] When circularly polarized light is reflected, the direction of rotation is reversed. The transmitted light of the circular polarizing plate becomes left-handed circular polarization (right-handed circular polarization -> left-handed circular polarization) in the opposite direction at the reflecting surface. This is because the direction of rotation of the polarization is the same and the direction of propagation of the light is reversed. When this light passes through the previous quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° with respect to the forward path.

[0120] When the polarization axis of the incident light forms an angle of 0° with the fast axis or the slow axis, the polarization does not change, so the emitted light is also linearly polarized light. When the angle is greater than 0° and less than 45°, it becomes elliptically polarized light. When the angle is 45°, it becomes circularly polarized light. Also, reversibly, circularly polarized light or elliptically polarized incident light can be changed to linearly polarized light and emitted.

[0121] In the embodiment of the present invention, the direction of rotation of the circularly polarized light is indicated by a rotation arrow in FIG. 9 and the like. The λ / 4 plate 204 is arranged and set so as to be incident at an azimuth angle of approximately 45°. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are arranged orthogonally.

[0122] The light 205a emitted from the light irradiator 201 becomes linearly polarized light (vertical direction) by the polarizing plate 202a. The linearly polarized light becomes circularly polarized light 205b by the λ / 4 plate 204a. When the circularly polarized light 205b is reflected by the polishing sample 102, it becomes circularly polarized light 205c in the reverse rotation direction to the rotation direction of the circularly polarized light 205b. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b. The polarization axis of the linearly polarized light 205d is orthogonal to the polarization axis of the polarization light emitted from the polarizing plate 202a. Therefore, the light transmitted through the λ / 4 plate 204b becomes linearly polarized light and passes through the polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection / photographing means 206, and the polishing state of the polishing sample 102 is observed.

[0123] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are orthogonal to each other. By rotating the rotation direction of the circularly polarized light, which is the reflected light 205c, in the opposite direction by the λ / 4 plate 204b, stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b. Therefore, the stray light reaching the optical image detection / photographing means 206 is reduced, and the polishing state can be observed well.

[0124] FIG. 9 shows a case where light is irradiated from the light irradiator 201 to the polishing sample 102 in the vertical direction and detected by the optical image detection / photographing means 206 arranged in the vertical direction that has been reflected by the polishing sample 102. The present invention is not limited to this.

[0125] As shown in FIG. 10, light may be irradiated from the light irradiator 201 to the polishing sample 102 in an oblique direction, and the light reflected by the polishing sample 102 may be detected by the optical image detection / photographing means 206 arranged in the oblique direction.

[0126] In FIG. 9(a), the polarizing plate 202a and the polarizing plate 202b may be made into a single polarizing plate 202, and the polarization axis of the polarizing plate 202 may be configured to have the same polarization axis with respect to the incident light 205a and the outgoing light 205c.

[0127] In FIG. 9(a), a λ / 2 plate 210 may be arranged on the light-emitting side of the polarizing plate 202a. Also, in FIG. 9(a), a configuration may be adopted in which a λ / 2 plate 210 is arranged on the light-emitting side of the polarizing plate 202a and the λ / 2 plate 210 on the light-incident side of the polarizing plate 202b is removed.

[0128] In FIG. 9(b), the λ / 4 plate 204a and the λ / 4 plate 204b may be made into a single λ / 4 plate 204, and the phase (optical axis) axis of the λ / 4 plate 204 may be configured to be in the same direction with respect to the incident light 205a and the outgoing light 205c.

[0129] In Fig. 9(b), the polarizing plates 202a and 202b may be configured as a single polarizing plate 202, and the polarization axis of the polarizing plate 202 may be configured to be the same polarization axis with respect to the incident light 205a and the emitted light 205c. In Fig. 9(b), a configuration may be adopted in which the λ / 4 plate 204 is disposed on either the light-emitting side of the polarizing plate 202a or the light-incident side of the polarizing plate 202b. Needless to say, the above matters are also applicable to Fig. 10 and other drawings of the present invention and the embodiments in the specification.

[0130] In the embodiment of Fig. 13(a), light 205d is emitted from the processed surface 602b, and in the embodiment of Fig. 13(b), light 205a is incident on the processed surface 602b. The processed surface 602b is mirror-finished in the embodiment of Fig. 6 and the like so as not to obstruct the emission of light 205d and the incidence of light 205a.

[0131] The light irradiator 201 shown in Fig. 10 is disposed or installed on the moving (rotating) stage 603a. The moving (rotating) stage 603a moves in the X-axis direction and the Y-axis direction, and rotates the angle of the light irradiated from the light irradiator 201.

[0132] The optical image detection / photographing means 206 is disposed or installed on the moving (rotating) stage 603b. The moving (rotating) stage 603a moves in the X-axis direction and the Y-axis direction, and rotates the angle so that the reflected light 205d is incident on the optical image detection / photographing means 206.

[0133] The light irradiator 201a is loaded (mounted, installed) on the moving (rotating) stage 603, and adjusts or sets or changes the angle of the light incident on the resin-sealed sample 105. The optical image detection / photographing means 206 is loaded (mounted, installed) on the moving (rotating) stage 603, and adjusts or sets or changes the angle to favorably receive the light emitted from the resin-sealed sample 105. Similar to Fig. 9(a), in Fig. 10(a), the polarization axes of the polarizing plate 202a and the polarizing plate 202b are arranged orthogonally.

[0134] In FIG. 10(a), it is arranged, set, and configured such that the optical axis of the light 205d is incident at an azimuth angle of approximately 45° with respect to the optical axis of the λ / 2 plate 210. The polarization axes of the polarizing plate 202a and the polarizing plate 202b are arranged to be orthogonal.

[0135] The reflected light 205c is rotated by 90° in the polarization axis by the λ / 2 plate 210. Therefore, the reflected light 205c passes through the polarizing plate 202b and becomes the reflected light 205d. The reflected light 205d is detected by the optical image detection / photographing means 206, and the polishing state of the polishing sample 102 is observed.

[0136] Since the polarization axes of the polarizing plate 202a and the polarizing plate 202b are orthogonal and the reflected light 205c is rotated by 90° by the λ / 2 plate 210, stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b.

[0137] The stray light generated in the resin-sealed sample 105 does not have the same phase and does not coincide with the polarization axis of the polarizing plate 202b. Therefore, the stray light reaching the optical image detection / photographing means 206 is reduced, the contrast of the optical image is improved, and the polishing state can be observed well.

[0138] Also, in order to observe most favorably, as shown in FIG. 9(c), the angle θ of the phase axis of the λ / 2 plate 210 (λ / 4 plate 204) is adjusted or set. The adjustment or setting of the angle θ is performed while monitoring the photographed image with the optical image detection / photographing means 206.

[0139] Needless to say, the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integral structure. By bonding the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204), the interfaces where the polarizing plate 202, the λ / 2 plate, etc. are in contact with air are reduced, and the light transmittance is improved. In FIG. 10(a), a configuration in which at least one of the λ / 2 plate 210 and the polarizing plate 202b is omitted is also exemplified. The above is the same in other embodiments of the present invention.

[0140] Figure 10(b) is a configuration diagram and an explanatory diagram of a polishing apparatus according to another embodiment of the present invention. In Figure 10(b), a λ / 4 plate 204a is disposed on the light-emitting side of the polarizing plate 202a. A λ / 4 plate 204b is disposed on the light-incident side of the polarizing plate 202b.

[0141] The quarter-wave plate is disposed at approximately 45° (DEG.) with respect to the polarization axis of the polarizing plate 202. Note that, as shown in FIG. 9(c), the quarter-wave plate changes θ to appropriately adjust the display contrast and the like. The quarter-wave plate gives a phase difference of π / 2 (=λ / 4) between two perpendicular polarization components of the incident light and emits the light. When the polarization direction of the incident light is incident at an azimuth angle of 45°, it ideally becomes circularly polarized light.

[0142] When circularly polarized light is reflected, the direction of rotation is reversed. The transmitted light of the circularly polarizing plate becomes left-handed rotation -> right-handed rotation in the opposite direction at the reflecting surface. When this light passes through the previous quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° with respect to the forward path.

[0143] When the polarization axis of the incident light forms an angle of 0° with the fast axis or the slow axis, the polarization does not change. The emitted light is also linearly polarized light. When the angle is greater than 0° and less than 45°, it is elliptically polarized light, and when the angle is 45°, it is circularly polarized light. Therefore, incident light that is circularly polarized or elliptically polarized can be changed to linearly polarized light and emitted. The λ / 4 plate 204 is arranged and set so as to be incident at an azimuth angle of approximately 45°. The polarization axes of the polarizing plate 202a and the polarizing plate 202b are arranged orthogonally. The light 205a emitted from the light irradiator 201 passes through the polarizing plate 202a and becomes linearly polarized light (vertical direction). The linearly polarized light becomes circularly polarized light 205b by the λ / 4 plate 204a.

[0144] When the circularly polarized light 205b is reflected by the polishing sample 102, it becomes circularly polarized light 205c rotating in the reverse direction to the rotation direction of the circularly polarized light 205b. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b. The polarization axis of the linearly polarized light 205d is orthogonal to the polarization axis of the polarization light emitted from the polarizing plate 202a. The light passing through the λ / 4 plate 204b becomes linearly polarized light and passes through the polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection and photographing means 206, and the polishing state of the polishing sample 102 is observed.

[0145] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are orthogonal to each other. By rotating the rotation direction of the circularly polarized light, which is the reflected light 205c, in the opposite direction by the λ / 4 plate 204b, stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b and does not enter the optical image detection and photographing means 206. Or it decreases. Therefore, the stray light reaching the optical image detection and photographing means 206 decreases, and the polishing state can be observed well.

[0146] In FIGS. 9(a), 9(b), 10(a), and 10(b), mainly the light from the light irradiator is irradiated onto the electrode terminal 101, and the electrode terminal 101 portion or the vicinity thereof is observed to observe the polishing state.

[0147] As shown in FIGS. 10(c) and 10(d), by moving the moving (rotating) stage 603 to change or adjust the light irradiation direction with respect to the polishing sample 102 and the light detection direction of the optical image detection and photographing means 206, the reflected image 208 can be observed, and the reflected image 208 and the electrode terminal 101 described in FIGS. 7 and 8 can be observed simultaneously.

[0148] In FIGS. 10(c) and 10(d), light enters from the side surface of the resin-sealed sample 105 to illuminate the polishing sample 102, and light exits from the side surface of the resin-sealed sample 105 and is detected and observed by the optical image detection and photographing means 206.

[0149] In FIG. 10(c), the light 205a emitted from the light irradiator 201 becomes polarized by the polarizing plate 202a, and the polarized light 205b enters from the side surface of the resin-sealed sample 105. The polarized light 205b is reflected by the polishing sample 102. The polishing sample 102 is illuminated by the polarized light 205, and a reflected image 208 of the electrode terminal 101 is generated on the processed surface 602a.

[0150] The reflected image 208 becomes clearer as the mirror finish of the processed surface 602 progresses. When the abrasive grain size is #400 or less, there are polishing scratches on the processed surface 602a, and the observation state of the electrode terminal 101 image on the processed surface 602a is poor. When the abrasive grain size becomes #1000 or more, the polishing scratches on the processed surface 602a decrease, and the observation state of the electrode terminal 101 image on the processed surface 602 becomes good.

[0151] Even when the processed surface 602a has scratches, the present invention fills the scratches with water, cleaning liquid, oil, petroleum jelly, etc. by generating a film such as water during polishing or the like on the processed surface 602a, bringing the processed surface 602a closer to a mirror surface, or reducing the influence of the existing scratches, so that a reflected image 208 (optical image) can be generated with the processed surface 602a as a mirror. Therefore, the processed surface 602a can be observed well from a stage where the number (#) of abrasive grains is small.

[0152] As it approaches the target cross-sectional polishing position, the number (#) of abrasive grains increases, the polishing scratches on the processed surface 602a are reduced, and by further generating a film such as water on the processed surface 602a, the mirror finish of the processed surface 602a improves, so that polishing with good processing position accuracy can be realized.

[0153] When the polishing position is near the target position, the processed surface 602a is mirror-finished. The processed surface 602a is cleaned, the polishing head 106 is lifted in the U1 direction in Fig. 5(b), the polishing head 106 is rotated at high speed to remove water or the like from the processed surface 602a, or to form a thin film coating such as water. The processed surface 602a of the resin-sealed sample 105 is made to contact the air layer.

[0154] The refractive index of the epoxy resin of the resin-sealed sample 105 is approximately 1.55, and the refractive index of air is 1.0. Alternatively, the refractive index of water of the water film on the processed surface 602a of the resin-sealed sample 105 is approximately 1.33, and the refractive index of air is 1.0. The water film and the like function to reduce the step of polishing scratches or make them less conspicuous. Since the water film and the like are thin, even if there is a slight difference in the refractive index of the sealing resin, the formation of a reflected image of the polished sample or the like occurs favorably. Therefore, the processed surface 602a can reflect light favorably, and a good reflected image 208 is generated. Therefore, the reflected image at the polishing position can be observed favorably, and polishing with good processing position accuracy can be realized.

[0155] It is arranged, set, and configured to be incident at an azimuth angle of approximately 45° with respect to the polarization axis of the λ / 2 plate 210. The polarization axes of the polarizing plate 202a and the polarizing plate 202b are arranged to be orthogonal.

[0156] The reflected light 205d is rotated by 90° in the polarization axis by the λ / 2 plate 210. Therefore, the reflected light 205d passes through the polarizing plate 202b. The reflected light 205e is detected by the optical image detection / photographing means 206, and the polishing state of the polished sample 102 is observed.

[0157] Since the polarization axes of the polarizing plate 202a and the polarizing plate 202b are orthogonal, and the reflected light 205e is rotated by 90° by the λ / 2 plate 210, stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b.

[0158] The stray light generated in the resin-sealed sample 105 does not have its light phases aligned or does not coincide with the polarization axis of the polarizing plate 202b. Therefore, the stray light reaching the optical image detection / photographing means 206 is reduced, the contrast of the optical image is improved, and the polishing state can be observed favorably.

[0159] As shown in FIG. 9(c), the angle θ of the phase axis of the λ / 2 plate 210 is adjusted or set so that it can be observed most favorably. The adjustment or setting of the angle θ is performed while monitoring the photographed image with the optical image detection / photographing means 206.

[0160] Needless to say, the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integral structure. By bonding the polarizing plate 202 and the λ / 2 plate 210 together, the interfaces where the polarizing plate 202, the λ / 2 plate, etc. are in contact with air are reduced, and the light transmittance is improved.

[0161] Figure 10(d) is a configuration diagram and an explanatory diagram of a polishing apparatus in another embodiment of the present invention. In Figure 10(d), a λ / 4 plate 204a is arranged on the light-emitting side of the polarizing plate 202a. A λ / 4 plate 204b is arranged on the light-incident side of the polarizing plate 202b.

[0162] In Figure 10(d), light enters from the side surface of the resin-sealed sample 105 to illuminate the polishing sample 102, and light exits from the side surface of the resin-sealed sample 105 and is detected and observed by the optical image detection / photographing means 206.

[0163] In Figure 10(d), the light 205a emitted from the light irradiator 201 becomes polarized by the polarizing plate 202a, and the polarized light 205b enters from the side surface of the resin-sealed sample 105. The polarized light 205b is reflected by the polishing sample 102. The polishing sample 102 is illuminated by the polarized light 205, and a reflected image 208 of the electrode terminal 101 is generated on the processed surface 602a.

[0164] The 1 / 4 wavelength plate is arranged at 45° with respect to the polarization axis of the polarizing plate 202. When circularly polarized light is reflected, the direction of rotation is reversed. The transmitted light of the circular polarizing plate becomes reverse (right rotation -> left rotation) on the reflecting surface. When this light passes through the previous 1 / 4 wavelength plate, it returns to linearly polarized light. The direction of the polarization plane changes by 90° with respect to the forward path. Therefore, incident light of circular polarization or elliptical polarization can be changed to linearly polarized light and emitted. The λ / 4 plate 204 is arranged and set so as to be incident at an azimuth angle of approximately 45°. The polarization axes of the polarizing plate 202a and the polarizing plate 202b are arranged orthogonally. The light 205a emitted from the light irradiator 201 passes through the polarizing plate 202a and becomes linearly polarized light (vertical direction). The linearly polarized light becomes circularly polarized light 205b by the λ / 4 plate 204a.

[0165] When the circularly polarized light 205b is reflected by the polished sample 102, it becomes circularly polarized light 205c rotating in the opposite direction to the rotation direction of the circularly polarized light 205b. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b. The light that passes through the λ / 4 plate 204b becomes linearly polarized light and passes through the polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection / photographing means 206, and the polishing state of the polished sample 102 is observed.

[0166] The reflected image 208 becomes clearer as the mirror finish of the processed surface 602 progresses. If there are polishing scratches on the processed surface 602a, the sharpness decreases. By cleaning the processed surface 602a and forming a film made of cleaning water or the like on the processed surface 602a, the processed surface 602a can be mirror-finished or the light reflectance can be improved.

[0167] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are orthogonal, and by rotating the rotation direction of the circularly polarized light, which is the reflected light 205c, in the opposite direction by the λ / 4 plate 204b, stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b. Therefore, the stray light reaching the optical image detection / photographing means 206 is reduced, and the polishing state can be observed well.

[0168] In FIGS. 9 and 10, it has been described that the polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are orthogonal, but the present invention is not limited to this. For example, the polarization axes of the polarizing plate 202a and the polarizing plate 202b may be configured to be substantially coincident.

[0169] The azimuth angles of the λ / 2 plate 210 and the λ / 4 plate 204 may be -θ, and the rotation axis of the circularly polarized light may be in the opposite direction. Also, it is not limited to circularly polarized light, and elliptically polarized light may be used.

[0170] In FIGS. 10(c) and 10(d), the λ / 2 plate 210 may be omitted. The λ / 4 plate 204 may be omitted. The polarization axes of the polarizing plate 202a and the polarizing plate 202b may be configured to be substantially coincident.

[0171] As shown in FIGS. 10(c) and 10(d), by arranging the aperture 504 so that the light incident on the optical image detection / imaging means 206 has a narrow directivity, stray light is eliminated, and the image of the polishing sample 102 or the like can be observed with high contrast. Also, the image becomes clear. In the embodiments of FIGS. 2, 4, 9, 10, etc., the resin-sealed sample 105 is described as being cylindrical, but the present invention is not limited to this.

[0172] FIG. 19 is an explanatory view of the resin-sealed sample 105 in the polishing apparatus of the present invention. In FIG. 19, FIG. 19(a) is an explanatory view of the resin-sealed sample 105 seen from the side direction, FIG. 19(b) is an explanatory view of the resin-sealed sample 105 seen from the front direction, and FIG. 19(c) is an explanatory view of the resin-sealed sample 105 seen from the top direction.

[0173] One side on the upper side of the resin-sealed sample 105 in FIG. 2(b) is cut or polished at an angle θ. The angle θ is preferably 40° or more and 60° or less in view of the relationship of the light incident angle. The cut processed surface 602b is polished or the like to be finished as a mirror surface. The method of polishing or the like is the same as that of the processed surface 602a.

[0174] As shown in FIG. 19, by cutting the resin-sealed sample 105 at an angle θ, the light 205a from the light irradiator 201 is less attenuated by the surface reflection of the resin-sealed sample 105 and can be made incident on the resin-sealed sample 105. The light 205a illuminates the polishing sample 102. The light reflected or the like by the polishing sample 102 exits from the resin-sealed sample 105 as the light 205b. The emitted light 205b is incident on the optical image detection / imaging means 206.

[0175] The light incident on the resin-sealed sample 105 is scattered or the like within the resin-sealed sample 105, and stray light is generated. When stray light is generated, it becomes difficult or the observation of the electrode terminal 101 and the polishing sample 102 deteriorates.

[0176] In this embodiment, in order to counteract stray light, as shown in FIG. 20, in the resin-sealed sample 105, a light absorption film 606 is formed at a location other than the processed surface 602, the light incident surface that illuminates the polished sample 102, and the light exit surface for observing the optical image of the polished sample 102.

[0177] Examples of the light absorption film 606 include those obtained by incorporating carbon into an organic material such as an acrylic resin, or those obtained by dispersing black beads or the like in a similar organic material. Further, an example is a material in which cyanine black, which is a phthalocyanine-based pigment having high electrical insulation, is contained in a resin vehicle. As shown in FIG. 4 and the like, after manufacturing the resin-sealed sample 105, a light absorption film 606 is formed on the surface of the resin-sealed sample 105, and processing such as the processed surface 602 is performed.

[0178] FIG. 11 is a configuration diagram and an explanatory diagram of the polishing apparatus of the present invention. The resin-sealed sample 105 is held by a polishing head 106. The polishing head 106 presses the resin-sealed sample 105 against the polishing surface 505, and the polishing head 106 rotates.

[0179] The optical image detection / imaging means 206 observes the polishing state. In order to observe the state of the polished sample 102 in the resin-sealed sample 105, the optical image detection / imaging means 206 synchronizes with the rotational position of the resin-sealed sample 105.

[0180] The optical image detection / imaging means 206a captures or observes the polished sample 102 when the polished sample 102 faces the front (point C). Similarly, the optical image detection / imaging means 206b captures or observes the reflected image 208 of the electrode terminal 101 of the polished sample 102 when the polished sample 102 faces the front (point C). The reflected image 208 is reflected on the processed surface 602a.

[0181] A space is formed between the resin-sealed sample 105 and the polishing surface 505, and a cleaning liquid such as water is supplied from the cleaning liquid supply nozzle 207 into the space to clean the polishing surface (machined surface 602a) of the resin-sealed sample 105 and form a film made of water or the like on the polishing surface (machined surface 602a). By rotating the polishing head 106 at high speed and supplying the cleaning liquid to the polishing surface of the polishing sample 102 under high pressure, the polishing surface (machined surface 602a) can be cleaned. The solution supplied during polishing and the solution supplied during cleaning may be the same, but it is preferable to make them different.

[0182] As shown in FIG. 6, the polishing head 106 is connected to the lower end of the polishing head shaft 301. The polishing head shaft 301 is opened so that the optical image detection / photographing means 206b can observe the reflected image 208.

[0183] FIG. 11(a) shows the case where the electrode terminal 101 and the reflected image 208 are arranged linearly as shown in FIG. 7, and FIG. 11(b) shows the case where the electrode terminal 101 and the reflected image 208 are arranged obliquely as shown in FIG. 8. In either case, the rotation position of the resin-sealed sample 105 and the optical image detection / photographing means 206 are synchronized to observe or detect the polishing state. FIG. 13 is a configuration diagram and an explanatory diagram of the polishing apparatus of the present invention. It is a method for observing the reflected image 208 of the processed portion 602a on the bottom surface of the resin-sealed sample 105.

[0184] A diaphragm (light-shielding tool) 504 is arranged on the front surface of the light irradiator 201. Also, a diaphragm (light-shielding tool) 504 is arranged on the light incident side of the optical image detection / photographing means 206 as necessary.

[0185] Examples of the diaphragm (light-shielding tool) 504 include a water house diaphragm in which a perforated plate is inserted from a slit beside the lens, a water gate diaphragm in which a flat rod with large and small holes is moved up and down in front of or inside the lens, a rotary diaphragm in which a disk with small holes is rotated in front of or inside the lens, and an iris diaphragm made by stacking a plurality of plates (diaphragm blades) so as to enable fine adjustment.

[0186] In this embodiment, it is preferable to adopt a iris diaphragm as the aperture 504. The center position of the iris diaphragm is arranged or configured as the center of the light beam of the light (optical path) 205. By changing the aperture of the iris diaphragm, the directivity of the light 205 in the optical path can be controlled. Therefore, control equivalent to changing the F number of the lens 605 can be achieved. By changing the aperture of the iris diaphragm, the contrast and sharpness of the optical image can be adjusted or set.

[0187] In the embodiment of FIG. 13(a), the light 205a emitted from the light irradiator 201 becomes polarized by the polarizing plate 202a, becomes circularly polarized by the λ / 4 plate, and is incident obliquely from the side surface of the resin-sealed sample 105 to become the light 205b. Since the refractive index of the resin-sealed sample 105 is higher than that of air, according to Snell's law, the incident angle of the light 205b is θ2 (θ1>θ2) for the incident angle θ1. The circularly polarized light 205b illuminates the polished sample 102, and a part of the light is reflected to become circularly polarized light 205c rotating in the reverse direction.

[0188] The processed surface 602a is in contact with air or in contact with the interface with water whose refractive index is lower than that of the resin-sealed sample 105. Therefore, the circularly polarized light 205c is totally reflected or reflected at the processed surface 602a. Due to the circularly polarized light 205c, a reflected image 208 of the electrode terminal 101 is formed on the processed surface 602a.

[0189] The circularly polarized light 205c and the circularly polarized light 205b are reflected inside the resin-sealed sample 105, and a part of the light becomes the reflected light 205d and is incident on the optical image detection / imaging means 206, and the optical image detection / imaging means 206 detects or observes the reflected image 208. Further, due to the aperture 504b, the light 205d has a narrow directivity, and the stray light incident on the optical image detection / imaging means 206 is reduced.

[0190] The light irradiator 201 is mounted (loaded, mounted) on the moving (rotating) stage 603, and the angle of the light incident on the resin-sealed sample 105 is changed to adjust so that the observed image by the optical image detection / imaging means 206 becomes optimal.

[0191] The reflected light 205d is converted into linearly polarized light by the λ / 4 plate 204b and passes through the polarizing plate 202b. The polarization axes of the polarizing plate 202ba and the polarizing plate 202b are configured to be orthogonal to each other. As described above, the present invention utilizes the processed surface 602a as a reflecting surface.

[0192] When the abrasive grains are #400 or less, there are polishing scratches on the processed surface 602a, and the observation state of the electrode terminal 101 image on the processed surface 602 is poor. When the abrasive grains are #1000 or more, the polishing scratches on the processed surface 602 decrease, and the observation state of the electrode terminal 101 image on the processed surface 602 becomes good. At the beginning of the polishing process, abrasive grains with a low number are used, and as the polishing approaches completion, abrasive grains with a high number are used.

[0193] The importance of polishing is to make the cross-sectional position reach the target position as it approaches the completion of polishing. Therefore, in the first stage of the polishing process, the accuracy of the polishing position is not necessary. In the final stage of the polishing process, the accuracy of the polishing position is required.

[0194] The present invention utilizes the processed surface 602 of the polishing sample 102 as a mirror surface and observes the image of the electrode terminal 101 reflected on the mirror surface to carry out the polishing process. Therefore, it is important to be able to observe the processed surface 602 at a stage when the number of abrasive grains is small.

[0195] At the beginning of the polishing process, if there are polishing scratches on the processed surface 602, the light is scattered by the polishing scratches, and the observation state of the image of the electrode terminal 101 reflected on the processed surface 602a deteriorates. However, since it is far from the target position of polishing, confirmation of the polishing position is not necessary.

[0196] Cleaning water is supplied from the cleaning liquid supply nozzle 207. It is preferably supplied to the cleaning water mixed with a surfactant. The cleaning water washes away abrasive grains and the like on the processed surface 602a. After cleaning, a solution mixed with cleaning water or a surfactant forms a film on the processed surface 602a at the polished scratch part. The film covers the polished scratches on the processed surface 602a, reduces the unevenness of the polished scratches, and mirrors the processed surface 602a. Alternatively, it increases the specular reflectance of the processed surface 602a and reduces stray light.

[0197] When a film is formed on the processed surface 602a and the processed surface 602a is mirrored, the polished scratches become less noticeable. Therefore, at a stage where the abrasive grains are small, the processed surface 602a becomes closer to a mirror surface, and the reflected image 208 of the electrode terminal 101 reflected in the mirror surface can be observed.

[0198] After washing away the abrasive grains on the processed surface 602, by supplying cleaning water or the like between the polishing table 107 and the processed surface 602a and filling or interposing cleaning liquid or the like between the polishing table 107 and the processed surface 602, the polished scratches on the processed surface 602a are reduced. Also, due to the difference in refractive index between the cleaning liquid or the like and the polishing sample 102, a light reflecting surface is generated. Therefore, the processed surface 602a becomes more mirrored, and the electrode terminal 101 part, the reflected image 208 of the electrode terminal 101 reflected on the processed surface 602a, etc. can be observed well.

[0199] As the polishing operation of the polishing sample progresses, at the polishing stage using large-numbered abrasive grains (number 200 or more), the polished scratches on the processed surface 602 become small and shallow. By forming a film of cleaning liquid or the like on the processed surface 602a, the processed surface 602a is mirrored, and the contrast and sharpness of the reflected image 208 are improved. As the polishing operation of the polishing sample progresses, at the final stage of the polishing process using large-numbered abrasive grains (number 200 or more), the polished scratches on the processed surface 602 disappear.

[0200] At this stage, by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction), an air layer can be arranged between the polishing sample 102 (resin-sealed sample 105) and the polishing surface 505.

[0201] Since the air layer has a refractive index of 1.0 and the resin-sealed sample 105 is composed of an epoxy resin or the like, the refractive index is about 1.55. Due to the refractive index difference between the air layer and the resin-sealed sample 105, a light reflection surface is generated due to the refractive index difference from the polished sample 102. Therefore, the processed surface 602 becomes a mirror surface, and the reflected image 208 of the electrode terminal 101 reflected on the mirror surface can be observed well. Moisture or solution adhering to the processed surface 602a can be removed by centrifugal force by rotating the polishing head 106 at high speed. Also, a thin water film or solution film can be formed on the processed surface 602a, and further polishing scratches are eliminated, and the processed surface 602a is mirror-finished.

[0202] By arranging the aperture 504a on the light-emitting side of the light irradiator 201, arranging the aperture 504b on the light-incident side of the optical image detection / imaging means 206, making the light have a narrow directivity, or defining the directivity, the generation of stray light and the reception of stray light can be suppressed, and an optical image can be detected and observed with high contrast.

[0203] Also, by arranging the aperture 504b on the light-incident side of the optical image detection / imaging means 206 and adjusting the aperture diameter of the aperture 504b, the F-number of the incident light can be controlled, and the contrast adjustment of the observed image can be carried out well.

[0204] In the embodiment of FIG. 13(a), the light emitted by the light irradiator 201 is made to enter from the side surface of the resin-sealed sample 105, and the light 205d emitted from the upper surface of the resin-sealed sample 105 is received by the optical image detection / imaging means 206. However, the present invention is not limited to this. For example, the light emitted by the light irradiator 201 may be made to enter the resin-sealed sample 105 from the upper surface (processed surface 602b surface) of the resin-sealed sample 105, and the light 205dc emitted from the side surface of the resin-sealed sample 105 may be received by the optical image detection / imaging means 206.

[0205] In Fig. 13(a), even if the λ / 4 plates 204a and 204b are removed, it may be sufficient for practical use. Also, the polarization axes of the polarizing plates 202a and 202b may be in the same direction. As shown in Fig. 13(a), the light 205b becomes the reflected light 205c by the polished sample 102 or the like. A part of the light 205c reflected by the polished sample 102 becomes stray light.

[0206] The λ / 4 plate 204a is arranged and set at an azimuth angle of approximately 45° with respect to the polarization axis of the polarizing plate 202a. The polarization axes of the polarizing plate 202a and the polarizing plate 202b are arranged orthogonally.

[0207] The polarized light transmitted through the λ / 4 plate 204a becomes circularly polarized light 205a. The circularly polarized light 205a enters from the side surface of the resin-sealed sample 105, becomes light 205b, and is reflected by the polished sample 102 or the like. The reflected circularly polarized light 205c becomes circularly polarized light that rotates in the opposite direction to the circularly polarized light 205b. A part of the circularly polarized light 205c is totally reflected by the processed surface 602a, and a reflection image 208 of the electrode terminal 101 is formed on the processed surface 602a. The light in the resin-sealed sample 105 is emitted outside the resin-sealed sample 105 as the reflected light 205d.

[0208] The reflected light 205d is converted into linearly polarized light by the λ / 4 plate 204b. Therefore, the reflected light 205b passes through the polarizing plate 202b, is detected by the optical image detection / photographing means 206, and the polishing state of the polished sample 102 is observed.

[0209] When circularly polarized light is reflected, the rotation direction is reversed. The transmitted light of the circular polarizing plate becomes left-handed rotation (right-handed rotation -> left-handed rotation) in the opposite direction at the reflection surface. This is because the rotation direction of the polarization is the same and the traveling direction of the light is reversed. When this light passes through the previous quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° with respect to the forward path.

[0210] The λ / 4 plate 204a converts it into circularly polarized light 205a, and the λ / 4 plate 204b converts it into circularly polarized light rotating in the opposite direction of the circularly polarized light 205a, so that stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b. Therefore, the stray light reaching the optical image detection / photographing means 206 is reduced, and the polishing state can be observed favorably. Further, as shown in FIG. 9(c), the angle θ of the phase axis of the λ / 4 plate 204 is adjusted or set so that the observation can be performed most favorably.

[0211] Needless to say, the polarizing plate 202 and the λ / 4 plate 204 may be bonded together and configured as one body. The above also applies to other embodiments of the present invention.

[0212] As shown in FIG. 5, the polishing table 107 can move up (U2) and down (D2). By lowering the polishing table 107 (D2), the polishing sample 102 can be separated from the polishing surface 505. By raising the polishing table 107 (U2), the polishing sample 102 can be pressed against the polishing surface 505. Further, by adjusting the amount of lowering (D1) or raising (U1) of the polishing table 107, the pressure for pressing the polishing sample 102 against the polishing surface 505 can be adjusted.

[0213] A space is formed between the resin-sealed sample 105 and the polishing surface 505, and a cleaning liquid such as water is supplied from the cleaning liquid supply nozzle 207 into the space, thereby cleaning the polishing surface of the resin-sealed sample 105 and forming a film made of water or the like on the processed surface 602a. The film made of water or the like reduces the optical scattering of light by the polishing scratches on the processed surface 602a and makes the processed surface 602a closer to a mirror surface. The mirror surface becomes a reflecting surface, and the reflecting surfaces described in FIGS. 7 and 8 can be generated.

[0214] The polishing head 106 is configured to be rotatable in the direction of the arrow. By rotating the polishing head 106 at high speed and supplying the cleaning liquid to the polishing surface of the polishing sample 102 at high pressure, the polishing surface (processed surface 602a) can be cleaned.

[0215] As shown in FIG. 6, the polishing head 106 is connected to the lower end of the polishing head shaft 301. The polishing head 106 is configured to hold the polishing sample 102. The polishing head shaft 301 is configured to be able to adjust the angle of the resin-sealed sample 105 by the angle adjustment unit 302. The polishing head shaft 301 is configured to move up and down and left and right by the operation of the up-down / left-right movement mechanism.

[0216] The polishing apparatus of the present invention shown in FIG. 13(a) includes an optical image detection / photographing means 206a from the upper surface direction of the resin-sealed sample 105 and a light irradiator 201 that irradiates light from the side surface direction of the resin-sealed sample 105. However, the present invention is not limited thereto.

[0217] FIG. 13(b) shows a configuration in which the light 205a emitted from the light irradiator 201 is incident on the resin-sealed sample 105 from the upper surface of the resin-sealed sample 105, and the light 205d emitted from the side surface of the resin-sealed sample 105 is detected by the optical image detection / photographing means 206.

[0218] FIG. 14(a) is a state diagram in which water (washing water) 209 is sandwiched between the processed surface 602a of the resin-sealed sample 105 and the polishing table 107. The refractive index of the epoxy resin constituting the resin-sealed sample 105 is 1.55 to 1.65, and the refractive index of water (washing water) is 1.33. Therefore, there is a refractive index difference between the epoxy resin and the water (washing water) 209, and light is reflected at the processed surface 602a. The reflected light is emitted from the resin-sealed sample 105 as the reflected light 205c and enters the optical image detection / photographing means 206.

[0219] A solution in which washing water or a surfactant is mixed forms a film on the polished scratch portion, and the processed surface 602 is mirror-finished or the polished scratches become less noticeable. Therefore, at a stage where the abrasive grains are small, the processed surface 602 becomes closer to a mirror surface, and the image of the electrode terminal 101 reflected in the mirror surface can be observed.

[0220] As the polishing operation of the polished sample progresses, in the polishing stage using larger-numbered abrasive grains, the polishing scratches on the processed surface 602 become smaller and shallower. By forming a film such as a cleaning liquid on the processed surface 602a, the processed surface 602a is mirror-finished, and the contrast and sharpness of the reflected image 208 are improved. As the polishing operation of the polished sample progresses, in the final stage of the polishing process using larger-numbered abrasive grains, the polishing scratches on the processed surface 602 disappear.

[0221] After washing away the abrasive grains on the processed surface 602, by supplying cleaning water or the like between the polishing table 107 and the processed surface 602 and filling or interposing a cleaning liquid 209 or the like between the polishing table 107 and the processed surface 602, the polishing scratches on the processed surface 602 are reduced, and due to the refractive index difference between the cleaning liquid or the like and the polished sample 102, a light reflection surface is generated. Therefore, the processed surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be observed well. FIG. 14(b) shows a configuration in which an air layer (gap) is arranged between the resin-sealed sample 105 and the polishing table 107.

[0222] As the polishing operation of the polished sample progresses, in the polishing stage with high abrasive grains, the polishing scratches on the processed surface 602 disappear. In this case, by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction), an air layer (gap) can be arranged between the polished sample 102 (resin-sealed sample 105) and the polishing surface 505.

[0223] Since the refractive index of the air layer is 1.0 and the resin-sealed sample 105 is composed of an epoxy resin or the like, the refractive index is 1.55 - 1.65. Due to the refractive index difference between the air layer and the resin-sealed sample 105, a light reflection surface is generated on the processed surface 602a due to the refractive index difference with the polished sample 102.

[0224] Accordingly, the processed surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be observed well. Moisture or solution adhering to the processed surface 602a can be removed by centrifugal force by rotating the polishing head 106 at high speed. Alternatively, a thinner water film can be formed on the processed surface 602a.

[0225] FIG. 14(b) shows a configuration in which an air layer (gap) is disposed between the resin-sealed sample 105 and the polishing table 107. However, it is also preferable to form a film (coating film) 604 made of a cleaning solution or water on the processed surface 602a of the resin-sealed sample 105 so that the film (coating film) 604 is in contact with air.

[0226] The film (water film) penetrates into the polished scratch portion of the processed surface 602 and flattens the polished scratch portion. Accordingly, the processed surface 602 becomes mirror-finished. Further, the resin-sealed sample 105 has a refractive index of 1.5 to 1.65, and the film (water film) has a refractive index of 1.33 to 1.5. The refractive index of air is 1.0.

[0227] A solution or material having an affinity with the encapsulating resin constituting the resin-sealed sample 105 is used for the film (water film). It is preferable to use a solution or material having a refractive index lower than that of the encapsulating resin constituting the resin-sealed sample 105 for the film (water film). Needless to say, the film may be formed by applying petrolatum or the like.

[0228] It is preferable to use a material having a refractive index of 1.5 or more and 1.65 or less for the encapsulating resin constituting the resin-sealed sample 105. When the film (water film) is formed by coating, it is preferable to use a material having a refractive index of 1.45 to 1.55 or less.

[0229] The film 604 is not limited to the cleaning solution. A cleaning water mixed with a surfactant or a surfactant may be sprayed or applied to form the film 604 on the processed surface 602.

[0230] Also, it is preferable to use a material with good wettability. Wettability mainly represents the affinity (ease of adhesion) of a liquid to a solid surface. When the liquid is a solution, wettability is also expressed by terms such as hydrophilicity and hydrophobicity.

[0231] Also, a coating agent such as wax may be applied or formed on the processed surface 602. For example, a photocurable resin made of an acrylic resin is applied and cured by ultraviolet light.

[0232] The present invention is a method or configuration for improving the specular reflectance of the processed surface 602 by filling the polishing scratches on the processed surface 602 with a liquid or a solid and flattening the processed surface 602 or reducing the light scattering property.

[0233] As the polishing operation of the polished sample progresses, at the polishing stage with high abrasive grains, the polishing scratches on the processed surface 602 disappear. In this case, by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction), an air layer (gap) can be arranged between the polished sample 102 (resin-sealed sample 105) and the polishing surface 505.

[0234] Since the refractive index of the air layer is 1.0 and the resin-sealed sample 105 is composed of an epoxy resin or the like, the refractive index is 1.55 - 1.65. Due to the refractive index difference between the air layer and the resin-sealed sample 105, a light reflection surface is generated on the processed surface 602a due to the refractive index difference with the polished sample 102.

[0235] The above matters are the same for the processed surface 602b. By forming a film (water film) 604b on the processed surface 602b, the influence of the polishing scratches on the surface of the processed surface 602b is reduced, and the processed surface 602b is mirror-finished. By being mirror-finished, no light attenuation occurs during the incidence and exit of the light 205.

[0236] In FIG. 15, the light 205 emitted from the light irradiator 201 is separated into P-polarized light 205P and S-polarized light 205S at the polarization separation surface 501 of the polarizing beam splitters (PBS) 502.

[0237] The PBS 502 is a polarizer that extracts light with a specific vibration (P-polarized light, S-polarized light) from natural light (random polarization). It can be either a cube type or a plate type. The wavelength band is adapted to the wavelength of the light emitted by the light irradiator 201.

[0238] The lens 605 is a relay lens. The lens 605 is arranged to collect the light 205, illuminate the polishing sample 102, and allow the light from the polishing sample 102 to be incident well on the optical image detection / photographing means 206.

[0239] At the separation surface 501, the S-polarized light 205S of the light 205 is reflected, and the P-polarized light 205P is transmitted. The S-polarized light 205S is converted into circularly polarized light 205b by the λ / 4 plate 204. The circularly polarized light 205b is incident on the resin-sealed sample 105 and irradiates the polishing sample 102.

[0240] The circularly polarized light 205b reflected by the polishing sample 102 or the like becomes circularly polarized light 205c in the opposite direction to the circularly polarized light 205b and exits from the resin-sealed sample 105. The circularly polarized light 205c is converted into P-polarized light 205d by the λ / 4 plate 204. The P-polarized light 205d passes through the separation surface 501 and is incident on the optical image detection / photographing means 206.

[0241] In the embodiment of FIG. 15, the light 205b is incident from the side surface of the resin-sealed sample 105, and the light 205c exits from the same side surface. Also, the incident light 205b and the emitted light 205c pass through the same λ / 4 plate 204. Therefore, linearly polarized light -> circularly polarized light, and circularly polarized light -> linearly polarized light can be reversibly converted. Also, the optical paths of the light entering and exiting the resin-sealed sample 105 can be made to coincide.

[0242] When the aperture 504a is completely closed, the light 205 from the light irradiator 201 is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206.

[0243] By adjusting the aperture diameter of the aperture 504a, the directivity of the light incident on the optical image detection / photographing means 206 can be adjusted. When the aperture diameter of the aperture 504a is decreased, the directivity of the light becomes narrower. Therefore, it is equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased. When the aperture diameter of the aperture 504a is increased, the directivity of the light becomes wider. Therefore, it is equivalent to decreasing the F-number of the lens, and the brightness of the optical image can be increased. FIG. 15 shows a configuration in which the incident light 205b and the emitted light 205c are incident on or emitted from the side surface of the resin-sealed sample 105. The present invention is not limited to this.

[0244] As shown in FIG. 16, a configuration may be adopted in which the light 205c is incident from the side surface of the resin-sealed sample 105, the light 205d is emitted from the side surface of the resin-sealed sample 105, the light 205a is incident from the upper surface of the resin-sealed sample 105, and the light 205b is emitted from the upper surface of the resin-sealed sample 105.

[0245] The light 205a emitted from the light emitter 201a becomes linearly polarized by the polarizing plate 202a, is condensed by the relay lens 605a, and is reflected by the total reflection mirror 503. After being reflected by the total reflection mirror 503, the direction of the light is changed and it is incident from the upper surface of the resin-sealed sample 105.

[0246] The linearly polarized light is converted into circularly polarized light 205a by the λ / 4 plate 204a. The circularly polarized light 205a is incident on the resin-sealed sample 105. The light 205b reflected by the resin-sealed sample 105 becomes circularly polarized light 205b in the opposite direction to the circularly polarized light 205a and is emitted from the resin-sealed sample 105.

[0247] The circularly polarized light 205b is converted into linearly polarized light by the λ / 4 plate 204a, reflected by the total reflection mirror 503, condensed by the relay lens 605b, transmitted through the polarizing plate 202b, and incident on the optical image detection / photographing means 206a. The polarization axes of the polarizing plate 202a and the polarizing plate 202b are arranged to be orthogonal.

[0248] The light 205 emitted from the light emitter 201b becomes linearly polarized light by the polarizing plate 202c. The linearly polarized light is converted into circularly polarized light 205c by the λ / 4 plate 204a. The circularly polarized light 205c is incident from the side surface of the resin-sealed sample 105.

[0249] The light 205d reflected within the resin-sealed sample 105 becomes circularly polarized light 205 opposite to the circularly polarized light 205c and is emitted from the resin-sealed sample 105. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b, transmitted through the polarizing plate 202d, and incident on the optical image detection / photographing means 206b.

[0250] When the aperture stop 504a is completely closed, the light 205a from the light irradiator 201a is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206a.

[0251] When the aperture stop 504b is completely closed, the light 205c from the light irradiator 201b is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206b. By adjusting the aperture diameters of the aperture stop 504a and the aperture stop 504b, the directivities of the light from the light irradiator 201a and the light irradiator 201b can be adjusted.

[0252] When the aperture diameters of the aperture stop 504a and the aperture stop 504b are reduced, the directivity of the light becomes narrower. Therefore, it is equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased. When the aperture diameters of the aperture stop 504a and the aperture stop 504b are increased, the directivity of the light becomes wider. Therefore, it is equivalent to reducing the F-number of the lens, and the brightness of the optical image can be increased.

[0253] FIG. 17 is an explanatory view of a polishing apparatus of the present invention in another embodiment. As shown in FIG. 17, light 205d is made incident from the side surface of the resin-encapsulated sample 105, and light 205e is emitted from the side surface of the resin-encapsulated sample 105. Light 205b is made incident from the upper surface of the resin-encapsulated sample 105, and light 205c is emitted from the upper surface of the resin-encapsulated sample 105.

[0254] The light 205a emitted from the light emitter 201a is separated into P-polarized light and S-polarized light at the light separation surface 501 of the PBS 502. The S-polarized light 205b is reflected at the separation surface 501, and the linearly polarized light is converted into circularly polarized light by the λ / 4 plate 204a.

[0255] Note that for the light 205, S-polarized light 205S is reflected at the separation surface 501, and P-polarized light 205P is transmitted. Although the S-polarized light 205S is reflected by the total reflection mirror 503b, it is not limited thereto. A PBS 502 may be used in which P-polarized light 205P is reflected at the separation surface 501 and S-polarized light 205S is transmitted.

[0256] The circularly polarized light 205b is incident on the resin-encapsulated sample 105. The light 205c reflected by the resin-encapsulated sample 105 becomes circularly polarized light in the opposite direction to the circularly polarized light 205b and is emitted from the resin-encapsulated sample 105. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204a, passes through the separation surface 501, and is incident on the optical image detection / imaging means 206a.

[0257] The light 205 emitted from the light emitter 201b becomes linearly polarized light by the polarizing plate 202c. The linearly polarized light is converted into circularly polarized light by the λ / 4 plate 204b. The circularly polarized light is incident from the side surface of the resin-encapsulated sample 105.

[0258] The light 205e reflected inside the resin-encapsulated sample 105 becomes circularly polarized light in the opposite direction to the circularly polarized light 205d and is emitted from the resin-encapsulated sample 105. The circularly polarized light 205e is converted into linearly polarized light by the λ / 4 plate 204b, passes through the polarizing plate 202b, and is incident on the optical image detection / imaging means 206a.

[0259] When the aperture 504a is fully closed, the light 205a from the light irradiator 201a is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206a.

[0260] When the aperture 504b is fully closed, the light 205c from the light irradiator 201b is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206b.

[0261] FIG. 18 is an explanatory diagram and a configuration diagram of a polishing apparatus in another embodiment. The light 205 emitted from the light irradiator 201 is separated into P-polarized light 205P and S-polarized light 205S at the polarization separation surface 501 of the polarization beam splitter (PBS) 502.

[0262] The lenses 605 (lenses 605a, 605b) are relay lenses. The lens 605 condenses the light 205, illuminates the polishing sample 102, and is arranged so that the light from the polishing sample 102 can be favorably incident on the optical image detection / photographing means 206.

[0263] At the separation surface 501, the S-polarized light 205S is reflected and the P-polarized light 205P is transmitted. The S-polarized light 205S is reflected by the total reflection mirror 503b. The S-polarized light 205S is converted into circularly polarized light by the λ / 4 plate 204b. The circularly polarized light is incident from the processed surface 602b of the resin-sealed sample 105. Inside the sealed sample 105, the light reflected by the polishing sample 102, the processed surface 602a, etc. becomes counter-rotating circularly polarized light 205c of the incident circularly polarized light.

[0264] The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204a, reflected by the total reflection mirror 503a, and incident on the PBS 502. The light incident on the PBS 502 is incident on the optical image detection / photographing means 206 at the light separation surface 501. The light that the circularly polarized light 205c is not converted into linearly polarized light by the λ / 4 plate 204a passes through the light separation surface 501 of the PBS 502.

[0265] When causing the light 205c to enter the optical image detection / shooting means 206, the aperture 504a is opened and the aperture 504b is closed. When causing the light 205d to enter the optical image detection / shooting means 206, the aperture 504b is opened and the aperture 504a is closed.

[0266] When the aperture 504a is completely closed, the light 205c that is mainly reflected by the processed surface 602a is blocked. When the aperture 504b is opened, the light reflected by the polished sample 102 can be made to enter the optical image detection / shooting means 206.

[0267] When the aperture 504b is completely closed, the light 205d that is mainly reflected by the polished sample 102 is blocked. When the aperture 504a is opened, the light mainly reflected by the processed surface 602a can be made to enter the optical image detection / shooting means 206.

[0268] In the embodiment of FIG. 18, the light 205S is made to enter from the side surface of the resin-sealed sample 105, and the light 205d exits from the same side surface. Therefore, linear polarization -> circular polarization and circular polarization -> linear polarization can be reversibly converted. Also, the optical path of the light entering and exiting the resin-sealed sample 105 can be made to coincide with the optical axis.

[0269] Also, the light 205P is made to enter from the upper surface of the resin-sealed sample 105, and the light 205c exits from the same upper surface. Therefore, linear polarization -> circular polarization and circular polarization -> linear polarization can be reversibly converted. Also, the optical path of the light entering and exiting the resin-sealed sample 105 can be made to coincide with the optical axis. When both the aperture 504a and the aperture 504b are completely closed, the dark level can be measured by measuring the amount of light entering the optical image detection / shooting means 206.

[0270] Also, by adjusting the aperture diameters of the aperture 504a and the aperture 504b, the directivity of the light entering the optical image detection / shooting means 206 can be adjusted. When the aperture diameter of the aperture 504 is reduced, the directivity of the light becomes narrower. Therefore, it is equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased.

[0271] Increasing the aperture diameter of the aperture 504 broadens the directivity of light. Therefore, it is equivalent to reducing the F-number of the lens, and the brightness of the optical image can be increased.

[0272] FIG. 16, FIG. 17, and FIG. 18 illustrate the incidence of light on the resin-sealed sample 105 from two directions, namely, the upper surface and the side surface of the resin-sealed sample 105. However, the present invention is not limited thereto. It goes without saying that light may be incident on the resin-sealed sample 105 from one direction, either the upper surface or the side surface of the resin-sealed sample 105, and the light emitted from the resin-sealed sample 105 may be detected or observed by the optical image detection / imaging means 206.

[0273] In the present invention, during the polishing process, the polished surface of the polished sample 105 with the member resin-sealed is cleaned. Through cleaning, the polished surface is cleaned, the cleaning liquid 604a coats the polishing scratches, and the polished surface 602a is mirror-finished.

[0274] The refractive index of the sealing resin of the resin-sealed polished sample 105 is as high as 1.55 to 1.65. Also, due to the large refractive index difference from the air coated with the cleaning liquid, the reflectance of the illumination light in the resin-sealed polished sample 105 becomes high. The optical image of the member is projected onto the polished surface 602a, and by simultaneously observing the real image 101 of the member and the optical image (reflection image, mirror image) 208 of the polished surface, the polished sample can be processed with high precision.

[0275] The light irradiated from the light irradiator 201 is polarized by the polarizing plate 202a, and the polarized light is converted into circularly polarized light 205a by the λ / 4 plate 204a to illuminate the polished sample 102. The light 205d emitted from the resin-sealed polished sample 105 is converted into polarized light by the λ / 4 plate 204b, and the light transmitted through the polarizing plate 202b is observed by an imaging camera (imaging camera, monitor screen, display monitor) 206 or the like. By making the illumination light polarized and circularly polarized by the λ / 4 plate, stray light in the resin-sealed sample 105 is reduced, and the polished surface can be observed favorably.

[0276] The embodiments disclosed this time are illustrative in all respects and not restrictive. The scope of the present invention is shown not by the above meaning but by the scope of claims, and it is intended that all modifications within the meaning and scope equivalent to the scope of claims are included. Needless to say, the matters or contents described in this specification and the drawings can be combined with each other.

Explanation of Signs

[0277] 101 Electrode terminal (cross-section location) 102 Object to be polished (polishing sample) 103 Polishing sample sealing pipe 104 Pusher 105 Resin-sealed sample 106 Polishing head 107 Polishing table 108 Table axis 109 Container 200 Optical coupling liquid (such as water) 201 Light irradiator 202 Polarizing plate (polarizing film) 204 λ / 4 plate (phase plate, wavelength plate, phase film) 205 Light (optical path) 206 Optical image detection / photographing means (optical detection means, camera, light receiving member, photographing device, light receiving element, display device, monitor, vision) 207 Cleaning liquid supply nozzle 208 Reflected image (mirror image, optical image) 209 Cleaning liquid 210 λ / 2 plate (phase plate, wavelength plate, phase film) 211 Wavelength axis (optical axis) 301 Polishing head shaft 302 Angle adjustment part (rotation part) 307 Polishing liquid supply nozzle 308 Captured image 501 Separation surface 502 Polarizing beam splitter (Polarizing Beam Splitters (PBS)) 503 Mirror 504 Aperture (light shielding tool) 505 Grinding surface 506 Grinding pad 507 Marking line (positioning marker) 508 Pad support surface 509 Grinding motor 601 Sample holding block 602 Processing surface (grinding surface, cutting surface) 603 Moving (rotating) stage 604 Coating (solution film, etc.) 605 Lens (relay lens, condenser lens) 606 Light absorption film

Claims

1. A polishing apparatus for processing a workpiece having an upper surface, a bottom surface, and a cylindrical side surface, with the abrasive material encapsulated in a resin having light transmissibility, comprising: a polishing processor for polishing the bottom surface; a light generator that generates illumination light that is incident from the cylindrical side surface and illuminates the abrasive material; observation means for forming a liquid film on the bottom surface and simultaneously observing, from the cylindrical side surface, a reflected image of the abrasive material on the bottom surface and a real image of the abrasive material. The polishing apparatus is characterized by this.

2. A polishing apparatus for processing a workpiece having an upper surface, a bottom surface, and a cylindrical side surface, with the abrasive material encapsulated in a resin having light transmissibility, comprising: a polishing processor for polishing the bottom surface; a light generator that generates illumination light that is incident from the cylindrical side surface and illuminates the abrasive material; observation means for forming a liquid film on the bottom surface and observing, from the cylindrical side surface, the reflected light reflected from the bottom surface, and characterized in that at least one of the illumination light or the reflected light is polarized light. The polishing apparatus is characterized by this.

3. A polishing apparatus for processing a workpiece having an upper surface, a bottom surface, and a cylindrical side surface, with the abrasive material encapsulated in a resin having light transmissibility, comprising: a presser for pressing the workpiece formed in the pipe and taking it out from the pipe; a polishing processor for polishing the bottom surface after polishing the end portion of the upper surface; a light generator that generates illumination light that is incident from the cylindrical side surface and illuminates the abrasive material; observation means for forming a liquid film on the bottom surface and simultaneously observing, from the cylindrical side surface, the reflected light reflected from the bottom surface and the reflected light reflected from the abrasive material, and characterized in that at least one of the illumination light or the reflected light is polarized light. The polishing apparatus is characterized by this.

4. A polishing apparatus for processing a workpiece having an upper surface, a bottom surface, and a cylindrical side surface, with the abrasive material encapsulated in a resin having light transmissibility, comprising: a polishing processor for polishing the bottom surface; a light generator that generates illumination light that is incident from the upper surface and illuminates the abrasive material; observation means for forming a liquid film on the bottom surface and observing, from the cylindrical side surface, the reflected light reflected from the bottom surface, and characterized in that at least one of the illumination light or the reflected light is polarized light. The polishing apparatus is characterized by this.

5. A polarizing plate capable of rotating the polarization direction is disposed in at least one of the optical paths of the illumination light and the optical path of the reflected light, A quarter-wave plate is disposed in at least one of the optical paths of the illumination light and the optical path of the reflected light. The polishing apparatus according to claim 2 or claim 3 or claim 4 is characterized by this.

6. The upper surface of the workpiece is cut, the illumination light is made to enter from a cut surface formed by cutting the upper surface, the resin is an epoxy resin having a refractive index of 1.55 or more and 1.7 or less, The polishing apparatus according to claim 1, claim 2, claim 3, or claim 4, wherein the refractive index of the liquid film is lower than the refractive index of the resin.

7. A polishing method for processing a workpiece having an upper surface, a bottom surface, and a cylindrical side surface, in which the abrasive is sealed with a resin having light transmissivity, the abrasive is illuminated with illumination light, a liquid film is formed on the bottom surface, and the reflected image of the abrasive on the bottom surface and the real image of the abrasive are simultaneously observed from the cylindrical side surface, the bottom surface of the workpiece is polished, A polishing method characterized in that the lengths of the reflected image and the real image are made to be a predetermined length.

8. A polishing method for processing a workpiece having an upper surface, a bottom surface, and a cylindrical side surface, in which the abrasive is sealed with a resin having light transmissivity, the abrasive has a first part and a second part, the abrasive is illuminated with illumination light, a liquid film is formed on the bottom surface, and the reflected image of the abrasive on the bottom surface and the real image of the abrasive are simultaneously observed from the cylindrical side surface, the bottom surface of the workpiece is polished, A polishing method characterized in that a first length between the reflected image of the first part and the real image of the first part and a second length between the reflected image of the second part and the real image of the second part are made to be substantially the same length.

9. A polishing method for processing a workpiece having an upper surface, a bottom surface, and a cylindrical side surface, in which the abrasive is sealed with a resin having light transmissivity, the abrasive is illuminated with illumination light, the workpiece is rotated, a liquid film is formed on the bottom surface, A polishing method characterized by observing the reflected image of the abrasive on the bottom surface and the real image of the abrasive simultaneously from the cylindrical side surface in synchronization with the rotational position of the workpiece.

10. The illumination light is polarized light, configured to be able to rotate the polarization direction of the polarized light, The polishing method according to claim 7, claim 8, or claim 9, characterized in that a quarter-wave plate is arranged in the optical path of the illumination light.

Images