Terminal joining method for electronic component and terminal joining structure for electronic component

Abstract

To provide a terminal joining method for an electronic component and a terminal joining structure for an electronic component that can suppress an increase in a working time in the process of welding terminals together using an energy beam.SOLUTION: A terminal joining method for an electronic component includes a step of arranging a tip portion of a first terminal portion 221a and a tip portion of a second terminal portion 21a so as to face each other, and a step of irradiating a volume-enlarged portion 213a of a second electronic component 21 with an energy beam La to melt the material and fill the gap Ma1, thereby welding the tip portion of the first terminal portion 221a and the tip portion of the second terminal portion 21a together.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a method for joining terminals of electronic components and a terminal joining structure of electronic components.

Background Art

[0002] Conventionally, a method for joining terminals of electronic components in which terminals are joined together by an energy beam such as a laser has been known (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a method for connecting electronic components (a method for joining terminals of electronic components) in which a plate-shaped terminal (terminal portion) is arranged so as to face a conductor (terminal portion) for connecting electronic components and welded by a laser (energy beam).

[0004] In the laser connection method of Patent Document 1, solder is welded to the tip portion on one side of the conductor. This solder is a filling metal material for filling (closing) a gap caused by scattering (sputtering) of the molten metal material generated during laser welding. In the laser connection method, the tip portion of the conductor to which the solder is welded is overlapped on the tip portion of the plate-shaped terminal. Then, the laser is irradiated toward the solder, and the solder, the tip portion of the conductor, and the tip portion of the plate-shaped terminal portion are melted and solidified, whereby the conductor and the plate-shaped terminal portion are connected.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the laser connection method of Patent Document 1 described above, in the process of welding the solder, which is a metal material for filling during laser welding, to the tip portion of one side of the conductor, a separate process of welding is required before the process of welding with the laser. Here, since there are often a plurality of locations to be connected by laser, the separate process of welding the solder to the tip portion of one side of the conductor is also performed at each of the plurality of locations before the process of welding with the laser. For this reason, in the laser connection method of Patent Document 1, there is a problem that the working time of the process of welding the conductor and the plate-shaped terminal (and the terminals to each other) with the laser (energy beam) increases.

[0007] The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a method for joining terminals of an electronic component and a structure for joining terminals of an electronic component capable of suppressing an increase in the working time of the process of welding terminals to each other with an energy beam.

Means for Solving the Problems

[0008] In order to achieve the above object, a method for joining terminals of an electronic component according to a first aspect of the present invention is a method for joining terminals of an electronic component in which a second terminal portion of a second electronic component is arranged to face a first terminal portion of a first electronic component and welded, the method including: arranging, so as to face each other, a tip portion of the first terminal portion and a tip portion of the second terminal portion provided with a volume increasing portion having a volume larger than the volume of a gap between the tip portion of the first terminal portion facing each other and the tip portion of the second terminal portion; and filling the gap with a material melted by irradiating the volume increasing portion of the second electronic component with an energy beam, thereby welding the tip portions of the first terminal portion and the second terminal portion to each other.

[0009] In the method for joining terminals of an electronic component according to the first aspect of the present invention, as described above, a step of welding the tip portions of the first terminal portion and the second terminal portion to each other is provided by filling a gap with a material melted by irradiating an energy beam onto the volume-increased portion of the second electronic component. As a result, since a volume-increased portion is provided at the tip portion of the second terminal portion of the second electronic component, it is not necessary to weld a material for filling (embedding) the gap between the tip portion of the first terminal portion and the tip portion of the second terminal portion to the tip portion of the second terminal portion of the second electronic component in a separate process. Therefore, an increase in the number of steps for welding the tip portion of the first terminal portion and the tip portion of the second terminal portion by an energy beam can be suppressed. As a result, an increase in the working time of the step of welding the terminal portions to each other by an energy beam can be suppressed.

Effects of the Invention

[0010] According to the present invention, as described above, an increase in the working time of the step of welding the terminal portions to each other by an energy beam can be suppressed.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

[0013] With reference to FIGS. 1 to 17, the configuration of the terminal bonding structure of the electronic component according to the embodiment will be described.

[0014] The terminal bonding structure of the electronic component is applied to the power conversion device 100 shown in FIG. 1. The power conversion device 100 is a vehicle device mounted on an electric vehicle having a drive motor. The power conversion device 100 is a device that converts DC power supplied from a main battery into three-phase AC power supplied to the drive motor.

[0015] The power conversion device 100 includes a DC-DC converter section 1 and an inverter section 2. The DC-DC converter section 1 is configured to step down the voltage of the DC power supplied from the main battery.

[0016] The inverter section 2 is configured to convert the DC power supplied from the DC-DC converter section 1 into AC power. Specifically, the inverter section 2 includes a capacitor 21, a first switching element group 22, a second switching element group 23, a third switching element group 24, and a current sensor 25. Each of the capacitor 21 and the current sensor 25 is an example of the "second electronic component" in the claims.

[0017] The capacitor 21 is an electronic component such as a ceramic capacitor, a film capacitor, and an electrolytic capacitor. The capacitor 21 is a component that smoothes the voltage supplied from the DC-DC converter section 1.

[0018] The first switching element group 22 is configured to convert the smoothed DC power into U-phase AC power. The first switching element group 22 has a switching element 22a and a switching element 22b. Each of the switching element 22a and the switching element 22b is an electronic component such as a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor). Each of the switching element 22a and the switching element 22b is an example of the "first electronic component" in the claims.

[0019] The second switching element group 23 is configured to convert the smoothed DC power into AC power of the V phase. The second switching element group 23 includes a switching element 23a and a switching element 23b. Each of the switching element 23a and the switching element 23b is an electronic component such as a power MOSFET or an IGBT. Also, the third switching element group 24 is configured to convert the smoothed DC power into AC power of the W phase. The third switching element group 24 includes a switching element 24a and a switching element 24b. Each of the switching element 24a and the switching element 24b is an electronic component such as a power MOSFET or an IGBT. Note that each of the switching element 23a, the switching element 24a, the switching element 23b, and the switching element 24b is an example of the "first electronic component" in the claims.

[0020] The current sensor 25 is an electronic component for measuring the current value of the AC power of the U phase converted in the first switching element group 22. The current sensor 25 is an electronic component for measuring the current value of the AC power of the V phase converted in the second switching element group 23. The current sensor 25 is an electronic component for measuring the current value of the AC power of the W phase converted in the third switching element group 24.

[0021] The AC power of the U phase, the AC power of the V phase, and the AC power of the W phase output from the current sensor 25 are supplied to the drive motor.

[0022] (Terminal bonding structure of electronic components) As shown in FIG. 2, the capacitor 21, the first switching element group 22, the second switching element group 23, the third switching element group 24, and the current sensor 25 are electrically connected to each other. Such a terminal bonding structure of electronic components includes the capacitor 21, the first switching element group 22, the second switching element group 23, the third switching element group 24, the current sensor 25, the welding part 26, the welding part 27, and the mounting body 28. Each of the capacitor 21, the first switching element group 22, the second switching element group 23, the third switching element group 24, and the current sensor 25 is attached to the mounting body 28.

[0023] Here, the direction in which the capacitor 21 and the current sensor 25 are arranged is defined as the X direction, the side of the capacitor 21 in the X direction is defined as the X1 direction, and the side of the current sensor 25 in the X direction is defined as the X2 direction. Also, the direction in which the mounting body 28 and the capacitor 21 are arranged is defined as the Z direction, the side of the capacitor 21 in the Z direction is defined as the Z1 direction, and the side of the mounting body in the Z direction is defined as the Z2 direction. The direction orthogonal to the X direction and the Z direction is defined as the Y direction, one side in the Y direction is defined as the Y1 direction, and the other side in the Y direction is defined as the Y2 direction.

[0024] 〈Capacitor〉 The capacitor 21 has a first terminal group having an input terminal portion 21a, a ground terminal portion 21b, and an output terminal portion 21c. This first terminal group is electrically connected to the switching element 22a of the first switching element group 22. The capacitor 21 has a second terminal group having an input terminal portion 21d, a ground terminal portion 21e, and an output terminal portion 21f. This second terminal group is electrically connected to the switching element 23a of the second switching element group 23. The capacitor 21 has a third terminal group having an input terminal portion 21g, a ground terminal portion 21h, and an output terminal portion 21i. This third terminal group is electrically connected to the switching element 24a of the third switching element group 24.

[0025] Each of the input terminal portion 21a, the ground terminal portion 21b, the output terminal portion 21c, the input terminal portion 21d, the ground terminal portion 21e, the output terminal portion 21f, the input terminal portion 21g, the ground terminal portion 21h, and the output terminal portion 21i is a copper terminal.

[0026] Further, the capacitor 21 has a capacitor main body portion 21j to which each of the first terminal group, the second terminal group, and the third terminal group is connected.

[0027] Note that each of the input terminal portion 21a, the ground terminal portion 21b, the output terminal portion 21c, the input terminal portion 21d, the ground terminal portion 21e, the output terminal portion 21f, the input terminal portion 21g, the ground terminal portion 21h, and the output terminal portion 21i is an example of the "second terminal portion" in the claims. Further, the capacitor main body portion 21j is an example of the "component main body portion" in the claims.

[0028] 〈First switching element group〉 The switching element 22a has an output terminal portion 221a, a ground terminal portion 222a, an input terminal portion 223a, and an element main body portion 224a. The output terminal portion 221a is electrically connected to the input terminal portion 21a. The ground terminal portion 222a is electrically connected to the ground terminal portion 21b. The input terminal portion 223a is electrically connected to the output terminal portion 21c. Each of the output terminal portion 221a, the ground terminal portion 222a, and the input terminal portion 223a is a copper terminal. The element main body portion 224a has each of the output terminal portion 221a, the ground terminal portion 222a, and the input terminal portion 223a connected thereto. Note that each of the output terminal portion 221a, the ground terminal portion 222a, and the input terminal portion 223a is an example of the "first terminal portion" in the claims.

[0029] The switching element 22b has an output terminal portion 221b, an input terminal portion 222b, and an element main body portion 223b. The output terminal portion 221b is electrically connected to the current sensor 25. The input terminal portion 222b is electrically connected to the current sensor 25. Each of the output terminal portion 221b and the input terminal portion 222b is a copper terminal. The element main body portion 223b has the output terminal portion 221b and the input terminal portion 222b connected thereto. Note that each of the output terminal portion 221b and the input terminal portion 222b is an example of the "first terminal portion" in the claims.

[0030] 〈Second Switching Element Group〉 The switching element 23a has an output terminal portion 231a, a ground terminal portion 232a, an input terminal portion 233a, and an element main body portion 234a. The output terminal portion 231a is electrically connected to the input terminal portion 21d. The ground terminal portion 232a is electrically connected to the ground terminal portion 21e. The input terminal portion 233a is electrically connected to the output terminal portion 21f. Each of the output terminal portion 231a, the ground terminal portion 232a, and the input terminal portion 233a is a copper terminal. The element main body portion 234a has the output terminal portion 231a, the ground terminal portion 232a, and the input terminal portion 233a connected thereto. Note that each of the output terminal portion 231a, the ground terminal portion 232a, and the input terminal portion 233a is an example of the "first terminal portion" in the claims.

[0031] The switching element 23b has an output terminal portion 231b, an input terminal portion 232b, and an element main body portion 233b. The output terminal portion 231b is electrically connected to the current sensor 25. The input terminal portion 232b is electrically connected to the current sensor 25. Each of the output terminal portion 231b and the input terminal portion 232b is a copper terminal. The element main body portion 233b has the output terminal portion 231b and the input terminal portion 232b connected thereto. Note that each of the output terminal portion 231b and the input terminal portion 232b is an example of the "first terminal portion" in the claims.

[0032] 〈Third Switching Element Group〉 The switching element 24a has an output terminal portion 241a, a ground terminal portion 242a, an input terminal portion 243a, and an element main body portion 244a. The output terminal portion 241a is electrically connected to the input terminal portion 21g. The ground terminal portion 242a is electrically connected to the ground terminal portion 21h. The input terminal portion 243a is electrically connected to the output terminal portion 21i. Each of the output terminal portion 241a, the ground terminal portion 242a, and the input terminal portion 243a is a copper terminal. The element main body portion 244a is where each of the output terminal portion 241a, the ground terminal portion 242a, and the input terminal portion 243a is connected. Note that each of the output terminal portion 241a, the ground terminal portion 242a, and the input terminal portion 243a is an example of the "first terminal portion" in the claims.

[0033] The switching element 24b has an output terminal portion 241b, an input terminal portion 242b, and an element main body portion 243b. The output terminal portion 241b is electrically connected to the current sensor 25. The input terminal portion 242b is electrically connected to the current sensor 25. Each of the output terminal portion 241b and the input terminal portion 242b is a copper terminal. The element main body portion 243b is where each of the output terminal portion 241b and the input terminal portion 242b is connected. Note that each of the output terminal portion 241b and the input terminal portion 242b is an example of the "first terminal portion" in the claims.

[0034] 〈Current Sensor〉 The current sensor 25 has a first terminal group having an input terminal portion 25a and an output terminal portion 25b. This first terminal group is electrically connected to the switching element 22b of the first switching element group 22. The input terminal portion 25a is connected to the output terminal portion 221b. The output terminal portion 25b is connected to the input terminal portion 222b.

[0035] The current sensor 25 has a second terminal group having an input terminal portion 25c and an output terminal portion 25d. This second terminal group is electrically connected to the switching element 23b of the second switching element group 23. The input terminal portion 25c is connected to the output terminal portion 231b. The output terminal portion 25d is connected to the input terminal portion 232b.

[0036] The current sensor 25 has a third terminal group having an input terminal portion 25e and an output terminal portion 25f. This third terminal group is electrically connected to the switching element 24b of the third switching element group 24. The input terminal portion 25e is connected to the output terminal portion 241b. The output terminal portion 25f is connected to the input terminal portion 242b.

[0037] Each of the input terminal portion 25a, the output terminal portion 25b, the input terminal portion 25c, the output terminal portion 25d, the input terminal portion 25e, and the output terminal portion 25f is a copper terminal.

[0038] Further, the current sensor 25 has a current sensor main body portion 25g to which each of the first terminal group, the second terminal group, and the third terminal group is connected.

[0039] Note that each of the input terminal portion 25a, the output terminal portion 25b, the input terminal portion 25c, the output terminal portion 25d, the input terminal portion 25e, and the output terminal portion 25f is an example of the "second terminal portion" in the claims. Also, the current sensor main body portion 25g is an example of the "component main body portion" in the claims.

[0040] (Welding portion) As shown in FIGS. 2 to 4, the welding portion 26 and the welding portion 27 are formed in a substantially spherical shape having a relatively large volume. Here, in the comparative example shown in FIG. 3, when the tip portion of the terminal portion CT1 of the electronic component CE1 and the tip portion of the terminal portion CT2 of the electronic component CE2 are welded, the welding portion CWe is formed in a tapered shape. Each of the terminal portion CT1 and the terminal portion CT2 has a uniform thickness. Also, the welding portion CWe is provided from the end portion on the Z1 direction side of the terminal portion CT1 to the end portion on the Z2 direction side of the terminal portion CT2.

[0041] As shown in FIGS. 4 and 5, the welded portions 26 and 27 of the present embodiment are each formed to have a larger volume than the volume of the welded portion CWe formed by bringing into contact and welding the flat terminal portions CT1 and CT2 having a uniform thickness as in the above-described comparative example. Here, since the structures of the welded portions 26 and 27 provided at the plurality of terminal portions of the terminal joining structure of the electronic component are the same, in FIG. 4, only the welded portion 26 at the joining portion between the input terminal portion 21a and the output terminal portion 221a will be described, and in FIG. 5, only the welded portion 27 at the joining portion between the output terminal portion 221b and the input terminal portion 25a will be described.

[0042] As shown in FIG. 4, the welded portion 26 is provided across the input terminal portion 21a and the output terminal portion 221a. The welded portion 26 has a first molten and solidified portion 261 and a second molten and solidified portion 262. The first molten and solidified portion 261 protrudes from the end face on the Z2 direction side of the output terminal portion 221a in the Z2 direction (opposite to the input terminal portion 21a side). The first molten and solidified portion 261 has a semi-circular shape in a cross section along the Z direction. The second molten and solidified portion 262 protrudes from the end face on the Z1 direction side of the input terminal portion 21a in the Z1 direction (opposite to the output terminal portion 221a side). The second molten and solidified portion 262 has a semi-circular shape in a cross section along the Z direction. The protruding amount of the first molten and solidified portion 261 is smaller than the protruding amount of the second molten and solidified portion 262. Also, the volume of the second molten and solidified portion 262 is larger than the volume of the first molten and solidified portion 261.

[0043] Further, in the output terminal portion 221a, a tapered through hole 2211a penetrating along the Z2 direction is formed in a cross section along the Z direction. The first molten and solidified portion 261 is molten and solidified in a shape that engages with the edge of the through hole 2211a in a cross section along the Z direction.

[0044] As shown in FIG. 5, the welding portion 27 is provided across the output terminal portion 221b and the input terminal portion 25a. The welding portion 27 has a third molten and solidified portion 271 and a fourth molten and solidified portion 272. The third molten and solidified portion 271 protrudes from the end surface on the Z2-direction side of the output terminal portion 221b toward the Z2 direction (opposite to the input terminal portion 25a side). The third molten and solidified portion 271 has a semi-circular shape in a cross-section along the Z direction. The fourth molten and solidified portion 272 protrudes from the end surface on the Z1-direction side of the input terminal portion 25a toward the Z1 direction (opposite to the output terminal portion 221a side). The fourth molten and solidified portion 272 has a semi-circular shape in a cross-section along the Z direction. The protruding amount of the third molten and solidified portion 271 is smaller than the protruding amount of the fourth molten and solidified portion 272. Also, the volume of the fourth molten and solidified portion 272 is larger than the volume of the third molten and solidified portion 271.

[0045] Further, in the output terminal portion 221a, a tapered through-hole 2211b penetrating along the Z2 direction is formed in a cross-section along the Z direction. The third molten and solidified portion 271 is molten and solidified in a shape engaging with the edge of the through-hole 2211b in a cross-section along the Z direction.

[0046] The material of each of the welding portion 26 and the welding portion 27 having the above-described structure is copper. That is, since the welding portion 26 is formed by melting the copper-made input terminal portion 21a and the copper-made output terminal portion 221a, it is formed of copper. The welding portion 27 is formed by melting the copper-made output terminal portion 221b and the copper-made output terminal portion 25b, so it is formed of copper.

[0047] (Terminal joining method of electronic component) With reference to FIGS. 6 to 17, a terminal joining method of an electronic component for realizing the above-described terminal joining structure of the electronic component will be described.

[0048] 〈Mounting step〉 As shown in FIG. 6, in step S1, an operator attaches the first switching element group 22, the second switching element group 23, and the third switching element group 24 to the attachment body 28 (see FIG. 7). In step S2, the operator attaches the capacitor 21 and the current sensor 25 to the attachment body 28 (see FIG. 7). Note that step S2 is an example of the step of “arranging so as to face each other” in the claims.

[0049] As shown in FIG. 7, in step S2, the input terminal portion 21a, the ground terminal portion 21b, and the output terminal portion 21c of the capacitor 21 are arranged so as to face the output terminal portion 221a, the ground terminal portion 222a, and the input terminal portion 223a of the switching element 22a in the Z1 direction, respectively. The input terminal portion 21d, the ground terminal portion 21e, and the output terminal portion 21f of the capacitor 21 are arranged so as to face the output terminal portion 231a, the ground terminal portion 232a, and the input terminal portion 233a of the switching element 23a in the Z1 direction, respectively. The input terminal portion 21g, the ground terminal portion 21h, and the output terminal portion 21i of the capacitor 21 are arranged so as to face the output terminal portion 241a, the ground terminal portion 242a, and the input terminal portion 243a of the switching element 24a in the Z1 direction, respectively.

[0050] Also, as shown in FIG. 7, in step S2, the input terminal portion 25a and the output terminal portion 25b of the current sensor 25 are arranged so as to face the output terminal portion 221b and the input terminal portion 222b of the switching element 22b in the Z1 direction, respectively. The input terminal portion 25c and the output terminal portion 25d of the current sensor 25 are arranged so as to face the output terminal portion 231b and the input terminal portion 232b of the switching element 23b in the Z1 direction, respectively. The input terminal portion 25e and the output terminal portion 25f of the current sensor 25 are arranged so as to face the output terminal portion 241b and the input terminal portion 242b of the switching element 24b in the Z1 direction, respectively.

[0051] <Gap on the capacitor side> Here, since the structures of the input terminal portion 21a, ground terminal portion 21b, output terminal portion 21c, input terminal portion 21d, ground terminal portion 21e, output terminal portion 21f, input terminal portion 21g, and ground terminal portion 21h of the capacitor 21 are the same, FIGS. 8 to 10 will be referred to for the description of only the structure of the input terminal portion 21a, which is the Zm1 portion in FIG. 7.

[0052] As shown in FIG. 8, the input terminal portion 21a has a base end portion 211a, a first linear portion 212a, a second linear portion 213a, and a protruding tip surface 214a. Note that the second linear portion 213a is an example of the "volume increasing portion" in the claims. Also, the protruding tip surface 214a is an example of the "tip surface of the volume increasing portion" in the claims.

[0053] The input terminal portion 21a has an L shape by the base end portion 211a, the first linear portion 212a, and the second linear portion 213a. The base end portion 211a is a portion connected to the capacitor main body portion 21j. The second linear portion 213a extends in the X2 direction from the base end portion 211a toward the tip end portion. The second linear portion 213a protrudes and extends in the Z1 direction from the tip surface (the portion on the X2 direction side of the surface on the Z1 direction side) of the first linear portion 212a. The second linear portion 213a is formed by bending the tip end portion on the side opposite to the base end portion 211a in the Z1 direction by press forming. The protruding tip surface 214a is the end surface on the Z1 direction side of the second linear portion 213a.

[0054] The widths of each of the first linear portion 212a and the second linear portion 213a are the same width W1 (see FIG. 10). The thicknesses of each of the first linear portion 212a and the second linear portion 213a are the same thickness Th1 (see FIG. 9). Thus, each of the first linear portion 212a and the second linear portion 213a has a constant width and a constant thickness. The protruding length Pr1 (see FIG. 9) of the second linear portion 213a is larger than the thickness Th1 of the first linear portion 212a.

[0055] As shown in FIG. 8, a gap Ma1 is formed between the tip portion of the first linear portion 212a and the tip portion of the output terminal portion 221a of the switching element 22a. As shown in FIG. 9, the gap Ma1 is provided at a portion where the tip portion of the first linear portion 212a and the tip portion of the output terminal portion 221a of the switching element 22a overlap in the Z direction. The length of the gap Ma1 in the X direction is the length L1. The height of the gap Ma1 in the Z direction is the height H1. As shown in FIG. 10, the width of the gap Ma1 in the Y direction is the width W1.

[0056] Here, the protruding length Pr1 of the second linear portion 213a is set such that the volume of the second linear portion 213a calculated by multiplying the thickness Th1, the protruding length Pr1, and the width W1 in the second linear portion 213a is equal to or greater than the volume of the gap Ma1 calculated by multiplying the length L1, the height H1, and the width W1. In this way, a second linear portion 213a is provided at the tip portion of the input terminal portion 21a as a volume increasing portion having a volume larger than the volume of the gap Ma1.

[0057] 〈Gap on the current sensor side〉 Also, since the structures of the input terminal portion 25a, the output terminal portion 25b, the input terminal portion 25c, the output terminal portion 25d, the input terminal portion 25e, and the output terminal portion 25f of the current sensor 25 are the same, only the structure of the input terminal portion 25a, which is the Zm2 portion in FIG. 7, will be described with reference to FIGS. 11 to 13.

[0058] As shown in FIG. 11, the input terminal portion 25a has a base end portion 251a, a first linear portion 252a, a second linear portion 253a, and a protruding tip surface 254a. Note that the second linear portion 253a is an example of the "volume increasing portion" in the claims. Also, the protruding tip surface 254a is an example of the "tip surface of the volume increasing portion" in the claims.

[0059] The input terminal portion 25a has an L-shape formed by a base end portion 251a, a first linear portion 252a, and a second linear portion 253a. The base end portion 251a is the portion connected to the current sensor main body portion 25g. The second linear portion 253a extends in the X1 direction from the base end portion 251a toward the tip end portion. The second linear portion 253a protrudes and extends in the Z1 direction from the tip end surface (the portion on the X1 direction side of the surface on the Z1 direction side) of the first linear portion 252a. The second linear portion 253a is formed by bending the tip end portion on the side opposite to the base end portion 251a in the Z1 direction by press forming. The protruding tip end surface 254a is the end surface on the Z1 direction side of the second linear portion 253a.

[0060] The width of each of the first linear portion 252a and the second linear portion 253a is the same width W2 (see FIG. 13). The thickness of each of the first linear portion 252a and the second linear portion 253a is the same thickness Th2 (see FIG. 12). Thus, each of the first linear portion 252a and the second linear portion 253a has a constant width and a constant thickness. The protruding length Pr2 (see FIG. 12) of the second linear portion 253a is larger than the thickness Th2 of the first linear portion 252a.

[0061] As shown in FIG. 11, a gap Ma2 is formed between the tip end portion of the first linear portion 252a and the tip end portion of the output terminal portion 225a of the switching element 22a. As shown in FIG. 12, the gap Ma2 is provided in a portion where the tip end portion of the first linear portion 252a and the tip end portion of the output terminal portion 225a of the switching element 22a overlap in the Z direction. The length in the X direction of the gap Ma2 is the length L2. The height in the Z direction of the gap Ma2 is the height H2. As shown in FIG. 13, the width in the Y direction of the gap Ma2 is the width W2.

[0062] Here, the protruding length Pr2 of the second linear portion 253a is set such that the volume of the second linear portion 253a calculated by multiplying the thickness Th2, the protruding length Pr2, and the width W2 in the second linear portion 253a is equal to or greater than the volume of the gap Ma2 calculated by multiplying the length L2, the height H2, and the width W2. In this way, at the tip portion of the input terminal portion 25a, the second linear portion 253a is provided as a volume increasing portion having a volume larger than the volume of the gap Ma2.

[0063] 〈Welding Process〉 After the mounting steps of step S1 and step S2 described above, in step S3, with respect to a laser irradiation device (not shown), the mounting body 28 to which the first switching element group 22, the second switching element group 23, the third switching element group 24, the capacitor 21, and the current sensor 25 are mounted is relatively moved in each of the X direction and the Y direction, and the laser La is irradiated from the laser irradiation device to the first region Ar1 (see FIG. 6). In step S4, after irradiating the first region Ar1 with the laser La, the mounting body 28 is relatively moved in each of the X direction and the Y direction with respect to the laser irradiation device, and the laser La is irradiated from the laser irradiation device to the second region Ar2 (see FIG. 6). Note that the laser La is an example of the "energy beam" in the claims. Also, steps S3 and S4 are examples of the "step of welding" in the claims.

[0064] That is, steps S3 and S4 are welding steps for electrically connecting the capacitor 21 and each of the switching element 22a, the switching element 23a, and the switching element 24a. Also, steps S3 and S4 are welding steps for electrically connecting each of the switching element 22b, the switching element 23b, and the switching element 24b and the current sensor 25.

[0065] Here, as shown in FIG. 14, since the configurations of welding the capacitor 21, each of the switching elements 22a, 23a, and 24a, and the current sensor 25 are the same, FIGS. 15 to 17 will be referred to and described only for the configuration of welding the input terminal portion 21a and the output terminal portion 221a of the capacitor 21 in the Zm3 portion of FIG. 14.

[0066] As shown in FIGS. 15 to 17, steps S3 and S4 are steps of welding the tip portions of the input terminal portion 21a and the output terminal portion 221a by filling the gap Ma1 with the material melted by irradiating the second linear portion 213a of the input terminal portion 21a with the laser La. Here, the laser La is a blue laser having a wavelength with a higher energy absorption rate for copper than lasers of other wavelengths.

[0067] Specifically, as shown in FIG. 15, step S3 is a step of irradiating the La along the first irradiation path Rt1 set in the first region Ar1 within the protruding tip surface 214a of the second linear portion 213a when viewed from the Z1 direction side. The first irradiation path Rt1 is inside the rectangular first region Ar1 and is a path along the outer edge of the rectangular first region Ar1 when viewed from the Z1 direction side. Here, in the irradiation of the laser La along the first irradiation path Rt1, the output of the laser La, the focal position of the laser La, the number of times of circulating along the first irradiation path Rt1, and the moving speed of the relative attachment body 28 are set in advance. Here, the focal position of the laser La is the position where the laser La of the laser irradiation device intersects the protruding tip surface 214a.

[0068] Also, as shown in FIG. 16, step S3 is a step of irradiating the protruding end surface 214a of the second linear portion 213a formed by bending the tip portion of the input terminal portion 21a in the direction opposite to the irradiation direction (Z2 direction) of the laser La (Z1 direction) with the laser La to melt the material and filling the gap Ma1 with the melted material. As a result, the gap Ma1 is filled with the melted copper material, so that the input terminal portion 21a and the output terminal portion 221a come into contact with each other. Step S3 is a step of switching to the irradiation of the laser La along the second irradiation path Rt2 (see FIG. 17) based on irradiating the laser La while moving it a preset number of times along the first irradiation path Rt1.

[0069] As shown in FIG. 17, step S4 is a step of irradiating the laser La along the first irradiation path Rt1 set in the first region Ar1 as viewed from the Z1 direction side, and then irradiating the laser La along the second irradiation path Rt2 set in the second region Ar2, which is a region larger than the first region Ar1 and includes the tip portions of the melted second linear portion 213a and the output terminal portion 221a. The second irradiation path Rt2 is inside the rectangular second region Ar2 and along the outer edge of the rectangular second region Ar2 as viewed from the Z1 direction side. Here, in the irradiation of the laser La along the second irradiation path Rt2, the output of the laser La, the focal position of the laser La, the number of times of circulating along the second irradiation path Rt2, and the moving speed of the relative attachment body 28 are preset. Also, the output of the laser La along the second irradiation path Rt2 is larger than the output of the laser La along the first irradiation path Rt1. Further, the focal position of the laser La is the position where the laser La of the laser irradiation device intersects the surface on the Z1 direction side of the tip portion of the input terminal portion 21a.

[0070] As a result, the tip portions of the input terminal portion 21a and the output terminal portion 221a are melted and solidified, so that the tip portions of the input terminal portion 21a and the output terminal portion 221a are welded to each other. Also, since each of the input terminal portion 21a and the output terminal portion 221a is made of the same copper material, generation of a metal compound is suppressed at the interface of the welded portion between the tip portion of the input terminal portion 21a and the tip portion of the output terminal portion 221a.

[0071] After step S4, the method for joining the terminals of the electronic component ends.

[0072] (Effect of this embodiment) In this embodiment, the following effects can be obtained.

[0073] In this embodiment, as described above, the method for joining the terminals of the electronic component includes step S3 of irradiating the second linear portion 213a (second linear portion 253a) of the capacitor 21 (current sensor 25) with the laser La to melt the material and filling the gap Ma1 (gap Ma2) therewith, thereby welding the tip portions of the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a) to each other. As a result, since the second linear portion 213a (second linear portion 253a) is provided at the tip portion of the input terminal portion 21a (input terminal portion 25a) of the capacitor 21 (current sensor 25), there is no need to weld a material for filling (filling) the gap Ma1 (gap Ma2) between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) to the tip portion of the input terminal portion 21a (input terminal portion 25a) of the capacitor 21 (current sensor 25) in a separate process. Therefore, an increase in the number of steps for welding the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) with the laser La can be suppressed. As a result, an increase in the working time of the step of welding the terminal portions with the laser La can be suppressed.

[0074] Also, in the present embodiment, as described above, the second linear portion 213a (second linear portion 253a) is formed by bending the tip portion of the input terminal portion 21a (input terminal portion 25a) in the Z1 direction (opposite to the Z2 direction (irradiation direction)) of the laser La. Step S3 includes a step of welding the tip portions of the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a) by filling the gap Ma1 (gap Ma2) with the material melted by irradiating the tip surface of the second linear portion 213a (second linear portion 253a) with the laser La. As a result, in the second linear portion 213a (second linear portion 253a) bent and protruding in the Z1 direction (opposite to the Z2 direction (irradiation direction)), the material of the second linear portion 213a (second linear portion 253a) melted by the irradiation of the laser La flows in the Z2 direction (irradiation direction) and fills the gap Ma1 (gap Ma2), so that the second linear portion 213a (second linear portion 253a) protruding after welding the tip portions of the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a) can be eliminated. As a result, since the dimension of the input terminal portion 21a (input terminal portion 25a) in the Z2 direction (irradiation direction) can be reduced after welding, the terminal joining portion of the electronic component can be made into a compact structure.

[0075] Also, in the present embodiment, as described above, the input terminal portion 21a (input terminal portion 25a) is formed by bending the tip portion of the input terminal portion 21a (input terminal portion 25a) having a certain thickness in the Z1 direction (the direction opposite to the Z2 direction (irradiation direction)), and includes a first linear portion 212a (first linear portion 252a) extending from the base end portion 211a (base end portion 251a) toward the tip portion, and a second linear portion 213a (second linear portion 253a) which is a volume increasing portion protruding and extending in the Z1 direction (the direction opposite to the Z2 direction (irradiation direction)) by a length greater than the thickness of the first linear portion 212a (first linear portion 252a) from the tip surface of the first linear portion 212a (first linear portion 252a). Thus, by simply bending the tip portion of the input terminal portion 21a (input terminal portion 25a) having a certain thickness in the Z1 direction (the direction opposite to the Z2 direction (irradiation direction)) to make the input terminal portion 21a (input terminal portion 25a) L-shaped, an input terminal portion 21a (input terminal portion 25a) having a volume increasing portion can be formed, so that it is possible to suppress the complication of the manufacturing process of the input terminal portion 21a (input terminal portion 25a).

[0076] Also, in the present embodiment, as described above, the terminal bonding structure of the electronic component is formed of the same material as the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a) by welding each of the tip portions of the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a), and welding the terminals having a flat surface shape with a uniform thickness in contact with each other. A welding portion 26 (welding portion 27) having a volume larger than the volume of the welding portion 26 (welding portion 27) is provided. As a result, a second linear portion 213a (second linear portion 253a) is provided in the welding portion 26 (welding portion 27) formed of the same material as the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a), so that the gap Ma1 (gap Ma2) between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) is filled (filled). The welding portion 26 (welding portion 27) is formed without welding a material different from the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a) to the tip portion of the input terminal portion 21a (input terminal portion 25a) of the capacitor 21 (current sensor 25) in a separate process. As a result, an increase in the number of steps for welding the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) by the laser La can be suppressed, so that an increase in the working time of the step of welding the terminal portions by the laser La can be suppressed. It is possible to realize a terminal bonding structure of an electronic component.

[0077] (Appended Claim 1) Also, in the present embodiment, as described above, in the welding step S3, when viewed from the Z1 direction side, after irradiating the laser La along the first irradiation path Rt1 set in the first region Ar1 within the protruding tip surface 214a (254a) of the second linear portion 213a (253a), the laser La is irradiated along the second irradiation path Rt2 set in the second region Ar2, which is a region larger than the first region Ar1 and includes the tip portions of the melted second linear portion 213a (253a) and the output terminal portion 221a (output terminal portion 221b). Thereby, the second linear portion 213a (253a) can be melted by irradiating the laser La along the first irradiation path Rt1 of the first region Ar1. Also, by irradiating the laser La along the second irradiation path Rt2 of the second region Ar2, the tip portions of the input terminal portion 21a (input terminal portion 25a) and the output terminal portion 221a (output terminal portion 221b) can be melted. In this way, by separately melting the welding portions between the tip portion of the input terminal portion 21a (input terminal portion 25a) and the tip portion of the output terminal portion 221a (output terminal portion 221b), even if the portion melted by the second linear portion 213a (253a) increases, the entire welding portion between the tip portion of the input terminal portion 21a (input terminal portion 25a) and the tip portion of the output terminal portion 221a (output terminal portion 221b) can be surely melted. Also, by irradiating the laser La along the first irradiation path Rt1 of the first region Ar1, the second linear portion 213a (253a) melts while spreading. Then, by irradiating the laser La along the second irradiation path Rt2 set in the second region Ar2, which is larger than the first region Ar1, the laser La can be irradiated onto the entire material of the second linear portion 213a (253a) that melts while spreading. Therefore, each of the second linear portion 213a (253a) that melts while spreading, the tip portion of the input terminal portion 21a (input terminal portion 25a), and the tip portion of the output terminal portion 221a (output terminal portion 221b) can be melted.As a result, the melted materials of the second linear portion 213a (253a), the tip portion of the input terminal portion 21a (input terminal portion 25a), and the tip portion of the output terminal portion 221a (output terminal portion 221b) are solidified, and the tip portion of the input terminal portion 21a (input terminal portion 25a) and the tip portion of the output terminal portion 221a (output terminal portion 221b) can be joined. Therefore, the joining strength between the tip portion of the input terminal portion 21a (input terminal portion 25a) and the tip portion of the output terminal portion 221a (output terminal portion 221b) can be increased.

[0078] (Appended Claim 2) Also, in the present embodiment, as described above, the output of the laser La along the second irradiation path Rt2 is larger than the output of the laser La along the first irradiation path Rt1. As a result, in the first irradiation path Rt1 of the first region Ar1, only the second linear portion 213a (253a) was melted, but in the second irradiation path Rt2 of the second region Ar2, it is necessary to melt both the tip portion of the input terminal portion 21a (input terminal portion 25a) and the tip portion of the output terminal portion 221a (output terminal portion 221b). Therefore, more energy of the laser La is required in the second irradiation path Rt2 of the second region Ar2 compared to the first irradiation path Rt1 of the first region Ar1. Therefore, by increasing the output of the laser La along the second irradiation path Rt2, both the tip portion of the input terminal portion 21a (input terminal portion 25a) and the tip portion of the output terminal portion 221a (output terminal portion 221b) can be surely melted.

[0079] (Appended Claim 3) Further, in the present embodiment, as described above, the protruding length Pr1 (protruding length Pr2) of the second linear portion 213a (253a) is such that the volume obtained by multiplying the protruding length Pr1 (protruding length Pr2), a predetermined thickness Th1 (thickness Th2), and a width W1 (width W2) in the second linear portion 213a (253a) is equal to or greater than the volume of the gap Ma1 (gap Ma2) between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a). Thereby, the material of the volume-increased portion that has been melted can reliably fill (embed) the gap Ma1 (gap Ma2) between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a). Therefore, even if a gap Ma1 (gap Ma2) occurs between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) due to variations occurring at each of the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a), the second linear portion 213a (253a) at the tip portion of the input terminal portion 21a (input terminal portion 25a) can weld the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a).

[0080] (Appended Claim 4) Further, in the present embodiment, as described above, the welded portion 26 (welded portion 27) includes a first molten and solidified portion 261 (third molten and solidified portion 271) protruding from the output terminal portion 221a (output terminal portion 221b) to the side opposite to the input terminal portion 21a (input terminal portion 25a), and a second molten and solidified portion 262 (fourth molten and solidified portion 272) protruding from the input terminal portion 21a (input terminal portion 25a) to the side opposite to the output terminal portion 221a (output terminal portion 221b) and larger than the first molten and solidified portion 261 (third molten and solidified portion 271). As a result, the gap Ma1 (gap Ma2) between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) is filled by the second molten and solidified portion 262 (fourth molten and solidified portion 272), and the first molten and solidified portion 261 (third molten and solidified portion 271) joins the second molten and solidified portion 262 (fourth molten and solidified portion 272) and the tip portion of the input terminal portion 21a (input terminal portion 25a). Thus, the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) can be surely electrically connected.

[0081] (Appended claim 5) Also, in the present embodiment, as described above, the capacitor 21 (current sensor 25) includes a capacitor main body portion 21j (current sensor main body portion 25g) and a base end portion 211a (base end portion 251a) connected to the capacitor main body portion 21j (current sensor main body portion 25g). The capacitor 21 (current sensor 25) has a first linear portion 212a (first linear portion 252a) extending from the base end portion 211a (base end portion 251a) toward the tip end portion, and by bending the tip end portion on the side opposite to the base end portion 211a (base end portion 251a), it protrudes and extends from the tip end surface of the first linear portion 212a (first linear portion 252a) by a length greater than the thickness Th1 (thickness Th2) of the first linear portion 212a (first linear portion 252a). It is provided with an L-shaped terminal portion (input terminal portion 21a, input terminal portion 25a) having a second linear portion 213a (second linear portion 253a). As a result, due to the provision of the second linear portion 213a (second linear portion 253a) in the capacitor 21 (current sensor 25) by the L-shaped terminal portion (input terminal portion 21a, input terminal portion 25a), when welding the capacitor 21 (current sensor 25) to another capacitor 21 (current sensor 25), a material for filling (filling) the gap Ma1 (gap Ma2) between the tip end portion of the terminal portion (input terminal portion 21a, input terminal portion 25a) of the other capacitor 21 (current sensor 25) and the tip end portion of the capacitor 21 (current sensor 25) is welded to the tip end portion of the terminal portion (input terminal portion 21a, input terminal portion 25a) of the capacitor 21 (current sensor 25) without the need for a separate process. The capacitor 21 (current sensor 25) can be welded to another capacitor 21 (current sensor 25). As a result, it is possible to suppress an increase in the number of steps for welding the tip end portion of the terminal portion (input terminal portion 21a, input terminal portion 25a) of the capacitor 21 (current sensor 25) and the tip end portion of another capacitor 21 (current sensor 25) by the laser La, so it is possible to suppress an increase in the working time of the step of welding the terminal portions (input terminal portion 21a, input terminal portion 25a) to each other by the laser La. A capacitor 21 (current sensor 25) can be realized.

[0082] Also, in the present embodiment, as described above, with a gap Ma1 (gap Ma2) provided between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a), the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) are welded. As a result, unlike the case where the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) are brought into contact with each other by sandwiching them, it is possible not to apply a load for sandwiching the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a). Here, when a load for sandwiching the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) is applied, after welding the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) and removing the above load, stress is applied to each of the switching element 22a (switching element 23a, switching element 24a, switching element 22b, switching element 23b, and switching element 24b) and the capacitor 21 (current sensor 25) due to the restoring force of the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a), and the durability performance deteriorates. Therefore, by welding the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) with a gap Ma1 (gap Ma2) provided between them, it is possible to suppress the generation of stress in each of the switching element 22a (switching element 23a, switching element 24a, switching element 22b, switching element 23b, and switching element 24b) and the capacitor 21 (current sensor 25) due to the restoring force of the output terminal portion 221a (output terminal portion 221b) and the input terminal portion 21a (input terminal portion 25a).

[0083] Further, in the present embodiment, as described above, even when a gap Ma1 (gap Ma2) is generated between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) due to variations occurring at each of the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a), the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a) can be welded by the second linear portion 213a (second linear portion 253a) of the tip portion of the input terminal portion 21a (input terminal portion 25a). As a result, it is possible to realize a method for joining terminals of an electronic component that allows for the gap Ma1 (gap Ma2) between the tip portion of the output terminal portion 221a (output terminal portion 221b) and the tip portion of the input terminal portion 21a (input terminal portion 25a).

[0084] [Modification Example] It should be considered that the above-described embodiment is illustrative in all respects and not restrictive. The scope of the present invention is shown not by the description of the above embodiment but by the claims, and further includes all changes (modification examples) within the meaning and scope equivalent to the claims.

[0085] For example, in the above embodiment, an example in which the terminal joining structure of the electronic component is applied to the power conversion device 100 for a vehicle is shown, but the present invention is not limited to this. In the present invention, the terminal joining structure of the electronic component may be applied to a power conversion device of a vehicle such as a hybrid vehicle or a railway vehicle, rather than an electric vehicle, or may be applied to the joining of terminals of electronic components other than vehicles.

[0086] Also, in the above embodiment, an example in which the laser La is a blue laser having a wavelength with a higher energy absorption rate for copper than lasers of other wavelengths is shown, but the present invention is not limited to this. In the present invention, the laser may be a laser other than a blue laser such as a green laser, or may be an electron beam (an example of the "energy beam" in the claims) instead of a laser.

[0087] In the above-described embodiment, an example in which each of the capacitor 21, the switching elements 22a, 23a, 24a, the switching elements 22b, 23b, 24b, and the current sensor 25 has a columnar terminal portion has been shown. However, the present invention is not limited thereto. In the present invention, as in the modification shown in FIG. 18, the capacitor and the current sensor may have a flat-plate-shaped terminal portion such as the terminal Bu1, and the switching element may have a flat-plate-shaped terminal portion such as the terminal Bu2. Further, the capacitor and the current sensor may have a rod-shaped or wire-shaped terminal portion, and the switching element may have a rod-shaped or wire-shaped terminal portion.

[0088] In the above-described embodiment, an example in which the second linear portion 213a is formed by bending the tip portion on the side opposite to the base end portion 211a in the Z1 direction by press forming has been shown. However, the present invention is not limited thereto. In the present invention, the second linear portion may be formed by bending the tip portion on the side opposite to the base end portion in the Z2 direction by press forming.

Description of Reference Numerals

[0089] 21 Capacitor (second electronic component), 21a Input terminal portion (second terminal portion), 21b Ground terminal portion (second terminal portion), 21c Output terminal portion (second terminal portion), 21d Input terminal portion (second terminal portion), 21e Ground terminal portion (second terminal portion), 21f Output terminal portion (second terminal portion), 21g Input terminal portion (second terminal portion), 21h Ground terminal portion (second terminal portion), 21i Output terminal portion (second terminal portion), 21j Capacitor main body portion (component main body portion) 22a Switching element (first electronic component), 22b Switching element (first electronic component), 23a Switching element (first electronic component), 23b Switching element (first electronic component), 24a Switching element (first electronic component), 24b Switching element (first electronic component), 25 Current sensor (second electronic component), 25a Input terminal part (second terminal part), 25b Output terminal part (second terminal part), 25c Input terminal part (second terminal part), 25d Output terminal part (second terminal part), 25e Input terminal part (second terminal part), 25f Output terminal part (second terminal part), 25g Current sensor main body part (component main body part), 26, 27 Welding part, 211a Base end part, 212a First linear part, 213a Second linear part, 214a Protruding tip surface (tip surface), 221a Output terminal part (first terminal part), 221b Output terminal part (first terminal part), 222a Ground terminal part (first terminal part), 222b Input terminal part (first terminal part), 223a Input terminal part (first terminal part), 225a Output terminal part (first terminal part), 231a Output terminal part (first terminal part), 231b Output terminal part (first terminal part), 232a Ground terminal part (first terminal part), 232b Input terminal part (first terminal part), 233a Input terminal part (first terminal part), 241a Output terminal part (first terminal part), 241b Output terminal part (first terminal part), 242a Ground terminal part (first terminal part), 242b Input terminal part (first terminal part), 243a Input terminal part (first terminal part), 251a Base end part, 252a First linear part, 253a Second linear part, 254a Protruding tip surface (tip surface), La Laser (energy beam) Ma1 Gap, Ma2 Gap, Th1 Thickness, Th2 Thickness

Claims

1. A method for joining terminals of electronic components, comprising arranging and welding a second terminal portion of a second electronic component so as to face a first terminal portion of a first electronic component, a step of arranging the tip portion of the first terminal portion and the tip portion of the second terminal portion having a volume increasing portion having a volume larger than the volume of the gap between the tip portions of the first terminal portion and the second terminal portion facing each other so as to face each other; and a step of welding the tip portions of the first terminal portion and the second terminal portion by filling the gap with a material melted by irradiating an energy beam onto the volume increasing portion of the second electronic component. A method for joining terminals of electronic components.

2. The volume increasing portion is formed by bending the tip portion of the second terminal portion in a direction opposite to the irradiation direction of the energy beam, The welding step includes welding the tip portions of the first terminal portion and the second terminal portion to each other by filling the gap with a material melted by irradiating the energy beam onto the tip surface of the volume increasing portion. The method for joining terminals of electronic components according to Claim 1.

3. The second terminal portion is formed by bending the tip portion of the second terminal portion having a certain thickness in a direction opposite to the irradiation direction, and a first linear portion extending from the base end portion toward the tip end portion; and a second linear portion which is the volume increasing portion protruding and extending in a direction opposite to the irradiation direction by a length greater than the thickness of the first linear portion from the tip surface of the first linear portion. The method for joining terminals of electronic components according to Claim 2, having an L-shaped configuration.

4. A first electronic component having a first terminal portion; A second electronic component made of the same material as the first terminal portion and having a second terminal portion to which the first terminal portion is joined; A welded portion having a volume larger than the volume of a welded portion formed by bringing into contact and welding flat-surface-shaped terminals formed of the same material as the first terminal portion and the second terminal portion and having a uniform thickness by welding the tip portions of the first terminal portion and the second terminal portion. A terminal joining structure of an electronic component.

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