Electronic component

Abstract

To provide an electronic component that suppresses deterioration in characteristics even when cracks occur in an element body.SOLUTION: A principal surface 3a is curved at an end connected to an end surface 3e. An external electrode 5 is disposed on the main surface 3a and the end surface 3e. A plurality of internal conductors include a plurality of internal electrodes 7 whose ends 7e are connected to the external electrode 5. An interval T1 (μm) in a direction orthogonal to a virtual plane PL1 between the internal conductor adjacent to the main surface 3a among the plurality of internal conductors and the virtual plane PL1 in contact with the main surface 3a and parallel to a main surface 3b, an interval H1 (μm) in a direction orthogonal to the virtual plane PL1 between an end 7e closest to the virtual plane PL1 and the virtual plane PL1, and a radius of curvature R1 (μm) at the end of the main surface 3a connected to the end surface 3e satisfy a relationship of H1 / 2>T1 and R1>T1.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] A known electronic component includes an element body, a plurality of external electrodes arranged on the element body, and a plurality of internal conductors arranged within the element body and including exposed ends exposed from the element body (see, for example, Patent Document 1). The element body includes a first main surface that constitutes a mounting surface, a second main surface opposite the first main surface, and an end surface that connects the first main surface and the second main surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 59-138229 Summary of the Invention [Problem to be solved by the invention]

[0004] In a configuration in which an electronic component is solder-mounted to an electronic device, an external force acting from the electronic device to the electronic component may act as stress on the element body. The electronic device may include, for example, a circuit board or an electronic component. The external force may act on the element body through a solder fillet formed during solder mounting and an external electrode. In this case, cracks may occur in the element body. If a crack occurs in the element, it may reach the internal conductor, and in an electronic component where the crack has reached the internal conductor, the characteristics may be degraded.

[0005] An object of one aspect of the present invention is to provide an electronic component that suppresses deterioration of characteristics even when cracks occur in the element body. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention includes an element body, a plurality of external electrodes arranged on the element body, and a plurality of internal conductors arranged within the element body and including exposed ends exposed from the element body. The element body includes a first main surface constituting a mounting surface, a second main surface opposite the first main surface, and an end surface connecting the first main surface and the second main surface. The first main surface is curved at the end connected to the end surface. The plurality of external electrodes include first external electrodes arranged on the first main surface and the end surface. The plurality of internal conductors include a plurality of first internal conductors whose exposed ends are connected to the first external electrode. The distance T1 (μm) between an internal conductor adjacent to the first main surface and an imaginary plane that is in contact with the first main surface and parallel to the second main surface in a direction perpendicular to the imaginary plane, the distance H1 (μm) between an exposed end connected to the first external electrode and the imaginary plane that is closest to the imaginary plane, and the radius of curvature R1 (μm) of the first main surface at the end connected to the end surface are H1 / 2>T1 R1>T1 Satisfy the relationship.

[0007] As a result of research and study by the present inventors, the following facts have been discovered. The stress acts on the element body, for example, from the edge of the first external electrode on the first main surface. In this case, a crack occurs in the element body, originating from a position corresponding to the edge of the first external electrode on the first main surface. The crack grows, for example, from the origin toward the end face in a direction intersecting the imaginary plane. If the angle of the direction in which the crack grows within the element body relative to the imaginary plane is large, the crack is likely to reach the internal conductor. If this angle is small, the crack is unlikely to reach the internal conductor.

[0008] The present inventors focused on the direction in which cracks grow within the element body. As a result, the present inventors found that cracks are unlikely to reach the internal conductors when the distance between an internal conductor adjacent to the first main surface and an imaginary plane that is in contact with the first main surface and parallel to the second main surface in a direction perpendicular to the imaginary plane, the distance between an exposed end connected to the first external electrode and an exposed end closest to the imaginary plane in a direction perpendicular to the imaginary plane, and the radius of curvature of the end of the first main surface connected to the end face satisfy a desired relationship. That is, when the distance T1 (μm), the distance H1 (μm), and the radius of curvature R1 (μm) are H1 / 2>T1 R1>T1 When the above relationship is satisfied, cracks growing inside the element are unlikely to reach the internal conductor.

[0009] Therefore, in the above-mentioned one aspect, even if a crack occurs in the element body, the crack is unlikely to reach the internal conductor, and as a result, the above-mentioned one aspect suppresses deterioration of characteristics.

[0010] In the electronic component according to the above aspect, the interval H1 (μm) and the radius of curvature R1 (μm) are: H1>R1 may satisfy the following relationship.

[0011] As a result of the research and study conducted by the present inventors, the following facts were also discovered. In electronic components, external electrodes may include an underlayer disposed on an element body and a plating layer disposed on the underlayer. The plating layer is formed by a plating method. In plating methods, for example, the element body on which the underlayer is disposed is immersed in a plating solution. In this case, the plating solution may penetrate into the element body. For example, the plating solution penetrates into the element body through the exposed ends of the internal conductors or the interface between the exposed ends and the element body. In electronic components where plating solution penetrates into the element body, the characteristics may be degraded. In a configuration in which the first main surface is curved at the end connected to the end surface, the thickness of the base layer tends to decrease at the end of the first main surface, making it easier for the plating solution to penetrate into the base layer from a region corresponding to the end of the first main surface.

[0012] The present inventors focused on the path of penetration of the plating solution. As a result, the present inventors found that the plating solution is unlikely to penetrate into the element body when the distance between the exposed end connected to the first external electrode that is closest to the imaginary plane and the imaginary plane in a direction perpendicular to the imaginary plane, and the radius of curvature of the first main surface at the end connected to the end face, satisfy a desired relationship. That is, when the distance H1 (μm) and the radius of curvature R1 (μm) are H1>R1 When the above relationship is satisfied, the plating solution is unlikely to penetrate into the element.

[0013] Therefore, the interval H1 (μm) and the radius of curvature R1 (μm) are H1>R1 A configuration that satisfies the above relationship reliably suppresses deterioration of characteristics.

[0014] In the electronic component according to the above aspect, the end face may be curved at an end connected to the second main surface, and the first external electrode may also be disposed on the second main surface. The radius of curvature R1 may be larger than the radius of curvature of the end face at the end connected to the second main surface. In a configuration in which the radius of curvature R1 is larger than the radius of curvature of the end face at the end connected to the second main surface, the first main surface and the second main surface are reliably distinguished from each other, and therefore, in this configuration, the electronic component can be solder-mounted to the electronic device so that the first main surface faces the electronic device reliably.

[0015] In the electronic component according to the above aspect, the element body may include a side surface connecting the first main surface and the second main surface and adjacent to the end surface. The plurality of external electrodes may include a second external electrode disposed on the first main surface and the side surface. The plurality of internal conductors may include a plurality of second internal conductors whose exposed ends are connected to the second external electrode. The interval T1 (μm) and the interval H2 (μm) between the exposed end connected to the second external electrode that is closest to the imaginary plane and the imaginary plane in a direction perpendicular to the imaginary plane are H2 / 2>T1 may satisfy the following relationship.

[0016] As a result of the research and study conducted by the present inventors, the following facts were also discovered. The stress acts on the element body, for example, from an end of the second external electrode on the first main surface. In this case, a crack occurs in the element body, originating from a position corresponding to the end of the second external electrode on the first main surface. The crack grows, for example, from the origin toward the side in a direction intersecting with the imaginary plane. If the angle of the direction in which the crack grows within the element body relative to the imaginary plane is large, the crack is likely to reach the internal conductor. If this angle is small, the crack is unlikely to reach the internal conductor.

[0017] The inventors focused on the direction in which cracks originating from the second external electrode grow within the element. As a result, the inventors found that cracks originating from the second external electrode are unlikely to reach the internal conductors when the distance between an internal conductor adjacent to the first main surface and an imaginary plane that is in contact with the first main surface and parallel to the second main surface in a direction perpendicular to the imaginary plane, among the multiple internal conductors, and the distance between an exposed end closest to the imaginary plane and the imaginary plane in a direction perpendicular to the imaginary plane, among the exposed ends connected to the second external electrode, satisfy a desired relationship. That is, when the distance T1 (μm) and the distance H2 (μm) are H2 / 2>T1 When the above relationship is satisfied, cracks that grow within the element body due to the second external electrode are unlikely to reach the internal conductor.

[0018] Therefore, the interval T1 (μm) and the interval H2 (μm) are H2 / 2>T1 In a configuration that satisfies the above relationship, even if a crack originating from the second external electrode occurs in the element body, the crack is unlikely to reach the internal conductor. This configuration further suppresses deterioration of characteristics.

[0019] In the electronic component according to the above aspect, the first main surface may be curved at an end connected to the side surface, wherein the interval T1 (μm) and the radius of curvature R2 (μm) of the first main surface at the end connected to the side surface are R2>T1 may satisfy the following relationship.

[0020] The inventors have found that, among the multiple internal conductors, when the distance between the internal conductor adjacent to the first main surface and an imaginary plane that is in contact with the first main surface and parallel to the second main surface in a direction perpendicular to the imaginary plane, and the radius of curvature of the first main surface at the end connected to the side surface, satisfy a desired relationship, cracks originating from the second external electrode are less likely to reach the internal conductors. That is, when the distance T1 (μm) and the radius of curvature R2 (μm) are R2>T1 When the above relationship is satisfied, cracks that grow within the element due to the second external electrode are less likely to reach the internal conductor.

[0021] Therefore, the interval T1 (μm) and the radius of curvature R2 (μm) are R2>T1 In a configuration that satisfies the above relationship, even if a crack originating from the second external electrode occurs in the element body, the crack is less likely to reach the internal conductor, and this configuration further suppresses deterioration of characteristics.

[0022] In the electronic component according to the above aspect, the interval H2 (μm) and the radius of curvature R2 (μm) are: H2>R2 may satisfy the following relationship.

[0023] The inventors have also found that the plating solution is less likely to penetrate into the element body when the distance between the exposed end connected to the second external electrode and the imaginary plane in a direction perpendicular to the imaginary plane and the imaginary plane, and the radius of curvature of the first main surface at the end connected to the side surface, satisfy a desired relationship. That is, when the distance H2 (μm) and the radius of curvature R2 (μm) are H2>R2 When the above relationship is satisfied, the plating solution is unlikely to penetrate into the element.

[0024] Therefore, the interval H2 (μm) and the radius of curvature R2 (μm) are H2>R2 A configuration that satisfies the above relationship reliably suppresses deterioration of characteristics.

[0025] In the electronic component according to the above aspect, the side surface may be curved at an end connected to the second main surface, and a second external electrode may also be disposed on the second main surface. The radius of curvature R2 may be larger than the radius of curvature of the side surface at the end connected to the second main surface. Even when the radius of curvature R2 is greater than the radius of curvature of the side surface at the end connected to the second main surface, the first main surface and the second main surface can be reliably distinguished from each other. Therefore, in this configuration, the electronic component can be solder-mounted to the electronic device so that the first main surface faces the electronic device more reliably.

[0026] In the electronic component according to the above aspect, the interval T1 (μm) is T1>45 may satisfy the following relationship.

[0027] Chips can occur in element bodies during the manufacturing process. For example, an impact is applied to an element body when it collides with another element body or when it collides with manufacturing equipment other than the element body. When an impact is applied to an element body, the possibility of chipping occurring in the element body increases. The present inventors have focused on the configuration in which chipping may occur. As a result, the present inventors have found that chipping is unlikely to occur in the element body when the distance between the internal conductor adjacent to the first main surface and the virtual plane in contact with the first main surface and parallel to the second main surface in the direction perpendicular to the virtual plane satisfies a desired relationship. That is, when the distance T1 (μm) is T1>45 If the above relationship is satisfied, chipping is unlikely to occur in the element body.

[0028] Therefore, the interval T1 (μm) is T1>45 A configuration that satisfies the relationship above prevents chipping from occurring in the element body.

[0029] In the electronic component according to the above aspect, the internal conductors may face each other in a direction in which the first main surface and the second main surface face each other. In a configuration in which multiple internal conductors face each other in the direction in which the first principal surface and the second principal surface face each other, if cracks occur in the element body, the characteristics are likely to deteriorate. However, as described above, even if cracks occur in the element body, the cracks are unlikely to reach the internal conductors. Therefore, even in this configuration, deterioration of characteristics is reliably suppressed. [Effects of the Invention]

[0030] One aspect of the present invention provides an electronic component that suppresses deterioration of characteristics even when cracks occur in the element body. [Brief explanation of the drawings]

[0031] [Figure 1] FIG. 1 is a perspective view of a feedthrough multilayer capacitor in accordance with one embodiment. [Figure 2] FIG. 2 is a diagram showing a cross-sectional configuration of the feedthrough multilayer capacitor in accordance with this embodiment. [Figure 3] FIG. 3 is a diagram showing a cross-sectional configuration of the feedthrough multilayer capacitor in accordance with this embodiment. [Figure 4] FIG. 4 is a diagram showing a cross-sectional configuration of the feedthrough multilayer capacitor in accordance with this embodiment. [Figure 5] FIG. 5 is a diagram showing a cross-sectional configuration of the feedthrough multilayer capacitor in accordance with this embodiment. [Figure 6] FIG. 6 is a chart showing the test results for each sample. [Figure 7] FIG. 7 is a chart showing the test results for each sample. [Figure 8] FIG. 8 is a diagram showing a cross-sectional configuration of the electronic component device. [Figure 9] FIG. 9 is a diagram showing a cross-sectional configuration of the electronic component device. [Figure 10] FIG. 10 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and redundant description will be omitted.

[0033] The configuration of the multilayer feedthrough capacitor C1 in accordance with this embodiment will be described with reference to Figures 1 to 5. Figure 1 is a perspective view of the multilayer feedthrough capacitor in accordance with this embodiment. Figures 2, 3, 4, and 5 are views showing cross-sectional configurations of the multilayer feedthrough capacitor in accordance with this embodiment. Hatching indicating cross sections is omitted in Figures 2, 3, 4, and 5. The electronic component includes, for example, a multilayer feedthrough capacitor C1.

[0034] As shown in FIGS. 1 to 3, the multilayer feedthrough capacitor C1 includes an element body 3 and a plurality of external electrodes arranged on the element body 3. The plurality of external electrodes include, for example, a pair of external electrodes 5 and a pair of external electrodes 6. The pair of external electrodes 5 and the pair of external electrodes 6 are spaced apart from each other. Each external electrode 5 is included, for example, in a signal terminal electrode, and each external electrode 6 is included, for example, in a ground terminal electrode. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which portions corresponding to corners and edges are rounded. In the element body 3, each portion corresponding to corners and edges is rounded so as to be curved. For example, the element body 3 is subjected to R-chamfering.

[0035] The element body 3 includes a pair of principal surfaces 3a, 3b facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. The pair of principal surfaces 3a, 3b, the pair of side surfaces 3c, and the pair of end surfaces 3e have a rectangular shape. The direction in which the pair of principal surfaces 3a, 3b face each other includes a first direction D1. The direction in which the pair of side surfaces 3c face each other includes a third direction D3. The direction in which the pair of end surfaces 3e face each other includes a second direction D2. The multilayer feedthrough capacitor C1 is solder-mounted to an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer feedthrough capacitor C1, the main surface 3a faces the electronic device. The main surface 3a is disposed so as to form a mounting surface. The main surface 3a is the mounting surface. For example, when the main surface 3a includes a first main surface, the main surface 3b includes a second main surface.

[0036] The first direction D1 includes a direction perpendicular to the principal faces 3 a, 3 b and is perpendicular to the third direction D3. The second direction D2 includes a direction parallel to the principal faces 3 a, 3 b and the side faces 3 c and is perpendicular to the first direction D1 and the third direction D3. The third direction D3 includes a direction perpendicular to the side faces 3 c, and the second direction D2 includes a direction perpendicular to the end faces 3 e. The pair of side surfaces 3c extend in the first direction D1 to connect the pair of main surfaces 3a, 3b. The pair of side surfaces 3c also extend in the second direction D2. The pair of end surfaces 3e extend in the first direction D1 to connect the pair of main surfaces 3a, 3b. The pair of end surfaces 3e also extend in the third direction D3. Each end face 3e connects the main face 3a and the main face 3b. Each end face 3e and the main face 3a are adjacent to each other, and each end face 3e and the main face 3b are adjacent to each other. Each side face 3c connects the main face 3a and the main face 3b. Each side face 3c and the main face 3a are adjacent to each other, and each side face 3c and the main face 3b are adjacent to each other. Each end face 3e and each side face 3c are adjacent to each other.

[0037] As shown in Fig. 4, the main surface 3a is curved at the end connected to the end surface 3e. The main surface 3a has a curved region R 3a1 Region R 3a1 The end surface 3e includes a curved surface having a predetermined radius of curvature. The end surface 3e is curved at the end connected to the main surface 3b. The end surface 3e has a curved region R 3e1 Region R 3e1 For example, the main surface 3b is substantially flat. As shown in Fig. 5, the main surface 3a is curved at the end connected to the side surface 3c. The main surface 3a has a curved region R 3a2 Region R 3a2 The side surface 3c includes a curved surface having a predetermined radius of curvature. The side surface 3c is curved at the end connected to the main surface 3b. The side surface 3c has a curved region R at the end connected to the main surface 3b. 3c1 Region R 3c1 includes a curved surface having a predetermined radius of curvature.

[0038] For example, the length of the element body 3 in the second direction D2 is greater than the length of the element body 3 in the first direction D1 and is also greater than the length of the element body 3 in the third direction D3. The second direction D2 includes the longitudinal direction of the element body 3. The length of the element body 3 in the first direction D1 and the length of the element body 3 in the third direction D3 may be equal to each other. The length of the element body 3 in the first direction D1 and the length of the element body 3 in the third direction D3 may be different from each other. The length of the element body 3 in the first direction D1 is the height of the element body 3. The length of the element body 3 in the third direction D3 is the width of the element body 3. The length of the element body 3 in the second direction D2 is the length of the element body 3. For example, the height of the element body 3 is 0.2 to 1.3 mm, the width of the element body 3 is 0.5 to 1.6 mm, and the length of the element body 3 is 1.0 to 3.2 mm. For example, the height of the element body 3 is 0.85 mm, the width of the element body 3 is 1.2 mm, and the length of the element body 3 is 2.0 mm.

[0039] The element body 3 is configured by stacking multiple dielectric layers in the first direction D1. The element body 3 includes multiple dielectric layers stacked one on top of the other. In the element body 3, the stacking direction of the multiple dielectric layers coincides with the first direction D1. Each dielectric layer is configured, for example, from a sintered ceramic green sheet containing a dielectric material. The dielectric material includes a dielectric ceramic. The dielectric ceramic includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based material. In the actual element body 3, the dielectric layers are integrated to the extent that the boundaries between the dielectric layers are not visible.

[0040] As shown in FIGS. 1 and 2, a pair of external electrodes 5 are respectively arranged at both ends of the element body 3 in the second direction D2. Each external electrode 5 is arranged on a corresponding one of the pair of end faces 3e. For example, each external electrode 5 is arranged on a pair of main faces 3a, 3b, a pair of side faces 3c, and one end face 3e. The external electrode 5 includes multiple electrode portions. As shown in FIG. 4, the multiple electrode portions include an electrode portion 5a arranged on the main face 3a, an electrode portion 5b arranged on the main face 3b, and an electrode portion 5e arranged on the end face 3e. The multiple electrode portions may include an electrode portion arranged on each side face 3c. The multiple electrode portions do not necessarily include the electrode portion 5b. Each external electrode 5 is arranged at least on the main face 3a and the corresponding end face 3e.

[0041] The electrode portion 5a covers a partial area of the main surface 3a. The electrode portion 5a is in contact with the partial area of the main surface 3a. The electrode portion 5a is in direct contact with the element body 3. The partial area of the main surface 3a is covered by the electrode portion 5a. The partial area of the main surface 3a is located closer to the end face 3e. The partial area of the main surface 3a is located closer to the curved end, i.e., the area R 3a1 The electrode portion 5a includes the region R 3a1 It covers. The electrode portion 5b covers a partial area of the main surface 3b. The electrode portion 5b contacts the partial area of the main surface 3b. The electrode portion 5b is in direct contact with the element body 3. The partial area of the main surface 3b is covered by the electrode portion 5b. The partial area of the main surface 3b is located closer to the end face 3e. The electrode portion 5e covers the end face 3e. The electrode portion 5e covers, for example, the entire end face 3e. The electrode portion 5e is in contact with the end face 3e. The electrode portion 5e is in direct contact with the element body 3. The electrode portion 5e is in contact with the region R included in the end face 3e. 3e1 It covers.

[0042] As shown in FIG. 1, the pair of external electrodes 6 are arranged in the center of the element body 3 in the second direction D2 and are located between the pair of external electrodes 5 in the second direction D2. As shown in FIG. 3, the pair of external electrodes 6 are arranged on both sides of the element body 3 in the third direction D3. Each external electrode 6 is arranged on a corresponding one of the pair of side faces 3c. For example, each external electrode 6 is arranged on a pair of principal faces 3a, 3b and one of the side faces 3c. The external electrode 6 includes multiple electrode portions. As shown in FIG. 5, the multiple electrode portions include an electrode portion 6a arranged on the principal face 3a, an electrode portion 6b arranged on the principal face 3b, and an electrode portion 6c arranged on the side face 3c. The multiple electrode portions do not necessarily have to include the electrode portion 6b. Each external electrode 6 is arranged on at least the principal face 3a and the corresponding side face 3c. For example, when the external electrode 5 includes a first external electrode, the external electrode 6 includes a second external electrode.

[0043] The electrode portion 6a covers a partial area of the main surface 3a. The electrode portion 6a is in contact with the partial area of the main surface 3a. The electrode portion 6a is in direct contact with the element body 3. The partial area of the main surface 3a is covered by the electrode portion 6a. The partial area of the main surface 3a is located closer to the side surface 3c. The partial area of the main surface 3a is located at the curved end, i.e., the area R 3a2 The electrode portion 6a includes the region R 3a2 It covers. The electrode portion 6b covers a partial area of the main surface 3b. The electrode portion 6b contacts the partial area of the main surface 3b. The electrode portion 6b is in direct contact with the element body 3. The partial area of the main surface 3b is covered by the electrode portion 6b. The partial area of the main surface 3b is located closer to the side surface 3c. The electrode portion 6c covers a partial area of the side surface 3c. The electrode portion 6c is in contact with the partial area of the side surface 3c. The electrode portion 6c is in direct contact with the element body 3. The partial area of the side surface 3c is covered by the electrode portion 6c. The partial area of the side surface 3c is located approximately in the center of the side surface 3c in the second direction D2. The partial area of the side surface 3c is located at the curved end, i.e., the area R 3c1 The electrode portion 6c includes the region R 3c1 It covers.

[0044] Each of the pair of external electrodes 5 is formed on five surfaces, for example, a pair of main surfaces 3a, 3b, a pair of side surfaces 3c, and one end surface 3e. Each of the pair of external electrodes 6 is formed on three surfaces, for example, a pair of main surfaces 3a, 3b and one side surface 3c. As shown in Figures 4 and 5, each of the external electrodes 5, 6 includes, for example, a first electrode layer E1 and a second electrode layer E2. The multiple electrode portions included in each of the external electrodes 5, 6 include, for example, a first electrode layer E1 and a second electrode layer E2.

[0045] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed by sintering a metal component (metal particles) contained in the conductive paste. The first electrode layer E1 includes a sintered metal layer. The first electrode layer E1 includes a sintered metal layer formed on the element body 3. For example, the first electrode layer E1 includes a sintered metal layer made of Cu. The first electrode layer E1 may include a sintered metal layer made of Ni. The first electrode layer E1 includes a base metal. The conductive paste includes, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent.

[0046] The second electrode layer E2 is formed on the first electrode layer E1 by plating. The second electrode layer E2 may have a multi-layer structure. In this case, the second electrode layer E2 includes, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder leach resistance than the metal contained in the first electrode layer E1. The second electrode layer E2 may include a Sn plating layer, a Cu plating layer, or an Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, a Sn plating layer, a Sn—Ag alloy plating layer, a Sn—Bi alloy plating layer, or a Sn—Cu alloy plating layer. The first electrode layer E1 includes an underlayer for forming the second electrode layer E2.

[0047] The multilayer feedthrough capacitor C1 includes a plurality of internal conductors arranged in an element body 3. As shown in FIGS. 2 to 5, the plurality of internal conductors include a plurality of internal electrodes 7 and a plurality of internal electrodes 9. The internal electrodes 7 and the internal electrodes 9 are arranged at different positions (layers) in the first direction D1. The internal electrodes 7 and the internal electrodes 9 face each other at an interval in the first direction D1 in the element body 3. The plurality of internal electrodes 7 and the plurality of internal electrodes 9 are arranged alternately in the first direction D1. The internal electrodes 7 and the internal electrodes 9 have mutually opposite polarities. The internal electrodes 7, 9 are located, for example, in a plane substantially parallel to the main surface 3b. Each of the internal electrodes 7, 9 contains a conductive material typically used as an internal conductor in a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. Each of the internal electrodes 7, 9 is formed as a sintered body of a conductive paste containing the conductive material. In the multilayer feedthrough capacitor C1, each of the internal electrodes 7, 9 contains, for example, Ni.

[0048] The internal electrode 7 is exposed at a pair of end faces 3e. The internal electrode 7 includes a pair of ends 7e. Each of the pair of ends 7e is exposed at a corresponding one of the pair of end faces 3e. The pair of ends 7e is exposed from the element body 3. Each end 7e includes an exposed end. The internal electrode 7 is not exposed at the pair of main faces 3a, 3b or the pair of side faces 3c. Each of the pair of ends 7e is connected to a corresponding one of the pair of external electrodes 5. For example, each of the pair of ends 7e is connected to an electrode portion 5e of the corresponding external electrode 5. Each of the pair of ends 7e is covered by and directly connected to the corresponding external electrode 5. The multiple internal electrodes 7 are physically and electrically connected to the pair of external electrodes 5.

[0049] The internal electrode 9 is exposed on a pair of side surfaces 3c. The internal electrode 9 includes a pair of ends 9e. Each of the pair of ends 9e is exposed on a corresponding one of the pair of side surfaces 3c. The pair of ends 9e is exposed from the element body 3. Each end 9e includes an exposed end. The internal electrode 9 is not exposed on the pair of main surfaces 3a, 3b or the pair of end surfaces 3e. Each of the pair of ends 9e is connected to a corresponding one of the pair of external electrodes 6. For example, each of the pair of ends 9e is connected to an electrode portion 6c of the corresponding external electrode 6. Each of the pair of ends 9e is covered by and directly connected to the corresponding external electrode 6. The multiple internal electrodes 9 are physically and electrically connected to the pair of external electrodes 6. For example, when the internal electrode 7 includes a first internal electrode, the internal electrode 9 includes a second internal electrode.

[0050] In the multilayer feedthrough capacitor C1, of the multiple internal electrodes 9, the internal electrode 9 closest to the principal surface 3a is adjacent to the principal surface 3a. Of the multiple internal electrodes 9, the internal electrode 9 closest to the principal surface 3b is adjacent to the principal surface 3b. The multiple internal electrodes 9 include a pair of outermost internal conductors located outermost in the first direction D1 among the multiple internal conductors. The multiple internal electrodes 7 may include a pair of outermost internal conductors located outermost in the first direction D1 among the multiple internal conductors. In this case, among the multiple internal electrodes 7, the internal electrode 7 closest to the main surface 3a is adjacent to the main surface 3a, and among the multiple internal electrodes 7, the internal electrode 7 closest to the main surface 3b is adjacent to the main surface 3b. The internal electrode 7 may be adjacent to the main surface 3a, and the internal electrode 9 may be adjacent to the main surface 3b. The internal electrode 9 may be adjacent to the main surface 3a, and the internal electrode 7 may be adjacent to the main surface 3b.

[0051] The configuration of the multilayer feedthrough capacitor C1 will be described with reference to Figures 4 and 5. As described above, the multilayer feedthrough capacitor C1 includes the element body 3, a plurality of external electrodes, and a plurality of internal conductors.

[0052] As shown in FIG. 4, the element body 3 includes a main surface 3a that constitutes the mounting surface, a main surface 3b opposite to the main surface 3a, and an end surface 3e connecting the main surface 3a and the main surface 3b. A plurality of external electrodes are arranged on the element body 3. A plurality of internal electrodes are arranged within the element body 3 and include ends exposed from the element body 3. The main surface 3a is curved at the end connected to the end surface 3e. The plurality of external electrodes include external electrodes 5 arranged on the main surface 3a and the end surface 3e. The plurality of internal conductors include a plurality of internal electrodes 7, each with an end 7e connected to the external electrode 5. The plurality of internal conductors includes an internal electrode 9 adjacent to the main surface 3a.

[0053] The interval T1 (μm), the interval H1 (μm), and the radius of curvature R1 (μm) are H1 / 2>T1 R1>T1 Satisfy the relationship. The interval T1 is defined by the distance between the internal electrode 9 adjacent to the principal surface 3a and the imaginary plane PL1 in a direction perpendicular to the imaginary plane PL1. The imaginary plane PL1 is in contact with the principal surface 3a and parallel to the principal surface 3b. The direction perpendicular to the imaginary plane PL1 includes, for example, the first direction D1. The interval H1 is defined by the distance between the imaginary plane PL1 and the end 7e, among the ends 7e connected to the external electrode 5, that is closest to the imaginary plane PL1. The radius of curvature R1 is defined by the radius of curvature of the end of the principal surface 3a that is connected to the end face 3e. The radius of curvature R1 is defined by, for example, the radius of curvature of the region R 3a1 The radius of curvature is determined by the

[0054] The interval H1 (μm) and the radius of curvature R1 (μm) are H1>R1 may satisfy the following relationship. The interval T1 (μm) is T1>45 may satisfy the following relationship.

[0055] 5, the element body 3 includes a side surface 3c that connects the principal surface 3a and the principal surface 3b and is adjacent to the end surface 3e. The multiple external electrodes include external electrodes 6 that are arranged on the principal surface 3a and the side surface 3c. The multiple internal conductors include multiple internal electrodes 9, each with an end 9e connected to the external electrode 6. The principal surface 3a is curved at the end that is connected to the side surface 3c. The multiple internal conductors include the internal electrode 9 that is adjacent to the principal surface 3a.

[0056] The interval T1 (μm) and the interval H2 (μm) are H2 / 2>T1 may satisfy the following relationship. The gap H2 is defined by the gap between the imaginary plane PL1 and the end 9e connected to the external electrode 6 that is closest to the imaginary plane PL1, in the direction perpendicular to the imaginary plane PL1. The interval T1 (μm) and the radius of curvature R2 (μm) are R2>T1 may satisfy the following relationship. The radius of curvature R2 (μm) is determined by the radius of curvature of the main surface 3a at the end connected to the side surface 3c. The radius of curvature R1 is determined by the radius of curvature of the main surface 3a at the end connected to the side surface 3c. 3a2 The radius of curvature is determined by the The spacing H2 (μm) and the radius of curvature R2 (μm) are H2>R2 may satisfy the following relationship.

[0057] As shown in Fig. 4, the end surface 3e is curved at the end connected to the main surface 3b. The radius of curvature R1 may be larger than the radius of curvature of the end surface 3e at the end connected to the main surface 3b. The above-mentioned radius of curvature of the end surface 3e may be, for example, the radius of curvature of the region R 3e1 The radius of curvature is determined by the As shown in Fig. 5, the side surface 3c is curved at the end connected to the main surface 3b. The radius of curvature R2 may be larger than the radius of curvature of the side surface 3c at the end connected to the main surface 3b. The above-mentioned radius of curvature of the side surface 3c may be, for example, the radius of curvature of the region R 3c1 The radius of curvature is determined by the

[0058] The interval T1, the interval H1, and the radius of curvature R1 can be calculated, for example, as follows. A cross-sectional photograph of the element body 3 is obtained. The cross-sectional photograph is a photograph of a cross section of the feedthrough capacitor C1 cut along a plane perpendicular to the main surface 3a and the end face 3e. The cross-sectional photograph is, for example, a photograph of a cross section of the feedthrough capacitor C1 cut along a plane parallel to the pair of side faces 3c and equidistant from the pair of side faces 3c. The spacing T1, spacing H1, and radius of curvature R1 are determined on the obtained cross-sectional photograph.

[0059] The distance H2 and the radius of curvature R2 can be determined, for example, as follows. A cross-sectional photograph of the element body 3 is obtained. The cross-sectional photograph is a photograph of a cross section of the feedthrough capacitor C1 cut along a plane perpendicular to the main surface 3a and the side surface 3c. The cross-sectional photograph is, for example, a photograph of a cross section of the feedthrough capacitor C1 cut along a plane parallel to the pair of end faces 3e and equidistant from the pair of end faces 3e. The distance H2 and the radius of curvature R2 are determined on the obtained cross-sectional photograph.

[0060] Next, the relationship between the distance T1, the distance H1, and the radius of curvature R1 will be described in detail. The inventors conducted the following test to clarify the relationship between the distance T1, the distance H1, and the radius of curvature R1. In this test, the inventors prepared samples 1 to 13 with different distances T1, H1, and the radius of curvature R1, and checked the changes in characteristics, the penetration of plating solution, and the occurrence of chipping for each of the samples 1 to 13. The results are shown in Figure 6. Figure 6 is a table showing the test results for each sample.

[0061] Each of Samples 1 to 13 is a lot containing multiple specimens. The specimens of Samples 1 to 13 are multilayer feedthrough capacitors having the same configuration except for differences in the spacing T1, spacing H1, and radius of curvature R1, as well as differences in the height of element body 3 (length of element body 3 in first direction D1) and the number of multiple internal conductors. In the specimens of Samples 1 to 13, the length of element body 3 is 2.0 mm and the width of element body 3 is 1.2 mm. In each specimen of Sample 1, the height of the element body 3 is 845 μm, the interval T1 is 85 μm, the interval H1 is 195 μm, and the radius of curvature R1 is 110 μm. In each specimen of Sample 2, the height of the element body 3 is 845 μm, the interval T1 is 81 μm, the interval H1 is 170 μm, and the radius of curvature R1 is 150 μm. In each specimen of sample 3, the height of element body 3 is 845 μm, the interval T1 is 85 μm, the interval H1 is 279 μm, and the radius of curvature R1 is 103 μm. In each specimen of Sample 4, the height of the element body 3 is 848 μm, the interval T1 is 79 μm, the interval H1 is 175 μm, and the radius of curvature R1 is 188 μm. In each specimen of Sample 5, the height of the element body 3 is 850 μm, the interval T1 is 40 μm, the interval H1 is 183 μm, and the radius of curvature R1 is 70 μm. In each specimen of sample 6, the height of element body 3 is 790 μm, the interval T1 is 70 μm, the interval H1 is 191 μm, and the radius of curvature R1 is 98 μm. In each specimen of sample 7, the height of element body 3 is 850 μm, the interval T1 is 60 μm, the interval H1 is 230 μm, and the radius of curvature R1 is 100 μm. In each specimen of Sample 8, the height of the element body 3 is 845 μm, the interval T1 is 87 μm, the interval H1 is 106 μm, and the radius of curvature R1 is 76 μm. In each specimen of Sample 9, the height of the element body 3 is 838 μm, the interval T1 is 90 μm, the interval H1 is 136 μm, and the radius of curvature R1 is 67 μm. In each specimen of sample 10, the height of element body 3 is 838 μm, the interval T1 is 95 μm, the interval H1 is 111 μm, and the radius of curvature R1 is 60 μm. In each specimen of sample 11, the height of element body 3 is 855 μm, the interval T1 is 49 μm, the interval H1 is 166 μm, and the radius of curvature R1 is 69 μm. In each specimen of sample 12, the height of element body 3 is 855 μm, the interval T1 is 49 μm, the interval H1 is 166 μm, and the radius of curvature R1 is 60 μm. In each specimen of Sample 13, the height of the element body 3 is 845 μm, the interval T1 is 81 μm, the interval H1 is 154 μm, and the radius of curvature R1 is 105 μm. The values of the distance T1, the distance H1, and the radius of curvature R1 were determined for each of the samples 1 to 13 from one specimen arbitrarily selected from a plurality of specimens according to the above-mentioned method.

[0062] The change in properties is confirmed as follows. For each of samples 1 to 13, one specimen is randomly selected from the multiple specimens. The capacitance of the selected specimen is measured. A deflection strength test is performed on the specimen whose capacitance has been measured. After the deflection strength test, the capacitance of the specimen is measured again. Based on the capacitance measurement results, the rate of change in capacitance before and after the deflection strength test is determined. For specimens whose rate of change in capacitance is less than 5%, the state of change in characteristics is determined to be "good (G)". For specimens whose rate of change in capacitance is 5% or more, the state of change in characteristics is determined to be "fail (F)". Multilayer feedthrough capacitors whose rate of change in capacitance is less than 5% are likely to be suitable for practical use.

[0063] The deflection strength test is carried out as follows. The selected specimen is solder-mounted in the center of a test board (glass epoxy board). The size of the test board is 100 mm x 40 mm, and the thickness of the test board is 1.0 mm. The test board with the specimen solder-mounted is placed on two supports arranged in parallel with a 90 mm gap between them. The test board is placed so that the surface on which the specimen is solder-mounted faces downward. Then, a bending stress is applied to the center of the test board from the back side of the surface on which the specimen is solder-mounted, so that the amount of deflection of the test board reaches the desired value. In this test, the amount of deflection of the test board is 15 mm.

[0064] The penetration of plating solution and the occurrence of chipping are confirmed by observing the cross section of the specimen when determining the values of the distance T1, the distance H1, and the radius of curvature R1. The penetration of plating solution and the occurrence of chipping may also be confirmed by observing the cross section of a specimen randomly selected from multiple specimens. The presence or absence of infiltration of plating solution is determined based on whether or not plating solution is present at the interface between the element body 3 and the external electrode 5. A specimen in which plating solution is not present at the above-mentioned interface is judged as "good (G)". A specimen in which plating solution is present at the above-mentioned interface is judged as "fail (F)". The presence or absence of infiltration of plating solution may also be determined based on whether or not elements constituting the plating layer are present at the above-mentioned interface. The occurrence of chipping was confirmed by determining whether the chipping occurred in the region R3a1 or region R 3a1 The judgment is based on whether or not a chip exists near the chip. A sample without a chip is judged as "Good (G)". A sample with a chip is judged as "Fail (F)".

[0065] As shown in Fig. 6, the results of the above tests confirmed that Samples 1 to 7 had a sufficiently low rate of change in capacitance. That is, it was confirmed that Samples 1 to 7 were able to suppress deterioration of characteristics. It was confirmed that Samples 1 to 3 and Samples 5 to 7 were able to suppress penetration of plating solution. It was confirmed that Samples 1 to 4, Sample 6, and Sample 7 were less likely to chip.

[0066] Next, the relationship between the distance T1, the distance H2, and the radius of curvature R2 will be described in detail. The inventors conducted the following test to clarify the relationship between the distance T1, the distance H2, and the radius of curvature R2. In this test, the inventors prepared samples 14 to 18 with different distances T1, H2, and the radius of curvature R2, and checked the changes in characteristics, the penetration of plating solution, and the occurrence of chipping for each of the samples 14 to 18. The results are shown in Figure 7. Figure 7 is a table showing the test results for each sample.

[0067] Each of Samples 14 to 18 is a lot containing multiple specimens. The specimens of Samples 14 to 18 are multilayer feedthrough capacitors having the same configuration except for differences in the spacing T1, spacing H1, H2, and radii of curvature R1, R2, as well as the height of the element body 3 and the number of multiple internal conductors. In the specimens of Samples 14 to 18, the length of the element body 3 is 2.0 mm, and the width of the element body 3 is 1.2 mm. In each specimen of Sample 14, the height of element body 3 is 845 μm, the interval T1 is 85 μm, the interval H1 is 195 μm, the radius of curvature R1 is 130 μm, the interval H2 is 221 μm, and the radius of curvature R2 is 127 μm. In each specimen of Sample 15, the height of element body 3 is 845 μm, the interval T1 is 85 μm, the interval H1 is 185 μm, the radius of curvature R1 is 123 μm, the interval H2 is 183 μm, and the radius of curvature R2 is 120 μm. In each specimen of Sample 16, the height of element body 3 is 846 μm, the interval T1 is 85 μm, the interval H1 is 268 μm, the radius of curvature R1 is 122 μm, the interval H2 is 268 μm, and the radius of curvature R2 is 120 μm. In each specimen of Sample 17, the height of element body 3 is 845 μm, the interval T1 is 45 μm, the interval H1 is 195 μm, the radius of curvature R1 is 70 μm, the interval H2 is 194 μm, and the radius of curvature R2 is 70 μm. In each specimen of sample 18, the height of element body 3 is 845 μm, the interval T1 is 72 μm, the interval H1 is 196 μm, the radius of curvature R1 is 218 μm, the interval H2 is 195 μm, and the radius of curvature R2 is 210 μm. The values of the distance T1, the distances H1 and H2, and the radii of curvature R1 and R2 were determined for each of Samples 14 to 18 from one specimen arbitrarily selected from a plurality of specimens according to the above-mentioned method.

[0068] The change in properties is confirmed as follows. For each of Samples 14 to 18, the rate of change in capacitance before and after the flexure strength test was determined, as with Samples 1 to 13. Samples with a rate of change in capacitance of less than 5% were judged to have a "good" (G) state of change in characteristics. Samples with a rate of change in capacitance of 5% or more were judged to have a "fail" (F) state of change in characteristics.

[0069] The penetration of plating solution and the occurrence of chipping are confirmed by observing the cross section of the specimen when determining the values of the distance T1, the distance H1, and the radius of curvature R1, and by observing the cross section of the specimen when determining the values of the distance H2 and the radius of curvature R2. The penetration of plating solution and the occurrence of chipping may also be confirmed by observing the cross section of a specimen randomly selected from multiple specimens. The presence or absence of infiltration of plating solution is determined based on whether plating solution is present at the interface between element body 3 and external electrode 5, and whether plating solution is present at the interface between element body 3 and external electrode 6. As with samples 1 to 13, specimens in which plating solution is not present at the above-mentioned interfaces are judged as "good (G)." Specimens in which plating solution is present at the above-mentioned interfaces are judged as "fail (F)." The occurrence of chipping was confirmed by determining whether the chipping occurred in the region R 3a1 or region R 3a1 and whether the chip exists in the vicinity of the region R 3a2 or region R 3a2 As with samples 1 to 13, specimens without chips are judged as "good (G)." Specimens with chips are judged as "fail (F)."

[0070] As shown in FIG. 7, the results of the above tests confirmed that Samples 14 to 18 had a sufficiently low rate of change in capacitance. That is, it was confirmed that Samples 14 to 18 were able to suppress deterioration of characteristics. It was confirmed that Samples 14 to 17 were able to suppress penetration of plating solution. In Sample 18, plating solution was present at the interface between element body 3 and external electrode 5 and the interface between element body 3 and external electrode 6. It was confirmed that Samples 14 to 16 and Sample 18 were less likely to chip.

[0071] In a multilayer feedthrough capacitor C1 solder-mounted to an electronic device, stress acts on the element body 3, for example, from an end of the external electrode 5 on the main surface 3a. In this case, a crack originates in the element body 3 at a position corresponding to the end of the external electrode 5 on the main surface 3a. The crack grows, for example, from the aforementioned origin toward the end face 3e in a direction intersecting with the imaginary plane PL1. If the angle of the direction in which the crack grows within the element body 3 relative to the imaginary plane PL1 is large, the crack is likely to reach the internal electrodes 7, 9. If this angle is small, the crack is unlikely to reach the internal electrodes 7, 9.

[0072] In the feedthrough multilayer capacitor C1, the interval T1 (μm), the interval H1 (μm), and the radius of curvature R1 (μm) are: H1 / 2>T1 R1>T1 Therefore, even if a crack occurs in the element body 3, the crack is unlikely to reach the internal electrodes 7, 9. As a result, the multilayer feedthrough capacitor C1 suppresses deterioration of its characteristics.

[0073] In the feedthrough multilayer capacitor C1, the reason why cracks originating from the external electrode 5 are unlikely to reach the internal electrodes 7, 9 is believed to be due to the following phenomenon. The interval T1 and the radius of curvature R1 are R1>T1 In a feedthrough capacitor C1 that satisfies the above relationship, molten solder is more likely to flow between the external electrodes 5 and the lands of the electronic device during solder mounting than in a feedthrough capacitor that does not satisfy this relationship. Therefore, in the feedthrough capacitor C1, the amount of solder that flows between the external electrodes 5 and the lands of the electronic device increases, and the size of the solder fillet tends to decrease. As the size of the solder fillet decreases, the position at which an external force from the electronic device acts on the feedthrough capacitor C1 tends to become lower. When the position at which an external force from the electronic device acts on the feedthrough capacitor C1 is low, the angle at which a crack caused by the external electrodes 5 grows within the element body 3 tends to become smaller. The interval T1 and the interval H1 are H1 / 2>T1 In the multilayer feedthrough capacitor C1 that satisfies the above relationship, the internal electrode 7 that is closest to the imaginary plane PL1 among the multiple internal electrodes tends to be farther away from the imaginary plane PL1 than in a multilayer feedthrough capacitor that does not satisfy the above relationship. Therefore, even if a crack grows inside the element body 3, the crack is less likely to reach the internal electrodes 7, 9.

[0074] In the multilayer feedthrough capacitor C1, the external electrode 5 includes a first electrode layer E1 and a second electrode layer E2. The second electrode layer E2 is formed by a plating method. In the plating method, for example, the element body 3 on which the first electrode layer E1 is arranged is immersed in a plating solution. In this case, the plating solution may penetrate into the element body 3. The plating solution may penetrate into the element body 3, for example, from the end 7e of the internal electrode 7 or the interface between the end 7e and the element body 3. In a multilayer feedthrough capacitor C1 in which the plating solution has penetrated into the element body 3, the characteristics may deteriorate. In the feedthrough capacitor C1, in which the main surface 3 a is curved at the end where it is joined to the end face 3 e, the thickness of the first electrode layer E1 tends to decrease at the end of the main surface 3 a, and in this case, the plating solution is likely to penetrate into the first electrode layer E1 from a region corresponding to the end of the main surface 3 a.

[0075] The interval H1 (μm) and the radius of curvature R1 (μm) are H1>R1 In a configuration that satisfies the above relationship, the plating solution is unlikely to penetrate into the element body 3. Therefore, the multilayer feedthrough capacitor C1 having this configuration reliably suppresses deterioration in its characteristics.

[0076] In a configuration in which the radius of curvature R1 is larger than the radius of curvature of the end face 3e at the end connected to the principal face 3b, the principal faces 3a and 3b are reliably distinguished from each other. Therefore, the multilayer feedthrough capacitor C1 having this configuration can be solder-mounted on an electronic device so that the principal face 3a faces the electronic device reliably.

[0077] In a multilayer feedthrough capacitor C1 solder-mounted to an electronic device, stress acts on the element body 3, for example, from an end of the external electrode 6 on the main surface 3a. In this case, a crack occurs in the element body 3, starting from a position corresponding to the end of the external electrode 6 on the main surface 3a. The crack grows, for example, from the starting point described above toward the side surface 3c in a direction intersecting with the imaginary plane PL1. If the angle of the direction in which the crack grows within the element body 3 relative to the imaginary plane PL1 is large, the crack is likely to reach the internal electrodes 7, 9. If this angle is small, the crack is unlikely to reach the internal electrodes 7, 9.

[0078] The interval T1 (μm) and the interval H2 (μm) are H2 / 2>T1 In a configuration that satisfies this relationship, even if a crack originating from the external electrode 6 occurs in the element body 3, the crack is unlikely to reach the internal electrodes 7, 9. Therefore, the multilayer feedthrough capacitor C1 having this configuration further suppresses deterioration in its characteristics.

[0079] In the feedthrough multilayer capacitor C1, the reason why cracks originating from the external electrode 6 are unlikely to reach the internal electrodes 7, 9 is believed to be due to the following phenomenon. The interval T1 and the interval H2 are H2 / 2>T1 In the multilayer feedthrough capacitor C1 that satisfies the above relationship, the internal electrode 9 that is closest to the imaginary plane PL1 among the multiple internal electrodes tends to be farther away from the imaginary plane PL1 than in a multilayer feedthrough capacitor that does not satisfy the above relationship. Therefore, even if a crack grows inside the element body 3, the crack is less likely to reach the internal electrodes 7, 9.

[0080] The distance T1 (μm) and the radius of curvature R2 (μm) are R2>T1 In a configuration that satisfies this relationship, even if a crack originating from the external electrode 6 occurs in the element body 3, the crack is more unlikely to reach the internal electrodes 7, 9. The multilayer feedthrough capacitor C1 having this configuration further suppresses deterioration of its characteristics.

[0081] In the feedthrough multilayer capacitor C1, the reason why cracks originating from the external electrode 6 are unlikely to reach the internal electrodes 7, 9 is thought to be due to the following phenomenon. The interval T1 and the radius of curvature R2 are R2>T1 In a feedthrough capacitor C1 that satisfies the above relationship, molten solder is more likely to flow between the external electrodes 6 and the pad electrodes of the electronic device during solder mounting than in a feedthrough capacitor that does not satisfy this relationship. Therefore, in the feedthrough capacitor C1, the amount of solder that flows between the external electrodes 6 and the pad electrodes of the electronic device increases, and the size of the solder fillet tends to decrease. As the size of the solder fillet decreases, the position at which an external force from the electronic device acts on the feedthrough capacitor C1 tends to become lower. When the position at which the external force from the electronic device acts on the feedthrough capacitor C1 is low, the angle at which a crack caused by the external electrodes 6 grows within the element body 3 tends to become smaller.

[0082] In the multilayer feedthrough capacitor C1, the external electrode 6 includes a first electrode layer E1 and a second electrode layer E2. The second electrode layer E2 is formed by a plating method. In the plating method, for example, the element body 3 on which the first electrode layer E1 is arranged is immersed in a plating solution. In this case, the plating solution may penetrate into the element body 3. The plating solution may penetrate into the element body 3, for example, from the end 9e of the internal electrode 9 or the interface between the end 9e and the element body 3. In a multilayer feedthrough capacitor C1 in which the plating solution has penetrated into the element body 3, the characteristics may deteriorate. In the feedthrough capacitor C1, in which the main surface 3 a is curved at the end where it is joined to the side surface 3 c, the thickness of the first electrode layer E1 tends to decrease at the end of the main surface 3 a, and in this case, the plating solution is likely to penetrate into the first electrode layer E1 from a region corresponding to the end of the main surface 3 a.

[0083] The distance H2 (μm) and the radius of curvature R2 (μm) are H2>R2 In a configuration that satisfies the above relationship, the plating solution is unlikely to penetrate into the element body 3. Therefore, the multilayer feedthrough capacitor C1 having this configuration reliably suppresses deterioration in its characteristics.

[0084] Even in a configuration in which the radius of curvature R2 is larger than the radius of curvature of the side surface 3c at the end connected to the principal surface 3b, the principal surfaces 3a and 3b can be reliably distinguished from each other. Therefore, the multilayer feedthrough capacitor C1 having this configuration can be solder-mounted on an electronic device so that the principal surface 3a faces the electronic device more reliably.

[0085] During the manufacturing process, chipping may occur in the element body 3. For example, an impact is applied to the element body 3 when the element bodies 3 collide with each other or when the element body 3 collides with manufacturing equipment other than the element body 3. When an impact is applied to the element body 3, the possibility of chipping occurring in the element body 3 increases.

[0086] The interval T1 (μm) is T1>45 A configuration that satisfies the above relationship prevents chipping from occurring in the element body 3.

[0087] In a configuration in which the internal electrodes 7, 9 face each other in the direction in which the principal surface 3a and the principal surface 3b face each other, if a crack occurs in the element body 3, the characteristics are likely to deteriorate. However, as described above, even if a crack occurs in the element body 3, the crack is unlikely to reach the internal electrodes 7, 9. Therefore, in the multilayer feedthrough capacitor C1 having this configuration, deterioration of the characteristics is also reliably suppressed.

[0088] Next, the configuration of the electronic component device will be described with reference to Fig. 8 and Fig. 9. Fig. 8 and Fig. 9 are diagrams showing the cross-sectional configuration of the electronic component device. In Fig. 8 and Fig. 9, hatching indicating a cross section is omitted. The electronic component device includes a multilayer feedthrough capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or another electronic component. The multilayer feedthrough capacitor C1 is solder-mounted to the electronic device ED. The electronic device ED includes a main surface EDa and a pair of pad electrodes PE1 and a pair of pad electrodes PE2. The pad electrodes PE1 and PE2 are arranged on the main surface EDa. The pair of pad electrodes PE1 and the pair of pad electrodes PE2 are spaced apart from each other. The multilayer feedthrough capacitor C1 is arranged in the electronic device ED so that the main surface 3a and the main surface EDa face each other. When the multilayer feedthrough capacitor C1 is solder-mounted, molten solder wets and rises on each of the external electrodes 5, 6 (second electrode layers E2). When the wetted solder solidifies, a solder fillet SF is formed on each of the external electrodes 5, 6. The corresponding external electrode 5 and pad electrode PE1 are connected via the solder fillet SF. The corresponding external electrode 6 and pad electrode PE2 are connected via the solder fillet SF.

[0089] Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0090] In the above-described embodiment, a feedthrough capacitor has been described as an example of an electronic component, but applicable electronic components are not limited to feedthrough capacitors. The electronic component may include, for example, a normal multilayer capacitor instead of a feedthrough capacitor. The structure of the multilayer capacitor C2 will be described with reference to Fig. 10. Fig. 10 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. In Fig. 10, hatching indicating a cross section is omitted. 10, the multilayer capacitor C2 includes an element body 3, a pair of external electrodes 5 and 6, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. The pair of external electrodes 5 and 6 are respectively arranged at both ends of the element body 3 in the second direction D2. The external electrode 5 is arranged on one of the pair of end faces 3e. The external electrode 6 is arranged on the other of the pair of end faces 3e. The multiple internal electrodes 7 are exposed on one end face 3e. Each internal electrode 7 includes an end 7e exposed on one end face 3e. The multiple internal electrodes 7 are not exposed on the other end face 3e. The multiple internal electrodes 7 are physically and electrically connected to the external electrode 5. The multiple internal electrodes 9 are exposed on the other end face 3e. Each internal electrode 9 includes an end 9e exposed on the other end face 3e. The multiple internal electrodes 9 are not exposed on one end face 3e. The multiple internal electrodes 9 are physically and electrically connected to the external electrode 6. As can be seen from the test results for Samples 1 to 7, the multilayer capacitor C2 also suppresses the deterioration of its characteristics.

[0091] The electronic component may include, instead of the multilayer capacitor C2, a multilayer capacitor including an element body 3, a pair of external electrodes respectively disposed at both ends of the element body 3 in the third direction D3, and a plurality of internal electrodes each connected to a corresponding one of the pair of external electrodes. The electronic component may include, in addition to the multilayer capacitor, a multilayer electronic component such as a multilayer inductor, a multilayer varistor, a multilayer piezoelectric actuator, a multilayer thermistor, a multilayer solid-state battery component, or a multilayer composite component, or an electronic component other than a multilayer electronic component.

[0092] As can be understood from the above description of the embodiments and modifications, the present specification includes disclosure of the following aspects. (Appendix 1) an element body including a first main surface constituting a mounting surface, a second main surface opposite to the first main surface, and an end surface connecting the first main surface and the second main surface; a plurality of external electrodes disposed on the element body; a plurality of internal conductors disposed within the element body and including exposed ends exposed from the element body; the first main surface is curved at an end connected to the end surface; the plurality of external electrodes include a first external electrode disposed on the first main surface and the end surface, the plurality of internal conductors include a plurality of first internal conductors, the exposed ends of which are connected to the first external electrode; Among the plurality of internal conductors, a distance T1 (μm) between an internal conductor adjacent to the first main surface and an imaginary plane that is in contact with the first main surface and parallel to the second main surface in a direction perpendicular to the imaginary plane; a distance H1 (μm) between an exposed end closest to the imaginary plane and the imaginary plane among the exposed ends connected to the first external electrode; and a radius of curvature R1 (μm) of the first main surface at the end connected to the end face are H1 / 2>T1 R1>T1 Satisfying the relationship between electronic components. (Appendix 2) The interval H1 (μm) and the radius of curvature R1 (μm) are H1>R1 The electronic component according to Supplementary Note 1, which satisfies the relationship: (Appendix 3) the end surface is curved at an end connected to the second main surface; the first external electrode is also disposed on the second main surface, 3. The electronic component according to claim 1, wherein the radius of curvature R1 is greater than the radius of curvature of the end surface at the end connected to the second main surface. (Appendix 4) the element body includes a side surface connecting the first main surface and the second main surface and adjacent to the end surface, the plurality of external electrodes include a second external electrode disposed on the first main surface and the side surface, the plurality of internal conductors include a plurality of second internal conductors, the exposed ends of which are connected to the second external electrodes; The interval T1 (μm), and the interval H2 (μm) between the exposed end connected to the second external electrode that is closest to the imaginary plane and the imaginary plane in the direction perpendicular to the imaginary plane, are H2 / 2>T1 4. The electronic component according to any one of claims 1 to 3, which satisfies the following relationship: (Appendix 5) the first main surface is curved at an end connected to the side surface; The interval T1 (μm) and the radius of curvature R2 (μm) of the first main surface at the end connected to the side surface are R2>T1 The electronic component according to Supplementary Note 4, which satisfies the relationship: (Appendix 6) The interval H2 (μm) and the radius of curvature R2 (μm) are H2>R2 The electronic component according to Supplementary Note 5, which satisfies the relationship: (Appendix 7) the side surface is curved at an end connected to the second major surface; the second external electrode is also disposed on the second main surface, 7. The electronic component according to claim 5, wherein the radius of curvature R2 is greater than the radius of curvature of the side surface at the end connected to the second main surface. (Appendix 8) The interval T1 (μm) is T1>45 8. The electronic component according to any one of claims 1 to 7, which satisfies the following relationship: (Appendix 9) 9. The electronic component according to any one of claims 1 to 8, wherein the plurality of internal conductors face each other in a direction in which the first main surface and the second main surface face each other. (Appendix 10) An electronic component according to any one of Supplementary Notes 1 to 9; an electronic device to which the electronic component is solder-mounted, The first main surface faces the electronic device. [Explanation of symbols]

[0093] 3...Element body, 3a, 3b...main surface, 3c...side surface, 3e...end surface, 5,6...external electrode, 7,9...internal electrode, 7e,9e...end, C1...through-layer capacitor, C2...multilayer capacitor, H1, H2, T1...interval, PL1...virtual plane, R1, R2...radius of curvature.

Claims

1. an element body including a first main surface constituting a mounting surface, a second main surface opposite to the first main surface, and an end surface connecting the first main surface and the second main surface; a plurality of external electrodes disposed on the element body; a plurality of internal conductors disposed within the element body and including exposed ends exposed from the element body; the first main surface is curved at an end connected to the end surface; the plurality of external electrodes include a first external electrode disposed on the first main surface and the end surface, the plurality of internal conductors include a plurality of first internal conductors, the exposed ends of which are connected to the first external electrode; Among the plurality of internal conductors, a distance T1 (μm) between an internal conductor adjacent to the first main surface and an imaginary plane that is in contact with the first main surface and parallel to the second main surface in a direction perpendicular to the imaginary plane; a distance H1 (μm) between an exposed end closest to the imaginary plane and the imaginary plane among the exposed ends connected to the first external electrode; and a radius of curvature R1 (μm) of the first main surface at the end connected to the end face are H1 / 2>T1 R1>T1 Satisfying the relationship between electronic components.

2. The interval H1 (μm) and the radius of curvature R1 (μm) are H1>R1 The electronic component according to claim 1 , which satisfies the relationship:

3. the end surface is curved at an end connected to the second main surface; the first external electrode is also disposed on the second main surface, The electronic component according to claim 1 , wherein the radius of curvature R1 is greater than the radius of curvature of the end face at the end connected to the second main surface.

4. the element body includes a side surface connecting the first main surface and the second main surface and adjacent to the end surface, the plurality of external electrodes include a second external electrode disposed on the first main surface and the side surface, the plurality of internal conductors include a plurality of second internal conductors, the exposed ends of which are connected to the second external electrodes; The distance T1 (μm), and the distance H2 (μm) between the exposed end connected to the second external electrode that is closest to the imaginary plane and the imaginary plane in the direction perpendicular to the imaginary plane, are H2 / 2>T1 The electronic component according to claim 1 , which satisfies the relationship:

5. the first main surface is curved at an end connected to the side surface; The interval T1 (μm) and the radius of curvature R2 (μm) of the first main surface at the end connected to the side surface are R2>T1 The electronic component according to claim 4 , which satisfies the relationship:

6. The interval H2 (μm) and the radius of curvature R2 (μm) are H2>R2 The electronic component according to claim 5 , which satisfies the relationship:

7. the side surface is curved at an end connected to the second major surface; the second external electrode is also disposed on the second main surface, The electronic component according to claim 5 or 6, wherein the radius of curvature R2 is larger than the radius of curvature of the side surface at the end connected to the second main surface.

8. The interval T1 (μm) is T1>45 The electronic component according to claim 1 , which satisfies the relationship:

9. The electronic component according to claim 1 , wherein the plurality of internal conductors face each other in a direction in which the first main surface and the second main surface face each other.

Images