Power source device and lighting tool

Abstract

To provide a power source device and a lighting tool that can suppress a rise in temperature of a power source circuit associated with an operation of power conversion.SOLUTION: A power source device includes: a power source circuit which is connected to a light source module, is connected to a power source, converts power supplied from the power source into power matching the light source module, and supplies the converted power to the light source module to turn on the light source module; and a case which has an inner space capable of housing the power source circuit, and houses the power source circuit in the inner space. The case has an inner surface facing the inner space side, and an outer surface facing the outside. An emissivity of at least part of the inner surface of the case is higher than an emissivity of at least part of the outer surface of the case.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD An embodiment of the present invention relates to a power supply device and a lighting fixture. [Background technology]

[0002] A lighting fixture is known that includes a light source module having a light source such as an LED, and a power supply device that supplies power to the light source module to light it up. The power supply device includes a power circuit and a case. The power circuit converts power supplied from a power source into power appropriate for the light source module and supplies the converted power to the light source module to light it up. The case has an internal space that can accommodate the power circuit, and the power circuit is housed within the internal space.

[0003] In such a power supply device, it is desirable to be able to suppress the temperature rise of the power supply circuit that accompanies the power conversion operation. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-273361 Summary of the Invention [Problem to be solved by the invention]

[0005] The embodiments of the present invention provide a power supply device and a lighting fixture that can suppress a rise in temperature of a power supply circuit that accompanies a power conversion operation. [Means for solving the problem]

[0006] According to an embodiment, a power supply device is provided that includes: a power supply circuit that is connected to a light source module and a power source, converts power supplied from the power source into power appropriate for the light source module, and supplies the converted power to the light source module, thereby lighting the light source module; and a case that has an internal space capable of accommodating the power supply circuit and accommodates the power supply circuit within the internal space, wherein the case has an inner surface facing the internal space and an outer surface facing outward, and the emissivity of at least a portion of the inner surface of the case is higher than the emissivity of at least a portion of the outer surface of the case. [Effects of the Invention]

[0007] It is possible to provide a power supply device and a lighting fixture that can suppress the temperature rise of the power supply circuit that accompanies the power conversion operation. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a block diagram schematically illustrating a lighting fixture according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view schematically illustrating an example of a case according to an embodiment. [Figure 3] FIG. 10 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. [Figure 4] FIG. 10 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. [Figure 5] FIG. 10 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. [Figure 6] FIG. 10 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. [Figure 7] FIG. 10 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Each embodiment will be described below with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Furthermore, even when the same part is shown, the dimensions and ratios may be different depending on the drawing. In the present specification and the drawings, elements similar to those described above with reference to the previous drawings are designated by the same reference numerals, and detailed descriptions thereof will be omitted as appropriate.

[0010] FIG. 1 is a block diagram schematically illustrating a lighting fixture according to an embodiment. 1, the lighting fixture 2 includes a power supply device 10 and a light source module 12. The power supply device 10 is connected to the light source module 12 and supplies power to the light source module 12, thereby lighting the light source module 12.

[0011] The light source module 12 is provided, for example, separately from the power supply device 10 and connected to the power supply device 10 via wiring. The light source module 12 is also detachably connected to the power supply device 10, for example, via a connector or the like. However, the light source module 12 does not necessarily have to be detachable from the power supply device 10.

[0012] The light source module 12 includes a light source 12a. The light source 12a is, for example, a light-emitting diode (LED). The light source 12a may be, for example, an organic light-emitting diode (OLED), an inorganic electroluminescence (EL) light-emitting element, an organic electroluminescence (EL) light-emitting element, or other electroluminescence-type light-emitting element. The light source 12a may be, for example, a light bulb. The light source 12a may be any light source that can emit light based on power supplied from the power supply device 10. The light source module 12 may include, for example, multiple light sources 12a connected in series, parallel, or series-parallel. The number of light sources 12a provided in the light source module 12 may be any number.

[0013] The power supply device 10 is installed, for example, in a space above the ceiling. The light source module 12 is attached to the ceiling of a building, for example, through an opening in the ceiling, and emits light into the room. The light source module 12 is, for example, a downlight. However, the configuration of the lighting fixture 2 is not limited to the above. For example, the power supply device 10 may be attached to the ceiling of a building together with the light source module 12. Furthermore, the installation position of the lighting fixture 2 is not limited to the ceiling, and may be any position where light needs to be emitted. The lighting fixture 2 may be installed, for example, on an exterior wall or a support pole outdoors. The method of installing the lighting fixture 2 to a building or the like may be any method that allows the lighting fixture 2 to be installed appropriately.

[0014] The power supply device 10 includes a power supply circuit 20 and a case 22. The power supply circuit 20 is connected to the light source module 12 and also to a power supply PS. The power supply circuit 20 converts the power supplied from the power supply PS into power appropriate for the light source module 12, and supplies the converted power to the light source module 12, thereby lighting the light source module 12.

[0015] The power supplied by the power source PS is, for example, AC power. The power source PS is, for example, a commercial power source. Furthermore, when the light source 12a is a light-emitting diode, the power supplied to the light source module 12 is DC power. The power supply circuit 20 converts, for example, the AC power supplied from the power source PS into DC power appropriate for the light source module 12, and supplies the converted DC power to the light source module 12.

[0016] The power supply circuit 20 is configured, for example, by a substrate 20a and a plurality of elements 20b mounted on the substrate 20a. The power supply circuit 20 has, for example, a rectifier circuit that rectifies AC power supplied from the power source PS, and a conversion circuit that converts the power rectified by the rectifier circuit into DC power. The conversion circuit has, for example, a switching element, and by switching the switching element, converts the rectified power into DC power of an arbitrary magnitude corresponding to the light source module 12. In other words, the plurality of elements 20b configure the rectifier circuit and the conversion circuit.

[0017] However, the power supplied by the power supply PS is not limited to AC power and may be DC power or the like. The power supplied to the light source module 12 is not limited to DC power and may be any power suitable for the light source 12a. The configuration of the power supply circuit 20 is not limited to the above and may be any configuration that can convert the power supplied from the power supply PS into power suitable for the light source module 12 and supply the converted power to the light source module 12. The configuration of the power supply circuit 20 may be set appropriately depending on the type of power supplied from the power supply PS, the configuration of the light source module 12, etc.

[0018] The case 22 has an internal space 30 capable of housing the power supply circuit 20, and houses the power supply circuit 20 within the internal space 30. In other words, the case 22 covers the periphery of the power supply circuit 20. For example, the case 22 covers the entire periphery of the power supply circuit 20. Furthermore, the case 22 supports the power supply circuit 20 with the power supply circuit 20 housed within the internal space 30. In other words, the power supply circuit 20 is attached within the internal space 30 of the case 22.

[0019] The case 22 is disposed near the light source module 12 when it is properly installed in, for example, an attic space (normal use state). In other words, the power supply device 10 is disposed near the light source module 12. The case 22 is disposed within an area that is affected by heat generated by the light emitted from the light source module 12, for example. The temperature of the case 22 rises due to the heat generated by the light source module 12 when the light source module 12 is turned on, for example. In other words, the temperature of the case 22 rises due to the radiant heat from the light source module 12. The distance between the case 22 and the light source module 12 is, for example, 20 cm or less.

[0020] The case 22 has an inner surface IS facing the internal space 30 and an outer surface ES facing outward. In other words, the inner surface IS of the case 22 is the surface that defines the internal space 30. In other words, the outer surface ES of the case 22 is the surface that is exposed to the outside.

[0021] The inner surface IS of the case 22 has, for example, an inner bottom surface 31 that covers the bottom of the power supply circuit 20 housed in the internal space 30, a ceiling surface 32 that covers the top of the power supply circuit 20 housed in the internal space 30, and an inner surface 33 that covers the sides of the power supply circuit 20 housed in the internal space 30. Here, the bottom, top, and sides of the power supply circuit 20 refer to, for example, the bottom, top, and sides of the power supply circuit 20 when the power supply device 10 is appropriately installed in a space above the ceiling or the like (in a normal operating state).

[0022] The case 22 has, for example, a base portion 40 that supports the power supply circuit 20, and a cover portion 42 that covers the power supply circuit 20 supported by the base portion 40. The base portion 40 is, for example, plate-shaped. The power supply circuit 20 is attached to the plate-shaped base portion 40 by, for example, screwing the board 20a. When the base portion 40 supports the power supply circuit 20, for example, the base portion 40 covers the lower side of the power supply circuit 20.

[0023] The cover 42 is, for example, in the shape of an open box that is open downward. The cover 42 is attached to the top of the base 40 by, for example, screws, etc., to cover the top and sides of the power supply circuit 20 supported by the base 40.

[0024] Therefore, in this example, the base portion 40 forms the inner bottom surface 31, and the cover portion 42 forms the ceiling surface 32 and the inner side surface 33.

[0025] In the power supply device 10, the emissivity of at least a portion of the inner surface IS of the case 22 is higher than the emissivity of at least a portion of the outer surface ES of the case 22. In other words, the absorptivity (spectral absorptivity) of at least a portion of the inner surface IS of the case 22 is higher than the absorptivity (spectral absorptivity) of at least a portion of the outer surface ES of the case 22. In other words, the surface roughness of at least a portion of the inner surface IS of the case 22 is higher than the surface roughness of at least a portion of the outer surface ES of the case 22.

[0026] The case 22 is made of a metal material such as aluminum, iron, copper, stainless steel, etc. In other words, the base portion 40 and the cover portion 42 are made of a metal material, for example. In other words, the case 22 is a metal case.

[0027] The base portion 40 has, for example, a plate-shaped metal portion 40a and a coating 40b provided on one surface of the plate-shaped metal portion 40a. The base portion 40 supports the power supply circuit 20 on the coating 40b side. The cover portion 42 has, for example, an open-box-shaped metal portion 42a and a coating 42b provided on the inner surface of the open-box-shaped metal portion 42a. The cover portion 42 covers the power supply circuit 20 on the coating 42b side.

[0028] At least a portion of the inner surface IS of the case 22 is a painted surface, and at least a portion of the outer surface ES of the case 22 is a metal surface. Generally, the surface roughness of a painted surface is rougher than the surface roughness of a metal surface. Therefore, the emissivity of a painted surface is higher than the emissivity of a metal surface. In this way, by painting the inner surface IS side of the case 22, the emissivity of at least a portion of the inner surface IS is made higher than the emissivity of at least a portion of the outer surface ES. For example, the case 22 is a metal case with a paint applied to the inner surface IS side, and by making at least a portion of the inner surface IS a painted surface and at least a portion of the outer surface ES a metal surface, the emissivity of at least a portion of the inner surface IS is made higher than the emissivity of at least a portion of the outer surface ES.

[0029] For example, as described above, the case 22 is painted on substantially the entire inner surface IS by painting one surface of the metal portion 40a of the base portion 40 and the inner surface of the metal portion 42a of the cover portion 42. As a result, the case 22 has a higher emissivity for substantially the entire inner surface IS than for substantially the entire outer surface ES. For example, the case 22 has a higher emissivity for substantially the entire inner bottom surface 31 than for substantially the entire outer surface ES, a higher emissivity for substantially the entire ceiling surface 32 than for substantially the entire outer surface ES, and a higher emissivity for substantially the entire inner surface 33 than for substantially the entire outer surface ES.

[0030] "Substantially the entirety of each surface" refers to, for example, 90% or more of the area of each surface. More specifically, the case 22 has a higher emissivity for 90% or more of the area of the inner surface IS than for 90% or more of the area of the outer surface ES. Similarly, the emissivity for 90% or more of the area of the inner bottom surface 31 is higher than the emissivity for 90% or more of the area of the outer surface ES. The emissivity for 90% or more of the area of the ceiling surface 32 is higher than the emissivity for 90% or more of the area of the outer surface ES. The emissivity for 90% or more of the area of the inner surface 33 is higher than the emissivity for 90% or more of the area of the outer surface ES.

[0031] For example, as shown in FIG. 1, it is conceivable that a portion of the paint applied to the base portion 40, the cover portion 42, etc., may be exposed on the outer surface ES. It is also conceivable that a sticker indicating the model number or manufacturer name of the power supply device 10 may be affixed to the outer surface ES, or that the model number or manufacturer name may be printed thereon. Therefore, the outer surface ES may include a portion with a higher emissivity than the inner surface IS. However, it is preferable that the area of the portion of the outer surface ES with a higher emissivity than the inner surface IS be smaller than the area of the portion with a lower emissivity than the inner surface IS.

[0032] Furthermore, it is possible that a portion of the inner surface IS is exposed to metal due to manufacturing reasons, for example. Therefore, the inner surface IS may include a portion with an emissivity lower than that of the outer surface ES. However, it is preferable that the area of the portion of the inner surface IS with an emissivity lower than that of the outer surface ES is smaller than the area of the portion with an emissivity higher than that of the outer surface ES.

[0033] Thus, in case 22, the overall emissivity of the inner surface IS does not necessarily have to be higher than the overall emissivity of the outer surface ES. However, in case 22, it is most preferable that the overall emissivity of the inner surface IS be higher than the overall emissivity of the outer surface ES.

[0034] As described above, in the power supply device 10 according to this embodiment, the emissivity of at least a portion of the inner surface IS of the case 22 is higher than the emissivity of at least a portion of the outer surface ES of the case 22. By making the emissivity of at least a portion of the inner surface IS of the case 22 higher than that of the outer surface ES in this way, when the temperature of the power supply circuit 20 rises due to the power conversion operation, it is possible to more easily transfer heat generated in the power supply circuit 20 to the case 22. In other words, it is possible to make it easier for the case 22 to absorb the heat generated in the power supply circuit 20. This allows the heat generated in the power supply circuit 20 to be more efficiently dissipated to the case 22.

[0035] Furthermore, in the power supply device 10 according to this embodiment, by making the emissivity of the outer surface ES of the case 22 lower than that of the inner surface IS, even when the case 22 is placed near the light source module 12, it is possible to make it easier for the outer surface ES to reflect the radiant heat from the light source module 12. In other words, it is possible to suppress absorption of the radiant heat from the light source module 12 by the outer surface ES. This also makes it possible to suppress an increase in the temperature of the case 22 (power supply device 10) due to the influence of the radiant heat from the light source module 12.

[0036] Therefore, in the power supply device 10 of this embodiment, compared to, for example, a configuration in which the inner surface IS and outer surface ES of the case 22 are each given the same surface treatment, or a configuration in which the emissivity of the outer surface ES side is increased by applying paint only to the outer surface ES side, the power supply device 10 can improve the heat dissipation properties of the heat generated in the power supply circuit 20 to the case 22, suppress the effects of radiant heat from the light source module 12, and suppress the rise in temperature of the power supply circuit 20 due to the power conversion operation.

[0037] Furthermore, in the power supply device 10 according to this embodiment, at least a portion of the inner surface IS is a painted surface, and at least a portion of the outer surface ES is a metallic surface, thereby making the emissivity of at least a portion of the inner surface IS higher than the emissivity of at least a portion of the outer surface ES. By making at least a portion of the inner surface IS a painted surface, heat generated in the power supply circuit 20 can be more easily transferred to the case 22. Furthermore, by making at least a portion of the outer surface ES a metallic surface, the effects of radiant heat from the light source module 12 can be further suppressed. Therefore, the temperature rise of the power supply circuit 20 due to the power conversion operation can be more appropriately suppressed.

[0038] In this case, it is preferable that the color of at least a portion of the painted surface of the inner surface IS (the color of the paint coatings 40b, 42b) be black. This allows for a higher emissivity than, for example, a case in which the painted surface is white. It is also preferable that the painted surface be matte. In other words, it is preferable to use a matte paint for painting at least a portion of the inner surface IS. This allows for a higher emissivity than, for example, a case in which the painted surface is glossy.

[0039] Note that the method for increasing the emissivity of at least a portion of the inner surface IS to be higher than the emissivity of at least a portion of the outer surface ES is not limited to painting. For example, the emissivity of at least a portion of the inner surface IS may be increased to be higher than the emissivity of at least a portion of the outer surface ES by, for example, surface treatment that increases the surface roughness of at least a portion of the inner surface IS. The method for increasing the emissivity of at least a portion of the inner surface IS to be higher than the emissivity of at least a portion of the outer surface ES is not limited to the above and may be any method that can appropriately set the emissivity.

[0040] Furthermore, in the power supply device 10 according to this embodiment, the emissivity of 90% or more of the area of the inner surface IS of the case 22 is higher than the emissivity of 90% or more of the area of the outer surface ES. This makes it easier to transfer heat generated in the power supply circuit 20 to the case 22, and also makes it possible to further suppress the effects of radiant heat from the light source module 12, thereby more appropriately suppressing the rise in temperature of the power supply circuit 20 due to the power conversion operation.

[0041] However, the size of the area of at least a portion of the inner surface IS where the emissivity is set to be high and the size of the area of at least a portion of the outer surface ES where the emissivity is set to be low are not limited to the above and may be any size.

[0042] FIG. 2 is a cross-sectional view schematically illustrating an example of a case according to the embodiment. 2, the cover portion 42 is attached to the base portion 40 by, for example, screws 44. In other words, the case 22 further has screws 44 for attaching the cover portion 42 to the base portion 40. Note that, for convenience, the power supply circuit 20 and the like are not shown in FIG.

[0043] As described above, the base portion 40 and the cover portion 42 are made of a metal material. The base portion 40 and the cover portion 42 are electrically conductive. If the outer surface ES is a metal surface, the outer surface ES is electrically conductive. On the other hand, if the inner surface IS is a painted surface, the inner surface IS is insulating.

[0044] For example, the potentials of the base portion 40 and the cover portion 42 may be set to ground potential in order to suppress electrical noise emitted from the power supply circuit 20. The base portion 40 is set to ground potential by, for example, being electrically connected to an external ground wire. The cover portion 42 is set to ground potential by being electrically connected to the base portion 40.

[0045] In this case, due to the influence of the painted surface on the base portion 40, it may be impossible to obtain an electrical connection by simply bringing the cover portion 42 into contact with the base portion 40. In this case, the cover portion 42 is electrically connected to the base portion 40 via the screws 44. The screws 44 are conductive and include, for example, a metal material.

[0046] Furthermore, for example, in a configuration in which both the inner surface IS and the outer surface ES of the case 22 are painted, even if the head of the screw 44 is brought into contact with the outer surface of the cover portion 42, the painted surface on the outer surface ES may prevent proper electrical connection between the base portion 40 and the cover portion 42. In this case, for example, it may be necessary to remove the paint from the portion that comes into contact with the head of the screw 44, which makes it difficult to electrically connect the base portion 40 and the cover portion 42. In other words, it is difficult to set the ground potential of the base portion 40 and the cover portion 42.

[0047] In contrast, in the power supply device 10 according to this embodiment, the outer surface ES is a metal surface, and the outer surface ES is conductive. In the power supply device 10, at least a portion of the outer surface of the cover portion 42 is a conductive metal surface. As a result, the base portion 40 and the cover portion 42 can be properly electrically connected simply by fastening the base portion 40 and the cover portion 42 together with the screws 44 and bringing the heads of the screws 44 into contact with the metal surface of the cover portion 42. In other words, by bringing the heads of the screws 44 into contact with the metal surface of the cover portion 42, the cover portion 42 is attached to the base portion 40 and electrically connected to the base portion 40. Therefore, in the power supply device 10 according to this embodiment, the electrical connection between the base portion 40 and the cover portion 42 can be reduced in complexity. In the power supply device 10 according to this embodiment, the base portion 40 and the cover portion 42 can be easily set to ground potential.

[0048] FIG. 3 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. It should be noted that components that are substantially the same in function and configuration as those in the above embodiment are given the same reference numerals and detailed explanations thereof will be omitted. 3, in the power supply device 10a, the base portion 40 of the case 22 is shaped like an open box with an open top, and the cover portion 42 of the case 22 is shaped like a plate. In the power supply device 10a, when the base portion 40 supports the power supply circuit 20, it covers the bottom and sides of the power supply circuit 20, and the cover portion 42 covers the top of the power supply circuit 20 supported by the base portion 40.

[0049] In this way, the configuration of the case 22 is not limited to a configuration having a plate-shaped base portion 40 and an open-box-shaped cover portion 42, but may also be a configuration having an open-box-shaped base portion 40 and a plate-shaped cover portion 42.

[0050] The case 22 may be configured to have, for example, a base portion 40 in the shape of an open box that is open at the top, and a cover portion 42 in the shape of an open box that is open at the bottom. In this case, when the base portion 40 supports the power supply circuit 20, it covers the bottom of the power supply circuit 20 and a part of the lower side of the power supply circuit 20, and the cover portion 42 covers the top of the power supply circuit 20 supported by the base portion 40 and another part of the upper side of the power supply circuit 20.

[0051] FIG. 4 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. 4, in power supply device 10b, cover portion 42 has side plate portions 50 and a top plate portion 52. Side plate portions 50 are attached to the top of plate-like base portion 40, thereby forming a frame-like (cylindrical) shape that covers the sides of power supply circuit 20 supported by base portion 40. Top plate portion 52 is attached to the top of side plate portions 50, thereby forming a plate-like shape that covers the top of power supply circuit 20 supported by base portion 40. That is, in power supply device 10b, side plate portions 50 and top plate portion 52 form cover portion 42 in the shape of an open box that is open at the bottom.

[0052] In this way, the case 22 is not limited to being made up of two members, but may be made up of a combination of three or more members. In the power supply device 10b, the base portion 40 is made up of one member, and the cover portion 42 is made up of two members (multiple members). Conversely, the base portion 40 may be made up of two members (multiple members), and the cover portion 42 may be made up of one member. Furthermore, each of the base portion 40 and the cover portion 42 may be made up of multiple members.

[0053] FIG. 5 is a block diagram that schematically illustrates a modified example of the power supply device according to the embodiment. As shown in FIG. 5, in the power supply device 10c, the case 22 is an open box having an opening for inserting and removing the power supply circuit 20 into and from the internal space 30. In this way, the case 22 is not limited to being made up of multiple members, and may be made up of a single member. For example, it is also possible to cover the opening of the case 22 with another member such as a terminal block (a terminal block for wiring between the power supply circuit 20 and the light source module 12, or between the power supply circuit 20 and the power source PS). In such a case, the case 22 may be made up of a single member.

[0054] FIG. 6 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. 6, in power supply device 10d, only the portion of inner surface IS of case 22 that constitutes ceiling surface 32 is painted. In other words, in power supply device 10d, paint coating 42b is provided only on the portion of cover 42 that constitutes ceiling surface 32.

[0055] In power supply device 10d, case 22 makes the emissivity of at least a portion of ceiling surface 32 higher than the emissivity of at least a portion of outer surface ES. For example, case 22 makes the emissivity of substantially the entire ceiling surface 32 higher than the emissivity of substantially the entire outer surface ES.

[0056] In this way, the case 22 may be configured so that the emissivity of a portion of the inner surface IS is higher than the emissivity of a portion of the outer surface ES, without necessarily making the emissivity of substantially the entire inner surface IS higher than the emissivity of substantially the entire outer surface ES.

[0057] Heat generated in the power supply circuit 20 tends to accumulate on the ceiling surface 32 side. Therefore, it is preferable that the emissivity of at least a portion of the ceiling surface 32 of the case 22 be higher than the emissivity of at least a portion of the outer surface ES. In other words, it is preferable that the portion of the inner surface IS with higher emissivity be set on at least the ceiling surface 32. This makes it easier for the heat generated in the power supply circuit 20 to be transferred to the case 22, and more appropriately suppresses the rise in temperature of the power supply circuit 20 that accompanies the power conversion operation.

[0058] However, it is more preferable that the emissivity of substantially the entire inner surface IS of the case 22 be higher than the emissivity of substantially the entire outer surface ES. This makes it easier to transfer heat generated in the power supply circuit 20 to the case 22. Furthermore, regardless of which side of the case 22 is placed facing upward, the heat generated in the power supply circuit 20 can be transferred appropriately to the case 22. This also increases the degree of freedom in the placement of the case 22 (power supply device).

[0059] FIG. 7 is a block diagram schematically illustrating a modified example of the power supply device according to the embodiment. As shown in Figure 7, the power supply unit 10e shows an example in which the case 22 (power supply unit 10e) is installed with the base portion 40 that supports the power supply circuit 20 facing upward and the cover portion 42 that covers the power supply circuit 20 supported by the base portion 40 facing downward.

[0060] In this case, the inner bottom surface 31 covering the lower part of the power supply circuit 20 stored in the internal space 30 is provided on the cover part 42, and the ceiling surface 32 covering the upper part of the power supply circuit 20 stored in the internal space 30 is provided on the base part 40.

[0061] Therefore, in the power supply device 10e, when painting only the portion of the inner surface IS of the case 22 that forms the ceiling surface 32, the painting is applied to the base portion 40 side. In the power supply device 10e, the paint coating 40b is provided only on the portion of the base portion 40 that forms the ceiling surface 32.

[0062] In this way, the orientation in which the power supply device is installed is not limited to the orientation in which the cover portion 42 side faces upward, and may be the orientation in which the base portion 40 side faces upward, etc. The orientation in which the power supply device is installed is not limited to the above, and may be any orientation depending on the object on which the power supply device is to be installed, etc. As described above, it is preferable that the portion of the inner surface IS where the emissivity is to be increased is set at least on the ceiling surface 32 depending on the orientation in which the power supply device is to be installed.

[0063] The present embodiment includes the following aspects. (Appendix 1) a power supply circuit connected to the light source module and also connected to a power source, converting power supplied from the power source into power appropriate for the light source module and supplying the converted power to the light source module, thereby lighting up the light source module; a case having an internal space capable of accommodating the power supply circuit, the case accommodating the power supply circuit within the internal space; Equipped with the case has an inner surface facing the internal space and an outer surface facing outward, A power supply device, characterized in that the emissivity of at least a portion of the inner surface of the case is higher than the emissivity of at least a portion of the outer surface of the case.

[0064] (Appendix 2) an inner surface of the case has a ceiling surface that covers an upper portion of the power supply circuit housed in the internal space; 2. The power supply device according to claim 1, wherein the case has a higher emissivity of at least a portion of the ceiling surface than the emissivity of at least a portion of the exterior surface.

[0065] (Appendix 3) The power supply device according to claim 1 or 2, wherein the case has a higher emissivity for 90% or more of the area of the inner surface than for 90% or more of the area of the outer surface.

[0066] (Appendix 4) the case is made of a metal material, the at least a portion of the inner surface of the case is a painted surface; 4. The power supply device according to claim 1, wherein at least the portion of the outer surface of the case is a metal surface.

[0067] (Appendix 5) The power supply device according to any one of claims 1 to 4, wherein the case has a base portion that supports the power supply circuit and a cover portion that covers the power supply circuit supported by the base portion.

[0068] (Appendix 6) the base portion and the cover portion are made of a metal material, at least a portion of the inner surface of the case is an insulating painted surface, At least a part of the outer surface of the cover is a metal surface having electrical conductivity, the case further includes a screw for attaching the cover to the base; The power supply device described in Appendix 5, characterized in that the screw is conductive and attaches the cover part to the base part and electrically connects the cover part to the base part by bringing the head of the screw into contact with the metal surface of the cover part.

[0069] (Appendix 7) a light source module having a light source; A power supply device according to any one of appendices 1 to 6; A lighting fixture comprising:

[0070] (Appendix 8) 8. The lighting fixture according to claim 7, wherein the case is disposed near the light source module.

[0071] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0072] 2...lighting fixture, 10, 10a to 10e...power supply unit, 12...light source module, 12a...light source, 20...power supply circuit, 22...case, 30...internal space, 31...inner bottom surface, 32...ceiling surface, 33...inner surface, 40...base portion, 42...cover portion, 44...screw, 50...side panel portion, 52...top panel portion, ES...outer surface, IS...inner surface

Claims

1. a power supply circuit connected to the light source module and also connected to a power source, converting power supplied from the power source into power appropriate for the light source module and supplying the converted power to the light source module, thereby lighting up the light source module; a case having an internal space capable of accommodating the power supply circuit, the case accommodating the power supply circuit within the internal space; Equipped with the case has an inner surface facing the internal space and an outer surface facing outward, A power supply device, characterized in that the emissivity of at least a portion of the inner surface of the case is higher than the emissivity of at least a portion of the outer surface of the case.

2. an inner surface of the case has a ceiling surface that covers an upper portion of the power supply circuit housed in the internal space; 2. The power supply device according to claim 1, wherein the case has a ceiling surface with a higher emissivity than the exterior surface of the case.

3. 2. The power supply device according to claim 1, wherein the case has an emissivity of 90% or more of the area of the inner surface higher than an emissivity of 90% or more of the area of the outer surface.

4. the case is made of a metal material, the at least a portion of the inner surface of the case is a painted surface; 2. The power supply device according to claim 1, wherein the at least a portion of the outer surface of the case is a metal surface.

5. 2. The power supply device according to claim 1, wherein the case has a base portion that supports the power supply circuit, and a cover portion that covers the power supply circuit supported by the base portion.

6. the base portion and the cover portion are made of a metal material, at least a portion of the inner surface of the case is an insulating painted surface, At least a part of the outer surface of the cover is a metal surface having electrical conductivity, the case further includes a screw for attaching the cover to the base; The power supply device according to claim 5, characterized in that the screw is conductive and attaches the cover to the base by bringing the head into contact with the metal surface of the cover, and electrically connects the cover to the base.

7. a light source module having a light source; A power supply device according to any one of claims 1 to 6; A lighting fixture comprising:

8. 8. The lighting fixture according to claim 7, wherein the case is disposed near the light source module.

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