Multilayer ceramic electronic component and electronic device including the same

Abstract

To provide a multilayer electronic component with reduced size, and an electronic device including the same.SOLUTION: A multilayer ceramic component according to the present invention includes: a capacitor body including first internal electrodes and second internal electrodes that are stacked alternately, first side surfaces that face each other in a first direction, second side surfaces that face each other in a second direction that is orthogonal to the first direction, third side surfaces that face each other in a third direction that intersects with the first direction and the second direction, and fourth side surfaces that face each other in a fourth direction that is orthogonal to the third direction; and an external electrode disposed on each of the first to fourth side surfaces of the capacitor body. Each of the first internal electrodes includes a first extraction part that is exposed onto the first side surface, and a second extraction part that is exposed onto the second side surface. Each of the second internal electrodes includes a third extraction part that is exposed onto the third side surface, and a fourth extraction part that is exposed onto the fourth side surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a multilayer ceramic electronic component and an electronic device including the same, and more particularly to a multilayer ceramic capacitor and an electronic device including the same. [Background technology]

[0002] As electronic devices become smaller and have higher capacitance, the electronic components used in these devices are also required to be smaller and have higher capacitance. Multilayer ceramic capacitors (MLCCs), one such electronic component, are mounted on printed circuit boards of various electronic devices, such as imaging devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, and smartphones, and serve to charge and discharge electricity. Multilayer ceramic capacitors are used as components in various electronic devices due to their advantages of small size and high capacitance. Recently, various research efforts have been underway to improve the reliability of multilayer ceramic capacitors, in addition to miniaturizing and increasing their capacitance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 10,312,024 Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention has been made in view of the above-mentioned conventional techniques, and an object of the present invention is to provide a miniaturized multilayer ceramic electronic component and an electronic device including the same. [Means for solving the problem]

[0005] In order to achieve the above object, one embodiment of the present invention provides a multilayer ceramic electronic component comprising: a capacitor body including first internal electrodes and second internal electrodes stacked alternately, and having first side surfaces facing each other in a first direction, second side surfaces facing each other in a second direction perpendicular to the first direction, third side surfaces facing each other in a third direction intersecting the first and second directions, and fourth side surfaces facing each other in a fourth direction perpendicular to the third direction; and external electrodes respectively arranged on the first to fourth side surfaces of the capacitor body, wherein each of the first internal electrodes includes a first extension portion exposed on the first side surface and a second extension portion exposed on the second side surface, and each of the second internal electrodes includes a third extension portion exposed on the third side surface and a fourth extension portion exposed on the fourth side surface.

[0006] In order to achieve the above object, according to another aspect of the present invention, a multilayer ceramic electronic component includes a capacitor body having at least three first side surfaces and the same number of second side surfaces as the first side surfaces, wherein each of the second side surfaces connects the two first side surfaces between adjacent two of the first side surfaces; first external electrodes each arranged on the first side surfaces of the capacitor body and extending in a vertical direction; and second external electrodes each arranged on the second side surfaces of the capacitor body and extending in the vertical direction, wherein the capacitor body includes first internal electrodes and second internal electrodes alternately stacked in the vertical direction, and a dielectric layer interposed between the first internal electrodes and the second internal electrodes, wherein each of the first internal electrodes includes a first main portion having a polygonal shape in a plan view and a first extension portion extending from the first main portion toward the first external electrode, and each of the second internal electrodes includes a second main portion having a polygonal shape in a plan view and a second extension portion extending from the second main portion toward the second external electrode.

[0007] According to one aspect of the present invention, an electronic device includes a substrate and a multilayer ceramic capacitor mounted on the substrate, the multilayer ceramic capacitor including first and second internal electrodes stacked in a direction perpendicular to an upper surface of the substrate, a capacitor body having an octagonal planar shape and first and second side surfaces alternately arranged, first external electrodes disposed on the first side of the capacitor body and extending in the perpendicular direction, and second external electrodes disposed on the second side of the capacitor body and extending in the perpendicular direction, each of the first internal electrode and the second internal electrode including a main portion and an extension portion extending in a different direction from the main portion, the first internal electrode and the second internal electrode having the same planar shape, and the first internal electrode and the second internal electrode are twist shifted at an angle of 45°. [Effects of the Invention]

[0008] The multilayer ceramic electronic component of the present invention has at least three first external electrodes and at least three second external electrodes. That is, each of the first internal electrode and the second internal electrode has three or more terminals, thereby reducing parasitic inductance (ESL). Furthermore, because only one external electrode is provided on each side of the capacitor body, adjacent pairs of external electrodes can be spaced apart by a large distance. Furthermore, because the capacitor body is positioned between the external electrodes, interference between the external electrodes can be reduced. In other words, a multilayer ceramic electronic component with improved electrical characteristics can be provided.

[0009] Furthermore, since the capacitor body is provided in a regular polygonal shape and the external electrodes are provided on each side of the capacitor body, the multilayer ceramic electronic component is provided in a symmetrical shape in a plan view. Therefore, even if the size of the capacitor body is reduced, a sufficient gap between the external electrodes can be secured, thereby providing a miniaturized multilayer ceramic electronic component.

[0010] In addition, the first and second internal electrodes may have substantially the same planar shape, although they are merely arranged with a twist shift relative to each other. Therefore, the first and second internal electrodes may be manufactured through the same process, thereby simplifying the process of forming the multilayer ceramic electronic component. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view illustrating a multilayer ceramic electronic component according to an embodiment of the present invention. [Figure 2] 1 is an exploded perspective view illustrating a capacitor body of a multilayer ceramic electronic component according to an embodiment of the present invention. [Figure 3] 2 is a plan view of an example of a first internal electrode of the multilayer ceramic electronic component according to a preferred embodiment of the present invention. FIG. [Figure 4] 4 is a plan view of an example of a second internal electrode of the multilayer ceramic electronic component according to a preferred embodiment of the present invention. FIG. [Figure 5] 2 is a plan view of an example of first and second internal electrodes of a multilayer ceramic electronic component according to a preferred embodiment of the present invention. FIG. [Figure 6] 1 is a side view illustrating a multilayer ceramic electronic component according to an embodiment of the present invention. [Figure 7] 1 is a cross-sectional view of a multilayer ceramic electronic component according to one embodiment of the present invention. [Figure 8] 1 is a cross-sectional view of a multilayer ceramic electronic component according to one embodiment of the present invention. [Figure 9] 10 is a plan view of another example of the first internal electrode of the multilayer ceramic electronic component according to a preferred embodiment of the present invention. FIG. [Figure 10] 10 is a plan view of another example of the second internal electrode of the multilayer ceramic electronic component according to a preferred embodiment of the present invention. FIG. [Figure 11] 10 is a plan view of another example of the first and second internal electrodes of the multilayer ceramic electronic component according to a preferred embodiment of the present invention. FIG. [Figure 12]FIG. 10 is a perspective view illustrating a multilayer ceramic electronic component according to another embodiment of the present invention. [Figure 13] FIG. 4 is a plan view of a first internal electrode of a multilayer ceramic electronic component according to another embodiment of the present invention. [Figure 14] FIG. 10 is a plan view of a second internal electrode of a multilayer ceramic electronic component according to another embodiment of the present invention. [Figure 15] FIG. 4 is a plan view of first and second internal electrodes of a multilayer ceramic electronic component according to another embodiment of the present invention. [Figure 16] FIG. 10 is a plan view of a first internal electrode of a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 17] FIG. 10 is a plan view of a second internal electrode of a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 18] FIG. 10 is a plan view of first and second internal electrodes of a multilayer ceramic electronic component according to still another embodiment of the present invention. [Figure 19] 1 is a cross-sectional view illustrating an electronic device according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific examples of embodiments for carrying out the multilayer ceramic electronic component of the present invention will be described in detail with reference to the drawings.

[0013] Fig. 1 is a perspective view illustrating a multilayer ceramic electronic component according to an embodiment of the present invention, and Fig. 2 is an exploded perspective view illustrating a capacitor body of the multilayer ceramic electronic component according to an embodiment of the present invention.

[0014] 1 and 2, a multilayer ceramic electronic component 1000 is a multilayer ceramic capacitor, and includes a capacitor body 100, a first external electrode 150a, and a second external electrode 150b.

[0015] The capacitor body 100 has a regular polygonal planar shape. The shape of the capacitor body 100 will be described in detail below based on one embodiment of the capacitor body 100. The capacitor body 100 has first side surfaces 100s1 facing each other in a first direction D1, second side surfaces 100s2 facing each other in a second direction D2, third side surfaces 100s3 facing each other in a third direction D3, and fourth side surfaces 100s4 facing each other in a fourth direction D4. The first to fourth directions (D1, D2, D3, D4) are horizontal directions. The first direction D1 and the second direction D2 are perpendicular to each other. The third direction D3 and the fourth direction D4 are perpendicular to each other. The third direction D3 and the fourth direction D4 intersect with the first direction D1 and the second direction D2. The angle between the third direction D3 and the fourth direction D4 and the first direction D1 and the second direction D2 is 45°. The horizontal width of the first side surface 100s1, the horizontal width of the second side surface 100s2, the horizontal width of the third side surface 100s3, and the horizontal width of the fourth side surface 100s4 are all the same. That is, the planar shape of the capacitor body 100 is a regular octagon when viewed from above. The capacitor body 100 has an upper surface 100U and a lower surface 100L that face each other in a fifth direction D5. The fifth direction D5 is a direction perpendicular to the first to fourth directions (D1, D2, D3, D4). In other words, the capacitor body 100 has an octagonal prism shape.

[0016] The first external electrode 150a is disposed on the first side surface 100s1 and the second side surface 100s2 of the capacitor body 100. The first external electrode 150a covers a portion of each of the first side surface 100s1 and the second side surface 100s2. The first external electrode 150a extends onto the upper surface 100U and the lower surface 100L of the capacitor body 100 and covers a portion of each of the upper surface 100U and the lower surface 100L. The first external electrode 150a surrounds upper end portions of the capacitor body 100 formed by the first side surface 100s1 or the second side surface 100s2 and the upper surface 100U, and lower end portions of the capacitor body 100 formed by the first side surface 100s1 or the second side surface 100s2 and the lower surface 100L.

[0017] The second external electrode 150b is disposed on the third side surface 100s3 and the fourth side surface 100s4 of the capacitor body 100. The second external electrode 150b covers a portion of each of the third side surface 100s3 and the fourth side surface 100s4. The second external electrode 150b extends onto the upper surface 100U and the lower surface 100L of the capacitor body 100 and covers a portion of each of the upper surface 100U and the lower surface 100L. The second external electrode 150b surrounds upper end portions of the capacitor body 100 formed by the third side surface 100s3 or the fourth side surface 100s4 and the upper surface 100U, and lower end portions of the capacitor body 100 formed by the third side surface 100s3 or the fourth side surface 100s4 and the lower surface 100L.

[0018] The first external electrode 150a and the second external electrode 150b include a conductive material, such as nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof.

[0019] The capacitor body 100 includes internal electrodes 120a and 120b and a dielectric layer 110 interposed between the internal electrodes 120a and 120b. The internal electrodes 120a and 120b and the dielectric layers 110 are alternately stacked along a fifth direction D5, for example. The internal electrodes 120a and 120b include first and second internal electrodes 120a and 120b alternately stacked on the bottommost dielectric layer 110 among the dielectric layers 110. The topmost dielectric layer 110 among the dielectric layers 110 covers the topmost internal electrode among the internal electrodes 120a and 120b. The dielectric layer 110 includes a ceramic material having a high dielectric constant. For example, the dielectric layer 110 includes barium titanate (BaTiO3) or strontium titanate (SrTiO3). The internal electrodes 120a and 120b include a conductive material. For example, the internal electrodes (120a, 120b) include nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof.

[0020] Fig. 3 is a plan view of an example of a first internal electrode of a multilayer ceramic electronic component according to one embodiment of the present invention. Fig. 4 is a plan view of an example of a second internal electrode of a multilayer ceramic electronic component according to one embodiment of the present invention. Fig. 5 is a plan view of an example of first and second internal electrodes of a multilayer ceramic electronic component according to one embodiment of the present invention, showing one first internal electrode and one second internal electrode overlapping each other.

[0021] 3 to 5, each of the first internal electrodes 120a includes a first main portion 130a and a plurality of first lead portions 140a1 and second lead portions 140a2 extending from the first main portion 130a.

[0022] The planar shape of the first main portion 130a corresponds to the planar shape of the capacitor body 100. For example, the planar shape of the first main portion 130a is a regular octagon. The first main portion 130a has side surfaces facing a first direction D1, a second direction D2, a third direction D3, and a fourth direction D4. The planar shape of the first main portion 130a is smaller than the planar shape of the capacitor body 100. For example, the horizontal width of the first main portion 130a is smaller than the horizontal width of the capacitor body 100. In a planar view, the first main portion 130a is located at the center of the capacitor body 100. For example, the first main portion 130a is separated from a first side surface 100s1, a second side surface 100s2, a third side surface 100s3, and a fourth side surface 100s4 of the capacitor body 100. The first main portion 130a is spaced apart from the first side surface 100s1, the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 of the capacitor body 100 by the same distance.

[0023] The first and second lead portions 140a1 and 140a2 extend from the first main portion 130a. More specifically, the first lead portion 140a1 extends from a side surface of the first main portion 130a in the first direction D1, and the second lead portion 140a2 extends from a side surface of the first main portion 130a in the second direction D2. The first lead portion 140a1 extends toward a first side surface 100s1 of the capacitor body 100, and the second lead portion 140a2 extends toward a second side surface 100s2 of the capacitor body 100. The first side surfaces 100s1 of the capacitor body 100 each expose one first lead portion 140a1, and the second side surfaces 100s2 of the capacitor body 100 each expose one second lead portion 140a2. The first lead portion 140a1 is connected to the first external electrode 150a on the first side surface 100s1 of the capacitor body 100, and the second lead portion 140a2 is connected to the first external electrode 150a on the second side surface 100s2 of the capacitor body 100. The first lead portion 140a1 and the second lead portion 140a2 each have a linear shape extending from the first main portion 130a. The horizontal width of the first lead portion 140a1 (i.e., the width in the second direction D2) is smaller than the horizontal width (i.e., the width in the second direction D2) of one side surface of the first main portion 130a to which the first lead portion 140a1 is connected. The horizontal width of the first lead portion 140a1 is smaller than the horizontal width (i.e., the width in the second direction D2) of the first side surface 100s1. For example, the horizontal width of the first lead portion 140a1 is one-third to two-thirds of the horizontal width of the first side surface 100s1. The horizontal width of the second drawer portion 140a2 (i.e., the width in the first direction D1) is smaller than the horizontal width of one side surface of the first main portion 130a to which the second drawer portion 140a2 is connected (i.e., the width in the first direction D1). The horizontal width of the second drawer portion 140a2 is smaller than the horizontal width of the second side surface 100s2 (i.e., the width in the first direction D1). For example, the horizontal width of the second drawer portion 140a2 is one-third to two-thirds of the horizontal width of the second side surface 100s2.

[0024] Each of the second internal electrodes 120b includes a second main portion 130b and a plurality of third lead portions 140b1 and fourth lead portions 140b2 extending from the second main portion 130b.

[0025] The planar shape of the second main portion 130b corresponds to the planar shape of the capacitor body 100. For example, the planar shape of the second main portion 130b is a regular octagon. The second main portion 130b has side surfaces facing a first direction D1, a second direction D2, a third direction D3, and a fourth direction D4. The planar shape of the second main portion 130b is smaller than the planar shape of the capacitor body 100. For example, the horizontal width of the second main portion 130b is smaller than the horizontal width of the capacitor body 100. In a planar view, the second main portion 130b is located at the center of the capacitor body 100. For example, the second main portion 130b is separated from a first side surface 100s1, a second side surface 100s2, a third side surface 100s3, and a fourth side surface 100s4 of the capacitor body 100. The second main portion 130b is spaced apart from the first side surface 100s1, the second side surface 100s2, the third side surface 100s3, and the fourth side surface 100s4 of the capacitor body 100 by the same distance.

[0026] The third and fourth lead portions 140b1 and 140b2 extend from the second main portion 130b. More specifically, the third lead portion 140b1 extends from a side surface of the second main portion 130b in the third direction D3, and the fourth lead portion 140b2 extends from a side surface of the second main portion 130b in the fourth direction D4. The third lead portion 140b1 extends toward a third side surface 100s3 of the capacitor body 100, and the fourth lead portion 140b2 extends toward a fourth side surface 100s4 of the capacitor body 100. The third side surfaces 100s3 of the capacitor body 100 each expose one third lead portion 140b1, and the fourth side surfaces 100s4 of the capacitor body 100 each expose one fourth lead portion 140b2. The third extension portion 140b1 is connected to the second external electrode 150b on the third side surface 100s3 of the capacitor body 100, and the fourth extension portion 140b2 is connected to the second external electrode 150b on the fourth side surface 100s4 of the capacitor body 100. The third extension portion 140b1 and the fourth extension portion 140b2 each have a linear shape extending from the second main portion 130b. The horizontal width of the third extension portion 140b1 (i.e., the width in the fourth direction D4) is smaller than the horizontal width (i.e., the width in the fourth direction D4) of one side surface of the second main portion 130b to which the third extension portion 140b1 is connected. The horizontal width of the third extension portion 140b1 is smaller than the horizontal width (i.e., the width in the fourth direction D4) of the third side surface 100s3. For example, the horizontal width of the third extension portion 140b1 is one-third to two-thirds of the horizontal width of the third side surface 100s3. The horizontal width of the fourth extension portion 140b2 (i.e., the width in the third direction D3) is smaller than the horizontal width of one side surface of the second main portion 130b to which the fourth extension portion 140b2 is connected (i.e., the width in the third direction D3). The horizontal width of the fourth extension portion 140b2 is smaller than the horizontal width of the fourth side surface 100s4 (i.e., the width in the third direction D3). For example, the horizontal width of the fourth extension portion 140b2 is one-third to two-thirds of the horizontal width of the fourth side surface 100s4.

[0027] The first internal electrode 120a and the second internal electrode 120b are stacked in a fifth direction D5. The planar shapes of the first internal electrode 120a and the second internal electrode 120b are identical to each other, but the first internal electrode 120a and the second internal electrode 120b are twist-shifted by an angle of 45°. The first main portion 130a of the first internal electrode 120a overlaps the second main portion 130b of the second internal electrode 120b perpendicularly along the fifth direction D5.

[0028] The first and second internal electrodes 120a and 120b are embedded in the dielectric layer 110. The first and second internal electrodes 120a and 120b are separated from each other by the dielectric layer 110. Adjacent first and second internal electrodes 120a and 120b, along with the dielectric layer 110 located therebetween, constitute a capacitor with a metal-insulator-metal (MIM) structure. The overlapping area between the first and second internal electrodes 120a and 120b, more specifically, the overlapping area between the first and second main portions 130a and 130b, determines the capacitance of the capacitor. Therefore, the areas of the first and second main portions 130a and 130b are adjusted to achieve the capacitance required for the multilayer ceramic electronic component 1000. The dielectric layer 110 embeds the first internal electrode 120a and the second internal electrode 120b, and fills the space between the first lead portion 140a1 and the second lead portion 140a2 of the first internal electrode 120a, and the space between the third lead portion 140b1 and the fourth lead portion 140b2 of the second internal electrode 120b.

[0029] The first internal electrode 120a is connected to the first external electrode 150a, and the second internal electrode 120b is connected to the second external electrode 150b.

[0030] Fig. 6 is a side view illustrating a multilayer ceramic electronic component according to an embodiment of the present invention, as viewed from the front in the second direction D2. Figs. 7 and 8 are cross-sectional views of a multilayer ceramic electronic component according to an embodiment of the present invention. Fig. 7 corresponds to a cross section taken along line A-A' in Fig. 5. Fig. 8 corresponds to a cross section taken along line B-B' in Fig. 5.

[0031] 5 to 8, the first and second side surfaces 100s1 and 100s2 of the capacitor body 100 expose the first and second lead portions 140a1 and 140a2, which are connected to the first external electrode 150a. The first external electrode 150a extends in a fifth direction D5 and is connected to the first internal electrodes 120a spaced apart from each other.

[0032] The third and fourth side surfaces 100s3 and 100s4 of the capacitor body 100 expose the third and fourth lead portions 140b1 and 140b2, which are connected to the second external electrode 150b. The second external electrode 150b extends in a fifth direction D5 and is connected to the second internal electrodes 120b spaced apart from each other.

[0033] The first external electrode 150 a and the second external electrode 150 b are terminals for transmitting electrical signals to the capacitor body 100 .

[0034] According to one embodiment of the present invention, the multilayer ceramic electronic component 1000 includes at least three first external electrodes 150a and at least three second external electrodes 150b. That is, because each of the first internal electrode 120a and the second internal electrode 120b has three or more terminals, parasitic inductance (ESL) can be reduced. Furthermore, because only one external electrode 150a, 150b is provided on each side of the capacitor body 100, adjacent pairs of the external electrodes 150a, 150b are spaced apart by a large distance. Furthermore, because the capacitor body 100 is positioned on a straight line connecting the adjacent pairs of external electrodes 150a, 150b, interference between the external electrodes 150a, 150b can be reduced. This provides a multilayer ceramic electronic component 1000 with improved electrical characteristics.

[0035] Furthermore, since the capacitor body 100 is provided in a regular octagonal shape and the external electrodes (150a, 150b) are provided on each of the side surfaces (100s1 to 100s4) of the capacitor body 100, the multilayer ceramic electronic component 1000 is provided in a symmetrical shape when viewed from above. Therefore, even if the size of the capacitor body 100 is reduced, sufficient spacing between the external electrodes (150a, 150b) can be ensured, making it possible to provide a miniaturized multilayer ceramic electronic component 1000.

[0036] Furthermore, since the first internal electrode 120a and the second internal electrode 120b are arranged with only a twist shift relative to each other and have substantially the same planar shape, the first internal electrode 120a and the second internal electrode 120b are manufactured through the same process, which simplifies the process of forming the multilayer ceramic electronic component 1000.

[0037] In the following embodiments, the same reference numerals are used for the components described in the embodiments of Figures 1 and 8, and for the sake of simplicity, the description thereof will be omitted or will be briefly given. That is, the following description will focus on the differences between the embodiments of Figures 1 and 8 and the following embodiments.

[0038] Fig. 9 is a plan view of another example of a first internal electrode of a multilayer ceramic electronic component according to an embodiment of the present invention. Fig. 10 is a plan view of another example of a second internal electrode of a multilayer ceramic electronic component according to an embodiment of the present invention. Fig. 11 is a plan view of another example of first and second internal electrodes of a multilayer ceramic electronic component according to an embodiment of the present invention, showing one first internal electrode and one second internal electrode overlapping each other.

[0039] In Figures 1 to 8, the horizontal width of the first lead portion 140a1 and the horizontal width of the second lead portion 140a2 of the first internal electrode 120a are shown to be smaller than the horizontal width of the first main portion 130a, and the horizontal width of the third lead portion 140b1 and the horizontal width of the fourth lead portion 140b2 of the second internal electrode 120b are shown to be smaller than the horizontal width of the second main portion 130b, but the present invention is not limited to this.

[0040] 9 to 11, the horizontal width of the first lead portion 140a1 and the second lead portion 140a2 of the first internal electrode 120a is the same as the horizontal width of the first main portion 130a. Explained differently, as shown in Fig. 9, the first internal electrode 120a has a cross-shaped planar shape formed by the first lead portion 140a1 extending in a first direction D1 and the second lead portion 140a2 extending in a second direction D2 crossing each other.

[0041] The planar shape of the second internal electrode 120b is substantially the same as or similar to the planar shape of the first internal electrode 120a. The horizontal width of the third lead portion 140b1 and the horizontal width of the fourth lead portion 140b2 of the second internal electrode 120b are the same as the horizontal width of the second main portion 130b. In other words, as shown in FIG. 10, the second internal electrode 120b has a cross-shaped planar shape formed by the third lead portion 140b1 extending in the third direction D3 and the fourth lead portion 140b2 extending in the fourth direction D4 intersecting each other.

[0042] 11, the first internal electrode 120a and the second internal electrode 120b are stacked in a fifth direction D5. The planar shapes of the first internal electrode 120a and the second internal electrode 120b are identical to each other, but the first internal electrode 120a and the second internal electrode 120b are twist-shifted by a 45° angle. The first main portion 130a of the first internal electrode 120a overlaps the second main portion 130b of the second internal electrode 120b perpendicularly along the fifth direction D5.

[0043] Fig. 12 is a perspective view illustrating a multilayer ceramic electronic component according to another embodiment of the present invention. Fig. 13 is a plan view of a first internal electrode of the multilayer ceramic electronic component according to another embodiment of the present invention. Fig. 14 is a plan view of a second internal electrode of the multilayer ceramic electronic component according to another embodiment of the present invention. Fig. 15 is a plan view of first and second internal electrodes of the multilayer ceramic electronic component according to another embodiment of the present invention.

[0044] 12 to 15, a multilayer ceramic electronic component 1001 includes a capacitor body 100, a first external electrode 150a, and a second external electrode 150b.

[0045] The capacitor body 100 has side surfaces facing each other in a sixth direction D6, side surfaces facing each other in a seventh direction D7, and side surfaces facing each other in an eighth direction D8. The sixth to eighth directions (D6, D7, D8) are horizontal directions. The sixth to eighth directions (D6, D7, D8) are angled at 60° from each other. The side surfaces of the capacitor body 100 have the same horizontal width. That is, the planar shape of the capacitor body 100 is a regular hexagon when viewed from above. The capacitor body 100 has upper and lower surfaces facing each other in a fifth direction D5. The fifth direction D5 is a direction perpendicular to the sixth to eighth directions (D6, D7, D8). In other words, the capacitor body 100 has a hexagonal prism shape.

[0046] The external electrodes 150a and 150b are disposed on the side surfaces of the capacitor body 100. Here, the external electrodes 150a and 150b are provided one on each side surface of the capacitor body 100, with the first external electrode 150a and the second external electrode 150b being alternately disposed. Stated differently, the first external electrode 150a is disposed on one of two adjacent side surfaces of the capacitor body 100, and the second external electrode 150b is disposed on the other. The external electrodes 150a and 150b cover a portion of each of the side surfaces of the capacitor body 100. The external electrodes 150a and 150b extend onto the upper and lower surfaces of the capacitor body 100, covering a portion of each of the upper and lower surfaces. The external electrodes 150a and 150b surround the upper end portions of the capacitor body 100, which are formed by the side and top surfaces of the capacitor body 100, and the lower end portions of the capacitor body 100, which are formed by the side and bottom surfaces of the capacitor body 100.

[0047] The capacitor body 100 includes internal electrodes (120a, 120b) and a dielectric layer 110 interposed between the internal electrodes (120a, 120b).

[0048] Each of the first internal electrodes 120a includes a first main portion 130a and a plurality of fifth lead portions 140a3 extending from the first main portion 130a.

[0049] The planar shape of the first main portion 130a corresponds to the planar shape of the capacitor body 100. For example, the planar shape of the first main portion 130a is a regular hexagon. The planar shape of the first main portion 130a is smaller than the planar shape of the capacitor body 100.

[0050] The fifth lead portion 140a3 extends from the first main portion 130a. More specifically, the fifth lead portion 140a3 extends from each side of the first main portion 130a. Here, the fifth lead portion 140a3 is provided only on three of the six side surfaces of the first main portion 130a. For example, of two adjacent side surfaces of the first main portion 130a, the fifth lead portion 140a3 is provided on one side and not on the other side. The fifth lead portion 140a3 extends toward the side surfaces of the capacitor body 100. Each side surface of the capacitor body 100 exposes one fifth lead portion 140a3. On the side surfaces of the capacitor body 100, the fifth lead portion 140a3 is connected to the first external electrode 150a. Each of the fifth lead portions 140a3 has a linear shape extending from the first main portion 130a. The horizontal width of the fifth extended portion 140a3 is smaller than the horizontal width of the side surface of the first main portion 130a to which the fifth extended portion 140a3 is connected. The horizontal width of the fifth extended portion 140a3 is smaller than the horizontal width of the side surface of the capacitor body 100. For example, the horizontal width of the fifth extended portion 140a3 is one-third to two-thirds of the horizontal width of the side surface of the capacitor body 100.

[0051] Each of the second internal electrodes 120b includes a second main portion 130b and a plurality of sixth lead portions 140b3 extending from the second main portion 130b.

[0052] The planar shape of the second main portion 130b corresponds to the planar shape of the capacitor body 100. For example, the planar shape of the second main portion 130b is a regular hexagon. The planar shape of the second main portion 130b is smaller than the planar shape of the capacitor body 100.

[0053] The sixth lead portion 140b3 extends from the second main portion 130b. More specifically, the sixth lead portion 140b3 extends from each side surface of the second main portion 130b. Here, the sixth lead portion 140b3 is provided only on three of the six side surfaces of the second main portion 130b. For example, of two adjacent side surfaces of the second main portion 130b, the sixth lead portion 140b3 is provided on one side surface, and the sixth lead portion 140b3 is not provided on the other side surface. The sixth lead portion 140b3 extends toward the side surfaces of the capacitor body 100. Each side surface of the capacitor body 100 exposes one sixth lead portion 140b3. On the side surfaces of the capacitor body 100, the sixth lead portion 140b3 is connected to the second external electrode 150b. Each sixth lead portion 140b3 has a linear shape extending from the second main portion 130b. The horizontal width of the sixth extension portion 140b3 is smaller than the horizontal width of the side surface of the second main portion 130b to which the sixth extension portion 140b3 is connected. The horizontal width of the sixth extension portion 140b3 is smaller than the horizontal width of the side surface of the capacitor body 100. For example, the horizontal width of the sixth extension portion 140b3 is one-third to two-thirds of the horizontal width of the side surface of the capacitor body 100.

[0054] The first internal electrode 120a and the second internal electrode 120b are stacked in a fifth direction D5. The planar shapes of the first internal electrode 120a and the second internal electrode 120b are identical to each other, but the first internal electrode 120a and the second internal electrode 120b are twist-shifted by an angle of 60°. The first main portion 130a of the first internal electrode 120a overlaps the second main portion 130b of the second internal electrode 120b perpendicularly along the fifth direction D5.

[0055] The first internal electrode 120a and the second internal electrode 120b are embedded in the dielectric layer 110. The first internal electrode 120a and the second internal electrode 120b are separated from each other by the dielectric layer 110. One first internal electrode 120a and one second internal electrode 120b adjacent to each other and the dielectric layer 110 located therebetween constitute a capacitor with an MIM (metal-insulator-metal) structure.

[0056] The first internal electrode 120a is connected to the first external electrode 150a, and the second internal electrode 120b is connected to the second external electrode 150b.

[0057] Fig. 16 is a plan view of a first internal electrode of a multilayer ceramic electronic component according to yet another embodiment of the present invention, Fig. 17 is a plan view of a second internal electrode of a multilayer ceramic electronic component according to yet another embodiment of the present invention, and Fig. 18 is a plan view of first and second internal electrodes of a multilayer ceramic electronic component according to yet another embodiment of the present invention.

[0058] 16 to 18, a multilayer ceramic electronic component 1001 includes a capacitor body 100, a first external electrode 150a, and a second external electrode 150b.

[0059] The planar shape of the capacitor body 100 is a regular decagon when viewed from above. The horizontal widths of the side surfaces of the capacitor body 100 are the same. The capacitor body 100 has an upper surface and a lower surface that face each other in a fifth direction D5. In other words, the capacitor body 100 has a decagonal prism shape.

[0060] The external electrodes 150a and 150b are disposed on the side surfaces of the capacitor body 100. Here, the external electrodes 150a and 150b are provided one on each side surface of the capacitor body 100, with the first external electrode 150a and the second external electrode 150b being alternately disposed. Stated differently, the first external electrode 150a is disposed on one of two adjacent side surfaces of the capacitor body 100, and the second external electrode 150b is disposed on the other. The external electrodes 150a and 150b cover a portion of each of the side surfaces of the capacitor body 100. The external electrodes 150a and 150b extend onto the upper and lower surfaces of the capacitor body 100, covering a portion of each of the upper and lower surfaces. The external electrodes 150a and 150b surround the upper end portions of the capacitor body 100, which are formed by the side and top surfaces of the capacitor body 100, and the lower end portions of the capacitor body 100, which are formed by the side and bottom surfaces of the capacitor body 100.

[0061] The capacitor body 100 includes internal electrodes (120a, 120b) and a dielectric layer 110 interposed between the internal electrodes (120a, 120b).

[0062] Each of the first internal electrodes 120a includes a first main portion 130a and a plurality of seventh lead portions 140a4 extending from the first main portion 130a.

[0063] The planar shape of the first main portion 130a corresponds to the planar shape of the capacitor body 100. For example, the planar shape of the first main portion 130a is a regular decagon. The planar shape of the first main portion 130a is smaller than the planar shape of the capacitor body 100.

[0064] The seventh lead portion 140a4 extends from the first main portion 130a. More specifically, the seventh lead portion 140a4 extends from each side of the first main portion 130a. Here, the seventh lead portion 140a4 is provided only on five of the ten side surfaces of the first main portion 130a. For example, of two adjacent side surfaces of the first main portion 130a, the seventh lead portion 140a4 is provided on one side surface, and the seventh lead portion 140a4 is not provided on the other side surface. The seventh lead portion 140a4 extends toward the side surfaces of the capacitor body 100. Each side surface of the capacitor body 100 exposes one seventh lead portion 140a4. On the side surfaces of the capacitor body 100, the seventh lead portion 140a4 is connected to the first external electrode 150a. Each of the seventh lead portions 140a4 has a linear shape extending from the first main portion 130a. The horizontal width of the seventh extension portion 140a4 is smaller than the horizontal width of the side surface of the first main portion 130a to which the seventh extension portion 140a4 is connected. The horizontal width of the seventh extension portion 140a4 is smaller than the horizontal width of the side surface of the capacitor body 100. For example, the horizontal width of the seventh extension portion 140a4 is one-third to two-thirds of the horizontal width of the side surface of the capacitor body 100.

[0065] Each of the second internal electrodes 120b includes a second main portion 130b and a plurality of eighth lead portions 140b4 extending from the second main portion 130b.

[0066] The planar shape of the second main portion 130b corresponds to the planar shape of the capacitor body 100. For example, the planar shape of the second main portion 130b is a regular decagon. The planar shape of the second main portion 130b is smaller than the planar shape of the capacitor body 100.

[0067] The eighth lead portion 140b4 extends from the second main portion 130b. More specifically, the eighth lead portion 140b4 extends from each side surface of the second main portion 130b. Here, the eighth lead portion 140b4 is provided only on five of the ten side surfaces of the second main portion 130b. For example, of two adjacent side surfaces of the second main portion 130b, the eighth lead portion 140b4 is provided on one side surface, and the eighth lead portion 140b4 is not provided on the other side surface. The eighth lead portion 140b4 extends toward the side surfaces of the capacitor body 100. Each side surface of the capacitor body 100 exposes one eighth lead portion 140b4. On the side surfaces of the capacitor body 100, the eighth lead portion 140b4 is connected to the second external electrode 150b. Each of the eighth lead portions 140b4 has a linear shape extending from the second main portion 130b. The horizontal width of the eighth extension portion 140b4 is smaller than the horizontal width of the side surface of the second main portion 130b to which the eighth extension portion 140b4 is connected. The horizontal width of the eighth extension portion 140b4 is smaller than the horizontal width of the side surface of the capacitor body 100. For example, the horizontal width of the eighth extension portion 140b4 is one-third to two-thirds of the horizontal width of the side surface of the capacitor body 100.

[0068] The first internal electrode 120a and the second internal electrode 120b are stacked in a fifth direction D5. The planar shapes of the first internal electrode 120a and the second internal electrode 120b are identical to each other, but the first internal electrode 120a and the second internal electrode 120b are twist-shifted by an angle of 36°. The first main portion 130a of the first internal electrode 120a overlaps the second main portion 130b of the second internal electrode 120b perpendicularly along the fifth direction D5.

[0069] The first internal electrode 120a and the second internal electrode 120b are embedded in the dielectric layer 110. The first internal electrode 120a and the second internal electrode 120b are separated from each other by the dielectric layer 110. One first internal electrode 120a and one second internal electrode 120b adjacent to each other and the dielectric layer 110 located therebetween constitute a capacitor with an MIM (metal-insulator-metal) structure.

[0070] The first internal electrode 120a is connected to the first external electrode 150a, and the second internal electrode 120b is connected to the second external electrode 150b.

[0071] 1 to 18, the capacitor body 100 has been described as having a regular octagonal, regular hexagonal, or regular decagonal planar shape, but the present invention is not limited thereto. The capacitor body 100 may have a regular n-gonal planar shape, where n is 4 or greater.

[0072] FIG. 19 is a cross-sectional view illustrating an electronic device according to an embodiment of the present invention.

[0073] 19, an electronic device 1100 includes a substrate 200 and a multilayer ceramic capacitor 1000 mounted on the substrate 200. The substrate 200 has substrate pads 210 provided on an upper surface of the substrate 200. The substrate pads 210 include a conductive material. The multilayer ceramic capacitor 1000 is the multilayer ceramic electronic device (1000 or 1001) described with reference to FIGS. 1 to 18. The multilayer ceramic capacitor 1000 is mounted on the substrate 200 such that the lower surface 100L of the capacitor body 100 of FIG. 1 faces the upper surface of the substrate 200. First and second external electrodes 150a and 150b of the multilayer ceramic capacitor 1000 are disposed on the substrate pads 210, respectively. Solder 220 is disposed between each of the first and second external electrodes 150a and 150b and the substrate pads 210, respectively. The solder 220 covers a portion of each outer surface of the first and second external electrodes 150a and 150b. The solder 220 includes tin (Sn), lead (Pb), silver (Ag), copper (Cu), gold (Au), or an alloy thereof. The solder 220 may further include a conductive polymer.

[0074] Although the embodiments of the present invention have been described in detail above with reference to the drawings, the present invention is not limited to the above-described embodiments and can be modified in various ways without departing from the technical concept of the present invention. [Explanation of symbols]

[0075] 100 Capacitor Body 100L, 100U bottom, top side 100s1~100s4 1st~3rd sides 110 dielectric layer 120a, 120b 1st, 2nd internal electrode 130a, 130b First and second main sections 140a1, 140a2, 140b1, 140b2 First to fourth drawer sections 140a3, 140b3, 140a4, 140b4 5th to 8th drawer sections 150a, 150b 1st, 2nd external electrode 200 boards 210 PCB pads 220 Solder 1000, 1001 Multilayer ceramic electronic components (multilayer ceramic capacitors) 1100 Electronic equipment D1~D8 1st~8th direction

Claims

1. a capacitor body including first internal electrodes and second internal electrodes alternately stacked, the capacitor body having first sides facing each other in a first direction, second sides facing each other in a second direction perpendicular to the first direction, third sides facing each other in a third direction intersecting the first and second directions, and fourth sides facing each other in a fourth direction perpendicular to the third direction; external electrodes disposed on first to fourth side surfaces of the capacitor body, respectively; Each of the first internal electrodes has a first lead portion exposed on the first side surface; a second lead portion exposed on the second side surface, Each of the second internal electrodes has a third lead portion exposed on the third side surface; a fourth lead portion exposed on the fourth side surface.

2. Each of the first internal electrodes further includes a first main portion, Each of the first lead portions extends from the first main portion toward one of the first side surfaces, Each of the second lead portions extends from the first main portion toward one of the second side surfaces, Each of the second internal electrodes further includes a second main portion, Each of the third extension portions extends from the second main portion toward one of the third side surfaces, The multilayer ceramic electronic component according to claim 1 , wherein each of the fourth lead portions extends from the second main portion toward one of the fourth side surfaces.

3. 3. The multilayer ceramic electronic component according to claim 2, wherein the first main portion and the second main portion have an octagonal shape in a plan view.

4. a horizontal width of the first and second drawer portions is equal to or smaller than a horizontal width of one side of the first main portion to which the first and second drawer portions are connected; 4. The multilayer ceramic electronic component according to claim 3, wherein the horizontal width of the third lead-out portion and the fourth lead-out portion is equal to or smaller than the horizontal width of one side of the second main portion to which the third lead-out portion and the fourth lead-out portion are connected.

5. The first lead-out portion and the second lead-out portion have a line shape extending from the first main portion, 3. The multilayer ceramic electronic component according to claim 2, wherein the third lead portion and the fourth lead portion have a linear shape extending from the second main portion.

6. each of the first internal electrodes has a cross-shaped planar shape constituted by the first lead portion and the second lead portion; 2. The multilayer ceramic electronic component according to claim 1, wherein each of the second internal electrodes has a cross-shaped planar shape defined by the third lead portion and the fourth lead portion.

7. The external electrode is a first external electrode extending vertically on a first side surface of the capacitor body; a second external electrode extending vertically on a second side surface of the capacitor body; a third external electrode extending vertically on a third side surface of the capacitor body; 2. The multilayer ceramic electronic component according to claim 1, further comprising: a fourth external electrode extending vertically on a fourth side surface of the capacitor body.

8. a first lead portion of the first internal electrode connected to the first external electrode; a second lead portion of the first internal electrode connected to the second external electrode; a third lead portion of the second internal electrode connected to the third external electrode; The multilayer ceramic electronic component according to claim 7 , wherein a fourth lead portion of the second internal electrode is connected to the fourth external electrode.

9. the capacitor body has a regular octagonal shape in a plan view, 2. The multilayer ceramic electronic component according to claim 1, wherein the horizontal width of the first side surface, the horizontal width of the second side surface, the horizontal width of the third side surface, and the horizontal width of the fourth side surface are the same.

10. 2. The multilayer ceramic electronic component according to claim 1, wherein the horizontal widths of the first to fourth lead portions are one-third to two-thirds of the horizontal widths of the first to fourth side surfaces.

11. 2. The multilayer ceramic electronic component according to claim 1, wherein the third direction forms an angle of 45 degrees with respect to the first direction and the second direction.

12. the capacitor body further includes a dielectric layer interposed between the first internal electrode and the second internal electrode; 2. The multilayer ceramic electronic component according to claim 1, wherein the dielectric layer fills a space between the first lead portion and the second lead portion and a space between the third lead portion and the fourth lead portion.

13. the first internal electrode and the second internal electrode have the same planar shape, 2. The multilayer ceramic electronic component according to claim 1, wherein the first internal electrodes and the second internal electrodes are twist shifted at an angle of 45 degrees.

14. a capacitor body having at least three first side surfaces and the same number of second side surfaces as the first side surfaces, each of the second side surfaces connecting the two first side surfaces between two adjacent ones of the first side surfaces; first external electrodes disposed on a first side surface of the capacitor body and extending in a vertical direction; second external electrodes disposed on second side surfaces of the capacitor bodies and extending in the vertical direction; The capacitor body includes: First internal electrodes and second internal electrodes alternately stacked in the vertical direction; a dielectric layer interposed between the first internal electrode and the second internal electrode, Each of the first internal electrodes has a first main portion having a polygonal shape in a plan view; a first extension portion extending from the first main portion toward the first external electrode, Each of the second internal electrodes has a second main portion having a polygonal shape in a plan view; a second lead portion extending from the second main portion toward the second external electrode.

15. The first side surface and the second side surface of the capacitor body are provided four in number, and 15. The multilayer ceramic electronic component according to claim 14, wherein the capacitor body has an octagonal shape in a plan view.

16. 16. The multilayer ceramic electronic component according to claim 15, wherein each of the first main portion and the second main portion has an octagonal planar shape.

17. the capacitor body has a regular octagonal shape in a plan view, 16. The multilayer ceramic electronic component according to claim 15, wherein the horizontal width of the first side surface and the horizontal width of the second side surface are the same.

18. A substrate; a multilayer ceramic capacitor mounted on the substrate, The multilayer ceramic capacitor comprises: a capacitor body including first and second internal electrodes stacked in a direction perpendicular to the upper surface of the substrate, the capacitor body having an octagonal planar shape and first and second side surfaces alternately arranged; first external electrodes disposed on the first side of the capacitor body and extending in the perpendicular direction; second external electrodes disposed on the second side of the capacitor body and extending in the perpendicular direction; Each of the first internal electrode and the second internal electrode is The main part and and extension portions extending in different directions from the main portion, the first internal electrode and the second internal electrode have the same planar shape, The electronic device, wherein the first internal electrode and the second internal electrode are twist shifted at an angle of 45°.

19. The lead portion of the first internal electrode extends from the main portion of the first internal electrode toward the first side surface and is connected to the first external electrode, The electronic device of claim 18, wherein the lead portion of the second internal electrode extends from the main portion of the second internal electrode toward the second side surface and is connected to the second external electrode.

20. The electronic device of claim 19, wherein the main portion of each of the first internal electrode and the second internal electrode has an octagonal planar shape.

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