Sensor module and electronic device

Abstract

To provide a sensor module capable of improving effectiveness of increasing accuracy of detection data and reliability.SOLUTION: A sensor module 100 includes: a substrate 21; a substrate 22 which is arranged along a first side 21a of the substrate 21 and which has a sensor device 13a for detecting angular velocity around a y-axis; and a substrate 26 which is arranged in a manner to be superimposed on the substrate 22 on the side of the first side 21a of the substrate 21 and which has a sensor device 13c for detecting the angular velocity around the y-axis.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a sensor module and an electronic device. [Background technology]

[0002] Patent document 1 describes a sensor module that aims to improve the accuracy of X-axis angular velocity data by mounting two X-axis angular velocity sensor devices, which detect angular velocity around the X-axis and output digital X-axis angular velocity data, on the side of the same board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-163955 Summary of the Invention [Problem to be solved by the invention]

[0004] In sensor modules equipped with multiple sensor devices for one detection axis, further improvements are required in terms of the effectiveness and reliability of high precision. [Means for solving the problem]

[0005] A sensor module according to one embodiment of the present application comprises a first substrate, a second substrate arranged along a first edge of the first substrate and having a first sensor device that detects a physical quantity of a first axis, and a third substrate arranged on the first edge side of the first substrate, overlapping the second substrate, and having a second sensor device that detects the physical quantity of the first axis.

[0006] An electronic device according to one aspect of the present application includes the sensor module described above. [Brief explanation of the drawings]

[0007] [Figure 1]FIG. 2 is a perspective view showing a state in which the sensor module according to the first embodiment is fixed to a mounting surface. [Figure 2] FIG. 2 is a perspective view showing the sensor module of FIG. 1 as viewed from the mounting surface side. [Figure 3] FIG. [Figure 4] FIG. [Figure 5] Exploded view of the circuit board unit. [Figure 6A] 5. FIG. 6 is a cross-sectional view taken along line AA in FIG. [Figure 6B] 5. FIG. 6 is a cross-sectional view taken along line AA in FIG. [Figure 7] Configuration diagram of the sensor device. [Figure 8] FIG. 10 is a perspective view of a substrate unit according to a modified example. [Figure 9] FIG. 10 is a development view of a substrate unit according to a modified example. [Figure 10] FIG. 10 is a perspective view showing an example of an electronic device according to a second embodiment. [Figure 11] FIG. 10 is a perspective view showing another example of the electronic device according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] In each drawing, the dimensions of some components may be drawn to different scales to make the components easier to see. In each drawing, the X-axis, Y-axis, and Z-axis are perpendicular to one another. In the following description, the "X-axis direction" refers to a direction parallel to the X-axis, the "Y-axis direction" refers to a direction parallel to the Y-axis, and the "Z-axis direction" refers to a direction parallel to the Z-axis. In the following description, the "plus side" refers to the tip side of the arrow direction of each of the X, Y, and Z axes, and the "minus side" refers to the end side of the arrow direction. In the following description, "planar view" refers to a view from the Z-axis direction relative to a plane that includes the X-axis and Y-axis.

[0009] In the following description, the term "top surface" refers to the surface of the structure on the positive side in the Z-axis direction. For example, "top surface of a substrate" refers to the surface of the substrate on the positive side in the Z-axis direction. In the following description, the term "bottom surface" of a certain component refers to the surface on the negative side in the Z-axis direction of the component.

[0010] 1. Embodiment 1 1 to 9 show a sensor module 100 according to a first embodiment. FIG. 1 is a perspective view showing a state in which a sensor module 100 is fixed to a mounting surface 71 of an automobile or the like. FIG. 2 is a perspective view showing the sensor module 100 of FIG. 1 as seen from the mounting surface 71 side. FIG. 3 is an exploded perspective view of the sensor module 100. FIG. 4 is a plan view of the sensor module 100. FIG. 5 is a development view of the board unit 20. FIG. 6A is a cross-sectional view taken along line AA in FIG. 5, showing an example of a sensor device 12d. FIG. 6B is a cross-sectional view taken along line AA in FIG. 5, showing another example of the sensor device 12d. FIG. 7 is an explanatory diagram showing the internal configuration of the sensor device 12d. FIG. 8 is a perspective view of a board unit 20 according to a modified example. FIG. 9 is a development view of the board unit 20 according to a modified example.

[0011] In this embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the attitude and behavior of a wearable device such as an automobile or a robot. Here, the wearable device can be rephrased as a moving body. The behavior can be rephrased as inertial momentum. In this embodiment, a case where the physical quantity detected by the sensor module 100 is angular velocity and / or acceleration will be described as an example. However, the physical quantity is not limited to angular velocity and / or acceleration, and may be other physical quantities such as velocity, pressure, displacement, attitude, angle, or gravity.

[0012] 1, the sensor module 100 has a housing 50. The housing 50 has a rectangular parallelepiped shape, and is sized such that the length of one side of a square is, for example, about 24 mm, and the thickness is about 10 mm.

[0013] The housing 50 is a case that houses the board unit 20 on which a plurality of sensor devices are mounted. The housing 50 is composed of a box 51 and a lid 58. A board unit 20 on which a plurality of sensor devices are mounted is housed inside the box 51. The board unit 20 will be described later. The housing 50 has screw holes 52. By passing screws 70 through the two screw holes 52, the sensor module 100 is fixed to a mounting surface 71 of a mounting device such as an automobile for use.

[0014] 2, the lid 58 has an opening 59. From the opening 59, the connector 15 of the board unit 20 is exposed.

[0015] The connector 15 is a plug-type connector with multiple pins. A socket-type connector (not shown) is connected to the device to which the sensor module 100 is attached. The sensor module 100 receives power from the power supply circuit of the device to which the sensor module 100 is attached via the connector 15, and transmits electrical signals such as detection data to the device to which the sensor module 100 is attached.

[0016] 1.1.Sensor module configuration FIG. 3 is an exploded perspective view of the sensor module 100 shown in FIG. As shown in FIG. 3, the sensor module 100 is composed of a housing 50 and a board unit 20 housed in the housing 50.

[0017] The box 51 is a base machined into a box shape from aluminum. The material is not limited to aluminum, and other metals such as zinc or stainless steel, resin, or a composite material of metal and resin may also be used.

[0018] An inside 53 of the box 51 is a storage space surrounded by a bottom surface 55 and side walls 54. A boss 62 is provided on the bottom surface 55. The boss 62 functions as a fixing portion that fixes the board unit 20 inside the box 51. A lid 58 is joined to an upper surface 56 of the box 51 via a packing (not shown).

[0019] 1.2.Configuration of the board unit FIG. 4 shows the board unit 20 stored in the box 51, and FIG. 5 shows the board unit 20 in an unfolded state. The unfolded substrate unit 20 is assembled and stored in a box 51 as shown in FIGS. The board unit 20 is held in its assembled state within the box 51 by the boss 62 and the spacer 60 and is fixed within the box 51. In this embodiment, the boss 62 and the spacer 60 are an example of a fixing portion. Note that the board unit 20 may be fixed within the box 51 by other members.

[0020] As shown in FIG. 5, the board unit 20 includes boards 21, 22, 23, 24, 25, 26, 27, 28, 29, and 30, connection portions 41, 42, 43, 44, 45, 46, 47, 48, and 49, sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18.

[0021] The substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, and 30 are hard substrates known as rigid substrates, specifically glass epoxy substrates. The substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, and 30 may also be rigid substrates such as composite substrates or ceramic substrates. The substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, and 30 may have either a multilayer or single-layer structure.

[0022] The connection portions 41, 42, 43, 44, 45, 46, 47, 48, and 49 are substrates that are softer than the substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, and 30. The connection portions 41, 42, 43, 44, 45, 46, 47, 48, and 49 are, for example, flexible printed circuits (FPCs). The connection portions 41, 42, 43, 44, 45, 46, 47, 48, and 49 may be flexible wiring cables, wiring cords, or wires such as flat cables or flat cords. The connection portions 41, 42, 43, 44, 45, 46, 47, 48, and 49 may include connectors, solder, conductive adhesive, crimp terminals, or the like.

[0023] The substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, and 30 and the connecting portions 41, 42, 43, 44, 45, 46, 47, 48, and 49 may be integrated into a rigid-flexible substrate. By using a rigid-flexible substrate, connectors or the like for connecting the substrates are not required, suppressing noise generation and improving detection accuracy. Furthermore, the connectorless design allows for thinner designs and three-dimensional mounting.

[0024] 1.2.1. Configuration of the substrate 21 1.2.1.1. Configuration of the Top Surface of the Substrate 21 An arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18 are mounted on the top surface of the substrate 21. Other electronic components may also be mounted on the top surface of the substrate 21.

[0025] The arithmetic circuit 14 is a primary controller for the sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h. The arithmetic circuit 14 is an integrated circuit device and can be realized by a processor such as an MPU (Micro Processor Unit) or a CPU (Central Processing Unit).

[0026] The arithmetic circuit 14 includes a digital interface, which is a circuit that performs digital interface processing based on a communication standard such as SPI or I2C.

[0027] The arithmetic circuit 14 receives the detection data output from each sensor device, performs various processes on the data, and transmits the processed detection data to the outside via the connector 15. In this embodiment, the arithmetic circuit 14 is an example of a processing unit.

[0028] The various processes performed by the arithmetic circuit 14 include sorting the detection data sent from each sensor device by detection axis, calculating the average value of the detection data for each detection axis, performing temperature correction, zero point correction, alignment correction, etc. on each calculated average value or the received detection data, sensitivity adjustment processing, filter processing, and outputting the processed data from the connector 15.

[0029] Connector 15 is a plug-type connector and has two rows of connection terminals arranged at equal pitches in the Y-axis direction. In this embodiment, connector 15 has 10 pins in each row, for a total of 20 connection terminals, but the number of terminals may be changed as appropriate depending on the design specifications.

[0030] The memory 16 stores programs for executing the various processes performed by the arithmetic circuit 14, programs for incorporating processed detection data into packet data, and data required for executing the programs, such as table data used for temperature correction processing.

[0031] The power supply circuit 17 receives power from the device to be worn and supplies the necessary power to each sensor device, the arithmetic circuit 14, and the like. The temperature sensor 18 outputs temperature information to the arithmetic circuit 14 for use in the temperature correction process.

[0032] 1.2.1.2. Configuration of the bottom surface of the substrate 21 Sensor device 11a and sensor device 11b are mounted on the lower surface of substrate 21. Sensor devices 11a and 11b are angular velocity sensor devices that detect angular velocity around the Z axis. Specifically, they are vibration gyro sensors that use a quartz crystal as an oscillator and detect angular velocity from the Coriolis force acting on the oscillator. The oscillator is not limited to a quartz crystal. For example, the oscillator may be a MEMS (Micro Electro Mechanical Systems) oscillator formed using a silicon substrate. Hereinafter, angle sensors will be described with a similar configuration.

[0033] In this embodiment, the sensor devices 11a and 11b mounted on the substrate 21 have different drive frequencies. Specifically, the drive frequency of the sensor device 11a is 49.6 kHz, and the drive frequency of the sensor device 11b is 51.0 kHz. Because the drive frequencies of the sensor devices 11a and 11b are different in this way, even if the sensor devices 11a and 11b are mounted on the same substrate 21, it is possible to prevent mechanical or electrical interference between the sensor devices 11a and 11b, which are arranged close to each other. This makes it possible to prevent a decrease in the detection accuracy of the sensor devices 11a and 11b.

[0034] In this embodiment, the drive frequencies of the sensor devices 11a and 11b correspond to the drive frequencies of the vibrators of the sensor devices 11a and 11b. Similarly, the drive frequencies of the vibrators of the other sensor devices correspond to the drive frequencies of the other sensor devices. The drive frequencies of the sensor devices will be described in detail in Section 1.2.4.6 below.

[0035] 1.2.2. Configuration of the substrate 30 As shown in FIG. 3, the substrate 30 is disposed parallel to the substrate 21 on the negative side of the substrate 21 in the Z axis direction, and overlaps with the substrate 21 in a plan view.

[0036] 5, sensor device 11c and sensor device 11d are mounted on substrate 30. Sensor devices 11c and 11d are angular velocity sensor devices that detect angular velocity around the Z axis.

[0037] In this embodiment, the sensor devices 11c and 11d mounted on the substrate 30 have different drive frequencies. Specifically, the drive frequency of the sensor device 11c is 49.6 kHz, and the drive frequency of the sensor device 11d is 51.0 kHz. Because the drive frequencies of the sensor devices 11c and 11d are different in this manner, even if the sensor devices 11c and 11d are mounted on the same substrate 30, it is possible to prevent mechanical or electrical interference between the sensor devices 11c and 11d, which are arranged close to each other. This makes it possible to prevent a decrease in the detection accuracy of the sensor devices 11c and 11d.

[0038] In addition, the substrate 21 and the substrate 30 are electrically connected via a connection portion 49 . As described above, since the connecting portion 49 is a substrate that is softer than the substrates 21 and 30, even if mechanical or electrical interference occurs in the substrate 30, the influence of the interference can be prevented from being transmitted to the substrate 21 via the connecting portion 49. Therefore, it is possible to prevent the detection accuracy of the sensor module 100 from decreasing.

[0039] 1.2.3. Configuration along each side of the substrate 21 1.2.3.1. Configuration along the first side 21a 5, the substrate 22 is disposed along the first side 21a of the substrate 21. The substrate 26 is disposed next to the substrate 22 on the first side 21a side of the substrate 21, on the positive side of the Y axis direction.

[0040] As shown in FIG. 3 or 4, when the board unit 20 is assembled, the board 22 and the board 26 are arranged to overlap when the board surfaces of the board 22 and the board 26 are viewed from the Y-axis direction.

[0041] 5, sensor devices 13a and 13b are mounted on substrate 22, and sensor devices 13c and 13d are mounted on substrate 26. Sensor devices 13a, 13b, 13c, and 13d are angular velocity sensor devices that detect angular velocity around the Y axis.

[0042] In this embodiment, the sensor devices 13a and 13b mounted on the substrate 22 have different drive frequencies. Specifically, the drive frequency of the sensor device 13a is 49.6 kHz, and the drive frequency of the sensor device 13b is 51.0 kHz. Because the drive frequencies of the sensor devices 13a and 13b are different in this manner, even if the sensor devices 13a and 13b are mounted on the same substrate 22, it is possible to prevent mechanical or electrical interference between the sensor devices 13a and 13b, which are arranged close to each other. This makes it possible to prevent a decrease in the detection accuracy of the sensor devices 13a and 13b.

[0043] Similarly, sensor device 13c and sensor device 13d mounted on substrate 26 have different drive frequencies. Specifically, sensor device 13c has a drive frequency of 49.6 kHz, and sensor device 13d has a drive frequency of 51.0 kHz. This makes it possible to prevent mechanical or electrical interference between sensor device 13c and sensor device 13d. This makes it possible to prevent a decrease in the detection accuracy of sensor device 13c and sensor device 13d.

[0044] In addition, the substrates 21 and 22 are electrically connected via a connection portion 41 , and the substrates 22 and 26 are electrically connected via a connection portion 45 . As described above, since the connecting portions 41 and 45 are substrates that are softer than the substrates 21, 22, and 26, even if mechanical or electrical interference occurs in the substrate 26, the influence of the interference can be prevented from being transmitted to the substrate 22 via the connecting portion 45. Similarly, even if mechanical or electrical interference occurs in the substrate 22, the influence of the interference can be prevented from being transmitted to the substrate 21 and / or the substrate 26. Therefore, the detection accuracy of the sensor module 100 can be prevented from decreasing.

[0045] 1.2.3.2. Configuration along the second side 21b 5, substrate 23 is disposed along second side 21b of substrate 21. Substrate 27 is disposed next to substrate 23 on the second side 21b of substrate 21, on the positive side of the X-axis direction.

[0046] As shown in FIG. 3 or 4, when the board unit 20 is assembled, the board 23 and the board 27 are arranged to overlap when the board surfaces of the board 23 and the board 27 are viewed from the X-axis direction.

[0047] 5, sensor devices 12e and 12f are mounted on substrate 23, and sensor devices 12g and 12h are mounted on substrate 27. Sensor devices 12e, 12f, 12g, and 12h are angular velocity sensor devices that detect angular velocity around the X axis.

[0048] In this embodiment, the drive frequencies of sensor device 12e and sensor device 12f mounted on substrate 23 are different. Specifically, the drive frequency of sensor device 12e is 49.6 kHz, and the drive frequency of sensor device 12f is 51.0 kHz. Because the drive frequencies of sensor device 12e and sensor device 12f are different in this manner, even if sensor device 12e and sensor device 12f are mounted on the same substrate 23, it is possible to prevent mechanical or electrical interference between sensor device 12e and sensor device 12f, which are arranged close to each other. This makes it possible to prevent a decrease in the detection accuracy of sensor device 12e and sensor device 12f.

[0049] Similarly, the drive frequencies of sensor device 12g and sensor device 12h mounted on substrate 27 are different. Specifically, the drive frequency of sensor device 12g is 49.6 kHz, and the drive frequency of sensor device 12h is 51.0 kHz. This makes it possible to prevent mechanical or electrical interference between sensor device 12g and sensor device 12h. This makes it possible to prevent a decrease in the detection accuracy of sensor device 12g and sensor device 12h.

[0050] In addition, the substrates 21 and 23 are electrically connected via a connection portion 42, and the substrates 23 and 27 are electrically connected via a connection portion 46. As described above, since the connecting portions 42 and 46 are substrates that are softer than the substrates 21, 23, and 27, even if mechanical or electrical interference occurs in the substrate 27, the influence of the interference can be prevented from being transmitted to the substrate 23 via the connecting portion 46. Similarly, even if mechanical or electrical interference occurs in the substrate 23, the influence of the interference can be prevented from being transmitted to the substrate 21 and / or the substrate 27. Therefore, the detection accuracy of the sensor module 100 can be prevented from decreasing.

[0051] 1.2.3.3. Configuration along the third side 21c 5, the substrate 24 is disposed along the third side 21c of the substrate 21. The substrate 28 is disposed next to the substrate 24 on the negative side of the Y axis direction, on the third side 21c side of the substrate 21.

[0052] As shown in FIG. 3 or 4, when the board unit 20 is assembled, the board 24 and the board 28 are arranged to overlap when the board surfaces of the board 24 and the board 28 are viewed from the Y-axis direction.

[0053] 5, sensor devices 13e and 13f are mounted on substrate 24, and sensor devices 13g and 13h are mounted on substrate 28. Sensor devices 13e, 13f, 13g, and 13h are angular velocity sensor devices that detect angular velocity around the Y axis.

[0054] In this embodiment, the drive frequencies of sensor device 13e and sensor device 13f mounted on substrate 24 are different. Specifically, the drive frequency of sensor device 13e is 49.6 kHz, and the drive frequency of sensor device 13f is 51.0 kHz. Because the drive frequencies of sensor device 13e and sensor device 13f are different in this manner, even if sensor device 13e and sensor device 13f are mounted on the same substrate 24, it is possible to prevent mechanical or electrical interference between sensor device 13e and sensor device 13f, which are arranged close to each other. This makes it possible to prevent a decrease in the detection accuracy of sensor device 13e and sensor device 13f.

[0055] Similarly, the drive frequencies of sensor device 13g and sensor device 13h mounted on substrate 28 are different. Specifically, the drive frequency of sensor device 13g is 49.6 kHz, and the drive frequency of sensor device 13h is 51.0 kHz. This makes it possible to prevent mechanical or electrical interference between sensor device 13g and sensor device 13h. This makes it possible to prevent a decrease in the detection accuracy of sensor device 13g and sensor device 13h.

[0056] In addition, the substrates 21 and 24 are electrically connected via a connection portion 43 , and the substrates 24 and 28 are electrically connected via a connection portion 47 . As described above, since the connecting portions 43 and 47 are substrates that are softer than the substrates 21, 24, and 28, even if mechanical or electrical interference occurs in the substrate 28, the influence of the interference can be prevented from being transmitted to the substrate 24 via the connecting portion 47. Similarly, even if mechanical or electrical interference occurs in the substrate 24, the influence of the interference can be prevented from being transmitted to the substrate 21 and / or the substrate 28. Therefore, the detection accuracy of the sensor module 100 can be prevented from decreasing.

[0057] 1.2.3.4. Configuration along the fourth side 21d 5, substrate 25 is disposed along fourth side 21d of substrate 21. Substrate 29 is disposed next to substrate 25 on the negative side of the X-axis direction, on the fourth side 21d of substrate 21.

[0058] As shown in FIG. 3 or 4, when the board unit 20 is assembled, the board 25 and the board 29 are arranged to overlap when the board surfaces of the board 25 and the board 29 are viewed from the X-axis direction.

[0059] 5, sensor devices 12a and 12b are mounted on substrate 25, and sensor devices 12c and 12d are mounted on substrate 29. Sensor devices 12a, 12b, 12c, and 12d are angular velocity sensor devices that detect angular velocity around the X axis.

[0060] In this embodiment, the sensor devices 12a and 12b mounted on the substrate 25 have different drive frequencies. Specifically, the drive frequency of the sensor device 12a is 49.6 kHz, and the drive frequency of the sensor device 12b is 51.0 kHz. Because the drive frequencies of the sensor devices 12a and 12b are different in this manner, even if the sensor devices 12a and 12b are mounted on the same substrate 25, it is possible to prevent mechanical or electrical interference between the sensor devices 12a and 12b, which are arranged close to each other. This makes it possible to prevent a decrease in the detection accuracy of the sensor devices 12a and 12b.

[0061] Similarly, sensor device 12c and sensor device 12d mounted on substrate 29 have different drive frequencies. Specifically, sensor device 12c has a drive frequency of 49.6 kHz, and sensor device 12d has a drive frequency of 51.0 kHz. This makes it possible to prevent mechanical or electrical interference between sensor device 12c and sensor device 12d. This makes it possible to prevent a decrease in the detection accuracy of sensor device 12c and sensor device 12d.

[0062] In addition, the substrates 21 and 25 are electrically connected via a connection portion 44, and the substrates 25 and 29 are electrically connected via a connection portion 48. As described above, since the connecting portions 44 and 48 are substrates that are softer than the substrates 21, 25, and 29, even if mechanical or electrical interference occurs in the substrate 29, the influence of the interference can be prevented from being transmitted to the substrate 25 via the connecting portion 48. Similarly, even if mechanical or electrical interference occurs in the substrate 25, the influence of the interference can be prevented from being transmitted to the substrate 21 and / or the substrate 29. Therefore, the detection accuracy of the sensor module 100 can be prevented from decreasing.

[0063] 1.2.4.Sensor Devices 1.2.4.1.Angular velocity sensor device that detects angular velocity around the Z axis As shown in FIG. 5, the sensor module 100 includes four sensor devices 11a, 11b, 11c, and 11d as angular velocity sensor devices that detect angular velocity around the Z axis.

[0064] Of the four sensor devices 11a, 11b, 11c, and 11d, the drive frequencies of the sensor devices 11a and 11c are each 49.6 kHz, and the drive frequencies of the sensor devices 11b and 11d are each 51.0 kHz.

[0065] In other words, the sensor module 100 of this embodiment has four sensor devices 11a, 11b, 11c, and 11d as angular velocity sensor devices that detect angular velocity around the Z axis, but there is no need to provide each of the four sensor devices 11a, 11b, 11c, and 11d with a different driving frequency.

[0066] Therefore, the sensor module 100 of this embodiment can reduce the costs required to prepare four sensor devices 11a, 11b, 11c, and 11d with different drive frequencies, such as costs for manufacturing, ordering, inventory, or assembly, thereby improving its industrial value.

[0067] The number of angular velocity sensor devices that detect the angular velocity around the Z axis is not limited to 4. For example, the number of angular velocity sensor devices that detect the angular velocity around the Z axis may be 2, 3, 6, etc. When the number of angular velocity sensor devices is two, one is mounted on the substrate 21 and one is mounted on the substrate 30. When the number of angular velocity sensor devices is three, another board may be placed parallel to the board 30 on the negative side of the Z axis direction of the board 30, and one may be mounted on each board. If there are six angular velocity sensor devices, three may be mounted on each of substrate 21 and substrate 30, or another substrate may be placed parallel to substrate 30 on the negative side of substrate 30 in the Z-axis direction, with two mounted on each substrate.

[0068] 1.2.4.2.Angular velocity sensor device that detects angular velocity around the Y axis As shown in FIG. 5, the sensor module 100 includes eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h as angular velocity sensor devices that detect angular velocity around the Y axis.

[0069] Of the eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h, the drive frequencies of sensor devices 13a, 13c, 13e, and 13g are each 49.6 kHz, and the drive frequencies of sensor devices 13b, 13d, 13f, and 13h are each 51.0 kHz.

[0070] In other words, the sensor module 100 of this embodiment has eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h, but there is no need to provide each of the eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h with a different driving frequency.

[0071] Therefore, the sensor module 100 of this embodiment can reduce the costs required to prepare eight sensor devices 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h with different drive frequencies, such as costs for manufacturing, ordering, inventory, or assembly, thereby improving its industrial value.

[0072] The number of angular velocity sensor devices that detect the angular velocity around the Y axis is not limited to 8. For example, the number of angular velocity sensor devices that detect the angular velocity around the Y axis may be 2, 12, etc. When the number of angular velocity sensor devices is two, one may be mounted on each of the substrates 22 and 26, and the substrates 24 and 28 may be omitted. If there are 12 angular velocity sensor devices, three may be mounted on each of the substrates 22, 24, 26, and 28, or another substrate may be placed parallel to the substrate 26 on the positive side of the Y axis direction of the substrate 26, and another substrate may be placed parallel to the substrate 28 on the negative side of the Y axis direction of the substrate 28, with two mounted on each substrate.

[0073] 1.2.4.3.Angular velocity sensor device that detects angular velocity around the X axis As shown in FIG. 5, the sensor module 100 includes eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, and 12h as angular velocity sensor devices that detect angular velocity around the X axis.

[0074] Of the eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, and 12h, the drive frequencies of sensor devices 12a, 12c, 12e, and 12g are each 49.6 kHz, and the drive frequencies of sensor devices 12b, 12d, 12f, and 12h are each 51.0 kHz.

[0075] In other words, the sensor module 100 of this embodiment has eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, and 12h, but there is no need to provide different drive frequencies for each of the eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, and 12h.

[0076] Therefore, the sensor module 100 of this embodiment can reduce the costs required to prepare eight sensor devices 12a, 12b, 12c, 12d, 12e, 12f, 12g, and 12h with different drive frequencies, such as costs for manufacturing, ordering, inventory, or assembly, thereby improving its industrial value.

[0077] The number of angular velocity sensor devices that detect the angular velocity around the X axis is not limited to 8. For example, the number of angular velocity sensor devices that detect the angular velocity around the X axis may be 2, 12, etc. When the number of angular velocity sensor devices is two, one may be mounted on each of the substrates 25 and 29, and the substrates 23 and 27 may be omitted. If there are 12 angular velocity sensor devices, three may be mounted on each of the boards 23, 25, 27, and 29, or another board may be placed parallel to the board 27 on the positive side of the X-axis direction of the board 27, and another board may be placed parallel to the board 29 on the negative side of the X-axis direction of the board 29, so that two may be mounted on each board.

[0078] 1.2.4.4.Sensor Device Packaging 6A and 6B are cross-sectional views taken along line AA in FIG. 5, illustrating the packaging of the sensor device. While FIGS. 6A and 6B show cross-sectional views of sensor device 12d, other sensor devices are similarly configured. In FIGS. 6A and 6B, the orientations of the X, Y, and Z axes are the same as in FIGS. 3 and 4.

[0079] In this embodiment, the sensor device 12d in Fig. 6A is a physical quantity sensor that detects angular velocity with the X-axis as its detection axis, and the sensor device 12d in Fig. 6B is a composite physical quantity sensor that detects angular velocity with the X-axis as its detection axis and acceleration with the X-axis as its detection axis.

[0080] As shown in FIGS. 6A and 6B, the sensor device 12d includes a package 7, and the sensor element 3 and the circuit element 4, or the sensor elements 3a and 3b and the circuit element 4, housed in the package 7.

[0081] The package 7 has a base 5 with a recessed portion that opens to the top surface, and a lid 6 that is joined to the top surface of the base 5 via a joining member so as to close the opening of the recessed portion. An internal space S is formed inside the package 7 by the recessed portion.

[0082] The package 7 is, for example, a ceramic package. The base 5 is made of a ceramic such as alumina, and the lid 6 is made of a ceramic such as alumina or a metal material such as Kovar.

[0083] Sensor device 12d in Fig. 6A accommodates a sensor element 3 and a circuit element 4 in an internal space S. Sensor element 3 is an angular velocity sensor element that detects angular velocity around the X axis, and includes an oscillator 1 and a support substrate 2. Oscillator 1 is a quartz oscillator. Circuit element 4 includes a detection circuit, which will be described later.

[0084] The internal space S is airtight and in a reduced pressure state, preferably in a state closer to a vacuum, which improves the vibration characteristics of the vibrator 1. However, the atmosphere of the internal space S is not particularly limited.

[0085] In the internal space S, the vibrator 1, the support substrate 2, and the circuit element 4 are arranged so as to overlap one another in a plan view. This configuration can suppress the expansion of the planar area of the package 7 in the directions along the X-axis and / or Y-axis, which is advantageous for miniaturization.

[0086] A plurality of internal terminals 8a and 8b are provided in the recess of the base 5, and a plurality of external terminals 8c are provided on the surface of the base 5 on the negative side in the X-axis direction. These internal terminals 8 a and 8 b and external terminal 8 c are electrically connected to wiring (not shown) formed within base 5 and on substrate 29 . The internal terminal 8 a is electrically connected to the sensor element 3 via a conductive bonding member, and the internal terminal 8 b is electrically connected to the circuit element 4 via a bonding wire 9 .

[0087] The sensor device 12d of FIG. 6B accommodates the sensor elements 3a and 3b and the circuit element 4 in the internal space S. The sensor element 3a is an angular velocity sensor element that detects angular velocity around the X axis, and like the sensor element 3, it has an oscillator that undergoes flexural vibration and detects angular velocity using Coriolis force.

[0088] Sensor element 3b is an acceleration sensor element that detects acceleration in the X-axis direction. Sensor element 3b includes a quartz crystal oscillator and detects acceleration using changes in the oscillation frequency of the quartz crystal oscillator. Sensor element 3b may also include a silicon MEMS with comb-shaped fixed and movable electrodes and detect acceleration using changes in capacitance formed between them. The circuit element 4 includes a detection circuit, which will be described later.

[0089] In the embodiment shown in FIG. 6A, the sensor device 12d includes a sensor element 3 that detects an angular velocity around the X axis, but the sensor device 12d is not limited to this configuration. For example, the sensor device 12d may include, in addition to the sensor element 3, a sensor element that detects an angular velocity around the Y axis and / or a sensor element that detects an angular velocity around the Z axis. For example, in the sensor device 12d, the sensor element 3 may be a sensor element that detects acceleration in the Y-axis direction. Furthermore, the sensor element 3 may include a sensor element that detects acceleration in the Z-axis direction and / or a sensor element that detects angular velocity around the Z-axis, in addition to the sensor element that detects acceleration in the Y-axis direction.

[0090] In the embodiment shown in FIG. 6B, the sensor device 12d includes a sensor element 3a that detects angular velocity around the X axis and a sensor element 3b that detects acceleration in the X axis direction, but the sensor device 12d is not limited to this configuration. For example, the sensor device 12d may include, in addition to the sensor elements 3a and 3b, a sensor element that detects angular velocity around the Y axis and / or a sensor element that detects acceleration in the Y axis direction. For example, the sensor device 12d may include, in addition to the sensor elements 3a and 3b, a sensor element that detects angular velocity around the Z axis and / or a sensor element that detects acceleration in the Z axis direction. For example, the sensor element 3a may be a three-axis sensor element that detects angular velocities around the X, Y, and Z axes. For example, the sensor element 3b may be a three-axis sensor element that detects acceleration in each of the X, Y, and Z axis directions. For example, the sensor element 3a may be a two-axis sensor element that detects angular velocity around the Y-axis or Z-axis in addition to the X-axis, or a three-axis sensor element that detects angular velocity around each of the X, Y, and Z axes. For example, the sensor element 3b may be a two-axis sensor element that detects acceleration in the Y-axis or Z-axis direction in addition to the X-axis direction, or a three-axis sensor element that detects acceleration in each of the X, Y, and Z-axis directions. For example, the sensor element 3a may be a triaxial sensor element that detects angular velocity around each of the X, Y, and Z axes, and the sensor element 3b may be a triaxial sensor element that detects acceleration in each of the X, Y, and Z axis directions. In other words, the sensor device 12d may be a triaxial angular velocity sensor device and a triaxial acceleration sensor device, or a 6DoF (Six degrees of freedom) sensor device.

[0091] When a ceramic package is used for the package 7, the package 7 can be rephrased as a hard substrate. In this case, the sensor elements 3, 3a, and 3b can be rephrased as a sensor device 12d. When a ceramic package is used as the package 7, the package 7 may be configured to be mounted directly on the connection portion 48 without the substrate 29 being interposed therebetween.

[0092] 1.2.4.5. Configuration of Sensor and Circuit Elements Fig. 7 shows a detailed configuration example of the sensor element 3 and the circuit element 4 of the sensor device 12d shown in Fig. 6A. The configuration in Fig. 7 can also be used in other sensor devices.

[0093] The sensor device 12d includes a sensor element 3 and a circuit element 4. The sensor element 3 includes a vibrator 1, and the circuit element 4 includes a drive circuit 81 and a detection circuit .

[0094] The drive circuit 81 includes an amplifier circuit that receives the feedback signal DG from the vibrator 1 and amplifies the signal, an AGC (Automatic Gain Control) circuit that performs automatic gain control, and an output circuit that outputs the drive signal DS to the vibrator 1. The AGC circuit automatically adjusts the gain so that the amplitude of the feedback signal DG from the vibrator 1 remains constant. The output circuit outputs the drive signal DS, for example, a square wave, to the vibrator 1.

[0095] The detection circuit 82 may include an amplifier circuit, a synchronous detection circuit, an A / D conversion circuit, etc. The amplifier circuit receives the detection signals S1 and S2 from the vibrator 1 and performs charge-to-voltage conversion and signal amplification of the detection signals S1 and S2, which are differential signals. The synchronous detection circuit uses a synchronization signal from the drive circuit 81 to perform synchronous detection for extracting a desired wave. The A / D conversion circuit converts the analog detection signals S1 and S2 after synchronous detection into digital detection data D1 and outputs it to the arithmetic circuit 14. In this embodiment, the detection data D1 is an example of a detection signal.

[0096] The arithmetic circuit 14 performs various processes on the detection data D1, such as temperature correction, zero point correction, sensitivity adjustment, and filter processing, and outputs the processed detection data D2 to the outside via the connector 15. In this embodiment, the detection data D2 is an example of an output signal.

[0097] In this embodiment, the vibrator 1 has a double T-type structure. As the vibrator 1, a tuning fork type or H-type vibrator may also be used. The vibrator 1 has drive arms 98a, 98b, 98c, and 98d, detection arms 99a and 99b, a base 91, and connecting arms 92a and 92b.

[0098] The base 91 has a rectangular shape, and is provided on each side with a detection arm 99a, a detection arm 99b, a connecting arm 92a, and a connecting arm 92b. A drive arm 98a and a drive arm 98b are provided at the tip of the connecting arm 92a. A drive arm 98c and a drive arm 98d are provided at the tip of the connecting arm 92b.

[0099] The driving arms 98a, 98b, 98c, and 98d and the detection arms 99a and 99b are provided at their tips with weights for adjusting the frequency. If the X-axis direction is the thickness direction of the vibrator 1, the vibrator 1 detects angular velocity around the X-axis.

[0100] Drive electrodes 93 are formed on the upper and lower surfaces of the drive arms 98a and 98b. Drive electrodes 94 are formed on the positive and negative surfaces of the drive arms 98a and 98b in the Y axis direction. Drive electrodes 94 are formed on the upper and lower surfaces of the drive arms 98c and 98d. Drive electrodes 93 are formed on the positive and negative surfaces of the drive arms 98c and 98d in the Y axis direction.

[0101] The drive electrodes 93 and 94 are electrically connected to a drive circuit 81. The drive circuit 81 supplies a drive signal DS to the drive electrode 93, and receives a feedback signal DG from the drive electrode 94.

[0102] A detection electrode 95 is formed on the upper and lower surfaces of the detection arm 99a. A ground electrode 97 is formed on the surface of the detection arm 99a on the positive side in the Y axis direction and on the negative side in the Y axis direction. A detection electrode 96 is formed on the upper and lower surfaces of the detection arm 99b. A ground electrode 97 is formed on the surfaces of the detection arm 99b on the positive and negative sides in the Y axis direction. The detection electrodes 95 and 96 are electrically connected to the detection circuit 82. The detection signals S1 and S2 from the detection electrodes 95 and 96 are input to the detection circuit 82.

[0103] 1.2.4.6. Operation of Sensor and Circuit Elements The sensor element 3 and the circuit element 4 operate as follows. When a drive signal DS is applied from the drive circuit 81 to the drive electrode 93, the drive arms 98a, 98b, 98c, and 98d undergo bending vibration as indicated by arrows C1 due to the inverse piezoelectric effect. Specifically, the tips of the drive arms 98a and 98c repeatedly move toward and away from each other, and the tips of the drive arms 98b and 98d also repeatedly move toward and away from each other.

[0104] In other words, the drive arms 98a, 98b, 98c, and 98d alternate between the vibration mode indicated by the solid arrow C1 and the vibration mode indicated by the dotted arrow C1 at a predetermined frequency, which may be, for example, 49.6 kHz.

[0105] In this embodiment, the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d is an example of the drive frequency of the sensor device 12d. The frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d may be defined by the frequency of the drive signal DS. This is because the frequency of the drive signal DS is correlated with the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d. Similarly, the drive frequency of the sensor device 12d may be defined by another signal that is correlated with the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d.

[0106] The bending vibration of the drive arms 98a and 98b and the bending vibration of the drive arms 98c and 98d are vibrations that are symmetrical with respect to the Z axis that passes through the center of gravity of the base 91. Therefore, the bending vibration of the drive arms 98a, 98b, 98c, and 98d causes almost no vibration in the base 91, the connecting arms 92a and 92b, and the detection arms 99a and 99b.

[0107] In this state, when an angular velocity about the X-axis is applied to the vibrator 1, the Coriolis force causes the drive arms 98a, 98b, 98c, and 98d to vibrate as shown by arrow C2. In other words, the Coriolis force acting in the direction of arrow C2, which is perpendicular to the direction of arrow C1 and the direction of the Y-axis, acts on the drive arms 98a, 98b, 98c, and 98d, generating a vibration component in the direction of arrow C2.

[0108] The vibration of the arrow C2 is transmitted to the base portion 91 via the connecting arms 92a and 92b, causing the detection arms 99a and 99b to vibrate in a bending manner in the direction of the arrow C3. Charge signals generated by the piezoelectric effect due to the bending vibration of the detection arms 99a and 99b are input to the detection circuit 82 as detection signals S1 and S2, and the angular velocity around the X axis is detected.

[0109] 1.3. Variations The above-described embodiment may be modified in various ways. FIG. 8 is a perspective view of the board unit 20 according to the modified example, and FIG. 9 is a development view of the board unit 20 according to the modified example.

[0110] In the sensor module 100 of the modified example, similar to the first embodiment described above, the board unit 20 includes boards 21, 22, 23, 24, 25, 26, 27, 28, 29, and 30, connection portions 41, 42, 43, 44, 45, 46, 47, 48, and 49, sensor devices 11a, 11b, 11c, 11d, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18. In FIG. 9, the boards 25, 26, 27, and 28 and connection portions 45, 46, and 47 are not shown.

[0111] In the substrate unit 20 according to the modified example, the connection relationship between the substrates 21, 22, 23, 24, 25, 26, 27, 28, and 29 and the connection portions 41, 42, 43, 44, 45, 46, 47, and 48 is different from the configuration described above.

[0112] As shown in FIG. 9 , substrate 22 is electrically connected to substrate 21 via connection portion 41. Substrate 23 is electrically connected to substrate 22 via connection portion 42. Substrate 24 is electrically connected to substrate 23 via connection portion 43. Substrate 25 (not shown) is electrically connected to substrate 24 via connection portion 44. Substrate 26 (not shown) is electrically connected to substrate 25 (not shown) via connection portion 45 (not shown). Substrate 27 (not shown) is electrically connected to substrate 26 (not shown) via connection portion 46 (not shown). Substrate 28 (not shown) is electrically connected to substrate 27 (not shown) via connection portion 47 (not shown). Substrate 29 is electrically connected to substrate 28 (not shown) via connection portion 48.

[0113] In other words, the substrates 22 to 29 are connected in a line like a string of beads. 8, when assembling the board units 20, starting from the first side 21a of the board 21, the boards 22 to 29 are rotated clockwise two times along the four sides of the board 21. In this way, the board unit 20 according to the modified example can be assembled by simply rotating the boards 22 to 29 clockwise two times along the four sides of the board 21. Therefore, the board unit 20 according to the modified example is easy to assemble, and the productivity of the sensor module 100 can be improved.

[0114] As shown in FIG. 8, when the substrate unit 20 according to the modified example is assembled, the positions of the substrates 21, 22, 23, 24, 25, 26, 27, 28, 29, and 30 are the same as those in the first embodiment.

[0115] Specifically, substrates 22 and 26 are arranged along the first side 21a of substrate 21, substrates 23 and 27 are arranged along the second side 21b of substrate 21, substrates 24 and 28 are arranged along the third side 21c of substrate 21, substrates 25 and 29 are arranged along the fourth side 21d of substrate 21, and substrate 30 is arranged on the negative side of substrate 21 in the Z-axis direction.

[0116] Substrate 22 is electrically connected to substrate 21 via connection portion 41, and substrate 26 is electrically connected to substrate 22 via connection portion 45. More specifically, substrate 26 is electrically connected to substrate 22 via connection portion 45, substrate 25, connection portion 44, substrate 24, connection portion 43, substrate 23, and connection portion 42.

[0117] Substrate 23 is electrically connected to substrate 21 via connection portion 42, and substrate 27 is electrically connected to substrate 23 via connection portion 46. More specifically, substrate 23 is electrically connected to substrate 21 via connection portion 42, substrate 22, and connection portion 41, and substrate 27 is electrically connected to substrate 23 via connection portion 46, substrate 26, connection portion 45, substrate 25, connection portion 44, substrate 24, and connection portion 43.

[0118] Substrate 24 is electrically connected to substrate 21 via connection portion 43, and substrate 28 is electrically connected to substrate 24 via connection portion 47. More specifically, substrate 24 is electrically connected to substrate 21 via connection portion 43, substrate 23, connection portion 42, substrate 22, and connection portion 41, and substrate 28 is electrically connected to substrate 24 via connection portion 47, substrate 27, connection portion 46, substrate 26, connection portion 45, substrate 25, and connection portion 44.

[0119] Substrate 25 is electrically connected to substrate 21 via connection portion 44, and substrate 29 is electrically connected to substrate 25 via connection portion 48. More specifically, substrate 25 is electrically connected to substrate 21 via connection portion 44, substrate 24, connection portion 43, substrate 23, connection portion 42, substrate 22, and connection portion 41, and substrate 29 is electrically connected to substrate 25 via connection portion 48, substrate 28, connection portion 47, substrate 27, connection portion 46, substrate 26, and connection portion 45.

[0120] In a modified example, arithmetic circuit 14 may be placed on board 24 or board 25 located near the center of the row of daisy-chained boards. This shortens the distance between arithmetic circuit 14 and board 29, and the distance between arithmetic circuit 14 and board 30, thereby reducing the transmission load. Alternatively, arithmetic circuit 14 may be distributed across each board.

[0121] As described above, the sensor module 100 of this embodiment has the following advantages. The sensor module 100 of this embodiment comprises a substrate 21 as a first substrate, a substrate 22 as a second substrate arranged along a first side 21a of the substrate 21 and having a sensor device 13a that detects an angular velocity around the Y axis as a first sensor device that detects a physical quantity of the first axis, and a substrate 26 as a third substrate arranged on the first side 21a of the substrate 21 so as to overlap with the substrate 22 and having a sensor device 13c that detects an angular velocity around the Y axis as a second sensor device that detects a physical quantity of the first axis.

[0122] Thus, the sensor module 100 of this embodiment comprises a substrate 21, a substrate 22 arranged along the first side 21a of the substrate 21, a substrate 26 arranged overlapping the substrate 22 on the first side 21a side of the substrate 21, a sensor device 13a that detects an angular velocity around the Y axis, and a sensor device 13c that detects an angular velocity around the Y axis, where the substrate 22 has the sensor device 13a and the substrate 26 has the sensor device 13c.

[0123] Therefore, in the sensor module 100 of this embodiment, mechanical and / or electrical interference between the sensor device 13a mounted on the substrate 22 and the sensor device 13c mounted on the substrate 26 is suppressed. Therefore, in a configuration including a plurality of angular velocity sensor devices around the Y axis, the sensor module 100 of this embodiment can improve the effectiveness of increasing the accuracy of angular velocity data.

[0124] In the sensor module 100 of this embodiment, the detection axis of the angular velocity sensor devices mounted on the substrate 22 and the substrate 26 may be the X-axis or the Z-axis. This allows the sensor module 100 of this embodiment to improve the effectiveness of improving the accuracy of angular velocity data in a configuration including a plurality of angular velocity sensor devices around the X-axis or the Z-axis.

[0125] In the sensor module 100 of this embodiment, the angular velocity sensor devices mounted on the substrate 22 and the substrate 26 may be acceleration sensor devices. This allows the sensor module 100 of this embodiment to improve the effectiveness of increasing the accuracy of the acceleration sensor devices in a configuration including a plurality of acceleration sensor devices.

[0126] In the sensor module 100 of this embodiment, the angular velocity sensor devices mounted on the substrate 22 and the substrate 26 may be physical quantity sensors that detect other physical quantities such as velocity, pressure, displacement, attitude, angle, or gravity. This allows the sensor module 100 of this embodiment to improve the effectiveness of increasing the accuracy of the physical quantity sensors in a configuration including a plurality of physical quantity sensors.

[0127] The sensor module 100 of this embodiment further includes a connection portion 41 as a first connection portion that is arranged between the substrate 21 and the substrate 22 and electrically connects the substrate 21 and the substrate 22, and a connection portion 45 as a second connection portion that is arranged between the substrate 22 and the substrate 26 and electrically connects the substrate 22 and the substrate 26.

[0128] As described above, in the sensor module 100 of this embodiment, the substrates 21 and 22 are electrically connected via the connection portion 41, and the substrates 22 and 26 are electrically connected via the connection portion 45. Therefore, the sensor module 100 of this embodiment can suppress mechanical or electrical interference between the substrate 21 and the substrate 22, and / or between the substrate 22 and the substrate 26. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of increasing the accuracy of the detection data D2.

[0129] In the sensor module 100 of this embodiment, the first connection portion and the second connection portion are each an FPC board. The connecting portion 41 is a substrate that is softer than the substrates 21, 22, and 26. Therefore, the sensor module 100 of this embodiment can suppress mechanical or electrical interference between the substrates 21 and 22 and / or between the substrates 22 and 26. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of increasing the accuracy of the detection data D2.

[0130] Therefore, in the sensor module 100 of this embodiment, the arithmetic circuit 14 processes each detection data D1 detected by each sensor device based on a configuration that ensures the effectiveness of high accuracy, and therefore the sensor module 100 of this embodiment can obtain detection data D2 with high accuracy and reliability.

[0131] In the sensor module 100 of this embodiment, the drive frequency of the sensor device 13a is the same as the drive frequency of the sensor device 13c. As described above, the sensor module 100 of this embodiment has a plurality of sensor devices 13a and 13c, but it is not necessary to prepare the plurality of sensor devices 13a and 13c each having a different drive frequency. Therefore, the sensor module 100 of this embodiment can reduce the costs required to prepare multiple sensor devices 13a, 13c each having a different driving frequency, such as costs for manufacturing, ordering, inventory, or assembly, thereby improving its industrial utility.

[0132] In the sensor module 100 of this embodiment, the substrate 21 further includes an arithmetic circuit 14 as a processing unit that processes detection data D1 as detection signals from the sensor device 13a and the sensor device 13c. Therefore, in the sensor module 100 of this embodiment, the arithmetic circuit 14 processes each detection data D1 detected by each sensor device based on a configuration that ensures the effectiveness of high accuracy, and therefore the sensor module 100 of this embodiment can obtain detection data D2 with high accuracy and reliability.

[0133] In the sensor module 100 of this embodiment, the substrate 21 further includes a connector 15 that outputs the detection data D2 as an output signal processed by the arithmetic circuit 14. Therefore, the sensor module 100 of this embodiment is capable of outputting highly accurate and reliable detection data D2 processed by the arithmetic circuit 14 to the outside via the connector 15, based on a configuration that ensures the effectiveness of high accuracy.

[0134] The sensor module 100 of this embodiment further includes a boss 62 and a spacer 60 as fixing parts for fixing the substrate 21, the substrate 22, and the substrate 26 together. Therefore, it is possible to easily and reliably arrange the substrate 22 along the first side 21a of the substrate 21, and arrange the substrate 26 on top of the substrate 22 on the first side 21a side of the substrate 21. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of increasing the accuracy of the detection data D2.

[0135] The sensor module 100 of this embodiment further includes a housing 50 that houses the substrates 21, 22, and 26. Therefore, the substrates 21, 22, and 26 on which the sensor devices are mounted are housed in the housing 50 and shielded from the outside. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of increasing the accuracy of the detection data D2.

[0136] The sensor module 100 of this embodiment further includes a substrate 23 as a fourth substrate, which is arranged along the second side 21b of the substrate 21 and has a sensor device 12e that detects an angular velocity about the X axis as a third sensor device that detects a physical quantity of the second axis, and a substrate 27 as a fifth substrate, which is arranged on the second side 21b of the substrate 21 so as to overlap with the substrate 23 and has a sensor device 12g that detects an angular velocity about the X axis as a fourth sensor device that detects a physical quantity of the second axis.

[0137] As such, the sensor module 100 of this embodiment further includes a substrate 23 arranged along the second side 21b of the substrate 21, a substrate 27 arranged overlapping the substrate 23 on the second side 21b side of the substrate 21, a sensor device 12e that detects an angular velocity around the X axis, and a sensor device 12g that detects an angular velocity around the X axis, where the substrate 23 has the sensor device 12e and the substrate 27 has the sensor device 12g.

[0138] Therefore, sensor module 100 of this embodiment further suppresses mechanical and / or electrical interference between sensor device 12e mounted on substrate 23 and sensor device 12g mounted on substrate 27. Therefore, sensor module 100 of this embodiment can improve the effectiveness of improving the accuracy of angular velocity data in a configuration including multiple angular velocity sensor devices about the Y axis and multiple angular velocity sensor devices about the X axis.

[0139] In the sensor module 100 of this embodiment, the angular velocity sensor devices mounted on the substrate 23 and the substrate 27 may be acceleration sensor devices. This allows the sensor module 100 of this embodiment to improve the effectiveness of increasing the accuracy of the acceleration sensor devices in a configuration including a plurality of acceleration sensor devices.

[0140] In the sensor module 100 of this embodiment, the angular velocity sensor devices mounted on the substrate 23 and the substrate 27 may be physical quantity sensors that detect other physical quantities such as velocity, pressure, displacement, attitude, angle, or gravity. This allows the sensor module 100 of this embodiment to improve the effectiveness of increasing the accuracy of the physical quantity sensors in a configuration including a plurality of physical quantity sensors.

[0141] The sensor module 100 of this embodiment further includes a connection portion 42 as a third connection portion that is arranged between the substrate 21 and the substrate 23 and electrically connects the substrate 21 and the substrate 23, and a connection portion 46 as a fourth connection portion that is arranged between the substrate 23 and the substrate 27 and electrically connects the substrate 23 and the substrate 27.

[0142] As described above, in the sensor module 100 of this embodiment, the substrates 21 and 23 are electrically connected via the connection portion 42, and the substrates 23 and 27 are electrically connected via the connection portion 46. Therefore, the sensor module 100 of this embodiment can suppress mechanical or electrical interference between the substrate 21 and the substrate 23, and / or between the substrate 23 and the substrate 27. Therefore, the sensor module 100 of this embodiment can improve the effectiveness and reliability of increasing the accuracy of the detection data D2.

[0143] 2. Embodiment 2 In the second embodiment, an electronic device including the sensor module 100 will be described. In the following, examples of electronic devices will be described, including a mobile device such as a smartphone and a mobile object such as an automobile.

[0144] 2.1. Overview of mobile devices FIG. 10 is a perspective view of a mobile device as an electronic device according to the second embodiment, showing the configuration of a smartphone 110 as an example of the mobile device.

[0145] The smartphone 110 is equipped with the sensor module 100 . The detection data D2 of the sensor module 100 is received by the control unit 111. The control unit 111 recognizes the posture and behavior of the smartphone 110 from the received detection data D2, and can change the image displayed on the display unit, sound an alarm or sound effect, or drive a vibration motor to vibrate the main unit.

[0146] The sensor module 100 may be mounted on a portable device other than the smartphone 110. For example, the sensor module 100 may be mounted on a portable device such as a smartwatch, a portable activity meter, a head mounted display (HMD), a mobile personal computer (PC), a tablet PC, a camera, or a personal digital assistant (PDA). This enables the portable device to recognize its posture and behavior based on the detection data D2 from the sensor module 100, and to change the displayed image, sound an alarm or sound effect, or drive a vibration motor to vibrate the main body.

[0147] In this manner, in this embodiment, a mobile device such as a smartphone 110 is equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of a mobile device equipped with the sensor module 100 can be improved.

[0148] 2.2. Overview of Mobile Vehicles FIG. 11 is a perspective view of a moving body as an electronic device according to the second embodiment, showing the configuration of an automobile 130 as an example of the moving body.

[0149] The automobile 130 is equipped with the sensor module 100 . The sensor module 100 detects the attitude of the vehicle body 131 and transmits the detected data D2 to the vehicle body attitude control device 132. The detected data D2 includes an angular velocity signal and an acceleration signal. When the vehicle body attitude control device 132, which controls the attitude of the vehicle body 131, receives the detection data D2 from the sensor module 100, it detects the attitude of the vehicle body 131 based on the signal, and controls the hardness of the suspension or the brakes of each wheel 133 according to the detection results.

[0150] The detection data D2 of the sensor module 100 may also be used in ECUs (Electronic Control Units) such as keyless entry, immobilizers, car navigation systems, car air conditioners, anti-lock braking systems (ABS), airbags, TPMS (Tire Pressure Monitoring Systems), engine controls, inertial navigation control equipment for autonomous driving, and battery monitors for hybrid and electric vehicles.

[0151] The sensor module 100 may be mounted on a moving body other than the automobile 130. Examples of the moving body include a bipedal robot, a train, a radio-controlled airplane, a radio-controlled helicopter, a drone, agricultural machinery, and construction machinery. The moving body equipped with the sensor module 100 can utilize the detection data D2 of the sensor module 100 for posture control, position measurement, and the like of the moving body.

[0152] In this manner, in this embodiment, a mobile object such as an automobile 130 is equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of the mobile object equipped with the sensor module 100 can be improved.

[0153] Although the preferred embodiment has been described above, the present invention is not limited to the above embodiment. The configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above embodiment, and any configuration can be added. [Explanation of symbols]

[0154] 1... resonator, 2... support substrate, 3... sensor element, 3a... sensor element, 3b... sensor element, 4... circuit element, 5... base, 6... lid, 7... package, 8a... internal terminal, 8b... internal terminal, 8c... external terminal, 9... bonding wire, 11a, 11b, 11c, 11d, 11d, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h...sensor device, 14...arithmetic circuit, 15...connector, 16...memory, 17...power supply circuit, 18...temperature sensor, 20...board unit, 21...board, 21a...first side, 21b...second side, 21c...third side, 21d...fourth side, 22, 23, 24, 25, 26, 27, 28, 29, 30...board, 41, 42, 43, 44, 45, 46, 47, 48, 49...Connection part, 50...Housing, 51...Box, 52...Screw hole, 53...Inside, 54...Side wall, 55...Bottom surface, 56...Top surface, 58...Lid, 59...Opening, 60...Spacer, 62...Boss, 70...Screw, 71...Mounting surface, 81...Drive circuit, 82...Detection circuit, 91...Base, 92a...Connecting arm, 92b...Connecting arm, 93...Drive electrode, 94...Drive electrode, 95...Detection electrode, 96...Detection electrode Pole, 97...ground electrode, 98a, 98b, 98c, 98d...drive arm, 99a, 99b...detection arm, 100...sensor module, 110...smartphone, 111...control unit, 130...automobile, 131...vehicle body, 132...vehicle body attitude control device, 133...wheel, C1, C2, C3...arrow, D1, D2...detection data, S1, S2...detection signal, DS...drive signal, DG...feedback signal.

Claims

1. a first substrate; a second substrate disposed along a first side of the first substrate and having a first sensor device configured to detect a physical quantity of a first axis; a third substrate disposed on the first side of the first substrate so as to overlap the second substrate, the third substrate having a second sensor device configured to detect a physical quantity of the first axis; Sensor module.

2. a first connection portion disposed between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate; a second connection portion disposed between the second substrate and the third substrate and electrically connecting the second substrate and the third substrate; The sensor module according to claim 1 .

3. The first connection portion and the second connection portion are each an FPC board. The sensor module according to claim 2 .

4. The drive frequency of the first sensor device is the same as the drive frequency of the second sensor device. The sensor module according to claim 1 .

5. the first substrate has a processing unit that processes detection signals from the first sensor device and the second sensor device; The sensor module according to claim 1 .

6. The first substrate has a connector that outputs an output signal processed by the processing unit. The sensor module according to claim 5 .

7. a fixing portion that fixes the first substrate, the second substrate, and the third substrate, The sensor module according to claim 1 .

8. a housing that houses the first board, the second board, and the third board, The sensor module according to claim 1 .

9. a fourth substrate disposed along a second side of the first substrate and having a third sensor device configured to detect a physical quantity of a second axis; a fifth substrate disposed on the second side of the first substrate so as to overlap the fourth substrate, and having a fourth sensor device that detects a physical quantity of the second axis; The sensor module according to claim 1 .

10. a third connection portion disposed between the first substrate and the fourth substrate and electrically connecting the first substrate and the fourth substrate; a fourth connection portion disposed between the fourth substrate and the fifth substrate and electrically connecting the fourth substrate and the fifth substrate; The sensor module according to claim 9 .

11. An electronic device comprising the sensor module according to any one of claims 1 to 10.

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