Laser irradiation apparatus

Abstract

To provide a laser irradiation apparatus that emits laser light to improve heat dissipation.SOLUTION: A laser irradiation apparatus includes a sub-mount including a first surface and a second surface opposite to the first surface, a laser element being provided to the first surface and configured to emit laser light, a heat radiation unit being provided to the second surface, and a moving mechanism configured to change a relative position of the laser element and an irradiation target object.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laser irradiation device. [Background technology]

[0002] 2. Description of the Related Art Processing devices that irradiate a laser beam to process an object to be processed and recording devices that perform recording, such as printing, on an object to be recorded are known.

[0003] For example, Patent Document 1 describes a three-dimensional printer device having a printer head configured with a light-emitting element array in which laser elements are arranged, a liquid tank that contains a photocurable liquid that hardens when exposed to light emitted from the printer head, and a stage section on which a molded product formed by hardening when exposed to light is attached. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-154714 Summary of the Invention [Problem to be solved by the invention]

[0005] In the laser irradiation device that irradiates the above-mentioned laser light, it is required to improve the heat dissipation property. [Means for solving the problem]

[0006] One aspect of the laser irradiation device according to the present invention is a submount having a first surface and a second surface opposite the first surface; a laser element provided on the first surface and configured to irradiate laser light; a heat dissipation portion provided on the second surface; a moving mechanism that changes the relative position between the laser element and an object to be irradiated; It has. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view schematically showing a laser irradiation device according to a first embodiment. [Figure 2] FIG. 2 is a bottom view schematically showing the laser irradiation device according to the first embodiment. [Figure 3] FIG. 1 is a cross-sectional view schematically showing a laser irradiation device according to a first embodiment. [Figure 4] FIG. 2 is a cross-sectional view schematically showing a laser element of the laser irradiation device according to the first embodiment. [Figure 5] FIG. 1 is a cross-sectional view schematically showing a laser irradiation device according to a first embodiment. [Figure 6] FIG. 1 is a plan view schematically showing a laser irradiation device according to a first embodiment. [Figure 7] FIG. 1 is a cross-sectional view schematically showing a laser irradiation device according to a first embodiment. [Figure 8] 5 is a flowchart for explaining the processing of a control unit of the laser irradiation device according to the first embodiment. [Figure 9] FIG. 10 is a perspective view schematically showing a laser irradiation device according to a first modified example of the first embodiment. [Figure 10] FIG. 10 is a plan view schematically showing a laser irradiation device according to a second modified example of the first embodiment. [Figure 11] FIG. 10 is a perspective view schematically showing a laser irradiation device according to a second embodiment. [Figure 12] FIG. 10 is a cross-sectional view schematically showing a laser irradiation device according to a second embodiment. [Figure 13] 10 is a flowchart for explaining the processing of a control unit of a laser irradiation device according to the second embodiment. [Figure 14] FIG. 10 is a perspective view schematically showing a laser irradiation device according to a modified example of the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Preferred embodiments of the present invention will be described in detail below with reference to the drawings. Note that the embodiments described below do not unduly limit the content of the present invention as defined in the claims. Furthermore, not all of the configurations described below are necessarily essential components of the present invention.

[0009] 1. First embodiment 1.1. Laser irradiation device Configuration First, a laser irradiation device according to the first embodiment will be described with reference to the drawings. Fig. 1 is a perspective view schematically showing a laser irradiation device 100 according to the first embodiment. Fig. 2 is a bottom view schematically showing the laser irradiation device 100. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2, schematically showing the laser irradiation device 100.

[0010] For convenience, Fig. 2 does not show components other than the head 10 of the laser irradiation device 100. Fig. 3 shows a simplified illustration of the laser element 18 of the laser irradiation device 100. Figs. 1 to 3 also show an X-axis, a Y-axis, and a Z-axis as three mutually orthogonal axes. The X-axis and Y-axis directions are, for example, horizontal directions. The Z-axis direction is, for example, vertical directions.

[0011] As shown in FIGS. 1 to 3, the laser irradiation device 100 includes, for example, a head 10, a mounting substrate 20, a support member 30, a heat dissipation unit 40, a moving mechanism 50, an optical element 60, a stage 70, and a control unit 80. The laser irradiation device 100 is, for example, a laser processing device. The laser irradiation device 100 is, for example, a laser melting method (Selective Laser Melting). It is a metal 3D printer that uses Selective Laser Melting (SLM).

[0012] As shown in Figures 2 and 3, the head 10 has, for example, a package 11, a submount 12, a first pad 13, a first wire bonding 14, a via 15, a second pad 16, a second wire bonding 17, and a laser element 18.

[0013] As shown in FIG. 3, the package 11 accommodates a submount 12, a first pad 13, a first wire bonding 14, a second pad 16, a second wire bonding 17, and a laser element 18.

[0014] The package 11 has, for example, a base 11a and a lid 11b. The base 11a is mounted on a mounting substrate 20. The base 11a is made of a ceramic material such as aluminum nitride or aluminum oxide. The lid 11b is connected to the base 11a. The lid 11b transmits light from the laser element 18. The lid 11b is made of a material such as quartz or glass.

[0015] The submount 12 is provided on the base 11a. The submount 12 has, for example, a plate-like shape. The submount 12 has a first surface 12a and a second surface 12b opposite to the first surface 12a. The first surface 12a and the second surface 12b face in opposite directions. In the illustrated example, the first surface 12a faces the −Z-axis direction. The second surface 12b faces the +Z-axis direction. In the example shown in FIG. 2, the submount 12 has a rectangular shape. The submount 12 has, for example, insulating properties. The material of the submount 12 is, for example, a ceramic such as aluminum nitride or aluminum oxide.

[0016] The first pad 13 is provided on the base 11a of the package 11. The first pad 13 is electrically connected to the laser element 18 via a first wire bonding 14. For example, only one first pad 13 is provided. The first pad 13 is electrically connected to a drive circuit provided on the mounting substrate 20 via a via 15, for example.

[0017] The second pad 16 is provided on the base 11a of the package 11. The second pad 16 is electrically connected to the laser element 18 via a second wire bonding 17. A plurality of second pads 16 are provided corresponding to the plurality of laser elements 18. In the illustrated example, the plurality of second pads 16 are arranged in the Y-axis direction. The second pads 16 are electrically connected to a drive circuit provided on the mounting substrate 20, for example, via a via (not shown). The pads 13 and 16, the wire bonding 14 and 17, and the via 15 are made of copper, aluminum, gold, or the like.

[0018] The laser element 18 is provided on the first surface 12a of the submount 12. In the illustrated example, the laser element 18 is in contact with the first surface 12a. The laser element 18 irradiates laser light, for example, in the -Z-axis direction. The laser element 18 is, for example, a photonic crystal surface emitting laser (PCSEL) that utilizes the photonic crystal effect. The laser light emitted from the laser element 18, which is a PCSEL, has a narrow radiation angle and high optical output. For example, a plurality of laser elements 18 are provided. In the illustrated example, eight laser elements 18 are provided, but the number is not particularly limited. The plurality of laser elements 18 are arranged, for example, in the Y-axis direction.

[0019] Fig. 4 is a cross-sectional view schematically showing the laser element 18. As shown in Fig. 4, the laser element 18 has, for example, a substrate 101, a first semiconductor layer 102, a first guide layer 103, a light emitting layer 104, a second guide layer 105, a second semiconductor layer 106, a contact layer 107, a first electrode 108, and a second electrode 109.

[0020] The substrate 101 is, for example, an n-type semiconductor substrate doped with Si. The substrates 101 are continuous with each other in adjacent laser elements 18. The substrate 101 is integrally provided for multiple laser elements 18. The substrate 101 is a common substrate for multiple laser elements 18.

[0021] The first semiconductor layer 102 is provided on the substrate 101. The first semiconductor layer 102 is provided between the substrate 101 and the first guide layer 103. The first semiconductor layer 102 is, for example, an n-type GaN layer doped with Si.

[0022] The first guide layer 103 is provided on the first semiconductor layer 102. The first guide layer 103 is provided between the first semiconductor layer 102 and the light emitting layer 104. The first guide layer 103 has, for example, an SL (Semiconductor Superlattice) structure made up of an i-type GaN layer and an InGaN layer that are not intentionally doped with impurities. The number of GaN layers and InGaN layers that make up the first guide layer 103 is not particularly limited.

[0023] An opening 103a is formed in the first guide layer 103. The opening 103a is, for example, a hole. The planar shape of the opening 103a is, for example, a circle or a polygon. The diameter of the opening 103a is, for example, not less than 50 nm and not more than 500 nm.

[0024] The "diameter of opening 103a" refers to the diameter when the planar shape of opening 103a is a circle, and refers to the diameter of the smallest circle that includes opening 103a when the planar shape of opening 103a is not a circle. For example, when the planar shape of opening 103a is a polygon, the diameter of opening 103a refers to the diameter of the smallest circle that includes the polygon, and when the planar shape of opening 103a is an ellipse, the diameter of opening 103a refers to the diameter of the smallest circle that includes the ellipse. The diameter of the smallest circle included in the part.

[0025] A plurality of openings 103a are provided. The plurality of openings 103a are spaced apart from one another. The interval between adjacent openings 103a is, for example, 1 nm or more and 500 nm or less. The plurality of openings 103a are arranged at a predetermined pitch along a predetermined direction in a plan view. The plurality of openings 103a are arranged, for example, in the form of a regular triangular lattice or a square lattice. The plurality of openings 103a exhibit a photonic crystal effect.

[0026] The "pitch of the openings 103a" refers to the distance between the centers of adjacent openings 103a in a predetermined direction. If the planar shape of the openings 103a is a circle, the "center of the openings 103a" refers to the center of the circle. If the planar shape of the openings 103a is not a circle, the "center of the openings 103a" refers to the center of the smallest encompassing circle. For example, if the planar shape of the openings 103a is a polygon, the center of the smallest circle that contains the polygon. If the planar shape of the openings 103a is an ellipse, the center of the smallest circle that contains the ellipse.

[0027] The light emitting layer 104 is provided on the first guide layer 103. The light emitting layer 104 is provided between the first guide layer 103 and the second guide layer 105. The light emitting layer 104 emits light when a current is injected into it. The light emitting layer 104 has, for example, a well layer and a barrier layer. The well layer and the barrier layer are i-type semiconductor layers that are not intentionally doped with impurities. The well layer is, for example, an InGaN layer. The barrier layer is, for example, a GaN layer. The light emitting layer 104 has an MQW (Multiple Quantum Well) structure composed of the well layer and the barrier layer.

[0028] There is no particular limitation on the number of well layers and barrier layers that constitute the light-emitting layer 104. For example, only one well layer may be provided, in which case the light-emitting layer 104 has an SQW (Single Quantum Well) structure.

[0029] The second guide layer 105 is provided on the light emitting layer 104. The second guide layer 105 is provided between the light emitting layer 104 and the second semiconductor layer 106. The second guide layer 105 has an SL structure composed of, for example, an i-type GaN layer that is not intentionally doped with impurities and an InGaN layer. The number of GaN layers and InGaN layers that make up the second guide layer 105 is not particularly limited. The first guide layer 103 and the second guide layer 105 have the function of increasing the optical confinement coefficient of the laser element 18.

[0030] Although not shown, the multiple openings 103a may not be formed in the first guide layer 103 but may be formed in the second guide layer 105. Alternatively, the openings 103a may be filled with a material having a refractive index lower than that of the first guide layer 103.

[0031] The second semiconductor layer 106 is provided on the second guide layer 105. The second semiconductor layer 106 is provided between the second guide layer 105 and the contact layer 107. The second semiconductor layer 106 is, for example, a p-type GaN layer doped with Mg. The first semiconductor layer 102 and the second semiconductor layer 106 are cladding layers that have the function of confining light in the light emitting layer 104.

[0032] The contact layer 107 is provided on the second semiconductor layer 106. The contact layer 107 is provided between the second semiconductor layer 106 and the second electrode 109. The contact layer 107 is, for example, a p-type GaN layer doped with Mg. The impurity concentration of the contact layer 107 is higher than the impurity concentration of the second semiconductor layer 106.

[0033] The first electrode 108 is provided in the +Z-axis direction of the substrate 101. The substrate 101 may be in ohmic contact with the first electrode 108. The first electrode 108 is connected to the substrate 101 via the substrate 101. The first electrode 108 is electrically connected to the first semiconductor layer 102 via a first bonding wire 14. The first electrodes 108 are continuous with each other in adjacent laser elements 18. The first electrode 108 is integrally provided in a plurality of laser elements 18. The first electrode 108 is a common electrode in a plurality of laser elements 18. The first electrode 108 is formed by laminating, for example, a Ni layer and an Au layer in this order from the substrate 101 side. The first electrode 108 is one of the electrodes for injecting a current into the light-emitting layer 104.

[0034] The second electrode 109 is provided on the contact layer 107. The contact layer 107 may be in ohmic contact with the second electrode 109. The second electrode 109 is electrically connected to the second semiconductor layer 106 via the contact layer 107. The second electrode 109 is electrically connected to the second pad 16 via a second wire bonding 17. The second electrode 109 is formed by laminating, for example, a Cr layer, a Ni layer, and an Au layer in this order from the contact layer 107 side. The second electrode 109 is the other electrode for injecting a current into the light-emitting layer 104.

[0035] A through-hole 109a is formed in the second electrode 109. The through-hole 109a penetrates the second electrode 109. Light generated in the light-emitting layer 104 is emitted through the through-hole 109a. When viewed from the Z-axis direction, the region of the contact layer 107 that overlaps with the through-hole 109a is a light-emitting region from which the light generated in the light-emitting layer 104 is emitted.

[0036] In laser element 18, a p-type second semiconductor layer 106, an i-type light-emitting layer 104 and guide layers 103 and 105 that are not intentionally doped with impurities, and an n-type first semiconductor layer 102 form a p-i-n diode. In laser element 18, when a forward bias voltage of the p-i-n diode is applied between first electrode 108 and second electrode 109 by a drive circuit (not shown), a current is injected into light-emitting layer 104, causing recombination of electrons and holes in light-emitting layer 104. This recombination generates light. Light generated in light-emitting layer 104 propagates in a direction perpendicular to the Z-axis direction and forms a standing wave due to the photonic crystal effect of multiple openings 103a. The light then receives gain in light-emitting layer 104 and oscillates as a laser. Then, laser element 18 emits the diffracted light in the Z-axis direction as laser light.

[0037] Although the above description has been given of an InGaN-based light emitting layer 104, various material systems that can emit light when a current is injected depending on the wavelength of the emitted light can be used for the light emitting layer 104. For example, semiconductor materials such as AlGaN-based, AlGaAs-based, InGaAs-based, InGaAsP-based, InP-based, GaP-based, and AlGaP-based materials can be used.

[0038] Fig. 5 is a cross-sectional view schematically showing the laser irradiation device 100. Fig. 6 is a plan view schematically showing the laser irradiation device 100. Fig. 5 is a cross-sectional view taken along line VV in Fig. 6. For convenience, Fig. 5 omits illustration of members other than the head 10, the mounting substrate 20, the support member 30, and the heat dissipation unit 40.

[0039] The mounting substrate 20 supports the head 10, as shown in Figures 5 and 6. In the illustrated example, the mounting substrate 20 is provided in the +Z-axis direction of the head 10. The mounting substrate 20 is provided between the head 10 and the support member 30. The mounting substrate 20 is, for example, a ceramic substrate. The mounting substrate 20 may also be a silicon substrate. The mounting substrate 20 may be provided with a drive circuit that drives the laser element 18.

[0040] The support member 30 supports the mounting substrate 20. In the illustrated example, the support member 30 is provided in the +Z-axis direction of the mounting substrate 20. The support member 30 is provided between the mounting substrate 20 and the heat dissipation section 40. The support member 30 is, for example, plate-shaped. As shown in FIG. 6, the support member 30 is supported by two guide rails 52 of the movement mechanism 50. The support member 30 is provided across the two guide rails 52. The material of the support member 30 is, for example, a metal such as iron, aluminum, or copper.

[0041] The heat dissipation unit 40 is supported by the support member 30. In the illustrated example, the heat dissipation unit 40 is provided in the +Z-axis direction of the support member 30. The heat dissipation unit 40 is provided on the second surface 12b of the submount 12, for example, via the support member 30, the mounting substrate 20, and the base 11a of the package 11. In other words, the heat dissipation unit 40 and the submount 12 are thermally connected to each other via the support member 30, the mounting substrate 20, and the base 11a of the package 11. "Thermal connection" refers to a state in which heat conduction is possible between connected components, either directly connected to each other or connected to each other via a thermally conductive material. The heat dissipation unit 40 dissipates heat generated by the laser element 18 via the submount 12, the base 11a, the mounting substrate 20, and the support member 30. The heat dissipation unit 40 is, for example, electrically conductive. The thermal conductivity of the heat dissipation unit 40 is higher than, for example, the thermal conductivity of the substrate 101, the thermal conductivity of the submount 12, and the thermal conductivity of the mounting substrate 20. The thermal conductivity of the heat dissipation unit 40 may be higher than the thermal conductivity of the support member 30. The material of the heat dissipation unit 40 is, for example, a metal such as copper.

[0042] As shown in FIG. 5, the heat dissipation unit 40 has, for example, a plate-shaped portion 42 and a plurality of fins 44. The plate-shaped portion 42 is provided on the support member 30. The plate-shaped portion 42 is provided between the support member 30 and the plurality of fins 44. The fins 44 are provided on the plate-shaped portion 42. In the illustrated example, the fins 44 protrude from the plate-shaped portion 42 in the +Z-axis direction. The fins 44 are, for example, provided integrally with the plate-shaped portion 42. The plurality of fins 44 are arranged, for example, in the Y-axis direction. As shown in FIG. 6, when viewed from the Z-axis direction, the fins 44 extend in the X-axis direction.

[0043] The movement mechanism 50 has, for example, guide rails 52 and a motor (not shown). For example, two guide rails 52 are provided. The two guide rails 52 are aligned in the Y-axis direction. The submount 12 is supported by the two guide rails 52 via the base 11a of the package 11, the mounting substrate 20, and the support member 30. The two guide rails 52 do not overlap the irradiation target 2 in a planar view. The two guide rails 52 do not overlap the head 10 in a planar view. In other words, the two guide rails 52 do not overlap the laser element 18 in a planar view.

[0044] The movement mechanism 50 changes the relative position between the laser element 18 and the irradiation object 2 using a motor (not shown). The motor is controlled by the control unit 80. In the example shown, the movement mechanism 50 moves the laser element 18 in the +X-axis direction. The movement mechanism 50 moves the head 10, the mounting substrate 20, the support member 30, and the heat dissipation unit 40 in the +X-axis direction. The guide rail 52 extends, for example, in the X-axis direction. The movement mechanism 50 moves the laser element 18 along the guide rail 52. The movement mechanism 50 may further have an encoder (not shown). The movement mechanism 50 does not move the irradiation object 2.

[0045] Fig. 7 is a cross-sectional view taken along line VII-VII in Fig. 1, schematically illustrating the laser irradiation device 100. For convenience, Fig. 7 shows a simplified illustration of the head 10. Fig. 7 also omits the mounting substrate 20, the support member 30, the heat dissipation unit 40, and the movement mechanism 50.

[0046] As shown in FIG. 7, the laser light L emitted from the laser element 18 is incident on the optical element 60. The optical element 60 is provided between the head 10 and the irradiation target 2. Although not shown, the optical element 60 may be supported by a guide rail 52. Optical element 60 For example, the optical element 60 focuses the laser light L from the laser element 18. The optical element 60 is, for example, a lens array. It is preferable that the focal point of the lens constituting the optical element 60 is positioned on the irradiation object 2. This can shorten the irradiation time of the irradiation object 2. For example, a plurality of lenses constituting the optical element 60 are provided corresponding to the number of laser elements 18.

[0047] The irradiation object 2 is supplied and placed on the stage 70. The irradiation object 2 is provided between the head 10 and the stage 70. The irradiation object 2 is, for example, an object to be processed by the laser light L from the laser element 18. The irradiation object 2 is, for example, a metal powder that can be melted by the laser light L. The irradiation object 2 is supplied by a supply machine (not shown).

[0048] The stage 70 includes, for example, a stage base 72, an elevator mechanism 74, and a housing 76 that houses the stage base 72 and the elevator mechanism 74.

[0049] An irradiation object 2 is provided on the stage base 72. The head 10 irradiates the irradiation object 2 on the stage base 72 with laser light L, forming a molten portion 2a and a non-melted portion 2b in the irradiation object 2. The molten portion 2a is melted by irradiation with the laser light L, and then cooled and solidified. The non-melted portion 2b is not irradiated with the laser light L. Therefore, the non-melted portion 2b is not solidified and remains as metal powder.

[0050] The elevator mechanism 74 supports the stage base 72. In the illustrated example, the elevator mechanism 74 moves the stage base 72 in the -Z axis direction. As the stage base 72 moves, the irradiation object 2 moves. After the stage base 72 has moved in the -Z axis direction, the supply machine again supplies the irradiation object 2 for the second layer. The irradiation object 2 for the second layer is supplied on top of the irradiation object 2 for the first layer. Then, the head 10 irradiates the laser light L onto the irradiation object 2 for the second layer.

[0051] As described above, by repeating the series of steps of supplying irradiation objects 2 by the supply device, irradiating the laser light L by the head 10, and moving the stage base 72 by the elevator mechanism 74, a laminate consisting of multiple layers of irradiation objects 2 can be formed. Then, the unmelted portions 2b of the laminate are removed by a removal device (not shown), thereby forming a three-dimensional object of a predetermined shape. Examples of the removal device include an air blower and a brush.

[0052] The control unit 80 is configured, for example, by a computer having a processor, a main memory device, and an input / output interface for inputting and outputting signals from and to the outside. The control unit 80 performs various functions, for example, by the processor executing a program loaded into the main memory device. Specifically, the control unit 80 controls the laser element 18, the movement mechanism 50, and the elevator mechanism 74. Note that the control unit 80 may be configured not by a computer but by a combination of multiple circuits.

[0053] 1, the laser irradiation device 100 may have a calibration device 90. The calibration device 90 may have a light receiving element that receives the laser light L. If the calibration device 90 is provided, even if the characteristics of the laser element 18 deviate from the design values, the deviation can be detected by the calibration device 90 and fed back to the processing.

[0054] 1.1.2. Operation Next, the operation of the laser irradiation device 100 according to the first embodiment will be described with reference to the drawings. Specifically, the processing of the control unit 80 of the laser irradiation device 100 according to the first embodiment will be described. The process will be described with reference to the drawings. Fig. 8 is a flowchart for explaining the process of the control unit 80.

[0055] The user operates, for example, an operation unit (not shown) to output a processing start signal for starting processing to the control unit 80. The operation unit is configured with, for example, a mouse, keyboard, touch panel, etc. The control unit 80 starts processing when it receives the processing start signal.

[0056] First, as shown in FIG. 8, the control unit 80 performs a data acquisition process to acquire modeling data for forming a three-dimensional object (step S1).

[0057] The modeling data includes information regarding, for example, the material of the metal powder that constitutes the irradiation object 2, the number of layers of the irradiation object 2, the moving speed of the head 10, the on / off state of the plurality of laser elements 18, and the like.

[0058] The modeling data is created, for example, by loading shape data into slicer software installed on a computer connected to the laser irradiation device 100. The shape data is data representing the target shape of a three-dimensional object created using three-dimensional CAD (Computer Aided Design) software, three-dimensional CG (Computer Graphics) software, or the like. Examples of the shape data include data in STL (Standard Triangulated Language) format and AMF (Additive Manufacturing File Format). The slicer software divides the target shape of the three-dimensional object into layers of a predetermined thickness and creates modeling data for each layer. The modeling data is expressed in G-code, M-code, or the like. The control unit 80 acquires the modeling data from a computer connected to the laser irradiation device 100 or a recording medium such as a USB (Universal Serial Bus) memory.

[0059] Next, the control unit 80 controls the laser element 18 and the moving mechanism 50 to perform a processing process in which the relative positions of the laser element 18 and the irradiation object 2 are changed while irradiating the irradiation object 2 with the laser light L (step S2).

[0060] Specifically, the control unit 80 drives the motor of the movement mechanism 50 to move the laser element 18 in the +X-axis direction while causing the laser element 18 to irradiate the laser light L based on the modeling data. This allows the irradiation object 2 to be processed. As shown in FIG. 7, a melted portion 2a and a non-melted portion 2b are formed in the irradiation object 2.

[0061] Next, as shown in FIG. 8, the control unit 80 performs a determination process to determine whether or not formation of all layers of the irradiation target 2 has been completed based on the modeling data (step S3).

[0062] If it is determined that the formation of all layers of the irradiation object 2 has not been completed ("NO" in step S3), the control unit 80 returns the process to step S2. The control unit 80 repeats steps S2 and S3 until it determines in step S3 that the formation of all layers of the irradiation object 2 has been completed.

[0063] On the other hand, if the control unit 80 determines that the formation of all layers of the irradiation object 2 has been completed ("YES" in step S3), the control unit 80 performs a non-melted portion removal process (step S4) to cause the removal device to remove the non-melted portion 2b of the layered body made up of the irradiation object 2. This results in the formation of a three-dimensional object. Then, the control unit 80 ends the process.

[0064] The unmelted portion 2b may be removed manually by the user. In this case, the control unit 80 ends the process after determining that the formation of all layers of the irradiation object 2 has been completed.

[0065] 1.1.3. Effects The laser irradiation device 100 includes a submount 12 having a first surface 12a and a second surface 12b opposite to the first surface 12a, a laser element 18 provided on the first surface 12a and irradiating laser light L, a heat dissipation section 40 provided on the second surface 12b, and a movement mechanism 50 that changes the relative position between the laser element 18 and the irradiation object 2.

[0066] Therefore, in the laser irradiation device 100, the heat of the laser element 18 can be dissipated from the heat dissipation section 40 via the submount 12. This improves heat dissipation. This reduces fluctuations in the output of the laser element 18 due to heat. As a result, the operation of the laser element 18 can be stabilized.

[0067] In the laser irradiation device 100, the submount 12 has insulating properties. Therefore, in the laser irradiation device 100, it is possible to prevent current from passing through the submount 12 and reaching the heat dissipation section 40.

[0068] In the laser irradiation device 100, the heat dissipation section 40 has electrical conductivity, and therefore the heat dissipation section 40 can have high thermal conductivity.

[0069] In the laser irradiation device 100, the movement mechanism 50 has two guide rails 52, and the submount 12 is supported by the two guide rails 52. Therefore, in the laser irradiation device 100, the submount 12 can be supported more stably than in a case where the submount is supported by a single guide rail.

[0070] In the laser irradiation device 100, the two guide rails 52 do not overlap the laser element 18 in a plan view. Therefore, in the laser irradiation device 100, the heat of the laser element 18 can be efficiently dissipated from the heat dissipation section 40.

[0071] In the laser irradiation device 100, the heat dissipation section 40 has a plurality of fins 44. Therefore, in the laser irradiation device 100, the heat of the laser element 18 can be dissipated from the plurality of fins 44.

[0072] In the laser irradiation device 100, the movement mechanism 50 moves the laser element 18 in the X-axis direction, which is a first direction, and in plan view, each of the multiple fins 44 extends in the X-axis direction. Therefore, in the laser irradiation device 100, the air resistance experienced by the fins 44 can be reduced. This allows the laser element 18 to move smoothly.

[0073] In the laser irradiation device 100, the irradiation object 2 is an object to be processed by the laser light L from the laser element 18. Therefore, the laser irradiation device 100 can process the irradiation object 2 with high precision.

[0074] In the laser irradiation device 100, the laser element 18 is a PCSEL. Therefore, in the laser irradiation device 100, the radiation angle of the laser light L from the laser element 18 can be narrowed. This allows the irradiation time of the irradiation object 2 to be shortened.

[0075] 1.2. Modified laser irradiation device 1.2.1. First variant Next, a laser irradiation device according to a first modified example of the first embodiment will be described with reference to the drawings. Fig. 9 is a cross-sectional view schematically showing a laser irradiation device 110 according to the first modified example of the first embodiment.

[0076] Hereinafter, in the laser irradiation device 110 according to the first modified example of the first embodiment, components having the same functions as the components of the laser irradiation device 100 according to the first embodiment described above will be denoted by the same reference numerals, and detailed description thereof will be omitted. This also applies to the laser irradiation device according to the second modified example of the first embodiment described later.

[0077] In the above-described laser irradiation device 100, as shown in FIG. 1, the head 10 was moved in the +X-axis direction during the processing.

[0078] 9, in the laser irradiation device 110, the head 10 is fixed to a fixed portion 112. The laser irradiation device 110 has, for example, the fixed portion 112 and a base 114.

[0079] The fixed portion 112 is provided across the guide rail 52 of the movement mechanism 50. The head 10 does not move during processing. The head 10 is spaced apart from the movement mechanism 50 and is positioned above the movement mechanism 50. Only one guide rail 52 is provided.

[0080] The base 114 supports the guide rails 52. The guide rails 52 are provided on the base 114. The stage 70 is provided on the guide rails 52. During processing, the control unit 80 controls the movement mechanism 50 to move the stage 70 in the +X-axis direction. As the stage 70 moves, the irradiation object 2 moves in the +X-axis direction. This changes the relative position between the laser element 18 and the irradiation object 2.

[0081] 1.2.2. Second variant Next, a laser irradiation device according to a second modified example of the first embodiment will be described with reference to the drawings. Fig. 10 is a plan view schematically showing a laser irradiation device 120 according to the second modified example of the first embodiment.

[0082] In the above-described laser irradiation device 100, as shown in FIG. 6, the fins 44 extend in the X-axis direction when viewed from the Z-axis direction.

[0083] In contrast, in the laser irradiation device 120, as shown in Fig. 10, the fins 44 extend in a direction inclined with respect to the X-axis direction when viewed from the Z-axis direction. That is, when viewed from the Z-axis direction, the fins 44 do not extend in the X-axis direction and do not extend in a direction perpendicular to the X-axis direction. The fins 44 extend in a direction inclined with respect to the X-axis direction and the Y-axis direction. In the example shown in the figure, the fins 44 extend in a direction inclined by 30° with respect to the X-axis direction. Note that the extension direction of the fins 44 is not particularly limited as long as it is inclined with respect to the X-axis direction.

[0084] In the laser irradiation device 120, the movement mechanism 50 moves the laser element 18 in the X-axis direction, which is a first direction, and in a plan view, each of the multiple fins 44 extends in a second direction inclined with respect to the X-axis direction. Therefore, in the laser irradiation device 120, the amount of air hitting the fins 44 can be increased, thereby improving heat dissipation. Although not shown, a cooling fan for cooling the heat dissipation unit 40 may be provided in the -X-axis direction of the heat dissipation unit 40. The cooling fan may blow air in the +X-axis direction.

[0085] 2. Second embodiment 2.1. Laser irradiation device Next, a laser irradiation device according to a second embodiment will be described with reference to the drawings. Fig. 11 is a perspective view showing a laser irradiation device 200 according to the second embodiment. Fig. 12 is a perspective view showing a laser irradiation device 200 according to the second embodiment, taken along line XII-X of Fig. 11. 12 is a cross-sectional view taken along line II. For convenience, the head 10 is shown in a simplified form in Fig. 12. Also, the mounting substrate 20, the support member 30, and the heat dissipation section 40 are not shown in Fig. 12.

[0086] Hereinafter, in the laser irradiation device 200 according to the second embodiment, components having the same functions as the components of the laser irradiation device 100 according to the first embodiment described above will be given the same reference numerals, and detailed explanations thereof will be omitted.

[0087] In the above-described laser irradiation device 100, the irradiation object 2 is an object to be processed by the laser light L from the laser element 18, as shown in FIGS.

[0088] 11 and 12, in the laser irradiation device 200, the irradiation object 2 is a recording object on which recording is performed by the laser light L from the laser element 18. The laser irradiation device 200 is a recording device.

[0089] The laser irradiation device 200 has, for example, a support rod 202. For example, two support rods 202 are provided. In the illustrated example, the two support rods 202 are aligned in the Y-axis direction. The support rods 202 have a shape that extends in the X-axis direction. The head 10 is supported by the support rods 202 via a support member 30.

[0090] The movement mechanism 50 is separated from the support member 30. The movement mechanism 50 is located on the −Z axis direction of the head 10. The movement mechanism 50 has, for example, a transport unit 54 and a support unit 56.

[0091] The transport unit 54 transports the irradiation object 2 toward the support unit 56. In the illustrated example, the transport unit 54 transports the irradiation object 2 in the -X axis direction. The irradiation object 2 is wrapped around the transport unit 54. The transport unit 54 is, for example, a roller that supplies the irradiation object 2 to the support unit 56. The shape of the irradiation object 2 is, for example, a sheet.

[0092] The support unit 56 is provided, for example, in the -X axis direction of the transport unit 54. The support unit 56 supports the irradiation object 2 transported from the transport unit 54 when recording on the irradiation object 2. The support unit 56 is, for example, a platen roller. In the illustrated example, the transport unit 54 and the support unit 56 rotate around the Y axis. The rotation of the transport unit 54 and the support unit 56 is controlled, for example, by the control unit 80. By the rotation of the transport unit 54 and the support unit 56, the movement mechanism 50 moves the irradiation object 2 in the -X axis direction.

[0093] During recording on the irradiation target 2, the irradiation target 2 is positioned between the head 10 and the support 56. The irradiation target 2 includes, for example, a recording sheet 4 and an ink ribbon 6 provided on the recording sheet 4. As shown in FIG. 12, the ink ribbon 6 includes, for example, an ink layer 7 made of heat-melting ink and a base 8 provided on the ink layer 7. The base 8 is, for example, transparent. When laser light L is irradiated from the head 10, the irradiated portion of the ink layer 7 melts and is transferred to the recording sheet 4. This allows recording, such as printing, on the recording sheet 4. The laser irradiation device 200 is, for example, a thermal transfer thermal printer. For ease of explanation, the recording sheet 4 and the ink ribbon 6 are shown separated from each other in FIG. 12, but the recording sheet 4 and the ink ribbon 6 are usually in contact with each other.

[0094] 13 is a flowchart for explaining the processing of the control unit 80 of the laser irradiation device 200. For example, the user operates an operation unit (not shown) to output a processing start signal for starting processing to the control unit 80. When the control unit 80 receives the processing start signal, Start.

[0095] First, as shown in FIG. 13, the control unit 80 performs a data acquisition process to acquire print data generated by a user (step S11).

[0096] Next, the control unit 80 controls the laser element 18 and the moving mechanism 50 to perform a recording process in which the relative positions of the laser element 18 and the irradiation object 2 are changed while irradiating the irradiation object 2 with the laser light L (step S12).

[0097] Specifically, the control unit 80 drives the conveying unit 54 of the movement mechanism 50 to move the irradiation object 2 in the −X-axis direction while causing the laser element 18 to irradiate the laser light L based on the print data. This allows recording on the irradiation object 2.

[0098] Then, the control unit 80 ends the process.

[0099] In the laser irradiation device 200, the object 2 is a recording object on which recording is performed by the laser light L from the laser element 18. Therefore, the laser irradiation device 200 can record on the object 2 with high precision.

[0100] 2.2. Modified laser irradiation device Next, a laser irradiation device according to a modification of the second embodiment will be described with reference to the drawings. Figure 14 is a perspective view that schematically shows a laser irradiation device 210 according to a modification of the second embodiment.

[0101] Hereinafter, in the laser irradiation device 210 relating to a modified example of the second embodiment, components having the same functions as the components of the laser irradiation device 200 relating to the second embodiment described above will be given the same symbols, and detailed explanations thereof will be omitted.

[0102] The laser irradiation device 210 differs from the above-described laser irradiation device 200 in that it is a receipt printer. The laser irradiation device 210 is installed at the checkout counter of a store such as a supermarket, convenience store, or restaurant. The laser irradiation device 210 prints an image on the irradiation object 2 in accordance with the transaction performed at the checkout counter and issues a receipt. The irradiation object 2 is made of paper, for example. The irradiation object 2 may also be made of polyethylene (PE), polyethylene terephthalate (PET), or polypropylene (PP).

[0103] As shown in FIG. 14, the laser irradiation device 210 includes, for example, a housing section 220 and a cutter 230.

[0104] The storage section 220 stores the rolled irradiation target 2, the head 10, the mounting substrate 20, the support member 30, the heat dissipation section 40, the moving mechanism 50, and the cutter 230. The storage section 220 has an openable cover 222. The cover 222 is opened when the user presses down a lever 224. With the cover 222 open, the user can replenish or replace the rolled irradiation target 2. The cover 222 has an outlet 226 for discharging the irradiation target 2 after printing. Furthermore, the storage section 220 has a power switch 228 for switching the power of the laser irradiation device 210 on and off.

[0105] The cutter 230 is provided at a position corresponding to the outlet 226. The cutter 230 cuts the printed irradiation object 2. In this way, a receipt is produced. Cutter 2 The shape of 30 is not particularly limited as long as it can cut the irradiation object 2.

[0106] The use of the laser irradiation device according to the present invention is not particularly limited, and may be, for example, a laser cleaner that removes rust and the like from metal using laser light, or a laser annealing device that heats the surface of metal or resin using laser light.

[0107] The material of the object to be irradiated is not particularly limited, and may be, for example, a resin such as a photocurable resin, wood, glass, paper, leather, or a mineral.

[0108] The above-described embodiment and modifications are merely examples, and the present invention is not limited to these. For example, the embodiments and modifications can be combined as appropriate.

[0109] The present invention includes configurations that are substantially the same as the configurations described in the embodiments, for example, configurations with the same functions, methods, and results, or configurations with the same purpose and effects. The present invention also includes configurations that replace non-essential parts of the configurations described in the embodiments. The present invention also includes configurations that achieve the same effects or purposes as the configurations described in the embodiments. The present invention also includes configurations that add publicly known technology to the configurations described in the embodiments.

[0110] The following can be derived from the above-described embodiment and modifications.

[0111] One aspect of the laser irradiation device is a submount having a first surface and a second surface opposite the first surface; a laser element provided on the first surface and configured to irradiate laser light; a heat dissipation portion provided on the second surface; a moving mechanism that changes the relative position between the laser element and an object to be irradiated; It has.

[0112] This laser irradiation device can improve heat dissipation.

[0113] In one embodiment of the laser irradiation device, The submount may have insulating properties.

[0114] This laser irradiation device can prevent current from reaching the heat sink through the submount.

[0115] In one embodiment of the laser irradiation device, The heat dissipation portion may be electrically conductive.

[0116] According to this laser irradiation device, the heat dissipation section can have high thermal conductivity.

[0117] In one embodiment of the laser irradiation device, The movement mechanism has two guide rails, The submount may be supported by the two guide rails.

[0118] This laser irradiation device can stably support the submount.

[0119] In one embodiment of the laser irradiation device, The two guide rails may not overlap the laser element in a plan view.

[0120] According to this laser irradiation device, the heat generated by the laser element can be efficiently dissipated from the heat dissipation section.

[0121] In one embodiment of the laser irradiation device, The heat dissipation portion may have a plurality of fins.

[0122] According to this laser irradiation device, the heat of the laser element can be dissipated from the plurality of fins.

[0123] In one embodiment of the laser irradiation device, the moving mechanism moves the laser element in a first direction; In a plan view, each of the plurality of fins may extend in the first direction.

[0124] This laser irradiation device can reduce the air resistance that the fins experience.

[0125] In one embodiment of the laser irradiation device, the moving mechanism moves the laser element in a first direction; In a plan view, each of the plurality of fins may extend in a second direction inclined with respect to the first direction.

[0126] This laser irradiation device can increase the amount of air that hits the fins.

[0127] In one embodiment of the laser irradiation device, The irradiation object may be an object to be processed by the laser light from the laser element.

[0128] This laser irradiation device can process the object to be irradiated with high precision.

[0129] In one embodiment of the laser irradiation device, The irradiation object may be a recording object on which recording is performed by the laser light from the laser element.

[0130] This laser irradiation device allows accurate recording on the irradiation target.

[0131] In one embodiment of the laser irradiation device, The laser element may be a photonic crystal surface emitting laser.

[0132] According to this laser irradiation device, the radiation angle of the laser light from the laser element can be narrowed. [Explanation of symbols]

[0133] 2...irradiation object, 2a...melted portion, 2b...non-melted portion, 4...recording sheet, 6...ink ribbon, 7...ink layer, 8...base, 10...head, 11...package, 11a...base, 11b...lid portion, 12...submount, 12a...first surface, 12b...second surface, 13...first pad, 14...first wire bonding, 15...via, 16...second pad, 17...second wire bonding, 18...laser element, 20...mounting substrate, 30...support member, 40...heat dissipation portion, 42...plate-shaped portion, 44...fin, 50...movement mechanism, 52...guide rail, 54...transport portion, 56...support portion, 60...optical element, 70...stage, 72...stage base, 74...elevator mechanism, 76...casing, 80...control portion, 90...calibration device, 100...laser irradiation device, 1 01...substrate, 102...first semiconductor layer, 103...first guide layer, 103a...opening, 104...light emitting layer, 105...second guide layer, 106...second semiconductor layer, 107...contact layer, 108...first electrode, 109...second electrode, 109a...through hole, 110...laser irradiation device, 112...fixing portion, 114...base, 120, 200...laser irradiation device, 202...support rod, 210...laser irradiation device, 220...accommodation portion, 222...cover, 224...lever, 226...discharge port, 228...power switch, 230...cutter

Claims

1. a submount having a first surface and a second surface opposite the first surface; a laser element provided on the first surface and configured to emit laser light; a heat dissipation portion provided on the second surface; a moving mechanism that changes the relative position between the laser element and an object to be irradiated; A laser irradiation device having:

2. In claim 1, The laser irradiation device, wherein the submount has insulating properties.

3. In claim 1, The laser irradiation device, wherein the heat dissipation portion has electrical conductivity.

4. In claim 1, The moving mechanism has two guide rails, The submount is supported by the two guide rails.

5. In claim 4, A laser irradiation device, wherein the two guide rails do not overlap with the laser element in a plan view.

6. In claim 1, The laser irradiation device, wherein the heat dissipation section has a plurality of fins.

7. In claim 6, the moving mechanism moves the laser element in a first direction; In a plan view, each of the plurality of fins extends in the first direction.

8. In claim 6, the moving mechanism moves the laser element in a first direction; In a plan view, each of the plurality of fins extends in a second direction inclined with respect to the first direction.

9. In claim 1, A laser irradiation device, wherein the irradiation object is an object to be processed by laser light from the laser element.

10. In claim 1, A laser irradiation device, wherein the irradiation object is a recording object on which recording is performed by laser light from the laser element.

11. In any one of claims 1 to 10, The laser irradiation device, wherein the laser element is a photonic crystal surface-emitting laser.

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