Inspection socket

Abstract

To provide a socket having a pressing member that does not wobble or can suppress wobbling when moving.SOLUTION: In a first section in which a cover member 120 moves upward from a close position by predetermined distance, a latch member 150 is restricted by a link mechanism from moving from an open position to above a placement surface 113a by pivoting about an axis along a depth direction. In a second section in which the cover member 120 moves further upward and reaches a separate position, the latch member is restricted by the link mechanism from moving up to a pressing position by moving only downward.SELECTED DRAWING: Figure 27

Description

[Technical Field]

[0001] The present invention relates to an inspection socket. [Background technology]

[0002] For example, a test socket used in a burn-in test of a semiconductor package is provided with a member (pressing member) that presses down the package so that the package does not rise from the mounting surface on which the package is placed. Conventionally, this pressing member has been configured to rotate to a position where it presses against the top surface of the package in conjunction with the lifting of the cover of the testing socket. However, if the pressing member is in contact with the top surface of the package as it rotates, there is a possibility that the pressing member will rub against and damage the top surface of the package due to the horizontal movement component of the rotating pressing member.

[0003] Patent Document 1 describes a socket for a semiconductor device in which a pressing member is moved so as not to scrape the top surface of the package. In the socket of Patent Document 1, the legs of the pressing member come into contact with the protruding piece or the guide wall surface, thereby rotating the pressing member. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4495200 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the configuration of Patent Document 1, a state may occur in which the leg of the pressing member is not in contact with either the protrusion or the guide wall surface, and in such a state, it is expected that the pressing member will wobble / the movement of the pressing member will become unstable.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an inspection socket equipped with a pressing member that does not wobble or can suppress wobbling when moved. [Means for solving the problem]

[0007] In order to solve the above problems, the inspection socket of the present invention employs the following means. The testing socket according to a first aspect of the present invention includes a base member having a mounting surface on which a semiconductor package is placed, a cover member attached to the base member and moving in a vertical direction perpendicular to the mounting surface between a proximity position where the cover member is closest to the base member and a remote position where the cover member is farthest from the base member, at least one pressing member moving between an open position where the cover member opens up above the mounting surface so that the semiconductor package can be placed thereon and a pressing position where the cover member presses against the top surface of the semiconductor package placed on the mounting surface, and a pressing member that presses against the top surface of the semiconductor package placed on the mounting surface. and a link mechanism that moves the pressing member between the open position and the pressing position in response to a command, and in a first section in which the cover member moves upward a predetermined distance from the close position, the movement of the pressing member is restricted by the link mechanism to move from the open position to above the placement surface by rotating about an axis along a first orthogonal direction that is orthogonal to the up-down direction, and in a second section in which the cover member moves further upward to reach the separated position, the movement of the pressing member is restricted by the link mechanism to move only downward to the pressing position.

[0008] According to the inspection socket of this embodiment, in the first section in which the cover member moves upward a predetermined distance from the approach position, the link mechanism restricts the movement of the pressing member so that it moves from the open position to above the mounting surface by rotating about an axis along the first orthogonal direction, and in the second section in which the cover member moves further upward to reach the separated position, the link mechanism restricts the movement so that it moves only downward to the pressing position.Therefore, when / just before the pressing member presses the semiconductor package, the pressing member moves only downward and does not move horizontally, so that the pressing member does not rub against and damage the top surface of the semiconductor package by moving horizontally on the top surface of the semiconductor package placed on the mounting surface. Furthermore, the movement of the pressing member is constantly restricted by the link mechanism while it moves from the release position to the pressing position, so the pressing member does not wobble or the wobbling of the pressing member is suppressed, and therefore the semiconductor package is not damaged due to the wobbling of the pressing member.

[0009] In an inspection socket according to a second aspect of the present invention, in the first aspect, the link mechanism has a transmission member, a first connecting shaft, a second connecting shaft, and a rotating shaft, the first connecting shaft, the second connecting shaft, and the rotating shaft extend in the first orthogonal direction, the transmission member is connected to the cover member by the first connecting shaft, and to the pressing member by the second connecting shaft, and when a direction orthogonal to the up-down direction and the first orthogonal direction is defined as a second orthogonal direction, the transmission member is connected to the base member by the rotating shaft located between the first connecting shaft and the second connecting shaft in the second orthogonal direction, and by rotating around the rotating shaft, upward movement of the cover member is converted into downward movement of the pressing member, and the movement of the second connecting shaft is restricted so as to move only in the up-down direction.

[0010] In the inspection socket of this embodiment, the transmission member rotates around the pivot shaft, converting the upward movement of the cover member into downward movement of the pressing member, and since the movement of the second connecting shaft is restricted to moving only in the vertical direction, the transmission member can impart a component to the pressing member that moves only upward.

[0011] In the inspection socket according to a third aspect of the present invention, in addition to the second aspect, the second connecting shaft portion is located laterally in the second orthogonal direction in a lower region of the placement surface.

[0012] According to the inspection socket of this embodiment, the second connecting shaft portion is located to the side of the lower region of the mounting surface in the second orthogonal direction, making it easier to position the pressing member with the second connecting shaft portion as its rotation center in the lateral region of the mounting surface. This reduces the rotation angle (opening / closing angle) of the pressing member required to open the upper part of the mounting surface. In other words, in an inspection socket with size restrictions, the movable range of the pressing member required to open the upper part of the mounting surface can be reduced, so the upper part of the mounting surface can be opened efficiently.

[0013] In the inspection socket according to a fourth aspect of the present invention, in the second or third aspect, the link mechanism has a contact portion, which is provided on the cover member and applies a force to the pressing member to rotate the pressing member around the second connecting shaft portion in the first section.

[0014] According to the inspection socket of this aspect, the link mechanism has a contact portion that is provided on the cover member and that applies a force to the pressing member in the first section to rotate the pressing member around the second connecting shaft portion, so that the pressing member can be reliably rotated by the contact portion.

[0015] An inspection socket according to a fifth aspect of the present invention is the fourth aspect, wherein the link mechanism has a slide shaft portion and a slide groove, the slide shaft portion is provided on the cover member and is located between the first connecting shaft portion and the second connecting shaft portion in the second orthogonal direction, and the slide groove is provided on the pressing member and is configured to allow the slide shaft portion to slide.

[0016] According to the inspection socket of this aspect, the slide shaft is provided on the cover member and is located between the first connecting shaft and the second connecting shaft in the second orthogonal direction, and the slide groove is provided on the pressing member and is configured to allow the slide shaft to slide, so that the posture of the pressing member is stabilized by the two shafts, the slide shaft and the second connecting shaft.

[0017] In a sixth aspect of the present invention, in the inspection socket of the fifth aspect, the slide shaft portion is the contact portion, and when the slide shaft portion contacts the slide groove, the pressing member rotates around the second connecting shaft portion.

[0018] According to the inspection socket of this embodiment, the slide shaft portion is the contact portion, and when the slide shaft portion comes into contact with the slide groove, the pressing member rotates around the second connecting shaft portion. Therefore, the pressing member can be rotated by utilizing the slide shaft portion and the slide groove, which stabilize the posture of the pressing member.

[0019] In the inspection socket according to a seventh aspect of the present invention, in the second or third aspect, the link mechanism has a contact portion, which is provided on the base member and applies a force to the pressing member to rotate the pressing member around the second connecting shaft portion in the first section.

[0020] According to the inspection socket of this aspect, the link mechanism has a contact portion that is provided on the base member and that applies a force to the pressing member in the first section to rotate the pressing member around the second connecting shaft portion, thereby ensuring that the pressing member can be rotated.

[0021] An inspection socket according to an eighth aspect of the present invention is configured in the seventh aspect, wherein the link mechanism has a slide shaft portion and a slide groove, the slide shaft portion is provided on the pressing member and is located above the second connecting shaft portion, and the slide groove is provided on the base member, and the second connecting shaft portion and the slide shaft portion slide.

[0022] According to the inspection socket of this embodiment, the slide shaft is provided on the pressing member and is located above the second connecting shaft, and the slide groove is provided on the base member so that the second connecting shaft and the slide shaft can slide, so that the posture of the pressing member is stabilized by the two shafts, the slide shaft and the second connecting shaft.

[0023] A ninth aspect of the present invention is an inspection socket according to the eighth aspect, wherein the slide groove is the contact portion, and when the slide shaft portion contacts the slide groove, the pressing member rotates around the second connecting shaft portion.

[0024] According to the inspection socket of this embodiment, the slide groove is the contact portion, and when the slide shaft portion comes into contact with the slide groove, the pressing member rotates around the second connecting shaft portion, so that the pressing member can be rotated by utilizing the slide shaft portion and the slide groove, which stabilize the posture of the pressing member.

[0025] An inspection socket according to a tenth aspect of the present invention is the same as that of the ninth aspect, wherein in the first section, the second connecting shaft portion slides in the slide groove in the vertical direction, and the slide shaft portion slides in the slide groove in the vertical direction and the second direction.

[0026] According to the inspection socket of this aspect, in the first section, the second connecting shaft slides up and down in the slide groove, and the slide shaft slides up and down and in the second direction in the slide groove, so that the pressing member can be rotated around the second connecting shaft by the slide shaft. [Effects of the Invention]

[0027] According to the present invention, it is possible to provide a socket equipped with a pressing member that does not wobble or can suppress wobbling when moved. [Brief explanation of the drawings]

[0028] [Figure 1]1 is a perspective view of an inspection socket according to a first embodiment of the present invention (semiconductor package: absent, cover member: separated position). [Figure 2] 1 is a perspective view of an inspection socket according to a first embodiment of the present invention (semiconductor package: present, cover member: separated position). [Figure 3] 1 is a perspective view of an inspection socket according to a first embodiment of the present invention (semiconductor package: absent, cover member: in a close position). [Figure 4] 1 is a perspective view of an inspection socket according to a first embodiment of the present invention (semiconductor package: present, cover member: in a close position). [Figure 5] 1 is an exploded perspective view of an inspection socket according to a first embodiment of the present invention; [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] 6 is a cross-sectional view taken along line VI-VI in FIG. 2 (latch member is omitted). [Figure 8] 6 is a cross-sectional view taken along line VI-VI in FIG. 2 (the latch member and the lever member are omitted). [Figure 9] FIG. 2 is a perspective view of an installation portion of the base member. [Figure 10] FIG. [Figure 11] FIG. [Figure 12] FIG. 1 is a plan view of the test socket with the latch member in the open position. [Figure 13] FIG. 13 is a cross-sectional view taken along line AA in FIG. [Figure 14] 13 is a cross-sectional view taken along line BB in FIG. 12. [Figure 15] 13 is a cross-sectional view taken along line AA in FIG. 12 (latch member omitted). [Figure 16] 13 is a cross-sectional view taken along line BB in FIG. 12 (latch member omitted). [Figure 17] 13 is a cross-sectional view taken along line AA in FIG. 12 (the latch member and the lever member are omitted). [Figure 18]13 is a cross-sectional view taken along line BB in FIG. 12 (the latch member and the lever member are omitted). [Figure 19] FIG. 10 is a plan view of the test socket with the latch member in a position between the open position and the upper position. [Figure 20] FIG. 20 is a cross-sectional view taken along line AA in FIG. [Figure 21] FIG. 20 is a cross-sectional view taken along line BB in FIG. [Figure 22] 20 is a cross-sectional view taken along line AA in FIG. 19 (latch member omitted). [Figure 23] 20 is a cross-sectional view taken along line BB in FIG. 19 (latch member omitted). [Figure 24] 20 is a cross-sectional view taken along line AA in FIG. 19 (the latch member and the lever member are omitted). [Figure 25] 20 is a cross-sectional view taken along line BB in FIG. 19 (the latch member and the lever member are omitted). [Figure 26] 10 is a plan view of the inspection socket when the latch member is positioned at an upper position from the open position. FIG. [Figure 27] FIG. 27 is a cross-sectional view taken along line AA in FIG. 26. [Figure 28] 27 is a cross-sectional view taken along line BB in FIG. 26. [Figure 29] FIG. 27 is a cross-sectional view taken along line AA in FIG. 26 (latch member omitted). [Figure 30] 27 is a cross-sectional view taken along line BB in FIG. 26 (the latch member is omitted). [Figure 31] 27 is a cross-sectional view taken along the line AA in FIG. 26 (the latch member and the lever member are omitted). [Figure 32] 27 is a cross-sectional view taken along line BB in FIG. 26 (the latch member and the lever member are omitted). [Figure 33] FIG. 10 is a plan view of the inspection socket when the latch member is in the pressed position. [Figure 34] FIG. 34 is a cross-sectional view taken along the line AA in FIG. 33. [Figure 35] 34 is a cross-sectional view taken along line BB in FIG. 33. [Figure 36] FIG. 34 is a cross-sectional view taken along line AA in FIG. 33 (latch member omitted). [Figure 37] 34 is a cross-sectional view taken along line BB in FIG. 33 (latch member omitted). [Figure 38] 34 is a cross-sectional view taken along the line AA in FIG. 33 (the latch member and the lever member are omitted). [Figure 39] 34 is a cross-sectional view taken along line BB in FIG. 33 (the latch member and the lever member are omitted). [Figure 40] 10 is a perspective view of a testing socket according to a second embodiment of the present invention (semiconductor package: absent, cover member: separated position). FIG. [Figure 41] FIG. 10 is a perspective view of a testing socket according to a second embodiment of the present invention (semiconductor package: present, cover member: separated position). [Figure 42] FIG. 10 is a perspective view of a testing socket according to a second embodiment of the present invention (semiconductor package: absent, cover member: in a close position). [Figure 43] FIG. 10 is a perspective view of a testing socket according to a second embodiment of the present invention (semiconductor package: present, cover member: in a close position). [Figure 44] FIG. 44 is a cross-sectional view taken along line XLIV-XLIV in FIG. [Figure 45] FIG. 42 is a cross-sectional view taken along line XLV-XLV in FIG. 41. [Figure 46] FIG. 2 is a perspective view of a lever member and a latch member. [Figure 47] FIG. [Figure 48] FIG. 1 is a plan view of the test socket with the latch member in the open position. [Figure 49] FIG. 49 is a cross-sectional view taken along line AA in FIG. 48. [Figure 50] FIG. 49 is a cross-sectional view taken along line BB in FIG. 48. [Figure 51] FIG. 10 is a plan view of the test socket with the latch member in a position between the open position and the upper position. [Figure 52] FIG. 52 is a cross-sectional view taken along line AA in FIG. 51. [Figure 53] FIG. 52 is a cross-sectional view taken along line BB in FIG. 51. [Figure 54] 10 is a plan view of the inspection socket when the latch member is positioned at an upper position from the open position. FIG. [Figure 55] FIG. 55 is a cross-sectional view taken along line AA in FIG. 54. [Figure 56] FIG. 55 is a cross-sectional view taken along line BB in FIG. 54. [Figure 57] FIG. 10 is a plan view of the inspection socket when the latch member is in the pressed position. [Figure 58] FIG. 58 is a cross-sectional view taken along line AA in FIG. 57. [Figure 59] FIG. 58 is a cross-sectional view taken along line BB in FIG. 57. DETAILED DESCRIPTION OF THE INVENTION

[0029] [First embodiment] An inspection socket according to a first embodiment of the present invention will be described below with reference to FIGS. In the following description, the "up-down direction," "width direction," and "depth direction" are generally perpendicular to one another. However, these terms are used for ease of understanding and do not limit the position of the inspection socket during use.

[0030] <Configuration of the test socket> The configuration of the inspection socket 100 will be described.

[0031] As shown in FIGS. 1 and 2, the inspection socket 100 is a device on which a semiconductor package 181 is placed when a burn-in test of the semiconductor package 181 is performed. The burn-in test is carried out in a state where the semiconductor package 181 placed on the placement surface 113a of the pedestal portion 113 of the base member 110 is pressed down by the latch member (pressing member) 150.

[0032] As shown in FIGS. 1 and 2, 3 and 4, the latch member 150 is configured to move and rotate in conjunction with the downward movement / upward movement of the cover member 120. Specifically, by moving the cover member 120 from above to below, the latch member 150 moves and rotates to the open position, allowing the semiconductor package 181 to be placed on the placement surface 113a (the space above the placement surface 113a is opened, making it possible to access the placement surface 113a). Conversely, by moving the cover member 120 from below to above, the latch member 150 rotates and moves to the pressing position, and the latch member 150 presses down the semiconductor package 181 placed on the placement surface 113a.

[0033] The configuration of the inspection socket 100 will be described in detail below. 5, the inspection socket 100 includes a base member 110, a cover member 120, a plurality of lever members (transmission members) 140, and a plurality of latch members 150. The inspection socket 100 also includes a link mechanism that connects two or more components among the base member 110, the cover member 120, the lever members 140, and the latch members 150. However, the link mechanism may be included in the configuration of the base member 110, the cover member 120, the lever members 140, and the latch members 150.

[0034] As shown in FIGS. 1 and 5, the base member 110 is a component that is fixed to a substrate (not shown), accommodates the contact pins 171, and has the semiconductor package 181 mounted thereon. The base member 110 constitutes, for example, the lower part of the inspection socket 100 . The base member 110 is made of an insulating material (for example, resin).

[0035] As shown in FIGS. 6, 7, and 8, the base member 110 includes, for example, an installation portion 111, a pin receiving portion 112, and a pedestal portion 113.

[0036] The installation portion 111 is a portion that is fixed to a substrate (not shown), and constitutes the lower portion of the base member 110 . As shown in FIG. 5, a space is formed in the center of the base member 110 in the depth direction (first orthogonal direction) and width direction (second orthogonal direction), and as shown in FIGS. 6, 7, and 8, a pin accommodating portion 112 and a base portion 113 are accommodated in the space.

[0037] The pin accommodating portion 112 is a portion that accommodates and holds a plurality of contact pins 171 . The contact pins 171 are pin-shaped components that extend in the vertical direction and are made of a conductive material (for example, metal). The upper ends of the contact pins 171 housed and held in the pin housing portions 112 come into contact with the solder balls of the semiconductor package 181.

[0038] The base 113 has a mounting surface 113a on which the semiconductor package 181 is placed. The mounting surface 113a corresponds to the upper surface of the base 113. The base portion 113 is attached to the top of the pin accommodating portion 112 .

[0039] The base member 110 is formed with a plurality of horizontal grooves 111a (link mechanism) and a plurality of vertical grooves 114 (link mechanism).

[0040] As shown in FIG. 9, the lateral groove 111a is a groove extending in the width direction, and is formed in the installation portion 111, for example. As shown in FIGS. 7, 8 and 9, the lateral grooves 111a are formed in pairs on both sides in the width direction. As shown in FIG. 9, two lateral grooves 111a that make up one pair face each other in the depth direction. 7, each protrusion (rotation shaft portion) 143 protruding in the depth direction of the lever member 140 (link mechanism) is inserted into these lateral grooves 111a. The movement of the protrusion 143 inserted into the lateral groove 111a is restricted so that it slides only in the width direction.

[0041] As shown in FIG. 8, the vertical grooves 114 are grooves that extend in the vertical direction, and are formed in pairs not in the lower region of the mounting surface 113a of the base portion 113, but on both sides of the lower region in the width direction (hereinafter referred to as "side regions"). In this embodiment, the vertical groove 114 is, for example, a gap defined between the installation portion 111 and the pin accommodating portion 112 . The two vertical grooves 114 that make up one pair face each other in the depth direction. Both ends of a second connecting shaft 162 (link mechanism) extending in the depth direction are inserted into these vertical grooves 114. Therefore, the second connecting shaft 162 is located in a lateral region rather than in a lower region of the mounting surface 113a. The movement of the second connecting shaft 162 inserted into the vertical grooves 114 is restricted so that it can slide only in the up and down direction. Although only the two vertical grooves 114 located at the back in the depth direction are shown in FIG. 8, in reality, two vertical grooves 114 also exist at the front in the depth direction.

[0042] The base member 110 configured as described above may include parts other than the installation section 111, the pin accommodating section 112, and the pedestal section 113, or at least one of the installation section 111, the pin accommodating section 112, and the pedestal section 113 may be divided into multiple parts, or the multiple parts that make up the base member 110 may be integrated as appropriate.

[0043] As shown in FIGS. 1 and 5, 6, 7 and 8, the cover member 120 is a component that covers the base member 110 from above. The cover member 120 forms, for example, the upper part of the inspection socket 100 . The cover member 120 is made of an insulating material (for example, resin). A through opening 121 is formed in the center of the cover member 120 in the depth and width directions, and is configured to allow access to the base member 110 (more specifically, the mounting surface 113a of the pedestal portion 113) through the through opening 121.

[0044] As shown in FIGS. 6, 7, and 8, the cover member 120 is formed with a plurality of shaft holders 123. The shaft holding portions 123 are portions that protrude downward from the lower ends of both sides in the width direction of the cover member 120, and two are formed on each side (four in total). The two shaft holders 123 on the same side face each other with a gap therebetween in the depth direction. The lever member 140 fits into the gap between the two shaft holders 123 facing each other in the depth direction. A single first connecting shaft 161 (link mechanism) extending in the depth direction is inserted along the depth direction into two shaft holders 123 facing each other in the depth direction. At this time, both ends of the first connecting shaft 161 are held by the shaft holders 123. Furthermore, the lever member 140 that enters the gap between the two shaft holders 123 facing each other in the depth direction is pivotally supported by the first connecting shaft 161 inserted into the shaft holder 123.

[0045] As shown in FIGS. 5, 6, 7 and 8, the cover member 120 has a plurality of arm portions 122 formed thereon. The arm portions 122 are portions that protrude diagonally downward and inward from the inner peripheral walls that face each other in the width direction of the cover member 120, and are formed one on each of the opposing inner peripheral walls at approximately the center in the depth direction (two in total). A through hole 122a is formed in the arm portion 122. The through hole 122a is a circular hole formed at the tip of the arm portion 122. A slide shaft portion 163 (link mechanism) extending in the depth direction is inserted into this through hole 122a along the depth direction. The through hole 122a is located more inward in the width direction than the shaft holding portion 123.

[0046] As shown in FIG. 5, a plurality of springs 130 that expand and contract in the vertical direction are provided between the cover member 120 and the base member 110. These springs 130 bias the cover member 120 in a direction (upward) that moves the cover member 120 away from the base member 110 along the vertical direction. However, the inspection socket 100 is provided with a mechanism for restricting the movable range of the cover member 120 so that the cover member 120 does not come off the base member 110 due to the upward force applied by the spring 130 .

[0047] When no external force is applied (when not pressed in), the cover member 120 waits at a position separated as far as possible from the base member 110 in the vertical direction (hereinafter referred to as the "separated position") due to the force exerted by the spring 130. On the other hand, by pushing the cover member 120 toward the base member 110 against the force of the spring 130, the cover member 120 moves to a position where it is as close as possible to the base member 110 in the vertical direction (hereinafter referred to as the "close position"). Here, it goes without saying that the distance varies depending on whether or not the semiconductor package 181 is present and the thickness of the semiconductor package 181 .

[0048] It should be noted that any part other than the spring 130 may be used as long as it can bias the cover member 120 upward.

[0049] As shown in FIGS. 6, 7 and 10, the lever member 140 is a component provided in a side region of the base member 110. The lever member 140 is made of an insulating material (for example, resin). The lever member 140 converts the upward movement (hereinafter also referred to as "upward movement") / downward movement (hereinafter also referred to as "downward movement") of the cover member 120 into downward movement / upward movement of the second connecting shaft portion 162 / latch member 150 and transmits it.

[0050] Each lever member 140 has a through hole 141, a long through hole 142, and a plurality of protrusions (rotation shaft portions) 143 formed therein.

[0051] The through-hole 141 is a circular hole formed in the outer portion of the lever member 140 in the width direction. The first connecting shaft portion 161 inserted into the shaft holding portion 123 of the cover member 120 is inserted in the depth direction into this through hole 141. As a result, the lever member 140 is connected to the cover member 120 via the first connecting shaft portion 161.

[0052] The through-hole 142 is an elongated hole formed in the inner portion of the lever member 140 in the width direction. The second connecting shaft portion 162 is inserted into this elongated through hole 142 along the depth direction.

[0053] The protrusion 143 is a convex portion formed in a portion between the through hole 141 and the elongated through hole 142 in the width direction. The protrusions 143 protrude outward from both sides in the depth direction. That is, there are two protrusions 143, one on the front side and one on the back side. These protrusions 143 are inserted into the lateral grooves 111a of the base member 110. As a result, the lever member 140 is connected to the base member 110.

[0054] Lever member 140 configured as above functions like a lever / seesaw with protrusion 143 as a fulcrum (rotational fulcrum), first connecting shaft 161 as a force point, and second connecting shaft 162 as a point of action. That is, by moving the cover member 120 connected to the first connecting shaft portion 161 up / down, the lever member 140 rotates around the protrusion 143, and the second connecting shaft portion 162, which is located opposite the first connecting shaft portion 161 relative to the protrusion 143, moves up / down. At this time, the second connecting shaft portion 162 slides only in the up-down direction because its movement is restricted by the vertical groove 114. Furthermore, the protrusion 143 slides only in the width direction (moves while rotating) because its movement is restricted by the horizontal groove 111a.

[0055] As shown in FIGS. 6, 7 and 11, the latch member 150 is, for example, a hook-shaped part provided on a side region of the base member 110. The latch member 150 is made of an insulating material (for example, resin). The latch member 150 is a component that presses the upper surface of the semiconductor package 181 placed on the placement surface 113a and also opens the upper side of the placement surface 113a so that the semiconductor package 181 can be placed thereon.

[0056] Each latch member 150 has a through hole 151, at least one slide groove 152 (link mechanism), and a pressing surface 153 formed therein.

[0057] The pressing surface 153 is a surface that faces (is approximately parallel to) the mounting surface 113a and / or the upper surface of the semiconductor package 181 when the cover member 120 is in the separated position, and is located more inward in the width direction than the second connecting shaft portion 162. Hereinafter, the position of the latch member 150 where the pressing surface 153 presses against (contacts with) the top surface of the semiconductor package 181 will be referred to as the "pressing position." Also, the position of the latch member 150 where the latch member 150 opens up above the mounting surface 113a so that the semiconductor package 181 can be placed thereon, i.e., the position of the latch member 150 where the pressing surface 153 is located outside the upper region of the mounting surface 113a, will be referred to as the "open position." Also, the position of the latch member 150 where the pressing surface 153 faces the top surface of the semiconductor package 181 but is above the semiconductor package 181 and does not press against (is not in contact with) the semiconductor package 181 will be referred to as the "upper position."

[0058] The through-hole 151 is a circular hole formed on the inside in the width direction. The second connecting shaft 162, which is inserted into the elongated through hole 142 of the lever member 140 and inserted into the vertical groove 114 of the base member 110, is inserted in the depth direction into this through hole 151. As a result, the latch member 150 is connected to the lever member 140 via the second connecting shaft 162, whose movement is restricted by the vertical groove 114.

[0059] The slide groove 152 is a groove formed outside the through hole 151 in the width direction. The slide groove 152 extends in the vertical direction when the latch member 150 is in the pressed position or the upper position. The width of the slide groove 152 is approximately equal to or slightly larger than the diameter of the slide shaft portion 163 . The slide shaft 163 inserted into the arm portion 122 of the cover member 120 is inserted in the depth direction into this slide groove 152. As a result, the latch member 150 is connected to the cover member 120 via the slide shaft 163. The slide shaft portion 163 slides while always contacting any part of the inner circumferential surface of the slide groove 152 .

[0060] In this embodiment, two slide grooves 152 are provided for each latch member 150. The two slide grooves 152 (more specifically, the portions where the slide grooves 152 are formed) face each other with a gap in between in the depth direction. The arm portion 122 of the cover member 120 fits into the gap between the two slide grooves 152 facing each other in the depth direction.

[0061] As shown in FIG. 6, a connection portion 154 is formed at the end portion of the latch member 150 (the end portion opposite the pressing surface 153, the lower end portion in FIG. 6). The connecting portion 154 is located between and connected to the two portions where the slide groove 152 is formed. In other words, the connecting portion 154 connects the two portions where the slide groove 152 is formed. The connecting portion 154 is formed with an arm-facing surface 154a. The arm-facing surface 154a is a surface facing the arm portion 122 of the cover member 120. For example, the arm-facing surface 154a faces upward when the latch member 150 is in the pressed position or the upper position.

[0062] The latch member 150 configured as described above moves between an open position, an upper position, and a pressed position. At this time, the latch member 150 is supported by the second connecting shaft portion 162 inserted into the through hole 151, and the slide shaft portion 163 inserted into the arm portion 122 of the cover member 120 is always in contact with the slide groove 152, so that the movement of the latch member 150 is restricted and fluctuation of its posture is suppressed.

[0063] <About the movement of the inspection socket> The movement of the latch member 150 when it moves from the release position to the pressing position after the semiconductor package 181 is placed on the base portion 113 will be described.

[0064] FIG. 12 shows a plan view of the inspection socket 100 viewed from above with the latch member 150 in the open position. 13 and 14 show cross-sectional views taken along the lines AA and BB in Fig. 12. 15 and 16 show cross-sectional views taken along the lines AA and BB in Fig. 12 (latch member 150 is omitted). 17 and 18 show cross-sectional views taken along the lines AA and BB in Fig. 12 (lever member 140 and latch member 150 are omitted).

[0065] As shown in Figures 13 to 18, when the cover member 120 is in the approximated position, the latch member 150 is in the open position. The first connecting shaft 161 is located at the lowest position within its movable range, and the second connecting shaft 162 is located at the highest position within its movable range. Furthermore, the slide groove 152 of the latch member 150 is inclined in accordance with the inclination of the latch member 150 .

[0066] FIG. 19 shows a plan view of the test socket 100 from above with the latch member 150 in a position between the open position and the upper position. 20 and 21 are cross-sectional views taken along the lines AA and BB in Fig. 19. 22 and 23 are cross-sectional views taken along the lines AA and BB in Fig. 19 (latch member 150 is omitted). 24 and 25 are cross-sectional views taken along the lines AA and BB in Fig. 19 (lever member 140 and latch member 150 are omitted).

[0067] 20 to 25, when the cover member 120 moves upward from the close position (but has not yet reached the distant position), the latch member 150 is positioned between the open position and the upper position. Specifically, when the latch member 150 rotates around the second connecting shaft portion 162, the pressing surface 153 moves inward in the width direction (the latch member 150 closes). However, the pressing surface 153 does not face the top surface of the semiconductor package 181. The movement will be explained in detail below. That is, when the cover member 120 moves upward from the close position, the first connecting shaft portion 161 provided on the cover member 120 moves upward. When the first connecting shaft portion 161 moves upward, the second connecting shaft portion 162 moves downward due to the function of the lever member 140 which rotates around the protrusion 143. When the second connecting shaft 162 moves downward, the latch member 150 connected to the second connecting shaft 162 moves downward. At this time, the slide shaft 163 serving as a contact portion provided on the cover member 120 comes into contact with the inner circumferential surface of the slide groove 152 formed in the latch member 150, and applies a force to the latch member 150 (slide groove 152) to rotate the latch member 150 around the second connecting shaft 162. As a result, the latch member 150 rotates around the second connecting shaft 162. In FIG. 21, the contact points between the slide shaft portion 163 and the slide groove 152 are indicated by black circles, and the force that rotates the latch member 150 around the second connecting shaft portion 162 is indicated by black arrows.

[0068] FIG. 26 shows a plan view of the inspection socket 100 as seen from above when the latch member 150 is moved from the open position to the upper position. 27 and 28 show cross-sectional views taken along the lines AA and BB in Fig. 26. 29 and 30 show cross-sectional views taken along the lines AA and BB in Fig. 26 (latch member 150 is omitted). 31 and 32 show cross-sectional views taken along the lines AA and BB in Fig. 26 (lever member 140 and latch member 150 are omitted).

[0069] 27 to 32, when the cover member 120 moves further upward (but has not yet reached the separated position), the latch member 150 moves from the open position to the upper position. Specifically, as the latch member 150 further rotates about the second connecting shaft portion 162, the pressing surface 153 moves further inward in the width direction, and the pressing surface 153 faces (but does not contact) the top surface of the semiconductor package 181. The movement will be explained in detail below. That is, when the cover member 120 moves further upward, the first connecting shaft portion 161 provided on the cover member 120 moves further upward. When the first connecting shaft 161 moves further upward, the second connecting shaft 162 moves further downward due to the function of the lever member 140 which rotates around the protrusion 143. When the second connecting shaft 162 moves further downward, the latch member 150 connected to the second connecting shaft 162 moves further downward. At this time, the slide shaft 163 serving as a contact portion provided on the cover member 120 comes into contact with the inner circumferential surface of the slide groove 152 formed in the latch member 150, and applies a force to the latch member 150 (slide groove 152) to rotate the latch member 150 around the second connecting shaft 162. When the latch member 150 moves downward and rotates around the second connecting shaft 162 so that the extension direction of the slide groove 152 roughly coincides with the vertical direction, the slide shaft 163, which moves only in the vertical direction, simply slides up and down in the slide groove 152, and no force is applied to the latch member 150 (slide groove 152) to rotate the latch member 150 around the second connecting shaft 162. This completes the rotation of the latch member 150. That is, the latch member 150 moves from the open position to the upper position, and the pressing surface 153 faces (but is not in contact with) the upper surface of the semiconductor package 181.

[0070] The section in which the cover member 120 moves upward by a predetermined distance from the close position while the latch member 150 moves from the open position to the upper position is referred to as the "first section."

[0071] FIG. 33 shows a plan view of the inspection socket 100 seen from above when the latch member 150 is in the pressing position. 34 and 35 are cross-sectional views taken along the lines AA and BB in Fig. 33. 36 and 37 are cross-sectional views taken along the lines AA and BB in Fig. 33 (latch member 150 is omitted). 38 and 39 are cross-sectional views taken along the lines AA and BB in Fig. 33 (lever member 140 and latch member 150 are omitted).

[0072] 34 to 39, when the cover member 120 moves further upward and reaches the separated position, the latch member 150 moves from the upper position to the pressing position. Specifically, as the latch member 150 moves downward, the pressing surface 153 comes into contact with the upper surface of the semiconductor package 181 and presses the semiconductor package 181. The movement will be explained in detail below. That is, when the cover member 120 moves further upward, the first connecting shaft portion 161 provided on the cover member 120 moves further upward. When the first connecting shaft 161 moves further upward, the second connecting shaft 162 moves further downward due to the function of the lever member 140 which rotates around the protrusion 143. When the second connecting shaft 162 moves further downward, the latch member 150 connected to the second connecting shaft 162 moves further downward. As described above, the slide shaft 163 provided on the cover member 120 is already in a state where it does not apply a force to the latch member 150 (slide groove 152) that would rotate the latch member 150. Therefore, the latch member 150 simply moves downward. However, the slide shaft 163 is in contact with the slide groove 152, which prevents the latch member 150 from wobbling. As the latch member 150 moves further downward, the pressing surface 153 eventually comes into contact with the upper surface of the semiconductor package 181 and presses the semiconductor package 181. In other words, the latch member 150 is positioned at the pressing position.

[0073] The section in which the cover member 120 moves further upward while the latch member 150 moves from the upper position to the pressing position and reaches the remote position is referred to as the “second section.” In other words, the section from the end of the first section to the remote position is referred to as the “second section.”

[0074] While the latch member 150 moves from the upper position to the pressing position, the latch member 150 moves only downward in the up-down direction, and does not move in the width or depth directions. Therefore, the pressing surface 153 in contact with the top surface of the semiconductor package 181 does not move in the width or depth directions, and the pressing surface 153 does not rub against and damage the top surface of the semiconductor package 181. Furthermore, by appropriately ensuring the distance that the latch member 150 moves from the upper position to the pressing position (i.e., the distance that it moves only in the vertical direction), the inspection socket 100 can be adapted to the specifications of semiconductor packages 181 having various thicknesses.

[0075] When the latch member 150 is moved from the pressed position to the released position, the cover member 120 in the separated position is pushed toward the base member 110. At this time, the cover member 120 moves from the separated position through the second section and the first section and reaches the close position. When the cover member 120 moves through the first section toward the close position, the slide shaft portion 163 provided on the cover member 120 as a contact portion comes into contact with the lower portion of the inner circumferential surface of the slide groove 152 formed in the latch member 150, and applies a force to the latch member 150 (slide groove 152) to rotate the latch member 150 about the second connecting shaft portion 162. Then, as the latch member 150 rotates about the second connecting shaft portion 162, the pressing surface 153 moves outward in the width direction (the latch member 150 opens). As shown in FIG. 11 , an inclined surface 152a may be formed on the lower portion of the inner circumferential surface of the slide groove 152 that comes into contact with the slide shaft portion 163 when the latch member 150 opens. The inclined surface 152a is a flat surface that slopes diagonally downward from the outer side toward the inner side in the width direction. When the slide shaft portion 163 comes into contact with this inclined surface 152a, downward and outward forces (forces that rotate the latch member 150 around the second connecting shaft portion 162) are applied to the slide groove 152, and as a result, the latch member 150 can be reliably rotated. However, the lower part of the inner circumferential surface of the slide groove 152 does not have to be the inclined surface 152a, and may be a simple circumferential surface, for example, as indicated by the two-dot chain line in FIG. 11. Even in this case, the slide shaft portion 163 as a contact portion can come into contact with the lower end of the inner circumferential surface of the slide groove 152 and apply a downward force (force that rotates the latch member 150 around the second connecting shaft portion 162) to the slide groove 152. Furthermore, when the cover member 120 moves through the first section toward the close position, the lower end of the arm portion 122 serving as a contact portion provided on the cover member 120 may be brought into contact with the arm opposing surface 154a (see FIG. 6) formed on the latch member 150, thereby applying a force to the latch member 150 (arm opposing surface 154a) to rotate the latch member 150 around the second connecting shaft portion 162.

[0076] <Variation 1> Although the first connecting shaft portion 161 is a separate component from the cover member 120 and the lever member 140, it may be formed integrally with the cover member 120 or the lever member 140. Furthermore, although the second connecting shaft portion 162 is a separate component from the latch member 150, it may be formed integrally with the latch member 150. Furthermore, although the slide shaft portion 163 is a separate component from the cover member 120, it may be formed integrally with the cover member 120. Furthermore, although the protrusion 143 is formed integrally with the lever member 140, a shaft-shaped part separate from the lever member 140 may be inserted into the lever member 140 in place of the protrusion 143.

[0077] <Variation 2> Although the latch member 150 is rotated by bringing the slide shaft portion 163 into contact with the slide groove 152, the mechanism for applying a force to the latch member 150 to rotate the latch member 150 is not limited to the combination of these parts. For example, a force to rotate the latch member 150 may be applied to the latch member 150 by bringing the arm portion 122 of the cover member 120 into contact with any part of the latch member 150. Also, a force to rotate the latch member 150 may be applied to the latch member 150 by appropriately setting the position of the center of gravity of the latch member 150.

[0078] <Variation 3> The inspection socket 100 described so far has two latch members 150 facing each other in the width direction. However, if the size of the semiconductor package 181 is large, for example, the inspection socket 100 may have two other latch members 150 facing each other in the depth direction. In this case, the total number of shaft holding portions 123 formed on the cover member 120 will be eight.

[0079] <Effects of this embodiment> When the cover member 120 is in the first section, the movement of the latch member 150 is restricted by the link mechanism so that it moves from the open position to the upper position by rotating around the second connecting shaft 162 along the depth direction, and when the cover member 120 is in the second section, the movement is restricted by the link mechanism so that it moves only downward from the upper position to the pressing position.Therefore, when / just before the latch member 150 presses the semiconductor package 181, the latch member 150 moves only downward and does not move horizontally (in the depth direction and width direction), so that the latch member 150 does not rub against and damage the upper surface of the semiconductor package 181 by moving horizontally on the upper surface of the semiconductor package 181 placed on the mounting surface 113a. Furthermore, the movement of the latch member 150 is constantly restricted by the link mechanism while it moves from the release position to the pressing position. Therefore, the latch member 150 does not wobble or the wobbling of the latch member 150 is suppressed, so that the semiconductor package 181 is not damaged due to the wobbling of the latch member 150.

[0080] Since the second connecting shaft 162 is located laterally (in the lateral region) in the width direction of the lower region of the placement surface 113a, the latch member 150, which rotates around the second connecting shaft 162, can be easily disposed in the lateral region. This reduces the rotation angle (opening / closing angle) of the latch member 150 required to open the upper part of the mounting surface 113a compared to when the rotation center (second connecting shaft portion 162) of the latch member 150 is located in the lower region of the mounting surface 113a. In other words, in an inspection socket 100 with size restrictions, the movable range of the latch member 150 required to open the upper part of the mounting surface 113a can be reduced, so that the upper part of the mounting surface 113a can be opened efficiently.

[0081] The link mechanism has a slide shaft portion 163 as a contact portion, and the slide shaft portion 163 is provided on the cover member 120. When the cover member 120 is in the first section, the slide shaft portion 163 applies a force to the latch member 150 to rotate the latch member 150 around the second connecting shaft portion 162, thereby enabling the latch member 150 to rotate reliably.

[0082] [Second embodiment] An inspection socket according to a second embodiment of the present invention will be described below with reference to FIGS. In the following description, the "up-down direction," "width direction," and "depth direction" are generally perpendicular to one another. However, these terms are used for ease of understanding and do not limit the position of the inspection socket during use.

[0083] <Configuration of the test socket> The configuration of the inspection socket 200 will be described.

[0084] As shown in FIGS. 40 and 41, the inspection socket 200 is a device on which the semiconductor package 281 is placed when a burn-in test of the semiconductor package 281 is performed. The burn-in test is carried out in a state where the semiconductor package 281 placed on the placement surface 213a of the pedestal portion 213 of the base member 210 is pressed down by the latch member (pressing member) 250.

[0085] As shown in FIGS. 40 and 41, 42 and 43, the latch member 250 is configured to move and rotate in conjunction with the downward movement / upward movement of the cover member 220. Specifically, by moving the cover member 220 from above to below, the latch member 250 moves and rotates to the open position, allowing the semiconductor package 281 to be placed on the placement surface 213a (the space above the placement surface 213a is opened, making it possible to access the placement surface 213a). Conversely, by moving the cover member 220 from below to above, the latch member 250 rotates and moves to the pressing position, and the latch member 250 presses down the semiconductor package 281 placed on the placement surface 213a.

[0086] The configuration of the inspection socket 200 will be described in detail below. 40, 41, and 44, the inspection socket 200 includes a base member 210, a cover member 220, a plurality of lever members (transmission members) 240, and a plurality of latch members 250. The inspection socket 200 also includes a link mechanism that connects two or more components among the base member 210, the cover member 220, the lever members 240, and the latch members 250. However, the link mechanism may be included in the configuration of the base member 210, the cover member 220, the lever members 240, and the latch members 250.

[0087] The base member 210 is fixed to a substrate (not shown), houses the contact pins 271, and is a component on which the semiconductor package 281 is placed. The base member 210 constitutes, for example, the lower part of the inspection socket 200 . The base member 210 is made of an insulating material (for example, resin).

[0088] As shown in FIGS. 44 and 45, the base member 210 includes, for example, a pin receiving portion 212 and a pedestal portion 213.

[0089] The pin accommodating portion 212 is fixed to a substrate (not shown) and is a portion that accommodates and holds a plurality of contact pins 271 , and constitutes the lower portion of the base member 210 . The contact pins 271 are pin-shaped components that extend in the vertical direction and are made of a conductive material (for example, metal). The upper ends of the contact pins 271 housed and held in the pin housing portions 212 come into contact with the solder balls of the semiconductor package 281.

[0090] The base 213 has a mounting surface 213a on which the semiconductor package 281 is placed. The mounting surface 213a corresponds to the upper surface of the base 213. The base portion 213 is attached to the top of the pin accommodating portion 212 .

[0091] The base member 210 is formed with a plurality of slide grooves 212a (link mechanisms) and through holes 212b.

[0092] As shown in Figure 45, the slide groove 212a is a groove that includes a lower groove portion 212a1 extending in the vertical direction and an upper groove portion 212a2 that is connected to the upper end of the lower groove portion 212a1 and extends diagonally upward toward the outside in the width direction, and is formed, for example, in the pin accommodating portion 212. The width of the slide groove 212a is approximately equal to or slightly larger than the diameter of the second connecting shaft portion 262 and the slide shaft portion 263. The slide grooves 212a are formed not in the lower region of the mounting surface 213a of the base portion 213 but on both sides in the width direction of the lower region (hereinafter referred to as "side regions"), one pair at a time. The two slide grooves 212a that make up one pair face each other in the depth direction. Both ends of a second connecting shaft 262 (link mechanism) extending in the depth direction and both ends of a slide shaft 263 (link mechanism) extending in the depth direction are inserted into these slide grooves 212a. Therefore, the second connecting shaft 262 and the slide shaft 263 are located in a lateral region rather than a lower region of the mounting surface 213a. The movement of the second connecting shaft 262 and the slide shaft 263 inserted into the slide groove 212a is restricted so that they slide along the slide groove 212a.

[0093] The through hole 212b is a circular hole formed outside the lower groove portion 212a1 of the slide groove 212a in the width direction. A rotation shaft portion 264 (link mechanism) extending in the depth direction is inserted into this through hole 212b along the depth direction.

[0094] The base member 210 configured as described above may include parts other than the pin accommodating portion 212 and the pedestal portion 213, or at least one of the pin accommodating portion 212 and the pedestal portion 213 may be divided into multiple parts, or the multiple parts that make up the base member 210 may be integrated as appropriate.

[0095] As shown in FIGS. 40 and 41, 44 and 45, the cover member 220 is a component that covers the base member 210 from above. The cover member 220 forms, for example, the upper part of the inspection socket 200 . The cover member 220 is made of an insulating material (for example, resin). A through opening 221 is formed in the center of the cover member 220 in the depth and width directions, and is configured to allow access to the base member 210 (more specifically, the mounting surface 213a of the pedestal portion 213) through the through opening 221.

[0096] The cover member 220 has a plurality of shaft holders 223 formed thereon. The shaft holding portions 223 are portions that protrude downward from the lower ends of both sides in the width direction of the cover member 220, and two are formed on each side (four in total). The two shaft holders 223 on the same side face each other with a gap in between in the depth direction. A first connecting shaft 261 (link mechanism) extending in the depth direction is inserted along the depth direction into the two opposing shaft holders 223. At this time, both ends of the first connecting shaft 261 are held by the shaft holders 223, respectively.

[0097] As shown in FIGS. 40 and 41, each shaft holder 223 is formed with a slit 223a. The slit 223a is a slit (a narrow gap) that extends upward from the lower end of the shaft holding portion 223. The lever member 240 fits into this slit 223a. At this time, the lever member 240 that has fit into the slit 223a is pivotally supported by the first connecting shaft portion 261 inserted into the shaft holding portion 223.

[0098] A spring 230 that expands and contracts in the vertical direction is provided between the cover member 220 and the base member 210 . These springs 230 bias the cover member 220 in a direction (upward) that moves the cover member 220 away from the base member 210 along the vertical direction. However, the inspection socket 200 is provided with a mechanism for restricting the movable range of the cover member 220 so that the cover member 220 does not come off the base member 210 due to the upward force applied by the spring 230 .

[0099] When no external force is applied (when not pushed in), the cover member 220 waits at a position separated as far as possible from the base member 210 in the vertical direction (hereinafter referred to as the "separated position") due to the force exerted by the spring 230. On the other hand, by pushing the cover member 220 toward the base member 210 against the force of the spring 230, the cover member 220 moves to a position where it is as close as possible to the base member 210 in the vertical direction (hereinafter referred to as the "close position"). Here, it goes without saying that the distance varies depending on whether or not the semiconductor package 281 is present and the thickness of the semiconductor package 281 .

[0100] It should be noted that any part other than the spring 230 may be used as long as it can bias the cover member 220 upward.

[0101] As shown in FIGS. 44, 45 and 46, the lever member 240 is a component provided in a side region of the base member 210. The lever member 240 is made of, for example, metal or resin. The lever member 240 converts the upward movement (hereinafter also referred to as "upward movement") / downward movement (hereinafter also referred to as "downward movement") of the cover member 220 into downward movement / upward movement of the second connecting shaft portion 262 / latch member 250 and transmits it.

[0102] Each lever member 240 is formed with a through-hole 241, a tip groove 242, and a through-hole 243.

[0103] The through-hole 241 is an elongated hole formed in the outer portion of the lever member 240 in the width direction. The first connecting shaft portion 261 inserted into the shaft holding portion 223 of the cover member 220 is inserted along the depth direction into this long through hole 241. As a result, the lever member 240 is connected to the cover member 220 via the first connecting shaft portion 261.

[0104] The tip groove 242 is a groove formed in the inner portion of the lever member 240 in the width direction. The tip groove 242 is formed, for example, by bifurcating the tip of the lever member 240 . The second connecting shaft portion 262 is inserted into this tip groove 242 .

[0105] The through hole 243 is a circular hole formed between the elongated through hole 241 and the tip groove 242 in the width direction. The pivot shaft 264 inserted into the through hole 212b of the base member 210 is inserted in the depth direction into the through hole 243. As a result, the lever member 240 is connected to the base member 210 via the pivot shaft 264.

[0106] The lever member 240 configured as above functions like a lever / seesaw with the rotation shaft portion 264 as a fulcrum (rotation fulcrum), the first connecting shaft portion 261 as a force point, and the second connecting shaft portion 262 as a point of action. That is, by moving the cover member 220 connected to the first connecting shaft portion 261 up / down, the lever member 240 rotates around the pivot shaft portion 264, and the second connecting shaft portion 262, which is located opposite the first connecting shaft portion 261 with respect to the pivot shaft portion 264, moves up / down. At this time, the second connecting shaft 262 is restricted in movement by the lower groove portion 212a1 of the slide groove 212a, and therefore slides only in the vertical direction. Note that the second connecting shaft 262 does not reach the upper groove portion 212a2 of the slide groove 212a.

[0107] As shown in FIGS. 44 and 45, 46 and 47, the latch member 250 is a component provided on a side region of the base member 210. The latch member 250 is a component that presses the upper surface of the semiconductor package 281 placed on the placement surface 213a and also opens the top of the placement surface 213a so that the semiconductor package 281 can be placed thereon.

[0108] The latch member 250 has a main body portion 251 and a pressing portion 252 .

[0109] The main body portion 251 is, for example, a hook-shaped part provided on a side region of the base member 210. The main body 251 is made of an insulating material (for example, resin).

[0110] The pressing portion 252 is a member pivotally supported at the tip of the main body portion 251 . The pressing portion 252 is made of an insulating material (for example, resin). As shown in FIG. 47, each pressing portion 252 is formed with a pressing surface 252a and a protrusion 252b.

[0111] The pressing surface 252a is a surface that faces (is approximately parallel to) the mounting surface 213a and / or the upper surface of the semiconductor package 281 when the cover member 220 is in the separated position, and is located more inward in the width direction than the second connecting shaft portion 262. Hereinafter, the position of the latch member 250 where the pressing surface 252a presses against (contacts with) the top surface of the semiconductor package 281 will be referred to as the "pressing position." Also, the position of the latch member 250 where the latch member 250 opens the area above the mounting surface 213a so that the semiconductor package 281 can be placed thereon, i.e., the position of the latch member 250 where the pressing surface 252a is located outside the upper area of the mounting surface 213a, will be referred to as the "open position." Also, the position of the latch member 250 where the pressing surface 252a faces the top surface of the semiconductor package 281 but is above the semiconductor package 281 and does not press against (is not in contact with) the semiconductor package 281 will be referred to as the "upper position."

[0112] The protrusion 252b is a convex portion formed above the pressing surface 252a. The protrusions 252b protrude inward from both sides in the depth direction. That is, there are two protrusions 252b, one at the front and one at the back. These protrusions 252b are fitted into recesses 251c formed at the tip of the main body 251. Details will be provided below.

[0113] As shown in FIGS. 46 and 47, each main body portion 251 is formed with a lower through-hole 251a, an upper through-hole 251b, and a recess 251c.

[0114] The recess 251c is a recess formed at the tip of the main body 251. The recess 251c is recessed inward from both sides in the depth direction. Protrusions 252b of pressing portion 252 are fitted into these recesses 251c from the outside. This allows pressing portion 252 to be rotatably connected to main body portion 251. A gap is formed between the outer peripheral surface of protrusion 252b and the inner peripheral surface of recess 251c, allowing pressing portion 252 to swing like a pendulum relative to main body portion 251. This makes it easier for pressing surface 252a to come into surface contact with the upper surface of semiconductor package 281. However, a mechanism for restricting the rotation range of the pressing portion 252 may be provided on the main body portion 251 and / or the pressing portion 252 so that the pressing portion 252 does not swing more than necessary relative to the main body portion 251.

[0115] The lower through-hole 251a is a circular hole. The second connecting shaft 262, which is inserted into the tip groove 242 of the lever member 240 and into the lower groove portion 212a1 of the slide groove 212a of the base member 210, is inserted into this lower through-hole 251a along the depth direction. This causes the latch member 250 to be connected to the lever member 240 via the second connecting shaft 262.

[0116] The upper through-hole 251b is a circular hole formed directly above the lower through-hole 251a when the latch member 250 is in the pressed position or the upper position. The slide shaft portion 263 inserted into the slide groove 212a of the base member 210 is inserted into this upper through-hole 251b along the depth direction. As a result, the latch member 250 is connected to the base member 210 via the slide shaft portion 263. The slide shaft 263 slides while always contacting some part of the inner surface of the slide groove 212a.

[0117] The latch member 250 configured as described above moves between an open position, an upper position, and a pressed position. At this time, the two shaft portions of the latch member 250, the second connecting shaft portion 262 inserted into the lower through-hole 251a and the slide shaft portion 263 inserted into the upper through-hole 251b, are always in contact with the slide groove 212a of the base member 210, so that the movement of the latch member 250 is restricted and fluctuation of its posture is suppressed.

[0118] <About the movement of the inspection socket> The movement of the latch member 250 when it moves from the release position to the pressing position after the semiconductor package 281 is placed on the base portion 213 will be described.

[0119] FIG. 48 shows a plan view of the inspection socket 200 from above with the latch member 250 in the open position. 49 and 50 are cross-sectional views taken along the line AA and the line BB in FIG.

[0120] As shown in Figures 49 and 50, when the cover member 220 is in the approximated position, the latch member 250 is in the open position. The first connecting shaft 261 is located at the lowest position within its movable range. The second connecting shaft 262 is located at the highest position within its movable range (for example, near the upper end of the lower groove portion 212a1 of the slide groove 212a formed in the base member 210). The slide shaft 263 is located at the highest and outermost position within its movable range (for example, near the upper end of the upper groove portion 212a2 of the slide groove 212a formed in the base member 210).

[0121] FIG. 51 shows a plan view of the test socket 200 from above with the latch member 250 in a position between the open position and the upper position. 52 and 53 are cross-sectional views taken along the line AA and the line BB in FIG. 51.

[0122] 52 and 53, when the cover member 220 moves upward from the close position (but has not yet reached the distant position), the latch member 250 is positioned between the open position and the upper position. Specifically, when the latch member 250 rotates around the second connecting shaft portion 262, the pressing portion 252 moves inward in the width direction (the latch member 250 closes). However, the pressing surface 252a of the pressing portion 252 does not face the top surface of the semiconductor package 281. The movement will be explained in detail below. That is, when the cover member 220 moves upward from the close position, the first connecting shaft portion 261 provided on the cover member 220 moves upward. When the first connecting shaft portion 261 moves upward, the second connecting shaft portion 262 moves downward due to the function of the lever member 240 which rotates around the rotation shaft portion 264. When the second connecting shaft 262 moves downward, the latch member 250 connected to the second connecting shaft 262 moves downward. At this time, the slide shaft 263 provided on the latch member 250 slides in the up-down and width directions along the upper groove portion 212a2 while making contact with the inner surface of the upper groove portion 212a2 of the slide groove 212a serving as a contact portion formed in the base member 210. When the slide shaft 263 slides, the upper groove portion 212a2 of the slide groove 212a serving as a contact portion applies a force to the latch member 250 (slide shaft 263) that rotates the latch member 250 about the second connecting shaft 262. As a result, the latch member 250 rotates about the second connecting shaft 262. In FIG. 53, the contact point between the slide shaft portion 263 and the slide groove 212a is indicated by a black circle, and the force that rotates the latch member 250 around the second connecting shaft portion 262 is indicated by a black arrow.

[0123] FIG. 54 shows a plan view of the inspection socket 200 as seen from above when the latch member 250 is moved from the open position to the upper position. 55 and 56 are cross-sectional views taken along the line AA and the line BB in FIG.

[0124] 55 and 56, when the cover member 220 moves further upward (but has not yet reached the separated position), the latch member 250 moves from the open position to the upper position. Specifically, as the latch member 250 further rotates about the second connecting shaft portion 262, the pressing portion 252 moves further inward in the width direction, and the pressing surface 252a faces (but does not contact) the top surface of the semiconductor package 281. The movement will be explained in detail below. That is, when the cover member 220 moves further upward, the first connecting shaft portion 261 provided on the cover member 220 moves further upward. When the first connecting shaft 261 moves further upward, the second connecting shaft 262 moves further downward due to the function of the lever member 240 which rotates around the rotation shaft 264. When the second connecting shaft 262 moves further downward, the latch member 250 connected to the second connecting shaft 262 moves further downward. At this time, the slide shaft 263 provided on the latch member 250 slides in the up-down and width directions along the upper groove portion 212a2 while making contact with the inner surface of the upper groove portion 212a2 of the slide groove 212a serving as a contact portion formed in the base member 210. When the slide shaft 263 slides, the upper groove portion 212a2 of the slide groove 212a serving as a contact portion applies a force to the latch member 250 (slide shaft 263) to rotate the latch member 250 about the second connecting shaft 262. When the latch member 250 moves downward and rotates around the second connecting shaft 262 until the slide shaft 263 reaches the lower groove portion 212a1 of the slide groove 212a, the slide shaft 263 simply slides up and down in the lower groove portion 212a1 of the slide groove 212a, and no force is applied to rotate the latch member 250 around the second connecting shaft 262. At this time, the slide shaft 263 is positioned directly above the second connecting shaft 262. This completes the rotation of the latch member 250. That is, the latch member 250 moves from the open position to the upper position, and the pressing surface 252a of the pressing portion 252 faces (but is not in contact with) the upper surface of the semiconductor package 281.

[0125] The section in which the cover member 220 moves upward by a predetermined distance from the close position while the latch member 250 moves from the open position to the upper position is referred to as the "first section."

[0126] FIG. 57 shows a plan view of the inspection socket 200 seen from above when the latch member 250 is in the pressing position. 58 and 59 are cross-sectional views taken along the line AA and the line BB in FIG. 57.

[0127] 58 and 59, when cover member 220 moves further upward and reaches the separated position, latch member 250 moves from the upper position to the pressing position. Specifically, as latch member 250 moves downward, pressing surface 252a of pressing portion 252 comes into contact with the upper surface of semiconductor package 281 and presses semiconductor package 281. The movement will be explained in detail below. That is, when the cover member 220 moves further upward, the first connecting shaft portion 261 provided on the cover member 220 moves further upward. When the first connecting shaft 261 moves further upward, the second connecting shaft 262 moves further downward due to the function of the lever member 240 which rotates around the rotation shaft 264. When the second connecting shaft portion 262 moves further downward, the latch member 250 connected to the second connecting shaft portion 262 moves further downward. As described above, the slide groove 212a of the base member 210 is already in a state where it does not apply a force to the latch member 250 (slide shaft portion 263) that would rotate the latch member 250. Therefore, the latch member 250 simply moves downward. However, the slide shaft portion 263 is in contact with the slide groove 212a (lower groove portion 212a1), which prevents the latch member 250 from wobbling. As the latch member 250 moves further downward, the pressing surface 252a of the pressing portion 252 eventually comes into contact with the upper surface of the semiconductor package 281 and presses the semiconductor package 281. In other words, the latch member 250 is positioned at the pressing position.

[0128] The section in which the cover member 220 moves further upward while the latch member 250 moves from the upper position to the pressing position and reaches the remote position is referred to as the “second section.” In other words, the section from the end of the first section to the remote position is referred to as the “second section.”

[0129] While the latch member 250 moves from the upper position to the pressing position, the latch member 250 moves only downward in the up-down direction, and does not move in the width or depth directions. Therefore, the pressing surface 252a of the pressing portion 252 that comes into contact with the top surface of the semiconductor package 281 does not move in the width or depth directions, and the pressing surface 252a does not rub against and damage the top surface of the semiconductor package 281. Furthermore, by appropriately ensuring the distance that the latch member 250 moves from the upper position to the pressing position (i.e., the distance that it moves only in the vertical direction), the inspection socket 200 can be adapted to the specifications of semiconductor packages 281 having various thicknesses.

[0130] When the latch member 250 is moved from the pressed position to the released position, the cover member 220 in the separated position is pressed toward the base member 210. At this time, the cover member 220 moves from the separated position through the second section and the first section and reaches the close position. When the cover member 220 moves through the first section toward the close position, a slide shaft portion 263 serving as a contact portion provided on the latch member 250 slides up and down and in the width direction along the upper groove portion 212a2 while making contact with the inner surface of the upper groove portion 212a2 of the slide groove 212a serving as a contact portion formed in the base member 210. When the slide shaft portion 263 slides, the upper groove portion 212a2 of the slide groove 212a serving as a contact portion applies a force to the latch member 250 (slide shaft portion 263) that rotates the latch member 250 about the second connecting shaft portion 262. Then, as the latch member 250 rotates about the second connecting shaft portion 262, the pressing portion 252 moves outward in the width direction (the latch member 250 opens). 56, the inner surface of upper groove portion 212a2 includes an upper surface and a lower surface facing each other, and the surface that applies force to slide shaft portion 263 when latch member 250 is opened is the upper surface of upper groove portion 212a2 (the surface facing downward, i.e., the surface that applies a downward force). Conversely, the surface that applies force to slide shaft portion 263 when latch member 250 is closed is the lower surface of upper groove portion 212a2 (the surface facing upward, i.e., the surface that applies an upward force).

[0131] <Variation 4> Although the first connecting shaft portion 261 is a separate component from the cover member 220, it may be formed integrally with the cover member 220. Furthermore, although the second connecting shaft portion 262 is a separate component from the latch member 250, it may be formed integrally with the latch member 250. Furthermore, although the slide shaft portion 263 is a separate component from the latch member 250, it may be formed integrally with the latch member 250. Furthermore, although the rotation shaft portion 264 is a separate component from the base member 210 and the lever member 240, it may be formed integrally with the base member 210 or the lever member 240.

[0132] <Variation 5> The protrusion 252b of the pressing portion 252 of the latch member 250 was formed integrally with the pressing portion 252, but the protrusion 252b may be replaced by inserting a shaft-shaped part separate from the pressing portion 252 into the pressing portion 252 and the main body portion 251.

[0133] <Variation 6> The inspection socket 200 described so far has two latch members 250 facing each other in the width direction. However, if the size of the semiconductor package 281 is large, for example, the inspection socket 200 may have two other latch members 250 facing each other in the depth direction. In this case, the total number of shaft holding portions 223 formed on the cover member 220 will be eight.

[0134] <Effects of this embodiment> When the cover member 220 is in the first section, the movement of the latch member 250 is restricted by the link mechanism so that it moves from the open position to the upper position by rotating around the second connecting shaft 262 along the depth direction, and when the cover member 220 is in the second section, the movement is restricted by the link mechanism so that it moves only downward from the upper position to the pressing position.Therefore, when / just before the latch member 250 presses the semiconductor package 281, the latch member 250 moves only downward and does not move horizontally (in the depth direction and width direction), so that the latch member 250 does not rub against and damage the upper surface of the semiconductor package 281 by moving horizontally on the upper surface of the semiconductor package 281 placed on the placement surface 213a. Furthermore, the movement of the latch member 250 is constantly restricted by the link mechanism while it moves from the release position to the pressing position. Therefore, the latch member 250 does not wobble or the wobbling of the latch member 250 is suppressed, so that the semiconductor package 281 is not damaged due to the wobbling of the latch member 250.

[0135] Since the second connecting shaft 262 is located laterally (in the lateral region) in the width direction of the lower region of the placement surface 213a, the latch member 250, which rotates around the second connecting shaft 262, can be easily disposed in the lateral region. This reduces the rotation angle (opening / closing angle) of the latch member 250 required to open the upper part of the mounting surface 213a compared to when the rotation center (second connecting shaft portion 262) of the latch member 250 is located in the lower region of the mounting surface 213a. In other words, in the inspection socket 200 with size restrictions, the movable range of the latch member 250 required to open the upper part of the mounting surface 213a can be reduced, so that the upper part of the mounting surface 213a can be opened efficiently.

[0136] The link mechanism has a slide groove 212a as a contact portion, and the slide groove 212a is provided in the base member 210. When the cover member 220 is in the first section, the slide groove 212a applies a force to the latch member 250 to rotate the latch member 250 around the second connecting shaft portion 262, thereby enabling the latch member 250 to rotate reliably. [Explanation of symbols]

[0137] 100 Inspection socket 110 Base member 111 Installation section 111a Horizontal groove (link mechanism) 112 Pin Receptacle 113 Pedestal 113a Placement surface 114 Vertical groove (link mechanism) 120 Cover member 121 Through opening 122 Arm section 122a Through hole 123 Shaft holding part 130 Spring 140 Lever member (transmission member, link mechanism) 141 through hole 142 through slot 143 Protrusion 150 Latch member (pressure member) 151 through hole 152 Slide groove (link mechanism) 152a Slope 153 Pressing surface 154 Connection 154a Arm facing surface 161 First connecting shaft (link mechanism) 162 Second connecting shaft (link mechanism) 163 Slide shaft (link mechanism, contact part) 171 Contact pin 181 Semiconductor Package 200 Inspection socket 210 Base member 212 Pin Receptacle 212a Slide groove (link mechanism) 212a1 Bottom groove 212a2 Upper groove 212b Through hole 213 Pedestal 213a Placement surface 220 Cover member 221 Through opening 223 Shaft holding part 223a Slit 230 Spring 240 Lever member (transmission member, link mechanism) 241 Through slot 242 Tip groove 243 Through Hole 250 Latch member (pressure member) 251 Main body 251a Lower through hole 251b Upper through hole 251c depression 252 Pressing part 252a Pressing surface 252b Protrusion 261 First connecting shaft (link mechanism) 262 Second connecting shaft (link mechanism) 263 Slide shaft (link mechanism) 264 Rotating shaft (link mechanism) 271 Contact pin 281 Semiconductor Package

Claims

1. a base member having a mounting surface on which a semiconductor package is mounted; a cover member attached to the base member and movable in a vertical direction perpendicular to the placement surface between a close position where the cover member is close to the base member and a distant position where the cover member is distant from the base member; at least one pressing member that moves between an open position that opens the upper side of the mounting surface so that the semiconductor package can be placed thereon and a pressing position that presses the upper surface of the semiconductor package placed on the mounting surface; a link mechanism that moves the pressing member between the release position and the pressing position in response to movement of the cover member along the up-down direction; Equipped with The pressing member is In a first section in which the cover member moves upward by a predetermined distance from the close position, the link mechanism restricts the movement of the cover member so that the cover member moves from the open position to above the placement surface by rotating about an axis along a first orthogonal direction that is orthogonal to the up-down direction, In a second section in which the cover member further moves upward and reaches the separated position, the movement is restricted by the link mechanism so that the cover member moves only downward to the pressing position. Inspection socket.

2. the link mechanism includes a transmission member, a first connecting shaft, a second connecting shaft, and a rotating shaft; the first connecting shaft portion, the second connecting shaft portion, and the rotating shaft portion extend in the first orthogonal direction, The transmission member is The first connecting shaft is connected to the cover member, The second connecting shaft is connected to the pressing member, When a direction perpendicular to the up-down direction and the first orthogonal direction is defined as a second orthogonal direction, the rotary shaft portion is connected to the base member between the first connecting shaft portion and the second connecting shaft portion in the second orthogonal direction, By rotating around the rotation shaft portion, upward movement of the cover member is converted into downward movement of the pressing member, The second connecting shaft is restricted in movement so as to move only in the up and down direction.

2. The inspection socket according to claim 1.

3. The second connecting shaft is located to the side of the lower region of the placement surface in the second orthogonal direction.

3. The inspection socket according to claim 2.

4. the link mechanism has a contact portion, The contact portion is provided on the cover member, In the first section, a force is applied to the pressing member to rotate the pressing member about the second connecting shaft portion.

3. The inspection socket according to claim 2.

5. the link mechanism has a slide shaft portion and a slide groove, The slide shaft portion is provided on the cover member, between the first connecting shaft portion and the second connecting shaft portion in the second orthogonal direction, The slide groove is provided on the pressing member, The slide shaft is configured to slide.

5. The inspection socket according to claim 4.

6. the slide shaft portion is the contact portion, When the slide shaft portion comes into contact with the slide groove, the pressing member rotates around the second connecting shaft portion.

6. The inspection socket according to claim 5.

7. the link mechanism has a contact portion, The contact portion is provided on the base member, In the first section, a force is applied to the pressing member to rotate the pressing member about the second connecting shaft portion.

3. The inspection socket according to claim 2.

8. the link mechanism has a slide shaft portion and a slide groove, The slide shaft portion is provided on the pressing member, Located above the second connecting shaft portion, The slide groove is provided on the base member, The second connecting shaft portion and the slide shaft portion are configured to slide.

8. The inspection socket according to claim 7.

9. the slide groove is the contact portion, When the slide shaft portion comes into contact with the slide groove, the pressing member rotates around the second connecting shaft portion.

9. The inspection socket according to claim 8.

10. In the first section, The second connecting shaft portion slides in the slide groove in the up-down direction, The slide shaft portion slides in the slide groove in the vertical direction and the second orthogonal direction.

10. The inspection socket of claim 9.

Images