Resin composition

Abstract

To provide a resin composition which has high viscosity, and enables an optical fiber to be bonded to a groove of a silicon chip with a small exposure amount.SOLUTION: There is provided a resin composition for bonding an optical fiber to a groove of a silicon chip. The resin composition contains (A) a liquid aliphatic oxetane resin, (B) a solid aliphatic epoxy resin, (C) a liquid aliphatic epoxy resin, and (D) a photocationic polymerization initiator. The resin composition contains or does not contain (E) inorganic particles, and the amount of (E) the inorganic particles is 15 mass% or less with respect to 100 wt.% of the total amount of the resin composition.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a resin composition, particularly to a resin composition for bonding an optical fiber to a groove in a silicon chip to which silicon photonics is applied, and to a device using the resin composition and a method for manufacturing the same. [Background technology]

[0002] Conventional optical semiconductor devices, in which optical components are mounted on a mounting substrate, are sometimes manufactured by adhering the optical components to the mounting substrate using an adhesive. Patent Document 1 proposes using a photocurable adhesive composition as the adhesive. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2022-69039 Summary of the Invention [Problem to be solved by the invention]

[0004] Silicon is generally transparent at optical communication wavelengths of 1.1 μm or longer. Therefore, silicon photonics, which uses silicon to form optical integrated circuits, is attracting attention. In silicon photonics, it is possible to form fine optical waveguides on silicon substrates using conventional LSI manufacturing techniques, and it is expected that, for example, silicon chips with nanometer-sized optical waveguides formed on silicon substrates can be manufactured at low cost.

[0005] The silicon chips formed using silicon photonics may require connection with optical fibers. For example, in order to optically connect multiple silicon chips, it may be necessary to connect optical fibers to the silicon chips. Furthermore, for example, silicon chips are expected to be mounted on opto-electrical hybrid boards. When multiple opto-electrical hybrid boards are connected with optical fibers, it may be necessary to connect the optical fibers to the silicon chips.

[0006] As a method for connecting an optical fiber to a silicon chip, the inventors have focused on a connection method using a groove such as a V-groove or a U-groove. In this method, a groove for connecting an optical fiber is formed on the surface of the silicon chip, and the optical fiber is bonded to the groove using a light-curing adhesive. In this method, the use of the groove makes it possible to precisely adjust the position of the optical fiber.

[0007] Silicon chips using silicon photonics are currently in the research stage, and connections to optical fibers are mainly performed manually. Therefore, it is currently acceptable for adhesives to take a long time to harden. However, in the future industrialization stage, high-speed mass production will be required, so adhesives that harden quickly are expected to be required. Specifically, adhesives must be able to harden to a degree that provides sufficient adhesive strength with a small amount of light exposure.

[0008] On the other hand, when connecting optical fibers using a groove, the adhesive must have a high viscosity to ensure uniform application, specifically, a viscosity of 4 Pa·s or more at room temperature (e.g., 25°C).

[0009] However, when a resin composition used as an adhesive has a high viscosity, the amount of exposure required for curing tends to be large. Therefore, there is a trade-off between increasing the viscosity of the resin composition and reducing the amount of exposure required to promote curing of the resin composition. For this reason, a resin composition that has a high viscosity and is capable of adhering an optical fiber to a groove in a silicon chip with a low amount of exposure has not yet been obtained.

[0010] The present invention was devised in view of the above-mentioned problems, and aims to provide a resin composition that has high viscosity and is capable of adhering an optical fiber to a groove in a silicon chip with a small amount of exposure light; and a device using the resin composition and a method for manufacturing the same. [Means for solving the problem]

[0011] The present inventors have conducted extensive research to solve the above-mentioned problems, and as a result, have found that the above-mentioned problems can be solved by a resin composition containing (A) an aliphatic liquid oxetane resin, (B) an aliphatic solid epoxy resin, (C) an aliphatic liquid epoxy resin, and (D) a photocationic polymerization initiator, and in which the amount of (E) inorganic particles in the resin composition is equal to or less than a specific threshold value, thereby completing the present invention. That is, the present invention includes the following.

[0012] <1> A resin composition for bonding an optical fiber to a groove in a silicon chip; The resin composition comprises (A) an aliphatic liquid oxetane resin, (B) an aliphatic solid epoxy resin, (C) an aliphatic liquid epoxy resin, and (D) a photocationic polymerization initiator; The resin composition may or may not contain (E) inorganic particles; (E) A resin composition in which the amount of inorganic particles is 15% by mass or less, relative to 100% by mass of the total amount of the resin composition. <2> the amount of (A) aliphatic liquid oxetane resin is 10 parts by mass or more and 50 parts by mass or less relative to 100 parts by mass of the total amount of (A) aliphatic liquid oxetane resin, (B) aliphatic solid epoxy resin, and (C) aliphatic liquid epoxy resin; <1> The resin composition according to claim 1. <3> the amount of the (B) aliphatic solid epoxy resin is 40 parts by mass or more and 80 parts by mass or less per 100 parts by mass of the total amount of the (A) aliphatic liquid oxetane resin, the (B) aliphatic solid epoxy resin, and the (C) aliphatic liquid epoxy resin; <1> or <2> The resin composition according to claim 1. <4> the amount of the (C) aliphatic liquid epoxy resin is 1 part by mass or more and 30 parts by mass or less per 100 parts by mass of the total amount of the (A) aliphatic liquid oxetane resin, the (B) aliphatic solid epoxy resin, and the (C) aliphatic liquid epoxy resin; <1> ~ <3> The resin composition according to any one of claims 1 to 10. <5> (D) the amount of the photocationic polymerization initiator is 0.1 parts by mass or more and 5 parts by mass or less per 100 parts by mass of the total amount of the (A) aliphatic liquid oxetane resin, the (B) aliphatic solid epoxy resin, and the (C) aliphatic liquid epoxy resin; <1> ~ <4> The resin composition according to any one of claims 1 to 10. <6> (B) The aliphatic solid epoxy resin comprises at least one selected from the group consisting of hydrogenated bisphenol A epoxy resins and aliphatic epoxy resins containing a 6-membered ring; <1> ~ <5> The resin composition according to any one of claims 1 to 10. <7> (C) The aliphatic liquid epoxy resin comprises at least one selected from the group consisting of hydrogenated bisphenol A epoxy resins and aliphatic epoxy resins containing a 6-membered ring; <1> ~ <6> The resin composition according to any one of claims 1 to 10. <8> (E) The amount of inorganic particles is 0.1% by mass or less relative to 100% by mass of the total amount of the resin composition; <1> ~ <7> The resin composition according to any one of claims 1 to 10. <9> placing an optical fiber in a groove in a silicon chip; In the groove, <1> ~ <8> applying the resin composition according to any one of the above; curing the resin composition; A method for manufacturing a device, comprising: <10> a silicon chip having a groove formed therein; an optical fiber placed in a groove in a silicon chip; an adhesive portion for adhering the optical fiber to the groove; The adhesive part is <1> ~ <8> A device comprising a cured product of the resin composition according to any one of claims 1 to 4. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide a resin composition that has high viscosity and is capable of adhering an optical fiber to a groove in a silicon chip with a small amount of exposure light; and a device using the resin composition and a method for manufacturing the same. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view schematically showing an optical device according to one embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view schematically showing an optical device according to one embodiment of the present invention. [Figure 3] FIG. 3 is a perspective view schematically showing a silicon chip included in an optical device according to one embodiment of the present invention. [Figure 4] FIG. 4 is a schematic side view showing an example of two test tubes used to determine whether a resin is in a liquid or solid state. DETAILED DESCRIPTION OF THE INVENTION

[0015] The present invention will be described below with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples shown below, and may be modified and implemented within the scope of the claims and their equivalents.

[0016] In the following explanation, the determination of whether a resin is liquid or solid will be made in accordance with the "Method of Confirming Liquid State" in Appendix 2 of the Ministerial Ordinance on the Testing and Properties of Hazardous Materials (Ministry of Home Affairs Ordinance No. 1 of 1989). The specific determination method is as follows:

[0017] (1) Equipment Thermostatic water bath: The high-temperature water bath is equipped with a stirrer, heater, thermometer, and automatic temperature controller (capable of controlling the temperature to within ±0.1°C), and is 150 mm or more deep. For example, a low-temperature constant temperature water bath (model BU300) manufactured by Yamato Scientific Co., Ltd. may be combined with an input-type constant temperature device Thermomate (model BF500), and approximately 22 liters of tap water may be placed in the low-temperature constant temperature water bath (model BU300), and the attached Thermomate (model BF500) may be turned on and set to the set temperature, with the Thermomate (model BF500) finely adjusting the water temperature to within ±0.1°C of the set temperature. Alternatively, another device capable of similar adjustments may be used.

[0018] Test tube: Figure 4 is a schematic side view showing an example of two test tubes used to determine the liquid and solid states of resins. As shown in Figure 4, the test tubes used are flat-bottomed, cylindrical, transparent glass tubes with an inner diameter of 30 mm and a height of 120 mm. They have marked lines 11A and 12B at heights of 55 mm and 85 mm from the bottom of the tube, respectively. The test tubes are liquid-state determination test tube 10a, whose mouth is sealed with rubber stopper 13a. The other test tube is temperature measurement test tube 10b, whose mouth is sealed with rubber stopper 13b of the same size and marked lines, with a hole in the center for inserting and supporting a thermometer. Thermometer 14 is inserted into rubber stopper 13b. Hereinafter, the marked line at a height of 55 mm from the bottom of the tube will be referred to as "Line A," and the marked line at a height of 85 mm from the bottom of the tube will be referred to as "Line B."

[0019] The thermometer 14 may be a thermometer for measuring freezing points (SOP-58 scale range 0°C to 100°C) as specified in JIS B7410 (1982) "Glass thermometers for testing petroleum products." Alternatively, another thermometer capable of measuring temperatures in the range of 0°C to 100°C may be used.

[0020] (2) Testing Procedures A sample that has been left for 24 hours or more under atmospheric pressure at a set temperature ±5°C is poured into a liquid determination test tube 10a shown in Figure 4(a) and a temperature measurement test tube 10b shown in Figure 4(b) up to the 11A line. The two test tubes 10a and 10b are placed upright in a low-temperature constant temperature water bath at the set temperature so that the 12B line is below the water surface. The thermometer is positioned so that its bottom is 30 mm below the 11A line.

[0021] After the sample temperature reaches the set temperature ±0.1°C, maintain this state for 10 minutes. After 10 minutes, remove the liquid state determination test tube 10a from the low-temperature constant temperature water bath and immediately lay it horizontally on a horizontal test table. Use a stopwatch to measure and record the time it takes for the tip of the liquid surface in the test tube to move from line 11A to line 12B.

[0022] Resins whose measured time is within 90 seconds are judged to be liquid resins. If the measured time exceeds 90 seconds, the resin is judged to be in a solid state. The determination of liquid and solid state is made at a set temperature of 25°C unless otherwise specified.

[0023] <Outline of Resin Composition> A resin composition according to one embodiment of the present invention is a resin composition for bonding an optical fiber to a groove in a silicon chip. Specifically, the silicon chip has an optical waveguide for optically connecting to the optical fiber. The silicon chip also has a groove formed therein for installing an optical fiber to be connected to the optical waveguide. The resin composition according to this embodiment is a resin composition that can function as an adhesive for bonding the optical fiber to this groove.

[0024] The resin composition according to this embodiment contains (A) an aliphatic liquid oxetane resin, (B) an aliphatic solid epoxy resin, (C) an aliphatic liquid epoxy resin, and (D) a photocationic polymerization initiator. The resin composition according to this embodiment may or may not contain (E) inorganic particles. The amount of (E) inorganic particles is equal to or less than a specific threshold value relative to 100% by mass of all components of the resin composition.

[0025] The resin composition according to the present embodiment can have high viscosity and can bond an optical fiber to a groove in a silicon chip with a small amount of exposure. Furthermore, the resin composition according to the present embodiment can produce a cured product that has high transparency at the communication wavelengths typically used in silicon photonics, such as 1310 nm.

[0026] The mechanism by which the above-mentioned excellent effects are obtained will be explained below, however, the technical scope of the present invention is not limited to the mechanism below.

[0027] Generally, the polymeric growth reaction of epoxy resins is slow, so the carbon chains of the resulting polymer tend to be short. As a result, the cured product of a composition containing the epoxy resin becomes brittle and prone to delamination due to breakage of the cured product, which can result in a failure to achieve high adhesive strength.

[0028] On the other hand, oxetane resins are generally capable of producing high-molecular-weight polymers through cationic polymerization. Therefore, it was expected that the use of oxetane resins would result in adhesives with high mechanical strength after curing. However, oxetane resins tend to initiate polymerization slowly, and polymerization is difficult to achieve with low exposure levels.

[0029] Furthermore, silicon chips may have thin films of SiOx, SiNx, SiON, etc. formed on them, and silicon chips with these thin films tend to have poorer adhesive wettability than glass chips and quartz chips. Therefore, when an adhesive is formed on a silicon chip with a thin film formed on it, if microphase separation occurs in the adhesive, the adhesive tends to have particularly poor adhesion at the phase-separated resin portion. Therefore, it is desirable to suppress the occurrence of microphase separation when bonding silicon chips.

[0030] Therefore, in this embodiment, an oxetane resin and an epoxy resin are combined. Epoxy resins generally tend to have a fast initiation reaction. Therefore, when an oxetane resin and an epoxy resin are combined, the epoxy resin initiates the reaction first, generating a large number of initiating species. In an environment where a large number of initiating species are generated, the reaction of the oxetane resin is initiated. This allows for a reduction in the amount of exposure light required to promote the curing reaction of the entire resin composition containing the oxetane resin and the epoxy resin.

[0031] As mentioned above, if only a liquid epoxy resin is used as the epoxy resin to be combined with an oxetane resin, the viscosity of the resin composition tends to be low. Furthermore, since liquid epoxy resins generally have short molecular chains, the molecular chains of the polymer obtained after polymerization tend to be short as well. Therefore, if the reaction does not proceed sufficiently, a cured product with high mechanical strength cannot be obtained. Therefore, the amount of exposure required to proceed curing sufficiently to obtain high adhesive strength tends to be large.

[0032] On the other hand, if only a solid epoxy resin is used as the epoxy resin to be combined with the oxetane resin, a high viscosity resin composition can be expected. However, the molecular chains of the solid epoxy resin are long, making it difficult for the molecules to move within the system. Therefore, the reaction is difficult to proceed, and the amount of exposure required to sufficiently progress the curing to obtain high adhesive strength tends to be large.

[0033] Therefore, in this embodiment, a solid epoxy resin and a liquid epoxy resin are combined as the epoxy resin. This combination allows the viscosity of the resin composition to be increased by the solid epoxy resin. Furthermore, the liquid epoxy resin allows for easy molecular movement within the system, which prevents the solid epoxy resin from slowing down the reaction. Therefore, while increasing the viscosity of the resin composition, the amount of exposure required to sufficiently promote curing to achieve high adhesive strength can be reduced.

[0034] Furthermore, in this embodiment, aliphatic resins such as (A) aliphatic liquid oxetane resin, (B) aliphatic solid epoxy resin, and (C) aliphatic liquid epoxy resin are used. Aliphatic resins have a more flexible molecular skeleton than aromatic resins, which makes it easier for the molecules to become entangled, thereby effectively increasing the viscosity of the resin composition.

[0035] Furthermore, because (A) the aliphatic liquid oxetane resin, (B) the aliphatic solid epoxy resin, and (C) the aliphatic liquid epoxy resin are all aliphatic resins, they are highly compatible with each other. This suppresses the occurrence of minute phase separation in the cured product, thereby suppressing the formation of phase interfaces that serve as the starting point for fracture. This effectively increases the mechanical strength of the cured product, thereby reducing the degree of curing required to achieve the desired adhesive strength. This allows for a lower exposure dose. Furthermore, this high compatibility suppresses the occurrence of minute phase separation, thereby suppressing light reflection at the phase interfaces, which generally increases the transparency of the cured product at communication wavelengths.

[0036] Furthermore, in general, once a reaction of an oxetane resin is initiated, the reaction tends to proceed rapidly. When the oxetane resin reaction proceeds rapidly, the resin composition cures rapidly, which tends to leave residual curing stress in the cured product. This residual stress can easily cause the cured product to break, potentially leading to delamination. However, the aliphatic chains contained in the (A) aliphatic liquid oxetane resin, (B) aliphatic solid epoxy resin, and (C) aliphatic liquid epoxy resin used in this embodiment are more flexible than aromatic chains and can therefore alleviate the residual stress. This suppresses delamination due to residual stress, thereby reducing the degree of curing required to achieve the desired adhesive strength. This allows for a lower exposure dose.

[0037] Furthermore, the resin composition according to the present embodiment contains few or no (E) inorganic particles. In a system containing a combination of (A) an aliphatic liquid oxetane resin, (B) an aliphatic solid epoxy resin, and (C) an aliphatic liquid epoxy resin, the (E) inorganic particles have low affinity with resin components other than the (E) inorganic particles. Therefore, when a large amount of (E) inorganic particles is present, stress concentration at the interface between the (E) inorganic particles and the resin component can easily cause breakage of the cured product, originating from the interface, leading to peeling. In contrast, the present embodiment contains few or no (E) inorganic particles, thereby suppressing breakage of the cured product originating from the interface between the (E) inorganic particles and the resin component. Therefore, the mechanical strength of the cured product required to achieve the desired adhesive strength can be reduced, thereby slowing the progress of curing of the resin composition. This allows for a lower exposure dose. Furthermore, the presence of few or no (E) inorganic particles suppresses light reflection from the surface of the (E) inorganic particles, which generally improves the transparency of the cured product at communication wavelengths.

[0038] <(A) Aliphatic liquid oxetane resin> The resin composition according to this embodiment includes (A) an aliphatic liquid oxetane resin as component (A). (A) aliphatic liquid oxetane resin refers to a liquid aliphatic oxetane resin. Furthermore, the aliphatic oxetane resin refers to a resin containing an oxetane ring and an aliphatic group. Furthermore, it is preferable that the (A) aliphatic oxetane resin does not contain an aromatic ring. The aromatic ring refers to a ring that conforms to Hückel's rule, in which the number of electrons contained in the π electron system on the ring is 4p+2 (p is a natural number). The (A) aliphatic liquid oxetane resin can react with (D) a photocationic polymerization initiator when exposed to light to generate cations, thereby curing the resin composition.

[0039] The number of oxetane rings contained in one molecule of (A) the aliphatic liquid oxetane resin is usually 1 or more, preferably 2 or more, and may be 2.

[0040] The aliphatic group contained in (A) aliphatic liquid oxetane resin may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear. The aliphatic group may be a saturated or unsaturated aliphatic group, but a saturated aliphatic group is preferred. For example, (A) aliphatic liquid oxetane resin may contain a monovalent or polyvalent aliphatic group. The number of carbon atoms in this aliphatic group is usually 1 or more, preferably 2 or more, and preferably 8 or less, more preferably 6 or less, and even more preferably 4 or less. Preferred examples of such aliphatic groups include monovalent or polyvalent chain hydrocarbon groups. Specific examples of these chain hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, and butyl; and alkylene groups such as methylene, ethylene, propylene, and butylene.

[0041] Examples of the (A) aliphatic liquid oxetane resin include the following resins (a-1) to (a-5).

[0042] [ka]

[0043] Commercially available aliphatic liquid oxetane resins (A) may be used. Examples of commercially available aliphatic liquid oxetane resins (A) include "OXT-101" (resin of formula (a-1)), "OXT-212" (resin of formula (a-2)), and "OXT-221" (resin of formula (a-3)) from the ARON OXETANE series manufactured by Toagosei Co., Ltd.; and "EHO" (resin of formula (a-1)), "HBOX" (resin of formula (a-4)), and "OXMA" (resin of formula (a-5)) from the ETERNACOLL series manufactured by UBE Corporation.

[0044] The (A) aliphatic liquid oxetane resin may be used alone or in combination of two or more.

[0045] (A) Aliphatic liquid oxetane resin can be in a liquid state at room temperature, and therefore can have a low viscosity. For example, the viscosity range of (A) Aliphatic liquid oxetane resin at 25°C is preferably 0.1 mPa·s or more, more preferably 1 mPa·s or more, even more preferably 7 mPa·s or more, and preferably 100 mPa·s or less, more preferably 25 mPa·s or less, even more preferably 16 mPa·s or less. The viscosity can be measured using an E-type viscometer (for example, the "RE-80U" manufactured by Toki Sangyo Co., Ltd., with a 1°34' x R24 cone).

[0046] The amount of (A) aliphatic liquid oxetane resin is preferably at least 10 parts by mass, more preferably at least 20 parts by mass, even more preferably at least 25 parts by mass, and is preferably at most 50 parts by mass, more preferably at most 40 parts by mass, even more preferably at most 35 parts by mass, relative to 100 parts by mass of the total amount of (A) aliphatic liquid oxetane resin, (B) aliphatic solid epoxy resin, and (C) aliphatic liquid epoxy resin. When the amount of (A) aliphatic liquid oxetane resin is within the above range, it is possible to achieve high levels of both an increased viscosity of the resin composition and adhesion of an optical fiber to a groove in a silicon chip with a low exposure dose.

[0047] The amount of (A) aliphatic liquid oxetane resin is preferably 10% by mass or more, more preferably 15% by mass or more, and even more preferably 20% by mass or more, relative to 100% by mass of the total amount of the resin composition, and is preferably 50% by mass or less, more preferably 45% by mass or less, and even more preferably 40% by mass or less. When the amount of (A) aliphatic liquid oxetane resin is within the above range, it is possible to achieve high levels of both an increase in the viscosity of the resin composition and adhesion of the optical fiber to the groove in the silicon chip with a small amount of exposure light.

[0048] The total amount of (A) aliphatic liquid oxetane resin, (B) aliphatic solid epoxy resin, and (C) aliphatic liquid epoxy resin is preferably 80% by mass or more, more preferably 85% by mass or more, even more preferably 90% by mass or more, and may even be 95% by mass or more, based on 100% by mass of the total amount of the resin composition. The upper limit is preferably 99.9% by mass or less, more preferably 99.5% by mass or less. When the total amount of (A) aliphatic liquid oxetane resin, (B) aliphatic solid epoxy resin, and (C) aliphatic liquid epoxy resin is within the above range, it is possible to achieve high levels of both an increased viscosity of the resin composition and bonding of an optical fiber to a groove in a silicon chip with a low exposure dose.

[0049] <(B) Aliphatic solid epoxy resin> The resin composition according to this embodiment includes an aliphatic solid epoxy resin (B) as component (B). The aliphatic solid epoxy resin (B) refers to a solid aliphatic epoxy resin. The aliphatic epoxy resin refers to a resin containing an epoxy group and an aliphatic group. The aliphatic solid epoxy resin (B) does not include those corresponding to the above-mentioned component (A). The aliphatic solid epoxy resin (B) preferably does not contain an aromatic ring. The aliphatic solid epoxy resin (B) can react with the cationic photopolymerization initiator (D) upon exposure to light to generate cations, thereby curing the resin composition.

[0050] The number of epoxy groups contained in one molecule of the aliphatic solid epoxy resin (B) is usually 1 or more, and preferably 2 or more. The epoxy group may be bonded to a non-aromatic carbon ring contained in the aliphatic solid epoxy resin (B) directly or via a linking group. For example, an epoxy group, a glycidyl group, or a glycidyloxy group may be bonded to a non-aromatic carbon ring contained in the aliphatic solid epoxy resin (B).

[0051] The aliphatic group contained in (B) aliphatic solid epoxy resin may be linear, branched, or cyclic, with cyclic being preferred. The aliphatic group may be a saturated aliphatic group or an unsaturated aliphatic group, with saturated aliphatic groups being preferred. For example, (B) aliphatic solid epoxy resin may contain a monovalent or divalent or higher aliphatic group. The number of carbon atoms in this aliphatic group is usually 1 or more, preferably 2 or more, and more preferably 6 or more. The upper limit of the number of carbon atoms is preferably 20 or less, more preferably 15 or less, and may even be 10 or less. Preferred examples of the aliphatic group include monovalent or divalent or higher cyclic aliphatic hydrocarbon groups.

[0052] The alicyclic hydrocarbon group generally contains a non-aromatic carbocyclic ring having carbon atoms as ring-constituting atoms. This non-aromatic carbocyclic ring is preferably a 4- to 14-membered ring, more preferably a 6-membered ring. Therefore, the aliphatic solid epoxy resin (B) is more preferably an aliphatic epoxy resin containing a 6-membered ring (a 6-membered ring-containing epoxy resin). Specific examples of the non-aromatic carbocyclic ring include monocycloalkane rings such as a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, and a cyclooctane ring; and monocycloalkene rings such as a cyclobutene ring, a cyclopentene ring, a cyclohexene ring, a cycloheptene ring, a cyclooctene ring, a cyclopentadiene ring, and a cyclohexadiene ring. Among these, a monocycloalkane ring is preferred, and a cyclohexane ring is more preferred.

[0053] The aliphatic solid epoxy resin (B) containing a cyclic aliphatic hydrocarbon group may be a hydrogenated epoxy resin. "Hydrogenated epoxy resin" refers to an epoxy resin obtained by hydrogenating an aromatic ring-containing epoxy resin such as a bisphenol A epoxy resin or a bisphenol F epoxy resin. The hydrogenation rate of the hydrogenated epoxy resin is preferably 50% or more, more preferably 70% or more. The upper limit of the hydrogenation rate is usually 100%, but it may be less than 100%.

[0054] (B) Examples of aliphatic solid epoxy resins include hydrogenated bisphenol A type epoxy resins, aliphatic epoxy resins containing a cyclohexane ring, alicyclic epoxy resins containing a dicyclopentadiene skeleton, polyethylene glycol diglycidyl ether, epoxy resins having an aliphatic polycyclic skeleton, etc. Here, the hydrogenated bisphenol A type epoxy resin refers to an epoxy resin obtained by hydrogenating a bisphenol A type epoxy resin.

[0055] From the viewpoint of achieving the effects of the present invention more significantly, it is preferable that the aliphatic solid epoxy resin (B) contains at least one selected from the group consisting of hydrogenated bisphenol A epoxy resins and aliphatic epoxy resins containing a 6-membered ring. The distinction between hydrogenated bisphenol A epoxy resins and aliphatic epoxy resins containing a 6-membered ring is not exclusive; for example, the hydrogenated bisphenol A epoxy resin may be an aliphatic epoxy resin containing a 6-membered ring.

[0056] As the (B) aliphatic solid epoxy resin, commercially available products may be used. Examples of commercially available products of the (B) aliphatic solid epoxy resin include "YX8040" (hydrogenated bisphenol A epoxy resin) manufactured by Mitsubishi Chemical Corporation, "EHPE3150" (alicyclic epoxy resin containing a poly(glycidylcyclohexyleneoxy) structure) manufactured by Daicel Corporation, "HP-7200" (alicyclic epoxy resin containing a dicyclopentadiene skeleton) manufactured by DIC Corporation, and "DE-102" and "DE-103" (both epoxy resins having an aliphatic polycyclic skeleton) manufactured by ENEOS Corporation.

[0057] The (B) aliphatic solid epoxy resin may be used alone or in combination of two or more.

[0058] The epoxy equivalent of (B) the aliphatic solid epoxy resin is preferably 50 g / eq. or more, more preferably 60 g / eq. or more, even more preferably 80 g / eq. or more, and particularly preferably 110 g / eq. or more, and is preferably 5,000 g / eq. or less, more preferably 3,000 g / eq. or less, even more preferably 2,000 g / eq. or less, and particularly preferably 1,000 g / eq. or less. The epoxy equivalent represents the mass of resin per equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0059] The weight-average molecular weight (Mw) of the (B) aliphatic solid epoxy resin is preferably in the range of 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight-average molecular weight can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0060] The amount of the (B) aliphatic solid epoxy resin is preferably at least 40 parts by mass, more preferably at least 50 parts by mass, and even more preferably at least 55 parts by mass, relative to 100 parts by mass of the total amount of the (A) aliphatic liquid oxetane resin, (B) aliphatic solid epoxy resin, and (C) aliphatic liquid epoxy resin, and is preferably at most 80 parts by mass, more preferably at most 70 parts by mass, and even more preferably at most 65 parts by mass. When the amount of the (B) aliphatic solid epoxy resin is within the above range, it is possible to achieve high levels of both an increased viscosity of the resin composition and adhesion of an optical fiber to a groove in a silicon chip with a low exposure dose.

[0061] The amount of the aliphatic solid epoxy resin (B) is preferably greater than the amount of the aliphatic liquid oxetane resin (A) by mass. The mass ratio of the aliphatic liquid oxetane resin (A) to the aliphatic solid epoxy resin (B) (aliphatic solid epoxy resin (B) / aliphatic liquid oxetane resin (A)) is preferably 1.1 or more, more preferably 1.2 or more, even more preferably 1.6 or more, and is preferably 10 or less, more preferably 6 or less, and even more preferably 3 or less. When the mass ratio (B) aliphatic solid epoxy resin (B) / aliphatic liquid oxetane resin (A)) is within the above range, it is possible to achieve high levels of both an increased viscosity of the resin composition and bonding of an optical fiber to a groove in a silicon chip with a low exposure dose.

[0062] <(C) Aliphatic liquid epoxy resin> The resin composition according to this embodiment contains (C) an aliphatic liquid epoxy resin as component (C). (C) aliphatic liquid epoxy resin refers to a liquid aliphatic epoxy resin. (C) aliphatic liquid epoxy resin does not include those corresponding to the above-mentioned components (A) and (B). (C) aliphatic liquid epoxy resin preferably does not contain an aromatic ring. (C) aliphatic liquid epoxy resin can react with (D) a photocationic polymerization initiator when exposed to light to generate cations, thereby curing the resin composition.

[0063] The number of epoxy groups contained in one molecule of the aliphatic liquid epoxy resin (C) is usually 1 or more, and preferably 2 or more. The epoxy group may be bonded to a non-aromatic carbon ring contained in the aliphatic liquid epoxy resin (C) directly or via a linking group. Furthermore, the carbon atom forming the epoxy group may be contained as part of the non-aromatic carbon ring contained in the aliphatic liquid epoxy resin (C). That is, an epoxy group may be formed by bonding an oxygen atom to two carbon atoms forming a non-aromatic carbon ring contained in the aliphatic liquid epoxy resin (C).

[0064] The aliphatic group contained in the aliphatic liquid epoxy resin (C) may be selected from the range described for the aliphatic group contained in the aliphatic solid epoxy resin (B). In this case, the aliphatic group contained in the aliphatic liquid epoxy resin (C) and the aliphatic group contained in the aliphatic solid epoxy resin (B) may be the same or different. The preferred range of the aliphatic group contained in the aliphatic liquid epoxy resin (C) may be the same as the preferred range of the aliphatic group contained in the aliphatic solid epoxy resin (B).

[0065] When the aliphatic liquid epoxy resin (C) contains a cycloaliphatic hydrocarbon group, the range of non-aromatic carbon rings that can be contained in the cycloaliphatic hydrocarbon group may be the same as the range of non-aromatic carbon rings that can be contained in the aliphatic solid epoxy resin (B). Among these, the non-aromatic carbon ring is preferably a monocycloalkane ring, more preferably a cyclohexane ring.

[0066] The aliphatic liquid epoxy resin (C) containing a cyclic aliphatic hydrocarbon group may be a hydrogenated epoxy resin. The hydrogenation rate of the hydrogenated epoxy resin is preferably 50% or more, more preferably 70% or more. The upper limit of the hydrogenation rate is usually 100%, but it may be less than 100%.

[0067] Examples of (C) aliphatic liquid epoxy resins include hydrogenated bisphenol A epoxy resins; aliphatic epoxy resins containing a cyclohexane ring; alicyclic epoxy resins containing a dicyclopentadiene skeleton; aliphatic polycyclic epoxy resins; and resins obtained by glycidyl etherifying aliphatic diols, aliphatic triols, aliphatic tetraols, aliphatic pentaols, or aliphatic hexaols.

[0068] From the viewpoint of achieving the effects of the present invention more significantly, the aliphatic liquid epoxy resin (C) preferably contains at least one selected from the group consisting of hydrogenated bisphenol A epoxy resins and aliphatic epoxy resins containing a 6-membered ring.

[0069] Commercially available aliphatic liquid epoxy resins (C) may be used. Examples of commercially available aliphatic liquid epoxy resins (C) include "YX8000D" (hydrogenated bisphenol A epoxy resin, resin (c-1) below), "YX7400N," and "YED216N" manufactured by Mitsubishi Chemical Corporation; "Celloxide 2021P" (alicyclic epoxy resin containing a cyclohexane ring, resin (c-2) below) manufactured by Daicel Corporation; "EP-4088L" (alicyclic epoxy resin containing a dicyclopentadiene skeleton) manufactured by ADEKA Corporation; "EX-321L," "EX-1610," "EX-212L," "EX-214L," "EX810P," "EX991L," and "EX121" manufactured by Nagase ChemteX Corporation; and "THI-DE" manufactured by ENEOS Corporation.

[0070] [ka]

[0071] The (C) aliphatic liquid epoxy resin may be used alone or in combination of two or more.

[0072] The epoxy equivalent range of the (C) aliphatic liquid epoxy resin may be the same as the epoxy equivalent range of the (B) aliphatic solid epoxy resin.

[0073] The weight average molecular weight (Mw) range of the (C) aliphatic liquid epoxy resin may be the same as the weight average molecular weight range of the (B) aliphatic solid epoxy resin.

[0074] Since the (C) aliphatic liquid epoxy resin can be in a liquid state at room temperature, it can have a low viscosity. The viscosity of the (C) aliphatic liquid epoxy resin may be lower than that of the (A) aliphatic liquid oxetane resin, but it is preferably higher. The viscosity of the (C) aliphatic liquid epoxy resin at 25°C is preferably 10 mPa·s or higher, more preferably 100 mPa·s or higher, and even more preferably 200 mPa·s or higher, and is preferably 500,000 mPa·s or lower, more preferably 100,000 mPa·s or lower, and even more preferably 80,000 mPa·s or lower.

[0075] The amount of the aliphatic liquid epoxy resin (C) is preferably at least 1 part by mass, more preferably at least 2 parts by mass, and even more preferably at least 5 parts by mass, per 100 parts by mass of the total amount of the aliphatic liquid oxetane resin (A), the aliphatic solid epoxy resin (B), and the aliphatic liquid epoxy resin (C). The amount of the aliphatic liquid epoxy resin (C) within this range is preferably at least 1 part by mass, more preferably at least 2 parts by mass, and even more preferably at least 5 parts by mass. The amount of the aliphatic liquid epoxy resin (C) within this range can achieve high levels of both an increased viscosity of the resin composition and bonding of an optical fiber to a groove in a silicon chip with a low exposure dose.

[0076] The amount of the aliphatic liquid epoxy resin (C) is preferably less than the amount of the aliphatic liquid oxetane resin (A) by mass. The mass ratio of the aliphatic liquid oxetane resin (A) to the aliphatic liquid epoxy resin (C) (aliphatic liquid epoxy resin (C) / aliphatic liquid oxetane resin (A)) is preferably 0.01 or more, more preferably 0.05 or more, even more preferably 0.10 or more, and is preferably 0.9 or less, more preferably 0.7 or less, even more preferably 0.6 or less. When the mass ratio (Aliphatic liquid epoxy resin (C) / aliphatic liquid oxetane resin (A)) is within the above range, it is possible to achieve high levels of both an increased viscosity of the resin composition and bonding of an optical fiber to a groove in a silicon chip with a low exposure dose.

[0077] <(D) Photocationic Polymerization Initiator> The resin composition according to this embodiment includes a (D) cationic photopolymerization initiator as component (D). The (D) cationic photopolymerization initiator does not include those corresponding to the above-mentioned components (A) to (C). The (D) cationic photopolymerization initiator generates cations upon exposure to light, and can initiate the reaction of components (A) to (C).

[0078] As the (D) photocationic polymerization initiator, for example, a compound capable of generating an acid upon irradiation with actinic rays can be used. Examples of such (D) photocationic polymerization initiator include oxime ester compounds, halogen-containing compounds, onium salt compounds, diazoketone compounds, sulfone compounds, sulfonic acid compounds, sulfonimide compounds, and diazomethane compounds. Among these, onium salt compounds are preferred.

[0079] (D) Examples of onium salt compounds that can be suitably used as a photocationic polymerization initiator include iodonium salts, sulfonium salts, phosphonium salts, diazonium salts, and pyridinium salts. Specific examples of suitable onium salt compounds include tris(4-methylphenyl)sulfonium trifluoromethanesulfonate, tris(4-methylphenyl)sulfonium hexafluorophosphonate, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium p-toluenesulfonate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluorophosphate, diphenyliodonium tetrafluoroborate, and diphenyl[4-(phenylthio)phenyl]sulfonium tetrakis(pentafluorophenyl)sulfonium. ) borate, diphenyl[4-(phenylthio)phenyl]sulfonium hexafluorophosphate, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium p-toluenesulfonate, triphenylsulfonium hexafluoroantimonate, 4-tert-butylphenyl diphenylsulfonium trifluoromethanesulfonate, 4-tert-butylphenyl diphenylsulfonium p-toluenesulfonate, 4,7-di-n-butoxynaphthyltetrahydrothiophenium trifluoromethanesulfonate, and the like.

[0080] As the (D) photocationic polymerization initiator, for example, an onium gallate salt having a triarylsulfonium cation and a gallate anion may be used. Examples of the triarylsulfonium cation include compounds represented by the following formula (d-1):

[0081] [ka]

[0082] In formula (d-1), R d1 , R d2 , R d3 and R d4each independently represent a group selected from the group consisting of an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an arylthiocarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, a hydroxy(poly)alkyleneoxy group, a group that forms a fused polycyclic hydrocarbon skeleton by condensing with the benzene ring to which it is bonded, a substituted or unsubstituted silyl group, a substituted or unsubstituted amino group, a cyano group, a nitro group, and a halogen atom.

[0083] R d1 ~R d4 Examples of the alkyl group in the formula (I) include linear alkyl groups having 1 to 18 carbon atoms, such as methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-octyl, n-decyl, n-dodecyl, n-tetradecyl, n-hexadecyl, and n-octadecyl groups; branched alkyl groups having 3 to 18 carbon atoms, such as isopropyl, isobutyl, sec-butyl, tert-butyl, isopentyl, neopentyl, tert-pentyl, isohexyl, and isooctadecyl groups; and cycloalkyl groups having 3 to 18 carbon atoms, such as cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, and 4-decylcyclohexyl groups.

[0084] R d1 ~R d4 Examples of the alkoxy group in the formula (I) include linear alkoxy groups having 1 to 18 carbon atoms and branched alkoxy groups having 3 to 18 carbon atoms. Specific examples thereof include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, an isobutoxy group, a sec-butoxy group, a tert-butoxy group, a hexyloxy group, a decyloxy group, a dodecyloxy group, and an octadecyloxy group.

[0085] R d1 ~R d4Examples of the aryl group in the formula (I) include aryl groups having 6 to 10 carbon atoms, such as a phenyl group, a tolyl group, a dimethylphenyl group, and a naphthyl group.

[0086] R d1 ~R d4 The fused polycyclic hydrocarbon skeleton in the formula (I) may have two or more rings or six or fewer rings, preferably four or fewer rings, and more preferably three or fewer rings. The fused polycyclic hydrocarbon skeleton may have a skeleton in which cyclic hydrocarbons with different numbers of rings, such as five-membered rings and six-membered rings, are fused together. Examples of such fused polycyclic hydrocarbon skeletons include a fluorene skeleton and a derivative of the fluorene skeleton. The fused polycyclic hydrocarbon skeleton may be a phenanthrene skeleton, and one or two substituents, such as an alkyl group, may be bonded to the 9-position of the phenanthrene skeleton.

[0087] R d1 ~R d4 Examples of the substituent in the above formula (d-1) include R d1 ~R d4 The same groups as those mentioned above are included.

[0088] In formula (d-1), a d , b d , c d and d d are R d1 , R d2 , R d3 and R d4 Specifically, a d represents an integer of 1 to 5. d represents an integer from 0 to 4. d and d d each independently represents an integer of 0 to 5.

[0089] Examples of gallate anions include compounds represented by the following formula (d-2).

[0090] [ka]

[0091] In formula (d-2), R d13 , R d14 , R d15 and R d16 each independently represents a substituted or unsubstituted phenyl group or perfluoroalkyl group. The substituent on the phenyl group is preferably a group selected from the group consisting of a perfluoroalkyl group, a perfluoroalkoxy group, a nitro group, a cyano group, an acyl group, and a halogen atom.

[0092] R d13 ~R d16 In the formula, the number of carbon atoms in the perfluoroalkyl group is preferably 1 to 8, and more preferably 1 to 4. Specific examples of the perfluoroalkyl group include linear perfluoroalkyl groups such as trifluoromethyl, pentafluoroethyl, heptafluoropropyl, nonafluorobutyl, perfluoropentyl, and perfluorooctyl groups; branched perfluoroalkyl groups such as heptafluoroisopropyl, nonafluoroisobutyl, nonafluoro-sec-butyl, and nonafluoro-tert-butyl groups; and perfluorocycloalkyl groups such as perfluorocyclopropyl, perfluorocyclobutyl, perfluorocyclopentyl, and perfluorocyclohexyl groups.

[0093] R d13 ~R d16 In the formula (I), the number of carbon atoms in the perfluoroalkoxy group is preferably 1 to 8, and more preferably 1 to 4. Specific examples of the perfluoroalkoxy group include linear perfluoroalkoxy groups such as trifluoromethoxy, pentafluoroethoxy, heptafluoropropoxy, nonafluorobutoxy, perfluoropentyloxy, and perfluorooctyloxy groups; and branched perfluoroalkoxy groups such as heptafluoroisopropoxy, nonafluoroisobutoxy, nonafluoro-sec-butoxy, and nonafluoro-tert-butoxy groups.

[0094] R d13 ~R d16In the above, examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

[0095] From the viewpoint of cationic polymerization performance, R d13 ~R d16 R is preferably a phenyl group substituted with at least one group selected from the group consisting of a perfluoroalkyl group and a fluorine atom. d13 , R d14 , R d15 and R d16 may be the same or different.

[0096] Examples of the gallate anion include (C6F5)4Ga - , ((CF3)2C6H3)4Ga - , (CF3C6H4)4Ga - , (C6F5)2GaF2 - , C6F5GaF3 - , (C6H3F2)4Ga - etc.

[0097] The (D) photocationic polymerization initiator may be a commercially available product. Examples of commercially available (D) photocationic polymerization initiators include onium salt compounds such as "TS-01" and "TS-91" manufactured by Sanwa Chemical Co., Ltd.; "CPI-110A," "CPI-110B," "CPI-110P," "CPI-210S," "HS-1," "LW-S1," "IK-1," "CPI-310B," and "CPI-310FG" manufactured by San-Apro Co., Ltd.; and "SI-110L," "SI-180L," and "SI-100L" manufactured by Sanshin Chemical Industry Co., Ltd.

[0098] The (D) cationic photopolymerization initiator may be used alone or in combination of two or more.

[0099] The amount of (D) cationic photopolymerization initiator is preferably at least 0.1 parts by mass, more preferably at least 0.3 parts by mass, and even more preferably at least 0.5 parts by mass, relative to 100 parts by mass of the total amount of (A) aliphatic liquid oxetane resin, (B) aliphatic solid epoxy resin, and (C) aliphatic liquid epoxy resin, and is preferably at most 5 parts by mass, more preferably at most 4 parts by mass, and even more preferably at most 3 parts by mass. When the amount of (D) cationic photopolymerization initiator is within the above range, it is possible to achieve high levels of both an increase in the viscosity of the resin composition and bonding of an optical fiber to a groove in a silicon chip with a small amount of exposure light.

[0100] <(E) Inorganic particles> The resin composition according to this embodiment may or may not contain (E) inorganic particles as component (E). The amount of (E) inorganic particles in the resin composition is usually 15% by mass or less, preferably 10% by mass or less, more preferably 5% by mass or less, and particularly preferably 0.1% by mass or less, based on 100% by mass of the total amount of the resin composition. Since the resin composition does not need to contain (E) inorganic particles, the lower limit is usually 0% by mass or more, and may be 0% by mass.

[0101] (E) Inorganic particles are made of inorganic compounds. Examples of (E) inorganic particles include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica and alumina are preferred, and silica is more preferred. Therefore, (E) inorganic particles preferably contain silica, or may contain only silica. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Spherical silica is preferred. The (E) inorganic particles may be used alone or in combination of two or more types.

[0102] (E) Examples of commercially available inorganic particles include "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C," "YA050C," "YA050C-MJE," "YA010C," "SC2500SQ," "SO-C4," "SO-C2," and "SO-C1" manufactured by Admatechs Co., Ltd.; "UFP-30," "DAW-03," and "FB-105FD" manufactured by Denka; "Silfil NSS-3N," "Silfil NSS-4N," and "Silfil NSS-5N" manufactured by Tokuyama Corporation; "CellSpheres" and "MGH-005" manufactured by Taiheiyo Cement Corporation; "Spherique" and "BA-1" manufactured by JGC Catalysts and Chemicals Co., Ltd., and "200" manufactured by Nippon Aerosil Co., Ltd.

[0103] The average particle size of the (E) inorganic particles is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, and preferably 10 μm or less, more preferably 5 μm or less, even more preferably 3 μm or less, even more preferably 1 μm or less.

[0104] (E) The average particle size of inorganic particles can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, a volumetric particle size distribution of inorganic particles is created using a laser diffraction / scattering particle size distribution analyzer, and the median diameter is used as the average particle size. A measurement sample can be prepared by weighing 100 mg of inorganic particles and 10 g of methyl ethyl ketone into a vial and dispersing them ultrasonically for 10 minutes. The volumetric particle size distribution of the inorganic particles is measured using a laser diffraction particle size distribution analyzer with blue and red light source wavelengths using a flow cell system, and the average particle size can be calculated as the median diameter from the particle size distribution obtained. Examples of laser diffraction particle size distribution analyzers include the LA-960 manufactured by Horiba, Ltd.

[0105] (E) The specific surface area of the inorganic particles is preferably 0.1 m 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more, particularly preferably 3m 2 / g or more, preferably 100m 2 / g or less, more preferably 70m 2 / g or less, more preferably 50m 2 / g or less, particularly preferably 40m 2 / g or less. (E) The specific surface area of inorganic particles can be measured in accordance with the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) and calculating the specific surface area using the BET multipoint method.

[0106] The (E) inorganic particles are preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of the surface treatment agent include a fluorine-containing silane coupling agent, an aminosilane coupling agent, an epoxysilane coupling agent, a mercaptosilane coupling agent, a silane coupling agent, an alkoxysilane, an organosilazane compound, and a titanate coupling agent. One type of surface treatment agent may be used alone, or two or more types may be used in combination.

[0107] Examples of commercially available surface treatment agents include Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane).

[0108] The degree of surface treatment with the surface treatment agent preferably falls within a specific range from the viewpoint of improving the dispersibility of the inorganic particles. Specifically, 100% by mass of the inorganic particles are preferably surface-treated with 0.2% to 5% by mass of the surface treatment agent, more preferably with 0.2% to 3% by mass of the surface treatment agent, and even more preferably with 0.3% to 2% by mass of the surface treatment agent.

[0109] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic particles. From the viewpoint of improving the dispersibility of the inorganic particles, the amount of carbon per unit surface area of the inorganic particles is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more2 On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition, it is more preferable that the content be 1.0 mg / m 2 Preferably less than 0.8 mg / m 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0110] (E) The amount of carbon per unit surface area of inorganic particles can be measured after the surface-treated inorganic particles are washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic particles that have been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solids, the amount of carbon per unit surface area of the inorganic particles can be measured using a carbon analyzer. The carbon analyzer that can be used is the "EMIA-320V" manufactured by Horiba, Ltd.

[0111] <(F) Sensitizer> The resin composition according to this embodiment may contain a sensitizer (F) as an optional component. The sensitizer (F) as the component (F) does not include those corresponding to the above-described components (A) to (E). The sensitizer (F) can generally be excited by exposure to light, but the sensitizer (F) itself does not generate cationic species. Furthermore, when the sensitizer (F) is excited, it usually transfers its energy to the cationic photopolymerization initiator (D) to promote the generation of cationic species. Therefore, the use of the sensitizer (F) can promote the curing of the resin composition.

[0112] (F) Examples of sensitizers include benzophenones such as Michler's ketone, 4,4'-bis(diethylamino)benzophenone, and 4-morpholinobenzophenone; cyclic alkanes such as 2,5-bis(4'-diethylaminobenzal)cyclopentane, 2,6-bis(4'-diethylaminobenzal)cyclohexanone, and 2,6-bis(4'-diethylaminobenzal)-4-methylcyclohexanone; chalcones such as 4,4'-bis(dimethylamino)chalcone and 4,4'-bis(diethylamino)chalcone; and p-dimethylaminocinnamylidene. Indanones such as danone and p-dimethylaminobenzylideneindanone; anthracenes such as 9,10-dibutoxyanthracene (DBA), 9,10-diethoxyanthracene (DEA), 9,10-dipropoxyanthracene, and 9,10-bis(2-ethylhexyloxy)anthracene; thiazoles such as 2-(p-dimethylaminophenylbiphenylene)benzothiazole, 2-(p-dimethylaminophenylvinylene)benzothiazole, and 2-(p-dimethylaminophenylvinylene)isonaphthothiazole; 1,3-bis(4'-dimethylaminophenylvinylene)benzothiazole; acetones such as 1,3-bis(4'-diethylaminobenzal)acetone and 1,3-bis(4'-diethylaminobenzal)acetone; coumarins such as 3,3'-carbonyl-bis(7-diethylaminocoumarin), 3-acetyl-7-dimethylaminocoumarin, 3-ethoxycarbonyl-7-dimethylaminocoumarin, 3-benzyloxycarbonyl-7-dimethylaminocoumarin, 3-methoxycarbonyl-7-diethylaminocoumarin, and 3-ethoxycarbonyl-7-diethylaminocoumarin; N-phenyl-N'-ethylethanolamine, N-phenyldiethanolamine amines such as amine, Np-tolyldiethanolamine, N-phenylethanolamine, isoamyl dimethylaminobenzoate, and isoamyl diethylaminobenzoate; heterocycles such as 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 2-(p-dimethylaminostyryl)benzoxazole, 2-(p-dimethylaminostyryl)benzthiazole, 2-(p-dimethylaminostyryl)naphtho(1,2-d)thiazole, 1-phenyl-5-mercaptotetrazole, and 1-p-hydroxyphenyl-5-mercaptotetrazole;styrenes such as 2-(p-dimethylaminobenzoyl)styrene; and among these, anthracenes are preferred.

[0113] The (F) sensitizer may be used alone or in combination of two or more.

[0114] The amount of the sensitizer (F) is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, and even more preferably 0.3 parts by mass or more, relative to 100 parts by mass of the total amount of the aliphatic liquid oxetane resin (A), the aliphatic solid epoxy resin (B), and the aliphatic liquid epoxy resin (C). The amount is preferably 5 parts by mass or less, more preferably 4 parts by mass or less, and even more preferably 3 parts by mass or less.

[0115] <(G) Optional Additives> The resin composition according to this embodiment may further contain (G) an optional additive as an optional component, provided that the desired effects of the present invention are not significantly impaired. The (G) optional additive as component (G) does not include components (A) to (F) described above. Examples of the (G) optional additive include adhesion aids; surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicone-based surfactants; polymerization inhibitors; antifoaming agents; flame retardants; thermal cationic polymerization initiators; curable resins other than the above-described components (A) to (C); and thermoplastic resins. One type of (G) optional additive may be used alone, or two or more types may be used in combination.

[0116] <(H) Solvent> The resin composition according to this embodiment may further contain a (H) solvent as an optional volatile component to dissolve or disperse the solid components (A) to (G) described above. An organic solvent is typically used as the (H) solvent. Examples of the organic solvent include ketone-based solvents, ester-based solvents, ether-based solvents, alcohol-based solvents, amide-based solvents, sulfoxide-based solvents, nitrile-based solvents, aliphatic hydrocarbon-based solvents, and aromatic hydrocarbon-based solvents. One type of (H) solvent may be used alone, or two or more types may be used in combination.

[0117] From the viewpoint of suppressing the formation of voids, it is preferable that the amount of (H) solvent is small. Specifically, the amount of (H) solvent is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 1% by mass or less, and particularly preferably 0.1% by mass or less, relative to the total amount (100% by mass) of the resin composition. Since it is preferable that the resin composition does not contain (H) solvent, the lower limit of the amount of (H) solvent is 0% by mass or more, and 0% by mass is particularly preferred.

[0118] <Characteristics of the resin composition and its cured product> The resin composition according to this embodiment can have liquid properties at room temperature. This resin composition can be cured by exposure to light such as ultraviolet light, as the resins of components (A) to (C) react and bond. The cured product of the resin composition obtained by this curing exhibits adhesive strength large enough to bond an optical fiber to a groove in a silicon chip. Therefore, the resin composition according to this embodiment can function as an adhesive for bonding an optical fiber to a groove in a silicon chip.

[0119] The resin composition according to this embodiment can have a high viscosity. For example, the viscosity of the resin composition at 25°C is usually 4 Pa·s or higher, preferably 10 Pa·s or higher, and more preferably 20 Pa·s or higher. The upper limit of the viscosity is preferably 200 Pa·s or lower, more preferably 160 Pa·s or lower, and even more preferably 130 Pa·s or lower. The viscosity can be measured using an E-type viscometer (Toki Sangyo Co., Ltd. "RE-80U", 1°34' x R24 cone).

[0120] The resin composition according to the present embodiment has a high viscosity as described above, and therefore can prevent excessive fluidity in the groove of the silicon chip. Therefore, when the resin composition is used as an adhesive to bond an optical fiber to the groove of the silicon chip, it is preferable to prevent the resin composition from leaking to an unintended location. For example, when the <Test 4. Appearance Evaluation Test> in the Examples described below is performed, it is preferable to bond the optical fiber to the V-groove while preventing the resin composition or its cured product from spilling out of the V-groove chip lid.

[0121] The resin composition according to this embodiment makes it possible to bond an optical fiber to a groove in a silicon chip with a small amount of exposure light. Specifically, when an optical fiber is bonded to a groove using a resin composition and the resin composition is exposed to light to harden the resin composition, sufficient adhesive strength for fixing the optical fiber to the groove can be obtained with a small amount of exposure light. For example, the <Test 3. Adhesion test between groove and optical fiber> in the Examples described below is performed. In this case, the minimum amount of exposure light required to obtain adhesive strength sufficient to prevent the optical fiber from peeling off from the V-groove in the silicon chip is preferably 2000 mJ / cm. 2 Less than or equal to 500 mJ / cm 2 More preferably, 100 mJ / cm or less 2 You can do the following:

[0122] The resin composition according to this embodiment can generally bond an optical fiber to a silicon member with high adhesive strength, and therefore can bond an optical fiber to a groove in a silicon chip with high adhesive strength. For example, the <Test 1. Adhesion Strength Measurement Test> in the Examples described below is carried out to bond a silicon chip (such as a capacitor chip) to a cured product of the resin composition. In this case, the exposure dose is 2000 mJ / cm. 2 The adhesive strength required to peel the chip from the cured product obtained in step 1 is preferably 12 N / mm 2 More than 14N / mm 2 More preferably, 20 N / mm 2 The upper limit of adhesive strength is, for example, 100 N / mm2 Below, 90N / mm 2 or less than 80N / mm 2 It can be the following:

[0123] As described above, the cured product of the resin composition according to this embodiment is cured by the reaction of resins such as components (A) to (C) to form bonds, and therefore may contain the components of the resin composition or their reaction products. Furthermore, this cured product can have low absorbance at the communication wavelengths typically used in silicon photonics. For example, the absorbance of the cured product at a wavelength of 1310 nm with an optical path length of 2 mm can be measured by performing "Test 5. Measurement of absorbance of cured product of resin composition" in the Examples described below. In this case, the absorbance can be preferably 0.10 or less, more preferably 0.09 or less, even more preferably 0.08 or less, and particularly preferably 0.06 or less.

[0124] <Device using resin composition as adhesive> The resin composition according to this embodiment can be used as an adhesive in a bonding method for bonding an optical fiber to a groove in a silicon chip. By using the resin composition as an adhesive, a device can be obtained that includes a silicon chip and an optical fiber bonded to the groove in the silicon chip. Hereinafter, this device may be referred to as an "optical device."

[0125] Fig. 1 is a perspective view schematically showing an optical device 1 according to one embodiment of the present invention. Fig. 2 is a cross-sectional view schematically showing the optical device 1 according to one embodiment of the present invention. Fig. 2 shows a cross-section of the optical device 1 taken along a plane perpendicular to the direction in which grooves 110 in a silicon chip 100 extend.

[0126] 1 and 2, the optical device 1 according to this embodiment includes a silicon chip 100, an optical fiber 200, and an adhesive part 300 that bonds the silicon chip 100 and the optical fiber 200. The optical device 1 may also include a lid member 400 that covers the optical fiber 200 and the adhesive part 300, as needed.

[0127] 3 is a perspective view schematically showing a silicon chip 100 included in an optical device 1 according to one embodiment of the present invention. The silicon chip 100 includes an optical waveguide 120 that is optically connectable to an optical fiber 200. Here, the optical waveguide 120 will be described as including a core 121 made of silicon and a cladding 122 made of SiO2 that covers the core 121, but the optical waveguide 120 is not limited to this. The silicon chip 100 has a groove 110 formed therein for mounting an optical fiber 200 that will be connected to the optical waveguide 120.

[0128] The groove 110 is usually formed to extend in one direction. Here, as shown in FIG. 2, a V-groove in which the cross-sectional shape of the side surface 110S is formed into a substantially V-shape will be described as an example of the groove 110, but the groove 110 is not limited to a V-groove. For example, the groove 110 may be a V-groove in which the cross-sectional shape of the bottom 110B is angular, or may be a groove (e.g., a U-groove) in which the bottom has a rounded cross-sectional shape or a flat bottom surface. As shown in FIG. 3, the groove 110 is usually formed so that an optical fiber 200 and a core 121 of the optical waveguide 120 can be optically connected at an end 110E of the groove 110 on the optical waveguide 120 side.

[0129] The specific cross-sectional shape and dimensions of the groove 110 are preferably set so that the optical fiber 200 can be aligned in the groove 110. The resin composition according to this embodiment has the advantage of being highly viscous, thereby enabling uniform application. From the perspective of utilizing this advantage, the resin composition according to this embodiment is suitable for applications in which the optical fiber 200 is connected to a minute groove 110, which requires high-precision uniformity. Therefore, from the perspective of utilizing the advantages of the resin composition according to this embodiment, as shown in FIG. 2 , the width W of the groove 110 is preferably small, and its specific range is preferably 0.30 mm or less, more preferably 0.20 mm or less, and preferably 0.01 mm or more, and more preferably 0.10 mm or more. Furthermore, the depth D of the groove 110 is preferably small, and its specific range is preferably 0.30 mm or less, more preferably 0.20 mm or less, more preferably 0.15 mm or less, and preferably 0.01 mm or more, and more preferably 0.10 mm or more. Furthermore, it is preferable that the angle θ formed by the side surface 110S of the groove 110 with respect to the chip main surface 100U is small, and the specific range is preferably 70° or less, more preferably 60° or less, even more preferably 55° or less, and preferably 20° or more, more preferably 30° or more, even more preferably 40° or more.

[0130] As shown in FIG. 2 , the optical fibers 200 are aligned and arranged in the grooves 110. The adhesive 300 fills the area around the optical fibers 200, adhering the optical fibers 200 to the grooves 110. The adhesive 300 contains a cured resin composition, and typically contains only the cured resin. Because the cured resin exhibits excellent adhesive strength, the adhesive 300 can stably hold the optical fibers 200 in the grooves 110. In this case, the tip (not shown) of the optical fiber 200 may be arranged to contact the end 110E of the groove 110, or may be arranged away from the end 110E of the groove 110. When the tip of the optical fiber 200 is spaced apart from the end 110E of the groove 110, the adhesive 300 may fill the gap between the tip of the optical fiber 200 and the end 110E of the groove 110. However, the adhesive 300 formed from the cured resin composition according to this embodiment has low absorbance at communication wavelengths, thereby suppressing attenuation of the optical signal.

[0131] Typically, the lid member 400 is placed so as to cover the optical fiber 200 and the adhesive portion 300 on the groove 110. When the lid member 400 is placed, the adhesive portion 300 is formed in the gap between the silicon chip 100 and the lid member 400, and a configuration is obtained in which the optical fiber 200 is fixed in the adhesive portion 300. Therefore, the lid member 400 can protect the optical fiber 200 and the adhesive portion 300. Furthermore, since the resin composition according to this embodiment does not have excessive fluidity on the silicon chip 100, it is preferable to prevent the adhesive portion 300 from being formed in an unintended position. Specifically, it is possible to prevent the adhesive portion 300 from being formed in a position that protrudes from the lid member 400 when viewed in the thickness direction.

[0132] Such an optical device 1 may be, for example, Step (I) of placing an optical fiber 200 in a groove 110 of a silicon chip 100; Step (II) of applying a resin composition to the groove 110; Step (IV) of curing the resin composition to form the adhesive joint 300; In addition, when manufacturing the optical device 1 including the lid member 400, the manufacturing method includes the following steps: Step (III) of placing the lid member 400 on the resin composition applied to the groove 110 may also include:

[0133] In the method for manufacturing the optical device 1, the order of step (I) of placing the optical fiber 200 in the groove 110 of the silicon chip 100 and step (II) of applying the resin composition to the groove 110 may be any. Therefore, step (I) may be performed after step (II), but it is preferable to perform step (II) after step (I). The resin composition can be applied using an appropriate application device such as a dispenser.

[0134] When the lid member 400 is provided, the method for manufacturing the optical device 1 includes, after the above-described steps (I) and (II), step (III) of placing the lid member 400 on the resin composition. The lid member 400 is preferably placed so as to cover the entire resin composition applied to the groove 110. The resin composition can spread to fill the space between the silicon chip 100 in which the groove 110 is formed and the lid member 400, but since it does not have excessive flow, it is preferably prevented from flowing out of the lid member 400 when viewed in the thickness direction.

[0135] Thereafter, a step (IV) of curing the resin composition is carried out. In this step (IV), an exposure treatment is carried out in which the resin composition is irradiated with actinic rays capable of curing the resin composition. There are no limitations on the actinic rays as long as they are capable of curing the resin composition, but ultraviolet rays are usually used. The actinic rays may be irradiated through the silicon chip 100 or through the lid material 400.

[0136] Since the resin composition cures with a small amount of exposure light and can bond the silicon chip 100 to the optical fiber 200, the exposure light amount can be reduced in step (IV). For example, when performing exposure treatment with ultraviolet light, the exposure light amount is preferably in the range of 3000 mJ / cm. 2 or less, more preferably 2500 mJ / cm 2 or less, more preferably 2000 mJ / cm 2 The lower limit is not limited as long as the desired adhesive strength is obtained, and is, for example, 100 mJ / cm2 As described above, the resin composition can be cured with a small amount of exposure light to form adhesive joint 300 having sufficient adhesive strength, so that the time required to manufacture optical device 1 can be shortened.

[0137] The adhesive portion 300 is formed in step (IV) to bond the optical fiber 200 to the groove 110 of the silicon chip 100, thereby obtaining the optical device 1. The method for manufacturing the optical device 1 may include any step in combination with steps (I) to (IV).

[0138] For example, the method for manufacturing the optical device 1 may include an annealing step of heating the optical device 1 after step (IV). In the annealing step, the optical device 1 is heated to, for example, 120°C or higher. However, from the viewpoint of utilizing the advantage of being able to shorten the manufacturing time of the optical device 1, it is preferable that the method for manufacturing the optical device 1 does not include the annealing step. [Example]

[0139] The present invention will be specifically described below with reference to examples. However, the present invention is not limited to these examples. In the following description, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Furthermore, the temperature and pressure conditions were room temperature (23°C) and atmospheric pressure (1 atm), unless otherwise specified.

[0140] <Reagent Description> The reagents used in the following examples and comparative examples are as follows. Viscosity values are all shown at 25°C.

[0141] (A) Aliphatic oxetane compounds: "OXT-221": Toagosei "OXT-221", viscosity 9mPa·s to 14mPa·s

[0142] (B) Aliphatic solid epoxy resin: "YX8040": Hydrogenated bisphenol A epoxy resin, Mitsubishi Chemical Corporation "YX8040", epoxy equivalent 1000g / eq. "EHPE3150": Cycloaliphatic epoxy resin containing a cyclohexane ring, manufactured by Daicel Corporation, "EHPE3150", epoxy equivalent 177g / eq. HP-7200: Alicyclic epoxy resin containing a dicyclopentadiene skeleton, manufactured by DIC Corporation, HP-7200, epoxy equivalent weight 254-264g / eq.

[0143] (C) Aliphatic liquid epoxy resin: "YX8000D": Hydrogenated bisphenol A epoxy resin, Mitsubishi Chemical Corporation "YX8000D", epoxy equivalent 185g / eq., viscosity 0.8Pa·s "2021P": Alicyclic epoxy resin containing a cyclohexane ring, "Celloxide 2021P" manufactured by Daicel Corporation, epoxy equivalent 130 g / eq., viscosity 240 mPa·s "EP-4088L": Alicyclic epoxy resin containing a dicyclopentadiene skeleton, manufactured by ADEKA Corporation, "EP-4088L", epoxy equivalent weight 165g / eq., 230mPa·s

[0144] (D) Photocationic polymerization initiator "CPI-110P": San-Apro Co., Ltd. "CPI-110P", diphenyl[4-(phenylthio)phenyl]sulfonium hexafluorophosphate "CPI-110B": San-Apro Co., Ltd.'s "CPI-110B", diphenyl[4-(phenylthio)phenyl]sulfonium-tetra(pentafluorophenyl)borate "CPI-310FG": San-Apro "CPI-310FG", sulfonium salt

[0145] (E) Inorganic particles: "Silica particle 1": Spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, specific surface area 5.8 m) surface-treated with a silane coupling agent ("KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.) 2 / g)) "Silica particles 2": Fumed silica (Nippon Aerosil Co., Ltd. "200", specific surface area 200 m 2 / g

[0146] (F) Photosensitizer: "UVS-1101": Air Water Performance Chemicals' "Anthracure UVS-1101", 9,10-diethoxyanthracene

[0147] Example 1 An intermediate mixture was obtained by weighing 30 parts of an aliphatic oxetane compound ("OXT-221" manufactured by Toagosei Co., Ltd.), 60 parts of an aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation), and 10 parts of an aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) into a plastic container designed for use with a centrifugal mixer ("Thinky Minertaro ARE-310" manufactured by Thinky Corporation). This intermediate mixture was then mixed at 2000 rpm using the centrifugal mixer until the aliphatic solid epoxy resin was completely dissolved. One part of a cationic photoinitiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) and 0.5 parts of a photosensitizer ("Anthracure UVS-1101" manufactured by Air Water Performance Chemicals Inc.) were then added to the intermediate mixture, and the mixture was again mixed using the centrifugal mixer to obtain Resin Composition 1.

[0148] <Example 2> Resin composition 2 was produced in the same manner as in Example 1, except that 10 parts of an aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 10 parts of an aliphatic liquid epoxy resin ("Celloxide 2021P" manufactured by Daicel Corporation).

[0149] Example 3 Resin composition 3 was produced in the same manner as in Example 1, except that 60 parts of an aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 60 parts of an aliphatic solid epoxy resin ("EHPE3150" manufactured by Daicel Corporation).

[0150] Example 4 Resin composition 4 was produced in the same manner as in Example 1, except that 60 parts of an aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 60 parts of an aliphatic solid epoxy resin ("EHPE3150" manufactured by Daicel Corporation), and 10 parts of an aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 10 parts of an aliphatic liquid epoxy resin ("Celloxide 2021P" manufactured by Daicel Corporation).

[0151] <Example 5> The amount of aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 30 parts. Also, 30 parts of aliphatic solid epoxy resin ("EHPE3150" manufactured by Daicel Corporation) was added to the intermediate mixture. Also, the amount of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 5 parts. Furthermore, 5 parts of aliphatic liquid epoxy resin ("Celloxide 2021P" manufactured by Daicel Corporation) was added to the intermediate mixture. Resin composition 5 was produced in the same manner as in Example 1, except for the above changes.

[0152] Example 6 Resin composition 6 was produced in the same manner as in Example 1, except that 60 parts of an aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 60 parts of an aliphatic solid epoxy resin ("HP-7200" manufactured by DIC Corporation) and 10 parts of an aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 10 parts of an aliphatic liquid epoxy resin ("EP-4088L" manufactured by ADEKA Corporation).

[0153] Example 7 The amount of aliphatic oxetane compound ("OXT-221" manufactured by Toagosei Co., Ltd.) was changed to 25 parts. The amount of aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 65 parts. The amount of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 5 parts. Furthermore, 5 parts of aliphatic liquid epoxy resin ("Celloxide 2021P" manufactured by Daicel Corporation) was added to the intermediate mixture. Resin composition 7 was produced in the same manner as in Example 1, except for the above changes.

[0154] Example 8 The amount of aliphatic oxetane compound ("OXT-221" manufactured by Toagosei Co., Ltd.) was changed to 35 parts. The amount of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was also changed to 2.5 parts. Furthermore, 2.5 parts of aliphatic liquid epoxy resin ("Celloxide 2021P" manufactured by Daicel Corporation) was added to the intermediate mixture. Resin composition 8 was produced in the same manner as in Example 1, except for the above-mentioned changes.

[0155] Example 9 The amount of aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 55 parts. The amount of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was also changed to 7.5 parts. Furthermore, 7.5 parts of aliphatic liquid epoxy resin ("Celloxide 2021P" manufactured by Daicel Corporation) was added to the intermediate mixture. Resin composition 9 was produced in the same manner as in Example 1, except for the above.

[0156] Example 10 The amount of aliphatic oxetane compound ("OXT-221" manufactured by Toagosei Co., Ltd.) was changed to 15 parts. The amount of aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 75 parts. The amount of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 5 parts. Furthermore, 5 parts of aliphatic liquid epoxy resin ("Celloxide 2021P" manufactured by Daicel Corporation) was added to the intermediate mixture. Except for the above, resin composition 10 was produced by the same method as in Example 1.

[0157] Example 11 The amount of aliphatic oxetane compound ("OXT-221" manufactured by Toagosei Co., Ltd.) was changed to 45 parts. The amount of aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 52 parts. The amount of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 1.5 parts. Furthermore, 1.5 parts of aliphatic liquid epoxy resin ("Celloxide 2021P" manufactured by Daicel Corporation) was added to the intermediate mixture. Resin composition 11 was produced by the same method as in Example 1, except for the above points.

[0158] Example 12 Resin composition 12 was produced in the same manner as in Example 1, except that the amount of aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 45 parts, and the amount of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 25 parts.

[0159] Example 13 Resin composition 13 was produced in the same manner as in Example 1, except that 10 parts of silica particles 1 were added to the intermediate mixture before mixing the cationic photopolymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) and the photosensitizer ("Anthracure UVS-1101" manufactured by Air Water Performance Chemicals Inc.).

[0160] Example 14 Resin composition 14 was produced in the same manner as in Example 1, except that the amount of photocationic polymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) was changed to 2.5 parts, and the amount of photosensitizer ("Anthracure UVS-1101" manufactured by Air Water Performance Chemicals Inc.) was changed to 2.5 parts.

[0161] Example 15 Resin composition 15 was produced in the same manner as in Example 1, except that the amount of cationic photopolymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) was changed to 0.5 parts.

[0162] Example 16 Resin composition 16 was produced in the same manner as in Example 1, except that the amount of photocationic polymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) was changed to 0.2 parts, and the amount of photosensitizer ("Anthracure UVS-1101" manufactured by Air Water Performance Chemicals Inc.) was changed to 0.2 parts.

[0163] Example 17 Resin composition 17 was produced in the same manner as in Example 1, except that the amount of cationic photopolymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) was changed to 4 parts, and the amount of photosensitizer ("Anthracure UVS-1101" manufactured by Air Water Performance Chemicals Inc.) was changed to 4 parts.

[0164] Example 18 Resin composition 18 was produced in the same manner as in Example 1, except that the amount of cationic photopolymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) was changed to 0.5 parts, and 0.5 parts of cationic photopolymerization initiator ("CPI-110B" manufactured by San-Apro Co., Ltd.) was added to the intermediate mixture.

[0165] Example 19 Resin composition 19 was produced in the same manner as in Example 1, except that 10 parts of silica particles 2 were added to the intermediate mixture before mixing the cationic photopolymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) and the photosensitizer ("Anthracure UVS-1101" manufactured by Air Water Performance Chemicals Inc.).

[0166] Example 20 Resin composition 20 was produced by the same method as in Example 1, except that 1 part of the cationic photopolymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) was changed to 1 part of cationic photopolymerization initiator ("CPI-310FG" manufactured by San-Apro Co., Ltd.).

[0167] <Comparative Example 1> Resin composition 18 was produced in the same manner as in Example 1, except that the aliphatic oxetane compound ("OXT-221" manufactured by Toagosei Co., Ltd.) was not used, and the amount of aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 90 parts.

[0168] <Comparative Example 2> Resin composition 19 was produced in the same manner as in Example 1, except that the aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was not used, and the amount of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 70 parts.

[0169] <Comparative Example 3> Resin composition 20 was produced in the same manner as in Example 1, except that the amount of aliphatic solid epoxy resin ("YX8040" manufactured by Mitsubishi Chemical Corporation) was changed to 70 parts, and the aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was not used.

[0170] <Comparative Example 4> The 10 parts of aliphatic liquid epoxy resin ("YX8000D" manufactured by Mitsubishi Chemical Corporation) was changed to 10 parts of aliphatic liquid epoxy resin ("EP-4088L" manufactured by ADEKA Corporation). Furthermore, 20 parts of silica particles 1 were added to the intermediate mixture before mixing the photocationic polymerization initiator ("CPI-110P" manufactured by San-Apro Co., Ltd.) and the photosensitizer ("Anthracure UVS-1101" manufactured by Air Water Performance Chemicals Inc.). Resin composition 21 was produced in the same manner as in Example 1, except for the above changes.

[0171] <Test 1. Adhesion strength measurement test> A glass slide measuring 76 mm x 26 mm x 1.0 mm thick was prepared. 1 mg to 3 mg of the resin composition was applied to the glass slide, and a silicon capacitor chip (JIS 2012 size) was placed on top. The resin composition was cured by photocuring under the following curing conditions 1 to 3. The die shear strength, which represents adhesive strength, was measured by scratching the capacitor chip on the cured resin composition at a speed of 200 μm / s using a die shear measuring device (Daisi Series 4000) at 25°C. The die shear strength represents the magnitude of the force required to peel the capacitor chip by applying a force in the in-plane direction (perpendicular to the thickness direction) to the capacitor chip. A higher die shear strength indicates better adhesive strength.

[0172] (Curing condition 1) The UV irradiation device (Ushio Inc. "NF-150") was used to measure the irradiance at 33 mW / cm 2 The resin composition was irradiated with ultraviolet light through a slide glass plate for 60 seconds (exposure dose 2000 mJ / cm 2 The adhesive strength of the cured product obtained by curing the resin composition under this curing condition 1 may be referred to hereinafter as "adhesive strength 1."

[0173] (Adhesion strength 2) The UV irradiation device (Ushio Inc. "NF-150") was used to measure the irradiance at 33 mW / cm 2 The resin composition was irradiated with ultraviolet light through a slide glass plate for 15 seconds (exposure dose 500 mJ / cm 2 The adhesive strength of the cured product obtained by curing the resin composition under curing condition 2 may be referred to as "adhesive strength 2" hereinafter.

[0174] (Adhesion strength 3) The UV irradiation device (Ushio Inc. "NF-150") was used to measure the irradiance at 33 mW / cm 2 The resin composition was irradiated with ultraviolet light through a slide glass plate for 3 seconds (exposure dose 100 mJ / cm 2 The adhesive strength of the cured product obtained by curing the resin composition under this curing condition 3 may be hereinafter referred to as "adhesive strength 3."

[0175] <Test 2. Viscosity measurement test> The viscosity of the resin composition was measured at 25°C using an E-type viscometer ("RE-80U" manufactured by Toki Sangyo Co., Ltd., 1°34'×R24 cone).

[0176] <Test 3. Adhesion test between groove and optical fiber> A silicon chip (OZoptics "VGC-8-250-10.4-3.8-1") with a V-groove formed was prepared. This silicon chip was 10.4 mm long, 3.8 mm wide, and 1 mm thick, and had eight V-grooves for installing optical fibers formed at a 250 μm pitch. Each V-groove had a width of 0.195 ± 0.005 mm, a depth of 0.138 ± 0.005 mm, and a length of 5.3 mm, and the angle formed by the side of the V-groove with respect to the main surface of the chip was 54.74°.

[0177] An 8-channel single-mode ribbon fiber was placed on the silicon chip so that the tip of the optical fiber of the ribbon fiber was placed on the V-groove of the silicon chip. 20 mg of a resin composition was applied to the V-groove using a dispenser. A V-groove chip lid ("VGC-LID-5.38-1" manufactured by OZoptics) was placed on the applied resin composition. Illuminance: 33 mW / cm 2 The resin composition was cured by irradiating it with ultraviolet light through the V-groove chip lid. Immediately after the resin composition had cured, a 1g weight was placed on the optical fiber. When the weight was placed on the optical fiber, if it did not peel off from the V-groove in the silicon chip, it was judged as "passed"; if it did peel off, it was judged as "failed."

[0178] The above operation was repeated with the ultraviolet irradiation time set to 60 seconds (exposure dose 2000 mJ / cm 2 ), 15 seconds (exposure dose 500 mJ / cm 2 ) and 3 seconds (exposure dose 100 mJ / cm 2 ) was performed and a pass or fail judgment was made for each. Based on the judgment results, the exposure dose required to bond the optical fiber to the V-groove in the silicon chip was evaluated according to the following criteria. "Excellent": Exposure amount 100mJ / cm 2 Passed with above "Good": Exposure amount 500mJ / cm 2 Passed with above "Acceptable": Exposure amount 2000mJ / cm 2 Passed with above "Not possible": Exposure amount 2000mJ / cm 2 Failed

[0179] <Test 4. Appearance evaluation test> In the above test 3, the ultraviolet irradiation time was 60 seconds (exposure dose 2000 mJ / cm 2 The samples prepared in step 1) were observed and the appearance after bonding between the V-groove and the optical fiber was evaluated according to the following criteria. "Excellent": The resin composition or its cured product did not protrude from the V-groove chip lid, and the optical fiber was adhered to the V-groove. "Fair": The resin composition or its cured product protrudes from the V-groove chip lid, and the optical fiber can be adhered to the V-groove. "Unacceptable": The optical fiber could not be adhered to the V-groove, and the V-groove and the optical fiber were separated.

[0180] <Test 5. Measurement of absorbance of cured resin composition> A 2 mm thick silicone rubber frame was placed on a release polyethylene terephthalate film ("AL-5" manufactured by Lintec Corporation), and the resin composition was poured into the frame. Another release polyethylene terephthalate film ("AL-5" manufactured by Lintec Corporation) was placed on top of the frame, and the resin composition was applied to the frame at an illuminance of 33 mW / cm using a UV irradiation device ("NF-150" manufactured by Ushio Inc.). 2 The resin composition was irradiated with ultraviolet light of 2000 mJ / cm for 60 seconds (exposure dose 2000 mJ / cm 2 The frame and polyethylene terephthalate film were removed to obtain a cured resin composition. The absorbance of the obtained cured product in the thickness direction was measured at a measurement wavelength of 1310 nm using a spectrophotometer ("V-770" manufactured by JASCO Corporation).

[0181] <Result> The results of the Examples and Comparative Examples are shown in the following table. In the table, the meanings of the abbreviations are as follows: "(A) content": the amount of component (A) per 100 parts by mass of the total amount of components (A) to (C) "(B) content": the amount of component (B) per 100 parts by mass of the total amount of components (A) to (C) "(C) content": the amount of component (C) per 100 parts by mass of the total amount of components (A) to (C) "(D) content": the amount of component (D) per 100 parts by mass of the total amount of components (A) to (C) "(F) content": the amount of component (F) per 100 parts by mass of the total amount of components (A) to (C) "(E) content": the amount of the (E) component relative to 100% by mass of the total amount of the resin composition

[0182] [Table 1]

[0183] [Table 2]

[0184] [Table 3]

[0185] [Table 4] [Explanation of symbols]

[0186] 1 Optical Devices 100 silicon chips Main surface of 100U silicon chip 110 Groove 110B Bottom of groove 110E End of groove 110S groove side 120 Optical waveguide 121 cores 122 Clad 200 Optical Fiber 300 Adhesive part 400 Lid material

Claims

1. A resin composition for bonding an optical fiber to a groove in a silicon chip, comprising: The resin composition comprises (A) an aliphatic liquid oxetane resin, (B) an aliphatic solid epoxy resin, (C) an aliphatic liquid epoxy resin, and (D) a photocationic polymerization initiator; The resin composition may or may not contain (E) inorganic particles; (E) A resin composition in which the amount of inorganic particles is 15% by mass or less, relative to 100% by mass of the total amount of the resin composition.

2. 2. The resin composition according to claim 1, wherein the amount of the aliphatic liquid oxetane resin (A) is 10 parts by mass or more and 50 parts by mass or less, relative to 100 parts by mass of the total amount of the aliphatic liquid oxetane resin (A), the aliphatic solid epoxy resin (B), and the aliphatic liquid epoxy resin (C).

3. 2. The resin composition according to claim 1, wherein the amount of the aliphatic solid epoxy resin (B) is 40 parts by mass or more and 80 parts by mass or less, relative to 100 parts by mass of the total amount of the aliphatic liquid oxetane resin (A), the aliphatic solid epoxy resin (B), and the aliphatic liquid epoxy resin (C).

4. 2. The resin composition according to claim 1, wherein the amount of the aliphatic liquid epoxy resin (C) is 1 part by mass or more and 30 parts by mass or less per 100 parts by mass of the total amount of the aliphatic liquid oxetane resin (A), the aliphatic solid epoxy resin (B), and the aliphatic liquid epoxy resin (C).

5. 2. The resin composition according to claim 1, wherein the amount of the photocationic polymerization initiator (D) is 0.1 parts by mass or more and 5 parts by mass or less, relative to 100 parts by mass of the total amount of the aliphatic liquid oxetane resin (A), the aliphatic solid epoxy resin (B), and the aliphatic liquid epoxy resin (C).

6. 2. The resin composition according to claim 1, wherein the aliphatic solid epoxy resin (B) comprises at least one selected from the group consisting of hydrogenated bisphenol A epoxy resins and aliphatic epoxy resins containing a 6-membered ring.

7. 2. The resin composition according to claim 1, wherein the aliphatic liquid epoxy resin (C) comprises at least one selected from the group consisting of hydrogenated bisphenol A epoxy resins and aliphatic epoxy resins containing a 6-membered ring.

8. The resin composition according to claim 1, wherein the amount of the inorganic particles (E) is 0.1% by mass or less, relative to 100% by mass of the total amount of the resin composition.

9. placing an optical fiber in a groove in a silicon chip; A step of applying the resin composition according to any one of claims 1 to 8 to the groove; curing the resin composition; A method for manufacturing a device, comprising:

10. a silicon chip having a groove formed therein; an optical fiber placed in a groove in a silicon chip; an adhesive portion for adhering the optical fiber to the groove; A device, wherein the adhesive portion comprises a cured product of the resin composition according to any one of claims 1 to 8.

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