Semiconductor jig conveying container

Abstract

To provide a semiconductor jig conveying container that houses and conveys a semiconductor jig.SOLUTION: A semiconductor jig conveying container comprises: a lower case having a top part opening; an upper cover having at least one side face annular groove; and at least one airtight rubber seal having a base part arranged on the side face annular groove and at least one flange which is connected to the base part and extended outside. In the case where the upper cover is bonded to the top part opening of the lower case, a flange of the airtight rubber seal is elastically bent, and closely adhered to an inner sidewall of the lower case to create an airtight state.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a jig transport container, and more particularly to a semiconductor jig transport container for storing and transporting semiconductor jigs. [Background technology]

[0002] Conventional semiconductor jigs, such as semiconductor transport carriers such as Front Opening Unified Pods (FOUPs), photomask carriers, board carriers, and substrate carriers, as well as related parts, are packed in clean bags or cardboard boxes during transport. Summary of the Invention [Problem to be solved by the invention]

[0003] However, the above-mentioned method using a clean bag or cardboard box has the following problems.

[0004] First, both clean bags and cardboard boxes lack sufficient sealing properties, making it difficult to keep semiconductor jigs clean for long periods of time and prone to contamination. Furthermore, both clean bags and cardboard boxes cannot be reused multiple times, making it difficult to reduce packaging costs over the long term and environmentally unfriendly. Furthermore, clean bags and cardboard boxes do not adequately protect the semiconductor jigs housed inside, making them susceptible to damage during transport.

[0005] Furthermore, due to the characteristics of the material, clean bags are prone to generating volatile organic compounds (VOCs), and it is not possible to maintain low humidity inside the bag for a long period of time.

[0006] In view of the above-mentioned drawbacks of the prior art, the present inventors have conducted extensive research and have succeeded in developing a semiconductor jig transport container that has excellent sealing properties and can maintain a clean and low humidity state inside the container.

[0007] Furthermore, the semiconductor jig transport container has a good structural strength, so that the semiconductor jigs housed therein can be reliably protected and can also be reused multiple times.

[0008] Furthermore, the semiconductor jig transport container does not generate volatile organic compounds.

[0009] Directions and similar terms used throughout the specification of the present invention, such as "front," "rear," "left," "right," "top," "bottom," "inside," "outside," "side," etc., primarily refer to directions in the drawings. These directions and similar terms are used to explain and understand each embodiment of the present invention, and are not intended to limit the present invention.

[0010] Although the quantifiers "one" or "one" are used for parts and components described throughout the specification of the present invention, this is for convenience and to disclose the present invention in the normal scope, and therefore, in the present invention, it should be interpreted as including both one and at least one. Furthermore, unless clearly indicated otherwise, the concept of singularity also includes plurality.

[0011] The terms "coupled," "engaged," "attached," and similar terms used throughout the present specification primarily refer to either a state in which the members can be separated without being destroyed after being connected, or a state in which the members cannot be separated after being connected. Those skilled in the art can select the appropriate term based on the materials of the members to be connected and the needs of the installation. [Means for solving the problem]

[0012] In order to achieve the above and other objects, the present invention provides a semiconductor jig transport container comprising: a lower case having a top opening; an upper cover having at least one side annular groove; and at least one airtight rubber seal having a base disposed in the side annular groove and at least one flange connected to the base and extending outward, wherein when the upper cover is coupled to the top opening of the lower case, the flange of the airtight rubber seal is elastically bent and tightly adheres to the inner wall of the lower case to create an airtight state.

[0013] In the semiconductor jig transport container described above, the upper cover may have an annular flange covering the upper edge of the lower case and a lower convex portion extending downward from the annular flange, and the side annular groove may be provided on the outer periphery of the lower convex portion.

[0014] In the semiconductor jig transport pod described above, the upper cover may include an OHT chuck protruding from the top of the lower convex portion.

[0015] In the semiconductor jig transport container described above, the lower convex portion may be integrally connected to the OHT chuck, and the upper cover may have a flat portion, with the OHT chuck provided at the center of the flat portion.

[0016] In the above-mentioned semiconductor jig transport container, the lower case may have a plurality of first overlapping portions, and the upper cover may have a plurality of second overlapping portions, and by stacking the plurality of first overlapping portions and the plurality of second overlapping portions on top of each other, a plurality of semiconductor jig transport containers of the same structure may be stored stacked on top of each other.

[0017] In the semiconductor jig transport container described above, the number of flanges of the airtight rubber seal is two, and the two flanges are spaced apart vertically. When the upper cover is connected to the top opening of the lower case, a second distance exists between the outer surface of the base and the inner wall of the lower case. When the two flanges of the airtight rubber seal are not bent, a third distance exists between the free ends of the two flanges, and the third distance may be equal to or greater than the second distance.

[0018] In the semiconductor jig transport pod described above, the flange may have an inclined surface that is inclined upward with respect to the horizontal surface of the base.

[0019] In the semiconductor jig transport container described above, a storage chamber may be provided inside the lower case, and the upper cover may be provided with a valve part that penetrates into the storage chamber and that evacuates or seals the gas inside the storage chamber.

[0020] In the semiconductor jig transport container, the valve part may include a valve nozzle and a valve plug, and the exhaust or airtightness of the valve nozzle may be controlled by opening or closing the valve plug.

[0021] In the semiconductor jig transport container described above, the valve nozzle may have a passageway communicating with the storage chamber, the annular wall of the passageway may have a plurality of cutouts, the valve plug may be used to open or close the passageway in accordance with the passageway, and the overall length of the passageway may be shorter than the overall length of the valve plug.

[0022] In the semiconductor jig transport container described above, the sidewall of the lower case is formed so as to slope widely outward from bottom to top, and a plurality of lower cases of the same structure may be stored by stacking them on top of each other.

[0023] In the semiconductor jig transport container described above, the lower case may have at least one component storage area inside.

[0024] In the semiconductor jig transport container described above, the lower case may have at least one barrier inside, and the barrier may be made of LCP, COP, or metal.

[0025] The semiconductor jig transport container may further include a plurality of locking portions provided around the boundary between the upper cover and the lower case to lock or unlock the upper cover and the lower case.

[0026] In the semiconductor jig transport container, the upper cover and the lower case may be made of LCP, COP, or metal. [Effects of the Invention]

[0027] As a result, in the semiconductor jig transport container according to the present invention, the flange of the airtight rubber seal can be gradually and elastically bent upward as the upper cover covers the top opening from top to bottom. When the upper cover reaches a predetermined position, the flange adheres tightly to the inner wall of the lower case and maintains that state, airtightly sealing the upper cover to the top opening of the lower case, thereby maintaining cleanliness and humidity within the storage chamber S for a long period of time. In addition, the semiconductor jig transport container can easily suction air from inside the container from outside through the valve, thereby reducing the oxygen content and humidity within the container and providing a suitable storage environment for the semiconductor jigs within the container. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is an exploded perspective view of an embodiment of the present invention. [Figure 2] FIG. 10 is an exploded perspective view of the embodiment of the present invention as seen from another angle. [Figure 3] 1 is a perspective cross-sectional view of an assembled state of an embodiment of the present invention. [Figure 4] 10 is a partial cross-sectional view showing a state in which an upper cover is not yet coupled to a lower case in an embodiment of the present invention; FIG. [Figure 5] 4 is a partial cross-sectional view showing a state in which an upper cover is coupled to a lower case in an embodiment of the present invention; FIG. [Figure 6] 1 is a side cross-sectional view of an airtight rubber seal according to an embodiment of the present invention. [Figure 7] FIG. 2 is a partial perspective cross-sectional view of an upper cover according to an embodiment of the present invention. [Figure 8] FIG. 2 is a partial cross-sectional view showing the valve in a closed state after assembly of the embodiment of the present invention. [Figure 9] FIG. 2 is a partial cross-sectional view showing the valve in an open state after assembly of the embodiment of the present invention. [Figure 10] FIG. 3 is a partial cross-sectional view showing an upper cover of the embodiment according to the present invention. [Figure 11] FIG. 2 is a side cross-sectional view showing a lower case according to an embodiment of the present invention. [Figure 12] FIG. 1 is a perspective view showing a state in which embodiments according to the present invention are stacked one on top of the other. [Figure 13] 1 is a perspective view showing a state in which a barrier is provided in a lower case according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0029] In order to fully understand the objects, features and effects of the present invention, the following specific embodiments will be described in detail with accompanying drawings.

[0030] Please refer to Figures 1 to 3. A preferred embodiment of a semiconductor jig transport container according to the present invention comprises a lower case 1, an upper cover 2 connected to the lower case 1 in an openable and closable manner, and an airtight rubber seal 3 joined to the upper cover 2.

[0031] For details, please refer to FIGS. 2 to 4. The lower case 1 has an accommodation chamber S therein and a top opening 11 communicating with the accommodation chamber S, and a semiconductor jig can be placed in or removed from the accommodation chamber S from the top of the lower case 1. The upper cover 2 has at least one side annular groove 21, and the airtight rubber seal 3 has a base 31 and at least one flange 32. The base 31 is disposed in the side annular groove 21, and the flange 32 is connected to the base 31 and extends outward. The upper cover 2 is used to cover the top opening 11 of the lower case 1. When the upper cover 2 is attached to the lower case 1, the side annular groove 21 of the upper cover 2 is located inside the lower case 1.

[0032] See Figures 4 and 5. With this configuration, when the upper cover 2 covers the top opening 11 from top to bottom, the flange 32 of the airtight rubber seal 3 contacts the inner wall 1a of the lower case 1. Depending on the degree to which the upper cover 2 is pressed downward, the flange 32 partially adheres to the inner wall 1a of the lower case 1 and gradually bends upward elastically. When the upper cover 2 reaches a predetermined position, the flange 32 adheres to the inner wall 1a of the lower case 1 due to its elastic return ability and maintains that state. The upper cover 2 airtightly seals the top opening 11 of the lower case 1, thereby maintaining the cleanliness and humidity of the storage chamber S for a long period of time. Furthermore, the flange 32 of the airtight rubber seal 3 elastically deforms to adhere to the inner wall 1a of the lower case 1 and increases the contact area with the inner wall 1a of the lower case 1, effectively preventing the upper cover 2 from falling off the lower case 1, thereby stabilizing the connection between the two components.

[0033] 2 and 5 for more details. In this embodiment of the present invention, the upper cover 2 has an annular flange 22 that covers the upper edge of the lower case 1, and a lower convex portion 23 that extends downward from the inside of the annular flange 22. When the upper cover 2 seals the top opening 11 of the lower case 1, the lower convex portion 23 protrudes slightly into the receiving chamber S, and the side annular groove 21 is formed on the outer periphery of the lower convex portion 23. As a result, the upper cover 2 of this embodiment can be easily molded, and the ease and stability of assembly of the upper cover 2 with the lower case 1 and the airtight rubber seal 3 can be improved.

[0034] 4 and 5. In this embodiment of the present invention, the base 31 of the airtight rubber seal 3 has an outer surface 311. When the flange 32 of the airtight rubber seal 3 is not bent, a first distance D1 exists between the outer surface 311 of the base 31 and the free end 321 of the flange 32. When the upper cover 2 is coupled to the top opening 11 of the lower case 1, a second distance D2 exists between the outer surface 311 of the base 31 and the inner wall 1a of the lower case 1. The first distance D1 may be greater than the second distance D2. This ensures that the flange 32 of the airtight rubber seal 3 of this embodiment is elastically deformed and tightly fitted to the inner wall 1a of the lower case 1.

[0035] 5 and 6. In this embodiment of the present invention, the flange 32 is inclined upward with respect to the horizontal plane of the base 31, i.e., has a slope 322 whose angle θ with the horizontal plane of the base 31 is greater than 0. As a result, the airtight rubber seal 3 of this embodiment has a flange 32 that is suitably inclined upward, and thus during the process of connecting the upper cover 2 to the top opening 11 of the lower case 1, the flange 32 elastically deforms in a desired direction, ensuring that the slope 322 of the flange 32 continues to closely contact the inner wall 1 a of the lower case 1.

[0036] 4 and 5. In an embodiment of the present invention, the number of the airtight rubber seals 3 may be two, and the two flanges 32 may be spaced apart from one another. This allows one airtight rubber seal 3 to have two portions that elastically deform and come into close contact with the inner wall 1a of the lower case 1, thereby improving the airtightness of the semiconductor jig transport container.

[0037] In an embodiment of the present invention, when the two flanges 32 of the airtight rubber seal 3 are not bent, a third distance D3 exists between the free ends 321 of the two flanges 32. The third distance D3 may be equal to or greater than the second distance D2. This prevents the airtight rubber seal 3 of this embodiment from losing its airtightness due to interference between the two flanges 32 when they are bent and deformed.

[0038] It is noteworthy that in this embodiment, the number of side annular grooves 21 on the upper cover 2 may be one, in which case the side annular groove 21 accommodates the base 31 of one airtight rubber seal 3. In other embodiments, the number of side annular grooves 21 on the upper cover 2 may be multiple, in which case two adjacent side annular grooves 21 are spaced apart vertically, and each of the multiple side annular grooves 21 can accommodate the base 31 of one airtight rubber seal 3. This allows the upper cover 2 to be provided with more airtight rubber seals 3, further improving the airtightness of the semiconductor jig transport container. For example, by providing two side annular grooves 21, the semiconductor jig transport container can ensure good airtightness and easily separate the upper cover 2 and the lower case 1 while maintaining a stable connection. In addition, the upper cover 2 may be formed with different numbers of side annular grooves 21 according to actual needs, and a corresponding number of airtight rubber seals 3 may be disposed thereon, so the present invention is not limited to the above-described embodiment in which one or two side annular grooves 21 are provided.

[0039] Please refer to FIGS. 3 and 7 to 9. In addition to the above-described embodiments, in other embodiments of the present invention, the upper cover 2 may be provided with a valve component that partially penetrates into the storage chamber S and evacuates or seals the storage chamber S. The valve component may include a valve nozzle 24 and a valve plug 25. For example, the valve nozzle 24 has at least one vent hole 241 and is connected to the lower protrusion 23 of the upper cover 2, extending into the storage chamber S. The valve plug 25 is operably provided on the valve nozzle 24 so as to selectively close the vent hole 241 of the valve nozzle 24. That is, when the valve plug 25 is in a closed state (the state shown in FIG. 8), the storage chamber S is not in communication with the outside of the upper cover 2. On the other hand, when the valve plug 25 is in an open state (the state shown in FIG. 9), the storage chamber S can be in communication with the outside of the upper cover 2 via the vent hole 241. As a result, the upper cover 2 of this embodiment can adjust the humidity and airtightness in the receiving chamber S by controlling the valve plug 25 to open or close while being coupled to the lower case 1. However, the present invention does not limit the specific structures of the valve nozzle 24 and the valve plug 25 as long as the above effects can be achieved.

[0040] More specifically, in this embodiment of the present invention, the valve nozzle 24 is generally tubular and has a passage therein that communicates with the storage chamber S. The valve nozzle 24 has an annular wall 242, and the vent hole 241 penetrates the inner and outer surfaces of the annular wall 242. For example, the vent hole 241 may be in the form of a through hole or a cutout extending a predetermined distance from the bottom of the annular wall 242, but is not limited thereto. In this embodiment, it is preferable that a plurality of the vent holes 241 (cutouts) are provided and arranged at equal angular intervals on the annular wall 242. The annular wall 242 of the valve nozzle 24 may be integrally molded and connected to the lower protrusion 23 of the upper cover 2, or may be additionally assembled and connected to the through hole of the lower protrusion 23. However, the present invention is not limited thereto.

[0041] The valve plug 25 may include a valve stem 251, an elastic plug 252, and a stop seat 253. Both ends of the valve stem 251 are connected to the elastic plug 252 and the stop seat 253, respectively. The lower end of the valve stem 251 penetrates the annular wall 242 of the valve nozzle 24, and the stop seat 253 has a width greater than the inner diameter of the annular wall 242 at least in part so as to remain positioned outside the lower end of the annular wall 242. The elastic plug 252 may also have at least one locking block 2521. The locking block 2521 is positioned adjacent to the valve stem 251 and protrudes from the outer circumferential surface of the elastic plug 252.

[0042] See Figures 7 and 8. The elastic plug 252 of the valve plug 25 closes the inside of the annular wall 242, and its outer circumferential surface tightly contacts the inner circumferential surface of the annular wall 242, thereby closing the valve plug 25. This prevents the storage chamber S from communicating with the outside of the upper cover 2 through the vent hole 241. The elastic plug 252 may be made of an elastic material (e.g., rubber) to improve airtightness. The locking block 2521 of the elastic plug 252 is inserted into the corresponding vent hole 241 to assist in positioning the valve plug 25, preventing the elastic plug 252 of the valve plug 25 from easily falling off the valve nozzle 24. The elastic plug 252 may have a tapered shape that is wider at the top and narrower at the bottom, and the upper half of the annular wall 242 may be formed in a corresponding shape to improve the degree of contact between them. Here, as shown in FIG. 8, in order to strictly control the exhaust or sealing of the valve nozzle 24 by opening or closing the valve plug 25, the overall length L1 of the passage of the valve nozzle 24 is made smaller than the overall length L2 of the valve plug 25.

[0043] See Figures 3 and 9. In operation, a suction device (e.g., a vacuum suction machine) may be used to suction the valve nozzle 24 from outside the upper cover 2. In this case, the valve plug 25, which is originally in a closed state, moves upward due to the suction of the suction device. The outer circumferential surface of the elastic plug 252 no longer contacts the inner circumferential surface of the annular wall 242, thereby opening the valve plug 25. In an embodiment in which the elastic plug 252 includes the locking block 2521, the locking block 2521 is elastically deformed by a force while the elastic plug 252 is being sucked upward, causing it to fall off the corresponding vent hole 241. When the valve plug 25 moves upward and the stop seat 253 abuts against the lower end of the annular wall 242, the stop seat 253 prevents the entire valve plug 25 from falling off the valve nozzle 24. As a result, a low-oxygen, low-humidity, low-pressure environment is created in the storage chamber S where air is sucked in by the suction device through the ventilation opening 241.

[0044] See Figures 3 and 8. After the suction device is stopped, the valve plug 25 may fall naturally, but it is preferable to push it downward to return it to the closed state in order to maintain a low-oxygen, low-humidity, low-pressure environment within the storage chamber S. At this time, the low-pressure environment within the storage chamber S also improves the sealing quality when the upper cover 2 closes the top opening 11 of the lower case 1, so the valve plug 25, together with the airtight rubber seal 3, achieves good airtightness, thereby maintaining a low-oxygen, low-humidity, low-pressure environment within the storage chamber S for an even longer period of time and ensuring the cleanliness of items stored within the storage chamber S.

[0045] Furthermore, the upper cover 2 may be provided with a humidity sensor that can be inserted into the storage chamber S to detect the humidity in real time, in order to obtain an indication of whether or not to stop the suction device. The humidity sensor makes it possible to read the humidity in the storage chamber S in real time even during use. Before opening the upper cover 2, the valve plug 25 may be switched to an open state to naturally release air and reduce the degree of vacuum in the storage chamber S, thereby making it easier to open the upper cover 2 from above the lower case 1.

[0046] It is noteworthy that in this embodiment of the present invention, the lower case 1 and the upper cover 2 may both be made of a low-moisture-absorbing material, such as a liquid crystal polymer (LCP) or cycloolefin polymers (COP), or a metal material. As a result, the lower case 1 and the upper cover 2 of this embodiment can effectively reduce the generation of volatile organic compounds and delay the recovery of humidity within the storage chamber S, thereby protecting the semiconductor jigs within the container from contamination by volatile organic compounds and extending the period during which a low-humidity environment is maintained within the semiconductor jig transport container. Furthermore, the lower case 1 and the upper cover 2 can be repeatedly cleaned and used, can be dried to prevent water stains, and have excellent structural strength to improve protection of the semiconductor jigs within the container.

[0047] See Figures 2, 3, and 10. In addition to the above-described embodiments, in another embodiment of the present invention, the upper cover 2 has an overhead hoist transfer (OHT) chuck 26 protruding from the upper surface of the lower protrusion 23. When the upper cover 2 is coupled to the lower case 1, the OHT chuck 26 of the upper cover 2 is clamped by an OHT system, allowing the semiconductor jig transport container of this embodiment to be transported and transferred through an automated system. The OHT chuck 26 may be attached to the lower protrusion 23, or, for easier attachment, may be integrally molded with the lower protrusion 23 and protrude upward, as shown in Figure 10. The OHT chuck 26 is preferably located at the center of the upper cover 2 so that the semiconductor jig transport container is stably clamped by the OHT system.

[0048] Furthermore, in an embodiment in which the lower convex portion 23 is integrally molded and joined to the OHT chuck 26, a flat portion 27 may be provided on the upper surface of the upper cover 2, and the OHT chuck 26 may be provided at the center of the flat portion 27. As a result, the flat portion 27 facilitates the die-cutting process during manufacturing, and the upper cover 2 having the OHT chuck 26 can be manufactured more easily and quickly.

[0049] See Figures 2 and 11. In addition to the above-described embodiments, in other embodiments of the present invention, the side walls 12 of the lower case 1 may be formed to slope outward from bottom to top. This allows multiple lower cases 1 of the same structure to be stacked on top of each other for storage, thereby saving storage space.

[0050] In addition, in an embodiment of the present invention, the side wall 12 of the lower case 1 may have an uneven structure, thereby strengthening the structure of the side wall 12 and providing impact resistance.

[0051] Please refer to Figures 1 and 3. In addition to the above-described embodiments, in other embodiments of the present invention, the interior of the lower case 1 may have at least one component storage area 13. The component storage area 13 may be, for example, a local groove formed by the bottom plate 14 of the lower case 1, or may be a small box disposed in the storage chamber S, but is not limited to these. As a result, components such as a moisture-proofing agent for reducing humidity in the storage chamber S, screws, and spare airtight rubber seals 3 may be stored inside the lower case 1 of this embodiment.

[0052] 1, 2, and 12. In addition to the above-described embodiments, in other embodiments of the present invention, the lower case 1 may have a plurality of first overlapping portions 15, and the upper cover 2 may have a plurality of second overlapping portions 28. Thus, when the upper cover 2 is fixed to the top of the lower case 1, the plurality of first overlapping portions 15 and the plurality of second overlapping portions 28 are stacked together, so that a plurality of semiconductor jig transport containers having the same structure can be stored stacked on top of each other.

[0053] The first overlapping portions 15 are provided on the bottom plate 14 of the lower case 1. For example, they may be bumps on the outer bottom surface of the bottom plate 14, and may function as support legs for the lower case 1, but are not limited thereto. The second overlapping portions 28 are provided on the upper surface of the upper cover 2. For example, they may be recesses recessed downward from the upper surface of the lower protrusion 23. When two sets of semiconductor jig transport containers are stacked vertically, the first overlapping portions 15 of the upper lower case 1 are inserted into the second overlapping portions 28 of the lower upper cover 2, and the lower edge of the upper lower case 1 is surrounded by the recessed lower protrusion 23, allowing the semiconductor jig transport containers of this embodiment to be stably stacked vertically. In other embodiments, the corresponding first overlapping portions 15 and second overlapping portions 28 may be arranged in the opposite direction to the above embodiment, or may have another equivalent structure that can limit horizontal displacement. The present invention is not limited to these.

[0054] See FIG. 13. In addition to the above-described embodiments, in other embodiments of the present invention, the interior of the lower case 1 may include at least one barrier 16, such as a barrier plate and / or a barrier box. The barrier 16 may also be made of a low-moisture-absorbing material such as LCP, COP, or metal. In this manner, the barrier 16 separates semiconductor jigs, such as carriers and / or components, from one another within the lower case 1 of this embodiment, thereby preventing contact contamination between the semiconductor jigs.

[0055] See Figures 2, 3, and 5. In addition to the above-described embodiments, in other embodiments of the present invention, multiple locking portions 4 may be provided around the boundary between the upper cover 2 and the lower case 1. For example, the locking portions 4 may be provided on the outer periphery of the annular flange 22 of the upper cover 2 and the outer periphery of the upper edge of the lower case 1. Thus, after the upper cover 2 of this embodiment is coupled to the lower case 1, the locking portions 4 can be further locked to stabilize the coupling between the upper cover 2 and the lower case 1 and prevent easy separation. In particular, this effectively prevents the upper cover 2 from falling off when the semiconductor jig transport container is gripped by an automated system. Meanwhile, when attempting to open the upper cover 2, the locking portions 4 must first be switched to an unlocked state. The number of locking portions 4 is not limited, and one or more may be provided as needed. The specific form of the locking portion 4 is not limited to that shown in the drawings, as long as it has an equivalent structure that can be locked and unlocked.

[0056] The semiconductor jig transport container according to the present invention is highly practical because it can be used not only to store wafer cassettes, but also to store semiconductor transport carriers such as mask carriers, substrate carriers, and substrate carriers, as well as related parts and other semiconductor jigs that require high levels of cleanliness.

[0057] Although the present invention has been disclosed in the above preferred embodiments, those skilled in the art should understand that these embodiments are merely illustrative of the present invention and do not limit the scope of the present invention. Furthermore, any modifications or replacements equivalent to the above embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is as defined by the claims. The claims should be interpreted in the broadest possible manner to encompass all modifications and similar arrangements. [Explanation of symbols]

[0058] 1 Lower Case 1a Medial wall 11 Top opening 12 Side wall 13 Parts storage area 14 Bottom plate 15 First Polymerization Section 16 Barrier 2 Top cover 21 Side annular groove 22 Annular flange 23 Lower convex part 24 valve nozzle 241 Ventilation 242 Circular Wall 25 Valve plug 251 Valve stem 252 Elastic Plug 2521 Locking Block 253 Stop Sheet 26 OHT chuck 27 Flat area 28 Second Polymerization Section 3 Airtight rubber seal 31 Base 311 Exterior 32 flange 321 Free end 322 Slope 4 Locking part D1 First distance D2 2nd distance D3 Third distance L1, L2 Overall length S Containment Room θ angle

Claims

1. a lower case having a top opening; a top cover having at least one side annular groove; at least one airtight rubber seal having a base disposed in the side annular groove and at least one flange connected to the base and extending outward; Equipped with When the upper cover is coupled to the top opening of the lower case, the flange of the airtight rubber seal is elastically bent and tightly fitted to the inner wall of the lower case to create an airtight state.

2. 2. The semiconductor jig transport container according to claim 1, wherein the upper cover has an annular flange covering the upper edge of the lower case and a lower convex portion extending downward from the annular flange, and the side annular groove is provided on the outer periphery of the lower convex portion.

3. 3. The semiconductor jig transport container according to claim 2, wherein the upper cover is provided with an OHT chuck protruding from the top of the lower convex portion.

4. 4. The semiconductor jig transport container according to claim 3, wherein the lower convex portion is integrally connected to the OHT chuck, the upper cover has a flat portion, and the OHT chuck is provided at the center of the flat portion.

5. the lower case has a plurality of first overlapping portions, and the upper cover has a plurality of second overlapping portions; 2. The semiconductor jig transport container according to claim 1, wherein a plurality of the first overlapping sections and a plurality of the second overlapping sections are stacked on top of each other to store a plurality of the semiconductor jig transport containers having the same structure.

6. The number of flanges of the airtight rubber seal is two, and the two flanges are provided at an interval above and below, a second distance exists between an outer surface of the base and an inner wall of the lower case when the upper cover is coupled to the top opening of the lower case; When the two flanges of the airtight rubber seal are not bent, a third distance exists between the free ends of the two flanges; 2. The semiconductor jig transport container according to claim 1, wherein the third distance is equal to or greater than the second distance.

7. 2. The semiconductor jig transport container according to claim 1, wherein said flange has an inclined surface that is inclined upward with respect to the horizontal surface of said base.

8. A storage chamber is provided inside the lower case, 2. The semiconductor jig transport container according to claim 1, wherein the upper cover is provided with a valve part that penetrates into the accommodation chamber and that exhausts gas from or seals the accommodation chamber.

9. The valve components include a valve nozzle and a valve plug; 9. The semiconductor jig transport container according to claim 8, wherein the valve nozzle is controlled to be airtight or not by opening or closing the valve plug.

10. The valve nozzle has a passage communicating with the storage chamber, and a plurality of cutouts are provided in an annular wall of the passage. the valve plug is adapted to open or close the passage; 10. The semiconductor jig transport container according to claim 9, wherein the overall length of said passage is shorter than the overall length of said valve plug.

11. 2. The semiconductor jig transport container according to claim 1, wherein the side walls of the lower case are formed to slope outward from bottom to top, so that a plurality of lower cases of the same structure can be stacked and stored.

12. 2. The semiconductor jig transport container according to claim 1, wherein the lower case has at least one component storage area inside.

13. The interior of the lower case is provided with at least one barrier, 2. The semiconductor jig transport container according to claim 1, wherein the barrier is made of LCP, COP or metal.

14. 2. The semiconductor jig transport container according to claim 1, further comprising a plurality of locking portions provided around the boundary between the upper cover and the lower case to lock or unlock the upper cover and the lower case.

15. 15. The semiconductor jig transport container according to claim 1, wherein the upper cover and the lower case are made of LCP, COP, or metal.

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