Terminal unit and method for producing terminal unit

Abstract

To provide a terminal unit and a method for producing a terminal unit, which achieve suppression of damage to an electric component even in a case where the current value supplied to the electric component becomes large.SOLUTION: A terminal unit 1 includes a substrate 20 having an electric component 2 mounted thereon, a busbar 3 electrically connected to the substrate, and a housing body 10 provided with a component accommodating chamber 40 accommodating both the substrate and the busbar 3, the component accommodating chamber 40 being provided with heat conductive members 71 and 72 disposed between the substrate and the housing body 10, the heat conductive members disposed in contact with both and configured to conduct heat of the substrate to the housing body 10.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a terminal unit and a method for manufacturing the terminal unit. [Background technology]

[0002] BACKGROUND ART Lighting units are installed in various locations in a vehicle (for example, door courtesy lighting, foot lighting, map lighting, charging port lighting, etc.) (for example, see Patent Document 1).

[0003] The conventional lighting unit disclosed in Patent Document 1 includes a component-mounted board on which LED components are mounted, a bus bar electrically connected to the component-mounted board, and a housing that accommodates the component-mounted board and the bus bar. The bus bar includes a base, a pair of clamping pieces that are continuous with one side of the base and clamp the component-mounted board, and male tabs that are continuous with the other side of the base and fit into mating terminals of a mating connector. In this conventional lighting unit, the bus bar is accurately positioned in the housing via the component-mounted board supported by the housing, ensuring stable electrical connectivity between the male tabs and the mating terminals and between the pair of clamping pieces and the component-mounted board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-13674 Summary of the Invention [Problem to be solved by the invention]

[0005] For example, LED lighting devices used in the interior of a vehicle are required to be highly bright so that they can be seen even in the daytime. To achieve this, the current value of the LED components needs to be increased, but the amount of heat generated increases in proportion to the current value, raising concerns that the LED components (electrical components) may be damaged.

[0006] An object of the present invention is to provide a terminal unit and a method for manufacturing the terminal unit that are designed to suppress damage to electrical components even when a large current value is supplied to the electrical components. [Means for solving the problem]

[0007] In order to solve the above problem and achieve the object, the terminal unit described in claim 1 comprises a substrate on which an electrical component is mounted, a bus bar electrically connected to the substrate, and a housing body having a component accommodating chamber for accommodating the substrate and the bus bar, and the component accommodating chamber is provided with a heat conducting member disposed between the substrate and the housing in contact with both, for conducting heat from the substrate to the housing. In the method for manufacturing a terminal unit according to claim 4, the heat conducting member is injected into the component-receiving chamber in a molten state. [Effects of the Invention]

[0008] According to the present invention, even if the current value supplied to the electrical component is increased, damage to the electrical component can be suppressed. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view showing an illumination unit (terminal unit) according to one embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view taken along line II in FIG. [Figure 3] FIG. 2 is a side view of the lighting unit. [Figure 4] FIG. 2 is an exploded perspective view of the lighting unit. [Figure 5] (A) A side view of a component-mounted substrate that constitutes the lighting unit, (B) A side view of a bus bar that constitutes the lighting unit, (C) A side view of a housing that constitutes the lighting unit, (D) A side view of a lens body that constitutes the lighting unit, and (E) A side view of a cover that constitutes the lighting unit. [Figure 6]10A and 10B are diagrams for explaining the procedure for manufacturing the lighting unit, in which (A) shows the state in which the injection port of the syringe is inserted into the discharge port of the housing body, and (B) is a cross-sectional view along line II-II in (A). DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a lighting unit 1 (terminal unit) according to one embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line II in Fig. 1. Fig. 3 is a side view of the lighting unit 1. Fig. 4 is an exploded perspective view of the lighting unit 1.

[0011] As shown in FIGS. 1 to 3 , the lighting unit 1 (terminal unit) of this embodiment includes a circuit board 20 (board, shown in FIG. 2 ) on which multiple chip components 2 (electrical components, shown in FIG. 2 ) are mounted, four (multiple) bus bars 3 (shown in FIG. 2 ) electrically connected to the circuit board 20, a housing 4 having a component receiving chamber 40 for receiving the circuit board 20, a lens body 5 including a lens 50 that refracts light from an LED component 2A (light-emitting component), which is one of the multiple chip components 2, a cover 6 that supports the lens body 5 and is attached to the housing 4, and gap fillers 71 and 72 (thermal conductive members, shown in FIG. 2 ) that transfer heat from the circuit board 20 to the housing 4 and the cover 6. The housing 4 and the cover 6 are made of a resin with high thermal conductivity. The housing 4 and the cover 6 constitute a “housing body 10.”

[0012] The lighting unit 1 is provided so as to be able to be fitted with a mating connector (not shown), and when the lighting unit 1 and the mating connector are fitted together, power is supplied via the mating connector.

[0013] As shown in FIGS. 4 and 5(A), the circuit board 20 is formed in a rectangular plate shape. The circuit board 20 is accommodated in a housing 4 (described later) with its longitudinal direction aligned with the front-rear direction X and its width direction aligned with the left-right direction Y. An LED component 2A (one of the electrical components) is mounted on the front end of the front surface 20s of the circuit board 20. A front-side chip component 2B is mounted behind the LED component 2A at a side X2 behind the LED component 2A. A back-side chip component 2C (another of the electrical components shown in FIG. 5(A)) is mounted on the back surface 20b of the circuit board 20. The multiple chip components 2 include the LED component 2A, the front-side chip component 2B, and the back-side chip component 2C.

[0014] 4, a circuit pattern (not shown) is formed on the front and back surfaces 20s and 20b of the circuit board 20. This circuit pattern is provided with four contact points 21 that are electrically connected to the bus bars 3, which will be described later. The circuit board 20 is configured so that the LED components 2A are driven in a state in which each of the bus bars 3, which will be described later, is electrically connected to each of the contact points 21 on the circuit board 20. Hereinafter, the circuit board 20 on which chip components 2 such as the LED components 2A are mounted may be referred to as a "circuit board 20A with components mounted thereon."

[0015] Hereinafter, the longitudinal direction of the circuit board 20 may be referred to as the "front-rear direction X," the width direction may be referred to as the "left-right direction Y," and the thickness direction may be referred to as the "up-down direction Z." In addition, within the front-rear direction X, the direction in which a mating connector is inserted may be referred to as the "front X1," and the opposite direction in which the circuit board 20 or the bus bar 3 is inserted into the housing 4 may be referred to as the "rear X2."

[0016] 4 and 5(B), the bus bar 3 includes a base 30, a pair of clamping pieces 31A and 31B that sandwich and hold the circuit board 20, a locking arm 33 having a locking claw 331 that can lock a locked portion 44 (described later) of the housing 4, and a mating terminal portion 34 that mates with a mating terminal of a mating connector (not shown). The base 30, the pair of clamping pieces 31A and 31B, and the locking arm 33 are located on the same plane.

[0017] 5(B), the pair of clamping pieces 31A, 31B are provided to extend forward X1 from the base 30 and are configured to be able to clamp the circuit board 20 from above and below. One of the pair of clamping pieces 31A, 31B (hereinafter may be referred to as the "first clamping piece 31A") is configured to have a first arm 310A that is provided to extend forward X1 from the base 30 and slightly downward Z2, and a claw portion 311A ​​that is provided to protrude downward Z2 (toward the circuit board 20) from the front end of the first arm 310A and is able to come into contact with a contact portion 21 provided on the circuit board 20.

[0018] 5(B), the other of the pair of clamping pieces 31A, 31B (hereinafter sometimes referred to as the "second clamping piece 31B") includes a second clamping piece main body 310B extending forward X1 from the base 30, and an abutting portion 311B rising upward Z1 at the rear end of the second clamping piece main body 310B and abutting the rear end of the circuit board 20. The dimension of the second clamping piece 31B in the front-rear direction X is longer than the dimension of the first clamping piece 31A in the front-rear direction X, and the front end of the second clamping piece 31B is located further forward X1 than the front end of the first clamping piece 31A.

[0019] 4 and 5(B), the locking arm 33 is provided above the pair of clipping pieces 31A, 31B in the Z1 direction. The locking arm 33 includes a locking arm main body 330 extending forward from the base 30 in the X1 direction, and a locking claw 331 protruding from the front end of the locking arm main body 330 in the Z1 direction (the side away from the circuit board 20) and capable of locking a lockable portion 44 of the housing 4, which will be described later.

[0020] 5(B), the fitting terminal portion 34 includes a root portion 340 that is continuous with the rear side X2 of the base portion 30, and a fitting terminal 341 that extends rearward X2 from the root portion 340. The fitting terminal 341 is provided between the pair of clamping pieces 31A, 31B in the vertical direction Z.

[0021] 2, the housing 4 includes a component accommodating chamber 40 that accommodates the component-mounted circuit board 20A and the bus bar 3, a connector fitting chamber 8 into which a mating connector (not shown) is fitted, and a partition wall 9 provided between the component accommodating chamber 40 and the connector fitting chamber 8. The component accommodating chamber 40 is provided in front of the connector fitting chamber 8 at a position X1, with the partition wall 9 in between.

[0022] As shown in FIG. 4, the component storage chamber 40 is a space surrounded by a front bottom wall 40A that is rectangular in plan view, a front top wall 40B that faces the front bottom wall 40A, a pair of front side walls 40C and 40D that stand upright from the widthwise (left-right direction Y) edges of the front bottom wall 40A, and a partition wall 9 (shown in FIG. 2), and is configured to have an upper opening 40E that opens upward Z1 and a front opening 40F that opens forward X1.

[0023] As shown in Figures 2 and 4, the upper opening 40E is provided at the front X1 of the front top wall 40B. The front opening 40F is provided at a position facing the partition wall 9 (shown in Figure 2). The upper opening 40E and the front opening 40F are provided continuously. The upper opening 40E and the front opening 40F are configured to be closed by the lens body 5 and the cover 6, which will be described later.

[0024] As shown in FIG. 4, the component storage chamber 40 is provided with four bus bar guide grooves 41 that guide each bus bar 3 to a predetermined position in the component storage chamber 40, an insulating wall 42 that insulates adjacent bus bars 3 from each other, a board guide portion 43 that guides the circuit board 20 to slide rearward X2, four engaging portions 44 that engage with engaging claws 331 provided on the bus bar 3, a housing first discharge port 45, a housing second discharge port 46, a cover engaging portion 47 that engages the cover 6, and a lens recess 48 that supports the lens body 5.

[0025] As shown in Fig. 4, the bus bar guide grooves 41 are recessed grooves that protrude from the inner surface of the front bottom wall 40A and are provided between a plurality of bottom side protrusions 41A, and extend in the front-rear direction X. The number of bus bar guide grooves 41 provided is the same as the number of bus bars 3 (four), and they are arranged side by side in the left-right direction Y. The bus bar guide grooves 41 are configured to guide the bus bars 3 to slide rearward X2 while positioned between adjacent bottom side protrusions 41A.

[0026] 4, the insulating wall 42 is provided to protrude from the inner surface of the front-side ceiling wall 40B and is positioned between adjacent bus bars 3. The insulating wall 42 is configured to be interposed between the adjacent bus bars 3 and to insulate the adjacent bus bars 3 from each other.

[0027] 4, the board guide portion 43 is provided on the front side walls 40C, 40D below a lens recess 48 (described later) in a direction Z2. The board guide portion 43 is configured to position the circuit board 20 between a convex ridge portion 43A provided in a convex shape on the front side walls 40C, 40D and an installation portion 48A of the lens recess 48, and to guide and slide the circuit board 20 rearward X2.

[0028] As shown in FIG. 4, the four locked portions 44 are arranged side by side in the left-right direction Y on the front ceiling wall 40B.

[0029] As shown in FIG. 5C , the housing first discharge port 45 is formed by cutting out the upper end of one of the pair of front side walls 40C, 40D (hereinafter, sometimes referred to as “one front side wall 40C”) that constitutes the housing 4. The housing first discharge port 45 is located in front X1 of the front top wall 40B and at the rear end of the upper opening 40E. When each bus bar 3 is assembled to the housing 4, the housing first discharge port 45 is located in front X1 of the first clamping piece 31A and the locking arm 33 of the bus bar 3. The housing first discharge port 45, together with a first cover discharge port 63A provided in the cover 6 (described later), constitutes a “first gap filler discharge port 10A.”

[0030] 5(C), the housing second discharge port 46 is located below the housing first discharge port 45 in a direction Z2 and in front of a cover locking portion 47 (described later) in a direction X1, and is provided by penetrating one of the front side walls 40C. When each bus bar 3 is assembled to the housing 4, the housing second discharge port 46 is located in front of a second clipping piece 31B of the bus bar 3 in a direction X1. The housing second discharge port 46, together with a second cover discharge port 63B provided in the cover 6 (described later), constitutes a "second gap filler discharge port 10B."

[0031] 5(C), the cover locking portion 47 is located below Z2 the housing first discharge port 45 and behind X2 the housing second discharge port 46. The cover locking portion 47 is provided to protrude from the outer surface of one of the front side walls 40C, and is positioned inside a lock receiving portion 63E provided on the cover 6, which will be described later, and is configured to lock onto the lock receiving portion 63E.

[0032] 4, the lens recess 48 is provided on the inner surface of each of the pair of front side walls 40C, 40D. The lens recess 48 has a mounting portion 48A for mounting an insertion piece 51D of the lens body 5 (described later) thereon, and a pair of continuous surfaces 48B, 48B that are continuous with the mounting portion 48A and face each other, so that the portion surrounded by the mounting portion 48A and the pair of continuous surfaces 48B, 48B forms a recess.

[0033] As shown in FIG. 2, the connector fitting chamber 8 is a space surrounded by a rear bottom wall 8A that is continuous with the rear X2 of the front bottom wall 40A, a rear top wall 8B that is continuous with the rear X2 of the front top wall 40B and faces the rear bottom wall 8A, and rear side walls 8C, 8C that are continuous with the rear X2 of each of the front side walls 40C, 40D, and has a rear opening 8D that opens to the rear X2 and receives a mating connector.

[0034] As shown in Figure 2, the partition wall 9 has four terminal through holes 90 for inserting the mating terminal portions 34 provided on each bus bar 3, and a pair of terminal receiving surfaces 91, 92 for abutting the rear end surfaces of the base portions 30 provided on the bus bar 3.

[0035] 2, the four terminal through-holes 90 are arranged side by side in the left-right direction Y and penetrate the partition wall 9. A pair of terminal receiving surfaces 91, 92 are provided on both the upper and lower sides of each terminal through-hole 90. The pair of terminal receiving surfaces 91, 92 are formed by surfaces that include the up-down direction Z and the left-right direction Y.

[0036] When the busbars 3 are assembled in such a housing 4, the base 30, pair of clamping pieces 31A, 31B and locking arm 33 of each busbar 3 are installed in predetermined positions in the component accommodating chamber 40, and the mating terminal 341 is installed in a predetermined position in the connector mating chamber 8.

[0037] As shown in FIGS. 2 and 4, the lens body 5 includes a lens 50 made of a resin that transmits light, and a substantially rectangular parallelepiped base 51 that supports the lens 50.

[0038] 4 and 5(D), the base 51 includes a lens base 51A having a rectangular shape in a plan view and supporting the lens 50, a pair of standing plates 51B, 51C (shown in FIG. 5(D)) standing downward Z2 from the edge of the lens base 51A in the front-rear direction X, and four insertion pieces 51D projecting from the ends of the pair of standing plates 51B, 51C in the left-right direction Y and installed in the lens recess 48 provided in the housing 4. Hereinafter, one of the pair of standing plates 51B, 51C located at the front X1 may be referred to as the "front standing plate 51B," and the other located at the rear X2 may be referred to as the "rear standing plate 51C (support plate)."

[0039] The pair of standing plates 51B, 51C are disposed opposite each other in the front-to-back direction X. The tips (lower ends) of these standing plates 51B, 51C are formed so as to be at the same position in the up-down direction Z. With the lens body 5 supported at a predetermined position in the housing 4, the front standing plate 51B is disposed in front X1 of the LED component 2A, and the rear standing plate 51C is disposed so as to be in contact with the upper surface of the front-side chip component 2B. Thus, with the lens body 5 supported at a predetermined position in the housing 4, the rear standing plate 51C, i.e., the base 51, exhibits an inflow prevention function that prevents the molten gap filler 7 from flowing toward the LED component 2A.

[0040] Four insertion pieces 51D are provided on each of the pair of standing plates 51B, 51C, and on both ends in the left-right direction Y.

[0041] Such a lens body 5 is supported by the housing 4 with the lens 50 positioned above Z1 the LED component 2A by inserting the insertion piece 51D provided on the base 51 into the lens recess 48 provided in the housing 4.

[0042] The cover 6 is made of a resin that does not transmit light. As shown in FIGS. 4 and 5(E), the cover 6 has a lens opening 60 (shown in FIG. 4) that exposes the lens 50 and includes an upper wall portion 61 that is rectangular in plan view and covers the upper opening 40E of the housing 4, a front wall portion 62 that is rectangular in plan view and hangs down in the downward direction Z2 from the front end of the upper wall portion 61 and covers the front opening 40F of the housing 4, and a pair of cover side walls 63, 64 that hang down in the downward direction Z2 from the end of the upper wall portion 61 in the left-right direction Y and face the outer surfaces of the pair of front side walls 40C, 40D provided on the housing 4. Hereinafter, one of the pair of cover side walls 63, 64 may be referred to as the "one-side cover side wall 63" and the other may be referred to as the "other-side cover side wall 64."

[0043] 4, the one-side cover side wall 63 is provided opposite one of the front side walls 40C of the housing 4. The one-side cover side wall 63 is provided with a horizontally long rectangular cutout portion 63C including the first cover discharge port 63A and the second cover discharge port 63B, and a convex portion 63D provided on the outer surface of the one-side cover side wall 63.

[0044] In the one-side cover side wall 63, the first cover discharge port 63A is provided above the notch 63C in the direction Z1, and a convex portion 63D is provided in front of the notch 63C in the direction X1. The first cover discharge port 63A and the notch 63C are configured to penetrate the one-side cover side wall 63.

[0045] When the cover 6 is assembled to the housing 4, the first cover discharge port 63A overlaps with the first housing discharge port 45 provided in the housing 4 to form the first gap filler discharge port 10A. The tip S of a syringe is inserted into the first gap filler discharge port 10A, and the molten gap filler 7 is discharged into the component storage chamber 40.

[0046] The molten gap filler 7 discharged from the first gap filler discharge port 10A hardens after a predetermined time has elapsed, and forms a first gap filler 71 in the shape of a rectangular parallelepiped.

[0047] As shown in FIG. 2, the first gap filler 71 is located in front of the first clamping piece 31A and the locking arm 33 of the bus bar 3 at X1 and behind the front-side chip component 2B in the front-rear direction X.

[0048] 2, the upper surface 71A of the first gap filler 71 is in contact with the cover 6, the lower surface 71B is in contact with the surface 20s of the circuit board 20, the front surface 71C is in contact with the rear standing plate 51C of the lens body 5, and both left and right surfaces (not shown) are in contact with the pair of front side walls 40C, 40D of the housing 4. As a result, heat generated from the circuit board 20 is transferred to the housing 4 and the cover 6 via the first gap filler 71 and dissipated.

[0049] As shown in FIG. 5(E), the notch 63C includes a second cover discharge port 63B and a locking portion 63E that is locked with the cover locking portion 47 provided on the housing 4. The second cover discharge port 63B is located in front of the locking portion 63E (X1). When the cover 6 is attached to the housing 4, the second cover discharge port 63B and the second housing discharge port 46 provided on the housing 4 overlap to form the second gap filler discharge port 10B. The tip S of a syringe is inserted into the second gap filler discharge port 10B, and the molten gap filler 7 is discharged into the component-receiving chamber 40.

[0050] The molten gap filler 7 discharged from the second gap filler discharge port 10B hardens after a predetermined time has elapsed, forming a second gap filler 72 in the shape of a rectangular parallelepiped.

[0051] The second gap filler 72 is located in front of the second clamping piece 31B of the bus bar 3 in the front-rear direction X1 and behind the back-side chip component 2C in the rear-rear direction X2.

[0052] 2, the upper surface 72A of the second gap filler 72 is in contact with the circuit board 20, the lower surface 72B is in contact with the front bottom wall 40A of the housing 4, and both left and right surfaces (not shown) are in contact with the pair of front side walls 40C, 40D of the housing 4. As a result, heat generated from the circuit board 20 is transferred to the housing 4 and the cover 6 via the second gap filler 72 and dissipated.

[0053] Next, an assembly procedure (a manufacturing method of the terminal unit) for assembling the lighting unit 1 (terminal unit) will be described with reference to FIGS. 6(A) and 6(B).

[0054] First, multiple chip components 2 are mounted on the circuit board 20. As a result, the LED component 2A is mounted on the front surface 20s of the circuit board 20, the front-side chip component 2B is mounted behind the LED component 2A at the side X2, and the back-side chip component 2C is mounted on the back surface 20b of the circuit board 20. In this manner, the component-mounted circuit board 20A is assembled.

[0055] Thereafter, the bus bars 3 are inserted into the housing 4. Specifically, the bus bars 3 are inserted with the tips of the mating terminal portions 34 of the bus bars 3 approaching the front end of the component-receiving chamber 40. As the insertion progresses, the second clipping pieces 31B of each bus bar 3 are positioned in the bus bar guide grooves 41 and guided rearward X2. As the insertion progresses, the locking arms 33 are positioned between the insulating walls 42, and the mating terminal portions 34 of each bus bar 3 are inserted into the terminal through-holes 90. As the insertion progresses, the rear end surfaces of the bases 30 provided on each bus bar 3 come into contact with the pair of terminal receiving surfaces 91, 92, and the insertion of each bus bar 3 is stopped. At approximately the same time, the locking claws 331 of the locking arms 33 lock the mating portions 44 of the housing 4. As a result, the base 30, pair of clamping pieces 31A, 31B, and locking arm 33 of each bus bar 3 are installed at predetermined positions in the component-accommodating chamber 40, and the mating terminals 341 are installed at predetermined positions in the connector mating chamber 8. In this manner, the bus bar 3 is assembled to the housing 4.

[0056] Thereafter, the component-equipped circuit board 20A is inserted into the component-receiving chamber 40 of the housing 4. Specifically, the rear end of the component-equipped circuit board 20A is inserted so as to approach the front end of the board guide portion 43 provided in the component-receiving chamber 40 of the housing 4. As the insertion progresses, the component-equipped circuit board 20A enters between the pair of clamping pieces 31A, 31B that constitute the bus bar 3. The rear end of the component-equipped circuit board 20A abuts against the abutting portion 311B of the bus bar 3, thereby stopping the insertion. At this time, the component-equipped circuit board 20A is clamped between the pair of clamping pieces 31A, 31B that constitute the bus bar 3, and the claw portion 311A ​​of the first clamping piece 31A abuts against the contact portion 21 of the component-equipped circuit board 20A. In this way, the component-equipped circuit board 20A is accommodated in the component-receiving chamber 40 of the housing 4, and the contact portions 21 of the component-equipped circuit board 20A are electrically connected to the bus bar 3.

[0057] Thereafter, the lens body 5 is inserted into the component housing chamber 40 from the upper opening 40E side of the housing 4. Specifically, the lens body 5 is installed by inserting the insertion pieces 51D provided on the upright plates 51B, 51C into the lens recesses 48 provided in the housing 4 with the front-side upright plate 51B positioned in front of the rear-side upright plate 51C at X1. In this manner, the lens body 5 is supported by the housing 4 with the lens 50 positioned above (directly above) the LED component 2A at Z1. With the lens body 5 supported in a predetermined position in the housing 4, the front-side upright plate 51B is provided in front of the LED component 2A at X1, and the rear-side upright plate 51C is positioned so as to be in contact with the upper surface of the front-side chip component 2B.

[0058] Next, the cover 6 is brought closer to the upper opening 40E of the housing 4 and assembled to the housing 4 so as to cover the upper opening 40E of the housing 4. During the assembly process, the lower ends of the pair of cover side walls 63, 64 abut against the cover locking portions 47 provided on the housing 4, and climb up and overcome the cover locking portions 47. As a result, the cover locking portions 47 provided on the housing 4 are positioned inside the notches 63C provided on the cover 6. In this way, the notches 63C provided on the cover 6 are engaged with the cover locking portions 47, and assembly of the cover 6 to the housing 4 is completed.

[0059] When the cover 6 is attached to the housing 4, the lens 50 of the lens body 5 is exposed from a lens opening 60 provided in the cover 6. The first cover outlet 63A overlaps with the first housing outlet 45 provided in the housing 4 to form a first gap filler outlet 10A, and the second cover outlet 63B overlaps with the second housing outlet 46 provided in the housing 4 to form a second gap filler outlet 10B.

[0060] Thereafter, as shown in FIG. 6(A), the tip S of a syringe is inserted into the first gap filler discharge port 10A, and the molten gap filler 7 is discharged from the first gap filler discharge port 10A into the component housing chamber 40 via the tip S of the syringe. At this time, as shown in FIG. 6(B), the rear standing plate 51C, i.e., the base 51, exhibits an inflow prevention function. This prevents the molten gap filler 7 from flowing toward the LED component 2A. The molten gap filler 7 hardens after a predetermined time has passed, forming a rectangular parallelepiped first gap filler 71.

[0061] Then, the tip S of the syringe is inserted into the second gap filler discharge port 10B, and the molten gap filler 7 is discharged from the second gap filler discharge port 10B into the component housing chamber 40. The molten gap filler 7 hardens after a predetermined time has passed, forming a rectangular parallelepiped second gap filler 72.

[0062] 2, the first gap filler 71 is located in front of the first clamping piece 31A and the locking arm 33 of the bus bar 3 and behind the front-side chip component 2B in the front-rear direction X1, and behind the front-side chip component 2B, with an upper surface 71A of the first gap filler 71 contacting the cover 6, a lower surface 71B contacting the surface 20s of the circuit board 20, a front surface 71C contacting the rear-side standing plate 51C of the lens body 5, and both left and right surfaces (not shown) contacting the pair of front-side side walls 40C, 40D of the housing 4. Thus, heat generated from the circuit board 20 is transferred to the housing 4 and the cover 6 via the first gap filler 71 and dissipated.

[0063] 2, the second gap filler 72 is located in front of the second clamping piece 31B of the bus bar 3 at a position X1 in front of the second clamping piece 31B and behind the chip component 2 mounted on the back surface 20b of the circuit board 20 at a position X2 in front of the second gap filler 72. The second gap filler 72 has an upper surface 72A in contact with the circuit board 20, a lower surface 72B in contact with the front bottom wall 40A of the housing 4, and both left and right surfaces (not shown) in contact with the pair of front side walls 40C, 40D of the housing 4. As a result, heat generated from the circuit board 20 is transmitted to the housing 4 and the cover 6 via the second gap filler 72 and dissipated. In this manner, the assembly of the lighting unit 1 is completed.

[0064] According to the above-described embodiment, gap fillers 71, 72 (thermal conduction members) are provided in the component housing chamber 40 between the circuit board 20 (substrate) and the housing body 10 in contact with both of them to conduct heat from the circuit board 20 to the housing body 10. As a result, heat generated from the circuit board 20 is transferred to the housing 4 and the cover 6 constituting the housing body 10 via the gap fillers 71, 72 and dissipated. As a result, even if the current value of the LED component 2A (electrical component) mounted in the lighting unit 1 is increased, heat from the circuit board 20 is dissipated to the housing 4 and the cover 6 via the gap fillers 71, 72. As a result, even if the current value supplied to the LED component 2A is increased, damage to the LED component 2A can be suppressed.

[0065] The busbar 3 also has a pair of clamping pieces 31A, 31B that sandwich the circuit board 20 (substrate) and are electrically connected to the circuit board 20, and the gap fillers 71, 72 (thermal conductive members) have a first gap filler 71 (first thermal conductive member) that is provided in contact with the front surface 20s (one side surface) of the circuit board 20, and a second gap filler 72 (second thermal conductive member) that is provided in contact with the back surface 20b (the other side surface) of the circuit board 20, and the first gap filler 71 is provided between one 2A of the chip components 2 (electrical components) and the first clamping piece 31A (one of the pair of clamping pieces 31A, 31B), and the second gap filler 72 is provided between the other 2C of the chip components 2 and the second clamping piece 31B (the other of the pair of clamping pieces 31A, 31B). This allows heat to be efficiently dissipated from the circuit board 20 to the housing 4 and the cover 6 via the gap fillers 71, 72, thereby realizing a configuration that can suppress damage to the LED components 2A, 2 (electrical components) even if the current value supplied to the LED components 2A, 2 is increased.

[0066] The LED component 2A further includes a lens body 5 including a lens 50, and the lens body 5 is provided with a rear-side standing plate 51C (support plate) that supports the lens 50. The rear-side standing plate 51C is provided on the busbar 3 side of the LED component 2A, and has an inflow prevention function that prevents the molten gap filler 7 from flowing into the LED component 2A. This prevents the molten gap filler 7 from blocking the light of the LED component 2A.

[0067] Furthermore, the gap filler 7 (thermal conductive member) is poured in a molten state into the component housing chamber 40. This allows the gap filler 7 to be placed inside the component housing chamber 40 without increasing the external size of the lighting unit 1.

[0068] The present invention is not limited to the above-described embodiment, but includes other configurations that can achieve the object of the present invention, and the following modified examples are also included in the present invention.

[0069] In the embodiment, the lighting unit 1 is configured to have the first gap filler 71 (first thermal conductive member) and the second gap filler 72 (second thermal conductive member) as the thermal conductive members, but the present invention is not limited to this. The lighting unit 1 may have at least either the first gap filler 71 or the second gap filler 72.

[0070] In addition, in the above embodiment, an LED component is used as one of the plurality of electrical components, but the present invention is not limited to this. Even if one of the plurality of electrical components is not an LED component, the same effects as those of this embodiment can be achieved.

[0071] In the above embodiment, the housing body 10 is configured to include the housing 4 and the cover 6, but the present invention is not limited to this. The housing body may be configured from a single member as long as it has the component housing chamber 40 that houses the circuit board 2 and the bus bar 3.

[0072] Although the best configurations and methods for carrying out the present invention have been disclosed above, the present invention is not limited thereto. That is, although the present invention has been particularly illustrated and described mainly with reference to specific embodiments, those skilled in the art can make various modifications to the above-described embodiments in terms of shape, material, quantity, and other detailed configurations without departing from the scope of the technical idea and purpose of the present invention. Therefore, the above-disclosed descriptions limiting the shape, material, etc. are provided as examples to facilitate understanding of the present invention and are not intended to limit the present invention. Therefore, descriptions using names of components that are free from some or all of the limitations on shape, material, etc. are included in the present invention. [Explanation of symbols]

[0073] 1 Lighting unit (terminal unit) 2A, 2 LED components (electrical components) 20 Circuit board (substrate) 20s Circuit board surface (one side of the board) 20b Back side of circuit board (other side of board) 3 Bus Bar 31A, 31B Pair of clamping pieces 40 Parts Storage Room 5 Lens body 51C Rear side standing plate (support plate) 10 Housing body 71, 7 First gap filler (first thermal conductive member, thermal conductive member) 72, 7 Second gap filler (second thermal conductive member, thermal conductive member)

Claims

1. A substrate on which electrical components are mounted; a bus bar electrically connected to the substrate; a housing body having a component accommodating chamber that accommodates the board and the bus bar, A terminal unit characterized in that the component storage chamber is provided with a thermal conductive member between the board and the housing body, in contact with both, and which conducts heat from the board to the housing body.

2. The electrical component is provided in plurality, the bus bar has a pair of clamping pieces that sandwich the substrate and are electrically connected to the substrate, the heat conduction member includes a first heat conduction member provided in contact with one surface of the substrate, and a second heat conduction member provided in contact with the other surface of the substrate; the first thermal conductive member is provided between one of the electrical components and one of the pair of clamping pieces in the extending direction of the board, The terminal unit according to claim 1, wherein the second thermal conductive member is provided between another one of the electrical components and the other of the pair of clamping pieces in the direction in which the board extends.

3. one of the plurality of electrical components is an LED component; a lens body including a lens disposed at a position separated from the substrate and sandwiching the LED component therebetween; The lens body is provided with a support plate that supports the lens, the support plate is provided on the bus bar side of the LED component in the extending direction of the substrate, 3. The terminal unit according to claim 2, wherein the support plate has an inflow prevention function for preventing the molten heat conduction member from flowing into the LED component.

4. A method for manufacturing the terminal unit according to any one of claims 1 to 3, comprising: The method for manufacturing a terminal unit is characterized in that the thermally conductive material is injected into the component-receiving chamber in a molten state.

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