Electronic component

Abstract

To provide an electronic component that includes a first main body and a second main body and that can have desired characteristics on the whole by elements in the first main body.SOLUTION: An electronic component 1 comprises: a first main body 50 including a capacitor C1; a second main body 50 including an acoustic wave element 31; and a band-pass filter circuit 5 including the capacitor C1 and the acoustic wave element 31. The first main body 50 further includes a first columnar conductor T1 connected to the ground. The capacitor C1 includes capacitor conductor layers C1a, C1b. The capacitor conductor layers C1a, C1b are arranged between the acoustic wave element 31 and the first columnar conductor T1.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to an electronic component having a main body and components mounted on the main body. [Background technology]

[0002] Filters such as low-pass filters, high-pass filters, and band-pass filters are constructed using multiple resonators. Examples of resonators used in these filters include LC resonators constructed using inductors and capacitors, and acoustic wave resonators constructed using acoustic wave elements. An acoustic wave element is an element that utilizes acoustic waves. Acoustic wave elements include surface acoustic wave elements that utilize surface acoustic waves and bulk acoustic wave elements that utilize bulk acoustic waves.

[0003] Patent Document 1 discloses a multilayer bandpass filter including multiple LC parallel resonators in which adjacent LC parallel resonators are coupled to each other. The LC parallel resonators are composed of a capacitor electrode and an inductor electrode. The inductor electrode is coiled and includes a via electrode that runs in the stacking direction of the dielectric layers and a line electrode that extends perpendicular to the stacking direction of the dielectric layers.

[0004] Patent Document 2 discloses an acoustic wave filter made up of a surface acoustic wave filter having a ladder-type circuit configuration, and an acoustic wave filter made up of a longitudinally coupled surface acoustic wave resonator filter. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2007 / 119356 [Patent Document 2] International Publication No. 2013 / 061694 Summary of the Invention [Problem to be solved by the invention]

[0006] As a filter device, in addition to a filter device configured using only LC resonators or only acoustic wave resonators, a hybrid filter device configured using LC resonators and acoustic wave resonators is known. In a hybrid filter device, for example, a second body including an acoustic wave resonator is mounted on a first body including an LC resonator.

[0007] Generally, the overall characteristics of a filter device are adjusted by adjusting the characteristics of each of the multiple elements of the filter device. In hybrid filter devices, the characteristics of the LC resonator and the acoustic wave resonator are adjusted separately. However, depending on the product, it may be difficult to adjust the overall characteristics using only the characteristics of the acoustic wave resonator, or it may be difficult to adjust the characteristics of the acoustic wave resonator itself.

[0008] The above problem is not limited to cases where the second body includes an acoustic wave resonator, but also applies to cases where it is difficult to adjust the entire structure using only the characteristics of the elements included in the second body, or where it is difficult to adjust the characteristics of the elements included in the second body.

[0009] The present invention has been made in consideration of such problems, and its object is to provide an electronic component that includes a first body and a second body mounted on the first body, and that is capable of adjusting the characteristics of the entire electronic component to desired characteristics by using elements within the first body. [Means for solving the problem]

[0010] An electronic component according to a first aspect of the present invention comprises a first body including a plurality of stacked dielectric layers and a first element, a second body mounted on the first body and including a second element, and a circuit including the first element and the second element. The first body further includes a first columnar conductor extending in a direction parallel to the stacking direction of the plurality of dielectric layers and connected to ground. The first element is a capacitor including a capacitor conductor layer extending in an orthogonal direction perpendicular to the stacking direction. The capacitor conductor layer is disposed between the second element and the first columnar conductor.

[0011] An electronic component according to a second aspect of the present invention includes a first body including a plurality of dielectric layers, a capacitor, and an inductor, a second body mounted on the first body and including an acoustic wave element, and a circuit. The circuit includes a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port. The acoustic wave element is disposed between the signal path and ground in the circuit configuration. The capacitor and inductor are connected in series and are disposed between the acoustic wave element and ground in the circuit configuration. [Effects of the Invention]

[0012] In the electronic component according to the first aspect of the present invention, the capacitor conductor layer is disposed between the second element and the first columnar conductor, thereby achieving the desired characteristics of the entire electronic component.

[0013] In the electronic component according to the second aspect of the present invention, the capacitor and inductor are connected in series and are provided between the acoustic wave element and ground in the circuit configuration, thereby achieving the desired characteristics of the entire electronic component. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a perspective view showing an electronic component according to an embodiment of the present invention; [Figure 2] FIG. 2 is a perspective view showing a first main body according to the embodiment of the present invention. [Figure 3] FIG. 2 is a perspective view showing a first main body according to the embodiment of the present invention. [Figure 4] 1 is a block diagram conceptually showing a circuit configuration of a bandpass filter circuit according to an embodiment of the present invention; [Figure 5] FIG. 10 is a circuit diagram showing an example of a configuration of a third circuit portion in an embodiment of the present invention. [Figure 6] FIG. 2 is a perspective view showing a part of the inside of a first main body according to the embodiment of the present invention. [Figure 7] FIG. 2 is a plan view showing a part of the inside of a first main body according to the embodiment of the present invention. [Figure 8] FIG. 2 is a side view showing a part of the inside of a first main body according to the embodiment of the present invention. [Figure 9] FIG. 10 is a characteristic diagram showing the pass attenuation characteristics of the sub-circuit obtained by a first simulation. [Figure 10] FIG. 10 is a characteristic diagram showing the pass attenuation characteristics of the sub-circuit obtained by a second simulation. [Figure 11] FIG. 10 is a characteristic diagram showing the return loss characteristics of the sub-circuit obtained by a second simulation. [Figure 12] FIG. 10 is a side view showing a part of the inside of a first main body in a first modified example of an electronic component according to an embodiment of the present invention. [Figure 13] FIG. 10 is a side view showing a part of the inside of a first body in a second modified example of an electronic component according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. First, the configuration of an electronic component 1 according to an embodiment of the present invention will be described with reference to Figs. 1 to 3. Fig. 1 is a perspective view showing the electronic component 1. Figs. 2 and 3 are perspective views showing a first main body.

[0016] The electronic component 1 according to this embodiment includes a first body 50 and a second body 80 mounted on the first body 50. The electronic component 1 further includes a circuit including a plurality of elements provided in the first body 50 and at least one element provided in the second body 80. In this embodiment, the electronic component 1 includes, as the circuit, a bandpass filter circuit 5 that selectively passes signals of frequencies within a predetermined passband. The bandpass filter circuit 5 is shown in FIG. 4, which will be described later.

[0017] The first body 50 includes a plurality of laminated dielectric layers and a plurality of conductors (a plurality of conductor layers and a plurality of through holes). Each of the plurality of dielectric layers is made of a dielectric material. In this embodiment, for example, low-temperature co-fired ceramics (LTCC) is used as the dielectric material. The relative permittivity of the dielectric material may be, for example, 8 or more, and is preferably 10 or more.

[0018] The first body 50 has a first surface 50A and a second surface 50B located at both ends in the stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the first surface 50A and the second surface 50B. The side surfaces 50C and 50D face in opposite directions from each other, and the side surfaces 50E and 50F also face in opposite directions from each other. The side surfaces 50C to 50F are perpendicular to the first surface 50A and the second surface 50B.

[0019] Here, the X direction, Y direction, and Z direction are defined as shown in FIGS. 1 to 3. The X direction, Y direction, and Z direction are perpendicular to one another. In this embodiment, a direction parallel to the stacking direction T is defined as the Z direction. The Z direction is also a direction parallel to the direction in which the first main body 50 and the second main body 80 are aligned. The direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. The expression "when viewed from a predetermined direction (e.g., the stacking direction T)" means viewing an object from a position away from the predetermined direction or a direction parallel to the predetermined direction.

[0020] As shown in Figures 1 to 3, the first surface 50A is located at the end of the first main body 50 in the Z direction. The first surface 50A is both the top surface of the first main body 50 and the mounting surface for mounting the second main body 80. The second surface 50B is located at the end of the first main body 50 in the -Z direction. The second surface 50B is also the bottom surface of the first main body 50. Figure 2 shows the first main body 50 as viewed from the first surface 50A side. Figure 3 shows the first main body 50 as viewed from the second surface 50B side.

[0021] The side surface 50C is located at the end of the first main body 50 in the -X direction. The side surface 50D is located at the end of the first main body 50 in the X direction. The side surface 50E is located at the end of the first main body 50 in the -Y direction. The side surface 50F is located at the end of the first main body 50 in the Y direction.

[0022] The first body 50 further includes a plurality of electrodes 111, 112, 113, 114, 115, 116, 117, 118, and 119 provided on the second surface 50B of the first body 50. The electrodes 111, 112, and 113 are arranged in this order in the X direction at positions closer to the side surface 50E than to the side surface 50F. The electrodes 115, 116, and 117 are arranged in this order in the -X direction at positions closer to the side surface 50F than to the side surface 50E.

[0023] Electrode 114 is disposed between electrode 113 and electrode 115. Electrode 118 is disposed between electrode 111 and electrode 117. Electrode 119 is disposed between electrode 112 and electrode 116. Electrode 119 is disposed approximately in the center of second surface 50B.

[0024] The first body 50 further includes four electrodes 121, 122, 123, and 124 provided on the first surface 50A of the first body 50. The electrodes 121 and 122 are arranged in this order in the X direction at positions closer to the side surface 50E than to the side surface 50F. The electrodes 123 and 124 are arranged in this order in the -X direction at positions further ahead of the electrodes 121 and 122 in the Y direction.

[0025] The second body 80 further includes four electrodes 81, 82, 83, and 84. When the second body 80 is mounted on the first body 50, the electrodes 81 to 84 face the electrodes 121 to 124 of the first body 50, respectively. The electrodes 81 to 84 are physically connected to the electrodes 121 to 124 by, for example, solder bumps 7.

[0026] The size of the planar shape of the first main body 50 (the shape when viewed from the stacking direction T) is different from the size of the planar shape of the second main body 80. In the example shown in FIG.

[0027] 1, the second main body 80 is disposed so as to overlap the center of gravity of the first surface 50A when viewed from the stacking direction T. The center of gravity of the second main body 80 when viewed from the stacking direction T may or may not coincide with the center of gravity of the first surface 50A.

[0028] The electronic component 1 may further include a sealing portion (not shown) that seals the second body 80. The sealing portion (not shown) covers the periphery of the second body 80 and at least a part of the first surface 50A of the first body 50. The sealing portion may also cover the side surfaces 50C to 50F of the first body 50. The sealing portion is made of, for example, resin.

[0029] Next, the circuit configuration of the bandpass filter circuit 5 of the electronic component 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram conceptually showing the circuit configuration of the bandpass filter circuit 5. The bandpass filter circuit 5 includes a first signal port 2, a second signal port 3, and a signal path 4 connecting the first signal port 2 and the second signal port 3.

[0030] Each of the first and second signal ports 2 and 3 is a port for inputting or outputting a signal. That is, when a signal is input to the first signal port 2, the signal is output from the second signal port 3. When a signal is input to the second signal port 3, the signal is output from the first signal port 2.

[0031] 2 and 3, two electrodes correspond to the first and second signal ports 2 and 3. The remaining seven electrodes among the electrodes 111 to 119 other than the two electrodes may be connected to ground.

[0032] The bandpass filter circuit 5 further includes a first circuit portion 10, a second circuit portion 20, and a third circuit portion 30. The first circuit portion 10 and the second circuit portion 20 are provided on the signal path 4. The third circuit portion 30 is provided between the signal path 4 and ground in terms of the circuit configuration. Note that in this application, the expression "in terms of the circuit configuration" is used to refer to the arrangement on a circuit diagram, not the arrangement in a physical configuration.

[0033] The first circuit portion 10 has a first end 10a and a second end 10b. The second circuit portion 20 has a first end 20a and a second end 20b. The third circuit portion 30 has a first end 30a and a second end 30b. The first end 10a of the first circuit portion 10 is connected to the first signal port 2. The first end 20a of the second circuit portion 20 is connected to the second end 10b of the first circuit portion 10. The second end 20b of the second circuit portion 20 is connected to the second signal port 3.

[0034] The first end 30a of the third circuit portion 30 is connected to the signal path 4 between the second end 10b of the first circuit portion 10 and the first end 20a of the second circuit portion 20. The second end 30b of the third circuit portion 30 is connected to ground.

[0035] The band-pass filter circuit 5 is composed of first to third circuit portions 10, 20, and 30. The band-pass filter circuit 5 can be composed, for example, by connecting a high-pass filter circuit and a low-pass filter circuit in series. One of the first circuit portion 10 and the second circuit portion 20 may be a high-pass filter circuit. The other of the first circuit portion 10 and the second circuit portion 20 may be a low-pass filter circuit. Alternatively, at least one of the first circuit portion 10 and the second circuit portion 20 may be a circuit including a high-pass filter circuit and a low-pass filter circuit.

[0036] The first circuit portion 10 and the second circuit portion 20 include a plurality of elements provided in the first body 50. The plurality of elements includes a plurality of inductors and a plurality of capacitors. The plurality of inductors are formed by a plurality of conductors in the first body 50. The plurality of capacitors are formed by a plurality of conductors and a plurality of dielectrics in the first body 50. Each of the plurality of dielectrics is a part of a plurality of dielectric layers that make up the first body 50.

[0037] At least one of the first circuit portion 10 and the second circuit portion 20 may further include at least one element disposed within a second body 80 .

[0038] The third circuit portion 30 includes a first element provided in the first body 50 and a second element provided in the second body 80. The first element and the second element are connected via some of the plurality of electrodes 81 to 84 shown in FIG. 1 and some of the plurality of electrodes 121 to 124 shown in FIGS. 2 and 3.

[0039] In this embodiment, the first element is a capacitor, and the second element is an acoustic wave element. The capacitor includes a plurality of capacitor conductor layers and a dielectric within a first body 50. Each of the plurality of capacitor conductor layers extends along an orthogonal direction perpendicular to the stacking direction T. The dielectric interposed between the plurality of capacitor conductor layers is part of the plurality of dielectric layers that make up the first body 50. Hereinafter, the dielectric of the capacitor (first element) will be referred to as the first dielectric. The first dielectric can be made of various ceramic materials, various glass ceramic materials used in low-temperature co-fired ceramics (LTCC), or a mixture thereof.

[0040] An acoustic wave element includes a dielectric. Hereinafter, the dielectric of the acoustic wave element (second element) will be referred to as the second dielectric. The acoustic wave element may be a bulk acoustic wave element or a surface acoustic wave element. In a bulk acoustic wave element, the vibration of the second dielectric is utilized. In a surface acoustic wave element, the second dielectric is utilized as a substrate. As the second dielectric, a dielectric generally used in an acoustic wave element can be used.

[0041] FIG. 5 shows an example of the configuration of the third circuit portion 30. In FIG. 5, reference numeral C1 denotes a capacitor serving as a first element, and reference numeral 31 denotes an acoustic wave element serving as a second element. The third circuit portion 30 further includes an inductor L1. The inductor L1 is provided within the first body 50.

[0042] Capacitor C1 and acoustic wave element 31 are connected in series and are provided between signal path 4 and ground in the circuit configuration. Capacitor C1 and inductor L1 are also connected in series and are provided between acoustic wave element 31 and ground in the circuit configuration. In the example shown in FIG. 5 , one end of acoustic wave element 31 is connected to first end 30a of third circuit portion 30. One end of capacitor C1 is connected to the other end of acoustic wave element 31. One end of inductor L1 is connected to the other end of capacitor C1. The other end of inductor L1 is connected to second end 30b of third circuit portion 30.

[0043] The inductor L1 may include multiple inductor portions, which may be connected in parallel to one another in a circuit configuration, as will be described later.

[0044] Next, structural features of the electronic component 1 according to this embodiment will be described with reference to Figures 6 to 8. Figure 6 is a perspective view showing a part of the interior of the first main body 50. Figure 7 is a plan view showing a part of the interior of the first main body 50. Figure 8 is a side view showing a part of the interior of the first main body 50.

[0045] First, the structure of the capacitor C1 will be described. The capacitor C1 is composed of capacitor conductor layers C1a and C1b that are arranged at a predetermined interval in the stacking direction T and face each other, and a dielectric between the capacitor conductor layers C1a and C1b. Each of the capacitor conductor layers C1a and C1b extends along an orthogonal direction that is perpendicular to the stacking direction T.

[0046] As shown in FIG. 8, the capacitor conductor layers C1a and C1b are arranged in this order along the Z direction. The capacitor conductor layer C1a is disposed between the capacitor conductor layer C1b and the first surface 50A. As shown in FIG. 7, the capacitor conductor layer C1a overlaps the capacitor conductor layer C1b when viewed from the Z direction. In particular, in this embodiment, the planar shapes of the capacitor conductor layer C1a (when viewed from the Z direction) and the capacitor conductor layer C1b are similar. In the example shown in FIG. 7, the planar shapes of the capacitor conductor layer C1a and the capacitor conductor layer C1b are both L-shaped. The planar shape of the capacitor conductor layer C1a is larger than the planar shape of the capacitor conductor layer C1b. The capacitor conductor layer C1a overlaps the entire capacitor conductor layer C1b when viewed from the Z direction.

[0047] Capacitor conductor layer C1a is electrically connected to electrode 121 via a conductor such as a through hole. Although not shown, acoustic wave element 31 is electrically connected to electrode 81. Therefore, capacitor C1 is connected in series to acoustic wave element 31 via electrodes 81 and 121.

[0048] Next, the structure of the inductor L1 will be described. The inductor L1 includes a first inductor portion L1a and a second inductor portion L1b connected in parallel to each other. Here, a columnar structure formed by connecting multiple through holes in series is called a columnar conductor. The columnar conductor extends in a direction parallel to the stacking direction T. The first body 50 includes a first columnar conductor T1 and a second columnar conductor T2. The first inductor portion L1a is formed by the first columnar conductor T1. The second inductor portion L1b is formed by the second columnar conductor T2.

[0049] 8, the first columnar conductor T1 is disposed between the capacitor conductor layer C1a and the second surface 50B of the first body 50. The first columnar conductor T1 has a first end T1a and a second end T1b located on opposite sides in a direction parallel to the stacking direction T. The first end T1a of the first columnar conductor T1 is electrically connected to the capacitor conductor layer C1b via a conductor such as a through hole.

[0050] 8, the second columnar conductor T2 is disposed between the capacitor conductor layer C1a and the second surface 50B of the first body 50. The second columnar conductor T2 has a first end T2a and a second end T2b located on opposite sides in a direction parallel to the stacking direction T. The first end T2a of the second columnar conductor T2 is electrically connected to the capacitor conductor layer C1b via a conductor such as a through hole.

[0051] As described above, the first end T1a of the first columnar conductor T1 and the first end T2a of the second columnar conductor T2 are connected to the capacitor conductor layer C1b via a conductor such as a through hole. The capacitor conductor layer C1b serves as both the "capacitor conductor layer" and the "first conductor layer" in the present invention.

[0052] The first body 50 further includes a conductor layer 11 extending along a direction perpendicular to the stacking direction T. A second end T1b of the first columnar conductor T1 and a second end T2b of the second columnar conductor T2 are electrically connected to the conductor layer 11. The conductor layer 11 is connected to ground via a conductor such as a through-hole and some of the electrodes 111-119. The first columnar conductor T1 and the second columnar conductor T2 are connected in parallel to each other via the capacitor conductor layer C1b, the conductor layer 11, and a conductor such as a through-hole. The first columnar conductor T1 and the second columnar conductor T2 are also connected to ground via the conductor layer 11, a conductor such as a through-hole, and some of the electrodes 111-119. The conductor layer 11 corresponds to the "second conductor layer" of the present invention.

[0053] The first end T1a of the first columnar conductor T1 may be directly connected to the capacitor conductor layer C1b without a conductor such as a through-hole. Similarly, the first end T2a of the second columnar conductor T2 may be directly connected to the capacitor conductor layer C1b without a conductor such as a through-hole.

[0054] Next, features related to the arrangement of capacitor C1 and acoustic wave element 31 will be described. In FIG. 7, the area surrounded by a two-dot chain rectangle labeled 80 indicates the area on first surface 50A of first body 50 where second body 80 is mounted. When viewed from stacking direction T, second body 80 overlaps a portion of capacitor C1. Although not shown, acoustic wave element 31 is arranged ahead of capacitor C1 in the Z direction. No element is arranged between capacitor C1 and acoustic wave element 31.

[0055] The capacitor conductor layers C1a and C1b constituting the capacitor C1 are disposed between the acoustic wave element 31 and the first and second columnar conductors T1 and T2 constituting the first and second inductor portions L1a and L1b. The capacitor conductor layers C1a and C1b entirely cover the first and second columnar conductors T1 and T2 when viewed from the Z direction.

[0056] Next, the operation and effect of electronic component 1 according to this embodiment will be described. In this embodiment, capacitor conductor layers C1a and C1b are disposed between acoustic wave element 31 and first and second columnar conductors T1 and T2. This configuration suppresses magnetic coupling between acoustic wave element 31 and first and second columnar conductors T1 and T2. As a result, this embodiment suppresses deviations of the overall characteristics of electronic component 1 from desired characteristics due to magnetic coupling between acoustic wave element 31 and first and second columnar conductors T1 and T2. In other words, this embodiment allows capacitor conductor layers C1a and C1b to achieve desired overall characteristics of electronic component 1.

[0057] Furthermore, in this embodiment, the first end T1a of the first columnar conductor T1 and the first end T2a of the second columnar conductor T2 are both connected to the capacitor conductor layer C1b, and the second end T1b of the first columnar conductor T1 and the second end T2b of the second columnar conductor T2 are both connected to the conductor layer 11. Therefore, in this embodiment, the direction of current flow in the first columnar conductor T1 and the direction of current flow in the second columnar conductor T2 are aligned, and the magnetic fields generated around the first columnar conductor T1 and the second columnar conductor T2 cancel each other out. This also prevents the overall characteristics of the electronic component 1 from deviating from the desired characteristics due to magnetic coupling between the acoustic wave element 31 and the first and second columnar conductors T1 and T2. That is, in this embodiment, the capacitor conductor layer C1b, the first and second columnar conductors T1 and T2, and the conductor layer 11 enable the overall characteristics of the electronic component 1 to be adjusted to the desired characteristics.

[0058] In this embodiment, acoustic wave element 31 is provided between signal path 4 and ground in the circuit configuration, and capacitor C1 and inductor L1 are connected in series and are provided between acoustic wave element 31 and ground in the circuit configuration. Capacitor C1 has the function of increasing the resonant frequency of the sub-circuit including third circuit portion 30. This function will be described below with reference to the results of a first simulation.

[0059] The first simulation used a sub-circuit model including a third circuit portion 30. The sub-circuit model includes a first signal port, a second signal port, a signal path connecting the first signal port and the second signal port, and a third circuit portion 30 provided between the signal path and ground. In the sub-circuit model, the third circuit portion 30 includes an acoustic wave element provided between the signal path and ground, and a capacitor provided between the signal path and the acoustic wave element.

[0060] In the first simulation, the bandpass attenuation characteristics of the sub-circuit were calculated using the above-described sub-circuit model while varying the capacitance of the capacitor within a range of 0.3 to ∞ pF. The bandpass attenuation characteristics when the capacitance of the capacitor is ∞ pF represent the bandpass attenuation characteristics when no capacitor is provided. In the first simulation, the Q value of the resonant frequency and the Q value of the antiresonant frequency of the acoustic wave element are each set to 300, and the electromechanical coupling coefficient of the acoustic wave element is set to 0.091.

[0061] Figure 9 is a characteristic diagram showing the pass attenuation characteristics of the sub-circuit obtained by the first simulation. In Figure 9, the horizontal axis represents frequency and the vertical axis represents attenuation. In Figure 9, reference numeral 91 represents the pass attenuation characteristics when the capacitor capacitance is ∞ pF, reference numeral 92 represents the pass attenuation characteristics when the capacitor capacitance is 10 pF, reference numeral 93 represents the pass attenuation characteristics when the capacitor capacitance is 3 pF, reference numeral 94 represents the pass attenuation characteristics when the capacitor capacitance is 1 pF, and reference numeral 95 represents the pass attenuation characteristics when the capacitor capacitance is 0.3 pF.

[0062] 9, the resonant frequency of the sub-circuit increases as the capacitance of the capacitor decreases. According to this embodiment, the capacitor can adjust the resonant frequency of the sub-circuit including the third circuit portion 30. In particular, the resonant frequency of the sub-circuit in which the capacitor is provided is higher than the resonant frequency of the sub-circuit in which the capacitance of the capacitor is ∞ pF, i.e., in which no capacitor is provided.

[0063] The characteristics of the sub-circuit can also be adjusted by using an acoustic wave element. A second simulation is described below, which examines the characteristics of the sub-circuit when the characteristics of the acoustic wave element are changed. In the second simulation, a sub-circuit model is used to determine the band attenuation and return loss characteristics of the sub-circuit for the first case, where the capacitance of the capacitor is 0.3 pF, the Q value of the resonant frequency and the Q value of the anti-resonant frequency of the acoustic wave element are each 500, and the electromechanical coupling coefficient of the acoustic wave element is 0.13. In the second simulation, a sub-circuit model is used to determine the band attenuation and return loss characteristics of the sub-circuit for the second case, where the capacitance of the capacitor is 0.3 pF, the Q value of the resonant frequency and the Q value of the anti-resonant frequency of the acoustic wave element are each 300, and the electromechanical coupling coefficient of the acoustic wave element is 0.091.

[0064] FIG. 10 is a characteristic diagram showing the pass attenuation characteristics of the sub-circuit obtained by the second simulation. FIG. 11 is a characteristic diagram showing the return attenuation characteristics of the sub-circuit obtained by the second simulation. In FIGS. 10 and 11, the horizontal axis represents frequency and the vertical axis represents attenuation. In addition, in FIGS. 10 and 11, the solid curves represent the characteristics in the first case, and the dashed curves represent the characteristics in the second case. As can be seen from FIGS. 10 and 11, the characteristics of the sub-circuit can also be adjusted by an acoustic wave element.

[0065] As can be seen from the results of the first and second simulations, according to this embodiment, the characteristics of the sub-circuit can be adjusted by using capacitor C1 and acoustic wave element 31.

[0066] Next, other effects of this embodiment will be described. Dielectrics have characteristics that change depending on temperature. Therefore, the bandpass filter circuit 5 configured with elements including a dielectric also has characteristics that change depending on temperature. Here, attention is focused on the resonance frequency of the dielectric material. The temperature coefficient of resonance frequency (TCF) is an index that indicates the temperature dependency of the resonance frequency of a dielectric material. The temperature coefficient of resonance frequency (TCF) (unit: ppm / K) is expressed by the following formula (1), as defined in JIS Standard R1627 (Test method for dielectric properties of fine ceramics for microwave use). Note that f ref is the reference temperature t ref represents the resonant frequency at T represents the resonant frequency at a given temperature t.

[0067] TCF=[(f T -f ref ) / {f ref (tt ref )}]×10 6 …(1)

[0068] Generally, the temperature dependence of the pass attenuation characteristics of bandpass filter circuit 5 can be suppressed by using an element containing a dielectric with a small absolute value of the temperature coefficient of resonance frequency (TCF). However, depending on the element, it may be difficult to use a dielectric with a small absolute value of the temperature coefficient of resonance frequency (TCF). The absolute value of the temperature coefficient of resonance frequency (TCF) can be reduced by combining materials with different temperature coefficients of resonance frequency (TCF). However, constructing acoustic wave element 31 using a dielectric material that combines multiple materials increases the cost of acoustic wave element 31. Another problem is that it is difficult to achieve a combination of materials that satisfies the characteristics of acoustic wave element 31 and bandpass filter circuit 5.

[0069] In this embodiment, the first dielectric used in capacitor C1 (first element) is made of a first dielectric material having a temperature coefficient of resonant frequency TCF of a first value, and the second dielectric used in acoustic wave element 31 (second element) is made of a second dielectric material having a temperature coefficient of resonant frequency TCF of a second value.

[0070] The first and second dielectrics may be selected so that the absolute value of the sum of the first and second values ​​or the absolute value of the average of the first and second values ​​is smaller than the absolute value of the second value. Even if it is difficult to reduce the absolute value of the temperature coefficient (TCF) of the resonant frequency of one of the first and second dielectrics, selecting the other of the first and second dielectrics so as to satisfy the above-mentioned requirements can prevent changes in the characteristics (resonant frequency) of the sub-circuit including the third circuit portion 30. As a result, according to this embodiment, it is possible to prevent changes in the pass attenuation characteristics of the band-pass filter circuit 5 due to temperature.

[0071] For example, if one of the first value and the second value is negative, the absolute value of the sum of the first value and the second value can be made smaller than the absolute value of the second value by making the other of the first value and the second value positive. In one example, the first value is 40 ppm / K and the second value is −25 ppm / K.

[0072] Furthermore, when both the first value and the second value are negative, the absolute value of the average of the first value and the second value can be made smaller than the absolute value of the second value by making the absolute value of the first value smaller than the absolute value of the second value. In one example, the first value is −5 ppm / K and the second value is −25 ppm / K.

[0073] The sum of the first value and the second value and the average value of the first value and the second value may both be within the range of, for example, −75 to 40 ppm / K.

[0074] [Variations] Next, first and second modified examples of the electronic component 1 according to the present embodiment will be described. First, the first modified example will be described with reference to FIG. 12. FIG. 12 is a side view showing a part of the interior of the first body 50 in the first modified example. In the first modified example, instead of the first and second inductor portions L1a and L1b, the inductor L1 includes inductor portions L1a1 and L1b1 connected in parallel to each other, inductor portions L1a2 and L1b2 connected in parallel to each other, and inductor portions L1a3 and L1b3 connected in parallel to each other.

[0075] In the first modification, the first body 50 includes pillar conductors T1A, T1B, T1C, T2A, T2B, and T2C instead of the first and second pillar conductors T1 and T2. The inductor portions L1a1, L1a2, and L1a3 are respectively formed by the pillar conductors T1A, T1B, and T1C. The inductor portions L1b1, L1b2, and L1b3 are respectively formed by the pillar conductors T2A, T2B, and T2C.

[0076] The columnar conductors T1A, T1B, and T1C are arranged in this order along the Z direction. In the example shown in Fig. 12, the columnar conductors T1A and T1C are arranged at the same position in a direction parallel to the Y direction. The columnar conductor T1B is arranged ahead of the columnar conductors T1A and T1C in the Y direction.

[0077] The columnar conductor T1A has a first end T1Aa and a second end T1Ab located on opposite sides in a direction parallel to the stacking direction T. The columnar conductor T1B has a first end and a second end located on opposite sides in a direction parallel to the stacking direction T. The columnar conductor T1C has a first end and a second end located on opposite sides in a direction parallel to the stacking direction T.

[0078] The columnar conductors T2A, T2B, and T2C are arranged in this order along the Z direction. In the example shown in Fig. 12, the columnar conductors T2A and T2C are arranged at the same position in a direction parallel to the Y direction. The columnar conductor T2B is arranged ahead of the columnar conductors T2A and T2C in the -Y direction.

[0079] The columnar conductor T2A has a first end T2Aa and a second end T2Ab located on opposite sides in a direction parallel to the stacking direction T. The columnar conductor T2B has a first end and a second end located on opposite sides in a direction parallel to the stacking direction T. The columnar conductor T2C has a first end and a second end located on opposite sides in a direction parallel to the stacking direction T.

[0080] A first end T1Aa of the pillar-shaped conductor T1A and a first end T2Aa of the pillar-shaped conductor T2A are electrically connected to a capacitor conductor layer C1b that constitutes the capacitor C1.

[0081] In the first modified example, the first body 50 further includes two conductor layers 12 and 13 that extend along orthogonal directions that are orthogonal to the stacking direction T. The conductor layers 12 and 13 are disposed between the capacitor conductor layer C1b and the conductor layer 11. The conductor layer 12 is disposed closer to the capacitor conductor layer C1b than the conductor layer 13. The conductor layer 13 is disposed closer to the conductor layer 11 than the conductor layer 12.

[0082] The second end T1Ab of the columnar conductor T1A, the second end T2Ab of the columnar conductor T2A, the first end of the columnar conductor T1B, and the first end of the columnar conductor T2B are connected to the conductor layer 12. The second end of the columnar conductor T1B, the second end of the columnar conductor T2B, the first end of the columnar conductor T1C, and the first end of the columnar conductor T2C are connected to the conductor layer 13. The second end of the columnar conductor T1C and the second end of the columnar conductor T2C are connected to the conductor layer 11.

[0083] Next, a second modified example will be described with reference to Fig. 13. Fig. 13 is a side view showing a part of the interior of the first body 50 in the second modified example. In the second modified example, the second columnar conductor T2 is disposed ahead of the first columnar conductor T1 in the -Z direction. A first end T1a of the first columnar conductor T1 is electrically connected to the capacitor conductor layer C1b. A second end T2b of the second columnar conductor T2 is electrically connected to the conductor layer 11.

[0084] In the second modified example, the first body 50 includes a conductor layer 14 extending along a direction perpendicular to the stacking direction T. In the second modified example, the second end T1b of the first columnar conductor T1 and the first end T2a of the second columnar conductor T2 are electrically connected to the conductor layer 14.

[0085] The present invention is not limited to the above-described embodiment, and various modifications are possible. For example, the electronic component of the present invention is not limited to a band-pass filter, and can be applied to other filters such as low-pass filters and high-pass filters, and electronic components including multiple resonators, such as a branching filter that separates multiple signals of different frequency bands.

[0086] As described above, the electronic component according to a first aspect of the present invention includes a first body including a plurality of stacked dielectric layers and a first element, a second body mounted on the first body and including a second element, and a circuit including the first element and the second element. The first body further includes a first columnar conductor extending in a direction parallel to the stacking direction of the plurality of dielectric layers and connected to ground. The first element is a capacitor including a capacitor conductor layer extending in an orthogonal direction perpendicular to the stacking direction. The capacitor conductor layer is disposed between the second element and the first columnar conductor.

[0087] In the electronic component according to the first aspect of the present invention, the first body may further have a first surface on which the second body is mounted and a second surface opposite to the first surface, and the first columnar conductor may be disposed between the capacitor conductor layer and the second surface.

[0088] In the electronic component according to the first aspect of the present invention, the first columnar conductor may form an inductor. The circuit may further include an inductor.

[0089] In the electronic component according to the first aspect of the present invention, the second element may be connected to the capacitor conductor layer.

[0090] In the electronic component of the first aspect of the present invention, the first body may further include a first conductor layer extending along the orthogonal direction and a second columnar conductor extending in a direction parallel to the stacking direction. One end of the first columnar conductor and one end of the second columnar conductor may be connected to the first conductor layer. The first conductor layer and the capacitor conductor layer may face each other. The first body may further include a second conductor layer extending along the orthogonal direction. The other end of the first columnar conductor and the other end of the second columnar conductor may be connected to the second conductor layer. The first columnar conductor and the second columnar conductor may constitute a first inductor and a second inductor, respectively. The circuit may further include a first inductor and a second inductor. The first inductor and the second inductor may be connected in parallel to each other.

[0091] In the electronic component according to the first aspect of the present invention, the first body may further include a first conductor layer extending along the orthogonal direction, and the shape of the capacitor conductor layer when viewed from the stacking direction may be similar to the shape of the first conductor layer when viewed from the stacking direction.

[0092] In the electronic component according to the first aspect of the present invention, the circuit may further include a sub-circuit including a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port. The first element and the second element may be connected in series and may be provided between the signal path and ground in the circuit configuration. The resonant frequency of the sub-circuit may be higher than the resonant frequency of the sub-circuit when the first element is not provided.

[0093] In the electronic component according to the first aspect of the present invention, the second body may overlap a part of the first element when viewed in the stacking direction.

[0094] In the electronic component according to the first aspect of the present invention, the second element may be an acoustic wave element.

[0095] An electronic component according to a second aspect of the present invention includes a first body including a plurality of dielectric layers, a capacitor, and an inductor, a second body mounted on the first body and including an acoustic wave element, and a circuit. The circuit includes a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port. The acoustic wave element is disposed between the signal path and ground in the circuit configuration. The capacitor and inductor are connected in series and are disposed between the acoustic wave element and ground in the circuit configuration.

[0096] In the electronic component according to the second aspect of the present invention, the inductor may include a plurality of inductor portions, which may be connected in parallel to one another in terms of circuit configuration. [Explanation of symbols]

[0097] 1...electronic component, 2...first signal port, 3...second signal port, 4...signal path, 5...bandpass filter circuit, 7...solder bump, 10...first circuit portion, 20...second circuit portion, 30...third circuit portion, 31...acoustic wave element, 50...first body, 50A...first surface, 50B...second surface, 50C-50F...side surface, 80...second body, 81-84...signal terminal, 111-119, 121-124...electrode, C1...capacitor, L1...inductor.

Claims

1. a first body including a plurality of stacked dielectric layers and a first element; a second body mounted to the first body and including a second element; a circuit including the first element and the second element; the first body further includes a first columnar conductor extending in a direction parallel to a stacking direction of the plurality of dielectric layers and connected to ground; the first element is a capacitor including a capacitor conductor layer extending along an orthogonal direction orthogonal to the stacking direction, The electronic component is characterized in that the capacitor conductor layer is disposed between the second element and the first columnar conductor.

2. the first body further has a first surface on which the second body is mounted and a second surface opposite to the first surface; 2. The electronic component according to claim 1, wherein the first columnar conductor is disposed between the capacitor conductor layer and the second surface.

3. the first columnar conductor constitutes an inductor, 2. The electronic component according to claim 1, wherein the circuit further includes the inductor.

4. 2. The electronic component according to claim 1, wherein the second element is connected to the capacitor conductor layer.

5. the first body further includes a first conductor layer extending along the orthogonal direction and a second columnar conductor extending in a direction parallel to the stacking direction; 2. The electronic component according to claim 1, wherein one end of the first columnar conductor and one end of the second columnar conductor are connected to the first conductor layer.

6. 6. The electronic component according to claim 5, wherein the first conductor layer and the capacitor conductor layer face each other.

7. the first body further includes a second conductor layer extending along the orthogonal direction; 6. The electronic component according to claim 5, wherein the other end of the first columnar conductor and the other end of the second columnar conductor are connected to the second conductor layer.

8. the first columnar conductor and the second columnar conductor constitute a first inductor and a second inductor, respectively; the circuit further includes the first inductor and the second inductor; 6. The electronic component according to claim 5, wherein the first inductor and the second inductor are connected in parallel with each other.

9. the first body further includes a first conductor layer extending along the orthogonal direction; 2. The electronic component according to claim 1, wherein the shape of the capacitor conductor layer when viewed from the stacking direction is similar to the shape of the first conductor layer when viewed from the stacking direction.

10. the circuit further includes a sub-circuit including a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port; the first element and the second element are connected in series and are provided between the signal path and the ground in a circuit configuration; 2. The electronic component according to claim 1, wherein the resonant frequency of the sub-circuit is higher than the resonant frequency of the sub-circuit when the first element is not provided.

11. 2. The electronic component according to claim 1, wherein the second body overlaps a part of the first element when viewed from the stacking direction.

12. 12. The electronic component according to claim 1, wherein the second element is an acoustic wave element.

13. a first body including a plurality of dielectric layers, a capacitor, and an inductor; a second body mounted on the first body and including an acoustic wave element; a circuit; the circuit includes a first signal port, a second signal port, and a signal path connecting the first signal port and the second signal port; The acoustic wave element is provided between the signal path and ground in terms of the circuit configuration, The electronic component is characterized in that the capacitor and the inductor are connected in series and are provided between the acoustic wave element and the ground in a circuit configuration.

14. the inductor includes a plurality of inductor portions; 14. The electronic component according to claim 13, wherein the plurality of inductor portions are connected in parallel to one another in a circuit configuration.

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