Component mounting device and pocket detection method of embossed tape

Abstract

To detect a pocket formed in an embossed tape.SOLUTION: A component mounting device has a plurality of pockets which can store components respectively and sends out an embossed tap in which a hole is formed in the bottom surface of the pocket toward a component take-out position on a tape conveyance path. When the pocket exists in the component take-out position and the component is not stored in the pocket, a part below the component take-out position in the bottom surface of the tape conveyance path reflects light. When the pocket exists in the component take-out position and the component is stored in the pocket, at least a part of the component reflects the light. The component take-out position irradiated with the light by an illumination part for irradiating the component take-out position with the light is imaged. When it is detected from a captured image that the part of the bottom surface of the tape conveyance path reflects the light or at least a part of the component reflects the light, it is determined that the pocket exists in the component take-out position.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus and a method for detecting pockets on an embossed tape. [Background technology]

[0002] Patent document 1 discloses a component mounting device that feeds out a carrier tape, detects the number of times the carrier tape is fed out, and calculates the pitch between adjacent pockets formed on the carrier tape based on the number of feeds until at least a first pocket and a second pocket, which are adjacent to each other, are detected among a plurality of pockets on the carrier tape that can each store a component. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-181868 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, when the carrier tape is realized by paper tape, the paper tape is imaged to detect pockets, and the pocket pitch of the currently used paper tape (carrier tape) can be automatically calculated based on the number of feeds until two adjacent pockets are detected.

[0005] Here, components may be supplied using an embossed tape, which is a type of carrier tape. The embossed tape may be formed using a black resin or the like, with feed holes and pockets formed in the black resin material. When such an embossed tape is used, the component mounting device may not be able to detect the pockets formed in the embossed tape because the color (black) of the embossed tape itself shown in the captured image is similar to the colors of the feed holes and pockets formed in the embossed tape.

[0006] Furthermore, even if the embossed tape contains the same type of components, the pocket pitch may differ. This requires the operator to temporarily suspend production using the component mounting device and manually change the pitch setting for feeding the new embossed tape when switching to an embossed tape with a different pocket pitch, which is extremely time-consuming. This also reduces the operating rate of the component mounting device, posing the issue of reduced production efficiency for boards with mounted components.

[0007] The present disclosure has been devised in view of the above-described conventional circumstances, and aims to provide a component mounting device and a method for detecting pockets formed on an embossed tape. [Means for solving the problem]

[0008] The present disclosure provides a component mounting device comprising: a tape feeding unit that feeds out an embossed tape having a plurality of pockets each capable of storing a component, the pockets having holes formed in the bottom surfaces thereof, toward a component removal position on a tape transport path; an illumination unit that irradiates light onto the component removal position; an imaging unit that images the component removal position onto which the light is irradiated by the illumination unit; and a detection unit that determines whether the pocket is present at the component removal position based on the image captured by the imaging unit, wherein a portion of the bottom surface of the tape transport path below the component removal position reflects the light when the pocket is present at the component removal position and no component is stored in the pocket; and when the pocket is present at the component removal position and a component is stored in the pocket, at least a portion of the component reflects the light; and the detection unit determines that the pocket is present at the component removal position when it detects from the image that the portion of the bottom surface of the tape transport path is reflecting the light or that at least a portion of the component is reflecting the light.

[0009] The present disclosure also provides a method for detecting pockets on embossed tape performed by a component mounting device that mounts components on a board, the method comprising: feeding an embossed tape having a plurality of pockets each capable of storing a component, with holes formed in the bottom surfaces of the pockets, toward a component removal position on a tape transport path; irradiating light onto the component removal position; capturing an image of the component removal position irradiated with the light; a portion of the bottom surface of the tape transport path below the component removal position reflecting the light if the pocket is present at the component removal position and no component is stored in the pocket; and if the pocket is present at the component removal position and a component is stored in the pocket, at least a portion of the component reflects the light; and determining, based on the captured image, that the pocket is present at the component removal position if it is detected from the captured image that the portion of the bottom surface of the tape transport path is reflecting the light or that at least a portion of the component is reflecting the light. [Effects of the Invention]

[0010] According to the present disclosure, the pitch between pockets formed on an embossed tape can be detected. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a plan view of a component mounting apparatus according to an embodiment; [Figure 2] 1 is a side view of a component mounting apparatus according to an embodiment; [Figure 3] FIG. 1 is a block diagram showing an example of the configuration of a control unit of a component mounting apparatus according to an embodiment; [Figure 4] 10A and 10B are diagrams illustrating a cover tape peeling operation and a component removal operation; [Figure 5] A diagram showing an example of an image of embossed tape [Figure 6] A diagram showing an example of embossed tape [Figure 7] A transparent view showing an example of a tape feeder [Figure 8] Diagram explaining an example of tape feeding for embossed tape [Figure 9] Diagram explaining an example of embossed tape switching [Figure 10] 1 is a flowchart showing an example of an operation procedure of a control unit according to an embodiment; [Figure 11] A diagram explaining the pitch calculation method [Figure 12] A diagram explaining the pitch calculation method [Figure 13] A diagram explaining the pitch calculation method DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, with reference to the drawings as appropriate, a detailed description of an embodiment specifically disclosing a component mounting apparatus and an embossed tape pocket detection method according to the present disclosure will be provided. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters or redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

[0013] The component mounting apparatus 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a plan view of the component mounting apparatus 1 according to the embodiment. Fig. 2 is a side view of the component mounting apparatus 1 according to the embodiment. Note that the component mounting apparatus 1 shown in Fig. 1 is an example and is not limited to this. For example, the component mounting apparatus 1 may be equipped with multiple mounting heads 8, or may be equipped with multiple board transport mechanisms 2 and be capable of producing multiple boards W.

[0014] The component mounting apparatus 1 includes a base 1A, a board transport mechanism 2, a component supply unit 4, a mounting head 8, a component recognition camera 9, a board recognition camera 10, a component mounting mechanism 12, and a tape feeding mechanism 20.

[0015] The base 1A has one Y-axis moving table 6 equipped with a linear drive mechanism and two X-axis moving tables 7 connected to one end of the top surface of the base 1A. Each of the two X-axis moving tables 7 has a mounting head 8 equipped with a suction nozzle 8A attached to its lower end.

[0016] The board transport mechanism 2 carries in and out the board W. The board transport mechanism 2 transports the carried-in board W to a mounting position for mounting components P. After mounting of all components P on the board W is completed, the board transport mechanism 2 carries the board W out of the component mounting apparatus 1.

[0017] The component supply unit 4 includes a carriage 3 and a tape feeder 5. The component supply unit 4 pulls out embossed tape 14 (see FIG. 6) from each of the feeder base 3A and the multiple reels 3C held by the reel holding unit 3B. The component supply unit 4 supplies components P by sending out the embossed tape 14 at a predetermined pitch toward a component pick-up position 5A, which is the pick-up position for components P. The component supply unit 4 includes multiple feeder bases 3A arranged side by side in a predetermined direction. Each of the multiple feeder bases 3A has a configuration in which a tape feeder 5 can be attached and detached.

[0018] When it is determined that the embossed tape 14 currently being used has been used up, the tape feeder 5 is a feeder that can automatically switch the embossed tape 14 used to supply the components P by pulling out new embossed tape 14 from the embossed tape stored on multiple reels 3C held in the reel holding unit 3B. The tape feeder 5 is realized by, for example, an intelligent feeder or an auto-loading feeder.

[0019] The mounting head 8 uses a suction nozzle 8A provided at the lower end to vacuum-suck and remove the component P accommodated in the pocket hole 15C of the embossed tape 14. The mounting head 8 moves above the board W while still holding the component P, releases the suction state of the component P, and mounts the component P at the component mounting position on the board W. The mounting head 8 also includes a board recognition camera 10, which will be described later, and an illumination 11 that illuminates the imaging area of ​​the board recognition camera 10.

[0020] The component recognition camera 9 is provided between the component supply unit 4 and the board transport mechanism 2. While the mounting head 8, which is holding the component P by suction, moves toward the board W, the component recognition camera 9 captures an image of the component P, which is held by suction on the suction nozzle 8A, from below at the timing when the component passes above the component recognition camera 9. Data of the captured image is input to the control unit 30.

[0021] The board recognition camera 10 is provided so as to be movable integrally with the mounting head 8, and, like the suction nozzle 8A, is provided on the underside of the mounting head 8, facing the board W or the embossed tape 14. The board recognition camera 10 captures images of the component storage pockets 15B formed on the embossed tape 14, which is fed out at regular intervals. The board recognition camera 10 captures images of the feed holes 15A or pocket holes 15C (see FIG. 6) that the embossed tape 14 has. Note that the board recognition camera 10 may also capture images of the component storage pockets 15B if the base tape 15 of the embossed tape 14 and the component storage pockets 15B formed on the base tape 15 can be distinguished.

[0022] The illuminator 11 is provided below the mounting head 8. The illuminator 11 is controlled by a control unit 30 (see FIG. 3) and illuminates the embossed tape 14 exposed from the opening 13A. The illuminator 11 is configured to have one or more light-emitting elements, such as light-emitting diodes (LEDs).

[0023] Next, the component removal operation of the component mounting apparatus 1 and the function of the control unit 30 will be described with reference to Figs. 3 to 6. Fig. 3 is a block diagram showing an example of the configuration of the control unit 30 of the component mounting apparatus 1 according to the embodiment. Fig. 4 is a diagram explaining the cover tape peeling operation and component removal operation of the component mounting apparatus 1 according to the embodiment. Fig. 5 is a diagram showing an example of an image of the embossed tape 14. Fig. 6 is a diagram showing an example of the embossed tape 14.

[0024] 4 and 5 show cross-sectional views of the tape feeder 5 near the component removal position 5A. Also, FIG. 6(a) shows a perspective view of the embossed tape 14 from which a portion of the cover tape 16 has been peeled off. FIG. 6(b) shows a side view of the embossed tape 14 from which a portion of the cover tape 16 has been peeled off. FIG. 6(c) is an enlarged view of FIG. 6(b), showing the positional relationship between the feed holes 15A, the component storage pockets 15B, and the pocket holes 15C.

[0025] In the component mounting apparatus 1, the pitch feeding operation is performed by the tape feeder 5, the mounting head 8, the pressing member 13, the embossed tape 14, and the tape feeding mechanism 20.

[0026] The tape feeder 5 is configured to have a tape running path 5B for feeding the embossed tape 14 in the direction toward the component removal position 5A for removing the component P. The tape running path 5B is formed of metal and has the function of guiding the embossed tape 14 fed from the lower surface toward the component removal position 5A. The component removal position 5A is the position where the component P is removed from the component storage pocket 15B formed on the embossed tape 14, and indicates the position where the board recognition camera 10 captures the image of the embossed tape 14.

[0027] Pressing member 13 is positioned on the upper surface of embossed tape 14 located on tape running path 5B, and is located before discharge sprocket 21. Pressing member 13 has opening 13A for removing components P from component removal position 5A. Pressing member 13 has the function of guiding embossed tape 14 from the upper surface when embossed tape 14 is sent toward component removal position 5A at a predetermined pitch.

[0028] Opening 13A is an opening through which components P stored in component storage pocket 15B are removed and through which board recognition camera 10 captures an image of embossed tape 14. A peeling section 13B is provided on the edge of opening 13A. Peeling section 13B has the function of peeling cover tape 16 from base tape 15 in conjunction with the feeding of embossed tape 14.

[0029] The embossed tape 14 is composed of a base tape 15 having a plurality of feed holes 15A into which pins 21A of the discharge sprocket 21 are inserted for pitch feeding, a plurality of component storage pockets 15B formed with recesses capable of storing components P, and a cover tape 16 that covers the top surfaces of the component storage pockets 15B. Each component storage pocket 15B has a pocket hole 15C on its bottom surface. The pocket hole 15C is hidden by the component P when the component is stored, and is exposed and can be imaged after the component P is removed. The embossed tape 14 may also have tape change holes (not shown) that indicate the start and end of the embossed tape 14.

[0030] The base tape 15 is formed so that the plurality of feed holes 15A and the plurality of component storage pockets 15B are arranged adjacent to each other at regular intervals. The intervals at which the plurality of feed holes 15A and the plurality of component storage pockets 15B are formed may be the same or different.

[0031] Cover tape 16 is formed from a single piece of tape, and covers the entire embossed tape 14 over the components P stored in component storage pocket 15B. Cover tape 16 is folded back at peeling portion 13B provided at opening 13A and pulled and peeled off in the tape feed direction (the direction of arrow A), which is opposite the direction in which embossed tape 14 is fed. As a result, cover tape 16 is peeled off from embossed tape 14 at peeling portion 13B, exposing components P stored in component storage pocket 15B, which can then be picked up by suction nozzle 8A.

[0032] The tape feeding mechanism 20 is composed of a rotary drive mechanism (not shown) and a feed sprocket 21 driven by the rotary drive mechanism. The feed sprocket 21 is driven by the rotary drive mechanism including a motor and feeds the embossed tape 14 at a predetermined pitch. The feed sprocket 21 has a plurality of feed pins 21A arranged at predetermined intervals. Each of the plurality of feed pins 21A is inserted into a corresponding one of a plurality of feed holes 15A formed in the base tape 15 and feeds the embossed tape 14 at the predetermined pitch by rotation by the rotary drive mechanism. It goes without saying that the predetermined intervals at which the plurality of feed pins 21A feed the embossed tape 14 at the predetermined intervals do not necessarily coincide with the predetermined intervals between the component storage pockets 15B formed in the base tape 15 (in other words, the embossed tape 14).

[0033] Mounting head 8 and suction nozzle 8A provided on mounting head 8 move up and down at component removal position 5A within the opening of opening 13A. Suction nozzle 8A descends to come into contact with component P, removes component P by vacuum suction, holds it by suction, and then rises. Board recognition camera 10, which moves integrally with mounting head 8, captures an image of embossed tape 14 exposed from opening 13A at component removal position 5A, which is the opening of opening 13A.

[0034] The control unit 30 controls each unit of the component mounting apparatus 1. The control unit 30 includes, as examples of each unit, a storage unit 31, a mechanism driving unit 32, an image capturing processing unit 34, and a pitch calculation unit 35. The control unit 30 is also externally connected to the board transport mechanism 2, the component mounting mechanism 12, the tape feed mechanism 20, the component recognition camera 9, and the board recognition camera 10 so as to be able to control each of them or to transmit and receive data therefrom.

[0035] The storage unit 31 has, for example, a random access memory (RAM) as a work memory used when executing each process of the control unit 30, and a read only memory (ROM) that stores programs and data that define the operation of the control unit 30. The RAM temporarily stores data or information generated or acquired by the control unit 30. The ROM has written therein a program that defines the operation of the control unit 30.

[0036] The storage unit 31 also stores mounting data 311, pitch sending data 312, etc., and stores data captured or detected by the externally connected component recognition camera 9 and board recognition camera 10.

[0037] The mounting data 311 is data for mounting components P on the board W. The mounting data 311 includes data related to the board W (e.g., the size of the board W), data related to the components P to be mounted on the board W (e.g., the type or shape), data related to the mounting position of the components P (e.g., the mounting orientation or mounting coordinates), and data related to the embossed tape 14 (e.g., the type or the number of components stored), etc. Based on the stored mounting data 311, the control unit 30 transmits control commands for mounting various components P to the board transport mechanism 2, the component mounting mechanism 12, and the tape feed mechanism 20 via the mechanism drive unit 32. Note that the mounting data 311 may be input from outside by a user or the like and stored.

[0038] The pitch sending data 312 is data relating to the length of the pitch (interval) that the mechanism driving unit 32 uses to cause the tape feeding mechanism 20 to send out the embossed tape 14 at a predetermined pitch. The pitch sending data 312 is the pitch of the component storage pockets 15B on the embossed tape 14 calculated by the pitch calculation unit 35. Note that if the types of pitches of the component storage pockets 15B on the embossed tape 14 used in the component mounting apparatus 1 are limited (for example, the pitches of the embossed tape 14 used are only 2 mm and 4 mm), the pitch sending data 312 may store information on all pitches in advance.

[0039] The mechanism drive unit 32 controls each of the board transport mechanism 2, the component mounting mechanism 12, and the tape feed mechanism 20. The mechanism drive unit 32 controls the board transport mechanism 2 to move the board W to the component mounting position. Based on the mounting data 311, the mechanism drive unit 32 controls the component mounting mechanism 12 to remove the component P from the component removal position 5A and mount the component P at the component mounting position on the board W. Based on the pitch calculated by the pitch calculation unit 35 (i.e., pitch feed data 312), the mechanism drive unit 32 controls the tape feed mechanism 20 to drive a rotation drive mechanism (not shown) and an output sprocket 21 driven by the rotation drive mechanism to feed the embossed tape 14 at a predetermined pitch.

[0040] The imaging processing unit 34 acquires data of the captured image captured by the board recognition camera 10. The imaging processing unit 34 processes the acquired captured image data. The imaging processing unit 34 also has a detection unit 341 as a functional configuration.

[0041] The detection unit 341 detects the detection target located at the component removal position 5A from the captured image captured by the board recognition camera 10. The detection target here is the component P or the pocket hole 15C, and specifically, the light irradiated by the illumination light 11 is reflected by metal such as an electrode or conductor of the component P, or the tape travel path 5B exposed from the pocket hole 15C.

[0042] When the detection unit 341 determines that the detection target has been detected by reflected light, it proceeds to the first pitch calculation process, generates a cut-out image of a first detection area that includes the component removal position 5A and is larger than the component P, and a cut-out image of a second detection area that includes the delivery position located one pitch in the feed direction for delivering the embossed tape 14 from the component removal position 5A and is larger than the component P, and outputs these cut-out images to the pitch calculation unit 35.

[0043] Furthermore, in the second and subsequent pitch calculation processes, the detection unit 341 detects the detection target from the first detection area in the captured image, that is, the component removal position 5A. The detection unit 341 outputs the detection result of the detection target to the pitch calculation unit 35.

[0044] In the first pitch calculation process executed after the detection target is detected at component removal position 5A, pitch calculation unit 35 performs template matching using the two cutout images output from detection unit 341 and determines whether the same detection target is captured in these two cutout images. If pitch calculation unit 35 determines through template matching that the detection targets captured in the two cutout images match, that is, that the same detection target is captured, it calculates that the pitch (spacing) of component storage pockets 15B on embossed tape 14 is 2 mm. Pitch calculation unit 35 outputs information on the calculated pitch (spacing) to storage unit 31 as pitch transmission data 312 for storage.

[0045] If the pitch calculation unit 35 determines in the first pitch calculation process that the detection target shown in the two cropped images does not match, it increments the number of times the embossed tape 14 has been fed from the time the detection unit 341 detected the detection target, and holds the current number of feeds. If the pitch calculation unit 35 obtains a detection result from the detection unit 341 in the second pitch calculation process that the detection target has been detected from the component removal position 5A, it calculates that the pitch (spacing) of the component storage pockets 15B on the embossed tape 14 is 4 mm. The pitch calculation unit 35 outputs information on the calculated pitch (spacing) to the memory unit 31 as pitch feeding data 312 for storage.

[0046] If the pitch calculation unit 35 does not obtain a detection result from the detection unit 341 in the second pitch calculation process, it increments the number of times the embossed tape 14 has been fed and proceeds to a third pitch calculation process. The pitch calculation unit 35 repeatedly counts the number of times the embossed tape 14 has been fed until it obtains a detection result from the detection unit 341 indicating that the detection target has been detected from the component removal position 5A. The pitch calculation unit 35 calculates the pitch (spacing) of the component storage pockets 15B on the embossed tape 14 based on the number of times the embossed tape 14 has been fed and the pit feed length of the embossed tape 14 at the time the detection result is obtained from the detection unit 341.

[0047] Furthermore, the pitch calculation unit 35 outputs information about the calculated pitch to the mechanism drive unit 32. The mechanism drive unit 32 controls the tape feed mechanism 20 so as to feed the embossed tape 14 at the input pitch.

[0048] Next, an example of tape feeding of the embossed tape 14 by an autoloading feeder will be described with reference to Fig. 7. Fig. 7 is a perspective view showing an example of a tape feeder 5. In Figs. 7 to 9, the delivery sprocket 21 and the delivery sprocket 22 are shown in a simplified form to make the configuration of the tape feeder 5 easier to understand.

[0049] The tape feeder 5 is controlled by the control unit 30 to pull out the embossed tape 14 from the reel 3C and deliver it to the component removal position 5A. The tape feeder 5 includes at least one output sprocket 21, at least one input sprocket 22, a tape support unit 23, a first tape detection unit 24A, and a second tape detection unit 24B.

[0050] The delivery sprocket 21 delivers the embossed tape 14, which has been delivered through the tape transport path RT, to the component pick-up position 5A.

[0051] The loading sprocket 22 has a plurality of pins (not shown) on its outer circumferential surface, similar to the output sprocket 21 shown in Fig. 4. The loading sprocket 22 is controlled by the control unit 30 to rotate in a predetermined direction with the pins inserted into the feed holes 15A of the unused embossed tape 14 stored in the reel 3C, thereby loading the embossed tape 14 into the tape transport path RT in the tape feeder 5.

[0052] The tape support section 23 supports the embossed tape 14 that has been fed into the tape feeder 5 by the feed sprocket 22, and guides the fed embossed tape 14 toward the tape transport path RT.

[0053] The first tape detection unit 24A and the second tape detection unit 24B each detect the embossed tape 14 that has been fed into the tape feeder 5 by the feed sprocket 22. The first tape detection unit 24A and the second tape detection unit 24B are each so-called optical sensors, and each include a light-emitting unit (not shown) that can emit light and a light-receiving unit (not shown) that can receive light reflected by the tape transport path RT. When the first tape detection unit 24A and the second tape detection unit 24B determine that the light emitted by the light-receiving unit (not shown) is not received, the first tape detection unit 24A and the second tape detection unit 24B determine that the light emitted by the embossed tape 14 has been blocked, and determine that the embossed tape 14 has been detected. When the first tape detection unit 24A and the second tape detection unit 24B detect the embossed tape 14, the first tape detection unit 24A and the second tape detection unit 24B each generate a detection result indicating that the embossed tape 14 has been detected, and output the result to the control unit 30.

[0054] The control unit 30 determines whether or not it is necessary to change the embossed tape 14 based on the detection results of the embossed tape 14 output from each of the first tape detection unit 24A and the second tape detection unit 24B. If it determines that it is necessary to change the embossed tape 14, the control unit 30 starts a process of calculating the pitch (spacing) of the component storage pockets 15B of the new embossed tape 14.

[0055] Next, an example of tape feeding of the embossed tapes 14A and 14B will be described with reference to Fig. 8 and Fig. 9. Fig. 8 is a diagram illustrating an example of tape feeding of the embossed tapes 14A and 14B. Fig. 9 is a diagram illustrating an example of switching between the embossed tapes 14A and 14B.

[0056] The control unit 30 causes the infeed sprocket 22 to feed the embossed tape 14A into the tape feeder 5 (step 1). The control unit 30 supports the fed embossed tape 14A with the tape support unit 23 and guides the tape feed path RT (step 1).

[0057] The control unit 30 detects the embossed tape 14A fed into the tape transport path RT using each of the first tape detection unit 24A and the second tape detection unit 24B. The control unit 30 controls the feed-in sprocket 22 to feed the embossed tape 14A through the tape transport path RT toward the feed-out sprocket 21 (Step 2). The control unit 30 controls the feed-out sprocket 21 to feed (feed out) the embossed tape 14A fed through the tape transport path RT to the component removal position 5A (Step 3).

[0058] After the control unit 30 has fed the embossed tape 14A up to the component pick-up position 5A, the control unit 30 releases the support of the embossed tape 14A by the tape support unit 23 (step 4).

[0059] The control unit 30 causes the input sprocket 22 to feed new embossed tape 14B into the tape feeder 5, and the tape support unit 23 to support the fed embossed tape 14A (step 5). The control unit 30 feeds the embossed tape 14B supported by the tape support unit 23 to a position where it is detected by the first tape detection unit 24A, and then stops the input sprocket 22 (step 5). The control unit 30 also calculates the pitch of the component storage pockets 15B of the embossed tape 14A that has been sent (transported) to the component removal position 5A, and starts supplying components P using the embossed tape 14A (step 5).

[0060] If the control unit 30 determines that the currently used embossed tape 14A is not detected by the second tape detection unit 24B, it determines that the tape is out of stock and rotates the feed sprocket 22 to begin guiding the fed embossed tape 14B into the tape transport path RT (step 6).

[0061] Next, an example of the operation procedure of the control unit 30 in the component mounting apparatus 1 will be described with reference to Fig. 10. Fig. 10 is a flowchart showing an example of the operation procedure of the control unit 30 according to the embodiment.

[0062] The mechanism driving unit 32 moves the board recognition camera 10, which moves integrally with the mounting head 8, to the component removal position 5A. The mechanism driving unit 32 illuminates the opening 13A with the lighting 11, and causes the board recognition camera 10 to capture an image of the embossed tape 14 exposed from the opening 13A. The image capturing processing unit 34 acquires the captured image captured by the board recognition camera 10 (St10).

[0063] The image capturing processing unit 34 processes the acquired captured image, and the detection unit 341 detects the detection target from a position in the captured image that corresponds to the component removal position 5A. The detection unit 341 determines whether or not the detection target has been detected at the component removal position 5A (St11).

[0064] When the detection unit 341 determines that the detection target has not been detected at the component pick-up position 5A (St11, NO), it generates a control command to the effect that the detection target has not been detected and outputs the control command to the control unit 30. The control unit 30 causes the mechanism drive unit 32 to drive the tape feed mechanism 20, thereby pitch-feeding the embossed tape 14 by 2 mm (one feed) toward the component pick-up position 5A (St12). Note that, in the flowchart shown in Fig. 10, an example in which the pitch length is 2 mm will be described as an example, but it goes without saying that the pitch length is not limited to this.

[0065] On the other hand, when the detection unit 341 determines that the detection target has been detected at the component take-out position 5A (St11, YES), it generates two cut-out images to be used in the template matching process. Specifically, the detection unit 341 generates a cut-out image by cutting out a first detection area larger than the component P stored on the embossed tape 14 from the captured image, with the component take-out position 5A as its center position. The detection unit 341 also measures a feed-out position 5C, which is fed out 2 mm (for one feed) from the component take-out position 5A along the feed direction of the embossed tape 14, from the captured image, and generates a cut-out image by cutting out a second detection area larger than the component P stored on the embossed tape 14, with the feed-out position 5C as its center position. The pitch calculation unit 35 executes the template matching process using the cut-out image by cutting out the first detection area and the cut-out image by cutting out the second detection area (St13).

[0066] The pitch calculation unit 35 determines, by template matching, whether the two cut-out images match, that is, whether the detection object appearing in the first detection area and the detection object appearing in the second detection area are the same detection object (St14).

[0067] If the pitch calculation unit 35 determines that the two cut-out images match (St14, YES), it determines the pitch for feeding the embossed tape 14 to be 2 mm (St18). The pitch calculation unit 35 stores information about the determined pitch of the embossed tape 14 in the memory unit 31 as pitch feeding data 312.

[0068] On the other hand, if the pitch calculation unit 35 determines that the two cut-out images do not match as a result of the template matching process (St14, NO), it outputs a control command to the control unit 30 to indicate that matching has failed. The control unit 30 then drives the tape feeding mechanism 20 using the mechanism driving unit 32 to feed the embossed tape 14 by 2 mm (one feed) toward the component pick-up position 5A (St15). The control unit 30 also counts the number of times the embossed tape 14 has been fed by one feed, and counts the current number of times the embossed tape 14 has been fed as two feeds (St15).

[0069] The mechanism driving unit 32 illuminates the opening 13A with the light 11 and causes the board recognition camera 10 to capture an image of the embossed tape 14 exposed from the opening 13A. The image capturing processing unit 34 acquires the captured image captured by the board recognition camera 10 (St16).

[0070] The detection unit 341 determines whether any detection target is captured in a first detection area, which is larger than the component P stored in the embossed tape 14 and has the component removal position 5A as its center position in the captured image (St17). In the processing of step St17, the detection unit 341 is only required to detect any one of the objects set as the detection target (for example, the component P and the pocket hole 15C). This allows the detection unit 341 to detect a component storage pocket 15B in which a component P is stored or in which a pocket hole 15C is formed.

[0071] If the pitch calculation unit 35 determines that any detection target is in the first detection area (St17, YES), it determines the pitch for feeding the embossed tape 14 to be 2 mm (St18). The pitch calculation unit 35 stores information about the determined pitch of the embossed tape 14 in the memory unit 31 as pitch feeding data 312.

[0072] On the other hand, if the pitch calculation unit 35 determines that no detection target is captured in the first detection area (St17, NO), it determines the pitch for feeding the embossed tape 14 to be 4 mm (St19). The pitch calculation unit 35 stores information about the determined pitch of the embossed tape 14 in the memory unit 31 as pitch feeding data 312.

[0073] As described above, the component mounting apparatus 1 according to the embodiment can automatically calculate the pitch of the component storage pockets 15B of the new embossed tape 14 at the timing when the embossed tape 14 is switched. This eliminates the need for an operator to set the pitch, and the component mounting apparatus 1 can resume supplying components P using the new embossed tape 14 in a shorter time, thereby further improving the production efficiency of the board W.

[0074] Furthermore, in the template matching process executed in step St13, the component mounting apparatus 1 according to the embodiment generates and matches a cut-out image cut out of the first detection area with a cut-out image cut out of the second detection area, thereby reducing the number of times the embossed tape 14 is sent out for the pitch calculation process by one, thereby more effectively reducing the time required for the pitch calculation process and more effectively suppressing the loss of components P in the pitch calculation process.

[0075] Next, the pitch calculation method executed in the example of the operation procedure shown in Fig. 10 will be specifically described with reference to Fig. 11. Fig. 11 is a diagram for explaining the pitch calculation method. In Figs. 11 to 13 shown below, for ease of understanding, the embossed tape 14 is shown in solid lines as it passes through the pressing member 13 and is pressed by the pressing member 13, and the portion not exposed from the opening 13A.

[0076] In the following description of FIGS. 11 to 13, for simplicity of explanation, an example will be described in which the pitch at which the embossed tape 14 is fed when the pitch is calculated is 2 mm, but the present invention is not limited to this.

[0077] First, we will explain the embossed tape 14 shown in Fig. 10. At the leading end of the embossed tape 14, empty component storage pockets 15B that do not store components P are mixed with component storage pockets 15B that store components P, and there are cases where it is impossible to match component storage pockets 15B that are successively imaged.

[0078] 11, even though the pitch of the component storage pockets 15B is 2 mm, the component storage pockets 15B in the second detection area AR12 do not store a component P, while the component storage pockets 15B in the first detection area AR11 store a component P. Therefore, the pitch calculation unit 35 does not match the cut-out image cut out of the first detection area AR11 with the cut-out image cut out of the second detection area AR12. Therefore, when the states of two consecutive component storage pockets 15B along the feeding direction of the embossed tape 14, as in the embossed tape 14 shown in FIG. 11, that is, when the detection targets detected at the positions of the component storage pockets 15B are different, it becomes difficult to calculate the pitch of the component storage pockets 15B by template matching.

[0079] Therefore, when the control unit 30 in the present disclosure determines by template matching that the same detection target is not detected in the first detection area AR11 and the second detection area AR12, it feeds the embossed tape 14 by 2 mm, re-images the embossed tape 14 after feeding, and detects one of the detection targets in the first detection area AR13 (i.e., the component removal position 5A) in the re-imaged image. This allows the control unit 30 to calculate the pitch of the component storage pockets 15B on the embossed tape 14 even if the states of two consecutive component storage pockets 15B are different.

[0080] Next, a specific example of the pitch calculation method executed in the example of the operation procedure shown in Fig. 10 will be described with reference to Fig. 12 and Fig. 13. Fig. 12 is a diagram for explaining an example of pitch calculation. Fig. 13 is a diagram for explaining an example of pitch calculation.

[0081] 12 and 13 illustrate an example of the detection process (step St17) of the detection target that is executed after it is determined that the detection targets appearing in the two cut-out images do not match in the template matching process described in Fig. 10 (i.e., in the case of "NO" in step St14). In the example shown in Fig. 12 and 13, the pitch sending data 312 is set in advance to be either 2 mm or 4 mm for the pitch of the embossed tape 14.

[0082] <For 2mm pitch> 12, after detecting a detection target (here, component P1) in first detection area AR21, control unit 30 determines by template matching that the same detection target is not detected at component take-out position 5A and feed-out position 5C. If control unit 30 determines by template matching that the same detection target is not detected at component take-out position 5A and feed-out position 5C, it causes mechanism drive unit 32 to feed embossed tape 14 by 2 mm (one feed). After feeding embossed tape 14, board recognition camera 10 again captures an image of embossed tape 14 exposed from opening 13A.

[0083] The detection unit 341 determines whether or not a detection target is captured in the first detection area AR22 from the captured image captured again. In the example shown in Fig. 12, the detection unit 341 detects a component P2 in the first detection area AR22. The detection unit 341 outputs the detection result to the pitch calculation unit 35. The pitch calculation unit 35 determines that the pitch of the embossed tape 14 is 2 mm, based on the fact that the current number of times the embossed tape 14 has been fed is one and that a detection target is captured in the first detection area AR22.

[0084] <For 4mm pitch> 12, after detecting a detection target (here, component P3) in first detection area AR31, control unit 30 determines by template matching that the same detection target is not detected at component take-out position 5A and feed-out position 5C. If control unit 30 determines by template matching that the same detection target is not detected at component take-out position 5A and feed-out position 5C, it causes mechanism drive unit 32 to feed embossed tape 14 by 2 mm (one feed count). After feeding embossed tape 14, board recognition camera 10 again captures an image of embossed tape 14 exposed from opening 13A.

[0085] The detection unit 341 determines whether or not a detection target is captured in the first detection area AR32 from the captured image taken again. In the example shown in FIG. 13, the detection unit 341 does not detect any detection target in the first detection area AR32. The detection unit 341 outputs the detection result to the pitch calculation unit 35. The pitch calculation unit 35 determines that the pitch of the embossed tape 14 is 4 mm based on the fact that the current feed count of the embossed tape 14 is one and that no detection target is captured in the first detection area AR32.

[0086] As a result, the component mounting device 1 of the embodiment can calculate the pitch of the currently attached embossed tape 14 based on the detection results of the detection target, even if there is a mixture of empty component storage pockets 15B that do not store components P and component storage pockets 15B that store components P at the tip side of the embossed tape 14, if the pitch length of the embossed tape 14 is determined in advance.

[0087] (Addendum) The above description of each embodiment discloses the following techniques.

[0088] (Technology 1) a tape feeding unit (tape feeding mechanism 20) that feeds an embossed tape having a plurality of pockets (component storage pockets 15B) each capable of storing a component, the pockets (component storage pockets 15B) having holes (pocket holes 15C) formed in the bottom surfaces of the pockets, toward a component removal position on the tape transport path RT; an illumination unit (illumination 11) that irradiates light onto the component removal position; an imaging unit (board recognition camera 10) that images the component removal position illuminated with light by the lighting unit (lighting 11); a detection unit (control unit 30) that determines whether the pocket (component storage pocket 15B) is present at the component removal position based on an image captured by the imaging unit (board recognition camera 10), a portion of the bottom surface of the tape transport path RT below the component removal position reflects the light when the pocket (component storage pocket 15B) is present at the component removal position and no component is stored in the pocket (component storage pocket 15B); When the pocket (component storage pocket 15B) is present at the component removal position and a component is stored in the pocket (component storage pocket 15B), at least a part of the component reflects the light, When the detection unit (control unit 30) detects from the captured image that the portion of the bottom surface of the tape transport path RT is reflecting the light, or that at least a part of the component is reflecting the light, it determines that the pocket (component storage pocket 15B) is present at the component removal position. Component mounting device 1. With this configuration, the component mounting device 1 can detect the component storage pockets 15B even if the pitch (spacing) of the component storage pockets 15B on the embossed tape 14 is different before and after switching, or even if there is a mixture of empty component storage pockets 15B that do not store components P and component storage pockets 15B that store components P at the tip side of the embossed tape 14.

[0089] (Technology 2) and a pitch calculation unit that determines that the pitch of the plurality of pockets (component storage pockets 15B) is the predetermined length when the detection unit (control unit 30) determines that the pocket (component storage pocket 15B) is present at the component removal position, the tape feed unit (tape feed mechanism 20) feeds out the embossed tape by a predetermined length, and the pocket (component storage pocket 15B) detection unit (control unit 30) again determines that the pocket (component storage pocket 15B) is present at the component removal position. The component mounting device 1 described in (Technology 1). With this configuration, the component mounting apparatus 1 can automatically determine the pitch (spacing) of the embossed tape 14 based on the presence of the component storage pocket 15B.

[0090] (Technology 3) the imaging unit (board recognition camera 10) images the component removal position as well as a position spaced apart from the component removal position by the predetermined distance; When the detection unit (control unit 30) determines that the pocket (component storage pocket 15B) is present at the component removal position, and the pitch calculation unit determines that the image of the component removal position and the image at the position separated by the predetermined distance match, the pitch calculation unit determines that the pitch of the plurality of pockets (component storage pockets 15B) is the predetermined length. The component mounting device 1 described in (Technology 2). As a result, the component mounting device 1 can reduce the number of times the embossed tape 14 is sent out by one by determining whether the cut-out image cut out at the component removal position 5A and the cut-out image cut out at the sending position 5C match in the captured image, thereby more effectively reducing the time required for the pitch calculation process.

[0091] (Technology 4) A method for detecting pockets on an embossed tape performed by a component mounting apparatus 1 that mounts components on a board, comprising: An embossed tape having a plurality of pockets (component storage pockets 15B) each capable of storing the component, with holes (pocket holes 15C) formed in the bottom surfaces of the pockets (component storage pockets 15B), is fed toward a component removal position on the tape transport path RT; irradiating the component removal position with light; taking an image of the component removal position illuminated with the light; a portion of the bottom surface of the tape transport path RT below the component removal position reflects the light when the pocket (component storage pocket 15B) is present at the component removal position and no component is stored in the pocket (component storage pocket 15B); When the pocket (component storage pocket 15B) is present at the component removal position and a component is stored in the pocket (component storage pocket 15B), at least a part of the component reflects the light, If it is detected from the captured image that the portion of the bottom surface of the tape transport path RT is reflecting the light, or that at least a part of the component is reflecting the light, it is determined that the pocket (component storage pocket 15B) is present at the component removal position. How to detect pockets on embossed tape. With this configuration, the component mounting device 1 can detect the component storage pockets 15B even if the pitch (spacing) of the component storage pockets 15B on the embossed tape 14 is different before and after switching, or even if there is a mixture of empty component storage pockets 15B that do not store components P and component storage pockets 15B that store components P at the tip side of the embossed tape 14.

[0092] Although various embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that those skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components of the various embodiments described above may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0093] The present disclosure is useful for a component mounting device for detecting pockets formed in an embossed tape and a method for detecting pockets in an embossed tape. [Explanation of symbols]

[0094] 1. Component mounting equipment 2. Substrate transport mechanism 3 carts 4. Parts Supply Department 5 Tape Feeder 5A Parts removal position 5C Sending position 8 Mounting head 8A suction nozzle 10 Circuit Board Recognition Camera 11. Lighting 13A opening 13B Peeling part 14, 14A, 14B Embossed tape 15 Base Tape 15A sprocket hole 15B Parts storage pocket 15C pocket hole 20 Tape feed mechanism 21 Delivery sprocket 21A pin 22 Carrying sprocket 30 Control Unit 31 Storage section 32 Mechanism drive unit 34 Imaging processing unit 35 Pitch calculation section 312 Pitch sending data 341 Detection unit AR11, AR13, AR21, AR22, AR31, AR32 First detection area AR12 Second Detection Area P,P1,P2,P3 parts RT tape transport path W substrate

Claims

1. a tape feeding section that feeds an embossed tape having a plurality of pockets each capable of storing a component, the pockets having holes formed in their bottom surfaces, toward a component removal position on a tape transport path; an illumination unit that irradiates light onto the component removal position; an imaging unit that images the component removal position illuminated with the light by the illumination unit; a detection unit that determines whether the pocket is present at the component removal position based on the captured image captured by the imaging unit, a portion of the bottom surface of the tape transport path below the component removal position reflects the light when the pocket is present at the component removal position and no component is stored in the pocket; When the pocket is present at the component removal position and a component is stored in the pocket, at least a portion of the component reflects the light, the detection unit determines that the pocket is present at the component removal position when it detects from the captured image that the portion of the bottom surface of the tape transport path is reflecting the light or that at least a part of the component is reflecting the light. Component mounting equipment.

2. a pitch calculation unit that determines that the pitch of the plurality of pockets is the predetermined length when the detection unit determines that the pocket exists at the component removal position, the tape feeding unit feeds out the embossed tape by a predetermined length, and the detection unit again determines that the pocket exists at the component removal position. The component mounting device according to claim 1 .

3. the imaging unit images the component removal position as well as a position spaced apart from the component removal position by the predetermined distance; the pitch calculation unit determines that the pitch of the plurality of pockets is the predetermined length when the detection unit determines that the pocket is present at the component removal position and the pitch calculation unit determines that the image of the component removal position and the image at the position separated by the predetermined length match. The component mounting device according to claim 2.

4. A method for detecting pockets on an embossed tape performed by a component mounting device that mounts components on a substrate, comprising: an embossed tape having a plurality of pockets each capable of storing the component, the pockets having holes formed in the bottom surfaces thereof, said tape being fed toward a component pick-up position on a tape transport path; irradiating the component removal position with light; taking an image of the component removal position illuminated with the light; a portion of the bottom surface of the tape transport path below the component removal position reflects the light when the pocket is present at the component removal position and no component is stored in the pocket; When the pocket is present at the component removal position and a component is stored in the pocket, at least a portion of the component reflects the light, and determining that the pocket is present at the component removal position when it is detected from the captured image that the portion of the bottom surface of the tape transport path is reflecting the light or that at least a portion of the component is reflecting the light. How to detect pockets on embossed tape.

Images