Pressure sensor device

Abstract

To provide a pressure sensor device capable of reducing the possibility that discharged electricity reaches a detection element.SOLUTION: The pressure sensor device according to the present invention comprises: a base substrate; a detection element mounted on a top face of the base substrate and detecting a pressure; and a resin package provided on a top face of the base substrate, and including a detection element embedded therein and an exposure hole for externally exposing a detection area which is a portion of the detection element. A ground electrode electrically connected to the ground is formed on at least portion of a borderline area with an inner side face of the exposure hole of the detection area.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a pressure sensor device for detecting pressure. [Background technology]

[0002] Patent Document 1 discloses a semiconductor device that detects pressure. The semiconductor device includes a detection element and a circuit element provided on a base substrate, and a resin package that is provided on the base substrate and embeds the detection element and the circuit element. The detection element has a detection portion that detects pressure. The circuit element is electrically connected to the detection element via a bonding wire. The resin package has an exposure hole that exposes the detection portion to the outside. Because the detection portion is exposed to the outside through the exposure hole, the detection portion can detect pressure acting from the outside. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 208127 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the semiconductor device disclosed in Patent Document 1 may have the following problems. Electricity, such as static electricity, may be discharged to the semiconductor device due to external disturbances or the like. This electricity has the property of traveling along the interface of materials rather than through the air. Therefore, when this electricity is discharged to the semiconductor device, it may reach the detection element along the inner surface of the resin package that forms the exposure hole in the resin package. After reaching the detection element, the electricity may reach the circuit element via the bonding wire and electrically destroy the circuit element.

[0005] SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a pressure sensor device that can reduce the possibility that electricity such as static electricity will reach the detection element. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention is configured as follows. A pressure sensor device according to one aspect of the present invention comprises: A base substrate; a detection element mounted on an upper surface of the base substrate to detect pressure; a resin package provided on the upper surface of the base substrate, in which the detection element is embedded, and having an exposure hole that exposes a detection region that is a part of the detection element to the outside, A ground electrode electrically connected to ground is formed in at least a part of a boundary area of ​​the detection area with the inner surface of the resin package that defines the exposure hole. [Effects of the Invention]

[0007] According to the present invention, it is possible to reduce the possibility that electricity such as static electricity will reach the detection element. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view of a pressure sensor device according to a first embodiment of the present invention. [Figure 2] Cross-sectional view taken along line AA in Figure 1. [Figure 3] FIG. 6 is a plan view of a pressure sensor device according to a second embodiment of the present invention. [Figure 4] FIG. 4 is a cross-sectional view taken along line BB in FIG. 3. [Figure 5] FIG. 10 is a plan view of a pressure sensor device according to a third embodiment of the present invention. [Figure 6] FIG. 6 is a cross-sectional view taken along line CC in FIG. 5 . DETAILED DESCRIPTION OF THE INVENTION

[0009] First Embodiment Fig. 1 is a plan view of a pressure sensor device according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line AA in Fig. 1. For the sake of convenience, terms indicating directions such as "upper" and "lower" are used below, but these terms do not limit the state of use of the pressure sensor device according to the present invention.

[0010] 1 and 2, the pressure sensor device 10 is an element that detects pressure. The pressure sensor device 10 includes a base substrate 20, a detection element 30 that is mounted on an upper surface 20A of the base substrate 20 and detects pressure, and a resin package 50 that is provided on the upper surface 20A of the base substrate 20 and covers a portion of the detection element 30.

[0011] In the first embodiment, the base substrate 20 is a rigid substrate made of ceramic, but is not limited to this. For example, the base substrate 20 may be a rigid substrate made of glass epoxy or other materials other than ceramic. Furthermore, for example, the base substrate 20 may be a lead frame instead of a rigid substrate.

[0012] In the first embodiment, the base substrate 20 has a rectangular parallelepiped shape that is thin in the vertical direction 101. That is, in the first embodiment, the base substrate 20 has a rectangular shape when viewed from above, in other words, when viewed from the vertical direction 101. The shape of the base substrate 20 is not limited to a rectangular parallelepiped shape (a shape that is rectangular when viewed from the vertical direction 101). For example, the base substrate 20 may have a polygonal shape other than a rectangular shape when viewed from the vertical direction 101.

[0013] As shown in Fig. 2, electrodes 21 and 22 are formed on an upper surface 20A of a base substrate 20. Although two electrodes are shown in Fig. 2, the number of electrodes is not limited to two.

[0014] The electrodes 21 are electrically connected to a circuit element (not shown). The circuit element may be mounted on the base substrate 20 or may be provided outside the base substrate 20. The circuit element is, for example, an element including an application specific integrated circuit (ASIC).

[0015] The circuit element includes, for example, a signal processing circuit that processes a signal input from the detection element 30 (described later) via the electrode 21 and outputs the processed signal. For example, the circuit element includes a converter, a filter, a temperature sensor, a processor, a memory, and the like. The converter converts the voltage signal input from the detection element 30 into a digital signal. The filter filters the digital signal from the converter. The temperature sensor detects the temperature. The processor corrects the filtered digital signal based on the temperature detected by the temperature sensor. The memory stores correction coefficients and the like used when correcting the digital signal using the detected temperature.

[0016] The electrode 22 is electrically connected to the ground. The ground is the reference potential of the pressure sensor device 10. For example, the potential of the electrode 22 may be set to the reference potential. Alternatively, for example, an electrode set to the reference potential may be provided on or outside the base substrate 20, and the electrode 22 may be electrically connected to that electrode. Furthermore, being electrically connected to the ground also includes being earthed. For example, the electrode 22 may be electrically connected to the ground via an earth wire.

[0017] In the first embodiment, the detection element 30 is a pressure sensor for measuring pressure. As shown in FIG. 2, the detection element 30 has an upper surface 30A and a lower surface 30B that is the back surface of the upper surface 30A. The detection element 30 is, for example, a piezo-resistive pressure sensor or a capacitance pressure sensor, and is a MEMS (Micro Electro Mechanical Systems) element. In the first embodiment, the lower surface 30B of the detection element 30 is bonded to the upper surface 20A of the base substrate 20 by a die attach film, a die attach material, or the like. In this way, the detection element 30 is mounted on the upper surface 20A of the base substrate 20. The detection element 30 may also be mounted on the base substrate 20 by solder, or the like.

[0018] The detection element 30 has a detection unit 33 on an upper surface 30A of which pressure acts. The detection unit 33 detects the pressure. The detection unit 33 of the detection element 30 is a membrane or diaphragm that receives the pressure. The detection unit 33 is provided with, for example, a passivation film, making it waterproof.

[0019] Electrodes 31 and 32 are formed on an upper surface 30A of the detection element 30. Although two electrodes are shown in Fig. 2, the number of electrodes is not limited to two.

[0020] The electrode 31 is electrically connected to the electrode 21 of the base substrate 20 via a bonding wire 41. The detection element 30 outputs a signal corresponding to the pressure detected by the detection unit 33 from the electrode 31 to the outside. In other words, the signal corresponding to the pressure detected by the detection unit 33 is output to the circuit element via the electrode 31 and the bonding wire 41.

[0021] The electrode 32 is electrically connected to the electrode 22 of the base substrate 20 via a bonding wire 42. In other words, the electrode 32 is electrically connected to the ground via the bonding wire 42 and the electrode 22. The electrode 32 is an example of a ground electrode.

[0022] 1, the electrode 32 is formed in a ring shape so as to surround the detection unit 33. However, the electrode 32 does not have to surround the detection unit 33. In other words, the electrode 32 does not have to be ring-shaped. For example, the electrode 32 may be formed only on the right side of the detection unit 33 in the plane of FIG. 1.

[0023] Resin package 50 is produced by molding a hard resin such as a thermosetting resin, an epoxy mold resin, or the like onto upper surface 20A of base substrate 20. That is, as shown in Fig. 2, resin package 50 is provided on upper surface 20A of base substrate 20. Upper surface 20A of base substrate 20 and electrodes 21, 22 formed on upper surface 20A are covered with resin package 50 and thereby protected and waterproofed.

[0024] The detection element 30 and the bonding wires 41, 42 are embedded in a resin package 50. By being embedded in the resin package 50, the detection element 30 and the bonding wires 41, 42 are protected and waterproofed.

[0025] As shown in FIGS. 1 and 2, the resin package 50 includes a base portion 51 and a cylindrical portion 52.

[0026] The base 51 constitutes the base substrate 20 side of the resin package 50. In other words, the base 51 constitutes the lower part of the resin package 50. As shown in FIG. 2 , the base 51 is in contact with the upper surface 20A of the base substrate 20. In other words, the base 51 is provided on the upper surface 20A of the base substrate 20.

[0027] In the first embodiment, the base 51 has a rectangular parallelepiped shape that is thin in the vertical direction 101. That is, in the first embodiment, the base 51 has a rectangular shape when viewed in the vertical direction 101. When viewed in the vertical direction 101, the base 51 and the base substrate 20 have the same shape and size. That is, in the first embodiment, the base 51 covers the entire upper surface 20A of the base substrate 20.

[0028] The shape of the base 51 is not limited to a rectangular parallelepiped shape (a quadrilateral shape when viewed in the vertical direction 101). For example, the base 51 may be a polygon other than a quadrilateral or a circle when viewed in the vertical direction 101. Furthermore, the base 51 and the base substrate 20 may have different shapes or sizes when viewed in the vertical direction 101. In other words, the base 51 may cover only a portion of the upper surface 20A of the base substrate 20.

[0029] The tubular portion 52 constitutes the opposite side of the base substrate 20 with respect to the base portion 51 of the resin package 50. In other words, the tubular portion 52 constitutes the upper part of the resin package 50. The tubular portion 52 protrudes from the base portion 51 so as to be away from the base substrate 20. In other words, the tubular portion 52 protrudes upward from the base portion 51.

[0030] As shown in Fig. 1, the outer surface 52B of the tubular portion 52 is located more inward than the base 51 when viewed in the up-down direction 101. In other words, as shown in Figs. 1 and 2, the base 51 extends outward from the outer surface 52B of the tubular portion 52. Note that in the first embodiment, as shown in Fig. 1, the base 51 extends outward from the outer surface 52B around the entire circumference of the outer surface 52B of the tubular portion 52. However, the base 51 may extend outward from the outer surface 52B only around a portion of the outer surface 52B of the tubular portion 52, rather than around the entire circumference.

[0031] 1 and 2, the tubular portion 52 has an exposure hole 52C. The exposure hole 52C penetrates the tubular portion 52 in the up-down direction 101. This gives the tubular portion 52 a cylindrical shape.

[0032] As shown in FIG. 1, the exposure hole 52C has a rectangular shape when viewed in the vertical direction 101, but may have another shape such as a circle.

[0033] As shown in Fig. 2, the detection region 102 on the surface of the detection element 30 faces the exposure hole 52C. That is, as shown in Figs. 1 and 2, the detection region 102 is exposed to the outside of the pressure sensor device 10 through the exposure hole 52C. That is, the exposure hole 52C exposes the detection region 102 of the detection element 30 to the outside. In Fig. 1, the detection region 102 is the region surrounded by a dashed line.

[0034] The detection region 102 is a region of the surface of the detection element 30 that is not embedded in the resin package 50 and is exposed to the outside of the pressure sensor device 10. In other words, the detection region 102 is a part of the detection element 30. In the first embodiment, the detection region 102 is a part of the upper surface 30A of the detection element 30.

[0035] The outer edge of the detection area 102, as viewed in the vertical direction 101, is in contact with the lower end of the inner surface 52A of the resin package 50, which constitutes the exposure hole 52C. The outer edge of the detection area 102, as viewed in the vertical direction 101, and the area nearby the outer edge, form a boundary area 103 with the inner surface 52A of the resin package 50. The boundary area 103 is a part (outer edge) of the detection area 102. In the first embodiment, the electrode 32 is formed in the entire boundary area 103. In this case, the electrode 32 is annular and surrounds the detection unit 33, as viewed in the vertical direction 101. The electrode 32 may be formed in only a part of the boundary area 103. In other words, the electrode 32 does not have to be annular.

[0036] The electrode 32 is provided across the lower end of the inner surface 52A of the resin package 50. That is, a part of the electrode 32 is formed in a boundary region 103 of the detection region 102 located inside the lower end of the inner surface 52A of the resin package 50 as viewed in the vertical direction 101. The remaining part of the electrode 32 is located outside the lower end of the inner surface 52A of the resin package 50 as viewed in the vertical direction 101, and is embedded in the resin package 50. Note that the electrode 32 may be provided only inside the lower end of the inner surface 52A of the resin package 50 as viewed in the vertical direction 101.

[0037] The detection portion 33 is formed inside the electrode 32 when viewed in the up-down direction 101. In other words, the detection portion 33 is formed in a region different from the boundary region 103 in the detection region 102. The detection portion 33 is exposed to the outside of the pressure sensor device 10 through the exposure hole 52C. This allows pressure to act on the detection portion 33 of the detection element 30 from the outside of the pressure sensor device 10 through the exposure hole 52C, and the detection element 30 can detect the pressure.

[0038] The detection region 102 is not limited to a portion of the upper surface 30A of the detection element 30. For example, the detection region 102 may be the entire upper surface 30A of the detection element 30. In this case, the outer edge of the upper surface 30A of the detection element 30 is in contact with the lower end of the inner surface 52A of the resin package 50. Furthermore, for example, the detection region 102 may extend over the entire upper surface 30A of the detection element 30 and the side surface 30C of the detection element 30. In this case, the side surface 30C of the detection element 30 is in contact with the lower end of the inner surface 52A of the resin package 50, and the electrode 32 is formed on the side surface 30C.

[0039] According to the first embodiment, electricity discharged to the resin package 50 of the pressure sensor device 10 flows along the surface of the resin package 50. Of this electricity, electricity that enters the exposure hole 52C flows along the inner surface 52A of the resin package 50 and can reach the ground electrode (electrode 32). Electricity that reaches the ground electrode (electrode 32) flows to the ground. In other words, the ground electrode (electrode 32) can prevent electricity that enters the exposure hole 52C from reaching the detection element 30. As a result, the possibility that electricity discharged to the pressure sensor device 10 will reach the detection element 30 can be reduced.

[0040] In the first embodiment, the detection element 30 (specifically, the electrodes 31 and 32 provided on the detection element 30) and the base substrate 20 (specifically, the electrodes 21 and 22 provided on the base substrate 20) are electrically connected via bonding wires 41 and 42. However, the detection element 30 and the base substrate 20 may be electrically connected by means other than the bonding wires 41 and 42. For example, the detection element 30 may be mounted on the base substrate 20 by flip chip mounting. In this case, the detection element 30 and the base substrate 20 are electrically connected by solder or the like.

[0041] Second Embodiment Fig. 3 is a plan view of a pressure sensor device according to a second embodiment of the present invention. Fig. 4 is a cross-sectional view taken along line BB in Fig. 3. The pressure sensor device 10A according to the second embodiment differs from the pressure sensor device 10 according to the first embodiment in that it includes a lid member 60. The differences from the first embodiment will be described below. The same reference numerals are used to denote commonalities with the pressure sensor device 10 according to the first embodiment, and explanations thereof will be omitted in principle, and will be provided only when necessary.

[0042] As shown in FIGS. 3 and 4, the pressure sensor device 10A includes a base substrate 20, a detection element 30, a resin package 50, and a lid member 60.

[0043] In the second embodiment, the lid member 60 is fitted into the exposure hole 52C. The lid member 60 closes the opening of the exposure hole 52C. Note that the lid member 60 does not necessarily have to be fitted into the exposure hole 52C, provided that the lid member 60 closes the opening of the exposure hole 52C. For example, the lid member 60 may be supported on the upper surface 50D of the resin package 50 so as to cover the opening of the exposure hole 52C from above.

[0044] A through hole 60A is formed in the lid member 60. The through hole 60A penetrates the lid member 60 from top to bottom. The through hole 60A has two openings (an upper opening 60Aa and a lower opening 60Ab). The upper opening 60Aa of the through hole 60A is open to the outside of the pressure sensor device 10A. The upper opening 60Aa is an example of an outer opening. The lower opening 60Ab of the through hole 60A is open to the exposure hole 52C. As a result, the through hole 60A connects the exposure hole 52C to the outside of the pressure sensor device 10A. In other words, the lid member 60 blocks the opening of the exposure hole 52C, while connecting the exposure hole 52C to the outside of the pressure sensor device 10A via the through hole 60A.

[0045] As shown in FIG. 3, the through holes 60A are formed at positions on the cover member 60 that correspond to the four vertices of the rectangular exposure hole 52C when viewed from the vertical direction 101. That is, the cover member 60 has four through holes 60A. Each through hole 60A is fan-shaped when viewed from the vertical direction 101. Each through hole 60A has the same shape and the same size. Note that the number of through holes 60A is not limited to four. Furthermore, the position, shape, and size of each through hole 60A are not limited to the position, shape, and size described above. Furthermore, each through hole 60A may have a different shape or size.

[0046] An imaginary line extending from the outside of the pressure sensor device 10A through the through-hole 60A to the exposure hole 52C intersects with the electrode 32 or the inner surface 52A of the resin package 50.

[0047] 4, an imaginary line 104A that passes through the center of the through hole 60A when viewed from the vertical direction 101 and penetrates the through hole 60A intersects the electrode 32. Furthermore, an imaginary line 104B that passes through the through hole 60A and penetrates the outer edge of the upper opening 60Aa and the inner edge of the lower opening 60Ab when viewed from the vertical direction 101 intersects the electrode 32. Furthermore, an imaginary line 104C that passes through the through hole 60A and penetrates the inner edge of the upper opening 60Aa and the outer edge of the lower opening 60Ab when viewed from the vertical direction 101 intersects the inner surface 52A.

[0048] On the other hand, an imaginary line connecting any position on the upper opening 60Aa and any position on the portion of the detection region 102 other than the electrode 32 intersects with the portion of the cover member 60 other than the through-hole 60A.

[0049] 4, when viewed from the vertical direction 101, an imaginary line 105 connecting the center of the upper opening 60Aa and the detection unit 33 (the portion of the detection area 102 other than the electrode 32) intersects with the inner surface 60Ac of the cover member 60 that forms the through-hole 60A. In other words, an imaginary line connecting an arbitrary position of the upper opening 60Aa and an arbitrary position of the portion of the detection area 102 other than the electrode 32 does not pass through the through-hole 60A. In other words, the portion of the detection area 102 other than the electrode 32 is shielded by the cover member 60.

[0050] The lid member 60 is primarily made of a dielectric material with a dielectric constant greater than that of air. When multiple types of materials are contained in the lid member 60, the primary material of the lid member 60 is the material that has the highest proportion of at least one of the volume and weight of the multiple types of materials. When the lid member 60 contains only one type of material, the primary material of the lid member 60 is that one type of material. In the first embodiment, the primary material of the lid member 60 is epoxy resin.

[0051] When the maximum diameter of through hole 60A is D, the length of cover member 60 in the depth direction of exposure hole 52C is α, and the dielectric constant of the dielectric that is the main material of cover member 60 is ε, the maximum diameter D of through hole 60A satisfies the following formula (1). In the first embodiment, the depth direction of exposure hole 52C coincides with up-down direction 101. Also, in the first embodiment, the diameter of through hole 60A is constant regardless of the position in up-down direction 101 (the depth direction of exposure hole 52C).

[0052] D≧α / ε (1)

[0053] The main material of the lid member 60 is not limited to a dielectric material. For example, the main material of the lid member 60 may be a conductor such as a metal, or may be a resin.

[0054] According to the second embodiment, the cover member 60 can prevent electricity from passing through the exposure hole 52C and reaching the detection element 40 directly.

[0055] According to the second embodiment, electricity discharged to the lid member 60 flows from the surface of the lid member 60 to the surface of the resin package 50. As described above, the electricity flowing on the surface of the resin package 50 can reach the ground electrode (electrode 32). Therefore, the possibility that electricity discharged to the pressure sensor device 10A will reach the detection element 40 can be reduced.

[0056] According to the second embodiment, the cover member 60 can prevent foreign matter from adhering to the detection element 40 from the outside of the pressure sensor device 10A via the exposure hole 52C. This can prevent the pressure detection characteristics of the detection element 40 from deteriorating due to the adhesion of foreign matter.

[0057] When the maximum diameter D of the through hole 60A is configured to satisfy the formula (1) of the second embodiment, electricity that enters the through hole 60A is easily drawn from the space of the through hole 60A to the inner surface of the through hole 60A. As described above, electricity flowing along the inner surface of the through hole 60A can reach the ground electrode (electrode 32) via the surface of the resin package 50, and therefore is unlikely to reach the detection element 40. This makes it possible to prevent electricity from reaching the detection element 40.

[0058] According to the second embodiment, a line connecting any position on the outer opening (upper opening 60Aa) of the through-hole 60A and any position on the portion of the detection area 102 other than the ground electrode (electrode 32) intersects with the portion of the lid member 60 other than the through-hole 60A (the inner surface 60Ac of the lid member 60). In other words, the portion of the detection area 102 other than the ground electrode (electrode 32) is shielded by the lid member 60. Therefore, electricity that enters the through-hole 60A from the outer opening (upper opening 60Aa) and travels straight through the space of the through-hole 60A toward the portion of the detection area 102 other than the ground electrode (electrode 32) collides with the inner surface 60Ac before passing through the through-hole 60A and flows along the inner surface 60Ac. In this case, the electricity can reach the ground electrode (electrode 32) from the inner surface 60Ac via the surface of the lid member 60 and the surface of the resin package 50.

[0059] On the other hand, electricity that enters through-hole 60A from the outer opening (upper opening 60Aa) and travels straight through the space of through-hole 60A toward the ground electrode (electrode 32) can pass through through-hole 60A. In this case, the electricity can collide with the ground electrode (electrode 32). That is, in this case as well, the electricity can reach the ground electrode (electrode 32).

[0060] As described above, according to the second embodiment, it is possible to prevent electricity from reaching the detection element 40.

[0061] <Third embodiment> FIG. 5 is a plan view of a pressure sensor device according to a third embodiment of the present invention. FIG. 6 is a cross-sectional view taken along line CC in FIG. 5. The pressure sensor device 10B according to the third embodiment differs from the pressure sensor device 10 according to the first embodiment in that it includes a lid member 70. The lid member 70 of the pressure sensor device 10B according to the third embodiment differs from the lid member 60 of the pressure sensor device 10A according to the second embodiment in that a portion of the lid member 70 extends outward beyond the tubular portion 52 of the resin package 50 when viewed in the up-down direction 101. Differences from the first and second embodiments will be described below. Components in common with at least one of the pressure sensor device 10 according to the first embodiment and the pressure sensor device 10A according to the second embodiment are denoted by the same reference numerals, and descriptions thereof will be omitted in principle and will be described only when necessary.

[0062] As shown in FIGS. 5 and 6, the pressure sensor device 10B includes a base substrate 20, a detection element 30, a resin package 50, and a lid member .

[0063] As shown in FIG. 6, the cover member 70 includes a lower portion 71 located inside the exposure hole 52C, and an upper portion 72 located above the exposure hole 52C.

[0064] The lower part 71 is fitted into the exposure hole 52 C. The lower part 71 closes the opening of the exposure hole 52 C. The configuration of the lower part 71 is similar to that of the cover member 60 of the second embodiment.

[0065] The upper portion 72 is located above the lower portion 71 and is connected to the lower portion 71. In the third embodiment, the upper portion 72 is formed integrally with the lower portion 71. The upper portion 72 is located above the tubular portion 52 of the resin package 50. A portion of the upper portion 72 is supported by the upper surface 52D of the tubular portion 52. When viewed in the vertical direction 101, the upper portion 72 extends outward from the outer surface 52B of the tubular portion 52.

[0066] As shown in Fig. 6, an O-ring 80, shown by a broken line in Fig. 6, can be fitted into a recess formed by the upper portion 72, the outer surface 52B of the cylindrical portion 52, and the base portion 51. The O-ring 80 is annular when viewed from the vertical direction 101. When viewed from the vertical direction 101, the inner diameter of the O-ring 80 is configured to be the same as or approximately the same as the outer diameter of the cylindrical portion 52 of the resin package 50. The O-ring 80 is made of a material that is easily deformed by compression, such as nitrile rubber.

[0067] In the third embodiment, the upper portion 72 extends outward from the outer surface 52B of the tubular portion 52 around the entire circumferential direction of the tubular portion 52. However, the upper portion 72 may extend outward from the outer surface 52B of the tubular portion 52 only in part of the circumferential direction of the tubular portion 52. For example, as shown by dashed dotted lines in Fig. 5 , the upper portion 72 may extend outward from the outer surface 52B of the tubular portion 52 at four locations in the circumferential direction of the tubular portion 52.

[0068] A through hole 70A is formed in the cover member 70. The through hole 70A corresponds to the through hole 60A of the cover member 60 of the second embodiment, and is configured in the same manner as the through hole 60A.

[0069] According to the third embodiment, an O-ring 80 can be fitted between the upper portion 72 of the lid member 70 and the base portion 51 of the resin package 50. When the pressure sensor device 10B is attached to another device (not shown), the O-ring 80 seals the gap between the pressure sensor device 10B and the other device. According to the third embodiment, the upper portion 72 of the lid member 70 can prevent the O-ring 80 from coming off.

[0070] The pressure sensor device described above can also be expressed as follows.

[0071] The pressure sensor device of the first aspect is A base substrate; a detection element mounted on an upper surface of the base substrate to detect pressure; a resin package provided on the upper surface of the base substrate, in which the detection element is embedded, and having an exposure hole that exposes a detection region that is a part of the detection element to the outside, A ground electrode electrically connected to ground is formed in at least a part of a boundary area of ​​the detection area with the inner surface of the resin package that defines the exposure hole.

[0072] The pressure sensor device of the second aspect is In the pressure sensor device of the first aspect, Further provided is a cover member that closes the opening of the exposure hole, The cover member has a through hole formed therein, which connects the exposure hole with the outside of the pressure sensor device.

[0073] The pressure sensor device of the third aspect is In the pressure sensor device of the second aspect, the cover member is made primarily of a dielectric material having a dielectric constant greater than that of air, When the maximum diameter of the through hole is D, the length of the lid member in the depth direction of the exposure hole is α, and the dielectric constant of the dielectric is ε, D satisfies the following formula. D ≥ α / ε

[0074] The pressure sensor device of the fourth aspect is In the pressure sensor device of the second or third aspect, A straight line connecting any position of the outer opening of the through hole that is opened to the outside of the pressure sensor device and any position of the part of the detection area other than the ground electrode intersects with the part of the cover member other than the through hole.

[0075] The pressure sensor device of the fifth aspect is In the pressure sensor device according to any one of the second to fourth aspects, The resin package is a base portion provided on the upper surface of the base substrate; a cylindrical portion protruding upward from the base portion and having the exposure hole, When viewed from the top-bottom direction, the base portion extends outward from the outer surface of the cylindrical portion, The cover member is a lower portion located inside the exposure hole; an upper portion located above the exposure hole and supported by the cylindrical portion, When viewed from the up-down direction, at least a part of the upper portion extends outward beyond the outer surface of the cylindrical portion.

[0076] Any of the various embodiments described above may be combined appropriately to achieve the effects of each of them.

[0077] While the present invention has been fully described in connection with preferred embodiments, with appropriate reference to the drawings, various changes and modifications will become apparent to those skilled in the art, and it is to be understood that such changes and modifications are included within the scope of the present invention as defined by the appended claims unless they depart therefrom. [Explanation of symbols]

[0078] 10 Pressure sensor device 20 Base board 20A top 30 Detector element 32 Electrode (Ground electrode) 50 Resin Package 51 Base 52 Cylinder part 52A inner surface 52B External surface 52C exposed hole 60 Lid member 60A through hole 60Aa Upper opening (outside opening) 70 Lid member 71 Lower part 72 Upper part 101 Up and down direction 102 detection area 103 Boundary area 105 Imaginary Line

Claims

1. A base substrate; a detection element mounted on an upper surface of the base substrate to detect pressure; a resin package provided on the upper surface of the base substrate, in which the detection element is embedded, and having an exposure hole that exposes a detection region that is a part of the detection element to the outside, The pressure sensor device has a ground electrode electrically connected to ground formed in at least a part of a boundary area between the detection area and the inner surface of the resin package that forms the exposure hole.

2. Further provided is a cover member that closes the opening of the exposure hole, The pressure sensor device according to claim 1 , wherein the cover member has a through hole formed therein for connecting the exposure hole to the outside of the pressure sensor device.

3. the cover member is made primarily of a dielectric material having a dielectric constant greater than that of air, 3. The pressure sensor device according to claim 2, wherein D satisfies the following formula, where D is the maximum diameter of the through hole, α is the length of the cover member in the depth direction of the exposure hole, and ε is the dielectric constant of the dielectric. D≧α / ε

4. 4. The pressure sensor device according to claim 2, wherein a straight line connecting any position of an outer opening of the through hole that is opened to the outside of the pressure sensor device and any position of a part of the detection area other than the ground electrode intersects with a part of the cover member other than the through hole.

5. The resin package is a base portion provided on the upper surface of the base substrate; a cylindrical portion protruding upward from the base portion and having the exposure hole, When viewed from the top-bottom direction, the base portion extends outward from the outer surface of the cylindrical portion, The cover member is a lower portion located inside the exposure hole; an upper portion located above the exposure hole and supported by the cylindrical portion, 4. The pressure sensor device according to claim 2, wherein at least a part of the upper portion extends outward beyond an outer surface of the cylindrical portion when viewed from the vertical direction.

Images