Disk device

Abstract

To provide a disc device capable of suppressing dust falling and out gas discharge from a side surface of a printed circuit board.SOLUTION: A disc device according to one embodiment includes a housing, a magnetic disc, a printed circuit board, and a film. The housing is provided with: an internal space filled with gas different from the air; and a through hole communicating between the internal space and an outside. The magnetic disc is arranged in the internal space. The printed circuit board has: a first surface fitted to the housing; a second surface located on a side opposite to the first surface; and a side surface provided between an outer edge of the first surface and an outer edge of the second surface, and is configured to seal the through hole. The film covers the side surface.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a disk drive. [Background technology]

[0002] A disk device such as a hard disk drive (HDD) includes, for example, a housing, a magnetic disk, and a printed wiring board (PWB). The magnetic disk is disposed in the internal space of the housing. The internal space of the housing may be filled with a gas other than air, such as helium. In this case, the PWB seals the through-holes in the housing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-179583 Summary of the Invention [Problem to be solved by the invention]

[0004] The insulating portion of the PWB is exposed on the side of the PWB, and dust may fall off or outgas from the exposed insulating portion.

[0005] One example of the problem to be solved by the present invention is to provide a disk drive that can suppress the falling off of dust and the emission of outgassing from the side surfaces of a printed wiring board. [Means for solving the problem]

[0006] A disk drive according to one embodiment includes a housing, a magnetic disk, a printed wiring board, and a film. The housing has an internal space filled with a gas other than air and a through-hole connecting the internal space to the outside. The magnetic disk is disposed in the internal space. The printed wiring board has a first surface attached to the housing, a second surface positioned opposite the first surface, and a side surface provided between the outer edge of the first surface and the outer edge of the second surface, and is configured to seal the through-hole. The film covers the side surface. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is an exemplary perspective view showing an exploded HDD according to the first embodiment. [Figure 2] FIG. 2 is an exemplary perspective view showing the HDD of the first embodiment in an exploded state, viewed from a different direction than FIG. [Figure 3] FIG. 3 is an exemplary plan view showing a part of the housing and the relay board according to the first embodiment. [Figure 4] FIG. 4 is an exemplary cross-sectional view showing a part of the HDD of the first embodiment taken along line F4-F4 in FIG. [Figure 5] FIG. 5 is an exemplary plan view showing a PWB in a manufacturing process of the first embodiment. [Figure 6] FIG. 6 is an exemplary plan view showing a part of a housing and a relay substrate according to the second embodiment. [Figure 7] FIG. 7 is an exemplary plan view showing a part of a housing and a relay substrate according to the third embodiment. [Figure 8] FIG. 8 is an exemplary cross-sectional view showing a part of an HDD according to the fourth embodiment. [Figure 9] FIG. 9 is an exemplary cross-sectional view showing a part of an HDD according to the fifth embodiment. [Figure 10] FIG. 10 is an exemplary cross-sectional view showing a part of an HDD according to the sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] (First embodiment) The first embodiment will be described below with reference to FIGS. 1 to 5. In this specification, components according to the embodiment and descriptions of the components may be described using multiple expressions. The components and their descriptions are merely examples and are not limited by the expressions in this specification. The components may also be identified by names different from those in this specification. Furthermore, the components may also be described using expressions different from those in this specification.

[0009] In the following description, "suppress" is defined as, for example, preventing an event, action, or influence from occurring, or reducing the severity of an event, action, or influence. Also, in the following description, "restrict" is defined as, for example, preventing movement or rotation, or allowing movement or rotation within a predetermined range and preventing movement or rotation beyond the predetermined range.

[0010] Fig. 1 is an exemplary perspective view showing an exploded hard disk drive (HDD) 10 according to the first embodiment. Fig. 2 is an exemplary perspective view showing the HDD 10 of the first embodiment exploded and viewed from a different direction than Fig. 1. The HDD 10 is an example of a disk device, and may also be called an electronic device, a storage device, an external storage device, or a magnetic disk device.

[0011] As shown in the drawings, for convenience, the X-axis, Y-axis, and Z-axis are defined in this specification. The X-axis, Y-axis, and Z-axis are perpendicular to one another. The X-axis is aligned along the width of the HDD 10. The Y-axis is aligned along the length of the HDD 10. The Z-axis is aligned along the thickness of the HDD 10.

[0012] Furthermore, in this specification, the X direction, Y direction, and Z direction are defined. The X direction is a direction along the X axis, and includes the +X direction indicated by the X axis arrow and the -X direction opposite to the X axis arrow. The Y direction is a direction along the Y axis, and includes the +Y direction indicated by the Y axis arrow and the -Y direction opposite to the Y axis arrow. The Z direction is a direction along the Z axis, and includes the +Z direction indicated by the Z axis arrow and the -Z direction opposite to the Z axis arrow.

[0013] As shown in FIG. 1, the HDD 10 includes a housing 11, multiple magnetic disks 12, a spindle motor 13, a head stack assembly (HSA) 14, and a voice coil motor (VCM) 15. The magnetic disks 12 may also be referred to as disks or platters. As shown in FIG. 2, the HDD 10 further includes a printed circuit board (PCB) 16 and an interconnect board 17.

[0014] 1, the housing 11 is formed in a box shape with an internal space S. A plurality of magnetic disks 12, a spindle motor 13, an HSA 14, and a VCM 15 are arranged in the internal space S. The housing 11 has a base 21, an inner cover 22, and an outer cover 23. However, the housing 11 is not limited to this example.

[0015] The base 21, the inner cover 22, and the outer cover 23 are each made of a metal material such as an aluminum alloy, but the materials of the base 21, the inner cover 22, and the outer cover 23 may be different from each other.

[0016] The base 21 is formed in a substantially rectangular box shape that is open in the +Z direction. An internal space S is provided inside the base 21 and communicates with the outside through an end of the base 21 in the +Z direction. The base 21 has a bottom wall 31 and a side wall 32.

[0017] The bottom wall 31 is formed in a substantially rectangular (quadrilateral) plate shape arranged substantially perpendicular to the Z direction. As shown in Fig. 2, a through hole 35 is provided in the bottom wall 31. The through hole 35 penetrates the bottom wall 31 substantially in the Z direction and connects the internal space S to the outside. The side wall 32 protrudes from the edge of the bottom wall 31 substantially in the +Z direction and is formed in a substantially rectangular frame shape.

[0018] 1, the inner cover 22 is attached to the side wall 32, for example, by screws. In this way, the inner cover 22 covers the internal space S. A gasket, for example, is disposed between the inner cover 22 and the side wall 32. The gasket seals the gap between the inner cover 22 and the side wall 32. The outer cover 23 covers the inner cover 22 and is attached to the side wall 32, for example, by welding.

[0019] An air vent 36 is provided in the inner cover 22. Furthermore, an air vent 37 is provided in the outer cover 23. After components are attached inside the base 21 and the inner cover 22 and the outer cover 23 are attached to the base 21, air is evacuated from the internal space S through the air vents 36 and 37. Furthermore, the internal space S is filled with a gas other than air.

[0020] The gas filled in the internal space S is, for example, a low-density gas having a density lower than that of air, an inert gas having low reactivity, etc. For example, helium is filled in the internal space S. Note that other fluids may also be filled inside the housing 11.

[0021] For example, a seal 38 closes the ventilation hole 37 of the outer cover 23. The seal 38 airtightly seals the ventilation hole 37 and restricts the gas filled in the internal space S from leaking out through the ventilation hole 37. Note that the ventilation holes 36, 37 may be sealed by other methods.

[0022] The magnetic disks 12 are arranged in the Z direction with gaps between them. The magnetic disks 12 are formed in the shape of disks and arranged substantially perpendicular to the Z direction. A magnetic recording layer is provided on the surface of each magnetic disk 12.

[0023] The spindle motor 13 supports the plurality of magnetic disks 12. The plurality of magnetic disks 12 are held on a hub of the spindle motor 13 by, for example, clamp springs. The spindle motor 13 rotates the plurality of magnetic disks 12 together around a central axis Axd.

[0024] The central axis Axd is an imaginary axis that extends substantially in the Z direction. The central axis Axd is, for example, the central axis of the magnetic disk 12 and the spindle motor 13. However, the central axis Axd is not limited to this example.

[0025] The HSA 14 includes a carriage 41, a plurality of head gimbal assemblies (HGA) 42, and a flexible printed circuit board (FPC) 43. However, the HSA 14 is not limited to this example.

[0026] The carriage 41 is attached to the base 21 so as to be rotatable around a central axis Axc. The central axis Axc is an imaginary axis that extends substantially in the Z direction. The central axis Axc is spaced apart from the central axis Axd.

[0027] The multiple HGAs 42 are attached to arms of the carriage 41 and rotate integrally with the carriage 41 around the central axis Axc. The multiple HGAs 42 are aligned in the Z direction with gaps between them. Each of the multiple HGAs 42 has a base plate 45, a load beam 46, a flexure 47, and a magnetic head 48. The magnetic head 48 may also be referred to as a slider.

[0028] The base plate 45 and the load beam 46 are made of, for example, stainless steel. The base plate 45 is formed in a plate shape and is attached to the arm of the carriage 41. The load beam 46 is formed in a plate shape that is thinner than the base plate 45. The load beam 46 is attached to the base plate 45.

[0029] The flexure 47 is a type of flexible printed wiring board formed in a long, thin strip shape, and includes, for example, a metal backing plate, an insulating base layer, a conductive layer, and an insulating cover layer.

[0030] The flexure 47 extends along the carriage 41, the base plate 45, and the load beam 46. A rotatable gimbal portion is provided at one end of the flexure 47. A magnetic head 48 is mounted on the gimbal portion of the flexure 47. Therefore, the magnetic head 48 moves relative to the magnetic disk 12 in accordance with the rotation of the carriage 41.

[0031] The magnetic head 48 records and reproduces information on a corresponding one of the plurality of magnetic disks 12. In other words, the magnetic head 48 reads and writes information from and to the magnetic disk 12.

[0032] One end of the FPC 43 is attached to the carriage 41. The other ends of the multiple flexures 47 are connected to the FPC 43. Therefore, the flexures 47 electrically connect the magnetic head 48 and the FPC 43. The other end of the FPC 43 is attached to the bottom wall 31. A portion of the FPC 43 flexes between the carriage 41 and the bottom wall 31 in response to the rotation of the carriage 41.

[0033] The VCM 15 rotates the carriage 41 around the central axis Axc to move the magnetic head 48 to a desired position along the magnetic disk 12. The VCM 15 has a voice coil, a pair of yokes, and a magnet attached to the yokes. The voice coil is held by the carriage 41.

[0034] 2, the PCB 16 and the relay board 17 are disposed outside the internal space S and attached to the bottom wall 31. The relay board 17 is located between the PCB 16 and the bottom wall 31. It should be noted that the relay board 17 may also be disposed inside the internal space S.

[0035] The PCB 16 has various electronic components such as an interface (I / F) connector that is connected to a host computer and a controller that controls the operation of the HDD 10.

[0036] FIG. 3 is an exemplary plan view showing a portion of the housing 11 and the relay board 17 of the first embodiment. FIG. 4 is an exemplary cross-sectional view showing a portion of the HDD 10 of the first embodiment along line F4-F4 in FIG. 3. For convenience, FIG. 4 shows the HSA 14 and PCB 16 virtually with two-dot chain lines. As shown in FIG. 4, the relay board 17 connects the PCB 16 and the FPC 43.

[0037] The relay board 17 includes a printed wiring board (PWB) 51, two relay connectors 52 and 53, and a plating 54. Note that the relay board 17 is not limited to this example. The relay connectors 52 and 53 are an example of electronic components. The plating 54 is an example of a metal film.

[0038] The HDD 10 further includes an adhesive 55. The adhesive 55 is made of synthetic resin and is an example of a resin film. The PWB 51 is adhered to the bottom wall 31 of the housing 11 by the adhesive 55, and hermetically seals the through-hole 35. The PWB 51 has a first surface 51a, a second surface 51b, and a side surface 51c.

[0039] The first surface 51a and the second surface 51b are each formed to be substantially flat. The first surface 51a faces substantially in the +Z direction. The first surface 51a faces the bottom wall 31 and the through-hole 35, and is attached to the bottom wall 31 of the housing 11 by the adhesive 55. That is, the adhesive 55 bonds the first surface 51a and the housing 11 to each other. The second surface 51b is located on the opposite side of the first surface 51a. The second surface 51b faces the PCB 16.

[0040] The side surface 51c is provided between the outer edge of the first surface 51a and the outer edge of the second surface 51b. The side surface 51c faces in a direction substantially perpendicular to the Z axis. In other words, the side surface 51c faces in a direction along the first surface 51a.

[0041] 3, the side surface 51c has a plurality of regions 51d, 51e, and 51f. Each of the regions 51d, 51e, and 51f is a part of the side surface 51c. The PWB 51 also has four protrusions 56.

[0042] Each of the four protrusions 56 protrudes from region 51d. Regions 51e and 51f are provided on each of the four protrusions 56. That is, protrusions 56 have a part of side surface 51c. Region 51e is connected to region 51d. Region 51f is provided at an end of protrusion 56 and is connected to region 51e.

[0043] As shown in FIG. 4, the PWB 51 of this embodiment is a rigid substrate such as a glass epoxy substrate, and is also a build-up substrate. The PWB 51 may be another rigid substrate or a flexible printed wiring board. The PWB 51 has five insulating layers 61, 62, 63, 64, and 65, four conductive layers 71, 72, 73, and 74, and a plurality of vias 75. The PWB 51 is not limited to this example.

[0044] At least one of the insulating layers 61, 62, and 63 may also be referred to as an insulating substrate. Each of the insulating layers 61, 62, and 63 includes, for example, glass fiber and a synthetic resin such as epoxy resin or polyimide (PI). However, the insulating layers 61, 62, and 63 are not limited to this example. The insulating layers 64 and 65 are, for example, solder resist.

[0045] Five insulating layers 61, 62, 63, 64, and 65 are stacked in the Z direction. The insulating layer 61 is located between the two insulating layers 62 and 63. The insulating layer 62 is located between the two insulating layers 61 and 64. The insulating layer 63 is located between the two insulating layers 61 and 65.

[0046] Each of the insulating layers 61, 62, and 63 has an end face 81 in a direction along the first surface 51a. The side face 51c of the PWB 51 has the end faces 81 of the insulating layers 61, 62, and 63. The side face 51c may further have an end face of at least one of the insulating layers 64 and 65 and the conductive layers 71, 72, 73, and 74.

[0047] The insulating layer 62 further has a surface 82. The surface 82 is formed to be approximately flat and faces approximately in the +Z direction. The insulating layer 64 covers the surface 82. The insulating layer 63 further has a surface 83. The surface 83 is formed to be approximately flat and faces approximately in the -Z direction. The insulating layer 65 covers the surface 83.

[0048] Each of the conductive layers 71, 72, 73, and 74 is made of a metal material such as copper. The conductive layer 71 is provided between the two insulating layers 61 and 62. The conductive layer 72 is provided between the two insulating layers 61 and 63. The conductive layer 73 is provided on the surface 82 and is located between the two insulating layers 62 and 64. The conductive layer 74 is provided on the surface 83 and is located between the two insulating layers 63 and 65.

[0049] Each of the conductive layers 71, 72, 73, and 74 has at least one of a wiring 85, a pad 86, and a ground plane 87. The ground plane 87 is an example of a conductor set to ground potential. Each of the conductive layers 73 and 74 has a plurality of pads 86.

[0050] Each of the vias 75 penetrates at least one of the insulating layers 61, 62, and 63 and connects at least two of the four conductive layers 71, 72, 73, and 74. Each of the vias 75 is, for example, a blind via or a buried via. The pads 86 of the conductive layer 73 and the pads 86 of the conductive layer 74 are electrically connected to each other through the vias 75.

[0051] Insulating layer 64 covers traces 85 and ground plane 87 of conductive layer 73. For example, insulating layer 64, exposed surface 82 of insulating layer 62, and exposed pads 86 of conductive layer 73 form first surface 51a of PWB 51. In other words, pads 86 of conductive layer 73 are provided on first surface 51a of PWB 51.

[0052] Insulating layer 65 covers traces 85 of conductive layer 74 and ground plane 87. For example, insulating layer 65, exposed surface 83 of insulating layer 63, and exposed pads 86 of conductive layer 74 form second side 51b of PWB 51. In other words, pads 86 of conductive layer 74 are provided on second side 51b of PWB 51.

[0053] Each of the two relay connectors 52 and 53 has a frame 91 and a plurality of leads 92. The frame 91 is made of, for example, synthetic resin. The leads 92 are made of a metal material and attached to the frame 91.

[0054] The multiple leads 92 are connected to the pads 86 by, for example, solder 95. The relay connector 52 is mounted on the first surface 51a of the PWB 51 by connecting the leads 92 to the pads 86 on the conductive layer 73. The relay connector 52 is disposed in the through hole 35. The relay connector 53 is mounted on the second surface 51b of the PWB 51 by connecting the leads 92 to the pads 86 on the conductive layer 74.

[0055] The plating 54 is made of a metal material such as copper, similar to the conductive layers 71, 72, 73, and 74. The material of the plating 54 and the material of the conductive layers 71, 72, 73, and 74 may be different from each other.

[0056] The plating 54 is electrically connected to the ground plane 87. For example, the plating 54 and the ground plane 87 are integrally formed. The plating 54 may be electrically connected to the ground plane 87 through a wiring 85, for example.

[0057] The plating 54 has two surface platings 101 and 102 and a side plating 103. Each of the surface platings 101 and 102 is connected to the side plating 103. Note that at least one of the surface platings 101 and 102 may be omitted from the plating 54.

[0058] The surface plating 101 covers a portion of the first surface 51a. For example, the surface plating 101 covers the exposed surface 82 of the insulating layer 62 and adheres to the surface 82. In this embodiment, the surface plating 101 is formed in a frame shape that extends along the outer edge of the first surface 51a of the PWB 51 and covers the entire outer edge of the first surface 51a.

[0059] The surface plating 102 covers a portion of the second surface 51b. For example, the surface plating 102 covers the exposed surface 83 of the insulating layer 63 and adheres to the surface 83. As shown in FIG. 3 , the surface plating 102 of this embodiment is formed in a frame shape that extends along the outer edge of the second surface 51b of the PWB 51 and covers the entire outer edge of the second surface 51b.

[0060] The side surface plating 103 covers at least a portion of the side surface 51c. For example, the side surface plating 103 covers regions 51d and 51e of the side surface 51c. In this embodiment, the side surface plating 103 does not cover region 51f of the side surface 51c and is spaced apart from region 51f. Note that the side surface plating 103 is not limited to this example.

[0061] Areas 51d and 51e of side surface 51c that are covered with side surface plating 103 are larger than area 51f of side surface 51c that is not covered with side surface plating 103 and is separated from side surface plating 103. Note that side surface 51c is not limited to this example.

[0062] As shown in FIG. 4, a portion of adhesive 55 covers region 51f of side surface 51c. Plating 54 and adhesive 55 form protective film 110. That is, HDD 10 has protective film 110 covering side surface 51c. Protective film 110 includes metal plating 54 and resin adhesive 55. Note that protective film 110 is not limited to this example. Protective film 110 is an example of a film. Instead of adhesive 55, another resin film may cover side surface 51c.

[0063] In this embodiment, the protective film 110 covers substantially the entire side surface 51c. That is, the regions 51d, 51e, and 51f of the side surface 51c that are covered with the protective film 110 are larger than the regions of the side surface 51c that are not covered with the protective film 110 and are spaced apart from the protective film 110.

[0064] The HSA 14 further includes a relay connector 121 mounted on an end of the FPC 43. The relay connector 121 is connected to the relay connector 52. As a result, the PWB 51 is electrically connected to the magnetic head 48 through the relay connectors 52 and 121, the FPC 43, and the flexure 47. In other words, the FPC 43 electrically connects the magnetic head 48 and the PWB 51.

[0065] The PCB 16 further includes a relay connector 125. The relay connector 125 is connected to the relay connector 53. As a result, the controller of the PCB 16 is electrically connected to the magnetic head 48 through the relay connectors 125 and 53, the PWB 51, the relay connectors 52 and 121, the FPC 43, and the flexure 47.

[0066] 5 is an exemplary plan view showing a PWB 51 in a manufacturing process of the first embodiment. As shown in FIG. 5, in the manufacturing process of the PWB 51, a panel 130 is manufactured by a build-up method. The panel 130 has a plurality of PWBs 51 and a plurality of hanging portions 131. The PWBs 51 and the hanging portions 131 are integrally formed.

[0067] Each of the hanging portions 131 connects two adjacent ones of the PWBs 51. For example, the hanging portions 131 are cut with a router bit, thereby separating the PWBs 51 from the panel 130.

[0068] The protrusion 56 is a part of the hanging portion 131 that has been cut with, for example, a router bit. The region 51f of the side surface 51c is a surface of the protrusion 56 that has been formed by cutting with the router bit. Therefore, the region 51f is not covered with the plating 54.

[0069] When the relay board 17 is attached to the bottom wall 31 of the housing 11, for example, a dispenser supplies adhesive 55 between the bottom wall 31 and the first surface 51a. The dispenser then applies adhesive 55 to the region 51f. As a result, the region 51f exposed by cutting is covered with adhesive 55.

[0070] 4, the side surface 51c of the PWB 51 has end faces 81 of the insulating layers 61, 62, and 63. That is, at least a portion of the side surface 51c includes glass fiber and synthetic resin, which are the materials of the insulating layers 61, 62, and 63.

[0071] If the side surface 51c is exposed, dust such as glass fibers or synthetic resin particles may fall off from the side surface 51c, and outgassing may occur. However, the protective film 110 of this embodiment covers the side surface 51c, thereby preventing dust from falling off from the side surface 51c and preventing outgassing from occurring from the side surface 51c. Therefore, the protective film 110 prevents dust and outgassing from contaminating the manufacturing equipment, such as a curing furnace, and the HDD 10.

[0072] In the HDD 10 according to the first embodiment described above, the housing 11 is provided with an internal space S and a through-hole 35. The internal space S is filled with a gas other than air. The through-hole 35 connects the internal space S to the outside. The magnetic disk 12 is provided in the internal space S. The PWB 51 has a first surface 51a, a second surface 51b, and a side surface 51c, and is configured to seal the through-hole 35. The first surface 51a is attached to the housing 11. The second surface 51b is located on the opposite side of the first surface 51a. The side surface 51c is provided between the outer edge of the first surface 51a and the outer edge of the second surface 51b. A protective film 110 covers the side surface 51c.

[0073] Typically, the PWB 51 has an insulating layer. The insulating layer includes, for example, glass fiber and synthetic resin. If the side surface 51c of the PWB 51 is exposed, dust such as glass fiber and synthetic resin may fall off or outgas from the side surface 51c. The HDD 10 can prevent dust from falling off and outgas from being released from the side surface 51c by covering the side surface 51c with the protective film 110. This prevents the HDD 10 from contaminating the manufacturing equipment for the PWB 51 and ultimately prevents dust from entering the internal space S in the manufacturing equipment.

[0074] The protective film 110 has a metal film, the plating 54. Metals generally allow gas less easily than resins. Therefore, the plating 54 can more reliably prevent outgassing from the side surface 51c. Furthermore, the plating 54 can be formed simultaneously with, for example, the conductive layers 71, 72, 73, and 74 and the vias 75 of the PWB 51. Therefore, the HDD 10 can easily manufacture the PWB 51 and the protective film 110.

[0075] The metallic protective film 110 is electrically connected to a conductor set to the ground potential, thereby enabling the metallic protective film 110 to suppress the generation of noise.

[0076] The PWB 51 has a ground plane 87. The metallic protective film 110 is electrically connected to the ground plane 87. For example, the metallic protective film 110 may have a copper foil extending from the ground plane 87. Therefore, the HDD 10 can easily manufacture the PWB 51 and the protective film 110.

[0077] The protective film 110 has a resin film, which is an adhesive 55. This allows the protective film 110 to cover the side surface 51c even if it is difficult to provide a metal film on the side surface 51c of the PWB 51 in terms of the wiring design of the PWB 51.

[0078] The adhesive 55 has a resin film that covers the side surface 51c and bonds the first surface 51a to the housing 11. That is, the adhesive 55 that bonds the first surface 51a to the housing 11 covers the side surface 51c of the PWB 51. This makes it possible to easily manufacture the PWB 51 and the protective film 110 of the HDD 10.

[0079] The protective film 110 also covers the first surface 51a and the second surface 51b. When manufacturing the PWB 51, multiple PWBs 51 are manufactured integrally and then separated from one another. At this time, there is a possibility that the protective film 110 will peel off from the side surface 51c. However, because the protective film 110 covers not only the side surface 51c but also the first surface 51a and the second surface 51b, it firmly adheres to the PWB 51. Therefore, the protective film 110 can be prevented from peeling off from the side surface 51c.

[0080] The protective film 110 covers the entire outer edge of the first surface 51a and the entire outer edge of the second surface 51b, thereby firmly adhering the protective film 110 to the PWB 51. Furthermore, the protective film 110 covers the corner between the side surface 51c and the first surface 51a and the corner between the side surface 51c and the second surface 51b, thereby preventing dust from falling off and outgassing from the corners.

[0081] Areas 51d, 51e, and 51f of side surface 51c that are covered by protective film 110 are larger than areas of side surface 51c that are separated from protective film 110. This allows HDD 10 to more effectively prevent dust from falling off and outgassing from side surface 51c.

[0082] The PWB 51 has multiple stacked insulating layers 61, 62, and 63. The side surface 51c has end faces 81 of the multiple insulating layers 61, 62, and 63 in the direction along the first surface 51a. That is, the protective film 110 collectively covers the side surface 51c of the PWB 51, which is a multilayer substrate. This makes it easier to manufacture the PWB 51 and the protective film 110 in the HDD 10.

[0083] The magnetic head 48 is disposed in the internal space S and is configured to read and write information from and to the magnetic head 48. The FPC 43 is disposed in the internal space S and electrically connects the magnetic head 48 to the PWB 51. That is, the PWB 51 can electrically connect components such as a controller located outside the internal space S to the magnetic head 48 and seal the through-hole 35.

[0084] The PWB 51 is located outside the internal space S. This prevents the internal space S from being contaminated by the PWB 51 even if dust falls off from the PWB 51 and outgassing occurs.

[0085] (Second embodiment) The second embodiment will be described below with reference to Fig. 6. In the following description of the embodiments, components having the same functions as components already described are given the same reference numerals as the components already described, and further description may be omitted. Furthermore, components given the same reference numerals do not necessarily have all the same functions and properties, and may have different functions and properties according to each embodiment.

[0086] 6 is an exemplary plan view showing a portion of the housing 11 and the relay substrate 17 according to the second embodiment. As shown in FIG. 6, the plating 54 of the second embodiment has a plurality of surface platings 201 and 202 instead of the surface platings 101 and 102. Note that the surface platings 201 and 202 are substantially the same as the surface platings 101 and 102, except for the points described below.

[0087] Four surface platings 201 cover the first surface 51a. The four surface platings 201 are spaced apart from one another and connected to the side surface plating 103 near the four protrusions 56. As a result, part of the outer edge of the first surface 51a is exposed and not covered by the plating 54.

[0088] Four surface platings 202 cover the second surface 51b. The four surface platings 202 are spaced apart from one another and connected to the side surface plating 103 near the four protrusions 56. As a result, part of the outer edge of the second surface 51b is exposed and not covered by the plating 54. The four surface platings 201 and the four surface platings 202 have substantially the same shape.

[0089] In the HDD 10 of the second embodiment described above, the plating 54 is spaced apart from at least one of a portion of the outer edge of the first surface 51a and a portion of the outer edge of the second surface 51b. That is, the plating 54 does not need to cover the entire outer edge of the first surface 51a or the entire outer edge of the second surface 51b. This allows the HDD 10 to improve the flexibility of the wiring design of the PWB 51.

[0090] (Third embodiment) The third embodiment will be described below with reference to FIG. 7. FIG. 7 is an exemplary plan view showing a portion of the housing 11 and the relay board 17 according to the third embodiment. As shown in FIG. 7, the side surface 51c of the third embodiment has regions 51g, 51h, 51i, 51j, and 51k instead of regions 51d, 51e, and 51f. Region 51g is an example of a first region. Region 51h is an example of a second region. Furthermore, the PWB 51 has four protrusions 301 instead of four protrusions 56.

[0091] Each of the regions 51g, 51h, 51i, 51j, and 51k is part of the side surface 51c. Each of the four regions 51h forms (defines, defines) a recess 305. The recess 305 is a notch recessed from the region 51g. The region 51h is connected to the region 51g.

[0092] The four protrusions 301 protrude from the four regions 51h. The protrusions 301 are located inside the recesses 305. In other words, the protrusions 301 do not extend beyond the regions 51g to the outside of the recesses 305.

[0093] Regions 51i, 51j, and 51k are provided in each of the four protrusions 301. Region 51i is connected to region 51h. Region 51j is connected to regions 51i and 51k and is provided between regions 51i and 51k. Region 51k has a semi-cylindrical curved surface and forms (defines, defines) a notch 307. Notch 307 is recessed from region 51j.

[0094] The plating 54 of the third embodiment has a plurality of side platings 311, 312 instead of the side plating 103. The side platings 311, 312 are substantially identical to the side plating 103, except as described below.

[0095] The side surface plating 311 covers regions 51g, 51h, and 51i of the side surface 51c. The side surface plating 312 is spaced apart from the side surface plating 311. The side surface plating 312 covers region 51k of the side surface 51c. The side surface platings 311 and 312 do not cover region 51j of the side surface 51c, and are spaced apart from region 51j. In other words, the protective film 110 covers region 51g, region 51h, and part of the protrusion 301.

[0096] 7 shows a panel 320 and multiple hanging portions 321 of the third embodiment in virtual form, indicated by two-dot chain lines. The panel 320 and hanging portions 321 are substantially identical to the panel 130 and hanging portion 131, except as described below. In the third embodiment, a through hole 325 is provided in the hanging portion 321. The side plating 312 is the conductor of the through hole 325.

[0097] For example, the router bit cuts the hanging portion 321 from region 51i, which is one side surface of the hanging portion 321, to the through-hole 325. Next, the router bit cuts the hanging portion 321 from region 51i, which is the other side surface of the hanging portion 321, to the through-hole 325. In this way, the router bit cuts the hanging portion 321.

[0098] The router bit applies force to plating 54 at the end of the cut portion in a direction that causes plating 54 to peel off from side surface 51c. However, by cutting hanging portion 321 from both sides, the router bit can prevent plating 54 from peeling off from side surface 51c.

[0099] The router bit cuts the hanging portion 321 so as to remove a portion of the through-hole 325. The protruding portion 301 is, for example, a portion of the hanging portion 321 that has been cut by the router bit. The notch 307 is a remaining portion of the through-hole 325. The region 51j on the side surface 51c is the surface of the protruding portion 301 that has been formed by cutting with the router bit. Therefore, the region 51j is not covered with the plating 54.

[0100] The side surface plating 311 covering the region 51i and the side surface plating 312 covering the region 51k are disposed close to each other, so that the region 51j not covered by the plating 54 is set to be relatively small.

[0101] In the HDD 10 of the third embodiment described above, the side surface 51c has an area 51g and an area 51h. The area 51h forms a recess 305 recessed from the area 51g. The PWB 51 has a protrusion 301 that protrudes from the area 51h and is located inside the recess 305. The protective film 110 covers the area 51g, the area 51h, and a portion of the protrusion 301.

[0102] During the manufacturing of the PWB 51, multiple PWBs 51 are manufactured as a single unit and then separated from one another. For example, the hanging portions 321 connecting two adjacent PWBs 51 are cut. The portions of the hanging portions 321 remaining on the PWB 51 become the protruding portions 301. By cutting the hanging portions 321 (protruding portions 301) with a tool such as a router bit used to cut the hanging portions 321, it is possible to prevent the tool from coming into contact with the side surface 51c, thereby reducing the amount of protective film 110 removed by the tool. Because the protruding portions 301 are located inside the recessed portions 305, they do not protrude beyond the region 51g. This prevents the protruding portions 301 from creating burrs that could interfere with other components.

[0103] (Fourth embodiment) The fourth embodiment will be described below with reference to FIG. 8. FIG. 8 is an exemplary cross-sectional view showing a portion of an HDD 10 according to the fourth embodiment. As shown in FIG. 8, the multiple leads 92 of the fourth embodiment include a ground line 401. The ground line 401 is an example of a terminal.

[0104] The ground line 401 is set to the ground potential and is connected to one of the pads 86 that is set to the ground potential by solder 95. The ground line 401 is electrically connected to another ground such as the base 21 through, for example, the relay connector 121 or the relay connector 125.

[0105] The protective film 110 of the fourth embodiment has a plating 411 instead of the plating 54. The plating 411 is substantially the same as the plating 54, except for the points described below. The plating 411 is electrically connected to the ground line 401, for example, through the wiring 85 and the pad 86. Therefore, the plating 411 is electrically connected to a conductor set to the ground potential.

[0106] In the fourth embodiment, the adhesive 55 may be conductive. For example, the adhesive 55 may contain a metal filler. The adhesive 55 bonds the plating 411 and the base 21 to each other and electrically connects the plating 411 and the base 21. Therefore, the plating 411 is electrically connected to the base 21, which is ground, through the conductive adhesive 55.

[0107] In the HDD 10 of the fourth embodiment described above, the relay connector 53 has a ground line 401 and is mounted on the PWB 51. The ground line 401 is set to a ground potential. The plating 411 is electrically connected to the ground line 401. This allows the plating 411 to be electrically connected to a ground outside the PWB 51.

[0108] (Fifth embodiment) The fifth embodiment will be described below with reference to Fig. 9. Fig. 9 is an exemplary cross-sectional view showing a portion of an HDD 10 according to the fifth embodiment. As shown in Fig. 9, a plurality of through holes 501 are provided in a PWB 51 of the fifth embodiment.

[0109] The through hole 501 connects the two conductive layers 73, 74. The through hole 501 is spaced apart from the through hole 35 in a direction along the first surface 51a. In other words, the through hole 501 is located outside the inner edge of the through hole 35. Therefore, the bottom wall 31 of the housing 11 covers the through hole 501.

[0110] In the HDD 10 of the fifth embodiment described above, the PWB 51 is provided with a through-hole 501. The through-hole 501 is spaced apart from the through-hole 35 in the direction along the first surface 51a. This prevents the PWB 51 from connecting the internal space S with the outside through the through-hole 501.

[0111] (Sixth embodiment) The sixth embodiment will be described below with reference to Fig. 10. Fig. 10 is an exemplary cross-sectional view showing a portion of an HDD 10 according to the sixth embodiment. As shown in Fig. 10, a plurality of through holes 601 are provided in a PWB 51 of the sixth embodiment.

[0112] The through hole 601 connects the two conductive layers 73 and 74. The through hole 601 overlaps the through hole 35 in the Z direction. Note that the through hole 601 may be spaced apart from the through hole 35.

[0113] The PWB 51 of the sixth embodiment further includes a resin 611. The resin 611 is, for example, a synthetic resin such as epoxy resin or PI. The resin 611 fills the through-holes 601. As a result, the resin 611 hermetically seals the through-holes 601.

[0114] In the HDD 10 of the sixth embodiment described above, the PWB 51 is provided with the through-holes 601. The PWB 51 has resin 611 filled in the through-holes 601. This prevents the PWB 51 from connecting the internal space S with the outside through the through-holes 601.

[0115] The structures of the fourth to sixth embodiments described above may be applied to any of the first to third embodiments.

[0116] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0117] 10...hard disk drive (HDD), 11...casing, 12...magnetic disk, 35...through hole, 43...flexible printed circuit board (FPC), 48...magnetic head, 51...printed wiring board (PWB), 51a...first surface, 51b...second surface, 51c...side surface, 51g, 51h...area, 52, 53...relay connector, 54, 411...plating, 55...adhesive, 61, 62, 63...insulating layer, 81...end surface, 87...ground plane, 110...protective film, 301...convex portion, 305...concave portion, 401...ground line, 501, 601...through hole, 611...resin, S...internal space.

Claims

1. a housing provided with an internal space filled with a gas other than air and a through hole communicating the internal space with the outside; a magnetic disk disposed in the internal space; a printed wiring board having a first surface attached to the housing, a second surface located opposite to the first surface, and a side surface provided between an outer edge of the first surface and an outer edge of the second surface, the printed wiring board being configured to seal the through hole; a film covering the side surface; A disk device comprising:

2. The membrane comprises a metallic membrane.

2. The disk device according to claim 1.

3. The metal film is electrically connected to a conductor set to a ground potential.

3. The disk device according to claim 2.

4. the printed wiring board has a ground plane; the metallic film is electrically connected to the ground plane; 4. The disk device according to claim 3.

5. an electronic component having a terminal set to a ground potential and mounted on the printed wiring board; Further comprising: The metal film is electrically connected to the terminal.

4. The disk device according to claim 3.

6. The membrane has a resin membrane.

6. A disk device according to claim 1.

7. an adhesive having the resin film and bonding the first surface and the housing together; 7. The disk drive of claim 6, further comprising:

8. the film further covers the first surface and the second surface; 2. The disk device according to claim 1.

9. The film covers the entire outer edge of the first surface and the entire outer edge of the second surface.

9. The disk device according to claim 8.

10. the side surface has a first region and a second region forming a recess recessed from the first region, the printed wiring board has a protrusion protruding from the second region and positioned inside the recess, the film covers the first region, the second region, and a part of the convex portion; 2. The disk device according to claim 1.

11. a through hole is provided in the printed wiring board, the through hole is spaced apart from the penetrating hole in a direction along the first surface; 2. The disk device according to claim 1.

12. The printed wiring board has through holes formed therein and a resin filled in the through holes.

2. The disk device according to claim 1.

13. an area of ​​the side surface covered by the film is larger than an area of ​​the side surface separated from the film; 2. The disk device according to claim 1.

14. The printed wiring board has a plurality of stacked insulating layers, the side surfaces include end surfaces of the plurality of insulating layers in a direction along the first surface; 2. The disk device according to claim 1.

15. a magnetic head disposed in the interior space and configured to read and write information from and to the magnetic disk; a flexible printed circuit board disposed in the internal space and electrically connecting the magnetic head and the printed wiring board; 2. The disk drive of claim 1, further comprising:

16. The printed wiring board is located outside the internal space.

2. The disk device according to claim 1.

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