Method for manufacturing liquid jet head

Abstract

To provide a method for manufacturing a liquid jet head which can easily align a plurality of head modules.SOLUTION: A method for manufacturing a liquid jet head, which includes a plurality of head modules each having a chip including at least a nozzle plate formed with a plurality of nozzles and a flow channel opening formation member, and a holder for holding the plurality of head modules, includes: a first positioning step of optically positioning the nozzle plate and the flow channel opening formation member, with the nozzles as a reference; and a second positioning step of press-fitting one of the first positioning part of the flow channel opening formation member and the second positioning part of the holder into the other positioning part, and thereby positioning the head module and the holder.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a liquid jet head. [Background technology]

[0002] 2. Description of the Related Art Liquid ejection apparatuses equipped with liquid ejection heads that eject liquid such as ink onto a medium such as printing paper have been proposed.

[0003] The liquid jet head described in Patent Document 1 has a plurality of head chips (head modules), a fixing plate, and a holder. The plurality of head chips are housed in a space surrounded by the fixing plate and the holder. The plurality of head chips are aligned with the fixing plate and fixed with an adhesive. The fixing plate is also fixed to the holder with an adhesive. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-42753 Summary of the Invention [Problem to be solved by the invention]

[0005] When one of the head modules among the plurality of head modules breaks down, there is a demand for repairing the liquid ejection head by removing only the broken head module and replacing it with a new head module.

[0006] However, in the conventional document, when removing some of the head modules from the holder, it is necessary to remove the fixing plate from the holder. This may result in misalignment between the multiple head modules relative to the fixing plate. Therefore, when repairing and replacing a liquid jet head by replacing some of the head modules included in a single liquid jet head, it is desirable to be able to easily align the multiple head modules with each other. Furthermore, it is desirable to be able to align the modules with high precision not only when replacing the liquid jet head, but also when manufacturing the liquid jet head. [Means for solving the problem]

[0007] A manufacturing method for a liquid jet head according to one aspect of the present disclosure is a manufacturing method for a liquid jet head including a plurality of head modules, each having a chip including at least a nozzle plate having a plurality of nozzles formed therein and a flow path opening forming member, and a holder that holds the plurality of head modules, and includes a first positioning step of optically positioning the nozzle plate and the flow path opening forming member based on the nozzles, and a second positioning step of positioning the head module and the holder by pressing one of the first positioning portion of the flow path opening forming member and the second positioning portion of the holder into the other.

[0008] A manufacturing method of a liquid jet head according to an aspect of the present disclosure is a method of manufacturing a second liquid jet head including a second holder by using a part of a first head module of a first liquid jet head including a plurality of first head modules and a first holder that holds the plurality of first head modules, the method including: a press-fit release step of releasing a press-fit state in which one of a first positioning portion of the first head module and a second positioning portion of the first holder is press-fitted into the other; and a method of disposing the first head module, the press-fit state of which has been released from the holder in the press-fit release step, in a first chip including at least a first nozzle plate in which a plurality of nozzles are formed, and a flow path opening forming plate in which the first positioning portion is provided. a first positioning step of optically positioning the flow path opening forming member separated from the first chip in the disassembly step and a second chip including at least a second nozzle plate different from the first nozzle plate, the second nozzle plate and the flow path opening forming member based on the nozzles of the second nozzle plate; and a second positioning step of positioning the second head module and the second holder by pressing one of the first positioning portion of the flow path opening forming member and the second positioning portion of the second holder into the other, the second head module including the second chip and the flow path opening forming member positioned in the first positioning step. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram illustrating an example of the configuration of a liquid ejecting apparatus according to a first embodiment. [Figure 2] FIG. 2 is a plan view showing the liquid jet unit shown in FIG. [Figure 3] 3 is a cross-sectional view of the liquid jet head shown in FIG. 2 as seen in a direction along the X axis. [Figure 4] 3 is a cross-sectional view of the liquid jet head shown in FIG. 2 as viewed in the direction along the Y axis. [Figure 5] FIG. 4 is a bottom view of the liquid jet head shown in FIG. [Figure 6] FIG. 4 is a cross-sectional view of a chip included in the head module shown in FIG. [Figure 7] 5 is a top view of a flow path opening forming member included in the head module shown in FIG. 4. FIG. [Figure 8] 5 is an enlarged view of the flow path opening forming member shown in FIG. 4. [Figure 9] 5 is a bottom view showing the holder and the relay board shown in FIG. 4. FIG. [Figure 10] FIG. 5 is a top view of the holder shown in FIG. 4. [Figure 11] FIG. 5 is a plan view of the lower part of the holder shown in FIG. 4. [Figure 12] FIG. 5 is a top view of the sealing member shown in FIG. [Figure 13] FIG. 5 is a top view of the cover shown in FIG. [Figure 14] 5 is a flowchart illustrating a part of a method for manufacturing the liquid jet head according to the first embodiment. FIG. [Figure 15] 15 is a view for explaining the first positioning step shown in FIG. 14. FIG. [Figure 16] 15 is a view for explaining the first positioning step shown in FIG. 14. FIG. [Figure 17] 15 is a view for explaining the first positioning step shown in FIG. 14. FIG. [Figure 18] 15 is a view for explaining the second positioning step shown in FIG. 14. FIG. [Figure 19] 10 is a flowchart illustrating a part of a method for manufacturing a liquid jet head according to a second embodiment. [Figure 20] 20 is a view for explaining the press-fit releasing step shown in FIG. 19. FIG. [Figure 21] FIG. 20 is a diagram for explaining the disassembly process shown in FIG. 19. [Figure 22] FIG. 20 is a view for explaining the first positioning step shown in FIG. 19. [Figure 23] 20 is a view for explaining the second positioning step shown in FIG. 19. FIG. [Figure 24] 10 is a cross-sectional view of a portion of a liquid jet head according to a first modified example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The dimensions and scale of each part in the drawings may differ from the actual dimensions, and some parts are shown schematically to facilitate understanding. The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to limit the present invention. Furthermore, the term "element β on element γ" is not limited to a configuration in which element γ and element β are in direct contact with each other, but also includes a configuration in which element γ and element β are not in direct contact with each other. The term "element γ and element β are equal" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like. The term "element γ and element β are the same" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like.

[0011] 1. First embodiment 1-1. Overall configuration of the liquid ejection device 100 FIG. 1 is a schematic diagram illustrating the configuration of a liquid ejection device 100 according to a first embodiment. For ease of explanation, the following description will appropriately use mutually perpendicular X, Y, and Z axes. A direction along the X axis will be referred to as the X1 direction, and a direction opposite to the X1 direction will be referred to as the X2 direction. Similarly, a direction along the Y axis will be referred to as the Y1 direction, and a direction opposite to the Y1 direction will be referred to as the Y2 direction. A direction along the Z axis will be referred to as the Z1 direction, and a direction opposite to the Z1 direction will be referred to as the Z2 direction. The Z1 direction corresponds to the "first direction." The Z2 direction corresponds to the "second direction opposite to the first direction." The Z1 direction relative to a certain point is referred to as "downward," and the Z2 direction from a certain point is referred to as "upward." Viewing in the Z1 or Z2 direction is referred to as a "planar view."

[0012] As shown in FIG. 1, the liquid ejecting device 100 includes a liquid storage section 9, a control unit 91, a conveying section 92, a head unit 10, and a movement mechanism 40.

[0013] The liquid storage unit 9 is a container that stores ink. Specific examples of the liquid storage unit 9 include a cartridge that is detachable from the liquid ejection device 100, a bag-shaped ink pack made of flexible film, and an ink tank that can be refilled with ink. The type of ink stored in the liquid storage unit 9 is not particularly limited and can be any type.

[0014] The control unit 91 controls the operation of each element of the liquid ejection device 100. The control unit 91 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and controls the operation of each element of the liquid ejection device 100.

[0015] The transport unit 92 transports the medium 90 in a direction DM under the control of the control unit 91. In this embodiment, the direction DM is the Y1 direction. In the example shown in FIG. 1, the transport unit 92 includes a long transport roller along the X axis and a motor that rotates the transport roller. Note that the transport unit 92 is not limited to a configuration using a transport roller, and may be configured, for example, to use a drum or endless belt that transports the medium 90 while adsorbing it to its outer peripheral surface using electrostatic force or the like.

[0016] The movement mechanism 40 has a conveyor belt to which the unit base 11 of the head unit 10 is fixed, and moves the head unit 10 back and forth in the X1 direction and the X2 direction under the control of a control unit 91. Under the control of the control unit 91, the head unit 10 ejects ink supplied from a liquid storage section 9 from each of a plurality of nozzles N onto the medium 90 in the Z1 direction. The ejection of ink from the head unit 10 is performed in parallel with the movement of the head unit 10 by the movement mechanism 40, thereby forming an ink image on the surface of the medium 90.

[0017] The number and arrangement of the multiple liquid jet heads 1 included in the head unit 10 are not limited to the example shown in Fig. 1 and are arbitrary. Furthermore, if the head unit 10 is configured to be able to circulate ink, the head unit 10 may be connected to the liquid storage section 9 via a circulation mechanism for circulating the ink within the head unit 10.

[0018] 1-2. Head unit 10 Fig. 2 is a plan view showing the head unit 10 shown in Fig. 1. As shown in Fig. 2, the head unit 10 includes a unit base 11 and a plurality of liquid jet heads 1. The plurality of liquid jet heads 1 are fixed to the unit base 11. The unit base 11 is a member that holds the plurality of liquid jet heads 1. In the illustrated example, the number of liquid jet heads 1 relative to the unit base 11 is not particularly limited, and may be any number equal to or greater than one.

[0019] The unit base 11 is, for example, a plate-like member whose thickness direction is along the Z axis. A recess 111 is provided in the unit base 11. The recess 111 is a depression provided in the unit base 11. A plurality of through holes 11H are provided in the bottom surface of the recess 111. The planar shape of each through hole 11H is, for example, a rectangle. One through hole 11H is provided for each liquid jet head 1. A part of the liquid jet head 1 is inserted into each through hole 11H. Note that in Figure 2, some of the liquid jet heads 1 arranged in part of the unit base 11 are not shown in order to show the through holes 11H.

[0020] Furthermore, the unit base 11 is provided with four mounting holes 101 and two third positioning portions 102 for each through hole 11H. The four mounting holes 101 and the two third positioning portions 102 are provided outside the through hole 11H in plan view. Note that the number and arrangement of the mounting holes 101 and the third positioning portions 102 are not limited to the example shown in FIG. 2 and are arbitrary.

[0021] The mounting holes 101 are provided, for example, near the four corners of the through-hole 11H in plan view. The mounting holes 101 are used to mount the liquid jet head 1 to the unit base 11. The mounting holes 101 penetrate the unit base 11, for example, in the thickness direction.

[0022] Each third positioning portion 102 is provided, for example, between two mounting holes 101 aligned in the direction along the X axis and spaced apart from each other. Each third positioning portion 102 is used for positioning when mounting the unit base 11 of the liquid jet head 1. Each third positioning portion 102 is, for example, a bottomed hole that opens on the surface of the unit base 11 facing in the Z1 direction. It can also be said that each third positioning portion 102 is a recess formed in the surface of the unit base 11 facing in the Z1 direction.

[0023] Note that each mounting hole 101 does not have to penetrate the unit base 11 in the thickness direction. Similarly, each third positioning portion 102 may penetrate the unit base 11 in the thickness direction. Furthermore, the shape of the unit base 11 is not limited to a plate shape, and may be, for example, a box shape.

[0024] 1-3. Liquid jet head 1 Fig. 3 is a cross-sectional view of the liquid jet head 1 shown in Fig. 2, viewed in the direction along the X axis. Fig. 4 is a cross-sectional view of the liquid jet head 1 shown in Fig. 2, viewed in the direction along the Y axis. As shown in Fig. 4, in this embodiment, the liquid jet head 1 has a configuration that is approximately symmetrical with respect to a central imaginary plane A10 along the XZ plane. However, the liquid jet head 1 does not have to be configured symmetrical with respect to the central imaginary plane A10.

[0025] As shown in either FIG. 3 or FIG. 4, the liquid jet head 1 includes a plurality of head modules 2, a sealing member 4, a plurality of covers 5, a holder 6, a plurality of wiring boards 7, and a relay board 70.

[0026] Furthermore, in the liquid jet head 1, the cover 5, the holder 6, and the plurality of head modules 2 are detachable from one another. After the cover 5 is removed from the holder 6, each head module 2 can be individually removed from the holder 6. Each head module 2 can be individually removed from the holder 6.

[0027] Therefore, for example, when one of the multiple head modules 2 included in the head unit 10 breaks down, the liquid jet head 1 can be refurbished by replacing the sub-unit 15 including the broken head module 2 with another sub-unit 15 including a non-faulty head module 2.

[0028] It is preferable that the cover 5 and the plurality of head modules 2 are fixed with an adhesive, but each head module 2 may be configured to be removable from the cover 5 by disassembling the adhesive.

[0029] 1-3A. Head Module 2 3, the plurality of head modules 2 are six head modules 2. The number of head modules 2 is not limited to six, and may be one to five or seven or more.

[0030] In this embodiment, the multiple head modules 2 are aligned along the X axis. As shown in FIG. 4, each head module 2 is elongated along the Y axis. Each head module 2 ejects ink in the Z1 direction. The head module 2 includes a chip 20 and a flow path opening forming member 25. The chip 20 is arranged in the Z1 direction relative to the flow path opening forming member 25.

[0031] FIG. 5 is a bottom view of the liquid jet head 1 shown in FIG. 3. As shown in FIG. 5, each head module 2 has a plurality of nozzles N that eject ink. The plurality of nozzles N are arranged along the Y axis. The plurality of nozzles N are divided into nozzle rows La and nozzle rows Lb that are arranged side by side at intervals along the X axis. Each of the nozzle rows La and Lb is a collection of a plurality of nozzles N that are linearly arranged along the Y axis. Furthermore, the surface of the head module 2 on which the openings of the plurality of nozzles N are formed is referred to as the nozzle surface SN. The nozzle surface SN is the surface of the chip 20 of the head module 2 that faces the Z1 direction. Note that, for example, the plurality of nozzles N may be arranged in a direction that intersects the X axis and the Y axis when viewed in the Z1 direction.

[0032] 1-3Aa. Chip 20 Fig. 6 is a cross-sectional view of the chip 20 included in the head module 2 shown in Fig. 3. The chip 20 has a structure in which elements related to each nozzle N of nozzle row La and elements related to each nozzle N of nozzle row Lb are arranged in a substantially plane-symmetrical manner. In the following explanation, the elements corresponding to nozzle row La will be mainly explained, and explanations of elements corresponding to nozzle row Lb will be omitted as appropriate. Furthermore, in the following, when there is no need to distinguish between nozzle row La and nozzle row Lb, they will be referred to as nozzle row L.

[0033] As shown in FIG. 6, the chip 20 of each head module 2 includes, for example, a communication plate 202, a pressure chamber substrate 203, a vibration plate 204, a nozzle plate 201, a cover 206, a plurality of drive elements E, and a sealing substrate 205.

[0034] The communicating plate 202, pressure chamber substrate 203, diaphragm 204, nozzle plate 201, and cover 206 are each a long plate-like member extending along the Y axis. The pressure chamber substrate 203 is placed on the surface of the communicating plate 202 facing the Z2 direction. The nozzle plate 201 and cover 206 are placed on the surface of the communicating plate 202 facing the Z1 direction. The components are fixed together, for example, with an adhesive.

[0035] The nozzle plate 201 is a plate-like member in which a plurality of nozzles N are formed. The nozzle plate 201 is the member of the head module 2 that is located furthest in the Z1 direction. The surface of the nozzle plate 201 that faces the Z1 direction is the nozzle surface SN. Each of the plurality of nozzles N is a circular through-hole that ejects ink. For example, the nozzle plate 201 is manufactured by processing a silicon (Si) single crystal substrate using semiconductor manufacturing techniques such as photolithography and etching.

[0036] The communicating plate 202 is formed with a plurality of throttle portions R1, a plurality of communicating channels R2, a communicating space Ra, and a common channel Rb. Each of the throttle portions R1 and the communicating channels R2 extends in the Z1 direction and is a through-hole formed for each nozzle N. The communicating channels R2 overlap with the nozzles N in plan view. The communicating spaces Ra are elongated openings formed along the Y axis. The communicating spaces Ra extend along the Y axis. The common channels Rb communicate with the communicating spaces Ra and overlap with the communicating spaces Ra in plan view. The common channels Rb extend along the Y axis. The common channels Rb communicate with the plurality of throttle portions R1. Furthermore, the communicating spaces Ra communicate with the spaces Rc of the channel opening forming member 25.

[0037] The communication space Ra, the common flow path Rb, and the space Rc form a common space R that is shared by multiple nozzles N. The common space R functions as an ink reservoir. The ink stored in the common space R branches off into each throttle section R1 and is supplied to and filled in multiple pressure chambers C in parallel.

[0038] A plurality of pressure chambers C are formed in the pressure chamber substrate 203. The pressure chambers C are located between the communication plate 202 and the vibration plate 204, and are spaces formed by the wall surfaces of the pressure chamber substrate 203. A pressure chamber C is formed for each nozzle N. The pressure chamber C is an elongated space extending in the X1 direction. The plurality of pressure chambers C are arranged along the Y axis.

[0039] The communication plate 202 and the pressure chamber substrate 203 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate.

[0040] An elastically deformable vibration plate 204 is disposed above the pressure chamber C. The vibration plate 204 is laminated on the pressure chamber substrate 203 and contacts the surface of the pressure chamber substrate 203 opposite the communicating plate 202. The vibration plate 204 is a long, rectangular plate-like member extending along the Y-axis in a plan view. The pressure chamber C communicates with the communicating flow path R2 and the throttle portion R1. Therefore, the pressure chamber C communicates with the nozzle N via the communicating flow path R2, and also communicates with the communicating space Ra via the throttle portion R1. Note that the nozzle N, the communicating flow path R2, the pressure chamber C, and the throttle portion R1 form an individual flow path for each nozzle N. Also, for ease of explanation, the pressure chamber substrate 203 and the vibration plate 204 are illustrated in FIG. 6 as separate substrates, but in reality they are laminated on a single silicon substrate.

[0041] A driving element E is formed for each pressure chamber C on the surface of the vibration plate 204 opposite to the pressure chamber C. The driving element E is an elongated piezoelectric element extending along the X-axis in a plan view. The driving element E includes, for example, a pair of electrodes and a piezoelectric body sandwiched between the pair of electrodes. The driving element E may also be an electrothermal conversion element that generates thermal energy.

[0042] The sealing substrate 205 is a structure that protects the multiple drive elements E. The sealing substrate 205 is fixed to the surface of the diaphragm 204 with, for example, an adhesive. The multiple drive elements E are housed inside a recess formed on the surface of the sealing substrate 205 that faces the diaphragm 204. The sealing substrate 205 also has wiring holes 20H for inserting a wiring substrate 7, which will be described later.

[0043] The cover 206 is a thin metal plate that forms the wall surface of the common flow path Rb. The cover 206 has a thickness similar to that of the nozzle plate 201. The planar shape of the cover 206 is, for example, a frame shape that surrounds the nozzle plate 201. A mold 207 made of resin is provided between the cover 206 and the nozzle plate 201. The surface of the cover 206 facing the Z1 direction forms part of the nozzle surface SN.

[0044] In this chip 20, when the drive element E contracts due to energization, the vibration plate 204 bends and deflects in the direction that reduces the volume of the pressure chamber C, causing the pressure inside the pressure chamber C to rise and eject an ink droplet from the nozzle N. At this time, pressure also propagates from the pressure chamber C toward the throttle portion R1, causing ink to flow into the common flow path Rb through the throttle portion R1. After the ink is ejected, the drive element E returns to its original position. At this time, the ink in the common flow path Rb from the nozzle N also vibrates. Then, at the same time as the meniscus of the nozzle N returns to its original position, ink is supplied from the throttle portion R1. Through this series of operations, ink is ejected from the nozzle N.

[0045] In the above description, chip 20 includes the elements shown in FIG. 6, but the components of chip 20 may not include all of the elements described above, or may include additional elements.

[0046] The chip 20 may have, for example, a monolithic structure and be thinner than the flow path opening-forming member 25, e.g., a component having a thickness of less than 3000 μm. The chip 20 may be a component having a thickness of 1500 μm or less, or 1000 μm or less. The thickness of the chip 20 may be ⅕ or less of the length of the short side of the chip 20 as viewed in the thickness direction. The chip 20 may include at least the nozzle plate 201, preferably further including a pressure chamber substrate 203, and particularly preferably further including a communication plate 202. At least one of the nozzle plate 201, the pressure chamber substrate 203, the communication plate 202, the driving element E, and the sealing substrate 205 may be considered to be the chip 20. The chip 20 may be a laminate of silicon substrates manufactured by MEMS, a laminate of thin plates such as ceramic sheets or metals, or a laminate of thin plate-like members made of the aforementioned materials.

[0047] 1-3Ab. Flow path opening forming member 25 4 and 6, a flow path opening forming member 25 is disposed in the Z2 direction of the chip 20. The flow path opening forming member 25 and the chip 20 are fixed to each other, for example, by an adhesive or the like. The flow path opening forming member 25 has, for example, a flow path that supplies ink to the chip 20.

[0048] Furthermore, the flow path opening-forming member 25 is preferably a member having a thickness of, for example, 3000 μm or more, more preferably a member having a thickness of 5000 μm or more, and even more preferably a member having a thickness of 8000 μm or more. Furthermore, the flow path opening-forming member 25 may be formed of a single member or may be a laminate of multiple members.

[0049] Furthermore, the flow path opening forming member 25 is made of metal, but may contain resin. By making the flow path opening forming member 25 out of resin such as thermosetting resin, costs can be reduced. However, by making the flow path opening forming member 25 out of metal, the flow path opening forming member 25 can be easily reused when the head module 2 is replaced. Therefore, compared to when it is made of resin, the flow path opening forming member 25 can be easily reused repeatedly. Furthermore, compared to when it is made of resin, using metal makes it possible to position the flow path opening forming member 25 with respect to the holder 6 with higher precision.

[0050] 4, the length of the flow path opening-forming member 25 in the direction along the Z axis, i.e., the thickness, is thicker than the thickness D2 of the chip 20. The thickness of the flow path opening-forming member 25 here is the thickness at a position overlapping with a sealing region 4S, which will be described later, when viewed in the Z1 direction. In other words, the chip 20 is thinner than the flow path opening-forming member 25. The flow path opening-forming member 25 also includes a surface 251 facing the Z1 direction and a surface 252 facing the Z2 direction.

[0051] Fig. 7 is a top view of the flow path opening forming member 25 included in the head module 2 shown in Fig. 4. As shown in Fig. 7, the planar shape of the flow path opening forming member 25 is larger than the planar shape of the chip 20. That is, the chip 20 has a smaller outer shape than the flow path opening forming member 25 when viewed in the Z1 direction. The flow path opening forming member 25 is disposed so as to overlap and cover the chip 20 when viewed in the Z1 direction.

[0052] As shown in FIGS. 4 and 7, the flow path opening forming member 25 has a flange portion 250 for fixing to the cover 5 described below. The planar shape of the flange portion 250 is a rectangular frame shape surrounding an opening 5H of the cover 5 described below. As shown in FIG. 4, the surface of the flange portion 250 facing the Z1 direction is a supported surface 2511 that is supported by the cover 5 described below. Since the planar shape of the flange portion 250 is a rectangular frame shape surrounding the opening 5H, the planar shape of the supported surface 2511 is also a rectangular frame shape surrounding the opening 5H. The supported surface 2511 is located further in the Z2 direction than the chip 20. Therefore, the supported surface 2511 is located in the Z2 direction of the nozzle plate 201.

[0053] 7, a wiring hole 25H is provided in the flow path opening forming member 25. A wiring board 7, which will be described later, is inserted into the wiring hole 25H. The wiring hole 25H is provided in the center of the flow path opening forming member 25 in plan view. Referring to FIG. 6, the wiring hole 25H overlaps with the wiring hole 20H of the sealing substrate 205 in plan view.

[0054] 4 and 6, a flow path 25R is formed inside the flow path opening forming member 25. The flow path 25R is provided to supply ink to the chip 20. As shown in Fig. 6, a space Rc is provided on the chip 20 side of the flow path 25R, i.e., on the downstream side. The flow path 25R and the space Rc are in communication with each other.

[0055] As shown in FIG. 4, a plurality of flow path openings 251H are provided on the side of the flow path 25R of the flow path opening forming member 25 opposite to the chip 20, i.e., on the upstream side. Each flow path opening 251H is an open end of the flow path 25R in the Z2 direction. The flow path opening 251H is an opening for connecting the flow path 25R of the flow path opening forming member 25 of the head module 2 with a flow path 6R of the holder 6, which will be described later. As shown in FIGS. 4 and 7, the plurality of flow path openings 251H are provided in the flange portion 250 of the flow path opening forming member 25. The flow path openings 251H are arranged outside the chip 20 when viewed in the Z1 direction. In this embodiment, two flow path openings 251H are provided for each nozzle row L.

[0056] 4 and 7, two fixing holes 215 are provided in each flow path opening forming member 25. The head module 2 including the flow path opening forming member 25 is detachable from the holder 6. Each fixing hole 215 is used to fix the head module 2 to the holder 6.

[0057] Each fixing hole 215 is provided in a surface 252 facing the Z2 direction of the flow path opening forming member 25. Each fixing hole 215 is a bottomed hole that opens in the surface 252 facing the Z2 direction of the flow path opening forming member 25. Each fixing hole 215 is a recessed portion provided in the surface 252 facing the Z2 direction of the flow path opening forming member 25, and can also be considered to be a depression formed in the surface 252. One of the two fixing holes 215 is located in the Y1 direction with respect to the chip 20 when viewed in the Z1 direction, and the other is located in the Y2 direction with respect to the chip 20.

[0058] Fig. 8 is an enlarged view of the flow path opening forming member 25 shown in Fig. 4. Note that in Fig. 8, bushings 522 and 526, which will be described later, are omitted from the illustration.

[0059] 8, each flow path opening forming member 25 has a first positioning portion 210H and a through hole 211H. The first positioning portion 210H and the through hole 211H constitute a hole that penetrates the flow path opening forming member 25 in the thickness direction. The first positioning portion 210H and the through hole 211H are used for positioning the head module 2 relative to the holder 6, etc. In particular, the first positioning portion 210H is a positioning hole for positioning the head module 2 relative to the holder 6, and corresponds to a second positioning portion 654, which will be described later.

[0060] The first positioning portion 210H and the through-hole 211H are aligned along the Z-axis and communicate with each other. The through-hole 211H is positioned in the Z1 direction relative to the first positioning portion 210H. A surface 251 of the flow path opening forming member 25 facing the Z1 direction has the through-hole 211H, specifically the opening end of the through-hole 211H. A surface 252 of the flow path opening forming member 25 facing the Z2 direction has the first positioning portion 210H, specifically the opening end of the first positioning portion 210H.

[0061] In this embodiment, the opening area of ​​the through hole 211H is larger than the opening area of ​​the first positioning portion 210H. In other words, the outer diameter of the through hole 211H is larger than the outer diameter of the first positioning portion 210H. The opening area of ​​the through hole 211H may be smaller than the opening area of ​​the first positioning portion 210H. The length of the through hole 211H along the Z axis, i.e., the depth D21, is larger than the depth D20 of the first positioning portion 210H. The depth D21 may be smaller than the depth D20. The width and opening area of ​​the through hole 211H are constant but do not have to be uniform. Similarly, the width and opening area of ​​the first positioning portion 210H are constant but do not have to be uniform.

[0062] 7, two first positioning portions 210H are provided in each flow path opening formation member 25. Therefore, two through holes 211H are provided in each flow path opening formation member 25. As shown in Fig. 7, one of the two first positioning portions 210H is located in the Y1 direction relative to the chip 20 when viewed in the Z1 direction, and the other is located in the Y2 direction relative to the chip 20.

[0063] 7, the shortest distance between the chip 20 and the fixing hole 215 as viewed in the Z1 direction is shorter than the shortest distance between the chip 20 and the first positioning portion 210H, but it may be longer. Also, the first positioning portion 210H, the fixing hole 215, and the opening 5H are aligned along the longitudinal direction of the cover 5, but they do not have to be aligned. For example, the first positioning portion 210H may be provided on both sides of the opening 5H in the X-axis direction.

[0064] 1-3B. Holder 6 3 and 4, the holder 6 holds and houses the plurality of head modules 2, and has a common flow path that supplies and distributes ink to the plurality of head modules 2. The holder 6 is common to the plurality of head modules 2.

[0065] As shown in FIG. 4, the holder 6 has one flow path 6R. The flow path 6R supplies ink to each head module 2 and distributes the ink to each head module 2. The flow path 6R is a common flow path shared by multiple head modules 2, and has a common portion 6RA that extends along the X axis, and multiple branch portions 6RB that branch off from the common portion 6RA and extend in the Z1 direction. Although not shown, the holder 6 is provided with a flow path joint for connecting to a supply flow path outside the liquid jet head 1 in order to communicate with the liquid storage portion 9. This flow path joint (not shown) is exposed to the outside of the liquid jet head 1, for example, via an opening (not shown) formed in the holder 6.

[0066] The holder 6 may have a plurality of flow paths 6R that communicate with a plurality of head modules 2. In other words, the flow path 6R may not have a common portion 6RA that communicates with a plurality of head modules 2, but may have a plurality of flow paths 6R that communicate with each of the plurality of head modules 2.

[0067] A flow path opening 650H is provided on the head module 2 side of the flow path 6R, i.e., on the downstream side. The flow path opening 650H is an open end of the flow path 6R in the Z1 direction. The flow path opening 650H is provided corresponding to the flow path opening 251H of the head module 2. The flow path opening 650H is an opening for connecting the flow path 25R of the head module 2 and the flow path 6R of the holder 6.

[0068] 9 is a bottom view showing the holder 6 and relay board 70 shown in FIG. 4. As shown in FIGS. 3, 4, and 9, the holder 6 is box-shaped and has a recess 610 that opens in the Z1 direction. Multiple head modules 2 are arranged in the storage space inside the recess 610 of the holder 6. It can also be said that the storage space for the multiple head modules 2 is formed by the holder 6 and a cover 5, which will be described later. The holder 6 includes a metal such as aluminum or stainless steel, for example.

[0069] As shown in FIGS. 4 and 9, the recess 610 includes a first recess 611 and a second recess 612. As shown in FIG. 4, the second recess 612 is formed on the bottom surface of the first recess 611. The first recess 611 is located in the Z1 direction from the center of the holder 6 in the Z axis. The second recess 612 is located in the Z2 direction from the center of the holder 6 in the Z axis. The opening area of ​​the second recess 612 is smaller than the opening area of ​​the first recess 611. Therefore, the recess 610 has a stepped surface.

[0070] The relay substrate 70 is bonded to the bottom surface of the recess 610, specifically the bottom surface of the second recess 612, for example, by an adhesive. Although not shown in detail, the holder 6 has an opening through which an external wiring member of the liquid jet head 1 is inserted to electrically connect the relay substrate 70 and the control unit 91.

[0071] 3, the holder 6 includes a flat plate portion 61, a side wall portion 62, and two flange portions 64. The flat plate portion 61, the side wall portion 62, and the two flange portions 64 are integrally formed.

[0072] FIG. 10 is a top view of the holder 6 shown in FIG. 3. FIG. 11 is a plan view of the lower part of the holder 6 shown in FIG. 3. As shown in FIG. 3, 4 or 10, the flat plate portion 61 is a flat plate-shaped portion along the XY plane, and is located in the Z2 direction of the multiple head modules 2. The side wall portion 62 is a portion extending in the Z1 direction from the outer edge of the flat plate portion 61. The planar shape of the side wall portion 62 is a rectangular frame shape. The aforementioned step surface is provided on the inner wall surface of the side wall portion 62.

[0073] 4, the holder 6 has a plurality of fixing holes 651H, a plurality of fixing holes 652H, and a plurality of second positioning portions 654. Each fixing hole 651H is used to fix the holder 6 and the head module 2. Each fixing hole 652H is used to fix the holder 6 and the cover 5. Each second positioning portion 654 is used to position the head module 2 relative to the holder 6.

[0074] Each fixing hole 651H is a hole that penetrates the holder 6 in the Z1 direction. Two fixing holes 651H are provided for each head module 2. Each fixing hole 651H is provided in the Y1 direction or the Y2 direction relative to the second recess 612 when viewed in the Z1 direction. The two fixing holes 651H are provided corresponding to the two fixing holes 215 described above, and overlap with the two fixing holes 215 when viewed in the Z1 direction. Each fixing hole 651H does not overlap with the chip 20 when viewed in the Z1 direction, but overlaps with the flow path opening forming member 25. The open end of each fixing hole 651H in the Z1 direction opens to the bottom surface of the first recess 611.

[0075] Each fixing hole 652H is a hole that penetrates the holder 6 in the Z1 direction. As shown in Fig. 11, the multiple fixing holes 652H are, for example, four fixing holes 652H, and each fixing hole 652H is provided at one of the four corners of the rectangular holder 6 when viewed in the Z1 direction. Each fixing hole 652H does not overlap with a recess 610 when viewed in the Z1 direction.

[0076] Each second positioning portion 654 is a protrusion provided on the surface 605 of the holder 6 facing the Z1 direction, specifically on the bottom surface of the first recess 611. More specifically, each second positioning portion 654 is a positioning pin protruding in the Z1 direction from the first recess 611. In this embodiment, two second positioning portions 654 are provided for each head module 2. The two second positioning portions 654 are provided corresponding to the two first positioning portions 210H described above, and overlap the two first positioning portions 210H when viewed in the Z1 direction. Therefore, the multiple second positioning portions 654 are provided in one-to-one correspondence with the multiple first positioning portions 210H.

[0077] As viewed in the Z1 direction, of fixing hole 651H, second positioning portion 654, and fixing hole 652H, fixing hole 651H is closest to chip 20, and fixing hole 652H is farthest from chip 20. Note that the distances between fixing hole 651H, second positioning portion 654, and fixing hole 652H and chip 20 as viewed in the Z1 direction may be the same or different.

[0078] Each second positioning portion 654 is press-fitted into the aforementioned first positioning portion 210H to position the cover 5 relative to the holder 6. By providing such first positioning portion 210H and second positioning portion 654, positioning can be easily performed when attaching the head module 2 to the holder 6.

[0079] Furthermore, alignment between the multiple head modules 2 can be performed with high precision by the simple method of press-fitting the first positioning portion 210H into the second positioning portion 654. This makes it easy to replace a desired head module 2 from among the multiple head modules 2. This makes it possible to replace each head module 2 individually, which makes it easy to repair the liquid jet head 1.

[0080] Furthermore, the first positioning part 210H and the second positioning part 654 are provided for each head module 2. By providing the first positioning part 210H and the second positioning part 654 for each head module 2, it is possible to perform highly accurate alignment between multiple head modules 2. Therefore, when replacing only some of the multiple head modules 2, it is not necessary to redo the alignment of all of the head modules 2.

[0081] 4, the holder 6 is provided with a plurality of fourth positioning portions 642. As shown in Fig. 4, the fourth positioning portions 642 are protrusions that protrude in the Z2 direction from the Z2-direction surface of the flange portion 64 of the holder 6. The plurality of fourth positioning portions 642 are provided in one-to-one correspondence with the plurality of third positioning portions 102 of the unit base 11 shown in Fig. 2.

[0082] The fourth positioning portion 642 is press-fitted into one of the plurality of third positioning portions 102 provided on the unit base 11, thereby positioning the liquid jet head 1 with respect to the unit base 11. This makes it possible to improve the alignment accuracy between the plurality of liquid jet heads 1 with respect to the unit base 11.

[0083] 10 , the flange portion 64 is provided with mounting holes 64H. The mounting holes 64H correspond to the mounting holes 101 of the unit base 11. For example, the flange portion 64 and the unit base 11 are fixed together by inserting screws or the like (not shown) through the mounting holes 64H and then the mounting holes 101 and screwing them together. As a result, the liquid jet head 1 is fixed to the unit base 11.

[0084] 1-3C. Sealing member 4 As shown in FIGS. 3 and 4 , the sealing member 4 is provided between each head module 2 and the holder 6 in the Z1 direction. A sealing member 4 is provided for each head module 2. The sealing member 4 has elasticity. In this embodiment, the sealing member 4 is made of an elastic material such as an elastomer, and the length of the sealing member 4 along the Z axis, i.e., the thickness, is constant. The thickness of the sealing member 4 is thinner than the thicknesses of the flow path opening forming member 25 and the holder 6. The sealing member 4 is crushed by the head module 2 and the holder 6.

[0085] 12 is a top view of the seal member 4 shown in FIG. 4. In the example shown in FIG. 11, two seal members 4 are provided for each head module 2. The two seal members 4 are provided at both ends of one head module 2 in the longitudinal direction. Each seal member 4 is rectangular when viewed in the Z1 direction. When viewed in the Z1 direction, each seal member 4 overlaps with a flange portion 250 of the flow path opening forming member 25 of the head module 2. On the other hand, in this embodiment, the seal member 4 is provided at a position different from the chip 20 when viewed in the Z1 direction. In other words, the seal member 4 does not overlap with the chip 20 when viewed in the Z1 direction.

[0086] As shown in FIGS. 4 and 12, each sealing member 4 has two communication ports 4H. As shown in FIG. 4, each communication port 4H is provided corresponding to one flow path opening 251H of the flow path opening forming member 25 and one flow path opening 650H of the holder 6. As shown in FIG. 12, the communication ports 4H overlap with the flow path opening 650H and the flow path opening 251H, respectively, when viewed in the Z1 direction. As shown in FIG. 4, the communication port 4H is connected to the flow path 25R via the flow path opening 251H. The communication port 4H is connected to the flow path 6R via the flow path opening 650H. Therefore, the flow path 25R and the flow path 6R are in communication with each other via the communication port 4H. Specifically, the sealing member 4 is compressed between the flow path opening forming member 25 and the holder 6, thereby connecting the flow path 25R and the flow path 6R with each other via the communication port 4H.

[0087] The sealing member 4 is a member that liquid-tightly connects the flow path opening 251H of the head module 2 and the flow path opening 650H of the holder 6. The ink flowing through the flow path 6R of the holder 6 flows into the flow path 25R of the flow path opening forming member 25 through the communication port 4H, and is supplied to the individual flow paths of the chip 20 through the common space R.

[0088] As shown in FIG. 12 , the seal member 4 has a seal region 4S. In this embodiment, the entire seal member 4 corresponds to the seal region 4S. The seal region 4S is in contact with both the flow path opening-forming member 25 and the holder 6, and is a region of the seal member 4 that is sandwiched between the flow path opening-forming member 25 and the holder 6. The seal region 4S is a region that is crushed by the load from the flow path opening-forming member 25 and the holder 6 to liquid-tightly connect the flow path opening 251H and the flow path opening 650H to each other. In other words, even if a region of the seal member 4 is sandwiched between both the flow path opening-forming member 25 and the holder 6, a portion that is not crushed by the load from both members and does not substantially contribute to liquid-tightly connecting the flow path opening 251H and the flow path opening 650H to each other is not included in the seal region 4S.

[0089] 12, the sealing member 4 is provided at a position different from the chip 20 when viewed in the Z1 direction, and therefore the sealing area 4S is provided at a position different from the chip 20 when viewed in the Z1 direction. In other words, the sealing area 4S does not overlap with the chip 20 when viewed in the Z1 direction. Because the sealing area 4S does not overlap with the chip 20 when viewed in the Z1 direction, the reaction force of the sealing member 4 is less likely to affect the chip 20 compared to when they overlap. This makes it possible to improve the reliability of the head module 2.

[0090] Furthermore, the sealing area 4S is arranged in the Y1 or Y2 direction, which is the longitudinal direction of the head module 2 relative to the chip 20, when viewed in the Z1 direction. By arranging the sealing area 4S in the longitudinal direction of the chip 20, it is possible to prevent the sealing area 4S from being arranged between adjacent chips 20. Therefore, providing the sealing area 4S prevents the distance between adjacent chips 20 from becoming too large. This makes it less likely that the printing quality will be affected.

[0091] The sealing region 4S may be provided in the direction in which the plurality of head modules 2 are lined up relative to the chip 20, i.e., in the short-side direction of the head modules 2. The sealing member 4 may be provided in the direction in which the plurality of head modules 2 are lined up relative to the chip 20, i.e., in the short-side direction of the head modules 2.

[0092] 1-3D.Cover 5 The cover 5 shown in FIGS. 3 and 4 is a support member that supports the multiple head modules 2. The cover 5 is common to the multiple head modules 2, but may be provided individually for each head module 2. The cover 5 is a plate-shaped member whose thickness direction is along the Z axis. The cover 5 is disposed in the Z1 direction relative to the multiple flow path opening forming members 25. The cover 5 is a member that sandwiches the seal member 4 and the flow path opening forming members 25 between itself and the holder 6. As shown in FIG. 4, the cover 5 includes a surface 511 facing the Z1 direction and a surface 512 facing the Z2 direction. The cover 5 is a member that does not have a flow path through which ink flows.

[0093] The cover 5 is made of, for example, metal. The cover 5 includes, for example, metals such as aluminum and stainless steel. The cover 5 has enough rigidity to support the plurality of head modules 2.

[0094] FIG. 13 is a top view of the cover 5 shown in FIG. 4. As shown in FIGS. 4 and 13, the cover 5 is provided with a plurality of openings 5H. Each opening 5H is a hole that penetrates the cover 5 in the thickness direction. Each opening 5H is provided to expose a part of the head module 2 to the outside. Specifically, the chip 20 is exposed from the opening 5H. Therefore, a plurality of nozzles N are exposed from the opening 5H.

[0095] The cover 5 includes a plurality of support surfaces 5S. The support surfaces 5S are parts of the surface 512 of the cover 5 facing the Z2 direction, and are surfaces that come into contact with and support the flow path opening-forming member 25. The support surfaces 5S are frame-shaped and surround the opening 5H of the cover 5. In FIG. 13, the support surfaces 5S are shaded.

[0096] 4, a portion of the surface 251 of the flow path opening forming member 25 facing the Z1 direction has a supported surface 2511. The supported surface 2511 is a surface that comes into contact with the support surface 5S of the cover 5 and is supported by the support surface 5S. The head module 2 is held by the cover 5 as the supported surface 2511 comes into contact with the support surface 5S.

[0097] Furthermore, since the flow path opening forming member 25, rather than the chip 20, is held by the cover 5, the chip 20 can be placed inside the opening 5H of the cover 5. This prevents the chip 20 from being excessively exposed in the Z1 direction relative to the cover 5. This makes it possible to prevent the distance between the chip 20 and the medium 90, i.e., the paper gap, from increasing.

[0098] Furthermore, the thickness D5 of the cover 5 in the Z1 direction is greater than the thickness D2 in the Z1 direction of the chip 20. This reduces the risk that the cover 5 will be deformed by the reaction force of the seal member 4.

[0099] Furthermore, the nozzle surface SN of the chip 20 and the surface 511 of the cover 5 facing the Z1 direction are substantially flush with each other. This makes it possible to prevent an increase in the paper gap. Furthermore, it is easy to wipe the surface 511 of the cover 5 facing the Z1 direction and the nozzle surface SN together. Note that the nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction being substantially flush with each other means that they are completely flush with each other, as well as cases where there is a step due to manufacturing errors or the like. Furthermore, the nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction do not have to be substantially flush with each other.

[0100] As shown in FIG. 4, the cover 5 has a plurality of fixing holes 503. Each fixing hole 503 is used to fix the cover 5 to the holder 6. As shown in FIG. 4, each fixing hole 503 is provided on a surface 512 of the cover 5 facing the Z2 direction. Each fixing hole 503 is a bottomed hole provided on the surface 512 of the cover 5 facing the Z2 direction. Each fixing hole 503 is also a recess provided on the surface 512 of the cover 5 facing the Z2 direction, and can be considered to be a depression formed on the surface 512. The multiple fixing holes 503 correspond one-to-one to the multiple fixing holes 652H described above and overlap when viewed in the Z1 direction.

[0101] In the above description, one cover 5 is provided for one holder 6, but multiple covers 5 may be provided for each holder 6. For example, a cover 5 that holds three of the six head modules 2 and a cover 5 that holds the remaining three head modules 2 may be provided.

[0102] For example, two or more head modules 2 that are to be replaced at similar times are held by one cover 5. This makes it possible to replace two or more head modules 2 that are to be replaced at similar times together, making the work easier.

[0103] Specifically, for example, it is preferable that the cover 5 holds, among the plurality of head modules 2, a plurality of head modules 2 that eject the same type of liquid. This allows chips that are nearing the end of their lifespan, for example, colors with a high ejection frequency, to be replaced all at once. This improves the workability of replacement. Note that the two or more head modules 2 held by one cover 5 do not have to eject the same type of ink. Furthermore, one head module 2 may be capable of ejecting one type of ink, or may be capable of ejecting two or more types of ink.

[0104] 3-1E. Fixing member group 150 As shown in FIG. 4, the fixing member group 150 includes a plurality of fixing members 155 and a plurality of fixing members 157.

[0105] The fixing member 155 fixes the holder 6 and the cover 5. The fixing member 155 is inserted through the fixing hole 652H, which is a through-hole, and then through the recessed fixing hole 503. Therefore, the fixing member 155 is not exposed on the nozzle surface SN side. On the other hand, a portion of the fixing member 155 is exposed on the surface 606 of the holder 6 facing the Z2 direction.

[0106] The fixing member 157 directly fixes the holder 6 and the head module 2. The fixing member 157 is inserted through the fixing hole 651H, which is a through-hole, and then through the recessed fixing hole 215. Therefore, the fixing member 157 is not exposed on the nozzle surface SN side. On the other hand, a part of the fixing member 157 is exposed on the surface 606 of the holder 6 facing the Z2 direction.

[0107] Since the fixing members 155 and 157 are not exposed on the nozzle surface SN side, it is possible to prevent ink mist from adhering to and solidifying the fixing members 155 and 157. This makes it possible to prevent the fixing members 155 and 157 from becoming difficult to remove due to mist adhesion.

[0108] 10, the multiple fixing members 155 are provided, for example, near corners of the holder 6, which has a rectangular shape when viewed in the Z1 direction. The multiple fixing members 157 are provided for each head module 2. Specifically, two fixing members 157 are provided for each head module 2. One of the two fixing members 157 is disposed in the Y1 direction of the head module 2 when viewed in the Z1 direction, and the other is disposed in the Y2 direction of the head module 2.

[0109] Each of the fixing members 155 and 157 is preferably a screw. In this case, for example, a female screw is formed on each wall surface that forms fixing hole 651H, fixing hole 652H, fixing hole 215, and fixing hole 503. When the fixing members 155 and 157 are screws, the fixing of the cover 5 and the multiple head modules 2 to the holder 6 can be easily released by turning and fastening the screws. When the fixing members 155 and 157 are screws, the fixing of the multiple head modules 2 and the cover 5 to the holder 6 can be arbitrarily attached and detached without using adhesive.

[0110] In addition, each of the fixing members 155 and 157 may be something other than a screw, and may include, for example, an L-shaped or T-shaped pin with the tip in the Z1 direction bent at a right angle and an elastic member such as a leaf spring or a coil spring, and may be configured to fix the holder 6 and the cover 5 using the elastic force of the elastic member.

[0111] In this way, the fixing member 155 may have any configuration as long as it is a member that fixes the holder 6 and the cover 5 to each other. The fixing member 157 may have any configuration as long as it is a member that fixes the holder 6 and the head module 2 to each other.

[0112] 1-3E. Wiring board 7, relay board 70 and connector 71 As shown in FIG. 3, a wiring board 7 is provided for each head module 2. The wiring board 7 is inserted through the wiring holes 25H of the chip 20 and the wiring holes 20H of the flow path opening forming member 25. The relay substrate 70 is electrically connected to the multiple head modules 2. The wiring board 7 is bonded to the vibration plate 204. The wiring board 7 protrudes from the vibration plate 204 in the Z2 direction. The wiring board 7 is a mounting component on which multiple wires are formed for electrically connecting the chip 20 and the relay substrate 70. The wiring board 7 is, for example, a flexible board such as an FPC (Flexible Printed Circuit) or a COF (Chip On Film) or a rigid board. A drive signal and a reference voltage for driving the drive elements E are supplied to each drive element E from the wiring board 7.

[0113] The relay board 70 is fixed to the bottom surface of a recess 610 in the Z1-direction surface 605 of the flat plate portion 61 of the holder 6. The relay board 70 is flat and fixed to the holder 6 with an adhesive or the like. The relay board 70 is electrically connected to the control unit 91. A plurality of connectors 71 are mounted on the relay board 70. The plurality of connectors 71 are provided one-to-one with the plurality of wiring boards 7. An end of the wiring board 7, on which a plurality of terminals are provided, is detachably inserted into each connector 71. In other words, the wiring board 7 is preferably rigid so that the end of the wiring board 7 can be easily inserted into and removed from the connector 71. When the wiring board 7 is made of a flexible substrate, it is desirable to attach a rigid body to support the flexible substrate. When the end of the wiring board 7 is inserted into the connector 71, the wiring board 7 is electrically connected to the control unit 91 via the relay board 70.

[0114] 1-3F. Bush As shown in FIG. 4, a bushing 526 is disposed between the flow path opening forming member 25 and the cover 5. Although not shown in detail, for example, the bushing 526 is provided in the Y1 and Y2 directions of each flow path opening forming member 25 when viewed in the Z1 direction. Furthermore, a bushing 522 is disposed between the holder 6 and the cover 5. Although not shown in detail, for example, the bushing 522 is disposed in the shape of a rectangular frame along the outer edge of the holder 6 when viewed in the Z1 direction. Each of the bushings 526 and 522 is made of, for example, an elastic resin material. The provision of the bushings 526 and 522 can reduce the risk of ink mist or the like entering the storage space in the recess 610 of the holder 6 from outside the liquid jet head 1.

[0115] 1-4. Manufacturing method of liquid jet head 1 14 is a flow diagram showing a part of a manufacturing method of the liquid jet head 1 of the first embodiment. As shown in Fig. 14, the manufacturing method of the liquid jet head 1 includes a first positioning step s01, an adhering step s03, a second positioning step s02, and a fixing step s04, in this order. The chip 20 is attached to the flow path opening forming member 25 through the first positioning step s01 and the adhering step s03, thereby manufacturing the head module 2. The head module 2 is attached to the holder 6 through the second positioning step s02 and the fixing step s04.

[0116] By providing the first positioning step s01 and the second positioning step s02, it is possible to achieve high accuracy in the alignment of the plurality of head modules 2 with each other, in particular, in the alignment of the nozzles N of the plurality of head modules 2 with each other.

[0117] 1-4A. First positioning step s01 In the first positioning step s01, the chip 20 is positioned relative to the flow path opening forming member 25. Specifically, the nozzle plate 201 of the chip 20 and the flow path opening forming member 25 are optically positioned relative to an arbitrary nozzle N among the multiple nozzles N.

[0118] 15, 16, and 17 are views for explaining the first positioning step s01 shown in Fig. 14. In the first positioning step s01, the relative positions of the first positioning part 210H and the nozzle N are determined with reference to a predetermined nozzle N, thereby positioning the nozzle plate 201 and the flow path opening forming member 25. Note that in Figs. 15, 16, and 17, a predetermined nozzle N among the multiple nozzles N is simply illustrated.

[0119] 15, in the first positioning step s01, first, a thermosetting adhesive 23, for example, is applied to the surface 251 of the flow path opening forming member 25 facing the Z1 direction, and then the chip 20 is brought into contact with the adhesive 23. At this time, the nozzle plate 201 of the chip 20 is positioned on the opposite side to the adhesive 23.

[0120] 16, a light-transmitting mask M is placed apart from the chip 20 in the Z1 direction of the chip 20. The mask M is, for example, a plate-shaped member having optical transparency of 70% or more for visible light. The mask M is made of an optically transparent material such as glass.

[0121] The mask M is provided with a mark MN corresponding to a predetermined nozzle N and a mark M2 corresponding to the first positioning portion 210H. The marks MN and M2 are provided at positions where the predetermined nozzle N and the first positioning portion 210H are spaced apart at a desired distance from each other. The marks MN and M2 have a light-blocking property with a visible light transmittance of 70% or less so that imaging can be performed.

[0122] Moreover, from the viewpoint of improving positional accuracy, a plurality of marks MN and a plurality of marks M2 are provided. In the illustrated example, two marks MN and two marks M2 are provided on the mask M. Furthermore, from the viewpoint of improving positional accuracy, it is preferable that the two marks MN and the two marks M2 are aligned in a straight line. Note that the number and arrangement of the marks MN and M2 are not limited to the illustrated example.

[0123] 17, the two marks MN and two marks M2 on the mask M, the two predetermined nozzles N on the nozzle plate 201, and the two first positioning portions 210H on the flow path opening forming member 25 are positioned using the imaging means 99. Each of the two predetermined nozzles N on the nozzle plate 201 and the two first positioning portions 210H on the flow path opening forming member 25 functions as an alignment mark for positioning.

[0124] The imaging means 99 is disposed in a state where it is spaced apart from the chip 20 in the Z1 direction of the chip 20 via the mask M. Therefore, the mask M is disposed between the imaging means 99 and the chip 20. Note that the mask M and the imaging means 99 are spaced apart.

[0125] The imaging means 99 is, for example, a camera equipped with an imaging element such as a CMOS image sensor or a CCD image sensor and a condensing lens that condenses light onto the imaging element. The imaging means 99 is used to optically position the two marks MN and two marks M2 on the mask M, and the two predetermined nozzles N and two first positioning portions 210H.

[0126] Specifically, using an image captured by the imaging means 99, two predetermined nozzles N and two first positioning portions 210H, which are multiple alignment marks, are overlapped with the multiple marks on the mask M. This positions the chip 20 and the flow path opening forming member 25 with reference to the nozzles N. Note that the first positioning portions 210H are imaged via the through-holes 211H. In the illustrated example, one camera capable of capturing an image of the entire mask M is shown as the imaging means 99, but the imaging means 99 may include multiple cameras arranged at positions facing the multiple alignment marks.

[0127] According to the above-described first positioning step s01, the chip 20 and the flow path opening forming member 25 can be positioned with high precision using the nozzle N as a reference.

[0128] Furthermore, as described above, in the first positioning step s01, the first positioning portion 210H is used as an alignment mark to position the relative position between the first positioning portion 210H and the nozzle N, thereby aligning the chip 20 with the flow path opening forming member 25.

[0129] The first positioning part 210H is used to position the head module 2 and the holder 6 in a second positioning step s02, which will be described later. Therefore, by using the first positioning part 210H used in the second positioning step s02 as an alignment mark in the first positioning step s01, there is no need to provide another alignment mark in the first positioning step s01. Furthermore, by using the same first positioning part 210H in the first positioning step s01 and the second positioning step s02, the positional accuracy of the chip 20, the flow path opening forming member 25, and the holder 6 relative to each other can be improved.

[0130] In the first positioning step s01, other alignment marks may be provided on the flow path opening forming member 25 without using the first positioning portions 210H as alignment marks.

[0131] As described above, in the first positioning step s01, the first positioning portion 210H and the nozzle N are optically detected by the imaging means 99 located in the Z1 direction in which the nozzle N opens, relative to the nozzle plate 201 and the flow path opening forming member 25. According to this method, the nozzle plate 201 and the flow path opening forming member 25 can be positioned easily and with high precision using the nozzle N as a reference.

[0132] Specifically, the first positioning portion 210H is optically detected via a through hole 211H that opens in a surface 251 facing the Z1 direction of the flow path opening forming member 25. As described above, the through hole 211H is disposed in the Z1 direction relative to the first positioning portion 210H, communicates with the first positioning portion 210H, and has a larger outer shape than the first positioning portion 210H. The presence of such a through hole 211H makes it easy to optically detect the position of the first positioning portion 210H via the through hole 211H.

[0133] 8, the depth D21 of the through-hole 211H is deeper than the depth D20 of the first positioning portion 210H. In other words, the depth D20 is shallower than the depth D21. This allows for highly accurate positioning. Furthermore, because the depth D20 is shallower than D21, it is easier to attach and detach the first positioning portion 210H and the second positioning portion 654 than when the depth D20 is deeper than D21.

[0134] Furthermore, the first positioning portion 210H does not overlap with the chip 20 when viewed in the Z1 direction. Therefore, the nozzle N and the first positioning portion 210H do not overlap when viewed in the Z1 direction. Therefore, the nozzle N and the first positioning portion 210H can be used as alignment marks to optically position the chip 20 and the flow path opening forming member 25 from below the chip 20.

[0135] 1-4B. Adhesion process s03 In the bonding step s03, after the first positioning step s01, the adhesive 23 for fixing the chip 20 and the flow path opening forming member 25 is hardened. For example, if the adhesive 23 is a thermosetting resin, the adhesive 23 is hardened by applying heat.

[0136] In this embodiment, the bonding step s03 is performed between the first positioning step s01 and the second positioning step s02. After the first positioning step s01, the chip 20 and the flow path opening-forming member 25 are bonded together, thereby improving the positioning accuracy between the chip 20 having the nozzle N and the flow path opening-forming member 25. Therefore, for example, the positioning between the wiring holes 20H and the wiring holes 25H, and the positioning between the space Rc and the communicating space Ra can be performed with high accuracy.

[0137] 1-4C. Second positioning step s02 In the second positioning step s02, the head module 2 is positioned relative to the holder 6. Specifically, the second positioning portion 654 of the holder 6 is press-fitted into the first positioning portion 210H of the flow path opening forming member 25, thereby positioning the head module 2 and the holder 6.

[0138] Fig. 18 is a view for explaining the second positioning step s02 shown in Fig. 14. In the second positioning step s02, the head module 2 is brought closer to the holder 6, as shown by arrow A2. Then, the second positioning portion 654 is press-fitted into the first positioning portion 210H. This allows the head module 2 and the holder 6 to be positioned.

[0139] Furthermore, when the second positioning portion 654 is press-fitted into the first positioning portion 210H, the sealing member 4 is interposed between the head module 2 and the holder 6. At this time, the sealing member 4 is positioned so that, for example, the communication port 4H of the sealing member 4 overlaps with the flow path opening 650H of the holder 6 when viewed in the Z1 direction. Furthermore, when the second positioning portion 654 is press-fitted into the first positioning portion 210H, the wiring board 7 is inserted into the connector 71.

[0140] 1-4D.Fixing process s04 In the fixing step s04, the head module 2 is attached to the holder 6. Specifically, the fixing members 157 are inserted through the fixing holes 651H and 215 in this order. If the fixing members 157 are screws, the head module 2 is fixed to the holder 6 by being screwed in by the fixing members 157.

[0141] By the above method, the chip 20 is attached to the flow path opening forming member 25, and the head module 2 is attached to the holder 6.

[0142] As described above, the manufacturing method of the liquid jet head 1 includes a first positioning step s01 and a second positioning step s02. Since the chip 20 and the flow path opening forming member 25 are positioned with reference to the nozzle N in the first positioning step s01, the head module 2 and the holder 6 are positioned with reference to the nozzle N simply by press-fitting the flow path opening forming member 25 into the holder 6. This makes it possible to improve the positional accuracy of each head module 2 with respect to the holder 6. Furthermore, it is possible to improve the precision of nozzle alignment between the multiple head modules 2. Therefore, when it becomes necessary to replace one of the multiple head modules 2 of the liquid jet head 1 with another head module 2 due to a malfunction or the like, it is possible to ensure highly accurate nozzle alignment between the multiple head modules 2 simply by press-fitting the flow path opening forming member 25 into the holder 6. This makes it easy to replace and regenerate the head module 2.

[0143] As described above, the direction in which one of the first positioning portion 210H and the second positioning portion 654 is press-fitted into the other is the same as the direction in which the flow path opening 650H and the flow path opening 251H overlap. Therefore, by attaching the head module 2 to the holder 6, the flow path 6R and the flow path 25R can be connected easily and with high precision.

[0144] Furthermore, the multiple second positioning parts 654 are arranged on the bottom surface of the first recess 611. Furthermore, the first positioning part 210H is arranged on the surface 252 of the cover 5 facing the Z2 direction, which is the opposite direction to the Z1 direction. By arranging the first positioning parts 210H and the second positioning parts 654 in this way, it is possible to easily attach and detach only the head module 2 to be replaced from below the holder 6.

[0145] 4, the fixing member 157 is arranged so as not to overlap the chip 20 when viewed in the Z1 direction and so as to sandwich the sealing member 4 between the chip 20 and the fixing member 157. Because the fixing member 157 does not overlap the chip 20 when viewed in the Z1 direction, the load generated by the fixing of the fixing member 157 is less likely to be applied to the chip 20 in the fixing step s04 than when the fixing member 157 overlaps. Furthermore, because the sealing member 4 is arranged between the fixing member 157 and the chip 20 when viewed in the Z1 direction, the distance between the chip 20 and the fixing member 157 can be increased by the length of the sealing member 4. Therefore, the load generated by the fixing of the fixing member 157 is less likely to be applied to the chip 20.

[0146] 2. Second embodiment A second embodiment of the present disclosure will be described below. In the following exemplary embodiments, elements whose actions or functions are similar to those of the first embodiment will be designated by the same reference numerals as those used in the description of the first embodiment, and detailed descriptions of each element will be omitted where appropriate.

[0147] 2-1. Manufacturing method of liquid jet head 1 The manufacturing method of the liquid jet head 1 of this embodiment is a method of removing the head module 2 of a certain liquid jet head 1, repairing the head module 2, and manufacturing a new liquid jet head 1 using the repaired head module 2. Hereinafter, the certain liquid jet head 1 will be referred to as the "first liquid jet head 1a," and the new liquid jet head 1 will be referred to as the "second liquid jet head 1b."

[0148] Specifically, the manufacturing method of the liquid jet head 1 of this embodiment includes a method of removing a specific head module 2 from a holder 6, repairing the specific head module to manufacture a new head module 2, and then attaching the new head module 2 to another holder 6.

[0149] In the following, a certain holder 6 will be referred to as the "first holder 6a," and the multiple head modules 2 attached to the first holder 6a will be referred to as the "first head module 2a." The specific head module 2 described above is one or more of the multiple first head modules 2a. Furthermore, another new holder 6 will be referred to as the "second holder 6b," and the multiple head modules 2 attached to the second holder 6b will be referred to as the "second head module 2b." The new head module 2 that replaces the first head module 2a is the second head module 2b. Furthermore, the chip 20 included in the first head module 2a will be referred to as the "first chip 20a," and the nozzle plate 201 included in the first chip 20a will be referred to as the "first nozzle plate 201a." The chip 20 included in the second head module 2b will be referred to as the "second chip 20b," and the nozzle plate 201 included in the second chip 20b will be referred to as the "second nozzle plate 201b."

[0150] Fig. 19 is a flow diagram showing a part of a manufacturing method of the liquid jet head 1 according to the second embodiment. As shown in Fig. 19, the manufacturing method of the liquid jet head 1 according to the present embodiment includes a fixing release step s05, a press-fit release step s06, a disassembly step s07, a first positioning step s01, a bonding step s03, a second positioning step s02, and a fixing step s04.

[0151] 2-1A. Fixing release process s05 In the fixing release step s05, the fixing between the first holder 6a and the first head module 2a of the first liquid jet head 1a is released. Specifically, the fixing between the first holder 6a and the first head module 2a can be released by removing the fixing members 157 from the fixing holes 651H and 215. Note that before this fixing release step s05, the cover 5 is removed from the first holder 6a.

[0152] 2-1B. Press-fit release process s06 Fig. 20 is a view for explaining the press-fit release step s06 shown in Fig. 19. As shown in Fig. 20, in the press-fit release step s06, the press-fit state of the second positioning portion 654 of the first holder 6a relative to the first positioning portion 210H of the first head module 2a is released. The worker grips and pulls the first head module 2a downward in the direction indicated by arrow A3, thereby releasing the press-fit and removing the first head module 2a from the first holder 6a.

[0153] Furthermore, for example, after removing the fixing member 157 from the fixing hole 651H and the fixing hole 215, a long rod-shaped member is inserted through the fixing hole 651H and the fixing hole 215, and the member is used to press the first head module 2a in the Z1 direction. This makes it possible to easily release the first head module 2a from being pressed into the first holder 6a. In other words, by using the fixing hole 651H as a hole for releasing the press-fit, it is possible to easily release the first head module 2a from being pressed into the first holder 6a. Furthermore, the depth of the fixing hole 651H is deeper than the depth of the fixing hole 215. This makes it easy to remove the flow path opening forming member 25 from the holder 6.

[0154] Furthermore, the relay substrate 70 is disposed in the Z2 direction relative to the multiple head modules 2. Furthermore, the first positioning portion 210H is provided on a surface 252 of the flow path opening forming member 25 that faces the Z2 direction. This makes it easy to attach and detach the first head module 2a and wiring substrate 7 to be replaced from below the first holder 6a and the relay substrate 70. This eliminates the need to disconnect the electrical connections of first head modules 2a other than the one to be replaced, simplifying the attachment and detachment work.

[0155] The press-fit state refers to an interference fit or intermediate fit, and refers to a state in which the second positioning portion 602 is in contact with the first positioning portion 502 at at least two points when the second positioning portion 602 is completely inserted into the first positioning portion 502. Also, before press-fitting, the length of the longest line segment connecting two points on the outer periphery of the second positioning portion 602, which is a positioning pin, when viewed in the direction along the Z axis is greater than the diameter of the largest circle inscribed in the first positioning portion 502, which is a positioning hole. Also, in the press-fit state, the head module 2 is fitted into the holder 6 to such an extent that it does not fall under its own weight due to the force of the press-fitting.

[0156] 2-1C. Decomposition process s07 FIG. 21 is a diagram illustrating the disassembly step s07 shown in FIG. 19. As shown in FIG. 21, in the disassembly step s07, the first chip 20a and the flow path opening forming member 25 of the first head module 2a are disassembled. That is, the first chip 20a having the first nozzle plate 201a is removed from the flow path opening forming member 25. For example, if the adhesive 23 is a thermosetting resin, a release agent or the like is used on the adhesive 23. If the adhesive 23 is a thermoplastic resin, a heater (not shown) is used to heat the adhesive 23, softening the adhesive 23 and separating the first chip 20a and the flow path opening forming member 25.

[0157] 2-1D. First positioning step s01 Fig. 22 is a diagram for explaining the first positioning step s01 shown in Fig. 19. As shown in Fig. 22, in the first positioning step s01 of this embodiment, the flow path opening forming member 25 separated from the first chip 20a in the disassembly step s07 and the second chip 20b including at least a second nozzle plate 201b different from the first nozzle plate 201a are optically positioned using the nozzles N of the second nozzle plate 201b as a reference. In other words, the second nozzle plate 201b and the flow path opening forming member 25 are optically positioned using the nozzles N as a reference.

[0158] The positioning method is the same as that of the first embodiment. Specifically, as shown in Fig. 22, the positioning is performed using a mask M and an imaging means 99. Therefore, even for the second chip 20b having a new second nozzle plate 201b, the second chip 20b and the flow path opening forming member 25 can be aligned with high precision.

[0159] The bonding step s03 in this embodiment is the same as the bonding step s03 in the first embodiment. In the bonding step s03 in this embodiment, the second chip 20b and the flow path opening forming member 25 are bonded together with the adhesive 23. As a result, a second head module 2b including the second chip 20b and the flow path opening forming member 25 is produced.

[0160] 2-1E. Second positioning step s02 Fig. 23 is a view for explaining the second positioning step s02 shown in Fig. 19. As shown in Fig. 23, in the second positioning step s02, the second head module 2b and the second holder 6b are positioned by press-fitting the second positioning portion 654 of a new second holder 6b, which is different from the first holder 6a, into the first positioning portion 210H of the flow path opening formation member 25 of the second head module 2b.

[0161] Since the second chip 20b and the flow path opening forming member 25 are aligned with respect to the nozzle N in the first positioning step s01, the second head module 2b and the second holder 6b are positioned with respect to the nozzle N simply by press-fitting the flow path opening forming member 25 into the second holder 6b. Therefore, highly accurate alignment of the nozzles N between the multiple second head modules 2b can be ensured simply by press-fitting the flow path opening forming member 25 into the second holder 6b. Therefore, by reusing the flow path opening forming member 25, the replacement work of the liquid jet head 1 can be facilitated by using the repaired head module 2.

[0162] Next, the second head module 2b is fixed to the second holder 6b in a fixing step s04 similar to that in the first embodiment.

[0163] The first holder 6a may be an example of a "second holder." In other words, the above-described first holder 6a and second holder 6b may be the same holder 6. Specifically, the second liquid jet head 1b may be manufactured by repairing the first head module 2a, which has been removed from the first holder 6a of the first liquid jet head 1a, through the steps from the unfixing step s05 to the bonding step s03, and then positioning and fixing the second head module 2b to the first holder 6a of the first liquid jet head 1a in the second positioning step s02 and the fixing step s04.

[0164] According to the method described above, the second liquid jet head 1b can be manufactured from the first liquid jet head 1a. From another perspective, according to the method described above, the liquid jet head 1 can be remanufactured by reusing the flow path opening-forming member 25.

[0165] Furthermore, it is preferable that the flow path opening forming member 25 is made of metal. When the flow path opening forming member 25 is made of metal, it is easier to reuse the flow path opening forming member 25 compared to when it is made of resin.

[0166] 3. Variations The first embodiment exemplified above can be modified in various ways. Specific modified aspects that can be applied to the first embodiment are exemplified below. Two or more aspects arbitrarily selected from the following examples can be combined as appropriate within a range that does not contradict each other.

[0167] 3-1. First modified example Figure 24 is a cross-sectional view of a portion of the liquid jet head 1 of the first modified example. The liquid jet head 1 of the first modified example shown in Figure 24 has a holder 8. The holder 8 has a first holder 81 and a second holder 82. The first holder 81 is almost the same as the holder 6 of the first embodiment, except that the flange portion 64 is omitted.

[0168] The second holder 82 is the same as the cover 5 of the first embodiment except for the following elements. When viewed in the Z1 direction, the second holder 82 has a portion that extends further in the Y1 or Y2 direction than the first holder 81. A fourth positioning portion 824 is provided in this extending portion. The fourth positioning portion 824 has the same configuration as the fourth positioning portion 642 of the first embodiment, and is press-fitted into the third positioning portion 102 of the unit base 11.

[0169] The second holder 82 also has a plurality of second positioning portions 822. Two second positioning portions 822 are provided for each head module 2. Although not shown in detail, one of the two second positioning portions 822 is located in the Y1 direction relative to the chip 20 when viewed in the Z1 direction, and the other is located in the Y2 direction. The second positioning portion 822 is a hole that opens into the surface 512 of the second holder 82 that faces the Z2 direction. The second positioning portion 822 is a recess formed in the surface 512 of the second holder 82 that faces the Z2 direction, and can also be said to be a depression provided in the surface 512.

[0170] The head module 2 also has a first positioning portion 217 corresponding to the second positioning portion 822. The first positioning portion 217 is a protrusion that protrudes in the Z1 direction from a surface 251 facing the Z1 direction of the flow path opening forming member 25. The first positioning portion 217 is press-fitted into the second positioning portion 822. This positions the head module 2 with respect to the holder 8 including the second holder 82.

[0171] It should be noted that, for example, the second holder 82 and each head module 2 are fixed with an adhesive or the like. When the second holder 82 and each head module 2 are fixed with an adhesive, if they can be separated by, for example, melting the adhesive with heat, they can be regarded as being detachably fixed to the second holder 82 and each head module 2.

[0172] In the liquid ejection head 1 of this modification, in the first positioning step s01, the first positioning portion 217 arranged on the surface 251 of the flow path opening forming member 25 facing the Z1 direction, and the nozzle N opening on the nozzle surface SN, which is the surface of the nozzle plate 201 of the chip 20 facing the Z1 direction, can be optically detected by an imaging means positioned in the Z1 direction relative to the nozzle plate 201 and the flow path opening forming member 25, so that optical positioning of the nozzle plate 201 and the flow path opening forming member 25 can be performed easily and with high precision using the nozzle N as a reference.

[0173] 2-2.Other variations Furthermore, for example, the holder 6 may be formed with a dedicated through-hole for releasing the press-fit between the first positioning portion 210H and the second positioning portion 654. For example, the through-hole may be a hole with an opening area larger than the opening area of ​​the fixing hole 651H.

[0174] In the above description, the sealing member 4 is provided for each head module 2, but the sealing member 4 may be integrated and shared by a plurality of head modules 2.

[0175] The configurations of the "first positioning portion" and the "second positioning portion" in the above-described embodiments and modified examples are not particularly limited as long as they are configured so that one is press-fitted into the other. Therefore, although the above-described embodiments are configured so that the "second positioning portion" is press-fitted into the "first positioning portion," the "first positioning portion" may be press-fitted into the "second positioning portion."

[0176] "Liquid ejection devices" can be used in various devices such as facsimile machines and copiers, as well as devices dedicated to printing. The uses of liquid ejection devices are not limited to printing. For example, a liquid ejection device that ejects a solution of coloring material is used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. A liquid ejection device that ejects a solution of conductive material is used as a manufacturing device for forming wiring and electrodes on relay boards. A liquid ejection device that ejects a solution of organic matter related to living organisms is used as a manufacturing device for manufacturing biochips, for example.

[0177] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the above-described embodiments. Furthermore, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above-described embodiments, and any configuration can be added. [Explanation of symbols]

[0178] REFERENCE SIGNS LIST 1...liquid jet head, 1a...first liquid jet head, 1b...second liquid jet head, 2...head module, 2a...first head module, 2b...second head module, 3...supply flow path member, 4...sealing member, 5...cover, 6...holder, 6a...first holder, 6b...second holder, 7...wiring board, 10...liquid jet head unit, 20...chip, 20a...first chip, 20b...second chip, 23...adhesive, 25...flow path opening forming member, 70...relay board, 71...connector, 100...liquid jet Injection device, 157...fixing member, 201...nozzle plate, 201a...first nozzle plate, 201b...second nozzle plate, 210H...first positioning portion, 211H...through hole, 251H...flow path opening, 650H...flow path opening, 654...second positioning portion, M...mask, M2...mark, MN...mark, N...nozzle, SN...nozzle surface, s01...first positioning step, s02...second positioning step, s03...bonding step, s04...fixing step, s05...fixing release step, s06...press-fit release step, s07...disassembly step.

Claims

1. A method for manufacturing a liquid jet head including a plurality of head modules, each of which has a flow path opening forming member and a chip including at least a nozzle plate in which a plurality of nozzles are formed, and a holder for holding the plurality of head modules, a first positioning step of optically positioning the nozzle plate and the flow path opening forming member with reference to the nozzle; a second positioning step of positioning the head module and the holder by press-fitting one of the first positioning portion of the flow path opening forming member and the second positioning portion of the holder into the other; A method for manufacturing a liquid jet head, comprising:

2. a bonding step of curing an adhesive for fixing the chip and the flow path opening forming member after the first positioning step, The method for manufacturing a liquid jet head according to claim 1 .

3. The first positioning step determines a relative position between the first positioning unit and the nozzle. The method for manufacturing a liquid jet head according to claim 1 .

4. the first positioning step optically detects the first positioning portion and the nozzle by an imaging means positioned in a first direction in which the nozzle opens relative to the nozzle plate and the flow path opening forming member; The method for manufacturing a liquid jet head according to claim 3 .

5. the first positioning step optically detects the first positioning portion disposed on a surface of the flow path opening forming member facing the first direction, and the nozzle; The method for manufacturing a liquid jet head according to claim 4 .

6. the first positioning portion is a positioning hole into which a positioning pin serving as the second positioning portion is press-fitted, a surface of the flow path opening forming member facing the first direction having a through hole that is disposed in the first direction with respect to the positioning hole, communicates with the positioning hole, and has an outer diameter larger than that of the positioning hole; The method for manufacturing a liquid jet head according to claim 4 .

7. The depth of the through hole is greater than the depth of the positioning hole. The method for manufacturing a liquid jet head according to claim 6 .

8. A method for manufacturing a second liquid jet head including a second holder, using some of the first head modules of a first liquid jet head including a plurality of first head modules and a first holder that holds the plurality of first head modules, the method comprising: a press-fit release step of releasing a press-fit state in which one of the first positioning portion of the first head module and the second positioning portion of the first holder is press-fitted into the other; a disassembly process of disassembling the first head module, the press-fit state of which has been released from the first holder in the press-fit release process, into a first chip including at least a first nozzle plate in which a plurality of nozzles are formed, and a flow path opening forming member in which the first positioning portion is provided; a first positioning step of optically positioning a flow path opening forming member separated from the first chip in the disassembly step and a second chip including at least a second nozzle plate different from the first nozzle plate, the second nozzle plate and the flow path opening forming member with reference to nozzles of the second nozzle plate; a second positioning step of positioning the second head module and the second holder by press-fitting one of the first positioning portion of the flow path opening forming member and the second positioning portion of the second holder into the other, the second head module including the second chip and the flow path opening forming member positioned by the first positioning step; A method for manufacturing a liquid jet head, comprising:

9. The flow path opening forming member is made of metal. The method for manufacturing a liquid jet head according to claim 8 .

Images