Liquid jet head, and liquid jet device

Abstract

To provide a liquid jet head and a liquid jet device which can easily align a plurality of head modules.SOLUTION: A liquid jet head includes a plurality of head modules for jetting liquid in a first direction, a plurality of sub holders which each includes at least one head module among the plurality of head modules and are made of metal, and a metal holder to which the plurality of sub modules are detachably fixed, wherein each of the plurality of sub holders has a first positioning part, and the holder has a plurality of second positioning parts which are press-fit into each of the plurality of first positioning parts, and thereby position each of the plurality of sub modules with respect to the holder.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. [Background technology]

[0002] 2. Description of the Related Art Liquid ejection apparatuses equipped with liquid ejection heads that eject liquid such as ink onto a medium such as printing paper have been proposed.

[0003] The liquid jet head described in Patent Document 1 has a plurality of head chips (head modules), a fixing plate, and a holder. The plurality of head chips are housed in a space surrounded by the fixing plate and the holder. The plurality of head chips are aligned with the fixing plate and fixed with an adhesive. The fixing plate is also fixed to the holder with an adhesive. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-42753 Summary of the Invention [Problem to be solved by the invention]

[0005] When one of the head modules among the plurality of head modules breaks down, there is a demand for repairing the liquid ejection head by removing only the broken head module and replacing it with a new head module.

[0006] However, in the conventional document, when removing some of the head modules from the holder, it is necessary to remove the fixing plate from the holder. As a result, there is a risk that misalignment will occur between the multiple head modules relative to the fixing plate. Therefore, when performing work to repair a liquid jet head by replacing some of the head modules included in one liquid jet head, it is desirable to be able to easily align the multiple head modules. [Means for solving the problem]

[0007] A liquid ejection head according to one embodiment of the present disclosure comprises a plurality of head modules that eject liquid in a first direction, a plurality of metal sub-holders that each hold at least one of the plurality of head modules, and a metal holder to which the plurality of sub-holders are removably fixed, wherein each of the plurality of sub-holders has a first positioning portion, and the holder has a plurality of second positioning portions that are pressed into or engaged with each of the plurality of first positioning portions to position each of the plurality of sub-holders relative to the holder.

[0008] A liquid ejection apparatus according to an aspect of the present disclosure includes a plurality of the liquid ejection heads and a unit base that holds the plurality of liquid ejection heads.

[0009] In one embodiment of the liquid jet head of the present disclosure, the holder has a fourth positioning portion that positions the liquid jet head relative to the unit base by being pressed into or being pressed into one of a plurality of third positioning portions provided on a unit base that holds a plurality of the liquid jet heads.

[0010] A liquid ejecting apparatus according to an aspect of the present disclosure includes a plurality of the liquid ejecting heads, and a unit base that includes a plurality of the third positioning portions and holds the plurality of liquid ejecting heads. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram illustrating an example of the configuration of a liquid ejecting apparatus according to a first embodiment. [Figure 2] FIG. 2 is a plan view showing the liquid jet unit shown in FIG. [Figure 3] FIG. 3 is a cross-sectional perspective view of the liquid jet head shown in FIG. [Figure 4] 4 is a cross-sectional view of the liquid jet head shown in FIG. 3 as viewed in a direction along the X axis. [Figure 5] 4 is a cross-sectional view of the liquid jet head shown in FIG. 3 as viewed in the direction along the Y axis. [Figure 6] FIG. 4 is a bottom view of the liquid jet head shown in FIG. [Figure 7] FIG. 5 is a cross-sectional view of a chip included in the head module shown in FIG. [Figure 8] 6 is a top view of a flow path opening forming member included in the head module shown in FIG. 5. FIG. [Figure 9] FIG. 6 is a bottom view of the common flow path member shown in FIG. [Figure 10] FIG. 6 is a top view of the common flow path member shown in FIG. [Figure 11] FIG. 6 is a top view of the sealing member shown in FIG. [Figure 12] FIG. 6 is a top view of the sub-holder shown in FIG. 5. [Figure 13] FIG. 6 is a top view of the upper portion of the holder shown in FIG. 5. [Figure 14] FIG. 6 is a view showing the lower part of the holder shown in FIG. 5. [Figure 15] 10 is a cross-sectional view of a portion of a liquid jet head according to a first modified example. [Figure 16] 10 is a cross-sectional view of a portion of a liquid jet head according to a first modified example. [Figure 17] FIG. 10 is a top view of a liquid jet head according to a first modified example. [Figure 18] FIG. 10 is a cross-sectional view of a portion of a liquid jet head according to a second modified example. [Figure 19] FIG. 10 is a cross-sectional view of a portion of a liquid jet head according to a second modified example. [Figure 20]10 is a cross-sectional view of a portion of a liquid jet head according to a third modified example. [Figure 21] 10 is a cross-sectional view of a portion of a liquid jet head according to a third modified example. [Figure 22] FIG. 10 is a view showing a second member of a holder according to a third modified example. [Figure 23] FIG. 13 is a cross-sectional view of a portion of a liquid jet head according to a fifth modified example. [Figure 24] FIG. 13 is a cross-sectional view showing a sealing member and its vicinity in a sixth modified example. [Figure 25] 13 is a cross-sectional view of a portion of a liquid jet head according to a sixth modified example. [Figure 26] FIG. 13 is a cross-sectional view showing a sealing member and its vicinity in a seventh modified example. [Figure 27] FIG. 13 is a cross-sectional view showing a first positioning portion and a second positioning portion of an eighth modified example. DETAILED DESCRIPTION OF THE INVENTION

[0012] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The dimensions and scale of each part in the drawings may differ from the actual dimensions, and some parts are shown schematically to facilitate understanding. The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to limit the present invention. Furthermore, the term "element β on element γ" is not limited to a configuration in which element γ and element β are in direct contact with each other, but also includes a configuration in which element γ and element β are not in direct contact with each other. The term "element γ and element β are equal" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like. The term "element γ and element β are the same" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like.

[0013] 1. First embodiment 1-1. Overall configuration of the liquid ejection device 100 FIG. 1 is a schematic diagram illustrating the configuration of a liquid ejection device 100 according to a first embodiment. For ease of explanation, the following description will appropriately use mutually perpendicular X, Y, and Z axes. A direction along the X axis will be referred to as the X1 direction, and a direction opposite to the X1 direction will be referred to as the X2 direction. Similarly, a direction along the Y axis will be referred to as the Y1 direction, and a direction opposite to the Y1 direction will be referred to as the Y2 direction. A direction along the Z axis will be referred to as the Z1 direction, and a direction opposite to the Z1 direction will be referred to as the Z2 direction. The Z1 direction corresponds to the "first direction." The Z2 direction corresponds to the "second direction opposite to the first direction." The Z1 direction relative to a certain point is referred to as "downward," and the Z2 direction from a certain point is referred to as "upward." Viewing in the Z1 or Z2 direction is referred to as a "planar view."

[0014] As shown in FIG. 1, the liquid ejecting device 100 includes a liquid storage section 9, a control unit 91, a conveying section 92, a head unit 10, and a movement mechanism 40.

[0015] The liquid storage unit 9 is a container that stores ink. Specific examples of the liquid storage unit 9 include a cartridge that is detachable from the liquid ejection device 100, a bag-shaped ink pack made of flexible film, and an ink tank that can be refilled with ink. The type of ink stored in the liquid storage unit 9 is not particularly limited and can be any type.

[0016] The control unit 91 controls the operation of each element of the liquid ejection device 100. The control unit 91 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and controls the operation of each element of the liquid ejection device 100.

[0017] The transport unit 92 transports the medium 90 in a direction DM under the control of the control unit 91. In this embodiment, the direction DM is the Y1 direction. In the example shown in FIG. 1, the transport unit 92 includes a long transport roller along the X axis and a motor that rotates the transport roller. Note that the transport unit 92 is not limited to a configuration using a transport roller, and may be configured, for example, to use a drum or endless belt that transports the medium 90 while adsorbing it to its outer peripheral surface using electrostatic force or the like.

[0018] The movement mechanism 40 has a conveyor belt to which the unit base 11 of the head unit 10 is fixed, and moves the head unit 10 back and forth in the X1 direction and the X2 direction under the control of a control unit 91. Under the control of the control unit 91, the head unit 10 ejects ink supplied from a liquid storage section 9 from each of a plurality of nozzles N onto the medium 90 in the Z1 direction. The ejection of ink from the head unit 10 is performed in parallel with the movement of the head unit 10 by the movement mechanism 40, thereby forming an ink image on the surface of the medium 90.

[0019] The number and arrangement of the multiple liquid jet heads 1 included in the head unit 10 are not limited to the example shown in Fig. 1 and are arbitrary. Furthermore, if the head unit 10 is configured to be able to circulate ink, the head unit 10 may be connected to the liquid storage section 9 via a circulation mechanism for circulating the ink within the head unit 10.

[0020] 1-2. Head unit 10 Fig. 2 is a plan view showing the head unit 10 shown in Fig. 1. As shown in Fig. 2, the head unit 10 includes a unit base 11 and a plurality of liquid jet heads 1. The plurality of liquid jet heads 1 are fixed to the unit base 11. The unit base 11 is a member that holds the plurality of liquid jet heads 1. In the illustrated example, the number of liquid jet heads 1 relative to the unit base 11 is not particularly limited, and may be any number equal to or greater than one.

[0021] The unit base 11 is, for example, a plate-like member whose thickness direction is along the Z axis. A recess 111 is provided in the unit base 11. The recess 111 is a depression provided in the unit base 11. A plurality of through holes 11H are provided in the bottom surface of the recess 111. The planar shape of each through hole 11H is, for example, a rectangle. One through hole 11H is provided for each liquid jet head 1. A part of the liquid jet head 1 is inserted into each through hole 11H. Note that in Figure 2, some of the liquid jet heads 1 arranged in part of the unit base 11 are not shown in order to show the through holes 11H.

[0022] Furthermore, the unit base 11 is provided with four mounting holes 101 and two third positioning portions 102 for each through hole 11H. The four mounting holes 101 and the two third positioning portions 102 are provided outside the through hole 11H in plan view. Note that the number and arrangement of the mounting holes 101 and the third positioning portions 102 are not limited to the example shown in FIG. 2 and are arbitrary.

[0023] The mounting holes 101 are provided, for example, near the four corners of the through-hole 11H in plan view. The mounting holes 101 are used to mount the liquid jet head 1 to the unit base 11. The mounting holes 101 penetrate the unit base 11, for example, in the thickness direction.

[0024] Each third positioning portion 102 is provided, for example, between two mounting holes 101 aligned in the direction along the X axis and spaced apart from each other. Each third positioning portion 102 is used for positioning when mounting the unit base 11 of the liquid jet head 1. Each third positioning portion 102 is, for example, a bottomed hole that opens on the surface of the unit base 11 facing in the Z1 direction. It can also be said that each third positioning portion 102 is a recess formed in the surface of the unit base 11 facing in the Z1 direction.

[0025] Note that each mounting hole 101 does not have to penetrate the unit base 11 in the thickness direction. Similarly, each third positioning portion 102 may penetrate the unit base 11 in the thickness direction. Furthermore, the shape of the unit base 11 is not limited to a plate shape, and may be, for example, a box shape.

[0026] As described above, the liquid ejection device 100 includes a plurality of liquid ejection heads 1 and a unit base 11 to which the plurality of liquid ejection heads 1 are fixed. The liquid ejection device 100 includes the liquid ejection heads 1 described below. As described below, each of the plurality of liquid ejection heads 1 is detachable from the unit base 11 and is configured to increase the alignment accuracy between the plurality of liquid ejection heads 1. Therefore, according to the liquid ejection device 100, even when any one of the plurality of liquid ejection heads 1 is replaced, it is possible to suppress a decrease in print quality.

[0027] 1-3. Liquid jet head 1 FIG. 3 is a cross-sectional perspective view of the liquid jet head 1 shown in FIG. 2. FIG. 4 is a cross-sectional view of the liquid jet head 1 shown in FIG. 3, viewed in a direction along the X-axis. FIG. 5 is a cross-sectional view of the liquid jet head 1 shown in FIG. 3, viewed in a direction along the Y-axis. As shown in FIG. 5, in this embodiment, the liquid jet head 1 is configured to be substantially symmetrical with respect to a central imaginary plane A10 along the XZ plane. The liquid jet head 1 does not have to be configured to be symmetrical with respect to the central imaginary plane A10. A partition wall portion 63 of a holder 6, which will be described later, is not shown in FIG.

[0028] 3 to 5, the liquid jet head 1 includes a plurality of head modules 2, two common flow path members 3, a sealing member 4, a plurality of sub-holders 5, a holder 6, a plurality of wiring substrates 7, and a relay substrate 70. In this embodiment, a sub-holder 5 is provided for each head module 2. As shown in FIG. 4, the head module 2 and the corresponding sub-holder 5 form a sub-unit 15.

[0029] 1-3A. Head Module 2 4, the plurality of head modules 2 are six head modules 2. The number of head modules 2 is not limited to six, and may be two or more and five or less, or seven or more.

[0030] In this embodiment, the multiple head modules 2 are aligned along the X axis. As shown in FIGS. 3 and 5, each head module 2 is elongated along the Y axis. Each head module 2 ejects ink in the Z1 direction. The head module 2 includes a chip 20 and a flow path opening forming member 25. The chip 20 is disposed in the Z1 direction relative to the flow path opening forming member 25.

[0031] FIG. 6 is a bottom view of the liquid jet head 1 shown in FIG. 3. As shown in FIG. 6, each head module 2 has a plurality of nozzles N that eject ink. The plurality of nozzles N are arranged along the Y axis. The plurality of nozzles N are divided into nozzle rows La and nozzle rows Lb that are arranged side by side at intervals along the X axis. Each of the nozzle rows La and Lb is a collection of a plurality of nozzles N that are linearly arranged along the Y axis. Furthermore, the surface of the head module 2 on which the openings of the plurality of nozzles N are formed is referred to as the nozzle surface SN. The nozzle surface SN is the surface of the chip 20 of the head module 2 that faces the Z1 direction. Note that, for example, the plurality of nozzles N may be arranged in a direction that intersects the X axis and the Y axis when viewed in the Z1 direction.

[0032] 1-3Aa. Chip 20 7 is a cross-sectional view of the chip 20 included in the head module 2 shown in FIG. 4. The chip 20 has a structure in which elements related to each nozzle N of the nozzle row La and elements related to each nozzle N of the nozzle row Lb are arranged in a substantially plane-symmetrical manner. In the following explanation, the elements corresponding to the nozzle row La will be mainly explained, and explanations of elements corresponding to the nozzle row Lb will be omitted as appropriate. In the following, when there is no need to distinguish between the nozzle row La and the nozzle row Lb, they will be referred to as the nozzle row L.

[0033] As shown in FIG. 7, the chip 20 of each head module 2 includes, for example, a communication plate 202, a pressure chamber substrate 203, a vibration plate 204, a nozzle plate 201, a cover 206, a plurality of drive elements E, and a sealing substrate 205.

[0034] The communicating plate 202, pressure chamber substrate 203, diaphragm 204, nozzle plate 201, and cover 206 are each a long plate-like member extending along the Y axis. The pressure chamber substrate 203 is placed on the surface of the communicating plate 202 facing the Z2 direction. The nozzle plate 201 and cover 206 are placed on the surface of the communicating plate 202 facing the Z1 direction. The components are fixed together, for example, with an adhesive.

[0035] The nozzle plate 201 is a plate-like member in which a plurality of nozzles N are formed. The nozzle plate 201 is the member of the head module 2 that is located furthest in the Z1 direction. The surface of the nozzle plate 201 that faces the Z1 direction is the nozzle surface SN. Each of the plurality of nozzles N is a circular through-hole that ejects ink. For example, the nozzle plate 201 is manufactured by processing a silicon (Si) single crystal substrate using semiconductor manufacturing techniques such as photolithography and etching.

[0036] The communicating plate 202 is formed with a plurality of throttle portions R1, a plurality of communicating channels R2, a communicating space Ra, and a common channel Rb. Each of the throttle portions R1 and the communicating channels R2 extends in the Z1 direction and is a through-hole formed for each nozzle N. The communicating channels R2 overlap with the nozzles N in plan view. The communicating spaces Ra are elongated openings formed along the Y axis. The communicating spaces Ra extend along the Y axis. The common channels Rb communicate with the communicating spaces Ra and overlap with the communicating spaces Ra in plan view. The common channels Rb extend along the Y axis. The common channels Rb communicate with the plurality of throttle portions R1. Furthermore, the communicating spaces Ra communicate with the spaces Rc of the channel opening forming member 25.

[0037] The communication space Ra, the common flow path Rb, and the space Rc form a common space R that is shared by multiple nozzles N. The common space R functions as an ink reservoir. The ink stored in the common space R branches off into each throttle section R1 and is supplied to and filled in multiple pressure chambers C in parallel.

[0038] A plurality of pressure chambers C are formed in the pressure chamber substrate 203. The pressure chambers C are located between the communication plate 202 and the vibration plate 204, and are spaces formed by the wall surfaces of the pressure chamber substrate 203. A pressure chamber C is formed for each nozzle N. The pressure chamber C is an elongated space extending in the X1 direction. The plurality of pressure chambers C are arranged along the Y axis.

[0039] The communication plate 202 and the pressure chamber substrate 203 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate.

[0040] An elastically deformable vibration plate 204 is disposed above the pressure chamber C. The vibration plate 204 is laminated on the pressure chamber substrate 203 and contacts the surface of the pressure chamber substrate 203 opposite the communicating plate 202. The vibration plate 204 is a long, rectangular plate-like member that extends along the Y-axis in a plan view. The pressure chamber C communicates with the communicating flow path R2 and the throttle portion R1. Therefore, the pressure chamber C communicates with the nozzle N via the communicating flow path R2, and also communicates with the communicating space Ra via the throttle portion R1. Note that the nozzle N, the communicating flow path R2, the pressure chamber C, and the throttle portion R1 form an individual flow path for each nozzle N. Also, for ease of explanation, in FIG. 7, the pressure chamber substrate 203 and the vibration plate 204 are illustrated as separate substrates, but in reality they are laminated on a single silicon substrate.

[0041] A driving element E is formed for each pressure chamber C on the surface of the vibration plate 204 opposite to the pressure chamber C. The driving element E is an elongated piezoelectric element extending along the X-axis in a plan view. The driving element E includes, for example, a pair of electrodes and a piezoelectric body sandwiched between the pair of electrodes. The driving element E may also be an electrothermal conversion element that generates thermal energy.

[0042] The sealing substrate 205 is a structure that protects the multiple drive elements E. The sealing substrate 205 is fixed to the surface of the diaphragm 204 with, for example, an adhesive. The multiple drive elements E are housed inside a recess formed on the surface of the sealing substrate 205 that faces the diaphragm 204. The sealing substrate 205 also has a through hole 20H for inserting a wiring substrate 7, which will be described later.

[0043] The cover 206 is a thin metal plate that forms the wall surface of the common flow path Rb. The cover 206 has a thickness similar to that of the nozzle plate 201. The planar shape of the cover 206 is, for example, a frame shape that surrounds the nozzle plate 201. A mold 207 made of resin is provided between the cover 206 and the nozzle plate 201. The surface of the cover 206 facing the Z1 direction forms part of the nozzle surface SN.

[0044] In this chip 20, when the drive element E contracts due to energization, the vibration plate 204 bends and deflects in the direction that reduces the volume of the pressure chamber C, causing the pressure inside the pressure chamber C to rise and eject an ink droplet from the nozzle N. At this time, pressure also propagates from the pressure chamber C toward the throttle portion R1, causing ink to flow into the common flow path Rb through the throttle portion R1. After the ink is ejected, the drive element E returns to its original position. At this time, the ink in the common flow path Rb from the nozzle N also vibrates. Then, at the same time as the meniscus of the nozzle N returns to its original position, ink is supplied from the throttle portion R1. Through this series of operations, ink is ejected from the nozzle N.

[0045] The chip 20 of this embodiment includes all of the elements shown in FIG. 3, but the components of the chip 20 do not necessarily have to include all of the elements, and may further include additional elements.

[0046] The chip 20 may have, for example, a monolithic structure and be thinner than the flow path opening-forming member 25, e.g., a component having a thickness of less than 3000 μm. The chip 20 may be a component having a thickness of 1500 μm or less, or 1000 μm or less. The thickness of the chip 20 may be ⅕ or less of the length of the short side as viewed in the direction along the Z axis, which is the thickness direction of the chip 20. The chip 20 may include at least one element of the nozzle plate 201, the pressure chamber substrate 203, the communication plate 202, or the driving element E, and the sealing substrate 205. The chip 20 preferably includes at least the nozzle plate 201, more preferably further includes the pressure chamber substrate 203, and particularly preferably further includes the communication plate 202. At least one of the nozzle plate 201, the pressure chamber substrate 203, the communication plate 202, the pressure chamber substrate 203 on which the driving element E is stacked, and the sealing substrate 205 may be considered to be the chip 20. Furthermore, the chip 20 may be not only a laminate of silicon substrates manufactured by MEMS, but also a laminate of thin plates such as ceramic sheets or metals, or a laminate of thin plate-like members of each of the aforementioned materials.

[0047] 1-3Ab. Flow path opening forming member 25 5 and 7, a flow path opening forming member 25 is disposed in the Z2 direction of the chip 20. The flow path opening forming member 25 and the chip 20 are fixed to each other, for example, by an adhesive or the like. The flow path opening forming member 25 and the chip 20 are positioned with high precision in advance. The flow path opening forming member 25 also has, for example, a flow path that supplies ink to the chip 20.

[0048] Furthermore, the flow path opening-forming member 25 is preferably a member having a thickness of, for example, 3000 μm or more, more preferably a member having a thickness of 5000 μm or more, and even more preferably a member having a thickness of 8000 μm or more. Furthermore, the flow path opening-forming member 25 may be formed of a single member or may be a laminate of multiple members. Furthermore, the flow path opening-forming member 25 may contain resin or may contain metal.

[0049] The length of the flow path opening-forming member 25 in the direction along the Z axis, i.e., the thickness, is thicker than the thickness D2 of the chip 20. The thickness of the flow path opening-forming member 25 here is the thickness at a position overlapping with a sealing region 4S, which will be described later, when viewed in the Z1 direction. In other words, the chip 20 is thinner than the flow path opening-forming member 25. As shown in FIG. 5, the flow path opening-forming member 25 includes a surface 251 facing the Z1 direction and a surface 252 facing the Z2 direction.

[0050] Fig. 8 is a top view of the flow path opening forming member 25 included in the head module 2 shown in Fig. 5. As shown in Fig. 8, the planar shape of the flow path opening forming member 25 is larger than the planar shape of the chip 20. That is, the chip 20 has a smaller outer shape than the flow path opening forming member 25 when viewed in the Z1 direction. The flow path opening forming member 25 is disposed so as to overlap and cover the chip 20 when viewed in the Z1 direction.

[0051] As shown in FIGS. 5 and 8, the flow path opening forming member 25 has a flange portion 250 for fixing to a sub-holder 5, which will be described later. The planar shape of the flange portion 250 is a rectangular frame shape that surrounds an opening 5H of the sub-holder 5, which will be described later. The surface of the flange portion 250 facing the Z1 direction is a supported surface 2511 that is supported by the sub-holder 5, which will be described later. Because the planar shape of the flange portion 250 is a rectangular frame shape that surrounds the opening 5H, the planar shape of the supported surface 2511 is also a rectangular frame shape that surrounds the opening 5H. As shown in FIG. 8, the supported surface 2511 is located further in the Z2 direction than the chip 20. Therefore, the supported surface 2511 is located in the Z2 direction of the nozzle plate 201.

[0052] 8, a through hole 25H is provided in the flow path opening forming member 25. A wiring substrate 7, which will be described later, is inserted into the through hole 25H. The through hole 25H is provided in the center of the flow path opening forming member 25 in plan view. The through hole 25H overlaps with the through hole 20H of the sealing substrate 205 in plan view.

[0053] 5 and 7, a flow path 25R is formed inside the flow path opening forming member 25. The flow path 25R is provided to supply ink to the chip 20. As shown in Fig. 7, a space Rc is provided on the chip 20 side of the flow path 25R, i.e., on the downstream side. The flow path 25R and the space Rc are in communication with each other.

[0054] As shown in Fig. 5, a plurality of flow path openings 251H are provided on the side of the flow path 25R of the flow path opening forming member 25 opposite to the chip 20, i.e., on the upstream side. Each flow path opening 251H is an open end of the flow path 25R in the Z2 direction. As shown in Figs. 5 and 8, the plurality of flow path openings 251H are provided in the flange portion 250 of the flow path opening forming member 25. The flow path openings 251H are arranged on the outer side of the chip 20 when viewed in the Z1 direction. In this embodiment, two flow path openings 251H are provided for each nozzle row L.

[0055] 1-3B. Common flow path member 3 As shown in FIGS. 3 to 5, each common flow path member 3 is disposed in the Z2 direction relative to the plurality of head modules 2. The common flow path member 3 has one flow path 3R. The flow path 3R supplies ink to each head module 2 and distributes the ink to each head module 2. The flow path 3R is a common flow path shared by the plurality of head modules 2. The common flow path member 3 also serves as a supply flow path member that supplies ink to the head modules 2, and has a common portion 3RA that extends along the X axis, and a plurality of branch portions 3RB that branch from the common portion 3RA and extend in the Z1 direction. Although not shown, the common flow path member 3 is provided with a flow path joint for connecting to a supply flow path outside the liquid jet head 1 in order to communicate with the liquid storage portion 9. This flow path joint (not shown) is exposed to the outside of the liquid jet head 1, for example, through an opening (not shown) formed in the holder 6.

[0056] The common flow path member 3 may have a plurality of flow paths 3R that communicate with a plurality of head modules 2. In other words, the flow path 3R may not have a common portion 3RA that communicates with a plurality of head modules 2, but may have a plurality of flow paths 3R that communicate with each of the plurality of head modules 2.

[0057] 5, a flow path opening 31H is provided on the head module 2 side, i.e., downstream side, of the flow path 3R. The flow path opening 31H is an open end of the flow path 3R in the Z1 direction. The flow path opening 31H is provided corresponding to the above-mentioned flow path opening 251H.

[0058] 9 is a bottom view of the common flow path member 3 shown in FIG. 5. FIG. 10 is a top view of the common flow path member 3 shown in FIG. 5. As shown in FIGS. 9 and 10, each common flow path member 3 is a long member extending in the X-axis direction. As shown in FIG. 9, two common flow path members 3 are placed in a recess 610 of a holder 6, which will be described later. The two common flow path members 3 are also placed so as to sandwich a relay substrate 70, which will be described later, when viewed in the Z2 direction. The plurality of flow path openings 31H of each common flow path member 3 are spaced apart from each other and aligned along the X-axis.

[0059] As shown in FIG. 10, each common flow path member 3 overlaps with multiple head modules 2 when viewed in the Z1 direction. The common flow path member 3 is provided in common to multiple head modules 2. Specifically, each common flow path member 3 overlaps with the flange portions 250 of multiple flow path opening forming members 25 when viewed in the Z1 direction. The multiple flow path openings 31H overlap with the multiple flow path openings 251H described above in a one-to-one relationship when viewed in the Z1 direction. Furthermore, each common flow path member 3 does not overlap with the multiple chips 20 when viewed in the Z1 direction, and is disposed at a position different from the chips 20. Furthermore, each common flow path member 3 overlaps with some of the multiple sealing members 4 described below when viewed in the Z1 direction.

[0060] 1-3C. Sealing member 4 As shown in FIGS. 3 to 5, the sealing member 4 is provided between each head module 2 and the common flow path member 3 in the Z1 direction. The sealing member 4 is provided for each head module 2. The sealing member 4 has elasticity. The sealing member 4 is made of an elastic material such as an elastomer. In this embodiment, the length of the sealing member 4 along the Z axis, i.e., the thickness, is constant. The thickness of the sealing member 4 is thinner than the thicknesses of the flow path opening forming member 25 and the common flow path member 3. The sealing member 4 is crushed by the head module 2 and the common flow path member 3.

[0061] 11 is a top view of the sealing member 4 shown in FIG. 5. In the example shown in FIG. 11, two sealing members 4 are provided for each head module 2. The two sealing members 4 are provided at both longitudinal ends of one head module 2. Each sealing member 4 is rectangular when viewed in the Z1 direction. When viewed in the Z1 direction, each sealing member 4 overlaps with a flange portion 250 of the flow path opening forming member 25 of the head module 2. On the other hand, in this embodiment, the sealing member 4 is provided at a position different from the chip 20 when viewed in the Z1 direction. In other words, the sealing member 4 does not overlap with the chip 20 when viewed in the Z1 direction.

[0062] As shown in FIGS. 5 and 11 , each seal member 4 has two communication ports 4H. As shown in FIG. 5 , each communication port 4H is provided corresponding to one flow path opening 251H of the flow path opening forming member 25 and one flow path opening 31H of the common flow path member 3. As shown in FIG. 11 , the communication port 4H overlaps with each of the flow path openings 31H and 251H when viewed in the Z1 direction. As shown in FIG. 5 , the communication port 4H is connected to the flow path 25R via the flow path opening 251H. The communication port 4H is connected to the flow path 3R via the flow path opening 31H. Therefore, the flow path 25R and the flow path 3R are in communication with each other via the communication port 4H. Specifically, the seal member 4 is crushed between the flow path opening forming member 25 and the common flow path member 3, thereby connecting the flow path 25R and the flow path 3R via the communication port 4H.

[0063] The sealing member 4 having such a communication port 4H is a member that liquid-tightly connects the flow path opening 251H of the head module 2 and the flow path opening 31H of the common flow path member 3. Ink flowing through the flow path 3R of the common flow path member 3 flows into the flow path 25R of the flow path opening forming member 25 via the communication port 4H, and is supplied to the individual flow paths of the chip 20 via the common space R.

[0064] As shown in FIG. 11 , the seal member 4 has a seal region 4S. In this embodiment, the entire seal member 4 corresponds to the seal region 4S. The seal region 4S is in contact with both the flow path opening forming member 25 and the common flow path member 3, and is a region of the seal member 4 that is sandwiched between the flow path opening forming member 25 and the common flow path member 3. The seal region 4S is a region that is crushed by the load from the flow path opening forming member 25 and the common flow path member 3 to connect the flow path opening 251H and the flow path opening 31H to each other in a liquid-filled state. In other words, even in a region of the seal member 4 that is sandwiched between both the flow path opening forming member 25 and the common flow path member 3, a portion that is not crushed by the load from both members and that does not substantially contribute to liquid-tight connection between the flow path opening 251H and the flow path opening 31H is not included in the seal region 4S.

[0065] 11, the sealing member 4 is provided at a position different from the chip 20 when viewed in the Z1 direction, and therefore the sealing area 4S is provided at a position different from the chip 20 when viewed in the Z1 direction. In other words, the sealing area 4S does not overlap with the chip 20 when viewed in the Z1 direction. Because the sealing area 4S does not overlap with the chip 20 when viewed in the Z1 direction, the reaction force of the sealing member 4 is less likely to affect the chip 20 compared to when they overlap. This makes it possible to improve the reliability of the head module 2.

[0066] As described above, the sealing member 4 is crushed between the flow path opening forming member 25 and the common flow path member 3, so that the flow path 25R and the flow path 3R are connected to each other via the communication opening 4H. The reaction force of the crushed sealing member 4 applies stress to the chip 20, which may cause warping of the chip 20. If the reaction force of the sealing member 4 acts on the chip 20 in this way, for example, the nozzle plate 201 may be deformed, causing the nozzles N to shift in position, the pressure chamber substrate 203 or the communication plate 202 may be deformed, causing changes in ejection characteristics, or if the components constituting the chip 20 include a silicon substrate or a ceramic sheet, the component may be cracked, which may result in a decrease in reliability of the head module 2.

[0067] In this embodiment, the sealing area 4S of the sealing member 4 does not overlap with the chip 20 when viewed in the Z1 direction. This makes it possible to suppress a decrease in the sealing performance of the sealing member 4, while also suppressing the effect of the reaction force of the sealing member 4 on the chip 20. This makes it possible to improve the reliability of the head module 2.

[0068] 10, the communication port 4H, the flow path opening 251H, and the flow path opening 31H do not overlap with the chip 20 when viewed in the Z1 direction. The communication port 4H, the flow path opening 251H, and the flow path opening 31H are each disposed outside the chip 20 when viewed in the Z1 direction. Specifically, the communication port 4H, the flow path openings 251H, and 31H are disposed on both longitudinal sides of the chip 20 when viewed in the Z1 direction. Therefore, as described above, the sealing region 4S of the sealing member 4 that liquid-tightly seals the flow paths 25R and 25R can be disposed outside the chip 20. Therefore, as described above, the effect of the reaction force of the sealing member 4 on the chip 20 can be suppressed.

[0069] Furthermore, the sealing area 4S is arranged in the Y1 or Y2 direction, which is the longitudinal direction of the head module 2 relative to the chip 20, when viewed in the Z1 direction. By arranging the sealing area 4S in the longitudinal direction of the chip 20, it is possible to prevent the sealing area 4S from being arranged between adjacent chips 20. Therefore, providing the sealing area 4S prevents the distance between adjacent chips 20 from becoming too large. This makes it less likely that the printing quality will be affected.

[0070] The sealing region 4S may be provided in the direction in which the plurality of head modules 2 are lined up relative to the chip 20, i.e., in the short-side direction of the head modules 2. The sealing member 4 may be provided in the direction in which the plurality of head modules 2 are lined up relative to the chip 20, i.e., in the short-side direction of the head modules 2.

[0071] 1-3D. Sub-holder 5 The sub-holder 5 shown in FIGS. 4 to 6 is a member that supports the head modules 2. The sub-holders 5 are provided in a one-to-one correspondence with the head modules 2. The sub-holders 5 are long, plate-like members that extend along the Y axis and whose thickness direction is along the Z axis. The sub-holder 5 is disposed in the Z1 direction relative to the flow path opening forming member 25. The sub-holder 5 is a member that sandwiches the seal member 4 and the flow path opening forming member 25 between itself and the common flow path member 3. As shown in FIG. 5, the sub-holder 5 includes a surface 511 facing the Z1 direction and a surface 512 facing the Z2 direction. The sub-holder 5 is a member that does not have a flow path through which ink flows.

[0072] Each sub-holder 5 and the corresponding head module 2 are fixed to each other with an adhesive. The sub-holder 5 and the head module 2 are fixed in a state in which the relative positions of the sub-holder 5 and the nozzles N of the nozzle plate 201 are aligned with high precision. Furthermore, the sub-units 15 including each sub-holder 5 are detachably fixed to the holder 6 described below. Specifically, the sub-holders 5 are not joined with an adhesive or the like. Therefore, each sub-unit 15 can be replaced individually. The sub-holder 5 and the head module 2 are fixed to each other with an adhesive.

[0073] Therefore, for example, when one of the multiple head modules 2 included in the head unit 10 breaks down, the liquid jet head 1 can be refurbished by replacing the sub-unit 15 including the broken head module 2 with another sub-unit 15 including a non-faulty head module 2.

[0074] Furthermore, the head module 2 and the common flow path member 3 are not connected to each other by adhesive, but are connected to each other by a sealing member 4. Therefore, when replacing the head module 2, it is easy to release the flow path connection between the head module 2 and the common flow path member 3. Therefore, the head module 2 can be easily replaced.

[0075] It is preferable that each sub-holder 5 and the corresponding head module 2 are fixed with an adhesive, but the head module 2 may be configured to be removable from the sub-holder 5 by breaking down the adhesive.

[0076] The sub-holder 5 is made of, for example, a metal. The sub-holder 5 is made of, for example, a metal such as aluminum or stainless steel. The sub-holder 5 has enough rigidity to support the plurality of head modules 2.

[0077] An opening 5H is provided in the sub-holder 5. The opening 5H is a hole that penetrates the sub-holder 5 in the thickness direction. The opening 5H is provided to expose a part of the head module 2 to the outside. Specifically, as shown in FIG. 6, the chip 20 is exposed from the opening 5H. Therefore, a plurality of nozzles N are exposed from the opening 5H.

[0078] FIG. 12 is a top view of the sub-holder 5 shown in FIG. 5. As shown in FIGS. 5 and 12, the sub-holder 5 includes a support surface 5S. The support surface 5S is part of the surface 512 of the sub-holder 5 facing the Z2 direction. In FIG. 12, the support surface 5S is shaded to make it easier to understand. In the example of FIG. 12, the support surface S5 has a rectangular frame shape when viewed in the Z1 direction.

[0079] 5, the support surface 5S is in contact with the flow path opening-forming member 25 and is an area that directly supports the flow path opening-forming member 25. The support surface 5S is in contact with the supported surface 2511 of the flow path opening-forming member 25. In addition, as shown in Fig. 12, the support surface 5S includes an area S50 that overlaps with the sealing area 4S when viewed in the Z1 direction.

[0080] Since the support surface 5S includes an area S50 that overlaps with the sealing area 4S when viewed in the Z1 direction, the sub-holder 5 receives the reaction force of the sealing member 4 perpendicularly. Therefore, the sub-holder 5 can firmly support the sealing area 4S of the sealing member 4 between itself and the common flow path member 3. Therefore, the reaction force of the sealing member 4 can be alleviated particularly effectively.

[0081] Furthermore, a portion of the surface 251 of the flow path opening forming member 25 facing the Z1 direction has a supported surface 2511. When viewed in the Z1 direction, the supported surface 2511 is supported so as to surround the opening 5H of the sub-holder 5 and to be in contact with the sub-holder 5. Specifically, as described above, the flange portion 250 of the flow path opening forming member 25 has the supported surface 3511, and the supported surface 2511 comes into contact with the support surface 5S of the sub-holder 5, thereby holding the head module 2 to the sub-holder 5. By supporting the flow path opening forming member 25 by the sub-holder 5 in this way, the load of the seal member 4 can be dispersed. This makes it possible to make the flow path opening forming member 25 less likely to break.

[0082] The contact between the supported surface 2511 and the support surface 5S includes both direct contact and connection via an adhesive or an elastic bushing. Therefore, the flow path opening-forming member 25 may be in direct contact with the sub-holder 5, or indirect contact via an adhesive or another member such as a bushing. The flange portion 250 does not have to be a rectangular frame in plan view. For example, the flange portion 250 may be rectangular and provided in both the Y1 and Y2 directions relative to the opening 5H in plan view.

[0083] 5, the thickness D5 of the sub-holder 5 in the Z1 direction is greater than the thickness D2 in the Z1 direction of the chip 20. This reduces the risk of the sub-holder 5 being deformed by the reaction force of the seal member 4.

[0084] Furthermore, the thickness D5 of the sub-holder 5 is preferably at least twice, and more preferably at least three times, the thickness D2 of the chip 20. This further reduces the risk of the sub-holder 5 being deformed by the reaction force of the sealing member 4. Note that the thickness D5 may be equal to or less than the thickness D2.

[0085] From the same perspective, the thickness D5 of the sub-holder 5 is preferably 1 mm or more, and more preferably 2 mm or more. To further increase the strength of the sub-holder 5, the thickness D5 may be 3 mm or more, 5 mm or more, or 6 mm or more. From the perspective of increasing the distance between the medium 90 and the nozzle surface SN, i.e., the paper gap, the thickness D5 of the sub-holder 5 is preferably 10 mm or less, and more preferably 7 mm or less.

[0086] As shown in FIG. 5, in addition to the chip 20, a portion of the flow path opening forming member 25 is disposed within the opening 5H of the sub-holder 5. That is, a portion of the flow path opening forming member 25 is inserted into the opening 5H of the sub-holder 5. When the sub-holder 5 is present, the paper gap may increase depending on the thickness D5 of the sub-holder 5. Specifically, if the thickness D5 of the sub-holder 5 is excessively large, the surface of the chip 20 facing the Z1 direction may be positioned further in the Z2 direction than the surface of the sub-holder 5 facing the Z1 direction. This increase in distance may result in a decrease in the accuracy of the ink landing position on the medium 90.

[0087] In this embodiment, as described above, in addition to the chip 20, a portion of the flow path opening forming member 25 is disposed within the opening 5H. Therefore, even if the thickness D5 of the sub-holder 5 is increased to further increase the strength of the sub-holder 5, an increase in the paper gap can be prevented.

[0088] Furthermore, the surface of the nozzle plate 201 of the chip 20 facing the Z1 direction, i.e., the nozzle surface SN, and the surface 511 of the sub-holder 5 facing the Z1 direction are substantially flush with each other. That is, the nozzle surface SN and the surface 511 of the sub-holder 5 facing the Z1 direction are at the same position on the Z axis. Therefore, an increase in the paper gap can be suppressed compared to when the nozzle surface SN is positioned further in the Z2 direction than the surface of the sub-holder 5 facing the Z1 direction. Furthermore, it is easier to wipe the surface 511 of the sub-holder 5 facing the Z1 direction and the nozzle surface SN together.

[0089] The nozzle surface SN and the surface 511 of the sub-holder 5 facing the Z1 direction being approximately flush with each other means that they are not only completely flush with each other, but also include cases where there is a step to the extent that it includes manufacturing errors, etc.

[0090] The nozzle surface SN and the surface 511 of the sub-holder 5 facing the Z1 direction do not have to be approximately flush. The nozzle surface SN and the surface 511 of the sub-holder 5 facing the Z1 direction may be at different positions on the Z axis, and a step may exist between these surfaces. In this case, the distance between the nozzle surface SN and the surface 511 of the sub-holder 5 facing the Z1 direction is preferably 100 μm or less, and more preferably 50 μm or less, from the perspective of ease of wiping.

[0091] Furthermore, the sub-holder 5 is detachably fixed to the holder 6, which will be described later. For example, when the sub-holder 5 is removed from the holder 6, the head module 2 and the wiring board 7, which will be described later, are removed from the holder 6 together with the sub-holder 5. The liquid jet head 1 of this embodiment is configured so that when each head module 2 is removed and then reattached to the holder 6, the alignment accuracy between the multiple head modules 2 does not decrease.

[0092] 5 and 12, each sub-holder 5 has two first positioning portions 502 and two first fixing holes 501. Each first positioning portion 502 is used for positioning the sub-holder 5 relative to the holder 6. Each first fixing hole 501 is used for fixing the sub-holder 5 relative to the holder 6.

[0093] Each first positioning portion 502 is provided on a surface 512 of the sub-holder 5 facing the Z2 direction. In this embodiment, each first positioning portion 502 is a bottomed hole that opens on the surface 512 of the sub-holder 5 facing the Z2 direction. Each first positioning portion 502 is a recessed portion provided on the surface 512 of the sub-holder 5 facing the Z2 direction, and can also be considered to be a depression formed on the surface 512. The two first positioning portions 502 are provided on both sides of the opening 5H in the longitudinal direction of the sub-holder 5. One of the two first positioning portions 502 is located in the Y1 direction with respect to the opening 5H, and the other is located in the Y2 direction with respect to the opening 5H.

[0094] Each first fixing hole 501 is provided on a surface 512 of the sub-holder 5 facing the Z2 direction. Each first fixing hole 501 is a bottomed hole provided on the surface 512 of the sub-holder 5 facing the Z2 direction. Each first fixing hole 501 is a recess provided on the surface 512 of the sub-holder 5 facing the Z2 direction, and can also be considered to be a depression formed on the surface 511. The two first fixing holes 501 are provided on both sides of the opening 5H in the longitudinal direction of the sub-holder 5. One of the two first fixing holes 501 is located in the Y1 direction with respect to the opening 5H, and the other is located in the Y2 direction with respect to the opening 5H.

[0095] Each first fixing hole 501 is provided at a distance from each first positioning portion 502 and the opening 5H. Furthermore, each first fixing hole 501 positioned in the Y1 direction relative to the opening 5H is closer to the opening 5H than each first positioning portion 502 positioned in the Y1 direction relative to the opening 5H. Similarly, each first fixing hole 501 positioned in the Y2 direction relative to the opening 5H is closer to the opening 5H than each first positioning portion 502 positioned in the Y2 direction relative to the opening 5H. Furthermore, the first positioning portions 502, first fixing holes 501, and opening 5H are aligned along the longitudinal direction of the sub-holder 5.

[0096] The shortest distance between the first fixing hole 501 and the opening 5H is shorter than the shortest distance between the first positioning portion 502 and the opening 5H, but it may be longer. Furthermore, the first positioning portion 502, the first fixing hole 501, and the opening 5H do not have to be aligned along the longitudinal direction of the sub-holder 5. For example, the first positioning portion 502 may be provided on both sides of the opening 5H in the X-axis direction.

[0097] 1-3E. Holder 6 As shown in FIGS. 3 to 5, the holder 6 is a case that houses a plurality of head modules 2 and a common flow path member 3. The holder 6 is box-shaped and has a recess 610 that opens in the Z1 direction. The plurality of head modules 2 and the common flow path member 3 are arranged in the housing space within the recess 610 of the holder 6. It can also be understood that the housing space for the plurality of head modules 2 and the common flow path member 3 is formed by the holder 6 and the plurality of sub-holders 5.

[0098] The relay substrate 70 is disposed on the bottom surface of the recess 610 of the holder 6. The bottom surface is the surface of the recess 610 of the holder 6 facing the Z1 direction. The holder 6 is made of a metal such as aluminum or stainless steel. Although not shown in detail, the holder 6 has an opening through which an external wiring member of the liquid jet head 1 is inserted to electrically connect the relay substrate 70 and the control unit 91.

[0099] The holder 6 includes a flat plate portion 61, a side wall portion 62, a plurality of partition wall portions 63, and two flange portions 64. The flat plate portion 61, the side wall portion 62, the plurality of partition wall portions 63, and the two flange portions 64 are integrally formed. The flat plate portion 61 is a flat portion along the XY plane. It is located in the Z2 direction of the common flow path member 3. The side wall portion 62 is a portion extending in the Z1 direction from the outer edge of the flat plate portion 61. The planar shape of the side wall portion 62 is a rectangular frame shape. The plurality of partition wall portions 63 are arranged between the plurality of head modules 2. Each partition wall portion 63 extends along the Y axis. The partition wall portions 63 and the head modules 2 are arranged alternately along the X axis.

[0100] Fig. 13 is a top view of the upper part of the holder 6 shown in Fig. 5. Fig. 14 is a view showing the lower part of the holder 6 shown in Fig. 5. As shown in Figs. 4 and 13, the upper part of the holder 6 does not have a plurality of partitions 63. In contrast, as shown in Figs. 4 and 14, the lower part of the holder 6 has a plurality of partitions 63. The part of the holder 6 where the plurality of partitions 63 are provided can be considered to be the lower part of the holder 6, and the part where the plurality of partitions 63 are not provided can be considered to be the upper part of the holder 6.

[0101] 12 and 13, the plurality of partition walls 63 are present in an area where the plurality of head modules 2 are provided. The plurality of partition walls 63 are located in the Z1 direction from the center of the holder 6 in the Z axis direction. The plurality of partition walls 63 are not provided in a portion of the holder 6 in the Z2 direction from the center of the Z axis direction so that the common flow path member 3 can be arranged.

[0102] 5 and 14, each holder 6 has two second positioning portions 602 and two first fixing holes 61H. As described above, the sub-holder 5 is detachable from the holder 6. The second positioning portions 602 are used for positioning the sub-holder 5 relative to the holder 6. The first fixing holes 61H are used for fixing the sub-holder 5 to the holder 6.

[0103] Each second positioning portion 602 is provided on a surface 605 of the holder 6 facing the Z1 direction. In this embodiment, each second positioning portion 602 is a protrusion that protrudes in the Z1 direction from the surface 605 of the holder 6 facing the Z1 direction. As shown in FIG. 13 , each second positioning portion 602 is provided in the Y1 direction or the Y2 direction with respect to the recess 610 as viewed in the Z1 direction. Furthermore, the two second positioning portions 602 are provided corresponding to the two first positioning portions 502 described above, and overlap the two first positioning portions 502 as viewed in the Z1 direction. Therefore, the multiple second positioning portions 602 are provided in one-to-one correspondence with the multiple first positioning portions 502.

[0104] Each first fixing hole 61H is a hole that penetrates the holder 6 in the Z1 direction. Each first fixing hole 61H is provided in the Y1 direction or the Y2 direction with respect to the recess 610 when viewed in the Z1 direction. The two first fixing holes 61H are provided corresponding to the two first fixing holes 501 described above, and overlap with the two first fixing holes 501 when viewed in the Z1 direction.

[0105] Each first fixing hole 61H positioned in the Y1 direction relative to the recess 610 is closer to the recess 610 than the second positioning portion 602 positioned in the Y1 direction relative to the recess 610. Similarly, each first fixing hole 61H positioned in the Y2 direction relative to the recess 610 is closer to the recess 610 than the first positioning portion 502 positioned in the Y2 direction relative to the recess 610. Furthermore, the first fixing holes 61H and the second positioning portions 602 are spaced apart from each other and aligned along the Y axis.

[0106] The shortest distance between the first fixing hole 61H and the recess 610 is shorter than the shortest distance between the second positioning portion 602 and the recess 610, but it may be longer. In addition, the second positioning portion 602 and the first fixing hole 61H do not have to be aligned along the longitudinal direction of the sub-holder 5.

[0107] Each second positioning portion 602 is press-fitted into the aforementioned first positioning portion 502 to position the sub-holder 5 relative to the holder 6. Furthermore, the first positioning portion 502 and the second positioning portion 602 are provided for each sub-holder 5, i.e., for each head module 2 held by the sub-holder 5.

[0108] The provision of the first positioning portion 502 and the second positioning portion 602 makes it easy to position the sub-holder 5 when attaching it to the holder 6. Furthermore, the provision of the first positioning portion 502 and the second positioning portion 602 for each sub-holder 5 makes it possible to align the multiple sub-holders 5 with each other with high precision using the holder 6 as a reference.

[0109] As described above, each sub-holder 5 holds a head module 2. Therefore, by providing the first positioning portion 502 and the second positioning portion 602, it is possible to position the head module 2 fixed to the sub-holder 5 with respect to the holder 6. Furthermore, by providing the first positioning portion 502 and the second positioning portion 602 for each sub-holder 5, it is possible to align the multiple head modules 2 with respect to the holder 6 with high precision. In other words, it is possible to align the multiple head modules 2 with respect to each other on a sub-holder 5 basis with respect to the holder 6. Therefore, when replacing only some of the multiple head modules 2, it is not necessary to redo the alignment of all of the head modules 2.

[0110] Furthermore, alignment between the multiple head modules 2 can be performed with high precision by the simple method of press-fitting the second positioning portion 602 into the first positioning portion 502. This makes it easy to replace a desired head module 2 from among the multiple head modules 2. This makes it possible to replace each head module 2 individually, which makes it easy to repair the liquid jet head 1.

[0111] Note that press-fitting refers to interference fitting or intermediate fitting. A state in which the second positioning portion 602 is in contact with the second positioning portion 602 and the first positioning portion 502 at at least two points when the second positioning portion 602 is completely inserted into the first positioning portion 502 is called a press-fit state. Also, before press-fitting, the length of the longest line segment connecting two points on the outer periphery of the second positioning portion 602, which is a positioning pin, when viewed in the direction along the Z axis is longer than the diameter of the largest circle inscribed in the first positioning portion 502, which is a positioning hole. Also, in the press-fit state, the force of press-fitting fits the head module 2 into the holder 6 to such an extent that it does not fall under its own weight.

[0112] The multiple second positioning portions 602 are arranged on a surface 605 of the holder 6 facing the Z1 direction. As described above, the first positioning portions 502 are arranged on a surface 512 of the sub-holder 5 facing the Z2 direction, which is the opposite direction to the Z1 direction. Each head module 2 is supported on the surface 512 of the sub-holder 5 facing the Z2 direction.

[0113] By arranging the first positioning part 502, the second positioning part 602, and the head module 2 in this manner, it is possible to easily attach and detach only the subunit 15 including the sub-holder 5 and head module 2 to be replaced from below the holder 6. Therefore, when replacing the subunit 15 to be replaced and reattaching it to the holder 6, it is only necessary to connect the flow path of the head module 2 to be replaced to the common flow path member 3 and electrically connect the wiring board 7 attached to the head module 2 to be replaced to the relay board 70. Therefore, it is not necessary to connect the flow path of head modules 2 other than the one to be replaced to the common flow path member 3 and electrically connect the wiring board 7 to the relay board 70. This makes it possible to simplify the attachment and detachment work when repairing the liquid jet head 1.

[0114] The surface 512 on which the first positioning portion 502 is arranged and the surface 512 that supports the head module 2 may be arranged at different positions in the direction along the Z axis.

[0115] Furthermore, the common flow path member 3 and the wiring board 7 are disposed on the bottom surface of the recess 610 of the holder 6, and the sub-holder 5 that holds the head module 2 is disposed so as to close the opening of the recess 610. This makes it easy to shorten the distance between the head module 2 and the common flow path member 3, and also makes it easy to shorten the length of the wiring board 7.

[0116] Furthermore, in this embodiment, as described above, the first positioning portion 502 is a hole provided on the surface of the sub-holder 5 facing the Z2 direction, and has a bottom surface recessed in the Z1 direction. Therefore, the first positioning portion 502 is not exposed to the outside of the sub-holder 5. For example, the first positioning portion 502 is not provided on the surface of the sub-holder 5 facing the Z1 direction. Therefore, it is possible to prevent ink mist, etc., ejected from the nozzle N from adhering to the first positioning portion 502.

[0117] Furthermore, the aforementioned common flow path member 3 is disposed in the Z2 direction relative to the multiple head modules 2, and overlaps the multiple head modules 2 when viewed in the Z1 direction. In this configuration in which multiple head modules 2 are disposed below the common flow path member 3, the first positioning portion 502 is provided on the surface of the sub-holder 5 that faces the Z2 direction. This makes it easy to attach and detach only the subunit 15 to be replaced from below the holder 6 and the common flow path member 3. This eliminates the need to disconnect the flow paths of subunits 15 other than the one to be replaced from the common flow path member 3, simplifying the attachment and detachment work.

[0118] Although the holder 6 and the common flow path member 3 are separate bodies, they may be integrated. Also, a part of the common flow path member 3 may be a part of the holder 6.

[0119] Additionally, first fixing members 151 are inserted through the first fixing holes 61H and 501. The sub-holders 5 are fixed to the holder 6 by the first fixing members 151. As shown in FIGS. 3 and 13, a first fixing member 151 is provided for each sub-holder 5. In this embodiment, two first fixing members 151 are provided for one sub-holder 5.

[0120] The multiple first fixing members 151 detachably fix each of the multiple sub-holders 5 to the holder 6. Therefore, each first fixing member 151 can be considered to fix the head module 2 and the common flow path member 3 by fixing the sub-holder 5 to the holder 6.

[0121] Specifically, the first fixing member 151 is inserted in the Z1 direction through the first fixing hole 61H, which is a through-hole, and the recessed first fixing hole 501. As a result, a portion of the first fixing member 151 is exposed from the surface 606 of the holder 6 facing the Z2 direction, but the first fixing member 151 is not exposed from the surface 511 of the sub-holder 5 facing the Z1 direction. This makes it possible to prevent ink mist from adhering to the first fixing member 151 and solidifying. This makes it possible to prevent the first fixing member 151 from becoming difficult to remove from the holder 6 and the sub-holder 5 due to the adhering mist.

[0122] Depth D61 of first fixing hole 61H is deeper than depth D51 of first fixing hole 501. First fixing hole 61H and first fixing hole 501 are each formed along the Z1 direction. Depths D61 and D51 are each the depth along the Z1 direction.

[0123] Subunit 15 is small in size and difficult for the user to grip. Depth D61 of first fixing hole 61H is deeper than depth D51 of first fixing hole 501, that is, depth D51 of first fixing hole 501 is shallower than depth D61 of first fixing hole 61H, so that even if subunit 15 is difficult to grip, it is easy to release subunit 15 from holder 6.

[0124] For example, after removing the first fixing member 151 from the first fixing hole 61H, a long rod-shaped member is inserted into the first fixing hole 61H and the member is used to press the sub-holder 5 in the Z1 direction. This makes it possible to easily release the sub-holder 5 from being pressed into the holder 6. In other words, by using the first fixing hole 61H as a hole for releasing the press-fit, it is possible to easily release the sub-holder 5 from being pressed into the holder 6. Furthermore, because the thickness D6 of the holder 6 is thicker than the thickness D5 of the sub-holder 5, it is easier to remove the sub-holder 5 from the holder 6 than when the thickness D6 is thinner than the thickness D5.

[0125] A distance L51 from the bottom surface of the first fixing hole 501 to a surface 511 of the sub-holder 5 facing the Z1 direction is greater than a depth D51 of the first fixing hole 501. Because the distance L51 is greater than the depth D51, the sub-holder 5 is less likely to deform when the sub-holder 5 is released from the press-fit into the holder 6 than when the distance L51 is smaller.

[0126] The distance L51 may be smaller than the depth D51. In this case, by reducing the distance L51 while ensuring the depth D51 necessary for positioning, it is easy to reduce the thickness D5 of the sub-holder 5. Reducing the thickness D5 makes it possible to suppress an increase in the paper gap.

[0127] In this embodiment, the first fixing member 151 is a screw. Therefore, for example, a female screw is formed on the inner peripheral wall surface that forms the first fixing hole 501. Because the first fixing member 151 is a screw, the sub-holder 5 can be easily released from the holder 6 by rotating and fastening the screw. Because the first fixing member 151 is a screw, the sub-holder 5 can be detachably fixed to the holder 6 without using adhesive.

[0128] The first fixing member 151 may be something other than a screw, and may include, for example, an L-shaped or T-shaped pin with the tip in the Z1 direction bent at a right angle and an elastic member such as a leaf spring or a coil spring, and may be configured to fix the holder 6 and the sub-holder 5 together using the elastic force of the elastic member.

[0129] In this way, the first fixing member 151 may have any configuration as long as it is a member that fixes the holder 6 and the sub-holder 5 to each other.

[0130] 5 and 14, for example, two first fixing members 151 are provided for each sub-holder 5. When viewed in the Z1 direction, the first fixing members 151 are arranged so as not to overlap the chip 20 and to sandwich the sealing area 4S between them and the chip 20.

[0131] Because first fixing member 151 does not overlap chip 20 when viewed in the Z1 direction, the load generated by fixing first fixing member 151 is less likely to be applied to chip 20 than if they overlap. Furthermore, by disposing seal member 4 between first fixing member 151 and chip 20 when viewed in the Z1 direction, the distance between chip 20 and first fixing member 151 can be increased by the dimension of seal member 4. Therefore, the load generated by fixing first fixing member 151 is less likely to be applied to chip 20.

[0132] 13, the holder 6 has a plurality of fourth positioning portions 642. The plurality of fourth positioning portions 642 are provided on the flange portion 64. As shown in FIG. 5, the fourth positioning portions 642 are protrusions that protrude in the Z2 direction from the Z2-direction surface of the flange portion 64. The plurality of fourth positioning portions 642 are provided in one-to-one correspondence with the plurality of third positioning portions 102 of the unit base 11 shown in FIG. 2.

[0133] The fourth positioning portion 642 is press-fitted into one of the plurality of third positioning portions 102 provided on the unit base 11, thereby positioning the liquid jet head 1 with respect to the unit base 11. This makes it possible to improve the alignment accuracy between the plurality of liquid jet heads 1 with respect to the unit base 11.

[0134] Furthermore, mounting holes 64H are provided in the flange portion 64. The mounting holes 64H correspond to the mounting holes 101 of the unit base 11. Each mounting hole 64H is, for example, a bottomed hole that opens on the surface of the flange portion 64 in the Z2 direction, and is, for example, a screw hole for mounting the liquid jet head 1 to the unit base 11 with a member such as a screw. The flange portion 64 and the unit base 11 are fixed together by inserting screws or the like (not shown) through the mounting holes 101 and then the mounting holes 64H and fastening them together with the screws. As a result, the liquid jet head 1 is fixed to the unit base 11.

[0135] 1-3E. Wiring board 7, relay board 70 and connector 71 As shown in FIG. 4, a wiring board 7 is provided for each head module 2. The wiring board 7 is inserted through the through-hole 25H of the chip 20 and the through-hole 20H of the flow path opening forming member 25. The wiring board 7 is bonded to the vibration plate 204. The wiring board 7 protrudes from the vibration plate 204 in the Z2 direction. The wiring board 7 is a mounting component on which a plurality of wires are formed for electrically connecting the chip 20 and the relay substrate 70. The wiring board 7 is, for example, a flexible board such as an FPC (Flexible Printed Circuit) or a COF (Chip On Film) or a rigid board. A drive signal and a reference voltage for driving the drive elements E are supplied to each drive element E from the wiring board 7.

[0136] The relay board 70 is fixed to the bottom surface of a recess 610 in the Z1-direction surface 605 of the flat plate portion 61 of the holder 6. The relay board 70 is flat and fixed to the holder 6 with an adhesive or the like. The relay board 70 is electrically connected to the control unit 91. A plurality of connectors 71 are mounted on the relay board 70. The plurality of connectors 71 are provided one-to-one with the plurality of wiring boards 7. An end of the wiring board 7, on which a plurality of terminals are provided, is detachably inserted into each connector 71. In other words, the wiring board 7 is preferably rigid so that the end of the wiring board 7 can be easily inserted into and removed from the connector 71. When the wiring board 7 is made of a flexible substrate, it is desirable to attach a rigid body to support the flexible substrate. When the end of the wiring board 7 is inserted into the connector 71, the wiring board 7 is electrically connected to the control unit 91 via the relay board 70.

[0137] The relay board 70 is electrically connected to the multiple head modules 2. The relay board 70 is arranged in the Z2 direction, which is the opposite direction to the Z1 direction, relative to the multiple head modules 2, and overlaps the multiple head modules 2 when viewed in the Z1 direction. The first positioning portion 502 is also provided on the surface of the sub-holder 5 that faces the Z2 direction. This makes it easy to attach and detach only the subunit 15 to be replaced from below the holder 6 and the relay board 70. This eliminates the need to disconnect the electrical connections of subunits 15 other than the one to be replaced, simplifying the attachment and detachment work.

[0138] As described above, when only the subunit 15 to be replaced is attached to the holder 6 from below the holder 6, the wiring board 7 moves in the Z2 direction from below the connector 71 toward the connector 71. Then, the wiring board 7 is inserted into the connector 71. This establishes an electrical connection between the wiring board 7 and the relay board 70.

[0139] 1-3F. Bush As shown in FIG. 4, bushes 521 are provided between the multiple sub-holders 5. The bushes 521 fill gaps formed between adjacent sub-holders 5. For example, when viewed in the Z1 direction, the bushes 521 are elongated along the Y axis between adjacent sub-holders 5. Furthermore, as shown in FIG. 5, bushes 522 are arranged between the holder 6 and the sub-holder 5. Specifically, the bushes 522 are arranged between the holder 6 and both longitudinal end portions of the sub-holder 5. Each of the bushes 521 and 522 includes, for example, an elastic resin material.

[0140] By providing the bushes 521 and 522, it is possible to reduce the risk of ink mist or the like entering the accommodation space in the recess 610 of the holder 6 from the outside of the liquid jet head 1.

[0141] 2. Variations The above-described embodiments can be modified in various ways. Specific modifications that can be applied to the above-described embodiments are exemplified below. Two or more embodiments arbitrarily selected from the following examples can be combined as appropriate within the scope of not mutually contradictory.

[0142] 2-1. First modified example Figures 15 and 16 are cross-sectional views of a portion of the liquid jet head 1 of the first modified example. Figure 17 is a top view of the liquid jet head 1 of the first modified example.

[0143] 15, a bushing 523 is provided. Although not shown in detail, the bushing 523 has a rectangular frame shape that follows the outer periphery of the sub-holder 5 when viewed in the Z1 direction. This prevents ink mist and the like from entering the space inside the recess 610 of the holder 6. Note that multiple bushings 523 may be configured as a single unit, or may be a common member for multiple sub-holders 5.

[0144] As shown in FIG. 16 , in the first modified example, the sub-holder 5 and the head module 2 are molded with adhesives 531 and 532. The adhesive 531 molds the gap between the flow path opening forming member 25 and the sub-holder 5. The adhesive 531 also overlaps the seal member 4 when viewed in the Z1 direction. The adhesive 532 molds the gap between the chip 20 and the sub-holder 5. Although not shown in detail, the adhesive 531 is provided in the shape of a rectangular frame surrounding the opening 5H when viewed in the Z1 direction. The adhesive 531 is provided in the shape of a rectangular frame surrounding the opening 5H when viewed in the Z1 direction. The adhesive 532 is provided along the inner circumferential wall of the opening 5H. This prevents ink mist and the like from entering the space within the recess 610 of the holder 6.

[0145] The holder 6 of the liquid jet head 1 of the first modified example includes a first member 691 and a second member 692. The first member 691 and the second member 692 are configured as separate bodies. The first member 691 corresponds to the upper part of the holder 6 of the first embodiment described above. Therefore, the first member 691 is configured from the flat plate portion 61 and a part of the side wall portion 62. The second member 692 corresponds to the lower part of the holder 6 of the first embodiment described above. The second member 692 is configured from a part of the side wall portion 62 and a plurality of partition wall portions 63.

[0146] The first member 691 is provided with a plurality of fixing holes 611H, 612H, and 614H. The second member 692 is provided with a plurality of fixing holes 613. The fixing holes 613 correspond one-to-one to the fixing holes 611H and overlap with the fixing holes 611H when viewed in the Z1 direction. The fixing holes 611H and 612H are holes that penetrate the first member 691 in the thickness direction. The fixing hole 611H does not overlap with the recessed portion 610 when viewed in the Z1 direction. The fixing hole 612H overlaps with the recessed portion 610 when viewed in the Z1 direction. The fixing hole 614H penetrates the second member 692 in the thickness direction. The fixing hole 614H does not overlap with the recessed portion 610 when viewed in the Z1 direction. The fixing hole 614H is provided for each sub-holder 5. The fixing hole 613 is a bottomed hole that opens onto the surface of the second member 692 facing the Z2 direction.

[0147] Moreover, in the first modified example, fixing holes 321 are provided in the common flow path member 3. The fixing holes 321 are bottomed holes that open on a surface facing the Z2 direction of the common flow path member 3. The fixing holes 321 are provided for each fixing hole 612H and overlap with the fixing holes 612H when viewed in the Z1 direction.

[0148] Moreover, in the first modified example, the sub-holder 5 is provided with fixing holes 504. The fixing holes 504 are bottomed holes that open to the surface 512 of the sub-holder 5 facing the Z2 direction. The fixing holes 504 are provided for each fixing hole 614H and overlap with the fixing holes 614H when viewed in the Z1 direction.

[0149] Furthermore, the liquid jet head 1 of the first modified example has a fixed member group 150. The fixed member group 150 includes a plurality of fixed members 152, 153, and 154.

[0150] The fixing member 152 is inserted through the fixing hole 611H and the fixing hole 613 in this order. The fixing member 152 fixes the first member 691 and the second member 692 to each other. The fixing member 153 is inserted through the fixing hole 612H and the fixing hole 321 in this order. The fixing member 153 fixes the first member 691 and the common flow path member 3 to each other. The fixing member 154 is inserted through the fixing hole 614H and the fixing hole 504 in this order. The fixing member 154 fixes the second member 692 and the sub-holder 5 to each other.

[0151] 17, the plurality of fixing members 152 are provided, for example, near the corners of the holder 6, which has a rectangular shape when viewed in the Z1 direction. The plurality of fixing members 153 are provided, for example, near the corners of the holder 6, which has a rectangular shape when viewed in the Z1 direction. The fixing members 154 are provided for each sub-holder 5.

[0152] The fixing member group 150 fixes the sub-holder 5 to the holder 6, and indirectly fixes the plurality of head modules 2 to the holder 6. Furthermore, by providing the plurality of fixing members 153, the common flow path member 3 is not joined to the holder 6 but is fixed so as to be detachable. Therefore, in addition to the sub-units 15, the common flow path member 3 can be replaced.

[0153] The fixing members 152, 153, and 154 are, for example, screws, but may also be the aforementioned L-shaped pins or T-shaped pins.

[0154] It is preferable that fixing member 152 is longer than fixing member 154, and that fixing member 152 and fixing member 154 have male threads with the same outer shape and pitch. First, fixing member 152 is removed from fixing hole 613, thereby removing first member 691 from second member 692. Next, fixing member 154 is removed from fixing hole 504, and then fixing member 152, which is longer than fixing member 154, is fastened to fixing hole 504, thereby moving sub-holder 5 in the Z1 direction relative to second member 692, and therefore the press-fit state between first positioning portion 502 and second positioning portion 602 can be easily released.

[0155] 2-2. Second modified example 18 and 19 are cross-sectional views of a portion of a liquid jet head 1 according to a second modified example. The liquid jet head 1 according to the second modified example shown in Fig. 18 and Fig. 19 has a cover 85. The cover 85 is fixed to the flange portion 64 of the holder 6.

[0156] The cover 85 is provided in common to the multiple sub-holders 5 and covers the portions of the multiple sub-holders 5 except for the openings H5. The cover 85 is a plate-shaped member made of, for example, metal. The cover 85 is positioned in the Z1 direction of the multiple sub-holders 5 and comes into contact with the multiple sub-holders 5. The cover 85 has multiple openings 85H. The multiple openings 85H are provided in one-to-one correspondence with the nozzle surfaces SN of the multiple head modules 2 and expose the nozzle surfaces SN.

[0157] Furthermore, the cover 85 covers the side wall surfaces of the multiple sub-holders 5. A portion of the cover 85 has a flange 851 that is in contact with the surface of the flange portion 64 facing the Z2 direction. A through hole is formed in the flange 851 for inserting the mounting screw 156. The flange portion 64 is also formed with a screw hole 643 that overlaps the through hole when viewed from the Z1 direction. The screw hole 643 is a bottomed hole that opens on the surface of the flange portion 64 facing the Z1 direction. With the cover 85 in contact with the multiple sub-holders 5, the mounting screw 156 is inserted into the screw hole 643 and screwed in, thereby fixing the cover 85 to the flange portion 64.

[0158] By providing the cover 85, the ink mist is prevented from entering the recess 620 of the holder 6.

[0159] 2-3. Third modified example 20 and 21 are cross-sectional views of a portion of the liquid jet head 1 of the third modified example. Fig. 22 is a diagram showing a second member 692 of the holder 6 of the third modified example. The following mainly describes the parts that differ from the first modified example.

[0160] 20, a bushing 524 is provided. Although not shown in detail, the bushing 524 has a rectangular frame shape that surrounds the opening H5 of the sub-holder 5 when viewed in the Z1 direction. This prevents ink mist and the like from entering the space inside the recess 610 of the holder 6.

[0161] 21 and 22, the flow path opening forming member 25 of the third modified example has a flange 209. The flange 209 is provided in the Y1 and Y2 directions of the chip 20 when viewed in the Z1 direction. As shown in FIG. 21, the flange 209 is provided with a fixing hole 201H. The sub-holder 5 is also provided with a fixing hole 505 corresponding to the fixing hole 201H. The fixing hole 505 is a bottomed hole that opens on the surface of the sub-holder 5 facing the Z2 direction. The fixing hole 505 is provided to correspond to the fixing hole 201H and overlaps with the fixing hole 201H when viewed in the Z1 direction.

[0162] Furthermore, the fixing member group 150 of the third modified example includes a plurality of fixing members 155, 152, and 154. The fixing member 155 is inserted through the fixing hole 201H and the fixing hole 505 in this order. The fixing member 155 fixes the flow path opening forming member 25 and the sub-holder 5 to each other. The fixing member 155 is provided for each sub-holder 5.

[0163] The fixing member group 150 fixes the sub-holder 5 to the holder 6, and indirectly fixes the multiple head modules 2 to the holder 6. Furthermore, by providing the multiple fixing members 155, the head module 2 is fixed to the sub-holder 5 without using adhesive or the like. This makes it easy to attach and detach the head module 2 to and from the sub-holder 5. In particular, since the fixing members 155 are screws, it is particularly easy to attach and detach the head module 2 to and from the sub-holder 5. Note that the fixing members 155 may be, for example, T-shaped or L-shaped. Furthermore, by fixing the head module 2 to the sub-holder 5 with the fixing members 155, it is possible to suppress misalignment between the multiple head modules 2 compared to when the head module 2 is fixed using an adhesive.

[0164] Furthermore, the bush 524, sub-holder 5, head module 2, and seal member 4 overlap when viewed in the Z1 direction. Therefore, compared to when these do not overlap, the risk of the flange 209 being deformed by the reaction force of the seal member 4 is reduced.

[0165] 2-5. Fifth Variation FIG. 23 is a cross-sectional view of a portion of the liquid jet head 1 of the fifth modified example. In the liquid jet head 1 of the fifth modified example shown in FIG. 23, the first positioning portion 502a is a pin that protrudes in the Z2 direction from the surface of the sub-holder 5 facing the Z2 direction. The second positioning portion 602a is a bottomed hole that opens in the Z1 direction of the holder 6. The second positioning portion 602a is also a recess, i.e., a depression, formed in the holder 6 in the Z1 direction. The second positioning portion 602a is press-fitted into the first positioning portion 502a, thereby positioning the sub-holder 5 with respect to the holder 6.

[0166] Even with these first positioning portion 502a and second positioning portion 602a, positioning can be easily performed when attaching the sub-holder 5 to the holder 6, as in the first embodiment. Furthermore, alignment of multiple sub-holders 5 with respect to the holder 6 can be performed with high precision. Therefore, alignment of multiple head modules 2 with respect to the holder 6 can be performed with high precision. Furthermore, when replacing only some of the multiple head modules 2, there is no need to redo the alignment of all of the head modules 2.

[0167] As shown in the first embodiment and the fifth modified example, alignment of multiple head modules 2 can be performed with high precision by the simple method of press-fitting either the second positioning portion 602 or the first positioning portion 502 into the other.

[0168] Furthermore, the fourth positioning portion 642a is a bottomed hole that opens in the Z2 direction of the flange portion 64. The fourth positioning portion 642a is also a recess, i.e., a depression, formed in the Z1 direction of the flange portion 64. Although not shown, in this case, the third positioning portion 102 is configured by a protrusion provided on the unit base 11. The fourth positioning portion 642a is press-fitted into the third positioning portion 102, thereby enabling the liquid jet head 1 to be positioned with respect to the unit base 11. This makes it possible to improve the alignment accuracy between multiple liquid jet heads 1 using the unit base 11 as a reference.

[0169] 2-6. Sixth Variation FIG. 24 is a cross-sectional view showing a sealing member 4 of a sixth modified example and its vicinity. FIG. 25 is a cross-sectional view of a portion of a liquid jet head 1 of a sixth modified example. The thickness of the sealing member 4 of the sixth modified example shown in FIG. 24 is not constant. The sealing member 4 of the sixth modified example includes a thick portion 41 and a thin portion 42. The thick portion 41 is located near the inner wall surface that forms the opening H4, and is thicker than the thin portion 42. The thin portion 42 is located outside the thick portion 41.

[0170] In the sixth modified example, the thick portion 41 of the seal member 4 has the sealing region 4S. The thick portion 41 is in contact with the flow path opening forming member 25 and the common flow path member 3, and is sandwiched between the flow path opening forming member 25 and the common flow path member 3.

[0171] 25, the first fixing member 151 for fixing the head module 2 and the common flow path member 3 is arranged so as not to overlap the chip 20 when viewed in the Z1 direction and to sandwich the sealing area 4S between the chip 20. Furthermore, the support surface 5S includes an area 55S that is arranged between the sealing area 4S and the chip 20 when viewed in the Z1 direction. Therefore, the influence of the reaction force of the sealing member 4 on the chip 20 can be reduced compared to when the support surface 5S does not include the area 55S.

[0172] 2-7. 7th Variation 26 is a cross-sectional view showing a sealing member 4 of a seventh modified example and its vicinity. The sealing member 4 of the seventh modified example shown in FIG. 26 includes a portion that is not in contact with both the common flow path member 3 and the flow path opening forming member 25. The sealing member 4 of the seventh modified example has a sealing region 4S in the vicinity of the communication port 4H. Thus, depending on the shapes of the common flow path member 3 and the flow path opening forming member 25, the sealing member 4 may include a portion that is not in contact with both the common flow path member 3 and the flow path opening forming member 25 and is not sandwiched between the common flow path member 3 and the flow path opening forming member 25. The portion of the sealing member 4 that is not sandwiched between the common flow path member 3 and the flow path opening forming member 25 corresponds to the sealing region 4S.

[0173] 2-8. Eighth Variation FIG. 27 is a cross-sectional view showing the first positioning portion and the second positioning portion of the eighth modified example. In the eighth modified example shown in FIG. 27, one sub-holder 5a holds multiple head modules 2. As such, one sub-holder 5a does not have to hold one head module 2. In this case, one sub-holder 5a has multiple openings 5H corresponding to multiple head modules 2. In this case, the sub-holder 5a serves as the reference for positioning the multiple head modules 2. In the illustrated example, one sub-holder 5a supports three head modules 2. That is, a sub-holder 5a is provided for each of the three head modules 2. Two first positioning portions 502 are provided for each sub-holder 5a. Therefore, the two first positioning portions 502 are common to the three head modules 2. The sub-holder 5a serves as the reference for positioning the three head modules 2. Two first fixing holes 501 are also provided for each sub-holder 5a. Therefore, the two first fixing holes 501 are common to the three head modules 2.

[0174] In the eighth modified example, one sub-holder 5a holds multiple head modules 2. That is, one sub-holder 5a holds two or more head modules 2. For example, two or more head modules 2 that are to be replaced at similar times are held by one sub-holder 5a. This makes it possible to replace two or more head modules 2 that are to be replaced at similar times together, making the work easier.

[0175] In the eighth modification, for example, the sub-holder 5a preferably holds a plurality of head modules 2 that eject the same type of liquid among the plurality of head modules 2. This makes it possible to collectively replace head modules 2 that are nearing the end of their lifespan, for example, head modules 2 that eject a type of liquid with a high ejection frequency (for example, black ink, white ink, a pre-treatment liquid such as a reaction liquid that aggregates the pigment contained in the ink, or a post-treatment liquid such as an overcoat liquid). This improves the workability of replacement. Note that the two or more head modules 2 held in one sub-holder 5a do not have to eject the same type of ink. Also, one head module 2 may be capable of ejecting one type of ink, or may be capable of ejecting two or more types of ink.

[0176] 2-9.Other variations

[0177] In the above description, the sealing member 4 is provided for each head module 2, but the sealing member 4 may be integrated and shared by a plurality of head modules 2.

[0178] Furthermore, for example, the holder 6 may be formed with a dedicated through-hole for releasing the press-fit between the first positioning portion 502 and the second positioning portion 602. The through-hole may penetrate the holder 6 in the insertion / removal direction of the second positioning portion 602 relative to the first positioning portion 502, and may have an opening area larger than the opening area of ​​the first fixing hole 61H.

[0179] "Liquid ejection devices" can be used in various devices such as facsimile machines and copiers, as well as devices dedicated to printing. The uses of liquid ejection devices are not limited to printing. For example, a liquid ejection device that ejects a solution of coloring material is used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. A liquid ejection device that ejects a solution of conductive material is used as a manufacturing device for forming wiring and electrodes on relay boards. A liquid ejection device that ejects a solution of organic matter related to living organisms is used as a manufacturing device for manufacturing biochips, for example.

[0180] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the above-described embodiments. Furthermore, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above-described embodiments, and any configuration can be added. [Explanation of symbols]

[0181] REFERENCE SIGNS LIST 1...liquid jet head, 2...head module, 2a...first head module, 2b...second head module, 3...supply flow path member, 4...sealing member, 4H...communication port, 4S...sealing area, 4a...first sealing member, 4b...second sealing member, 5...sub-holder, 5H...opening, 5S...support surface, 6...holder, 7...wiring board, 10...liquid jet head unit, 11...unit base, 15...sub-unit, 20...chip, 25...flow path opening forming member, 25R...flow path, 31H...flow path opening, 55S...area, 61H...first fixing hole, 64...flange portion, 70...relay board, 71...connector, 75...wiring support portion, 85 ...Cover, 100...Liquid injection device, 102...Third positioning portion, 151...First fixing member, 251H...Flow path opening, 251Ha...First flow path opening, 251Hb...Second flow path opening, 501...First fixing hole, 502...First positioning portion, 502a...First positioning portion, 602...Second positioning portion, 602a...Second positioning portion, 610...Recess, 641...Fourth positioning portion, 641a...Fourth positioning portion, 750...Groove, 2511...Supported surface, D2...Thickness, D5...Thickness, D51...Depth, D53...Depth, D6...Thickness, D61...Depth, L53...Distance, N...Nozzle, 4S...Sealing area, S5...Support surface, S50...Area, SN...Nozzle surface.

Claims

1. a plurality of head modules that eject liquid in a first direction; a plurality of metal sub-holders each holding at least one head module among the plurality of head modules; a metal holder to which the plurality of sub-holders are detachably fixed; Equipped with Each of the plurality of sub-holders has a first positioning portion, the holder has a plurality of second positioning portions that are press-fitted or engaged with the plurality of first positioning portions, respectively, to position the plurality of sub-holders relative to the holder; A liquid jet head characterized by:

2. the plurality of second positioning portions are arranged on a surface of the holder facing the first direction, the first positioning portion is provided on a surface of the sub-holder facing a second direction that is opposite to the first direction, the at least one head module is supported on a surface of the sub-holder facing the second direction; The liquid jet head according to claim 1 .

3. The head module includes: a nozzle plate having a plurality of nozzles for ejecting liquid; a supported surface that is positioned in the second direction relative to the nozzle plate and faces the first direction, The sub-holder is an opening for exposing the plurality of nozzles of the head module to the outside; a support surface facing the second direction, the supported surface comes into contact with the supporting surface, whereby the head module is held by the sub-holder. The liquid jet head according to claim 2 .

4. the head module has the supported surface and a flow path opening forming member having a flow path formed therein, a portion of the flow path opening forming member is inserted into the opening of the sub-holder; The liquid jet head according to claim 3 .

5. a surface of the sub-holder facing the first direction and a surface of the nozzle plate facing the first direction are substantially flush with each other; The liquid jet head according to claim 3 .

6. a common flow path member having one or more flow paths communicating with the plurality of head modules; the common flow path member is disposed in a second direction that is an opposite direction to the first direction with respect to the plurality of head modules, and overlaps the plurality of head modules when viewed in the first direction, The first positioning portion is provided on a surface of the sub-holder facing the second direction. The liquid jet head according to claim 1 .

7. a relay substrate electrically connected to the plurality of head modules; the relay substrate is disposed in a second direction that is an opposite direction to the first direction with respect to the plurality of head modules, and overlaps the plurality of head modules when viewed in the first direction, The first positioning portion is provided on a surface of the sub-holder facing the second direction. The liquid jet head according to claim 1 .

8. Each of the plurality of sub-holders holds two or more of the head modules. The liquid jet head according to claim 1 .

9. the sub-holder holds two or more head modules that eject the same type of liquid among the plurality of head modules; The liquid jet head according to claim 8 .

10. the first positioning portion is a hole provided on the surface of the sub-holder facing the second direction and having a bottom surface recessed in the first direction, or a pin protruding in the second direction from the surface of the sub-holder facing the second direction. The liquid jet head according to claim 2 .

11. a plurality of first fixing members that detachably fix each of the plurality of sub-holders to the holder; Each of the plurality of sub-holders has a first fixing hole having a recessed shape and a bottom surface, the holder has a first fixing hole penetrating in the first direction, The first fixing member is inserted into the first fixing hole and the second fixing hole in this order in the first direction. The liquid jet head according to claim 1 .

12. the plurality of second positioning portions are arranged on a surface of the holder facing the first direction, the first positioning portion is provided on a surface of the sub-holder facing a second direction that is opposite to the first direction, The depth of the first fixing hole is deeper than the depth of the second fixing hole. The liquid jet head according to claim 11 .

13. a distance from the bottom surface of the first fixing hole to the surface of the sub-holder facing the first direction is greater than a depth of the first fixing hole; The liquid jet head according to claim 12 .

14. The first fixing member is a screw. The liquid jet head according to claim 12 .

15. A plurality of the liquid jet heads according to claim 1 ; a unit base for holding the plurality of liquid jet heads; A liquid ejection device comprising:

16. the holder has a fourth positioning portion that is press-fitted into or is press-fitted into one of a plurality of third positioning portions provided on a unit base that holds the plurality of liquid jet heads, thereby positioning the liquid jet head with respect to the unit base; The liquid jet head according to claim 1 .

17. A plurality of the liquid jet heads according to claim 16; a unit base including the plurality of third positioning portions and holding the plurality of liquid jet heads; A liquid ejection device comprising:

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