Liquid jet head and liquid jet device

Abstract

To provide a liquid jet head which is prevented from deteriorating in reliability, and a liquid jet device.SOLUTION: The liquid jet head comprises: a head module including a flow passage opening forming member and a chip; a supply flow passage member that supplies liquid to the head module; an elastic seal member that liquid-tightly connects the flow passage opening forming member to the supply flow passage member; and a fixing member fixing the supply flow passage member to the flow passage opening forming member. A seal region held by the flow passage opening forming member and the supply flow passage member of the seal member overlaps with the chip when viewed in a jetting direction. A dimension in the jetting direction of a portion overlapping with the seal region, of the flow passage opening forming member, is larger than a distance between the seal region and the fixing member when viewed in the jetting direction.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. [Background technology]

[0002] 2. Description of the Related Art Liquid ejection apparatuses equipped with liquid ejection heads that eject liquid such as ink onto a medium such as printing paper have been proposed.

[0003] The liquid ejection head described in Patent Document 1 comprises a recording element unit (head module) including an element recording substrate having an ejection port for ejecting liquid and a support member for fixing the element recording substrate, and a flow path unit (supply flow path member) having a liquid supply path for supplying liquid to the recording element unit, and the recording element unit and the flow path unit are fluid-tightly connected via an elastic member (sealing member). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-226988 Summary of the Invention [Problem to be solved by the invention]

[0005] When a seal member is sandwiched between the head module and the supply flow path member to connect the flow path in a liquid-tight manner, the reaction force of the seal member may reduce the reliability of the head module. [Means for solving the problem]

[0006] a supply flow path member that supplies liquid to the first head module; an elastic first sealing member that is sandwiched between the first head module and the supply flow path member in the first direction to liquid-tightly connect the first flow path opening with the flow path opening of the supply flow path member; and a first fixing member that fixes the supply flow path member and the first flow path opening forming member, wherein a first sealing region of the first sealing member sandwiched between the first flow path opening forming member and the supply flow path member overlaps with the first chip when viewed in the first direction, and a first dimension in the first direction of a portion of the first flow path opening forming member that overlaps with the first sealing region is greater than a first distance between the first sealing region and the first fixing member when viewed in the first direction.

[0007] A liquid ejection apparatus according to one aspect of the present disclosure includes a plurality of liquid ejection heads and a unit base to which the plurality of liquid ejection heads are fixed. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram illustrating the configuration of a liquid ejecting apparatus according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the liquid jet head shown in FIG. [Figure 3] FIG. 3 is a bottom view of the liquid jet head shown in FIG. [Figure 4] 3 is a cross-sectional view of a chip included in the head module shown in FIG. 2. FIG. [Figure 5] 3 is a diagram showing a head module, a supply flow path member, and a sealing member shown in FIG. 2. FIG. [Figure 6] FIG. 3 is a plan view of the head module and the seal member shown in FIG. 2. [Figure 7] FIG. 10 is a plan view of a sealing member and a fixing member of a first modified example. [Figure 8]FIG. 10 is a cross-sectional view of a sealing member and a fixing member of a first modified example. [Figure 9] FIG. 10 is a plan view of a sealing member and a fixing member of a second modified example. [Figure 10] FIG. 10 is a cross-sectional view of a sealing member and a fixing member of a second modified example. [Figure 11] FIG. 11 is a plan view of a sealing member and a fixing member of a third modified example. [Figure 12] FIG. 10 is a plan view of a sealing member and a fixing member of a fourth modified example. [Figure 13] FIG. 13 is a plan view of a sealing member and a fixing member of a fifth modified example. [Figure 14] FIG. 13 is a cross-sectional view of a sealing member and a fixing member of a sixth modified example. [Figure 15] FIG. 13 is a plan view of a head module according to a sixth modified example. [Figure 16] FIG. 13 is a plan view of a sealing member and a fixing member of a seventh modified example. [Figure 17] FIG. 13 is a cross-sectional view of a sealing member and a fixing member of a seventh modified example. [Figure 18] FIG. 13 is a plan view of a head module according to an eighth modified example. [Figure 19] FIG. 13 is a cross-sectional view of a head module according to an eighth modified example. [Figure 20] FIG. 13 is a cross-sectional view of a head module according to a ninth modified example. [Figure 21] FIG. 20 is a cross-sectional view showing a sealing member and its vicinity according to a tenth modified example. [Figure 22] FIG. 20 is a cross-sectional view showing a sealing member and its vicinity in an eleventh modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The dimensions and scale of each part in the drawings may differ from the actual dimensions, and some parts are shown schematically to facilitate understanding. The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to limit the present invention. Furthermore, the term "element β on element γ" is not limited to a configuration in which element γ and element β are in direct contact with each other, but also includes a configuration in which element γ and element β are not in direct contact with each other. The term "element γ and element β are equal" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like. The term "element γ and element β are the same" means that element γ and element β are substantially equal, and includes measurement errors, manufacturing errors, and the like.

[0010] 1. First embodiment 1-1. Overall configuration of the liquid ejection device 100 FIG. 1 is a schematic diagram illustrating the configuration of a liquid ejection device 100 according to a first embodiment. For ease of explanation, the following description will appropriately use mutually perpendicular X, Y, and Z axes. A direction along the X axis will be referred to as the X1 direction, and a direction opposite to the X1 direction will be referred to as the X2 direction. Similarly, a direction along the Y axis will be referred to as the Y1 direction, and a direction opposite to the Y1 direction will be referred to as the Y2 direction. A direction along the Z axis will be referred to as the Z1 direction, and a direction opposite to the Z1 direction will be referred to as the Z2 direction. The Z1 direction corresponds to the "first direction." The Z1 direction is referred to as "downward" relative to a certain point, and the Z2 direction is referred to as "upward" from a certain point. Viewing in the Z1 or Z2 direction is referred to as a "planar view."

[0011] As shown in FIG. 1, the liquid ejecting device 100 includes a liquid storage section 9, a control unit 91, a conveying section 92, a head unit 10, and a movement mechanism 93.

[0012] The liquid storage unit 9 is a container that stores ink. Specific examples of the liquid storage unit 9 include a cartridge that is detachable from the liquid ejection device 100, a bag-shaped ink pack made of flexible film, and an ink tank that can be refilled with ink. The type of ink stored in the liquid storage unit 9 is not particularly limited and can be any type.

[0013] The control unit 91 controls the operation of each element of the liquid ejection device 100. The control unit 91 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, and controls the operation of each element of the liquid ejection device 100.

[0014] The transport unit 92 transports the medium 90 in a direction DM under the control of the control unit 91. In this embodiment, the direction DM is the Y1 direction. In the example shown in FIG. 1, the transport unit 92 includes a long transport roller along the X axis and a motor that rotates the transport roller. Note that the transport unit 92 is not limited to a configuration using a transport roller, and may be configured, for example, to use a drum or endless belt that transports the medium 90 while adsorbing it to its outer peripheral surface using electrostatic force or the like.

[0015] The head unit 10 has a unit base 11 and a liquid ejection head 1. The liquid ejection head 1 ejects ink from nozzles N toward a medium 90. The unit base 11 holds the liquid ejection head 1.

[0016] The movement mechanism 93 has a conveyor belt to which the unit base 11 of the head unit 10 is fixed, and moves the head unit 10 back and forth in the X1 direction and the X2 direction under the control of the control unit 91. Under the control of the control unit 91, the head unit 10 ejects ink supplied from the liquid storage section 9 from each of the multiple nozzles N onto the medium 90 in the Z1 direction. The ejection of ink from the head unit 10 is performed in parallel with the movement of the head unit 10 by the movement mechanism 93, so that an ink image is formed on the surface of the medium 90.

[0017] The number and arrangement of the multiple liquid jet heads 1 included in the head unit 10 are not limited to the example shown in Fig. 1 and are arbitrary. Furthermore, if the head unit 10 is configured to be able to circulate ink, the head unit 10 may be connected to the liquid storage section 9 via a circulation mechanism for circulating the ink within the head unit 10.

[0018] As described above, the liquid ejection device 100 includes a plurality of liquid ejection heads 1 and a unit base 11 to which the plurality of liquid ejection heads 1 are fixed. The liquid ejection device 100 includes the liquid ejection heads 1 described below. As will be described later, each of the plurality of liquid ejection heads 1 is less susceptible to defects such as warping, and has excellent reliability in print quality. Therefore, the liquid ejection device 100 including the plurality of liquid ejection heads 1 can improve the reliability of print quality.

[0019] 1-2. Liquid jet head 1 Fig. 2 is a cross-sectional view of the liquid jet head 1 shown in Fig. 1. As shown in Fig. 2, the liquid jet head 1 includes a plurality of head modules 2, a plurality of sealing members 4, a cover 5, a flow path unit 6, and an interconnect substrate 7. The flow path unit 6 includes a supply flow path member 3, a flow path member 60, and a case 62. The flow path unit 6 may also be considered as a "supply flow path member."

[0020] Each of the multiple head modules 2 has multiple nozzles N. Each of the multiple head modules 2 ejects ink in the Z1 direction, which is the "first direction." The multiple head modules 2 are lined up along the X axis. Each head module 2 is a long member extending along the Y axis. Note that, while the number of the multiple head modules 2 is four in the illustrated example, it is not limited to this and may be one to three, or five or more. Each head module 2 also has a chip 20 and a flow path opening forming member 25. The chip 20 has multiple nozzles N that eject ink. The flow path opening forming member 25 is positioned in the Z2 direction relative to the chip 20 and supplies ink to the chip 20. The flow path opening forming member 25 and the chip 20 are fixed to each other, for example, with an adhesive or the like. The flow path opening forming member 25 is preferably a member having a thickness of 3000 μm or more, more preferably a member having a thickness of 5000 μm or more, and even more preferably a member having a thickness of 8000 μm or more. The flow path opening-forming member 25 may be formed of a single member or may be a laminate of multiple members. The flow path opening-forming member 25 may be formed of a resin or a metal. The flow path opening-forming member 25 may contain a resin and a metal.

[0021] The supply flow path member 3 is positioned in the Z2 direction relative to the multiple head modules 2. The supply flow path member 3 is common to the multiple head modules 2. The supply flow path member 3 includes a supply flow path that supplies ink to each head module 2. The supply flow path member 3 is a flow path common to the multiple head modules 2. The material of the supply flow path member 3 is, for example, resin or metal such as stainless steel.

[0022] A plurality of seal members 4 are disposed between each head module 2 and the supply flow path member 3. A plurality of seal members 4 are provided for each head module 2. The seal members 4 are sandwiched between the head module 2 and the supply flow path member 3 in the Z1 direction and are crushed by the head module 2 and the supply flow path member 3. The plurality of seal members 4 are members that connect the flow paths between each head module 2 and the supply flow path member 3 in a liquid-tight manner. The seal members 4 have elasticity. The material of the seal members 4 is, for example, an elastic material such as an elastomer. In this embodiment, the length of the seal members 4 along the Z axis, i.e., their thickness, is constant. The thickness of the seal members 4 is thinner than the thickness of the flow path opening forming member 25.

[0023] The supply flow path member 3 houses and holds the multiple head modules 2. The supply flow path member 3 has a recess recessed in the Z2 direction on its bottom surface facing the Z1 direction, and the multiple head modules 2 are arranged in an internal space formed inside the recess.

[0024] The cover 5 is a flat plate-shaped member provided in the Z1 direction of the multiple head modules 2, and holds the multiple head modules 2 together with the supply flow path member 3. The cover 5 is made of a metal such as stainless steel. The cover 5 also has openings 5H, which are through-holes formed for each head module 2.

[0025] The relay board 7 is a board on which mounted components are mounted that electrically connect the aforementioned control unit 71 and a wiring board 209 (described later) that is provided in each head module 2. The relay board 7 is a flat plate along the XY plane, and is disposed between the supply flow path member 3 and the case 62. Although not shown, the relay board 7 is provided with a through hole that communicates with the flow path of the supply flow path member 3.

[0026] The flow path member 60 is disposed in the Z2 direction relative to the relay substrate 7. The flow path member 60 has a flow path for supplying ink to the flow path of the supply flow path member 3 via a through hole provided in the relay substrate 7. The material of the flow path member 60 is, for example, resin.

[0027] The case 62 is a member that houses the flow path member 60. The case 62 has a hole that penetrates along the Z axis, and the flow path member 60 is disposed in the internal space formed inside the hole. Although not shown, the case 62 is connected to the supply flow path member 3 and holds the supply flow path member 3. The method of connecting the case 62 and the supply flow path member 3 is not particularly limited. The case 62 and the supply flow path member 3 may be connected using any member, such as an adhesive, a screw, or an engaging member. Although not shown, the case 62 has an opening through which a wiring member for electrically connecting the relay board 7 and the control unit 91 is inserted. Although not shown, the case 62 has a through hole through which ink is supplied from the liquid storage section 9 to the flow path member 60. The case 62 is made of a material such as resin or a metal such as aluminum or stainless steel.

[0028] The liquid jet head 1 in Fig. 2 described above is one example. The liquid jet head 1 of this embodiment includes all of the elements shown in Fig. 2, but the components of the liquid jet head 1 do not need to include all of the elements, and may further include additional elements.

[0029] FIG. 3 is a bottom view of the liquid jet head 1 shown in FIG. 2. As shown in FIG. 3, a plurality of nozzles N of the head module 2 are exposed from an opening 5H of the cover 5. The plurality of nozzles N of each head module 2 are arranged along the Y axis. The plurality of nozzles N are divided into nozzle rows La and nozzle rows Lb that are arranged side by side at intervals along the X axis. Each of the nozzle rows La and Lb is a collection of a plurality of nozzles N linearly arranged along the Y axis. Furthermore, a surface of the head module 2 on which the openings of the plurality of nozzles N are formed is referred to as a nozzle surface SN. The nozzle surface SN is a surface of the chip 20 of the head module 2 that faces the Z1 direction. Note that, for example, the plurality of nozzles N may be arranged in a direction that intersects the X axis and the Y axis when viewed in the Z1 direction.

[0030] 1-3. Chip 20 4 is a cross-sectional view of the chip 20 included in the head module 2 shown in FIG. 4. As shown in FIG. 4, the chip 20 is disposed in the Z1 direction relative to the flow path opening forming member 25. The chip 20 has a structure in which elements related to each nozzle N of the nozzle row La and elements related to each nozzle N of the nozzle row Lb are disposed in approximate plane symmetry. Hereinafter, when there is no need to distinguish between the nozzle row La and the nozzle row Lb, they will be referred to as the nozzle row L. Below, the configuration corresponding to one of the nozzles N will be mainly described.

[0031] As shown in FIG. 4, the chip 20 of each head module 2 includes, for example, a communication plate 202, a pressure chamber substrate 203, a vibration plate 204, a nozzle plate 201, a vibration absorber 206, a plurality of drive elements E, and a sealing substrate 205.

[0032] The communicating plate 202, pressure chamber substrate 203, diaphragm 204, nozzle plate 201, and vibration absorber 206 are each a long plate-like member extending along the Y axis. The pressure chamber substrate 203 is installed on the surface of the communicating plate 202 facing the Z2 direction. The nozzle plate 201 and vibration absorber 206 are installed on the surface of the communicating plate 202 facing the Z1 direction. The components are fixed together, for example, with an adhesive.

[0033] The nozzle plate 201 is a plate-like member in which a plurality of nozzles N are formed. The nozzle plate 201 is the member of the head module 2 that is located furthest in the Z1 direction. The surface of the nozzle plate 201 that faces the Z1 direction is the nozzle surface SN. Each of the plurality of nozzles N is a circular through-hole that ejects ink. For example, the nozzle plate 201 is manufactured by processing a silicon (Si) single crystal substrate using semiconductor manufacturing techniques such as photolithography and etching.

[0034] The communicating plate 202 is formed with a plurality of throttle portions R1, a plurality of communicating channels R2, a communicating space Ra, and a common channel Rb. Each of the throttle portions R1 and the communicating channels R2 extends in the Z1 direction and is a through-hole formed for each nozzle N. The communicating channels R2 overlap with the nozzles N in plan view. The communicating spaces Ra are elongated openings formed along the Y axis. The communicating spaces Ra extend along the Y axis. The common channels Rb communicate with the communicating spaces Ra and overlap with the communicating spaces Ra in plan view. The common channels Rb extend along the Y axis. The common channels Rb communicate with the plurality of throttle portions R1. Furthermore, the communicating spaces Ra communicate with the spaces Rc of the channel opening forming member 25.

[0035] The communication space Ra, the common flow path Rb, and the space Rc form a common space R that is shared by multiple nozzles N. The common space R functions as an ink reservoir. The ink stored in the common space R branches off into each throttle section R1 and is supplied to and filled in parallel into multiple pressure chambers C0.

[0036] A plurality of pressure chambers C0 are formed in the pressure chamber substrate 203. The pressure chambers C0 are located between the communication plate 202 and the vibration plate 204, and are spaces formed by the wall surfaces of the pressure chamber substrate 203. A pressure chamber C0 is formed for each nozzle N. The pressure chamber C0 is an elongated space extending in the X1 direction. The plurality of pressure chambers C0 are arranged along the Y axis.

[0037] The communication plate 202 and the pressure chamber substrate 203 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate.

[0038] An elastically deformable vibration plate 204 is disposed above the pressure chamber C0. The vibration plate 204 is laminated on the pressure chamber substrate 203 and contacts the surface of the pressure chamber substrate 203 opposite the communicating plate 202. The vibration plate 204 is a long, rectangular plate-like member extending along the Y-axis in a plan view. The pressure chamber C0 communicates with the communicating flow path R2 and the throttle portion R1. Therefore, the pressure chamber C0 communicates with the nozzle N via the communicating flow path R2, and also communicates with the communicating space Ra via the throttle portion R1. Note that the nozzle N, the communicating flow path R2, the pressure chamber C0, and the throttle portion R1 form an individual flow path for each nozzle N. Also, for ease of explanation, the pressure chamber substrate 203 and the vibration plate 204 are illustrated in FIG. 4 as separate substrates, but in reality they are laminated on a single silicon substrate.

[0039] A driving element E is formed for each pressure chamber C0 on the surface of the vibration plate 204 opposite to the pressure chamber C0. The driving element E is an elongated piezoelectric element extending along the X-axis in a plan view. The driving element E includes, for example, a pair of electrodes and a piezoelectric body sandwiched between the pair of electrodes. The driving element E may also be an electrothermal conversion element that generates thermal energy.

[0040] The sealing substrate 205 is a structure that protects the multiple drive elements E. The sealing substrate 205 is fixed to the surface of the diaphragm 204 with, for example, an adhesive. The multiple drive elements E are housed inside a recess formed on the surface of the sealing substrate 205 that faces the diaphragm 204. The sealing substrate 205 also has a through-hole 21H for inserting the wiring substrate 209 therethrough.

[0041] Wiring board 209 is bonded to diaphragm 204. Wiring board 209 protrudes from diaphragm 204 in the Z2 direction. Wiring board 209 is a mounting component on which a plurality of wires are formed for electrically connecting chip 20 and relay substrate 7. Wiring board 209 is, for example, a flexible board such as an FPC (Flexible Printed Circuit) or a COF (Chip On Film) or a rigid board. A drive signal and a reference voltage for driving drive elements E are supplied to each drive element E from wiring board 209.

[0042] The vibration absorber 206 is a thin metal plate that forms the wall surface of the common flow path Rb. The vibration absorber 206 has a thickness similar to that of the nozzle plate 201. The planar shape of the vibration absorber 206 is, for example, a frame-like shape that surrounds the nozzle plate 201. A mold 207 made of resin is provided between the vibration absorber 206 and the nozzle plate 201. The vibration absorber 206 is a flexible film that forms the wall surface of the communication space Ra and absorbs pressure fluctuations of the ink in the common space R. By providing the vibration absorber 206, the natural frequency of the flow path from the nozzle N through the pressure chamber C0 to the throttle section 312 is stabilized regardless of the nozzle N being driven. In addition, a frame 501 is bonded between the vibration absorber 206 and the aforementioned cover 5 with an adhesive or the like. The frame 501 is a frame-shaped member that fits along the outer periphery of the vibration absorber 206. The frame 501 is made of, for example, metal.

[0043] In this chip 20, when the drive element E contracts due to energization, the vibration plate 204 bends and deflects in the direction that reduces the volume of the pressure chamber C0, and the force inside the pressure chamber C0 increases, causing an ink droplet to be ejected from the nozzle N. At this time, pressure also propagates from the pressure chamber C0 toward the throttle portion R1, causing ink to flow into the common flow path Rb through the throttle portion R1. After the ink is ejected, the drive element E returns to its original position. At this time, the ink in the common flow path Rb from the nozzle N also vibrates. Then, at the same time that the meniscus of the nozzle N returns to its original position, ink is supplied from the throttle portion R1. Through this series of operations, ink is ejected from the nozzle N.

[0044] The chip 20 of this embodiment includes all of the elements shown in FIG. 3, but the components of the chip 20 do not necessarily have to include all of the elements, and may further include additional elements.

[0045] The chip 20 may have, for example, a monolithic structure and be thinner than the flow path opening-forming member 25, e.g., a component having a thickness of less than 3000 μm. The chip 20 may be a component having a thickness of 1500 μm or less, or 1000 μm or less. The thickness of the chip 20 may be ⅕ or less of the length of the short side as viewed in the direction along the Z axis, which is the thickness direction of the chip 20. The chip 20 may include at least one element of the nozzle plate 201, the pressure chamber substrate 203, the communication plate 202, or the driving element E, and the sealing substrate 205. The chip 20 preferably includes at least the nozzle plate 201, more preferably further includes the pressure chamber substrate 203, and particularly preferably further includes the communication plate 202. At least one of the nozzle plate 201, the pressure chamber substrate 203, the communication plate 202, the pressure chamber substrate 203 on which the driving element E is stacked, and the sealing substrate 205 may be considered to be the chip 20. Furthermore, chip 20 may be not only a laminate of silicon substrates manufactured using MEMS, but also a laminate of thin plates such as ceramic sheets or metals, or a laminate of thin plate-like members of each of the aforementioned materials.

[0046] 1-4. Flow path opening forming member 25 4, a flow path opening forming member 25 is disposed in the Z2 direction of the chip 20. A through hole 21H is provided in the flow path opening forming member 25. The through hole 21H overlaps with the through hole 20H of the sealing substrate 205 in a plan view. A wiring substrate 209 is inserted into the through hole 21H.

[0047] Furthermore, a flow path 25R is formed inside the flow path opening forming member 25. The flow path 25R is provided to supply ink to the chip 20. A space Rc is provided on the chip 20 side of the flow path 25R, i.e., downstream. The flow path 25R and the space Rc are in communication with each other.

[0048] 5 is a diagram showing the head module 2, supply flow path member 3, and sealing member 4 shown in FIG. 2. As shown in FIG. 5, flow path 25R of flow path opening forming member 25 has a plurality of flow path openings 25H on the side opposite to chip 20, i.e., upstream. Therefore, flow path openings 25H are formed in flow path opening forming member 25. Each flow path opening 25H is an opening end of flow path 25R in the Z2 direction. Flow path opening 25H is an opening for flow path connection between flow path 25R of flow path opening forming member 25 of head module 2 and flow path 3R of supply flow path member 3, which will be described later.

[0049] Furthermore, the flow path opening forming member 25 is provided with a plurality of fixing holes 251. The fixing holes 251 are bottomed holes provided on the surface of the flow path opening forming member 25 facing the Z2 direction, and can also be considered as recesses or depressions. A fixing member 150 for fixing the head module 2 and the supply flow path member 3 to each other is inserted into each fixing hole 251.

[0050] Although not shown, the planar shape of the flow path opening forming member 25 is substantially the same as the planar shape of the chip 20.

[0051] 1-5. Supply flow path member 3 As shown in FIG. 5, the supply flow path member 3 has a flow path 3R. The flow path 3R supplies ink to each head module 2 and distributes the ink to each head module 2. The flow path 3R is a common flow path shared by multiple head modules 2, and has a common portion 3RA that extends along the X axis, and multiple branch portions 3RB that branch off from the common portion 3RA and extend in the Z1 direction. Although not shown, the supply flow path member 3 is provided with a flow path joint for communicating with the liquid storage section 9 via the flow path member 60. The flow path joint is exposed to the outside of the liquid jet head 1, for example, through an opening (not shown) formed in the supply flow path member 3.

[0052] A flow path opening 3H is provided on the head module 2 side, i.e., downstream, of the flow path 3R. The flow path opening 3H is an open end of the flow path 3R in the Z1 direction. The flow path opening 3H is provided corresponding to the above-mentioned flow path opening 25H.

[0053] The supply flow path member 3 is also provided with a plurality of fixing holes 31. Each fixing hole 31 is a hole that penetrates the supply flow path member 3 in a direction along the Z axis, which is the thickness direction of the supply flow path member 3. A fixing member 150 is inserted into each fixing hole 31.

[0054] The fixing member 150 fixes the supply flow path member 3 and the flow path opening forming member 25. The fixing member 150 is, for example, a screw. In this case, a female thread is formed on each inner peripheral wall surface that forms the fixing hole 251. Since the fixing member 150 is a screw, the supply flow path member 3 and the flow path opening forming member 25 can be easily fixed and released by rotating and screwing the screw. Furthermore, since the fixing member 150 is a screw, the flow path opening forming member 25 can be detachably fixed to the supply flow path member 3 without using adhesive.

[0055] The fixing member 150 may be something other than a screw, and may include, for example, an L-shaped or T-shaped pin with the tip in the Z1 direction bent at a right angle and an elastic member such as a leaf spring or a coil spring, and may be configured to fix the supply flow path member 3 and the flow path opening forming member 25 using the elastic force of the elastic member.

[0056] 1-6.Sealing material 4 As shown in Fig. 5, each sealing member 4 has a communication opening 4H. The communication opening 4H is provided to correspond to the flow path opening 25H of the flow path opening forming member 25 and the flow path opening 3H of the supply flow path member 3. Although not shown in detail, when viewed in the Z1 direction, the communication opening 4H overlaps with the flow path opening 3H and the flow path opening 25H. The communication opening 4H is connected to the flow path 25R via the flow path opening 25H. The communication opening 4H is connected to the flow path 3R via the flow path opening 3H. Therefore, the flow path 25R and the flow path 3R are in communication with each other via the communication opening 4H.

[0057] The sealing member 4 is a member that is sandwiched between the head module 2 and the supply flow path member 3 in the Z1 direction, thereby liquid-tightly connecting the flow path opening 25H of the head module 2 and the flow path opening 3H of the supply flow path member 3. The sealing member 4 is crushed between the flow path opening forming member 25 and the supply flow path member 3, thereby connecting the flow path 25R and the flow path 3R via the communication port 4H. Ink flowing through the flow path 3R of the supply flow path member 3 flows into the flow path 25R of the flow path opening forming member 25 via the communication port 4H, and is supplied to the individual flow paths of the chip 20 via the common space R.

[0058] The seal member 4 also has a seal region 4S. In this embodiment, the entire seal member 4 corresponds to the seal region 4S. The seal region 4S is in contact with both the flow path opening-forming member 25 and the supply flow path member 3, and is a region of the seal member 4 that is sandwiched between the flow path opening-forming member 25 and the supply flow path member 3. The seal region 4S is a region that is crushed by the load from the flow path opening-forming member 25 and the supply flow path member 3 in order to liquid-tightly connect the flow path opening 25H and the flow path opening 3H to each other. In other words, even in a region of the seal member 4 that is sandwiched between both the flow path opening-forming member 25 and the supply flow path member 3, a portion that is not crushed by the load from both members and does not substantially contribute to liquid-tightly connecting the flow path opening 25H and the flow path opening 3H to each other is not included in the seal region 4S.

[0059] 6 is a plan view of the head module 2 and the sealing member 4 shown in FIG. 2. As shown in FIG. 6, four sealing members 4 are provided for each head module 2. The four sealing members 4 are provided at both longitudinal ends of one head module 2. Each sealing member 4 is circular when viewed in the Z1 direction, but may be polygonal, etc. Furthermore, the through hole 21H of the flow path opening forming member 25 described above is provided in the center of the flow path opening forming member 25 in a plan view. When viewed in the Z1 direction, each sealing member 4 is located in the Y1 direction or Y2 direction relative to the through hole 21H. In the illustrated example, each sealing member 4 is arranged at a corner of a quadrangle when viewed in the Z1 direction.

[0060] Fixing members 150 are provided near the sealing members 4. Four fixing members 150 are provided for each head module 2. The four fixing members 150 are provided at both ends of one head module 2 in the longitudinal direction. When viewed in the Z1 direction, each fixing member 150 is closer to the through hole 21H than the sealing members 4 located in its vicinity. In the illustrated example, each fixing member 150 is arranged at a corner of a quadrangle when viewed in the Z1 direction.

[0061] As shown in FIG. 6, the planar shape of the flow path opening forming member 25 is approximately the same as the planar shape of the chip 20 indicated by the broken line.

[0062] The seal member 4 and the seal area 4S overlap with the chip 20 when viewed in the Z2 direction. As shown in FIG. 5, the dimension B in the Z1 direction of the portion of the flow path opening forming member 25 that overlaps with the seal area 4S is greater than the distance A, which is the shortest distance between the seal area 4S and the fixing member 150 when viewed in the Z2 direction. Therefore, compared to when the seal area 4S does not overlap with the chip 20, the liquid jet head 1 can be made more compact. Furthermore, because the dimension B is greater than the distance A, the effect of the reaction force of the seal member 4 on the chip 20 is less likely to act on the chip 20 compared to when the dimension B is smaller. Therefore, warping or the like is less likely to occur in the chip 20. This improves the reliability of the head module 2. The dimension B is the length along the Z1 direction of the portion of the flow path opening forming member 25 that overlaps with the seal area 4S when viewed in the Z1 direction.

[0063] Furthermore, the fixing member 150 overlaps with the chip 20 when viewed in the Z1 direction. Therefore, compared to a case where the fixing member 150 does not overlap with the chip 20, the liquid jet head 1 can be made even more compact.

[0064] Furthermore, the sealing area 4S and the fixing member 150 do not overlap each other when viewed in the Z2 direction, but are spaced apart from each other. This makes it easier to arrange the flow path, the sealing member 4, and the fixing member 150 compared to when the sealing area 4S and the fixing member 150 overlap each other.

[0065] The dimension B is preferably greater than twice the distance A, and more preferably greater than three times the distance A. This makes it possible to significantly exhibit the above-mentioned effects.

[0066] The dimension C in the Z1 direction of the portion of the flow path opening-forming member 25 that overlaps with the fixing member 150 is larger than the distance A. Having the dimension C larger than the distance A prevents damage to the flow path opening-forming member 25 at the fixed position of the fixing member 150 due to the reaction force of the sealing member 4, compared to when the dimension C is smaller. The dimension C is preferably larger than twice the distance A, and more preferably larger than three times the distance A. Here, as shown in FIG. 5 , the dimension C is the dimension at the position where the dimension in the Z1 direction of the portion of the flow path opening-forming member 25 that overlaps with the fixing member 150 as viewed in the Z1 direction is largest. However, the dimension C may also be the dimension at the position where the dimension in the Z1 direction of the portion of the flow path opening-forming member 25 that overlaps with the fixing member 150 as viewed in the Z1 direction is smallest. In this case, the dimension C corresponds to the distance from the bottom surface of the fixing hole 251 to the tip surface of the flow path opening-forming member 25 in the Z1 direction. Note that the dimension C may be equal to or smaller than the distance A.

[0067] As described above, the liquid jet head 1 has a plurality of head modules 2. For example, the head module 2 located on the leftmost side in FIG. 6 is referred to as the "first head module 2a." The head module 2 adjacent to the first head module 2a on the right is referred to as the "second head module 2b." In this case, the flow path opening forming member 25 included in the first head module 2a is referred to as the "first flow path opening forming member 25a," and the flow path opening forming member 25 included in the second head module 2b is referred to as the "second flow path opening forming member 25b." The flow path opening 25H formed in the first flow path opening forming member 25a is referred to as the "first flow path opening 25Ha," and the flow path opening 25H formed in the second flow path opening forming member 25b is referred to as the "second flow path opening 25Hb." The chip 20 included in the first head module 2a is referred to as the "first chip 20a," and the chip 20 included in the second head module 2b is referred to as the "second chip 20b." The seal member 4 that connects the first flow path opening 25Ha and the flow path opening 3H of the supply flow path member 3 liquid-tightly between the first head module 2a and the supply flow path member 3 in the Z1 direction is the "first seal member 4a." The seal member 4 that connects the second flow path opening 25Hb and the flow path opening 3H of the supply flow path member 3 liquid-tightly between the second head module 2b and the supply flow path member 3 in the Z1 direction is the "second seal member 4b." The seal area 4S of the first seal member 4a is the "first seal area 4Sa," and the seal area 4S of the second seal member 4b is the "second seal area 4Sb." The fixing member 150 that fixes the supply flow path member 3 and the first flow path opening forming member 25a is the "first fixing member 150a," and the fixing member 150 that fixes the supply flow path member 3 and the second flow path opening forming member 25b is the "second fixing member 150b."

[0068] The dimension B in Z1 of the first flow path opening forming member 25a sandwiched between the first tip 20a and the first seal member 4a is the "first dimension B1." The dimension B in Z1 of the second flow path opening forming member 25b sandwiched between the second tip 20b and the second seal member 4b is the "second dimension B2." The distance A between the first seal region 4Sa and the first fixing member 150a when viewed in the Z1 direction is the "first distance A1." The distance A between the second seal region 4Sb and the second fixing member 150b when viewed in the Z1 direction is the "second distance A2."

[0069] The first dimension B1 is greater than the first distance A1. The second dimension B2 is greater than the second distance A2. In this way, for each of the multiple head modules 2, because the dimension B is greater than the distance A, the reaction force of the sealing member 4 is less likely to affect the chip 20 than when it is smaller. Therefore, the reliability of the multiple head modules 2 can be improved, and therefore the reliability of the liquid jet head 1 can be improved.

[0070] 2. Variations The first embodiment exemplified above can be modified in various ways. Specific modified aspects that can be applied to the first embodiment are exemplified below. Two or more aspects arbitrarily selected from the following examples can be combined as appropriate within the scope of not mutually contradicting each other.

[0071] 2-1. First modified example Fig. 7 is a plan view of the sealing member 4 and the fixing member 150 of the first modified example. Fig. 8 is a cross-sectional view of the sealing member 4 and the fixing member 150 of the first modified example. In the first modified example shown in Fig. 7, two sealing members 4 are provided for each head module 2. Each sealing member 4 is disposed between two adjacent fixing members 150 when viewed in the Z1 direction.

[0072] For example, in FIG. 7, the fixing member 150 positioned in the X1 direction relative to one sealing member 4 is the "first fixing member 150a," and the fixing member 150 positioned in the X2 direction relative to that sealing member 4 is the "third fixing member 150c."

[0073] As shown in FIG. 8, the dimension B is greater than both the distance A (first distance A1) between the sealing region 4S and the first fixing member 150a as viewed in the Z2 direction and the distance A between the sealing region 4S and the third fixing member 150c as viewed in the Z2 direction. This prevents the chip 20 from being affected by the reaction force of the sealing member 4. Additionally, as shown in FIG. 7, the third fixing member 150c is not located on the half line L1 extending from the sealing region 4S toward the first fixing member 150a as viewed in the Z2 direction. The first fixing member 150a and the third fixing member 150c can hold down the sealing member 4 at different positions in the sealing region 4S, effectively preventing the reaction force of the sealing member 4 from being affected by the chip 20. The third fixing member 150c may also be located on the half line L1.

[0074] In particular, the sealing region 4S is disposed between the first fixing member 150a and the third fixing member 150c when viewed in the Z1 direction, which makes it possible to particularly effectively suppress the effect of the reaction force of the sealing member 4 on the chip 20.

[0075] 2-2. Second modified example Fig. 9 is a plan view of the sealing member 4 and the fixing member 150 of the second modified example. Fig. 10 is a cross-sectional view of the sealing member 4 and the fixing member 150 of the second modified example. The second modified example will be mainly described with reference to the differences from the first modified example.

[0076] The planar shape of the sealing member 4 of the second modified example shown in Fig. 9 is much larger than that of the first modified example. The sealing member 4 of the second modified example has through holes 45 for inserting the fixing members 150. A through hole 45 is provided for each fixing member 150. Specifically, the sealing member 4 has a through hole 45 through which the first fixing member 150a is inserted and a through hole 45 through which the third fixing member 150c is inserted.

[0077] Even in this modified example, the dimension B is larger than both the distance A between the seal area 4S and the first fixing member 150a as viewed in the Z2 direction and the distance A between the seal area 4S and the third fixing member 150c as viewed in the Z2 direction. Therefore, the effect of the reaction force of the seal member 4 on the chip 20 can be suppressed.

[0078] 2-3.Third Modification FIG. 11 is a plan view of the sealing member 4 and the fixing member 150 of the third modified example. The differences between the third modified example and the first modified example will be mainly described. In the modified example shown in FIG. 11, four fixing members 150 are provided at both ends of one head module 2 in the short direction. This arrangement also makes it possible to suppress the effect of the reaction force of the sealing member 4 on the chip 20.

[0079] 2-4.Fourth Modification 12 is a plan view of a sealing member 4 and a fixing member 150 of a fourth modified example. In the fourth modified example shown in FIG. 12, three or more adjacent fixing members 150 are provided for one sealing member 4. Specifically, a first fixing member 150a, a third fixing member 150c, and a fourth fixing member 150d are provided. Each fixing member 150 fixes the supply flow path member 3 and the flow path opening forming member 25.

[0080] Although some detailed illustrations are omitted, for each fixing member 150, the distance A from the sealing area 4S when viewed in the Z2 direction is smaller than the dimension B. Therefore, the effect of the reaction force of the sealing member 4 on the chip 20 can be suppressed.

[0081] 12, the sealing area 4S is disposed inside the smallest convex polygon K0 that contains the plurality of fixing members 150 when viewed in the Z2 direction. This makes it possible to particularly effectively suppress the effect of the reaction force of the sealing member 4 on the chip 20.

[0082] In the illustrated example, the convex polygon K0 is a triangle. The convex polygon K0 varies depending on the number of fixing members 150. The convex polygon K0 circumscribes each fixing member 150. The number of fixing members 150 for one sealing area 4S is not particularly limited, but may be, for example, between three and five.

[0083] 2-5. Fifth Modification Fig. 13 is a plan view of a sealing member 4 and a fixing member 150 of a fifth modified example. In the fifth modified example shown in Fig. 13, two sealing members 4 are provided between two adjacent fixing members 150. A set consisting of two adjacent fixing members 150 and the two sealing members 4 arranged between them is provided at an end in the longitudinal direction of the head module 2. Furthermore, the through hole 21H for inserting the wiring board 209 is provided at an end in the longitudinal direction, rather than at the center of the head module 2, when viewed in the Z1 direction.

[0084] 2-6. Sixth Modification FIG. 14 is a cross-sectional view of a sealing member 4 and a fixing member 150 of a sixth modified example. FIG. 15 is a plan view of a head module 2 of a sixth modified example. In the sixth modified example shown in FIG. 14, a stepped surface is provided on the surface of the flow path opening forming member 25 of the head module 2 facing the Z2 direction. For example, the flow path opening forming member 25 of the sixth modified example includes a first member 255 and a second member 256. The second member 256 is disposed in the Z2 direction of the first member 255. The first member 255 and the second member 256 are each elongated along the Y axis. As shown in FIG. 15, the length of the first member 255 along the Y axis is longer than the length of the second member 256 along the Y axis. When viewed in the Z1 direction, the first member 255 has a portion that extends in the Y1 direction and the Y2 direction relative to the second member 256, and this portion does not overlap with the second member 256 when viewed in the Z1 direction.

[0085] A plurality of sealing members 4 are provided on the surface of the second member 256 in the Z2 direction. The plurality of sealing members 4 are provided at both longitudinal ends of the second member 256. A plurality of fixing holes 251 are provided in a portion of the first member 255 that does not overlap with the second member 256 when viewed in the Z1 direction. Therefore, a fixing position where the fixing member 150 of the flow path opening forming member 25 is fixed is present in a portion of the first member 255 that does not overlap with the second member 256 when viewed in the Z1 direction. As shown in FIG. 14 , a gap corresponding to the length of the second member 256 along the Z axis is provided between the first member 255 and the supply flow path member 3.

[0086] Although not shown in detail, the second member 256 has the same shape and the same planar area as the chip 20 when viewed in the Z1 direction, and overlaps with the chip 20 when viewed in the Z1 direction. On the other hand, the portion of the first member 255 that does not overlap with the second member 256 when viewed in the Z1 direction does not overlap with the chip 20 when viewed in the Z1 direction. Therefore, a plurality of fixing holes 251 are provided in the portion of the first member 255 that does not overlap with the second member 256 when viewed in the Z1 direction, and the plurality of fixing members 150 do not overlap with the chip 20 when viewed in the Z1 direction.

[0087] 14, in the sixth modified example, the dimension B is larger than the shortest distance D between the sealing area 4S and the fixing position where the fixing member 150 of the flow path opening-forming member 25 is fixed. Therefore, compared to when the dimension B is smaller than the shortest distance D, twisting in the rotational direction around the fixing position of the flow path opening-forming member 25 as a base point can be prevented.

[0088] Note that, for example, when the fixing member 150 is a screw, the fixing position refers to a location where the fixing force of the fixing member 150 directly acts on the flow path opening-forming member 25, such as a contact position between the fixing member 150 and an edge that forms the opening of the fixing hole 251 of the flow path opening-forming member 25. Note that the dimension B may be equal to or less than the shortest distance D.

[0089] In this modification, the dimension B is also greater than the distance A between the seal area 4S and the first fixing member 150a as viewed in the Z2 direction. This makes it possible to suppress the effect of the reaction force of the seal member 4 on the chip 20.

[0090] 2-7. Seventh Variation Fig. 16 is a plan view of a sealing member 4 and a fixing member 150 of a seventh modified example. Fig. 17 is a cross-sectional view of a sealing member 4 and a fixing member 150 of the seventh modified example. In the seventh modified example shown in Figs. 16 and 17, one fixing member 150 is provided between two sealing members 4 adjacent to each other when viewed in the Z1 direction.

[0091] For example, one of two sealing members 4 adjacent in the Z1 direction is referred to as the "first sealing member 4a" and the other as the "third sealing member 4c." In this case, the sealing area 4S of the first sealing member 4a is referred to as the "first sealing area 4Sa," and the sealing area 4S of the third sealing member 4c is referred to as the "third sealing area 4Sc." Furthermore, the communication port 4H of the first sealing member 4a is referred to as the "first communication port 4Ha," and the communication port 4H of the third sealing member 4c is referred to as the "third communication port 4Hc." The flow path opening 25H of the flow path opening forming member 25 that communicates with the first communication port 4Ha is referred to as the "first flow path opening 25Ha," and the flow path opening 25H of the flow path opening forming member 25 that communicates with the third communication port 4Hc is referred to as the "third flow path opening 25Hc." The first seal member 4a and the third seal member 4c are disposed between the first flow path opening forming member 25a, which is the same flow path opening forming member 25, and the supply flow path member 3. The first seal region 4Sa and the third seal region 4Sc overlap with the chip 20 when viewed in the Z1 direction.

[0092] In the seventh modified example, the first seal member 4a and the third seal member 4c are fixed in a sandwiched state between the flow path opening-forming member 25 and the supply flow path member 3 by a fixing member 150 arranged between the first seal member 4a and the third seal member 4c. The dimension B in the Z1 direction of the portion of the flow path opening-forming member 25 that overlaps with the first seal region 4Sa is greater than the distance A between the first seal region 4Sa and the first fixing member 150a as viewed in the Z1 direction. Similarly, the dimension B in the Z1 direction of the portion of the flow path opening-forming member 25 that overlaps with the third seal region 4Sc is greater than the distance A between the third seal region 4Sc and the first fixing member 150a as viewed in the Z1 direction.

[0093] In this way, one fixing member 150 is used to fix the first seal member 4a and the third seal member 4c, and each dimension B is greater than the distance A. Therefore, compared to when the fixing member 150 and the seal member 4 are provided in a one-to-one correspondence, the liquid jet head 1 can be made more compact.

[0094] 2-8. Eighth Variation Fig. 18 is a plan view of the head module 2 of the eighth modified example. Fig. 19 is a cross-sectional view of the head module 2 of the eighth modified example. In the eighth modified example, the parts that differ from the seventh modified example will be mainly described.

[0095] Two flange portions 250 are connected to the flow path opening forming member 25 of the head module 2 of the eighth modified example shown in Fig. 18 and Fig. 19. The two flange portions 250 are provided at corners of the flow path opening forming member 25 that face each other when viewed in the Z1 direction. Each flange portion 250 protrudes from the flow path opening forming member 25 in the X1 direction or the X2 direction. The Z2 direction surface of each flange portion 250 and the Z2 direction surface of the flow path opening forming member 25 are substantially flush with each other. The thickness, which is the length along the Z axis, of each flange portion 250 is smaller than the thickness of the flow path opening forming member 25.

[0096] In the seventh modified example, one fixing member 150 is provided between two adjacent seal members 4 in the Z1 direction. This fixing member 150 is referred to as the "first fixing member 150a." Another fixing member 150 is provided on one flange portion 250. This fixing member 150 is referred to as the "third fixing member 150c." The first fixing member 150a, the two seal members 4, and the third fixing member 150c are located on a line segment along the X-axis.

[0097] The dimension B in the Z1 direction of the portion of the flow path opening forming member 25 that overlaps with the third sealing region 4Sc is greater than the distance A between the third sealing region 4Sc and the third fixing member 150c as viewed in the Z1 direction. This arrangement also makes it possible to suppress the effect of the reaction force of the sealing member 4 on the chip 20.

[0098] 2-9. 9th Variation FIG. 20 is a cross-sectional view of a head module 2 of a ninth modified example. In the ninth modified example, differences from the eighth modified example will be mainly described. In the ninth modified example shown in FIG. 20, the flow path opening forming member 25 is provided with two flange portions 250 located on the same line along the X axis. Each flange portion 250 is considered to be part of the flow path opening forming member 25. A fixing member 150 is provided on each flange portion 250. In the ninth modified example, unlike the eighth modified example, no fixing member 150 is provided between the two seal members 4. Even in this configuration, the dimension B is greater than the distance A. Therefore, it is possible to suppress the effect of the reaction force of the seal member 4 acting on the chip 20.

[0099] 2-10. 10th Variation 21 is a cross-sectional view showing a sealing member 4 of a tenth modified example and its vicinity. The thickness of the sealing member 4 of the tenth modified example shown in FIG. 21 is not constant. The sealing member 4 of the tenth modified example includes a thick portion 41 and a thin portion 42. The thick portion 41 is located near the inner wall surface that forms the communication port 4H, and is thicker than the thin portion 42. The thin portion 42 is located outside the thick portion 41.

[0100] In the case of the tenth modification, the thick portion 41 of the seal member 4 has the sealing region 4S. The thick portion 41 is in contact with the flow path opening forming member 25 and the supply flow path member 3, and is sandwiched between the flow path opening forming member 25 and the supply flow path member 3.

[0101] 2-11. 11th Variation FIG. 22 is a cross-sectional view showing a sealing member 4 of an eleventh modified example and its vicinity. The sealing member 4 of the eleventh modified example shown in FIG. 22 includes a portion that is not in contact with both the supply flow path member 3 and the flow path opening formation member 25. The sealing member 4 of the eleventh modified example has a sealing region 4S near the communication port 4H. Thus, depending on the shapes of the supply flow path member 3 and the flow path opening formation member 25, the sealing member 4 may include a portion that is not in contact with both the supply flow path member 3 and the flow path opening formation member 25 and is not sandwiched between them. The portion of the sealing member 4 that is not sandwiched between the supply flow path member 3 and the flow path opening formation member 25 corresponds to the sealing region 4S. 2-12. 12th Variation In the first embodiment described above, the supply flow path member 3 in which the flow path 3R is formed and the flow path opening forming member 25 are directly fixed by the fixing member 150, but this is not limiting. The supply flow path member 3 may be configured such that the portion in which the flow path 3R is formed and the portion fixed to the flow path opening forming member 25 via the fixing member 150 are separate bodies.

[0102] 2-12.Other variations "Liquid ejection devices" can be used in various devices such as facsimile machines and copiers, as well as devices dedicated to printing. The uses of liquid ejection devices are not limited to printing. For example, a liquid ejection device that ejects a solution of coloring material is used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. A liquid ejection device that ejects a solution of conductive material is used as a manufacturing device for forming wiring and electrodes on relay boards. A liquid ejection device that ejects a solution of organic matter related to living organisms is used as a manufacturing device for manufacturing biochips, for example.

[0103] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the above-described embodiments. Furthermore, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above-described embodiments, and any configuration can be added. [Explanation of symbols]

[0104] REFERENCE SIGNS LIST 1...liquid jet head, 2...head module, 2a...first head module, 2b...second head module, 3...supply flow path member, 3R...flow path, 4...sealing member, 4H...communication port, 4Ha...first communication port, 4Hc...third communication port, 4S...sealing area, 4S1...sealing area, 4Sa...first sealing area, 4Sb...second sealing area, 4Sc...third sealing area, 4a...first sealing member, 4b...second sealing member, 4c...third sealing member, 5H...opening, 20...chip, 20a...first chip, 20b...second chip, 25...flow path Aperture forming member, 25H...flow path opening, 25Ha...first flow path opening, 25Hc...third flow path opening, 25R...flow path, 25a...first flow path opening forming member, 25b...second flow path opening forming member, 31...fixing hole, 3H...flow path opening, 100...liquid injection device, 150...fixing member, 150a...first fixing member, 150b...second fixing member, 201...nozzle plate, A...distance, A1...first distance, A2...second distance, B...dimension, B1...first dimension, B2...second dimension, D...shortest distance, E...driving element, K0...convex polygon, L1...half line, N...nozzle.

Claims

1. a first head module that ejects liquid in a first direction, the first head module including: a first flow path opening forming member in which a first flow path opening is formed; and a first tip that is disposed in the first direction with respect to the first flow path opening forming member; a supply flow path member that supplies liquid to the first head module; an elastic first seal member that is sandwiched between the first head module and the supply flow path member in the first direction, thereby liquid-tightly connecting the first flow path opening and a flow path opening of the supply flow path member; a first fixing member that fixes the supply flow path member and the first flow path opening forming member; Equipped with a first sealing region of the first sealing member sandwiched between the first flow path opening forming member and the supply flow path member overlaps with the first tip when viewed in the first direction; a first dimension in the first direction of a portion of the first flow path opening forming member that overlaps with the first sealing area is greater than a first distance between the first sealing area and the first fixing member as viewed in the first direction; A liquid jet head characterized by:

2. the first dimension is greater than twice the first distance; The liquid jet head according to claim 1 .

3. the first dimension is greater than three times the first distance; The liquid jet head according to claim 2 .

4. the first fixing member overlaps with the first chip when viewed in the first direction; The liquid jet head according to claim 1 .

5. a dimension in the first direction of a portion of the first flow path opening forming member that overlaps with the first fixing member is greater than the first distance; The liquid jet head according to claim 1 .

6. a third fixing member that fixes the supply flow path member and the first flow path opening forming member, the first dimension is greater than a distance between the first seal area and the third fixing member when viewed in the first direction; the third fixing member is not located on a half line extending from the first sealing area toward the first fixing member when viewed in the first direction; The liquid jet head according to claim 1 .

7. The first sealing region is disposed between the first fixing member and the third fixing member when viewed in the first direction. The liquid jet head according to claim 6 .

8. a plurality of fixing members, each of which includes three or more fixing members including the first fixing member and the third fixing member, the distance from the first sealing area being smaller than the first dimension when viewed in the first direction, and which fix the supply flow path member and the first flow path opening forming member; the first sealing area is disposed inside a smallest convex polygon that contains the plurality of fixing members when viewed in the first direction. The liquid jet head according to claim 6 .

9. a third flow path opening is formed in the first flow path opening forming member, the liquid jet head further includes an elastic third seal member that is sandwiched between the first head module and the supply flow path member in the first direction to liquid-tightly connect the third flow path opening and a flow path opening of the supply flow path member, a third seal region of the third seal member sandwiched between the first flow path opening forming member and the supply flow path member overlaps with the first tip when viewed in the first direction; a dimension in the first direction of a portion of the first flow path opening forming member that overlaps with the third sealing area is greater than a distance between the third sealing area and the first fixing member as viewed in the first direction; The liquid jet head according to claim 1 .

10. the first sealing area and the first fixing member do not overlap each other when viewed in the first direction; The liquid jet head according to claim 1 .

11. the first dimension is greater than the shortest distance between a fixing position of the first flow path opening forming member at which the first fixing member is fixed and the first sealing area; The liquid jet head according to claim 1 .

12. a second head module including a second flow path opening forming member in which a second flow path opening is formed, and a second chip disposed in the first direction relative to the second flow path opening forming member; an elastic second seal member that is sandwiched between the second head module and the supply flow path member in the first direction, thereby liquid-tightly connecting the second flow path opening and a flow path opening of the supply flow path member; a second fixing member that fixes the supply flow path member and the second flow path opening forming member; Equipped with a second sealing region of the second sealing member sandwiched between the second flow path opening forming member and the supply flow path member overlaps with the second tip when viewed in the first direction; a second dimension in the first direction of the second flow path opening forming member sandwiched between the second tip and the second sealing member is larger than a second distance between the second sealing area and the second fixing member as viewed in the first direction; The liquid jet head according to claim 1 .

13. A plurality of liquid jet heads according to any one of claims 1 to 12; a unit base to which the plurality of liquid jet heads are fixed; A liquid ejection device comprising:

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