Manufacturing method of film chip and film chip

Abstract

To provide a manufacturing method of a film chip which can manufacture a film chip which has a polygonal shape having five or more vertices and inhibits occurrence of cracks.SOLUTION: A manufacturing method of a film chip according to an embodiment of the invention includes a step in which a sheet is transported and concurrently cut into a product portion having a polygonal shape having five or more vertices and a product outside portion by a rotary cutter. The sheet includes: a laminated film having a lamination structure comprising five or more layers; and a first low-release-strength layer disposed at one side in a lamination direction of the laminated film. The first low-release-strength layer is disposed at an outermost layer. An upstream end of the production portion in a sheet transport direction is a side which is substantially parallel to a direction orthogonal to the transport direction or a corner part having an angle of 150° or larger.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for producing a film chip and a film chip. [Background technology]

[0002] Film chips having a structure suited to the application are widely used in various industrial products. Continuous cutting of such film chips from a mother sheet using a rotary cutter has been studied. For example, a die-cut roll described in Patent Document 1 has been proposed as a rotary cutter. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-202768 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, the applications of film chips have become more diverse, and the external shapes required for film chips have become more complex. As a result, there is a need to manufacture film chips with polygonal shapes of pentagons or more. In addition, it is desirable to provide a light release layer on the outermost layer of the film chip to protect the surface of the film chip during the manufacturing and transportation processes. Therefore, it has been considered to use a rotary cutter to cut out film chips having a polygonal shape with pentagons or more from a mother sheet having a light release layer as the outermost layer. However, with this method, when cutting the mother sheet, the cutting blade of the rotary cutter exits the mother sheet in an oblique direction (a direction intersecting with the thickness direction), and therefore, when film chips having a polygonal shape with pentagons or more are cut out, cracks may occur in the film chips. A primary object of the present invention is to provide a method for producing film chips that are capable of producing film chips having a polygonal shape with pentagons or more sides, in which the occurrence of cracks is suppressed. [Means for solving the problem]

[0005] [1] A method for manufacturing film chips according to an embodiment of the present invention includes a step of cutting a sheet, while conveying it, using a rotary cutter into a product portion having a polygonal shape with pentagons or more and an outer portion of the product. The sheet comprises a laminated film having a laminated structure of five or more layers and a first light release layer. The first light release layer is disposed on one side of the laminated film in the lamination direction. The first light release layer is located on the outermost layer. The upstream end of the product portion in the conveying direction of the sheet is a side that is approximately parallel to a direction perpendicular to the conveying direction or a corner having an angle of 150° or more. [2] In the method for producing a film chip described in [1] above, the first light release layer may be laminated on a second light release layer. [3] In the method for producing film chips according to the above [1] or [2], the downstream end of the product portion in the conveying direction of the individual sheets may be a corner. [4] In the method for producing film chips described in [3] above, the corner of the downstream end of the product portion in the conveying direction of the individual sheets may have an angle of 60° or more. [5] In the method for producing film chips according to any one of [1] to [4] above, the rotary cutter may have a cutting blade, and a first angle of the cutting blade on the side of the outer portion of the product with respect to a reference line passing through the tip of the cutting blade along the radial direction of the rotary cutter may be 1.5 times or more larger than a second angle of the cutting blade on the side of the outer portion of the product with respect to the reference line. [6] In the method for producing film chips according to any one of [1] to [5] above, the thickness of the individual sheets may be 300 μm or more. [7] In the method for producing a film chip according to any one of [1] to [6] above, the laminated film may further include a polarizing plate. [8] A film chip according to another aspect of the present invention includes a laminated film having a laminated structure of five or more layers and a first light release layer disposed on one side of the laminated film in the lamination direction. The film chip has a polygonal shape with pentagons or more sides when viewed in the thickness direction. The first light release layer is located as the outermost layer. The release force of the first light release layer is 0.10 N / mm or less. [9] The film chip described in [8] above may further include a second light release layer. The first light release layer is laminated on the second light release layer. The release force of the second light release layer may be 0.11 N / mm or more. [Effects of the Invention]

[0006] According to an embodiment of the present invention, it is possible to manufacture a film chip having a polygonal shape with pentagons or more sides, in which the occurrence of cracks is suppressed. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram of a film chip production line capable of carrying out a film chip production method according to one embodiment of the present invention. [Figure 2] Figure 2 is a schematic explanatory diagram for illustrating an aspect in which the upstream end of the product portion has a side that is approximately parallel to a direction perpendicular to the conveying direction in the process of cutting the individual sheet shown in Figure 1 into a hexagonal product portion and a non-product portion. [Figure 3] FIG. 3 is a schematic explanatory view illustrating an embodiment in which the upstream end of the product portion is a corner portion in the step of cutting the sheet shown in FIG. 1 into a hexagonal product portion and an outer product portion. [Figure 4] FIG. 4 is a schematic cross-sectional view of the sheet shown in FIG. [Figure 5] FIG. 5 is a schematic cross-sectional view of the rotary cutter shown in FIG. [Figure 6]FIG. 6 is a schematic cross-sectional view of the cutting blade of the rotary cutter shown in FIG. [Figure 7] FIG. 7 is a schematic cross-sectional view of the blade-shaped sheet and cushion material shown in FIG. [Figure 8] FIG. 8 is a schematic cross-sectional view of the cushion material shown in FIG. 7 sandwiched and compressed between the blade-shaped sheet and the individual sheets. [Figure 9] FIG. 9 is a schematic plan view of the film chip shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] Representative embodiments of the present invention will be described below, but the present invention is not limited to these embodiments. In addition, in order to clarify the explanation, the width, thickness, shape, etc. of each part may be shown schematically in the drawings compared to the embodiments, but these are merely examples and do not limit the interpretation of the present invention.

[0009] A. Overview of film chip manufacturing method Figure 1 is a schematic diagram of a film chip production line capable of carrying out a film chip production method according to one embodiment of the present invention; Figure 2 is a schematic explanatory diagram for explaining an aspect in which, in the process of cutting the sheet shown in Figure 1 into a hexagonal product portion and a non-product portion, the upstream end of the product portion has a side that is approximately parallel to a direction perpendicular to the conveying direction; Figure 3 is a schematic explanatory diagram for explaining an aspect in which, in the process of cutting the sheet shown in Figure 1 into a hexagonal product portion and a non-product portion, the upstream end of the product portion has a corner; Figure 4 is a schematic cross-sectional diagram of the sheet shown in Figure 2.

[0010] A method for producing film chips according to one embodiment of the present invention includes a cutting step. As shown in FIGS. 1 and 2, in the cutting step, a sheet 2 (see FIG. 4) is conveyed and cut by a rotary cutter 31 into a product portion 2a having a polygonal shape with pentagons or more and an outer portion 2b of the product. The sheet 2 includes a laminate film 22 having a laminate structure of five or more layers and a first light release layer 21a. The first light release layer 21a is disposed on one side of the laminate film 22 in the stacking direction and is located as the outermost layer of the sheet 2 (see FIG. 4). The rotary cutter 31 typically includes a cutting blade 313 (see FIG. 5). 2 and 3, the upstream end of the product portion 2a in the conveying direction of the individual sheet 2 (laminated film 22 provided with first light release layer 21a) is, when viewed from the thickness direction of the product portion 2a, a side that is approximately parallel to the direction perpendicular to the conveying direction (see FIG. 2) or a corner having an angle of 150° or more (see FIG. 3). Note that the expression "approximately parallel" also includes the case where the angle between the side located at the upstream end of the product portion 2a and the direction perpendicular to the conveying direction of the individual sheet 2 is 0°±3°. According to this method, even when a product portion having a polygonal shape with pentagons or more sides is cut out using a rotary cutter, the occurrence of cracks in the product portion can be suppressed, and as a result, a film chip having a polygonal shape with pentagons or more sides as the product portion, in which the occurrence of cracks is suppressed, can be manufactured. Furthermore, by cutting out the product portions from the individual sheets in this manner in the cutting step, it is possible to prevent the first light release layer from partially lifting (peeling off).

[0011] When the upstream end of the product portion 2a is a corner (see FIG. 3), the angle of the corner is preferably 160° or more and less than 180°. When the angle of the corner of the upstream end of the product portion is in this range, the occurrence of cracks in the product portion can be stably suppressed.

[0012] The upstream end of the product portion 2a is preferably a side that is approximately parallel to a direction perpendicular to the conveyance direction, and more preferably is the shortest side of the product portion 2a.

[0013] In one embodiment, the downstream end of the product portion 2a in the conveying direction of the individual sheet 2 is a side (see FIG. 2) or a corner (see FIG. 3) that is approximately parallel to the direction perpendicular to the conveying direction when viewed from the thickness direction of the product portion 2a. The downstream end of the product portion 2a is preferably a corner. When the downstream end of the product portion is a corner, the cutting blade of the rotary cutter gradually penetrates into the individual sheet during the cutting process, compared to when the downstream end of the product portion is a side. This can more stably prevent cracks from occurring in the product portion. The angle of the corners at the downstream end of the product portion 2a is, for example, 45° or more, preferably 60° or more, and more preferably 80° or more. On the other hand, the angle of the corners at the downstream end of the product portion 2a is, for example, 120° or less. If the angle of the corners at the downstream end of the product portion is within this range, the cutting process is performed continuously from one end by the rotary cutter, and stress relief can be dispersed.

[0014] In one embodiment, in the cutting step, a single sheet 2 is cut into a plurality of product portions 2a each having a polygonal shape with pentagons or more sides. The shape of the product portion 2a is not particularly limited as long as it is a polygonal shape with pentagons or more sides, and examples of the shape of the product portion 2a include pentagons, hexagons, and octagons.

[0015] 4, in one embodiment, the individual sheet 2 further includes a second light release layer 21b in addition to the first light release layer 21a and the laminate film 22. The second light release layer 21b is typically disposed between the first light release layer 21a and the laminate film 22. The first light release layer 21a is laminated to the second light release layer 21b. Even if the individual sheet has a first light release layer and a second light release layer, if the product portion is cut out as described above in the cutting process, the first light release layer can be prevented from floating (peeling off) from the second light release layer.

[0016] As shown in Figures 5 and 6, in one embodiment, the rotary cutter 31 includes a cylindrical roll 311 and a blade sheet 312 including a cutting blade 313. Although Figures 5 and 6 are cross-sectional views, hatching has been omitted for convenience. The cylindrical roll 311 is configured to rotate by receiving a driving force from the outside. The blade-shaped sheet 312 includes a sheet body 315 and a cutting blade 313. The sheet body 315 is flexible. The cutting blade 313 has any appropriate pattern shape that corresponds to the outer shape of the product portion 2a. The cutting blade 313 protrudes from the sheet body 315 in the thickness direction. The blade sheet 312 is wound and fixed on the circumferential surface of the roll 311. With the blade sheet 312 fixed on the circumferential surface of the roll 311, the cutting blades 313 protrude radially outward from the roll 311. The length of the cutting blade 313 in the radial direction of the rotary cutter 31 (hereinafter referred to as the height of the cutting blade 313) is, for example, 0.5 mm to 3.0 mm, or, for example, 0.6 mm to 1.5 mm, or, for example, 0.6 mm to 0.8 mm.

[0017] 6, the cross section of the cutting blade 313 is substantially wedge-shaped. The cutting edge angle of the cutting blade 313 is divided into a first angle θ1 on the side of the outside-of-product portion 2b and a second angle θ2 on the side of the product portion 2a by a reference line L that passes through the tip of the cutting blade 313 along the radial direction of the rotary cutter 31 (more specifically, the roll 311). The first angle θ1 on the outer-product portion 2b side is, for example, 1.0 times or more, preferably 1.5 times or more, and more preferably 2.0 times or more, relative to the second angle θ2 on the product portion 2a side. When the first angle θ1 to the second angle θ2 is in this ratio, kicking up the release layer when the cutting blade leaves the sheet can be prevented. Therefore, lifting (peeling) of the release layer when cutting the sheet can be stably prevented, and cracks can be stably prevented from occurring in the product portion. The first angle θ1 on the side of the outer product portion 2b is, for example, 0° to 30°, preferably 15° to 30°, and more preferably 18° to 30°. The second angle θ2 on the product portion 2a side is, for example, 0° to 30°, preferably 0° to 15°, and more preferably 0° to 12°.

[0018] As shown in FIG. 5, in one embodiment, the rotary cutter 31 further includes a flexible cushion material 314 in addition to the roll 311 and the blade sheet 312 . The cushion material 314 is typically located on the opposite side of the blade-shaped sheet 312 from the roll 311. In the illustrated example, the cushion material 314 is fixed to the sheet body 315. The cushion material 314 is in contact with the cutting blade 313.

[0019] 7, cushion material 314 has slits 314a in a portion corresponding to cutting blade 313. Slits 314a penetrate cushion material 314 in the radial direction of roll 311. Cutting blade 313 is disposed within slit 314a and is in contact with the inner surface of slit 314a. 7 and 8, for convenience, the blade-shaped sheet 312 and the cushion material 314 are shown extending linearly in the left-right direction of the paper, but in reality, the blade-shaped sheet 312 and the cushion material 314 extend in an arc shape along the outer peripheral surface of the roll 311.

[0020] As shown in Figure 8, during the cutting process, the cushion material 314 is sandwiched and compressed between the sheet body 315 of the blade-shaped sheet 312 and the individual sheets 2, and comes into contact with the product portion 2a and the non-product portion 2b. This allows the cushion material to prevent the product portion and the non-product portion from moving unintentionally during the cutting process. This prevents friction between the cutting blade and the product portion and / or between the product portion and the non-product portion. As a result, cracks in the product portion can be more reliably prevented. The cushion material 314 may be provided partially on the rotary cutter 31 so that it comes into contact with the product portion 2a but does not come into contact with the outside-product portion 2b during the cutting process.

[0021] The hardness of the cushion material 314 is, for example, 10° to 80°, and preferably 30° to 60°. The hardness of the cushion material is measured, for example, by a durometer. If the hardness of the cushioning material is within this range, the cushioning material can appropriately press the product portion and the outer portion during the cutting process, thereby stably suppressing the movement of the product portion and the outer portion during the cutting process and suppressing the occurrence of dents in the product portion.

[0022] Before the cutting step, the thickness of cushion material 314 (i.e., the thickness of cushion material 314 before compression) is, for example, 1 to 5 times, and preferably 0.8 to 2 times, the height of cutting blade 313. Before the cutting step, the thickness of cushion material 314 is, for example, 0.4 mm to 8.0 mm, and preferably 1.0 mm to 6.0 mm. In the cutting process, the cushion material 314 may be compressed as described above. The compression rate of the cushion material in the cutting process is, for example, 70% or less, preferably 60% or less, and more preferably 50% or less. On the other hand, the compression rate of the cushion material in the cutting process is, for example, 20% or more, and preferably 35% or more. The compression rate of the cushion material is calculated, for example, by the following formula: Compression ratio = (thickness of cushion material in compressed state / thickness of cushion material before compression) x 100 If the compression rate of the cushioning material is within this range, the pressing force of the cushioning material on the product portion and the portion outside the product can be appropriately adjusted, which can prevent dents from occurring in the product portion, more stably prevent movement of the product portion and the portion outside the product, and more stably prevent lifting (peeling) of the light release layer.

[0023] 1, rotary cutter 31 typically cuts a sheet 2 (a laminated film 22 to which a plurality of light release layers 21 are attached) that is placed on a carrier sheet 1 and transported. That is, in one embodiment, the moving direction of carrier sheet 1 and the transport direction of sheet 2 are the same. The conveying speed (movement speed) of the sheet 2 in the cutting step is, for example, 10 m / min or less, preferably 5 m / min or less. On the other hand, the conveying speed of the sheet 2 in the cutting step is, for example, 1 m / min or more. When the sheet is conveyed at such a speed in the cutting step, the rotary cutter can cut the sheet stably.

[0024] In the cutting process, the rotary cutter 31 typically rotates so as to send the sheet 2 to be cut downstream in the direction of movement of the carrier sheet 1. In the illustrated example, the rotary cutter 31 rotates counterclockwise as viewed from the front side of the paper. The peripheral speed of the rotary cutter 31 in the cutting step is, for example, ±1.0 m / min of the conveyance speed of the sheet 2, and preferably ±0.5 m / min of the conveyance speed of the sheet 2. The peripheral speed of the rotary cutter 31 is, for example, 1 m / min to 10 m / min, and preferably 1 m / min to 5 m / min. If the peripheral speed of the rotary cutter in the cutting step is within this range, the moving sheet can be cut with high precision.

[0025] In one embodiment, the method for producing film chips further includes a disposing step. The disposing step is performed before the cutting step. In the disposing step, typically, a single sheet 2 (a laminated film 22 having a plurality of light release layers 21 attached thereto) is disposed on a moving carrier sheet 1. The carrier sheet 1 may move intermittently or continuously. The carrier sheet 1 preferably moves continuously.

[0026] In the arrangement step, typically, a plurality of individual sheets 2 are arranged on a carrier sheet 1 so as to be aligned in the direction of movement of the carrier sheet 1 (see FIG. 2). The plurality of individual sheets 2 are arranged at intervals from one another on the carrier sheet 1. All of the intervals between adjacent individual sheets 2 among the plurality of individual sheets 2 are preferably substantially the same.

[0027] In one embodiment, the film chip manufacturing method further includes a takt time difference absorbing step, in which the carrier sheet 1 is routed so as to pass through a buffer roller 73 between the placement step and the cutting step. This makes it possible to absorb the takt time difference between the placement step and the cutting step, and to supply the individual sheets to the rotary cutter at the appropriate timing.

[0028] In one embodiment, the buffer roller 73 is movable in a direction intersecting the direction in which the axis of the rotary cutter 31 extends. When the rotary cutter 31 cuts the individual sheet 2 as described above in the cutting process, the individual sheet 2 and the carrier sheet 1 may be pulled by the rotation of the rotary cutter 31. In this case, the buffer roller 73 receives force from the carrier sheet 1 that is pulled around it and moves in a direction approaching the rotary cutter 31. In the takt time difference absorbing process, the position of the buffer roller 73 may be detected. In the takt time difference absorbing process, if the position of the buffer roller 73 is closer to the rotary cutter 31 than a predetermined position, the individual sheet 2 and the carrier sheet 1 may be pulled beyond an allowable range by the rotation of the rotary cutter 31. Therefore, cutting of the individual sheet 2 by the rotary cutter 31 is stopped. This can prevent the occurrence of defective product portions and improve the yield of film chips.

[0029] In one embodiment, the method for producing a film chip further includes a separation step in which the outer product portion 2b is separated from the product portion 2a after the cutting step. Furthermore, when a plurality of individual sheets 2 are arranged on the carrier sheet 1 in the arrangement step, the film chip manufacturing method may further include a connection step. In the connection step, between the arrangement step and the separation step, the non-product portions 2b of adjacent individual sheets 2 among the plurality of individual sheets 2 are connected by a connecting material 63. In the illustrated example, the connection step is performed between the arrangement step and the tact difference absorption step. According to this method, the plurality of out-of-product portions are connected by the connecting material, so that the plurality of out-of-product portions can be continuously separated from the product portion in the separation step.

[0030] 2, the connecting material 63 is typically a long connecting tape 63a. The connecting tape 63a may have any appropriate configuration. The connecting tape 63a is affixed to the non-product portions 2b of adjacent sheet sheets 2 together so as not to overlap the product portions 2a of the sheet sheets 2. In one embodiment, the connecting tape 63a is affixed to the widthwise ends (direction perpendicular to the moving direction of the carrier sheet 1) of multiple individual sheets 2 lined up in the moving direction of the carrier sheet 1. This allows the non-product portions of three or more individual sheets to be connected by one connecting tape. In the illustrated example, both widthwise ends of the individual sheets 2 are connected by the connecting tape 63a.

[0031] As shown in FIG. 1, in one embodiment, the method for producing film chips further includes an image recognition step. In the image recognition step, the product portion 2a is image-recognized. The image recognition step is carried out at least after the cutting step, and in the illustrated example, it is carried out after the separation step. Since continuous processing using a rotary cutter is used in the cutting step, vibrations during cutting of the sheet can be reduced compared to when cutting the sheet by intermittent processing (e.g., press processing). Therefore, even if the image recognition step is carried out after the cutting step, the film chips can be image-recognized with high accuracy.

[0032] In the image recognition process, typically, the product portion 2a is image-recognized to acquire information about the product portion 2a. The acquired information about the product portion 2a includes, for example, the outer shape of the product portion, detection of defect markings, and confirmation of the position of product markings.

[0033] B. Details of the sheet Next, with reference to FIG. 4, the individual sheets used in the film chip manufacturing method will be described in detail. The individual sheet 2 is a mother sheet from which at least one product portion 2a can be punched. The shape and size of the individual sheet 2 are not particularly limited as long as the product portion 2a can be punched out. In other words, one or more product portions 2a can be cut out from one individual sheet 2 in the cutting process. The number of product portions 2a that can be cut out from one individual sheet 2 is, for example, 1 to 6, or 15 to 30. The thickness of the individual sheets 2 is, for example, 250 μm or more, preferably 300 μm or more, while the thickness of the individual sheets 2 is, for example, 700 μm or less, preferably 500 μm or less.

[0034] The individual sheets 2 have a laminated structure of six or more layers. The number of layers of the individual sheets 2 is six or more, preferably seven or more, and more preferably eight or more, excluding layers that do not stand on their own, such as adhesive layers (adhesive layers and pressure-sensitive adhesive layers) and surface treatment layers. On the other hand, the number of layers of the individual sheets 2 is typically ten or less, excluding layers that do not stand on their own, such as adhesive layers (adhesive layers and pressure-sensitive adhesive layers) and surface treatment layers. In the illustrated example, the individual sheet 2 includes a laminated film 22 and a plurality of light release layers 21 .

[0035] B-1.Laminated film The laminated film 22 has a laminated structure of five or more layers. The number of layers of the laminated film 22 is five or more, preferably six or more, excluding layers that do not stand on their own, such as adhesive layers (adhesive layers and pressure-sensitive adhesive layers) and surface treatment layers. On the other hand, the number of layers of the laminated film 22 is typically eight or less, excluding layers that do not stand on their own, such as adhesive layers (adhesive layers and pressure-sensitive adhesive layers) and surface treatment layers.

[0036] In the illustrated example, the laminated film 22 includes a polarizing plate 221 , a retardation film 226 , and an optical function film 222 . The polarizing plate 221 typically includes a polarizer 221a. According to one embodiment, even if the laminated film includes a polarizing plate, it is possible to stably prevent cracks from occurring in the polarizer during the cutting process. Any appropriate polarizer can be adopted as the polarizer 221a. The polarizer may be made of, for example, a single-layer resin film, or may be obtained by using a laminate of two or more layers.

[0037] Specific examples of polarizers made of a single-layer resin film include hydrophilic polymer films such as polyvinyl alcohol (PVA) resin films, partially formalized PVA resin films, and partially saponified ethylene-vinyl acetate copolymer films that have been dyed with iodine or a dichroic substance such as a dichroic dye and stretched, and polyene-based oriented films such as dehydrated PVA films and dehydrochlorinated polyvinyl chloride films. Polarizers obtained by dyeing a PVA resin film with iodine and uniaxially stretching it are preferred because of their excellent optical properties.

[0038] Specific examples of polarizers obtained using laminates include a laminate of a resin substrate and a PVA-based resin layer (PVA-based resin film) laminated on the resin substrate, or a polarizer obtained using a laminate of a resin substrate and a PVA-based resin layer coated on the resin substrate. A polarizer obtained using a laminate of a resin substrate and a PVA-based resin layer coated on the resin substrate can be produced, for example, by applying a PVA-based resin solution to the resin substrate and drying the resin substrate to form a PVA-based resin layer on the resin substrate, thereby obtaining a laminate of the resin substrate and the PVA-based resin layer, and then stretching and dyeing the laminate to convert the PVA-based resin layer into a polarizer. In one embodiment, a polyvinyl alcohol-based resin layer containing a halide and a polyvinyl alcohol-based resin is formed on one side of the resin substrate. Stretching typically involves immersing the laminate in an aqueous boric acid solution and stretching it. Furthermore, the stretching may optionally further include in-air stretching the laminate at an elevated temperature (e.g., 95°C or higher) before stretching in the aqueous boric acid solution. Additionally, in one embodiment of the present invention, the laminate is preferably subjected to a drying shrinkage treatment in which the laminate is heated while being transported in the longitudinal direction, thereby shrinking the laminate by 2% or more in the width direction. Typically, the manufacturing method of this embodiment includes subjecting the laminate to an in-air auxiliary stretching treatment, a dyeing treatment, an underwater stretching treatment, and a drying shrinkage treatment, in this order. By introducing auxiliary stretching, it is possible to increase the crystallinity of PVA, even when PVA is coated on a thermoplastic resin, thereby achieving high optical properties. Furthermore, by simultaneously increasing the orientation of PVA in advance, problems such as a decrease in orientation or dissolution of PVA when immersed in water in the subsequent dyeing or stretching steps can be prevented, thereby achieving high optical properties. Furthermore, when the PVA-based resin layer is immersed in a liquid, the disordering of the orientation of polyvinyl alcohol molecules and the decrease in orientation can be suppressed compared to when the PVA-based resin layer does not contain a halide. This can improve the optical properties of a polarizer obtained through treatment steps in which the laminate is immersed in a liquid, such as a dyeing treatment and an underwater stretching treatment. Furthermore, the optical properties can be improved by shrinking the laminate in the width direction through drying shrinkage treatment.The obtained resin substrate / polarizer laminate may be used as is (i.e., the resin substrate may be used as a protective layer for the polarizer), or the resin substrate may be peeled off from the resin substrate / polarizer laminate and any appropriate protective layer depending on the purpose may be laminated on the peeled surface. Details of such a polarizer manufacturing method are described in, for example, JP 2012-73580 A and Japanese Patent No. 6470455 A. The entire disclosures of these publications are incorporated herein by reference.

[0039] The dyeing with iodine is carried out, for example, by immersing the PVA-based resin film in an aqueous iodine solution. The stretching ratio in the uniaxial stretching is preferably 3 to 7 times. The stretching may be carried out after the dyeing treatment or while dyeing. Alternatively, the stretching may be carried out before dyeing. If necessary, the PVA-based resin film may be subjected to a swelling treatment, a crosslinking treatment, a washing treatment, a drying treatment, or the like. For example, by immersing the PVA-based resin film in water and washing it before dyeing, it is possible to wash away dirt and antiblocking agents on the surface of the PVA-based resin film, and also to swell the PVA-based resin film, thereby suppressing uneven dyeing.

[0040] The thickness of the polarizer 221a is, for example, 1 μm to 80 μm, preferably 1 μm to 15 μm, more preferably 1 μm to 12 μm, and even more preferably 3 μm to 12 μm.

[0041] The polarizer 221a typically exhibits absorptive dichroism at any wavelength between 380 nm and 780 nm. The single transmittance of the polarizer 221a is, for example, 41.5% to 46.0%, preferably 43.0% to 46.0%, and more preferably 44.5% to 46.0%. The degree of polarization of the polarizer 221a is preferably 97.0% or more, more preferably 99.0% or more, and even more preferably 99.9% or more.

[0042] The polarizing plate 221 may include a protective layer 221b in addition to the polarizer 221a. The protective layer 221b is provided on at least one surface of the polarizer 221a. That is, the protective layer 221b may be provided on only one surface of the polarizer 221a, or may be provided on both surfaces of the polarizer 221a. In the illustrated example, the protective layer 221b is provided on both surfaces of the polarizer 221a. The protective layer 221b is typically attached to the polarizer 221a via any appropriate adhesive layer (not shown).

[0043] The protective layer is formed of any suitable film that can be used as a protective layer for a polarizer. Typical examples of the main component of the film include transparent resins, such as cycloolefin (COP) resins (e.g., polynorbornene-based), polyester resins (e.g., polyethylene terephthalate (PET)-based), cellulose resins (e.g., triacetyl cellulose (TAC)), polycarbonate (PC) resins, (meth)acrylic resins, polyvinyl alcohol resins, polyamide resins, polyimide resins, polyethersulfone resins, polysulfone resins, polystyrene resins, polyolefin resins, and acetate resins. Other examples include thermosetting or ultraviolet-curable resins such as (meth)acrylic, urethane, (meth)acrylic urethane, epoxy, and silicone resins. In this specification, "(meth)acrylic" includes both acrylic and methacrylic. Other examples include glassy polymers such as siloxane-based polymers. The polymer film described in JP 2001-343529 A (WO 01 / 37007) can also be used. Examples of materials for this film include resin compositions containing a thermoplastic resin having substituted or unsubstituted imide groups in its side chains and a thermoplastic resin having substituted or unsubstituted phenyl and nitrile groups in its side chains. Examples include a resin composition containing an alternating copolymer of isobutene and N-methylmaleimide and an acrylonitrile-styrene copolymer. The polymer film can be, for example, an extrusion molded product of the above resin composition. The resin film materials can be used alone or in combination.

[0044] The thickness of the protective layer 221b is typically 5 mm or less, preferably 1 mm or less, more preferably 1 μm to 500 μm, and even more preferably 5 μm to 150 μm.

[0045] Furthermore, a surface treatment layer 221c may be provided on the surface of the protective layer 221b as needed. In the illustrated example, the surface treatment layer 221c is provided on the surface of the protective layer 221b on the optical function film 222 side. Examples of the surface treatment layer 221c include a hard coat layer, an anti-reflection layer, an anti-sticking layer, and an anti-glare treatment layer, and a hard coat layer is preferred. The thickness of the surface treatment layer 221c can be set arbitrarily and appropriately, and is, for example, 1 μm to 10 μm.

[0046] The retardation film 226 is typically attached to the polarizing plate 221 via a first adhesive layer 223. In the illustrated example, the retardation film 226 is attached to the surface treatment layer 221c via the first adhesive layer 223.

[0047] Any appropriate material may be adopted as the material of the retardation film 226. In one embodiment, the retardation film 226 is made of a stretched polymer film.

[0048] Any appropriate resin may be used as the resin for forming the polymer film. Specific examples include resins that form positive birefringence films, such as norbornene-based resins, polycarbonate-based resins, cellulose-based resins, polyvinyl alcohol-based resins, and polysulfone-based resins. Among these materials for the retardation film 226, polycarbonate-based resins are preferred.

[0049] The optical function film 222 can impart any appropriate performance to the film chip 10. In one embodiment, the optical function film 222 is disposed on the opposite side of the retardation film 226 from the polarizing plate 221. In the illustrated example, the optical function film 222 is attached to the retardation film 226 via a second adhesive layer 224.

[0050] The optical function film 222 includes a substrate 222a and a function layer 222b. The substrate 222a is a resin film that supports the functional layer 222b. The substrate 222a may be made of any appropriate material. Examples of materials for the substrate 222a include the transparent resins described above. The thickness of the base material 222a is, for example, 20 μm or more, preferably 30 μm or more, whereas the thickness of the base material 222a is, for example, 80 μm or less, preferably 50 μm or less.

[0051] The functional layer 222b is typically provided on the surface of the base material 222a opposite to the polarizing plate 221. Examples of the functional layer 222b include a hard coat layer, an anti-reflection layer, an anti-sticking layer, and an anti-glare layer. The functional layer 222b may have a laminated structure of two or more layers. Of the functional layers 222b, an anti-reflection layer is preferred. The thickness of the functional layer 222b can be set arbitrarily and appropriately, and is, for example, 0.05 μm to 15 μm, or 1 μm to 8 μm.

[0052] In the illustrated example, the laminate film 22 further includes a third adhesive layer 225. The third adhesive layer 225 is located on the opposite side of the polarizing plate 221 from the retardation film 226. In the illustrated example, the third adhesive layer 225 is laminated on the protective layer 221b of the polarizing plate 221.

[0053] Each of the first adhesive layer 223, the second adhesive layer 224, and the third adhesive layer 225 may be composed of any appropriate adhesive. Examples of adhesives include (meth)acrylic adhesives, rubber adhesives, silicone adhesives, polyester adhesives, urethane adhesives, epoxy adhesives, and polyether adhesives. By adjusting the type, number, combination, and compounding ratio of the monomers that form the base resin of the adhesive, as well as the amount of crosslinking agent, reaction temperature, reaction time, etc., an adhesive having desired properties depending on the purpose can be prepared. The base resin of the adhesive may be used alone or in combination of two or more types. Of the adhesives, a (meth)acrylic adhesive is preferable.

[0054] The shear storage modulus of each of the first pressure-sensitive adhesive layer 223, the second pressure-sensitive adhesive layer 224, and the third pressure-sensitive adhesive layer 225 is, for example, 10 kPa to 300 kPa, and preferably 50 kPa to 300 kPa at 25°C. If the storage modulus of each pressure-sensitive adhesive layer is below the above lower limit, peeling failure tends to occur. The shear storage modulus is measured, for example, using a dynamic viscoelasticity device (product name: manufactured by ARES Rheometric Scientific) at a temperature rise rate of 5°C / min, a frequency of 1 Hz, and a measurement temperature range of -40°C to 100°C. The thickness of each of the first adhesive layer 223, the second adhesive layer 224, and the third adhesive layer 225 is, for example, 3 μm to 30 μm, or, for example, 5 μm to 20 μm.

[0055] As described above, the laminated film 22 in the illustrated example includes, in this order, the optical function film 222, the second pressure-sensitive adhesive layer 224, the retardation film 226, the first pressure-sensitive adhesive layer 223, the protective layer 221b, the polarizer 221a, the protective layer 221b, and the third pressure-sensitive adhesive layer 225. In other words, the laminated film 22 in the illustrated example has a five-layer laminated structure excluding the adhesive layers (adhesive layer and pressure-sensitive adhesive layer).

[0056] Although not shown, the laminated film 22 may further include another retardation film, if necessary. The other retardation film is typically disposed between the retardation film 226 and the optically functional film 222. The other retardation film may have any appropriate retardation depending on the application of the film chip 10.

[0057] B-2. Light peeling layer The light release layer 21 is disposed on one side in the lamination direction of the laminated film 22. In the illustrated example, a plurality of light release layers 21 are laminated on the optical function film 222.

[0058] Although not shown, each of the plurality of light release layers 21 includes a base film and an adhesive layer. The base film may be made of any suitable material. Examples of materials for the base film include polyester-based resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); cellulose-based resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resins; (meth)acrylic resins such as polymethyl methacrylate; and cycloolefin-based resins such as polynorbornene. These may be used alone or in combination. The thickness of the base film is, for example, 20 μm to 70 μm, and preferably 30 μm to 60 μm. The adhesive layer provided in the light release layer 21 can be explained in the same manner as the first adhesive layer 223 described above. The thickness of the light release layer 21 is, for example, 30 μm to 80 μm, and preferably 40 μm to 70 μm.

[0059] In the illustrated example, the plurality of light release layers 21 include, as described above, first light release layer 21a and second light release layer 21b. First light release layer 21a is typically attached to second light release layer 21b.

[0060] The peel strength of first release layer 21a to second release layer 21b is, for example, 0.15 N / 50 mm or less, and preferably 0.10 N / 50 mm or less. On the other hand, the peel strength of first release layer 21a to second release layer 21b is typically 0.05 N / 50 mm or more. The peel strength is measured, for example, by a peel strength test using an autograph.

[0061] In the illustrated example, the plurality of light release layers 21 further includes a third light release layer 21c. The third light release layer 21c is located between the second light release layer 21b and the laminated film 22. That is, the first light release layer 21a, the second light release layer 21b, and the third light release layer 21c are laminated in this order. The second light release layer 21b is typically attached to the third light release layer 21c. The peel force of second light release layer 21b to third light release layer 21c is, for example, 0.11 N / 50 mm or more, preferably 0.15 N / 50 mm or more. On the other hand, the peel force of second light release layer 21b to third light release layer 21c is typically 0.2 N / 50 mm or less.

[0062] In the illustrated example, the third light release layer 21c is attached to the optical function film 222. The range of the release force of the third light release layer 21c with respect to the optical function film 222 is, for example, the same as the range of the release force of the first light release layer 21a described above. The plurality of light release layers 21 may not include the third light release layer 21c. In this case, the second light release layer 21b is attached to the optical function film 222 with the above-mentioned peeling force.

[0063] B-3.Release liner The individual sheet 2 may further include a release liner 23. In one embodiment, the release liner 23 is temporarily attached to the surface of the third pressure-sensitive adhesive layer 225 opposite the polarizing plate 221. In the illustrated example, the release liner 23 is located as the outermost layer of the individual sheet 2, opposite the first light release layer 21a. Release liner 23 may be made of any suitable plastic film. Specific examples of plastic films include polyethylene terephthalate (PET) film, polyethylene film, and polypropylene film. Although not shown, the surface of release liner 23 on the side of third pressure-sensitive adhesive layer 225 may be treated with any suitable release agent (e.g., a silicone-based release agent) as needed. The thickness of the release liner 23 is, for example, 20 μm to 100 μm, or, for example, 30 μm to 50 μm.

[0064] As described above, the illustrated example of the individual sheet 2 includes, in this order, the first light release layer 21a, the second light release layer 21b, the third light release layer 21c, the optical function film 222, the second pressure-sensitive adhesive layer 224, the retardation film 226, the first pressure-sensitive adhesive layer 223, the protective layer 221b, the polarizer 221a, the protective layer 221b, the third pressure-sensitive adhesive layer 225, and the release liner 23. In other words, the illustrated example of the individual sheet 2 has a laminated structure of nine layers, excluding the adhesive layers (adhesive layer and pressure-sensitive adhesive layer).

[0065] C. Film chip production line Next, with reference to FIG. 1, a film chip production line 100 capable of carrying out the above-described film chip production method will be described. Film chip production line 100 is an integrated line capable of producing film chips 10. In one embodiment, film chip production line 100 includes a carrier sheet conveying unit 7, a sheet supply unit 5, a tape application unit 6, a cutting device 3, a separation unit 8, an image recognition unit 4, and a chip recovery unit 9.

[0066] C-1. Carrier sheet transport section In the illustrated example, the carrier sheet conveying section 7 includes a carrier sheet payout roller 71 (hereinafter referred to as the CS payout roller 71), a carrier sheet take-up roller 72 (hereinafter referred to as the CS take-up roller 72), the above-mentioned buffer roller 73, and a plurality of guide rollers 74. A long carrier sheet 1 is wound in a roll shape around the CS payout roller 71. The CS winding roller 72 is rotatable by receiving an external driving force, and can wind up the carrier sheet 1 pulled out from the CS payout roller 71. This allows the carrier sheet 1 to move from the CS payout roller 71 toward the CS winding roller 72. The buffer roller 73 is located between the CS payout roller 71 and the CS take-up roller 72. The buffer roller 73 is a dancer roll. In the illustrated example, the carrier sheet 1 is bent and routed around the buffer roller 73 between the tape application unit 6 and the cutting device 3. The plurality of guide rollers 74 are arbitrarily and appropriately arranged to guide the movement of the carrier sheet 1. In the illustrated example, the plurality of guide rollers 74 include two first guide rollers 74a located between the tape application unit 6 and the cutting device 3. The two first guide rollers 74a guide the carrier sheet 1 so that the carrier sheet 1 passes around the buffer roller 73. The two first guide rollers 74a are positioned horizontally at a distance from each other and are positioned above the buffer roller 73.

[0067] C-2. Sheet supply unit The sheet supply unit 5 can supply the above-mentioned individual sheets 2 onto the carrier sheet 1 that is moved by the carrier sheet transport unit 7. In the illustrated example, the sheet supply unit 5 includes a sheet tray 51, a stage 52, a conveyor 53, two first pinch rollers 55, and a pickup device 54.

[0068] The sheet tray 51 can accommodate a plurality of individual sheets 2. The plurality of individual sheets 2 are typically accommodated in the sheet tray 51 in a state where they are stacked in the thickness direction. The stage 52 has a generally flat plate shape that extends horizontally. The conveyor 53 is capable of transporting the individual sheets 2 placed thereon in a horizontal direction. The conveyor 53 may operate intermittently or continuously. The conveyor 53 preferably operates continuously. The conveyor 53 may have any appropriate configuration. A typical example of the conveyor 53 is a roller conveyor. The two first pinch rollers 55 are disposed downstream of the conveyor 53 in the conveying direction of the conveyor 53. The two first pinch rollers 55 typically face each other in the vertical direction. The carrier sheet 1 passes between the two first pinch rollers 55. The pickup device 54 is capable of picking up the individual sheets 2 stored in the sheet tray 51 one by one, and is capable of moving while holding the individual sheets 2. The pickup device 54 may have any appropriate configuration. A representative example of the pickup device 54 is a vacuum suction type pickup device.

[0069] C-3. Tape attachment part The tape application unit 6 is capable of applying the above-mentioned connecting tape 63a to the plurality of individual sheets 2 arranged on the carrier sheet 1. In the illustrated example, the tape application unit 6 includes a tape feed roller 61 and two second pinch rollers 62.

[0070] A long connected tape 63a is wound in a roll around the tape feed roller 61. The connected tape 63a is pulled out from the tape feed roller 61 and fed toward a gap between the two second pinch rollers 62. The two second pinch rollers 62 are located downstream of the first pinch roller 55 in the moving direction of the carrier sheet 1, and in the illustrated example, are located between the first pinch roller 55 and the buffer roller 73. The two second pinch rollers 62 typically face each other in the vertical direction. The carrier sheet 1 passes between the two second pinch rollers 62.

[0071] C-4.Cutting device The cutting device 3 is capable of cutting the individual sheets 2 placed on the carrier sheet 1. The cutting device 3 is located downstream of the buffer roller 73 in the moving direction of the carrier sheet 1. In the illustrated example, the cutting device 3 is a rotary processing device, and includes the rotary cutter 31 and the opposing roller 32 described above. The rotary cutter 31 and the opposing roller 32 typically face each other in the vertical direction. The carrier sheet 1 passes between the rotary cutter 31 and the opposing roller 32. Furthermore, among the multiple guide rollers 74, the guide roller 74 located between the cutting device 3 and the separating section 8 may function as a peeling roller 74b. The peeling roller 74b peels the cut individual sheets 2 from the carrier sheet 1. As a result, the cut individual sheets 2 are transferred from the carrier sheet 1 to the separating section 8 (typically, the conveyor 83).

[0072] C-5. Separation part The separator 8 is configured to separate the outer product portion 2b and the product portion 2a cut by the cutting device 3. The separator 8 is located on the opposite side of the buffer roller 73 with respect to the cutting device 3. In the illustrated example, the separator 8 includes a conveyor 83, a separation roller 81, and a winding roller 82. Note that the separator 8 may also be a more acute-angled one, such as a separation bar.

[0073] The conveyor 83 is capable of horizontally transporting the individual sheets 2 received from the carrier sheet 1. The conveyor 83 may operate intermittently or continuously. The conveyor 83 preferably operates continuously. The conveyor 83 may have any appropriate configuration. A representative example of the conveyor 83 is a belt conveyor. The separation roller 81 is disposed above the conveyor 83 with a small gap therebetween. The separation roller 81 can separate the non-product portion 2b from the product portion 2a when the individual sheets 2 transported by the conveyor 83 pass between the separation roller 81 and the conveyor 83. The winding roller 82 is capable of winding up the non-product portion 2b separated by the separation roller 81.

[0074] C-6. Image Recognition Unit The image recognition unit 4 is capable of image-recognizing the product portion 2a. More specifically, by performing image recognition on the product portion 2a, the image recognition unit 4 can perform, for example, defect marking detection, center of gravity detection, IJP printing position detection, printing defect detection, outer diameter measurement, printing detection, defect detection, etc. In the illustrated example, the image recognition unit 4 performs image recognition of the product portion 2a separated from the non-product portion 2b. The image recognition unit 4 is located downstream of the separation roller 81 in the conveying direction of the conveyor 83. The image recognition unit 4 is disposed above the conveyor 83 with a gap therebetween. The image recognition unit 4 performs image recognition of the information on the product portion 2a that has reached below the image recognition unit 4. During image recognition by the image recognition unit 4, the conveyor 83 may be stopped or may maintain its conveying state. When the conveyor 83 maintains its conveying state, the image recognition unit 4 performs image recognition of the information on the product portion 2a as the product portion 2a conveyed by the conveyor 83 passes below the image recognition unit 4. This enables efficient image recognition of the product portion 2a. However, vibrations caused by driving the conveyor 83 may affect the image recognition unit 4. The image recognition unit 4 may include, for example, a camera, a light source, a monitor, and an image processing unit.

[0075] C-7. Chip collection section The chip recovery unit 9 is capable of recovering the product portion 2a. In the illustrated example, the chip recovery unit 9 is capable of recovering the product portion 2a after image recognition by the image recognition unit 4. The chip recovery unit 9 includes a pickup device 91, a non-defective product tray 92, and a defective product tray 93.

[0076] The pickup device 91 is capable of picking up the product portions 2a on the conveyor 83 one by one, and is capable of moving while holding the product portions 2a. The pickup device 91 may have any appropriate configuration. A representative example of the pickup device 91 is a vacuum suction type pickup device. The non-defective tray 92 can accommodate, as film chips 10, product portions 2a that have been determined to be non-defective based on information about the product portions 2a image-recognized by the image recognition unit 4. The film chips 10 are typically accommodated in the non-defective tray 92 in a state where they are stacked in the thickness direction. The defective product tray 93 can accommodate product parts 2 a that have been determined to be defective based on the information of the product parts 2 a that have been image-recognized by the image recognition unit 4 .

[0077] D. Details of the film chip manufacturing process Next, a method for manufacturing the film chip 10 will be described in detail with reference to FIG. In the illustrated example, the above-mentioned arrangement step, connection step, tact difference absorption step, cutting step, separation step, and image recognition step are carried out consecutively.

[0078] D-1. Placement process In the placement step, as described above, the individual sheet 2 is placed on the carrier sheet 1. At this time, the first light release layer 21a is located on the opposite side of the carrier sheet 1. When the individual sheet 2 includes the laminated film 22, the plurality of light release layers 21, and the release liner 23, the release liner 23 comes into contact with the carrier sheet 1. In the illustrated example, the individual sheets 2 stored in the sheet tray 51 are first removed onto the stage 52 by the pickup device 54. Then, at a predetermined timing, the individual sheets 2 are transported from the stage 52 to the conveyor 53 by the pickup device 54. In one embodiment, the individual sheets 2 are intermittently placed on the continuously operating conveyor 53. The individual sheets 2 are then transported by the conveyor 53 toward a gap between two first pinch rollers 55. When the individual sheets 2 pass between the two first pinch rollers 55, they are placed on the carrier sheet 1 and are appropriately pressed by the first pinch rollers 55. As a result, the individual sheets 2 are transferred from the conveyor 53 to the carrier sheet 1 and placed on the carrier sheet 1. Furthermore, by repeating this placement process, a plurality of individual sheets 2 are placed on the carrier sheet 1 so as to be aligned in the direction in which the carrier sheet 1 moves.

[0079] D-2.Connection process In the connecting step, adjacent sheets 2 among the plurality of sheets 2 are connected by the long connecting tape 63a, as described above. In the illustrated example, the connecting tape 63a is continuously supplied from the tape feed roller 61 to between the two second pinch rollers 62. Then, when the individual sheet 2 passes between the two second pinch rollers 62 as the carrier sheet 1 moves, the connecting tape 63a is attached to the widthwise end of the individual sheet 2. Thereafter, when the next individual sheet 2 passes between the two second pinch rollers 62, the connecting tape 63a is attached to the widthwise end of the individual sheet 2. As a result, the connecting tape 63a is continuously attached to the width direction ends of the individual sheets 2 passing between the two second pinch rollers 62 in sequence, and the multiple individual sheets 2 are connected together by the connecting tape 63a.

[0080] D-3. Takt difference absorption process In the tact time difference absorbing process, the carrier sheet 1 supporting the single sheet 2 is guided by two guide rollers 74 so as to pass around the buffer roller 73. Note that in the tact time difference absorbing process, the position of the buffer roller 73 may be detected as described above, and the operation of the rotary cutter 31 may be controlled based on the detected position of the buffer roller 73.

[0081] D-4.Cutting process In the cutting step, as described above, the individual sheets 2 on the carrier sheet 1 are cut into the product portion 2a and the non-product portion 2b by the rotary cutter 31 (see FIG. 2). In the illustrated example, when the individual sheet 2 passes between the rotary cutter 31 and the opposing roller 32 as the carrier sheet 1 moves, the individual sheet 2 is cut into a product portion 2a and a non-product portion 2b by the rotary cutter 31. More specifically, the portion of the individual sheet 2 to which the connecting tape 63a is not attached (in the illustrated example, the portion of the individual sheet 2 between the two connecting tapes 63a) is cut by the rotary cutter 31.

[0082] D-5. Separation process As shown in FIG. 1, in the separation step, the outer product portion 2b is separated from the product portion 2a as described above. In the illustrated example, the individual sheet 2 that has passed through the cutting device 3 is peeled from the carrier sheet 1 by the peeling roller 74b and transferred from the carrier sheet 1 to the conveyor 83. In other words, between the cutting process and the separation process, the carrier sheet 1 is peeled from the individual sheet 2. The individual sheet 2 is then transported by the conveyor 83 and passes between the separation roller 81 and the conveyor 83. At this time, the non-product portion 2b is separated from the product portion 2a by the separation roller 81. Thereafter, the multiple non-product portions 2b connected by the connecting tape 63a are continuously wound up by the winding roller 82. Meanwhile, the product portion 2a is maintained on the conveyor 83.

[0083] D-6. Image recognition process In the image recognition step, the product portion 2a is image-recognized by the image recognition unit 4 as described above. In the illustrated example, the image recognition unit 4 performs image recognition with high accuracy on the product portions 2a positioned on the conveyor 83. Thereafter, the pickup device 91 transports the product portions 2a whose information, image-recognized by the image recognition unit 4, is within the allowable range to a non-defective tray 92 as film chips 10. On the other hand, the pickup device 91 transports the product portions 2a whose information, image-recognized by the image recognition unit 4, is outside the allowable range to a defective tray 93 as defective products.

[0084] In this manner, film chips 10 having desired performance are continuously manufactured. The film chip 10 typically has a laminated structure similar to that of the individual sheets 2. As shown in Fig. 4, in one embodiment, the film chip 10 includes a laminated film 22 and a first light release layer 21a. In the illustrated example, the film chip 10 includes a plurality of light release layers 21, the laminated film 22, and a release liner 23. 9, the film chip 10 has a polygonal shape with pentagons or more sides when viewed in the thickness direction. In the illustrated example, the film chip 10 has a hexagonal shape when viewed in the thickness direction.

[0085] Such a film chip 10 can be subjected to various inspections (e.g., foreign matter inspection, air bubble inspection) after the first light release layer 21a, which is located at the outermost layer, is peeled off. In other words, the film chip can be inspected after removing the first light release layer, which is relatively susceptible to scratches during the manufacturing and / or transportation of the film chip. Therefore, false detections due to scratches on the light release layer during the above inspection can be suppressed. Furthermore, in one embodiment, once the first light release layer is removed, the second light release layer becomes the outermost layer of the film chip. Therefore, the film chip can be transported while protecting the surface of the film chip after inspection. Furthermore, film chip 10 can be used in a variety of applications, and is particularly suitable for optical applications. More specifically, after release liner 23 is peeled off from second adhesive layer 224, film chip 10 can be attached to an optical component via second adhesive layer 224, and used in optical applications. Examples of optical components include liquid crystal display panels and organic EL display panels. [Example]

[0086] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. The methods for measuring each property are as follows.

[0087] (1) Thickness measurement The thickness of each layer in the examples and comparative examples was measured using a film tester thickness measuring device (HKT-1202 manufactured by Fujiwork Co., Ltd.).

[0088] (2) Cracks The film chips obtained in the examples and comparative examples were inspected for cracks in the polarizers by microscopic transmission inspection and evaluated according to the following criteria. The results are shown in Table 1. ◯: The length of the crack in the plane direction of the polarizer is 0 μm or more and 500 μm or less △: The length of the crack in the plane direction of the polarizer is more than 500 μm and less than 1000 μm ×: The length of the crack in the plane direction of the polarizer exceeds 1000 μm

[0089] (3) Lifting of the light peeling layer The film chips obtained in the examples and comparative examples were inspected for lifting of the light release layer by a microscope using a reflection inspection, and were evaluated according to the following criteria. The results are shown in Table 1. ◯: The maximum depth of the floating in the plane direction of the polarizer is 0 μm or more and 500 μm or less △: The maximum depth of the lift in the plane direction of the polarizer is more than 500 μm and 1000 μm or less ×: The maximum depth of the lift in the plane direction of the polarizer exceeds 1000 μm

[0090] <<Production Example 1>> A 30 μm thick polyvinyl alcohol resin film (PVA resin film manufactured by Kuraray Co., Ltd.) was immersed in a dye bath at a liquid temperature of 30° C. for 30 seconds to be dyed (dyeing step). The dye bath was prepared by dissolving iodine in water. The iodine concentration in the dye bath was 1.0 mass%. Next, the PVA-based resin film after the dyeing process was immersed in a crosslinking bath (a boric acid aqueous solution obtained by blending 5 parts by mass of boric acid with 100 parts by mass of water) at a liquid temperature of 60°C for 300 seconds, while being uniaxially stretched to a total stretch ratio of 6.0 times the original length, thereby crosslinking with boric acid (stretching process). Next, the PVA resin film after the stretching step was immersed in a washing bath (water) at a liquid temperature of 20°C (washing treatment). The PVA resin film after the washing step was then dried in an oven at 60°C for 4 minutes to obtain a polarizer with a thickness of 12 μm. Next, a triacetyl cellulose resin film (thickness 25 μm) was attached as a protective layer to one surface of the obtained polarizer via a UV-curable adhesive layer (thickness 1 μm). A hard coat layer (surface treatment layer, thickness 7 μm) was provided on the surface of the triacetyl cellulose resin film opposite the polarizer. A cycloolefin resin film (thickness: 13 μm) was attached as a protective layer to the other surface of the polarizer via a UV-curable adhesive layer (thickness: 1 μm), thereby obtaining a polarizing plate having a protective layer / polarizer / protective layer structure.

[0091] Next, a first adhesive layer (thickness 15 μm) made of a (meth)acrylic adhesive was formed on the hard coat layer. Thereafter, a retardation film (Zeon Corporation, ZT12, cycloolefin-based retardation film, thickness 17 μm) was attached to the hard coat layer via the first adhesive layer. Next, a second adhesive layer (thickness 15 μm) made of a (meth)acrylic adhesive was formed on the retardation film. Thereafter, an optical function film was attached to the retardation film via the second adhesive layer. The optical function film included a substrate (thickness 40 μm) made of an acrylic resin and an antireflection layer (functional layer, thickness 4 μm). The antireflection layer was provided on the surface of the substrate opposite the hard coat layer.

[0092] Next, a light release film was attached to the anti-reflection layer to form a second light release layer. The second light release layer had a base film (50 μm thick) made of a cycloolefin resin and an adhesive layer (10 μm thick) made of an acrylic adhesive. Next, a light release film (manufactured by Nitto Denko Corporation, product name: E-MASK RP207) was attached to the base film of the second light release layer to form the first light release layer. The first light release layer had a base film (thickness 38 μm) made of PET and an adhesive layer (thickness 10 μm) made of an acrylic adhesive.

[0093] A second adhesive layer (thickness: 20 μm) made of a (meth)acrylic adhesive was formed on the cycloolefin resin film, and then a release liner made of PET (manufactured by Mitsubishi Chemical Corporation, product name: Diafoil MRV#50) was attached to the surface of the second adhesive layer. This resulted in a sheet having the following structure: first light release layer / second light release layer / optical function film / second pressure-sensitive adhesive layer / retardation film / first pressure-sensitive adhesive layer / polarizing plate / second pressure-sensitive adhesive layer / release liner. The number of light release layers in the sheet is shown in Table 1.

[0094] <<Production Example 2>> A single sheet was obtained in the same manner as in Production Example 1, except that the light release layer was changed to a single layer. Specifically, a light release film (manufactured by Nitto Denko Corporation, product name: E-MASK RP207) was attached to the anti-reflection layer to form a first light release layer. This resulted in a single sheet having a configuration of first light release layer / optical function film / second pressure-sensitive adhesive layer / retardation film / first pressure-sensitive adhesive layer / polarizing plate / second pressure-sensitive adhesive layer / release liner.

[0095] <<Examples 1 to 5 and Comparative Examples 1 and 2>> The individual sheets of Production Example 1 were set in the film chip production line shown in Figure 1. In this film chip production line, the individual sheets were placed on a carrier sheet as described above, and the individual sheets on the carrier sheet were cut into a product portion and a non-product portion using a rotary cutter (cutting process). The product portion had the overall shape shown in Table 1 when viewed in the thickness direction. The shapes and angles of the upstream end and downstream end of the product portion in the conveying direction of the individual sheets are shown in Table 1. "180°" in Table 1 indicates that the sides of the product portion are approximately parallel to the direction perpendicular to the conveying direction. The rotary cutter was equipped with a cylindrical roll and a blade-type sheet having multiple cutting blades. The height of the cutting blades was 0.7 mm. Details of the cutting blades (specifically, the cutting edge angle, the first angle on the outer side of the product, and the second angle on the inner side of the product) are shown in Table 1. In the cutting process, the peripheral speed of the rotary cutter was 1 m / min, and the moving speed of the sheet was 1 m / min. In this way, a film chip was produced as a product part.

[0096] <<Example 6>> Film chips were produced as product portions in the same manner as in Example 4, except that the individual sheets of Production Example 1 were replaced with the individual sheets of Production Example 2.

[0097] [Table 1]

[0098] As is clear from Table 1, when the upstream end of the product portion cut by the rotary cutter is a side that is approximately parallel to the direction perpendicular to the conveying direction of the sheet, or a corner having an angle of 150° or more, it is possible to suppress both lifting (peeling) of the light release layer and cracking of the polarizer. [Industrial Applicability]

[0099] The method for manufacturing film chips according to the embodiment of the present invention can be suitably used for manufacturing film chips that are applied to various industrial products. [Explanation of symbols]

[0100] 2 individual sheets 2a Product part 2b External part of the product 21 Light delamination layer 21a First light peeling layer 21b Second light peeling layer 22 Laminated film 221 Polarizing Plate 31 Rotary Cutter 313 cutting edge

Claims

1. The method includes a step of cutting the sheet into a product portion having a polygonal shape of pentagon or more and an outer portion of the product by a rotary cutter while conveying the sheet, The individual sheet comprises a laminated film having a laminated structure of five or more layers, and a first light release layer arranged on one side of the laminated film in the lamination direction, the first light release layer is located as an outermost layer, A method for manufacturing film chips, wherein the upstream end of the product portion in the conveying direction of the sheet is a side that is approximately parallel to a direction perpendicular to the conveying direction, or a corner having an angle of 150° or more.

2. The sheet further comprises a second light release layer located between the laminate film and the first light release layer, The method for manufacturing a film chip according to claim 1 , wherein the first light release layer is laminated on the second light release layer.

3. The method for manufacturing film chips according to claim 1 or 2, wherein a downstream end of the product portion in the conveying direction of the sheet is a corner portion.

4. The method for manufacturing film chips according to claim 3 , wherein a corner of a downstream end of the product portion in the conveying direction of the sheet has an angle of 60° or more.

5. The rotary cutter has a cutting blade, A method for manufacturing film chips as described in claim 1 or 2, wherein, among the cutting edge angles of the cutting blade, a first angle on the side of the portion outside the product relative to a reference line passing through the tip of the cutting blade along the radial direction of the rotary cutter is 1.5 times or more larger than a second angle on the side of the product portion relative to the reference line.

6. 3. The method for producing film chips according to claim 1, wherein the thickness of the individual sheets is 300 μm or more.

7. The method for manufacturing a film chip according to claim 1 or 2, wherein the laminated film further comprises a polarizing plate.

8. A film chip comprising a laminated film having a laminated structure of five or more layers and a first light release layer disposed on one side of the laminated film in the lamination direction, The film chip has a polygonal shape with pentagons or more sides when viewed in the thickness direction, the first light release layer is located as an outermost layer, A film chip, wherein the first light release layer has a release force of 0.10 N / mm or less.

9. Further provided is a second light release layer on which the first light release layer is laminated, the first light release layer is laminated to the second light release layer; The film chip according to claim 8 , wherein the release force of the second light release layer is 0.11 N / mm or more.

Images