Method for manufacturing printed circuit board, and printed circuit board

Abstract

To maintain the strength of a panelized printed circuit board.SOLUTION: A panelized printed circuit board to be divided 911 has: a printed circuit board 211; a printed circuit board 213; a printed circuit board 212; a connection part 514 connecting the printed circuit board 211 and the printed circuit board 213; and a connection part 511 connecting the printed circuit board 211 and the printed circuit board 212, where the length (2 mm) of the connection part 514 in a direction of connecting the printed circuit board 211 and the printed circuit board 213 is longer than the length (1 mm) of the connection part 511 in a direction of connecting the printed circuit board 211 and the printed circuit board 212, and by cutting off the connection part 511 together with the connection part 514, the printed circuit board 211, the printed circuit board 213 and the printed circuit board 212 are produced from the panelized printed circuit board to be divided 911.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a printed circuit board and a printed circuit board, for example, to a method for manufacturing a plurality of printed circuit boards from a divided aggregate printed circuit board and the printed circuit board. [Background technology]

[0002] To reduce the manufacturing, mounting, and management costs of printed circuit boards, heterogeneous multi-faceted manufacturing is sometimes employed, in which multiple printed circuit boards are manufactured by dividing a single divided assembly printed circuit board. Each board is connected at a uniform 1.0 mm long perforation, and a method has been proposed in which the connections are simultaneously divided using a board dividing device when dividing the printed circuit board. For example, the following method is known as a method suitable for dividing complex, irregular printed circuit boards. Specifically, this method involves raising and lowering the upper and lower blades of the dividing device using air or hydraulic cylinders connected to a power source, and cutting along the perforations in the printed circuit board (see, for example, Patent Documents 1, 2, and 3).

[0003] Figure 13 is a diagram showing the configuration of a substrate dividing apparatus 100. In the substrate dividing apparatus 100 of Figure 13, when the lifting plate 4 is lowered, the blade tips of the upper dividing blade 8 and the lower dividing blade 7 rub against the perforations 5 of the divided assembled printed circuit board 9 from above and below, cutting the perforations and dividing the printed circuit board into individual boards. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 02-124296 [Patent Document 2] Japanese Patent Application Publication No. 07-066509 [Patent Document 3] Japanese Patent Application Publication No. 08-141998 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the size and shape of each printed circuit board are specified, and when attempting to connect each board with a connecting part of the same length, the following problem occurs: In other words, the length between some boards may be longer than the length of the connecting part, and it is not possible to provide a connecting part between such boards, resulting in a problem of reduced strength of the divided aggregated printed circuit board. When mounting components on a divided aggregated printed circuit board, the components are mounted on the bare board connected by the connecting part, and then the divided aggregated printed circuit board is divided by a board dividing device. If the strength of the divided aggregated printed circuit board is low, the bare board may crack before the components are mounted, resulting in a problem of the mounter not being able to mount the components in the specified position.

[0006] The present invention has been made under these circumstances, and has as its object to maintain the strength of the aggregate printed circuit board. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems, the present invention has the following configuration.

[0008] (1) A method for manufacturing a printed circuit board, in which a printed circuit board is manufactured by cutting a connection portion of an aggregate printed circuit board in which a plurality of printed circuit boards are connected and arranged by the connection portion, wherein the aggregate printed circuit board has a first printed circuit board, a second printed circuit board, a third printed circuit board, a first connection portion connecting the first printed circuit board and the second printed circuit board, and a second connection portion connecting the first printed circuit board and the third printed circuit board, wherein the length of the first connection portion in the direction connecting the first printed circuit board and the second printed circuit board is longer than the length of the second connection portion in the direction connecting the first printed circuit board and the third printed circuit board, and the first printed circuit board, the second printed circuit board, and the third printed circuit board are manufactured from the aggregate printed circuit board by cutting the second connection portion together with the first connection portion.

[0009] (2) A method for manufacturing a printed circuit board, in which a printed circuit board is manufactured by cutting a connection portion of an aggregate printed circuit board in which a plurality of printed circuit boards are connected and arranged by the connection portion, the aggregate printed circuit board having a first printed circuit board, a second printed circuit board, and a connection portion connecting the first printed circuit board and the second printed circuit board, the first printed circuit board or the second printed circuit board having a component mounted on an end portion to which the connection portion is connected, the connection portion being divided by a dividing device, the dividing device having a lower dividing blade provided below the aggregate printed circuit board in the vertical direction and an upper dividing blade provided above the aggregate printed circuit board to be paired with the lower dividing blade, the upper dividing blade having a first vertical plane parallel to the vertical direction, a first inclined plane inclined with respect to the vertical direction, and a first tip portion formed by an intersection line between the first vertical plane and the first inclined plane, the lower dividing blade a second vertical surface parallel to the vertical direction, a second inclined surface inclined with respect to the vertical direction, and a second tip formed by an intersection line between the second vertical surface and the second inclined surface, the aggregate printed circuit board is placed on the dividing device so that the connection portion is located above the lower dividing blade, and when the component is mounted on the top surface of the first printed circuit board or the second printed circuit board, the first vertical surface of the upper dividing blade is positioned to face the component, and when the component is mounted on the underside of the first printed circuit board or the second printed circuit board, the second vertical surface of the lower dividing blade is positioned to face the component, the upper dividing blade contacts the connection portion from above and rubs against the lower dividing blade via the connection portion to cut the connection portion, thereby producing the first printed circuit board and the second printed circuit board from the aggregate printed circuit board.

[0010] (3) A printed circuit board for mounting components, comprising a first protrusion and a second protrusion protruding from an outer edge of the printed circuit board, wherein the length of the first protrusion in the protruding direction is longer than the length of the second protrusion in the protruding direction. [Effects of the Invention]

[0011] According to the present invention, the strength of the aggregate printed circuit board can be maintained. [Brief explanation of the drawings]

[0012] [Figure 1] Outline drawing of a conventional divided aggregate printed circuit board for comparison with Example 1 [Figure 2] Outline drawing of the divided aggregate printed circuit board of Example 1 [Figure 3] Enlarged perspective dimensional diagram of the divided aggregate printed circuit board and upper and lower dividing blades of Example 1 [Figure 4] 1 is an outline diagram of a printed circuit board after dividing the divided assembly printed circuit board of Example 1. [Figure 5] Outline drawing of a conventional divided aggregate printed circuit board for comparison with Example 2 [Figure 6] An enlarged perspective view of a conventional divided aggregate printed circuit board and an upper dividing blade for comparison with Example 2, and a cross section taken along the line AA in FIG. [Figure 7] Outline drawing of the divided aggregate printed circuit board of the second embodiment [Figure 8] 8 is an enlarged perspective view of the divided aggregate printed circuit board and the upper dividing blade of the second embodiment, and is a cross-sectional view of FIG. [Figure 9] 1 is an outline diagram of a printed circuit board after dividing the divided assembly printed circuit board of Example 2. [Figure 10] Outline drawing of the divided aggregate printed circuit board of Example 3 [Figure 11] 10 is an enlarged perspective view of the divided aggregate printed circuit board and the upper dividing blade of the third embodiment; and FIG. 11 is a cross-sectional view taken along the line CC in FIG. [Figure 12] 10 in the DD cross section of the third embodiment, and an outline view of the printed circuit board after dividing the divided aggregate printed circuit board. [Figure 13] Schematic diagram of a conventional substrate dividing device DETAILED DESCRIPTION OF THE INVENTION

[0013] Specific configurations of the present invention for solving the above problems will be described based on examples. Note that the examples shown below are merely examples and are not intended to limit the technical scope of the present invention.

[0014] <General substrate dividing equipment> FIG. 13 shows the configuration of a typical substrate dividing apparatus 100 (dividing apparatus). The substrate dividing apparatus 100 has, in the vertical direction, a lower dividing blade provided below the aggregate printed circuit board and an upper dividing blade provided above the aggregate printed circuit board to be paired with the lower dividing blade. A divided aggregate printed circuit board 9, on which multiple components are mounted, is placed on a substrate positioning table 2. Multiple perforations 5 are formed in the divided aggregate printed circuit board 9, and multiple lower dividing blades 7 are arranged on the substrate positioning table 2 so that the joints of the perforations can be the dividing positions. Support columns 10 are erected on the base 1, and an upper plate 3 is fixed to the upper ends of the support columns 10. A lifting plate 4 is suspended below the upper plate 3 so that it can be raised and lowered. Multiple upper dividing blades 8 are fixed to the underside of the lifting plate 4, and the upper dividing blades 8 are positioned so that the joints of the perforations on the divided aggregate printed circuit board 9 can be the dividing positions. Therefore, when the lifting plate 4 is lowered, the tips of the blades of the upper dividing blade 8 and the lower dividing blade 7 rub against the perforations 5 of the aggregate printed circuit board 9 from above and below, cutting the perforations and separating the board into individual printed circuit boards. In the following explanation, it is assumed that the board dividing device for dividing the aggregate printed circuit board has the same configuration as that shown in Figure 13, except for the configuration of the upper dividing blade and the lower dividing blade.

[0015] In a typical heterogeneous multi-surface assembly printed circuit board, the size and shape of each printed circuit board are specified. When as many printed circuit boards as possible with fixed shapes and specifications are arranged on a single assembly printed circuit board, the spacing between the printed circuit boards may not be uniform. On the other hand, when printed circuit boards are connected at multiple locations using connectors, a so-called perforation configuration, the multiple connectors are generally configured with the same length. In this case, when multiple printed circuit boards are connected using common connectors of the same length, it is not possible to connect some of the multiple printed circuit boards using the connectors. Specifically, in locations where the spacing between the printed circuit boards is greater than the length of the connectors, it is not possible to provide connectors at those locations. This may reduce the strength of the assembly printed circuit board. [Example]

[0016] <General divided assembly printed circuit board> Some printed circuit boards are manufactured by dividing (cutting) a single board (hereinafter referred to as an aggregated printed circuit board) on which multiple printed circuit boards are arranged (aggregated) into multiple printed circuit boards using a board dividing device (or a manual tool such as a cutter). Each printed circuit board arranged on the aggregated printed circuit board is separated into its area by slits, elongated holes, etc. (hereinafter referred to as perforations), and the printed circuit boards are connected to each other by connecting parts to form a single aggregated printed circuit board. The upper and lower dividing blades of the board dividing device cut the connecting parts that connect the printed circuit boards to each other.

[0017] 1 is a diagram showing the configuration of an example of a dividable aggregate printed circuit board as a general aggregate printed circuit board in which multiple printed circuit boards are connected by connecting parts of the same length of 1.0 mm and width of 2.0 mm. Note that the length of the connecting part refers to the length in the direction connecting the printed circuit boards, and the width refers to the length in the direction perpendicular to the length. Four printed circuit boards 201, 202, 203, and 204 are connected by connecting parts 501, 502, and 503 to form a dividable aggregate printed circuit board 901.

[0018] The distance between the outer edges of printed circuit boards 201 and 202, between printed circuit boards 202 and 203, and between printed circuit boards 203 and 204 is 1.0 mm. The distance between printed circuit boards 201 and 203, and between printed circuit boards 202 and 204 is 2.0 mm. The length of a typical connection is a common length of 1.0 mm. The shape of each printed circuit board is fixed, and it is not possible to connect printed circuit boards 201 and 203, and printed circuit boards 202 and 204 using a common connection of a common length. As a result, the connection strength between the printed circuit boards is weak, and there is a risk that divided assembled printed circuit board 901 may unintentionally break.

[0019] When components are mounted on a divided aggregate printed circuit board, the components are mounted on the bare board connected at the connection parts (pre-division state), and then the divided aggregate printed circuit board is divided using a board dividing device. That is, the board dividing device divides the divided aggregate printed circuit board along the perforations while multiple components are mounted on the divided aggregate printed circuit board. Therefore, even after the components are mounted, if a part of the divided aggregate printed circuit board breaks, a problem occurs in that it becomes impossible to position the divided aggregate printed circuit board when it is placed on the board dividing device. Note that the positioning of the divided aggregate printed circuit board and the board dividing device is performed by a general method, for example, by fitting a pilot pin of the board dividing device into a through hole provided in the divided aggregate printed circuit board.

[0020] The reasons for the standard 1.0 mm length for connection parts are as follows. First, when solder flow mounting components on a printed circuit board, the smaller the gap between the printed circuit boards, the less risk there is of solder flow-up from the solder flow layer. Therefore, one reason is that the connection length is set to 1.0 mm to minimize the gap. Note that the gap between the printed circuit boards can be larger as long as there is no risk of flow-up. Another reason is that when dividing a connection part by hand, it is impossible to control the position of the connection part at which it will be divided. When dividing a connection part by hand, if the connection part is connected with a length of 1.0 mm, it is possible that after division, the entire 1.0 mm length of the connection part will remain on the printed circuit board as a remnant of the connection part (also known as a perforation remnant). For these reasons, a length of 1.0 mm is used as the standard length to minimize the length of the connection part. However, when dividing using a substrate dividing device rather than by hand, the substrate is divided using the tip of a sharp blade, which allows the connection to be stably cut, making it possible to control the length of the remaining perforation.

[0021] <Multiple printed circuit boards of Example 1> 2 shows the configuration of a divided aggregate printed circuit board 911 as the aggregate printed circuit board of Example 1. Four printed circuit boards 211, 212, 213, and 214 are connected by connecting portions 511, 512, 513, 514, and 515 to form the divided aggregate printed circuit board 911.

[0022] The distance between printed circuit boards 211 and 212, i.e., the distance between their outer edges, is 1.0 mm. The distance between printed circuit boards 212 and 213, and the distance between printed circuit boards 213 and 214, i.e., the distance between their outer edges, is 1.0 mm. The distance between printed circuit boards 211 and 213, and the distance between printed circuit boards 212 and 214, i.e., the distance between their outer edges, is 2.0 mm. The shape of each printed circuit board is fixed, and connection portions 511, 512, and 513 are 1.0 mm long, and connection portions 514 and 515 are 2.0 mm long. Dividable aggregate printed circuit board 911 is composed of multiple printed circuit boards connected by connection portions 511-513 and 514-515 of different lengths. This makes the connection strength of divided aggregate printed circuit board 911 stronger than that of conventional divided aggregate printed circuit board 901. Specifically, in Example 1, the printed circuit boards are connected by connection portions 514 and 515, and therefore the connection strength is improved compared to the divided aggregate printed circuit board 901 in Fig. 1. Note that although only four printed circuit boards 211 to 214 are drawn in the divided aggregate printed circuit board 911, in reality, it includes many printed circuit boards connected at intervals of 1 mm and many printed circuit boards connected at intervals of 2 mm, as shown in Fig. 2.

[0023] When printed circuit board 211 is defined as the first printed circuit board, printed circuit board 213 corresponds to the second printed circuit board, and printed circuit board 212 corresponds to the third printed circuit board. Connection portion 514 corresponds to the first connection portion, and connection portion 511 corresponds to the second connection portion. When printed circuit board 214 is defined as the first printed circuit board, printed circuit board 212 corresponds to the second printed circuit board, and printed circuit board 213 corresponds to the third printed circuit board. Connection portion 515 corresponds to the first connection portion, and connection portion 513 corresponds to the second connection portion.

[0024] <How to apply the split blade> 3 shows a dimensional diagram of the state when upper dividing blade 811, which serves as a first upper dividing blade, contacts connecting portion 514 and upper dividing blade 812, which serves as a second upper dividing blade, contacts connecting portion 511 when dividing a divided aggregate printed circuit board 911 using board dividing apparatus 100. Upper dividing blade 811 has a first leading end 811a formed by the intersection of inclined surface 811b, which serves as a first inclined surface inclined with respect to the vertical direction, and vertical surface 811c, which serves as a first vertical surface parallel to the vertical direction. Upper dividing blade 812 has a third leading end 812a formed by the intersection of inclined surface 812b, which serves as a third inclined surface inclined with respect to the vertical direction, and vertical surface 812c, which serves as a third vertical surface parallel to the vertical direction. Each of upper dividing blades 811 and 812 has a blade width of 3.0 mm and a blade thickness of 2.0 mm.

[0025] The substrate dividing apparatus 100 has a lower dividing blade 711 as a first lower dividing blade that pairs with the upper dividing blade 811, and a lower dividing blade 712 as a second lower dividing blade that pairs with the upper dividing blade 812. The lower dividing blade 711 has a vertical surface 711c as a second vertical surface parallel to the vertical direction, a sloped surface 711b as a second inclined surface inclined with respect to the vertical direction, and a tip 711a as a second tip formed by the intersection line between the vertical surface 711c and the sloped surface 711b. The lower dividing blade 712 has a vertical surface 712c as a fourth vertical surface parallel to the vertical direction, a sloped surface 712b as a fourth inclined surface inclined with respect to the vertical direction, and a tip 712a as a fourth tip formed by the intersection line between the vertical surface 712c and the sloped surface 712b. The divided assembled printed circuit board 911 is placed on the board dividing apparatus 100 so that the connection portion 514 is located above the lower dividing blade 711 and so that the connection portion 511 is located above the lower dividing blade 712. The upper dividing blade 811 comes into contact with the connection portion 514 from above and cuts the connection portion 514 by fitting together with the lower dividing blade 711 via the connection portion 514. The upper dividing blade 812 comes into contact with the connection portion 511 from above and cuts the connection portion 511 by fitting together with the lower dividing blade 711 via the connection portion 511.

[0026] When dividing the divided assembly printed circuit board 911, the position of the blade tip 811a of the upper split blade 811 is 1.0 mm away from the outer edge of the printed circuit board 211 and 1.0 mm away from the outer edge of the printed circuit board 213 with respect to the connection portion 514. Furthermore, the tip 811a is positioned so that the center of the blade tip 811a, which has a blade width of 3.0 mm, overlaps the center of the width of the connection portion 514, with the width of the connection portion 514 being 2.0 mm, and the blade comes into contact with the center of the 2.0 mm length of the connection portion. The upper split blade 811 and the lower split blade 711 cut the center of the connection portion 514 in the length direction of the connection portion 514. In this way, the connection portion 514 is sandwiched between the upper split blade 811 and the lower split blade 711 and cut.

[0027] Similarly, when dividing the divided assembly printed circuit board 911, the position of the blade tip 812a of the upper dividing blade 812 is 0.5 mm away from the outer edge of the printed circuit board 211 and 0.5 mm away from the outer edge of the printed circuit board 212 with respect to the connection portion 511. Furthermore, the tip 812a is positioned so that the center of the blade tip 812a, which has a blade width of 3.0 mm and is aligned with the center of the width of the connection portion 511, with the blade contacting the center of the 1.0 mm length of the connection portion. The upper dividing blade 812 and the lower dividing blade 712 cut the center of the connection portion 511 in the length direction of the connection portion 511. In this way, the connection portion 511 is sandwiched between the upper dividing blade 812 and the lower dividing blade 712 and cut.

[0028] Similarly, the upper and lower dividing blades come into contact with the center of the length of the connection portions 512, 513, and 515, respectively, and the connection portions are cut at the center of the length of the connection portions. Note that when dividing the divided aggregate printed circuit board 911, the components mounted on each printed circuit board (not shown) and the upper and lower dividing blades are mounted on the printed circuit board with a clearance of 1.0 mm or more so that they do not collide with each other.

[0029] <Connection after splitting> 4 is a diagram showing multiple printed circuit boards after being divided. Printed circuit board 211 after being divided has remaining connection portion 514a as a first protrusion protruding from the outer edge of printed circuit board 211, and remaining connection portion 511a as a second protrusion. Printed circuit board 212 after being divided has remaining connection portion 515a as a first protrusion protruding from the outer edge of printed circuit board 212, and remaining connection portion 511a, 512a as second protrusions. Printed circuit board 213 after being divided has remaining connection portion 514a as a first protrusion protruding from the outer edge of printed circuit board 213, and remaining connection portion 512a, 513a as second protrusions. Printed circuit board 214 after being divided has remaining connection portion 515a as a first protrusion protruding from the outer edge of printed circuit board 214, and remaining connection portion 513a as a second protrusion. The length of the remaining connection portions 514a and 515a in the protruding direction is longer than the length of the remaining connection portions 511a, 512a, and 513a in the protruding direction.

[0030] The connection remainder at connection parts 514 and 515, which have a connection length of 2.0 mm, is 1.0 mm from the tip to the outer edge of each printed circuit board. On the other hand, the connection remainder at connection parts 511, 512, and 513, which have a connection length of 1.0 mm, is 0.5 mm from the tip to the outer edge of each printed circuit board. The difference in the length of these connection remainders is 0.5 mm. The connection remainder at the long connection parts is 1.0 mm, which is the same length as the connection remainder expected when the board is divided by hand, and it is possible to maintain the expected specifications for conventional printed circuit boards.

[0031] In Example 1, the length of the short connection portions 511, 512, and 513 of the divided assembled printed circuit board 911 is set to 1.0 mm due to the configuration of the printed circuit board, but it may be 1.0 mm or less as long as the connection portions can be formed and the board can be divided using the board dividing device. Also, the clearance between the dividing blade and the mounted components is set to 1.0 mm, but this length is not limited as long as the configuration of the board dividing device can ensure a distance that prevents the dividing blade and the mounted components from colliding.

[0032] Furthermore, although the connection lengths of the longest connection portions 514 and 515 are set to 2.0 mm, this length is not limited. The connection length can be adjusted depending on the shape and size of the printed circuit boards to be connected to each other. The connection length is not limited as long as the remaining length of the connection portion divided at the center after division satisfies the specifications and there are no issues with the connection strength of the printed circuit boards and the rise of the solder jet during solder flow. For example, printed circuit boards connected only by long connection portions may be included in the divided aggregate printed circuit board.

[0033] As described above, according to the first embodiment, the strength of the aggregate printed circuit board can be maintained. [Example]

[0034] <Issues with conventional divided aggregate printed circuit boards> 5 is a diagram showing the configuration of an example of a conventional splittable aggregate printed circuit board in which multiple printed circuit boards are connected by connecting parts that are the same 1.0 mm long and 2.0 mm wide. Three printed circuit boards 221, 222, and 223 are connected by connecting parts 521, 522, and 523 that are 1.0 mm long, respectively, to form splittable aggregate printed circuit board 921. Connector 121 is mounted on printed circuit board 223 at a position 2.5 mm from the outer edge of printed circuit board 223 to which connecting part 523 is connected.

[0035] 6(a) shows a dimensional diagram of the vicinity of the joint portion 523 when the upper dividing blade 821 is in contact with the joint portion 523 when dividing the divided aggregate printed circuit board 921 using the board dividing apparatus 100. The tip 821a of the upper dividing blade 821 is formed by the intersection of the inclined surface 821b and the vertical surface 821c, and the blade width of the upper dividing blade 821 is 3.0 mm and the blade thickness is 2.0 mm. The position of the tip 821a of the upper dividing blade 821 is 0.5 mm away from the outer edge of the printed circuit board 221 and 0.5 mm away from the outer edge of the printed circuit board 223 with respect to the joint portion 523. The position of the tip 821a is such that the center of the tip 821a of the blade, which has a blade width of 3.0 mm, overlaps with the center of the width of the joint portion 523, and the blade contacts the center of the 1.0 mm length of the joint portion. In this way, the connecting portion 523 is sandwiched between the upper split blade 812 and the lower split blade 721 (see FIG. 6(b)) and cut. The upper split blade 821 is oriented such that the inclined surface 821b faces the connector 121 (not shown in FIG. 6(a)).

[0036] FIG. 6(b) shows an enlarged cross-sectional view of the AA cross section of the divided assembly printed circuit board 921 shown in FIG. 5, near the connection portion 523, showing the upper dividing blade 821 and the lower dividing blade 721 before division. The lower dividing blade 721 has a tip 721a, a sloped surface 721b, and a vertical surface 721c. As shown in FIG. 6(b), the sloped surface 821b of the upper dividing blade 821 and the sloped surface 721b of the lower dividing blade 721 are arranged so that the sloped surfaces 821b and 721b face the connector 121. A clearance of 1.0 mm or more is maintained between the lower dividing blade 721 and the connector 121 to prevent contact during division of the printed circuit board. For this reason, the connector 121 can only be positioned at a distance of 2.5 mm or more from the outer edge of the printed circuit board 203 to which the connection portion 523 is connected. That is, there is a problem in that it is not possible to arrange the outer edge of the printed circuit board 223 so that the outer edge of the connector 121 overlaps with the outer edge of the printed circuit board (close to the outer edge of the printed circuit board).

[0037] When connecting printed circuit boards using a conventional common connection part with a length of 1 mm, one method for arranging mounted components such as connector 121 at the outer edge of printed circuit board 223 is to remove connection part 523. However, in this case, printed circuit board 223 is connected only at connection part 522, which may reduce the connection strength of divided assembled printed circuit board 921. Another method for arranging mounted components such as connector 121 at the outer edge of printed circuit board 223 is to manually separate only connection part 523 instead of using a board dividing device, but this poses the problem of increasing the number of steps required to divide the printed circuit board.

[0038] <Divided aggregate printed circuit board according to Example 2> 7 is a diagram showing the configuration of a splittable aggregate printed circuit board 931 in which multiple printed circuit boards are connected at connecting portions according to Example 2. Three printed circuit boards 231, 232, and 233 are connected at connecting portions 531, 532, and 533 to form the splittable aggregate printed circuit board 931. The lengths of connecting portions 531 and 532 are 1.0 mm, and the length of connecting portion 533 is 2.0 mm, and connector 131 is mounted on the outer edge of printed circuit board 233 adjacent to connecting portion 533. The widths of connecting portions 531, 532, and 533 are all 2.0 mm.

[0039] <How to apply the upper blade> 8(a) shows a dimensional diagram of the vicinity of the connection portion when the upper dividing blade 831 is in contact with the connection portion 533 when dividing the divided assembled printed circuit board 931 by the board dividing apparatus 100. Also, as shown in FIG. 8(b), a connector 131 is mounted as a component on the underside of the printed circuit board 233.

[0040] When dividing the printed circuit board, the position of the blade tip 831a of the upper dividing blade 831 is 1.0 mm away from the outer edge of the printed circuit board 231 and 1.0 mm away from the outer edge of the printed circuit board 233 with respect to the connection portion 533. The position of the tip 831a is such that the center of the blade width of 3.0 mm overlaps the center of the connection portion width for the 2.0 mm width of the connection portion 533, and the blade contacts the center of the 2.0 mm length of the connection portion. The connection portion 533 is sandwiched between the upper dividing blade 831 and the lower dividing blade 731 (see FIG. 8(b)) and cut. The orientation of the upper dividing blade 831 is reversed so that the inclined surface 831b does not face the connector 131 (not shown). In other words, the orientation of the upper dividing blade 831 is such that the vertical surface 831c faces the connector 131.

[0041] 8(b) shows an enlarged cross-sectional view of the vicinity of connection portion 533 in the BB cross-section of divided aggregate printed circuit board 931 shown in FIG. 7, and also shows upper split blade 831 and lower split blade 731. As shown in FIG. 8(b), blade tip 831a of upper split blade 831 and blade tip 731a of lower split blade 731 are arranged so that inclined surfaces 831b, 731b of the respective blades face in the opposite direction to the direction facing connector 131. In other words, upper split blade 831 is oriented so that vertical surface 831c faces connector 131, and lower split blade 731 is oriented so that vertical surface 731c faces connector 131.

[0042] At this time, a clearance of 1.0 mm is provided between the lower dividing blade 731 and the connector 131 so that they do not come into contact when the printed circuit board is divided, making it possible to mount the connector 131 on the outer edge of the printed circuit board 233 even if the connection portion 533 is connected. Similarly, the upper and lower dividing blades for the connection portions 531 and 532 come into contact with the center of the connection portion, and the connection portion is cut at the center of its length. Furthermore, when the printed circuit board is divided, the components mounted on each printed circuit board (not shown) and the upper and lower dividing blades are mounted on the printed circuit board so that a clearance of 1.0 mm or more is provided.

[0043] The connector 131 may be mounted on the upper surface of the printed circuit board 233. In this case, it is sufficient that the vertical surface 831c as the first vertical surface of the upper divided blade 831 as the first upper divided blade faces the connector 131. The connector 131 may also be mounted on the upper or lower surface of the printed circuit board 231. In either case, it is sufficient that the vertical surface 831c of the upper divided blade 831 or the vertical surface 731c as the second vertical surface of the lower divided blade 731 as the first lower divided blade faces the connector 131.

[0044] Furthermore, even in the case shown in FIG. 5 , i.e., when the length is 1 mm as in connection portion 523, by arranging the blade so that the vertical surface faces the component, it is possible to mount the component on the end of the printed circuit board. That is, when connector 121 is mounted on the underside of printed circuit board 223, vertical surface 721c as the second vertical surface of lower split blade 721 as the first lower split blade may be arranged so that it faces connector 121. Connector 121 may also be arranged on the upper surface of printed circuit board 223. In this case, it is sufficient that first vertical surface 821c of upper split blade 821 as the first upper split blade faces connector 121. Furthermore, connector 121 may be mounted on the upper or lower surface of printed circuit board 221. In either case, it is sufficient that vertical surface 821c of upper split blade 821 or vertical surface 721c as the second vertical surface of lower split blade 721 as the first lower split blade faces connector 121. In other words, when the connector 121 is mounted on the upper or lower surface of the printed circuit board 221 adjacent to the connection portion 523, the upper split blade 821 and the lower split blade 721 may be arranged in the orientation shown in Figure 6(b).

[0045] <Printed circuit board after separation> 9 shows printed circuit board 233 after separation. Connector 131, a component, is mounted on the end from which remaining connection portion 533a, which serves as a first protrusion, protrudes. The length in the protruding direction of remaining connection portion 533a is 1.0 mm or more, and the length in the protruding direction of remaining connection portion 533b, which serves as a second protrusion, is 0.5 mm or less. In other words, the difference between the length in the protruding direction of remaining connection portion 533a and the length in the protruding direction of remaining connection portion 533b is 0.5 mm or more.

[0046] The remaining connection portion 533a of the connection portion 533, which has a connection portion length of 2.0 mm, is 1.0 mm from its tip to the outer edge of each printed circuit board. The remaining connection portion 532a of the connection portion 532, which has a connection portion length of 1.0 mm, is 0.5 mm from its tip to the outer edge of each printed circuit board. Therefore, the difference in length between the two remaining connection portions 533a and 532a is 0.5 mm.

[0047] In Example 2, the shortest connection length of the divided assembled printed circuit board is 1.0 mm due to the configuration of the printed circuit board, but it can be less than 1.0 mm as long as the connection can be formed and the board can be divided by the board dividing device. Also, the clearance between the dividing blade and the mounted components is 1.0 mm, but there is no limit to the length as long as the configuration of the board dividing device allows for a distance that does not cause the dividing blade and the mounted components to collide.

[0048] Additionally, while the longest connection is set at 2.0 mm, it is sufficient to have a clearance between the connector and the lower dividing blade when dividing the printed circuit board, and it can be adjusted depending on the shape and size of the printed circuit board to be connected. As long as the remaining length of the connection after division meets the specifications and there are no issues with the connection strength of the printed circuit board or the rise of the solder jet during the solder flow, there is no limit to the connection length.

[0049] In addition, while in Example 2, there was only one long connection portion connected to a given printed circuit board, there may be multiple. As long as there is sufficient clearance to prevent contact between the components mounted on the printed circuit board and the upper and lower blade segments, connectors may be mounted adjacent to each long connection portion. This allows for flexible connection of locations that could not be connected using the conventional 1.0 mm long connection portion. Even when multiple connectors need to be mounted on the outer edge of a printed circuit board, the flexibility of arranging the connection portions to maintain connection strength is increased. While a connector has been used as an example of a component mounted adjacent to a long connection portion, this applies to all board-mounted components and is not limited to connectors.

[0050] As described above, according to the second embodiment, the strength of the aggregate printed circuit board can be maintained. [Example]

[0051] <Divided aggregate printed circuit board according to the third embodiment> FIG. 10 is a diagram showing the configuration of a divided aggregate printed circuit board 941 in which multiple printed circuit boards are connected at connection portions according to the third embodiment. Three printed circuit boards 241, 242, and 243 are connected at connection portions 541, 542, and 543 to form the divided aggregate printed circuit board 941. The lengths of connection portions 541 and 542 are 1.0 mm, and the length of connection portion 543 is 1.5 mm. Connection portions 541 and 543 are spaced 4.0 mm apart, and each has a width of 2.0 mm. In this way, the longer connection portion only needs to be 1.5 mm or longer. Connector 141 is mounted on the outer edge of printed circuit board 243 adjacent to connection portion 543.

[0052] <How to apply the upper blade> 11(a) shows a dimensional diagram of the vicinity of the joints 541, 543 when the upper dividing blade 841 is in contact with the joints 541, 543 when dividing the divided aggregate printed circuit board 941 using the board dividing apparatus 100. The tip 841a of the upper dividing blade 841 is formed by the intersection of the inclined surface 841b and the vertical surface 841c, and has a blade width of 9.0 mm and a blade thickness of 2.0 mm. The tip 741a of the lower dividing blade 741 is formed by the intersection of the inclined surface 741b and the vertical surface 741c, and has a blade width of 9.0 mm and a blade thickness of 2.0 mm (see FIG. 11(b)).

[0053] The position of the tip 841a of the upper split blade 841 is 0.5 mm away from the outer edge of the printed circuit board 241 and 0.5 mm away from the outer edge of the printed circuit board 242 in the length direction of the connection portion with respect to the connection portion 541. The tip 841a of the upper split blade 841 contacts the center of the 1.0 mm length of the connection portion of the connection portion 541. With respect to the connection portion 543, the tip 841a is 0.5 mm away from the outer edge of the printed circuit board 241 and 1.0 mm away from the outer edge of the printed circuit board 243. The upper split blade 841 and the lower split blade 741 cut between the center of the connection portion 543 and the outer edge of the printed circuit board 241 in the length direction of the connection portion as the first connection portion, and cut the center of the connection portion 541 in the length direction of the connection portion 541 as the second connection portion.

[0054] The tip 841a of the upper split blade 841 is positioned so that the center of the 9.0 mm split blade width in the width direction overlaps the midpoint of the connecting portion 541 and the connecting portion 543, and the connecting portion 543 is sandwiched and cut between the upper split blade 841 and the lower split blade 741. The upper split blade 841 and the lower split blade 741 are oriented in the opposite direction so that their respective inclined surfaces 841b, 741b do not face the connector 141 (not shown). In other words, the upper split blade 841 and the lower split blade 741 are oriented so that their respective vertical surfaces 841c, 741c face the connector 141 (not shown).

[0055] 11(b) shows an enlarged cross-sectional view of the vicinity of connection portion 541 in the CC cross-section of divided aggregate printed circuit board 931 shown in FIG. 10, and also shows upper split blade 841 and lower split blade 741. As shown in FIG. 11(b), blade tip 841a of upper split blade 841 and blade tip 741a of lower split blade 741 are arranged so that inclined surfaces 841b, 741b of the respective blades face in the opposite direction to the direction facing printed circuit board 242.

[0056] FIG. 12(a) shows an enlarged cross-sectional view of the DD cross-section of the divided assembly printed circuit board 941 shown in FIG. 10 , focusing on the vicinity of the connection portion 543, and also illustrates the upper dividing blade 841 and the lower dividing blade 741. As shown in FIG. 12(a), the blade tip 841a of the upper dividing blade 841 and the blade tip 741a of the lower dividing blade 741 are arranged so that the inclined surfaces 841b, 741b of the respective blades face in the opposite direction to the direction facing the connector 141. A clearance of 1.0 mm is provided between the lower dividing blade 741 and the connector 141 to prevent contact when the printed circuit board is divided. Therefore, even if the connection portion 543 is connected, the connector 141 can be mounted on the outer edge of the printed circuit board 243. As in Example 2, the corresponding upper and lower dividing blades contact the center of the connection portion 542, and the connection portion is cut at the center of its length. Furthermore, when the printed circuit board is divided, the components mounted on each printed circuit board (not shown) are mounted on the printed circuit board so that a clearance of 1.0 mm or more is provided between the upper and lower dividing blades.

[0057] <Printed circuit board after separation> Figure 12(b) shows printed circuit board 243 after division. Remaining connection portion 543a of connection portion 543, which has a connection length of 1.5 mm, is 1.0 mm from its tip to the outer edge of each printed circuit board. On the other hand, remaining connection portion 542a of connection portion 542, which has a connection length of 1.0 mm, is 0.5 mm from its tip to the outer edge of each printed circuit board. The difference in length between the remaining connection portions is 0.5 mm.

[0058] In Example 3, the short length of the connection part of the divided assembled printed circuit board is set to 1.0 mm due to the configuration of the printed circuit board, but it may be less than 1.0 mm as long as the connection part can be formed and the board can be divided by the board dividing device. Also, the clearance between the dividing blade and the mounted components is set to 1.0 mm, but the clearance distance is not limited as long as the configuration of the board dividing device provides a distance that prevents the dividing blade and the mounted components from colliding.

[0059] Additionally, while the length of the longer connection is set to 1.5 mm, it can be adjusted depending on the shape and size of the PCBs to be connected, as long as there is sufficient clearance between the connector and the lower dividing blade when the divided assembly PCB is divided. The length of the connection is not limited as long as the remaining length of the connection after the divided assembly PCB meets the specifications and there are no issues with the connection strength of the PCBs before the division of the divided assembly PCB or the rise of the solder jet during the solder flow. Furthermore, while the connector adjacent to the longer connection is described as an example of a mounted component, this applies to all board-mounted components.

[0060] As described above, according to the third embodiment, the strength of the aggregate printed circuit board can be maintained.

[0061] The disclosure of this embodiment includes the following methods and configurations. (Method 1) A method of manufacturing a printed circuit board, in which a printed circuit board is manufactured by cutting a connection portion of an aggregate printed circuit board in which a plurality of printed circuit boards are connected and arranged by the connection portion, the aggregate printed circuit board includes a first printed circuit board, a second printed circuit board, a third printed circuit board, a first connection portion connecting the first printed circuit board and the second printed circuit board, and a second connection portion connecting the first printed circuit board and the third printed circuit board, a length of the first connection portion in a direction connecting the first printed circuit board and the second printed circuit board is longer than a length of the second connection portion in a direction connecting the first printed circuit board and the third printed circuit board; A method for manufacturing a printed circuit board, characterized in that the first printed circuit board, the second printed circuit board, and the third printed circuit board are manufactured from the aggregate printed circuit board by cutting the second connection portion together with the first connection portion. (Method 2) the first connection portion and the second connection portion are divided by a dividing device, the dividing device has a lower dividing blade provided below the aggregate printed circuit board in a vertical direction when the aggregate printed circuit board is placed thereon, and an upper dividing blade provided above the aggregate printed circuit board so as to be paired with the lower dividing blade, the upper dividing blade and the lower dividing blade include a first upper dividing blade and a first lower dividing blade that cut the first connecting portion, and a second upper dividing blade and a second lower dividing blade that cut the second connecting portion, the first upper divided blade has a first vertical surface parallel to the vertical direction, a first inclined surface inclined with respect to the vertical direction, and a first tip portion formed by an intersection line between the first vertical surface and the first inclined surface, the first lower blade has a second vertical surface parallel to the vertical direction, a second inclined surface inclined with respect to the vertical direction, and a second tip portion formed by an intersection line between the second vertical surface and the second inclined surface, the second upper divided blade has a third vertical surface parallel to the vertical direction, a third inclined surface inclined with respect to the vertical direction, and a third tip portion formed by an intersection line between the third vertical surface and the third inclined surface, the second lower blade has a fourth vertical surface parallel to the vertical direction, a fourth inclined surface inclined with respect to the vertical direction, and a fourth tip portion formed by an intersection line between the fourth vertical surface and the fourth inclined surface, the aggregate printed circuit board is placed on the dividing device so that the first connecting portion is positioned above the first lower dividing blade and the second connecting portion is positioned above the second lower dividing blade; the first upper divided blade contacts the first connecting portion from above, and cuts the first connecting portion by sliding against the first lower divided blade via the first connecting portion; The method for manufacturing a printed circuit board described in Method 1 is characterized in that the second upper blade contacts the second connection portion from above, and rubs against the second lower blade through the second connection portion to cut the second connection portion. (Method 3) The first upper dividing blade and the first lower dividing blade cut the first connecting portion at a center in a length direction of the first connecting portion, A method for manufacturing a printed circuit board according to method 2, characterized in that the second upper dividing blade and the second lower dividing blade cut the center of the second connection portion in the longitudinal direction of the second connection portion. (Method 4) the first printed circuit board or the second printed circuit board has a component mounted on an end portion to which the first connection portion is connected, When the component is mounted on an upper surface of the first printed circuit board or the second printed circuit board, the first upper dividing blade is disposed so that the first vertical surface faces the component, The method for manufacturing a printed circuit board according to Method 2 or Method 3, wherein when the component is mounted on the underside of the first printed circuit board or the second printed circuit board, the second vertical surface of the first lower dividing blade is positioned so as to face the component. (Method 5) the first printed circuit board or the third printed circuit board has a component mounted on an end portion to which the second connection portion is connected, When the component is mounted on an upper surface of the first printed circuit board or the third printed circuit board, the third vertical surface of the second upper dividing blade is disposed so as to face the component, A method for manufacturing a printed circuit board according to any one of methods 2 to 4, characterized in that when the component is mounted on the underside of the first printed circuit board or the third printed circuit board, the fourth vertical surface of the second lower dividing blade is positioned to face the component. (Method 6) A method of manufacturing a printed circuit board, in which a printed circuit board is manufactured by cutting a connection portion of an aggregate printed circuit board in which a plurality of printed circuit boards are connected and arranged by the connection portion, the aggregate printed circuit board includes a first printed circuit board, a second printed circuit board, and a connection portion that connects the first printed circuit board and the second printed circuit board, the first printed circuit board or the second printed circuit board has a component mounted on an end portion to which the connection portion is connected, the connection portion is divided by a dividing device, the dividing device has a lower dividing blade provided below the printed circuit board assembly in the vertical direction, and an upper dividing blade provided above the printed circuit board assembly so as to be paired with the lower dividing blade, the upper divided blade has a first vertical surface parallel to the vertical direction, a first inclined surface inclined with respect to the vertical direction, and a first tip portion formed by an intersection line between the first vertical surface and the first inclined surface, the lower segmented blade has a second vertical surface parallel to the vertical direction, a second inclined surface inclined with respect to the vertical direction, and a second tip portion formed by an intersection line between the second vertical surface and the second inclined surface, the printed circuit board assembly is placed on the dividing device so that the connection portion is positioned above the lower dividing blade; When the component is mounted on the upper surface of the first printed circuit board or the second printed circuit board, the upper dividing blade is disposed so that the first vertical surface faces the component, When the component is mounted on the lower surface of the first printed circuit board or the second printed circuit board, the second vertical surface of the lower dividing blade is disposed to face the component, a cutting blade for cutting the first printed circuit board and the second printed circuit board from the aggregate printed circuit board; a cutting blade for cutting the first printed circuit board and the second printed circuit board from the aggregate printed circuit board; a cutting blade for cutting the first printed circuit board and the second printed circuit board from the aggregate printed circuit board; (Method 7) When the connection portion is a first connection portion, the aggregate printed circuit board includes a third printed circuit board and a second connection portion that connects the first printed circuit board and the third printed circuit board, The method for manufacturing a printed circuit board described in Method 6, characterized in that the length of the first connection portion in the direction connecting the first printed circuit board and the second printed circuit board is longer than the length of the second connection portion in the direction connecting the first printed circuit board and the third printed circuit board. (Method 8) When the upper divided blade is a first upper divided blade and the lower divided blade is a first lower divided blade, the second connection portion is divided together with the first connection portion by the dividing device, the dividing device has a second upper dividing blade and a second lower dividing blade that cut the second connection portion, the second upper divided blade has a third vertical surface parallel to the vertical direction, a third inclined surface inclined with respect to the vertical direction, and a third tip portion formed by an intersection line between the third vertical surface and the third inclined surface, the second lower blade has a fourth vertical surface parallel to the vertical direction, a fourth inclined surface inclined with respect to the vertical direction, and a fourth tip portion formed by an intersection line between the fourth vertical surface and the fourth inclined surface, the printed circuit board assembly is placed on the dividing device so that the second connection portion is positioned above the second lower dividing blade; The method for manufacturing a printed circuit board described in Method 7, characterized in that the second upper blade contacts the second connection portion from above, and rubs against the second lower blade through the second connection portion to cut the second connection portion. (Method 9) When the connection portion is a first connection portion, the aggregate printed circuit board includes a third printed circuit board and a second connection portion that connects the first printed circuit board and the third printed circuit board, a length of the first connection portion in a direction connecting the first printed circuit board and the second printed circuit board is longer than a length of the second connection portion in a direction connecting the first printed circuit board and the third printed circuit board; the aggregate printed circuit board is placed on the dividing device so that the first connecting portion and the second connecting portion are positioned above the lower dividing blade; The method for manufacturing a printed circuit board described in Method 6 is characterized in that the upper blade contacts the first connection portion and the second connection portion from above the second connection portion together with the first connection portion, and rubs against the lower blade via the first connection portion and the second connection portion to cut the second connection portion together with the first connection portion. (Method 10) The method for manufacturing a printed circuit board described in Method 9, characterized in that the upper dividing blade and the lower dividing blade cut between the center of the first connection portion and the outer edge of the first printed circuit board in the length direction of the first connection portion, and cut at the center of the second connection portion in the length direction of the second connection portion. (Method 11) the first connection portion has a length of 1.5 mm or more; The method for manufacturing a printed circuit board according to any one of Methods 1 to 10, wherein the second connection portion has a length of 1.0 mm or less. (Method 12) A method for manufacturing a printed circuit board described in any of methods 1 to 11, characterized in that the difference between the length of the first connection portion and the length of the second connection portion is 0.5 mm or more. (Configuration 1) A printed circuit board for mounting components, a first protrusion and a second protrusion protruding from an outer edge of the printed circuit board; A printed circuit board, characterized in that the length of the first protrusion in the protruding direction is longer than the length of the second protrusion in the protruding direction. (Configuration 2) 2. The printed circuit board according to configuration 1, wherein the component is mounted on the end portion from which the first protrusion protrudes. (Configuration 3) The length of the first protrusion in the protruding direction is 1.0 mm or more, 3. The printed circuit board according to claim 1, wherein the length of the second protrusion in the protruding direction is 0.5 mm or less. (Configuration 4) The printed circuit board according to any one of configurations 1 to 3, characterized in that the difference between the length of the first protrusion in the protruding direction and the length of the second protrusion in the protruding direction is 0.5 mm or more. [Explanation of symbols]

[0062] 511 Connection 514 Connection 911 Divided aggregate printed circuit board 211, 212, 213 Printed circuit board

Claims

1. A method of manufacturing a printed circuit board, in which a printed circuit board is manufactured by cutting a connection portion of an aggregate printed circuit board in which a plurality of printed circuit boards are connected and arranged by the connection portion, the aggregate printed circuit board includes a first printed circuit board, a second printed circuit board, a third printed circuit board, a first connection portion connecting the first printed circuit board and the second printed circuit board, and a second connection portion connecting the first printed circuit board and the third printed circuit board, a length of the first connection portion in a direction connecting the first printed circuit board and the second printed circuit board is longer than a length of the second connection portion in a direction connecting the first printed circuit board and the third printed circuit board; A method for manufacturing a printed circuit board, characterized in that the first printed circuit board, the second printed circuit board, and the third printed circuit board are manufactured from the aggregate printed circuit board by cutting the second connection portion together with the first connection portion.

2. the first connection portion and the second connection portion are divided by a dividing device, the dividing device has a lower dividing blade provided below the aggregate printed circuit board in a vertical direction when the aggregate printed circuit board is placed thereon, and an upper dividing blade provided above the aggregate printed circuit board so as to be paired with the lower dividing blade, the upper dividing blade and the lower dividing blade include a first upper dividing blade and a first lower dividing blade that cut the first connecting portion, and a second upper dividing blade and a second lower dividing blade that cut the second connecting portion, the first upper divided blade has a first vertical surface parallel to the vertical direction, a first inclined surface inclined with respect to the vertical direction, and a first tip portion formed by an intersection line between the first vertical surface and the first inclined surface, the first lower blade has a second vertical surface parallel to the vertical direction, a second inclined surface inclined with respect to the vertical direction, and a second tip portion formed by an intersection line between the second vertical surface and the second inclined surface, the second upper divided blade has a third vertical surface parallel to the vertical direction, a third inclined surface inclined with respect to the vertical direction, and a third tip portion formed by an intersection line between the third vertical surface and the third inclined surface, the second lower blade has a fourth vertical surface parallel to the vertical direction, a fourth inclined surface inclined with respect to the vertical direction, and a fourth tip portion formed by an intersection line between the fourth vertical surface and the fourth inclined surface, the aggregate printed circuit board is placed on the dividing device so that the first connecting portion is positioned above the first lower dividing blade and the second connecting portion is positioned above the second lower dividing blade; the first upper divided blade contacts the first connecting portion from above, and cuts the first connecting portion by sliding against the first lower divided blade via the first connecting portion; 2. The method for manufacturing a printed circuit board according to claim 1, wherein the second upper blade contacts the second connection portion from above, and cuts the second connection portion by rubbing against the second lower blade through the second connection portion.

3. the first upper dividing blade and the first lower dividing blade cut the first connecting portion at a center in a length direction of the first connecting portion, The method for manufacturing a printed circuit board according to claim 2 , wherein the second upper dividing blade and the second lower dividing blade cut the second connecting portion at a center in a length direction of the second connecting portion.

4. the first printed circuit board or the second printed circuit board has a component mounted on an end portion to which the first connection portion is connected, When the component is mounted on an upper surface of the first printed circuit board or the second printed circuit board, the first upper dividing blade is disposed so that the first vertical surface faces the component, 3. The method for manufacturing a printed circuit board according to claim 2, wherein when the component is mounted on the underside of the first printed circuit board or the second printed circuit board, the second vertical surface of the first lower dividing blade is positioned so as to face the component.

5. the first printed circuit board or the third printed circuit board has a component mounted on an end portion to which the second connection portion is connected, When the component is mounted on an upper surface of the first printed circuit board or the third printed circuit board, the third vertical surface of the second upper dividing blade is disposed to face the component, 3. The method for manufacturing a printed circuit board according to claim 2, wherein when the component is mounted on the underside of the first printed circuit board or the third printed circuit board, the fourth vertical surface of the second lower dividing blade is positioned so as to face the component.

6. A method of manufacturing a printed circuit board, in which a printed circuit board is manufactured by cutting a connection portion of an aggregate printed circuit board in which a plurality of printed circuit boards are connected and arranged by the connection portion, the aggregate printed circuit board includes a first printed circuit board, a second printed circuit board, and a connection portion that connects the first printed circuit board and the second printed circuit board, the first printed circuit board or the second printed circuit board has a component mounted on an end portion to which the connection portion is connected, the connection portion is divided by a dividing device, the dividing device has a lower dividing blade provided below the aggregate printed circuit board in a vertical direction when the aggregate printed circuit board is placed thereon, and an upper dividing blade provided above the aggregate printed circuit board so as to be paired with the lower dividing blade, the upper divided blade has a first vertical surface parallel to the vertical direction, a first inclined surface inclined with respect to the vertical direction, and a first tip portion formed by an intersection line between the first vertical surface and the first inclined surface, the lower segmented blade has a second vertical surface parallel to the vertical direction, a second inclined surface inclined with respect to the vertical direction, and a second tip portion formed by an intersection line between the second vertical surface and the second inclined surface, the printed circuit board assembly is placed on the dividing device so that the connection portion is positioned above the lower dividing blade; When the component is mounted on an upper surface of the first printed circuit board or the second printed circuit board, the upper dividing blade is disposed so that the first vertical surface faces the component, When the component is mounted on the lower surface of the first printed circuit board or the second printed circuit board, the second vertical surface of the lower dividing blade is disposed to face the component, a cutting blade for cutting the first printed circuit board and the second printed circuit board from the aggregate printed circuit board; a cutting blade for cutting the first printed circuit board and the second printed circuit board from the aggregate printed circuit board; a cutting blade for cutting the first printed circuit board and the second printed circuit board from the aggregate printed circuit board;

7. When the connection portion is a first connection portion, the aggregate printed circuit board includes a third printed circuit board and a second connection portion that connects the first printed circuit board and the third printed circuit board, 7. The method for manufacturing a printed circuit board according to claim 6, wherein the length of the first connection portion in the direction connecting the first printed circuit board and the second printed circuit board is longer than the length of the second connection portion in the direction connecting the first printed circuit board and the third printed circuit board.

8. When the upper divided blade is a first upper divided blade and the lower divided blade is a first lower divided blade, the second connection portion is divided together with the first connection portion by the dividing device, the dividing device has a second upper dividing blade and a second lower dividing blade that cut the second connection portion, the second upper divided blade has a third vertical surface parallel to the vertical direction, a third inclined surface inclined with respect to the vertical direction, and a third tip portion formed by an intersection line between the third vertical surface and the third inclined surface, the second lower divided blade has a fourth vertical surface parallel to the vertical direction, a fourth inclined surface inclined with respect to the vertical direction, and a fourth tip portion formed by an intersection line between the fourth vertical surface and the fourth inclined surface, the printed circuit board assembly is placed on the dividing device so that the second connection portion is positioned above the second lower dividing blade; 8. The method for manufacturing a printed circuit board according to claim 7, wherein the second upper blade contacts the second connection portion from above, and rubs against the second lower blade through the second connection portion to cut the second connection portion.

9. When the connection portion is a first connection portion, the aggregate printed circuit board includes a third printed circuit board and a second connection portion that connects the first printed circuit board and the third printed circuit board, a length of the first connection portion in a direction connecting the first printed circuit board and the second printed circuit board is longer than a length of the second connection portion in a direction connecting the first printed circuit board and the third printed circuit board; the printed circuit board assembly is placed on the dividing device so that the first connecting portion and the second connecting portion are positioned above the lower dividing blade; 7. The method for manufacturing a printed circuit board according to claim 6, wherein the upper split blade contacts the first connection portion and the second connection portion from above the second connection portion together with the first connection portion, and rubs against the lower split blade via the first connection portion and the second connection portion to cut the second connection portion together with the first connection portion.

10. 10. The method for manufacturing a printed circuit board according to claim 9, wherein the upper dividing blade and the lower dividing blade cut between the center of the first connection portion and the outer edge of the first printed circuit board in the length direction of the first connection portion, and cut the center of the second connection portion in the length direction of the second connection portion.

11. the first connection portion has a length of 1.5 mm or more; The method for manufacturing a printed circuit board according to any one of claims 1 to 10, wherein the second connection portion has a length of 1.0 mm or less.

12. 11. The method for manufacturing a printed circuit board according to claim 1, wherein a difference in length between the first connection portion and the second connection portion is 0.5 mm or more.

13. A printed circuit board for mounting components, a first protrusion and a second protrusion protruding from an outer edge of the printed circuit board; The printed circuit board according to claim 1, wherein the length of the first protrusion in the protruding direction is longer than the length of the second protrusion in the protruding direction.

14. 14. The printed circuit board according to claim 13, wherein the component is mounted on an end portion from which the first protrusion protrudes.

15. The length of the first protrusion in the protruding direction is 1.0 mm or more, 15. The printed circuit board according to claim 13, wherein the length of the second protruding portion in the protruding direction is 0.5 mm or less.

16. 15. The printed circuit board according to claim 13, wherein a difference between a length in the protruding direction of the first protrusion and a length in the protruding direction of the second protrusion is 0.5 mm or more.

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